US20210118874A1 - Semiconductor device and method for fabricating the same - Google Patents
Semiconductor device and method for fabricating the same Download PDFInfo
- Publication number
- US20210118874A1 US20210118874A1 US16/658,949 US201916658949A US2021118874A1 US 20210118874 A1 US20210118874 A1 US 20210118874A1 US 201916658949 A US201916658949 A US 201916658949A US 2021118874 A1 US2021118874 A1 US 2021118874A1
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- layer
- insulating
- semiconductor device
- conductive layer
- semiconductor unit
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 201
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 239000010410 layer Substances 0.000 claims description 395
- 239000000945 filler Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 23
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000002346 layers by function Substances 0.000 claims description 12
- 229910052721 tungsten Inorganic materials 0.000 claims description 10
- 239000010937 tungsten Substances 0.000 claims description 10
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 8
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 6
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- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
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- 238000002955 isolation Methods 0.000 description 6
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- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
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- 238000005137 deposition process Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
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- 238000000206 photolithography Methods 0.000 description 3
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- 239000010936 titanium Substances 0.000 description 3
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- 229910052726 zirconium Inorganic materials 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
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- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- ILCYGSITMBHYNK-UHFFFAOYSA-N [Si]=O.[Hf] Chemical compound [Si]=O.[Hf] ILCYGSITMBHYNK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
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- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- AXQKVSDUCKWEKE-UHFFFAOYSA-N [C].[Ge].[Si] Chemical compound [C].[Ge].[Si] AXQKVSDUCKWEKE-UHFFFAOYSA-N 0.000 description 1
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- DBOSVWZVMLOAEU-UHFFFAOYSA-N [O-2].[Hf+4].[La+3] Chemical compound [O-2].[Hf+4].[La+3] DBOSVWZVMLOAEU-UHFFFAOYSA-N 0.000 description 1
- MTJMIUIMDNFTMN-UHFFFAOYSA-N [Si]=O.[Sc] Chemical compound [Si]=O.[Sc] MTJMIUIMDNFTMN-UHFFFAOYSA-N 0.000 description 1
- ANZHXYXLYVMQDK-UHFFFAOYSA-N [Si]=O.[Sr] Chemical compound [Si]=O.[Sr] ANZHXYXLYVMQDK-UHFFFAOYSA-N 0.000 description 1
- VQANKOFXSBIWDC-UHFFFAOYSA-N [Si]=O.[Ta] Chemical compound [Si]=O.[Ta] VQANKOFXSBIWDC-UHFFFAOYSA-N 0.000 description 1
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- 239000000956 alloy Substances 0.000 description 1
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- 238000009792 diffusion process Methods 0.000 description 1
- ZPDRQAVGXHVGTB-UHFFFAOYSA-N gallium;gadolinium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Gd+3] ZPDRQAVGXHVGTB-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- ZQXQADNTSSMHJI-UHFFFAOYSA-N hafnium(4+) oxygen(2-) tantalum(5+) Chemical compound [O-2].[Ta+5].[Hf+4] ZQXQADNTSSMHJI-UHFFFAOYSA-N 0.000 description 1
- KQHQLIAOAVMAOW-UHFFFAOYSA-N hafnium(4+) oxygen(2-) zirconium(4+) Chemical compound [O--].[O--].[O--].[O--].[Zr+4].[Hf+4] KQHQLIAOAVMAOW-UHFFFAOYSA-N 0.000 description 1
- KUVFGOLWQIXGBP-UHFFFAOYSA-N hafnium(4+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Hf+4] KUVFGOLWQIXGBP-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- GSJMPHIKYICTQX-UHFFFAOYSA-N magnesium;oxosilicon Chemical compound [Mg].[Si]=O GSJMPHIKYICTQX-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- HEHINIICWNIGNO-UHFFFAOYSA-N oxosilicon;titanium Chemical compound [Ti].[Si]=O HEHINIICWNIGNO-UHFFFAOYSA-N 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- HYXGAEYDKFCVMU-UHFFFAOYSA-N scandium oxide Chemical compound O=[Sc]O[Sc]=O HYXGAEYDKFCVMU-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
- H01L29/513—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures the variation being perpendicular to the channel plane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823462—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823857—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66621—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation using etching to form a recess at the gate location
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823828—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
- H01L21/823842—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
Definitions
- the present disclosure relates to a semiconductor device and a method for fabricating the semiconductor device, and more particularly, to a semiconductor device with multiple threshold voltages and a method for fabricating the semiconductor device with multiple threshold voltages.
- Semiconductor devices are used in a variety of electronic applications, such as personal computers, cellular telephones, digital cameras, and other electronic equipment. In addition, demands for more sophisticated designs of semiconductor devices are arising.
- One aspect of the present disclosure provides a semiconductor device including a substrate, a first semiconductor unit having a first threshold voltage and a first insulating stack in the substrate, a second semiconductor unit having a second threshold voltage and a second insulating stack in the substrate, and a third semiconductor unit having a third threshold voltage and a third insulating stack in the substrate.
- the first threshold voltage, the second threshold voltage, and the third threshold voltage are different from each other.
- a thickness of the first insulating stack is different from a thickness of the second insulating stack and a thickness of the third insulating stack.
- the thickness of the second insulating stack is different from the thickness of the third insulating stack.
- the first insulating stack comprises a first bottom insulating layer inwardly positioned in the substrate
- the third insulating stack comprises a third bottom insulating layer inwardly positioned in the substrate and a third top insulating layer positioned on the third bottom insulating layer.
- the second insulating stack comprises a second bottom insulating layer inwardly positioned in the substrate, a second middle insulating layer positioned on the second bottom insulating layer, and a second top insulating layer positioned on the second middle insulating layer.
- the first semiconductor unit further comprises a first bottom conductive layer positioned on the first bottom insulating layer, and the first bottom conductive layer has a thickness between about 10 angstroms and about 200 angstroms.
- the first semiconductor unit further comprises a first top conductive layer positioned on the first bottom conductive layer, and the first top conductive layer has a thickness between about 10 angstroms and about 100 angstroms.
- the first semiconductor unit further comprises a first filler layer positioned on the first top conductive layer, and the first filler layer is formed of tungsten or aluminum.
- the second semiconductor unit further comprises a second bottom conductive layer positioned on the second top insulating layer, and the second bottom conductive layer has a thickness between about 10 angstroms and about 100 angstroms.
- the second semiconductor unit further comprises a second top conductive layer positioned on the second bottom conductive layer, and the second top conductive layer has a thickness between about 10 angstroms and about 200 angstroms.
- the second semiconductor unit further comprises a second pair of stress regions attached to lower portions of the two sides of the second semiconductor unit, and the second pair of stress regions are formed of silicon carbide.
- the third semiconductor unit further comprises a third bottom conductive layer positioned on the third top insulating layer, and the third bottom conductive layer has a thickness between about 10 angstroms and about 100 angstroms.
- the third semiconductor unit further comprises a third top conductive layer positioned on the third bottom conductive layer, and the third top conductive layer has a thickness between about 10 angstroms and about 200 angstroms.
- the third semiconductor unit further comprises a third filler layer positioned on the third top conductive layer and a third capping layer positioned on the third filler layer.
- the second semiconductor unit further comprises a second interfacial layer positioned between the substrate and the second bottom insulating layer, and the second interracial layer has a thickness less than 2 nm.
- the second semiconductor unit further comprises a second functional layer positioned between the second top insulating layer and the second bottom conductive layer, and the second functional layer has a thickness between about 10 angstroms and about 15 angstroms.
- the second semiconductor unit further comprises a second dipole layer positioned between the substrate and the second bottom insulating layer, and the second dipole layer is formed of a material including one or more of lutetium oxide, lutetium silicon oxide, yttrium oxide, yttrium silicon oxide, lanthanum oxide, lanthanum silicon oxide, barium oxide, or barium silicon oxide.
- the second semiconductor unit further comprises a second protection layer positioned between the second top insulating layer and the second bottom conductive layer, and the second protection layer is formed of titanium nitride.
- the second semiconductor unit further comprises a second encapsulation layer positioned between the second filler layer and the second top conductive layer, and the second encapsulation layer has a thickness between about 15 angstroms and about 25 angstroms.
- Another aspect of the present disclosure provides a method for fabricating a semiconductor device including providing a substrate and concurrently forming a first semiconductor unit, a second semiconductor unit, and a third semiconductor unit in the substrate.
- the first semiconductor unit includes a first insulating stack
- the second semiconductor unit includes a second insulating stack
- the third semiconductor unit includes a third insulating stack. Thicknesses of the first insulating stack, the second insulating stack, and the third insulating stack are all different.
- the method for fabricating the semiconductor device further comprises forming a plurality of trenches in the substrate and forming a first insulating film over the substrate and in the plurality of trenches.
- the method for fabricating the semiconductor device further comprises removing portions of the first insulating film and forming a second insulating film over the substrate.
- the first semiconductor unit, the second semiconductor unit, and the third semiconductor unit may have different threshold voltages and may provide different functions; therefore, the applicability of the semiconductor device may be increased.
- the carrier mobility of the semiconductor device may be improved.
- the threshold voltages of the semiconductor device may be fine-tuned.
- FIG. 1 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with one embodiment of the present disclosure
- FIG. 2 illustrates, in a schematic top-view diagram, the semiconductor device in accordance with one embodiment of the present disclosure
- FIG. 3 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance with FIG. 1 ;
- FIG. 4 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure
- FIG. 5 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance with FIG. 4 ;
- FIG. 6 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure
- FIG. 7 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance with FIG. 6 ;
- FIG. 8 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure
- FIG. 9 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance with FIG. 8 ;
- FIG. 10 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure
- FIG. 11 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance with FIG. 10 ;
- FIG. 12 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure
- FIG. 13 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance with FIG. 12 ;
- FIGS. 14 and 15 illustrate, in schematic cross-sectional view diagrams, semiconductor devices in accordance with some embodiments of the present disclosure
- FIG. 16 illustrates, in a schematic enlarged cross-sectional view diagram, a semiconductor device in accordance with one embodiment of the present disclosure
- FIG. 17 illustrates, in a flowchart diagram form, a method 30 for fabricating a semiconductor device in accordance with one embodiment of the present disclosure
- FIGS. 18 to 31 illustrate, in schematic cross-sectional diagrams, a flow of fabricating a semiconductor device in accordance with one embodiment of the present disclosure.
- first and second features are formed in direct contact
- additional features may be formed between the first and second features, such that the first and second features may not be in direct contact
- present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.
- the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
- the apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
- orientation, layout, location, shapes, sizes, amounts, or other measures do not necessarily mean an exactly identical orientation, layout, location, shape, size, amount, or other measure, but are intended to encompass nearly identical orientation, layout, location, shapes, sizes, amounts, or other measures within acceptable variations that may occur, for example, due to manufacturing processes.
- the term “substantially” may be used herein to reflect this meaning.
- items described as “substantially the same,” “substantially equal,” or “substantially planar,” may be exactly the same, equal, or planar, or may be the same, equal, or planar within acceptable variations that may occur, for example, due to manufacturing processes.
- a semiconductor device generally means a device which can function by utilizing semiconductor characteristics, and an electro-optic device, a light-emitting display device, a semiconductor circuit, and an electronic device are all included in the category of the semiconductor device.
- a semiconductor element with a lower threshold voltage may have a faster switching speed and may be suitable for providing computational logic functions.
