US20200273722A1 - Semiconductor package structure and method for manufacturing the same - Google Patents
Semiconductor package structure and method for manufacturing the same Download PDFInfo
- Publication number
- US20200273722A1 US20200273722A1 US16/870,738 US202016870738A US2020273722A1 US 20200273722 A1 US20200273722 A1 US 20200273722A1 US 202016870738 A US202016870738 A US 202016870738A US 2020273722 A1 US2020273722 A1 US 2020273722A1
- Authority
- US
- United States
- Prior art keywords
- layer
- insulating layer
- layered circuit
- circuit structure
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
- H01L2223/6655—Matching arrangements, e.g. arrangement of inductive and capacitive components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/1601—Structure
- H01L2224/16012—Structure relative to the bonding area, e.g. bond pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
- H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81395—Bonding interfaces outside the semiconductor or solid-state body having an external coating, e.g. protective bond-through coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81399—Material
- H01L2224/814—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/81438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/81444—Gold [Au] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81399—Material
- H01L2224/814—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/81463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/81464—Palladium [Pd] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/142—HF devices
- H01L2924/1421—RF devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
- H01L2924/35121—Peeling or delaminating
Definitions
- the present disclosure relates to a semiconductor package structure and a manufacturing method, and to a semiconductor package structure having a multi-layered circuit structure disposed on a first conductive layer, and a method for manufacturing the semiconductor package structure.
- a redistribution layer (RDL) structure can be used to couple with the RF chip. Due to impedance matching concerns, such an RDL structure can be designed with a structure having five passivation layers and five metal layers (5P5M). A manufacturing process for a structure having one passivation layer and one metal layer (1P1M) can take about 10 days, and thus the manufacturing process for 5P5M structure can have a total manufacturing time of about 60 days. Thus, the manufacturing cost may be high. Further, such a 5P5M structure has a great thickness, which may readily cause warpage and/or delamination issues.
- a semiconductor package structure includes a first insulating layer, a first conductive layer, a multi-layered circuit structure, a protection layer, and a semiconductor chip.
- the first insulating layer has an upper surface and a lower surface, and defines a first through hole extending through the first insulating layer.
- the first conductive layer has an upper surface, and includes a conductive pad disposed in the first through hole and a trace disposed on the upper surface of the first insulating layer.
- the multi-layered circuit structure is disposed on the upper surface of the first conductive layer.
- the multi-layered circuit structure includes a bonding region disposed on the conductive pad of the first conductive layer and an extending region disposed on the trace of the first conductive layer.
- the protection layer covers the upper surface of the first insulating layer and the extending region of the multi-layered circuit structure, and exposes the bonding region of the multi-layered circuit structure.
- the semiconductor chip is electrically connected to the multi-layered circuit structure.
- a method for manufacturing a semiconductor package structure includes (a) forming a first insulating layer and a first conductive layer, wherein the first insulating layer has an upper surface and defines a first through hole, and the first conductive layer has an upper surface and includes a conductive pad disposed in the first through hole and a trace extending on the upper surface of the first insulating layer; (b) forming a multi-layered circuit structure on the upper surface of the first conductive layer; (c) forming a protection layer covering the first insulating layer and the multi-layered circuit structure, and exposing a portion of the multi-layered circuit structure; and (d) bonding a semiconductor chip to the exposed portion of the multi-layered circuit structure.
- FIG. 1 illustrates a cross-sectional view of an example of a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 2 illustrates a cross-sectional view of an example of a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 3 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 4 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 5 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 6 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 7 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 8 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 9 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 10 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 11 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 12 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 13 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 14 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 15 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 16 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 17 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 18 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 19 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 20 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- FIG. 21 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- first and second features are formed or disposed in direct contact
- additional features may be formed or disposed between the first and second features, such that the first and second features may not be in direct contact
- present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- an RDL structure can be used to couple with the RF chip. Due to impedance matching concerns, such an RDL structure can be designed with a 5P5M structure.
- a comparative manufacturing process of such a 5P5M structure includes providing a carrier having a seed layer (or a release metal film) disposed thereon, forming a first passivation layer (P1) with a first through hole on the seed layer, forming a first metal layer (M1) on the P1 and in the first through hole, forming a second passivation layer (P2) with a second through hole on the P1 and covering the M1, forming a second metal layer (M2) on the P2 and in the second through hole to electrically connect the M1, and then sequentially forming a third passivation layer (P3), a third metal layer (M3), a fourth passivation layer (P4), a fourth metal layer (M4), a fifth passivation layer (P5) and a fifth metal layer (M5) in a similar manner
- the M5 is an under bump metallization (UBM) for external connections.
- UBM under bump metallization
- the maximum width of the M5 is slightly greater than the maximum width of the fourth through hole of the P4.
- An area of the M5 from a top view is slightly greater than an area of the fourth through hole from a top view.
- a ratio of the width of the portion of the M5 disposed on the top surface of the P4 to the maximum width of the fourth through hole of the P4 may be about 1 ⁇ 2 or more, or about 1 ⁇ 3 or more.
- An area of the M5 from a top view is much less than an area of the M4 from a top view.
- a ratio of the area of the M5 from a top view to the area of the M4 from a top view may be about 1 ⁇ 2 or less, about 1 ⁇ 5 or less, or about 1/10 or less.
- each of the five metal layers may be formed with a distinct patterned photoresist corresponding to the layout thereof, and thus the manufacturing process of such 5P5M structure uses five different photomasks.
- the P1, P2, P3, P4 and P5 do not completely cover the seed layer (or the release metal film).
- the P1 may define a first gap to expose the seed layer (or the release metal film). The position of the first gap may correspond to a saw street.
- the P2 may define a second gap above the first gap, and a width of the second gap is greater than a width of the first gap.
- the P3 may define a third gap above the second gap, and a width of the third gap is greater than a width of the second gap.
- the P4 may define a fourth gap above the third gap, and a width of the fourth gap is greater than a width of the third gap.
- the P5 may define a fifth gap above the fourth gap, and a width of the fifth gap is greater than a width of the fourth gap.
- the present disclosure addresses at least the above concerns and provides for an improved semiconductor package structure, and improved techniques for manufacturing the semiconductor package structure.
- a multi-layered circuit structure is disposed on a first conductive layer directly to form a conductive metal layer.
- the cost of the manufacturing process is reduced.
- FIG. 1 illustrates a cross-sectional view of a semiconductor package structure 1 according to some embodiments of the present disclosure.
- the semiconductor package structure 1 includes a first insulating layer 2 , a first conductive layer 20 , a multi-layered circuit structure 3 , a protection layer 4 , a semiconductor chip 5 , an encapsulant 14 , a second insulating layer 6 , a second conductive layer 60 , a third insulating layer 7 , a third conductive layer 70 , a fourth insulating layer 8 , a fourth conductive layer 80 , and a pre-solder 16 .
- the first insulating layer 2 has an upper surface 21 , a lower surface 22 opposite the upper surface 21 , and a side surface 23 extending between the upper surface 21 and the lower surface 22 .
- the first insulating layer 2 defines a first through hole 24 extending through the first insulating layer 2 .
- a material of the first insulating layer 2 may include an insulating material, a passivation material, a dielectric material or a solder resist material, such as, for example, a benzocyclobutene (BCB) based polymer or a polyimide (PI).
- the first insulating layer 2 may include a cured photoimageable dielectric (PID) material, such as an epoxy or a PI including photoinitiators.
- the first conductive layer 20 is disposed on the upper surface 21 of the first insulating layer 2 and in the first through hole 24 of the first insulating layer 2 .
- the first conductive layer 20 has an upper surface 201 , a lower surface 202 opposite the upper surface 201 , and a peripheral wall 208 extending between the upper surface 201 and the lower surface 202 .
- the lower surface 202 of the first conductive layer 20 is disposed on the upper surface 21 of the first insulating layer 2 .
- the first conductive layer 20 includes a conductive pad 204 and a trace 206 .
- the conductive pad 204 of the first conductive layer 20 is disposed in the first through hole 24 of the first insulating layer 2 .
- the trace 206 is disposed on the upper surface 21 of the first insulating layer 2 .
- the conductive pad 204 and the trace 206 may be integrally formed as a monolithic structure.
- a material of the first conductive layer 20 may include, for example, copper, another conductive metal, or an alloy thereof.
- the first conductive layer 20 may be a single layer, and a seed layer (e.g., titanium and/or copper, another metal, or an alloy) may be interposed between the first conductive layer 20 and the first insulating layer 2 .
- the first conductive layer 20 may include a metal layer (e.g., a copper layer) and a seed layer.
- the multi-layered circuit structure 3 is disposed on the upper surface 201 of the first conductive layer 20 .
- the multi-layered circuit structure 3 includes a bonding region 34 and an extending region 36 .
- the bonding region 34 is disposed on the conductive pad 204 of the first conductive layer 20
- the extending region 36 is disposed on the trace 206 of the conductive layer 20 .
- each layer of the multi-layered circuit structure 3 within the bonding region 34 and within the extending region 36 may be integrally formed as a monolithic structure.
- the bonding region 34 may be used as a UBM for electrical connections, such as connection with the semiconductor 5 . As shown in FIG.
- a length “L” of the extending region 36 is greater than a maximum width “W” of the bonding region 34 (e.g. by a factor of about 1.1 or more, about 1.2 or more, or about 1.3 or more).
- the multi-layered circuit structure 3 has a peripheral wall 38 which aligns with (e.g. is continuous with) the peripheral wall 208 of the first conductive layer 20 .
- the multi-layered circuit structure 3 may cover (e.g. substantially completely cover) the upper surface 201 of the first conductive layer 20 .
- a layout of the multi-layered circuit structure 3 may be the same as, or similar to, the layout of the first conductive layer 20 .
- the first conductive layer 20 and the multi-layered circuit structure 3 may be formed by using a same photomask and/or a same photoresist.
- the multi-layered circuit structure 3 may be sputtered or plated on the upper surface 201 of the first conductive layer 20 , and the multi-layered circuit structure 3 may be conformal with the first conductive layer 20 .
- the multi-layered circuit structure 3 may include a barrier layer and/or a wetting layer.
- the multi-layered circuit structure 3 includes a first layer 31 , a second layer 32 and a third layer 33 .
- the first layer 31 may be a barrier layer disposed on the upper surface 201 of the first conductive layer 20 , and may be formed by sputtering.
- a material of the first layer 31 includes, for example, nickel.
- the second layer 32 and the third layer 33 may be wetting layers sequentially disposed on the first layer 31 , and may be formed by sputtering. Materials of the second layer 32 and the third layer 33 include, for example, palladium and/or gold.
- the layouts of the first layer 31 , the second layer 32 and the third layer 33 may be the same as, or similar to, the layout of the first conductive layer 20 .
- warpage of the semiconductor package structure 1 corresponding to the conductive layers can be balanced.
- the protection layer 4 covers the upper surface 21 of the first insulating layer 2 and the extending region 36 of the multi-layered circuit structure 3 .
- the protection layer 4 defines at least one through hole 44 to expose the bonding region 34 of the multi-layered circuit structure 3 .
- a width “W” of the through hole 44 is substantially equal to the maximum width “W” of the bonding region 34 of the multi-layered circuit structure 3 .
