US20200161283A1 - Display module and display device including inorganic light emitting element and light blocking member on connecting member - Google Patents
Display module and display device including inorganic light emitting element and light blocking member on connecting member Download PDFInfo
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- US20200161283A1 US20200161283A1 US16/589,459 US201916589459A US2020161283A1 US 20200161283 A1 US20200161283 A1 US 20200161283A1 US 201916589459 A US201916589459 A US 201916589459A US 2020161283 A1 US2020161283 A1 US 2020161283A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/387—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
- This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2018-0140918, filed on Nov. 15, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein its entirety.
- The disclosure relates to a technology for disposing an inorganic light emitting element and a light blocking member on a connecting member to improve the contrast ratio (CR) of a display.
- A display module including a display device may display a screen in various ways. A display device, such as a liquid crystal display (LCD) device or a light emitting diode (LED) chip, which includes a back light has a thin film transistor (TFT) substrate and a color filter substrate that are sequentially disposed on the back light, in which the color filter substrate imparts colors to light emitted from the back light. A light blocking member such as a black matrix (BM) for preventing the mixture of light passing through color filters of different colors is disposed between the color filters. The light blocking member is disposed on a region through which light does not pass.
- Recently, a display module having micro light emitting diodes (μLEDs) applied thereto has emerged. The display module having the μLEDs applied thereto includes micrometer-scale inorganic light emitting elements having an area less than about 0.01 times to about 0.1 times the areas of LED chips. The inorganic light emitting elements are at least partly exposed on an upper side of a TFT substrate and emit light of their own colors.
- In the case of the display module having the color filters, the luminance of a screen displayed may be decreased. Furthermore, in the case of the display module having the light blocking member disposed between the color filters, the viewing angle may be reduced, and therefore the display quality of the display module may be degraded when the display module is viewed from a side.
- In the case of the display module having the inorganic light emitting elements at least partly exposed on the upper side of the TFT substrate, a connecting member may be disposed to fix the inorganic light emitting elements. In this case, the performance of displaying a black gradation may be degraded due to the color of the connecting member. Furthermore, the display quality of the display module may be degraded due to diffused reflection caused by a non-uniform rough surface of the connecting member.
- The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.
- Embodiments of the disclosure address at least the above-mentioned problems and/or disadvantages and provide at least the advantages described below. Accordingly, an example aspect of the disclosure is to provide a display module and a display device that have a light blocking member for improving the contrast ratio of an inorganic light emitting element without reducing a viewing angle and without invading an emissive area of the inorganic light emitting element.
- In accordance with an example aspect of the disclosure, a display module includes a substrate including a plurality of interconnection wires, a connecting member comprising a conductive material disposed on one side of the substrate, a plurality of inorganic light emitting elements arranged on the connecting member, and a light blocking member comprising an opaque material disposed on a region other than regions where the plurality of inorganic light emitting elements are disposed. A portion of each of the plurality of inorganic light emitting elements is disposed to pass through a portion of the connecting member and is spaced apart from the substrate. The connecting member electrically connects each of the plurality of inorganic light emitting elements with at least one interconnection wire among the plurality of interconnection wires. The light blocking member is spaced apart from the substrate and disposed on the connecting member.
- In accordance with another example aspect of the disclosure, a display device includes one or more display modules and a connecting portion including a region joining the one or more display modules. Each of the one or more display modules includes a substrate including a plurality of interconnection wires, a connecting member comprising a conductive material disposed on one side of the substrate, a plurality of inorganic light emitting elements arranged on the connecting member, and a light blocking member comprising an opaque material disposed on a region other than regions where the plurality of inorganic light emitting elements are disposed. A portion of each of the plurality of inorganic light emitting elements is disposed to pass through a portion of the connecting member and is spaced apart from the substrate. The connecting member electrically connects each of the plurality of inorganic light emitting elements with at least one interconnection wire among the plurality of interconnection wires. The light blocking member is spaced apart from the substrate and disposed on the connecting portion and the connecting member.
- In accordance with another example aspect of the disclosure, a display module includes a substrate, a connecting member comprising a conductive material disposed on an upper side of the substrate, a plurality of inorganic light emitting elements, each of which is disposed to pass through at least a portion of the connecting member and is fixed in a specified position, and a black matrix (BM) spaced apart from the plurality of inorganic light emitting elements. The plurality of inorganic light emitting elements are spaced apart from the substrate. The connecting member electrically connects the plurality of inorganic light emitting elements with a plurality of electrodes or a plurality of pads disposed on the substrate. The BM is spaced apart from the substrate and disposed on the connecting member.
- Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.
- The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
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FIG. 1 is a block diagram illustrating an example electronic device in a network environment according to various embodiments; -
FIG. 2 is a block diagram illustrating an example display device according to various embodiments; -
FIG. 3 is a sectional view illustrating an example display module according to an embodiment; -
FIG. 4 is a sectional view illustrating an example display module according to another embodiment; -
FIG. 5 is a sectional view illustrating an example display module according to another embodiment; -
FIG. 6 is a sectional view illustrating an example display module according to another embodiment; -
FIGS. 7A and 7B are sectional views illustrating an example display module according to another embodiment; -
FIG. 8 is a sectional view illustrating an example display module according to another embodiment; -
FIG. 9 is a front view illustrating an example display module according to various embodiments; -
FIG. 10A is a sectional view illustrating an example display module according to another embodiment; -
FIG. 10B is a front view illustrating the example display module according to the other embodiment; -
FIG. 11A is a sectional view illustrating an example display module according to another embodiment; -
FIG. 11B is a front view illustrating an example display module according to another embodiment; -
FIG. 12 is a sectional view illustrating an example display module according to an embodiment; -
FIGS. 13A and 13B are sectional views illustrating an example display module according to another embodiment; -
FIG. 14 is a front view illustrating an example display device according to an embodiment; and -
FIGS. 15A and 15B are sectional views illustrating an example display device according to an embodiment. - With regard to the description of the drawings, identical or similar reference numerals may be used to refer to identical or similar components.
- Hereinafter, various example embodiments of the disclosure will be described with reference to the accompanying drawings. However, those of ordinary skill in the art will recognize that various modifications, equivalents, and/or alternatives on the various example embodiments described herein can be variously made without departing from the scope and spirit of the disclosure.
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FIG. 1 is a block diagram illustrating an exampleelectronic device 101 in anetwork environment 100 according to various embodiments. Referring toFIG. 1 , theelectronic device 101 in thenetwork environment 100 may communicate with anelectronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or anelectronic device 104 or aserver 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, theelectronic device 101 may communicate with theelectronic device 104 via theserver 108. According to an embodiment, theelectronic device 101 may include aprocessor 120, amemory 130, aninput device 150, asound output device 155, adisplay device 160, anaudio module 170, asensor module 176, aninterface 177, ahaptic module 179, acamera module 180, apower management module 188, abattery 189, acommunication module 190, a subscriber identification module (SIM) 196, or anantenna module 197. In some embodiments, at least one (e.g., thedisplay device 160 or the camera module 180) of the components may be omitted from theelectronic device 101, or one or more other components may be added in theelectronic device 101. In some embodiments, some of the components may be implemented as single integrated circuitry. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display). - The
processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of theelectronic device 101 coupled with theprocessor 120, and may perform various data processing or computation. According to an example embodiment, as at least part of the data processing or computation, theprocessor 120 may load a command or data received from another component (e.g., thesensor module 176 or the communication module 190) involatile memory 132, process the command or the data stored in thevolatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, theprocessor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, themain processor 121. Additionally or alternatively, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as part of themain processor 121. - The
auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., thedisplay device 160, thesensor module 176, or the communication module 890) among the components of theelectronic device 101, instead of themain processor 121 while themain processor 121 is in an inactive (e.g., sleep) state, or together with themain processor 121 while themain processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., thecamera module 180 or the communication module 190) functionally related to theauxiliary processor 123. - The
memory 130 may store various data used by at least one component (e.g., theprocessor 120 or the sensor module 176) of theelectronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. Thememory 130 may include thevolatile memory 132 or thenon-volatile memory 134. - The program 840 may be stored in the
memory 130 as software, and may include, for example, an operating system (OS) 842, middleware 844, or anapplication 146. - The
input device 150 may receive a command or data to be used by other component (e.g., the processor 120) of theelectronic device 101, from the outside (e.g., a user) of theelectronic device 101. Theinput device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen). - The
sound output device 155 may output sound signals to the outside of theelectronic device 101. Thesound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker. - The
display device 160 may visually provide information to the outside (e.g., a user) of theelectronic device 101. Thedisplay device 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, thedisplay device 160 may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch. - The
audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, theaudio module 170 may obtain the sound via theinput device 150, or output the sound via thesound output device 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with theelectronic device 101. - The
sensor module 176 may detect an operational state (e.g., power or temperature) of theelectronic device 101 or an environmental state (e.g., a state of a user) external to theelectronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, thesensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. - The
interface 177 may support one or more specified protocols to be used for theelectronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, theinterface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface. - A connecting
terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connectingterminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector). - The
haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, thehaptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator. - The
camera module 180 may capture a still image or moving images. According to an embodiment, thecamera module 180 may include one or more lenses, image sensors, image signal processors, or flashes. - The
power management module 188 may manage power supplied to theelectronic device 101. According to an example embodiment, thepower management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC). - The
battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, thebattery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. - The
communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between theelectronic device 101 and the external electronic device (e.g., theelectronic device 102, theelectronic device 104, or the server 108) and performing communication via the established communication channel. Thecommunication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, thecommunication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth™ wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. Thewireless communication module 192 may identify and authenticate theelectronic device 101 in a communication network, such as thefirst network 198 or thesecond network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in thesubscriber identification module 196. - The
antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, theantenna module 197 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., PCB). According to an embodiment, the antenna module 897 may include a plurality of antennas. In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as thefirst network 198 or thesecond network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. The signal or the power may then be transmitted or received between thecommunication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of theantenna module 197. - At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
- According to an embodiment, commands or data may be transmitted or received between the
electronic device 101 and the externalelectronic device 104 via theserver 108 coupled with thesecond network 199. Each of theelectronic devices electronic device 101. According to an embodiment, all or some of operations to be executed at theelectronic device 101 may be executed at one or more of the externalelectronic devices electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, theelectronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to theelectronic device 101. Theelectronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology may be used, for example. -
FIG. 2 is a block diagram 200 illustrating anexample display device 160 according to various embodiments. Referring toFIG. 2 , thedisplay device 160 may include adisplay 210 and a display driver integrated circuit (DDI) 230 to control thedisplay 210. TheDDI 230 may include aninterface module 231, memory 233 (e.g., buffer memory), animage processing module 235, or amapping module 237. TheDDI 230 may receive image information that contains image data or an image control signal corresponding to a command to control the image data from another component of theelectronic device 101 via theinterface module 231. For example, according to an embodiment, the image information may be received from the processor 120 (e.g., the main processor 121 (e.g., an application processor)) or the auxiliary processor 123 (e.g., a graphics processing unit) operated independently from the function of themain processor 121. TheDDI 230 may communicate, for example, withtouch circuitry 250 or thesensor module 176 via theinterface module 231. TheDDI 230 may also store at least part of the received image information in thememory 233, for example, on a frame by frame basis. - The
image processing module 235 may perform pre-processing or post-processing (e.g., adjustment of resolution, brightness, or size) with respect to at least part of the image data. According to an embodiment, the pre-processing or post-processing may be performed, for example, based at least in part on one or more characteristics of the image data or one or more characteristics of thedisplay 210. - The
mapping module 237 may generate a voltage value or a current value corresponding to the image data pre-processed or post-processed by theimage processing module 235. According to an embodiment, the generating of the voltage value or current value may be performed, for example, based at least in part on one or more attributes of the pixels (e.g., an array, such as an RGB stripe or a pentile structure, of the pixels, or the size of each sub-pixel). At least some pixels of thedisplay 210 may be driven, for example, based at least in part on the voltage value or the current value such that visual information (e.g., a text, an image, or an icon) corresponding to the image data may be displayed via thedisplay 210. - According to an embodiment, the
display device 160 may further include thetouch circuitry 250. Thetouch circuitry 250 may include atouch sensor 251 and atouch sensor IC 253 to control the touch sensor 951. Thetouch sensor IC 253 may control thetouch sensor 251 to sense a touch input or a hovering input with respect to a certain position on thedisplay 210. To achieve this, for example, thetouch sensor 251 may detect (e.g., measure) a change in a signal (e.g., a voltage, a quantity of light, a resistance, or a quantity of one or more electric charges) corresponding to the certain position on thedisplay 210. Thetouch circuitry 250 may provide input information (e.g., a position, an area, a pressure, or a time) indicative of the touch input or the hovering input detected via thetouch sensor 251 to theprocessor 120. According to an embodiment, at least part (e.g., the touch sensor IC 253) of thetouch circuitry 250 may be formed as part of thedisplay 210 or theDDI 230, or as part of another component (e.g., the auxiliary processor 123) disposed outside thedisplay device 160. - According to an embodiment, the
display device 160 may further include at least one sensor (e.g., a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of thesensor module 176 or a control circuit for the at least one sensor. In such a case, the at least one sensor or the control circuit for the at least one sensor may be embedded in one portion of a component (e.g., thedisplay 210, theDDI 230, or the touch circuitry 250)) of thedisplay device 160. For example, when thesensor module 176 embedded in thedisplay device 160 includes a biometric sensor (e.g., a fingerprint sensor), the biometric sensor may obtain biometric information (e.g., a fingerprint image) corresponding to a touch input received via a portion of thedisplay 210. As another example, when thesensor module 176 embedded in thedisplay device 160 includes a pressure sensor, the pressure sensor may obtain pressure information corresponding to a touch input received via a partial or whole area of thedisplay 210. According to an embodiment, thetouch sensor 251 or thesensor module 176 may be disposed between pixels in a pixel layer of thedisplay 210, or over or under the pixel layer. -
FIG. 3 is a sectional view illustrating anexample display module 300 according to an embodiment. Thedisplay module 300 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, such as, for example, a light emitting diode) 330, and a light blocking member (e.g., including an opaque material) 340. In the following drawings, a front side of thedisplay module 300 faces a Z-axis direction, lateral sides of thedisplay module 300 face an X-axis or Y-axis direction, and the Z-axis direction is directed upward. - In an embodiment, the
substrate 310 may include a plurality of interconnection wires. The plurality of interconnection wires arranged on thesubstrate 310 may be connected to at least one inorganic light emitting element among the plurality of inorganiclight emitting elements 330 to supply current. - In an embodiment, the
substrate 310 may include asupport substrate 311 and a thin film transistor (hereinafter, referred to as TFT)substrate 312. - In an embodiment, the
support substrate 311 may form one side of thedisplay module 300. For example, thesupport substrate 311 may form a rear side of thedisplay module 300. Thesupport substrate 311 may, for example, and without limitation, be comprise glass or plastic. Thesupport substrate 311 may maintain the shape of thedisplay module 300 and may protect thedisplay module 300 from an external impact. - In an embodiment, the
TFT substrate 312 may be disposed on one side of thesupport substrate 311. For example, theTFT substrate 312 may be disposed on an upper side of thesupport substrate 311. TheTFT substrate 312 may include a plurality of electrodes connected with the display driver IC 230 (see, e.g.,FIG. 2 ). TheTFT substrate 312 may include, on an upper side thereof, a plurality of pads electrically connected with at least one inorganic light emitting element among the plurality of inorganiclight emitting elements 330. The plurality of pads may be conductive. For example, the plurality of pads may be a plurality of metal pads. TheTFT substrate 312 may include a plurality of interconnection wires connected with the plurality of electrodes and/or the plurality of pads. - In an embodiment, the connecting
member 320 may be disposed on one side of thesubstrate 310. For example, the connectingmember 320 may be disposed on (the term “on” as used herein covers both directly on and indirectly on, and thus the term “on” is not limited to being directly on or contacting) the upper side of theTFT substrate 312. - In an embodiment, the connecting
member 320 may have the plurality of inorganiclight emitting elements 330 mounted in preset positions on the connectingmember 320. The connectingmember 320 may fix the plurality of inorganiclight emitting elements 330. The connectingmember 320 may serve to hold the plurality of inorganiclight emitting elements 330 in place on the connectingmember 320. - In an embodiment, the connecting
member 320 may electrically connect each of the plurality of inorganiclight emitting elements 330 with at least one interconnection wire among the plurality of interconnection wires. The connectingmember 320 may connect the plurality of inorganiclight emitting elements 330 with the plurality of electrodes and/or the plurality of pads of theTFT substrate 312. For example, the connectingmember 320 may include an anisotropic conductive film (hereinafter, referred to as ACF). In this case, the ACF may be attached to at least part of an emissive area on an upper side of thesubstrate 310. The ACF may be attached to the entire upper side of thesubstrate 310. - In an embodiment, the plurality of inorganic
light emitting elements 330 may be arranged on the connectingmember 320. The plurality of inorganiclight emitting elements 330 may be connected with the plurality of interconnection wires included in thesubstrate 310. The plurality of inorganiclight emitting elements 330 may be connected with the plurality of electrodes and/or the plurality of pads included in theTFT substrate 312. The plurality of inorganiclight emitting elements 330 may be supplied with current and may emit light having specified colors. For example, the plurality of inorganiclight emitting elements 330 may include ared light element 331 that emits red light and agreen light element 332 that emits green light. The plurality of inorganiclight emitting elements 330 may emit light by themselves using inorganic materials. For example, each of the plurality of inorganiclight emitting elements 330 may be a micro light emitting diode (μLED). - In an embodiment, the
display module 300 having μLEDs applied thereto may refer, for example, to adisplay module 300 including densely arranged micrometer (μm)-scale LEDs having, for example, and without limitation, an area less than about 0.01 times to about 0.1 times the area of a light emitting diode chip (LED chip) and may be too small to be identified with eyes. The μLEDs have high response speed, consume low power, and have high luminance. The μLEDs are capable of implementing high resolution and excellent color, contrast, and brightness. - In an embodiment, the μLEDs may accurately represent a wide range of colors and may implement a clear screen even outdoors in bright sunlight. Furthermore, the μLEDs may ensure a long service life without deformation due to high resistance to burn-in and low heat. The μLEDs are appropriate for a virtual reality (VR) or augmented reality (AR) display module, which has to display rapidly changing images, because the μLEDs are capable of rapidly changing colors in nanoseconds. For example, the μLEDs may be used in a display module, such as, for example, and without limitation, a light, a bio-contact lens, a medical patch, a medical field, a wearable display, a camera module, a head up display (HUD), or the like, for which low-power consumption, down-sizing, and light weight are preferred.
- In an embodiment, a portion of each of the plurality of inorganic
light emitting elements 330 may pass through a portion of the connectingmember 320 and may be spaced apart from thesubstrate 310. Lower portions of the plurality of inorganiclight emitting elements 330 may be surrounded by the connectingmember 320. Upper portions of the plurality of inorganiclight emitting elements 330 may be exposed. For example, in the case where the connectingmember 320 has a thickness of not less than about 5 μm and not more than about 10 μm in the Z-axis direction and the plurality of inorganiclight emitting elements 330 have a length of not less than about 4 μm and not more than about 5 μm in the Z-axis direction, the plurality of inorganiclight emitting elements 330 may pass through the connectingmember 320 by a distance of not less than about 3 μm and nor more than about 4 μm in a lower direction and may be exposed upwards by a distance of not less than about 1 μm and not more than about 2 μm. The plurality of inorganiclight emitting elements 330 may be attached to the connectingmember 320 by, for example, being pressed in the Z-axis direction after aligned in preset positions on the connectingmember 320. - In an embodiment, the
light blocking member 340 may include, for example, an opaque (or substantially opaque) material and be disposed on a region other than the regions where the plurality of inorganiclight emitting elements 330 are disposed. Thelight blocking member 340 may prevent and/or reduce the mixture of light emitted from different pixels among the plurality of inorganiclight emitting elements 330. For example, thelight blocking member 340 may prevent and/or reduced the mixture of red light emitted from thered light element 331 and green light emitted from thegreen light element 332 of adjacent pixels among the plurality of inorganiclight emitting elements 330. - In an embodiment, the
light blocking member 340 may include a black matrix (hereinafter, referred to as BM). The BM may represent a black gradation or a black color between a pixel and a pixel or between the plurality of inorganiclight emitting elements 330. Thelight blocking member 340 including the BM may increase the contrast ratio (hereinafter, referred to as CR) of thedisplay module 300. - In an embodiment, the
light blocking member 340 may be patterned and disposed so as not to overlap the plurality of inorganiclight emitting elements 330. For example, thelight blocking member 340 may be applied, for example, and without limitation, by a jetting method using a jetting head, a printing method using a printing apparatus, or the like. Thelight blocking member 340 may, for example, be formed by applying black ink to the connectingmember 320. - In an embodiment, the
light blocking member 340 may be spaced apart from thesubstrate 310 and disposed on the connectingmember 320. For example, thelight blocking member 340 may be disposed on an upper side of the connectingmember 320. Thelight blocking member 340 may be disposed on at least one side of the plurality of inorganiclight emitting elements 330. Thelight blocking member 340 and theTFT substrate 312 may be spaced apart from each other by a specified distance in the Z-axis direction by the thickness of the connectingmember 320. - In an embodiment, the
light blocking member 340 may be spaced apart from the plurality of inorganiclight emitting elements 330. Thelight blocking member 340 including the BM may block light emitted from the plurality of inorganiclight emitting elements 330 to prevent and/or reduce the light from passing though thelight blocking member 340. In the case where thelight blocking member 340 including the BM is in contact with lateral sides of the plurality of inorganiclight emitting elements 330, thelight blocking member 340 may block light emitted from the lateral sides of the plurality of inorganiclight emitting elements 330, and therefore the viewing angle of thedisplay module 300 may be reduced. Thelight blocking member 340 may be laterally spaced apart from the plurality of inorganiclight emitting elements 330 by a specified distance. For example, the BM may be applied so as not to make contact with the plurality of inorganiclight emitting elements 330, for example, according to settings of the jetting head. -
FIG. 4 is a sectional view illustrating anexample display module 400 according to an embodiment. Thedisplay module 400 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, and a transparent layer (e.g., including a transparent material) 410. Thesubstrate 310, the connectingmember 320, and the plurality of inorganiclight emitting elements 330 ofFIG. 4 may be components substantially identical to or similar to thesubstrate 310, the connectingmember 320, and the plurality of inorganiclight emitting elements 330 described above in relation toFIG. 3 . Descriptions of the identical components may not be repeated here. - In an embodiment, the
transparent layer 410 may be disposed on the connectingmember 320 and the plurality of inorganiclight emitting elements 330. For example, thetransparent layer 410 may be disposed on an upper side of the connectingmember 320 and upper sides of the plurality of inorganiclight emitting elements 330. Thetransparent layer 410 may include a polymer compound with excellent light transmittance. For example, thetransparent layer 410 may comprise, for example, and without limitation, a clear resin, an optical clear resin (hereinafter, referred to as OCR), or the like. The OCR may enhance luminance and may be cured by ultraviolet (UV) light. The OCR may have an adhesive force, and therefore an additional protective layer may be disposed on thetransparent layer 410. - In an embodiment, the connecting
member 320 may include a conductive material for electrically connecting the plurality of inorganiclight emitting elements 330 with a plurality of interconnection wires included in thesubstrate 310. The surface of the connectingmember 320 may include a bumpy structure of the conductive material. The upper side of the connectingmember 320 may not be smooth like a mirror, and therefore light emitted from the plurality of inorganiclight emitting elements 330 may be diffusely reflected, which may lead to a decrease in the transparency of thedisplay module 400. The transparency of thedisplay module 400 may be increased by applying thetransparent layer 410 to the upper side of the connectingmember 320. In the case of increasing the transparency of thedisplay module 400, the color of thesubstrate 310 covered with the connectingmember 320 may appear to be dark, and thus the CR of thedisplay module 400 may be improved. -
FIG. 5 is a sectional view illustrating anexample display module 500 according to an embodiment. Thedisplay module 500 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, a light blocking member (e.g., including an opaque material) 340, and a transparent layer (e.g., including a transparent material) 410. Thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 ofFIG. 5 may be components substantially identical to or similar to thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 described above in relation toFIG. 3 . Furthermore, thetransparent layer 410 ofFIG. 5 may be a component substantially identical to or similar to thetransparent layer 410 described above in relation toFIG. 4 . - In an embodiment, the
transparent layer 410 may be disposed on the plurality of inorganiclight emitting elements 330 and thelight blocking member 340. For example, thetransparent layer 410 may be disposed on upper sides of the plurality of inorganiclight emitting elements 330 and an upper side of thelight blocking member 340. Thetransparent layer 410 may be integrally formed with an upper portion of the connectingmember 320, upper portions of the plurality of inorganiclight emitting elements 330, and an upper portion of thelight blocking member 340. - In an embodiment, the
light blocking member 340 may be applied between the plurality of inorganiclight emitting elements 330. Thetransparent layer 410 may be applied all over the surface. Thetransparent layer 410 may include a material having no repulsive force on thelight blocking member 340. In the case of applying both thelight blocking member 340 and thetransparent layer 410 to thedisplay module 500, the CR of thedisplay module 500 may be further improved. -
FIG. 6 is a sectional view illustrating anexample display module 600 according to another embodiment. Thedisplay module 600 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, a transparent layer (e.g., including a transparent material) 410, and a light blocking member (e.g., including an opaque material) 610. Thesubstrate 310, the connectingmember 320, and the plurality of inorganiclight emitting elements 330 ofFIG. 6 may be components substantially identical to or similar to thesubstrate 310, the connectingmember 320, and the plurality of inorganiclight emitting elements 330 described above in relation toFIG. 3 . Furthermore, thetransparent layer 410 ofFIG. 6 may be a component substantially identical to or similar to thetransparent layer 410 described above in relation toFIG. 4 . - In an embodiment, the
transparent layer 410 may be disposed on the connectingmember 320 and the plurality of inorganiclight emitting elements 330, and thelight blocking member 610 may be disposed on thetransparent layer 410. For example, thelight blocking member 610 may be disposed on an upper side of thetransparent layer 410. Thelight blocking member 610 may be disposed so as not to overlap the plurality of inorganiclight emitting elements 330. Thelight blocking member 610 may include a material having no repulsive force on thetransparent layer 410. - In an embodiment, the
transparent layer 410 may be applied all over the surface. Thelight blocking member 610 may be applied to a region of the upper side of thetransparent layer 410 that does not overlap the regions where the plurality of inorganiclight emitting elements 330 are disposed, with respect to the Z-axis direction. In the case where thetransparent layer 410 is applied all over the surface and thelight blocking member 610 is applied, thelight blocking member 610 may be prevented from and/or avoid invading lateral sides or upper sides of the plurality of inorganiclight emitting elements 330 when applied. - In an embodiment, in the case where the
light blocking member 610 is disposed on the upper side of thetransparent layer 410, a coating layer may be disposed on the upper side of thetransparent layer 410. The coating layer may be configured such that thelight blocking member 610 is removable from thetransparent layer 410. In the case where an error in alignment occurs while thelight blocking member 340 is applied between the plurality of inorganiclight emitting elements 330, re-work to apply thelight blocking member 340 again is impossible due to damage to the plurality of inorganiclight emitting elements 330. In the case where the coating layer is disposed on the upper side of thetransparent layer 410, re-working of thelight blocking member 610 may be easy when an error in alignment of thelight blocking member 610 occurs. -
FIGS. 7A and 7B are sectional views illustrating anexample display module 700 according to another embodiment. Thedisplay module 700 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, a light blocking member (e.g., including an opaque material) 340, and a first transparent pattern (e.g., including a transparent material) 710. Thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 ofFIGS. 7A and 7B may be components substantially identical to or similar to thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 described above in relation toFIG. 3 . - In an embodiment, the first
transparent pattern 710 may be disposed on the plurality of inorganiclight emitting elements 330. For example, the firsttransparent pattern 710 may be disposed to surround upper sides and parts of lateral sides of the plurality of inorganiclight emitting elements 330. The firsttransparent pattern 710 may be disposed on a region other than the region where thelight blocking member 340 is disposed. The firsttransparent pattern 710 may include, for example, a polymer compound with excellent light transmittance. For example, the firsttransparent pattern 710 may be formed of a clear resin, or the like, but is not limited thereto. The firsttransparent pattern 710 may be partly applied to the upper sides of the plurality of inorganiclight emitting elements 330. For example, the firsttransparent pattern 710 may be applied by a jetting method using a jetting head or a printing method using, for example, a printing apparatus, or the like, but the disclosure is not limited thereto. - In an embodiment, in the case of disposing the first
transparent pattern 710 on the plurality of inorganiclight emitting elements 330, thelight blocking member 340 may be spaced apart from the plurality of inorganiclight emitting elements 330. The firsttransparent pattern 710 and thelight blocking member 340 may make contact with each other because thelight blocking member 340 and the plurality of inorganiclight emitting elements 330 are spaced apart from each other by the firsttransparent pattern 710. However, without being limited thereto, the firsttransparent pattern 710 and thelight blocking member 340 may be spaced apart from each other within a range satisfying a specified CR. - In an embodiment, the first
transparent pattern 710 may adjust a patterned unit size to satisfy the specified CR and increase the degree of freedom in manufacturing or design. - For example, as illustrated in
FIG. 7A , the firsttransparent pattern 710 may be formed on the plurality of inorganiclight emitting elements 330 forming one pixel. In this case, upper portions of ared light element 331 and agreen light element 332 that form one pixel may be covered with one firsttransparent pattern 710. - In another example, as illustrated in
FIG. 7B , the firsttransparent pattern 710 may be formed on an element-by-element basis. In this example, one firsttransparent pattern 710 may cover thered light element 331, and another firsttransparent pattern 710 may cover the upper portion of thegreen light element 332. The firsttransparent patterns 710 may be separately formed to cover the upper portions of the inorganiclight emitting elements - In an embodiment, the
light blocking member 340 and the firsttransparent pattern 710 may have repulsive forces therebetween. A repellent liquid characteristic may be formed between thelight blocking member 340 and the firsttransparent pattern 710. Because the viewing angle is reduced in the case where thelight blocking member 340 spreads along a lateral side of the firsttransparent pattern 710, it is advantageous that the repellent liquid characteristic between thelight blocking member 340 and the firsttransparent pattern 710 increases.FIGS. 7A and 7B illustrate a case in which the firsttransparent pattern 710 is in an island shape and the firsttransparent pattern 710 and thelight blocking member 340 have a complete repellent liquid characteristic. In the case where the firsttransparent pattern 710 and thelight blocking member 340 have the complete repellent liquid characteristic, thelight blocking member 340 may be more assuredly prevented from and/or avoid invading the firsttransparent pattern 710 or making contact with the plurality of inorganiclight emitting elements 330 when thelight blocking member 340 is applied after the firsttransparent pattern 710. - In an embodiment, the first
transparent pattern 710 may be disposed on the plurality of inorganiclight emitting elements 330 to prevent and/or avoid thelight blocking member 340 from invading the lateral sides or the upper sides of the plurality of inorganiclight emitting elements 330. Furthermore, by disposing the firsttransparent pattern 710 on a region other than the region where thelight blocking member 340 is disposed, the height of the upper side of thelight blocking member 340 may be lowered, and thus the viewing angle of thedisplay module 700 may be more easily ensured. -
FIG. 8 is a sectional view illustrating anexample display module 800 according to an embodiment. Thedisplay module 800 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, a light blocking member (e.g., including an opaque material) 340, a first transparent pattern (e.g., including a transparent material) 710, and a second transparent pattern (e.g., including a transparent material) 720. Thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 ofFIG. 8 may be components substantially identical to or similar to thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 described above in relation toFIG. 3 . Furthermore, the firsttransparent pattern 710 ofFIG. 8 may be a component substantially identical to or similar to the firsttransparent pattern 710 described above in relation toFIGS. 7A and 7B . - In an embodiment, the second
transparent pattern 720 may be disposed on thelight blocking member 340 and the firsttransparent pattern 710. For example, the secondtransparent pattern 720 may be disposed to surround an upper side of thelight blocking member 340 and an upper portion of the firsttransparent pattern 710. The secondtransparent pattern 720 may include, for example, a polymer compound with excellent light transmittance. For example, the secondtransparent pattern 720 may be formed of a clear resin, or the like, but is not limited thereto. - In an embodiment, the second
transparent pattern 720 may uniformly cover an upper side of the connectingmember 320. The secondtransparent pattern 720 may include a material having no repulsive force on thelight blocking member 340 and the firsttransparent pattern 710. After the firsttransparent pattern 710 is partly applied to upper portions of the plurality of inorganiclight emitting elements 330, thelight blocking member 340 may be applied to a region other than the regions where the plurality of inorganiclight emitting elements 330 are disposed, and the secondtransparent pattern 720 may be applied to the entire upper side. - In an embodiment, in the case of uniformly covering the entire upper side of the connecting
member 320 with the secondtransparent pattern 720, depressions generated on the upper side of the connectingmember 320 by thelight blocking member 340 and the firsttransparent pattern 710 may be flattened. Accordingly, a change in light emitting characteristics by the convex shape of the firsttransparent pattern 710 may be compensated for. -
FIG. 9 is a front view illustrating anexample display module 900 according to various embodiments. Thedisplay module 900 may include a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, and a light blocking member (e.g., including an opaque material) 340. The connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 ofFIG. 9 may be components substantially identical to or similar to the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 described above in relation toFIG. 3 . - In an embodiment, the plurality of inorganic
light emitting elements 330 may be grouped and arranged by pixels. The plurality of inorganiclight emitting elements 330 may be continuously arranged in all directions on the XY plane. The plurality of inorganiclight emitting elements 330 may each include ared light element 331 that emits red light, agreen light element 332 that emits green light, and a bluelight element 333 that emits blue light. One pixel formed by the plurality of inorganiclight emitting elements 330 may include RGB sub-pixels. - In an embodiment, the plurality of inorganic
light emitting elements 330 may be arranged in a pentile structure. For example, thered light element 331, thegreen light element 332, and the bluelight element 333 may be disposed on a lower left side, a lower right side, and an upper right side of one pixel with respect to the XY plane. However, without being limited thereto, thered light element 331, thegreen light element 332, and the bluelight element 333 may be disposed in three positions among an upper left side, a lower left side, an upper right side, and a lower right side of one pixel. - In an embodiment, the connecting
member 320 may be disposed on asubstrate 310. The connectingmember 320 may be uniformly formed on an upper side of thesubstrate 310. The connectingmember 320 may be implemented using an ACF. The connectingmember 320 may fix the plurality of inorganiclight emitting elements 330 in specified positions. The connectingmember 320 may supply current to the plurality of inorganiclight emitting elements 330. - In an embodiment, the
light blocking member 340 may be disposed to distinguish between the plurality of inorganiclight emitting elements 330 by pixels. Thelight blocking member 340 may be continuously arranged in all directions on the XY plane. Thelight blocking member 340 may have a matrix structure on the XY plane. Thelight blocking member 340 may have various forms as described above, depending on the arrangement of the plurality of inorganiclight emitting elements 330. For example, in the case where no sub-pixel is disposed on an upper left side of one pixel with respect to the XY plane, thelight blocking member 340 may cover at least part of the upper left side of the one pixel. - In an embodiment, a black gradation having a feeling of dark black or a low brightness may be increased as the CR of the
display module 900 increases. The black gradation may be increased with an increase in the area of thelight blocking member 340. In other words, a high black gradation may be represented as an aperture ratio decreases. Accordingly, thelight blocking member 340 may be disposed on a region other than the regions where the plurality of inorganiclight emitting elements 330 are disposed. However, the viewing angle of thedisplay module 900 may be reduced in the case where thelight blocking member 340 makes contact with the plurality of inorganiclight emitting elements 330. Therefore, thelight blocking member 340 may be disposed under the condition that thelight blocking member 340 does not make contact with the plurality of inorganiclight emitting elements 330. -
FIG. 10A is a sectional view illustrating anexample display module 1000 according to another embodiment.FIG. 10B is a front view illustrating theexample display module 1000 according to the other embodiment. Thedisplay module 1000 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, and a light blocking member (e.g., including an opaque material) 340. Thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 ofFIG. 10A may be components substantially identical to or similar to thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 described above in relation toFIG. 3 . - In an embodiment, the
light blocking member 340 may be disposed between the plurality of inorganiclight emitting elements 330 forming one pixel. For example, thelight blocking member 340 may be additionally disposed between ared light element 331 and agreen light element 332 that form one pixel. - In the case of additionally disposing the
light blocking member 340 between the plurality of inorganiclight emitting elements 330 forming one pixel, the CR of thedisplay module 100 may be further improved. -
FIG. 11A is a sectional view illustrating anexample display module 1100 according to another embodiment. Thedisplay module 1100 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 1010, and a light blocking member (e.g., including an opaque material) 340. Thesubstrate 310, the connectingmember 320, and thelight blocking member 340 ofFIG. 11A may be components substantially identical to or similar to thesubstrate 310, the connectingmember 320, and thelight blocking member 340 described above in relation toFIG. 3 . - In an embodiment, the plurality of inorganic
light emitting elements 1010 may be arranged on the connectingmember 320. The plurality of inorganiclight emitting elements 1010 may include ared light element 1011 that emits red light, agreen light element 1012 that emits green light, and ablue light element 1013 that emits blue light. - In an embodiment, the
red light element 1011, thegreen light element 1012, and theblue light element 1013 included in the plurality of inorganiclight emitting elements 1010 may implement RGB sub-pixels in one pixel. - In an embodiment, the plurality of inorganic
light emitting elements 1010 may be red, green, and blue semiconductor light emitting elements that form sub-pixels. For example, the plurality of inorganiclight emitting elements 1010 may be μLED elements. - In an embodiment, the μLED elements may have a length and a width of not less than about 1 μm and not more than about 100 μm. The μLED elements may, for example, be manufactured by growing a thin film on a substrate, such as a sapphire substrate or a silicon substrate, using an inorganic material such as aluminum (Al), gallium (Ga), nitrogen (N), phosphor (P), arsenic (As), or indium (In).
- In an embodiment, the plurality of inorganic
light emitting elements 1010 may, for example, and without limitation, have a lateral electrode structure, a vertical electrode structure, a flip chip structure, or the like, according to a manufacturing process. The lateral electrode structure may refer, for example, to a structure in which a cathode and an anode are spaced apart from each other on a substrate without overlapping each other. The vertical electrode structure may refer, for example, to a structure in which a cathode and an anode are vertically superimposed on each other. The flip chip structure may refer, for example, to a structure in which a chip is fused as it is, using an electrode pattern on a lower side of the chip without a separate connecting structure such as a metal lead or wire. The flip chip structure may, for example, be referred to as a leadless chip structure. - In an embodiment, in the lateral electrode structure and the vertical electrode structure, a separate connecting structure is used to attach a semiconductor chip to a circuit board. These structures may have a limitation in compactness and high density integration of elements and may have low manufacturing efficiency, in particular, in manufacturing medium and large displays. In the flip chip structure, a space required for a separate connecting structure may be omitted because an electrode does not limit an emissive area and no separate connecting structure is used in combining the electrode with a substrate. Accordingly, the flip chip structure may be advantageous in compactness, light weight, and high density integration of elements. Furthermore, the flip chip structure may improve luminous efficiency and transfer process efficiency in manufacturing a display device and hence is widely applied to a μLED field.
-
FIG. 11B is a front view illustrating adisplay module 1100 according to another embodiment. Thedisplay module 1100 may include a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 1010, and a light blocking member (e.g., including an opaque material) 340. The connectingmember 320 and thelight blocking member 340 ofFIG. 11B may be components substantially identical to or similar to the connectingmember 320 and thelight blocking member 340 described above in relation toFIG. 3 . Furthermore, the plurality of inorganiclight emitting elements 1010 ofFIG. 11B may be components substantially identical to or similar to the plurality of inorganiclight emitting elements 1010 described above in relation toFIG. 11A . - In an embodiment, the plurality of inorganic
light emitting elements 1010 may be grouped and arranged by pixels. The plurality of inorganiclight emitting elements 1010 may be arranged in an RGB stripe structure. The plurality of inorganiclight emitting elements 1010 forming one pixel may, for example, be arranged in a row. The plurality of inorganiclight emitting elements 1010 forming one pixel may be arranged in a row in the X-axis direction or the Y-axis direction. For example, ared light element 1011, agreen light element 1012, and ablue light element 1013 may, for example, be disposed on a left side, at the center, and on a right side of one pixel with respect to the XY plane. However, without being limited thereto, thered light element 1011, thegreen light element 1012, or theblue light element 1013 may be disposed in various sequences on a left side, at the center, and on a right side of one pixel. Furthermore, thered light element 1011, thegreen light element 1012, or theblue light element 1013 may be disposed on an upper side, at the center, and on a lower side of one pixel. -
FIG. 12 is a sectional view illustrating anexample display module 1200 according to an embodiment. Thedisplay module 1200 may include aTFT substrate 312, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, a light blocking member (e.g., including an opaque material) 340, at least oneinterconnection wire 1210, a fixingmember 1220, and a plurality ofconductive balls 1221. TheTFT substrate 312, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 ofFIG. 12 may be components substantially identical to theTFT substrate 312, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 described above in relation toFIG. 3 . - In an embodiment, the plurality of inorganic
light emitting elements 330 and thelight blocking member 340 are spaced apart in the X-axis direction. The plurality of inorganiclight emitting elements 330 and thelight blocking member 340 do not contact to each other. The gap G is the distance between the plurality of inorganiclight emitting elements 330 and thelight blocking member 340 in the X-axis direction. The gap G prevents or avoidslight blocking member 340 blocking emitted light from the plurality of inorganiclight emitting elements 330. The distance of gap G is above 1 μm. - In an embodiment, the connecting
member 320 may be an ACF that includes the fixingmember 1220 for fixing the plurality of inorganiclight emitting elements 330 and the plurality ofconductive balls 1221 for electrically connecting the at least oneinterconnection wire 1210 and the plurality of inorganiclight emitting elements 330. The fixingmember 1220 may be the modified ACF which is at the state having supporting strength by adding pressure and/or heat to ACF. The material that comprises the fixingmember 1220 may be various types of resin. For example, the fixingmember 1220 may be made of epoxy resin. The ACF may cause the plurality ofconductive balls 1221 to be connected or pressed together in a region to which pressure is applied. The ACF may form a current path, through which current flows, in the region to which the pressure is applied. - In an embodiment, the at least one
interconnection wire 1210 may be formed on theTFT substrate 312. In an embodiment, the at least oneinterconnection wire 1210 may be formed on an upper side of theTFT substrate 312. The at least oneinterconnection wire 1210 may be connected with a plurality of electrodes and/or a plurality of pads included in theTFT substrate 312. - In an embodiment, the plurality of inorganic
light emitting elements 330 may be disposed in specified positions by the fixingmember 1220. - In an embodiment, the plurality of inorganic
light emitting elements 330 may be disposed to pass through portions of the connectingmember 320. The regions of the connectingmember 320 in which the plurality of inorganiclight emitting elements 330 are disposed may be pressed. A current path may be formed in the regions where the plurality of inorganiclight emitting elements 330 are disposed. For example, a current path may be formed in the Z-axis direction in the regions where the plurality of inorganiclight emitting elements 330 are disposed. - In an embodiment, the plurality of inorganic
light emitting elements 330 and the at least oneinterconnection wire 1210 may be electrically connected using the current path. Accordingly, the plurality of electrodes and/or the plurality of pads included in theTFT substrate 312 and the plurality of inorganiclight emitting elements 330 may be electrically connected through the at least oneinterconnection wire 1210 and the current path. The plurality of inorganiclight emitting elements 330 may emit light by current supplied from theTFT substrate 312. -
FIGS. 13A and 13B are sectional views illustrating anexample display module 1300 according to another embodiment. Thedisplay module 1300 may include asupport substrate 311, aTFT substrate 312, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, a first transparent pattern (e.g., including a transparent material) 710, and a light blocking member (e.g., including an opaque material) 1310. Thesupport substrate 311, theTFT substrate 312, the connectingmember 320, and the plurality of inorganiclight emitting elements 330 ofFIGS. 13A and 13B may be components substantially identical to or similar to thesupport substrate 311, theTFT substrate 312, the connectingmember 320, and the plurality of inorganiclight emitting elements 330 described above in relation toFIG. 3 . Furthermore, the firsttransparent pattern 710 ofFIGS. 13A and 13B may be a component substantially identical to or similar to the firsttransparent pattern 710 described above in relation toFIGS. 7A and 7B . - In an embodiment, the
light blocking member 1310 may be disposed to make contact with the firsttransparent pattern 710. Thelight blocking member 1310 may make contact with a lateral side of the firsttransparent pattern 710. Thelight blocking member 1310 may be disposed to overlap the firsttransparent pattern 710 with respect to the Z-axis direction. Thelight blocking member 1310 and the firsttransparent pattern 710 may overlap each other when the degree of repellent liquid characteristic between the firsttransparent pattern 710 and thelight blocking member 1310 is low or thelight blocking member 1310 is abundantly applied. Thelight blocking member 1310 may be spaced apart from the plurality of inorganiclight emitting elements 330 by the firsttransparent pattern 710. - In an embodiment, the
light blocking member 1310 may be applied to a portion that is defined as the boundary of the firsttransparent pattern 710. In the case where thelight blocking member 1310 is applied to the portion that is defined as the boundary of the firsttransparent pattern 710, the aperture ratio of thedisplay module 1300 may be decreased. The CR may be increased in the case of decreasing the aperture ratio of thedisplay module 1300. - In an embodiment, the
light blocking member 1310 may be applied after the firsttransparent pattern 710 is applied by, for example, a jetting method, but the disclosure is not limited thereto. Thelight blocking member 1310 may, for example, be applied by a jetting method, a spray method, or the like, but is not limited thereto. When thelight blocking member 1310 is applied, the firsttransparent pattern 710 may have a shape to protect the plurality of inorganiclight emitting elements 330 such that thelight blocking member 1310 does not make contact with the plurality of inorganiclight emitting elements 330. Thelight blocking member 1310, when applied, does not need to be jetted in a pattern form. Thelight blocking member 1310 may be more easily applied by a spray method, and the tact time of thedisplay module 1300 may be reduced. - In an embodiment, the thickness of the
light blocking member 1310 on an upper side may be much smaller than that of thelight blocking member 1310 on a lateral side. Thelight blocking member 1310, before cured, may flow down to a height lower than the height of the firsttransparent pattern 710 with respect to the Z-axis direction. As illustrated inFIG. 13A , thelight blocking member 1310 may at least partly protrude from the border between thelight blocking member 1310 and the firsttransparent pattern 710. However, thelight blocking member 1310 is not disposed on an upper portion of the firsttransparent pattern 710, and therefore the viewing angle of thedisplay module 1300 may be ensured. - In an embodiment, as illustrated in
FIG. 13B , thelight blocking member 1310 may cover at least part of the upper portion of the firsttransparent pattern 710. The upper portion of the firsttransparent pattern 710 may have a convex form, and therefore thelight blocking member 1310 may easily flow down to the edge. Accordingly, thelight blocking member 130 may be formed to be very thin on the upper portion of the firsttransparent pattern 710. Furthermore, after the firsttransparent pattern 710 is formed, a solvent used to form the firsttransparent pattern 710 may evaporate. A thin film may be formed on an upper side of the firsttransparent pattern 710 when the solvent evaporates. The thin film may cause thelight blocking member 1310 to flow down. Accordingly, thelight blocking member 1310 may not hide light emitted from the plurality of inorganiclight emitting elements 330 even though a structure close to wetting in which thelight blocking member 1310 is formed to an emissive area is formed. - In an embodiment, the first
transparent pattern 710 may be applied to be wider than the emissive area. Thelight blocking member 1310 may be formed to be thick on the lateral side of the firsttransparent pattern 710, and thus a high CR may be maintained when the plurality of inorganiclight emitting elements 330 are turned on. Furthermore, most of light may pass because most of thelight blocking member 1310 substantially flows down from the upper side of the firsttransparent pattern 710 and the remaininglight blocking member 1310 is a very thin film. Accordingly, the viewing angle of thedisplay module 1300 may be ensured. -
FIG. 14 is a front view illustrating anexample display device 1400 according to an embodiment. - In an embodiment, the
display device 1400 may include one ormore display modules 1410 and a connecting portion (e.g., a region between adjacent display modules) 1420. - In an embodiment, the
display modules 1410 may include asubstrate 310, a connectingmember 320, a plurality of inorganiclight emitting elements 330, and alight blocking member 340. Thedisplay modules 1410 may display a screen based on image data. The connectingportion 1420 may be formed in thedisplay device 1400 having a large display that cannot be formed by onedisplay module 1410. - In an embodiment, the connecting
portion 1420 may connect the one ormore display modules 1410. Thedisplay modules 1410 connected by the connectingportion 1420 may display one screen. The connectingportion 1420 may include, on a lateral side thereof, a connecting member for connecting the one ormore display modules 1410 or a side coating member for preventing and/or reducing a gap between thedisplay modules 1410, which is formed in the connectingportion 1420, from being viewed from the outside. -
FIGS. 15A and 15B are sectional views illustrating anexample display device 1500 according to an embodiment. Thedisplay device 1500 may include asubstrate 310, a connecting member (e.g., including a conductive material) 320, a plurality of inorganic light emitting elements (e.g., including light emitting circuitry, for example, a light emitting diode) 330, and a light blocking member (e.g., including an opaque material) 340. Thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 ofFIGS. 15A and 15B may be components substantially identical to or similar to thesubstrate 310, the connectingmember 320, the plurality of inorganiclight emitting elements 330, and thelight blocking member 340 described above in relation toFIG. 3 . - In an embodiment, the
light blocking member 340 may be spaced apart from thesubstrate 310 and disposed on a connecting portion (or region) 1420 and the connectingmember 320. The connectingportion 1420 may be formed in a structure in which a hole is betweendisplay modules 1410. The connectingportion 1420 may be visible from the front of thedisplay device 1500 in the case where light emitted from the plurality of inorganiclight emitting elements 330 leaks from lateral sides of thedisplay modules 1410 or external light is reflected from the lateral sides of thedisplay modules 1410. In the case of disposing thelight blocking member 340 on the connectingportion 1420, the connectingportion 1420 may be prevented from being viewed. - In an embodiment, the
light blocking member 340 may be disposed on the connectingportion 1420. For example, as illustrated inFIG. 15A , due to the viscosity and curing of thelight blocking member 340, thelight blocking member 340 may be disposed on the connectingmember 320 without flowing down to the connectingportion 1420. In another example, as illustrated inFIG. 15B , thelight blocking member 340 may be disposed in the state of at least partly flowing into the connectingportion 1420. The connectingportion 1420 may have a width of about 100 μm or less in the X-axis direction. Accordingly, the amount of thelight blocking member 340 flowing into the connectingportion 1420 is small, and a specified penetration condition range may be satisfied. - The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
- It should be appreciated that various embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
- As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
- Various embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g.,
internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the “non-transitory” storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium. - According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
- According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
- According to the embodiments of the disclosure, the light blocking member may be formed on the upper side of the connecting member, thereby improving the contrast ratio of the display module and enabling representation of a darker black gradation, irrespective of non-uniformity of the color or surface of the connecting member.
- Furthermore, according to various example embodiments of the disclosure, the light blocking member is disposed on a region other that the regions where the plurality of inorganic light emitting elements are disposed, thereby implementing a display module having μLEDs applied thereto that has a light blocking member that does not reduce a viewing angle and that does not invade emissive areas of inorganic light emitting elements.
- In addition, the disclosure may provide various effects that are directly or indirectly recognized.
- While the disclosure has been illustrated and described with reference to various example embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined, for example, by the appended claims and their equivalents.
Claims (20)
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US20020163301A1 (en) * | 2001-05-02 | 2002-11-07 | Morley Roland M. | Large format emissive display |
US20040188696A1 (en) | 2003-03-28 | 2004-09-30 | Gelcore, Llc | LED power package |
JP4059153B2 (en) * | 2003-06-23 | 2008-03-12 | ソニー株式会社 | Manufacturing method of display device |
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JP6196568B2 (en) * | 2013-03-27 | 2017-09-13 | ソニーセミコンダクタソリューションズ株式会社 | Display device |
JP2015023221A (en) * | 2013-07-22 | 2015-02-02 | ローム株式会社 | Display device |
US9818725B2 (en) | 2015-06-01 | 2017-11-14 | X-Celeprint Limited | Inorganic-light-emitter display with integrated black matrix |
KR102377794B1 (en) * | 2015-07-06 | 2022-03-23 | 엘지전자 주식회사 | Display device using semiconductor light emitting device and method for manufacturing |
KR102465382B1 (en) * | 2015-08-31 | 2022-11-10 | 삼성디스플레이 주식회사 | Diplay apparatus and manufacturing method for the same |
US10304813B2 (en) * | 2015-11-05 | 2019-05-28 | Innolux Corporation | Display device having a plurality of bank structures |
EP3800673A1 (en) * | 2015-11-30 | 2021-04-07 | Nichia Corporation | Light emitting device |
KR102591388B1 (en) * | 2016-01-18 | 2023-10-19 | 엘지전자 주식회사 | Display device using semiconductor light emitting diode |
US10340256B2 (en) * | 2016-09-14 | 2019-07-02 | Innolux Corporation | Display devices |
US11024773B2 (en) * | 2016-11-07 | 2021-06-01 | Goertek. Inc | Micro-LED with vertical structure, display device, electronics apparatus and manufacturing method |
KR101947643B1 (en) * | 2016-12-02 | 2019-02-13 | 엘지전자 주식회사 | Display device using semiconductor light emitting device |
TWI650854B (en) * | 2017-10-31 | 2019-02-11 | 英屬開曼群島商錼創科技股份有限公司 | Miniature light emitting diode display panel and manufacturing method thereof |
JP2019114675A (en) * | 2017-12-25 | 2019-07-11 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
KR102182584B1 (en) * | 2019-03-20 | 2020-11-24 | 주식회사 테토스 | LED display module |
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CN114023785A (en) * | 2021-11-02 | 2022-02-08 | 业成科技(成都)有限公司 | Display device |
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EP3821468A4 (en) | 2021-09-08 |
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