- a semiconductor element with a high threshold voltage may decrease power consumption of the semiconductor element and may be suitable to implement in storage functions. Therefore, a semiconductor device with semiconductor elements with multiple threshold voltages may have broader applicability than a semiconductor device with only a single threshold voltage.
- FIG. 1 illustrates, in a schematic cross-sectional view diagram, a semiconductor device 100 A in accordance with one embodiment of the present disclosure.
- FIG. 2 illustrates, in a schematic top-view diagram, the semiconductor device 100 A in accordance with one embodiment of the present disclosure.
- FIG. 3 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device 100 A in accordance with FIG. 1 .
- the semiconductor device 100 A may include a substrate 101 , an isolation layer 103 , a plurality of doped regions, a first semiconductor unit 301 , a second semiconductor unit 401 , and a third semiconductor unit 501 .
- the substrate 101 may include an array area 10 and a peripheral area 20 .
- the array area 10 may be in the center of the substrate 101 .
- the peripheral area 20 may surround the peripheral area 20 .
- the substrate 101 may be formed of, for example, silicon, germanium, silicon germanium, silicon carbon, silicon germanium carbon, gallium, gallium arsenic, indium arsenic, indium phosphorus or other IV-IV, III-V or II-VI semiconductor materials.
- the substrate 101 may have a first lattice constant and a crystal orientation ⁇ 100>.
- the substrate 101 may include an organic semiconductor or a layered semiconductor such as silicon/silicon germanium, silicon-on-insulator or silicon germanium-on-insulator.
- the substrate 101 may include a top semiconductor layer and a bottom semiconductor layer formed of silicon, and a buried insulating layer which may separate the top semiconductor layer from the bottom semiconductor layer.
- the buried insulating layer may include, for example, a crystalline or non-crystalline oxide, nitride or any combination thereof.
- the isolation layer 103 may be disposed in the substrate 101 .
- the isolation layer 103 may be disposed in an upper portion of the substrate 101 .
- the isolation layer 103 may define a first active region 105 , a second active region 107 , and a third active region 109 separated from each other.
- the first active region 105 may be located at the array area 10 of the substrate 101 .
- the second active region 107 and the third active region 109 may be located at the peripheral area 20 of the substrate 101 .
- the first active region 105 , the second active region 107 , and the third active region 109 may be all located at the array area 10 or all located at the peripheral area 20 , but are not limited thereto.
- the first active region 105 , the second active region 107 , and the third active region 109 may be connected to each other.
- the isolation layer 103 may be formed of, for example, an insulating material such as silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or fluoride-doped silicate.
- silicon oxynitride refers to a substance which contains silicon, nitrogen, and oxygen and in which a proportion of oxygen is greater than that of nitrogen.
- Silicon nitride oxide refers to a substance which contains silicon, oxygen, and nitrogen and in which a proportion of nitrogen is greater than that of oxygen.
- the plurality of doped regions may be disposed in the substrate 101 .
- the plurality of doped regions may be respectively correspondingly disposed in the first active region 105 , the second active region 107 , and the third active region 109 .
- the plurality of doped regions may include two first doped regions 201 , two second doped regions 203 , and two third doped regions 205 .
- the two first doped regions 201 may be disposed in the first active region 105 and separated from each other. Top surfaces of the two first doped regions 201 may be even with a top surface of the substrate 101 .
- the two first doped regions 201 may be doped with a dopant such as phosphorus, arsenic, or antimony and have a first electrical type.
- the two second doped regions 203 may be disposed in the second active region 107 and separated from each other. Top surfaces of the two second doped regions 203 may be even with the top surface of the substrate 101 .
- the two second doped regions 203 may have a same electrical type as the two first doped regions 201 .
- the two third doped regions 205 may be disposed in the third active region 109 and separated from each other. Top surfaces of the two third doped regions 205 may be even with the top surface of the substrate 101 .
- the two third doped regions 205 may be doped with a dopant such as boron and have a second electrical type. The second electrical type may be different from the first electrical type.
- the first semiconductor unit 301 may be disposed in the first active region 105 and between the two first doped regions 201 .
- the first semiconductor unit 301 may have a first threshold voltage.
- the first semiconductor unit 301 may include a first insulating stack, a first bottom conductive layer 305 , and a first filler layer 307 .
- the first insulating stack may be disposed in the first active region 105 and include a first bottom insulating layer 303 .
- the first bottom insulating layer 303 may be inwardly disposed in the first active region 105 .
- the two first doped regions 201 may be attached to two sides of the first bottom insulating layer 303 .
- the first bottom insulating layer 303 may have a thickness between about 0.5 nm and about 5.0 nm.
- the thickness of the first bottom insulating layer 303 may be between about 0.5 nm and about 2.5 nm. It should be noted that the thickness of the first bottom insulating layer 303 may be set to an arbitrary range depending on the circumstances.
- the first bottom insulating layer 303 may be formed of, for example, an insulating material having a dielectric constant of about 4.0 or greater. (All dielectric constants mentioned herein are relative to a vacuum unless otherwise noted.)
- the insulating material having a dielectric constant of about 4.0 or greater may be hafnium oxide, hafnium zirconium oxide, hafnium lanthanum oxide, hafnium silicon oxide, hafnium tantalum oxide, hafnium titanium oxide, zirconium oxide, aluminum oxide, aluminum silicon oxide, titanium oxide, tantalum pentoxide, lanthanum oxide, lanthanum silicon oxide, strontium titanate, lanthanum aluminate, yttrium oxide, gallium (III) trioxide, gadolinium gallium oxide, lead zirconium titanate, barium titanate, barium strontium titanate, barium zirconate, or a mixture thereof.
- the insulating material may be silicon oxide, silicon n
- the first bottom conductive layer 305 may be disposed in the first active region 105 and on the first bottom insulating layer 303 .
- the first bottom conductive layer 305 may have a thickness between about 10 angstroms and about 200 angstroms.
- the thickness of the first bottom conductive layer 305 may be between about 10 angstroms and about 100 angstroms.
- the first bottom conductive layer 305 may be formed of, for example, aluminum, silver, titanium, titanium nitride, titanium aluminum, titanium carbide aluminum, titanium nitride aluminum, titanium silicon aluminum, tantalum nitride, tantalum carbide, tantalum silicon nitride, manganese, zirconium, or tungsten nitride.
- the first filler layer 307 may be disposed in the first active region 105 and on the first bottom conductive layer 305 .
- a top surface of the first filler layer 307 may be even with the top surface of the substrate 101 .
- the first filler layer 307 may be formed of, for example, tungsten or aluminum.
- the second semiconductor unit 401 may be disposed in the second active region 107 and between the two second doped regions 203 .
- the second semiconductor unit 401 may include a second insulating stack, a second bottom conductive layer 409 , and a second filler layer 411 .
- the second insulating stack may include a second bottom insulating layer 403 , a second middle insulating layer 405 , and a second top insulating layer 407 .
- the second semiconductor unit 401 may have a second threshold voltage. The second threshold voltage may be greater than the first threshold voltage.
- the second bottom insulating layer 403 may be inwardly disposed in the second active region 107 .
- the two second doped regions 203 may be attached to two sides of the second bottom insulating layer 403 .
- the second bottom insulating layer 403 may have a thickness between about 0.1 nm and about 3.0 nm.
- the thickness of the second bottom insulating layer 403 may be between about 0.5 nm and about 2.5 nm. It should be noted that the thickness of the second bottom insulating layer 403 may be set to an arbitrary range depending on the circumstances.
- the second bottom insulating layer 403 may be formed of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like. Alternatively, in another embodiment, the second bottom insulating layer 403 may be formed of an insulating material having a dielectric constant of about 4.0 or greater.
- the second middle insulating layer 405 may be disposed in the second active region 107 and on the second bottom insulating layer 403 .
- the second middle insulating layer 405 may have a thickness between about 0.1 nm and about 2.0 nm.
- the thickness of the second middle insulating layer 405 may be between about 0.5 nm to about 1.5 nm. It should be noted that the thickness of the second middle insulating layer 405 may be set to an arbitrary range depending on the circumstances.
- the second middle insulating layer 405 may be formed of, for example, an insulating material having a dielectric constant of about 4.0 or greater.
- the second middle insulating layer 405 may be formed of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like.
- the second top insulating layer 407 may be disposed in the second active region 107 and on the second middle insulating layer 405 .
- the second top insulating layer 407 may have a same thickness as the first bottom insulating layer 303 , but is not limited thereto.
- the second top insulating layer 407 may be formed of a same material as the first bottom insulating layer 303 , but is not limited thereto.
- the second bottom conductive layer 409 may be disposed in the second active region 107 and on the second top insulating layer 407 .
- the second bottom conductive layer 409 may have a same thickness as the first bottom conductive layer 305 , but is not limited thereto.
- the second bottom conductive layer 409 may be formed of a same material as the first bottom conductive layer 305 , but is not limited thereto.
- the second filler layer 411 may be disposed in the second active region 107 and on the second bottom conductive layer 409 .
- the second filler layer 411 may be formed of a same material as the first bottom conductive layer 305 , but is not limited thereto.
- the third semiconductor unit 501 may be disposed in the third active region 109 and between the two third doped regions 205 .
- the third semiconductor unit 501 may include a third insulating stack, a third bottom conductive layer 507 , a third top conductive layer 509 , and a third filler layer 511 .
- the third insulating stack may include a third bottom insulating layer 503 and a third top insulating layer 505 .
- the third semiconductor unit 501 may have a third threshold voltage. The third threshold voltage may be greater than the first threshold voltage and less than the second threshold voltage.
- the third bottom insulating layer 503 may be inwardly disposed in the third active region 109 .
- the two third doped regions 205 may be attached to two sides of the third bottom insulating layer 503 .
- the third bottom insulating layer 503 may have a same thickness as the second middle insulating layer 405 , but is not limited thereto. It should be noted that the thickness of the third bottom insulating layer 503 may be set to an arbitrary range depending on the circumstances.
- the third bottom insulating layer 503 may be formed of a same material as the second middle insulating layer 405 , but is not limited thereto.
- the third top insulating layer 505 may be disposed in the third active region 109 and on the third bottom insulating layer 503 .
- the third top insulating layer 505 may have a same thickness as the second top insulating layer 407 , but is not limited thereto.
- the third top insulating layer 505 may be formed of a same material as the second top insulating layer 407 , but is not limited thereto.
- the third bottom conductive layer 507 may be disposed in the third active region 109 and on the third top insulating layer 505 .
- the third bottom conductive layer 507 may have a thickness between about 10 angstroms and about 100 angstroms.
- the third bottom conductive layer 507 may be formed of, for example, titanium nitride, tantalum nitride, tantalum carbide, tungsten nitride, or ruthenium.
- the third top conductive layer 509 may be disposed in the third active region 109 and on the third bottom conductive layer 507 .
- the third top conductive layer 509 may have a same thickness as the second bottom conductive layer 409 , but is not limited thereto.
- the third top conductive layer 509 may be formed of a same material as the second bottom conductive layer 409 , but is not limited thereto.
- the third filler layer 511 may be disposed in the third active region 109 and on the third top conductive layer 509 .
- the third filler layer 511 may be formed of a same material as the second filler layer 411 , but is not limited thereto.
- the first insulating stack of the first semiconductor unit 301 may have a thickness T 1 , which may be equal to the thickness of the first bottom insulating layer 303 .
- the second insulating stack may have a thickness T 2 , which may be equal to a sum of the thicknesses of the second top insulating layer 407 , the second middle insulating layer 405 , and the second bottom insulating layer 403 .