- the protection layer 4 has an upper surface 41 , a lower surface 42 opposite the upper surface 41 , and a side surface 43 extending between the upper surface 41 and the lower surface 42 .
- the lower surface 42 is disposed on the upper surface 21 of the first insulating layer 2 .
- the side surface 23 of the first insulating layer 2 is not coplanar with the side surface 43 of the protection layer 4 .
- the protection layer 4 covers the peripheral wall 208 of the first conductive layer 20 and the peripheral wall 38 of the multi-layered circuit structure 3 .
- a material of the protection layer 4 may be the same as, or similar to,
- the semiconductor chip 5 is electrically connected to the multi-layered circuit structure 3 .
- At least one solder bump 54 connects the semiconductor chip 5 and the multi-layered circuit structure 3 .
- the semiconductor 5 includes at least one bump pad 53
- the solder bump 54 is disposed on the bonding region 34 of the multi-layered circuit structure 3 and connects to the bump pad 53 of the semiconductor chip 5 .
- the encapsulant 14 which can be, for example, a molding compound, is disposed on the protection layer 4 and encapsulates and covers the semiconductor chip 5 and the solder bump 54 .
- the encapsulant 14 has a side surface 143 , and the side surface 143 is not coplanar with the side surface 43 of the protection layer 4 or the side surface 23 of the first insulating layer 2 . In some embodiments, as shown in FIG. 1 , the encapsulant 14 covers the side surface 23 of the first insulating layer 2 and the side surface 43 of the protection layer 4 .
- the second insulating layer 6 and the second conductive layer 60 are disposed adjacent the lower surface 22 of the first insulating layer 2 .
- the second insulating layer 6 has an upper surface 61 , a lower surface 62 opposite the upper surface 61 , and a side surface 63 extending between the upper surface 61 and the lower surface 62 .
- the upper surface 61 of the second insulating layer 6 is disposed on the lower surface 22 of the first insulating layer 2 .
- the side surface 63 of the second insulating layer 6 is not coplanar with the side surface 23 of the first insulating layer 2 .
- the side surface 63 of the second insulating layer 6 is not coplanar with the side surface 43 of the protection layer 4 .
- the side surface 63 of the second insulating layer 6 is substantially coplanar with the side surface 143 of the encapsulant 14 .
- the second insulating layer 6 defines a second through hole 64 extending through the second insulating layer 6 .
- a material of the second insulating layer 6 may be the same as, or similar to, the material of the first insulating layer 2 .
- the second conductive layer 60 is disposed on the upper surface 61 of the second insulating layer 6 and embedded in or covered by the first insulating layer 2 .
- the second conductive layer 60 extends into the second through hole 64 of the second insulating layer 6 to form a second conductive via 604 . That is, the second conductive via 604 of the second conductive layer 60 extends through the second insulating layer 6 .
- a portion of the extending region 36 of the multi-layered circuit structure 3 is disposed directly above the second conductive via 604 of the second conductive layer 60 .
- the first conductive layer 20 is electrically connected to the second conductive layer 60 through a first conductive via 39 including at least a portion of the bonding region 34 of the multi-layered circuit structure 3 and at least a portion of the conductive pad 204 of the first conductive layer 20 in the first through hole 24 of the first insulating layer 2 .
- an area of the multi-layered circuit structure 3 from a top view is in a range of about 0.5 times to about 1.5 times, about 0.7 times to about 1.3 times, about 0.9 times to about 1.1 times, or about 0.95 times to about 1.05 times as large as an area of the second conductive layer 60 from a top view.
- a material of the second conductive layer 60 may be the same as, or similar to, the material of the first conductive layer 20 .
- a sum of a cross-sectional area of the multi-layered circuit structure 3 and a cross-sectional area of the first conductive layer 20 is in a range of about 0.5 times to about 1.5 times, about 0.7 times to about 1.3 times, about 0.9 times to about 1.1 times, or about 0.95 times to about 1.05 times as large as a cross-sectional area of the second conductive layer 60 .
- the third insulating layer 7 and the fourth insulating layer 8 are sequentially disposed on the second insulating layer 6 .
- the third insulating layer 7 has an upper surface 71 , a lower surface 72 opposite the upper surface 71 , and a side surface 73 extending between the upper surface 71 and the lower surface 72 .
- the upper surface 71 of the third insulating layer 7 is disposed on the lower surface 62 of the second insulating layer 6 .
- the side surface 63 of the second insulating layer 6 and the side surface 73 of the third insulating layer 7 are substantially coplanar.
- the third insulating layer 7 defines a third through hole 74 extending through the third insulating layer 7 .
- a material of the third insulating layer 7 may be the same as, or similar to, the material of the first insulating layer 2 .
- the third conductive layer 70 is disposed on the upper surface 71 of the third insulating layer 7 , and embedded in or covered by the second insulating layer 6 .
- the third conductive layer 70 extends into the third through hole 74 of the third insulating layer 7 to form a third conductive via 704 .
- the third conductive via 704 of the third conductive layer 70 extends through the third insulating layer 7 .
- the third conductive layer 70 is electrically connected to the second conductive layer 60 through the second conductive via 604 of the second conductive layer 60 .
- a material of the third conductive layer 70 may be the same as, similar to, the material of the first conductive layer 20 .
- the fourth insulating layer 8 has an upper surface 81 , a lower surface 82 opposite the upper surface 81 , and a side surface 83 extending between the upper surface 81 and the lower surface 82 .
- the upper surface 81 of the fourth insulating layer 8 is disposed on the lower surface 72 of the third insulating layer 7 .
- the side surface 73 of the third insulating layer 7 and the side surface 83 of the fourth insulating layer 8 are substantially coplanar.
- the fourth insulating layer 8 defines a fourth through hole 84 extending through the fourth insulating layer 8 .
- a material of the fourth insulating layer 8 may be the same as, or similar to, the material of the first insulating layer 2 .
- the fourth conductive layer 80 is disposed on the upper surface 81 of the fourth insulating layer 8 , and embedded in or covered by the third insulating layer 7 .
- the fourth conductive layer 80 extends into the fourth through hole 84 of the fourth insulating layer 8 to form a fourth conductive via 804 .
- the fourth conductive via 804 of the fourth conductive layer 80 extends through the fourth insulating layer 8 .
- the fourth conductive layer 80 is electrically connected to the third conductive layer 70 through the third conductive via 704 of the third conductive layer 70 .
- a material of the fourth conductive layer 80 may be the same as, or similar to, the material of the first conductive layer 20 .
- a thickness of the second conductive layer 60 , a thickness of the third conductive layer 70 and a thickness of the fourth conductive layer 80 may be substantially equal to each other, while a thickness of the first conductive layer 20 may be less than the thickness of the second conductive layer 60 , the thickness of the third conductive layer 70 and/or the thickness of the fourth conductive layer 80 .
- a ratio of the thickness of the first conductive layer 20 to the thickness of the second conductive layer 60 may be about 2 ⁇ 3 or less, about 1 ⁇ 2 or less, or about 1 ⁇ 3 or less.
- the pre-solder 16 is disposed on a side of the fourth conductive via 804 adjacent to the second surface 82 of the fourth insulating layer 8 for external connections.
- the semiconductor package structure 1 since the multi-layered circuit structure 3 is directly disposed on the first conductive layer 20 (and may not be disposed on the first conductive layer 20 via another conductive metal layer), the semiconductor package structure 1 includes four conductive metal layers rather than five conductive metal layers. Thus, a metal layer can be omitted, and a formation time of the semiconductor package structure 1 can be reduced, and the manufacturing cost can be reduced. In addition, a total thickness of the semiconductor package structure 1 can be reduced. Besides, the multi-layered circuit structure 3 and the first conductive layer 20 can be formed by using a same photomask and/or a same photoresist, and thus the manufacturing cost of the semiconductor package structure 1 can be reduced.
- FIG. 2 illustrates a cross-sectional view of a semiconductor package structure 1 a according to some embodiments of the present disclosure.
- the semiconductor package structure 1 a is similar to the semiconductor package structure 1 shown in FIG. 1 , except that the semiconductor package structure 1 a shown in FIG. 2 includes a second insulating layer 6 a , a third insulating layer 7 a and a fourth insulating layer 8 a instead of the second insulating layer 6 , the third insulating layer 7 and the fourth insulating layer 8 of the semiconductor package structure 1 shown in FIG. 1 .
- the second insulating layer 6 a , the third insulating layer 7 a and the fourth insulating layer 8 a are similar to the second insulating layer 6 , the third insulating layer 7 and the fourth insulating layer 8 of the semiconductor package structure 1 shown in FIG. 1 .
- a side surface 63 a of the second insulating layer 6 a and a side surface 83 a of the fourth insulating layer 8 a are substantially coplanar, and the second insulating layer 6 a covers a side surface 73 a of the third insulating layer 7 a.
- FIG. 3 through FIG. 20 illustrate a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- the method is for manufacturing a semiconductor package structure such as the semiconductor package structure 1 shown in FIG. 1 .
- a carrier 90 is provided.
- the carrier 90 may include a release film disposed thereon, such as a release metal film.
- a seed layer 91 is formed on the carrier 90 .
- a fourth insulating layer 8 is formed on the seed layer 90 .
- the fourth insulating layer 8 may cover the seed layer 91 to avoid undesired etching of the seed layer 91 before the carrier 90 is removed.
- the fourth insulating layer 8 has an upper surface 81 and a lower surface 82 opposite the upper surface 81 .
- the lower surface 82 of the fourth insulating layer 8 is disposed on the carrier 90 .
- the fourth insulating layer 8 defines at least one fourth through hole 84 to expose a portion of the seed layer 91 .
- the fourth through hole 84 is used for receiving a fourth conductive via 804 (shown in FIG. 6 ).
- a material of the fourth insulating layer 8 may include an insulating material, a passivation material, a dielectric material or a solder resist material, such as, for example, a BCB based polymer or a PI.
- the fourth insulating layer 8 may include a cured PID material, such as an epoxy or a PI including photoinitiators.
- a first photoresist layer 92 a is disposed on the fourth insulating layer 8 . Then, the first photoresist layer 92 a is exposed to a pattern of intense light. For example, a first photomask 94 a is disposed adjacent to the first photoresist layer 92 a , so as to cover a portion of the first photoresist layer 92 a . Then, the first photoresist layer 92 a is exposed to a radiation source 96 .
- the first photoresist layer 92 a is then developed by a developer. That is, the first photoresist layer 92 a is patterned to define a plurality of openings 921 a to expose portions of the fourth insulating layer 8 , including the fourth through hole 84 of the fourth insulating layer 8 .
- a fourth conductive layer 80 is formed in the openings 921 a of the first photoresist layer 92 a and on the fourth insulating layer 8 .
- the fourth conductive layer 80 is disposed on the upper surface 81 of the fourth insulating layer 8 .
- the fourth conductive layer 80 extends into the fourth through hole 84 of the fourth insulating layer 8 to form a fourth conductive via 804 .
- the fourth conductive via 804 of the fourth conductive layer 80 extends through the fourth insulating layer 8 .
- a material of the fourth conductive layer 80 may include, for example, copper, another conductive metal, or an alloy thereof.
