US20210241790A1 - Suspension standoff arrangement for confining adhesive - Google Patents
Suspension standoff arrangement for confining adhesive Download PDFInfo
- Publication number
- US20210241790A1 US20210241790A1 US16/778,433 US202016778433A US2021241790A1 US 20210241790 A1 US20210241790 A1 US 20210241790A1 US 202016778433 A US202016778433 A US 202016778433A US 2021241790 A1 US2021241790 A1 US 2021241790A1
- Authority
- US
- United States
- Prior art keywords
- dielectric
- adhesive
- standoff
- suspension
- standoffs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 122
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 122
- 239000000725 suspension Substances 0.000 title claims abstract description 52
- 238000013500 data storage Methods 0.000 claims abstract description 8
- 239000004642 Polyimide Substances 0.000 claims description 144
- 229920001721 polyimide Polymers 0.000 claims description 144
- 238000012545 processing Methods 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 12
- 239000010935 stainless steel Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
Definitions
- This disclosure relates to head assemblies used in data storage devices.
- a hard-disk drive is a non-volatile storage device that is housed in a protective enclosure and stores digitally encoded data on one or more circular disks having magnetic surfaces.
- each magnetic-recording disk of a hard-disk drive is rapidly rotated by a spindle system.
- Data are read from and written to a magnetic-recording disk using a read-write head that is positioned over a specific location of a disk by an actuator.
- a read-write head uses a magnetic field to read data from and write data to the surface of a magnetic-recording disk.
- a write head makes use of the electricity flowing through a coil, which produces a magnetic field. Electrical pulses are sent to the write head, with different patterns of positive and negative currents. The current in the coil of the write head induces a magnetic field across the gap between the head and the magnetic disk, which in turn magnetizes a small area on the recording medium.
- the read-write head is fabricated in a head slider, which is coupled with a suspension in a head gimbal assembly.
- An adhesive often is used to adhere the slider to the suspension. It is desirable to improve techniques for adhering the slider to the suspension.
- FIG. 1 is a plan view illustrating an embodiment of a hard disk drive.
- FIGS. 2A-2E depict various views of part of an embodiment of a head gimbal assembly.
- FIGS. 3A-3M depict various views of part of an embodiment of a head gimbal assembly.
- a head gimbal assembly for a data storage device.
- the head gimbal assembly includes a suspension, and a slider mounting point on the suspension.
- the slider mounting point includes an adhesive pocket bounded by multiple dielectric standoffs.
- the multiple dielectric standoffs are configured to limit a spread of multiple adhesive dots disposed in the adhesive pocket.
- Embodiments may be used in the context of a head gimbal assembly (HGA) for a hard disk drive (HDD).
- FIG. 1 illustrates a functional arrangement of components of an example HDD 100 , which includes a HGA 102 , a magnetic-recording medium 104 rotatably mounted on a spindle 106 and a drive motor (not visible) attached to spindle 106 for rotating magnetic-recording medium 104 .
- Magnetic-recording medium 104 (or a plurality of disk media) may be affixed to spindle 106 with a disk clamp 108 .
- HGA 102 includes a slider 102 a mounted to a suspension 102 b .
- a magnetic read-write head 102 c is mounted to slider 102 a .
- Magnetic read-write head 102 c includes a write element (not shown) and a read element (not shown) for respectively writing and reading information stored on magnetic-recording medium 104 .
- HDD 100 further includes an arm 110 attached to HGA 102 , a carriage 112 , a voice-coil motor (VCM) that includes an armature 114 including a voice coil 116 attached to carriage 112 and a stator 118 including a voice-coil magnet (not visible).
- VCM voice-coil motor
- Armature 114 is attached to carriage 112 , and is mounted on a pivot-shaft 120 with an interposed pivot bearing assembly 122 .
- Armature 114 is configured to move arm 110 and HGA 102 to access portions of magnetic-recording medium 104 .
- carriage 112 is called an “E-block,” or comb, because the carriage is arranged to carry a ganged array of arms that gives it the appearance of a comb.
- a flexible interconnect cable (“flex cable”) 124 .
- Interconnection between flex cable 124 and magnetic read-write head 102 c may be provided by an arm-electronics (AE) module 126 .
- AE module 126 includes an on-board pre-amplifier for the read signal, as well as other read-channel and write-channel electronic components.
- AE module 126 may be attached to carriage 112 as shown.
- flex cable 124 is coupled to an electrical-connector block 128 , which provides electrical communication through electrical feed-throughs provided by an HDD housing 130 .
- HDD housing 130 also referred to as a base, in conjunction with an HDD cover (not shown) provides a sealed, protective enclosure for the information storage components of HDD 100 .
- DSP digital-signal processor
- the spinning magnetic-recording medium 104 commonly creates a cushion of air that acts as an air-bearing on which the air-bearing surface (ABS) of slider 102 a rides so that slider 102 a flies above the surface of magnetic-recording medium 104 without making contact with a thin magnetic-recording layer in which information is recorded.
- ABS air-bearing surface
- the spinning medium 104 creates a cushion of gas that acts as a gas or fluid bearing on which slider 102 a rides.
- voice coil 116 enables magnetic read-write head 102 c to access a track 134 on which information is recorded.
- armature 114 swings through an arc 136 , which enables magnetic read-write head 102 c to access various tracks on magnetic-recording medium 104 .
- Information is stored on magnetic-recording medium 104 in a plurality of radially nested tracks arranged in sectors on magnetic-recording medium 104 , such as sector 138 .
- each track is composed of a plurality of sectored track portions (or “track sector”), for example, track sector 140 .
- Each track sector 140 may be composed of recorded data and a header containing a servo-burst-signal pattern, for example, an ABCD-servo-burst-signal pattern, which is information that identifies track 134 , and error correction code information.
- a servo-burst-signal pattern for example, an ABCD-servo-burst-signal pattern, which is information that identifies track 134 , and error correction code information.
- the read element of magnetic read-write head 102 c reads the servo-burst-signal pattern which provides a position-error-signal (PES) to the servo electronics, which control the electrical signals provided to voice coil 116 , enabling magnetic read-write head 102 c to follow track 134 .
- PES position-error-signal
- magnetic read-write head 102 c Upon finding track 134 and identifying a particular track sector 140 , magnetic read-write head 102 c either reads data from track 134 or writes data to track 134 depending on instructions received by the disk controller from an external agent, for example, a microprocessor of a computer system.
- an external agent for example, a microprocessor of a computer system.
- a HDD's electronic architecture includes numerous electronic components for performing their respective functions for operation of an HDD, such as a hard disk controller (“HDC”), an interface controller, an arm electronics module, a data channel, a motor driver, a servo processor, buffer memory, etc. Two or more of such components may be combined on a single integrated circuit board referred to as a “system on a chip” (“SOC”). Several, if not all, of such electronic components are typically arranged on a printed circuit board that is coupled to the bottom side of an HDD, such as to HDD housing 130 .
