US20200275580A1 - Integrated power module and capacitor module thermal and packaging design - Google Patents
Integrated power module and capacitor module thermal and packaging design Download PDFInfo
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- US20200275580A1 US20200275580A1 US16/283,626 US201916283626A US2020275580A1 US 20200275580 A1 US20200275580 A1 US 20200275580A1 US 201916283626 A US201916283626 A US 201916283626A US 2020275580 A1 US2020275580 A1 US 2020275580A1
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- busbar
- capacitor
- cell
- cold plate
- module
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- 239000003990 capacitor Substances 0.000 title claims abstract description 122
- 238000004806 packaging method and process Methods 0.000 title description 2
- 238000003878 thermal aging Methods 0.000 title 1
- 238000003491 array Methods 0.000 claims abstract description 34
- 239000012530 fluid Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000011104 metalized film Substances 0.000 claims abstract description 4
- 239000002826 coolant Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000010408 film Substances 0.000 description 5
- 238000004382 potting Methods 0.000 description 5
- 239000000446 fuel Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0081—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by a single plate-like element ; the conduits for one heat-exchange medium being integrated in one single plate-like element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/46—Boxes; Parts thereof or accessories therefor
- H02B1/48—Mounting of devices therein
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/02—Open installations
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
Definitions
- This disclosure relates to integrated capacitor and power modules and capacitor modules having busbars that connect oppositely oriented cells of adjacent arrays of cells and may also provide a thermal path to a cold plate.
- Electric Vehicles EVs
- HEVs Hybrid Electric Vehicles
- PHEVs Plug-in Hybrid Electric Vehicles
- a traction drive inverter system that includes a power module and a capacitor module.
- One way to improve fuel efficiency is by downsizing and reducing the weight of the traction drive inverter system.
- continued miniaturization of traction drive inverter systems has resulted in challenges of mechanical integration and cooling design for components, such as the power module and DC-link capacitor.
- an integrated capacitor and power module includes a power module, an intermediate cold plate, and a capacitor module.
- the intermediate cold plate has a first side attached to the power module and a second side opposite the first side.
- the capacitor module is attached to a second side of the intermediate cold plate.
- the capacitor module includes a plurality of metalized film capacitor cells supported by a metal plate and a base cold plate with a layer of thermal interface material between the metal plate and the base cold plate.
- a fluid circulation system is operatively connected to the intermediate cold plate to circulate a fluid through the cold plate.
- a capacitor module includes a housing, a plurality of capacitor cells and first and second busbars.
- the capacitor cells are aligned in a first cell array and a second cell array on a base plate of the housing.
- the first and second cell arrays have a P-end and an N-end on each cell.
- the P-end and N-end of adjacent first and second cell arrays are inverted relative to each other.
- the first busbar has a first lower portion directly contacting the P-end of each cell below the first cell array, a first upper portion directly contacting the P-end of each cell above the second cell array, and a first intermediate portion connecting the first lower portion and the first upper portion.
- the second busbar has a second lower portion directly contacting the N-end of each cell below the second cell array, a second upper portion directly contacting the N-end of each cell above the first cell array, and a second intermediate portion connecting the second lower portion and the second upper portion.
- the first busbar and the second busbar are electrically isolated from each other.
- a capacitor module includes a housing, a plurality of capacitor cells aligned in several linear arrays, and an N-busbar and a P-busbar.
- the housing includes a base plate on which the capacitor cells are aligned in several linear arrays.
- the linear arrays have a P-end of each cell and an N-end of each cell of adjacent linear arrays are oppositely oriented relative to each other.
- the N-busbar contacts an N-end of the capacitor cells of the several linear arrays.
- the P-busbar contacts a P-end of the capacitor cells of the several linear arrays.
- the N-busbar includes N-busbar linking portions connecting the N-ends of adjacent linear arrays
- the P-busbar includes P-busbar linking portions connecting the P-ends of adjacent linear arrays.
- the N-busbar and the P-busbar are electrically isolated from each other.
- FIG. 1 is a perspective view of an integrated power module and a capacitor module made according to one embodiment of the disclosure.
- FIG. 2 is a diagrammatic perspective view of the heat sink, base plate and sidewalls of a housing and a plurality of capacitor cells.
- FIG. 3 is a diagrammatic perspective view of a P busbar disposed in a housing without any capacitor cells.
- FIG. 4 is a diagrammatic perspective view of the P busbar disposed in the housing with capacitor cells arranged in linear arrays with alternating rows being oppositely oriented.
- FIG. 5 is a diagrammatic perspective view of an N busbar disposed in a housing without any capacitor cells.
- FIG. 6 is a diagrammatic perspective view of the N busbar disposed in the housing with capacitor cells arranged in linear arrays with alternating rows being oppositely oriented.
- FIG. 7 is a diagrammatic perspective view of a capacitor module fully assembled with the sidewalls shown in phantom lines.
- FIG. 8 is a diagrammatic elevation view of the capacitor module with three heat dissipation thermal paths.
- FIG. 9 is a diagrammatic perspective view of a P busbar for a capacitor module having three rows of cells disposed in a housing without any capacitor cells.
- FIG. 10 is a diagrammatic perspective view of an N busbar for a capacitor module having three rows of cells disposed in a housing without any capacitor cells.
- FIG. 11 is a diagrammatic perspective view of the P busbar and the N busbar disposed in the housing with capacitor cells arranged in linear arrays with alternating rows being oppositely oriented.
- a DC-link capacitor may be connected between a plurality of busbars.
- the main functions of the DC-link capacitor include absorbing ripple currents generated either by the inverters or by power sources and stabilizing the DC-link voltage for inverter control.
- Film capacitors with various configuration are widely used for DC-link capacitor applications that are subject to extensive high ripple currents in certain driving conditions.
- Capacitor heat loss is generated either by dielectric material self-heating due to ripple current, or by electrode system Ohm loss. Advanced technology has been applied to film capacitor design to improve the capability to pack more capacitance in a smaller volume at a given voltage rating. However, this results in higher heat loss density.
- the capacitor module is usually made up of individual film cells (metalized polypropylene), that are encapsulated in an engineering plastic housing with potting resin for electrical insulation, mechanical and humidity protection for film cells.
- the capacitor module may also contain busbars for connecting ends of film cells to DC terminals (P and N).
- the thermal paths for a conventional DC-link capacitor package transfer heat from the center of the cells upwardly through a busbar and potting material to be transferred by convection to ambient. Heat is also transferred from the center of the cells downwardly through a busbar through the potting material and the housing and transferred to the surrounding environment through natural convection.
- thermal conductivity is low for capacitor cells, potting and housing materials resulting in high thermal resistance along the thermal paths.
- a capacitor having increased size may be selected with greater module skin area that leads to the oversizing and low cooling effectiveness because the thermal path becomes even longer as capacitor size increases.
- DC-link capacitor terminals are connected to the inverter power module.
- the capacitor module should be placed as close as possible to the power module to minimize the parasitic inductance.
- the operating temperature of the power module can be as high as 150 degrees C., whereas the maximum allowable temperature of the capacitor module is usually less than 105 degrees C. Considerable heat energy may be transferred from power module to the capacitor terminals resulting in additional heating of the capacitor cells.
- FIG. 1 illustrates one embodiment of an integrated power and capacitor module 10 that includes a capacitor module 12 , a power module 14 , and an intermediate cold plate 16 .
- the cold plate 16 is attached on a first side 18 to the capacitor module portion 12 and on an oppositely oriented second side 20 to the power module 14 .
- the cold plate 16 defines an internal coolant channel 22 that receives coolant fluid from a coolant inlet channel 24 and returns the coolant fluid through a coolant outlet channel 26 to a coolant circulation system 28 .
- the capacitor module 12 , the power module 14 , and the intermediate cold plate 16 include a plurality of fastener bosses 30 for receiving fasteners 32 .
- FIG. 2 illustrates the capacitor module 12 and a cold plate 34 .
- the cold plate 34 may be a solid plate or may include an internal coolant channel like the intermediate cold plate 16 shown in FIG. 1 .
- the cold plate 34 may be provided in combination with the cold plate 16 or may be provided without the cold plate 16 .
- the capacitor module 12 includes a plurality of metalized film capacitor cells 36 arranged in two linear arrays of capacitor cells 36 .
- the capacitor cells 36 are supported by a copper base plate 38 .
- the copper base plate 38 could alternatively be made of a different metal, if desired.
- the base plate 38 forms part of a housing 40 in combination with a plurality of plastic sidewalls 42 shown in phantom lines.
- the housing 40 is supported on the cold plate 34 .
- the capacitor module 12 is shown to include a P-busbar 46 with the capacitor cells 38 shown in FIG. 4 and omitted from FIG. 3 for better visibility.
- the P-busbar 46 includes a lower portion 48 and an upper portion 50 that are connected by an intermediate portion 52 (or linking portion).
- the P-end 54 of each capacitor cell 38 is in contact with the lower portion 48 of the P-busbar 46 or the upper portion 50 of the P-busbar 46 .
- the intermediate portion 52 extends between a first cell array 56 and an adjacent second cell array 58 and electrically connects the lower portion 48 and the upper portion 50 .
- a first cell array 56 has a P-end 54 in contact with the upper portion 50 of the P-busbar 46 and a second cell array 58 has a P-end 54 in contact with the lower portion 48 of the P-busbar 46 .
- the capacitor module 12 is shown to include an N-busbar 60 with the capacitor cells 38 shown in FIG. 6 and omitted from FIG. 5 .
- the N-busbar 60 includes a lower portion 62 and an upper portion 64 that are connected by an intermediate portion 66 (or linking portion).
- the N-end 68 of each capacitor cell 38 is in contact with the lower portion 62 of the N-busbar 60 or the upper portion 64 of the N-busbar 60 .
- the intermediate portion 66 extends between a first cell array 56 and an adjacent second cell array 58 and electrically connects the lower portion 62 and the upper portion 64 .
- a first cell array 56 has the N-end 68 in contact with the upper portion 64 of the N-busbar 60 and a second cell array 58 has an N-end 68 in contact the with the lower portion 62 of the N-busbar 60 .
- the capacitor module 12 is shown with the P-busbar 46 and the N-busbar 60 assembled to the base plate 40 with the capacitor cells 38 between the respective upper portions 50 and 64 and lower portions 48 and 62 of the busbars 46 and 60 .
- a P-terminal 70 and an N-terminal 72 are connected to the P-busbar 46 and the N-busbar 60 and are provided to connect the capacitor module to the power module 14 .
- the terminals 70 , 72 are disposed on the bottom of the capacitor cells 38 close to the lower cold plate 34 and the power module 14 (shown in FIG. 1 ). Heat from the power module 14 and the capacitor module 12 is transferred from the terminals 70 , 72 to the lower cold plate 34 .
- thermal paths for cooling the capacitor cells 38 are shown diagrammatically.
- heat is conducted upwardly from the capacitor cells 38 , through one of the busbars 46 or 60 , through a potting material 74 and to ambient air above the capacitor module 12 .
- heat is conducted downwardly from the capacitor cells 38 , in sequence through the base plate 40 , the thermal interface material 36 , the lower cold plate 34 to ambient.
- heat received from the power module 14 through the terminals 70 and 72 , and sequentially through the P-busbar 46 and N-busbar 60 .
- an alternative embodiment of a capacitor module 80 includes 3 linear arrays of capacitor cells 38 .
- the same reference numerals used with reference to the embodiment of FIGS. 1-8 are used to identify similar parts of the embodiment of FIGS. 9-11 .
- the capacitor module 80 includes a P-busbar 82 .
- the P-busbar 82 includes two lower portions 84 and an upper portion 86 that are connected by an intermediate portion 88 .
- the P-end 90 of each capacitor cell 38 is in contact with the lower portion 84 of the P-busbar 82 or the upper portion 86 of the P-busbar 82 .
- a P-terminal 94 is provided on the upper portion 86 of the busbar 82 .
- the alternative embodiment of a capacitor module 80 includes an N-busbar 96 .
- the N-busbar 96 includes a lower portion 98 and two upper portions 100 that are connected by an intermediate portion 102 .
- the N-end 104 of each capacitor cell 38 is in contact with the lower portion 98 of the N-busbar 96 or the upper portion 100 of the N-busbar 96 .
- An N-terminal 106 is provided on the upper portion 100 of the N-busbar 96 .
- the capacitor module 80 is shown with the P-busbar 82 , the N-busbar 96 and three linear arrays of capacitor cells 38 installed in the housing 108 that is shown with some of the sidewalls 110 in phantom and the base wall 112 supporting the capacitor cells 38 .
- the P-terminal 94 and N-terminal 106 extend outwardly from an upper area of the housing 108 . While three linear arrays of capacitor cells 38 are shown in FIGS. 9-11 , it should be understood that any number of linear arrays may be provided depending upon the desired number of capacitor cells 38 .
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Inverter Devices (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
- This disclosure relates to integrated capacitor and power modules and capacitor modules having busbars that connect oppositely oriented cells of adjacent arrays of cells and may also provide a thermal path to a cold plate.
- Electric Vehicles (EVs), Hybrid Electric Vehicles (HEVs), and Plug-in Hybrid Electric Vehicles (PHEVs) are being developed with a goal of improving fuel efficiency and reducing CO2 emissions. These types of electric vehicles may include a traction drive inverter system that includes a power module and a capacitor module. One way to improve fuel efficiency is by downsizing and reducing the weight of the traction drive inverter system. However, continued miniaturization of traction drive inverter systems has resulted in challenges of mechanical integration and cooling design for components, such as the power module and DC-link capacitor.
- According to one aspect of this disclosure, an integrated capacitor and power module is disclosed that includes a power module, an intermediate cold plate, and a capacitor module. The intermediate cold plate has a first side attached to the power module and a second side opposite the first side. The capacitor module is attached to a second side of the intermediate cold plate. The capacitor module includes a plurality of metalized film capacitor cells supported by a metal plate and a base cold plate with a layer of thermal interface material between the metal plate and the base cold plate. A fluid circulation system is operatively connected to the intermediate cold plate to circulate a fluid through the cold plate.
- According to another aspect of this disclosure, a capacitor module is disclosed that includes a housing, a plurality of capacitor cells and first and second busbars. The capacitor cells are aligned in a first cell array and a second cell array on a base plate of the housing. The first and second cell arrays have a P-end and an N-end on each cell. The P-end and N-end of adjacent first and second cell arrays are inverted relative to each other. The first busbar has a first lower portion directly contacting the P-end of each cell below the first cell array, a first upper portion directly contacting the P-end of each cell above the second cell array, and a first intermediate portion connecting the first lower portion and the first upper portion. The second busbar has a second lower portion directly contacting the N-end of each cell below the second cell array, a second upper portion directly contacting the N-end of each cell above the first cell array, and a second intermediate portion connecting the second lower portion and the second upper portion. The first busbar and the second busbar are electrically isolated from each other.
- According to another aspect of this disclosure, a capacitor module is disclosed that includes a housing, a plurality of capacitor cells aligned in several linear arrays, and an N-busbar and a P-busbar. The housing includes a base plate on which the capacitor cells are aligned in several linear arrays. The linear arrays have a P-end of each cell and an N-end of each cell of adjacent linear arrays are oppositely oriented relative to each other. The N-busbar contacts an N-end of the capacitor cells of the several linear arrays. The P-busbar contacts a P-end of the capacitor cells of the several linear arrays. The N-busbar includes N-busbar linking portions connecting the N-ends of adjacent linear arrays, and the P-busbar includes P-busbar linking portions connecting the P-ends of adjacent linear arrays. The N-busbar and the P-busbar are electrically isolated from each other.
- The above aspects of this disclosure and other aspects will be described below with reference to the attached drawings.
-
FIG. 1 is a perspective view of an integrated power module and a capacitor module made according to one embodiment of the disclosure. -
FIG. 2 is a diagrammatic perspective view of the heat sink, base plate and sidewalls of a housing and a plurality of capacitor cells. -
FIG. 3 is a diagrammatic perspective view of a P busbar disposed in a housing without any capacitor cells. -
FIG. 4 is a diagrammatic perspective view of the P busbar disposed in the housing with capacitor cells arranged in linear arrays with alternating rows being oppositely oriented. -
FIG. 5 is a diagrammatic perspective view of an N busbar disposed in a housing without any capacitor cells. -
FIG. 6 is a diagrammatic perspective view of the N busbar disposed in the housing with capacitor cells arranged in linear arrays with alternating rows being oppositely oriented. -
FIG. 7 is a diagrammatic perspective view of a capacitor module fully assembled with the sidewalls shown in phantom lines. -
FIG. 8 is a diagrammatic elevation view of the capacitor module with three heat dissipation thermal paths. -
FIG. 9 is a diagrammatic perspective view of a P busbar for a capacitor module having three rows of cells disposed in a housing without any capacitor cells. -
FIG. 10 is a diagrammatic perspective view of an N busbar for a capacitor module having three rows of cells disposed in a housing without any capacitor cells. -
FIG. 11 is a diagrammatic perspective view of the P busbar and the N busbar disposed in the housing with capacitor cells arranged in linear arrays with alternating rows being oppositely oriented. - Various embodiments of the present disclosure are described herein. However, the disclosed embodiments are merely exemplary and other embodiments may take various and alternative forms that are not explicitly illustrated or described. The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one of ordinary skill in the art to variously employ the present invention. As those of ordinary skill in the art will understand, various features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to produce embodiments that are not explicitly illustrated or described. The combinations of features illustrated provide representative embodiments for typical applications. However, various combinations and modifications of the features consistent with the teachings of this disclosure may be desired for particular applications or implementations.
- A DC-link capacitor may be connected between a plurality of busbars. The main functions of the DC-link capacitor include absorbing ripple currents generated either by the inverters or by power sources and stabilizing the DC-link voltage for inverter control. Film capacitors with various configuration are widely used for DC-link capacitor applications that are subject to extensive high ripple currents in certain driving conditions.
- Capacitor heat loss is generated either by dielectric material self-heating due to ripple current, or by electrode system Ohm loss. Advanced technology has been applied to film capacitor design to improve the capability to pack more capacitance in a smaller volume at a given voltage rating. However, this results in higher heat loss density.
- For conventional DC-link capacitor designs, the capacitor module is usually made up of individual film cells (metalized polypropylene), that are encapsulated in an engineering plastic housing with potting resin for electrical insulation, mechanical and humidity protection for film cells. The capacitor module may also contain busbars for connecting ends of film cells to DC terminals (P and N).
- The thermal paths for a conventional DC-link capacitor package transfer heat from the center of the cells upwardly through a busbar and potting material to be transferred by convection to ambient. Heat is also transferred from the center of the cells downwardly through a busbar through the potting material and the housing and transferred to the surrounding environment through natural convection.
- One challenge is that thermal conductivity is low for capacitor cells, potting and housing materials resulting in high thermal resistance along the thermal paths. To meet the thermal performance requirements, a capacitor having increased size may be selected with greater module skin area that leads to the oversizing and low cooling effectiveness because the thermal path becomes even longer as capacitor size increases.
- In addition, DC-link capacitor terminals are connected to the inverter power module. The capacitor module should be placed as close as possible to the power module to minimize the parasitic inductance. The operating temperature of the power module can be as high as 150 degrees C., whereas the maximum allowable temperature of the capacitor module is usually less than 105 degrees C. Considerable heat energy may be transferred from power module to the capacitor terminals resulting in additional heating of the capacitor cells.
-
FIG. 1 illustrates one embodiment of an integrated power andcapacitor module 10 that includes acapacitor module 12, apower module 14, and an intermediatecold plate 16. Thecold plate 16 is attached on afirst side 18 to thecapacitor module portion 12 and on an oppositely orientedsecond side 20 to thepower module 14. Thecold plate 16 defines aninternal coolant channel 22 that receives coolant fluid from acoolant inlet channel 24 and returns the coolant fluid through acoolant outlet channel 26 to acoolant circulation system 28. - The
capacitor module 12, thepower module 14, and the intermediatecold plate 16 include a plurality offastener bosses 30 for receivingfasteners 32. -
FIG. 2 illustrates thecapacitor module 12 and acold plate 34. Thecold plate 34 may be a solid plate or may include an internal coolant channel like the intermediatecold plate 16 shown inFIG. 1 . Thecold plate 34 may be provided in combination with thecold plate 16 or may be provided without thecold plate 16. Thecapacitor module 12 includes a plurality of metalizedfilm capacitor cells 36 arranged in two linear arrays ofcapacitor cells 36. Thecapacitor cells 36 are supported by acopper base plate 38. Thecopper base plate 38 could alternatively be made of a different metal, if desired. Thebase plate 38 forms part of ahousing 40 in combination with a plurality ofplastic sidewalls 42 shown in phantom lines. Thehousing 40 is supported on thecold plate 34. - Referring to
FIGS. 3 and 4 , thecapacitor module 12 is shown to include a P-busbar 46 with thecapacitor cells 38 shown inFIG. 4 and omitted fromFIG. 3 for better visibility. The P-busbar 46 includes alower portion 48 and anupper portion 50 that are connected by an intermediate portion 52 (or linking portion). The P-end 54 of eachcapacitor cell 38 is in contact with thelower portion 48 of the P-busbar 46 or theupper portion 50 of the P-busbar 46. Theintermediate portion 52 extends between afirst cell array 56 and an adjacentsecond cell array 58 and electrically connects thelower portion 48 and theupper portion 50. As shown inFIG. 4 , afirst cell array 56 has a P-end 54 in contact with theupper portion 50 of the P-busbar 46 and asecond cell array 58 has a P-end 54 in contact with thelower portion 48 of the P-busbar 46. - Referring to
FIGS. 5 and 6 , thecapacitor module 12 is shown to include an N-busbar 60 with thecapacitor cells 38 shown inFIG. 6 and omitted fromFIG. 5 . The N-busbar 60 includes alower portion 62 and anupper portion 64 that are connected by an intermediate portion 66 (or linking portion). The N-end 68 of eachcapacitor cell 38 is in contact with thelower portion 62 of the N-busbar 60 or theupper portion 64 of the N-busbar 60. Theintermediate portion 66 extends between afirst cell array 56 and an adjacentsecond cell array 58 and electrically connects thelower portion 62 and theupper portion 64. As shown inFIG. 6 , afirst cell array 56 has the N-end 68 in contact with theupper portion 64 of the N-busbar 60 and asecond cell array 58 has an N-end 68 in contact the with thelower portion 62 of the N-busbar 60. - Referring to
FIG. 7 , thecapacitor module 12 is shown with the P-busbar 46 and the N-busbar 60 assembled to thebase plate 40 with thecapacitor cells 38 between the respectiveupper portions lower portions busbars terminal 70 and an N-terminal 72 are connected to the P-busbar 46 and the N-busbar 60 and are provided to connect the capacitor module to thepower module 14. As shown inFIG. 8 , theterminals capacitor cells 38 close to the lowercold plate 34 and the power module 14 (shown inFIG. 1 ). Heat from thepower module 14 and thecapacitor module 12 is transferred from theterminals cold plate 34. - Referring to
FIG. 8 , three thermal paths for cooling thecapacitor cells 38 are shown diagrammatically. In the first thermal path, heat is conducted upwardly from thecapacitor cells 38, through one of thebusbars potting material 74 and to ambient air above thecapacitor module 12. In the second thermal path, heat is conducted downwardly from thecapacitor cells 38, in sequence through thebase plate 40, thethermal interface material 36, the lowercold plate 34 to ambient. In the third thermal path heat received from thepower module 14 through theterminals busbar 46 and N-busbar 60. - Referring to
FIG. 9 , an alternative embodiment of acapacitor module 80 includes 3 linear arrays ofcapacitor cells 38. The same reference numerals used with reference to the embodiment ofFIGS. 1-8 are used to identify similar parts of the embodiment ofFIGS. 9-11 . Thecapacitor module 80 includes a P-busbar 82. The P-busbar 82 includes twolower portions 84 and anupper portion 86 that are connected by anintermediate portion 88. The P-end 90 of eachcapacitor cell 38 is in contact with thelower portion 84 of the P-busbar 82 or theupper portion 86 of the P-busbar 82. A P-terminal 94 is provided on theupper portion 86 of thebusbar 82. - Referring to
FIG. 10 , the alternative embodiment of acapacitor module 80 includes an N-busbar 96. The N-busbar 96 includes alower portion 98 and twoupper portions 100 that are connected by anintermediate portion 102. The N-end 104 of eachcapacitor cell 38 is in contact with thelower portion 98 of the N-busbar 96 or theupper portion 100 of the N-busbar 96. An N-terminal 106 is provided on theupper portion 100 of the N-busbar 96. - Referring to
FIG. 11 , thecapacitor module 80 is shown with the P-busbar 82, the N-busbar 96 and three linear arrays ofcapacitor cells 38 installed in thehousing 108 that is shown with some of thesidewalls 110 in phantom and thebase wall 112 supporting thecapacitor cells 38. The P-terminal 94 and N-terminal 106 extend outwardly from an upper area of thehousing 108. While three linear arrays ofcapacitor cells 38 are shown inFIGS. 9-11 , it should be understood that any number of linear arrays may be provided depending upon the desired number ofcapacitor cells 38. - The words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the disclosure and claims. As previously described, the features of various embodiments may be combined to form further embodiments that may not be explicitly described or illustrated. While various embodiments may have been described as providing advantages or being preferred over other embodiments or prior art implementations with respect to one or more desired characteristics, those of ordinary skill in the art recognize that one or more features or characteristics may be compromised to achieve desired overall system attributes, which depend on the specific application and implementation. These attributes include, but are not limited to cost, strength, durability, life cycle cost, marketability, appearance, packaging, size, serviceability, weight, manufacturability, ease of assembly, etc. As such, embodiments described as less desirable than other embodiments or prior art implementations with respect to one or more characteristics are not outside the scope of the disclosure and may be desirable for particular applications.
Claims (20)
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US16/283,626 US10765042B1 (en) | 2019-02-22 | 2019-02-22 | Integrated power module and capacitor module thermal and packaging design |
DE102020104549.2A DE102020104549A1 (en) | 2019-02-22 | 2020-02-20 | THERMAL AND PACKAGING DESIGN FOR AN INTEGRATED POWER AND CAPACITOR MODULE |
CN202010104292.9A CN111613439A (en) | 2019-02-22 | 2020-02-20 | Thermal packaging design for integrated power and capacitor modules |
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US16/283,626 US10765042B1 (en) | 2019-02-22 | 2019-02-22 | Integrated power module and capacitor module thermal and packaging design |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD942392S1 (en) * | 2020-04-30 | 2022-02-01 | Thermo King Corporation | High power module for controller of transport climate control system |
CN114255996A (en) * | 2021-12-22 | 2022-03-29 | 北京国家新能源汽车技术创新中心有限公司 | Novel high-voltage ceramic bus supporting capacitor for automobile inverter |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102021104389A1 (en) | 2021-02-24 | 2022-07-07 | Semikron Elektronik Gmbh & Co. Kg | condenser device |
KR20220145653A (en) * | 2021-04-22 | 2022-10-31 | 현대자동차주식회사 | Inverter |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040062006A1 (en) * | 2002-09-27 | 2004-04-01 | Pfeifer David W. | Laminated bus bar for use with a power conversion configuration |
US20050126184A1 (en) * | 2003-12-12 | 2005-06-16 | Cauchy Matt J. | Thermoelectric heat pump with direct cold sink support |
US7299639B2 (en) * | 2004-06-22 | 2007-11-27 | Intel Corporation | Thermoelectric module |
US20080013253A1 (en) * | 2005-09-02 | 2008-01-17 | Maxwell Technologies, Inc. | Expandable enclosure for energy storage devices |
US20100134983A1 (en) * | 2007-06-28 | 2010-06-03 | Karsten Rechenberg | Electric memory module with cooling bodies |
US7965510B2 (en) * | 2008-07-29 | 2011-06-21 | Hitachi, Ltd. | Power conversion apparatus and power module |
US20120019970A1 (en) * | 2010-07-20 | 2012-01-26 | Kabushiki Kaisha Yaskawa Denki | Matrix converter |
US20180233285A1 (en) * | 2015-11-10 | 2018-08-16 | Panasonic Intellectual Property Management Co., Ltd. | Film capacitor |
US20190080850A1 (en) * | 2016-05-25 | 2019-03-14 | Panasonic Intellectual Property Management Co., Ltd. | Capacitor |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103782670B (en) | 2011-05-05 | 2017-05-31 | 克里恩威孚科技公司 | For the system and method for cooling power electronic device |
-
2019
- 2019-02-22 US US16/283,626 patent/US10765042B1/en active Active
-
2020
- 2020-02-20 DE DE102020104549.2A patent/DE102020104549A1/en active Pending
- 2020-02-20 CN CN202010104292.9A patent/CN111613439A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040062006A1 (en) * | 2002-09-27 | 2004-04-01 | Pfeifer David W. | Laminated bus bar for use with a power conversion configuration |
US20050126184A1 (en) * | 2003-12-12 | 2005-06-16 | Cauchy Matt J. | Thermoelectric heat pump with direct cold sink support |
US7299639B2 (en) * | 2004-06-22 | 2007-11-27 | Intel Corporation | Thermoelectric module |
US20080013253A1 (en) * | 2005-09-02 | 2008-01-17 | Maxwell Technologies, Inc. | Expandable enclosure for energy storage devices |
US20100134983A1 (en) * | 2007-06-28 | 2010-06-03 | Karsten Rechenberg | Electric memory module with cooling bodies |
US7965510B2 (en) * | 2008-07-29 | 2011-06-21 | Hitachi, Ltd. | Power conversion apparatus and power module |
US20120019970A1 (en) * | 2010-07-20 | 2012-01-26 | Kabushiki Kaisha Yaskawa Denki | Matrix converter |
US20180233285A1 (en) * | 2015-11-10 | 2018-08-16 | Panasonic Intellectual Property Management Co., Ltd. | Film capacitor |
US20190080850A1 (en) * | 2016-05-25 | 2019-03-14 | Panasonic Intellectual Property Management Co., Ltd. | Capacitor |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD942392S1 (en) * | 2020-04-30 | 2022-02-01 | Thermo King Corporation | High power module for controller of transport climate control system |
CN114255996A (en) * | 2021-12-22 | 2022-03-29 | 北京国家新能源汽车技术创新中心有限公司 | Novel high-voltage ceramic bus supporting capacitor for automobile inverter |
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US10765042B1 (en) | 2020-09-01 |
DE102020104549A1 (en) | 2020-08-27 |
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