US20210096293A1 - Keyboard backlight module and manufacturing method thereof - Google Patents
Keyboard backlight module and manufacturing method thereof Download PDFInfo
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- US20210096293A1 US20210096293A1 US16/675,833 US201916675833A US2021096293A1 US 20210096293 A1 US20210096293 A1 US 20210096293A1 US 201916675833 A US201916675833 A US 201916675833A US 2021096293 A1 US2021096293 A1 US 2021096293A1
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- Prior art keywords
- light
- guiding sheet
- circuit board
- sheet
- backlight module
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
- G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
- G02B6/0061—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to provide homogeneous light output intensity
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/704—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
- G02B6/006—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to produce indicia, symbols, texts or the like
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/036—Light emitting elements
- H01H2219/038—Light emitting elements ambient light dependent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/036—Light emitting elements
- H01H2219/039—Selective or different modes of illumination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/036—Light emitting elements
- H01H2219/04—Attachments; Connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/036—Light emitting elements
- H01H2219/044—Edge lighting of layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/06—Reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/062—Light conductor
Definitions
- the present invention relates to a keyboard backlight module and a manufacturing method thereof.
- the backlight module is disposed at the bottom of a key module of the illuminated keyboard.
- the backlight module includes structures such as a light-shading sheet, a light-guiding sheet, a reflective sheet and a light-emitting element.
- a generally used method is to dispose the light-emitting element at a side edge of the light-guiding sheet, and light is incident into the light-guiding sheet by the light-emitting element, so that the light incident into the light-guiding sheet is diffused in the light-guiding sheet through the light-guiding sheet and the reflective sheet, and the light diffused in the light-guiding sheet is merely emergent from the bottom of a key by using the light-shading sheet.
- a keyboard backlight module includes a light-guiding sheet, a circuit board, a light-emitting element, a reflective sheet and a release film.
- the circuit board is located on a surface of the light-guiding sheet.
- the light-emitting element is located between the circuit board and the light-guiding sheet, and disposed on the circuit board.
- the light-emitting element emits light into the light-guiding sheet.
- the reflective sheet is located on another surface of the light-guiding sheet opposite to the circuit board.
- the release film is located on the surface of the light-guiding sheet and the circuit board, and transfers a glue layer on the surface of the light-guiding sheet.
- the light-guiding sheet includes a plurality of illuminated patterns, and the keyboard backlight module adjusts the illumination uniformity of the light through the reflective sheet, the glue layer and the plurality of illuminated patterns.
- a keyboard backlight module manufacturing method includes: sequentially stacking and attaching a reflective sheet, a light-guiding sheet and a circuit board; forming a glue layer on a first surface of a release film; and attaching the first surface of the release film to a first surface of the light-guiding sheet, to transfer the glue layer on the surface of the light-guiding sheet.
- a light-emitting element is disposed on the circuit board, the light-emitting element is located between the circuit board and the light-guiding sheet, and the circuit board is attached to the first surface of the light-guiding sheet.
- the illumination uniformity of the light is adjusted through the reflective sheet, the glue layer and the illuminated patterns on the light-guiding sheet according to the keyboard backlight module and the manufacturing method thereof of the present invention.
- the keyboard backlight module may achieve light uniformity without a light-shading sheet and may be further thinned (namely, relatively reduces an entire thickness of the keyboard backlight module), and costs may be relatively reduced.
- FIG. 1 is a schematic exploded diagram of a keyboard backlight module according to an embodiment.
- FIG. 2 is a combination diagram of the keyboard backlight module in FIG. 1 .
- FIG. 3 is a schematic diagram of a circuit board in FIG. 1 .
- FIG. 4 is a schematic diagram of a first example of an illuminated pattern.
- FIG. 5 is a schematic diagram of a second example of an illuminated pattern.
- FIG. 6 is a schematic diagram of a third example of an illuminated pattern.
- FIG. 7 is a schematic diagram of a fourth example of an illuminated pattern.
- FIG. 8 is a schematic diagram of a fifth example of an illuminated pattern.
- FIG. 9 is a schematic sectional diagram of the keyboard backlight module along a section line I-I in FIG. 1 .
- FIG. 10 is a flowchart of a keyboard backlight module manufacturing method according to an embodiment.
- FIG. 11 is a schematic exploded diagram of an illuminated keyboard according to an embodiment.
- FIG. 12 is a schematic sectional diagram of the illuminated keyboard along a section line II-II in FIG. 11 .
- a keyboard backlight module 10 includes a light-guiding sheet 110 , a circuit board 120 , a light-emitting element 130 , a reflective sheet 140 and a release film 150 .
- the circuit board 120 is located on a surface of the light-guiding sheet 110 .
- the reflective sheet 140 is located on another surface of the light-guiding sheet 110 opposite to the circuit board 120 .
- the light-guiding sheet 110 includes a first surface 110 a and a second surface 110 b opposite to each other.
- the circuit board 120 is attached to the first surface 110 a of the light-guiding sheet 110 .
- the reflective sheet 140 is attached to the second surface 110 b of the light-guiding sheet 110 .
- the light-emitting element 130 is disposed on the circuit board 120 .
- the circuit board 120 includes two surfaces 120 a and 120 b opposite to each other.
- the light-emitting element 130 is located on the surface 120 a of the circuit board 120 , and is electrically coupled to a circuit (not shown) on the circuit board 120 .
- the surface 120 a of the circuit board 120 including the light-emitting element 130 faces the first surface 110 a of the light-guiding sheet 110 , and is attached to the first surface 110 a of the light-guiding sheet 110 .
- the circuit (not shown) on the circuit board 120 can drive the light-emitting element 130 , so that the light-emitting element 130 emits light into the light-guiding sheet 110 .
- the circuit board 120 can control an operation of the light-emitting element 130 .
- the release film 150 is located on the first surface 110 a of the light-guiding sheet 110 and the circuit board 120 .
- the release film 150 includes a first surface 150 a and a second surface 150 b opposite to each other.
- a glue layer 160 is correspondingly formed on the first surface 150 a of the release film 150 in advance, then the release film 150 covers the first surface 110 a of the light-guiding sheet 110 from a side of the light-guiding sheet 110 with the circuit board 120 , to transfer the glue layer 160 on the first surface 110 a of the light-guiding sheet 110 through the release film 150 .
