US20200225168A1 - Methods, test structures, and test systems for determining a surface characteristic of a chip facet - Google Patents
Methods, test structures, and test systems for determining a surface characteristic of a chip facet Download PDFInfo
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- US20200225168A1 US20200225168A1 US16/830,399 US202016830399A US2020225168A1 US 20200225168 A1 US20200225168 A1 US 20200225168A1 US 202016830399 A US202016830399 A US 202016830399A US 2020225168 A1 US2020225168 A1 US 2020225168A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
Definitions
- the present invention relates to methods, test structures, and test systems for determining a surface characteristic of a chip facet. More particularly, the present invention relates to methods, test structures, and test systems for determining a surface characteristic of a facet of a photonic chip including a waveguide.
- a photonic chip 110 includes a waveguide 120 , such as an edge coupler, that directs light towards a facet 130 of the photonic chip 110 .
- the light is coupled out of the facet 130 into an off-chip optical fiber 140 .
- the facet 130 is not perfectly perpendicular to the propagation path of the light and the plane of the photonic chip 110 , which can reduce coupling efficiency. Accordingly, it is desirable to determine the facet angle 0 , defined relative to the plane of the photonic chip 110 in FIG. 1 .
- the facet angle is determined from top-view or perspective-view SEM images of chips on a wafer.
- the accuracy and throughput of this technique may be inadequate, and the number of measurement sites that can be accommodated by the technique may be limited.
- the facet angle is determined from cross-sectional SEM images of chips on a wafer. Although this technique provides a higher accuracy, the technique often requires additional and/or destructive processing steps.
- an aspect of the present invention relates to a test system for determining a surface characteristic of a chip facet, the test system comprising: a chip having a facet, the chip including a waveguide configured to direct test light towards the facet; a detector configured to measure an amount of a portion of the test light reflected by the facet or a portion of the test light transmitted by the facet; and a processor configured to determine a surface characteristic of the facet on the basis of the measured amount.
- Another aspect of the present invention relates to a method of determining a surface characteristic of a chip facet, the method comprising: providing a chip having a facet, the chip including a waveguide; directing test light towards the facet via the waveguide; measuring an amount of a portion of the test light reflected by the facet or a portion of the test light transmitted by the facet; and determining a surface characteristic of the facet on the basis of the measured amount.
- FIG. 1 is a schematic illustration of a cross-sectional side view of a conventional edge-coupling arrangement.
- FIG. 2 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 3 is a schematic illustration of a top view of a test structure.
- FIG. 4 is a schematic illustration of a top view of a test structure.
- FIG. 5 is a schematic illustration of a top view of a test structure.
- FIG. 6 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 7 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 8 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 9 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 10A is a schematic illustration of a top view of a test structure.
- FIG. 10B is a schematic illustration of a cross-sectional side view of the test structure of FIG. 10A .
- FIG. 11 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 12 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 13 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 14 is a schematic illustration of a top view of a test structure.
- FIG. 15 is a schematic illustration of a top view of a test structure.
- FIG. 16 is a schematic illustration of a top view of a test structure.
- FIG. 17 is a schematic illustration of a relationship between waveguide angle, facet angle, and critical angle.
- FIG. 18 is a schematic illustration of a top view of a test structure.
- FIG. 19 is a schematic illustration of a cross-sectional side view of a test structure.
- FIG. 20 is a schematic illustration of a top view of a test structure.
- the present invention provides methods, test structures, and test systems for determining a surface characteristic of a chip facet, typically a facet of a photonic chip.
- the methods, test structure, and test systems may be used to determine the surface characteristic of the chip facet at the wafer scale, i.e., while the photonic chip is on a wafer, prior to dicing or packaging.
- the methods, test structures, and test systems may be implemented with any suitable type of integrated photonics platform, for example, a silicon-on-insulator (SOI) platform, e.g., with silicon and/or silicon nitride waveguides, a silica-on-silicon platform, or a III-V material platform.
- SOI silicon-on-insulator
- the photonic chip includes a facet and at least one waveguide.
- the facet is typically an edge facet disposed at an edge of the photonic chip, and a top edge of the facet typically forms the chip edge.
- the facet is typically formed as a sidewall of a trench in the wafer, e.g., by etching.
- the facet may be substantially perpendicular to a plane of the photonic chip, and typically to a plane of the wafer, or may be inclined relative to the chip plane.
- the facet may be coated with an antireflective coating.
- the waveguide may be any suitable type of waveguide, for example, a ridge waveguide, e.g., a narrow single-mode ridge waveguide or a wide multi-mode ridge waveguide, a strip waveguide, or a slot waveguide.
- the waveguide is typically formed in the photonic chip, i.e., formed on or in a substrate or layer of the photonic chip. Accordingly, the waveguide is typically disposed substantially parallel to the chip plane. In some embodiments, the waveguide or a segment thereof is disposed substantially perpendicular to the top edge of the facet, and typically to the chip edge. In other embodiments, the waveguide or a segment thereof is disposed at an oblique angle to the top edge of the facet. In yet other embodiments, the waveguide or a segment thereof is disposed substantially parallel to the top edge of the facet.
- test structures that can be used in methods and test systems for determining a surface characteristic of a chip facet are described hereafter. It should be understood that individual elements of any of the exemplary embodiments may be combined as appropriate to arrive at further embodiments.
- the test structure comprises a chip 210 , typically a photonic chip, that includes a first waveguide 220 configured to direct test light towards the facet 230 in a direction substantially perpendicular to a top edge of a facet 230 of the photonic chip 210 . At least an output segment of the first waveguide 220 is disposed substantially perpendicular to the top edge of the facet 230 .
- the test structure may be included in a test system that also includes a light source, a detector, and/or a processor.
- the light source e.g., a laser or a broadband light source
- the detector e.g., a photodetector
- the detector is configured to measure an amount, e.g., an optical power, of the reflected portion of the test light or the transmitted portion of the test light.
- the detector detects the reflected portion of the test light or the transmitted portion of the test light and provides an output signal representative of the amount of the reflected portion of the test light or the transmitted portion of the test light to the processor.
- the processor e.g., a general-purpose processor or a special-purpose processor, is configured, e.g., programmed with instructions, to determine a surface characteristic of the facet 230 , such as a facet angle, a facet curvature, and/or a facet roughness, on the basis of the measured amount.