- the third insulating stack may have a thickness T 3 , which may be equal to a sum of the thicknesses of the third top insulating layer 505 and the third bottom insulating layer 503 .
- the thickness T 3 may be greater than the thickness T 2 and the thickness T 1 .
- the thickness T 2 may be greater than the thickness T 1 .
- the threshold voltage may be proportional to the thickness of the insulating stack; hence, the second threshold voltage of the second semiconductor unit 401 including the second insulating stack may be greater than the third threshold voltage of the third semiconductor unit 501 including the third insulating stack and the first threshold voltage of the first semiconductor unit 301 including the first insulating stack. Accordingly, the third threshold voltage of the third semiconductor unit 501 including the third insulating stack may be greater than the first threshold voltage of the first semiconductor unit 301 including the first insulating stack.
- FIG. 4 illustrates, in a schematic cross-sectional view diagram, a semiconductor device 100 B in accordance with another embodiment of the present disclosure.
- FIG. 5 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device 100 B in accordance with FIG. 4 .
- the two third doped regions 205 B may have the first electrical type and may be doped with a dopant such as phosphorus, arsenic, or antimony.
- the third semiconductor unit 501 may include the third bottom insulating layer 503 , the third top insulating layer 505 , the third bottom conductive layer 507 B, and the third filler layer 511 .
- the third bottom insulating layer 503 may be inwardly disposed in the third active region 109 .
- the third top insulating layer 505 may be disposed on the third bottom insulating layer 503 .
- the third bottom conductive layer 507 B may be disposed on the third top insulating layer 505 .
- the third bottom conductive layer 507 B may have a same thickness as the second bottom conductive layer 409 and may be formed of a same material as the second bottom conductive layer 409 .
- the third filler layer 511 may be directly disposed on the third bottom conductive layer 507 B.
- FIG. 6 illustrates, in a schematic cross-sectional view diagram, a semiconductor device 100 C in accordance with another embodiment of the present disclosure.
- FIG. 7 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device 100 C in accordance with FIG. 6 .
- the two second doped regions 203 C may have the second electrical type and may be doped with a dopant such as boron.
- the second semiconductor unit 401 may include the second bottom insulating layer 403 , the second middle insulating layer 405 , the second top insulating layer 407 , the second bottom conductive layer 409 C, the second filler layer 411 , and a second top conductive layer 413 .
- the second bottom insulating layer 403 may be inwardly disposed in the second active region 107 .
- the second middle insulating layer 405 may be disposed on the second bottom insulating layer 403 .
- the second top insulating layer 407 may be disposed on the second middle insulating layer 405 .
- the second bottom conductive layer 409 C may be disposed on the second top insulating layer 407 .
- the second bottom conductive layer 409 C may have a same thickness as the third bottom conductive layer 507 and may be formed of a same material as the third bottom conductive layer 507 .
- the second top conductive layer 413 may be disposed on the second bottom conductive layer 409 C.
- the second top conductive layer 413 may have a same thickness as the first bottom conductive layer 305 and may be formed of a same material as the first bottom conductive layer 305 .
- the second filler layer 411 may be disposed on the second top conductive layer 413 .
- FIG. 8 illustrates, in a schematic cross-sectional view diagram, a semiconductor device 100 D in accordance with another embodiment of the present disclosure.
- FIG. 9 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device 100 D in accordance with FIG. 8 .
- the two first doped regions 201 D may have the second electrical type and may be doped with a dopant such as boron.
- the first semiconductor unit 301 may include the first bottom insulating layer 303 , the first bottom conductive layer 305 D, the first filler layer 307 , and a first top conductive layer 309 .
- the first bottom insulating layer 303 may be inwardly disposed in the first active region 105 .
- the first bottom conductive layer 305 D may be disposed on the first bottom insulating layer 303 .
- the first bottom conductive layer 305 D may have a thickness between about 10 angstroms and about 100 angstroms.
- the first bottom conductive layer 305 D may be formed of, for example, titanium nitride, tantalum nitride, tantalum carbide, tungsten nitride, or ruthenium.
- the first top conductive layer 309 may be disposed on the first bottom conductive layer 305 .
- the first top conductive layer 309 may have a thickness between about 10 angstroms and about 200 angstroms.
- the first top conductive layer 309 may be formed of, for example, aluminum, silver, titanium, titanium nitride, titanium aluminum, titanium carbide aluminum, titanium nitride aluminum, titanium silicon aluminum, tantalum nitride, tantalum carbide, tantalum silicon nitride, manganese, zirconium, or tungsten nitride.
- FIG. 10 illustrates, in a schematic cross-sectional view diagram, a semiconductor device 100 E in accordance with another embodiment of the present disclosure.
- FIG. 11 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device 100 E in accordance with FIG. 10 .
- the two third doped regions 205 E may have the first electrical type and may be doped with a dopant such as phosphorus, arsenic, or antimony.
- the third semiconductor unit 501 may include the third bottom insulating layer 503 , the third top insulating layer 505 , the third bottom conductive layer 507 E, and the third filler layer 511 .
- the third bottom insulating layer 503 may be inwardly disposed in the third active region 109 .
- the third top insulating layer 505 may be disposed on the third bottom insulating layer 503 .
- the third bottom conductive layer 507 E may be disposed on the third top insulating layer 505 .
- the third bottom conductive layer 507 E may have a same thickness as the second bottom conductive layer 409 and may be formed of a same material as the second bottom conductive layer 409 .
- the third filler layer 511 may be directly disposed on the third bottom conductive layer 507 E.
- FIG. 12 illustrates, in a schematic cross-sectional view diagram, a semiconductor device 100 F in accordance with another embodiment of the present disclosure.
- FIG. 13 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device 100 F in accordance with FIG. 12 .
- the two second doped regions 203 F may have the second electrical type and may be doped with a dopant such as boron.
- the second semiconductor unit 401 may include the second bottom insulating layer 403 , the second middle insulating layer 405 , the second top insulating layer 407 , the second bottom conductive layer 409 F, the second filler layer 411 , and a second top conductive layer 413 .
- the second bottom insulating layer 403 may be inwardly disposed in the second active region 107 .
- the second middle insulating layer 405 may be disposed on the second bottom insulating layer 403 .
- the second top insulating layer 407 may be disposed on the second middle insulating layer 405 .
- the second bottom conductive layer 409 F may be disposed on the second top insulating layer 407 .
- the second bottom conductive layer 409 F may have a same thickness as the third bottom conductive layer 507 and may be formed of a same material as the third bottom conductive layer 507 .
- the second top conductive layer 413 may be disposed on the second bottom conductive layer 409 F.
- the second top conductive layer 413 may have a same thickness as the third top conductive layer 509 and may be formed of a same material as the third top conductive layer 509 .
- the second filler layer 411 may be disposed on the second top conductive layer 413 .
- FIGS. 14 and 15 illustrate, in schematic cross-sectional view diagrams, semiconductor devices 100 G, 100 H in accordance with some embodiments of the present disclosure.
- the semiconductor device 100 G may include a first pair of stress regions 207 , a second pair of stress regions 209 , and a third pair of stress regions 211 .
- the first pair of stress regions 207 may be disposed in the first active region 105 and respectively correspondingly attached to lower portions of the two sides of the first semiconductor unit 301 .
- the first pair of stress regions 207 may be attached to lower portions of the two sides of the first bottom insulating layer 303 .
- the first pair of stress regions 207 may be formed of, for example, silicon carbide.
- the second pair of stress regions 209 may be disposed in the second active region 107 and respectively correspondingly attached to lower portions of the two sides of the second semiconductor unit 401 .
- the second pair of stress regions 209 may be attached to lower portions of the two sides of the second bottom insulating layer 403 .
- the second pair of stress regions 209 may be formed of a same material as the first pair of stress regions 207 .
- the third pair of stress regions 211 may be disposed in the third active region 109 and respectively correspondingly attached to lower portions of the two sides of the third semiconductor unit 501 .
- the third pair of stress regions 211 may be attached to lower portions of the two sides of the third bottom insulating layer 503 .
- the third pair of stress regions 211 may be formed of, for example, silicon germanium.
- the first pair of stress regions 207 , the second pair of stress regions 209 , and the third pair of stress regions 211 may have lattice constants different form the lattice constant of the substrate 101 .
- the first pair of stress regions 207 , the second pair of stress regions 209 , and the third pair of stress regions 211 may increase the carrier mobility of the semiconductor device 100 G; therefore, the performance of the semiconductor device 100 G may be improved.
- the first semiconductor unit 301 may further include a first capping layer 311 .
- the first capping layer 311 may be disposed on the first filler layer 307 and may be formed of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or fluoride-doped silicate. A top surface of the first capping layer 311 may be even with the top surface of the substrate 101 .
- the second semiconductor unit 401 may further include a second capping layer 415 .
- the second capping layer 415 may be disposed on the second filler layer 411 and may be formed of a same material as the first capping layer 311 .
- the third semiconductor unit 501 may further include a third capping layer 513 .
- the third capping layer 513 may be disposed on the third filler layer 511 and may be formed of a same material as the first capping layer 311 .
- FIG. 16 illustrates, in a schematic enlarged cross-sectional view diagram, a semiconductor device 100 I in accordance with one embodiment of the present disclosure.
- the first semiconductor unit 301 may further include a first interfacial layer 313 , a first dipole layer 315 , a first functional layer 317 , a first adjustment layer 319 , a first protection layer 321 , and a first encapsulation layer 323 .
- the first interfacial layer 313 may be disposed between the substrate 101 and the first bottom insulating layer 303 .
- the first interfacial layer 313 may facilitate formation of the first bottom insulating layer 303 .
- the first interfacial layer 313 may have a thickness between about 5 angstroms and about 20 angstroms.
- the first interfacial layer 313 may be formed of a chemical oxide of the underlying substrate 101 such as silicon oxide.
- the first dipole layer 315 may be disposed between the first bottom insulating layer 303 and the first interfacial layer 313 .
- the first dipole layer 315 may have a thickness less than 2 nm.
- the first dipole layer 315 may displace defects in the first bottom insulating layer 303 and improve the mobility and reliability of the first semiconductor unit 301 .
- the first dipole layer 315 may be formed of a material including one or more of lutetium oxide, lutetium silicon oxide, yttrium oxide, yttrium silicon oxide, lanthanum oxide, lanthanum silicon oxide, barium oxide, barium silicon oxide, strontium oxide, strontium silicon oxide, aluminum oxide, aluminum silicon oxide, titanium oxide, titanium silicon oxide, hafnium oxide, hafnium silicon oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, tantalum silicon oxide, scandium oxide, scandium silicon oxide, magnesium oxide, and magnesium silicon oxide.
- the first functional layer 317 may be disposed on the first bottom insulating layer 303 .
- the first functional layer 317 may have a thickness between about 10 angstroms and about 15 angstroms and may be formed of, for example, titanium nitride or tantalum nitride.
- the first functional layer 317 may protect the first bottom insulating layer 303 from damage during subsequent semiconductor processes.
- the first adjustment layer 319 may be disposed on the first functional layer 317 and may include a material or an alloy including lanthanide nitride.
- the first adjustment layer 319 may be used to fine-tune the first threshold voltage.
- the first protection layer 321 may be disposed on the first adjustment layer 319 and may protect the first adjustment layer 319 from damage during subsequent semiconductor processes.
- the first protection layer 321 may be formed of, for example, titanium nitride.
- the first encapsulation layer 323 may be disposed between the first bottom conductive layer 305 and the first filler layer 307 .
- the first encapsulation layer 323 may have a thickness between about 15 angstroms and about 25 angstroms.