- the glue layer 160 may be grid-like. It should be understood that, for clear drawing, in FIG.
- the light-guiding sheet 110 includes a plurality of illuminated patterns 114 (for example, patterns shown in FIG. 4 to FIG. 8 ).
- the keyboard backlight module 10 adjusts, through the reflective sheet 140 , the glue layer 160 and the illuminated patterns 114 , the illumination uniformity of the light emitted from the light-guiding sheet 110 .
- FIG. 8 In other words, referring to FIG.
- the light emitted by the light-emitting element 130 is incident into the light-guiding sheet 110 from a side direction of the light-guiding sheet 110 and is laterally transmitted inside the light-guiding sheet 110 ; and during the transmission, the amount of the light emitted from the first surface 110 a of the light-guiding sheet 110 is adjusted through the reflective sheet 140 , the glue layer 160 and the illuminated patterns 114 .
- the light-emitting element 130 disposed on the circuit board 120 is accommodated in the slot hole 180 of the light-guiding sheet 110 . Therefore, the light emitted by the light-emitting element 130 is incident into the light-guiding sheet 110 from a side wall of the slot hole 180 of the light-guiding sheet 110 , and is further laterally transmitted inside the light-guiding sheet 110 .
- each of the illuminated areas 112 a is an area in which the first surface 110 a of the light-guiding sheet 110 overlaps a corresponding key, for example, an area covered by a vertical projection of the corresponding key on the first surface 110 a of the light-guiding sheet 110 .
- the glue layer 160 is disposed along edges of the illuminated areas 112 a and 112 b. That is, the glue layer 160 includes a plurality of openings, and there is an illuminated area 112 a (or 112 b ) in each of the openings.
- the illuminated patterns 114 are respectively disposed in the illuminated areas 112 a and 112 b in the openings.
- the appearance and location of the circuit board 120 correspond to the plurality of illuminated areas 112 a and 112 b.
- a small part (not shown) of the plurality of illuminated areas of the light-guiding sheet 110 overlaps the circuit board 120 , and the remaining part (for example, the illuminated areas 112 a and 112 b ) separately corresponds to the openings of the glue layer 160 .
- the circuit board 120 may overlap a plurality of illuminated areas in the middle of the light-guiding sheet 110 .
- the glue layer 160 is transferred on the first surface 110 a of the light-guiding sheet 110 on two sides of the circuit board 120 , and is stuck to the first surface 110 a of the light-guiding sheet 110 along the edges of the illuminated areas 112 a (or 112 b ) on the two sides of the circuit board 120 .
- each of the illuminated patterns 114 may be a polygon, an entire appearance of the illuminated pattern 114 is a polygon, and each edge line of the illuminated patterns 114 is a saw-tooth wave (as shown in FIG. 4 ), a sine wave (as shown in FIG. 5 ), a square wave (as shown in FIG. 6 or FIG. 7 ) or any combination thereof.
- each of the illuminated patterns 114 is a polygon pattern formed by lines of continuous unit patterns 114 a.
- the illumination brightness of the corresponding illuminated area 112 a is adjusted by adjusting the density of the unit patterns 114 a of each edge line of the illuminated patterns 114 .
- the density of light energy is relatively low, and therefore the density of saw tooth of each edge line of the illuminated patterns 114 here is relatively high.
- the density of light energy is relatively high, and therefore the density of saw tooth of each edge line of the illuminated patterns 114 here is relatively low.
- the density of the unit patterns 114 a of each edge line may be adjusted by, for example, adjusting the width of each of the unit patterns 114 a, the amplitude of each of the unit patterns 114 a, and/or the total quantity of the unit patterns 114 a.
- the density of the unit patterns 114 a of each edge line may be adjusted by, for example, adjusting the pitch (that is, the width) of each of the saw tooth, the amplitude of each of the saw tooth, and/or the total quantity of the saw tooth.
- the density of the illuminated patterns 114 far away from the light-emitting element 130 is greater than the density of the illuminated patterns 114 close to the light-emitting element 130 .
- the unit patterns 114 a may be formed by a plurality of microstructures (for example, net points) concatenated with each other.
- each of the illuminated patterns 114 (that is, the entire appearance) may be, for example, an octagon, but is not limited thereto.
- each of the illuminated patterns 114 may be a polygon pattern formed by a plurality of discrete net points 114 b.
- the illumination brightness of the corresponding illuminated area 112 a (or 112 b ) is adjusted by adjusting the density of the net points 114 b of each of the illuminated patterns 114 (that is, the spacing between two neighboring net points 114 b and the total quantity of the net points 114 b ).
- the density of light energy is relatively low, and therefore the density of the net points 114 b of the illuminated patterns 114 here is relatively high.
- the density of light energy is relatively high, and therefore the density of the net points 114 b of the illuminated patterns 114 here is relatively low.
- the density of the illuminated patterns 114 far away from the light-emitting element 130 is greater than the density of the illuminated patterns 114 close to the light-emitting element 130 .
- the circuit board 120 includes a light-cutoff part 122 , and the light-cutoff part 122 is located around the light-emitting element 130 .
- the light-cutoff part 122 may be a black ink layer.
- the black ink layer (that is, the light-cutoff part 122 ) may cover an entire surface of a body 124 of the circuit board 120 , that is, the surface 120 a including the light-emitting element 130 .
- the black ink layer (that is, the light-cutoff part 122 ) may partially cover the surface of the body 124 of the circuit board 120 corresponding to the light-emitting element 130 , that is, be merely used to coat the partial surface 120 a (not shown) around the light-emitting element 130 .
- the reflective sheet 140 includes a light-cutoff part 142 , and the light-cutoff part 142 is disposed corresponding to a bright region of the light-guiding sheet 110 .
- the light-cutoff part 142 is located on a surface of a body 144 of the reflective sheet 140 and is disposed around the body 144 of the reflective sheet 140 .
- the light-cutoff part 142 may be a black ink layer.
- the black ink layer (that is, the light-cutoff part 142 ) may cover the surface of the body 144 of the reflective sheet 140 along an edge of the body 144 of the reflective sheet 140 .
- the black ink layer is in a frame shape with a central opening, and the frame-shaped black ink layer is disposed along a peripheral edge of the reflective sheet 140 .
- the keyboard backlight module 10 may further include a plurality of through holes 170 , and each of the through holes 170 penetrates through the light-guiding sheet 110 and the reflective sheet 140 .
- the black ink layer (that is, the light-cutoff part 142 ) may cover the surface of the body 144 of the reflective sheet 140 along the peripheral edge of the body 144 of the reflective sheet 140 and a peripheral edge of each of the through holes 170 .
- the foregoing keyboard backlight module 10 may be manufactured by the following steps. Referring to FIG. 10 , first, the reflective sheet 140 , the light-guiding sheet 110 and the circuit board 120 are sequentially stacked and attached from bottom to top (step S 11 ), to form a semi-finished product in which the reflective sheet 140 and the circuit board 120 are respectively attached to two opposite surfaces of the light-guiding sheet 110 (step S 12 ). In other words, the first surface 110 a of the light-guiding sheet 110 is attached to the circuit board 120 , and the second surface 110 b of the light-guiding sheet 110 is attached to the reflective sheet 140 .
- the light-emitting element 130 is first disposed on the circuit board 120 and is electrically coupled to the circuit on the circuit board 120 . Then, the surface 120 a of the circuit board 120 , where the light-emitting element 130 are disposed, faces the first surface 110 a of the light-guiding sheet 110 , and is attached to the first surface 110 a of the light-guiding sheet 110 . After attaching, the light-emitting element 130 is located between the circuit board 120 and the light-guiding sheet 110 .
- the release film 150 with the glue layer 160 is provided.
- the glue layer 160 is formed on a first surface 150 a of the release film 150 according to the configurations and sizes (that is, corresponding to the edges of the illuminated areas 112 a and 112 b of the light-guiding sheet 110 ) of keys of the keyboard module (step S 21 ), to form the release film 150 with the glue layer 160 (step S 22 ).
- the first surface 150 a of the release film 150 is adhered to the first surface 110 a of the light-guiding sheet 110 (step S 31 ), to form the keyboard backlight module 10 (step S 32 ).
- the release film 150 is adhered to the light-guiding sheet 110 by using the glue layer 160 .
- the adhesion of the glue layer 160 to the release film 150 is less than the adhesion to the light-guiding sheet 110 . Therefore, after the release film 150 is adhered to the light-guiding sheet 110 , the glue layer 160 may be transferred to the first surface 110 a of the light-guiding sheet 110 from the release film 150 .
- the glue layer 160 may be, for example, glue of model 3M7533.
- the release film 150 may be first removed from the keyboard backlight module 10 ; and after the release film 150 is removed, the glue layer 160 is not removed accordingly, but is still stuck to the light-guiding sheet 110 . Then, after the release film 150 is removed, the keyboard backlight module 10 is adhered to a base sheet 220 of the keyboard module 20 through the glue layer 160 transferred on the light-guiding sheet 110 , to form the illuminated keyboard, as shown in FIG. 11 .
- the keyboard module 20 includes a plurality of keys 210 .
- the keyboard backlight module 10 when the keyboard backlight module 10 is adhered to the keyboard module 20 , the keys 210 of the keyboard module 20 are separately aligned with the illuminated areas 112 of the light-guiding sheet 110 . After the adhesion, vertical projections of the keys 210 of the keyboard module 20 overlap the illuminated areas 112 of the light-guiding sheet 110 , as shown in FIG. 11 .
- the keyboard module 20 may further include a circuit board 240 , and the circuit board 240 is located between the keys 210 and the base sheet 220 . In this case, the circuit board 240 of the keyboard module 20 can sense touches on the keys 210 , and correspondingly generate touching signals of characters represented by the touched keys 210 .
- the keyboard backlight module 10 includes the through holes 170 penetrating through the light-guiding sheet 110 and the reflective sheet 140 .
- the keyboard backlight module 10 may be adhered to the keyboard module 20 steadily by filling the through holes 170 with fixing glue (for example, hot melt glue).
- the illuminated patterns 114 is formed on the first surface 110 a of the light-guiding sheet 110 through heat-pressing based on designed patterns. For example, by using a heat-pressing process or a heat-rolling process, structure graphics on a male die are transferred onto the first surface 110 a of the light-guiding sheet 110 through surface pressure contact to form each of the illuminated patterns 114 on the light-guiding sheet 110 .
- the designed patterns may be a polygon, for example, an octagon, but is not limited thereto. Each of edge lines of the polygonal designed patterns may be formed by the continuous unit patterns 114 a or the discrete net points 114 b.
- the designed patterns may be designed according to the characters represented by the keys 210 of the keyboard module 20 .
- the surface of the circuit board 120 around the light-emitting element 130 may be coated with black ink.
- the black ink may be merely used to coat a partial surface of the circuit board 120 around the light-emitting element 130 .
- the black ink may be used to coat the entire surface of the circuit board 120 where the light-emitting element 130 is disposed.
- a surface of the reflective sheet 140 that is attached to the light-guiding sheet 110 may be coated with the black ink corresponding to a bright region of the light-guiding sheet 110 .
- the black ink layer may be used to coat the edges of the reflective sheet 140 along an entire periphery of the reflective sheet 140 .
- the black ink layer may be used to coat the edges of the reflective sheet 140 along the entire periphery of the reflective sheet 140 , and/or coat the reflective sheet 140 on the edges of the through holes 170 along an entire periphery of the through holes 170 .
- the illumination uniformity of the light is adjusted through the reflective sheet 140 , the glue layer 160 and the illuminated patterns 114 on the light-guiding sheet 110 according to the keyboard backlight module and the manufacturing method thereof of the disclosure.
- the keyboard backlight module 10 may achieve light uniformity without a light-shading sheet and may be further thinned (namely, relatively reduces an entire thickness of the keyboard backlight module 10 ), and costs may be relatively reduced.
- the illuminated patterns 114 on the light-guiding sheet 110 are correspondingly designed according to the light energy transmitted to each part of the light-guiding sheet 110 , to further adjust the illumination uniformity, thereby providing a surface light source with more uniform entire brightness.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Push-Button Switches (AREA)
- Planar Illumination Modules (AREA)
Abstract
A keyboard backlight module includes a light-guiding sheet, a circuit board, a light-emitting element, a reflective sheet and a release film. The circuit board is located on a surface of the light-guiding sheet, and the reflective sheet is located on another surface of the light-guiding sheet opposite to the circuit board. The light-emitting element is located between the circuit board and the light-guiding sheet, and disposed on the circuit board. The light-emitting element emits light into the light-guiding sheet. The release film is located on the light-guiding sheet and the circuit board, and transfers a glue layer on the surface of the light-guiding sheet. The light-guiding sheet includes a plurality of illuminated patterns, and the keyboard backlight module adjusts the illumination uniformity of the light through the reflective sheet, the glue layer and the plurality of illuminated patterns.
Description
- This non-provisional application claims priority under 35 U.S.C. § 119(a) to Patent Application No. 108134963 filed in Taiwan, R.O.C. on Sep. 26, 2019, the entire contents of which are hereby incorporated by reference.
- The present invention relates to a keyboard backlight module and a manufacturing method thereof.
- With fast development of the electronic technology and the information industry, electronic devices such as computers, notebooks and smart phones have become indispensable tools in life and work of modern people. In addition, the electronic devices are mostly controlled through input devices such as mouse and/or keyboard. The usage of the keyboard is the most convenient.
- For convenience of using the keyboards in a dark environment or providing a special usage requirement (for example, an appearance), technicians import a light source technology in the keyboards, so that an illuminated keyboard with a backlight module is developed. The backlight module is disposed at the bottom of a key module of the illuminated keyboard. The backlight module includes structures such as a light-shading sheet, a light-guiding sheet, a reflective sheet and a light-emitting element. To enable a light source to be evenly distributed, a generally used method is to dispose the light-emitting element at a side edge of the light-guiding sheet, and light is incident into the light-guiding sheet by the light-emitting element, so that the light incident into the light-guiding sheet is diffused in the light-guiding sheet through the light-guiding sheet and the reflective sheet, and the light diffused in the light-guiding sheet is merely emergent from the bottom of a key by using the light-shading sheet.
- However, as thinness is required, how to further reduce an entire thickness of the backlight module is one of research objectives of the technicians. In addition, as distances between keys and the light source are different, the brightness of light emitted by the keys is also different, resulting in poor overall light-emitting uniformity of the keyboard, which affects a visual effect.
- In an embodiment, a keyboard backlight module includes a light-guiding sheet, a circuit board, a light-emitting element, a reflective sheet and a release film. The circuit board is located on a surface of the light-guiding sheet. The light-emitting element is located between the circuit board and the light-guiding sheet, and disposed on the circuit board. The light-emitting element emits light into the light-guiding sheet. The reflective sheet is located on another surface of the light-guiding sheet opposite to the circuit board. The release film is located on the surface of the light-guiding sheet and the circuit board, and transfers a glue layer on the surface of the light-guiding sheet. The light-guiding sheet includes a plurality of illuminated patterns, and the keyboard backlight module adjusts the illumination uniformity of the light through the reflective sheet, the glue layer and the plurality of illuminated patterns.
- In an embodiment, a keyboard backlight module manufacturing method includes: sequentially stacking and attaching a reflective sheet, a light-guiding sheet and a circuit board; forming a glue layer on a first surface of a release film; and attaching the first surface of the release film to a first surface of the light-guiding sheet, to transfer the glue layer on the surface of the light-guiding sheet. A light-emitting element is disposed on the circuit board, the light-emitting element is located between the circuit board and the light-guiding sheet, and the circuit board is attached to the first surface of the light-guiding sheet.
- In conclusion, the illumination uniformity of the light is adjusted through the reflective sheet, the glue layer and the illuminated patterns on the light-guiding sheet according to the keyboard backlight module and the manufacturing method thereof of the present invention. In some embodiments, the keyboard backlight module may achieve light uniformity without a light-shading sheet and may be further thinned (namely, relatively reduces an entire thickness of the keyboard backlight module), and costs may be relatively reduced.
-
FIG. 1 is a schematic exploded diagram of a keyboard backlight module according to an embodiment. -
FIG. 2 is a combination diagram of the keyboard backlight module inFIG. 1 . -
FIG. 3 is a schematic diagram of a circuit board inFIG. 1 . -
FIG. 4 is a schematic diagram of a first example of an illuminated pattern. -
FIG. 5 is a schematic diagram of a second example of an illuminated pattern. -
FIG. 6 is a schematic diagram of a third example of an illuminated pattern. -
FIG. 7 is a schematic diagram of a fourth example of an illuminated pattern. -
FIG. 8 is a schematic diagram of a fifth example of an illuminated pattern. -
FIG. 9 is a schematic sectional diagram of the keyboard backlight module along a section line I-I inFIG. 1 . -
FIG. 10 is a flowchart of a keyboard backlight module manufacturing method according to an embodiment. -
FIG. 11 is a schematic exploded diagram of an illuminated keyboard according to an embodiment. -
FIG. 12 is a schematic sectional diagram of the illuminated keyboard along a section line II-II inFIG. 11 . - Referring to
FIG. 1 andFIG. 2 , akeyboard backlight module 10 includes a light-guidingsheet 110, acircuit board 120, a light-emitting element 130, areflective sheet 140 and arelease film 150. - The
circuit board 120 is located on a surface of the light-guidingsheet 110. Thereflective sheet 140 is located on another surface of the light-guidingsheet 110 opposite to thecircuit board 120. In other words, the light-guidingsheet 110 includes afirst surface 110 a and asecond surface 110 b opposite to each other. Thecircuit board 120 is attached to thefirst surface 110 a of the light-guidingsheet 110. Thereflective sheet 140 is attached to thesecond surface 110 b of the light-guidingsheet 110. - Referring to
FIG. 1 toFIG. 3 , the light-emittingelement 130 is disposed on thecircuit board 120. After thecircuit board 120 is attached to the light-guidingsheet 110, the light-emittingelement 130 is located between thecircuit board 120 and the light-guidingsheet 110. In other words, thecircuit board 120 includes twosurfaces element 130 is located on thesurface 120 a of thecircuit board 120, and is electrically coupled to a circuit (not shown) on thecircuit board 120. Thesurface 120 a of thecircuit board 120 including the light-emittingelement 130 faces thefirst surface 110 a of the light-guidingsheet 110, and is attached to thefirst surface 110 a of the light-guidingsheet 110. During usage of thekeyboard backlight module 10, the circuit (not shown) on thecircuit board 120 can drive the light-emitting element 130, so that the light-emittingelement 130 emits light into the light-guidingsheet 110. In other words, thecircuit board 120 can control an operation of the light-emittingelement 130. - The
release film 150 is located on thefirst surface 110 a of the light-guidingsheet 110 and thecircuit board 120. In this case, therelease film 150 includes afirst surface 150 a and asecond surface 150 b opposite to each other. Aglue layer 160 is correspondingly formed on thefirst surface 150 a of therelease film 150 in advance, then therelease film 150 covers thefirst surface 110 a of the light-guidingsheet 110 from a side of the light-guidingsheet 110 with thecircuit board 120, to transfer theglue layer 160 on thefirst surface 110 a of the light-guidingsheet 110 through therelease film 150. In some embodiments, theglue layer 160 may be grid-like. It should be understood that, for clear drawing, inFIG. 1 , though theglue layer 160 is located below therelease film 150, because therelease film 150 is transparent, theglue layer 160 is still drawn with solid lines. Similarly, for clear drawing, inFIG. 2 , because therelease film 150 and the light-guidingsheet 110 are transparent and theglue layer 160 is transparent or translucent, components located below, for example, theglue layer 160, thecircuit board 120 and thereflective sheet 140 are still drawn with solid lines. - The light-guiding
sheet 110 includes a plurality of illuminated patterns 114 (for example, patterns shown inFIG. 4 toFIG. 8 ). In this case, thekeyboard backlight module 10 adjusts, through thereflective sheet 140, theglue layer 160 and theilluminated patterns 114, the illumination uniformity of the light emitted from the light-guidingsheet 110. In other words, referring toFIG. 9 , the light emitted by the light-emittingelement 130 is incident into the light-guidingsheet 110 from a side direction of the light-guidingsheet 110 and is laterally transmitted inside the light-guidingsheet 110; and during the transmission, the amount of the light emitted from thefirst surface 110 a of the light-guidingsheet 110 is adjusted through thereflective sheet 140, theglue layer 160 and theilluminated patterns 114. - In some embodiments, there is a
slot hole 180 at a location on the light-guidingsheet 110 corresponding to the light-emittingelement 130. After thecircuit board 120 is attached to the light-guidingsheet 110, the light-emitting element 130 disposed on thecircuit board 120 is accommodated in theslot hole 180 of the light-guidingsheet 110. Therefore, the light emitted by the light-emittingelement 130 is incident into the light-guidingsheet 110 from a side wall of theslot hole 180 of the light-guidingsheet 110, and is further laterally transmitted inside the light-guidingsheet 110. - In some embodiments, there is a plurality of
illuminated areas first surface 110 a of the light-guidingsheet 110 that correspond to keys. Theilluminated areas first surface 110 a of the light-guidingsheet 110 corresponding to configurations and sizes of the keys of a keyboard module (not shown). In other words, after thekeyboard backlight module 10 and the keyboard module are assembled, each of the illuminatedareas 112 a (or 112 b) is an area in which thefirst surface 110 a of the light-guidingsheet 110 overlaps a corresponding key, for example, an area covered by a vertical projection of the corresponding key on thefirst surface 110 a of the light-guidingsheet 110. In some embodiments, theglue layer 160 is disposed along edges of the illuminatedareas glue layer 160 includes a plurality of openings, and there is an illuminatedarea 112 a (or 112 b) in each of the openings. Theilluminated patterns 114 are respectively disposed in the illuminatedareas circuit board 120 correspond to the plurality ofilluminated areas sheet 110 overlaps thecircuit board 120, and the remaining part (for example, theilluminated areas glue layer 160. In an embodiment, thecircuit board 120 may overlap a plurality of illuminated areas in the middle of the light-guidingsheet 110. Theglue layer 160 is transferred on thefirst surface 110 a of the light-guidingsheet 110 on two sides of thecircuit board 120, and is stuck to thefirst surface 110 a of the light-guidingsheet 110 along the edges of the illuminatedareas 112 a (or 112 b) on the two sides of thecircuit board 120. - In some embodiments, each of the illuminated patterns 114 (that is, an entire appearance) may be a polygon, an entire appearance of the
illuminated pattern 114 is a polygon, and each edge line of the illuminatedpatterns 114 is a saw-tooth wave (as shown inFIG. 4 ), a sine wave (as shown inFIG. 5 ), a square wave (as shown inFIG. 6 orFIG. 7 ) or any combination thereof. In other words, each of the illuminatedpatterns 114 is a polygon pattern formed by lines ofcontinuous unit patterns 114 a. In this case, the illumination brightness of the correspondingilluminated area 112 a (or 112 b) is adjusted by adjusting the density of theunit patterns 114 a of each edge line of the illuminatedpatterns 114. For example, at a distal end (that is, the illuminatedarea 112 b far away from the light-emitting element 130) on the light-guidingsheet 110 relative to a light source, the density of light energy is relatively low, and therefore the density of saw tooth of each edge line of the illuminatedpatterns 114 here is relatively high. - Correspondingly, at a proximal end (that is, the illuminated
area 112 a close to the light-emitting element 130) on the light-guidingsheet 110 relative to the light source, the density of light energy is relatively high, and therefore the density of saw tooth of each edge line of the illuminatedpatterns 114 here is relatively low. The density of theunit patterns 114 a of each edge line may be adjusted by, for example, adjusting the width of each of theunit patterns 114 a, the amplitude of each of theunit patterns 114 a, and/or the total quantity of theunit patterns 114 a. For example, taking the saw-tooth wave as an example, the density of theunit patterns 114 a of each edge line may be adjusted by, for example, adjusting the pitch (that is, the width) of each of the saw tooth, the amplitude of each of the saw tooth, and/or the total quantity of the saw tooth. In other words, the density of the illuminatedpatterns 114 far away from the light-emittingelement 130 is greater than the density of the illuminatedpatterns 114 close to the light-emittingelement 130. In some embodiments, theunit patterns 114 a may be formed by a plurality of microstructures (for example, net points) concatenated with each other. In some embodiments, each of the illuminated patterns 114 (that is, the entire appearance) may be, for example, an octagon, but is not limited thereto. - In some embodiments, each of the illuminated
patterns 114 may be a polygon pattern formed by a plurality of discretenet points 114 b. In this case, the illumination brightness of the correspondingilluminated area 112 a (or 112 b) is adjusted by adjusting the density of thenet points 114 b of each of the illuminated patterns 114 (that is, the spacing between two neighboringnet points 114 b and the total quantity of thenet points 114 b). For example, at a distal end (that is, the illuminatedarea 112 b far away from the light-emitting element 130) on the light-guidingsheet 110 relative to the light source, the density of light energy is relatively low, and therefore the density of thenet points 114 b of the illuminatedpatterns 114 here is relatively high. Correspondingly, at a proximal end (that is, the illuminatedarea 112 a close to the light-emitting element 130) on the light-guidingsheet 110 relative to the light source, the density of light energy is relatively high, and therefore the density of thenet points 114 b of the illuminatedpatterns 114 here is relatively low. In other words, the density of the illuminatedpatterns 114 far away from the light-emittingelement 130 is greater than the density of the illuminatedpatterns 114 close to the light-emittingelement 130. - In some embodiments, the
circuit board 120 includes a light-cutoff part 122, and the light-cutoff part 122 is located around the light-emittingelement 130. In some embodiments, the light-cutoff part 122 may be a black ink layer. In an embodiment, the black ink layer (that is, the light-cutoff part 122) may cover an entire surface of abody 124 of thecircuit board 120, that is, thesurface 120 a including the light-emittingelement 130. In another embodiment, the black ink layer (that is, the light-cutoff part 122) may partially cover the surface of thebody 124 of thecircuit board 120 corresponding to the light-emittingelement 130, that is, be merely used to coat thepartial surface 120 a (not shown) around the light-emittingelement 130. - In some embodiments, the
reflective sheet 140 includes a light-cutoff part 142, and the light-cutoff part 142 is disposed corresponding to a bright region of the light-guidingsheet 110. In some embodiments, the light-cutoff part 142 is located on a surface of abody 144 of thereflective sheet 140 and is disposed around thebody 144 of thereflective sheet 140. In some embodiments, the light-cutoff part 142 may be a black ink layer. In an embodiment, the black ink layer (that is, the light-cutoff part 142) may cover the surface of thebody 144 of thereflective sheet 140 along an edge of thebody 144 of thereflective sheet 140. For example, the black ink layer is in a frame shape with a central opening, and the frame-shaped black ink layer is disposed along a peripheral edge of thereflective sheet 140. In some embodiments, thekeyboard backlight module 10 may further include a plurality of throughholes 170, and each of the throughholes 170 penetrates through the light-guidingsheet 110 and thereflective sheet 140. In this case, the black ink layer (that is, the light-cutoff part 142) may cover the surface of thebody 144 of thereflective sheet 140 along the peripheral edge of thebody 144 of thereflective sheet 140 and a peripheral edge of each of the throughholes 170. - In some embodiments, the foregoing
keyboard backlight module 10 may be manufactured by the following steps. Referring toFIG. 10 , first, thereflective sheet 140, the light-guidingsheet 110 and thecircuit board 120 are sequentially stacked and attached from bottom to top (step S11), to form a semi-finished product in which thereflective sheet 140 and thecircuit board 120 are respectively attached to two opposite surfaces of the light-guiding sheet 110 (step S12). In other words, thefirst surface 110 a of the light-guidingsheet 110 is attached to thecircuit board 120, and thesecond surface 110 b of the light-guidingsheet 110 is attached to thereflective sheet 140. Before the light-guidingsheet 110 and thecircuit board 120 are attached to each other, the light-emittingelement 130 is first disposed on thecircuit board 120 and is electrically coupled to the circuit on thecircuit board 120. Then, thesurface 120 a of thecircuit board 120, where the light-emittingelement 130 are disposed, faces thefirst surface 110 a of the light-guidingsheet 110, and is attached to thefirst surface 110 a of the light-guidingsheet 110. After attaching, the light-emittingelement 130 is located between thecircuit board 120 and the light-guidingsheet 110. - In addition, the
release film 150 with theglue layer 160 is provided. In some embodiments, theglue layer 160 is formed on afirst surface 150 a of therelease film 150 according to the configurations and sizes (that is, corresponding to the edges of the illuminatedareas release film 150 with the glue layer 160 (step S22). - Then, the
first surface 150 a of therelease film 150 is adhered to thefirst surface 110 a of the light-guiding sheet 110 (step S31), to form the keyboard backlight module 10 (step S32). In this case, therelease film 150 is adhered to the light-guidingsheet 110 by using theglue layer 160. The adhesion of theglue layer 160 to therelease film 150 is less than the adhesion to the light-guidingsheet 110. Therefore, after therelease film 150 is adhered to the light-guidingsheet 110, theglue layer 160 may be transferred to thefirst surface 110 a of the light-guidingsheet 110 from therelease film 150. In some embodiments, theglue layer 160 may be, for example, glue of model 3M7533. - In some embodiments, when an illuminated keyboard is assembled, the
release film 150 may be first removed from thekeyboard backlight module 10; and after therelease film 150 is removed, theglue layer 160 is not removed accordingly, but is still stuck to the light-guidingsheet 110. Then, after therelease film 150 is removed, thekeyboard backlight module 10 is adhered to abase sheet 220 of thekeyboard module 20 through theglue layer 160 transferred on the light-guidingsheet 110, to form the illuminated keyboard, as shown inFIG. 11 . In some embodiments, referring toFIG. 11 andFIG. 12 , thekeyboard module 20 includes a plurality ofkeys 210. In some embodiments, when thekeyboard backlight module 10 is adhered to thekeyboard module 20, thekeys 210 of thekeyboard module 20 are separately aligned with theilluminated areas 112 of the light-guidingsheet 110. After the adhesion, vertical projections of thekeys 210 of thekeyboard module 20 overlap theilluminated areas 112 of the light-guidingsheet 110, as shown inFIG. 11 . In some embodiments, thekeyboard module 20 may further include acircuit board 240, and thecircuit board 240 is located between thekeys 210 and thebase sheet 220. In this case, thecircuit board 240 of thekeyboard module 20 can sense touches on thekeys 210, and correspondingly generate touching signals of characters represented by the touchedkeys 210. - In some embodiments, the
keyboard backlight module 10 includes the throughholes 170 penetrating through the light-guidingsheet 110 and thereflective sheet 140. When the illuminated keyboard is assembled, after thekeyboard backlight module 10 is adhered to thekeyboard module 20, thekeyboard backlight module 10 may be adhered to thekeyboard module 20 steadily by filling the throughholes 170 with fixing glue (for example, hot melt glue). - In some embodiments, before the step S11, the illuminated
patterns 114 is formed on thefirst surface 110 a of the light-guidingsheet 110 through heat-pressing based on designed patterns. For example, by using a heat-pressing process or a heat-rolling process, structure graphics on a male die are transferred onto thefirst surface 110 a of the light-guidingsheet 110 through surface pressure contact to form each of the illuminatedpatterns 114 on the light-guidingsheet 110. In some embodiments, the designed patterns may be a polygon, for example, an octagon, but is not limited thereto. Each of edge lines of the polygonal designed patterns may be formed by thecontinuous unit patterns 114 a or the discretenet points 114 b. In some embodiments, the designed patterns may be designed according to the characters represented by thekeys 210 of thekeyboard module 20. - In some embodiments, before the step S11, the surface of the
circuit board 120 around the light-emittingelement 130 may be coated with black ink. In an example, the black ink may be merely used to coat a partial surface of thecircuit board 120 around the light-emittingelement 130. In another example, the black ink may be used to coat the entire surface of thecircuit board 120 where the light-emittingelement 130 is disposed. - In some embodiments, before the step S11, a surface of the
reflective sheet 140 that is attached to the light-guidingsheet 110 may be coated with the black ink corresponding to a bright region of the light-guidingsheet 110. In an example, the black ink layer may be used to coat the edges of thereflective sheet 140 along an entire periphery of thereflective sheet 140. In another example, the black ink layer may be used to coat the edges of thereflective sheet 140 along the entire periphery of thereflective sheet 140, and/or coat thereflective sheet 140 on the edges of the throughholes 170 along an entire periphery of the throughholes 170. - In conclusion, the illumination uniformity of the light is adjusted through the
reflective sheet 140, theglue layer 160 and theilluminated patterns 114 on the light-guidingsheet 110 according to the keyboard backlight module and the manufacturing method thereof of the disclosure. In some embodiments, thekeyboard backlight module 10 may achieve light uniformity without a light-shading sheet and may be further thinned (namely, relatively reduces an entire thickness of the keyboard backlight module 10), and costs may be relatively reduced. In some embodiments, there is a light-cutoff part (122 and/or 142) properly disposed in thekeyboard backlight module 10, to adjust the illumination brightness, thereby reducing the illumination brightness at an illuminated location of the corresponding light-cutoff part (122 and/or 142). In some embodiments, in thekeyboard backlight module 10, the illuminatedpatterns 114 on the light-guidingsheet 110 are correspondingly designed according to the light energy transmitted to each part of the light-guidingsheet 110, to further adjust the illumination uniformity, thereby providing a surface light source with more uniform entire brightness.
Claims (15)
1. A keyboard backlight module, comprising:
a light-guiding sheet;
a circuit board, located on a surface of the light-guiding sheet;
a light-emitting element, located between the circuit board and the light-guiding sheet, disposed on the circuit board, and configured to emit light into the light-guiding sheet;
a reflective sheet, located on another surface of the light-guiding sheet opposite to the circuit board;
a glue layer, located directly on the surface of the light-guiding sheet and
a release film, removably located on the glue layer;
wherein when the release film is removed from the glue layer, the glue layer is fully transferred from the release film to the surface of the light-guiding sheet; and
wherein the light-guiding sheet comprises a plurality of illuminated patterns, and the keyboard backlight module adjusts illumination uniformity of the light through the reflective sheet, the glue layer and the plurality of illuminated patterns.
2. The keyboard backlight module according to claim 1 , wherein the circuit board comprises a light-cutoff part, located around the light-emitting element.
3. The keyboard backlight module according to claim 2 , wherein the light-cutoff part is a black ink layer.
4. The keyboard backlight module according to claim 1 , wherein the reflective sheet comprises a light-cutoff part, disposed corresponding to a bright region of the light-guiding sheet.
5. The keyboard backlight module according to claim 4 , wherein the light-cutoff part is a black ink layer.
6. The keyboard backlight module according to claim 1 , wherein in the plurality of illuminated patterns, density of illuminated patterns far away from the light-emitting element is greater than density of illuminated patterns close to the light-emitting element.
7. The keyboard backlight module according to claim 6 , wherein each of the plurality of illuminated patterns is a polygon.
8. A keyboard backlight module manufacturing method, comprising:
sequentially stacking and attaching a reflective sheet, a light-guiding sheet and a circuit board, wherein the circuit board is attached to the first surface of the light-guiding sheet, a light-emitting element is disposed on the circuit board, and the light-emitting element is located between the circuit board and the light-guiding sheet;
forming a glue layer on a first surface of a release film; and
attaching the first surface of the release film to a first surface of the light-guiding sheet by using the glue layer, wherein after the attaching step, the glue layer is directly located on the first surface of the light-guiding sheet, and the circuit board is located between and the release film, and wherein when the release film is removed from the glue layer, the glue layer is fully transferred from the release film to the light-guiding sheet.
9. The keyboard backlight module manufacturing method according to claim 8 , further comprising:
forming a plurality of illuminated patterns on the first surface of the light-guiding sheet through heat-pressing before the step of sequentially stacking and attaching the reflective sheet, the light-guiding sheet and the circuit board.