- HDC hard disk controller
- SOC system on a chip
- references herein to a hard disk drive may encompass a data storage device that is at times referred to as a “hybrid drive.”
- a hybrid drive refers generally to a storage device having functionality of both a traditional HDD (e.g., HDD 100 ) combined with solid-state storage device (SSD) using non-volatile memory, such as flash or other solid-state (e.g., integrated circuits) memory, which is electrically erasable and programmable.
- the solid-state portion of a hybrid drive may include its own corresponding controller functionality, which may be integrated into a single controller along with the HDD functionality.
- a hybrid drive may be designed and configured to operate and to utilize the solid-state portion in a number of ways, such as, for non-limiting examples, by using the solid-state memory as cache memory, for storing frequently-accessed data, for storing I/O intensive data, and the like. Further, a hybrid drive may be architected and configured essentially as two storage devices in a single enclosure, i.e., a traditional HDD and an SSD, with either one or multiple interfaces for host connection.
- FIGS. 2A-2E depict various views of part of a HGA 200 that includes a slider 202 mounted to a suspension 204 .
- Slider 202 is an embodiment of slider 102 a of FIG. 1
- suspension 204 is an embodiment of suspension 102 b of FIG. 1 .
- FIG. 2A is a top view of HGA 200 , with slider 202 shown only in outline to reveal features below slider 202 .
- FIG. 2B is a top view of HGA 200 , with slider 202 attached to suspension 204 .
- FIG. 2C is a side view of HGA 200 .
- suspension 204 includes a stainless steel layer 206 , which provides structural support for HGA 200 .
- a first dielectric standoff 208 is disposed on stainless steel layer 206 , and provides electrical isolation for additional elements (not shown) of HGA 200 .
- first dielectric standoff 208 is polyimide, although other material may be used.
- first dielectric standoff 208 will be referred to in the remaining description as “first polyimide standoff 208 .”
- First polyimide standoff 208 also partially bounds adhesive pocket 210 , and provides height control for slider 202 .
- Adhesive pocket 210 contains an adhesive (not shown in FIGS. 2A-2C , but described below with reference to FIGS. 2D-2E ), such as epoxy, which bonds slider 202 to suspension 204 .
- the region on stainless steel layer 206 directly beneath slider 202 is referred to as a slider mounting point 212 , which is represented by the dashed-line rectangle in FIG. 2A .
- Slider mounting point 212 includes adhesive pocket 210 and first polyimide standoff 208 .
- Contact pad 214 is connected to the read/write element contacts of slider 202 by solder 216 . In an embodiment, contact pad 214 is made of gold-plated copper.
- first polyimide standoff 208 has a thickness (height) of between about 5 ⁇ m and about 10 ⁇ m, and a width of between about 50 ⁇ m and about 70 ⁇ m, although other thicknesses and widths may be used. In an embodiment, first polyimide standoff 208 has a generally V-type shape, although other shapes may be used.
- FIG. 2D illustrates multiple adhesive dots disposed on stainless steel layer 206 in adhesive pocket 210 prior to depositing slider 202 on stainless steel layer 206 .
- two adhesive dots 218 a and 218 b are disposed on stainless steel layer 206 in adhesive pocket 210 , although more than two adhesive dots may be used.
- adhesive dots 218 a and 218 b are substantially circular in shape, although other dot shapes (e.g., elliptical, rectangular, polygonal) may be used.
- a region 220 (shown in cross-hatch) of stainless steel layer 206 depicts the permissible area in which adhesive dots 218 a and 218 b may spread after slider 202 is deposited on stainless steel layer 206 .
- Region 220 also referred to herein as “permissible adhesive spread region 220 ” defines the outer limits of the region of stainless steel layer 206 in which adhesive may spread without causing damage to components of HGA 200 . In other words, it is desirable to limit or confine the spread of adhesive dots 218 a and 218 b to permissible adhesive spread region 220 .
- first polyimide standoff 208 has a shape designed to limit or confine the spread of adhesive dots 218 a and 218 b to permissible adhesive spread region 220 . In an embodiment, first polyimide standoff 208 has a shape that generally conforms to the shape of permissible adhesive spread region 220 .
- FIG. 2E illustrates an example spread of adhesive dots 218 a and 218 b after slider 202 (shown only in outline in FIG. 2E ) is deposited on stainless steel layer 206 .
- adhesive dots 218 a and 218 b merge and spread to form a merged adhesive shape 218 c that includes multiple portions 222 that extend beyond the boundaries of permissible adhesive spread region 220 .
- first polyimide standoff 208 confined portions of merged adhesive shape 218 c to permissible adhesive spread region 220
- first polyimide standoff 208 may not be effective to entirely confine merged adhesive shape 218 c within the boundaries of permissible adhesive spread region 220 .
- FIGS. 3A-3B depict top views of part of an embodiment of an HGA 300 a that includes a slider 202 mounted to a suspension 204 .
- FIG. 3A is a top view of HGA 300 a before slider 202 is attached to suspension 204
- FIG. 3B is a top view of HGA 300 a , with slider 202 attached to suspension 204 .
- HGA 300 a is similar to HGA 200 of FIGS. 2A-2E , and includes first polyimide standoff 208 .
- HGA 300 a also includes additional polyimide standoffs 302 a - 302 d .
- a second polyimide standoff 302 a and a third polyimide standoff 302 b are disposed near an upper perimeter of permissible adhesive spread region 220
- a fourth polyimide standoff 302 c and a fifth polyimide standoff 302 d are disposed in a central region of permissible adhesive spread region 220 .
- second polyimide standoff 302 a , third polyimide standoff 302 b , fourth polyimide standoff 302 c and fifth polyimide standoff 302 d each have a thickness (height) of between about 5 ⁇ m and about 10 ⁇ m, and a width of between about 50 ⁇ m and about 70 ⁇ m, although other thicknesses and widths may be used.
- second polyimide standoff 302 a , third polyimide standoff 302 b , fourth polyimide standoff 302 c and fifth polyimide standoff 302 d each have a generally rectangular shape, although other shapes may be used.
- second polyimide standoff 302 a and third polyimide standoff 302 b extend in a direction substantially parallel to the upper perimeter of permissible adhesive spread region 220 .
- fourth polyimide standoff 302 c and fifth polyimide standoff 302 d are disposed at an angle (e.g., positive and negative 45 degrees, respectively) relative to the orientation of second polyimide standoff 302 a and third polyimide standoff 302 b , as depicted in FIG. 3A .
- second polyimide standoff 302 a and third polyimide standoff 302 b may be formed as distinct features, independent of first polyimide standoff 208 , or may be formed as a unitary feature with first polyimide standoff 208 .
- fourth polyimide standoff 302 c and fifth polyimide standoff 302 d are formed as distinct features, independent of one another, and of first polyimide standoff 208 , second polyimide standoff 302 a and third polyimide standoff 302 b.
- FIG. 3B illustrates an example spread of adhesive dots 218 a and 218 b after slider 202 (shown only in outline in FIG. 3B ) is deposited on stainless steel layer 206 .
