US20200118993A1 - Semiconductor package and method of manufacturing the semiconductor package - Google Patents
Semiconductor package and method of manufacturing the semiconductor package Download PDFInfo
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- US20200118993A1 US20200118993A1 US16/709,001 US201916709001A US2020118993A1 US 20200118993 A1 US20200118993 A1 US 20200118993A1 US 201916709001 A US201916709001 A US 201916709001A US 2020118993 A1 US2020118993 A1 US 2020118993A1
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Definitions
- Example embodiments relate to semiconductor packages and/or methods of manufacturing the semiconductor package. More particularly, example embodiments relate to fan out wafer level packages (FOWLP) and/or methods of manufacturing the semiconductor packages.
- FOWLP fan out wafer level packages
- a fan out type wafer level package may include a mold layer surrounding sidewalls and a bottom surface of a semiconductor chip and a redistribution wiring layer formed on the semiconductor chip.
- a redistribution wiring process in wafer level may be performed on a flip chip bump exposed from the mold layer to form the redistribution wiring layer.
- the semiconductor chip has a bonding wiring structure, it may be difficult to perform the redistribution wiring process in wafer level.
- Some example embodiments provide fan out wafer level packages including a bonding wiring structure.
- Some example embodiments provide methods of manufacturing a fan out wafer level package.
- a semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate, the at least one first semiconductor chip including chip pads, wiring bonding pads at a first surface of the mold substrate, the wiring bonding pads connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate, the distribution wiring layer including redistribution wirings, the redistribution wirings connected to the wiring bonding pads.
- a method of manufacturing includes forming wiring bonding pads on a dummy substrate, stacking at least one first semiconductor chip on the dummy substrate, forming bonding wires to connect first chip pads of the first semiconductor chip and the wiring bonding pads to each other, cover the first semiconductor chip on the dummy substrate with a molding member to form a mold substrate, removing the dummy substrate from the mold substrate such that the wiring bonding pads are exposed from a first surface of the mold substrate, and forming a redistribution wiring layer on the first surface of the mold substrate, the redistribution wiring layer including redistribution wirings electrically connected to the wiring bonding pads.
- a method of manufacturing a semiconductor package includes forming relay bonding pads on a dummy substrate, stacking at least one first semiconductor chip on the dummy substrate, forming conductive connection members to connect chip pads of the first semiconductor chip with the relay bonding pads, covering the first semiconductor chip on the dummy substrate with a molding member to form a mold substrate on the dummy substrate, removing the dummy substrate from the mold substrate such that the relay bonding pads are exposed from a first surface of the mold substrate, and forming a redistribution wiring layer on the first surface of the mold substrate, the redistribution wiring layer including redistribution wirings electrically connected to the relay bonding pads.
- a method of manufacturing a semiconductor package includes forming relay bonding pads on a dummy substrate, stacking at least one first semiconductor chip on the dummy substrate, forming conductive connection members to connect chip pads of the first semiconductor chip with the relay bonding pads, covering the first semiconductor chip on the dummy substrate with a molding member to form a mold substrate on the dummy substrate, removing the dummy substrate from the mold substrate such that the relay bonding pads are exposed from a first surface of the mold substrate, and forming a redistribution wiring layer on the first surface of the mold substrate, the redistribution wiring layer including redistribution wirings electrically connected to the relay bonding pads.
- a semiconductor package includes a first semiconductor chip having a bonding wiring structure in a mold substrate, wiring bonding pads formed in a first surface of the mold substrate and bonded to end portions of bonding wires electrically connected to the first semiconductor chip, and a fan out type redistribution wiring layer formed on the first surface of the mold substrate by a redistribution wiring process.
- a first redistribution wiring of the redistribution wiring layer may be bonded to the wiring bonding pad exposed from the first surface of the mold substrate.
- a semiconductor package includes a redistribution wiring layer including redistribution wirings and fan out type landing pads connected to the redistribution wirings, at least one first semiconductor chip on the redistribution wiring layer, the at least one first semiconductor chip including a first surface having first chip pads thereon and a second surface facing the redistribution wiring layer, wiring bonding pads at a first surface of the redistribution wiring layer, the wire bonding pads connected to corresponding ones of the redistribution wirings, and bonding wires connecting the first chip pads with wiring bonding pads such that the first chip pads are connected to corresponding ones of the fan out type landing pads on a second surface of the redistribution wiring layer, the second surface of the redistribution wiring layer being opposite to the first surface of the redistribution wiring layer.
- the wiring bonding pads may serve as a medium to electrically connect the bonding wires to the redistribution wirings, which are formed by the redistribution wiring process, and provide physical bonding surfaces therebetween.
- the wiring bonding pads may mount the semiconductor chips, which are incompatible with the fan out type redistribution wiring layer due to the bonding wiring structure, on the redistribution wiring layer, thereby providing the fan out wafer level package.
- FIGS. 1 to 37 represent non-limiting, example embodiments as described herein.
- FIG. 1 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment.
- FIGS. 2 to 14 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.
- FIGS. 15 to 19 are cross-sectional views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.
- FIG. 20 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment.
- FIGS. 21 to 27 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.
- FIG. 28 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment.
- FIGS. 29 to 37 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.
- FIG. 1 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment.
- a semiconductor package 1 may include a mold substrate 700 , a first semiconductor chip 200 disposed in the mold substrate 700 , wiring bonding pads 300 formed in a first surface 702 of the mold substrate 700 , and a redistribution wiring layer 100 covering the first surface 702 of the mold substrate 700 and including redistribution wirings connected to the wiring bonding pads 300 .
- the semiconductor package 1 may further include second semiconductor chips 600 (e.g., 600 a , 600 b , 600 c , and 600 d ) disposed in the mold substrate 700 and wiring bonding pads 310 formed in the first surface of the mold substrate 700 .
- the semiconductor package 1 may further include a support member 500 disposed in the mold substrate 700 .
- the semiconductor package 1 may further include outer connection members 800 disposed on the redistribution wiring layer 100 .
- the semiconductor package 1 may be a fan out wafer level package including the mold substrate 700 and the redistribution wiring layer 100 formed on the first surface 702 of the mold substrate 700 .
- the redistribution wiring layer 100 may be formed on the first surface 702 of the mold substrate 700 by a redistribution wiring process in wafer level.
- the first semiconductor chip 200 and the second semiconductor chip 600 electrically connected to the bonding wires 400 and 410 , respectively, may be received in the mold substrate 700 .
- the wiring bonding pads 300 and 310 connected to end portions of the bonding wires 400 and 410 , respectively, may be formed in the first surface 702 of the mold substrate 700 .
- the wiring bonding pads 300 and 310 may be exposed from the first surface 702 of the mold substrate 700 , and may be connected to the redistribution wirings of the redistribution wiring layer 100 .
- first surfaces of the wiring bonding pads 300 and 310 may be connected to the end portion of the bonding wires, respectively, and second surfaces of the wiring bonding pads 300 and 310 opposite to the first surfaces may be exposed from the first surface 702 of the mold surface 700 and may be connected to the redistribution wiring.
- the second surface of the wiring bonding pads 300 and 310 may be coplanar with the first surface 702 of the mold substrate 700 .
- the first surface and side surfaces of the wiring bonding pads 300 and 310 may be covered by the mold substrate 700 .
- the first surface of the wiring bonding pad may be connected to the bonding wire, and the second surface of the wiring bonding pad may be connected to the redistribution wiring. That is, the wiring bonding pad may be a relay bonding pad as a medium structure to provide physical bonding surfaces for connecting the bonding wire and the redistribution wire.
- the wiring bonding pad may have the same or substantially similar structure to under bump metallurgy (UBM) and perform the same or substantially similar function.
- UBM under bump metallurgy
- the wiring bonding pads 300 and 310 may be provided as a conductive pattern, however, it may not limited thereto.
- the wiring bonding pads 300 and 310 may be provided as a connector including a conductive electrode penetrating an insulation layer, a silicon-based semiconductor layer, etc.
- the first semiconductor chip 200 may include a plurality of chip pads 202 on its first surface (e.g., an active surface).
- the first semiconductor chip 200 may be received in the mold substrate 700 such that a second surface of the first semiconductor chip 200 opposite to the first surface faces the redistribution wiring layer 100 .
- the second surface of the first semiconductor chip 200 may be exposed from the first surface 702 of the mold substrate 700 .
- the first semiconductor chip 200 may include integrated circuits.
- the first semiconductor chip 200 may be a logic chip including a logic circuit.
- the logic chip may be a controller for controlling memory chips. Although only some chip pads are illustrated in the figure, the illustrated structure and arrangement of the chip pads are merely an example, and they are not limited thereto.
- the support member 500 may function to support a plurality of the second semiconductor chips 600 .
- the support member 500 may have a height from the redistribution wiring layer 100 , which is the same as that of the first semiconductor chip 200 .
- a surface of the support member 500 may be exposed from the first surface 702 of the mold substrate 700 .
- the support member 500 may include a semiconductor substrate, a metal or non-metal plate, a printed circuit board, etc.
- the support member 500 may include a passive device therein.
- the support member 500 may include a capacitor, a resistor, an inductor, etc.
- the support member 500 may provide functions such as decoupling, filtering, resonance damping and/or voltage control. Although it is not illustrated in the figure, the support member 500 may be electrically connected to some of the redistribution wirings.
- a plurality of the second semiconductor chips 600 may be disposed on the first semiconductor chip 200 and the support member 500 .
- the second semiconductor chips 600 a , 600 b , 600 c , and 600 d may include a plurality of chip pads 602 a , 602 b , 602 c and 602 d , respectively, on their respective first surfaces (e.g., active surfaces).
- the second semiconductor chip 600 may be received in the mold substrate 700 such that a second surface of the second semiconductor chip 600 opposite to the first surface faces the redistribution wiring layer 100 .
- the second semiconductor chips 600 may include memory chips.
- the memory chip may include various types of memory circuits, for example, DRAM, SRAM, flash PRAM, ReRAM, FeRAM or MRAM.
- the number, the size, the arrangement, etc., of the second semiconductor chips may be variously modified.
- the wiring bonding pad 300 may be formed in the first surface 702 of the mold substrate 700 and may be connected to the end portions of the bonding wires 400 . Accordingly, the wiring bonding pads 300 may be electrically connected to the chip pad 202 of the first semiconductor chip 200 by the bonding wires 400 .
- the redistribution wirings of the redistribution wiring layer 100 may make contact with the second surfaces of the wiring bonding pads 300 , 310 exposed from the first surface 702 of the mold substrate 700 .
- the redistribution wiring layer 100 may include a first insulation layer 110 formed on the first surface 702 of the mold substrate 700 , first openings exposing the wiring bonding pads 300 and 310 , and first redistribution wirings 112 formed on the first insulation layer 110 . At least portions of the first redistribution wirings 112 may directly contact the wiring bonding pads 300 , 310 through the first opening.
- the redistribution wiring layer 100 may include a second insulation layer 120 formed on the first insulation layer 120 , second openings exposing the first redistribution wirings 112 , and second redistribution wirings 122 formed on the second insulation layer 120 . At least a portion of the second redistribution wiring 122 may directly contact the first redistribution wiring 112 through the second opening.
- the redistribution wiring layer 100 may include a third insulation layer 130 formed on the second insulation layer 120 , third openings exposing the second redistribution wirings 122 , and third redistribution wirings 132 formed on the third insulation layer 130 . At least a portion of the third redistribution wiring 132 may directly contact the second redistribution wiring 122 through the third opening.
- the redistribution wiring layer 100 may include a fourth insulation layer 140 formed on the third insulation layer 130 , fourth openings exposing the third redistribution wirings 132 , and fourth redistribution wirings 142 formed on the fourth insulation layer 140 . At least a portion of the fourth redistribution wiring 142 may directly contact the third redistribution wiring 132 through the fourth opening.
- the redistribution wiring layer 100 may include a fifth insulation layer 150 formed on the fourth insulation layer 140 , fifth openings exposing the fourth redistribution wirings 142 .
- the redistribution wiring layer 100 may include fan out type solder ball landing pads which are formed on the mold substrate 700 and correspond to each die of a wafer by performing semiconductor manufacturing processes.
- Outer connection members 800 may be disposed on portions of the fourth redistribution wirings 142 exposed through the fifth openings.
- the outer connection member 800 may include a solder ball.
- the portion of the fourth redistribution wirings 142 may serve as a solder ball landing pad (e.g., a package pad).
- the semiconductor package 1 as the fan out wafer level package may include the first semiconductor chip 200 and a plurality of second semiconductor chips 600 having bonding wiring connections in the mold substrate 700 , the wiring bonding pads 300 and 310 formed in the first surface 702 of the mold substrate 700 and bonded to the end portions of the bonding wires 400 and 410 electrically connected to the first and second semiconductor chips, respectively, and the fan out type redistribution wiring layer 100 formed on the first surface 702 of the mold substrate 700 by a redistribution wiring process.
- the first redistribution wiring 112 of the redistribution wiring layer 100 may be bonded to the wiring bonding pads 300 , 310 exposed from the first surface 702 of the mold substrate 700 .
- the wiring bonding pads 300 and 310 may serve as a medium to electrically connect the bonding wires to redistribution wirings formed by the redistribution wiring process and provide physical bonding surfaces therebetween.
- the wiring bonding pads may mount the semiconductor chips, which are incompatible with or are difficult to be compatible with the fan out type redistribution wiring layer due to the bonding wiring structure, on the redistribution wiring layer, thereby providing the fan out wafer level package.
- FIGS. 2 to 14 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.
- FIGS. 2, 3, 4, 6, 9, 11, 12, 13 and 14 are cross-sectional views illustrating the method of manufacturing a semiconductor package.
- FIG. 5 is a plan view of FIG. 4 .