10. The keyboard backlight module manufacturing method according to claim 8 , further comprising:
coating a surface of the circuit board around the light-emitting element with black ink before the step of sequentially stacking and attaching the reflective sheet, the light-guiding sheet and the circuit board.
11. The keyboard backlight module manufacturing method according to claim 8 , further comprising:
coating a surface of the reflective sheet attached to the light-guiding sheet with black ink corresponding to a bright region of the light-guiding sheet before the step of sequentially stacking and attaching the reflective sheet, the light-guiding sheet and the circuit board.
12. A keyboard backlight module, comprising:
a light-guiding sheet, comprising a plurality of illuminated areas;
a circuit board, located on a part of a first surface of the light-guiding sheet;
a light-emitting element, located between the circuit board and the light-guiding sheet, disposed on the circuit board, and configured to emit light into the light-guiding sheet;
a reflective sheet, located on another surface of the light-guiding sheet opposite to the circuit board; and
a glue layer, located directly on another part of the first surface of the light-guiding sheet, wherein the glue layer is disposed along edge of at least one of the plurality of illuminated areas.
13. The keyboard backlight module according to claim 12 , wherein the glue layer includes a plurality of openings, and any one of the plurality of illuminated areas is located in one of the plurality of openings.
14. The keyboard backlight module according to claim 13 , wherein any one of the plurality of openings only accommodates one of the plurality of illuminated areas.
15. The keyboard backlight module according to claim 12 , wherein the plurality of illuminated areas are separated by the glue layer.
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TW108134963A TWI689959B (en) | 2019-09-26 | 2019-09-26 | Keyboard backlight module and manufacturing method thereof |
TW108134963 | 2019-09-26 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI743913B (en) * | 2020-07-30 | 2021-10-21 | 群光電子股份有限公司 | Illuminated keyboard |
TWI816230B (en) * | 2021-08-20 | 2023-09-21 | 群光電子股份有限公司 | Keyboard and backlight module |
TWI787084B (en) | 2022-02-16 | 2022-12-11 | 群光電能科技股份有限公司 | Backlight module |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI247142B (en) | 2002-11-20 | 2006-01-11 | Hon Hai Prec Ind Co Ltd | Light guide plate used for backlight module |
TWI324278B (en) | 2006-12-06 | 2010-05-01 | Au Optronics Corp | Backlight module |
CN101634726B (en) | 2008-07-21 | 2012-06-13 | 鸿富锦精密工业(深圳)有限公司 | Light panel and manufacturing method as well as backlight module adopting same |
US8057056B2 (en) | 2008-08-09 | 2011-11-15 | Tsinghua University | Light guide plates and backlight module |
TWI399776B (en) * | 2010-01-08 | 2013-06-21 | Zippy Tech Corp | Thin light-emitting keyboard |
TWI423287B (en) * | 2010-07-16 | 2014-01-11 | Primax Electronics Ltd | Force sensing and backlight keyboard |
TW201211637A (en) | 2010-09-14 | 2012-03-16 | Sun Toward Tech Entpr Co Ltd | Reflective sheet and backlight module using the same |
TW201248222A (en) | 2011-05-16 | 2012-12-01 | Ichia Tech Inc | Light guide plate structure |
TW201318017A (en) | 2011-10-19 | 2013-05-01 | Dengis Technology Corp | Slim uniformly luminous illumination keyboard |
TWI523060B (en) * | 2013-06-17 | 2016-02-21 | 致伸科技股份有限公司 | Luminous keyboard device |
TW201500815A (en) * | 2013-06-17 | 2015-01-01 | Primax Electronics Ltd | Backlight module |
TWI501276B (en) * | 2013-10-18 | 2015-09-21 | Primax Electronics Ltd | Luminous keyboard device |
CN204084009U (en) | 2014-08-26 | 2015-01-07 | 精元电脑股份有限公司 | Backlight module and illuminated keyboard |
CN204178989U (en) | 2014-10-14 | 2015-02-25 | 群光电能科技股份有限公司 | Ray structure around keyboard back light module |
CN204348576U (en) | 2015-01-07 | 2015-05-20 | 昆山鑫正源金属制品有限公司 | A kind of shading condensing film structure for optical keyboard |
TWI607475B (en) * | 2015-06-05 | 2017-12-01 | 達方電子股份有限公司 | Backlight module and lighting keyboard using the same |
TWI587340B (en) | 2015-06-25 | 2017-06-11 | 群光電能科技股份有限公司 | Anti - side leakage structure of keyboard backlight module |
TWI556280B (en) * | 2015-07-03 | 2016-11-01 | 致伸科技股份有限公司 | Luminous keyboard |
US10571624B2 (en) * | 2015-08-28 | 2020-02-25 | Microsoft Technology Licensing, Llc | Laminated input devices |
TWI592707B (en) | 2015-09-18 | 2017-07-21 | 達方電子股份有限公司 | Backlight module |
TWI604492B (en) * | 2016-11-28 | 2017-11-01 | 群光電能科技股份有限公司 | Back light module and luminous keyboard applied to a luminous keyboard |
CN206421125U (en) | 2017-01-19 | 2017-08-18 | 信利半导体有限公司 | The anti-dazzling screen and backlight of a kind of backlight |
CN206876921U (en) | 2017-05-31 | 2018-01-12 | 深圳市汇创达科技股份有限公司 | A kind of integrated guide optical mode group counterdie and guide-lighting module |
TWI652710B (en) | 2017-11-08 | 2019-03-01 | 群光電子股份有限公司 | Backlight module for keyboard |
TWI652711B (en) | 2018-01-09 | 2019-03-01 | 達方電子股份有限公司 | Luminous keyboard and backlight module thereof |
TWI636267B (en) | 2018-02-12 | 2018-09-21 | 友達光電股份有限公司 | Method of testing light emitting diode |
-
2019
- 2019-09-26 TW TW108134963A patent/TWI689959B/en active
- 2019-10-17 CN CN201910990548.8A patent/CN112563060A/en active Pending
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US10948651B1 (en) | 2021-03-16 |
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TW202113892A (en) | 2021-04-01 |
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