US20210028237A1 - Color film substrate and preparation method therefor, and display panel and display device - Google Patents
Color film substrate and preparation method therefor, and display panel and display device Download PDFInfo
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- US20210028237A1 US20210028237A1 US16/617,015 US201916617015A US2021028237A1 US 20210028237 A1 US20210028237 A1 US 20210028237A1 US 201916617015 A US201916617015 A US 201916617015A US 2021028237 A1 US2021028237 A1 US 2021028237A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
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- H01L27/322—
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- H01L51/5228—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
Definitions
- the present disclosure relates to the technical field of display, particularly relates to a color film substrate and a fabrication method thereof, a display panel and a display device.
- AMOLED active-matrix organic light-emitting diode
- the auxiliary cathode is generally provided on a color film substrate, and the technological difficulty of preparing the auxiliary cathode on the color film substrate is quite large.
- the main difficulty is that the production conditions of the auxiliary cathode are limited to other structures on the color film substrate, and have great impact on the performance of other film layers. Therefore, the fabrication of the auxiliary cathode is a difficult problem to be solved urgently.
- the present disclosure provides a color film substrate and a fabrication method thereof, a display panel and a display device to reduce the technological difficulty of preparing an auxiliary cathode layer, to ensure good performance of each film layer of the color film substrate, and to simplify the whole fabrication process of the color film substrate.
- the present disclosure provides the following technical solution.
- the present disclosure provides a color film substrate electroluminescent diode, including: a base substrate; an auxiliary cathode layer arranged on the base substrate and configured to couple to a cathode of the electroluminescent diode; a black matrix layer arranged on the auxiliary cathode layer, and the black matrix layer including a plurality of first via holes penetrating through the black matrix layer in a direction perpendicular to the base substrate to expose the auxiliary cathode layer; a flat layer arranged on the black matrix layer, and the flat layer including a plurality of second via holes corresponding to the first via holes one by one to expose the auxiliary cathode layer; a plurality of spacers arranged at intervals on the flat layer, where the spacers are at positions other than the first via holes in the black matrix layer; and a transparent conductive layer arranged on the spacers, wherein the transparent conductive layer is connected with the auxiliary cathode layer through the first via holes and the second via holes.
- the color film substrate also includes a color film layer arranged on the same layer as the black matrix layer.
- the auxiliary cathode layer includes a graphic identification for alignment and an auxiliary cathode grid routing, and the auxiliary cathode grid routing corresponds to the black matrix layer and is connected with the transparent conductive layer through the first via holes and the second via holes.
- the first via holes correspond to the intersections in the auxiliary cathode grid routing.
- an orthographic projection of the graphic identification on the base substrate is located on a corner of the base substrate.
- the present disclosure also provides a display panel, including any color film substrate provided in the above technical solution.
- the present disclosure also provides a display device, including any display panel provided in the above technical solution.
- the present disclosure also provides a method of fabricating a color film substrate in electroluminescent diode.
- the method includes: depositing metal on the base substrate to form a metal layer, and patterning the metal layer to form an auxiliary cathode layer configured to couple to a cathode of the electroluminescent diode; forming a black matrix layer on the auxiliary cathode layer and a plurality of first via holes in the black matrix layer penetrating through the black matrix layer in a direction perpendicular to the base substrate to expose the auxiliary cathode layer; forming a flat layer on the black matrix layer and a plurality of second via holes in the flat layer corresponding to the first via holes one by one to expose the auxiliary cathode layer; forming a plurality of spacers at intervals on the flat layer, where the spacers are at positions other than the first via holes in the black matrix layer; and forming a transparent conductive layer on the spacers, where the transparent conductive layer is connected with the auxiliary ca
- the method further includes: forming a color film layer on the same layer as the black matrix layer.
- the auxiliary cathode layer includes a graphic identification for alignment and an auxiliary cathode grid routing.
- the auxiliary cathode grid routing corresponds to the black matrix layer and is connected with the transparent conductive layer through the first via holes and the second via holes.
- FIGS. 1-5 are schematic diagrams of changes in a local film layer in the fabrication process of a color film substrate provided in embodiments of the present disclosure.
- FIG. 6 is a schematic diagram of the structure of a local film layer of a color film substrate provided in embodiments of the present disclosure.
- FIG. 7 is a top view of the structure of a color film substrate provided in embodiments of the present disclosure.
- FIG. 8 is a top view of a local structure of a black matrix layer and an auxiliary cathode layer of a color film substrate provided in embodiments of the present disclosure.
- FIG. 9 is a flowchart of a fabrication method of a color film substrate provided in embodiments of the present disclosure.
- FIG. 5 is a schematic diagram of a local structure of a color film substrate provided in embodiments of the present disclosure.
- the color film substrate includes: a base substrate 1 ; an auxiliary cathode layer 2 arranged on the base substrate 1 ; a black matrix layer 3 arranged on the auxiliary cathode layer 2 , where the black matrix layer 3 includes a plurality of first via holes 31 penetrating through the black matrix layer 3 in a direction perpendicular to the base substrate 1 to expose the auxiliary cathode layer 2 ; a flat layer 4 arranged on the black matrix layer 3 , where the flat layer 4 includes a plurality of second via holes 41 corresponding to the first via holes 31 one by one to expose the auxiliary cathode layer 2 ; a plurality of spacers 5 arranged at intervals on the flat layer 4 , where the spacers 5 correspond to positions other than the first via holes 31 in the black matrix layer 3 ; and a transparent conductive layer 6 arranged on the spacers 5 , where the transparent
- the auxiliary cathode layer 2 is provided on the base substrate 1 as the first layer, and the black matrix layer 3 is provided on the auxiliary cathode layer 2 and corresponds to the auxiliary cathode layer 2 .
- the black matrix layer 3 includes a plurality of first via holes 31 penetrating through the black matrix layer 3 in a direction perpendicular to the base substrate 1 .
- the auxiliary cathode layer 2 may be reached through the first via holes 31 in the black matrix layer 3 , and the auxiliary cathode layer 2 may be exposed.
- the flat layer 4 is arranged on the black matrix layer 3 .
- the flat layer 4 may be an organic film layer.
- the flat layer 4 includes a plurality of second via holes 41 corresponding to the first via holes 31 one by one. Each pair of the first via hole 31 and the second via hole 41 may be nested holes.
- the auxiliary cathode layer 2 may be reached through the second via holes 41 penetrating through the flat layer 4 , and the auxiliary cathode layer 2 may be exposed.
- the flat layer 4 includes a plurality of spacers 5 arranged at intervals, and the spacers 5 correspond to positions other than the first via holes 31 in the black matrix layer 3 .
- the spacers 5 are provided on the flat layer 4 .
- the flat layer 4 is an organic film layer. The spacers 5 are connected with the flat layer 4 , and the adhesion of the spacers 5 with the flat layer 4 may be increased to avoid the falling off of the spacers 5 .
- the transparent conductive layer 6 is arranged on the spacers 5 , and is contacted and connected with the auxiliary cathode layer 2 through the first via holes 31 and the second via holes 41 .
- the auxiliary cathode layer 2 is electrically connected with the transparent conductive layer 6 , then the transparent cathode layer is electrically connected with the cathode after the cell aligning of the color film substrate is completed, that is, the auxiliary cathode layer 2 may be electrically connected with the cathode to reduce the cathode resistance, to avoid voltage drop and to improve the display effect of the display panel.
- the auxiliary cathode layer 2 used as the first layer on the base substrate 1 , is prepared before other film layers, and does not need more peculiar conditions and requirements in the fabrication process due to the consideration of the performance and fabrication conditions of other film layers, thus the technological difficulty of preparing the auxiliary cathode layer 2 may be reduced.
- the auxiliary cathode layer 2 may be prepared at first by high temperature deposition, which is conducive to improving the physical properties of the auxiliary cathode layer 2 .
- preparing other film layers after the fabrication of the auxiliary cathode layer 2 may avoid affecting other film layers in the fabrication process of the auxiliary cathode layer 2 , which is beneficial to ensuring constant sound performance of other film layers.
- the complexity of the whole fabrication process of the color film substrate is reduced, that is, the fabrication process is simplified and the fabrication cost is reduced.
- the auxiliary cathode layer 2 provided on the base substrate 1 as the first layer reduces the technological difficulty of preparing the auxiliary cathode layer 2 .
- the metal material of the auxiliary cathode layer 2 may be deposited at high temperature, which is conducive to improving the physical properties of the auxiliary cathode layer 2 and avoiding the influence of the fabrication process of the auxiliary cathode layer 2 on other film layers, so as to ensure the sound performance of other film layers.
- the spacers 5 are provided on the flat layer 4 and are connected with the flat layer 4 , and the adhesion of the spacers 5 with the flat layer 4 may be increased to avoid the falling off of the spacers 5 .
- the whole fabrication process of the color film substrate is simplified and the fabrication cost is reduced.
- the color film substrate also includes a color film layer 7 provided on the same layer as the black matrix layer 3 .
- the auxiliary cathode layer 2 includes a graphic identification 21 for alignment and an auxiliary cathode grid routing 22 .
- the graphic identification 21 for alignment is used to align an exposure machine with the graphic identification when the film layer is patterned in the subsequent film layer fabrication process, so as to avoid the deviation of the subsequently prepared film layers;
- the auxiliary cathode grid routing 22 in the auxiliary cathode layer 2 corresponds to the black matrix layer 3 and is electrically connected with the transparent conductive layer 6 through the first via holes 31 and the second via holes 41 .
- the auxiliary cathode grid routing 22 is electrically connected with the cathode through the transparent conductive layer 6 , so as to reduce cathode resistance, to avoid voltage drop and to improve the display quality of the formed display panel.
- the auxiliary cathode grid routing 22 of the auxiliary cathode layer 2 corresponds to the black matrix layer 3 , that is, the auxiliary cathode grid routing 22 is located in the area where the black matrix layer 3 is located, and at least partially overlaps with the area where the black matrix layer 3 is located.
- the black matrix layer 3 is grid-shaped and covers the auxiliary cathode grid routing 22 .
- the first via holes 31 are located at the intersections in the black matrix layer 3 , and the first via holes 31 in the black matrix layer 3 correspond to the intersections in the auxiliary cathode grid routing 22 , which is conducive to ensuring the structural stability of the black matrix layer 3 .
- the orthographic projection of the graphic identification 21 in the auxiliary cathode layer 2 on the base substrate 1 is located in the corner of the base substrate 1 .
- the graphic identification is provided in a corner of the auxiliary cathode layer 2 , which is convenient for alignment during the subsequent fabrication process of the film layer and will not affect the auxiliary cathode layer 2 .
- the spacers 5 in the color film substrate are arranged at a certain density and a moderate size, and the transparent conductive layer 6 may contact with the cathode in the case of cell aligning.
- the spacer 5 may be a spacer column with a circular cross section.
- the spacer 5 may be arranged as a cylindrical spacer column for the convenience of fabrication, and may also be arranged as a spacer column with a circular truncated cone shape, and the diameter of the circular surface of the circular truncated cone-shaped spacer column toward the flat layer 4 is larger than that of the circular surface toward the transparent cathode layer, so that the contact surface between the spacer columns and the flat layer 4 may be quite large to ensure firm connection with the flat layer 4 , and to increase the stability of the spacer columns.
- the spacers 5 may also be arranged as other shapes without limitation in this embodiment.
- the embodiment of the present disclosure also provides a display panel, including any color film substrate provided in the above embodiments.
- the embodiment of the present disclosure also provides a display device, including any display panel provided in the above embodiment.
- the embodiments of the present disclosure also provide a fabrication method of a color film substrate.
- the method includes the following steps.
- the auxiliary cathode layer is mostly directly prepared on the flat layer of an existing color film substrate to obtain a color film substrate with an auxiliary cathode layer.
- the auxiliary cathode layer 2 is firstly prepared on the base substrate 1 without considering its influence on other film layers, thus the technological difficulty of preparing the auxiliary cathode layer 2 may be reduced. And when auxiliary cathode metal is deposited, high temperature deposition may be adopted, which is helpful to improve the physical properties of the auxiliary cathode layer 2 and to avoid affecting other film layers during the fabrication process of the auxiliary cathode layer 2 , ensuring that the performance of other film layers remains good.
- the fabrication method of the color film substrate simplifies the whole fabrication process of the color film substrate and reduces the fabrication cost.
- the fabrication method of the color film substrate after forming the black matrix layer 3 and before forming the flat layer 4 , also includes: forming a color film layer 7 , which is arranged on the same layer as the black matrix layer 3 , as shown in FIG. 6 .
- the black matrix layer 3 is a grid pattern, which is used to define sub-pixel light-emitting arrays.
- the subsequently prepared color film arrays of different colors correspond to sub-pixels.
- the coating of the flattened organic film layer is performed.
- the auxiliary cathode layer 2 includes a graphic identification for alignment and an auxiliary cathode grid routing, the auxiliary cathode grid routing corresponds to the black matrix layer 3 and is connected with the transparent conductive layer 6 through the first via holes 31 and the second via holes 41 .
- the graphic identification for alignment in the auxiliary cathode layer 2 may be used to align an exposure machine with the graphic identification when the film layer is patterned in the subsequent film layer fabrication process to avoid the deviation of the subsequently prepared film layer.
- the auxiliary cathode grid routing in the auxiliary cathode layer 2 corresponds to the black matrix layer 3 and is electrically connected with the transparent conductive layer 6 through the first via holes 31 and the second via holes 41 .
- the color film substrate provided in the embodiments of the present disclosure will be electrically connected with the cathode after the cell aligning, thereby reducing the cathode resistance, avoiding voltage drop and improving the display quality of the formed display panel.
- the auxiliary cathode layer 2 includes the graphic identification and the auxiliary cathode grid routing without additional production of a graphic identification for alignment, the overall fabrication process is simple and the fabrication cost is low.
Abstract
A color film substrate and a preparation method therefor, and a display panel and a display device comprising the color film substrate. The color film substrate comprises: an auxiliary cathode layer formed on a substrate; a black matrix layer formed on the auxiliary cathode layer, a plurality of first via holes penetrating through the black matrix layer in a direction vertical to the substrate being provided on the black matrix layer; a flat layer formed on the black matrix layer, a plurality of second via holes having one-to-one correspondence to the first via holes so as to expose the auxiliary cathode layer being provided on the flat layer; a plurality of spacers formed on the flat layer; and a transparent conductive layer formed on the spacers, the transparent conductive layer being connected to the auxiliary cathode layer by means of the second via holes.
Description
- This disclosure is a US National Stage of International Application No. PCT/CN2019/083498, filed Apr. 19, 2019, which claims the priority to Chinese Patent Application No. 201810358565.5 filed with the Chinese Patent Office on Apr. 20, 2018, and entitled“Color Film Substrate and Fabrication Method thereof, Display Panel and Display Device”, the content of which is hereby incorporated by reference in its entirety.
- The present disclosure relates to the technical field of display, particularly relates to a color film substrate and a fabrication method thereof, a display panel and a display device.
- In the development of large-scale active-matrix organic light-emitting diode (AMOLED) display panels, a technical solution of top emission may improve resolution of the display panels, so the technical solution has been studied deeply gradually. Because of the limitation of the cathodic conductivity and manufacturing thickness, the AMOLED display panel for large-scale display needs an auxiliary cathode to reduce the overall cathode resistance, to avoid voltage drop and improve the display quality of the display panel.
- In the related art, the auxiliary cathode is generally provided on a color film substrate, and the technological difficulty of preparing the auxiliary cathode on the color film substrate is quite large. The main difficulty is that the production conditions of the auxiliary cathode are limited to other structures on the color film substrate, and have great impact on the performance of other film layers. Therefore, the fabrication of the auxiliary cathode is a difficult problem to be solved urgently.
- The present disclosure provides a color film substrate and a fabrication method thereof, a display panel and a display device to reduce the technological difficulty of preparing an auxiliary cathode layer, to ensure good performance of each film layer of the color film substrate, and to simplify the whole fabrication process of the color film substrate.
- To achieve the above purpose, the present disclosure provides the following technical solution.
- The present disclosure provides a color film substrate electroluminescent diode, including: a base substrate; an auxiliary cathode layer arranged on the base substrate and configured to couple to a cathode of the electroluminescent diode; a black matrix layer arranged on the auxiliary cathode layer, and the black matrix layer including a plurality of first via holes penetrating through the black matrix layer in a direction perpendicular to the base substrate to expose the auxiliary cathode layer; a flat layer arranged on the black matrix layer, and the flat layer including a plurality of second via holes corresponding to the first via holes one by one to expose the auxiliary cathode layer; a plurality of spacers arranged at intervals on the flat layer, where the spacers are at positions other than the first via holes in the black matrix layer; and a transparent conductive layer arranged on the spacers, wherein the transparent conductive layer is connected with the auxiliary cathode layer through the first via holes and the second via holes.
- Optionally, the color film substrate also includes a color film layer arranged on the same layer as the black matrix layer.
- Optionally, the auxiliary cathode layer includes a graphic identification for alignment and an auxiliary cathode grid routing, and the auxiliary cathode grid routing corresponds to the black matrix layer and is connected with the transparent conductive layer through the first via holes and the second via holes.
- Optionally, the first via holes correspond to the intersections in the auxiliary cathode grid routing.
- Optionally, an orthographic projection of the graphic identification on the base substrate is located on a corner of the base substrate.
- The present disclosure also provides a display panel, including any color film substrate provided in the above technical solution.
- The present disclosure also provides a display device, including any display panel provided in the above technical solution.
- In addition, the present disclosure also provides a method of fabricating a color film substrate in electroluminescent diode. The method includes: depositing metal on the base substrate to form a metal layer, and patterning the metal layer to form an auxiliary cathode layer configured to couple to a cathode of the electroluminescent diode; forming a black matrix layer on the auxiliary cathode layer and a plurality of first via holes in the black matrix layer penetrating through the black matrix layer in a direction perpendicular to the base substrate to expose the auxiliary cathode layer; forming a flat layer on the black matrix layer and a plurality of second via holes in the flat layer corresponding to the first via holes one by one to expose the auxiliary cathode layer; forming a plurality of spacers at intervals on the flat layer, where the spacers are at positions other than the first via holes in the black matrix layer; and forming a transparent conductive layer on the spacers, where the transparent conductive layer is connected with the auxiliary cathode layer through the first via holes and the second via holes.
- Optionally, after forming the black matrix layer and before forming the flat layer, the method further includes: forming a color film layer on the same layer as the black matrix layer.
- Optionally, the auxiliary cathode layer includes a graphic identification for alignment and an auxiliary cathode grid routing. The auxiliary cathode grid routing corresponds to the black matrix layer and is connected with the transparent conductive layer through the first via holes and the second via holes.
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FIGS. 1-5 are schematic diagrams of changes in a local film layer in the fabrication process of a color film substrate provided in embodiments of the present disclosure. -
FIG. 6 is a schematic diagram of the structure of a local film layer of a color film substrate provided in embodiments of the present disclosure. -
FIG. 7 is a top view of the structure of a color film substrate provided in embodiments of the present disclosure. -
FIG. 8 is a top view of a local structure of a black matrix layer and an auxiliary cathode layer of a color film substrate provided in embodiments of the present disclosure. -
FIG. 9 is a flowchart of a fabrication method of a color film substrate provided in embodiments of the present disclosure. - The technical solution in embodiments of the present disclosure will be described clearly and completely in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments acquired by those of ordinary skilled in the field without making creative work fall within the scope of the protection of the present disclosure.
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FIG. 5 is a schematic diagram of a local structure of a color film substrate provided in embodiments of the present disclosure. The color film substrate includes: abase substrate 1; anauxiliary cathode layer 2 arranged on thebase substrate 1; ablack matrix layer 3 arranged on theauxiliary cathode layer 2, where theblack matrix layer 3 includes a plurality offirst via holes 31 penetrating through theblack matrix layer 3 in a direction perpendicular to thebase substrate 1 to expose theauxiliary cathode layer 2; aflat layer 4 arranged on theblack matrix layer 3, where theflat layer 4 includes a plurality ofsecond via holes 41 corresponding to thefirst via holes 31 one by one to expose theauxiliary cathode layer 2; a plurality ofspacers 5 arranged at intervals on theflat layer 4, where thespacers 5 correspond to positions other than thefirst via holes 31 in theblack matrix layer 3; and a transparent conductive layer 6 arranged on thespacers 5, where the transparent conductive layer 6 is connected with theauxiliary cathode layer 2 through thefirst via holes 31 and the second viaholes 41. - As shown in
FIGS. 1-5 , in the above-mentioned color film substrate, theauxiliary cathode layer 2 is provided on thebase substrate 1 as the first layer, and theblack matrix layer 3 is provided on theauxiliary cathode layer 2 and corresponds to theauxiliary cathode layer 2. Theblack matrix layer 3 includes a plurality offirst via holes 31 penetrating through theblack matrix layer 3 in a direction perpendicular to thebase substrate 1. Theauxiliary cathode layer 2 may be reached through thefirst via holes 31 in theblack matrix layer 3, and theauxiliary cathode layer 2 may be exposed. - The
flat layer 4 is arranged on theblack matrix layer 3. Theflat layer 4 may be an organic film layer. Theflat layer 4 includes a plurality ofsecond via holes 41 corresponding to thefirst via holes 31 one by one. Each pair of thefirst via hole 31 and thesecond via hole 41 may be nested holes. Theauxiliary cathode layer 2 may be reached through thesecond via holes 41 penetrating through theflat layer 4, and theauxiliary cathode layer 2 may be exposed. Theflat layer 4 includes a plurality ofspacers 5 arranged at intervals, and thespacers 5 correspond to positions other than the first viaholes 31 in theblack matrix layer 3. Thespacers 5 are provided on theflat layer 4. Theflat layer 4 is an organic film layer. Thespacers 5 are connected with theflat layer 4, and the adhesion of thespacers 5 with theflat layer 4 may be increased to avoid the falling off of thespacers 5. - The transparent conductive layer 6 is arranged on the
spacers 5, and is contacted and connected with theauxiliary cathode layer 2 through thefirst via holes 31 and thesecond via holes 41. Theauxiliary cathode layer 2 is electrically connected with the transparent conductive layer 6, then the transparent cathode layer is electrically connected with the cathode after the cell aligning of the color film substrate is completed, that is, theauxiliary cathode layer 2 may be electrically connected with the cathode to reduce the cathode resistance, to avoid voltage drop and to improve the display effect of the display panel. - In the structure of the above-mentioned color film substrate, compared with the related art, the
auxiliary cathode layer 2, used as the first layer on thebase substrate 1, is prepared before other film layers, and does not need more peculiar conditions and requirements in the fabrication process due to the consideration of the performance and fabrication conditions of other film layers, thus the technological difficulty of preparing theauxiliary cathode layer 2 may be reduced. - For example, as the first layer, the
auxiliary cathode layer 2 may be prepared at first by high temperature deposition, which is conducive to improving the physical properties of theauxiliary cathode layer 2. - Moreover, because there is no organic film on the
base substrate 1 during the sputtering deposition of the auxiliary cathode metal, the chamber of sputtering deposition equipment will not be polluted. - In addition, preparing other film layers after the fabrication of the
auxiliary cathode layer 2 may avoid affecting other film layers in the fabrication process of theauxiliary cathode layer 2, which is beneficial to ensuring constant sound performance of other film layers. - In addition, for the whole fabrication process of the color film substrate, based on the film layer structure arrangement of the color film substrate provided in the embodiment of the present disclosure, the complexity of the whole fabrication process of the color film substrate is reduced, that is, the fabrication process is simplified and the fabrication cost is reduced.
- In summary, in the color film substrate, the
auxiliary cathode layer 2 provided on thebase substrate 1 as the first layer reduces the technological difficulty of preparing theauxiliary cathode layer 2. The metal material of theauxiliary cathode layer 2 may be deposited at high temperature, which is conducive to improving the physical properties of theauxiliary cathode layer 2 and avoiding the influence of the fabrication process of theauxiliary cathode layer 2 on other film layers, so as to ensure the sound performance of other film layers. Furthermore, thespacers 5 are provided on theflat layer 4 and are connected with theflat layer 4, and the adhesion of thespacers 5 with theflat layer 4 may be increased to avoid the falling off of thespacers 5. Furthermore, based on the film layer structure arrangement of the color film substrate provided in the embodiments of the present disclosure, the whole fabrication process of the color film substrate is simplified and the fabrication cost is reduced. - Specifically, as shown in
FIG. 6 , the color film substrate also includes a color film layer 7 provided on the same layer as theblack matrix layer 3. - Specifically, as shown in
FIG. 7 , theauxiliary cathode layer 2 includes agraphic identification 21 for alignment and an auxiliarycathode grid routing 22. Provided in theauxiliary cathode layer 2, thegraphic identification 21 for alignment is used to align an exposure machine with the graphic identification when the film layer is patterned in the subsequent film layer fabrication process, so as to avoid the deviation of the subsequently prepared film layers; the auxiliarycathode grid routing 22 in theauxiliary cathode layer 2 corresponds to theblack matrix layer 3 and is electrically connected with the transparent conductive layer 6 through thefirst via holes 31 and thesecond via holes 41. After the cell aligning of the color film substrate provided in the embodiments of the present disclosure is completed, the auxiliarycathode grid routing 22 is electrically connected with the cathode through the transparent conductive layer 6, so as to reduce cathode resistance, to avoid voltage drop and to improve the display quality of the formed display panel. - Specifically, as shown in
FIG. 8 , the auxiliarycathode grid routing 22 of theauxiliary cathode layer 2 corresponds to theblack matrix layer 3, that is, the auxiliarycathode grid routing 22 is located in the area where theblack matrix layer 3 is located, and at least partially overlaps with the area where theblack matrix layer 3 is located. As shown inFIGS. 7 and 8 , theblack matrix layer 3 is grid-shaped and covers the auxiliarycathode grid routing 22. The first viaholes 31 are located at the intersections in theblack matrix layer 3, and the first viaholes 31 in theblack matrix layer 3 correspond to the intersections in the auxiliarycathode grid routing 22, which is conducive to ensuring the structural stability of theblack matrix layer 3. - As shown in
FIG. 7 , the orthographic projection of thegraphic identification 21 in theauxiliary cathode layer 2 on thebase substrate 1 is located in the corner of thebase substrate 1. The graphic identification is provided in a corner of theauxiliary cathode layer 2, which is convenient for alignment during the subsequent fabrication process of the film layer and will not affect theauxiliary cathode layer 2. - Specifically, as shown in
FIG. 7 , thespacers 5 in the color film substrate are arranged at a certain density and a moderate size, and the transparent conductive layer 6 may contact with the cathode in the case of cell aligning. As an example, thespacer 5 may be a spacer column with a circular cross section. For example, thespacer 5 may be arranged as a cylindrical spacer column for the convenience of fabrication, and may also be arranged as a spacer column with a circular truncated cone shape, and the diameter of the circular surface of the circular truncated cone-shaped spacer column toward theflat layer 4 is larger than that of the circular surface toward the transparent cathode layer, so that the contact surface between the spacer columns and theflat layer 4 may be quite large to ensure firm connection with theflat layer 4, and to increase the stability of the spacer columns. It shall be noted that thespacers 5 may also be arranged as other shapes without limitation in this embodiment. - The embodiment of the present disclosure also provides a display panel, including any color film substrate provided in the above embodiments.
- The embodiment of the present disclosure also provides a display device, including any display panel provided in the above embodiment.
- As shown in
FIG. 9 in conjunction withFIGS. 1-5 , the embodiments of the present disclosure also provide a fabrication method of a color film substrate. The method includes the following steps. - S101: forming a metal layer by depositing metal on a
base substrate 1, and patterning the metal layer to form anauxiliary cathode layer 2, as shown inFIG. 1 . - S102: forming a
black matrix layer 3 on theauxiliary cathode layer 2, and a plurality of first viaholes 31 in theblack matrix layer 3 penetrating through theblack matrix layer 3 in a direction perpendicular to thebase substrate 1 to expose theauxiliary cathode layer 2, as shown inFIG. 2 . - S103: forming a
flat layer 4 on theblack matrix layer 3 and a plurality of second viaholes 41 in theflat layer 4 corresponding to the first viaholes 31 one by one to expose theauxiliary cathode layer 2, as shown inFIG. 3 . - S104: forming a plurality of
spacers 5 at intervals on theflat layer 4, where thespacers 5 are opposite to positions other than the first viaholes 31 in theblack matrix layer 3, as shown inFIG. 4 . - S105: forming a transparent conductive layer 6 on the
spacers 5, where the transparent conductive layer 6 is connected with theauxiliary cathode layer 2 through the first viaholes 31 and the second viaholes 41, as shown inFIG. 5 . - In the related art, the auxiliary cathode layer is mostly directly prepared on the flat layer of an existing color film substrate to obtain a color film substrate with an auxiliary cathode layer.
- In contrast, in the fabrication method of the color film substrate provided in the embodiments of the present disclosure, the
auxiliary cathode layer 2 is firstly prepared on thebase substrate 1 without considering its influence on other film layers, thus the technological difficulty of preparing theauxiliary cathode layer 2 may be reduced. And when auxiliary cathode metal is deposited, high temperature deposition may be adopted, which is helpful to improve the physical properties of theauxiliary cathode layer 2 and to avoid affecting other film layers during the fabrication process of theauxiliary cathode layer 2, ensuring that the performance of other film layers remains good. Moreover, by arranging thespacers 5 on theflat layer 4, and connecting thespacers 5 with theflat layer 4, the adhesion of thespacers 5 may be increased and the falling off of thespacers 5 may be avoided. In addition, the fabrication method of the color film substrate provided in the embodiments of the present disclosure simplifies the whole fabrication process of the color film substrate and reduces the fabrication cost. - Specifically, the fabrication method of the color film substrate, after forming the
black matrix layer 3 and before forming theflat layer 4, also includes: forming a color film layer 7, which is arranged on the same layer as theblack matrix layer 3, as shown inFIG. 6 . Theblack matrix layer 3 is a grid pattern, which is used to define sub-pixel light-emitting arrays. The subsequently prepared color film arrays of different colors correspond to sub-pixels. After preparing of the color film arrays of different sub-pixels, the coating of the flattened organic film layer is performed. - In the fabrication method of the color film substrate, the
auxiliary cathode layer 2 includes a graphic identification for alignment and an auxiliary cathode grid routing, the auxiliary cathode grid routing corresponds to theblack matrix layer 3 and is connected with the transparent conductive layer 6 through the first viaholes 31 and the second via holes 41. The graphic identification for alignment in theauxiliary cathode layer 2 may be used to align an exposure machine with the graphic identification when the film layer is patterned in the subsequent film layer fabrication process to avoid the deviation of the subsequently prepared film layer. The auxiliary cathode grid routing in theauxiliary cathode layer 2 corresponds to theblack matrix layer 3 and is electrically connected with the transparent conductive layer 6 through the first viaholes 31 and the second via holes 41. The color film substrate provided in the embodiments of the present disclosure will be electrically connected with the cathode after the cell aligning, thereby reducing the cathode resistance, avoiding voltage drop and improving the display quality of the formed display panel. Compared with a fabrication method of a color film substrate of the related art, in the fabrication method of the color film substrate provided in the embodiments of the present disclosure, theauxiliary cathode layer 2 includes the graphic identification and the auxiliary cathode grid routing without additional production of a graphic identification for alignment, the overall fabrication process is simple and the fabrication cost is low. - Obviously, those skilled in the art may make various changes and variations to the embodiments of the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure is also intended to include these modifications and variations.
Claims (19)
1. A color film substrate in electroluminescent diode, comprising:
a base substrate;
an auxiliary cathode layer arranged on the base substrate and configured to couple to a cathode of the electroluminescent diode;
a black matrix layer arranged on the auxiliary cathode layer, and the black matrix layer comprising a plurality of first via holes penetrating through the black matrix layer in a direction perpendicular to the base substrate to expose the auxiliary cathode layer;
a flat layer arranged on the black matrix layer, and the flat layer comprising a plurality of second via holes corresponding to the first via holes one by one to expose the auxiliary cathode layer;
a plurality of spacers arranged at intervals on the flat layer, wherein the spacers are at positions other than the first via holes in the black matrix layer; and
a transparent conductive layer arranged on the spacers, wherein the transparent conductive layer is connected with the auxiliary cathode layer through the first via holes and the second via holes.
2. The color film substrate according to claim 1 , further comprising a color film layer arranged on the same layer as the black matrix layer.
3. The color film substrate according to claim 1 , wherein, the auxiliary cathode layer comprises an auxiliary cathode grid routing, and the auxiliary cathode grid routing corresponds to the black matrix layer and is connected with the transparent conductive layer through the first via holes and the second via holes.
4. The color film substrate according to claim 3 , wherein, the first via holes correspond to intersections in the auxiliary cathode grid routing.
5. The color film substrate according to claim 3 , wherein, an orthographic projection of the graphic identification on the base substrate is located on a corner of the base substrate.