- FIG. 7 is a plan view of FIG. 6 .
- FIG. 10 is a plan view of FIG. 9 .
- a separating layer 20 may be formed on a dummy substrate 10 .
- the dummy substrate 10 may be used as a base substrate on which a plurality of semiconductor chips are stacked and then molded.
- the dummy substrate 10 may have a size corresponding to a wafer.
- the dummy substrate 10 may include a silicon substrate, a glass substrate, a metal or non-metal plate, etc.
- the separating layer 20 may include a polymer tape that serves as a temporary adhesive.
- the separating layer 20 may include a material that loses its adhesive strength, for example, when irradiated with light or heated.
- the separating layer 20 may include a dual cure silicon adhesive that is cross-linkable by irradiation of ultraviolet ray or visible light.
- a plurality of relay bonding pads 300 and 310 may be formed on the separating layer 20 .
- the relay bonding pads 300 and 310 may include metal patterns spaced apart from each other.
- the metal patterns may be formed by, for example, a sputtering process, a plating process, and a patterning process.
- the metal pattern may be adhered on the separating layer 20 in a desired (or alternatively, predetermined) position.
- the relay bonding pads 300 and 310 may include a metal (e.g., gold (Au), copper (Cu), or aluminum (Al)), or a metal alloy, (e.g., nickel/gold (Ni/Au), or tin/copper (Sn/Cu)).
- the relay bonding pads 300 and 310 may be used as wiring bonding pads bonded to bonding wires.
- the relay bonding pad 300 may be a metal bonding part to be bonded to the bonding wire for electrical connection to a first semiconductor chip which will be stacked later.
- the relay bonding pad 310 may be a metal bonding part to be bonded to the bonding wire for electrical connection to a second semiconductor chip will be stacked later.
- chip pads 202 of the first semiconductor chip 200 may be connected to the relay bonding pads 300 by conductive connection members 400 .
- a support member 500 may be disposed adjacent to the first semiconductor chip 200 on the separating layer 20 .
- the first semiconductor chip 200 may include a plurality of the chip pads 202 on a first surface (e.g., an active surface).
- the first semiconductor chip 200 may be arranged on the dummy substrate 10 such that a second surface of the first semiconductor chip 200 opposite to the first surface faces the dummy substrate 10 .
- the conductive connection members 400 may be bonding wires.
- the relay bonding pads 300 may be wiring bonding pads.
- a wiring bonding process may be performed to electrically connect the chip pads 202 of the first semiconductor chip 200 and the wiring bonding pads 300 to each other with the bonding wires 400 .
- end portions of the bonding wires 400 may be bonded to first surfaces of the wiring bonding pads 300 , respectively.
- the first semiconductor chip 200 may include integrated circuits.
- the first semiconductor chip 200 may be a logic chip including a logic circuit.
- the logic chip may be a controller for controlling memory chips.
- the structure and arrangement of the chip pads illustrated in the figure are merely an example, and they are not limited thereto.
- the support member 500 may support a plurality of semiconductor chips stacked thereon, as described later.
- the support member 500 may have a height from the separating layer 20 the same as that of the first semiconductor chip 200 . Accordingly, an upper surface of the support member 500 may be coplanar with the first surface of the first semiconductor chip 200 .
- the support member 500 may include a semiconductor substrate, a metal or non-metal plate, a printed circuit board, etc.
- the support member 500 may include a passive device therein.
- the support member 500 may include a capacitor, a resistor, an inductor, etc.
- the support member 500 may provide functions such as decoupling, filtering, resonance damping and/or voltage control. Although it is not illustrated in the figures, the support member 500 may be electrically connected to some of redistribution wirings.
- the support member 500 , chip pads 602 a , 602 b , 602 c , and 602 d of the respective second semiconductor chips 600 a , 600 b , 600 c , and 600 d may be electrically connected to the relay bonding pads 310 by conductive connection members 410 .
- the second semiconductor chips 600 a , 600 b , 600 c and 600 d may include a plurality of the chip pads 602 a , 602 b , 602 c and 602 d on their respective first surfaces (e.g., active surfaces).
- the second semiconductor chips 600 may be arranged on the dummy substrate 10 such that a second surface of the second semiconductor chip 600 opposite to the first surface faces the dummy substrate 10 .
- a plurality of second semiconductor chips 600 a , 600 b , 600 c and 600 d may be stacked sequentially by adhesive layers 610 .
- the second semiconductor chips 600 a , 600 b , 600 c and 600 d may be staked in a cascade structure.
- the second semiconductor chips may be offset to each other.
- An area of the second semiconductor chip is greater than an area of the first semiconductor chip or the support member when viewed in a plan view.
- the conductive connection members 410 may be bonding wires.
- the relay bonding pads 310 may be wiring bonding pads.
- a wiring bonding process may be performed to electrically connect the chip pads 602 a , 602 b , 602 c and 602 d of the second semiconductor chips 600 and the wiring bonding pads 310 to each other with the bonding wires 410 .
- end portions of the bonding wires 410 may be bonded to first surfaces of the wiring bonding pads 310 .
- the second semiconductor chips 600 may include memory chips.
- the memory chip may include various types of memory circuits, for example, DRAM, SRAM, flash PRAM, ReRAM, FeRAM or MRAM.
- the number, the size, the arrangement, etc., of the second semiconductor chips may be variously changed.
- a mold substrate 700 may be formed on the dummy substrate 10 to cover the first semiconductor chip 200 and the second semiconductor chips 600 .
- a molding member may be formed on the separating layer 20 by a molding process, to form the mold substrate 700 to cover the first semiconductor chip 200 , the support member 500 and the second semiconductor chips 600 .
- the mold substrate 700 may include an epoxy molding compound.
- the structure including the mold substrate 700 formed therein in FIG. 8 may be reversed, and then, the dummy substrate 10 and the separating layer 20 may be removed from the mold substrate 700 .
- the separating layer 20 may be irradiated with light or may be heated to remove the dummy substrate 10 from the mold substrate 700 .
- the relay bonding pads 300 and 310 may be exposed from a first surface 702 of the mold substrate 700 .
- the second surface of the first semiconductor chip and a bottom surface of the support substrate 500 may be exposed from the first surface 702 of the mold substrate 700 .
- the wiring bonding pads 300 and 310 may be formed in the first surface 702 of the mold substrate 700 .
- the wiring bonding pads 300 may be connected to end portions of the bonding wires 400 which are connected to the chip pad 202 of the first semiconductor chip 200 .
- the wiring bonding pad 310 may be connected to end portions of the bonding wire 410 which are connected to the chip pad of the second semiconductor chip 600 .
- Second surfaces of the wiring bonding pads 300 , 310 opposite to the first surfaces of the wiring bonding pads 300 and 310 to which the end portions of the bonding wires 400 and 410 are bonded, respectively, may be exposed from the first surface 702 of the mold substrate 700 .
- a first insulation layer 110 having first openings 111 exposing the wiring bonding pads 300 and 310 may be formed on the first surface 702 of the mold substrate 700 .
- the first insulation layer 110 may be patterned to define first openings 111 that expose the wiring bonding pads 300 , 310 respectively.
- the first insulation layer 110 may include polymer, a dielectric material, etc.
- the first insulation layer 110 may be formed by a vapor deposition process, a spin coating process, etc.
- first redistribution wirings 112 may be formed on the first insulation layer 110 to make contact with the wiring bonding pads 300 and 310 through the first openings 111 .
- the first redistribution wirings 112 may be formed on the first insulation layer 110 and on the respective wiring bonding pads 300 and 310 , respectively.
- the first redistribution wirings 112 may be formed by forming a seed layer on at least a portion of the first insulation layer 110 and on the first openings 111 , pattering the seed layer, and performing an electroplating process.
- the first redistribution wirings 112 may make contact with the wiring bonding pads 300 and 310 through the first openings 111 , respectively.
- processes the same as or substantially similar to the processes described with reference to FIGS. 11 and 12 may be repeatedly performed to form a redistribution wiring layer 100 on the first surface 702 of the mold substrate 700 , and then, outer connection members 800 may be formed on the redistribution wiring layer 100 .
- a second insulation layer 120 and second redistribution wirings 122 may be formed on the first insulation layer 110 and the first redistribution wirings 112 .
- the second insulation layer 120 may have openings, which expose the first redistribution wirings 112 on the first insulation layer 110 , respectively.
- the second redistribution wirings 122 may be formed on the second insulation layer 120 and on the respective first redistribution wirings 112 .
- a third insulation layer 130 and third redistribution wirings 132 may be formed on the second insulation layer 120 and the second redistribution wirings 122 .
- the third insulation layer 130 may have openings, which expose the second redistribution wirings 122 on the second insulation layer 120 , respectively.
- the third redistribution wirings 132 may be formed on the third insulation layer 130 and on the respective second redistribution wirings 122 .
- a fourth insulation layer 140 and fourth redistribution wirings 142 may be formed on the third insulation layer 130 and the third redistribution wiring 132 .
- the fourth insulation layer 140 may have openings, which expose the third redistribution wirings 132 on the third insulation layer 130 , respectively.
- the fourth redistribution wirings 142 may be formed the fourth insulation layer 140 on the respective third redistribution wirings 132 .
- the redistribution wiring layer 100 which includes redistribution wirings electrically connected to the wiring bonding pads 300 and 310 that function as the relay bonding pads, may be formed on the first surface 702 of the mold substrate 700 .
- the number and the arrangement of the insulation layers included in the redistribution wiring layer in the figures are merely an example, and they may be variously modified.
- the outer connection members 800 electrically connected to the redistribution wirings may be formed on the redistribution wiring layer 100 .
- a solder ball as the outer connection member may be disposed on at least some of the fourth redistribution wirings 142 .
- the portion of the fourth redistribution wirings 142 may serve as a landing pad (e.g., a package pad).
- the redistribution wiring layer 100 may be formed to include fan out type solder ball landing pads, which are formed on the mold substrate 700 , and correspond to each die of a wafer by performing semiconductor manufacturing processes.
- a sawing process may be performed on the mold substrate 700 to form an individual fan out wafer level package, which include the mold substrate 700 having the wiring bonding pads 300 and 310 , and the redistribution wiring layer 100 on the mold substrate 700 .
- FIGS. 15 and 16 are cross-sectional views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.
- the method may be substantially the same as or substantially similar to the method described with reference to FIGS. 2 to 14 except for steps of forming relay bonding pads.
- same reference numerals will be used to refer to the same or like elements and any further repetitive explanation concerning the above elements will be omitted.
- a metal pattern layer 30 having a plurality of protrusions 32 and 34 may be formed on the first separating layer 20 .
- a second separating layer 40 may be formed on the metal pattern layer 30 .
- the metal pattern layer 30 may be formed by, for example, a plating process, a deposition process and a patterning process, to be adhered on the first separating layer 20 .
- the metal pattern layer 30 may have the protrusions 32 and 34 for forming a relay bonding pad portion.
- the metal pattern layer 30 may include a single metal layer or a plurality of metal layers.
- the metal pattern layer 30 may include a metal (e.g., gold (Au), copper (Cu), or aluminum (Al)), or a metal alloy (e.g., nickel/gold (Ni/Au), or tin/copper (Sn/Cu)).
- the second separating layer 40 may be formed on the metal pattern layer 30 , and may have openings exposing the protrusions 32 and 34 respectively.
- the first and second separating layer 20 and 40 may include a polymer tape for serving as a temporary adhesive.
- chip pads 202 of the first semiconductor chip 200 may be connected to the protrusions 32 of the metal pattern layer 30 by conductive connection members 400 .
- a support member 500 may be disposed adjacent to the first semiconductor chip 200 on the second separating layer 40 .
- the first semiconductor chip 200 may include a plurality of the chip pads 202 on a first surface.
- the first semiconductor chip 200 may be arranged on the dummy substrate 10 such that a second surface of the first semiconductor chip 200 opposite to the first surface faces the dummy substrate 10 .
- the conductive connection members 400 may be bonding wires.
- a wiring bonding process may be performed to electrically connect the chip pads 202 of the first semiconductor chip 200 and the protrusions 32 of the metal pattern layer 30 to each other with the bonding wires 400 .
- end portions of the bonding wires 400 may be bonded to first surfaces of the protrusions 32 of the metal pattern layer 30 .
- chip pads 602 a , 602 b , 602 c , 602 d of the respective second semiconductor chip 600 a , 600 b , 600 c , and 600 d may be electrically connected to respective groups of the protrusions 34 of the metal pattern layer 30 by conductive connection members 410 .
- the second semiconductor chips 600 a , 600 b , 600 c and 600 d may include a plurality of the chip pads 602 a , 602 b , 602 c and 602 d on a first surface.
- the second semiconductor chips 600 may be arranged on the dummy substrate 10 such that second surfaces of the respective second semiconductor chips 600 a , 600 b , 600 c , and 600 d opposite to the first surface face the dummy substrate 10 .
- the conductive connection members 410 may be bonding wires.
- a wiring bonding process may be performed to electrically connect the chip pads 602 a , 602 b , 602 c and 602 d of the respective second semiconductor chips 600 a , 600 b , 600 c , and 600 d and the respective groups of the protrusions 34 of the metal pattern layer 30 to each other with the bonding wires 410 .
- end portions of the bonding wire may be bonded to first surfaces of the protrusion 34 of the metal pattern layer 30 .
- a mold substrate 700 may be formed on the dummy substrate 10 to cover the first semiconductor chip 200 and the second semiconductor chips 600 .
- the structure including the mold substrate 700 formed therein in FIG. 16 may be reversed, and the dummy substrate 10 and the first separating layer 20 may be removed from the mold substrate 700 . Then, the metal pattern layer 30 and the second separating layer 40 may be removed from the mold substrate 700 such that the protrusions 32 and 34 remain in the mold substrate 700 .
- the first separating layer 20 may be irradiated with light or may be heated to remove the dummy substrate 10 from the mold substrate 700 . As the dummy substrate 10 is removed, the metal pattern layer 30 may be exposed.
- portion of the metal pattern layer 30 is etched such that the protrusions remain, and the second separating layer 40 may be removed from the mold substrate 700 .
- the remaining protrusions may be used as relay bonding pads 300 and 310 respectively. Accordingly, the relay bonding pads 300 and 310 may be exposed from a first surface 702 of the mold substrate 700 .
- the second separating layer 40 may be peeled off to remove the metal pattern layer 30 on the second separating layer 40 while leaving the protrusions.
- the metal pattern layer 30 may have a relatively small thickness such that only the protrusions 32 and 34 remain when the second separating layer 40 is peeled off.
- a redistribution wiring layer 100 including redistribution wirings 112 , 122 , 132 , and 142 electrically connected to the relay bonding pads 300 or 310 may be formed on the first surface 702 of the mold substrate 700 , and then, an outer connection members 800 may be formed on the redistribution wiring layer 100 to be electrically connected to the redistribution wirings.
- a sawing process may be performed on the mold substrate 700 to form an individual fan out wafer level package, which includes the mold substrate 700 having the relay bonding pads 300 and 310 , and the redistribution wiring layer 100 on the mold substrate 700 .
- FIG. 20 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment.
- the semiconductor package may be substantially the same as or substantially similar to the semiconductor package as described with reference to FIG. 1 , except for an addition of a semiconductor chip including at least one chip pad directly connected to a redistribution wiring.
- same reference numerals will be used to refer to the same or like elements and any further repetitive explanation concerning the above elements will be omitted.
- a semiconductor package 2 may include a mold substrate 700 , a first semiconductor chip 200 , a second semiconductor chip 220 , and a plurality of third semiconductor chips 600 disposed in the mold substrate 700 , wiring bonding pads 300 and 310 formed in a first surface 702 of the mold substrate 700 , and a redistribution wiring layer 100 covering the first surface 702 of the mold substrate 700 and including redistribution wirings connected to the wiring bonding pads 300 or 310 .
- the semiconductor package 2 may further include outer connection members 800 disposed on the redistribution wiring layer 100 .
- the first semiconductor chip 200 may include a plurality of chip pads 202 on a first surface.
- the first semiconductor chip 200 may be received in the mold substrate 700 such that a second surface of the first semiconductor chip 200 opposite to the first surface faces the redistribution wiring layer 100 .
- the second surface of the first semiconductor chip 200 may be exposed from the first surface 702 of the mold substrate 700 .
- the second semiconductor chip 220 may include a plurality of chip pads 222 on a first surface.
- the second semiconductor chip 220 may be received in the mold substrate 700 such that the first surface of the second semiconductor chip 220 faces the redistribution wiring layer 100 .
- the first surface of the second semiconductor chip 222 and the chip pads 222 may be exposed from the first surface 702 of the mold substrate 700 .
- the second semiconductor chip 220 may have a height from the redistribution wiring layer 100 the same as that of the first semiconductor chip 200 .
- a plurality of the third semiconductor chips 600 may be disposed on the first semiconductor chip 200 and the second semiconductor chip 220 .
- the third semiconductor chips 600 a , 600 b , 600 c , and 600 d may include a plurality of chip pads 602 a , 602 b , 602 c and 602 d on their respective first surfaces.
- the third semiconductor chips 600 may be received in the mold substrate 700 such that a second surface of the second semiconductor chip 600 opposite to the first surface faces the redistribution wiring layer 100 .
- the second semiconductor chip 220 may be a logic chip including a logic circuit.
- the first semiconductor chip 200 and the third semiconductor chips 600 may be memory chips including memory circuit.
- the number, the size, the arrangement, etc., of the first to third semiconductor chips may not be limited thereto.
- the wiring bonding pads 300 may be formed in the first surface 702 of the mold substrate 700 and may be connected to end portions of the bonding wires 400 , respectively. Accordingly, the wiring bonding pads 300 may be electrically connected to the chip pads 202 of the first semiconductor chip 200 , respectively, by the bonding wires 400 .
- the wiring bonding pads 310 may be formed in the first surface 702 of the mold substrate 700 and may be connected to end portions of the bonding wires 410 , respectively. Accordingly, the wiring bonding pads 310 may be electrically connected to the chip pads 602 a , 602 b , 602 c , and 602 d of the third semiconductor chips 600 , respectively, by the bonding wires 410 .
- the redistribution wirings of the redistribution wiring layer 100 may make contact with the wiring bonding pads 300 or 310 , and the chip pads 222 of the second semiconductor chip exposed from the first surface 702 of the mold substrate 700 .
- the redistribution wiring layer 100 may include a first insulation layer 110 formed on the first surface 702 of the mold substrate 700 , first openings exposing the wiring bonding pads 300 and 310 , and first redistribution wirings 112 formed on the first insulation layer 110 and electrically connected to the chip pads 222 of the second semiconductor chip 220 . At least portions of the first redistribution wirings 112 may directly contact the wiring bonding pads 300 and 310 and the chip pad 222 of the second semiconductor chip 220 , respectively, through the first openings.
- the redistribution wiring layer 100 may further include second, third, fourth, and fifth insulation layers 120 , 130 , 140 and 150 , and second, third, and fourth redistribution wirings 122 , 132 , and 142 sequentially formed on the first insulation layer 110 .
- Outer connection members 800 may be disposed on at least portions of the fourth redistribution wirings 142 .
- the outer connection member 800 may include a solder ball.
- FIGS. 21 to 27 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.
- FIGS. 21, 22, 23, 25, 26 and 27 are cross-sectional views illustrating the method of manufacturing a semiconductor package.
- FIG. 24 is a plan view of FIG. 23 .
- a plurality of relay bonding pads 300 , 310 and a first semiconductor chip 200 may be arranged on a separating layer 20 on a dummy substrate 10 , and then, chip pads 202 of the first semiconductor chip 200 may be connected to the relay bonding pads 300 , respectively, by conductive connection members 400 . Then, a second semiconductor chip 220 may be arranged adjacent to the first semiconductor chip 200 on the separating layer 20 .
- the first semiconductor chip 200 may include a plurality of the chip pads 202 on a first surface (e.g., an active surface).
- the first semiconductor chip 200 may be arranged on the dummy substrate 10 such that a second surface of the first semiconductor chip 200 opposite to the first surface faces the dummy substrate 10 .
- the conductive connection members 400 may be bonding wires.
- the relay bonding pads 300 may be wiring bonding pads.
- a wiring bonding process may be performed to electrically connect the chip pads 202 of the first semiconductor chip 200 and the wiring bonding pads 300 to each other with the bonding wires 400 , respectively.
- end portions of the bonding wires 400 may be bonded to first surfaces of the wiring bonding pads 300 .
- the second semiconductor chip 220 may include a plurality of the chip pads 222 on a first surface (e.g., an active surface).
- the second semiconductor chip 220 may be arranged on the dummy substrate 10 such that the first surface of the second semiconductor chip 220 faces the dummy substrate 10 .
- the first semiconductor chip 200 may be a memory chip including a memory circuit
- the second semiconductor chip 220 may be a logic chip including a logic circuit
- the logic chip may be a controller for controlling the memory chip.
- chip pads 602 a , 602 b , 602 c , 602 d of the third semiconductor chips 600 may be electrically connected to the relay bonding pads 310 , respectively, by conductive connection members 410 .
- a mold substrate 700 may be formed on the dummy substrate 10 to cover the first semiconductor chip 200 , the second semiconductor chip 220 and the third semiconductor chips 600 .
- the third semiconductor chips 600 a , 600 b , 600 c and 600 d may include a plurality of the chip pads 602 a , 602 b , 602 c and 602 d on respective first surfaces, (e.g., respective active surfaces).
- the third semiconductor chips 600 may be arranged on the dummy substrate 10 such that a second surface of the third semiconductor chip 600 opposite to the first surface faces the dummy substrate 10 .
- the conductive connection members 410 may be bonding wires.
- the relay bonding pads 310 may be wiring bonding pads.
- a wiring bonding process may be performed to electrically connect the chip pads 602 a , 602 b , 602 c , and 602 d of the third semiconductor chips 600 and the wiring bonding pads 310 to each other with the bonding wires 410 .
- end portions of the bonding wires 410 may be bonded to first surfaces of the wiring bonding pads 310 .
- the structure including the mold substrate 700 formed in FIG. 22 may be reversed, and then, the dummy substrate 10 and the separating layer 20 may be removed from the mold substrate 700 .
- the separating layer 20 may be irradiated with light or may be heated to remove the dummy substrate 10 from the mold substrate 700 .
- the relay bonding pads 300 and 310 and the chip pads 222 of the second semiconductor chip 220 may be exposed from the first surface 702 of the mold substrate 700 .
- the second surface of the first semiconductor chip and the first surface of the second semiconductor chip 220 may be exposed from the first surface 702 of the mold substrate 700 .
- a first insulation layer 110 having first openings 111 which expose the wiring bonding pads 300 and 310 and the chip pads 222 of the second semiconductor chip 220 , respectively may be formed on the first surface 702 of the mold substrate 700 .
- the first insulation layer 110 may be patterned to form the first openings 111 to expose the wiring bonding pads 300 , 310 and the chip pads 222 of the second semiconductor chip 220 , respectively.
- the first insulation layer 110 may include polymer, a dielectric material, etc.
- the first insulation layer 110 may be formed by a vapor deposition process, a spin coating process, etc.
- first redistribution wirings 112 may be formed on the first insulation layer 110 to make contact with the wiring bonding pads 300 and 310 and the chip pads 222 of the second semiconductor chip 220 through the first openings 111 , respectively.
- the first redistribution wirings 112 may be formed on a portion of the first insulation layer 110 , the wiring bonding pads 300 and 310 , and the chip pads 222 of the second semiconductor chip 220 .
- the first redistribution wirings 112 may be formed by forming a seed layer on at least a portion of the first insulation layer 110 and on the first openings 111 , pattering the seed layer, and performing an electroplating process.
- the first redistribution wirings 112 may make contact with the wiring bonding pads 300 and 310 and the chip pads 222 of the second semiconductor chip 220 through the first openings 111 , respectively.
- processes the same as or substantially similar to the processes described with reference to FIGS. 25 and 26 may be repeatedly performed to form a redistribution wiring layer 100 on the first surface 702 of the mold substrate 700 , and then, outer connection members 800 may be formed on the redistribution wiring layer 100 .
- the redistribution wiring layer 100 including redistribution wirings, which are electrically connected to the wiring bonding pads 300 and 310 as relay bonding pads and the chip pads 222 of the second semiconductor chip 220 , respectively, may be formed on the first surface 702 of the mold substrate 700 .
- the redistribution wiring layer 100 may be formed to include fan out type solder ball landing pads which are formed on the mold substrate 700 , and correspond to each die of a wafer by performing semiconductor manufacturing processes.
- the outer connection members 800 may be formed on the redistribution wiring layer 100 to be electrically connected to the redistribution wirings.
- a sawing process may be performed to divide the mold substrate 700 individually to complete a fan out wafer level package including the mold substrate 700 having the wiring bonding pads 300 and 310 , and the redistribution wiring layer 100 on the mold substrate 700 .
- FIG. 28 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment.
- the semiconductor package may be substantially the same as or substantially similar to the semiconductor package as described with reference to FIG. 1 , except for an addition of a semiconductor chip mounted in a flip chip bonding manner.
- same reference numerals will be used to refer to the same or like elements and any further repetitive explanation concerning the above elements will be omitted.
- a semiconductor package 3 may include a mold substrate 700 , a first semiconductor chip 240 and a plurality of second semiconductor chips 600 disposed in the mold substrate 700 , wiring bonding pads 310 formed in a first surface 702 of the mold substrate 700 , bump bonding pads 320 in the first surface 702 of the mold substrate 700 , and a redistribution wiring layer 100 covering the first surface 702 of the mold substrate 700 and including redistribution wirings connected to the wiring bonding pads 310 .
- the semiconductor package 3 may further include a support member 500 disposed in the redistribution wiring layer 100 .
- the semiconductor package 3 may further include outer connection members 800 disposed on the redistribution wiring layer 100 .
- the first semiconductor chip 240 may include a plurality of chip pads 242 on a first surface.
- the first semiconductor chip 240 may be received in the mold substrate 700 such that the first surface of the first semiconductor chip 240 faces the redistribution wiring layer 100 .
- the first semiconductor chip 240 may mounted in a flip chip bonding manner in the mold substrate 700 .
- Conductive bumps 420 may be disposed on the chip pads 242 , and the conductive bumps 420 may be disposed on the bump bonding pads 320 .
- the bump bonding pads 320 may be exposed from the first surface 702 of the mold substrate 700 .
- the support member 500 may function to support a plurality of the second semiconductor chips 600 .
- the support member 500 may have a height from the redistribution wiring layer 100 the same as that of the first semiconductor chip 240 .
- a plurality of the second semiconductor chips 600 may be disposed on the first semiconductor chip 240 and the support member 500 .
- the second semiconductor chips 600 a , 600 b , 600 c , and 600 d may include a plurality of chip pads 602 a , 602 b , 602 c and 602 d on their respective first surfaces.
- the second semiconductor chips 600 may be received in the mold substrate 700 such that respective second surfaces of the second semiconductor chips 600 a , 602 b , 602 c and 602 d opposite to the corresponding first surface face the redistribution wiring layer 100 .
- the first semiconductor chip 240 may be a logic chip including a logic circuit
- the second semiconductor chips 600 may be a memory chip including a memory circuit.
- the logic chip may be a controller for controlling the memory chip.
- the number, the size, the arrangement, etc., of the first and second semiconductor chips may not be limited thereto.