- the fourth conductive layer 80 may be a single layer, and a seed layer (e.g., titanium and/or copper, another metal, or an alloy) may be interposed between the fourth conductive layer 80 and the fourth insulating layer 8 .
- the fourth conductive layer 80 may include a metal layer (e.g., a copper layer) and a seed layer.
- the first photoresist layer 92 a is removed, and a third insulating layer 7 is formed on and covers the fourth insulating layer 8 and the fourth conductive layer 80 .
- the third insulating layer 7 has an upper surface 71 and a lower surface 72 opposite the upper surface 71 .
- the lower surface 72 of the third insulating layer 7 is disposed on the upper surface 81 of the fourth insulating layer 8 .
- the third insulating layer 7 defines a third through hole 74 extending through the third insulating layer 7 .
- the third through hole 74 may expose a portion of the fourth conductive layer 80 .
- the third insulating layer 7 further has a lateral surface 75 defining a gap 76 to expose a portion of the fourth insulating layer 8 .
- the position of the gap 76 corresponds to the position of the saw street 98 (as shown in FIG. 12 ).
- a material of the third insulating layer 7 may be the same as, or similar to, the material of the fourth insulating layer 8 .
- a third conductive layer 70 is formed on the third insulating layer 7 .
- the third conductive layer 70 is disposed on the upper surface 71 of the third insulating layer 7 .
- the third conductive layer 70 extends into the third through hole 74 of the third insulating layer 7 to form a third conductive via 704 .
- the third conductive via 704 of the third conductive layer 70 extends through the third insulating layer 7 .
- the third conductive layer 70 is electrically connected to the fourth conductive layer 80 through the third conductive via 704 .
- a material of the third conductive layer 70 may be the same as, or similar to, the material of the fourth conductive layer 80 .
- a second insulating layer 6 is formed on and covers the third insulating layer 7 and the second conductive layer 70 .
- a portion of the second insulating layer 6 extends into and fills the gap 76 of the third insulating layer 7 .
- the second insulating layer 6 has an upper surface 61 and a lower surface 62 opposite the upper surface 61 .
- the lower surface 62 of the second insulating layer 6 is disposed on the upper surface 71 of the third insulating layer 7 .
- the second insulating layer 6 defines a second through hole 64 extending through the second insulating layer 6 to expose a portion of the third conductive layer 70 .
- a material of the second insulating layer 6 may be the same as, or similar to, the material of the fourth insulating layer 8 .
- a second conductive layer 60 is formed on the second insulating layer 6 .
- the second conductive layer 60 is disposed on the upper surface 61 of the second insulating layer 6 .
- the second conductive layer 60 extends into the second through hole 64 of the second insulating layer 6 to form a second conductive via 604 . That is, the second conductive via 604 of the second conductive layer 60 extends through the second insulating layer 6 .
- the second conductive layer 60 is electrically connected to the third conductive layer 70 through the second conductive via 604 .
- a material of the second conductive layer 60 may be the same as, or similar to, the material of the fourth conductive layer 80 .
- a first insulating layer 2 is formed on and covers the second insulating layer 6 and the second conductive layer 60 .
- the first insulating layer 2 has an upper surface 21 , a lower surface 22 opposite the upper surface 21 , and a side surface 23 extending between the upper surface 21 and the lower surface 22 .
- Two adjacent side surfaces 23 may define a gap 25 corresponding to the gap 76 of the third insulating layer 7 .
- the gap 25 may extend through the first insulating layer 2 to expose the second insulating layer 6 , and is disposed directly above the gap 76 of the third insulating layer 7 .
- the first insulating layer 2 further defines a first through hole 24 extending through the first insulating layer 2 to expose a portion of the second conductive layer 60 .
- a second photoresist layer 92 b is disposed on the first insulating layer 2 . Then, the second photoresist layer 92 b is exposed to a pattern of intense light. For example, a second photomask 94 b is disposed adjacent to the second photoresist layer 92 b , so as to cover a portion of the second photoresist layer 92 b . Then, the second photoresist layer 92 b is exposed to a radiation source 96 .
- the second photoresist layer 92 b is then developed by a developer. That is, the second photoresist layer 92 b is patterned to define a plurality of openings 921 b to expose portions of the first insulating layer 2 .
- a first conductive layer 20 is formed in the openings 921 b of the second photoresist layer 92 b and on the first insulating layer 2 .
- the first conductive layer 20 is disposed on the upper surface 21 of the first insulating layer 2 and in the first through hole 24 of the first insulating layer 2 .
- the first conductive layer 20 has an upper surface 201 , a lower surface 202 opposite the upper surface 201 , and a peripheral wall 208 extending between the upper surface 201 and the lower surface 202 .
- the lower surface 202 of the first conductive layer 20 is disposed on the upper surface 21 of the first insulating layer 2 .
- the first conductive layer 20 includes a conductive pad 204 and a trace 206 .
- the conductive pad 204 of the first conductive layer 20 is disposed in the first through hole 24 of the first insulating layer 2 .
- the trace 206 extends on the upper surface 21 of the first insulating layer 2 .
- a material of the first conductive 20 layer may be the same as, or similar to, the material of the fourth conductive layer 80 .
- a thickness of the second conductive layer 60 , a thickness of the third conductive layer 70 and a thickness of the fourth conductive layer 80 may be substantially the same as each other, while a thickness of the first conductive layer 20 may be less than the thickness of the second conductive layer 60 , the thickness of the third conductive layer 70 and/or the thickness of the fourth conductive layer 80 .
- a ratio of the thickness of the first conductive layer 20 to the thickness of the second conductive layer 60 may be about 2 ⁇ 3 or less, about 1 ⁇ 2 or less, or about 1 ⁇ 3 or less.
- a multi-layered circuit structure 3 is formed in the openings 921 b of the second photoresist 92 b and on the upper surface 201 of the first conductive layer 20 .
- the multi-layered circuit structure 3 may be formed by sputtering or plating.
- the first conductive layer 20 and the multi-layered circuit structure 3 are formed using the same photoresist 92 b . That is, the first conductive layer 20 and the multi-layered circuit structure 3 are formed by using the same photomask 94 b .
- the multi-layered circuit structure 3 may be sputtered or plated on the upper surface 201 of the first conductive layer 20 , and the multi-layered circuit structure 3 may be conformal with the first conductive layer 20 .
- an area of the multi-layered circuit structure 3 from a top view is in a range of about 0.5 times to about 1.5 times, or about 0.7 times to about 1.2 times as large as an area of the second conductive layer 60 from a top view.
- the multi-layered circuit structure 3 includes a bonding region 34 and an extending region 36 .
- the bonding region 34 is disposed on the conductive pad 204 of the first conductive layer 20
- the extending region 36 is disposed on the trace 206 of the conductive layer 20 .
- the first conductive layer 20 is electrically connected to the second conductive layer 60 through a first conductive via 39 including the conductive pad 204 in the first through hole 24 of the first insulating layer 2 .
- the multi-layered circuit structure 3 has a peripheral wall 38 which aligns with (e.g. is substantially coplanar with) the peripheral wall 208 of the first conductive layer 20 .
- the multi-layered circuit structure 3 may cover the upper surface 201 of the first conductive layer 20 .
- a layout of the multi-layered circuit structure 3 may be the same as, or similar to, a layout of the first conductive layer 20 .
- the multi-layered circuit structure 3 may include a barrier layer and/or a wetting layer. For example, as shown in FIG.
- the multi-layered circuit structure 3 includes a first layer 31 , a second layer 32 and a third layer 33 sequentially disposed on the first conductive layer 20 .
- the first layer 31 may be a barrier layer disposed on the upper surface 201 of the first conductive layer 20 .
- a material of the first layer 31 includes, for example, nickel.
- the second layer 32 and the third layer 33 may be wetting layers sequentially disposed on the first layer 31 .
- Materials of the second layer 32 and the third layer 33 include, for example, palladium and/or gold.
- the layouts of the first layer 31 , the second layer 32 and the third layer 33 may be the same as, or similar to, the layout of the first conductive layer 20 .
- the multi-layered circuit structure 3 includes nickel and/or palladium
- warpage of the semiconductor package structure 1 corresponding to the conductive layers can be balanced.
- the second photoresist 92 b is removed, and a protection layer 4 is formed on the first insulating layer 2 .
- the protection layer 4 covers the first insulating layer 2 and the multi-layered circuit structure 3 , and exposes a portion of the multi-layered circuit structure 3 .
- the protection layer 4 covers the upper surface 21 of the first insulating layer 2 and the extending region 36 of the multi-layered circuit structure 3 .
- the protection layer 4 defines at least one through hole 44 to expose the bonding region 34 of the multi-layered circuit structure 3 .
- a length “L” of the extending region 36 is greater than a maximum width “W” of the bonding region 34 (e.g.
- a width “W” of the through hole 44 is substantially equal to the maximum width “W” of the bonding region 34 of the multi-layered circuit structure 3 .
- the protection layer 4 has an upper surface 41 , a lower surface 42 opposite the upper surface 41 , and a side surface 23 extending between the upper surface 41 and the lower surface 42 .
- the lower surface 42 is disposed on the upper surface 21 of the first insulating layer 2 .
- the side surface 43 of the protection layer 4 is not coplanar with the side surface 23 of the first insulating layer 2 .
- the protection layer 4 covers the peripheral wall 208 of the first conductive layer 20 and the peripheral wall 38 of the multi-layered circuit structure 3 .
- a material of the protection layer 4 may be the same as, or similar to, the material of the fourth insulating layer 8 .
- a semiconductor chip 5 is provided.
- the semiconductor chip 5 includes at least one bump pad 53 , and at least one solder bump 54 is disposed on the bump pad 53 .
- a diameter “W” of the exposed portion (e.g., the bonding region 34 ) of the multi-layered circuit structure 3 is slightly greater than a maximum diameter “D” of the solder bump 54 (e.g. by a ratio of about 1.1 or more, about 1.2 or more, or about 1.3 or more).
- the diameter “W”′ of the exposed portion (e.g., the bonding region 34 ) of the multi-layered circuit structure 3 may substantially equal to the maximum diameter “D” of the solder bump 54 .
- the semiconductor chip 5 is bonded to the exposed portion of the multi-layered circuit structure 3 .
- the semiconductor chip 5 is bonded to the bonding region 34 of the multi-layered circuit structure 3 by the solder bump 54 .
- the solder bump 54 is disposed between the bonding region 34 of the multi-layered circuit structure 3 and the bump pad 53 of the semiconductor chip 5 .
- an encapsulant 14 for example, a molding compound, is formed on the protection layer 4 , and encapsulates the semiconductor chip 5 and the solder bump 54 .
- the encapsulant 14 extends along the side surface 43 of the protection layer 4 and the side surface 23 of the first insulating layer 2 to contact the second insulating layer 6 . Accordingly, the encapsulant 14 covers the side surface 23 of the first insulating layer 2 and the side surface 43 of the protection layer 4 .
- the carrier 90 is removed.
- the seed layer 91 is removed by, for example, etching, and then a pre-solder 16 is formed on a side of the fourth conductive via 804 adjacent to the second surface 82 of the fourth insulating layer 8 for external connection.