6. A display panel, comprising a color film substrate in electroluminescent diode, wherein the color film substrate comprises:
a base substrate;
an auxiliary cathode layer arranged on the base substrate and configured to couple to a cathode of the electroluminescent diode;
a black matrix layer arranged on the auxiliary cathode layer, and the black matrix layer comprising a plurality of first via holes penetrating through the black matrix layer in a direction perpendicular to the base substrate to expose the auxiliary cathode layer;
a flat layer arranged on the black matrix layer, and the flat layer comprising a plurality of second via holes corresponding to the first via holes one by one to expose the auxiliary cathode layer;
a plurality of spacers arranged at intervals on the flat layer, wherein the spacers are at positions other than the first via holes in the black matrix layer; and
a transparent conductive layer arranged on the spacers, wherein the transparent conductive layer is connected with the auxiliary cathode layer through the first via holes and the second via holes.
7. A display device, comprising the display panel according to claim 6 .
8. A method of fabricating a color film substrate in electroluminescent diode, comprising:
depositing metal on a base substrate to form a metal layer, and patterning the metal layer to form an auxiliary cathode layer configured to couple to a cathode of the electroluminescent diode;
forming a black matrix layer on the auxiliary cathode layer, and forming a plurality of first via holes in the black matrix layer penetrating through the black matrix layer in a direction perpendicular to the base substrate to expose the auxiliary cathode layer;
forming a flat layer on the black matrix layer, and forming a plurality of second via holes in the flat layer corresponding to the first via holes one by one to expose the auxiliary cathode layer;
forming a plurality of spacers at intervals on the flat layer, wherein the spacers are at positions other than the first via holes in the black matrix layer; and
forming a transparent conductive layer on the spacers, wherein the transparent conductive layer is connected with the auxiliary cathode layer through the first via holes and the second via holes.
9. The method according to claim 8 , wherein, after forming the black matrix layer and before forming the flat layer, the method further comprises: forming a color film layer on the same layer as the black matrix layer.
10. The method according to claim 8 , wherein, the auxiliary cathode layer comprises an auxiliary cathode grid routing, and the auxiliary cathode grid routing corresponds to the black matrix layer and is connected with the transparent conductive layer through the first via holes and the second via holes.
11. The color film substrate according to claim 1 , wherein the auxiliary cathode layer comprises a graphic identification for alignment.
12. The display panel according to claim 6 , wherein the color film substrate further comprises a color film layer arranged on the same layer as the black matrix layer.
13. The display panel according to claim 6 , wherein the auxiliary cathode layer comprises an auxiliary cathode grid routing, and the auxiliary cathode grid routing corresponds to the black matrix layer and is connected with the transparent conductive layer through the first via holes and the second via holes.
14. The display panel according to claim 13 , wherein, the first via holes correspond to intersections in the auxiliary cathode grid routing.
15. The display panel according to claim 13 , wherein an orthographic projection of the graphic identification on the base substrate is located on a corner of the base substrate.
16. The display panel according to claim 6 , wherein the auxiliary cathode layer comprises a graphic identification for alignment.
17. The method according to claim 8 , wherein the auxiliary cathode layer comprises a graphic identification for alignment.
18. The method according to claim 10 , wherein, the first via holes correspond to intersections in the auxiliary cathode grid routing.
19. The method according to claim 10 , wherein, an orthographic projection of the graphic identification on the substrate is located on a corner of the base substrate.
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CN201810358565.5A CN108336125B (en) | 2018-04-20 | 2018-04-20 | Color film substrate, preparation method thereof, display panel and display device |
PCT/CN2019/083498 WO2019201338A1 (en) | 2018-04-20 | 2019-04-19 | Color film substrate and preparation method therefor, and display panel and display device |
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CN110289366B (en) * | 2019-05-06 | 2021-10-12 | 京东方科技集团股份有限公司 | Cover plate structure, manufacturing method thereof, display panel and display device |
CN115377319A (en) * | 2021-04-09 | 2022-11-22 | 武汉天马微电子有限公司 | Display panel and display device |
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US6812637B2 (en) | 2003-03-13 | 2004-11-02 | Eastman Kodak Company | OLED display with auxiliary electrode |
KR100692062B1 (en) * | 2004-12-08 | 2007-03-12 | 엘지전자 주식회사 | Methode of manufacturing a plasma display panel |
JP5505442B2 (en) * | 2010-02-15 | 2014-05-28 | カシオ計算機株式会社 | Display device and camera |
WO2012038999A1 (en) * | 2010-09-21 | 2012-03-29 | パナソニック株式会社 | Thin-film transistor array device and method for manufacturing thin-film transistor array device |
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CN104409455B (en) * | 2014-11-17 | 2017-06-23 | 京东方科技集团股份有限公司 | A kind of substrate and its manufacture method, display device |
CN105467667B (en) * | 2016-01-28 | 2018-12-18 | 京东方科技集团股份有限公司 | Color membrane substrates and preparation method thereof, display panel and display device |
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CN108336125B (en) | 2018-04-20 | 2023-10-17 | 京东方科技集团股份有限公司 | Color film substrate, preparation method thereof, display panel and display device |
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CN108336125A (en) | 2018-07-27 |
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