- a surface characteristic of the facet 230 such as a facet angle, a facet curvature, and/or a facet roughness
- the surface characteristic is determined by using a empirical model, such as a calibration curve, relating the measured amount to the surface characteristic.
- the first waveguide 220 is configured to receive the reflected portion of the test light from the facet 230
- the detector is configured to measure the amount of the reflected portion of the test light.
- An optical circulator may be used as both an input port configured to couple the test light from an off-chip light source into the first waveguide 220 and as an output port configured to couple the reflected portion of the test light to an off-chip detector.
- an off-chip reflectometer may be used as a detector.
- the photonic chip 210 further includes a first vertical coupler 321 , e.g., a grating coupler, as an input port, a second waveguide 340 , and a second vertical coupler 341 , e.g., a grating coupler, as an output port.
- the first vertical coupler 321 is configured to couple the test light from an off-chip light source into the first waveguide 220 .
- the second waveguide 340 is coupled to the first waveguide 220 to receive the reflected portion of the test light from the first waveguide 220 .
- the first waveguide 220 and the second waveguide 340 may be coupled by a directional coupler, as shown in FIG.
- the second vertical coupler 341 is configured to couple the reflected portion of the test light from the second waveguide 340 to an off-chip detector configured to measure the amount of the reflected portion of the test light.
- MMI multimode interference
- FIG. 4 is similar to the embodiment of FIG. 3 , but the photonic chip 210 includes an on-chip detector 450 , e.g., a photodetector, configured to measure the amount of the reflected portion of the test light, in place of the second vertical coupler 341 .
- an on-chip detector 450 e.g., a photodetector
- the embodiment of FIG. 5 is similar to the embodiment of FIG. 3 , but the photonic chip 210 further includes a phase shifter 543 and a mirror 544 , which together with the first waveguide 220 and the second waveguide 340 are included in an on-chip Michelson interferometer.
- the first waveguide 220 forms a test arm of the Michelson interferometer and is configured to direct test light towards the facet 230 .
- the second waveguide 340 forms a reference arm of the Michelson interferometer and is configured to direct reference light towards the mirror 544 .
- the reference arm has an adjustable optical path length.
- the optical path length may be thermally adjustable or may be adjustable by adjusting a charge-carrier concentration in the reference arm.
- the phase shifter 543 is configured to phase shift the reference light.
- the photonic chip 210 also includes an on-chip balanced photodetector 550 configured to receive the reflected portion of the test light from the test arm and the reflected reference light from the reference arm, and to measure the amount of the reflected portion of the test light as an interference pattern.
- Other similar embodiments may use an off-chip balanced photodetector and/or an off-chip Michelson interferometer.
- a Michelson interferometer may enhance the signal of the reflected portion of the test light, providing a larger dynamic range and improved measurement sensitivity.
- a Michelson interferometer including a 2 ⁇ 2 MMI coupler may be considered. If two signals with respective optical powers of P 1 and P 2 enter the two input ports of the 2 ⁇ 2 MMI coupler, the output optical power P out from each of the output ports of the 2 ⁇ 2 MMI coupler will be 1/2[P 1 +P 2 +2 ⁇ square root over (P 1 P 2 ) ⁇ cos( ⁇ )], where ⁇ is the relative phase shift between the electric fields of the two signals.
- the output photocurrent from the balanced photodetector 550 will be proportional to 2 ⁇ square root over (P 1 P 2 ) ⁇ cos( ⁇ ). If we assume that P 1 is the optical power of the portion of the test light reflected by the facet 230 , and that P 2 is the optical power of reference light reflected from a mirror 544 with a reflectivity of 100%, then P 1 is likely to be smaller than P 2 . If the relative phase shift between the two signals is modulated through a by the phase shifter 543 , then the interference signal at the balanced photodetector 550 will have a power greater than P 1 alone. In this way, the amount of the reflected portion of the test light can be more easily measured, even when the amount is relatively small.
- the photonic chip 210 further includes an integrated photodetector 650 , e.g., a large-area photodetector.
- the integrated photodetector 650 is disposed near the facet 230 at a different height from the first waveguide 220 , and is configured to receive the reflected portion of the test light from the facet 230 and to measure an amount of the reflected portion of the test light.
- the integrated photodetector 650 may be disposed above or below, as shown in FIG. 6 , the first waveguide 220 .
- the use of an integrated photodetector 650 may allow a larger portion of the test light reflected by the facet 230 to be detected and measured, since there is no need to couple the reflected portion of the test light into a waveguide.
- the first waveguide 220 includes a grating structure 722 configured to diffract the test light exiting the first waveguide 220 .
- the grating structure 722 is typically formed, e.g., etched, in the first waveguide 220 near an output end thereof.
- the facet 230 is intentionally inclined, and the grating structure 722 is configured to diffract the test light such that the test light is directed towards the facet 230 in a direction substantially perpendicular to the inclined facet 230 .
- the grating structure 722 is configured to diffract the test light upwards by a diffraction angle that is substantially equal in magnitude to 90° minus a desired facet angle defined relative to the chip plane. Such an embodiment may provide more efficient coupling of the reflected portion of the test light into first waveguide 220 .
- the photonic chip 210 further includes a second waveguide 840 disposed at a different height from the first waveguide 220 and configured to receive the reflected portion of the test light from the facet 230 , and the detector is configured to measure an amount of the reflected portion of the test light.
- the second waveguide 840 may be disposed above, as shown in FIGS. 8 and 9 , or below the first waveguide 220 , and may, as shown in FIG. 9 , or may not, as shown in FIG. 8 , include a grating structure 942 .
- the first waveguide 220 and the second waveguide 840 are incorporated at different layers in the photonic chip 210 , e.g., at different dielectric layers in an SOI chip. Since the facet angle may cause the reflected portion of the test light to be reflected at an angle, the additional second waveguide 840 at a different height from the first waveguide 220 may increase the sensitivity of the measurement.
- the second waveguide 840 may be connected to optical circuits similar to those shown in FIGS. 3 to 5 .
- the facet 230 includes a lithographically defined feature, e.g., a lens, near the first waveguide 220 , that is configured to facilitate reflection of the reflected portion of the test light or to facilitate transmission of the transmitted portion of the test light.
- a lithographically defined feature e.g., a lens
- the lithographically defined feature is configured to facilitate coupling of the reflected portion of the test light into the first waveguide 220
- the detector is configured to measure an amount of the reflected portion of the test light.
- the lithographically defined feature 1031 is configured to facilitate far-field imaging of the transmitted portion of the test light.
- the first waveguide 220 may or may not include the grating structure 722 shown in FIG. 10B .
- a far-field receiving element 1060 e.g., an optical fiber or a spatial imager, is configured to receive the transmitted portion of the test light from the facet 230 .
- the detector is configured to receive the transmitted portion of the test light from the receiving element 1060 and to measure an amount of the transmitted portion of the test light.
- the lithographically defined feature 1031 may be designed so that changes in a surface characteristic of the facet 230 , e.g., facet angle, produce different far-field patterns.
- an optical fiber 1160 is configured to receive the transmitted portion of the test light from the facet 230 via an input end of the optical fiber 1160 , and the detector is configured to receive the transmitted portion of the test light from the optical fiber 1160 and to measure an amount of the transmitted portion of the test light.
- the optical fiber 1160 is disposed substantially perpendicular to the chip plane, i.e., substantially vertically, such that the input end thereof is disposed near the first waveguide 220 .
- the optical fiber 1160 may be lowered into a dicing lane or a trench, e.g., an etched trench or a deep silicon trench, on the wafer.
- the input end of the optical fiber 1160 is configured to couple the transmitted portion of the test light from the facet 230 into the optical fiber 1160 when the optical fiber 1160 is disposed substantially perpendicular to the chip plane.
- the input end of the optical fiber 1160 may include an optical sub-assembly 1161 , e.g., a prism, as shown in FIG. 11 , an angled tip 1261 , as shown in FIG. 12 , or a bent end 1361 , as shown in FIG. 13 .
- the test structure comprises a first chip 1410 , typically a photonic chip, that includes a first waveguide 1420 configured to direct test light towards the facet 1430 in a direction at an oblique first angle a to the top edge of the facet 1430 . At least an output segment of the first waveguide 1420 is disposed at the first angle to the top edge of the facet 1430 .
- the test light When the test light is incident on the facet 1430 , a portion of the test light is reflected by the facet 1430 .
- the test light may be substantially totally internally reflected by the facet 1430 .
- the first angle of the first waveguide 1420 may be selected such that total internal reflection is sensitive to the facet angle.
- the test structure may be included in a test system that also includes a light source, a detector, and/or a processor.
- the light source e.g., a laser or a broadband light source
- the detector e.g., a photodetector
- the detector is configured to measure an amount, e.g., an optical power, of the reflected portion of the test light or the transmitted portion of the test light.
- the detector detects the reflected portion of the test light or the transmitted portion of the test light and provides an output signal representative of the amount of the reflected portion of the test light or the transmitted portion of the test light to the processor.
- the processor e.g., a general-purpose processor or a special-purpose processor, is configured, e.g., programmed with instructions, to determine a surface characteristic of the facet 1430 , such as a facet angle, a facet curvature, and/or a facet roughness, on the basis of the measured amount.
- the measured amount is compared to a threshold amount to determine whether the surface characteristic, typically the facet angle, is within a range corresponding to total internal reflection. For example, if a measured optical power of the reflected portion of the test light is greater than a threshold optical power, then the facet angle is determined to be within a facet-angle range providing total internal reflection. For another example, if a measured optical power of the transmitted portion of the test light is greater than a threshold optical power, then the facet angle is determined to be outside of a facet-angle range providing total internal reflection.
- a plurality of first waveguides 1420 each having output segments disposed at different first angles relative to the top edge of the facet 1430 , may be used to determine the surface characteristic, typically the facet angle, more precisely. By determining which of the first angles result in the test light being substantially totally internally reflected by the facet 1430 , both a lower bound and an upper bound for the facet angle may be determined.
- the first photonic chip 1410 further includes a first vertical coupler 1421 , e.g., a grating coupler, as an input port, a second waveguide 1440 , and a second vertical coupler 1441 , e.g., a grating coupler, as an output port.
- the first vertical coupler 1421 is configured to couple the test light from an off-chip light source into the first waveguide 1420 .
- the second waveguide 1440 is disposed at a substantially same height as the first waveguide 1420 in a reflection path of the reflected portion of the test light, and is configured to receive the reflected portion of the test light from the facet 1430 .
- At least an input segment of the second waveguide 1440 is disposed at a second angle to the top edge of the facet 1430 , the second angle being substantially equal in magnitude to the first angle.
- the second vertical coupler 1441 is configured to couple the reflected portion of the test light from the second waveguide 1440 to an off-chip detector configured to measure the amount of the reflected portion of the test light.
- the embodiment of FIG. 15 is similar to the embodiment of FIG. 14 , but the first photonic chip 1410 includes a first integrated photodetector 1550 , e.g., a large-area photodetector, in place of the second waveguide 1440 and the second vertical coupler 1441 .
- the first integrated photodetector 1550 is disposed near the facet 1430 at a substantially same height as the first waveguide 1420 in a reflection path of the reflected portion of the test light, and is configured to receive the reflected portion of the test light from the facet 1430 and to measure the amount of the reflected portion of the test light.
- FIG. 16 is similar to the embodiment of FIG. 15 , but further includes a second chip 1610 , typically a photonic chip, including a second integrated photodetector 1650 .
- the second photonic chip 1610 is disposed across a dicing lane from the first photonic chip 1410 on the same wafer as the first photonic chip 1410 .
- the second integrated photodetector 1650 is disposed on the second photonic chip 1610 in a transmission path of the transmitted portion of the test light, and is configured to receive the transmitted portion of the test light and to measure the amount of the transmitted portion of the test light.
- the test structure comprises a chip 1810 , typically a photonic chip, that includes one or more waveguides 1820 configured to direct test light in a direction substantially parallel to a top edge of a facet 1830 of the photonic chip 1810 . At least a test segment of each waveguide 1820 is disposed substantially parallel to the top edge of the facet 1830 .
- the test structure may be included in a test system that also includes a light source, a detector, and/or a processor.
- the light source e.g., a laser or a broadband light source
- the detector e.g., a photodetector
- the detector is configured to measure an amount, e.g., an optical power, of the test light transmitted by the waveguide 1820 .
- the detector detects the transmitted test light and provides an output signal representative of the amount of the transmitted test light to the processor.
- the processor e.g., a general-purpose processor or a special-purpose processor, is configured, e.g., programmed with instructions, to determine a surface characteristic of the facet 1830 , such as a facet angle, a facet curvature, and/or a facet roughness, on the basis of the measured amount.
- the photonic chip 1810 includes a plurality of input vertical couplers 1821 , e.g., grating couplers, as input ports, a plurality of waveguides 1820 , and a plurality of output vertical couplers 1822 , e.g., grating couplers, as output ports.
- Each of the plurality of waveguides 1820 includes a test segment disposed at a substantially same height and substantially parallel to the top edge of the facet 1830 at a different distance from the facet 1830 .
- Each of the plurality of input vertical couplers 1821 is configured to couple the test light from an off-chip light source into a waveguide 1820
- each of the plurality of second vertical couplers 1822 is configured to couple the test light from the waveguide 1820 to an off-chip detector configured to measure the amount of the test light transmitted by the waveguide 1820 .
- the test segments Prior to forming the facet 1830 , the test segments are formed near the expected location of the facet 1830 , typically so as to bound the expected location. When the facet 1830 is formed, e.g., by etching, some of the test segments may be entirely or partially removed. For example, as shown in FIG. 19 , depending on the location of the photolithography mask relative to a test segment 1820 , the test segment 1820 may be etched or the propagating electric field may extend beyond the facet 1830 . Any of the plurality of waveguides 1820 including a test segment that is entirely or partially removed will no longer effectively transmit the test light between the input and output ports.
- the location of the facet 1830 relative to the waveguide locations can be determined. Since each waveguide location and the facet location at the surface of the photonic chip 1810 , e.g., the etch start location, are predetermined, e.g., lithographically defined, the facet angle from chip surface to the waveguide location can be determined.
- the processor may be configured to determine the facet angle on the basis of the measured amounts of test light transmitted by each waveguide 1820 and the predetermined waveguide locations.
- FIG. 20 is similar to the embodiment of FIG. 18 , but the photonic chip 1810 further includes at least one resonator 2070 , e.g., a ring resonator, coupled to at least one waveguide 1820 , e.g., by a directional coupler.
- the resonator 2070 is disposed adjacent to the test segment of the waveguide 1820 , between the test segment and the facet 1830 . A portion of the test light is coupled from the waveguide 1820 into the resonator 2070 and back into the waveguide 1820 .
- a detector may be configured to measure the amount of test light transmitted by the waveguide 1820 as a function of spectral position, i.e., frequency or wavelength, in order to obtain a transmission spectrum of the resonator 2070 .
- the transmission spectrum of the resonator 2070 may depend on the proximity of the resonator 2070 to the facet 1830 and/or on a surface characteristic of the facet 1830
- the processor may be configured to determine the surface characteristic of the facet 1830 on the basis of the transmission spectrum. For example, proximity to the facet 1830 and/or facet roughness may increase optical loss in the resonator 2070 and reduce the quality (Q)-factor of the resonator 2070 , altering the transmission spectrum of the resonator 2070 .
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Abstract
A test system for determining a surface characteristic of a chip facet comprises a chip, which has a facet and includes a waveguide, a detector, and a processor. The on-chip waveguide is configured to direct test light towards the facet, where a portion of the test light is reflected and a portion of the test light is transmitted. The detector is configured to measure an amount of the reflected portion or the transmitted portion, and the processor is configured to determine a surface characteristic of the facet, such as a facet angle, a facet curvature, and/or a facet roughness, on the basis of the measured amount.
Description
- This application is a continuation of U.S. patent application Ser. No. 16/546,179, filed Aug. 20, 2019, now allowed, which is a continuation of U.S. patent application Ser. No. 15/427,185, filed Feb. 8, 2017, now U.S. Pat. No. 10,429,313, which is hereby incorporated by reference in its entirety.
- The present invention relates to methods, test structures, and test systems for determining a surface characteristic of a chip facet. More particularly, the present invention relates to methods, test structures, and test systems for determining a surface characteristic of a facet of a photonic chip including a waveguide.
- In devices and systems incorporating photonic chips, it is often necessary to couple light from an on-chip waveguide into an off-chip optical fiber. With reference to
FIG. 1 , in a conventional edge coupling arrangement, aphotonic chip 110 includes awaveguide 120, such as an edge coupler, that directs light towards afacet 130 of thephotonic chip 110. The light is coupled out of thefacet 130 into an off-chipoptical fiber 140. Typically, owing to fabrication process limitations, thefacet 130 is not perfectly perpendicular to the propagation path of the light and the plane of thephotonic chip 110, which can reduce coupling efficiency. Accordingly, it is desirable to determine thefacet angle 0, defined relative to the plane of thephotonic chip 110 inFIG. 1 . - Conventionally, scanning electron microscopic (SEM) techniques are used to determine the facet angle. In one technique, the facet angle is determined from top-view or perspective-view SEM images of chips on a wafer. Unfortunately, the accuracy and throughput of this technique may be inadequate, and the number of measurement sites that can be accommodated by the technique may be limited. In another technique, the facet angle is determined from cross-sectional SEM images of chips on a wafer. Although this technique provides a higher accuracy, the technique often requires additional and/or destructive processing steps.
- Accordingly, there is a need for new methods, test structures, and test systems for determining the facet angle and other surface characteristics of a chip facet, particularly at the wafer scale.
- Accordingly, an aspect of the present invention relates to a test system for determining a surface characteristic of a chip facet, the test system comprising: a chip having a facet, the chip including a waveguide configured to direct test light towards the facet; a detector configured to measure an amount of a portion of the test light reflected by the facet or a portion of the test light transmitted by the facet; and a processor configured to determine a surface characteristic of the facet on the basis of the measured amount.
- Another aspect of the present invention relates to a method of determining a surface characteristic of a chip facet, the method comprising: providing a chip having a facet, the chip including a waveguide; directing test light towards the facet via the waveguide; measuring an amount of a portion of the test light reflected by the facet or a portion of the test light transmitted by the facet; and determining a surface characteristic of the facet on the basis of the measured amount.
- Numerous exemplary embodiments of the present invention will now be described in greater detail with reference to the accompanying drawings wherein:
-
FIG. 1 is a schematic illustration of a cross-sectional side view of a conventional edge-coupling arrangement. -
FIG. 2 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 3 is a schematic illustration of a top view of a test structure. -
FIG. 4 is a schematic illustration of a top view of a test structure. -
FIG. 5 is a schematic illustration of a top view of a test structure. -
FIG. 6 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 7 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 8 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 9 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 10A is a schematic illustration of a top view of a test structure. -
FIG. 10B is a schematic illustration of a cross-sectional side view of the test structure ofFIG. 10A . -
FIG. 11 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 12 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 13 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 14 is a schematic illustration of a top view of a test structure. -
FIG. 15 is a schematic illustration of a top view of a test structure. -
FIG. 16 is a schematic illustration of a top view of a test structure. -
FIG. 17 is a schematic illustration of a relationship between waveguide angle, facet angle, and critical angle. -
FIG. 18 is a schematic illustration of a top view of a test structure. -
FIG. 19 is a schematic illustration of a cross-sectional side view of a test structure. -
FIG. 20 is a schematic illustration of a top view of a test structure. - The present invention provides methods, test structures, and test systems for determining a surface characteristic of a chip facet, typically a facet of a photonic chip. Advantageously, the methods, test structure, and test systems may be used to determine the surface characteristic of the chip facet at the wafer scale, i.e., while the photonic chip is on a wafer, prior to dicing or packaging. The methods, test structures, and test systems may be implemented with any suitable type of integrated photonics platform, for example, a silicon-on-insulator (SOI) platform, e.g., with silicon and/or silicon nitride waveguides, a silica-on-silicon platform, or a III-V material platform.
- In general, the photonic chip includes a facet and at least one waveguide. The facet is typically an edge facet disposed at an edge of the photonic chip, and a top edge of the facet typically forms the chip edge. The facet is typically formed as a sidewall of a trench in the wafer, e.g., by etching. The facet may be substantially perpendicular to a plane of the photonic chip, and typically to a plane of the wafer, or may be inclined relative to the chip plane. The facet may be coated with an antireflective coating.
- The waveguide may be any suitable type of waveguide, for example, a ridge waveguide, e.g., a narrow single-mode ridge waveguide or a wide multi-mode ridge waveguide, a strip waveguide, or a slot waveguide. The waveguide is typically formed in the photonic chip, i.e., formed on or in a substrate or layer of the photonic chip. Accordingly, the waveguide is typically disposed substantially parallel to the chip plane. In some embodiments, the waveguide or a segment thereof is disposed substantially perpendicular to the top edge of the facet, and typically to the chip edge. In other embodiments, the waveguide or a segment thereof is disposed at an oblique angle to the top edge of the facet. In yet other embodiments, the waveguide or a segment thereof is disposed substantially parallel to the top edge of the facet.
- Several exemplary embodiments of test structures that can be used in methods and test systems for determining a surface characteristic of a chip facet are described hereafter. It should be understood that individual elements of any of the exemplary embodiments may be combined as appropriate to arrive at further embodiments.
- In the exemplary embodiments of
FIGS. 2-13 , the test structure comprises achip 210, typically a photonic chip, that includes afirst waveguide 220 configured to direct test light towards thefacet 230 in a direction substantially perpendicular to a top edge of afacet 230 of thephotonic chip 210. At least an output segment of thefirst waveguide 220 is disposed substantially perpendicular to the top edge of thefacet 230. When the test light is incident on thefacet 230, a portion of the test light is reflected by thefacet 230, and a portion of the test light is transmitted by thefacet 230. - The test structure may be included in a test system that also includes a light source, a detector, and/or a processor. The light source, e.g., a laser or a broadband light source, is configured to provide the test light. The detector, e.g., a photodetector, is configured to measure an amount, e.g., an optical power, of the reflected portion of the test light or the transmitted portion of the test light. Typically, the detector detects the reflected portion of the test light or the transmitted portion of the test light and provides an output signal representative of the amount of the reflected portion of the test light or the transmitted portion of the test light to the processor. The processor, e.g., a general-purpose processor or a special-purpose processor, is configured, e.g., programmed with instructions, to determine a surface characteristic of the
facet 230, such as a facet angle, a facet curvature, and/or a facet roughness, on the basis of the measured amount. Typically, the surface characteristic is determined by using a empirical model, such as a calibration curve, relating the measured amount to the surface characteristic. - In the embodiment of
FIG. 2 , thefirst waveguide 220 is configured to receive the reflected portion of the test light from thefacet 230, and the detector is configured to measure the amount of the reflected portion of the test light. An optical circulator may be used as both an input port configured to couple the test light from an off-chip light source into thefirst waveguide 220 and as an output port configured to couple the reflected portion of the test light to an off-chip detector. Alternatively, an off-chip reflectometer may be used as a detector. - In the embodiment of
FIG. 3 , thephotonic chip 210 further includes a firstvertical coupler 321, e.g., a grating coupler, as an input port, asecond waveguide 340, and a secondvertical coupler 341, e.g., a grating coupler, as an output port. The firstvertical coupler 321 is configured to couple the test light from an off-chip light source into thefirst waveguide 220. Thesecond waveguide 340 is coupled to thefirst waveguide 220 to receive the reflected portion of the test light from thefirst waveguide 220. Thefirst waveguide 220 and thesecond waveguide 340 may be coupled by a directional coupler, as shown inFIG. 3 , or a multimode interference (MMI) coupler, e.g., a 2×1 MMI coupler or a 2×2 MMI coupler. The secondvertical coupler 341 is configured to couple the reflected portion of the test light from thesecond waveguide 340 to an off-chip detector configured to measure the amount of the reflected portion of the test light. - The embodiment of
FIG. 4 is similar to the embodiment ofFIG. 3 , but thephotonic chip 210 includes an on-chip detector 450, e.g., a photodetector, configured to measure the amount of the reflected portion of the test light, in place of the secondvertical coupler 341. - The embodiment of
FIG. 5 is similar to the embodiment ofFIG. 3 , but thephotonic chip 210 further includes a phase shifter 543 and amirror 544, which together with thefirst waveguide 220 and thesecond waveguide 340 are included in an on-chip Michelson interferometer. Thefirst waveguide 220 forms a test arm of the Michelson interferometer and is configured to direct test light towards thefacet 230. Thesecond waveguide 340 forms a reference arm of the Michelson interferometer and is configured to direct reference light towards themirror 544. In some embodiments, the reference arm has an adjustable optical path length. For example, the optical path length may be thermally adjustable or may be adjustable by adjusting a charge-carrier concentration in the reference arm. The phase shifter 543 is configured to phase shift the reference light. Thephotonic chip 210 also includes an on-chipbalanced photodetector 550 configured to receive the reflected portion of the test light from the test arm and the reflected reference light from the reference arm, and to measure the amount of the reflected portion of the test light as an interference pattern. Other similar embodiments may use an off-chip balanced photodetector and/or an off-chip Michelson interferometer. - Advantageously, the use of a Michelson interferometer may enhance the signal of the reflected portion of the test light, providing a larger dynamic range and improved measurement sensitivity. To illustrate how the signal of the reflected portion of the test light may be enhanced, a Michelson interferometer including a 2×2 MMI coupler may be considered. If two signals with respective optical powers of P1 and P2 enter the two input ports of the 2×2 MMI coupler, the output optical power Pout from each of the output ports of the 2×2 MMI coupler will be 1/2[P1+P2+2√{square root over (P1P2)} cos(Δϕ)], where Δϕ is the relative phase shift between the electric fields of the two signals. If the output optical power from each of the two paths is input to a
balanced photodetector 550, then the output photocurrent from thebalanced photodetector 550 will be proportional to 2√{square root over (P1P2)} cos(Δϕ). If we assume that P1 is the optical power of the portion of the test light reflected by thefacet 230, and that P2 is the optical power of reference light reflected from amirror 544 with a reflectivity of 100%, then P1 is likely to be smaller than P2. If the relative phase shift between the two signals is modulated through a by the phase shifter 543, then the interference signal at thebalanced photodetector 550 will have a power greater than P1 alone. In this way, the amount of the reflected portion of the test light can be more easily measured, even when the amount is relatively small. - In the embodiment of
FIG. 6 , thephotonic chip 210 further includes anintegrated photodetector 650, e.g., a large-area photodetector. Theintegrated photodetector 650 is disposed near thefacet 230 at a different height from thefirst waveguide 220, and is configured to receive the reflected portion of the test light from thefacet 230 and to measure an amount of the reflected portion of the test light. Theintegrated photodetector 650 may be disposed above or below, as shown inFIG. 6 , thefirst waveguide 220. Advantageously, the use of anintegrated photodetector 650 may allow a larger portion of the test light reflected by thefacet 230 to be detected and measured, since there is no need to couple the reflected portion of the test light into a waveguide. - In the embodiments of
FIGS. 7 to 9 , thefirst waveguide 220 includes agrating structure 722 configured to diffract the test light exiting thefirst waveguide 220. Thegrating structure 722 is typically formed, e.g., etched, in thefirst waveguide 220 near an output end thereof. - In the embodiment of
FIG. 7 , thefacet 230 is intentionally inclined, and thegrating structure 722 is configured to diffract the test light such that the test light is directed towards thefacet 230 in a direction substantially perpendicular to theinclined facet 230. Typically, thegrating structure 722 is configured to diffract the test light upwards by a diffraction angle that is substantially equal in magnitude to 90° minus a desired facet angle defined relative to the chip plane. Such an embodiment may provide more efficient coupling of the reflected portion of the test light intofirst waveguide 220. - In the embodiments of
FIGS. 8 and 9 , thephotonic chip 210 further includes asecond waveguide 840 disposed at a different height from thefirst waveguide 220 and configured to receive the reflected portion of the test light from thefacet 230, and the detector is configured to measure an amount of the reflected portion of the test light. Thesecond waveguide 840 may be disposed above, as shown inFIGS. 8 and 9 , or below thefirst waveguide 220, and may, as shown inFIG. 9 , or may not, as shown inFIG. 8 , include agrating structure 942. Typically, thefirst waveguide 220 and thesecond waveguide 840 are incorporated at different layers in thephotonic chip 210, e.g., at different dielectric layers in an SOI chip. Since the facet angle may cause the reflected portion of the test light to be reflected at an angle, the additionalsecond waveguide 840 at a different height from thefirst waveguide 220 may increase the sensitivity of the measurement. In other similar embodiments, thesecond waveguide 840 may be connected to optical circuits similar to those shown inFIGS. 3 to 5 . - In some embodiments, the
facet 230 includes a lithographically defined feature, e.g., a lens, near thefirst waveguide 220, that is configured to facilitate reflection of the reflected portion of the test light or to facilitate transmission of the transmitted portion of the test light. In a non-illustrated embodiment, the lithographically defined feature is configured to facilitate coupling of the reflected portion of the test light into thefirst waveguide 220, and the detector is configured to measure an amount of the reflected portion of the test light. - In the embodiment of
FIG. 10 , the lithographically definedfeature 1031 is configured to facilitate far-field imaging of the transmitted portion of the test light. Thefirst waveguide 220 may or may not include thegrating structure 722 shown inFIG. 10B . A far-field receiving element 1060, e.g., an optical fiber or a spatial imager, is configured to receive the transmitted portion of the test light from thefacet 230. In some instances, the detector is configured to receive the transmitted portion of the test light from the receivingelement 1060 and to measure an amount of the transmitted portion of the test light. In other instances, the lithographically definedfeature 1031 may be designed so that changes in a surface characteristic of thefacet 230, e.g., facet angle, produce different far-field patterns. - In the embodiments of
FIGS. 11-13 , anoptical fiber 1160 is configured to receive the transmitted portion of the test light from thefacet 230 via an input end of theoptical fiber 1160, and the detector is configured to receive the transmitted portion of the test light from theoptical fiber 1160 and to measure an amount of the transmitted portion of the test light. During testing, theoptical fiber 1160 is disposed substantially perpendicular to the chip plane, i.e., substantially vertically, such that the input end thereof is disposed near thefirst waveguide 220. For example, theoptical fiber 1160 may be lowered into a dicing lane or a trench, e.g., an etched trench or a deep silicon trench, on the wafer. The input end of theoptical fiber 1160 is configured to couple the transmitted portion of the test light from thefacet 230 into theoptical fiber 1160 when theoptical fiber 1160 is disposed substantially perpendicular to the chip plane. For example, the input end of theoptical fiber 1160 may include anoptical sub-assembly 1161, e.g., a prism, as shown inFIG. 11 , anangled tip 1261, as shown inFIG. 12 , or abent end 1361, as shown inFIG. 13 . - In the exemplary embodiments of
FIGS. 14, 15, and 16 , the test structure comprises afirst chip 1410, typically a photonic chip, that includes afirst waveguide 1420 configured to direct test light towards thefacet 1430 in a direction at an oblique first angle a to the top edge of thefacet 1430. At least an output segment of thefirst waveguide 1420 is disposed at the first angle to the top edge of thefacet 1430. When the test light is incident on thefacet 1430, a portion of the test light is reflected by thefacet 1430. Depending on the first angle of thefirst waveguide 1420 and the facet angle, the test light may be substantially totally internally reflected by thefacet 1430. If the test light is not substantially totally internally reflected, a portion of the test light is transmitted by thefacet 1430. As shown inFIG. 17 , the incidence angle ϕ of the test light, defined relative to the facet normal, depends on both the first angle a and the facet angle θ according to ϕ=√{square root over (α2+θ2)}, and total internal reflection occurs for the critical incidence angle ϕc when ϕc=arcsin (n2/n1), where n1 and n2 are the refractive indices bounding thefacet 1430. Accordingly, the first angle of thefirst waveguide 1420 may be selected such that total internal reflection is sensitive to the facet angle. - The test structure may be included in a test system that also includes a light source, a detector, and/or a processor. The light source, e.g., a laser or a broadband light source, is configured to provide the test light. The detector, e.g., a photodetector, is configured to measure an amount, e.g., an optical power, of the reflected portion of the test light or the transmitted portion of the test light. Typically, the detector detects the reflected portion of the test light or the transmitted portion of the test light and provides an output signal representative of the amount of the reflected portion of the test light or the transmitted portion of the test light to the processor. The processor, e.g., a general-purpose processor or a special-purpose processor, is configured, e.g., programmed with instructions, to determine a surface characteristic of the
facet 1430, such as a facet angle, a facet curvature, and/or a facet roughness, on the basis of the measured amount. - Typically, the measured amount is compared to a threshold amount to determine whether the surface characteristic, typically the facet angle, is within a range corresponding to total internal reflection. For example, if a measured optical power of the reflected portion of the test light is greater than a threshold optical power, then the facet angle is determined to be within a facet-angle range providing total internal reflection. For another example, if a measured optical power of the transmitted portion of the test light is greater than a threshold optical power, then the facet angle is determined to be outside of a facet-angle range providing total internal reflection. In some instances, a plurality of
first waveguides 1420, each having output segments disposed at different first angles relative to the top edge of thefacet 1430, may be used to determine the surface characteristic, typically the facet angle, more precisely. By determining which of the first angles result in the test light being substantially totally internally reflected by thefacet 1430, both a lower bound and an upper bound for the facet angle may be determined. - In the embodiment of
FIG. 14 , thefirst photonic chip 1410 further includes a firstvertical coupler 1421, e.g., a grating coupler, as an input port, asecond waveguide 1440, and a secondvertical coupler 1441, e.g., a grating coupler, as an output port. The firstvertical coupler 1421 is configured to couple the test light from an off-chip light source into thefirst waveguide 1420. Thesecond waveguide 1440 is disposed at a substantially same height as thefirst waveguide 1420 in a reflection path of the reflected portion of the test light, and is configured to receive the reflected portion of the test light from thefacet 1430. At least an input segment of thesecond waveguide 1440 is disposed at a second angle to the top edge of thefacet 1430, the second angle being substantially equal in magnitude to the first angle. The secondvertical coupler 1441 is configured to couple the reflected portion of the test light from thesecond waveguide 1440 to an off-chip detector configured to measure the amount of the reflected portion of the test light. - The embodiment of
FIG. 15 is similar to the embodiment ofFIG. 14 , but thefirst photonic chip 1410 includes a firstintegrated photodetector 1550, e.g., a large-area photodetector, in place of thesecond waveguide 1440 and the secondvertical coupler 1441. The firstintegrated photodetector 1550 is disposed near thefacet 1430 at a substantially same height as thefirst waveguide 1420 in a reflection path of the reflected portion of the test light, and is configured to receive the reflected portion of the test light from thefacet 1430 and to measure the amount of the reflected portion of the test light. - The embodiment of
FIG. 16 is similar to the embodiment ofFIG. 15 , but further includes asecond chip 1610, typically a photonic chip, including a secondintegrated photodetector 1650. Thesecond photonic chip 1610 is disposed across a dicing lane from thefirst photonic chip 1410 on the same wafer as thefirst photonic chip 1410. The secondintegrated photodetector 1650 is disposed on thesecond photonic chip 1610 in a transmission path of the transmitted portion of the test light, and is configured to receive the transmitted portion of the test light and to measure the amount of the transmitted portion of the test light. - In the exemplary embodiments of
FIGS. 18 to 20 , the test structure comprises achip 1810, typically a photonic chip, that includes one ormore waveguides 1820 configured to direct test light in a direction substantially parallel to a top edge of afacet 1830 of thephotonic chip 1810. At least a test segment of eachwaveguide 1820 is disposed substantially parallel to the top edge of thefacet 1830. - The test structure may be included in a test system that also includes a light source, a detector, and/or a processor. The light source, e.g., a laser or a broadband light source, is configured to provide the test light. The detector, e.g., a photodetector, is configured to measure an amount, e.g., an optical power, of the test light transmitted by the
waveguide 1820. Typically, the detector detects the transmitted test light and provides an output signal representative of the amount of the transmitted test light to the processor. The processor, e.g., a general-purpose processor or a special-purpose processor, is configured, e.g., programmed with instructions, to determine a surface characteristic of thefacet 1830, such as a facet angle, a facet curvature, and/or a facet roughness, on the basis of the measured amount. - In the embodiment of
FIG. 18 , thephotonic chip 1810 includes a plurality of inputvertical couplers 1821, e.g., grating couplers, as input ports, a plurality ofwaveguides 1820, and a plurality of outputvertical couplers 1822, e.g., grating couplers, as output ports. Each of the plurality ofwaveguides 1820 includes a test segment disposed at a substantially same height and substantially parallel to the top edge of thefacet 1830 at a different distance from thefacet 1830. Each of the plurality of inputvertical couplers 1821 is configured to couple the test light from an off-chip light source into awaveguide 1820, and each of the plurality of secondvertical couplers 1822 is configured to couple the test light from thewaveguide 1820 to an off-chip detector configured to measure the amount of the test light transmitted by thewaveguide 1820. - Prior to forming the
facet 1830, the test segments are formed near the expected location of thefacet 1830, typically so as to bound the expected location. When thefacet 1830 is formed, e.g., by etching, some of the test segments may be entirely or partially removed. For example, as shown inFIG. 19 , depending on the location of the photolithography mask relative to atest segment 1820, thetest segment 1820 may be etched or the propagating electric field may extend beyond thefacet 1830. Any of the plurality ofwaveguides 1820 including a test segment that is entirely or partially removed will no longer effectively transmit the test light between the input and output ports. By determining which of the plurality ofwaveguides 1820 transmit light and which do not, the location of thefacet 1830 relative to the waveguide locations can be determined. Since each waveguide location and the facet location at the surface of thephotonic chip 1810, e.g., the etch start location, are predetermined, e.g., lithographically defined, the facet angle from chip surface to the waveguide location can be determined. The processor may be configured to determine the facet angle on the basis of the measured amounts of test light transmitted by eachwaveguide 1820 and the predetermined waveguide locations. - The embodiment of
FIG. 20 is similar to the embodiment ofFIG. 18 , but thephotonic chip 1810 further includes at least oneresonator 2070, e.g., a ring resonator, coupled to at least onewaveguide 1820, e.g., by a directional coupler. Theresonator 2070 is disposed adjacent to the test segment of thewaveguide 1820, between the test segment and thefacet 1830. A portion of the test light is coupled from thewaveguide 1820 into theresonator 2070 and back into thewaveguide 1820. Accordingly, a detector may be configured to measure the amount of test light transmitted by thewaveguide 1820 as a function of spectral position, i.e., frequency or wavelength, in order to obtain a transmission spectrum of theresonator 2070. As the transmission spectrum of theresonator 2070 may depend on the proximity of theresonator 2070 to thefacet 1830 and/or on a surface characteristic of thefacet 1830, the processor may be configured to determine the surface characteristic of thefacet 1830 on the basis of the transmission spectrum. For example, proximity to thefacet 1830 and/or facet roughness may increase optical loss in theresonator 2070 and reduce the quality (Q)-factor of theresonator 2070, altering the transmission spectrum of theresonator 2070. - The present disclosure is not to be limited in scope by the specific embodiments described herein. Indeed, other various embodiments of and modifications to the present disclosure, in addition to those described herein, will be apparent to those of ordinary skill in the art from the foregoing description and accompanying drawings. Thus, such other embodiments and modifications are intended to fall within the scope of the present disclosure. Further, although the present disclosure has been described herein in the context of a particular implementation in a particular environment for a particular purpose, those of ordinary skill in the art will recognize that its usefulness is not limited thereto and that the present disclosure may be beneficially implemented in any number of environments for any number of purposes.
Claims (19)
1. A method for determining a surface characteristic of a facet of a photonic chip, the method comprising:
using a first waveguide defined in a wafer to direct test light toward a sidewall etched in the wafer, the sidewall forming the facet of the photonic chip;
measuring at least one of: a reflected portion of the test light that is reflected by the sidewall, or a transmitted portion of the test light that is transmitted through the sidewall; and,
determining a surface characteristic of the facet based upon at least one of the reflected portion or the transmitted portion.
2. The method of claim 1 comprising selectively etching the wafer to form the sidewall.
3. The method of claim 1 wherein the measuring is performed before the photonic chip is separated from the wafer.
4. The method of claim 1 wherein the measuring is performed after the photonic chip is separated from the wafer.
5. The method of claim 1 comprising coupling the test light into the first waveguide using a first vertical coupler.
6. The method of claim 1 comprising coupling the reflected portion of the test light to a first photodetector (PD).
7. The method of claim 6 wherein the first PD is separate from the photonic chip, and wherein the coupling of the reflected portion of the test light to the first PD comprises using a second vertical coupler.
8. The method of claim 6 wherein the first PD is integrated with the photonic chip.
9. The method of claim 6 comprising coupling the reflected portion of the test light into a second waveguide that is monolithically integrated with the first waveguide, for guiding at least a fraction thereof into the first PD.
10. The method of claim 9 first waveguide, and collecting the reflected portion of the test light upon a reflection thereof from the facet using an end section of the second waveguide that is inclined toward the first waveguide.
11. The method of claim 6 comprising collecting the reflected portion of the test light into an end section of the first waveguide that is proximate to the facet.
12. The method of claim 10 comprising coupling at least a fraction of the reflected portion of the test light from the first waveguide into a second waveguide for guiding to the first PD.
13. The method of claim 12 comprising using an on-chip Michelson interferometer to measure the reflected portion of the test light.
14. The method of claim 13 comprising using the first waveguide as a test arm of the on-chip Michelson interferometer, using the second waveguide as a reference arm of the on-chip Michelson interferometer, using an integrated 2×2 optical coupler to optically couple the first waveguide to the second waveguide, and an integrated reflector disposed at one end of the second waveguide to reflect a fraction of the test light back toward the integrated 2×2 optical coupler as reference light for mixing with the reflected portion of the test light prior to coupling to the first PD.
15. The method of claim 14 comprising using an integrated balanced photodetector comprising the first PD coupled to the second waveguide and a second PD coupled to the first waveguide.
16. The method of claim 14 comprising adjusting an optical phase of the reference light using an integrated phase shifter.
17. The method of claim 8 wherein the first PD is disposed above or below the first waveguide relative to a plane of the wafer.
18. The method of claim 1 wherein the measuring comprises measuring the transmitted portion of the test light.
19. The method of claim 18 wherein the measuring is performed on-wafer using an optical fiber to collect the transmitted portion of the test light into a photodetector (PD).
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2020
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US10429313B2 (en) | 2019-10-01 |
US10634620B2 (en) | 2020-04-28 |
US20190369029A1 (en) | 2019-12-05 |
US20180224501A1 (en) | 2018-08-09 |
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