- adhesive dots 218 a and 218 b merge and spread to form a merged adhesive shape 304 .
- first polyimide standoff 208 , second polyimide standoff 302 a , third polyimide standoff 302 b , fourth polyimide standoff 302 c and fifth polyimide standoff 302 d of FIGS. 3A-3B may confine merged adhesive shape 304 within the boundaries of permissible adhesive spread region 220 .
- FIG. 3C depicts a top view of part of an embodiment of an HGA 300 b before slider 202 is attached to suspension 204 .
- HGA 300 b is similar to HGA 300 a of FIGS. 3A-3B , but includes a sixth polyimide standoff 302 ab (instead of second polyimide standoff 302 a and third polyimide standoff 302 b ) that is disposed near an upper perimeter of permissible adhesive spread region 220 .
- sixth polyimide standoff 302 ab extends in a direction substantially parallel to the upper perimeter of permissible adhesive spread region 220 .
- sixth polyimide standoff 302 ab has a thickness (height) of between about 5 ⁇ m and about 10 ⁇ m, and a width of between 50 ⁇ m and about 70 ⁇ m, although other thicknesses and widths may be used. In an embodiment, sixth polyimide standoff 302 ab has a generally rectangular shape, although other shapes may be used.
- sixth polyimide standoff 302 ab may be formed as a distinct feature, independent of first polyimide standoff 208 , or may be formed as a unitary feature with first polyimide standoff 208 .
- fourth polyimide standoff 302 c and fifth polyimide standoff 302 d are formed as distinct features, independent of one another, and of first polyimide standoff 208 , and sixth polyimide standoff 302 ab.
- first polyimide standoff 208 , fourth polyimide standoff 302 c , fifth polyimide standoff 302 d and sixth polyimide standoff 302 ab of FIG. 3C may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- a merged adhesive shape e.g., a merger of adhesive dots 218 a and 218 b
- FIG. 3D depicts a top view of part of an embodiment of an HGA 300 c before slider 202 is attached to suspension 204 .
- HGA 300 c is similar to HGA 300 a of FIGS. 3A-3B , but fourth polyimide standoff 302 c and fifth polyimide standoff 302 d are disposed substantially parallel to the orientation of second polyimide standoff 302 a and third polyimide standoff 302 b .
- first polyimide standoff 208 , second polyimide standoff 302 a , third polyimide standoff 302 b , fourth polyimide standoff 302 c and fifth polyimide standoff 302 d of FIG. 3D may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- a merged adhesive shape e.g., a merger of adhesive dots 218 a and 218 b
- FIG. 3E depicts a top view of part of an embodiment of an HGA 300 d before slider 202 is attached to suspension 204 .
- HGA 300 d is similar to HGA 300 c of FIG. 3D , but includes sixth polyimide standoff 302 ab (instead of second polyimide standoff 302 a and third polyimide standoff 302 b ) that is disposed near an upper perimeter of permissible adhesive spread region 220 .
- first polyimide standoff 208 , fourth polyimide standoff 302 c , fifth polyimide standoff 302 d and sixth polyimide standoff 302 ab of FIG. 3E may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- FIG. 3F depicts a top view of part of an embodiment of an HGA 300 e before slider 202 is attached to suspension 204 .
- HGA 300 e is similar to HGA 300 c of FIG. 3D , but fourth polyimide standoff 302 c and fifth polyimide standoff 302 d are disposed substantially perpendicular to the orientation of second polyimide standoff 302 a and third polyimide standoff 302 b .
- first polyimide standoff 208 , second polyimide standoff 302 a , third polyimide standoff 302 b , fourth polyimide standoff 302 c and fifth polyimide standoff 302 d of FIG. 3F may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- a merged adhesive shape e.g., a merger of adhesive dots 218 a and 218 b
- FIG. 3G depicts a top view of part of an embodiment of an HGA 300 f before slider 202 is attached to suspension 204 .
- HGA 300 f is similar to HGA 300 e of FIG. 3F , but includes sixth polyimide standoff 302 ab (instead of second polyimide standoff 302 a and third polyimide standoff 302 b ) that is disposed near an upper perimeter of permissible adhesive spread region 220 .
- first polyimide standoff 208 , fourth polyimide standoff 302 c , fifth polyimide standoff 302 d and sixth polyimide standoff 302 ab of FIG. 3G may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- FIG. 3H depicts a top view of part of an embodiment of an HGA 300 g before slider 202 is attached to suspension 204 .
- HGA 300 g is similar to HGA 300 c of FIG. 3D , but includes a seventh polyimide standoff 302 cd (instead of fourth polyimide standoff 302 c and fifth polyimide standoff 302 d ).
- seventh polyimide standoff 302 cd has a thickness (height) of between about 5 ⁇ m and about 10 ⁇ m, and a width of between about 50 ⁇ m and about 70 ⁇ m, although other thicknesses and widths may be used.
- seventh polyimide standoff 302 cd has a generally rectangular shape, although other shapes may be used.
- seventh polyimide standoff 302 cd extends between the areas occupied by fourth polyimide standoff 302 c and fifth polyimide standoff 302 d of FIG. 3D .
- seventh polyimide standoff 302 cd is formed as a distinct feature, independent of first polyimide standoff 208 , second polyimide standoff 302 a , and third polyimide standoff 302 b.
- first polyimide standoff 208 , second polyimide standoff 302 a , third polyimide standoff 302 b , and seventh polyimide standoff 302 cd of FIG. 3H may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- a merged adhesive shape e.g., a merger of adhesive dots 218 a and 218 b
- FIG. 3I depicts a top view of part of an embodiment of an HGA 300 h before slider 202 is attached to suspension 204 .
- HGA 300 h is similar to HGA 300 g of FIG. 3H , but includes sixth polyimide standoff 302 ab (instead of second polyimide standoff 302 a and third polyimide standoff 302 b ) that is disposed near an upper perimeter of permissible adhesive spread region 220 .
- first polyimide standoff 208 , sixth polyimide standoff 302 ab , and seventh polyimide standoff 302 cd of FIG. 3I may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- FIG. 3J depicts a top view of part of an embodiment of an HGA 300 i before slider 202 is attached to suspension 204 .
- HGA 300 i is similar to HGA 300 g of FIG. 3H , but includes a shorter-length seventh polyimide standoff 302 cd (e.g., approximately the same length as that of fourth polyimide standoff 302 c and fifth polyimide standoff 302 d of FIG. 3D ).
- first polyimide standoff 208 , second polyimide standoff 302 a , third polyimide standoff 302 b , and seventh polyimide standoff 302 cd of FIG. 3J may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- FIG. 3K depicts a top view of part of an embodiment of an HGA 300 j before slider 202 is attached to suspension 204 .
- HGA 300 j is similar to HGA 300 i of FIG. 3J , but includes sixth polyimide standoff 302 ab (instead of second polyimide standoff 302 a and third polyimide standoff 302 b ) that is disposed near an upper perimeter of permissible adhesive spread region 220 .
- first polyimide standoff 208 , sixth polyimide standoff 302 ab , and seventh polyimide standoff 302 cd of FIG. 3K may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- FIG. 3L depicts a top view of part of an embodiment of an HGA 300 k before slider 202 is attached to suspension 204 .
- HGA 300 k is similar to HGA 300 i of FIG. 3J , but seventh polyimide standoff 302 cd is disposed substantially perpendicular to the orientation of second polyimide standoff 302 a and third polyimide standoff 302 b .
- first polyimide standoff 208 , second polyimide standoff 302 a , third polyimide standoff 302 b , and seventh polyimide standoff 302 cd of FIG. 3L may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- a merged adhesive shape e.g., a merger of adhesive dots 218 a and 218 b
- FIG. 3M depicts a top view of part of an embodiment of an HGA 300 l before slider 202 is attached to suspension 204 .
- HGA 300 l is similar to HGA 300 k of FIG. 3L , but includes sixth polyimide standoff 302 ab (instead of second polyimide standoff 302 a and third polyimide standoff 302 b ) that is disposed near an upper perimeter of permissible adhesive spread region 220 .
- first polyimide standoff 208 , sixth polyimide standoff 302 ab , and seventh polyimide standoff 302 cd of FIG. 3M may confine a merged adhesive shape (e.g., a merger of adhesive dots 218 a and 218 b ) within the boundaries of permissible adhesive spread region 220 .
- x merged adhesive shape
- One embodiment includes a head gimbal assembly for a data storage device.
- the head gimbal assembly includes a suspension, and a slider mounting point on the suspension.
- the slider mounting point includes an adhesive pocket bounded by a plurality of dielectric standoffs.
- One embodiment includes a data recording device that includes a disk having a data surface of concentric data tracks, a rotator for rotating the disk about an axis generally perpendicular to the disk, a slider maintained in operative relationship with the data surface when the disk is rotating, a suspension coupled to the slider with an adhesive, a plurality of dielectric standoffs disposed on the suspension to confine a spread of the adhesive, a transducer attached to the slider for reading data from and writing data to the data surface, an actuator for moving the slider generally radially to the disk to allow the transducer to access the data tracks, and an electronics module for processing data read from and written to the data surface.
- the head gimbal assembly includes a suspension, a plurality of adhesive dots on the suspension, a permissible adhesive spread region on the suspension, the permissible adhesive spread region defining outer limits in which the adhesive dots may spread without causing damage to the head gimbal assembly, a first dielectric standoff disposed on the suspension, the first dielectric standoff comprising a shape that conforms to a shape of permissible adhesive spread region, and a second dielectric standoff disposed on the suspension, the second dielectric standoff disposed in a central region of the permissible adhesive spread region.
- a connection may be a direct connection or an indirect connection (e.g., via one or more other parts).
- the element when an element is referred to as being connected or coupled to another element, the element may be directly connected to the other element or indirectly connected to the other element via intervening elements.
- the element When an element is referred to as being directly connected to another element, then there are no intervening elements between the element and the other element.
- Two devices are “in communication” if they are directly or indirectly connected so that they can communicate electronic signals between them.
- first and second object are used as identification labels to distinguish the register and are not meant to indicate an order or priority.
- set of objects may refer to a “set” of one or more of the objects.
Landscapes
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
- This disclosure relates to head assemblies used in data storage devices.
- A hard-disk drive is a non-volatile storage device that is housed in a protective enclosure and stores digitally encoded data on one or more circular disks having magnetic surfaces. In operation, each magnetic-recording disk of a hard-disk drive is rapidly rotated by a spindle system. Data are read from and written to a magnetic-recording disk using a read-write head that is positioned over a specific location of a disk by an actuator. A read-write head uses a magnetic field to read data from and write data to the surface of a magnetic-recording disk. A write head makes use of the electricity flowing through a coil, which produces a magnetic field. Electrical pulses are sent to the write head, with different patterns of positive and negative currents. The current in the coil of the write head induces a magnetic field across the gap between the head and the magnetic disk, which in turn magnetizes a small area on the recording medium.
- The read-write head is fabricated in a head slider, which is coupled with a suspension in a head gimbal assembly. An adhesive often is used to adhere the slider to the suspension. It is desirable to improve techniques for adhering the slider to the suspension.
- Like-numbered elements refer to common components in the different figures.
-
FIG. 1 is a plan view illustrating an embodiment of a hard disk drive. -
FIGS. 2A-2E depict various views of part of an embodiment of a head gimbal assembly. -
FIGS. 3A-3M depict various views of part of an embodiment of a head gimbal assembly. - A head gimbal assembly is described for a data storage device. The head gimbal assembly includes a suspension, and a slider mounting point on the suspension. The slider mounting point includes an adhesive pocket bounded by multiple dielectric standoffs. The multiple dielectric standoffs are configured to limit a spread of multiple adhesive dots disposed in the adhesive pocket.
- Embodiments may be used in the context of a head gimbal assembly (HGA) for a hard disk drive (HDD).
FIG. 1 illustrates a functional arrangement of components of anexample HDD 100, which includes aHGA 102, a magnetic-recording medium 104 rotatably mounted on aspindle 106 and a drive motor (not visible) attached tospindle 106 for rotating magnetic-recording medium 104. Magnetic-recording medium 104 (or a plurality of disk media) may be affixed to spindle 106 with adisk clamp 108. - In an embodiment, HGA 102 includes a
slider 102 a mounted to asuspension 102 b. A magnetic read-writehead 102 c is mounted toslider 102 a. Magnetic read-writehead 102 c includes a write element (not shown) and a read element (not shown) for respectively writing and reading information stored on magnetic-recording medium 104. - HDD 100 further includes an
arm 110 attached to HGA 102, acarriage 112, a voice-coil motor (VCM) that includes anarmature 114 including avoice coil 116 attached tocarriage 112 and astator 118 including a voice-coil magnet (not visible).Armature 114 is attached tocarriage 112, and is mounted on a pivot-shaft 120 with an interposedpivot bearing assembly 122.Armature 114 is configured to movearm 110 and HGA 102 to access portions of magnetic-recording medium 104. In the case of an HDD having multiple disks,carriage 112 is called an “E-block,” or comb, because the carriage is arranged to carry a ganged array of arms that gives it the appearance of a comb. - Electrical signals (e.g., current to voice coil 116) comprising a write signal to and a read signal from magnetic read-write
head 102 c are provided by a flexible interconnect cable (“flex cable”) 124. Interconnection betweenflex cable 124 and magnetic read-writehead 102 c may be provided by an arm-electronics (AE)module 126. In an embodiment,AE module 126 includes an on-board pre-amplifier for the read signal, as well as other read-channel and write-channel electronic components.AE module 126 may be attached tocarriage 112 as shown. - In an embodiment,
flex cable 124 is coupled to an electrical-connector block 128, which provides electrical communication through electrical feed-throughs provided by anHDD housing 130.HDD housing 130, also referred to as a base, in conjunction with an HDD cover (not shown) provides a sealed, protective enclosure for the information storage components ofHDD 100. - Other electronic components (not shown), including a disk controller and servo electronics including a digital-signal processor (DSP), provide electrical signals to the drive motor,
voice coil 116 and magnetic read-writehead 102 c. Electrical signals provided to the drive motor enables the drive motor to spin providing a torque tospindle 106 which is in turn transmitted to magnetic-recording medium 104. As a result, magnetic-recording medium 104 spins in adirection 132. - The spinning magnetic-
recording medium 104 commonly creates a cushion of air that acts as an air-bearing on which the air-bearing surface (ABS) ofslider 102 a rides so thatslider 102 a flies above the surface of magnetic-recording medium 104 without making contact with a thin magnetic-recording layer in which information is recorded. Similarly in an HDD in which a lighter-than-air gas is utilized, such as helium or nitrogen for non-limiting examples, the spinningmedium 104 creates a cushion of gas that acts as a gas or fluid bearing on which slider 102 a rides. - Electrical signals provided to
voice coil 116 enables magnetic read-writehead 102 c to access atrack 134 on which information is recorded. Thus,armature 114 swings through anarc 136, which enables magnetic read-writehead 102 c to access various tracks on magnetic-recording medium 104. Information is stored on magnetic-recording medium 104 in a plurality of radially nested tracks arranged in sectors on magnetic-recording medium 104, such assector 138. Correspondingly, each track is composed of a plurality of sectored track portions (or “track sector”), for example,track sector 140. - Each
track sector 140 may be composed of recorded data and a header containing a servo-burst-signal pattern, for example, an ABCD-servo-burst-signal pattern, which is information that identifiestrack 134, and error correction code information. In accessingtrack 134, the read element of magnetic read-writehead 102 c reads the servo-burst-signal pattern which provides a position-error-signal (PES) to the servo electronics, which control the electrical signals provided tovoice coil 116, enabling magnetic read-writehead 102 c to followtrack 134. Upon findingtrack 134 and identifying aparticular track sector 140, magnetic read-writehead 102 c either reads data fromtrack 134 or writes data totrack 134 depending on instructions received by the disk controller from an external agent, for example, a microprocessor of a computer system. - A HDD's electronic architecture includes numerous electronic components for performing their respective functions for operation of an HDD, such as a hard disk controller (“HDC”), an interface controller, an arm electronics module, a data channel, a motor driver, a servo processor, buffer memory, etc. Two or more of such components may be combined on a single integrated circuit board referred to as a “system on a chip” (“SOC”). Several, if not all, of such electronic components are typically arranged on a printed circuit board that is coupled to the bottom side of an HDD, such as to
HDD housing 130. - References herein to a hard disk drive, such as HDD 100 illustrated and described in reference to
FIG. 1 , may encompass a data storage device that is at times referred to as a “hybrid drive.” A hybrid drive refers generally to a storage device having functionality of both a traditional HDD (e.g., HDD 100) combined with solid-state storage device (SSD) using non-volatile memory, such as flash or other solid-state (e.g., integrated circuits) memory, which is electrically erasable and programmable. As operation, management and control of the different types of storage media typically differs, the solid-state portion of a hybrid drive may include its own corresponding controller functionality, which may be integrated into a single controller along with the HDD functionality. - A hybrid drive may be designed and configured to operate and to utilize the solid-state portion in a number of ways, such as, for non-limiting examples, by using the solid-state memory as cache memory, for storing frequently-accessed data, for storing I/O intensive data, and the like. Further, a hybrid drive may be architected and configured essentially as two storage devices in a single enclosure, i.e., a traditional HDD and an SSD, with either one or multiple interfaces for host connection.
-
FIGS. 2A-2E depict various views of part of aHGA 200 that includes aslider 202 mounted to asuspension 204.Slider 202 is an embodiment ofslider 102 a ofFIG. 1 , andsuspension 204 is an embodiment ofsuspension 102 b ofFIG. 1 .FIG. 2A is a top view ofHGA 200, withslider 202 shown only in outline to reveal features belowslider 202.FIG. 2B is a top view ofHGA 200, withslider 202 attached tosuspension 204.FIG. 2C is a side view ofHGA 200. - In an embodiment,
suspension 204 includes astainless steel layer 206, which provides structural support forHGA 200. Afirst dielectric standoff 208 is disposed onstainless steel layer 206, and provides electrical isolation for additional elements (not shown) ofHGA 200. In an embodiment,first dielectric standoff 208 is polyimide, although other material may be used. For simplicity,first dielectric standoff 208 will be referred to in the remaining description as “first polyimide standoff 208.” -
First polyimide standoff 208 also partially boundsadhesive pocket 210, and provides height control forslider 202.Adhesive pocket 210 contains an adhesive (not shown inFIGS. 2A-2C , but described below with reference toFIGS. 2D-2E ), such as epoxy, which bondsslider 202 tosuspension 204. The region onstainless steel layer 206 directly beneathslider 202 is referred to as aslider mounting point 212, which is represented by the dashed-line rectangle inFIG. 2A .Slider mounting point 212 includesadhesive pocket 210 andfirst polyimide standoff 208.Contact pad 214 is connected to the read/write element contacts ofslider 202 bysolder 216. In an embodiment,contact pad 214 is made of gold-plated copper. - In an embodiment,
first polyimide standoff 208 has a thickness (height) of between about 5 μm and about 10 μm, and a width of between about 50 μm and about 70 μm, although other thicknesses and widths may be used. In an embodiment,first polyimide standoff 208 has a generally V-type shape, although other shapes may be used. -
FIG. 2D illustrates multiple adhesive dots disposed onstainless steel layer 206 inadhesive pocket 210 prior to depositingslider 202 onstainless steel layer 206. In an embodiment, twoadhesive dots 218 a and 218 b are disposed onstainless steel layer 206 inadhesive pocket 210, although more than two adhesive dots may be used. In an embodiment,adhesive dots 218 a and 218 b are substantially circular in shape, although other dot shapes (e.g., elliptical, rectangular, polygonal) may be used. - After
slider 202 is deposited onstainless steel layer 206,adhesive dots 218 a and 218 b tend to spread, due to the viscosity of the adhesive. A region 220 (shown in cross-hatch) ofstainless steel layer 206 depicts the permissible area in whichadhesive dots 218 a and 218 b may spread afterslider 202 is deposited onstainless steel layer 206.Region 220, also referred to herein as “permissibleadhesive spread region 220” defines the outer limits of the region ofstainless steel layer 206 in which adhesive may spread without causing damage to components ofHGA 200. In other words, it is desirable to limit or confine the spread ofadhesive dots 218 a and 218 b to permissibleadhesive spread region 220. - In an embodiment,
first polyimide standoff 208 has a shape designed to limit or confine the spread ofadhesive dots 218 a and 218 b to permissibleadhesive spread region 220. In an embodiment,first polyimide standoff 208 has a shape that generally conforms to the shape of permissibleadhesive spread region 220. - However,
FIG. 2E illustrates an example spread ofadhesive dots 218 a and 218 b after slider 202 (shown only in outline inFIG. 2E ) is deposited onstainless steel layer 206. In an embodiment,adhesive dots 218 a and 218 b merge and spread to form a mergedadhesive shape 218 c that includesmultiple portions 222 that extend beyond the boundaries of permissibleadhesive spread region 220. Thus, althoughfirst polyimide standoff 208 confined portions of mergedadhesive shape 218 c to permissibleadhesive spread region 220,first polyimide standoff 208 may not be effective to entirely confine mergedadhesive shape 218 c within the boundaries of permissibleadhesive spread region 220. -
FIGS. 3A-3B depict top views of part of an embodiment of anHGA 300 a that includes aslider 202 mounted to asuspension 204.FIG. 3A is a top view ofHGA 300 a beforeslider 202 is attached tosuspension 204, andFIG. 3B is a top view ofHGA 300 a, withslider 202 attached tosuspension 204. -
HGA 300 a is similar toHGA 200 ofFIGS. 2A-2E , and includesfirst polyimide standoff 208.HGA 300 a also includes additional polyimide standoffs 302 a-302 d. In particular, asecond polyimide standoff 302 a and athird polyimide standoff 302 b are disposed near an upper perimeter of permissibleadhesive spread region 220, and afourth polyimide standoff 302 c and afifth polyimide standoff 302 d are disposed in a central region of permissibleadhesive spread region 220. - In an embodiment,
second polyimide standoff 302 a,third polyimide standoff 302 b,fourth polyimide standoff 302 c andfifth polyimide standoff 302 d each have a thickness (height) of between about 5 μm and about 10 μm, and a width of between about 50 μm and about 70 μm, although other thicknesses and widths may be used. In an embodiment,second polyimide standoff 302 a,third polyimide standoff 302 b,fourth polyimide standoff 302 c andfifth polyimide standoff 302 d each have a generally rectangular shape, although other shapes may be used. - In an embodiment,
second polyimide standoff 302 a andthird polyimide standoff 302 b extend in a direction substantially parallel to the upper perimeter of permissibleadhesive spread region 220. In an embodiment,fourth polyimide standoff 302 c andfifth polyimide standoff 302 d are disposed at an angle (e.g., positive and negative 45 degrees, respectively) relative to the orientation ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b, as depicted inFIG. 3A . - In an embodiment,
second polyimide standoff 302 a andthird polyimide standoff 302 b may be formed as distinct features, independent offirst polyimide standoff 208, or may be formed as a unitary feature withfirst polyimide standoff 208. In an embodiment,fourth polyimide standoff 302 c andfifth polyimide standoff 302 d are formed as distinct features, independent of one another, and offirst polyimide standoff 208,second polyimide standoff 302 a andthird polyimide standoff 302 b. -
FIG. 3B illustrates an example spread ofadhesive dots 218 a and 218 b after slider 202 (shown only in outline inFIG. 3B ) is deposited onstainless steel layer 206. In an embodiment,adhesive dots 218 a and 218 b merge and spread to form a mergedadhesive shape 304. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208,second polyimide standoff 302 a,third polyimide standoff 302 b,fourth polyimide standoff 302 c andfifth polyimide standoff 302 d ofFIGS. 3A-3B may confine mergedadhesive shape 304 within the boundaries of permissibleadhesive spread region 220. -
FIG. 3C depicts a top view of part of an embodiment of anHGA 300 b beforeslider 202 is attached tosuspension 204.HGA 300 b is similar toHGA 300 a ofFIGS. 3A-3B , but includes a sixth polyimide standoff 302 ab (instead ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b) that is disposed near an upper perimeter of permissibleadhesive spread region 220. In an embodiment, sixth polyimide standoff 302 ab extends in a direction substantially parallel to the upper perimeter of permissibleadhesive spread region 220. - In an embodiment, sixth polyimide standoff 302 ab has a thickness (height) of between about 5 μm and about 10 μm, and a width of between 50 μm and about 70 μm, although other thicknesses and widths may be used. In an embodiment, sixth polyimide standoff 302 ab has a generally rectangular shape, although other shapes may be used.
- In an embodiment, sixth polyimide standoff 302 ab may be formed as a distinct feature, independent of
first polyimide standoff 208, or may be formed as a unitary feature withfirst polyimide standoff 208. In an embodiment,fourth polyimide standoff 302 c andfifth polyimide standoff 302 d are formed as distinct features, independent of one another, and offirst polyimide standoff 208, and sixth polyimide standoff 302 ab. - Without wanting to be bound by any particular theory, it is believed that
first polyimide standoff 208,fourth polyimide standoff 302 c,fifth polyimide standoff 302 d and sixth polyimide standoff 302 ab ofFIG. 3C may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3D depicts a top view of part of an embodiment of anHGA 300 c beforeslider 202 is attached tosuspension 204.HGA 300 c is similar toHGA 300 a ofFIGS. 3A-3B , butfourth polyimide standoff 302 c andfifth polyimide standoff 302 d are disposed substantially parallel to the orientation ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208,second polyimide standoff 302 a,third polyimide standoff 302 b,fourth polyimide standoff 302 c andfifth polyimide standoff 302 d ofFIG. 3D may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3E depicts a top view of part of an embodiment of anHGA 300 d beforeslider 202 is attached tosuspension 204.HGA 300 d is similar toHGA 300 c ofFIG. 3D , but includes sixth polyimide standoff 302 ab (instead ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b) that is disposed near an upper perimeter of permissibleadhesive spread region 220. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208,fourth polyimide standoff 302 c,fifth polyimide standoff 302 d and sixth polyimide standoff 302 ab ofFIG. 3E may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3F depicts a top view of part of an embodiment of anHGA 300 e beforeslider 202 is attached tosuspension 204.HGA 300 e is similar toHGA 300 c ofFIG. 3D , butfourth polyimide standoff 302 c andfifth polyimide standoff 302 d are disposed substantially perpendicular to the orientation ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208,second polyimide standoff 302 a,third polyimide standoff 302 b,fourth polyimide standoff 302 c andfifth polyimide standoff 302 d ofFIG. 3F may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3G depicts a top view of part of an embodiment of anHGA 300 f beforeslider 202 is attached tosuspension 204.HGA 300 f is similar toHGA 300 e ofFIG. 3F , but includes sixth polyimide standoff 302 ab (instead ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b) that is disposed near an upper perimeter of permissibleadhesive spread region 220. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208,fourth polyimide standoff 302 c,fifth polyimide standoff 302 d and sixth polyimide standoff 302 ab ofFIG. 3G may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3H depicts a top view of part of an embodiment of anHGA 300 g beforeslider 202 is attached tosuspension 204.HGA 300 g is similar toHGA 300 c ofFIG. 3D , but includes a seventh polyimide standoff 302 cd (instead offourth polyimide standoff 302 c andfifth polyimide standoff 302 d). In an embodiment, seventh polyimide standoff 302 cd has a thickness (height) of between about 5 μm and about 10 μm, and a width of between about 50 μm and about 70 μm, although other thicknesses and widths may be used. In an embodiment, seventh polyimide standoff 302 cd has a generally rectangular shape, although other shapes may be used. - In an embodiment, seventh polyimide standoff 302 cd extends between the areas occupied by
fourth polyimide standoff 302 c andfifth polyimide standoff 302 d ofFIG. 3D . In an embodiment, seventh polyimide standoff 302 cd is formed as a distinct feature, independent offirst polyimide standoff 208,second polyimide standoff 302 a, andthird polyimide standoff 302 b. - Without wanting to be bound by any particular theory, it is believed that
first polyimide standoff 208,second polyimide standoff 302 a,third polyimide standoff 302 b, and seventh polyimide standoff 302 cd ofFIG. 3H may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3I depicts a top view of part of an embodiment of anHGA 300 h beforeslider 202 is attached tosuspension 204.HGA 300 h is similar toHGA 300 g ofFIG. 3H , but includes sixth polyimide standoff 302 ab (instead ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b) that is disposed near an upper perimeter of permissibleadhesive spread region 220. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208, sixth polyimide standoff 302 ab, and seventh polyimide standoff 302 cd ofFIG. 3I may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3J depicts a top view of part of an embodiment of anHGA 300 i beforeslider 202 is attached tosuspension 204.HGA 300 i is similar toHGA 300 g ofFIG. 3H , but includes a shorter-length seventh polyimide standoff 302 cd (e.g., approximately the same length as that offourth polyimide standoff 302 c andfifth polyimide standoff 302 d ofFIG. 3D ). Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208,second polyimide standoff 302 a,third polyimide standoff 302 b, and seventh polyimide standoff 302 cd ofFIG. 3J may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3K depicts a top view of part of an embodiment of anHGA 300 j beforeslider 202 is attached tosuspension 204.HGA 300 j is similar toHGA 300 i ofFIG. 3J , but includes sixth polyimide standoff 302 ab (instead ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b) that is disposed near an upper perimeter of permissibleadhesive spread region 220. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208, sixth polyimide standoff 302 ab, and seventh polyimide standoff 302 cd ofFIG. 3K may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3L depicts a top view of part of an embodiment of anHGA 300 k beforeslider 202 is attached tosuspension 204.HGA 300 k is similar toHGA 300 i ofFIG. 3J , but seventh polyimide standoff 302 cd is disposed substantially perpendicular to the orientation ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208,second polyimide standoff 302 a,third polyimide standoff 302 b, and seventh polyimide standoff 302 cd ofFIG. 3L may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissibleadhesive spread region 220. -
FIG. 3M depicts a top view of part of an embodiment of an HGA 300 l beforeslider 202 is attached tosuspension 204. HGA 300 l is similar toHGA 300 k ofFIG. 3L , but includes sixth polyimide standoff 302 ab (instead ofsecond polyimide standoff 302 a andthird polyimide standoff 302 b) that is disposed near an upper perimeter of permissibleadhesive spread region 220. Without wanting to be bound by any particular theory, it is believed thatfirst polyimide standoff 208, sixth polyimide standoff 302 ab, and seventh polyimide standoff 302 cd ofFIG. 3M may confine a merged adhesive shape (e.g., a merger ofadhesive dots 218 a and 218 b) within the boundaries of permissible adhesive spread region 220.x - One embodiment includes a head gimbal assembly for a data storage device. The head gimbal assembly includes a suspension, and a slider mounting point on the suspension. The slider mounting point includes an adhesive pocket bounded by a plurality of dielectric standoffs.
- One embodiment includes a data recording device that includes a disk having a data surface of concentric data tracks, a rotator for rotating the disk about an axis generally perpendicular to the disk, a slider maintained in operative relationship with the data surface when the disk is rotating, a suspension coupled to the slider with an adhesive, a plurality of dielectric standoffs disposed on the suspension to confine a spread of the adhesive, a transducer attached to the slider for reading data from and writing data to the data surface, an actuator for moving the slider generally radially to the disk to allow the transducer to access the data tracks, and an electronics module for processing data read from and written to the data surface.
- One embodiment includes a head gimbal assembly for a data storage device. The head gimbal assembly includes a suspension, a plurality of adhesive dots on the suspension, a permissible adhesive spread region on the suspension, the permissible adhesive spread region defining outer limits in which the adhesive dots may spread without causing damage to the head gimbal assembly, a first dielectric standoff disposed on the suspension, the first dielectric standoff comprising a shape that conforms to a shape of permissible adhesive spread region, and a second dielectric standoff disposed on the suspension, the second dielectric standoff disposed in a central region of the permissible adhesive spread region.
- For purposes of this document, reference in the specification to “an embodiment,” “one embodiment,” “some embodiments,” or “another embodiment” may be used to describe different embodiments or the same embodiment.
- For purposes of this document, a connection may be a direct connection or an indirect connection (e.g., via one or more other parts). In some cases, when an element is referred to as being connected or coupled to another element, the element may be directly connected to the other element or indirectly connected to the other element via intervening elements. When an element is referred to as being directly connected to another element, then there are no intervening elements between the element and the other element. Two devices are “in communication” if they are directly or indirectly connected so that they can communicate electronic signals between them.
- For purposes of this document, the term “based on” may be read as “based at least in part on.”
- For purposes of this document, without additional context, use of numerical terms such as a “first” object, a “second” object, and a “third” object may not imply an ordering of objects, but may instead be used for identification purposes to identify different objects. For example, the terms “first” and “second” in the phrases first register and second register are used as identification labels to distinguish the register and are not meant to indicate an order or priority.
- For purposes of this document, the term “set” of objects may refer to a “set” of one or more of the objects.
- The foregoing detailed description has been presented for purposes of illustration and description, and is not intended to be exhaustive or to limit to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The described embodiments were chosen to best explain the principles and practical application of the disclosed technology, to thereby enable others skilled in the art to best utilize the technology in various embodiments and with various modifications as are suited to the particular use contemplated. The scope of the disclosed technology is defined by the appended claims.