- a singulation process is conducted to form the semiconductor package structure 1 shown in FIG. 1 .
- the encapsulant 14 , the second insulating layer 6 , the third insulating layer 7 and the fourth insulating layer 8 are cut along a saw street 98 , forming a side surface 143 of the encapsulant 14 , a side surface 63 of the second insulating layer 6 , a side surface 73 of the third insulating layer 7 and a side surface 83 of the fourth insulating layer 8 .
- a width of the saw street 98 is equal to or greater than (e.g. by a ratio of about 1.1 or more, about 1.2 or more, or about 1.3 or more) a width of the gap 76 of the third insulating layer 7 .
- a width of the saw street 98 may be less than a width of the gap 25 (the width of the saw street 98 may be about 0.9 times the width of the gap 25 or less, about 0.8 times the width of the gap 25 or less, or about 0.7 times the width of the gap 25 or less).
- the side surface 63 of the second insulating layer 6 , the side surface 73 of the third insulating layer 7 and the side surface 83 of the fourth insulating layer 8 are substantially coplanar.
- the side surface 63 of the second insulating layer 6 is substantially coplanar with the side surface 143 of the encapsulant 14 .
- the first conductive layer 20 and the multi-layered circuit structure 3 may be formed by using a same photomask (e.g., the photomask 94 b ) and/or a same photoresist (e.g., the photoresist 92 b ), a manufacturing cost of the semiconductor package structure 1 can be reduced.
- the gaps 76 may divide the third insulating layer 7 into a plurality of units, the stress of the third insulating layer 7 is discontinuous. Thus if warpage of the third insulating layer 7 occurs, the warpage may be dispersed across the units of the third insulating layer 7 . Thus, warpage of the third insulating layer 7 may be reduced (e.g.
- the second insulating layer 6 extends into and fills the gap 76 defined by the third insulating layer 7 and contacts the fourth insulating layer 8 , thus, warpage corresponding to the conductive layers (e.g., the first conductive layer 20 , the second conductive layer 60 , the third conductive layer 70 and/or the fourth conductive layer 80 ) can be balanced.
- the conductive layers e.g., the first conductive layer 20 , the second conductive layer 60 , the third conductive layer 70 and/or the fourth conductive layer 80 .
- FIG. 21 illustrates a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure.
- the method is for manufacturing a semiconductor package structure such as the semiconductor package structure 1 a shown in FIG. 2 .
- the initial stages of the illustrated process are the same as, or similar to, the stages illustrated in FIG. 3 through FIG. 19 .
- FIG. 21 depicts a stage subsequent to that depicted in FIG. 19 .
- the carrier 90 is removed.
- the seed layer 91 is removed by, for example, etching, and then a pre-solder 16 is formed on a side of the fourth conductive via 804 adjacent to the second surface 82 of the fourth insulating layer 8 for external connections.
- a singulation process is conducted to form the semiconductor package structure 1 a shown in FIG. 2 .
- the encapsulant 14 , the second insulating layer 6 , the third insulating layer 7 and the fourth insulating layer 8 are cut along a saw street 98 a , forming a side surface 143 of the encapsulant 14 , a side surface 63 a of the second insulating layer 6 a , a side surface 73 a of the third insulating layer 7 a and a side surface 83 a of the fourth insulating layer 8 a . As shown in FIG.
- a width of the saw street 98 a is less than a width of the gap 76 of the third insulating layer 7 (the width of the saw street 98 a may be about 0.9 times the width of the gap 76 or less, about 0.8 times the width of the gap 76 or less, or about 0.7 times the width of the gap 76 or less).
- the side surface 63 a of the second insulating layer 6 a and the side surface 83 a of the fourth insulating layer 8 a are substantially coplanar, and the second insulating layer 6 a covers a side surface 73 a of the third insulating layer 7 a .
- the side surface 63 a of the second insulating layer 6 a is substantially coplanar with the side surface 143 of the encapsulant 14 .
- the terms “approximately,” “substantially,” “substantial” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation.
- the terms can refer to a range of variation less than or equal to ⁇ 10% of that numerical value, such as less than or equal to ⁇ 5%, less than or equal to ⁇ 4%, less than or equal to ⁇ 3%, less than or equal to ⁇ 2%, less than or equal to ⁇ 1%, less than or equal to ⁇ 0.5%, less than or equal to ⁇ 0.1%, or less than or equal to ⁇ 0.05%.
- two numerical values can be deemed to be “substantially” the same or equal if a difference between the values is less than or equal to ⁇ 10% of an average of the values, such as less than or equal to ⁇ 5%, less than or equal to ⁇ 4%, less than or equal to ⁇ 3%, less than or equal to ⁇ 2%, less than or equal to ⁇ 1%, less than or equal to ⁇ 0.5%, less than or equal to ⁇ 0.1%, or less than or equal to ⁇ 0.05%.
- Two surfaces can be deemed to be coplanar or substantially coplanar if a displacement between the two surfaces is no greater than 5 ⁇ m, no greater than 2 ⁇ m, no greater than 1 ⁇ m, or no greater than 0.5 ⁇ m.
- conductive As used herein, the terms “conductive,” “electrically conductive” and “electrical conductivity” refer to an ability to transport an electric current. Electrically conductive materials typically indicate those materials that exhibit little or no opposition to the flow of an electric current. One measure of electrical conductivity is Siemens per meter (S/m). Typically, an electrically conductive material is one having a conductivity greater than approximately 10 4 S/m, such as at least 10 5 S/m or at least 10 6 S/m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.
Abstract
A semiconductor package structure includes a first insulating layer, a first conductive layer, a multi-layered circuit structure, a protection layer, and a semiconductor chip electrically connected to the multi-layered circuit structure. The first insulating layer defines a first through hole extending through the first insulating layer. The first conductive layer includes a conductive pad disposed in the first through hole and a trace disposed on an upper surface of the first insulating layer. The multi-layered circuit structure is disposed on an upper surface of the first conductive layer. The multi-layered circuit structure includes a bonding region disposed on the conductive pad of the first conductive layer and an extending region disposed on the trace of the first conductive layer. The protection layer covers the upper surface of the first insulating layer and the extending region of the multi-layered circuit structure, and exposes the bonding region of the multi-layered circuit structure.
Description
- This application is a continuation of U.S. patent application Ser. No. 15/870,315 filed Jan. 12, 2018, the contents of which is incorporated herein by reference in its entirety.
- The present disclosure relates to a semiconductor package structure and a manufacturing method, and to a semiconductor package structure having a multi-layered circuit structure disposed on a first conductive layer, and a method for manufacturing the semiconductor package structure.
- In a package including a radio frequency (RF) chip, a redistribution layer (RDL) structure can be used to couple with the RF chip. Due to impedance matching concerns, such an RDL structure can be designed with a structure having five passivation layers and five metal layers (5P5M). A manufacturing process for a structure having one passivation layer and one metal layer (1P1M) can take about 10 days, and thus the manufacturing process for 5P5M structure can have a total manufacturing time of about 60 days. Thus, the manufacturing cost may be high. Further, such a 5P5M structure has a great thickness, which may readily cause warpage and/or delamination issues.
- In some embodiments, a semiconductor package structure includes a first insulating layer, a first conductive layer, a multi-layered circuit structure, a protection layer, and a semiconductor chip. The first insulating layer has an upper surface and a lower surface, and defines a first through hole extending through the first insulating layer. The first conductive layer has an upper surface, and includes a conductive pad disposed in the first through hole and a trace disposed on the upper surface of the first insulating layer. The multi-layered circuit structure is disposed on the upper surface of the first conductive layer. The multi-layered circuit structure includes a bonding region disposed on the conductive pad of the first conductive layer and an extending region disposed on the trace of the first conductive layer. The protection layer covers the upper surface of the first insulating layer and the extending region of the multi-layered circuit structure, and exposes the bonding region of the multi-layered circuit structure. The semiconductor chip is electrically connected to the multi-layered circuit structure.
- In some embodiments, a method for manufacturing a semiconductor package structure includes (a) forming a first insulating layer and a first conductive layer, wherein the first insulating layer has an upper surface and defines a first through hole, and the first conductive layer has an upper surface and includes a conductive pad disposed in the first through hole and a trace extending on the upper surface of the first insulating layer; (b) forming a multi-layered circuit structure on the upper surface of the first conductive layer; (c) forming a protection layer covering the first insulating layer and the multi-layered circuit structure, and exposing a portion of the multi-layered circuit structure; and (d) bonding a semiconductor chip to the exposed portion of the multi-layered circuit structure.
- Aspects of some embodiments of the present disclosure are readily understood from the following detailed description when read with the accompanying figures. It is noted that various structures may not be drawn to scale, and dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion.
-
FIG. 1 illustrates a cross-sectional view of an example of a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 2 illustrates a cross-sectional view of an example of a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 3 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 4 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 5 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 6 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 7 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 8 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 9 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 10 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 11 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 12 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 13 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 14 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 15 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 16 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 17 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 18 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 19 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 20 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. -
FIG. 21 illustrates one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. - Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar components. Embodiments of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.
- The following disclosure provides for many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed or disposed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- In a package including an RF chip, an RDL structure can be used to couple with the RF chip. Due to impedance matching concerns, such an RDL structure can be designed with a 5P5M structure. A comparative manufacturing process of such a 5P5M structure includes providing a carrier having a seed layer (or a release metal film) disposed thereon, forming a first passivation layer (P1) with a first through hole on the seed layer, forming a first metal layer (M1) on the P1 and in the first through hole, forming a second passivation layer (P2) with a second through hole on the P1 and covering the M1, forming a second metal layer (M2) on the P2 and in the second through hole to electrically connect the M1, and then sequentially forming a third passivation layer (P3), a third metal layer (M3), a fourth passivation layer (P4), a fourth metal layer (M4), a fifth passivation layer (P5) and a fifth metal layer (M5) in a similar manner. The M5 is an under bump metallization (UBM) for external connections. It is noted that the maximum width of the M5 is slightly greater than the maximum width of the fourth through hole of the P4. An area of the M5 from a top view is slightly greater than an area of the fourth through hole from a top view. For example, a ratio of the width of the portion of the M5 disposed on the top surface of the P4 to the maximum width of the fourth through hole of the P4 may be about ½ or more, or about ⅓ or more. An area of the M5 from a top view is much less than an area of the M4 from a top view. For example, a ratio of the area of the M5 from a top view to the area of the M4 from a top view may be about ½ or less, about ⅕ or less, or about 1/10 or less.