- the wiring bonding pads 310 may be formed in the first surface 702 of the mold substrate 700 and may be connected to end portions of bonding wires 410 . Accordingly, the wiring bonding pads 310 may be electrically connected to the chip pads of the second semiconductor chips 600 by the bonding wires 410 .
- first surfaces of the wiring bonding pads 310 may be connected to end portions of the bonding wires 410 , respectively, and second surfaces of the wiring bonding pads 310 opposite to the corresponding first surfaces may be exposed from the first surface 702 of the mold surface 700 and may be connected to the redistribution wiring.
- the second surfaces of the wiring bonding pads 310 may be coplanar with the first surface 702 of the mold substrate 700 .
- the bump bonding pads 320 may be formed in the first surface 702 of the mold substrate 700 and may be connected to the conductive bumps 420 , respectively. Accordingly, the bump bonding pads 320 may be electrically connected to the chip pads 242 of the first semiconductor chip 240 by the conductive bumps 420 .
- the redistribution wirings of the redistribution wiring layer 100 may make contact with the wiring bonding pads 310 and the bump bonding pads 320 exposed from the first surface 702 of the mold substrate 700 .
- the redistribution wiring layer 100 may include a first insulation layer 110 formed on the first surface 702 of the mold substrate 700 , first openings exposing the wiring bonding pads 310 and the bump bonding pads 320 , and first redistribution wirings 112 formed on the first insulation layer 110 . At least portions of the first redistribution wirings 112 may directly contact the wiring bonding pads 310 or the bump bonding pads 320 through the first openings. The first redistribution wiring 112 may make contact with the second surfaces of the wiring bonding pads 310 , the first surface of the wiring bonding pad 310 may be covered by the mold substrate 700 , and side surfaces of the wiring bonding pad 310 may be covered by the first insulation layer 110 .
- the redistribution wiring layer 100 may further include second, third, fourth and fifth insulation layers 120 , 130 , 140 and 150 and second, third and fourth redistribution wirings 122 , 132 and 142 sequentially formed on the first insulation layer 110 .
- Outer connection members 800 may be disposed on portions of the fourth redistribution wirings 142 .
- the outer connection member 800 may include a solder ball.
- FIGS. 29 to 37 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.
- FIGS. 29, 31, 32, 33, 34, 35, 36 and 37 are cross-sectional views illustrating the method of manufacturing a semiconductor package.
- FIG. 30 is a plan view of FIG. 29 .
- a plurality of relay bonding pads 310 , 320 may be formed on the metal layer 50 .
- the metal layer 50 may be formed by, for example, a plating process, a deposition process and a patterning process, and then may be adhered on the dummy substrate 10 .
- the metal layer 50 may have protrusions 52 and 54 for forming relay bonding pad portions.
- the metal layer 50 may include a single metal layer or a plurality of metal layers.
- the metal layer 50 may include a metal (e.g., gold (Au), copper (Cu), or aluminum (Al)), or a metal alloy (e.g., nickel/gold (Ni/Au) or tin/copper (Sn/Cu)).
- An insulation layer 60 may be formed on the metal layer 60 , and may have openings exposing the protrusions 52 and 54 respectively.
- the insulation layer 60 may include an insulating material (e.g., polymer tape or solder resist).
- the relay bonding pads 310 and 320 may be formed on the protrusions 52 and 54 , respectively.
- the relay bonding pads 310 and 320 may include a different metal from the metal layer 50 .
- the metal layer 50 may include copper (Cu)
- the relay bonding pads 310 and 320 may include gold (Au) or nickel/gold (Ni/Au).
- the relay bonding pads 320 may be bump bonding pads.
- the relay bonding pads 320 may be metal bonding parts to be bonded to conductive bumps for electrical connection to a first semiconductor chip which will be stacked later.
- the relay bonding pads 310 may be wiring bonding pads.
- the relay bonding pad 310 may be metal bonding parts to be bonded to bonding wires for electrical connection to second semiconductor chips which will be stacked later.
- the step of forming the insulation layer 60 may be omitted, and the relay bonding pads may be formed on the metal layer 50 in desired (or alternatively, predetermined) positions.
- chip pads 242 of the first semiconductor chip 240 may be connected to the relay bonding pads 320 by conductive connection members 420 .
- a support member 500 may be disposed adjacent to the first semiconductor chip 240 on the metal layer 50 on the dummy substrate 10 .
- the first semiconductor chip 240 may include a plurality of the chip pads 242 on a first surface.
- the first semiconductor chip 240 may be arranged on the dummy substrate 10 such that the first surface of the first semiconductor chip 240 faces the dummy substrate 10 .
- the first semiconductor chip 240 may be mounted on the metal layer 50 in a flip chip bonding manner.
- the conductive connection members 420 may be conductive bumps.
- the relay bonding pads 320 may be bump bonding pads.
- the first semiconductor chip 240 may be mounted on the dummy substrate 10 via the conductive bumps 420 .
- the conductive bumps 420 may be disposed on the bump bonding pads 320 , respectively. Then, the conductive bumps 420 may be adhered to the bump bonding pads 320 by a reflow process to mount the first semiconductor chip 240 on the dummy substrate 10 .
- the support member 500 may be stacked on the insulation layer 60 by an adhesive layer 510 .
- another semiconductor chip may be disposed instead of the support member 500 .
- chip pads 602 a , 602 b , 602 c , 602 d of the second semiconductor chip 600 may be electrically connected to the relay bonding pads 310 by conductive connection members 410 .
- a mold substrate 700 may be formed on the dummy substrate 10 to cover the first semiconductor chip 240 and the second semiconductor chips 600 .
- the second semiconductor chips 600 a , 600 b , 600 c and 600 d may include a plurality of the chip pads 602 a , 602 b , 602 c and 602 d on respective first surfaces (e.g., respective active surfaces).
- the second semiconductor chips 600 a , 600 b , 600 c , and 600 d may be arranged on the dummy substrate 10 such that second surfaces of the second semiconductor chip 600 opposite to the corresponding first surfaces face the dummy substrate 10 .
- a plurality of the second semiconductor chips 600 a , 600 b , 600 c and 600 d may be stacked sequentially by adhesive layers 610 .
- the second semiconductor chips 600 a , 600 b , 600 c and 600 d may be staked in a cascade structure.
- the second semiconductor chips may be offset to each other.
- An area of the second semiconductor chip is greater than an area of the first semiconductor chip or the support member when viewed in a plan view.
- the conductive connection members 410 may be bonding wires.
- the relay bonding pads 310 may be wiring bonding pads.
- a wiring bonding process may be performed to electrically connect the chip pads of the second semiconductor chips 600 and the wiring bonding pads 310 to each other with the bonding wires 410 .
- end portions of the bonding wires may be bonded to first surfaces of the wiring bonding pads 310 , respectively.
- a molded underfill (MUF) process may be performed to mold a molding member on the insulation layer 60 , to form the mold substrate 700 covering the first semiconductor chip 240 , the support member 500 and the second semiconductor chips 600 .
- the mold substrate 700 may include an epoxy molding compound.
- the structure including the mold substrate 700 formed therein in FIG. 32 may be reversed, and then, the dummy substrate 10 , the metal layer 50 and the insulation layer 60 may be removed from the mold substrate 700 .
- a selective etch process may be performed to remove the metal layer 50 and the insulation layer 60 .
- relay bonding pads 310 and the bump bonding pads 320 may be exposed from the first surface 702 of the mold substrate 700 .
- a first insulation layer 110 having first openings 111 which expose the wiring bonding pads 310 and the bump bonding pads, respectively, may be formed on the first surface 702 of the mold substrate 700 .
- the first insulation layer 111 may be patterned to form the first openings 111 to expose the wiring bonding pads 310 and the bump bonding pads 320 , respectively.
- the first insulation layer 110 may include polymer, a dielectric material, etc.
- the first insulation layer 110 may be formed by a vapor deposition process, a spin coating process, etc.
- first redistribution wirings 112 may be formed on the first insulation layer 110 to make contact with the wiring bonding pads 310 and the bump bonding pads 320 through the first openings 111 , respectively.
- the first redistribution wirings 112 may be formed on portions of the first insulation layer 110 , the wiring bonding pads 310 , and the bump bonding pads 320 .
- the first redistribution wirings 112 may be formed by forming a seed layer on the portions of the first insulation layer 110 and on the first openings 111 , pattering the seed layer, and performing an electroplating process.
- the first redistribution wirings 112 may make contact with the wiring bonding pads 310 or the bump bonding pads 320 through the first openings.
- processes the same as or substantially similar to the processes described with reference to FIGS. 35 and 36 may be performed to form a redistribution wiring layer 100 on the first surface 702 of the mold substrate 700 , and then, outer connection members 800 may be formed on the redistribution wiring layer 100 .
- the redistribution wiring layer 100 which includes redistribution wirings electrically connected to the wiring bonding pads 310 or the bump bonding pads 320 , may be formed on the first surface 702 of the mold substrate 700 .
- the redistribution wiring layer 100 may be formed to include fan out type solder ball landing pads, which are formed on the mold substrate 700 , and correspond to each die of a wafer by performing semiconductor manufacturing processes.
- the outer connection members 800 may be formed on the redistribution wiring layer 100 to be electrically connected to the redistribution wirings.
- a sawing process may be performed to divide the mold substrate 700 individually to complete a fan out wafer level package including the mold substrate 700 having the relay bonding pads 310 and 320 , and the redistribution wiring layer 100 on the mold substrate 700 .
- the semiconductor package may include logic devices (e.g., central processing units (CPUs), main processing units (MPUs), or application processors (APs)), and volatile memory devices (e.g., DRAM devices or SRAM devices), or non-volatile memory devices (e.g., flash memory devices, PRAM devices, MRAM devices, or ReRAM devices).
- logic devices e.g., central processing units (CPUs), main processing units (MPUs), or application processors (APs)
- volatile memory devices e.g., DRAM devices or SRAM devices
- non-volatile memory devices e.g., flash memory devices, PRAM devices, MRAM devices, or ReRAM devices.
Abstract
A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.
Description
- This application is a continuation of U.S. application Ser. No. 15/791,831, filed on Oct. 24, 2017, which claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2016-0145316, filed on Nov. 2, 2016 in the Korean Intellectual Property Office (KIPO), the contents of each of which are herein incorporated by reference in their entirety.
- Example embodiments relate to semiconductor packages and/or methods of manufacturing the semiconductor package. More particularly, example embodiments relate to fan out wafer level packages (FOWLP) and/or methods of manufacturing the semiconductor packages.
- A fan out type wafer level package may include a mold layer surrounding sidewalls and a bottom surface of a semiconductor chip and a redistribution wiring layer formed on the semiconductor chip. In case that the semiconductor chip is mounted in a flip chip manner, a redistribution wiring process in wafer level may be performed on a flip chip bump exposed from the mold layer to form the redistribution wiring layer. However, when the semiconductor chip has a bonding wiring structure, it may be difficult to perform the redistribution wiring process in wafer level.
- Some example embodiments provide fan out wafer level packages including a bonding wiring structure.
- Some example embodiments provide methods of manufacturing a fan out wafer level package.
- According to an example embodiment, a semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate, the at least one first semiconductor chip including chip pads, wiring bonding pads at a first surface of the mold substrate, the wiring bonding pads connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate, the distribution wiring layer including redistribution wirings, the redistribution wirings connected to the wiring bonding pads.
- According to an example embodiment, a method of manufacturing includes forming wiring bonding pads on a dummy substrate, stacking at least one first semiconductor chip on the dummy substrate, forming bonding wires to connect first chip pads of the first semiconductor chip and the wiring bonding pads to each other, cover the first semiconductor chip on the dummy substrate with a molding member to form a mold substrate, removing the dummy substrate from the mold substrate such that the wiring bonding pads are exposed from a first surface of the mold substrate, and forming a redistribution wiring layer on the first surface of the mold substrate, the redistribution wiring layer including redistribution wirings electrically connected to the wiring bonding pads.
- According to an example embodiment, a method of manufacturing a semiconductor package includes forming relay bonding pads on a dummy substrate, stacking at least one first semiconductor chip on the dummy substrate, forming conductive connection members to connect chip pads of the first semiconductor chip with the relay bonding pads, covering the first semiconductor chip on the dummy substrate with a molding member to form a mold substrate on the dummy substrate, removing the dummy substrate from the mold substrate such that the relay bonding pads are exposed from a first surface of the mold substrate, and forming a redistribution wiring layer on the first surface of the mold substrate, the redistribution wiring layer including redistribution wirings electrically connected to the relay bonding pads.
- According to an example embodiment, a method of manufacturing a semiconductor package includes forming relay bonding pads on a dummy substrate, stacking at least one first semiconductor chip on the dummy substrate, forming conductive connection members to connect chip pads of the first semiconductor chip with the relay bonding pads, covering the first semiconductor chip on the dummy substrate with a molding member to form a mold substrate on the dummy substrate, removing the dummy substrate from the mold substrate such that the relay bonding pads are exposed from a first surface of the mold substrate, and forming a redistribution wiring layer on the first surface of the mold substrate, the redistribution wiring layer including redistribution wirings electrically connected to the relay bonding pads.
- According to an example embodiment, a semiconductor package includes a first semiconductor chip having a bonding wiring structure in a mold substrate, wiring bonding pads formed in a first surface of the mold substrate and bonded to end portions of bonding wires electrically connected to the first semiconductor chip, and a fan out type redistribution wiring layer formed on the first surface of the mold substrate by a redistribution wiring process. A first redistribution wiring of the redistribution wiring layer may be bonded to the wiring bonding pad exposed from the first surface of the mold substrate.
- According to an example embodiment, a semiconductor package includes a redistribution wiring layer including redistribution wirings and fan out type landing pads connected to the redistribution wirings, at least one first semiconductor chip on the redistribution wiring layer, the at least one first semiconductor chip including a first surface having first chip pads thereon and a second surface facing the redistribution wiring layer, wiring bonding pads at a first surface of the redistribution wiring layer, the wire bonding pads connected to corresponding ones of the redistribution wirings, and bonding wires connecting the first chip pads with wiring bonding pads such that the first chip pads are connected to corresponding ones of the fan out type landing pads on a second surface of the redistribution wiring layer, the second surface of the redistribution wiring layer being opposite to the first surface of the redistribution wiring layer.
- Accordingly, the wiring bonding pads may serve as a medium to electrically connect the bonding wires to the redistribution wirings, which are formed by the redistribution wiring process, and provide physical bonding surfaces therebetween. The wiring bonding pads may mount the semiconductor chips, which are incompatible with the fan out type redistribution wiring layer due to the bonding wiring structure, on the redistribution wiring layer, thereby providing the fan out wafer level package.
- Example embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.
FIGS. 1 to 37 represent non-limiting, example embodiments as described herein. -
FIG. 1 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment. -
FIGS. 2 to 14 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment. -
FIGS. 15 to 19 are cross-sectional views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment. -
FIG. 20 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment. -
FIGS. 21 to 27 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment. -
FIG. 28 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment. -
FIGS. 29 to 37 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment. -
FIG. 1 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment. - Referring to
FIG. 1 , asemiconductor package 1 may include amold substrate 700, afirst semiconductor chip 200 disposed in themold substrate 700,wiring bonding pads 300 formed in afirst surface 702 of themold substrate 700, and aredistribution wiring layer 100 covering thefirst surface 702 of themold substrate 700 and including redistribution wirings connected to thewiring bonding pads 300. Thesemiconductor package 1 may further include second semiconductor chips 600 (e.g., 600 a, 600 b, 600 c, and 600 d) disposed in themold substrate 700 andwiring bonding pads 310 formed in the first surface of themold substrate 700. Thesemiconductor package 1 may further include asupport member 500 disposed in themold substrate 700. Thesemiconductor package 1 may further includeouter connection members 800 disposed on theredistribution wiring layer 100. - In example embodiments, the
semiconductor package 1 may be a fan out wafer level package including themold substrate 700 and theredistribution wiring layer 100 formed on thefirst surface 702 of themold substrate 700. Theredistribution wiring layer 100 may be formed on thefirst surface 702 of themold substrate 700 by a redistribution wiring process in wafer level. Thefirst semiconductor chip 200 and thesecond semiconductor chip 600 electrically connected to thebonding wires mold substrate 700. - The
wiring bonding pads bonding wires first surface 702 of themold substrate 700. Thewiring bonding pads first surface 702 of themold substrate 700, and may be connected to the redistribution wirings of theredistribution wiring layer 100. For example, first surfaces of thewiring bonding pads wiring bonding pads first surface 702 of themold surface 700 and may be connected to the redistribution wiring. The second surface of thewiring bonding pads first surface 702 of themold substrate 700. The first surface and side surfaces of thewiring bonding pads mold substrate 700. - Accordingly, the first surface of the wiring bonding pad may be connected to the bonding wire, and the second surface of the wiring bonding pad may be connected to the redistribution wiring. That is, the wiring bonding pad may be a relay bonding pad as a medium structure to provide physical bonding surfaces for connecting the bonding wire and the redistribution wire. The wiring bonding pad may have the same or substantially similar structure to under bump metallurgy (UBM) and perform the same or substantially similar function.
- The
wiring bonding pads wiring bonding pads - For example, the
first semiconductor chip 200 may include a plurality ofchip pads 202 on its first surface (e.g., an active surface). Thefirst semiconductor chip 200 may be received in themold substrate 700 such that a second surface of thefirst semiconductor chip 200 opposite to the first surface faces theredistribution wiring layer 100. The second surface of thefirst semiconductor chip 200 may be exposed from thefirst surface 702 of themold substrate 700. - The
first semiconductor chip 200 may include integrated circuits. For example, thefirst semiconductor chip 200 may be a logic chip including a logic circuit. The logic chip may be a controller for controlling memory chips. Although only some chip pads are illustrated in the figure, the illustrated structure and arrangement of the chip pads are merely an example, and they are not limited thereto. - The
support member 500 may function to support a plurality of thesecond semiconductor chips 600. Thesupport member 500 may have a height from theredistribution wiring layer 100, which is the same as that of thefirst semiconductor chip 200. A surface of thesupport member 500 may be exposed from thefirst surface 702 of themold substrate 700. For example, thesupport member 500 may include a semiconductor substrate, a metal or non-metal plate, a printed circuit board, etc. - The
support member 500 may include a passive device therein. For example, thesupport member 500 may include a capacitor, a resistor, an inductor, etc. Thesupport member 500 may provide functions such as decoupling, filtering, resonance damping and/or voltage control. Although it is not illustrated in the figure, thesupport member 500 may be electrically connected to some of the redistribution wirings. - A plurality of the
second semiconductor chips 600 may be disposed on thefirst semiconductor chip 200 and thesupport member 500. Thesecond semiconductor chips chip pads second semiconductor chip 600 may be received in themold substrate 700 such that a second surface of thesecond semiconductor chip 600 opposite to the first surface faces theredistribution wiring layer 100. - The
second semiconductor chips 600 may include memory chips. The memory chip may include various types of memory circuits, for example, DRAM, SRAM, flash PRAM, ReRAM, FeRAM or MRAM. The number, the size, the arrangement, etc., of the second semiconductor chips may be variously modified. - The
wiring bonding pad 300 may be formed in thefirst surface 702 of themold substrate 700 and may be connected to the end portions of thebonding wires 400. Accordingly, thewiring bonding pads 300 may be electrically connected to thechip pad 202 of thefirst semiconductor chip 200 by thebonding wires 400. - The redistribution wirings of the
redistribution wiring layer 100 may make contact with the second surfaces of thewiring bonding pads first surface 702 of themold substrate 700. - For example, the
redistribution wiring layer 100 may include afirst insulation layer 110 formed on thefirst surface 702 of themold substrate 700, first openings exposing thewiring bonding pads first redistribution wirings 112 formed on thefirst insulation layer 110. At least portions of thefirst redistribution wirings 112 may directly contact thewiring bonding pads - The
redistribution wiring layer 100 may include asecond insulation layer 120 formed on thefirst insulation layer 120, second openings exposing thefirst redistribution wirings 112, and second redistribution wirings 122 formed on thesecond insulation layer 120. At least a portion of thesecond redistribution wiring 122 may directly contact thefirst redistribution wiring 112 through the second opening. - The
redistribution wiring layer 100 may include athird insulation layer 130 formed on thesecond insulation layer 120, third openings exposing thesecond redistribution wirings 122, andthird redistribution wirings 132 formed on thethird insulation layer 130. At least a portion of thethird redistribution wiring 132 may directly contact thesecond redistribution wiring 122 through the third opening. - The
redistribution wiring layer 100 may include afourth insulation layer 140 formed on thethird insulation layer 130, fourth openings exposing thethird redistribution wirings 132, and fourth redistribution wirings 142 formed on thefourth insulation layer 140. At least a portion of thefourth redistribution wiring 142 may directly contact thethird redistribution wiring 132 through the fourth opening. - The
redistribution wiring layer 100 may include afifth insulation layer 150 formed on thefourth insulation layer 140, fifth openings exposing thefourth redistribution wirings 142. Thus, theredistribution wiring layer 100 may include fan out type solder ball landing pads which are formed on themold substrate 700 and correspond to each die of a wafer by performing semiconductor manufacturing processes. -
Outer connection members 800 may be disposed on portions of thefourth redistribution wirings 142 exposed through the fifth openings. For example, theouter connection member 800 may include a solder ball. The portion of the fourth redistribution wirings 142 may serve as a solder ball landing pad (e.g., a package pad). - As mentioned above, the
semiconductor package 1 as the fan out wafer level package may include thefirst semiconductor chip 200 and a plurality ofsecond semiconductor chips 600 having bonding wiring connections in themold substrate 700, thewiring bonding pads first surface 702 of themold substrate 700 and bonded to the end portions of thebonding wires redistribution wiring layer 100 formed on thefirst surface 702 of themold substrate 700 by a redistribution wiring process. Thefirst redistribution wiring 112 of theredistribution wiring layer 100 may be bonded to thewiring bonding pads first surface 702 of themold substrate 700. - Accordingly, the
wiring bonding pads - Hereinafter, a method of manufacturing the semiconductor package in
FIG. 1 will be explained. -
FIGS. 2 to 14 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.FIGS. 2, 3, 4, 6, 9, 11, 12, 13 and 14 are cross-sectional views illustrating the method of manufacturing a semiconductor package.FIG. 5 is a plan view ofFIG. 4 .FIG. 7 is a plan view ofFIG. 6 .FIG. 10 is a plan view ofFIG. 9 . - Referring to
FIG. 2 , first, aseparating layer 20 may be formed on adummy substrate 10. - In some example embodiments, the
dummy substrate 10 may be used as a base substrate on which a plurality of semiconductor chips are stacked and then molded. Thedummy substrate 10 may have a size corresponding to a wafer. For example, thedummy substrate 10 may include a silicon substrate, a glass substrate, a metal or non-metal plate, etc. - The
separating layer 20 may include a polymer tape that serves as a temporary adhesive. Theseparating layer 20 may include a material that loses its adhesive strength, for example, when irradiated with light or heated. For example, theseparating layer 20 may include a dual cure silicon adhesive that is cross-linkable by irradiation of ultraviolet ray or visible light. - Referring to
FIG. 3 , a plurality ofrelay bonding pads separating layer 20. - In some example embodiments, the
relay bonding pads separating layer 20 in a desired (or alternatively, predetermined) position. For example, therelay bonding pads - The
relay bonding pads relay bonding pad 300 may be a metal bonding part to be bonded to the bonding wire for electrical connection to a first semiconductor chip which will be stacked later. Therelay bonding pad 310 may be a metal bonding part to be bonded to the bonding wire for electrical connection to a second semiconductor chip will be stacked later. - Referring to
FIGS. 4 and 5 , after afirst semiconductor chip 200 is disposed on theseparating layer 20,chip pads 202 of thefirst semiconductor chip 200 may be connected to therelay bonding pads 300 byconductive connection members 400. Asupport member 500 may be disposed adjacent to thefirst semiconductor chip 200 on theseparating layer 20. - In some example embodiments, the
first semiconductor chip 200 may include a plurality of thechip pads 202 on a first surface (e.g., an active surface). Thefirst semiconductor chip 200 may be arranged on thedummy substrate 10 such that a second surface of thefirst semiconductor chip 200 opposite to the first surface faces thedummy substrate 10. - The
conductive connection members 400 may be bonding wires. In such case, therelay bonding pads 300 may be wiring bonding pads. A wiring bonding process may be performed to electrically connect thechip pads 202 of thefirst semiconductor chip 200 and thewiring bonding pads 300 to each other with thebonding wires 400. Thus, end portions of thebonding wires 400 may be bonded to first surfaces of thewiring bonding pads 300, respectively. - The
first semiconductor chip 200 may include integrated circuits. For example, thefirst semiconductor chip 200 may be a logic chip including a logic circuit. The logic chip may be a controller for controlling memory chips. The structure and arrangement of the chip pads illustrated in the figure are merely an example, and they are not limited thereto. - The
support member 500 may support a plurality of semiconductor chips stacked thereon, as described later. Thesupport member 500 may have a height from theseparating layer 20 the same as that of thefirst semiconductor chip 200. Accordingly, an upper surface of thesupport member 500 may be coplanar with the first surface of thefirst semiconductor chip 200. For example, thesupport member 500 may include a semiconductor substrate, a metal or non-metal plate, a printed circuit board, etc. - The
support member 500 may include a passive device therein. For example, thesupport member 500 may include a capacitor, a resistor, an inductor, etc. Thesupport member 500 may provide functions such as decoupling, filtering, resonance damping and/or voltage control. Although it is not illustrated in the figures, thesupport member 500 may be electrically connected to some of redistribution wirings. - Referring to
FIGS. 6 and 7 , after a plurality ofsecond semiconductor chips 600 are stacked on thefirst semiconductor chip 200, thesupport member 500,chip pads second semiconductor chips relay bonding pads 310 byconductive connection members 410. - In some example embodiments, the
second semiconductor chips chip pads second semiconductor chips 600 may be arranged on thedummy substrate 10 such that a second surface of thesecond semiconductor chip 600 opposite to the first surface faces thedummy substrate 10. - A plurality of
second semiconductor chips adhesive layers 610. Thesecond semiconductor chips - The
conductive connection members 410 may be bonding wires. In such case, therelay bonding pads 310 may be wiring bonding pads. A wiring bonding process may be performed to electrically connect thechip pads second semiconductor chips 600 and thewiring bonding pads 310 to each other with thebonding wires 410. Thus, end portions of thebonding wires 410 may be bonded to first surfaces of thewiring bonding pads 310. - The
second semiconductor chips 600 may include memory chips. The memory chip may include various types of memory circuits, for example, DRAM, SRAM, flash PRAM, ReRAM, FeRAM or MRAM. The number, the size, the arrangement, etc., of the second semiconductor chips may be variously changed. - Referring to
FIG. 8 , amold substrate 700 may be formed on thedummy substrate 10 to cover thefirst semiconductor chip 200 and the second semiconductor chips 600. - In some example embodiments, a molding member may be formed on the
separating layer 20 by a molding process, to form themold substrate 700 to cover thefirst semiconductor chip 200, thesupport member 500 and the second semiconductor chips 600. For example, themold substrate 700 may include an epoxy molding compound. - Referring to
FIGS. 9 and 10 , the structure including themold substrate 700 formed therein inFIG. 8 may be reversed, and then, thedummy substrate 10 and theseparating layer 20 may be removed from themold substrate 700. - In some example embodiments, the
separating layer 20 may be irradiated with light or may be heated to remove thedummy substrate 10 from themold substrate 700. As thedummy substrate 10 is removed, therelay bonding pads first surface 702 of themold substrate 700. In addition, the second surface of the first semiconductor chip and a bottom surface of thesupport substrate 500 may be exposed from thefirst surface 702 of themold substrate 700. - Accordingly, the
wiring bonding pads first surface 702 of themold substrate 700. Thewiring bonding pads 300 may be connected to end portions of thebonding wires 400 which are connected to thechip pad 202 of thefirst semiconductor chip 200. Thewiring bonding pad 310 may be connected to end portions of thebonding wire 410 which are connected to the chip pad of thesecond semiconductor chip 600. Second surfaces of thewiring bonding pads wiring bonding pads bonding wires first surface 702 of themold substrate 700. - Referring to
FIG. 11 , afirst insulation layer 110 havingfirst openings 111 exposing thewiring bonding pads first surface 702 of themold substrate 700. - In some example embodiments, after the
first insulation layer 110 is formed to cover thefirst surface 702 of themold substrate 700, thefirst insulation layer 110 may be patterned to definefirst openings 111 that expose thewiring bonding pads - For example, the
first insulation layer 110 may include polymer, a dielectric material, etc. Thefirst insulation layer 110 may be formed by a vapor deposition process, a spin coating process, etc. - Referring to
FIG. 12 ,first redistribution wirings 112 may be formed on thefirst insulation layer 110 to make contact with thewiring bonding pads first openings 111. - In some example embodiments, the
first redistribution wirings 112 may be formed on thefirst insulation layer 110 and on the respectivewiring bonding pads first redistribution wirings 112 may be formed by forming a seed layer on at least a portion of thefirst insulation layer 110 and on thefirst openings 111, pattering the seed layer, and performing an electroplating process. - Accordingly, the
first redistribution wirings 112 may make contact with thewiring bonding pads first openings 111, respectively. - Referring to
FIGS. 13 and 14 , processes the same as or substantially similar to the processes described with reference toFIGS. 11 and 12 may be repeatedly performed to form aredistribution wiring layer 100 on thefirst surface 702 of themold substrate 700, and then,outer connection members 800 may be formed on theredistribution wiring layer 100. - In some example embodiments, a
second insulation layer 120 andsecond redistribution wirings 122 may be formed on thefirst insulation layer 110 and thefirst redistribution wirings 112. Thesecond insulation layer 120 may have openings, which expose thefirst redistribution wirings 112 on thefirst insulation layer 110, respectively. Thesecond redistribution wirings 122 may be formed on thesecond insulation layer 120 and on the respectivefirst redistribution wirings 112. - Then, a
third insulation layer 130 andthird redistribution wirings 132 may be formed on thesecond insulation layer 120 and thesecond redistribution wirings 122. Thethird insulation layer 130 may have openings, which expose the second redistribution wirings 122 on thesecond insulation layer 120, respectively. Thethird redistribution wirings 132 may be formed on thethird insulation layer 130 and on the respectivesecond redistribution wirings 122. - Then, a
fourth insulation layer 140 and fourth redistribution wirings 142 may be formed on thethird insulation layer 130 and thethird redistribution wiring 132. Thefourth insulation layer 140 may have openings, which expose the third redistribution wirings 132 on thethird insulation layer 130, respectively. The fourth redistribution wirings 142 may be formed thefourth insulation layer 140 on the respectivethird redistribution wirings 132. - Thus, the
redistribution wiring layer 100, which includes redistribution wirings electrically connected to thewiring bonding pads first surface 702 of themold substrate 700. The number and the arrangement of the insulation layers included in the redistribution wiring layer in the figures are merely an example, and they may be variously modified. - Then, the
outer connection members 800 electrically connected to the redistribution wirings may be formed on theredistribution wiring layer 100. For example, a solder ball as the outer connection member may be disposed on at least some of thefourth redistribution wirings 142. In such case, the portion of the fourth redistribution wirings 142 may serve as a landing pad (e.g., a package pad). Thus, theredistribution wiring layer 100 may be formed to include fan out type solder ball landing pads, which are formed on themold substrate 700, and correspond to each die of a wafer by performing semiconductor manufacturing processes. - Then, a sawing process may be performed on the
mold substrate 700 to form an individual fan out wafer level package, which include themold substrate 700 having thewiring bonding pads redistribution wiring layer 100 on themold substrate 700. -
FIGS. 15 and 16 are cross-sectional views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment. The method may be substantially the same as or substantially similar to the method described with reference toFIGS. 2 to 14 except for steps of forming relay bonding pads. Thus, same reference numerals will be used to refer to the same or like elements and any further repetitive explanation concerning the above elements will be omitted. - Referring to
FIG. 15 , after afirst separating layer 20 is formed on adummy substrate 10, ametal pattern layer 30 having a plurality ofprotrusions first separating layer 20. Then, asecond separating layer 40 may be formed on themetal pattern layer 30. - In some example embodiments, the
metal pattern layer 30 may be formed by, for example, a plating process, a deposition process and a patterning process, to be adhered on thefirst separating layer 20. Themetal pattern layer 30 may have theprotrusions metal pattern layer 30 may include a single metal layer or a plurality of metal layers. For example, themetal pattern layer 30 may include a metal (e.g., gold (Au), copper (Cu), or aluminum (Al)), or a metal alloy (e.g., nickel/gold (Ni/Au), or tin/copper (Sn/Cu)). Thesecond separating layer 40 may be formed on themetal pattern layer 30, and may have openings exposing theprotrusions second separating layer - Referring to
FIG. 16 , after afirst semiconductor chip 200 is disposed on thesecond separating layer 40 on thedummy substrate 10,chip pads 202 of thefirst semiconductor chip 200 may be connected to theprotrusions 32 of themetal pattern layer 30 byconductive connection members 400. Then, asupport member 500 may be disposed adjacent to thefirst semiconductor chip 200 on thesecond separating layer 40. - In some example embodiments, the
first semiconductor chip 200 may include a plurality of thechip pads 202 on a first surface. Thefirst semiconductor chip 200 may be arranged on thedummy substrate 10 such that a second surface of thefirst semiconductor chip 200 opposite to the first surface faces thedummy substrate 10. - The
conductive connection members 400 may be bonding wires. A wiring bonding process may be performed to electrically connect thechip pads 202 of thefirst semiconductor chip 200 and theprotrusions 32 of themetal pattern layer 30 to each other with thebonding wires 400. Thus, end portions of thebonding wires 400 may be bonded to first surfaces of theprotrusions 32 of themetal pattern layer 30. - Then, after a plurality of
second semiconductor chips 600 is stacked on thefirst semiconductor chip 200 and thesupport member 500,chip pads second semiconductor chip protrusions 34 of themetal pattern layer 30 byconductive connection members 410. - In some example embodiments, the
second semiconductor chips chip pads second semiconductor chips 600 may be arranged on thedummy substrate 10 such that second surfaces of the respectivesecond semiconductor chips dummy substrate 10. - The
conductive connection members 410 may be bonding wires. A wiring bonding process may be performed to electrically connect thechip pads second semiconductor chips protrusions 34 of themetal pattern layer 30 to each other with thebonding wires 410. Thus, end portions of the bonding wire may be bonded to first surfaces of theprotrusion 34 of themetal pattern layer 30. - Then, a
mold substrate 700 may be formed on thedummy substrate 10 to cover thefirst semiconductor chip 200 and the second semiconductor chips 600. - Referring to
FIGS. 17 and 18 , the structure including themold substrate 700 formed therein inFIG. 16 may be reversed, and thedummy substrate 10 and thefirst separating layer 20 may be removed from themold substrate 700. Then, themetal pattern layer 30 and thesecond separating layer 40 may be removed from themold substrate 700 such that theprotrusions mold substrate 700. - In some example embodiments, the
first separating layer 20 may be irradiated with light or may be heated to remove thedummy substrate 10 from themold substrate 700. As thedummy substrate 10 is removed, themetal pattern layer 30 may be exposed. - Subsequently, portion of the
metal pattern layer 30 is etched such that the protrusions remain, and thesecond separating layer 40 may be removed from themold substrate 700. The remaining protrusions may be used asrelay bonding pads relay bonding pads first surface 702 of themold substrate 700. - Alternatively, the
second separating layer 40 may be peeled off to remove themetal pattern layer 30 on thesecond separating layer 40 while leaving the protrusions. Themetal pattern layer 30 may have a relatively small thickness such that only theprotrusions second separating layer 40 is peeled off. - Referring to
FIG. 19 , aredistribution wiring layer 100 includingredistribution wirings relay bonding pads first surface 702 of themold substrate 700, and then, anouter connection members 800 may be formed on theredistribution wiring layer 100 to be electrically connected to the redistribution wirings. - Then, a sawing process may be performed on the
mold substrate 700 to form an individual fan out wafer level package, which includes themold substrate 700 having therelay bonding pads redistribution wiring layer 100 on themold substrate 700. -
FIG. 20 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment. The semiconductor package may be substantially the same as or substantially similar to the semiconductor package as described with reference toFIG. 1 , except for an addition of a semiconductor chip including at least one chip pad directly connected to a redistribution wiring. Thus, same reference numerals will be used to refer to the same or like elements and any further repetitive explanation concerning the above elements will be omitted. - Referring to
FIG. 20 , asemiconductor package 2 may include amold substrate 700, afirst semiconductor chip 200, asecond semiconductor chip 220, and a plurality ofthird semiconductor chips 600 disposed in themold substrate 700,wiring bonding pads first surface 702 of themold substrate 700, and aredistribution wiring layer 100 covering thefirst surface 702 of themold substrate 700 and including redistribution wirings connected to thewiring bonding pads semiconductor package 2 may further includeouter connection members 800 disposed on theredistribution wiring layer 100. - In some example embodiments, the
first semiconductor chip 200 may include a plurality ofchip pads 202 on a first surface. Thefirst semiconductor chip 200 may be received in themold substrate 700 such that a second surface of thefirst semiconductor chip 200 opposite to the first surface faces theredistribution wiring layer 100. The second surface of thefirst semiconductor chip 200 may be exposed from thefirst surface 702 of themold substrate 700. - The
second semiconductor chip 220 may include a plurality ofchip pads 222 on a first surface. Thesecond semiconductor chip 220 may be received in themold substrate 700 such that the first surface of thesecond semiconductor chip 220 faces theredistribution wiring layer 100. The first surface of thesecond semiconductor chip 222 and thechip pads 222 may be exposed from thefirst surface 702 of themold substrate 700. Thesecond semiconductor chip 220 may have a height from theredistribution wiring layer 100 the same as that of thefirst semiconductor chip 200. - A plurality of the
third semiconductor chips 600 may be disposed on thefirst semiconductor chip 200 and thesecond semiconductor chip 220. Thethird semiconductor chips chip pads third semiconductor chips 600 may be received in themold substrate 700 such that a second surface of thesecond semiconductor chip 600 opposite to the first surface faces theredistribution wiring layer 100. - For example, the
second semiconductor chip 220 may be a logic chip including a logic circuit. Thefirst semiconductor chip 200 and thethird semiconductor chips 600 may be memory chips including memory circuit. The number, the size, the arrangement, etc., of the first to third semiconductor chips may not be limited thereto. - The
wiring bonding pads 300 may be formed in thefirst surface 702 of themold substrate 700 and may be connected to end portions of thebonding wires 400, respectively. Accordingly, thewiring bonding pads 300 may be electrically connected to thechip pads 202 of thefirst semiconductor chip 200, respectively, by thebonding wires 400. - The
wiring bonding pads 310 may be formed in thefirst surface 702 of themold substrate 700 and may be connected to end portions of thebonding wires 410, respectively. Accordingly, thewiring bonding pads 310 may be electrically connected to thechip pads third semiconductor chips 600, respectively, by thebonding wires 410. - The redistribution wirings of the
redistribution wiring layer 100 may make contact with thewiring bonding pads chip pads 222 of the second semiconductor chip exposed from thefirst surface 702 of themold substrate 700. - For example, the
redistribution wiring layer 100 may include afirst insulation layer 110 formed on thefirst surface 702 of themold substrate 700, first openings exposing thewiring bonding pads first redistribution wirings 112 formed on thefirst insulation layer 110 and electrically connected to thechip pads 222 of thesecond semiconductor chip 220. At least portions of thefirst redistribution wirings 112 may directly contact thewiring bonding pads chip pad 222 of thesecond semiconductor chip 220, respectively, through the first openings. - Further, the
redistribution wiring layer 100 may further include second, third, fourth, and fifth insulation layers 120, 130, 140 and 150, and second, third, andfourth redistribution wirings first insulation layer 110. -
Outer connection members 800 may be disposed on at least portions of thefourth redistribution wirings 142. For example, theouter connection member 800 may include a solder ball. - Hereinafter, a method of manufacturing the semiconductor package in
FIG. 20 will be explained. -
FIGS. 21 to 27 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.FIGS. 21, 22, 23, 25, 26 and 27 are cross-sectional views illustrating the method of manufacturing a semiconductor package.FIG. 24 is a plan view ofFIG. 23 . - Referring to
FIG. 21 , a plurality ofrelay bonding pads first semiconductor chip 200 may be arranged on aseparating layer 20 on adummy substrate 10, and then,chip pads 202 of thefirst semiconductor chip 200 may be connected to therelay bonding pads 300, respectively, byconductive connection members 400. Then, asecond semiconductor chip 220 may be arranged adjacent to thefirst semiconductor chip 200 on theseparating layer 20. - In some example embodiments, the
first semiconductor chip 200 may include a plurality of thechip pads 202 on a first surface (e.g., an active surface). Thefirst semiconductor chip 200 may be arranged on thedummy substrate 10 such that a second surface of thefirst semiconductor chip 200 opposite to the first surface faces thedummy substrate 10. - The
conductive connection members 400 may be bonding wires. In such case, therelay bonding pads 300 may be wiring bonding pads. A wiring bonding process may be performed to electrically connect thechip pads 202 of thefirst semiconductor chip 200 and thewiring bonding pads 300 to each other with thebonding wires 400, respectively. Thus, end portions of thebonding wires 400 may be bonded to first surfaces of thewiring bonding pads 300. - In some example embodiments, the
second semiconductor chip 220 may include a plurality of thechip pads 222 on a first surface (e.g., an active surface). Thesecond semiconductor chip 220 may be arranged on thedummy substrate 10 such that the first surface of thesecond semiconductor chip 220 faces thedummy substrate 10. - For example, the
first semiconductor chip 200 may be a memory chip including a memory circuit, and thesecond semiconductor chip 220 may be a logic chip including a logic circuit. The logic chip may be a controller for controlling the memory chip. - Referring to
FIG. 22 , after a plurality ofthird semiconductor chips 600 are stacked on thefirst semiconductor chip 200 and thesecond semiconductor chip 220,chip pads third semiconductor chips 600 may be electrically connected to therelay bonding pads 310, respectively, byconductive connection members 410. Then, amold substrate 700 may be formed on thedummy substrate 10 to cover thefirst semiconductor chip 200, thesecond semiconductor chip 220 and the third semiconductor chips 600. - In some example embodiments, the
third semiconductor chips chip pads third semiconductor chips 600 may be arranged on thedummy substrate 10 such that a second surface of thethird semiconductor chip 600 opposite to the first surface faces thedummy substrate 10. - The
conductive connection members 410 may be bonding wires. In such case, therelay bonding pads 310 may be wiring bonding pads. A wiring bonding process may be performed to electrically connect thechip pads third semiconductor chips 600 and thewiring bonding pads 310 to each other with thebonding wires 410. Thus, end portions of thebonding wires 410 may be bonded to first surfaces of thewiring bonding pads 310. - Referring to
FIGS. 23 and 24 , the structure including themold substrate 700 formed inFIG. 22 may be reversed, and then, thedummy substrate 10 and theseparating layer 20 may be removed from themold substrate 700. - In some example embodiments, the
separating layer 20 may be irradiated with light or may be heated to remove thedummy substrate 10 from themold substrate 700. As thedummy substrate 10 is removed, therelay bonding pads chip pads 222 of thesecond semiconductor chip 220 may be exposed from thefirst surface 702 of themold substrate 700. Further, the second surface of the first semiconductor chip and the first surface of thesecond semiconductor chip 220 may be exposed from thefirst surface 702 of themold substrate 700. - Referring to
FIG. 25 , afirst insulation layer 110 havingfirst openings 111, which expose thewiring bonding pads chip pads 222 of thesecond semiconductor chip 220, respectively may be formed on thefirst surface 702 of themold substrate 700. - In some example embodiments, after the
first insulation layer 110 is formed to cover thefirst surface 702 of themold substrate 700, the second surface of thefirst semiconductor chip 200, the first surface of thesecond semiconductor chip 220, thewiring bonding pads chip pads 222 of thesecond semiconductor chip 220, thefirst insulation layer 110 may be patterned to form thefirst openings 111 to expose thewiring bonding pads chip pads 222 of thesecond semiconductor chip 220, respectively. - For example, the
first insulation layer 110 may include polymer, a dielectric material, etc. Thefirst insulation layer 110 may be formed by a vapor deposition process, a spin coating process, etc. - Referring to
FIG. 26 ,first redistribution wirings 112 may be formed on thefirst insulation layer 110 to make contact with thewiring bonding pads chip pads 222 of thesecond semiconductor chip 220 through thefirst openings 111, respectively. - In some example embodiments, the
first redistribution wirings 112 may be formed on a portion of thefirst insulation layer 110, thewiring bonding pads chip pads 222 of thesecond semiconductor chip 220. Thefirst redistribution wirings 112 may be formed by forming a seed layer on at least a portion of thefirst insulation layer 110 and on thefirst openings 111, pattering the seed layer, and performing an electroplating process. - Accordingly, the
first redistribution wirings 112 may make contact with thewiring bonding pads chip pads 222 of thesecond semiconductor chip 220 through thefirst openings 111, respectively. - Referring to
FIG. 27 , processes the same as or substantially similar to the processes described with reference toFIGS. 25 and 26 may be repeatedly performed to form aredistribution wiring layer 100 on thefirst surface 702 of themold substrate 700, and then,outer connection members 800 may be formed on theredistribution wiring layer 100. - In some example embodiments, the
redistribution wiring layer 100 including redistribution wirings, which are electrically connected to thewiring bonding pads chip pads 222 of thesecond semiconductor chip 220, respectively, may be formed on thefirst surface 702 of themold substrate 700. Thus, theredistribution wiring layer 100 may be formed to include fan out type solder ball landing pads which are formed on themold substrate 700, and correspond to each die of a wafer by performing semiconductor manufacturing processes. - Then, the
outer connection members 800 may be formed on theredistribution wiring layer 100 to be electrically connected to the redistribution wirings. - Then, a sawing process may be performed to divide the
mold substrate 700 individually to complete a fan out wafer level package including themold substrate 700 having thewiring bonding pads redistribution wiring layer 100 on themold substrate 700. -
FIG. 28 is a cross-sectional view illustrating a semiconductor package in accordance with an example embodiment. The semiconductor package may be substantially the same as or substantially similar to the semiconductor package as described with reference toFIG. 1 , except for an addition of a semiconductor chip mounted in a flip chip bonding manner. Thus, same reference numerals will be used to refer to the same or like elements and any further repetitive explanation concerning the above elements will be omitted. - Referring to
FIG. 28 , asemiconductor package 3 may include amold substrate 700, afirst semiconductor chip 240 and a plurality ofsecond semiconductor chips 600 disposed in themold substrate 700,wiring bonding pads 310 formed in afirst surface 702 of themold substrate 700, bumpbonding pads 320 in thefirst surface 702 of themold substrate 700, and aredistribution wiring layer 100 covering thefirst surface 702 of themold substrate 700 and including redistribution wirings connected to thewiring bonding pads 310. Thesemiconductor package 3 may further include asupport member 500 disposed in theredistribution wiring layer 100. Thesemiconductor package 3 may further includeouter connection members 800 disposed on theredistribution wiring layer 100. - In some example embodiments, the
first semiconductor chip 240 may include a plurality ofchip pads 242 on a first surface. Thefirst semiconductor chip 240 may be received in themold substrate 700 such that the first surface of thefirst semiconductor chip 240 faces theredistribution wiring layer 100. Thefirst semiconductor chip 240 may mounted in a flip chip bonding manner in themold substrate 700.Conductive bumps 420 may be disposed on thechip pads 242, and theconductive bumps 420 may be disposed on thebump bonding pads 320. Thebump bonding pads 320 may be exposed from thefirst surface 702 of themold substrate 700. - The
support member 500 may function to support a plurality of the second semiconductor chips 600. Thesupport member 500 may have a height from theredistribution wiring layer 100 the same as that of thefirst semiconductor chip 240. - A plurality of the
second semiconductor chips 600 may be disposed on thefirst semiconductor chip 240 and thesupport member 500. Thesecond semiconductor chips chip pads second semiconductor chips 600 may be received in themold substrate 700 such that respective second surfaces of thesecond semiconductor chips redistribution wiring layer 100. - For example, the
first semiconductor chip 240 may be a logic chip including a logic circuit, and thesecond semiconductor chips 600 may be a memory chip including a memory circuit. The logic chip may be a controller for controlling the memory chip. The number, the size, the arrangement, etc., of the first and second semiconductor chips may not be limited thereto. - The
wiring bonding pads 310 may be formed in thefirst surface 702 of themold substrate 700 and may be connected to end portions ofbonding wires 410. Accordingly, thewiring bonding pads 310 may be electrically connected to the chip pads of thesecond semiconductor chips 600 by thebonding wires 410. - For example, first surfaces of the
wiring bonding pads 310 may be connected to end portions of thebonding wires 410, respectively, and second surfaces of thewiring bonding pads 310 opposite to the corresponding first surfaces may be exposed from thefirst surface 702 of themold surface 700 and may be connected to the redistribution wiring. The second surfaces of thewiring bonding pads 310 may be coplanar with thefirst surface 702 of themold substrate 700. - The
bump bonding pads 320 may be formed in thefirst surface 702 of themold substrate 700 and may be connected to theconductive bumps 420, respectively. Accordingly, thebump bonding pads 320 may be electrically connected to thechip pads 242 of thefirst semiconductor chip 240 by theconductive bumps 420. - The redistribution wirings of the
redistribution wiring layer 100 may make contact with thewiring bonding pads 310 and thebump bonding pads 320 exposed from thefirst surface 702 of themold substrate 700. - For example, the
redistribution wiring layer 100 may include afirst insulation layer 110 formed on thefirst surface 702 of themold substrate 700, first openings exposing thewiring bonding pads 310 and thebump bonding pads 320, andfirst redistribution wirings 112 formed on thefirst insulation layer 110. At least portions of thefirst redistribution wirings 112 may directly contact thewiring bonding pads 310 or thebump bonding pads 320 through the first openings. Thefirst redistribution wiring 112 may make contact with the second surfaces of thewiring bonding pads 310, the first surface of thewiring bonding pad 310 may be covered by themold substrate 700, and side surfaces of thewiring bonding pad 310 may be covered by thefirst insulation layer 110. - Further, the
redistribution wiring layer 100 may further include second, third, fourth and fifth insulation layers 120, 130, 140 and 150 and second, third andfourth redistribution wirings first insulation layer 110. -
Outer connection members 800 may be disposed on portions of thefourth redistribution wirings 142. For example, theouter connection member 800 may include a solder ball. - Hereinafter, a method of manufacturing the semiconductor package in
FIG. 28 will be explained. -
FIGS. 29 to 37 are views illustrating a method of manufacturing a semiconductor package in accordance with an example embodiment.FIGS. 29, 31, 32, 33, 34, 35, 36 and 37 are cross-sectional views illustrating the method of manufacturing a semiconductor package.FIG. 30 is a plan view ofFIG. 29 . - Referring to
FIGS. 29 and 30 , after ametal layer 50 is formed on adummy substrate 10, a plurality ofrelay bonding pads metal layer 50. - In some example embodiments, the
metal layer 50 may be formed by, for example, a plating process, a deposition process and a patterning process, and then may be adhered on thedummy substrate 10. Themetal layer 50 may haveprotrusions metal layer 50 may include a single metal layer or a plurality of metal layers. For example, themetal layer 50 may include a metal (e.g., gold (Au), copper (Cu), or aluminum (Al)), or a metal alloy (e.g., nickel/gold (Ni/Au) or tin/copper (Sn/Cu)). Aninsulation layer 60 may be formed on themetal layer 60, and may have openings exposing theprotrusions insulation layer 60 may include an insulating material (e.g., polymer tape or solder resist). - Then, the
relay bonding pads protrusions relay bonding pads metal layer 50. For example, when themetal layer 50 may include copper (Cu), therelay bonding pads - The
relay bonding pads 320 may be bump bonding pads. Therelay bonding pads 320 may be metal bonding parts to be bonded to conductive bumps for electrical connection to a first semiconductor chip which will be stacked later. Therelay bonding pads 310 may be wiring bonding pads. Therelay bonding pad 310 may be metal bonding parts to be bonded to bonding wires for electrical connection to second semiconductor chips which will be stacked later. - Alternatively, the step of forming the
insulation layer 60 may be omitted, and the relay bonding pads may be formed on themetal layer 50 in desired (or alternatively, predetermined) positions. - Referring to
FIG. 31 , after afirst semiconductor chip 240 is disposed on themetal layer 50 on thedummy substrate 10,chip pads 242 of thefirst semiconductor chip 240 may be connected to therelay bonding pads 320 byconductive connection members 420. Then, asupport member 500 may be disposed adjacent to thefirst semiconductor chip 240 on themetal layer 50 on thedummy substrate 10. - In some example embodiments, the
first semiconductor chip 240 may include a plurality of thechip pads 242 on a first surface. Thefirst semiconductor chip 240 may be arranged on thedummy substrate 10 such that the first surface of thefirst semiconductor chip 240 faces thedummy substrate 10. For example, thefirst semiconductor chip 240 may be mounted on themetal layer 50 in a flip chip bonding manner. - The
conductive connection members 420 may be conductive bumps. In such case, therelay bonding pads 320 may be bump bonding pads. After theconductive bumps 420 are formed on thechip pads 242 on the first surface of thefirst semiconductor chip 240, thefirst semiconductor chip 240 may be mounted on thedummy substrate 10 via the conductive bumps 420. Theconductive bumps 420 may be disposed on thebump bonding pads 320, respectively. Then, theconductive bumps 420 may be adhered to thebump bonding pads 320 by a reflow process to mount thefirst semiconductor chip 240 on thedummy substrate 10. - The
support member 500 may be stacked on theinsulation layer 60 by anadhesive layer 510. Alternatively, another semiconductor chip may be disposed instead of thesupport member 500. - Referring to
FIG. 32 , after a plurality ofsecond semiconductor chips 600 is stacked on thefirst semiconductor chip 240 and thesupport member 500,chip pads second semiconductor chip 600 may be electrically connected to therelay bonding pads 310 byconductive connection members 410. Then, amold substrate 700 may be formed on thedummy substrate 10 to cover thefirst semiconductor chip 240 and the second semiconductor chips 600. - In some example embodiments, the
second semiconductor chips chip pads second semiconductor chips dummy substrate 10 such that second surfaces of thesecond semiconductor chip 600 opposite to the corresponding first surfaces face thedummy substrate 10. - A plurality of the
second semiconductor chips adhesive layers 610. Thesecond semiconductor chips - The
conductive connection members 410 may be bonding wires. In such case, therelay bonding pads 310 may be wiring bonding pads. A wiring bonding process may be performed to electrically connect the chip pads of thesecond semiconductor chips 600 and thewiring bonding pads 310 to each other with thebonding wires 410. Thus, end portions of the bonding wires may be bonded to first surfaces of thewiring bonding pads 310, respectively. - Then, a molded underfill (MUF) process may be performed to mold a molding member on the
insulation layer 60, to form themold substrate 700 covering thefirst semiconductor chip 240, thesupport member 500 and the second semiconductor chips 600. For example, themold substrate 700 may include an epoxy molding compound. - Referring to
FIGS. 33 and 34 , the structure including themold substrate 700 formed therein inFIG. 32 may be reversed, and then, thedummy substrate 10, themetal layer 50 and theinsulation layer 60 may be removed from themold substrate 700. - For example, after the
dummy substrate 10 is removed, a selective etch process may be performed to remove themetal layer 50 and theinsulation layer 60. - Thus, the
relay bonding pads 310 and thebump bonding pads 320 may be exposed from thefirst surface 702 of themold substrate 700. - Referring to
FIG. 35 , afirst insulation layer 110 havingfirst openings 111, which expose thewiring bonding pads 310 and the bump bonding pads, respectively, may be formed on thefirst surface 702 of themold substrate 700. - In some example embodiments, after the
first insulation layer 111 is formed to cover thefirst surface 702 of themold substrate 700, thewiring bonding pads 310 and thebump bonding pads 320, the first insulation layer may be patterned to form thefirst openings 111 to expose thewiring bonding pads 310 and thebump bonding pads 320, respectively. - For example, the
first insulation layer 110 may include polymer, a dielectric material, etc. Thefirst insulation layer 110 may be formed by a vapor deposition process, a spin coating process, etc. - Referring to
FIG. 36 ,first redistribution wirings 112 may be formed on thefirst insulation layer 110 to make contact with thewiring bonding pads 310 and thebump bonding pads 320 through thefirst openings 111, respectively. - In some example embodiments, the
first redistribution wirings 112 may be formed on portions of thefirst insulation layer 110, thewiring bonding pads 310, and thebump bonding pads 320. Thefirst redistribution wirings 112 may be formed by forming a seed layer on the portions of thefirst insulation layer 110 and on thefirst openings 111, pattering the seed layer, and performing an electroplating process. - Accordingly, at least portions of the
first redistribution wirings 112 may make contact with thewiring bonding pads 310 or thebump bonding pads 320 through the first openings. - Referring to
FIG. 37 , processes the same as or substantially similar to the processes described with reference toFIGS. 35 and 36 may be performed to form aredistribution wiring layer 100 on thefirst surface 702 of themold substrate 700, and then,outer connection members 800 may be formed on theredistribution wiring layer 100. - In some example embodiments, the
redistribution wiring layer 100, which includes redistribution wirings electrically connected to thewiring bonding pads 310 or thebump bonding pads 320, may be formed on thefirst surface 702 of themold substrate 700. Thus, theredistribution wiring layer 100 may be formed to include fan out type solder ball landing pads, which are formed on themold substrate 700, and correspond to each die of a wafer by performing semiconductor manufacturing processes. - Then, the
outer connection members 800 may be formed on theredistribution wiring layer 100 to be electrically connected to the redistribution wirings. - Then, a sawing process may be performed to divide the
mold substrate 700 individually to complete a fan out wafer level package including themold substrate 700 having therelay bonding pads redistribution wiring layer 100 on themold substrate 700. - The aforementioned methods of manufacturing the semiconductor package may be applied to manufacture semiconductor packages including logic devices and memory devices. For example, the semiconductor package may include logic devices (e.g., central processing units (CPUs), main processing units (MPUs), or application processors (APs)), and volatile memory devices (e.g., DRAM devices or SRAM devices), or non-volatile memory devices (e.g., flash memory devices, PRAM devices, MRAM devices, or ReRAM devices).
- The foregoing example embodiments are illustrative and are not to intended to be construed as limiting thereof. Although a few example embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible in example embodiments without materially departing from the novel teachings and advantages of the present inventive concepts. Accordingly, all such modifications are intended to be included within the scope of example embodiments as defined in the claims.
Claims (20)
1. A semiconductor package, comprising:
a mold substrate;
a first semiconductor chip, a support member and a plurality of second semiconductor chips in the mold substrate, the first semiconductor chip including first chips pads, the second semiconductor chip including second chip pads;
wiring bonding pads at a first surface of the mold substrate, the wiring bonding pads connected to the first chip pads and the second chip pads by bonding wires, at least a portion of each of the wiring bonding pads embedded within the mold substrate; and
a redistribution wiring layer covering the first surface of the mold substrate, the redistribution wiring layer including redistribution wirings, the redistribution wirings connected to the wiring bonding pads,
wherein at least a portion of the first semiconductor chip and at least a portion of the support member are exposed from the first surface of the mold substrate such that the at least a portion of the first semiconductor chip and the at least a portion of the support member are in contact with the redistribution wiring layer, and
wherein the plurality of second semiconductor chips are stacked on the first semiconductor chip and the support member in the mold substrate.
2. The semiconductor package of claim 1 , wherein a thickness of the first semiconductor chip is the same as a thickness of the support member.
3. The semiconductor package of claim 1 , wherein the second semiconductor chips are mounted on the first semiconductor chip and the support member using an adhesive film that is in contact with the first semiconductor chip and the support member.
4. The semiconductor package of claim 1 , wherein the first semiconductor chip and the support member are arranged on the redistribution wiring layer to be spaced apart from each other.
5. The semiconductor package of claim 1 , wherein the redistribution wiring layer comprises a first insulation layer, which is on the first surface of the mold substrate and includes openings exposing the wiring bonding pads.
6. The semiconductor package of claim 1 , wherein the first chip pads are on a third surface of the first semiconductor chip and a fourth surface of the first semiconductor chip opposite to the first surface is in contact with the redistribution wiring layer.
7. The semiconductor package of claim 6 , wherein the fourth surface of the first semiconductor chip is exposed from the first surface of the mold substrate.
8. The semiconductor package of claim 6 , wherein a fifth surface of the support member is in contact with the redistribution wiring layer and the fifth surface of the support member is exposed from the first surface of the mold substrate.
9. The semiconductor package of claim 8 , wherein the fourth surface of the first semiconductor chip and the fifth surface of the support member are coplanar with the redistribution wiring layer.
10. The semiconductor package of claim 1 , wherein a seventh surface of each of the wiring bonding pads is exposed from the first surface of the mold substrate, and each of the bonding wires is bonded to an eighth surface of each of the wiring bonding pads opposite to the seventh surface.
11. A semiconductor package, comprising:
a redistribution wiring layer including redistribution wirings and fan out type landing pads connected to the redistribution wirings, the redistribution wiring layer having a first surface and a second surface that are opposite to each other;
a first semiconductor chip on the first surface of the redistribution wiring layer, the first semiconductor chip including a third surface having first chip pads thereon and a fourth surface facing the redistribution wiring layer and opposite to the third surface;
a support member on the first surface of the redistribution wiring layer to be spaced apart from the first semiconductor chip;
a plurality of second semiconductor chips stacked on the first semiconductor chip and the support member;
wiring bonding pads at the first surface of the redistribution wiring layer such that a fifth surface of each of the wiring bonding pads is above the redistribution wiring layer, and a sixth surface of each of the wiring bonding pads opposite to the fifth surface is coplanar with the first surface of the redistribution wiring layer, the wiring bonding pads connected to corresponding ones of the redistribution wirings;
bonding wires connecting the first chip pads with the wiring boding pads such that the first chip pads are connected to corresponding ones of the fan out type landing pads on the second surface of the redistribution wiring layer; and
a mold substrate on the redistribution wiring layer, the mold substrate covering the first semiconductor chip, the support member, the second semiconductor chips, the wiring bonding pads and the bonding wires such that at least a portion of the first semiconductor chip and at least a portion of the support member are exposed from a seventh surface of the mold substrate that faces the first surface of the redistribution wiring layer.
12. The semiconductor package of claim 11 , wherein the at least a portion of the first semiconductor chip and the at least a portion of the support member are in contact with the first surface of the redistribution wiring layer.
13. The semiconductor package of claim 11 , wherein the wiring bonding pads are on the first surface of the redistribution wiring layer.
14. The semiconductor package of claim 11 , wherein a thickness of the first semiconductor chip is the same as a thickness of the support member.
15. The semiconductor package of claim 11 , wherein the second semiconductor chips are mounted on the first semiconductor chip and the support member using an adhesive film that is in contact with the first semiconductor chip and the support member.
16. The semiconductor package of claim 11 , wherein the first semiconductor chip and the support member are arranged on the redistribution wiring layer to be spaced apart from each other.
17. The semiconductor package of claim 11 , wherein the redistribution wiring layer comprises a first insulation layer, which is on the seventh surface of the mold substrate and includes openings exposing the wiring bonding pads.
18. The semiconductor package of claim 11 , wherein the fourth surface of the first semiconductor chip is in contact with the first surface of the redistribution wiring layer.
19. The semiconductor package of claim 18 , wherein the fourth surface of the first semiconductor chip is exposed from the seventh surface of the mold substrate.
20. The semiconductor package of claim 19 , wherein a ninth surface of the support member is in contact with the first surface of the redistribution wiring layer and the ninth surface of the support member is exposed from the seventh surface of the mold substrate.
Priority Applications (2)
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---|---|---|---|
US16/709,001 US20200118993A1 (en) | 2016-11-02 | 2019-12-10 | Semiconductor package and method of manufacturing the semiconductor package |
US17/376,865 US11901348B2 (en) | 2016-11-02 | 2021-07-15 | Semiconductor package and method of manufacturing the semiconductor package |
Applications Claiming Priority (4)
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KR10-2016-0145316 | 2016-11-02 | ||
KR1020160145316A KR102591618B1 (en) | 2016-11-02 | 2016-11-02 | Semiconductor package and method of manufacturing the semiconductor package |
US15/791,831 US20180122789A1 (en) | 2016-11-02 | 2017-10-24 | Semiconductor package and method of manufacturing the semiconductor package |
US16/709,001 US20200118993A1 (en) | 2016-11-02 | 2019-12-10 | Semiconductor package and method of manufacturing the semiconductor package |
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US15/791,831 Continuation US20180122789A1 (en) | 2016-11-02 | 2017-10-24 | Semiconductor package and method of manufacturing the semiconductor package |
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US17/376,865 Continuation US11901348B2 (en) | 2016-11-02 | 2021-07-15 | Semiconductor package and method of manufacturing the semiconductor package |
Publications (1)
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US20200118993A1 true US20200118993A1 (en) | 2020-04-16 |
Family
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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US15/791,831 Abandoned US20180122789A1 (en) | 2016-11-02 | 2017-10-24 | Semiconductor package and method of manufacturing the semiconductor package |
US16/709,001 Abandoned US20200118993A1 (en) | 2016-11-02 | 2019-12-10 | Semiconductor package and method of manufacturing the semiconductor package |
US17/376,865 Active 2038-10-02 US11901348B2 (en) | 2016-11-02 | 2021-07-15 | Semiconductor package and method of manufacturing the semiconductor package |
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US15/791,831 Abandoned US20180122789A1 (en) | 2016-11-02 | 2017-10-24 | Semiconductor package and method of manufacturing the semiconductor package |
Family Applications After (1)
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US17/376,865 Active 2038-10-02 US11901348B2 (en) | 2016-11-02 | 2021-07-15 | Semiconductor package and method of manufacturing the semiconductor package |
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US (3) | US20180122789A1 (en) |
KR (1) | KR102591618B1 (en) |
CN (1) | CN108010886B (en) |
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US11631660B2 (en) | 2020-08-24 | 2023-04-18 | Samsung Electronics Co., Ltd. | Semiconductor package |
EP4270456A3 (en) * | 2022-04-25 | 2024-02-07 | Nxp B.V. | Semiconductor packages with wiring on re-distributed bumps |
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KR102438456B1 (en) * | 2018-02-20 | 2022-08-31 | 삼성전자주식회사 | Semiconductor package and method of manufacturing the semiconductor package |
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-
2016
- 2016-11-02 KR KR1020160145316A patent/KR102591618B1/en active IP Right Grant
-
2017
- 2017-10-24 US US15/791,831 patent/US20180122789A1/en not_active Abandoned
- 2017-11-02 CN CN201711062541.7A patent/CN108010886B/en active Active
-
2019
- 2019-12-10 US US16/709,001 patent/US20200118993A1/en not_active Abandoned
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2021
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US11631660B2 (en) | 2020-08-24 | 2023-04-18 | Samsung Electronics Co., Ltd. | Semiconductor package |
TWI780598B (en) * | 2020-08-28 | 2022-10-11 | 日商鎧俠股份有限公司 | semiconductor device |
EP4270456A3 (en) * | 2022-04-25 | 2024-02-07 | Nxp B.V. | Semiconductor packages with wiring on re-distributed bumps |
Also Published As
Publication number | Publication date |
---|---|
CN108010886A (en) | 2018-05-08 |
KR102591618B1 (en) | 2023-10-19 |
US20210343691A1 (en) | 2021-11-04 |
KR20180048128A (en) | 2018-05-10 |
US11901348B2 (en) | 2024-02-13 |
CN108010886B (en) | 2023-03-28 |
US20180122789A1 (en) | 2018-05-03 |
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