- the first encapsulation layer 323 may be formed of, for example, titanium nitride.
- the first encapsulation layer 323 may protect layers below the first encapsulation layer 323 from mechanical damage or diffusion of the first filler layer 307 .
- the second semiconductor unit 401 may further include a second interfacial layer 417 , a second dipole layer 419 , a second functional layer 421 , a second adjustment layer 423 , a second protection layer 425 , and a second encapsulation layer 427 .
- the third semiconductor unit 501 may further include a third interfacial layer 515 , a third dipole layer 517 , a third functional layer 519 , a third adjustment layer 521 , a third protection layer 523 , and a third encapsulation layer 525 .
- the aforementioned layers of the second semiconductor unit 401 and the third semiconductor unit 501 may be disposed in a manner similar to that of the first semiconductor unit 301 .
- FIG. 17 illustrates, in a flowchart diagram form, a method 30 for fabricating a semiconductor device 100 A in accordance with one embodiment of the present disclosure.
- FIGS. 18 to 31 illustrate, in schematic cross-sectional diagrams, a flow of fabricating the semiconductor device 100 A in accordance with one embodiment of the present disclosure.
- a substrate 101 may be provided and a plurality of trenches may be formed in the substrate 101 .
- An isolation layer 103 may be formed in the substrate 101 and may define a first active region 105 , a second active region 107 , and a third active region 109 .
- a plurality of doped regions may be formed in the substrate 101 by implantation processes.
- the plurality of trenches may be respectively correspondingly formed in the first active region 105 , the second active region 107 , and the third active region 109 .
- the plurality of trenches may include a first trench 111 , a second trench 113 , and a third trench 115 .
- the first trench 111 may be formed in the first active region 105 .
- the second trench 113 may be formed in the second active region 107 .
- the third trench 115 may be formed in the third active region 109 .
- the plurality of doped regions may be respectively correspondingly divided by the plurality of trenches and turned into two first doped regions 201 in the first active region 105 , two second doped regions 203 in the second active region 107 , and two third doped regions 205 in the third active region 109 .
- a first insulating film 701 may be formed over the substrate 101 .
- the first insulating film 701 may be conformally formed over a top surface of the substrate 101 and in the plurality of trenches by a deposition process such as physical vapor deposition, atomic layer deposition, chemical vapor deposition, sputtering, or the like.
- the first insulating film 701 may have a thickness between about 0.1 nm and about 3.0 nm.
- the first insulating film 701 may be formed of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like.
- the first insulating film 701 may be formed of an insulating material having a dielectric constant of about 4.0 or greater.
- portions of the first insulating film 701 may be removed.
- a photolithography process may be performed using a first mask layer 801 as a mask for the second active region 107 .
- the first mask layer 801 may be a photoresist layer.
- an etch process may be performed to remove the portions of the first insulating film 701 formed at the first active region 105 and the third active region 109 .
- the first insulating film 701 formed at the second active region 107 may be retained. After the etch process, the first mask layer 801 may be removed.
- a second insulating film 703 may be formed over the substrate 101 .
- the second insulating film 703 may be conformally formed over the top surface of the substrate 101 , on the first insulating film 701 , and in the first trench 111 and the third trench 115 .
- the second insulating film 703 may be formed by a deposition process similar to that of step S 13 .
- the second insulating film 703 may have a thickness between about 0.1 nm and about 2.0 nm.
- the second insulating film 703 may be formed of a same material as the first insulating film 701 , but is not limited thereto.
- portions of the second insulating film 703 may be removed.
- a photolithography process may be performed using a second mask layer 803 as a mask for the second active region 107 and the third active region 109 .
- the second mask layer 803 may be a photoresist layer.
- an etch process may be performed to remove the portions of the second insulating film 703 formed at the first active region 105 .
- the second insulating film 703 formed at the second active region 107 and the third active region 109 may be retained. After the etch process, the second mask layer 803 may be removed.
- a third insulating film 705 and a first conductive film 707 may be formed over the substrate 101 .
- the third insulating film 705 may be conformally formed over the top surface of the substrate 101 and on the second insulating film 703 .
- the third insulating film 705 may have a thickness between about 0.5 nm and about 5.0 nm.
- the first conductive film 707 may be formed on the third insulating film 705 .
- the first conductive film 707 may have a thickness between about 10 angstroms and about 100 angstroms.
- the first conductive film 707 may be formed of, for example, titanium nitride, tantalum nitride, tantalum carbide, tungsten nitride, or ruthenium.
- the third insulating film 705 and the first conductive film 707 may be formed by deposition processes similar to those of step S 13 .
- portions of the first conductive film 707 may be removed.
- a photolithography process may be performed using a third mask layer 805 as a mask for the third active region 109 .
- the third mask layer 805 may be a photoresist layer.
- an etch process may be performed to remove the portions of the first conductive film 707 formed at the first active region 105 and the second active region 107 .
- the first conductive film 707 formed at the third active region 109 may be retained.
- the third mask layer 805 may be removed.
- a second conductive film 709 and a filler film 711 may be formed over the substrate 101 .
- the second conductive film 709 may be formed on the third insulating film 705 and the first conductive film 707 .
- the second conductive film 709 may have a thickness between about 10 angstroms and about 200 angstroms.
- the second conductive film 709 may be formed of, for example, aluminum, silver, titanium, titanium nitride, titanium aluminum, titanium carbide aluminum, titanium nitride aluminum, titanium silicon aluminum, tantalum nitride, tantalum carbide, tantalum silicon nitride, manganese, zirconium, or tungsten nitride.
- the filler film 711 may be formed on the second conductive film 709 and may fill the first trench 111 , the second trench 113 , and the third trench 115 .
- the filler film 711 may be formed of, for example, tungsten or aluminum.
- a first semiconductor unit 301 , a second semiconductor unit 401 , and a third semiconductor unit 501 may be concurrently formed in the substrate 101 .
- a planarization process such as chemical mechanical polishing, may be performed to remove excess material, provide a substantially flat surface for subsequent processing steps, and conformally form the first semiconductor unit 301 , the second semiconductor unit 401 , and the third semiconductor unit 501 .
- the first insulating film 701 may be turned into a second bottom insulating layer 403 .
- the second insulating film 703 may be turned into a second middle insulating layer 405 and a third bottom insulating layer 503 .
- the third insulating film 705 may be turned into a first bottom insulating layer 303 , a second top insulating layer 407 , and a third top insulating layer 505 .
- the first conductive film 707 may be turned into a third bottom conductive layer 507 .
- the second conductive film 709 may be turned into a first bottom conductive layer 305 , a second bottom conductive layer 409 , and a third top conductive layer 509 .
- the filler film 711 may be turned into a first filler layer 307 , a second filler layer 411 , and a third filler layer 511 .
- the first bottom insulating layer 303 , the first bottom conductive layer 305 , and the first filler layer 307 together form the first semiconductor unit 301 in the first active region 105 .
- the second bottom insulating layer 403 , the second middle insulating layer 405 , the second top insulating layer 407 , the second bottom conductive layer 409 , and the second filler layer 411 together form the second semiconductor unit 401 in the second active region 107 .
- the third bottom insulating layer 503 , the third top insulating layer 505 , the third bottom conductive layer 507 , the third top conductive layer 509 , and the third filler layer 511 together form the third semiconductor unit 501 in the third active region 109 .
- the first semiconductor unit 301 , the second semiconductor unit 401 , and the third semiconductor unit 501 may have different threshold voltages and may provide different functions; therefore, the applicability of the semiconductor device may be increased.
- the carrier mobility of the semiconductor device may be improved due to presence of the first pair of stress regions 207 , the second pair of stress regions 209 , and the third pair of stress regions 211 .
- the threshold voltages of the semiconductor device may be fine-tuned by the first functional layer 317 , the second adjustment layer 423 , and the third adjustment layer 521 .
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Abstract
Description
- The present disclosure relates to a semiconductor device and a method for fabricating the semiconductor device, and more particularly, to a semiconductor device with multiple threshold voltages and a method for fabricating the semiconductor device with multiple threshold voltages.
- Semiconductor devices are used in a variety of electronic applications, such as personal computers, cellular telephones, digital cameras, and other electronic equipment. In addition, demands for more sophisticated designs of semiconductor devices are arising.
- This Discussion of the Background section is provided for background information only. The statements in this Discussion of the Background are not an admission that the subject matter disclosed in this section constitutes prior art to the present disclosure, and no part of this Discussion of the Background section may be used as an admission that any part of this application, including this Discussion of the Background section, constitutes prior art to the present disclosure.
- One aspect of the present disclosure provides a semiconductor device including a substrate, a first semiconductor unit having a first threshold voltage and a first insulating stack in the substrate, a second semiconductor unit having a second threshold voltage and a second insulating stack in the substrate, and a third semiconductor unit having a third threshold voltage and a third insulating stack in the substrate. The first threshold voltage, the second threshold voltage, and the third threshold voltage are different from each other. A thickness of the first insulating stack is different from a thickness of the second insulating stack and a thickness of the third insulating stack. The thickness of the second insulating stack is different from the thickness of the third insulating stack.
- In some embodiments, the first insulating stack comprises a first bottom insulating layer inwardly positioned in the substrate, and the third insulating stack comprises a third bottom insulating layer inwardly positioned in the substrate and a third top insulating layer positioned on the third bottom insulating layer.
- In some embodiments, the second insulating stack comprises a second bottom insulating layer inwardly positioned in the substrate, a second middle insulating layer positioned on the second bottom insulating layer, and a second top insulating layer positioned on the second middle insulating layer.
- In some embodiments, the first semiconductor unit further comprises a first bottom conductive layer positioned on the first bottom insulating layer, and the first bottom conductive layer has a thickness between about 10 angstroms and about 200 angstroms.
- In some embodiments, the first semiconductor unit further comprises a first top conductive layer positioned on the first bottom conductive layer, and the first top conductive layer has a thickness between about 10 angstroms and about 100 angstroms.
- In some embodiments, the first semiconductor unit further comprises a first filler layer positioned on the first top conductive layer, and the first filler layer is formed of tungsten or aluminum.
- In some embodiments, the second semiconductor unit further comprises a second bottom conductive layer positioned on the second top insulating layer, and the second bottom conductive layer has a thickness between about 10 angstroms and about 100 angstroms.
- In some embodiments, the second semiconductor unit further comprises a second top conductive layer positioned on the second bottom conductive layer, and the second top conductive layer has a thickness between about 10 angstroms and about 200 angstroms.
- In some embodiments, the second semiconductor unit further comprises a second pair of stress regions attached to lower portions of the two sides of the second semiconductor unit, and the second pair of stress regions are formed of silicon carbide.
- In some embodiments, the third semiconductor unit further comprises a third bottom conductive layer positioned on the third top insulating layer, and the third bottom conductive layer has a thickness between about 10 angstroms and about 100 angstroms.
- In some embodiments, the third semiconductor unit further comprises a third top conductive layer positioned on the third bottom conductive layer, and the third top conductive layer has a thickness between about 10 angstroms and about 200 angstroms.
- In some embodiments, the third semiconductor unit further comprises a third filler layer positioned on the third top conductive layer and a third capping layer positioned on the third filler layer.
- In some embodiments, the second semiconductor unit further comprises a second interfacial layer positioned between the substrate and the second bottom insulating layer, and the second interracial layer has a thickness less than 2 nm.
- In some embodiments, the second semiconductor unit further comprises a second functional layer positioned between the second top insulating layer and the second bottom conductive layer, and the second functional layer has a thickness between about 10 angstroms and about 15 angstroms.
- In some embodiments, the second semiconductor unit further comprises a second dipole layer positioned between the substrate and the second bottom insulating layer, and the second dipole layer is formed of a material including one or more of lutetium oxide, lutetium silicon oxide, yttrium oxide, yttrium silicon oxide, lanthanum oxide, lanthanum silicon oxide, barium oxide, or barium silicon oxide.
- In some embodiments, the second semiconductor unit further comprises a second protection layer positioned between the second top insulating layer and the second bottom conductive layer, and the second protection layer is formed of titanium nitride.
- In some embodiments, the second semiconductor unit further comprises a second encapsulation layer positioned between the second filler layer and the second top conductive layer, and the second encapsulation layer has a thickness between about 15 angstroms and about 25 angstroms.
- Another aspect of the present disclosure provides a method for fabricating a semiconductor device including providing a substrate and concurrently forming a first semiconductor unit, a second semiconductor unit, and a third semiconductor unit in the substrate. The first semiconductor unit includes a first insulating stack, the second semiconductor unit includes a second insulating stack, and the third semiconductor unit includes a third insulating stack. Thicknesses of the first insulating stack, the second insulating stack, and the third insulating stack are all different.
- In some embodiments, the method for fabricating the semiconductor device further comprises forming a plurality of trenches in the substrate and forming a first insulating film over the substrate and in the plurality of trenches.
- In some embodiments, the method for fabricating the semiconductor device further comprises removing portions of the first insulating film and forming a second insulating film over the substrate.
- Due to the design of the semiconductor device of the present disclosure, the first semiconductor unit, the second semiconductor unit, and the third semiconductor unit may have different threshold voltages and may provide different functions; therefore, the applicability of the semiconductor device may be increased. In addition, the carrier mobility of the semiconductor device may be improved. Furthermore, the threshold voltages of the semiconductor device may be fine-tuned.
- The foregoing has outlined rather broadly the features and technical advantages of the present disclosure in order that the detailed description of the disclosure that follows may be better understood. Additional features and advantages of the disclosure will be described hereinafter, and form the subject of the claims of the disclosure. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes of the present disclosure. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the disclosure as set forth in the appended claims.
- Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
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FIG. 1 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with one embodiment of the present disclosure; -
FIG. 2 illustrates, in a schematic top-view diagram, the semiconductor device in accordance with one embodiment of the present disclosure; -
FIG. 3 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance withFIG. 1 ; -
FIG. 4 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure; -
FIG. 5 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance withFIG. 4 ; -
FIG. 6 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure; -
FIG. 7 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance withFIG. 6 ; -
FIG. 8 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure; -
FIG. 9 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance withFIG. 8 ; -
FIG. 10 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure; -
FIG. 11 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance withFIG. 10 ; -
FIG. 12 illustrates, in a schematic cross-sectional view diagram, a semiconductor device in accordance with another embodiment of the present disclosure; -
FIG. 13 illustrates, in a schematic enlarged cross-sectional view diagram, the semiconductor device in accordance withFIG. 12 ; -
FIGS. 14 and 15 illustrate, in schematic cross-sectional view diagrams, semiconductor devices in accordance with some embodiments of the present disclosure; -
FIG. 16 illustrates, in a schematic enlarged cross-sectional view diagram, a semiconductor device in accordance with one embodiment of the present disclosure; -
FIG. 17 illustrates, in a flowchart diagram form, amethod 30 for fabricating a semiconductor device in accordance with one embodiment of the present disclosure; -
FIGS. 18 to 31 illustrate, in schematic cross-sectional diagrams, a flow of fabricating a semiconductor device in accordance with one embodiment of the present disclosure. - The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter.
- Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
- It should be understood that when an element or layer is referred to as being “connected to,” or “coupled to” another element or layer, it can be directly connected to or coupled to another element or layer or intervening elements or layers may be present.
- It should be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. Unless indicated otherwise, these terms are only used to distinguish one element from another element. Thus, for example, a first element, a first component or a first section discussed below could be termed a second element, a second component or a second section without departing from the teachings of the present disclosure.
- Unless the context indicates otherwise, terms such as “same,” “equal,” “planar,” or “coplanar,” as used herein when referring to orientation, layout, location, shapes, sizes, amounts, or other measures do not necessarily mean an exactly identical orientation, layout, location, shape, size, amount, or other measure, but are intended to encompass nearly identical orientation, layout, location, shapes, sizes, amounts, or other measures within acceptable variations that may occur, for example, due to manufacturing processes. The term “substantially” may be used herein to reflect this meaning. For example, items described as “substantially the same,” “substantially equal,” or “substantially planar,” may be exactly the same, equal, or planar, or may be the same, equal, or planar within acceptable variations that may occur, for example, due to manufacturing processes.
- In the present disclosure, a semiconductor device generally means a device which can function by utilizing semiconductor characteristics, and an electro-optic device, a light-emitting display device, a semiconductor circuit, and an electronic device are all included in the category of the semiconductor device. A semiconductor element with a lower threshold voltage may have a faster switching speed and may be suitable for providing computational logic functions. In contrast, a semiconductor element with a high threshold voltage may decrease power consumption of the semiconductor element and may be suitable to implement in storage functions. Therefore, a semiconductor device with semiconductor elements with multiple threshold voltages may have broader applicability than a semiconductor device with only a single threshold voltage.
- It should be noted that, in the description of the present disclosure, above (or up) corresponds to the direction of the arrow of the direction Z, and below (or down) corresponds to the opposite direction of the arrow of the direction Z.
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FIG. 1 illustrates, in a schematic cross-sectional view diagram, asemiconductor device 100A in accordance with one embodiment of the present disclosure.FIG. 2 illustrates, in a schematic top-view diagram, thesemiconductor device 100A in accordance with one embodiment of the present disclosure.FIG. 3 illustrates, in a schematic enlarged cross-sectional view diagram, thesemiconductor device 100A in accordance withFIG. 1 . - With reference to
FIGS. 1 to 3 , in the embodiment depicted, thesemiconductor device 100A may include asubstrate 101, anisolation layer 103, a plurality of doped regions, afirst semiconductor unit 301, asecond semiconductor unit 401, and athird semiconductor unit 501. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, thesubstrate 101 may include anarray area 10 and a peripheral area 20. Thearray area 10 may be in the center of thesubstrate 101. The peripheral area 20 may surround the peripheral area 20. Thesubstrate 101 may be formed of, for example, silicon, germanium, silicon germanium, silicon carbon, silicon germanium carbon, gallium, gallium arsenic, indium arsenic, indium phosphorus or other IV-IV, III-V or II-VI semiconductor materials. Thesubstrate 101 may have a first lattice constant and a crystal orientation <100>. - Alternatively, in another embodiment, the
substrate 101 may include an organic semiconductor or a layered semiconductor such as silicon/silicon germanium, silicon-on-insulator or silicon germanium-on-insulator. When thesubstrate 101 is formed of silicon-on-insulator, thesubstrate 101 may include a top semiconductor layer and a bottom semiconductor layer formed of silicon, and a buried insulating layer which may separate the top semiconductor layer from the bottom semiconductor layer. The buried insulating layer may include, for example, a crystalline or non-crystalline oxide, nitride or any combination thereof. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, theisolation layer 103 may be disposed in thesubstrate 101. In some embodiments, theisolation layer 103 may be disposed in an upper portion of thesubstrate 101. Theisolation layer 103 may define a firstactive region 105, a secondactive region 107, and a thirdactive region 109 separated from each other. The firstactive region 105 may be located at thearray area 10 of thesubstrate 101. The secondactive region 107 and the thirdactive region 109 may be located at the peripheral area 20 of thesubstrate 101. Alternatively, in another embodiment, the firstactive region 105, the secondactive region 107, and the thirdactive region 109 may be all located at thearray area 10 or all located at the peripheral area 20, but are not limited thereto. Alternatively, in another embodiment, the firstactive region 105, the secondactive region 107, and the thirdactive region 109 may be connected to each other. Theisolation layer 103 may be formed of, for example, an insulating material such as silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or fluoride-doped silicate. - It should be noted that, in the present disclosure, silicon oxynitride refers to a substance which contains silicon, nitrogen, and oxygen and in which a proportion of oxygen is greater than that of nitrogen. Silicon nitride oxide refers to a substance which contains silicon, oxygen, and nitrogen and in which a proportion of nitrogen is greater than that of oxygen.
- With reference to
FIGS. 1 to 3 , in the embodiment depicted, the plurality of doped regions may be disposed in thesubstrate 101. In some embodiments, the plurality of doped regions may be respectively correspondingly disposed in the firstactive region 105, the secondactive region 107, and the thirdactive region 109. The plurality of doped regions may include two firstdoped regions 201, two seconddoped regions 203, and two thirddoped regions 205. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the two firstdoped regions 201 may be disposed in the firstactive region 105 and separated from each other. Top surfaces of the two firstdoped regions 201 may be even with a top surface of thesubstrate 101. The two firstdoped regions 201 may be doped with a dopant such as phosphorus, arsenic, or antimony and have a first electrical type. The two seconddoped regions 203 may be disposed in the secondactive region 107 and separated from each other. Top surfaces of the two seconddoped regions 203 may be even with the top surface of thesubstrate 101. The two seconddoped regions 203 may have a same electrical type as the two firstdoped regions 201. The two thirddoped regions 205 may be disposed in the thirdactive region 109 and separated from each other. Top surfaces of the two thirddoped regions 205 may be even with the top surface of thesubstrate 101. The two thirddoped regions 205 may be doped with a dopant such as boron and have a second electrical type. The second electrical type may be different from the first electrical type. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, thefirst semiconductor unit 301 may be disposed in the firstactive region 105 and between the two firstdoped regions 201. Thefirst semiconductor unit 301 may have a first threshold voltage. Thefirst semiconductor unit 301 may include a first insulating stack, a first bottomconductive layer 305, and afirst filler layer 307. The first insulating stack may be disposed in the firstactive region 105 and include a firstbottom insulating layer 303. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the firstbottom insulating layer 303 may be inwardly disposed in the firstactive region 105. The two firstdoped regions 201 may be attached to two sides of the firstbottom insulating layer 303. The firstbottom insulating layer 303 may have a thickness between about 0.5 nm and about 5.0 nm. Preferably, the thickness of the firstbottom insulating layer 303 may be between about 0.5 nm and about 2.5 nm. It should be noted that the thickness of the firstbottom insulating layer 303 may be set to an arbitrary range depending on the circumstances. - The first
bottom insulating layer 303 may be formed of, for example, an insulating material having a dielectric constant of about 4.0 or greater. (All dielectric constants mentioned herein are relative to a vacuum unless otherwise noted.) The insulating material having a dielectric constant of about 4.0 or greater may be hafnium oxide, hafnium zirconium oxide, hafnium lanthanum oxide, hafnium silicon oxide, hafnium tantalum oxide, hafnium titanium oxide, zirconium oxide, aluminum oxide, aluminum silicon oxide, titanium oxide, tantalum pentoxide, lanthanum oxide, lanthanum silicon oxide, strontium titanate, lanthanum aluminate, yttrium oxide, gallium (III) trioxide, gadolinium gallium oxide, lead zirconium titanate, barium titanate, barium strontium titanate, barium zirconate, or a mixture thereof. Alternatively, in another embodiment, the insulating material may be silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the first bottomconductive layer 305 may be disposed in the firstactive region 105 and on the firstbottom insulating layer 303. The first bottomconductive layer 305 may have a thickness between about 10 angstroms and about 200 angstroms. Preferably, the thickness of the first bottomconductive layer 305 may be between about 10 angstroms and about 100 angstroms. The first bottomconductive layer 305 may be formed of, for example, aluminum, silver, titanium, titanium nitride, titanium aluminum, titanium carbide aluminum, titanium nitride aluminum, titanium silicon aluminum, tantalum nitride, tantalum carbide, tantalum silicon nitride, manganese, zirconium, or tungsten nitride. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, thefirst filler layer 307 may be disposed in the firstactive region 105 and on the first bottomconductive layer 305. A top surface of thefirst filler layer 307 may be even with the top surface of thesubstrate 101. Thefirst filler layer 307 may be formed of, for example, tungsten or aluminum. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, thesecond semiconductor unit 401 may be disposed in the secondactive region 107 and between the two seconddoped regions 203. Thesecond semiconductor unit 401 may include a second insulating stack, a second bottomconductive layer 409, and asecond filler layer 411. The second insulating stack may include a secondbottom insulating layer 403, a second middle insulatinglayer 405, and a second top insulatinglayer 407. Thesecond semiconductor unit 401 may have a second threshold voltage. The second threshold voltage may be greater than the first threshold voltage. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the secondbottom insulating layer 403 may be inwardly disposed in the secondactive region 107. The two seconddoped regions 203 may be attached to two sides of the secondbottom insulating layer 403. The secondbottom insulating layer 403 may have a thickness between about 0.1 nm and about 3.0 nm. Preferably, the thickness of the secondbottom insulating layer 403 may be between about 0.5 nm and about 2.5 nm. It should be noted that the thickness of the secondbottom insulating layer 403 may be set to an arbitrary range depending on the circumstances. The secondbottom insulating layer 403 may be formed of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like. Alternatively, in another embodiment, the secondbottom insulating layer 403 may be formed of an insulating material having a dielectric constant of about 4.0 or greater. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the second middle insulatinglayer 405 may be disposed in the secondactive region 107 and on the secondbottom insulating layer 403. The second middle insulatinglayer 405 may have a thickness between about 0.1 nm and about 2.0 nm. Preferably, the thickness of the second middle insulatinglayer 405 may be between about 0.5 nm to about 1.5 nm. It should be noted that the thickness of the second middle insulatinglayer 405 may be set to an arbitrary range depending on the circumstances. The second middle insulatinglayer 405 may be formed of, for example, an insulating material having a dielectric constant of about 4.0 or greater. Alternatively, in another embodiment, the second middle insulatinglayer 405 may be formed of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the second top insulatinglayer 407 may be disposed in the secondactive region 107 and on the second middle insulatinglayer 405. The second top insulatinglayer 407 may have a same thickness as the firstbottom insulating layer 303, but is not limited thereto. The second top insulatinglayer 407 may be formed of a same material as the firstbottom insulating layer 303, but is not limited thereto. The second bottomconductive layer 409 may be disposed in the secondactive region 107 and on the second top insulatinglayer 407. The second bottomconductive layer 409 may have a same thickness as the first bottomconductive layer 305, but is not limited thereto. The second bottomconductive layer 409 may be formed of a same material as the first bottomconductive layer 305, but is not limited thereto. Thesecond filler layer 411 may be disposed in the secondactive region 107 and on the second bottomconductive layer 409. Thesecond filler layer 411 may be formed of a same material as the first bottomconductive layer 305, but is not limited thereto. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, thethird semiconductor unit 501 may be disposed in the thirdactive region 109 and between the two thirddoped regions 205. Thethird semiconductor unit 501 may include a third insulating stack, a third bottomconductive layer 507, a third topconductive layer 509, and athird filler layer 511. The third insulating stack may include a third bottom insulatinglayer 503 and a third top insulatinglayer 505. Thethird semiconductor unit 501 may have a third threshold voltage. The third threshold voltage may be greater than the first threshold voltage and less than the second threshold voltage. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the third bottom insulatinglayer 503 may be inwardly disposed in the thirdactive region 109. The two thirddoped regions 205 may be attached to two sides of the third bottom insulatinglayer 503. The third bottom insulatinglayer 503 may have a same thickness as the second middle insulatinglayer 405, but is not limited thereto. It should be noted that the thickness of the third bottom insulatinglayer 503 may be set to an arbitrary range depending on the circumstances. The third bottom insulatinglayer 503 may be formed of a same material as the second middle insulatinglayer 405, but is not limited thereto. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the third top insulatinglayer 505 may be disposed in the thirdactive region 109 and on the third bottom insulatinglayer 503. The third top insulatinglayer 505 may have a same thickness as the second top insulatinglayer 407, but is not limited thereto. The third top insulatinglayer 505 may be formed of a same material as the second top insulatinglayer 407, but is not limited thereto. The third bottomconductive layer 507 may be disposed in the thirdactive region 109 and on the third top insulatinglayer 505. The third bottomconductive layer 507 may have a thickness between about 10 angstroms and about 100 angstroms. The third bottomconductive layer 507 may be formed of, for example, titanium nitride, tantalum nitride, tantalum carbide, tungsten nitride, or ruthenium. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the third topconductive layer 509 may be disposed in the thirdactive region 109 and on the third bottomconductive layer 507. The third topconductive layer 509 may have a same thickness as the second bottomconductive layer 409, but is not limited thereto. The third topconductive layer 509 may be formed of a same material as the second bottomconductive layer 409, but is not limited thereto. Thethird filler layer 511 may be disposed in the thirdactive region 109 and on the third topconductive layer 509. Thethird filler layer 511 may be formed of a same material as thesecond filler layer 411, but is not limited thereto. - With reference to
FIGS. 1 to 3 , in the embodiment depicted, the first insulating stack of thefirst semiconductor unit 301 may have a thickness T1, which may be equal to the thickness of the firstbottom insulating layer 303. The second insulating stack may have a thickness T2, which may be equal to a sum of the thicknesses of the second top insulatinglayer 407, the second middle insulatinglayer 405, and the secondbottom insulating layer 403. The third insulating stack may have a thickness T3, which may be equal to a sum of the thicknesses of the third top insulatinglayer 505 and the third bottom insulatinglayer 503. The thickness T3 may be greater than the thickness T2 and the thickness T1. The thickness T2 may be greater than the thickness T1. The threshold voltage may be proportional to the thickness of the insulating stack; hence, the second threshold voltage of thesecond semiconductor unit 401 including the second insulating stack may be greater than the third threshold voltage of thethird semiconductor unit 501 including the third insulating stack and the first threshold voltage of thefirst semiconductor unit 301 including the first insulating stack. Accordingly, the third threshold voltage of thethird semiconductor unit 501 including the third insulating stack may be greater than the first threshold voltage of thefirst semiconductor unit 301 including the first insulating stack. -
FIG. 4 illustrates, in a schematic cross-sectional view diagram, asemiconductor device 100B in accordance with another embodiment of the present disclosure.FIG. 5 illustrates, in a schematic enlarged cross-sectional view diagram, thesemiconductor device 100B in accordance withFIG. 4 . - With reference to
FIGS. 4 and 5 and in contrast toFIG. 1 , the two thirddoped regions 205B may have the first electrical type and may be doped with a dopant such as phosphorus, arsenic, or antimony. Thethird semiconductor unit 501 may include the third bottom insulatinglayer 503, the third top insulatinglayer 505, the third bottomconductive layer 507B, and thethird filler layer 511. The third bottom insulatinglayer 503 may be inwardly disposed in the thirdactive region 109. The third top insulatinglayer 505 may be disposed on the third bottom insulatinglayer 503. The third bottomconductive layer 507B may be disposed on the third top insulatinglayer 505. The third bottomconductive layer 507B may have a same thickness as the second bottomconductive layer 409 and may be formed of a same material as the second bottomconductive layer 409. Thethird filler layer 511 may be directly disposed on the third bottomconductive layer 507B. -
FIG. 6 illustrates, in a schematic cross-sectional view diagram, asemiconductor device 100C in accordance with another embodiment of the present disclosure.FIG. 7 illustrates, in a schematic enlarged cross-sectional view diagram, thesemiconductor device 100C in accordance withFIG. 6 . - With reference to