- After formation of the 5P5M structure, at least one semiconductor chip is attached to the 5P5M structure, and an encapsulant is applied to cover the semiconductor chip and the 5P5M structure. Then, the carrier is removed, and the seed layer (or the release metal film) is removed by etching. Then, a singulation process is conducted to form a plurality of separate package structures. During the manufacturing process of such 5P5M structure, each of the five metal layers may be formed with a distinct patterned photoresist corresponding to the layout thereof, and thus the manufacturing process of such 5P5M structure uses five different photomasks. In addition, formation of a passivation layer and a metal layer can take about 10 days, and thus formation of 5P5M structure can have a total manufacture time of about 60 days. Thus, the manufacturing cost can be high. Further, such an 5P5M structure has a great thickness, which may readily cause warpage and/or delamination issues. Besides, in the comparative manufacturing process, the P1, P2, P3, P4 and P5 do not completely cover the seed layer (or the release metal film). For example, the P1 may define a first gap to expose the seed layer (or the release metal film). The position of the first gap may correspond to a saw street. Further, the P2 may define a second gap above the first gap, and a width of the second gap is greater than a width of the first gap. The P3 may define a third gap above the second gap, and a width of the third gap is greater than a width of the second gap. The P4 may define a fourth gap above the third gap, and a width of the fourth gap is greater than a width of the third gap. The P5 may define a fifth gap above the fourth gap, and a width of the fifth gap is greater than a width of the fourth gap. Hence, during the manufacturing process, undesired etching of the seed layer (or the release metal film) may occur before removal of the carrier, resulting in delamination of the P1 from the carrier before the 5P5M structure is finished.
- The present disclosure addresses at least the above concerns and provides for an improved semiconductor package structure, and improved techniques for manufacturing the semiconductor package structure. In the semiconductor package structure, a multi-layered circuit structure is disposed on a first conductive layer directly to form a conductive metal layer. Thus, the cost of the manufacturing process is reduced.
-
FIG. 1 illustrates a cross-sectional view of asemiconductor package structure 1 according to some embodiments of the present disclosure. Thesemiconductor package structure 1 includes a first insulatinglayer 2, a firstconductive layer 20, amulti-layered circuit structure 3, aprotection layer 4, asemiconductor chip 5, anencapsulant 14, a secondinsulating layer 6, a secondconductive layer 60, a thirdinsulating layer 7, a thirdconductive layer 70, a fourth insulatinglayer 8, a fourthconductive layer 80, and a pre-solder 16. - The first insulating
layer 2 has anupper surface 21, alower surface 22 opposite theupper surface 21, and aside surface 23 extending between theupper surface 21 and thelower surface 22. The first insulatinglayer 2 defines a first throughhole 24 extending through the first insulatinglayer 2. A material of the first insulatinglayer 2 may include an insulating material, a passivation material, a dielectric material or a solder resist material, such as, for example, a benzocyclobutene (BCB) based polymer or a polyimide (PI). In some embodiments, the first insulatinglayer 2 may include a cured photoimageable dielectric (PID) material, such as an epoxy or a PI including photoinitiators. - The first
conductive layer 20 is disposed on theupper surface 21 of the first insulatinglayer 2 and in the first throughhole 24 of the first insulatinglayer 2. The firstconductive layer 20 has anupper surface 201, alower surface 202 opposite theupper surface 201, and aperipheral wall 208 extending between theupper surface 201 and thelower surface 202. Thelower surface 202 of the firstconductive layer 20 is disposed on theupper surface 21 of the first insulatinglayer 2. The firstconductive layer 20 includes aconductive pad 204 and atrace 206. Theconductive pad 204 of the firstconductive layer 20 is disposed in the first throughhole 24 of the first insulatinglayer 2. Thetrace 206 is disposed on theupper surface 21 of the first insulatinglayer 2. In some embodiments, theconductive pad 204 and thetrace 206 may be integrally formed as a monolithic structure. A material of the firstconductive layer 20 may include, for example, copper, another conductive metal, or an alloy thereof. In some embodiments, the firstconductive layer 20 may be a single layer, and a seed layer (e.g., titanium and/or copper, another metal, or an alloy) may be interposed between the firstconductive layer 20 and the first insulatinglayer 2. Alternatively, the firstconductive layer 20 may include a metal layer (e.g., a copper layer) and a seed layer. - The
multi-layered circuit structure 3 is disposed on theupper surface 201 of the firstconductive layer 20. Themulti-layered circuit structure 3 includes abonding region 34 and an extendingregion 36. Thebonding region 34 is disposed on theconductive pad 204 of the firstconductive layer 20, and the extendingregion 36 is disposed on thetrace 206 of theconductive layer 20. In some embodiments, each layer of themulti-layered circuit structure 3 within thebonding region 34 and within the extendingregion 36 may be integrally formed as a monolithic structure. Thebonding region 34 may be used as a UBM for electrical connections, such as connection with thesemiconductor 5. As shown inFIG. 1 , a length “L” of the extendingregion 36 is greater than a maximum width “W” of the bonding region 34 (e.g. by a factor of about 1.1 or more, about 1.2 or more, or about 1.3 or more). Themulti-layered circuit structure 3 has aperipheral wall 38 which aligns with (e.g. is continuous with) theperipheral wall 208 of the firstconductive layer 20. For example, themulti-layered circuit structure 3 may cover (e.g. substantially completely cover) theupper surface 201 of the firstconductive layer 20. A layout of themulti-layered circuit structure 3 may be the same as, or similar to, the layout of the firstconductive layer 20. In some embodiments, the firstconductive layer 20 and themulti-layered circuit structure 3 may be formed by using a same photomask and/or a same photoresist. Thus, themulti-layered circuit structure 3 may be sputtered or plated on theupper surface 201 of the firstconductive layer 20, and themulti-layered circuit structure 3 may be conformal with the firstconductive layer 20. Themulti-layered circuit structure 3 may include a barrier layer and/or a wetting layer. For example, as shown inFIG. 1 , themulti-layered circuit structure 3 includes afirst layer 31, asecond layer 32 and athird layer 33. Thefirst layer 31 may be a barrier layer disposed on theupper surface 201 of the firstconductive layer 20, and may be formed by sputtering. A material of thefirst layer 31 includes, for example, nickel. Thesecond layer 32 and thethird layer 33 may be wetting layers sequentially disposed on thefirst layer 31, and may be formed by sputtering. Materials of thesecond layer 32 and thethird layer 33 include, for example, palladium and/or gold. The layouts of thefirst layer 31, thesecond layer 32 and thethird layer 33 may be the same as, or similar to, the layout of the firstconductive layer 20. In embodiments in which themulti-layered circuit structure 3 includes nickel and/or palladium, warpage of thesemiconductor package structure 1 corresponding to the conductive layers (e.g., the firstconductive layer 20, the secondconductive layer 60, the thirdconductive layer 70 and/or the fourth conductive layer 80) can be balanced. - The
protection layer 4 covers theupper surface 21 of the first insulatinglayer 2 and the extendingregion 36 of themulti-layered circuit structure 3. Theprotection layer 4 defines at least one throughhole 44 to expose thebonding region 34 of themulti-layered circuit structure 3. A width “W” of the throughhole 44 is substantially equal to the maximum width “W” of thebonding region 34 of themulti-layered circuit structure 3. Theprotection layer 4 has anupper surface 41, alower surface 42 opposite theupper surface 41, and aside surface 43 extending between theupper surface 41 and thelower surface 42. Thelower surface 42 is disposed on theupper surface 21 of the first insulatinglayer 2. Theside surface 23 of the first insulatinglayer 2 is not coplanar with theside surface 43 of theprotection layer 4. Theprotection layer 4 covers theperipheral wall 208 of the firstconductive layer 20 and theperipheral wall 38 of themulti-layered circuit structure 3. A material of theprotection layer 4 may be the same as, or similar to, the material of the first insulatinglayer 2. - The
semiconductor chip 5 is electrically connected to themulti-layered circuit structure 3. At least onesolder bump 54 connects thesemiconductor chip 5 and themulti-layered circuit structure 3. For example, thesemiconductor 5 includes at least onebump pad 53, and thesolder bump 54 is disposed on thebonding region 34 of themulti-layered circuit structure 3 and connects to thebump pad 53 of thesemiconductor chip 5. - The
encapsulant 14, which can be, for example, a molding compound, is disposed on theprotection layer 4 and encapsulates and covers thesemiconductor chip 5 and thesolder bump 54. Theencapsulant 14 has aside surface 143, and theside surface 143 is not coplanar with theside surface 43 of theprotection layer 4 or theside surface 23 of the first insulatinglayer 2. In some embodiments, as shown inFIG. 1 , theencapsulant 14 covers theside surface 23 of the first insulatinglayer 2 and theside surface 43 of theprotection layer 4. - The second
insulating layer 6 and the secondconductive layer 60 are disposed adjacent thelower surface 22 of the first insulatinglayer 2. The secondinsulating layer 6 has anupper surface 61, alower surface 62 opposite theupper surface 61, and aside surface 63 extending between theupper surface 61 and thelower surface 62. Theupper surface 61 of the second insulatinglayer 6 is disposed on thelower surface 22 of the first insulatinglayer 2. Theside surface 63 of the second insulatinglayer 6 is not coplanar with theside surface 23 of the first insulatinglayer 2. Theside surface 63 of the second insulatinglayer 6 is not coplanar with theside surface 43 of theprotection layer 4. Theside surface 63 of the second insulatinglayer 6 is substantially coplanar with theside surface 143 of theencapsulant 14. The secondinsulating layer 6 defines a second throughhole 64 extending through the second insulatinglayer 6. A material of the second insulatinglayer 6 may be the same as, or similar to, the material of the first insulatinglayer 2. - The second
conductive layer 60 is disposed on theupper surface 61 of the second insulatinglayer 6 and embedded in or covered by the first insulatinglayer 2. The secondconductive layer 60 extends into the second throughhole 64 of the second insulatinglayer 6 to form a second conductive via 604. That is, the second conductive via 604 of the secondconductive layer 60 extends through the second insulatinglayer 6. A portion of the extendingregion 36 of themulti-layered circuit structure 3 is disposed directly above the second conductive via 604 of the secondconductive layer 60. The firstconductive layer 20 is electrically connected to the secondconductive layer 60 through a first conductive via 39 including at least a portion of thebonding region 34 of themulti-layered circuit structure 3 and at least a portion of theconductive pad 204 of the firstconductive layer 20 in the first throughhole 24 of the first insulatinglayer 2. In addition, an area of themulti-layered circuit structure 3 from a top view is in a range of about 0.5 times to about 1.5 times, about 0.7 times to about 1.3 times, about 0.9 times to about 1.1 times, or about 0.95 times to about 1.05 times as large as an area of the secondconductive layer 60 from a top view. A material of the secondconductive layer 60 may be the same as, or similar to, the material of the firstconductive layer 20. In some embodiments, as shown inFIG. 1 , a sum of a cross-sectional area of themulti-layered circuit structure 3 and a cross-sectional area of the firstconductive layer 20 is in a range of about 0.5 times to about 1.5 times, about 0.7 times to about 1.3 times, about 0.9 times to about 1.1 times, or about 0.95 times to about 1.05 times as large as a cross-sectional area of the secondconductive layer 60. - The third