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/778,433 US11081130B1 (en) | 2020-01-31 | 2020-01-31 | Suspension standoff arrangement for confining adhesive |
PCT/US2020/035013 WO2021154324A1 (en) | 2020-01-31 | 2020-05-28 | Suspension standoff arrangement for confining adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/778,433 US11081130B1 (en) | 2020-01-31 | 2020-01-31 | Suspension standoff arrangement for confining adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
US11081130B1 US11081130B1 (en) | 2021-08-03 |
US20210241790A1 true US20210241790A1 (en) | 2021-08-05 |
Family
ID=77062293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/778,433 Active US11081130B1 (en) | 2020-01-31 | 2020-01-31 | Suspension standoff arrangement for confining adhesive |
Country Status (2)
Country | Link |
---|---|
US (1) | US11081130B1 (en) |
WO (1) | WO2021154324A1 (en) |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3296187B2 (en) * | 1996-04-15 | 2002-06-24 | ティーディーケイ株式会社 | Magnetic head slider support mechanism and head gimbal assembly using the support mechanism |
US5907452A (en) * | 1997-10-20 | 1999-05-25 | International Business Machines Corporation | Apparatus and method to dampen flex cable vibration to disk drive actuator |
JPH11149625A (en) | 1997-11-19 | 1999-06-02 | Fujitsu Ltd | Suspension for head assembly, and method of manufacturing head assembly and suspension for head assembly |
US6657821B1 (en) | 2001-09-28 | 2003-12-02 | Hutchinson Technology Incorporated | Hand suspension with compliant locating feature |
CN100392724C (en) | 2003-09-27 | 2008-06-04 | 新科实业有限公司 | Method and system for partial potting magnetic head slider to magnetic head suspension |
US7199979B2 (en) | 2004-01-20 | 2007-04-03 | Seagate Technology Llc | Head gimbal assembly using slider and gimbal features |
JP2006252657A (en) * | 2005-03-10 | 2006-09-21 | Alps Electric Co Ltd | Magnetic head |
US20060285249A1 (en) | 2005-06-15 | 2006-12-21 | Shinobu Hagiya | Method for reducing PSA tilt in Femto format sliders through increased adhesive area |
US7545605B2 (en) | 2005-06-15 | 2009-06-09 | Hitachi Global Storage Technologies Netherlands B.V. | Method for reducing PSA tilt through standoff relocation |
US20060285252A1 (en) | 2005-06-15 | 2006-12-21 | Shinobu Hagiya | Head assembly with reduced PSA tilt |
US8553364B1 (en) | 2005-09-09 | 2013-10-08 | Magnecomp Corporation | Low impedance, high bandwidth disk drive suspension circuit |
US7729089B1 (en) | 2006-10-13 | 2010-06-01 | Western Digital Technologies, Inc. | Head-gimbal assembly including a flexure tongue with stand-offs arranged to facilitate lateral light entry |
US7995310B1 (en) | 2006-11-09 | 2011-08-09 | Western Digital Technologies, Inc. | Head-gimbal assembly including a flexure tongue with adhesive receptacles disposed adjacent to stand-offs |
US8792212B1 (en) | 2010-09-14 | 2014-07-29 | Western Digital (Fremont), Llc | Robust gimbal design for head gimbal assembly |
JP2013020669A (en) * | 2011-07-08 | 2013-01-31 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with head, and hard disk drive |
US9311938B1 (en) | 2013-05-30 | 2016-04-12 | Magnecomp Corporation | Dual stage actuated suspension having adhesive overflow control channels |
US9196274B2 (en) | 2013-12-16 | 2015-11-24 | Seagate Technology Llc | Slider cavity feature for gimbal attachment |
US9558768B1 (en) | 2015-09-10 | 2017-01-31 | HGST Netherlands B.V. | Suspension standoff geometry for slider crown change reduction |
-
2020
- 2020-01-31 US US16/778,433 patent/US11081130B1/en active Active
- 2020-05-28 WO PCT/US2020/035013 patent/WO2021154324A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US11081130B1 (en) | 2021-08-03 |
WO2021154324A1 (en) | 2021-08-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9025277B1 (en) | Hard disk drive having multiple disk stacks on a rotatable platform | |
US8958172B1 (en) | Multiple disk stack, single actuator hard disk drive | |
US8824094B1 (en) | Hard disk drive having multiple disk stacks and a movable head stack assembly | |
US9734874B1 (en) | Adhesive leak channel structure for hermetic sealing of a hard disk drive | |
US9218834B2 (en) | Dual stage microactuator flexure feature for minimizing electrical shorts | |
US9558768B1 (en) | Suspension standoff geometry for slider crown change reduction | |
US9449623B2 (en) | Reducing ion migration in a hard disk drive microactuator flexure assembly | |
US9460757B2 (en) | Flexible cable assembly having reduced-tolerance electrical connection pads | |
US20120140360A1 (en) | Integrated lead suspension (ils) for use with a dual stage actuator (dsa) | |
US20240040688A1 (en) | Flexible printed circuit finger layout for low crosstalk | |
US9153275B1 (en) | Laser-integrated head gimbal assembly having laser contact protection | |
US9013967B1 (en) | Heat-dissipating stepped slider for a heat-assisted magnetic recording head | |
US20160365105A1 (en) | Hard Disk Drive Actuator Pivot To Base Tower Clearance Spacer Mechanism | |
US9025423B1 (en) | Thermally conductive features for a heat-assisted magnetic recording head | |
US11430474B1 (en) | Hard disk drive suspension tail having narrowing tip | |
US8837261B1 (en) | Electrical contact for an energy-assisted magnetic recording laser sub-mount | |
US11081130B1 (en) | Suspension standoff arrangement for confining adhesive | |
US9779765B1 (en) | Perpendicular magnetic recording writer having improved performance and wide area track erasure reliability | |
US11069375B1 (en) | Suspension standoff arrangement for confining adhesive | |
US20060285252A1 (en) | Head assembly with reduced PSA tilt | |
US9245546B1 (en) | Contamination mitigation cap for a hard disk drive actuator pivot assembly | |
US20160358621A1 (en) | Self-Servo Write Non-Reference Head Position Measuring | |
US8958179B1 (en) | Managing resonance frequency of hard disk drive voice coil motor | |
US10056117B1 (en) | Data storage device baseplate diverter and downstream spoiler | |
US20060285249A1 (en) | Method for reducing PSA tilt in Femto format sliders through increased adhesive area |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: WESTERN DIGITAL TECHNOLOGIES, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHAWALITSITTIKUL, PONGSATORN;SUVIBUA, ANUCHA;SEDKLANG, WANCHAI;REEL/FRAME:051686/0703 Effective date: 20200131 |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
AS | Assignment |
Owner name: JPMORGAN CHASE BANK, N.A., AS AGENT, ILLINOIS Free format text: SECURITY INTEREST;ASSIGNOR:WESTERN DIGITAL TECHNOLOGIES, INC.;REEL/FRAME:058426/0815 Effective date: 20211104 |
|
AS | Assignment |
Owner name: WESTERN DIGITAL TECHNOLOGIES, INC., CALIFORNIA Free format text: RELEASE OF SECURITY INTEREST AT REEL 058426 FRAME 0815;ASSIGNOR:JPMORGAN CHASE BANK, N.A.;REEL/FRAME:058965/0679 Effective date: 20220203 |
|
AS | Assignment |
Owner name: JPMORGAN CHASE BANK, N.A., ILLINOIS Free format text: PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT;ASSIGNOR:WESTERN DIGITAL TECHNOLOGIES, INC.;REEL/FRAME:064715/0001 Effective date: 20230818 Owner name: JPMORGAN CHASE BANK, N.A., ILLINOIS Free format text: PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT;ASSIGNOR:WESTERN DIGITAL TECHNOLOGIES, INC.;REEL/FRAME:067045/0156 Effective date: 20230818 |