FIGS. 6 and 7 and in contrast toFIG. 1 , the two seconddoped regions 203C may have the second electrical type and may be doped with a dopant such as boron. Thesecond semiconductor unit 401 may include the secondbottom insulating layer 403, the second middle insulatinglayer 405, the second top insulatinglayer 407, the second bottomconductive layer 409C, thesecond filler layer 411, and a second topconductive layer 413. The secondbottom insulating layer 403 may be inwardly disposed in the secondactive region 107. The second middle insulatinglayer 405 may be disposed on the secondbottom insulating layer 403. The second top insulatinglayer 407 may be disposed on the second middle insulatinglayer 405. The second bottomconductive layer 409C may be disposed on the second top insulatinglayer 407. The second bottomconductive layer 409C may have a same thickness as the third bottomconductive layer 507 and may be formed of a same material as the third bottomconductive layer 507. The second topconductive layer 413 may be disposed on the second bottomconductive layer 409C. The second topconductive layer 413 may have a same thickness as the first bottomconductive layer 305 and may be formed of a same material as the first bottomconductive layer 305. Thesecond filler layer 411 may be disposed on the second topconductive layer 413. -
FIG. 8 illustrates, in a schematic cross-sectional view diagram, asemiconductor device 100D in accordance with another embodiment of the present disclosure.FIG. 9 illustrates, in a schematic enlarged cross-sectional view diagram, thesemiconductor device 100D in accordance withFIG. 8 . - With reference to
FIGS. 8 and 9 and in contrast toFIG. 1 , the two firstdoped regions 201D may have the second electrical type and may be doped with a dopant such as boron. Thefirst semiconductor unit 301 may include the firstbottom insulating layer 303, the first bottomconductive layer 305D, thefirst filler layer 307, and a first topconductive layer 309. The firstbottom insulating layer 303 may be inwardly disposed in the firstactive region 105. The first bottomconductive layer 305D may be disposed on the firstbottom insulating layer 303. The first bottomconductive layer 305D may have a thickness between about 10 angstroms and about 100 angstroms. The first bottomconductive layer 305D may be formed of, for example, titanium nitride, tantalum nitride, tantalum carbide, tungsten nitride, or ruthenium. The first topconductive layer 309 may be disposed on the first bottomconductive layer 305. The first topconductive layer 309 may have a thickness between about 10 angstroms and about 200 angstroms. The first topconductive layer 309 may be formed of, for example, aluminum, silver, titanium, titanium nitride, titanium aluminum, titanium carbide aluminum, titanium nitride aluminum, titanium silicon aluminum, tantalum nitride, tantalum carbide, tantalum silicon nitride, manganese, zirconium, or tungsten nitride. -
FIG. 10 illustrates, in a schematic cross-sectional view diagram, asemiconductor device 100E in accordance with another embodiment of the present disclosure.FIG. 11 illustrates, in a schematic enlarged cross-sectional view diagram, thesemiconductor device 100E in accordance withFIG. 10 . - With reference to
FIGS. 10 and 11 and in contrast toFIG. 8 , the two thirddoped regions 205E may have the first electrical type and may be doped with a dopant such as phosphorus, arsenic, or antimony. Thethird semiconductor unit 501 may include the third bottom insulatinglayer 503, the third top insulatinglayer 505, the third bottomconductive layer 507E, and thethird filler layer 511. The third bottom insulatinglayer 503 may be inwardly disposed in the thirdactive region 109. - The third top insulating
layer 505 may be disposed on the third bottom insulatinglayer 503. The third bottomconductive layer 507E may be disposed on the third top insulatinglayer 505. The third bottomconductive layer 507E may have a same thickness as the second bottomconductive layer 409 and may be formed of a same material as the second bottomconductive layer 409. Thethird filler layer 511 may be directly disposed on the third bottomconductive layer 507E. -
FIG. 12 illustrates, in a schematic cross-sectional view diagram, asemiconductor device 100F in accordance with another embodiment of the present disclosure.FIG. 13 illustrates, in a schematic enlarged cross-sectional view diagram, thesemiconductor device 100F in accordance withFIG. 12 . - With reference to
FIGS. 12 and 13 and in contrast toFIG. 8 , the two seconddoped regions 203F may have the second electrical type and may be doped with a dopant such as boron. Thesecond semiconductor unit 401 may include the secondbottom insulating layer 403, the second middle insulatinglayer 405, the second top insulatinglayer 407, the second bottomconductive layer 409F, thesecond filler layer 411, and a second topconductive layer 413. The secondbottom insulating layer 403 may be inwardly disposed in the secondactive region 107. The second middle insulatinglayer 405 may be disposed on the secondbottom insulating layer 403. The second top insulatinglayer 407 may be disposed on the second middle insulatinglayer 405. The second bottomconductive layer 409F may be disposed on the second top insulatinglayer 407. The second bottomconductive layer 409F may have a same thickness as the third bottomconductive layer 507 and may be formed of a same material as the third bottomconductive layer 507. The second topconductive layer 413 may be disposed on the second bottomconductive layer 409F. The second topconductive layer 413 may have a same thickness as the third topconductive layer 509 and may be formed of a same material as the third topconductive layer 509. Thesecond filler layer 411 may be disposed on the second topconductive layer 413. -
FIGS. 14 and 15 illustrate, in schematic cross-sectional view diagrams,semiconductor devices - With reference to
FIG. 14 , thesemiconductor device 100G may include a first pair ofstress regions 207, a second pair ofstress regions 209, and a third pair ofstress regions 211. The first pair ofstress regions 207 may be disposed in the firstactive region 105 and respectively correspondingly attached to lower portions of the two sides of thefirst semiconductor unit 301. In some embodiments, the first pair ofstress regions 207 may be attached to lower portions of the two sides of the firstbottom insulating layer 303. The first pair ofstress regions 207 may be formed of, for example, silicon carbide. The second pair ofstress regions 209 may be disposed in the secondactive region 107 and respectively correspondingly attached to lower portions of the two sides of thesecond semiconductor unit 401. In some embodiments, the second pair ofstress regions 209 may be attached to lower portions of the two sides of the secondbottom insulating layer 403. The second pair ofstress regions 209 may be formed of a same material as the first pair ofstress regions 207. The third pair ofstress regions 211 may be disposed in the thirdactive region 109 and respectively correspondingly attached to lower portions of the two sides of thethird semiconductor unit 501. In some embodiments, the third pair ofstress regions 211 may be attached to lower portions of the two sides of the third bottom insulatinglayer 503. The third pair ofstress regions 211 may be formed of, for example, silicon germanium. The first pair ofstress regions 207, the second pair ofstress regions 209, and the third pair ofstress regions 211 may have lattice constants different form the lattice constant of thesubstrate 101. The first pair ofstress regions 207, the second pair ofstress regions 209, and the third pair ofstress regions 211 may increase the carrier mobility of thesemiconductor device 100G; therefore, the performance of thesemiconductor device 100G may be improved. - With reference to
FIG. 15 , thefirst semiconductor unit 301 may further include afirst capping layer 311. Thefirst capping layer 311 may be disposed on thefirst filler layer 307 and may be formed of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or fluoride-doped silicate. A top surface of thefirst capping layer 311 may be even with the top surface of thesubstrate 101. Thesecond semiconductor unit 401 may further include asecond capping layer 415. Thesecond capping layer 415 may be disposed on thesecond filler layer 411 and may be formed of a same material as thefirst capping layer 311. Thethird semiconductor unit 501 may further include athird capping layer 513. Thethird capping layer 513 may be disposed on thethird filler layer 511 and may be formed of a same material as thefirst capping layer 311. -
FIG. 16 illustrates, in a schematic enlarged cross-sectional view diagram, a semiconductor device 100I in accordance with one embodiment of the present disclosure. - With reference to
FIG. 16 , thefirst semiconductor unit 301 may further include a firstinterfacial layer 313, afirst dipole layer 315, a firstfunctional layer 317, afirst adjustment layer 319, afirst protection layer 321, and afirst encapsulation layer 323. The firstinterfacial layer 313 may be disposed between thesubstrate 101 and the firstbottom insulating layer 303. The firstinterfacial layer 313 may facilitate formation of the firstbottom insulating layer 303. The firstinterfacial layer 313 may have a thickness between about 5 angstroms and about 20 angstroms. - The first
interfacial layer 313 may be formed of a chemical oxide of theunderlying substrate 101 such as silicon oxide. Thefirst dipole layer 315 may be disposed between the firstbottom insulating layer 303 and the firstinterfacial layer 313. Thefirst dipole layer 315 may have a thickness less than 2 nm. Thefirst dipole layer 315 may displace defects in the firstbottom insulating layer 303 and improve the mobility and reliability of thefirst semiconductor unit 301. Thefirst dipole layer 315 may be formed of a material including one or more of lutetium oxide, lutetium silicon oxide, yttrium oxide, yttrium silicon oxide, lanthanum oxide, lanthanum silicon oxide, barium oxide, barium silicon oxide, strontium oxide, strontium silicon oxide, aluminum oxide, aluminum silicon oxide, titanium oxide, titanium silicon oxide, hafnium oxide, hafnium silicon oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, tantalum silicon oxide, scandium oxide, scandium silicon oxide, magnesium oxide, and magnesium silicon oxide. - With reference to
FIG. 16 , the firstfunctional layer 317 may be disposed on the firstbottom insulating layer 303. The firstfunctional layer 317 may have a thickness between about 10 angstroms and about 15 angstroms and may be formed of, for example, titanium nitride or tantalum nitride. The firstfunctional layer 317 may protect the firstbottom insulating layer 303 from damage during subsequent semiconductor processes. Thefirst adjustment layer 319 may be disposed on the firstfunctional layer 317 and may include a material or an alloy including lanthanide nitride. Thefirst adjustment layer 319 may be used to fine-tune the first threshold voltage. Thefirst protection layer 321 may be disposed on thefirst adjustment layer 319 and may protect thefirst adjustment layer 319 from damage during subsequent semiconductor processes. Thefirst protection layer 321 may be formed of, for example, titanium nitride. - With reference to
FIG. 16 , thefirst encapsulation layer 323 may be disposed between the first bottomconductive layer 305 and thefirst filler layer 307. Thefirst encapsulation layer 323 may have a thickness between about 15 angstroms and about 25 angstroms. Thefirst encapsulation layer 323 may be formed of, for example, titanium nitride. Thefirst encapsulation layer 323 may protect layers below thefirst encapsulation layer 323 from mechanical damage or diffusion of thefirst filler layer 307. Thesecond semiconductor unit 401 may further include a secondinterfacial layer 417, asecond dipole layer 419, a secondfunctional layer 421, asecond adjustment layer 423, asecond protection layer 425, and asecond encapsulation layer 427. Thethird semiconductor unit 501 may further include a thirdinterfacial layer 515, athird dipole layer 517, a thirdfunctional layer 519, athird adjustment layer 521, athird protection layer 523, and athird encapsulation layer 525. The aforementioned layers of thesecond semiconductor unit 401 and thethird semiconductor unit 501 may be disposed in a manner similar to that of thefirst semiconductor unit 301. -
FIG. 17 illustrates, in a flowchart diagram form, amethod 30 for fabricating asemiconductor device 100A in accordance with one embodiment of the present disclosure.FIGS. 18 to 31 illustrate, in schematic cross-sectional diagrams, a flow of fabricating thesemiconductor device 100A in accordance with one embodiment of the present disclosure. - With reference to
FIGS. 17 and 18 , at step S11, in the embodiment depicted, asubstrate 101 may be provided and a plurality of trenches may be formed in thesubstrate 101. Anisolation layer 103 may be formed in thesubstrate 101 and may define a firstactive region 105, a secondactive region 107, and a thirdactive region 109. A plurality of doped regions may be formed in thesubstrate 101 by implantation processes. The plurality of trenches may be respectively correspondingly formed in the firstactive region 105, the secondactive region 107, and the thirdactive region 109. In some embodiments, the plurality of trenches may include afirst trench 111, asecond trench 113, and athird trench 115. Thefirst trench 111 may be formed in the firstactive region 105. Thesecond trench 113 may be formed in the secondactive region 107. Thethird trench 115 may be formed in the thirdactive region 109. The plurality of doped regions may be respectively correspondingly divided by the plurality of trenches and turned into two firstdoped regions 201 in the firstactive region 105, two seconddoped regions 203 in the secondactive region 107, and two thirddoped regions 205 in the thirdactive region 109. - With reference to
FIGS. 17 and 19 , at step S13, in the embodiment depicted, a firstinsulating film 701 may be formed over thesubstrate 101. The firstinsulating film 701 may be conformally formed over a top surface of thesubstrate 101 and in the plurality of trenches by a deposition process such as physical vapor deposition, atomic layer deposition, chemical vapor deposition, sputtering, or the like. The firstinsulating film 701 may have a thickness between about 0.1 nm and about 3.0 nm. The firstinsulating film 701 may be formed of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like. Alternatively, in another embodiment, the first insulatingfilm 701 may be formed of an insulating material having a dielectric constant of about 4.0 or greater. - With reference to
FIGS. 17, 20, and 21 , at step S15, in the embodiment depicted, portions of the first insulatingfilm 701 may be removed. With reference toFIG. 20 , a photolithography process may be performed using afirst mask layer 801 as a mask for the secondactive region 107. Thefirst mask layer 801 may be a photoresist layer. With reference toFIG. 21 , an etch process may be performed to remove the portions of the first insulatingfilm 701 formed at the firstactive region 105 and the thirdactive region 109. The firstinsulating film 701 formed at the secondactive region 107 may be retained. After the etch process, thefirst mask layer 801 may be removed. - With reference to
FIGS. 17 and 22 , at step S17, in the embodiment depicted, a secondinsulating film 703 may be formed over thesubstrate 101. The secondinsulating film 703 may be conformally formed over the top surface of thesubstrate 101, on the first insulatingfilm 701, and in thefirst trench 111 and thethird trench 115. The secondinsulating film 703 may be formed by a deposition process similar to that of step S13. The secondinsulating film 703 may have a thickness between about 0.1 nm and about 2.0 nm. The secondinsulating film 703 may be formed of a same material as the first insulatingfilm 701, but is not limited thereto. - With reference to
FIGS. 17, 23, and 24 , at step S19, in the embodiment depicted, portions of the secondinsulating film 703 may be removed. With reference toFIG. 23 , a photolithography process may be performed using asecond mask layer 803 as a mask for the secondactive region 107 and the thirdactive region 109. Thesecond mask layer 803 may be a photoresist layer. With reference toFIG. 24 , an etch process may be performed to remove the portions of the secondinsulating film 703 formed at the firstactive region 105. The secondinsulating film 703 formed at the secondactive region 107 and the thirdactive region 109 may be retained. After the etch process, thesecond mask layer 803 may be removed. - With reference to
FIGS. 17, 25, and 26 , at step S21, in the embodiment depicted, a thirdinsulating film 705 and a firstconductive film 707 may be formed over thesubstrate 101. With reference toFIG. 25 , the thirdinsulating film 705 may be conformally formed over the top surface of thesubstrate 101 and on the secondinsulating film 703. The thirdinsulating film 705 may have a thickness between about 0.5 nm and about 5.0 nm. With reference toFIG. 26 , the firstconductive film 707 may be formed on the thirdinsulating film 705. The firstconductive film 707 may have a thickness between about 10 angstroms and about 100 angstroms. The firstconductive film 707 may be formed of, for example, titanium nitride, tantalum nitride, tantalum carbide, tungsten nitride, or ruthenium. The thirdinsulating film 705 and the firstconductive film 707 may be formed by deposition processes similar to those of step S13. - With reference to
FIGS. 17, 27, and 28 , at step S23, in the embodiment depicted, portions of the firstconductive film 707 may be removed. With reference toFIG. 27 , a photolithography process may be performed using athird mask layer 805 as a mask for the thirdactive region 109. Thethird mask layer 805 may be a photoresist layer. With reference toFIG. 28 , an etch process may be performed to remove the portions of the firstconductive film 707 formed at the firstactive region 105 and the secondactive region 107. The firstconductive film 707 formed at the thirdactive region 109 may be retained. After the etch process, thethird mask layer 805 may be removed. - With reference to
FIGS. 17, 29, and 30 , at step S25, in the embodiment depicted, a secondconductive film 709 and afiller film 711 may be formed over thesubstrate 101. With reference toFIG. 29 , the secondconductive film 709 may be formed on the thirdinsulating film 705 and the firstconductive film 707. The secondconductive film 709 may have a thickness between about 10 angstroms and about 200 angstroms. The secondconductive film 709 may be formed of, for example, aluminum, silver, titanium, titanium nitride, titanium aluminum, titanium carbide aluminum, titanium nitride aluminum, titanium silicon aluminum, tantalum nitride, tantalum carbide, tantalum silicon nitride, manganese, zirconium, or tungsten nitride. With reference toFIG. 30 , thefiller film 711 may be formed on the secondconductive film 709 and may fill thefirst trench 111, thesecond trench 113, and thethird trench 115. Thefiller film 711 may be formed of, for example, tungsten or aluminum. - With reference to
FIGS. 17 and 31 , at step S27, in the embodiment depicted, afirst semiconductor unit 301, asecond semiconductor unit 401, and athird semiconductor unit 501 may be concurrently formed in thesubstrate 101. A planarization process, such as chemical mechanical polishing, may be performed to remove excess material, provide a substantially flat surface for subsequent processing steps, and conformally form thefirst semiconductor unit 301, thesecond semiconductor unit 401, and thethird semiconductor unit 501. After the planarization process, the first insulatingfilm 701 may be turned into a secondbottom insulating layer 403. The secondinsulating film 703 may be turned into a second middle insulatinglayer 405 and a third bottom insulatinglayer 503. The thirdinsulating film 705 may be turned into a firstbottom insulating layer 303, a second top insulatinglayer 407, and a third top insulatinglayer 505. The firstconductive film 707 may be turned into a third bottomconductive layer 507. The secondconductive film 709 may be turned into a first bottomconductive layer 305, a second bottomconductive layer 409, and a third topconductive layer 509. Thefiller film 711 may be turned into afirst filler layer 307, asecond filler layer 411, and athird filler layer 511. - With reference to
FIG. 31 , the firstbottom insulating layer 303, the first bottomconductive layer 305, and thefirst filler layer 307 together form thefirst semiconductor unit 301 in the firstactive region 105. The secondbottom insulating layer 403, the second middle insulatinglayer 405, the second top insulatinglayer 407, the second bottomconductive layer 409, and thesecond filler layer 411 together form thesecond semiconductor unit 401 in the secondactive region 107. The third bottom insulatinglayer 503, the third top insulatinglayer 505, the third bottomconductive layer 507, the third topconductive layer 509, and thethird filler layer 511 together form thethird semiconductor unit 501 in the thirdactive region 109. - Due to the design of the semiconductor device of the present disclosure, the
first semiconductor unit 301, thesecond semiconductor unit 401, and thethird semiconductor unit 501 may have different threshold voltages and may provide different functions; therefore, the applicability of the semiconductor device may be increased. In addition, the carrier mobility of the semiconductor device may be improved due to presence of the first pair ofstress regions 207, the second pair ofstress regions 209, and the third pair ofstress regions 211. Furthermore, the threshold voltages of the semiconductor device may be fine-tuned by the firstfunctional layer 317, thesecond adjustment layer 423, and thethird adjustment layer 521. - Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure as defined by the appended claims. For example, many of the processes discussed above can be implemented in different methodologies and replaced by other processes, or a combination thereof.
- Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the present disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, and steps.
Claims (20)
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US16/658,949 US20210118874A1 (en) | 2019-10-21 | 2019-10-21 | Semiconductor device and method for fabricating the same |
TW109127394A TWI749703B (en) | 2019-10-21 | 2020-08-12 | Semiconductor device and method for fabricating the same |
CN202010939845.2A CN112768448B (en) | 2019-10-21 | 2020-09-09 | Semiconductor element and method for manufacturing the same |
US17/526,141 US11876094B2 (en) | 2019-10-21 | 2021-11-15 | Method for fabricating semiconductor device |
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US16/658,949 US20210118874A1 (en) | 2019-10-21 | 2019-10-21 | Semiconductor device and method for fabricating the same |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220285240A1 (en) * | 2020-07-10 | 2022-09-08 | Nanya Technology Corporation | Method for fabricating semiconductor device with protection layers |
US20230223440A1 (en) * | 2019-11-05 | 2023-07-13 | Nanya Technology Corporation | Semiconductor device |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030183877A1 (en) * | 2002-03-29 | 2003-10-02 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing method of semiconductor device |
US20130299914A1 (en) * | 2012-05-14 | 2013-11-14 | Ju-youn Kim | Semiconductor device and method for manufacturing the device |
US20150069524A1 (en) * | 2013-09-09 | 2015-03-12 | Freescale Semiconductor, Inc | Method of Forming Different Voltage Devices with High-K Metal Gate |
US20150236125A1 (en) * | 2014-02-14 | 2015-08-20 | Semiconductor Manufacturing International (Shanghai) Corporation | Semiconductor device and manufacturing method thereof |
US20150262822A1 (en) * | 2014-03-14 | 2015-09-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | N-work function metal with crystal structure |
US20150263004A1 (en) * | 2014-03-12 | 2015-09-17 | Samsung Electronics Co., Ltd. | Semiconductor device having mid-gap work function metal gate electrode |
US20160225867A1 (en) * | 2015-01-29 | 2016-08-04 | Juyoun Kim | Semiconductor device having work-function metal and method of forming the same |
US20170236821A1 (en) * | 2016-02-11 | 2017-08-17 | Samsung Electronics Co., Ltd, | Semiconductor device including transistors with adjusted threshold voltages |
US20180151376A1 (en) * | 2016-11-25 | 2018-05-31 | Samsung Electronics Co., Ltd. | Methods of fabricating semiconductor devices |
US20190122891A1 (en) * | 2017-10-20 | 2019-04-25 | Samsung Electronics Co., Ltd. | Method of forming multi-threshold voltage devices and devices so formed |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010027823A (en) * | 2008-07-18 | 2010-02-04 | Nec Electronics Corp | Method of manufacturing semiconductor device, and semiconductor device |
US8324090B2 (en) * | 2008-08-28 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method to improve dielectric quality in high-k metal gate technology |
KR102056582B1 (en) * | 2013-06-05 | 2020-01-22 | 삼성전자 주식회사 | Semiconductor device and method for the same |
US9553090B2 (en) * | 2015-05-29 | 2017-01-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and formation method of semiconductor device structure |
TWI712084B (en) * | 2016-11-17 | 2020-12-01 | 聯華電子股份有限公司 | Semiconductor device and manufacturing method thereof |
KR102633489B1 (en) * | 2017-07-13 | 2024-02-06 | 어플라이드 머티어리얼스, 인코포레이티드 | Low thickness-dependent work function nMOS integration for metal gates |
US10607895B2 (en) * | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
KR102316293B1 (en) * | 2017-09-18 | 2021-10-22 | 삼성전자주식회사 | Semiconductor devices |
KR102403723B1 (en) * | 2017-12-15 | 2022-05-31 | 삼성전자주식회사 | Semiconductor device and manufacturing method thereof |
-
2019
- 2019-10-21 US US16/658,949 patent/US20210118874A1/en not_active Abandoned
-
2020
- 2020-08-12 TW TW109127394A patent/TWI749703B/en active
- 2020-09-09 CN CN202010939845.2A patent/CN112768448B/en active Active
-
2021
- 2021-11-15 US US17/526,141 patent/US11876094B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030183877A1 (en) * | 2002-03-29 | 2003-10-02 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing method of semiconductor device |
US20130299914A1 (en) * | 2012-05-14 | 2013-11-14 | Ju-youn Kim | Semiconductor device and method for manufacturing the device |
US20150069524A1 (en) * | 2013-09-09 | 2015-03-12 | Freescale Semiconductor, Inc | Method of Forming Different Voltage Devices with High-K Metal Gate |
US20150236125A1 (en) * | 2014-02-14 | 2015-08-20 | Semiconductor Manufacturing International (Shanghai) Corporation | Semiconductor device and manufacturing method thereof |
US20150263004A1 (en) * | 2014-03-12 | 2015-09-17 | Samsung Electronics Co., Ltd. | Semiconductor device having mid-gap work function metal gate electrode |
US20150262822A1 (en) * | 2014-03-14 | 2015-09-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | N-work function metal with crystal structure |
US20160225867A1 (en) * | 2015-01-29 | 2016-08-04 | Juyoun Kim | Semiconductor device having work-function metal and method of forming the same |
US20170236821A1 (en) * | 2016-02-11 | 2017-08-17 | Samsung Electronics Co., Ltd, | Semiconductor device including transistors with adjusted threshold voltages |
US20180151376A1 (en) * | 2016-11-25 | 2018-05-31 | Samsung Electronics Co., Ltd. | Methods of fabricating semiconductor devices |
US20190122891A1 (en) * | 2017-10-20 | 2019-04-25 | Samsung Electronics Co., Ltd. | Method of forming multi-threshold voltage devices and devices so formed |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230223440A1 (en) * | 2019-11-05 | 2023-07-13 | Nanya Technology Corporation | Semiconductor device |
US11942514B2 (en) * | 2019-11-05 | 2024-03-26 | Nanya Technology Corporation | Semiconductor device |
US20220285240A1 (en) * | 2020-07-10 | 2022-09-08 | Nanya Technology Corporation | Method for fabricating semiconductor device with protection layers |
US11462453B2 (en) * | 2020-07-10 | 2022-10-04 | Nanya Technology Corporation | Semiconductor device with protection layers and method for fabricating the same |
US11705380B2 (en) * | 2020-07-10 | 2023-07-18 | Nanya Technology Corporation | Method for fabricating semiconductor device with protection layers |
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TWI749703B (en) | 2021-12-11 |
TW202118007A (en) | 2021-05-01 |
US20220077144A1 (en) | 2022-03-10 |
CN112768448B (en) | 2024-05-28 |
US11876094B2 (en) | 2024-01-16 |
CN112768448A (en) | 2021-05-07 |
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