insulating layer 7 and the fourth insulatinglayer 8 are sequentially disposed on the second insulatinglayer 6. The thirdinsulating layer 7 has anupper surface 71, alower surface 72 opposite theupper surface 71, and aside surface 73 extending between theupper surface 71 and thelower surface 72. Theupper surface 71 of the third insulatinglayer 7 is disposed on thelower surface 62 of the second insulatinglayer 6. Theside surface 63 of the second insulatinglayer 6 and theside surface 73 of the third insulatinglayer 7 are substantially coplanar. The thirdinsulating layer 7 defines a third throughhole 74 extending through the third insulatinglayer 7. A material of the third insulatinglayer 7 may be the same as, or similar to, the material of the first insulatinglayer 2. - The third
conductive layer 70 is disposed on theupper surface 71 of the third insulatinglayer 7, and embedded in or covered by the second insulatinglayer 6. The thirdconductive layer 70 extends into the third throughhole 74 of the third insulatinglayer 7 to form a third conductive via 704. The third conductive via 704 of the thirdconductive layer 70 extends through the third insulatinglayer 7. The thirdconductive layer 70 is electrically connected to the secondconductive layer 60 through the second conductive via 604 of the secondconductive layer 60. A material of the thirdconductive layer 70 may be the same as, similar to, the material of the firstconductive layer 20. - The fourth insulating
layer 8 has anupper surface 81, alower surface 82 opposite theupper surface 81, and aside surface 83 extending between theupper surface 81 and thelower surface 82. Theupper surface 81 of the fourth insulatinglayer 8 is disposed on thelower surface 72 of the third insulatinglayer 7. Theside surface 73 of the third insulatinglayer 7 and theside surface 83 of the fourth insulatinglayer 8 are substantially coplanar. The fourth insulatinglayer 8 defines a fourth throughhole 84 extending through the fourth insulatinglayer 8. A material of the fourth insulatinglayer 8 may be the same as, or similar to, the material of the first insulatinglayer 2. - The fourth
conductive layer 80 is disposed on theupper surface 81 of the fourth insulatinglayer 8, and embedded in or covered by the third insulatinglayer 7. The fourthconductive layer 80 extends into the fourth throughhole 84 of the fourth insulatinglayer 8 to form a fourth conductive via 804. The fourth conductive via 804 of the fourthconductive layer 80 extends through the fourth insulatinglayer 8. The fourthconductive layer 80 is electrically connected to the thirdconductive layer 70 through the third conductive via 704 of the thirdconductive layer 70. A material of the fourthconductive layer 80 may be the same as, or similar to, the material of the firstconductive layer 20. In some embodiments, a thickness of the secondconductive layer 60, a thickness of the thirdconductive layer 70 and a thickness of the fourthconductive layer 80 may be substantially equal to each other, while a thickness of the firstconductive layer 20 may be less than the thickness of the secondconductive layer 60, the thickness of the thirdconductive layer 70 and/or the thickness of the fourthconductive layer 80. For example, a ratio of the thickness of the firstconductive layer 20 to the thickness of the secondconductive layer 60 may be about ⅔ or less, about ½ or less, or about ⅓ or less. - The pre-solder 16 is disposed on a side of the fourth conductive via 804 adjacent to the
second surface 82 of the fourth insulatinglayer 8 for external connections. - In the
semiconductor package structure 1, since themulti-layered circuit structure 3 is directly disposed on the first conductive layer 20 (and may not be disposed on the firstconductive layer 20 via another conductive metal layer), thesemiconductor package structure 1 includes four conductive metal layers rather than five conductive metal layers. Thus, a metal layer can be omitted, and a formation time of thesemiconductor package structure 1 can be reduced, and the manufacturing cost can be reduced. In addition, a total thickness of thesemiconductor package structure 1 can be reduced. Besides, themulti-layered circuit structure 3 and the firstconductive layer 20 can be formed by using a same photomask and/or a same photoresist, and thus the manufacturing cost of thesemiconductor package structure 1 can be reduced. -
FIG. 2 illustrates a cross-sectional view of a semiconductor package structure 1 a according to some embodiments of the present disclosure. The semiconductor package structure 1 a is similar to thesemiconductor package structure 1 shown inFIG. 1 , except that the semiconductor package structure 1 a shown inFIG. 2 includes a secondinsulating layer 6 a, a thirdinsulating layer 7 a and a fourth insulatinglayer 8 a instead of the second insulatinglayer 6, the third insulatinglayer 7 and the fourth insulatinglayer 8 of thesemiconductor package structure 1 shown inFIG. 1 . - As shown in
FIG. 2 , the second insulatinglayer 6 a, the third insulatinglayer 7 a and the fourth insulatinglayer 8 a are similar to the second insulatinglayer 6, the third insulatinglayer 7 and the fourth insulatinglayer 8 of thesemiconductor package structure 1 shown inFIG. 1 . However, in the semiconductor package structure 1 a shown inFIG. 2 , aside surface 63 a of the second insulatinglayer 6 a and aside surface 83 a of the fourth insulatinglayer 8 a are substantially coplanar, and the second insulatinglayer 6 a covers aside surface 73 a of the third insulatinglayer 7 a. -
FIG. 3 throughFIG. 20 illustrate a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. In some embodiments, the method is for manufacturing a semiconductor package structure such as thesemiconductor package structure 1 shown inFIG. 1 . - Referring to
FIG. 3 , acarrier 90 is provided. Thecarrier 90 may include a release film disposed thereon, such as a release metal film. Then, aseed layer 91 is formed on thecarrier 90. Then, a fourth insulatinglayer 8 is formed on theseed layer 90. At a position corresponding to a saw street 98 (shown inFIG. 20 ), the fourth insulatinglayer 8 may cover theseed layer 91 to avoid undesired etching of theseed layer 91 before thecarrier 90 is removed. The fourth insulatinglayer 8 has anupper surface 81 and alower surface 82 opposite theupper surface 81. Thelower surface 82 of the fourth insulatinglayer 8 is disposed on thecarrier 90. The fourth insulatinglayer 8 defines at least one fourth throughhole 84 to expose a portion of theseed layer 91. The fourth throughhole 84 is used for receiving a fourth conductive via 804 (shown inFIG. 6 ). A material of the fourth insulatinglayer 8 may include an insulating material, a passivation material, a dielectric material or a solder resist material, such as, for example, a BCB based polymer or a PI. In some embodiments, the fourth insulatinglayer 8 may include a cured PID material, such as an epoxy or a PI including photoinitiators. - Referring to
FIG. 4 , afirst photoresist layer 92 a is disposed on the fourth insulatinglayer 8. Then, thefirst photoresist layer 92 a is exposed to a pattern of intense light. For example, afirst photomask 94 a is disposed adjacent to thefirst photoresist layer 92 a, so as to cover a portion of thefirst photoresist layer 92 a. Then, thefirst photoresist layer 92 a is exposed to aradiation source 96. - Referring to
FIG. 5 , thefirst photoresist layer 92 a is then developed by a developer. That is, thefirst photoresist layer 92 a is patterned to define a plurality ofopenings 921 a to expose portions of the fourth insulatinglayer 8, including the fourth throughhole 84 of the fourth insulatinglayer 8. - Referring to
FIG. 6 , a fourthconductive layer 80 is formed in theopenings 921 a of thefirst photoresist layer 92 a and on the fourth insulatinglayer 8. The fourthconductive layer 80 is disposed on theupper surface 81 of the fourth insulatinglayer 8. The fourthconductive layer 80 extends into the fourth throughhole 84 of the fourth insulatinglayer 8 to form a fourth conductive via 804. The fourth conductive via 804 of the fourthconductive layer 80 extends through the fourth insulatinglayer 8. A material of the fourthconductive layer 80 may include, for example, copper, another conductive metal, or an alloy thereof. In some embodiments, the fourthconductive layer 80 may be a single layer, and a seed layer (e.g., titanium and/or copper, another metal, or an alloy) may be interposed between the fourthconductive layer 80 and the fourth insulatinglayer 8. Alternatively, the fourthconductive layer 80 may include a metal layer (e.g., a copper layer) and a seed layer. - Referring to
FIG. 7 , thefirst photoresist layer 92 a is removed, and a thirdinsulating layer 7 is formed on and covers the fourth insulatinglayer 8 and the fourthconductive layer 80. The thirdinsulating layer 7 has anupper surface 71 and alower surface 72 opposite theupper surface 71. Thelower surface 72 of the third insulatinglayer 7 is disposed on theupper surface 81 of the fourth insulatinglayer 8. The thirdinsulating layer 7 defines a third throughhole 74 extending through the third insulatinglayer 7. The third throughhole 74 may expose a portion of the fourthconductive layer 80. The thirdinsulating layer 7 further has alateral surface 75 defining agap 76 to expose a portion of the fourth insulatinglayer 8. The position of thegap 76 corresponds to the position of the saw street 98 (as shown inFIG. 12 ). A material of the third insulatinglayer 7 may be the same as, or similar to, the material of the fourth insulatinglayer 8. - Referring to
FIG. 8 , a thirdconductive layer 70 is formed on the third insulatinglayer 7. The thirdconductive layer 70 is disposed on theupper surface 71 of the third insulatinglayer 7. The thirdconductive layer 70 extends into the third throughhole 74 of the third insulatinglayer 7 to form a third conductive via 704. The third conductive via 704 of the thirdconductive layer 70 extends through the third insulatinglayer 7. The thirdconductive layer 70 is electrically connected to the fourthconductive layer 80 through the third conductive via 704. A material of the thirdconductive layer 70 may be the same as, or similar to, the material of the fourthconductive layer 80. - Referring to
FIG. 9 , a secondinsulating layer 6 is formed on and covers the third insulatinglayer 7 and the secondconductive layer 70. A portion of the second insulatinglayer 6 extends into and fills thegap 76 of the third insulatinglayer 7. The secondinsulating layer 6 has anupper surface 61 and alower surface 62 opposite theupper surface 61. Thelower surface 62 of the second insulatinglayer 6 is disposed on theupper surface 71 of the third insulatinglayer 7. The secondinsulating layer 6 defines a second throughhole 64 extending through the second insulatinglayer 6 to expose a portion of the thirdconductive layer 70. A material of the second insulatinglayer 6 may be the same as, or similar to, the material of the fourth insulatinglayer 8. - Referring to
FIG. 10 , a secondconductive layer 60 is formed on the second insulatinglayer 6. The secondconductive layer 60 is disposed on theupper surface 61 of the second insulatinglayer 6. The secondconductive layer 60 extends into the second throughhole 64 of the second insulatinglayer 6 to form a second conductive via 604. That is, the second conductive via 604 of the secondconductive layer 60 extends through the second insulatinglayer 6. The secondconductive layer 60 is electrically connected to the thirdconductive layer 70 through the second conductive via 604. A material of the secondconductive layer 60 may be the same as, or similar to, the material of the fourthconductive layer 80. - Referring to
FIG. 11 , a first insulatinglayer 2 is formed on and covers the second insulatinglayer 6 and the secondconductive layer 60. The first insulatinglayer 2 has anupper surface 21, alower surface 22 opposite theupper surface 21, and aside surface 23 extending between theupper surface 21 and thelower surface 22. Two adjacent side surfaces 23 may define agap 25 corresponding to thegap 76 of the third insulatinglayer 7. Thegap 25 may extend through the first insulatinglayer 2 to expose the second insulatinglayer 6, and is disposed directly above thegap 76 of the third insulatinglayer 7. In addition, the first insulatinglayer 2 further defines a first throughhole 24 extending through the first insulatinglayer 2 to expose a portion of the secondconductive layer 60. - Referring to
FIG. 12 , asecond photoresist layer 92 b is disposed on the first insulatinglayer 2. Then, thesecond photoresist layer 92 b is exposed to a pattern of intense light. For example, asecond photomask 94 b is disposed adjacent to thesecond photoresist layer 92 b, so as to cover a portion of thesecond photoresist layer 92 b. Then, thesecond photoresist layer 92 b is exposed to aradiation source 96. - Referring to
FIG. 13 , thesecond photoresist layer 92 b is then developed by a developer. That is, thesecond photoresist layer 92 b is patterned to define a plurality ofopenings 921 b to expose portions of the first insulatinglayer 2. - Referring to
FIG. 14 , a firstconductive layer 20 is formed in theopenings 921 b of thesecond photoresist layer 92 b and on the first insulatinglayer 2. The firstconductive layer 20 is disposed on theupper surface 21 of the first insulatinglayer 2 and in the first throughhole 24 of the first insulatinglayer 2. The firstconductive layer 20 has anupper surface 201, alower surface 202 opposite theupper surface 201, and aperipheral wall 208 extending between theupper surface 201 and thelower surface 202. Thelower surface 202 of the firstconductive layer 20 is disposed on theupper surface 21 of the first insulatinglayer 2. The firstconductive layer 20 includes aconductive pad 204 and atrace 206. Theconductive pad 204 of the firstconductive layer 20 is disposed in the first throughhole 24 of the first insulatinglayer 2. Thetrace 206 extends on theupper surface 21 of the first insulatinglayer 2. A material of the first conductive 20 layer may be the same as, or similar to, the material of the fourthconductive layer 80. In some embodiments, a thickness of the secondconductive layer 60, a thickness of the thirdconductive layer 70 and a thickness of the fourthconductive layer 80 may be substantially the same as each other, while a thickness of the firstconductive layer 20 may be less than the thickness of the secondconductive layer 60, the thickness of the thirdconductive layer 70 and/or the thickness of the fourthconductive layer 80. For example, a ratio of the thickness of the firstconductive layer 20 to the thickness of the secondconductive layer 60 may be about ⅔ or less, about ½ or less, or about ⅓ or less. - Referring to
FIG. 15 , amulti-layered circuit structure 3 is formed in theopenings 921 b of thesecond photoresist 92 b and on theupper surface 201 of the firstconductive layer 20. For example, themulti-layered circuit structure 3 may be formed by sputtering or plating. As shown inFIGS. 14 and 15 , the firstconductive layer 20 and themulti-layered circuit structure 3 are formed using thesame photoresist 92 b. That is, the firstconductive layer 20 and themulti-layered circuit structure 3 are formed by using thesame photomask 94 b. Thus, themulti-layered circuit structure 3 may be sputtered or plated on theupper surface 201 of the firstconductive layer 20, and themulti-layered circuit structure 3 may be conformal with the firstconductive layer 20. In addition, an area of themulti-layered circuit structure 3 from a top view is in a range of about 0.5 times to about 1.5 times, or about 0.7 times to about 1.2 times as large as an area of the secondconductive layer 60 from a top view. Themulti-layered circuit structure 3 includes abonding region 34 and an extendingregion 36. Thebonding region 34 is disposed on theconductive pad 204 of the firstconductive layer 20, and the extendingregion 36 is disposed on thetrace 206 of theconductive layer 20. The firstconductive layer 20 is electrically connected to the secondconductive layer 60 through a first conductive via 39 including theconductive pad 204 in the first throughhole 24 of the first insulatinglayer 2. Themulti-layered circuit structure 3 has aperipheral wall 38 which aligns with (e.g. is substantially coplanar with) theperipheral wall 208 of the firstconductive layer 20. For example, themulti-layered circuit structure 3 may cover theupper surface 201 of the firstconductive layer 20. A layout of themulti-layered circuit structure 3 may be the same as, or similar to, a layout of the firstconductive layer 20. Themulti-layered circuit structure 3 may include a barrier layer and/or a wetting layer. For example, as shown inFIG. 15 , themulti-layered circuit structure 3 includes afirst layer 31, asecond layer 32 and athird layer 33 sequentially disposed on the firstconductive layer 20. Thefirst layer 31 may be a barrier layer disposed on theupper surface 201 of the firstconductive layer 20. A material of thefirst layer 31 includes, for example, nickel. Thesecond layer 32 and thethird layer 33 may be wetting layers sequentially disposed on thefirst layer 31. Materials of thesecond layer 32 and thethird layer 33 include, for example, palladium and/or gold. The layouts of thefirst layer 31, thesecond layer 32 and thethird layer 33 may be the same as, or similar to, the layout of the firstconductive layer 20. In the embodiment that themulti-layered circuit structure 3 includes nickel and/or palladium, warpage of thesemiconductor package structure 1 corresponding to the conductive layers (e.g., the firstconductive layer 20, the secondconductive layer 60, the thirdconductive layer 70 and/or the fourth conductive layer 80) can be balanced. - Referring to
FIG. 16 , thesecond photoresist 92 b is removed, and aprotection layer 4 is formed on the first insulatinglayer 2. Theprotection layer 4 covers the first insulatinglayer 2 and themulti-layered circuit structure 3, and exposes a portion of themulti-layered circuit structure 3. For example, theprotection layer 4 covers theupper surface 21 of the first insulatinglayer 2 and the extendingregion 36 of themulti-layered circuit structure 3. Theprotection layer 4 defines at least one throughhole 44 to expose thebonding region 34 of themulti-layered circuit structure 3. As shown inFIG. 16 , a length “L” of the extendingregion 36 is greater than a maximum width “W” of the bonding region 34 (e.g. by a ratio of about 1.1 or more, about 1.2 or more, or about 1.3 or more). A width “W” of the throughhole 44 is substantially equal to the maximum width “W” of thebonding region 34 of themulti-layered circuit structure 3. Theprotection layer 4 has anupper surface 41, alower surface 42 opposite theupper surface 41, and aside surface 23 extending between theupper surface 41 and thelower surface 42. Thelower surface 42 is disposed on theupper surface 21 of the first insulatinglayer 2. Theside surface 43 of theprotection layer 4 is not coplanar with theside surface 23 of the first insulatinglayer 2. Theprotection layer 4 covers theperipheral wall 208 of the firstconductive layer 20 and theperipheral wall 38 of themulti-layered circuit structure 3. A material of theprotection layer 4 may be the same as, or similar to, the material of the fourth insulatinglayer 8. - Referring to
FIG. 17 , asemiconductor chip 5 is provided. Thesemiconductor chip 5 includes at least onebump pad 53, and at least onesolder bump 54 is disposed on thebump pad 53. In some embodiments, as shown inFIG. 17 , a diameter “W” of the exposed portion (e.g., the bonding region 34) of themulti-layered circuit structure 3 is slightly greater than a maximum diameter “D” of the solder bump 54 (e.g. by a ratio of about 1.1 or more, about 1.2 or more, or about 1.3 or more). Alternatively, in other embodiments, such as shown inFIG. 18 , the diameter “W”′ of the exposed portion (e.g., the bonding region 34) of themulti-layered circuit structure 3 may substantially equal to the maximum diameter “D” of thesolder bump 54. - Referring to
FIG. 19 , thesemiconductor chip 5 is bonded to the exposed portion of themulti-layered circuit structure 3. For example, thesemiconductor chip 5 is bonded to thebonding region 34 of themulti-layered circuit structure 3 by thesolder bump 54. Thesolder bump 54 is disposed between thebonding region 34 of themulti-layered circuit structure 3 and thebump pad 53 of thesemiconductor chip 5. Then, anencapsulant 14, for example, a molding compound, is formed on theprotection layer 4, and encapsulates thesemiconductor chip 5 and thesolder bump 54. As shown inFIG. 19 , theencapsulant 14 extends along theside surface 43 of theprotection layer 4 and theside surface 23 of the first insulatinglayer 2 to contact the second insulatinglayer 6. Accordingly, theencapsulant 14 covers theside surface 23 of the first insulatinglayer 2 and theside surface 43 of theprotection layer 4. - Referring to
FIG. 20 , thecarrier 90 is removed. Then, theseed layer 91 is removed by, for example, etching, and then a pre-solder 16 is formed on a side of the fourth conductive via 804 adjacent to thesecond surface 82 of the fourth insulatinglayer 8 for external connection. Then, a singulation process is conducted to form thesemiconductor package structure 1 shown inFIG. 1 . For example, theencapsulant 14, the second insulatinglayer 6, the third insulatinglayer 7 and the fourth insulatinglayer 8 are cut along asaw street 98, forming aside surface 143 of theencapsulant 14, aside surface 63 of the second insulatinglayer 6, aside surface 73 of the third insulatinglayer 7 and aside surface 83 of the fourth insulatinglayer 8. As shown inFIG. 20 , a width of thesaw street 98 is equal to or greater than (e.g. by a ratio of about 1.1 or more, about 1.2 or more, or about 1.3 or more) a width of thegap 76 of the third insulatinglayer 7. A width of thesaw street 98 may be less than a width of the gap 25 (the width of thesaw street 98 may be about 0.9 times the width of thegap 25 or less, about 0.8 times the width of thegap 25 or less, or about 0.7 times the width of thegap 25 or less). Hence, theside surface 63 of the second insulatinglayer 6, theside surface 73 of the third insulatinglayer 7 and theside surface 83 of the fourth insulatinglayer 8 are substantially coplanar. Theside surface 63 of the second insulatinglayer 6 is substantially coplanar with theside surface 143 of theencapsulant 14. - In the manufacturing method described above, since the first
conductive layer 20 and themulti-layered circuit structure 3 may be formed by using a same photomask (e.g., thephotomask 94 b) and/or a same photoresist (e.g., thephotoresist 92 b), a manufacturing cost of thesemiconductor package structure 1 can be reduced. Besides, since thegaps 76 may divide the third insulatinglayer 7 into a plurality of units, the stress of the third insulatinglayer 7 is discontinuous. Thus if warpage of the third insulatinglayer 7 occurs, the warpage may be dispersed across the units of the third insulatinglayer 7. Thus, warpage of the third insulatinglayer 7 may be reduced (e.g. may be kept below a threshold). In addition, the second insulatinglayer 6 extends into and fills thegap 76 defined by the third insulatinglayer 7 and contacts the fourth insulatinglayer 8, thus, warpage corresponding to the conductive layers (e.g., the firstconductive layer 20, the secondconductive layer 60, the thirdconductive layer 70 and/or the fourth conductive layer 80) can be balanced. -
FIG. 21 illustrates a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. In some embodiments, the method is for manufacturing a semiconductor package structure such as the semiconductor package structure 1 a shown inFIG. 2 . The initial stages of the illustrated process are the same as, or similar to, the stages illustrated inFIG. 3 throughFIG. 19 .FIG. 21 depicts a stage subsequent to that depicted inFIG. 19 . - Referring to
FIG. 21 , thecarrier 90 is removed. Then, theseed layer 91 is removed by, for example, etching, and then a pre-solder 16 is formed on a side of the fourth conductive via 804 adjacent to thesecond surface 82 of the fourth insulatinglayer 8 for external connections. Then, a singulation process is conducted to form the semiconductor package structure 1 a shown inFIG. 2 . For example, theencapsulant 14, the second insulatinglayer 6, the third insulatinglayer 7 and the fourth insulatinglayer 8 are cut along asaw street 98 a, forming aside surface 143 of theencapsulant 14, aside surface 63 a of the second insulatinglayer 6 a, aside surface 73 a of the third insulatinglayer 7 a and aside surface 83 a of the fourth insulatinglayer 8 a. As shown inFIG. 21 , a width of thesaw street 98 a is less than a width of thegap 76 of the third insulating layer 7 (the width of thesaw street 98 a may be about 0.9 times the width of thegap 76 or less, about 0.8 times the width of thegap 76 or less, or about 0.7 times the width of thegap 76 or less). The side surface 63 a of the second insulatinglayer 6 a and theside surface 83 a of the fourth insulatinglayer 8 a are substantially coplanar, and the second insulatinglayer 6 a covers aside surface 73 a of the third insulatinglayer 7 a. The side surface 63 a of the second insulatinglayer 6 a is substantially coplanar with theside surface 143 of theencapsulant 14. - Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,” “down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,” “lower,” “upper,” “over,” “under,” and so forth, are indicated with respect to the orientation shown in the figures unless otherwise specified. It should be understood that the spatial descriptions used herein are for purposes of illustration only, and that practical implementations of the structures described herein can be spatially arranged in any orientation or manner, provided that the merits of embodiments of this disclosure are not deviated from by such an arrangement.
- As used herein, the terms “approximately,” “substantially,” “substantial” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. For example, when used in conjunction with a numerical value, the terms can refer to a range of variation less than or equal to ±10% of that numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two numerical values can be deemed to be “substantially” the same or equal if a difference between the values is less than or equal to ±10% of an average of the values, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.
- Two surfaces can be deemed to be coplanar or substantially coplanar if a displacement between the two surfaces is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.
- As used herein, the singular terms “a,” “an,” and “the” may include plural referents unless the context clearly dictates otherwise.
- As used herein, the terms “conductive,” “electrically conductive” and “electrical conductivity” refer to an ability to transport an electric current. Electrically conductive materials typically indicate those materials that exhibit little or no opposition to the flow of an electric current. One measure of electrical conductivity is Siemens per meter (S/m). Typically, an electrically conductive material is one having a conductivity greater than approximately 104 S/m, such as at least 105 S/m or at least 106 S/m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.
- Additionally, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such range format is used for convenience and brevity and should be understood flexibly to include numerical values explicitly specified as limits of a range, but also to include all individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly specified.
- While the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations are not limiting. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not be necessarily drawn to scale. There may be distinctions between the artistic renditions in the present disclosure and the actual apparatus due to manufacturing processes and tolerances. There may be other embodiments of the present disclosure which are not specifically illustrated. The specification and drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. While the methods disclosed herein have been described with reference to particular operations performed in a particular order, it will be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations are not limitations of the present disclosure.
Claims (20)
1. A substrate structure, comprising:
a conductive layer having an upper surface; and
a multi-layered circuit structure and a protection layer disposed on the upper surface of the conductive layer, wherein an upper surface of the multi-layered circuit structure is lower than an upper surface of the protection layer.
2. The substrate structure of claim 1 , further comprising a solder bump directly disposed on the upper surface of the multi-layered circuit structure.
3. The substrate structure of claim 2 , wherein the protection layer defines a through hole to expose a portion of the multi-layered circuit structure, and the solder bump is disposed on and contacts the portion of the multi-layered circuit structure.
4. The substrate structure of claim 1 , wherein the multi-layered circuit structure comprises a barrier layer and a wetting layer disposed on the barrier layer.
5. The substrate structure of claim 4 , wherein the barrier layer is disposed on and contacts the upper surface of the conductive layer.
6. The substrate structure of claim 4 , wherein a material of the barrier layer comprises nickel, and a material of the wetting layer comprises palladium or gold.
7. The substrate structure of claim 1 , wherein the multi-layered circuit structure contacts the upper surface of the conductive layer, and the protection layer contacts the upper surface of the multi-layered circuit structure.
8. The substrate structure of claim 1 , wherein the multi-layered circuit structure consists of a plurality of layers, and peripheral walls of the layers align with each other.
9. The substrate structure of claim 1 , wherein the protection layer covers the peripheral walls of each of the layers of the multi-layered circuit structure.
10. The substrate structure of claim 1 , further comprising an insulating layer having a side surface, wherein the conductive layer and the protection layer are disposed on the insulating layer, and the protection layer has a side surface that is not coplanar with the side surface of the first insulating layer.
11. The substrate structure of claim 10 , wherein the insulating layer defines a first through hole extending through the first insulating layer, the first conductive layer has a conductive pad disposed in the first through hole, the multi-layered circuit structure comprises a bonding region disposed on the conductive pad, and the solder bump is directly disposed on the bonding region of the multi-layered circuit structure
12. The substrate structure of claim 1 , wherein a layout of the multi-layered circuit structure is the same as a layout of the conductive layer.
13. The substrate structure of claim 1 , wherein the multi-layered circuit structure has as substantially consistent thickness.
14. A semiconductor package structure, comprising:
a conductive layer having an upper surface;
a multi-layered circuit structure and a protection layer disposed on the upper surface of the conductive layer, wherein an upper surface of the multi-layered circuit structure is lower than an upper surface of the protection layer; and
a semiconductor chip electrically connected to the multi-layered circuit structure.
15. The semiconductor package structure of claim 14 , further comprising at least one solder bump connecting the semiconductor chip and the multi-layered circuit structure.
16. The semiconductor package structure of claim 15 , wherein the solder bump is directly disposed on the upper surface of the multi-layered circuit structure.
17. The semiconductor package structure of claim 16 , wherein the protection layer defines a through hole to expose a portion of the multi-layered circuit structure, and the solder bump is disposed on and contacts the portion of the multi-layered circuit structure.
18. The semiconductor package structure of claim 17 , further comprising an encapsulant encapsulating the semiconductor chip and the solder bump, and a portion of the encapsulant is disposed between a surface of the solder bump and a side wall of the through hole of the protection layer.
19. The substrate structure of claim 14 , wherein the multi-layered circuit structure comprises a barrier layer and a wetting layer disposed on the barrier layer.
20. The semiconductor package structure of claim 19 , wherein a material of the barrier layer comprises nickel, and a material of the wetting layer comprises palladium or gold.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/870,738 US20200273722A1 (en) | 2018-01-12 | 2020-05-08 | Semiconductor package structure and method for manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/870,315 US10651052B2 (en) | 2018-01-12 | 2018-01-12 | Semiconductor package structure and method for manufacturing the same |
US16/870,738 US20200273722A1 (en) | 2018-01-12 | 2020-05-08 | Semiconductor package structure and method for manufacturing the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/870,315 Continuation US10651052B2 (en) | 2018-01-12 | 2018-01-12 | Semiconductor package structure and method for manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20200273722A1 true US20200273722A1 (en) | 2020-08-27 |
Family
ID=67213026
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/870,315 Active 2038-01-20 US10651052B2 (en) | 2018-01-12 | 2018-01-12 | Semiconductor package structure and method for manufacturing the same |
US16/870,738 Abandoned US20200273722A1 (en) | 2018-01-12 | 2020-05-08 | Semiconductor package structure and method for manufacturing the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/870,315 Active 2038-01-20 US10651052B2 (en) | 2018-01-12 | 2018-01-12 | Semiconductor package structure and method for manufacturing the same |
Country Status (1)
Country | Link |
---|---|
US (2) | US10651052B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10515827B2 (en) * | 2017-10-31 | 2019-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming chip package with recessed interposer substrate |
US11189521B2 (en) * | 2018-10-30 | 2021-11-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of manufacturing redistribution circuit structures using phase shift mask |
CN110729255A (en) * | 2019-08-08 | 2020-01-24 | 厦门云天半导体科技有限公司 | Three-dimensional packaging structure and method for bonding wall fan-out device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI230450B (en) | 2003-06-30 | 2005-04-01 | Advanced Semiconductor Eng | Under bump metallurgy structure |
US7244671B2 (en) * | 2003-07-25 | 2007-07-17 | Unitive International Limited | Methods of forming conductive structures including titanium-tungsten base layers and related structures |
TWI288447B (en) | 2005-04-12 | 2007-10-11 | Siliconware Precision Industries Co Ltd | Conductive bump structure for semiconductor device and fabrication method thereof |
KR100892935B1 (en) * | 2005-12-14 | 2009-04-09 | 신꼬오덴기 고교 가부시키가이샤 | Substrate with built-in chip and method for manufacturing substrate with built-in chip |
US8624359B2 (en) | 2011-10-05 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level chip scale package and method of manufacturing the same |
JP6780933B2 (en) * | 2015-12-18 | 2020-11-04 | 新光電気工業株式会社 | Terminal structure, terminal structure manufacturing method, and wiring board |
US9598876B1 (en) | 2016-02-12 | 2017-03-21 | Clam Corporation | Portable shelters having a hinged side wall |
-
2018
- 2018-01-12 US US15/870,315 patent/US10651052B2/en active Active
-
2020
- 2020-05-08 US US16/870,738 patent/US20200273722A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US10651052B2 (en) | 2020-05-12 |
US20190221446A1 (en) | 2019-07-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20200273722A1 (en) | Semiconductor package structure and method for manufacturing the same | |
US11031326B2 (en) | Wiring structure, electronic device and method for manufacturing the same | |
CN109994389B (en) | Semiconductor package structure and manufacturing method thereof | |
US11574890B2 (en) | Semiconductor devices and methods of manufacturing semiconductor devices | |
US11075188B2 (en) | Package structure and assembly structure | |
US11854991B2 (en) | Semiconductor devices and methods of manufacturing semiconductor devices | |
US10854527B2 (en) | Semiconductor device package and method of manufacturing the same | |
US11545406B2 (en) | Substrate structure, semiconductor package structure and method for manufacturing a substrate structure | |
TW201740523A (en) | Semiconductor device and manufacturing method thereof | |
US10566279B2 (en) | Package device, semiconductor device, and method for manufacturing the package device | |
KR20240017393A (en) | Semiconductor device and manufacturing method thereof | |
US10573572B2 (en) | Electronic device and method for manufacturing a semiconductor package structure | |
US11798859B2 (en) | Electronic device package and method of manufacturing the same | |
US11101237B2 (en) | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | |
US11728260B2 (en) | Wiring structure and method for manufacturing the same | |
US10354969B2 (en) | Substrate structure, semiconductor package including the same, and method for manufacturing the same | |
US11508655B2 (en) | Semiconductor package structure and method for manufacturing the same | |
US20210020597A1 (en) | Semiconductor package structure and method for manufacturing the same | |
US20190363040A1 (en) | Semiconductor device package and method of manufacturing the same | |
US11217520B2 (en) | Wiring structure, assembly structure and method for manufacturing the same | |
US11101541B2 (en) | Semiconductor assembly and method for manufacturing the same | |
US11532542B2 (en) | Wiring structure and method for manufacturing the same | |
US11282777B2 (en) | Semiconductor package and method of manufacturing the same | |
US11688657B2 (en) | Semiconductor devices and methods of manufacturing semiconductor devices | |
US11664339B2 (en) | Package structure and method for manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |