US20200075884A1 - Display panel capable of preventing a defect in light emission of an organic light emitting element - Google Patents
Display panel capable of preventing a defect in light emission of an organic light emitting element Download PDFInfo
- Publication number
- US20200075884A1 US20200075884A1 US16/593,060 US201916593060A US2020075884A1 US 20200075884 A1 US20200075884 A1 US 20200075884A1 US 201916593060 A US201916593060 A US 201916593060A US 2020075884 A1 US2020075884 A1 US 2020075884A1
- Authority
- US
- United States
- Prior art keywords
- electrode
- light emitting
- layer
- insulating layer
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007547 defect Effects 0.000 title description 3
- 239000010409 thin film Substances 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 description 314
- 239000000463 material Substances 0.000 description 40
- 101000685663 Homo sapiens Sodium/nucleoside cotransporter 1 Proteins 0.000 description 34
- 102100023116 Sodium/nucleoside cotransporter 1 Human genes 0.000 description 34
- 238000000034 method Methods 0.000 description 30
- 238000002347 injection Methods 0.000 description 22
- 239000007924 injection Substances 0.000 description 22
- 239000003086 colorant Substances 0.000 description 14
- 102100027094 Echinoderm microtubule-associated protein-like 1 Human genes 0.000 description 13
- 102100027126 Echinoderm microtubule-associated protein-like 2 Human genes 0.000 description 13
- 101001057941 Homo sapiens Echinoderm microtubule-associated protein-like 1 Proteins 0.000 description 13
- 101001057942 Homo sapiens Echinoderm microtubule-associated protein-like 2 Proteins 0.000 description 13
- 101000821827 Homo sapiens Sodium/nucleoside cotransporter 2 Proteins 0.000 description 13
- 102100021541 Sodium/nucleoside cotransporter 2 Human genes 0.000 description 13
- 230000005525 hole transport Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- -1 poly(p-phenylene vinylene) Polymers 0.000 description 12
- 101100225046 Schizosaccharomyces pombe (strain 972 / ATCC 24843) ecl2 gene Proteins 0.000 description 11
- 101150058725 ecl1 gene Proteins 0.000 description 10
- 239000002585 base Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000007983 Tris buffer Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 101150100424 SPX4 gene Proteins 0.000 description 6
- 101100207507 Streptomyces coelicolor (strain ATCC BAA-471 / A3(2) / M145) tri2 gene Proteins 0.000 description 6
- 101150066742 TRI1 gene Proteins 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 6
- 229920000767 polyaniline Polymers 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- 101150056821 spx1 gene Proteins 0.000 description 6
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910052741 iridium Inorganic materials 0.000 description 4
- IMKMFBIYHXBKRX-UHFFFAOYSA-M lithium;quinoline-2-carboxylate Chemical compound [Li+].C1=CC=CC2=NC(C(=O)[O-])=CC=C21 IMKMFBIYHXBKRX-UHFFFAOYSA-M 0.000 description 4
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 3
- AWXGSYPUMWKTBR-UHFFFAOYSA-N 4-carbazol-9-yl-n,n-bis(4-carbazol-9-ylphenyl)aniline Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(N(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 AWXGSYPUMWKTBR-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 3
- 238000007648 laser printing Methods 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 125000002524 organometallic group Chemical group 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000001931 thermography Methods 0.000 description 3
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- VBQVHWHWZOUENI-UHFFFAOYSA-N 1-phenyl-2H-quinoline Chemical compound C1C=CC2=CC=CC=C2N1C1=CC=CC=C1 VBQVHWHWZOUENI-UHFFFAOYSA-N 0.000 description 2
- GEQBRULPNIVQPP-UHFFFAOYSA-N 2-[3,5-bis(1-phenylbenzimidazol-2-yl)phenyl]-1-phenylbenzimidazole Chemical compound C1=CC=CC=C1N1C2=CC=CC=C2N=C1C1=CC(C=2N(C3=CC=CC=C3N=2)C=2C=CC=CC=2)=CC(C=2N(C3=CC=CC=C3N=2)C=2C=CC=CC=2)=C1 GEQBRULPNIVQPP-UHFFFAOYSA-N 0.000 description 2
- HNWFFTUWRIGBNM-UHFFFAOYSA-N 2-methyl-9,10-dinaphthalen-2-ylanthracene Chemical compound C1=CC=CC2=CC(C3=C4C=CC=CC4=C(C=4C=C5C=CC=CC5=CC=4)C4=CC=C(C=C43)C)=CC=C21 HNWFFTUWRIGBNM-UHFFFAOYSA-N 0.000 description 2
- OBAJPWYDYFEBTF-UHFFFAOYSA-N 2-tert-butyl-9,10-dinaphthalen-2-ylanthracene Chemical compound C1=CC=CC2=CC(C3=C4C=CC=CC4=C(C=4C=C5C=CC=CC5=CC=4)C4=CC=C(C=C43)C(C)(C)C)=CC=C21 OBAJPWYDYFEBTF-UHFFFAOYSA-N 0.000 description 2
- ZVFQEOPUXVPSLB-UHFFFAOYSA-N 3-(4-tert-butylphenyl)-4-phenyl-5-(4-phenylphenyl)-1,2,4-triazole Chemical compound C1=CC(C(C)(C)C)=CC=C1C(N1C=2C=CC=CC=2)=NN=C1C1=CC=C(C=2C=CC=CC=2)C=C1 ZVFQEOPUXVPSLB-UHFFFAOYSA-N 0.000 description 2
- ZOKIJILZFXPFTO-UHFFFAOYSA-N 4-methyl-n-[4-[1-[4-(4-methyl-n-(4-methylphenyl)anilino)phenyl]cyclohexyl]phenyl]-n-(4-methylphenyl)aniline Chemical compound C1=CC(C)=CC=C1N(C=1C=CC(=CC=1)C1(CCCCC1)C=1C=CC(=CC=1)N(C=1C=CC(C)=CC=1)C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 ZOKIJILZFXPFTO-UHFFFAOYSA-N 0.000 description 2
- AOQKGYRILLEVJV-UHFFFAOYSA-N 4-naphthalen-1-yl-3,5-diphenyl-1,2,4-triazole Chemical compound C1=CC=CC=C1C(N1C=2C3=CC=CC=C3C=CC=2)=NN=C1C1=CC=CC=C1 AOQKGYRILLEVJV-UHFFFAOYSA-N 0.000 description 2
- VIZUPBYFLORCRA-UHFFFAOYSA-N 9,10-dinaphthalen-2-ylanthracene Chemical compound C12=CC=CC=C2C(C2=CC3=CC=CC=C3C=C2)=C(C=CC=C2)C2=C1C1=CC=C(C=CC=C2)C2=C1 VIZUPBYFLORCRA-UHFFFAOYSA-N 0.000 description 2
- VFUDMQLBKNMONU-UHFFFAOYSA-N 9-[4-(4-carbazol-9-ylphenyl)phenyl]carbazole Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 VFUDMQLBKNMONU-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- 101000837344 Homo sapiens T-cell leukemia translocation-altered gene protein Proteins 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 101150036141 SPX3 gene Proteins 0.000 description 2
- 101150081544 Slc37a3 gene Proteins 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 102100038952 Sugar phosphate exchanger 3 Human genes 0.000 description 2
- 102100028692 T-cell leukemia translocation-altered gene protein Human genes 0.000 description 2
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- UFVXQDWNSAGPHN-UHFFFAOYSA-K bis[(2-methylquinolin-8-yl)oxy]-(4-phenylphenoxy)alumane Chemical compound [Al+3].C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC([O-])=CC=C1C1=CC=CC=C1 UFVXQDWNSAGPHN-UHFFFAOYSA-K 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- UEEXRMUCXBPYOV-UHFFFAOYSA-N iridium;2-phenylpyridine Chemical compound [Ir].C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1 UEEXRMUCXBPYOV-UHFFFAOYSA-N 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Inorganic materials [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 2
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- FGDZQCVHDSGLHJ-UHFFFAOYSA-M rubidium chloride Chemical compound [Cl-].[Rb+] FGDZQCVHDSGLHJ-UHFFFAOYSA-M 0.000 description 2
- 101150091285 spx2 gene Proteins 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 2
- MIOPJNTWMNEORI-GMSGAONNSA-N (S)-camphorsulfonic acid Chemical compound C1C[C@@]2(CS(O)(=O)=O)C(=O)C[C@@H]1C2(C)C MIOPJNTWMNEORI-GMSGAONNSA-N 0.000 description 1
- NGQSLSMAEVWNPU-YTEMWHBBSA-N 1,2-bis[(e)-2-phenylethenyl]benzene Chemical compound C=1C=CC=CC=1/C=C/C1=CC=CC=C1\C=C\C1=CC=CC=C1 NGQSLSMAEVWNPU-YTEMWHBBSA-N 0.000 description 1
- IYZMXHQDXZKNCY-UHFFFAOYSA-N 1-n,1-n-diphenyl-4-n,4-n-bis[4-(n-phenylanilino)phenyl]benzene-1,4-diamine Chemical compound C1=CC=CC=C1N(C=1C=CC(=CC=1)N(C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=CC=CC=1)C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 IYZMXHQDXZKNCY-UHFFFAOYSA-N 0.000 description 1
- SPDPTFAJSFKAMT-UHFFFAOYSA-N 1-n-[4-[4-(n-[4-(3-methyl-n-(3-methylphenyl)anilino)phenyl]anilino)phenyl]phenyl]-4-n,4-n-bis(3-methylphenyl)-1-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=C(C)C=CC=2)C=2C=C(C)C=CC=2)C=2C=C(C)C=CC=2)=C1 SPDPTFAJSFKAMT-UHFFFAOYSA-N 0.000 description 1
- LPCWDYWZIWDTCV-UHFFFAOYSA-N 1-phenylisoquinoline Chemical compound C1=CC=CC=C1C1=NC=CC2=CC=CC=C12 LPCWDYWZIWDTCV-UHFFFAOYSA-N 0.000 description 1
- VFMUXPQZKOKPOF-UHFFFAOYSA-N 2,3,7,8,12,13,17,18-octaethyl-21,23-dihydroporphyrin platinum Chemical compound [Pt].CCc1c(CC)c2cc3[nH]c(cc4nc(cc5[nH]c(cc1n2)c(CC)c5CC)c(CC)c4CC)c(CC)c3CC VFMUXPQZKOKPOF-UHFFFAOYSA-N 0.000 description 1
- STTGYIUESPWXOW-UHFFFAOYSA-N 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline Chemical compound C=12C=CC3=C(C=4C=CC=CC=4)C=C(C)N=C3C2=NC(C)=CC=1C1=CC=CC=C1 STTGYIUESPWXOW-UHFFFAOYSA-N 0.000 description 1
- DHDHJYNTEFLIHY-UHFFFAOYSA-N 4,7-diphenyl-1,10-phenanthroline Chemical compound C1=CC=CC=C1C1=CC=NC2=C1C=CC1=C(C=3C=CC=CC=3)C=CN=C21 DHDHJYNTEFLIHY-UHFFFAOYSA-N 0.000 description 1
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 1
- QYNTUCBQEHUHCS-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n-[4-[4-(n-[4-(n-(3-methylphenyl)anilino)phenyl]anilino)phenyl]phenyl]-1-n,4-n-diphenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 QYNTUCBQEHUHCS-UHFFFAOYSA-N 0.000 description 1
- LTUJKAYZIMMJEP-UHFFFAOYSA-N 9-[4-(4-carbazol-9-yl-2-methylphenyl)-3-methylphenyl]carbazole Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(C=2C(=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C)C(C)=C1 LTUJKAYZIMMJEP-UHFFFAOYSA-N 0.000 description 1
- VIJYEGDOKCKUOL-UHFFFAOYSA-N 9-phenylcarbazole Chemical compound C1=CC=CC=C1N1C2=CC=CC=C2C2=CC=CC=C21 VIJYEGDOKCKUOL-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- KESRRRLHHXXBRW-UHFFFAOYSA-N C1=CC=NC2=C3C(O)=CC=CC3=CC=C21 Chemical compound C1=CC=NC2=C3C(O)=CC=CC3=CC=C21 KESRRRLHHXXBRW-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N Phenanthrene Natural products C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- LPTWEDZIPSKWDG-UHFFFAOYSA-N benzenesulfonic acid;dodecane Chemical compound OS(=O)(=O)C1=CC=CC=C1.CCCCCCCCCCCC LPTWEDZIPSKWDG-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- XZCJVWCMJYNSQO-UHFFFAOYSA-N butyl pbd Chemical compound C1=CC(C(C)(C)C)=CC=C1C1=NN=C(C=2C=CC(=CC=2)C=2C=CC=CC=2)O1 XZCJVWCMJYNSQO-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Inorganic materials [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000009918 complex formation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/32—Stacked devices having two or more layers, each emitting at different wavelengths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H01L51/5228—
-
- H01L27/3209—
-
- H01L27/3246—
-
- H01L51/0096—
-
- H01L51/5044—
-
- H01L51/5206—
-
- H01L51/56—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
- H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
- H10K50/131—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit with spacer layers between the electroluminescent layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H01L2251/301—
-
- H01L2251/5392—
-
- H01L2251/558—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/341—Short-circuit prevention
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present disclosure relates to a display panel and a method of manufacturing the same. More particularly, the present disclosure relates to a display panel capable of preventing a defect in light emission of an organic light emitting element from occurring due to a lateral leakage current, a method of manufacturing the display panel, and a display device having the display panel.
- An organic light emitting device is a self-emissive device and has advantages of a wide viewing angle and a superior contrast ratio.
- the organic light emitting device has a fast response speed, a high brightness, and a low driving voltage.
- the organic light emitting device includes an anode, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode.
- the hole transport layer, the light emitting layer, the electron transport layer, and the cathode are sequentially stacked on the anode.
- the hole transport layer, the light emitting layer, and the electron transport layer are organic thin layers, each including an organic compound.
- Embodiments provide a display panel including a base substrate, an auxiliary electrode disposed on the base substrate, a first electrode spaced apart from the auxiliary electrode when viewed in a plan view, a first light emitting unit disposed on the auxiliary electrode and the first electrode, an conductive thin film layer disposed on the first light emitting unit, a second light emitting unit disposed on the conductive thin film layer, a insulating layer including a first part disposed in a first contact hole defined through at least the first light emitting unit, the conductive thin film layer, and the second light emitting unit to expose the auxiliary electrode, and a second electrode including a first electrode part and a second electrode part, the first electrode part being disposed on the first part and including at least a portion disposed in the first contact hole and the second electrode part extending from the first electrode part, overlapped with the first electrode when viewed in a plan view, and disposed on the second light emitting unit.
- a portion of the first part is disposed between the first electrode part and the conductive thin film
- the other portion of the first part is disposed between the first electrode part and the auxiliary electrode.
- the other portion of the first part makes contact with the auxiliary electrode.
- the portion of the first part makes contact with an exposing surface of the conductive thin film layer exposed through the first contact hole.
- a second contact hole is defined in the other portion of the first part to expose at least a portion of an upper surface of the auxiliary electrode, and a portion of the first electrode part is disposed in the second contact hole defined in the insulating layer to make contact with the auxiliary electrode.
- the insulating layer further includes a second part extending from the first part and disposed between the second light emitting unit and the second electrode.
- the display panel further includes a pixel definition layer disposed between the auxiliary electrode and the first electrode when viewed in a plan view, and the insulating layer further includes a third part disposed on the pixel definition layer to connect the first and second parts.
- the second part is overlapped with the first electrode when viewed in a plan view.
- the insulating layer is spaced apart from the first electrode when viewed in a plan view.
- the first light emitting unit generates a first light
- the second light emitting unit generates a light having a color different from a color of the first light
- the insulating layer has a resistance greater than a resistance of the conductive thin film layer.
- the insulating layer has a thickness from about 1 nm to about 10 nm.
- the insulating layer includes at least one of LiF and LiQ.
- Embodiments also provide a method of manufacturing a display panel, including forming an auxiliary electrode in a first area defined in a base substrate, forming a first electrode in a second area defined in the base substrate and spaced apart from the first area when viewed in a plan view, forming a first light emitting unit on the first electrode, forming an conductive thin film layer on the first light emitting unit, forming a second light emitting unit on the conductive thin film layer, removing at least a portion of the first light emitting unit, the conductive thin film layer, and the second light emitting unit to form a first contact hole through which an upper surface of the auxiliary electrode is exposed, forming a insulating layer on an exposing surface of the conductive thin film layer, which is exposed through the first contact hole, and forming a second electrode on the insulating layer.
- the method further includes removing a portion of the insulating layer to form a second contact hole, through which at least a portion of the upper surface of the auxiliary electrode is exposed, through the insulating layer.
- the forming the second contact hole is performed after the forming the insulating layer and before the forming the second electrode.
- the first light emitting unit, the conductive thin film layer, and the second light emitting unit are removed using a laser drilling method.
- Embodiments also provide a display device including a display panel and a controller controlling the display panel.
- the display panel includes a base substrate, an auxiliary electrode disposed on the base substrate, a first electrode spaced apart from the auxiliary electrode when viewed in a plan view, a first light emitting unit disposed on the auxiliary electrode and the first electrode, an conductive thin film layer disposed on the first light emitting unit, a second light emitting unit disposed on the conductive thin film layer, a insulating layer including a first part disposed in a first contact hole defined through at least the first light emitting unit, the conductive thin film layer, and the second light emitting unit to expose the auxiliary electrode, and a second electrode including a first electrode part disposed in the first contact hole and disposed on the first par and a second electrode part extending from the first electrode part, overlapped with the first electrode when viewed in a plan view, and disposed on the second light emitting unit.
- a portion of the first part is disposed between the first electrode part and the
- the other portion of the first part is disposed between the first electrode part and the auxiliary electrode.
- the other portion of the first part makes contact with the auxiliary electrode, and the portion of the first part makes contact with an exposing surface of the conductive thin film layer exposed through the first contact hole.
- FIG. 1 illustrates a plan view of a display device according to an exemplary embodiment of the present disclosure
- FIG. 2 illustrates a plan view of a display panel according to an exemplary embodiment of the present disclosure
- FIG. 3A illustrates a cross-sectional view along line I-I′ in FIG. 2 ;
- FIG. 3B illustrates an enlarged cross-sectional view of a first contact hole shown in FIG. 3A ;
- FIG. 3C illustrates an enlarged cross-sectional view of the first contact hole shown in FIG. 3A ;
- FIG. 3D illustrates a cross-sectional view of a display panel according to an exemplary embodiment of the present disclosure
- FIG. 4 illustrates a plan view of a display panel according to an exemplary embodiment of the present disclosure
- FIG. 5 illustrates a cross-sectional view along line II-If in FIG. 2 ;
- FIG. 6 illustrates a cross-sectional view of a display panel according to an exemplary embodiment of the present disclosure
- FIG. 7 illustrates a schematic cross-sectional view of an organic light emitting element according to an exemplary embodiment of the present disclosure
- FIGS. 8A, 8B, 8C, 8D, 8E, and 8F illustrate cross-sectional views of stages in a method of manufacturing a display panel according to an exemplary embodiment
- FIGS. 9A, 9B, and 9C illustrate cross-sectional views of stages in a method of manufacturing a display panel according to an exemplary embodiment.
- an element or layer When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it may be directly on, connected to, or coupled to the other element or layer or intervening elements or layers may be present. When, however, an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.
- “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be construed as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as, for instance, XYZ, XYY, YZ, and ZZ.
- Like numbers refer to like elements throughout.
- the term “and/or” includes any and all combinations of one or more of the associated listed items.
- first, second, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and/or section from another element, component, region, layer, and/or section. Thus, a first element, component, region, layer, and/or section discussed below could be termed a second element, component, region, layer, and/or section without departing from the teachings of the present disclosure.
- Spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for descriptive purposes, and, thereby, to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the drawings.
- Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and/or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.
- the exemplary term “below” can encompass both an orientation of above and below.
- the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.
- exemplary embodiments are described herein with reference to sectional illustrations that are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, exemplary embodiments disclosed herein should not be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. The regions illustrated in the drawings are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to be limiting.
- FIG. 1 is a plan view showing a display device DD according to an exemplary embodiment of the present disclosure.
- the display device DD may include a display panel DP, a flexible printed circuit board FPC, and a printed circuit board PCB.
- the display panel DP displays an image through a display area DA.
- the display area DA is operated by a control signal and image data provided from the printed circuit board PCB.
- the display panel DP includes gate lines GL 1 to GLn, data lines DL 1 to DLm, and sub-pixels SPX, which are arranged in the display area DA.
- the gate lines GL 1 to GLn extend in a first direction DR 1 and are arranged, e.g., spaced apart, in a second direction DR 2 .
- the data lines DL 1 to DLm are insulated from the gate lines GL 1 to GLn while crossing the gate lines.
- the data lines DL 1 to DLm extend in the second direction DR 2 and are arranged, e.g., spaced apart, in the first direction DR 1 .
- a direction substantially parallel to the first and second directions DR 1 and DR 2 may be referred to as a “horizontal direction”.
- the display panel DP includes a non-display area NDA surrounding the display area DA when viewed in a plan view.
- the sub-pixels SPX are not arranged in the non-display area NDA, and the image is not displayed through the non-display area NDA.
- the non-display area NDA may be referred to as a “bezel” of the display device DD.
- Each of the sub-pixels SPX is connected to a corresponding gate line of the gate lines GL 1 to GLn and a corresponding data line of the data lines DL 1 to DLm.
- the sub-pixels SPX may be arranged in a matrix form along the first and second directions DR 1 and DR 2 .
- Each sub-pixel SPX displays one of three primary colors of red, green, and blue colors.
- the colors displayed by the sub-pixels SPX are not be limited to red, green, and blue colors, and the sub-pixels SPX may display a second primary color of white, yellow, cyan, and magenta colors in addition to the red, green, and blue colors.
- the sub-pixels SPX may form the pixel PX.
- four sub-pixels SPX may form one pixel PX, but the number of the sub-pixels SPX required to form one pixel PX is not be limited to four. That is, one pixel PX may include two, three, five, or more sub-pixels SPX.
- the pixel PX serves as an element to display a unit image, and a resolution of the display panel DP is determined by the number of the pixels PX included in the display panel DP.
- FIG. 1 shows only one pixel PX, and the other pixels may have the same configurations as the one pixel PX.
- the display panel DP may be, but not limited to, an organic light emitting display panel, and each sub-pixel SPX may include an organic light emitting element.
- the display panel DP may have, for example, a plate-like shape with a pair of short sides and a pair of long sides, which are respectively parallel to the first and second directions DR 1 and DR 2 .
- the display panel DP may have various shapes.
- the display panel DP may have a shape curved in at least one direction when viewed in a cross-section, or the display panel DP may have at least one round-shaped edge when viewed in a plan view.
- the flexible printed circuit board FPC connects the display panel DP and the printed circuit board PCB.
- FIG. 1 shows only one flexible printed circuit board FPC, but the flexible printed circuit board FPC may be provided in a plural number.
- the flexible printed circuit boards FPC may be arranged in an edge of the display panel along one direction. In the present exemplary embodiment, the number of the flexible printed circuit boards may vary.
- the flexible printed circuit board FPC includes a driving chip DC.
- the driving chip DC is mounted in a tape carrier package (TCP) manner and includes a chip implemented as a data driver.
- the driving chip DC may further include a chip implemented as a gate driver.
- the gate driver may be disposed in the non-display area NDA.
- the printed circuit board PCB includes a controller to control the display panel DP.
- the controller receives input image signals and converts a data format of the input image signals to a data format appropriate to an interface and a driving mode of the data driver, the gate driver, and the display panel DP to generate the image data.
- the controller outputs the image data and the control signal.
- the image data include information with respect to the image displayed in the display area DA.
- the data driver receives the image data and the control signal.
- the data driver converts the image data to data voltages in response to the control signal and applies the data voltages to the data lines DL 1 to DLm.
- the data voltages may be analog voltages corresponding to the image data.
- the printed circuit board PCB may include a passive device, e.g., a capacitor, a resistor, etc., an active device, e.g., a microprocessor including an integrated circuit, a memory chip, etc., and lines connecting them.
- a passive device e.g., a capacitor, a resistor, etc.
- an active device e.g., a microprocessor including an integrated circuit, a memory chip, etc., and lines connecting them.
- the display panel DP may further include an auxiliary electrode 100 .
- the auxiliary electrode 100 may be disposed between the sub-pixels SPX when viewed in a plan view.
- the auxiliary electrode 100 may have, for example, a grid shape.
- the auxiliary electrode 100 includes a plurality of first extension parts 100 _ a and a plurality of second extension parts 100 _ b .
- the first extension parts 100 _ a extend in the first direction DR 1 and are arranged in the second direction DR 2 .
- the second extension parts 100 _ b extend in the second direction DR 2 and are arranged in the first direction DR 1 .
- the first and second extension parts 100 _ a and 100 _ b may be disposed every one sub-pixel SPX along the first and second directions DR 1 and DR 2 , e.g., each of the first extension parts 100 _ a may be disposed along corresponding rows of sub-pixel SPX in a one-to-one correspondence, and each of the second extension parts 100 _ b may be disposed along corresponding columns of sub-pixels SPX in a one-to-one correspondence.
- embodiments are not limited thereto or thereby, e.g., the first and second extension parts 100 _ a and 100 _ b may be disposed every two sub-pixels SPX along the first and second directions DR 1 and DR 2 .
- the auxiliary electrode 100 may prevent an IR-drop from occurring in the display panel DP.
- the IR-drop will be described in detail later.
- FIG. 2 is a plan view showing a display panel according to an exemplary embodiment of the present disclosure
- FIG. 3A is a cross-sectional view taken along line I-I′ in FIG. 2
- FIG. 3B is an enlarged cross-sectional view showing a first contact hole in FIG. 3A
- FIG. 3C is an enlarged cross-sectional view showing the first contact hole in FIG. 3A .
- each of the pixels PX may include first, second, third, and fourth sub-pixels SPX 1 , SPX 2 , SPX 3 , and SPX 4 .
- the first to fourth sub-pixels SPX 1 to SPX 4 correspond to an embodiment of the sub-pixels SPX shown in FIG. 1 .
- the first, second, third, and fourth sub-pixels SPX 1 , SPX 2 , SPX 3 , and SPX 4 respectively correspond to red, green, blue, and white sub-pixels.
- Each of the first to fourth sub-pixels SPX 1 to SPX 4 may have, e.g., a substantially quadrangular shape.
- the display panel DP may include a pixel definition layer PDL disposed between the first to fourth sub-pixels SPX 1 to SPX 4 .
- the pixel definition layer PDL may define a boundary between the first to fourth sub-pixels SPX 1 to SPX 4 and a boundary between the pixels PX.
- a first contact hole CNT 1 is defined through the display panel DP.
- the first contact hole CNT 1 is defined in an area in which the first and second extension parts 100 _ a and 100 _ b cross each other.
- the display panel DP may include a base substrate BS, a pixel circuit layer PC, a first insulating layer ILL an organic light emitting element 200 , a insulating layer 300 , and a second insulating layer IL 2 .
- the base substrate BS may be transparent and may include, e.g., a rigid glass or a flexible polymer.
- the pixel circuit layer PC may be disposed on the base substrate BS.
- the pixel circuit layer PC may include a circuit to drive the organic light emitting element 200 and at least two transistors.
- the pixel circuit layer PC may include, e.g., a switching transistor turned on in response to a gate signal applied thereto to transmit the data voltage and a driving transistor applying a driving current corresponding to the data voltage from the switching transistor to the organic light emitting element 200 .
- the first insulating layer IL 1 may be disposed on the pixel circuit layer PC.
- the first insulating layer IL 1 may include a contact hole defined therethrough to expose a portion of the pixel circuit layer PC.
- the first insulating layer IL 1 has a single- or multi-layer structure of an organic material or an inorganic material.
- the organic light emitting element 200 may include a first electrode 210 , a first light emitting unit 220 , an conductive thin film layer 230 , a second light emitting unit 240 , and a second electrode 250 .
- the first electrode 210 may be disposed on the first insulating layer IL 1 .
- a first end of the first electrode 210 makes contact with the pixel circuit layer PC through the contact hole in the first insulating layer IL 1 to receive the driving current from the pixel circuit layer PC.
- the base substrate BS includes a first area A 1 and a second area A 2 spaced apart from the first area A 1 in a horizontal direction.
- a second end of the first electrode 210 extends from the first electrode 210 and is disposed in the second area A 2 .
- the auxiliary electrode 100 is disposed in the first area A 1 .
- the auxiliary electrode 100 includes a conductive material.
- the auxiliary electrode 100 may be a transparent electrode, a semi-transparent electrode, or a non-transparent electrode (or a reflective electrode).
- the auxiliary electrode 100 may have a single-layer structure of a single material or plural different materials or a multi-layer structure of layers formed of different materials.
- the pixel definition layer PDL is disposed on the auxiliary electrode 100 and the first electrode 210 .
- the pixel definition layer PDL covers an edge of the auxiliary electrode 100 and exposes a center portion of the auxiliary electrode 100 .
- a portion of the pixel definition layer PDL may be disposed between the first and second areas A 1 and A 2 when viewed in a plan view.
- the first area A 1 may be defined to correspond to the center portion of the auxiliary electrode 100 .
- the pixel definition layer PDL may cover an edge of the first electrode 210 and expose a center portion of the first electrode 210 .
- the second area A 2 may be defined to correspond to the exposed center portion of the first electrode 210 .
- the first light emitting unit 220 is disposed on the pixel definition layer PDL, the first electrode 210 , and the auxiliary electrode 100 .
- the first light emitting unit 220 generates, e.g., a first light having a first color.
- the first light emitting unit 220 includes a plurality of organic layers.
- the conductive thin film layer 230 may be disposed on the first light emitting unit 220 .
- the conductive thin film layer 230 is disposed between the first and second light emitting units 220 and 240 to provide electric charges (electrons and/or holes) to the first and second light emitting units 220 and 240 and to control a balance of the electric charges.
- the second light emitting unit 240 may be disposed on the conductive thin film layer 230 .
- the second light emitting unit 240 generates, e.g., a second light having a second color.
- the second light emitting unit 240 includes a plurality of organic layers.
- the organic light emitting element 200 may be, but is not limited to, a white organic light emitting element.
- a color obtained by mixing the first and second colors may be white, and the first and second colors may have a complementary color relationship with each other.
- the first and second lights may be mixed with each other to generate white light.
- the first and second colors may be respectively blue and yellow colors, but they are not limited thereto or thereby, e.g., the first and second colors may be respectively red and green colors.
- the second electrode 250 may be disposed on the insulating layer 300 .
- the second electrode 250 includes a first electrode part 251 disposed in the first area A 1 and a second electrode part 252 extending from the first electrode part 251 and disposed in the second area A 2 .
- the first electrode part 251 and the second electrode part 252 are respectively overlapped with the auxiliary electrode 100 and the first electrode 210 when viewed in a plan view.
- the second electrode 250 is disposed over the entire surface of the base substrate BS. Accordingly, the IR-drop occurs in the second electrode 250 along the horizontal direction, and a brightness of the pixel PX becomes different in accordance with a position of the display panel DP. To prevent the IR-drop from occurring, the second electrode 250 may be connected to the auxiliary electrode 100 . Since the auxiliary electrode 100 is connected to the second electrode 250 through a first part 310 of the insulating layer 300 , the IR-drop occurring in the second electrode 250 may be prevented from occurring or may be reduced.
- the insulating layer 300 is disposed on the second light emitting unit 240 , first, second, and third exposing surfaces 221 , 231 , and 241 , and a portion of the auxiliary electrode 100 .
- the insulating layer 300 includes the first part 310 , a second part 320 , and a third part 330 .
- the first contact hole CNT 1 is defined in the first area A 1 and is disposed above the auxiliary electrode 100 .
- the first contact hole CNT 1 is defined through the first light emitting unit 220 , the conductive thin film layer 230 , and the second light emitting unit 240 to expose the auxiliary electrode 100 .
- some elements are not shown for the convenience of explanation of the first contact hole CNT 1 and the first part 310 .
- the insulating layer 300 and layers disposed above the insulating layer 300 are not shown in FIG. 3C .
- the expression “a contact hole is defined in a layer” means that a space obtained by partially removing the layer is defined as the contact hole. Accordingly, the first contact hole CNT 1 may be defined by an empty space (an area hatched with dots in FIGS. 3B and 3C ) formed by partially removing the first light emitting unit 220 , the conductive thin film layer 230 , and the second light emitting unit 240 .
- At least a portion of an upper surface of the auxiliary electrode 100 , the first exposing surface 221 of the first light emitting unit 220 , the second exposing surface 231 of the conductive thin film layer 230 , and the third exposing surface 241 of the second light emitting unit 240 are exposed through the first contact hole CNT 1 . Since the first portion of the first part 310 is disposed in the first contact hole CNT 1 , the first portion of the first part 310 may be disposed only in an area surrounded by the first, second, and third exposing surfaces 221 , 231 , and 241 .
- the first portion of the first part 310 is disposed between the conductive thin film layer 230 and the first electrode part 251 .
- a lower surface of the first portion of the first part 310 makes contact with the first, second, and third exposing surfaces 221 , 231 , and 241 , and an upper surface of the first portion 310 makes contact with the first electrode part 251 .
- a second portion of the first part 310 is disposed between the first electrode part 251 and the auxiliary electrode 100 to electrically connect the first electrode part 251 to the auxiliary electrode 100 .
- a lower surface of the second portion of the first part 310 makes contact with the auxiliary electrode 100 .
- the second portion of the first part 310 is a portion extending in parallel to the base substrate BS, i.e., on a bottom of the first contact hole CNT 1 , on the auxiliary electrode 100
- the first portion of the first part 310 is a portion extending from the second portion along sidewalls of the first contact hole CNT 1 .
- the second part 320 is disposed in the second area A 2 .
- the second part 320 is disposed on the second electrode part 252 and disposed between the second light emitting unit 240 and the second electrode part 252 in the second area A 2 .
- the third part 330 is disposed between the first and second parts 310 and 320 when viewed in a plan view and connects the first and second parts 310 and 320 .
- the third part 330 is disposed on the pixel definition layer PDL.
- the insulating layer 300 prevents the lateral leakage current from flowing through the conductive thin film layer 230 . If the insulating layer 300 were to be omitted, the conductive thin film layer 230 would directly contact the first electrode part 251 in the first contact hole CNT 1 , causing a first voltage applied to the first electrode part 251 to be applied to the conductive thin film layer 230 , thereby causing lateral leakage current through the conductive thin film layer 230 in the first contact hole CNT 1 . Accordingly, the lateral leakage current could pass through the first light emitting unit 220 . In addition, a leakage voltage could be applied in the second area A 2 due to the lateral leakage current. The leakage voltage may be voltage obtained by voltage-dividing the voltage applied in the first contact hole CNT 1 along a path of the lateral leakage current. The leakage voltage is greater than the voltage applied to the first electrode 210 and smaller than the first voltage.
- lateral leakage current and leakage voltage are applied in the second areas A 2 , light emission of the light emitted from the first light emitting unit 220 may be poor (hereinafter, referred to as a “poor light emission”).
- the first light emitting unit 220 may emit light or generate light corresponding to a grayscale level different from the grayscale level of the voltage applied to the first electrode 210 .
- the insulating layer 300 may insulate the conductive thin film layer 230 from the second electrode 250 , thereby preventing the lateral leakage current and the leakage voltage between the conductive thin film layer 230 and the first electrode part 251 , which in turn, prevents or substantially minimizes poor light emission from occurring in the organic light emitting element 200 .
- the first portion of the insulating layer 300 along a sidewall of the first contact hole CNT 1 may, e.g., completely or partially, insulate the conductive thin film layer 230 from the second electrode 250 .
- the insulating layer 300 completely insulates the conductive thin film layer 230 from the second electrode 250 , the lateral leakage current does not flow to the conductive thin film layer 230 from the first electrode part 251 , and the leakage voltage is not applied to the first part 310 .
- a lateral leakage current equal to or smaller than a critical current may flow, and leakage voltage equal to or smaller than a critical voltage may be applied to the second part 320 .
- the first light emitting unit 220 may not emit the light, e.g., may not emit light corresponding to voltage and/or current smaller than respective critical values.
- the insulating layer 300 has a resistance determined such that poor light emission is prevented.
- the resistance of the insulating layer 300 is greater than a resistance of the conductive thin film layer 230 .
- the insulating layer 300 has a thickness determined such that the first electrode part 251 is electrically connected to the auxiliary electrode 100 and the conductive thin film layer 230 is insulated from the first electrode part 251 .
- the thickness of the insulating layer 300 is in a range from about 1 nm to about 10 nm.
- the insulating layer 300 is required to have the above indicated thickness, and thus the insulating layer 300 may have an insulating function in the first area A 1 .
- the insulating layer 300 insulates the conductive thin film layer 230 from the second electrode 250 , and thus poor light emission of the organic light emitting element 200 due to the lateral leakage current may be prevented from occurring, and the organic light emitting element 200 may be stably driven.
- Each of the first and second electrodes 210 and 250 includes a conductive material.
- each of the first and second electrodes 210 and 250 is a transparent electrode, a semi-transparent electrode, or a non-transparent electrode (or a reflective electrode).
- the first and second electrodes 210 and 250 may have a single-layer structure of a single material or plural different materials or a multi-layer structure of layers formed of different materials.
- each of the first and second electrodes 210 and 250 may include, for example, Li, Ca, LiF/Ca, LiF/Al, Al, Mg, BaF, Ba, Ag, a compound thereof, or a mixture thereof, e.g., a mixture of Ag and Mg, each which is optically thin, or a transparent metal oxide, e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), Mo, Ti, etc.
- a transparent metal oxide e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), Mo, Ti, etc.
- each of the first and second electrodes 210 and 250 may include, e.g., Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF/Ca, LiF/Al, Mo, Ti, a compound thereof, or a mixture thereof, e.g., a mixture of Ag and Mg, each which is optically thick.
- the organic light emitting element 200 may be a rear surface light emitting type or a front surface light emitting type.
- the first electrode 210 is provided as a transparent or semi-transparent electrode
- the second electrode 250 is a reflective electrode. In this case, white light exits to the outside through the first electrode 210 .
- the first electrode 210 is provided as a reflective electrode
- the second electrode 250 is a transparent or semi-transparent electrode, and accordingly, white light exits to the outside through the second electrode 250 .
- the organic light emitting element 200 may have a non-inverted structure or an inverted structure.
- the first electrode 210 is an anode
- the second electrode 250 is a cathode
- a voltage applied to the first electrode 210 is greater than a voltage applied to the second electrode 250 .
- the organic light emitting element 200 has an inverted structure
- the first electrode 210 is the cathode
- the second electrode 250 is the anode
- the voltage applied to the first electrode 210 is smaller than the voltage applied to the second electrode 250 .
- FIG. 3D is a cross-sectional view showing a display panel according to an exemplary embodiment of the present disclosure.
- the display panel DP in FIG. 3D is substantially the same as the display panel DP in FIG. 3A , with the exception of the first contact hole and the first part extending deeper than those in FIG. 3A .
- the pixel circuit layer PC includes a transistor TR.
- the transistor TR includes a gate electrode GE, a source electrode SE, a drain electrode DE, and a semiconductor layer SL.
- the semiconductor layer SL is disposed on the base substrate BS.
- a first transistor insulating layer TRI 1 is disposed on the semiconductor layer SL.
- a second transistor insulating layer TRI 2 is disposed above the first transistor insulating layer TRI 1 .
- the source electrode SE and the drain electrode DE are disposed on the second transistor insulating layer TRI 2 and spaced apart from each other.
- the source electrode SE is connected to one end of the semiconductor layer SL through a contact hole defined through the first and second transistor insulating layers TRI 1 and TRI 2
- the drain electrode DE is connected to the other end of the semiconductor layer SL through a contact hole defined through the first and second transistor insulating layers TRI 1 and TRI 2 .
- the transistor TR applies voltage applied to the source electrode SE to the first electrode 210 through the drain electrode DE in response to a control signal applied to the gate electrode GE.
- the auxiliary electrode 100 is disposed between the first insulating layer IL 1 and the second transistor insulating layer TRI 2 , and the first insulating layer IL 1 includes an intermediate contact hole CNT_M defined therethrough to expose the auxiliary electrode 100 . That is, the upper surface of the auxiliary electrode 100 is exposed through the intermediate contact hole CNT_M. Portions of the first and second light emitting units 220 and 240 and the conductive thin film layers 230 , which are disposed in the first area A 1 , are disposed in the intermediate contact hole CNT_M.
- the first contact hole CNT 1 is defined through the portions of the first and second light emitting units 220 and 240 and the conductive thin film layers 230 , which are disposed in the intermediate contact hole CNT_M.
- the upper surface of the auxiliary electrode 100 is exposed through the first contact hole CNT 1 .
- the first and intermediate contact holes CNT 1 and CNT_M may be in fluid communication with each other, e.g., portions of the first light emitting unit 220 may extend along sidewalls of the first contact hole CNT 1 and continuously extend along sidewall of the intermediate contact hole CNT_M.
- portions of the first light emitting unit 220 may extend along sidewalls of the first contact hole CNT 1 and continuously extend along sidewall of the intermediate contact hole CNT_M.
- the intermediate contact hole CNT_M may be between the first contact hole CNT 1 and sidewalls of the first insulating layer ILL e.g., the intermediate contact hole CNT_M may extend radially from the first contact hole CNT 1 toward the sidewalls of the first insulating layer IL 1 .
- the first part 310 of the insulating layer 300 is disposed in the first contact hole CNT 1 . At least the portion of an upper surface of the auxiliary electrode 100 , the first exposing surface 221 of the first light emitting unit 220 , the second exposing surface 231 of the conductive thin film layer 230 , and the third exposing surface 241 of the second light emitting unit 240 are exposed through the first contact hole CNT 1 . Since the first part 310 is disposed in the first contact hole CNT 1 , the first part 310 may be disposed only in the area surrounded by the first, second, and third exposing surfaces 221 , 231 , and 241 and the first electrode part 251 .
- the first portion of the first part 310 e.g., on sidewalls of the first contact hole CNT 1 , is disposed between the conductive thin film layer 230 and the first electrode part 251 .
- a lower surface of the portion of the first part 310 makes contact with the first, second, and third exposing surfaces 221 , 231 , and 241 , and an upper surface of the first portion 310 makes contact with the first electrode part 251 .
- the second portion of the first part 310 e.g., on a bottom of the first contact hole CNT 1 , is disposed between the first electrode part 251 and the auxiliary electrode 100 to electrically connect the first electrode part 251 to the auxiliary electrode 100 .
- a lower surface of the second portion of the first part 310 makes contact with the auxiliary electrode 100 .
- the auxiliary electrode 100 may be disposed between the first and second transistor insulating layers TRI 1 and TRI 2 .
- the first contact hole CNT 1 is defined in the first transistor insulating layer TRI 1 to expose the upper surface of the auxiliary electrode 100 , and the first portion 310 may be disposed in the first contact hole CNT 1 .
- FIG. 4 is a plan view showing a display panel according to an exemplary embodiment of the present disclosure
- FIG. 5 is a cross-sectional view taken along line II-II′ in FIG. 2
- the display panel DP in FIGS. 4 and 5 is substantially the same as the display panel DP shown in FIGS. 2-3 , except for a second contact hole CNT 2 and the conductive thin film layer.
- a second contact hole CNT 2 and the conductive thin film layer will be mainly described, and details of the others will be omitted.
- the second contact hole CNT 2 may be further defined in the display panel DP.
- the second contact hole CNT 2 may be defined in the first contact hole CNT 1 when viewed in a plan view.
- the second contact hole CNT 2 is defined in the first area A 1 above the auxiliary electrode 100 .
- the second contact hole CNT 2 is defined through the insulating layer 300 .
- the second contact hole CNT 2 is defined in the first part 310 , and at least a portion of an upper surface of the auxiliary electrode 100 and a fourth exposing surface 301 of the insulating layer 300 are exposed through the second contact hole CNT 2 .
- the first electrode part 251 is disposed in the second contact hole CNT 2 and makes contact with the portion of the auxiliary electrode 100 exposed through the second contact hole CNT 2 .
- the second electrode 250 is directly connected to the auxiliary electrode 100 , a voltage drop does not occur between the second electrode 250 and the auxiliary electrode 100 . Accordingly, the IR-drop may be effectively prevented, and a voltage-current characteristic of the organic light emitting element 200 may be improved.
- FIG. 6 is a cross-sectional view showing a display panel according to an exemplary embodiment of the present disclosure.
- the display panel DP in FIG. 6 is substantially the same as the display panel DP shown in FIG. 5 , except for the insulating layer. Thus different features of the insulating layer will be mainly described, and details of the others will be omitted.
- the insulating layer 300 is not disposed in the second area A 2 .
- the insulating layer 300 is disposed spaced apart from the second area A 2 without being overlapped with the second area A 2 when viewed in a plan view.
- the second and third parts 320 and 330 may be omitted.
- the insulating layer 300 is not disposed between organic layers of the organic light emitting element 200 in the second area A 2 . Accordingly, the insulating layer 300 does not exert an influence on the balance of electric charge and the voltage-current characteristic of the organic light emitting element 200 . Thus, a design of the organic light emitting element 200 to maintain the electric charge balance and a design of the insulating layer 300 to prevent the lateral leakage current from occurring may be independently performed.
- FIG. 7 is a schematic cross-sectional view of the organic light emitting element 200 .
- the first light emitting unit 220 includes a first hole control layer HCL 1 , a first light emitting layer EML 1 , and a first electron control layer ECL 1 .
- the second light emitting unit 240 includes a second hole control layer HCL 2 , a second light emitting layer EML 2 , and a second electron control layer ECL 2 .
- the first and second light emitting layers EML 1 and EML 2 are disposed between the first electrode 210 and the second electrode 250 .
- each of the first and second light emitting layers EML 1 and EML 2 includes a host material and a dopant material.
- Each of the first and second light emitting layers EML 1 and EML 2 is formed by applying a fluorescent material or a phosphorescent material to the host material.
- Colors of the light emitting layers may be determined by a combination of the host material and the dopant material.
- the light emitting layers may include a fluorescent material containing, e.g., PBD:Eu(DBM)3(Phen)(tris(dibenzoylmethanato)phenanthoroline europium) or Perylene.
- the dopant included in the organic light emitting layers may be a metal complex, e.g., PIQIr(acac)(bis(1-phenylisoquinoline)acetylacetonate iridium), PQIr(acac)(bis(1-phenylquinoline)acetylacetonate iridium), PQIr(tris(1-phenylquinoline)iridium), PtOEP(octaethylporphyrin platinum), etc., or organometallic complex.
- PIQIr(acac) bis(1-phenylisoquinoline)acetylacetonate iridium
- PtOEP(octaethylporphyrin platinum) etc.
- the light emitting layers may include a fluorescent material containing, e.g., Alq3(tris(8-hydroxyquinolino)aluminum).
- the dopant included in the light emitting layers may be a metal complex, e.g., Ir(ppy)3(fac-tris(2-phenylpyridine)iridium), or organometallic complex.
- the light emitting layers may include a fluorescent material including, e.g., any one from the groups consisting of spiro-DPVBi, spiro-6P, DSB(distyryl-benzene), DSA(distyryl-arylene), PFO(Polyfluorene)-based polymer, and PPV(poly(p-phenylene vinylene)-based polymer.
- the dopant included in the light emitting layers may be a metal complex, e.g., (4,6-F2ppy)2Irpic, or organometallic complex.
- the first light emitting layer EML 1 generates light having a wavelength shorter than a wavelength of a light generated by the second light emitting layer EML 2 .
- the first light may be the blue light and have a wavelength range equal to or greater than about 450 nm and equal to or smaller than about 595 nm.
- the second light may be the yellow light and have a wavelength range equal to or greater than about 570 nm and equal to or smaller than about 590 nm.
- the first and second light emitting layers EML 1 and EML 2 may be designed to generate lights having various colors according to embodiments.
- the first and second light emitting layers EML 1 and EML 2 may be formed by various methods, e.g., a vacuum deposition method, a spin coating method, a cast method, an LB (Langmuir-Blodgett) method, an inkjet printing method, a laser printing method, an LITI (Laser Induced Thermal Imaging) method, etc.
- the conductive thin film layer 230 is disposed between the first and second light emitting layers EML 1 and EML 2 to improve a current efficiency and a light efficiency of the organic light emitting element 200 .
- the conductive thin film layer 230 When voltage is applied to the conductive thin film layer 230 , the conductive thin film layer 230 generates electric charges by a complex formation due to oxidation-reduction reaction.
- the conductive thin film layer 230 may include first and second conductive thin film layers 231 and 232 sequentially stacked.
- the first and second conductive thin film layers 231 and 232 may be respectively N-type and P-type conductive thin film layers.
- the N-type conductive thin film layer may include an alkali metal, e.g., Li, Na, K, Cs, or the like, or an organic layer doped with an alkali earth metal, e.g., Mg, Sr, Ba, Ra, or the like, but it should not be limited thereto or thereby.
- the P-type conductive thin film layer may include an organic layer with a P-type dopant, but it should not be limited thereto or thereby.
- the first hole control layer HCL 1 is disposed between the first electrode 210 and the first light emitting layer EML 1 .
- the second hole control layer HCL 2 is disposed between the electric charge layer 230 and the second light emitting layer EML 2 .
- the first electrode 210 is an anode electrode layer
- holes injected from the first electrode 210 are provided to the first light emitting layer EML 1 through the first hole control layer HCL 1 .
- the holes generated by the conductive thin film layer 230 are provided to the second light emitting layer EML 2 through the second hole control layer HCL 2 .
- Each of the first and second hole control layers HCL 1 and HCL 2 may correspond to at least one of a hole injection area, a hole transport area, a buffer area, and an electron block area.
- Each of the first and second hole control layers HCL 1 and HCL 2 may have a single-layer structure of a single material or plural different materials or a multi-layer structure of layers formed of different materials.
- each of the first and second hole control layers HCL 1 and HCL 2 may include at least one of a hole injection layer corresponding to the hole injection layer, a hole transport layer corresponding to the hole transport area, and a single layer having a hole injection function and a hole transport function.
- Each of the first and second hole control layers HCL 1 and HCL 2 may include at least one of a hole injection material and a hole transport material.
- the hole injection material and the hole transport material may be known materials.
- the hole transport material may include, but not limited to, e.g., carbazole-based derivatives, e.g., n-phenyl carbazole, polyvinyl carbazole, etc., fluorine-based derivatives, triphenylamine-based derivatives, e.g., TPD(N,N-bis(3-methylphenyl)-N,N-diphenyl[1,1-biphenyl]-4,4′-diamine), TCTA(4,4′,4′′-tris(N-carbazolyl)triphenylamine), etc., NPB(N,N′-di(1-naphthyl)-N,N′-diphenylbenzidine), or TAPC(4,4′-Cyclohexylidene bis[N,N-bis(4-methylphenyl)benzenamine]).
- carbazole-based derivatives e.g., n-phenyl carbazole, polyvinyl carb
- the hole injection material may include, but not limited to, at least one of a phthalocyanine compound such as copper phthalocyanine, DNTPD (N,N′-diphenyl-N,N′-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4′-diamine), m-MTDATA(4,4′,4′′-tris(3-methylphenylphenylamino)triphenylamine), TDATA(4,4′4′′-Tris(N,N-diphenylamino)triphenylamine), 2TNATA(4,4′,4′′-tris ⁇ N,-(2-naphthyl)-N-phenylamino ⁇ -triphenylamine), PEDOT/PSS(Poly(3,4-ethylenedioxythiophene)/Poly(4-styrenesulfonate), PANI/DBSA(Polyaniline/Dodecylbenzene
- Each of the first and second hole control layers HCL 1 and HCL 2 may be formed by similar process of forming the first and second light emitting layers EML 1 and EML 2 .
- each of the first and second hole control layers HCL 1 and HCL 2 may be formed by various methods, e.g., a vacuum deposition method, a spin coating method, a cast method, an LB (Langmuir-Blodgett) method, an inkjet printing method, a laser printing method, an LITI (Laser Induced Thermal Imaging) method, etc.
- each of the first and second hole control layers HCL 1 and HCL 2 may include a hole block layer corresponding to the hole block area.
- each of the first and second hole control layers HCL 1 and HCL 2 may include a hole block material.
- each of the first and second hole control layers HCL 1 and HCL 2 may further include an electric charge generating material.
- the first electron control layer ECL 1 is disposed between the first light emitting layer EML 1 and the conductive thin film layer 230 .
- the electrons generated by the conductive thin film layer 230 are provided to the first light emitting layer EML 1 through the first electron control layer ECL 1 .
- the second electron control layer ECL 2 is disposed between the second light emitting layer EML 2 and the second electrode 250 .
- the second electrode 250 is a cathode electrode layer
- the electrons injected from the second electrode 250 are provided to the second light emitting layer EML 2 through the insulating layer 300 and the second electron control layer ECL 2 .
- Each of the first and second electron control layers ECL 1 and ECL 2 may correspond to at least one of an electron injection area, an electron transport area, and a hole block area.
- Each of the first and second electron control layers ECL 1 and ECL 2 may have a single-layer structure of a single material or plural different materials or a multi-layer structure of layers formed of different materials.
- each of the first and second electron control layers ECL 1 and ECL 2 may include at least one of an electron injection layer corresponding to the electron injection layer, an electron transport layer corresponding to the electron transport area, and a single layer having an electron injection function and an electron transport function.
- Each of the first and second electron control layers ECL 1 and ECL 2 may include at least one of an electron transport material and an electron injection material.
- the electron transport material may include, but not limited to, Alq3(Tris(8-hydroxyquinolinato)aluminum), TPBi(1,3,5-Tri(1-phenyl-1H-benzo[d]imidazol-2-yl)phenyl), BCP(2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline), Bphen(4,7-Diphenyl-1,10-phenanthroline), TAZ(3-(4-Biphenylyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole), NTAZ(4-(Naphthalen-1-yl)-3,5-diphenyl-4H-1,2,4-triazole), tBu-PBD(2-(4-Biphenylyl)-5-(4-tert-butylphenyl
- the electron injection material may include a lanthanide-based metal, e.g., LiF, LiQ (Lithium quinolate), Li 2 O, BaO, NaCl, CsF, Yb, etc., or a metal halide, e.g., RbCl, RbI, etc., but it should not be limited thereto or thereby.
- the electron transport layer may include a mixture of an electron transport material and an organo metal salt with insulating property.
- the organo metal salt has an energy band gap of about 4 eV or more.
- the organo metal salt may include, e.g., metal acetate, metal benzoate, metal acetoacetate, metal acetylacetonate, or metal stearate.
- Each of the first and second electron control layers ECL 1 and ECL 2 may be formed by various methods, e.g., a vacuum deposition method, a spin coating method, a cast method, an LB (Langmuir-Blodgett) method, an inkjet printing method, a laser printing method, an LITI (Laser Induced Thermal Imaging) method, etc.
- a vacuum deposition method e.g., a spin coating method, a cast method, an LB (Langmuir-Blodgett) method, an inkjet printing method, a laser printing method, an LITI (Laser Induced Thermal Imaging) method, etc.
- the organic light emitting element 200 should not be limited to the above-mentioned structure and function.
- the organic light emitting element 200 may include three light emitting units and two conductive thin film layers interposed between the three light emitting units.
- the insulating layer 300 may insulate the two conductive thin film layers from the second electrode 250 .
- the insulating layer 300 corresponds to a separate component disposed on the second light emitting unit 240 , but the present disclosure should not be limited thereto or thereby. That is, the insulating layer 300 may be provided as a layer that performs a function of the second light emitting unit 240 .
- the insulating layer 300 may correspond to the electron injection area, and the second electron control layer ECL 2 of the second light emitting unit 240 may include the electron transport area and the hole block area.
- the insulating layer 300 may perform a function of the electron injection area of the second light emitting unit 240 .
- the insulating layer 300 may be not only the electron injection area but also the electron transport area and the hole block area.
- the insulating layer 300 may be one of the hole injection area, the hole transport area, and the electron block area.
- the insulating layer 300 may include, for example, at least one of LiQ and LiF.
- the insulating layer 300 may include the host material of the first and second hole control layers HCL 1 and HCL 2 to block the injection/transport of the electrons or a material of the first and second electron control layers ECL 1 and ECL 2 , which has a low electron conductivity. Accordingly, the electrons injected from the first electrode part 251 that is the cathode are blocked, and thus the lateral leakage current may be effectively prevented.
- the insulating layer 300 has a thickness of about 1 nm to about 10 nm. When the thickness of the insulating layer 300 is smaller than about 1 nm, the insulating layer 300 may not be sufficiently thick to properly perform an insulating function with respect to the conductive thin film layer 230 in the first area A 1 (refer to FIG. 3A ). When the thickness of the insulating layer 300 exceeds about 10 nm, the insulating layer 300 may be too thick to perform the function of the electron injection/transport with respect to the second light emitting unit 240 in the second area A 2 (refer to FIG. 3A ).
- the insulating layer 300 may include the host material of the first and second electron control layers ECL 1 and ECL 2 to block the injection/transport of the holes or a material of the first and second hole control layers HCL 1 and HCL 2 , which has a low hole conductivity. Accordingly, the holes injected from the first electrode part 251 that is the anode are blocked, and thus the lateral leakage current may be effectively prevented.
- FIGS. 8A to 8F are cross-sectional views showing stages in a method of manufacturing a display panel according to an exemplary embodiment.
- the pixel circuit layer PC is formed on the base substrate BS, and the first insulating layer IL 1 is formed on the pixel circuit layer PC.
- a driving contact hole CNT_Dr is formed through the first insulating layer IL 1 .
- a portion of the pixel circuit layer PC is exposed through the driving contact hole CNT_Dr.
- the first electrode 210 and the auxiliary electrode 100 are formed on the first insulating layer IL 1 .
- the first end of the first electrode 210 is disposed in the driving contact hole CNT_Dr formed through the first insulating layer IL 1 and makes contact with the pixel circuit layer PC.
- the second end of the first electrode 210 extends from the first end of the first electrode 210 and is disposed in the second area A 2 .
- the auxiliary electrode 100 is spaced apart from the first electrode 210 and disposed in the first area
- the pixel definition layer PDL is formed on the first electrode 210 and the auxiliary electrode 100 . Then, the first light emitting unit 220 , the conductive thin film layer 230 , and the second light emitting unit 240 are sequentially formed on the pixel definition layer PDL, the first electrode 210 , and the auxiliary electrode 100 .
- the first contact hole CNT 1 is formed in the first area A 1 .
- the first contact hole CNT 1 is formed by removing portions (hereinafter, referred to as “removed layers”) of the first light emitting unit 220 , the conductive thin film layer 230 , and the second light emitting unit 240 in the first area A 1 to expose a portion, e.g., of the upper surface, of the first auxiliary electrode 100 .
- the first, second, and third exposing surfaces 221 , 231 , and 241 are formed, e.g., the first through third exposing surfaces 221 through 241 are lateral surfaces facing the interior of the first contact hole CNT 1 and defining a sidewall of the first contact hole CNT 1 .
- the insulating layer 300 is formed, e.g., conformally, on the second light emitting unit 240 .
- the first part 310 is formed, e.g., conformally, in the first contact hole CNT 1 and makes contact with the exposed auxiliary electrode 100 .
- the first electrode part 251 and the second insulating layer IL 2 are formed on the insulating layer 300 .
- FIGS. 9A to 9C are cross-sectional views showing stages in a method of manufacturing a display panel according to an exemplary embodiment.
- components including the pixel circuit layer PC, the insulating layer 300 , and elements disposed between the pixel circuit layer PC and the insulating layer 300 are sequentially stacked on the base substrate BS.
- a method of stacking the pixel circuit layer PC, the insulating layer 300 , and elements disposed between the pixel circuit layer PC and the insulating layer 300 are the same as the manufacturing method described with reference to FIGS. 8A to 8E , and thus details thereof will be omitted.
- the second contact hole CNT 2 is formed through the insulating layer 300 .
- the second contact hole CNT 2 is formed by removing a portion of the first part 310 in the first area A 1 to expose a portion of the auxiliary electrode 100 .
- the portion of the first part 310 may be removed by using a laser drilling method.
- the fourth exposing surface 301 is formed.
- the second electrode 250 is formed on the insulating layer 300 .
- the first electrode part 251 makes contact with the auxiliary electrode 100 exposed through the second contact hole CNT 2 .
- the second insulating layer IL 2 is formed on the second electrode 250 .
- the present disclosure provides a display panel capable of preventing poor emission of an organic light emitting element due to a lateral leakage current.
- the present disclosure also provides a method of manufacturing the display panel, as well as a display device having the display panel.
- a insulating layer is disposed between the conductive thin film layer and the second electrode to insulate the conductive thin film layer from the second electrode. Accordingly, the lateral leakage current may be prevented from flowing through the conductive thin film layer, and defect in light emission of the organic light emitting element may be prevented from occurring due to the lateral leakage current.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A display panel includes an auxiliary electrode on a base substrate, a first electrode spaced from the auxiliary electrode, a first light emitting unit on the auxiliary electrode and the first electrode, an conductive thin film layer on the first light emitting unit, a second light emitting unit on the conductive thin film layer, a first contact hole through the conductive thin film layer to expose the auxiliary electrode, a insulating layer in the first contact hole, and a second electrode including a first electrode part and a second electrode part, the first electrode part being on the insulating layer in the first contact hole, and the second electrode part overlapping the first electrode and being on the second light emitting unit, in which the insulating layer is between the first electrode part and the conductive thin film layer.
Description
- This application is a Continuation of U.S. patent application Ser. No. 16/020,572, filed on Jun. 27, 2018, which is a Divisional application of U.S. patent application Ser. No. 15/646,362, filed on Jul. 11, 2017, now issued as U.S. Pat. No. 10,020,461, which claims priority to and the benefit of Korean Patent Application No. 10-2016-0090947, filed on Jul. 18, 2016, each of which is hereby incorporated by reference for all purposes as if fully set forth herein.
- The present disclosure relates to a display panel and a method of manufacturing the same. More particularly, the present disclosure relates to a display panel capable of preventing a defect in light emission of an organic light emitting element from occurring due to a lateral leakage current, a method of manufacturing the display panel, and a display device having the display panel.
- An organic light emitting device is a self-emissive device and has advantages of a wide viewing angle and a superior contrast ratio. In addition, the organic light emitting device has a fast response speed, a high brightness, and a low driving voltage. In general, the organic light emitting device includes an anode, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode. The hole transport layer, the light emitting layer, the electron transport layer, and the cathode are sequentially stacked on the anode. The hole transport layer, the light emitting layer, and the electron transport layer are organic thin layers, each including an organic compound.
- When different voltages are respectively applied to the anode and the cathode of the organic light emitting device, holes injected from the anode move to the light emitting layer through the hole transport layer, and electrons injected from the cathode move to the light emitting layer through the electron transport layer. The holes are recombined with the electrons in the light emitting layer to generate excitons, and the organic light emitting device emits light by the excitons that return to a ground state from an excited state.
- Embodiments provide a display panel including a base substrate, an auxiliary electrode disposed on the base substrate, a first electrode spaced apart from the auxiliary electrode when viewed in a plan view, a first light emitting unit disposed on the auxiliary electrode and the first electrode, an conductive thin film layer disposed on the first light emitting unit, a second light emitting unit disposed on the conductive thin film layer, a insulating layer including a first part disposed in a first contact hole defined through at least the first light emitting unit, the conductive thin film layer, and the second light emitting unit to expose the auxiliary electrode, and a second electrode including a first electrode part and a second electrode part, the first electrode part being disposed on the first part and including at least a portion disposed in the first contact hole and the second electrode part extending from the first electrode part, overlapped with the first electrode when viewed in a plan view, and disposed on the second light emitting unit. A portion of the first part is disposed between the first electrode part and the conductive thin film layer to insulate the first electrode part from the conductive thin film layer.
- The other portion of the first part is disposed between the first electrode part and the auxiliary electrode.
- The other portion of the first part makes contact with the auxiliary electrode.
- The portion of the first part makes contact with an exposing surface of the conductive thin film layer exposed through the first contact hole.
- A second contact hole is defined in the other portion of the first part to expose at least a portion of an upper surface of the auxiliary electrode, and a portion of the first electrode part is disposed in the second contact hole defined in the insulating layer to make contact with the auxiliary electrode.
- The insulating layer further includes a second part extending from the first part and disposed between the second light emitting unit and the second electrode.
- The display panel further includes a pixel definition layer disposed between the auxiliary electrode and the first electrode when viewed in a plan view, and the insulating layer further includes a third part disposed on the pixel definition layer to connect the first and second parts.
- The second part is overlapped with the first electrode when viewed in a plan view.
- The insulating layer is spaced apart from the first electrode when viewed in a plan view.
- The first light emitting unit generates a first light, and the second light emitting unit generates a light having a color different from a color of the first light.
- The insulating layer has a resistance greater than a resistance of the conductive thin film layer.
- The insulating layer has a thickness from about 1 nm to about 10 nm.
- The insulating layer includes at least one of LiF and LiQ.
- Embodiments also provide a method of manufacturing a display panel, including forming an auxiliary electrode in a first area defined in a base substrate, forming a first electrode in a second area defined in the base substrate and spaced apart from the first area when viewed in a plan view, forming a first light emitting unit on the first electrode, forming an conductive thin film layer on the first light emitting unit, forming a second light emitting unit on the conductive thin film layer, removing at least a portion of the first light emitting unit, the conductive thin film layer, and the second light emitting unit to form a first contact hole through which an upper surface of the auxiliary electrode is exposed, forming a insulating layer on an exposing surface of the conductive thin film layer, which is exposed through the first contact hole, and forming a second electrode on the insulating layer.
- The method further includes removing a portion of the insulating layer to form a second contact hole, through which at least a portion of the upper surface of the auxiliary electrode is exposed, through the insulating layer.
- The forming the second contact hole is performed after the forming the insulating layer and before the forming the second electrode.
- The first light emitting unit, the conductive thin film layer, and the second light emitting unit are removed using a laser drilling method.
- Embodiments also provide a display device including a display panel and a controller controlling the display panel. The display panel includes a base substrate, an auxiliary electrode disposed on the base substrate, a first electrode spaced apart from the auxiliary electrode when viewed in a plan view, a first light emitting unit disposed on the auxiliary electrode and the first electrode, an conductive thin film layer disposed on the first light emitting unit, a second light emitting unit disposed on the conductive thin film layer, a insulating layer including a first part disposed in a first contact hole defined through at least the first light emitting unit, the conductive thin film layer, and the second light emitting unit to expose the auxiliary electrode, and a second electrode including a first electrode part disposed in the first contact hole and disposed on the first par and a second electrode part extending from the first electrode part, overlapped with the first electrode when viewed in a plan view, and disposed on the second light emitting unit. A portion of the first part is disposed between the first electrode part and the conductive thin film layer to insulate the first electrode part from the conductive thin film layer.
- The other portion of the first part is disposed between the first electrode part and the auxiliary electrode.
- The other portion of the first part makes contact with the auxiliary electrode, and the portion of the first part makes contact with an exposing surface of the conductive thin film layer exposed through the first contact hole.
- Additional aspects will be set forth in the detailed description which follows, and, in part, will be apparent from the disclosure, or may be learned by practice of the inventive concept.
- The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter.
- The accompanying drawings, which are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the inventive concept, and, together with the description, serve to explain principles of the inventive concept.
-
FIG. 1 illustrates a plan view of a display device according to an exemplary embodiment of the present disclosure; -
FIG. 2 illustrates a plan view of a display panel according to an exemplary embodiment of the present disclosure; -
FIG. 3A illustrates a cross-sectional view along line I-I′ inFIG. 2 ; -
FIG. 3B illustrates an enlarged cross-sectional view of a first contact hole shown inFIG. 3A ; -
FIG. 3C illustrates an enlarged cross-sectional view of the first contact hole shown inFIG. 3A ; -
FIG. 3D illustrates a cross-sectional view of a display panel according to an exemplary embodiment of the present disclosure; -
FIG. 4 illustrates a plan view of a display panel according to an exemplary embodiment of the present disclosure; -
FIG. 5 illustrates a cross-sectional view along line II-If inFIG. 2 ; -
FIG. 6 illustrates a cross-sectional view of a display panel according to an exemplary embodiment of the present disclosure; -
FIG. 7 illustrates a schematic cross-sectional view of an organic light emitting element according to an exemplary embodiment of the present disclosure; -
FIGS. 8A, 8B, 8C, 8D, 8E, and 8F illustrate cross-sectional views of stages in a method of manufacturing a display panel according to an exemplary embodiment; and -
FIGS. 9A, 9B, and 9C illustrate cross-sectional views of stages in a method of manufacturing a display panel according to an exemplary embodiment. - In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various exemplary embodiments. It is apparent, however, that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring various exemplary embodiments.
- In the accompanying figures, the size and relative sizes of layers, films, panels, regions, etc., may be exaggerated for clarity and descriptive purposes. Also, like reference numerals denote like elements.
- When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it may be directly on, connected to, or coupled to the other element or layer or intervening elements or layers may be present. When, however, an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be construed as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
- Although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and/or section from another element, component, region, layer, and/or section. Thus, a first element, component, region, layer, and/or section discussed below could be termed a second element, component, region, layer, and/or section without departing from the teachings of the present disclosure.
- Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for descriptive purposes, and, thereby, to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and/or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.
- The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms, “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Moreover, the terms “comprises,” “comprising,” “includes,” and/or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
- Various exemplary embodiments are described herein with reference to sectional illustrations that are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, exemplary embodiments disclosed herein should not be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. The regions illustrated in the drawings are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to be limiting.
- Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense, unless expressly so defined herein.
-
FIG. 1 is a plan view showing a display device DD according to an exemplary embodiment of the present disclosure. - Referring to
FIG. 1 , the display device DD may include a display panel DP, a flexible printed circuit board FPC, and a printed circuit board PCB. The display panel DP displays an image through a display area DA. The display area DA is operated by a control signal and image data provided from the printed circuit board PCB. - The display panel DP includes gate lines GL1 to GLn, data lines DL1 to DLm, and sub-pixels SPX, which are arranged in the display area DA. The gate lines GL1 to GLn extend in a first direction DR1 and are arranged, e.g., spaced apart, in a second direction DR2. The data lines DL1 to DLm are insulated from the gate lines GL1 to GLn while crossing the gate lines. For instance, the data lines DL1 to DLm extend in the second direction DR2 and are arranged, e.g., spaced apart, in the first direction DR1. In the following descriptions, a direction substantially parallel to the first and second directions DR1 and DR2 may be referred to as a “horizontal direction”.
- The display panel DP includes a non-display area NDA surrounding the display area DA when viewed in a plan view. The sub-pixels SPX are not arranged in the non-display area NDA, and the image is not displayed through the non-display area NDA. The non-display area NDA may be referred to as a “bezel” of the display device DD.
- Each of the sub-pixels SPX is connected to a corresponding gate line of the gate lines GL1 to GLn and a corresponding data line of the data lines DL1 to DLm. The sub-pixels SPX may be arranged in a matrix form along the first and second directions DR1 and DR2. Each sub-pixel SPX displays one of three primary colors of red, green, and blue colors. The colors displayed by the sub-pixels SPX are not be limited to red, green, and blue colors, and the sub-pixels SPX may display a second primary color of white, yellow, cyan, and magenta colors in addition to the red, green, and blue colors.
- The sub-pixels SPX may form the pixel PX. As an example, four sub-pixels SPX may form one pixel PX, but the number of the sub-pixels SPX required to form one pixel PX is not be limited to four. That is, one pixel PX may include two, three, five, or more sub-pixels SPX.
- The pixel PX serves as an element to display a unit image, and a resolution of the display panel DP is determined by the number of the pixels PX included in the display panel DP.
FIG. 1 shows only one pixel PX, and the other pixels may have the same configurations as the one pixel PX. In the present exemplary embodiment, the display panel DP may be, but not limited to, an organic light emitting display panel, and each sub-pixel SPX may include an organic light emitting element. - The display panel DP may have, for example, a plate-like shape with a pair of short sides and a pair of long sides, which are respectively parallel to the first and second directions DR1 and DR2. In the present exemplary embodiment, the display panel DP may have various shapes. The display panel DP may have a shape curved in at least one direction when viewed in a cross-section, or the display panel DP may have at least one round-shaped edge when viewed in a plan view.
- The flexible printed circuit board FPC connects the display panel DP and the printed circuit board PCB.
FIG. 1 shows only one flexible printed circuit board FPC, but the flexible printed circuit board FPC may be provided in a plural number. The flexible printed circuit boards FPC may be arranged in an edge of the display panel along one direction. In the present exemplary embodiment, the number of the flexible printed circuit boards may vary. - As an example, the flexible printed circuit board FPC includes a driving chip DC. The driving chip DC is mounted in a tape carrier package (TCP) manner and includes a chip implemented as a data driver. The driving chip DC may further include a chip implemented as a gate driver. In addition, the gate driver may be disposed in the non-display area NDA.
- The printed circuit board PCB includes a controller to control the display panel DP. The controller receives input image signals and converts a data format of the input image signals to a data format appropriate to an interface and a driving mode of the data driver, the gate driver, and the display panel DP to generate the image data. The controller outputs the image data and the control signal. The image data include information with respect to the image displayed in the display area DA.
- The data driver receives the image data and the control signal. The data driver converts the image data to data voltages in response to the control signal and applies the data voltages to the data lines DL1 to DLm. The data voltages may be analog voltages corresponding to the image data.
- Various electronic devices may be mounted on the printed circuit board PCB to implement the controller. For instance, the printed circuit board PCB may include a passive device, e.g., a capacitor, a resistor, etc., an active device, e.g., a microprocessor including an integrated circuit, a memory chip, etc., and lines connecting them.
- The display panel DP may further include an
auxiliary electrode 100. Theauxiliary electrode 100 may be disposed between the sub-pixels SPX when viewed in a plan view. - The
auxiliary electrode 100 may have, for example, a grid shape. Theauxiliary electrode 100 includes a plurality of first extension parts 100_a and a plurality of second extension parts 100_b. The first extension parts 100_a extend in the first direction DR1 and are arranged in the second direction DR2. The second extension parts 100_b extend in the second direction DR2 and are arranged in the first direction DR1. The first and second extension parts 100_a and 100_b may be disposed every one sub-pixel SPX along the first and second directions DR1 and DR2, e.g., each of the first extension parts 100_a may be disposed along corresponding rows of sub-pixel SPX in a one-to-one correspondence, and each of the second extension parts 100_b may be disposed along corresponding columns of sub-pixels SPX in a one-to-one correspondence. However, embodiments are not limited thereto or thereby, e.g., the first and second extension parts 100_a and 100_b may be disposed every two sub-pixels SPX along the first and second directions DR1 and DR2. - The
auxiliary electrode 100 may prevent an IR-drop from occurring in the display panel DP. The IR-drop will be described in detail later. -
FIG. 2 is a plan view showing a display panel according to an exemplary embodiment of the present disclosure,FIG. 3A is a cross-sectional view taken along line I-I′ inFIG. 2 ,FIG. 3B is an enlarged cross-sectional view showing a first contact hole inFIG. 3A , andFIG. 3C is an enlarged cross-sectional view showing the first contact hole inFIG. 3A . - Referring to
FIG. 2 , each of the pixels PX may include first, second, third, and fourth sub-pixels SPX1, SPX2, SPX3, and SPX4. The first to fourth sub-pixels SPX1 to SPX4 correspond to an embodiment of the sub-pixels SPX shown inFIG. 1 . - In the present exemplary embodiment, the first, second, third, and fourth sub-pixels SPX1, SPX2, SPX3, and SPX4 respectively correspond to red, green, blue, and white sub-pixels. Each of the first to fourth sub-pixels SPX1 to SPX4 may have, e.g., a substantially quadrangular shape.
- In the present exemplary embodiment, the display panel DP may include a pixel definition layer PDL disposed between the first to fourth sub-pixels SPX1 to SPX4. The pixel definition layer PDL may define a boundary between the first to fourth sub-pixels SPX1 to SPX4 and a boundary between the pixels PX.
- In the present exemplary embodiment, a first contact hole CNT1 is defined through the display panel DP. The first contact hole CNT1 is defined in an area in which the first and second extension parts 100_a and 100_b cross each other.
- Referring to
FIG. 3A , the display panel DP may include a base substrate BS, a pixel circuit layer PC, a first insulating layer ILL an organiclight emitting element 200, a insulatinglayer 300, and a second insulating layer IL2. The base substrate BS may be transparent and may include, e.g., a rigid glass or a flexible polymer. - The pixel circuit layer PC may be disposed on the base substrate BS. The pixel circuit layer PC may include a circuit to drive the organic
light emitting element 200 and at least two transistors. The pixel circuit layer PC may include, e.g., a switching transistor turned on in response to a gate signal applied thereto to transmit the data voltage and a driving transistor applying a driving current corresponding to the data voltage from the switching transistor to the organiclight emitting element 200. - The first insulating layer IL1 may be disposed on the pixel circuit layer PC. The first insulating layer IL1 may include a contact hole defined therethrough to expose a portion of the pixel circuit layer PC. The first insulating layer IL1 has a single- or multi-layer structure of an organic material or an inorganic material.
- In the present exemplary embodiment, the organic
light emitting element 200 may include afirst electrode 210, a firstlight emitting unit 220, an conductivethin film layer 230, a secondlight emitting unit 240, and asecond electrode 250. - In the present exemplary embodiment, the
first electrode 210 may be disposed on the first insulating layer IL1. For example, a first end of thefirst electrode 210 makes contact with the pixel circuit layer PC through the contact hole in the first insulating layer IL1 to receive the driving current from the pixel circuit layer PC. - The base substrate BS includes a first area A1 and a second area A2 spaced apart from the first area A1 in a horizontal direction. A second end of the
first electrode 210 extends from thefirst electrode 210 and is disposed in the second area A2. - The
auxiliary electrode 100 is disposed in the first area A1. Theauxiliary electrode 100 includes a conductive material. Theauxiliary electrode 100 may be a transparent electrode, a semi-transparent electrode, or a non-transparent electrode (or a reflective electrode). In addition, theauxiliary electrode 100 may have a single-layer structure of a single material or plural different materials or a multi-layer structure of layers formed of different materials. - In the present exemplary embodiment, the pixel definition layer PDL is disposed on the
auxiliary electrode 100 and thefirst electrode 210. The pixel definition layer PDL covers an edge of theauxiliary electrode 100 and exposes a center portion of theauxiliary electrode 100. A portion of the pixel definition layer PDL may be disposed between the first and second areas A1 and A2 when viewed in a plan view. The first area A1 may be defined to correspond to the center portion of theauxiliary electrode 100. - The pixel definition layer PDL may cover an edge of the
first electrode 210 and expose a center portion of thefirst electrode 210. The second area A2 may be defined to correspond to the exposed center portion of thefirst electrode 210. - In the present exemplary embodiment, the first
light emitting unit 220 is disposed on the pixel definition layer PDL, thefirst electrode 210, and theauxiliary electrode 100. The firstlight emitting unit 220 generates, e.g., a first light having a first color. The firstlight emitting unit 220 includes a plurality of organic layers. - In the present exemplary embodiment, the conductive
thin film layer 230 may be disposed on the firstlight emitting unit 220. The conductivethin film layer 230 is disposed between the first and secondlight emitting units light emitting units - In the present exemplary embodiment, the second
light emitting unit 240 may be disposed on the conductivethin film layer 230. The secondlight emitting unit 240 generates, e.g., a second light having a second color. The secondlight emitting unit 240 includes a plurality of organic layers. - In the present exemplary embodiment, the organic
light emitting element 200 may be, but is not limited to, a white organic light emitting element. A color obtained by mixing the first and second colors may be white, and the first and second colors may have a complementary color relationship with each other. The first and second lights may be mixed with each other to generate white light. For example, the first and second colors may be respectively blue and yellow colors, but they are not limited thereto or thereby, e.g., the first and second colors may be respectively red and green colors. - The
second electrode 250 may be disposed on the insulatinglayer 300. Thesecond electrode 250 includes afirst electrode part 251 disposed in the first area A1 and asecond electrode part 252 extending from thefirst electrode part 251 and disposed in the second area A2. In more detail, thefirst electrode part 251 and thesecond electrode part 252 are respectively overlapped with theauxiliary electrode 100 and thefirst electrode 210 when viewed in a plan view. - The
second electrode 250 is disposed over the entire surface of the base substrate BS. Accordingly, the IR-drop occurs in thesecond electrode 250 along the horizontal direction, and a brightness of the pixel PX becomes different in accordance with a position of the display panel DP. To prevent the IR-drop from occurring, thesecond electrode 250 may be connected to theauxiliary electrode 100. Since theauxiliary electrode 100 is connected to thesecond electrode 250 through afirst part 310 of the insulatinglayer 300, the IR-drop occurring in thesecond electrode 250 may be prevented from occurring or may be reduced. - In the present exemplary embodiment, the insulating
layer 300 is disposed on the secondlight emitting unit 240, first, second, and third exposingsurfaces auxiliary electrode 100. In the present exemplary embodiment, the insulatinglayer 300 includes thefirst part 310, asecond part 320, and athird part 330. - In detail, at least a portion of the
first part 310, i.e., a first portion of thefirst part 310, is disposed, e.g., conformally along sidewalls, in the first contact hole CNT1. Referring toFIGS. 3B and 3C , the first contact hole CNT1 is defined in the first area A1 and is disposed above theauxiliary electrode 100. The first contact hole CNT1 is defined through the firstlight emitting unit 220, the conductivethin film layer 230, and the secondlight emitting unit 240 to expose theauxiliary electrode 100. InFIGS. 3B and 3C , some elements are not shown for the convenience of explanation of the first contact hole CNT1 and thefirst part 310. For instance, the insulatinglayer 300 and layers disposed above the insulatinglayer 300 are not shown inFIG. 3C . - In the following descriptions, the expression “a contact hole is defined in a layer” means that a space obtained by partially removing the layer is defined as the contact hole. Accordingly, the first contact hole CNT1 may be defined by an empty space (an area hatched with dots in
FIGS. 3B and 3C ) formed by partially removing the firstlight emitting unit 220, the conductivethin film layer 230, and the secondlight emitting unit 240. - At least a portion of an upper surface of the
auxiliary electrode 100, the first exposingsurface 221 of the firstlight emitting unit 220, the second exposingsurface 231 of the conductivethin film layer 230, and the third exposingsurface 241 of the secondlight emitting unit 240 are exposed through the first contact hole CNT1. Since the first portion of thefirst part 310 is disposed in the first contact hole CNT1, the first portion of thefirst part 310 may be disposed only in an area surrounded by the first, second, and third exposingsurfaces - The first portion of the
first part 310 is disposed between the conductivethin film layer 230 and thefirst electrode part 251. A lower surface of the first portion of thefirst part 310 makes contact with the first, second, and third exposingsurfaces first portion 310 makes contact with thefirst electrode part 251. - In the present exemplary embodiment, a second portion of the
first part 310 is disposed between thefirst electrode part 251 and theauxiliary electrode 100 to electrically connect thefirst electrode part 251 to theauxiliary electrode 100. A lower surface of the second portion of thefirst part 310 makes contact with theauxiliary electrode 100. For example, referring toFIG. 3A , the second portion of thefirst part 310 is a portion extending in parallel to the base substrate BS, i.e., on a bottom of the first contact hole CNT1, on theauxiliary electrode 100, and the first portion of thefirst part 310 is a portion extending from the second portion along sidewalls of the first contact hole CNT1. - In the present exemplary embodiment, the
second part 320 is disposed in the second area A2. Thesecond part 320 is disposed on thesecond electrode part 252 and disposed between the secondlight emitting unit 240 and thesecond electrode part 252 in the second area A2. - In the present exemplary embodiment, the
third part 330 is disposed between the first andsecond parts second parts third part 330 is disposed on the pixel definition layer PDL. - The insulating
layer 300 prevents the lateral leakage current from flowing through the conductivethin film layer 230. If the insulatinglayer 300 were to be omitted, the conductivethin film layer 230 would directly contact thefirst electrode part 251 in the first contact hole CNT1, causing a first voltage applied to thefirst electrode part 251 to be applied to the conductivethin film layer 230, thereby causing lateral leakage current through the conductivethin film layer 230 in the first contact hole CNT1. Accordingly, the lateral leakage current could pass through the firstlight emitting unit 220. In addition, a leakage voltage could be applied in the second area A2 due to the lateral leakage current. The leakage voltage may be voltage obtained by voltage-dividing the voltage applied in the first contact hole CNT1 along a path of the lateral leakage current. The leakage voltage is greater than the voltage applied to thefirst electrode 210 and smaller than the first voltage. - If lateral leakage current and leakage voltage are applied in the second areas A2, light emission of the light emitted from the first
light emitting unit 220 may be poor (hereinafter, referred to as a “poor light emission”). For instance, if lateral leakage current and leakage voltage are applied in the second areas A2, e.g., when the insulatinglayer 300 is omitted, when voltage corresponding to zero (0) grayscale level is applied to thefirst electrode 210, the firstlight emitting unit 220 may emit light or generate light corresponding to a grayscale level different from the grayscale level of the voltage applied to thefirst electrode 210. - In contrast, according to the present exemplary embodiment, the insulating
layer 300 may insulate the conductivethin film layer 230 from thesecond electrode 250, thereby preventing the lateral leakage current and the leakage voltage between the conductivethin film layer 230 and thefirst electrode part 251, which in turn, prevents or substantially minimizes poor light emission from occurring in the organiclight emitting element 200. In more detail, the first portion of the insulatinglayer 300 along a sidewall of the first contact hole CNT1 may, e.g., completely or partially, insulate the conductivethin film layer 230 from thesecond electrode 250. - In the case that the insulating
layer 300 completely insulates the conductivethin film layer 230 from thesecond electrode 250, the lateral leakage current does not flow to the conductivethin film layer 230 from thefirst electrode part 251, and the leakage voltage is not applied to thefirst part 310. In the case that the insulatinglayer 300 partially insulates the conductivethin film layer 230 from thesecond electrode 250, a lateral leakage current equal to or smaller than a critical current may flow, and leakage voltage equal to or smaller than a critical voltage may be applied to thesecond part 320. When the leakage voltage is smaller than the critical voltage and the lateral leakage current is smaller than the critical current, the firstlight emitting unit 220 may not emit the light, e.g., may not emit light corresponding to voltage and/or current smaller than respective critical values. - The insulating
layer 300 has a resistance determined such that poor light emission is prevented. The resistance of the insulatinglayer 300 is greater than a resistance of the conductivethin film layer 230. The insulatinglayer 300 has a thickness determined such that thefirst electrode part 251 is electrically connected to theauxiliary electrode 100 and the conductivethin film layer 230 is insulated from thefirst electrode part 251. - The thickness of the insulating
layer 300 is in a range from about 1 nm to about 10 nm. The insulatinglayer 300 is required to have the above indicated thickness, and thus the insulatinglayer 300 may have an insulating function in the first area A1. In addition, it is preferred that the insulatinglayer 300 has the above indicated thickness to perform an electron injection/transport function or a hole injection/transport function in the second area A2. These will be described in detail with reference toFIG. 7 . According to the above, in the present exemplary embodiment, the insulatinglayer 300 insulates the conductivethin film layer 230 from thesecond electrode 250, and thus poor light emission of the organiclight emitting element 200 due to the lateral leakage current may be prevented from occurring, and the organiclight emitting element 200 may be stably driven. - Each of the first and
second electrodes second electrodes second electrodes - In the case that each of the first and
second electrodes second electrodes second electrodes second electrodes - In the present exemplary embodiment, the organic
light emitting element 200 may be a rear surface light emitting type or a front surface light emitting type. In the case that the organiclight emitting element 200 is a rear surface light emitting type, thefirst electrode 210 is provided as a transparent or semi-transparent electrode, and thesecond electrode 250 is a reflective electrode. In this case, white light exits to the outside through thefirst electrode 210. In the case that the organiclight emitting element 200 is a front surface light emitting type, thefirst electrode 210 is provided as a reflective electrode, thesecond electrode 250 is a transparent or semi-transparent electrode, and accordingly, white light exits to the outside through thesecond electrode 250. - As an example, the organic
light emitting element 200 may have a non-inverted structure or an inverted structure. When the organiclight emitting element 200 has a non-inverted structure, thefirst electrode 210 is an anode, thesecond electrode 250 is a cathode, and a voltage applied to thefirst electrode 210 is greater than a voltage applied to thesecond electrode 250. On the contrary, when the organiclight emitting element 200 has an inverted structure, thefirst electrode 210 is the cathode, thesecond electrode 250 is the anode, and the voltage applied to thefirst electrode 210 is smaller than the voltage applied to thesecond electrode 250. -
FIG. 3D is a cross-sectional view showing a display panel according to an exemplary embodiment of the present disclosure. The display panel DP inFIG. 3D is substantially the same as the display panel DP inFIG. 3A , with the exception of the first contact hole and the first part extending deeper than those inFIG. 3A . - Referring to
FIG. 3D , the pixel circuit layer PC includes a transistor TR. The transistor TR includes a gate electrode GE, a source electrode SE, a drain electrode DE, and a semiconductor layer SL. The semiconductor layer SL is disposed on the base substrate BS. A first transistor insulating layer TRI1 is disposed on the semiconductor layer SL. A second transistor insulating layer TRI2 is disposed above the first transistor insulating layer TRI1. The source electrode SE and the drain electrode DE are disposed on the second transistor insulating layer TRI2 and spaced apart from each other. - The source electrode SE is connected to one end of the semiconductor layer SL through a contact hole defined through the first and second transistor insulating layers TRI1 and TRI2, and the drain electrode DE is connected to the other end of the semiconductor layer SL through a contact hole defined through the first and second transistor insulating layers TRI1 and TRI2. The transistor TR applies voltage applied to the source electrode SE to the
first electrode 210 through the drain electrode DE in response to a control signal applied to the gate electrode GE. - The
auxiliary electrode 100 is disposed between the first insulating layer IL1 and the second transistor insulating layer TRI2, and the first insulating layer IL1 includes an intermediate contact hole CNT_M defined therethrough to expose theauxiliary electrode 100. That is, the upper surface of theauxiliary electrode 100 is exposed through the intermediate contact hole CNT_M. Portions of the first and secondlight emitting units - The first contact hole CNT1 is defined through the portions of the first and second
light emitting units auxiliary electrode 100 is exposed through the first contact hole CNT1. For example, as illustrated inFIG. 3D , the first and intermediate contact holes CNT1 and CNT_M may be in fluid communication with each other, e.g., portions of the firstlight emitting unit 220 may extend along sidewalls of the first contact hole CNT1 and continuously extend along sidewall of the intermediate contact hole CNT_M. For example, as further illustrated inFIG. 3D , the intermediate contact hole CNT_M may be between the first contact hole CNT1 and sidewalls of the first insulating layer ILL e.g., the intermediate contact hole CNT_M may extend radially from the first contact hole CNT1 toward the sidewalls of the first insulating layer IL1. - In the present exemplary embodiment, the
first part 310 of the insulatinglayer 300 is disposed in the first contact hole CNT1. At least the portion of an upper surface of theauxiliary electrode 100, the first exposingsurface 221 of the firstlight emitting unit 220, the second exposingsurface 231 of the conductivethin film layer 230, and the third exposingsurface 241 of the secondlight emitting unit 240 are exposed through the first contact hole CNT1. Since thefirst part 310 is disposed in the first contact hole CNT1, thefirst part 310 may be disposed only in the area surrounded by the first, second, and third exposingsurfaces first electrode part 251. - The first portion of the
first part 310, e.g., on sidewalls of the first contact hole CNT1, is disposed between the conductivethin film layer 230 and thefirst electrode part 251. A lower surface of the portion of thefirst part 310 makes contact with the first, second, and third exposingsurfaces first portion 310 makes contact with thefirst electrode part 251. In the present exemplary embodiment, the second portion of thefirst part 310, e.g., on a bottom of the first contact hole CNT1, is disposed between thefirst electrode part 251 and theauxiliary electrode 100 to electrically connect thefirst electrode part 251 to theauxiliary electrode 100. A lower surface of the second portion of thefirst part 310 makes contact with theauxiliary electrode 100. In addition, according to another embodiment, theauxiliary electrode 100 may be disposed between the first and second transistor insulating layers TRI1 and TRI2. The first contact hole CNT1 is defined in the first transistor insulating layer TRI1 to expose the upper surface of theauxiliary electrode 100, and thefirst portion 310 may be disposed in the first contact hole CNT1. -
FIG. 4 is a plan view showing a display panel according to an exemplary embodiment of the present disclosure, andFIG. 5 is a cross-sectional view taken along line II-II′ inFIG. 2 . The display panel DP inFIGS. 4 and 5 is substantially the same as the display panel DP shown inFIGS. 2-3 , except for a second contact hole CNT2 and the conductive thin film layer. Thus different features of the second contact hole CNT2 and the conductive thin film layer will be mainly described, and details of the others will be omitted. - Referring to
FIG. 4 , the second contact hole CNT2 may be further defined in the display panel DP. The second contact hole CNT2 may be defined in the first contact hole CNT1 when viewed in a plan view. - Referring to
FIG. 5 , the second contact hole CNT2 is defined in the first area A1 above theauxiliary electrode 100. The second contact hole CNT2 is defined through the insulatinglayer 300. In more detail, the second contact hole CNT2 is defined in thefirst part 310, and at least a portion of an upper surface of theauxiliary electrode 100 and a fourth exposingsurface 301 of the insulatinglayer 300 are exposed through the second contact hole CNT2. - In the present exemplary embodiment, at least a portion of the
first electrode part 251 is disposed in the second contact hole CNT2 and makes contact with the portion of theauxiliary electrode 100 exposed through the second contact hole CNT2. As described above, since thesecond electrode 250 is directly connected to theauxiliary electrode 100, a voltage drop does not occur between thesecond electrode 250 and theauxiliary electrode 100. Accordingly, the IR-drop may be effectively prevented, and a voltage-current characteristic of the organiclight emitting element 200 may be improved. -
FIG. 6 is a cross-sectional view showing a display panel according to an exemplary embodiment of the present disclosure. The display panel DP inFIG. 6 is substantially the same as the display panel DP shown inFIG. 5 , except for the insulating layer. Thus different features of the insulating layer will be mainly described, and details of the others will be omitted. - Referring to
FIG. 6 , the insulatinglayer 300 is not disposed in the second area A2. The insulatinglayer 300 is disposed spaced apart from the second area A2 without being overlapped with the second area A2 when viewed in a plan view. In other words, the second andthird parts - In the present exemplary embodiment, the insulating
layer 300 is not disposed between organic layers of the organiclight emitting element 200 in the second area A2. Accordingly, the insulatinglayer 300 does not exert an influence on the balance of electric charge and the voltage-current characteristic of the organiclight emitting element 200. Thus, a design of the organiclight emitting element 200 to maintain the electric charge balance and a design of the insulatinglayer 300 to prevent the lateral leakage current from occurring may be independently performed. -
FIG. 7 is a schematic cross-sectional view of the organiclight emitting element 200. - Referring to
FIG. 7 , the firstlight emitting unit 220 includes a first hole control layer HCL1, a first light emitting layer EML1, and a first electron control layer ECL1. The secondlight emitting unit 240 includes a second hole control layer HCL2, a second light emitting layer EML2, and a second electron control layer ECL2. - The first and second light emitting layers EML1 and EML2 are disposed between the
first electrode 210 and thesecond electrode 250. In the present exemplary embodiment, each of the first and second light emitting layers EML1 and EML2 includes a host material and a dopant material. Each of the first and second light emitting layers EML1 and EML2 is formed by applying a fluorescent material or a phosphorescent material to the host material. - As the host, for example, Alq3(tris(8-hydroxyquinolino)aluminum), CBP(4,4′-bis(N-carbazolyl)-1,1′-biphenyl), PVK(poly(n-vinylcabazole), ADN(9,10-di(naphthalene-2-yl)anthracene), TCTA(4,4′,4″-Tris(carbazol-9-yl)-triphenylamine), TPBi(1,3,5-tris(N-phenylbenzimidazole-2-yl)benzene), TBADN(3-tert-butyl-9,10-di(naphth-2-yl)anthracene), DSA(distyrylarylene), CDBP(4,4′-bis(9-carbazolyl)-2,2″-dimethyl-biphenyl), MADN(2-Methyl-9,10-bis(naphthalen-2-yl)anthracene) may be used. However, embodiments are not limited thereto or thereby.
- Colors of the light emitting layers may be determined by a combination of the host material and the dopant material. For instance, when the light emitting layers emit red light, the light emitting layers may include a fluorescent material containing, e.g., PBD:Eu(DBM)3(Phen)(tris(dibenzoylmethanato)phenanthoroline europium) or Perylene. When the light emitting layers emit the red light, the dopant included in the organic light emitting layers may be a metal complex, e.g., PIQIr(acac)(bis(1-phenylisoquinoline)acetylacetonate iridium), PQIr(acac)(bis(1-phenylquinoline)acetylacetonate iridium), PQIr(tris(1-phenylquinoline)iridium), PtOEP(octaethylporphyrin platinum), etc., or organometallic complex.
- When the light emitting layers emit green light, the light emitting layers may include a fluorescent material containing, e.g., Alq3(tris(8-hydroxyquinolino)aluminum). When the light emitting layers emit the green light, the dopant included in the light emitting layers may be a metal complex, e.g., Ir(ppy)3(fac-tris(2-phenylpyridine)iridium), or organometallic complex.
- When the light emitting layers emit blue light, the light emitting layers may include a fluorescent material including, e.g., any one from the groups consisting of spiro-DPVBi, spiro-6P, DSB(distyryl-benzene), DSA(distyryl-arylene), PFO(Polyfluorene)-based polymer, and PPV(poly(p-phenylene vinylene)-based polymer. When the light emitting layers emits blue light, the dopant included in the light emitting layers may be a metal complex, e.g., (4,6-F2ppy)2Irpic, or organometallic complex.
- The first light emitting layer EML1 generates light having a wavelength shorter than a wavelength of a light generated by the second light emitting layer EML2. As described above, the first light may be the blue light and have a wavelength range equal to or greater than about 450 nm and equal to or smaller than about 595 nm. As described above, the second light may be the yellow light and have a wavelength range equal to or greater than about 570 nm and equal to or smaller than about 590 nm.
- Meanwhile, the first and second light emitting layers EML1 and EML2 may be designed to generate lights having various colors according to embodiments. The first and second light emitting layers EML1 and EML2 may be formed by various methods, e.g., a vacuum deposition method, a spin coating method, a cast method, an LB (Langmuir-Blodgett) method, an inkjet printing method, a laser printing method, an LITI (Laser Induced Thermal Imaging) method, etc.
- The conductive
thin film layer 230 is disposed between the first and second light emitting layers EML1 and EML2 to improve a current efficiency and a light efficiency of the organiclight emitting element 200. When voltage is applied to the conductivethin film layer 230, the conductivethin film layer 230 generates electric charges by a complex formation due to oxidation-reduction reaction. - In the present exemplary embodiment, the conductive
thin film layer 230 may include first and second conductive thin film layers 231 and 232 sequentially stacked. The first and second conductive thin film layers 231 and 232 may be respectively N-type and P-type conductive thin film layers. The N-type conductive thin film layer may include an alkali metal, e.g., Li, Na, K, Cs, or the like, or an organic layer doped with an alkali earth metal, e.g., Mg, Sr, Ba, Ra, or the like, but it should not be limited thereto or thereby. The P-type conductive thin film layer may include an organic layer with a P-type dopant, but it should not be limited thereto or thereby. - The first hole control layer HCL1 is disposed between the
first electrode 210 and the first light emitting layer EML1. The second hole control layer HCL2 is disposed between theelectric charge layer 230 and the second light emitting layer EML2. - When the
first electrode 210 is an anode electrode layer, holes injected from thefirst electrode 210 are provided to the first light emitting layer EML1 through the first hole control layer HCL1. The holes generated by the conductivethin film layer 230 are provided to the second light emitting layer EML2 through the second hole control layer HCL2. - Each of the first and second hole control layers HCL1 and HCL2 may correspond to at least one of a hole injection area, a hole transport area, a buffer area, and an electron block area. Each of the first and second hole control layers HCL1 and HCL2 may have a single-layer structure of a single material or plural different materials or a multi-layer structure of layers formed of different materials.
- For instance, each of the first and second hole control layers HCL1 and HCL2 may include at least one of a hole injection layer corresponding to the hole injection layer, a hole transport layer corresponding to the hole transport area, and a single layer having a hole injection function and a hole transport function.
- Each of the first and second hole control layers HCL1 and HCL2 may include at least one of a hole injection material and a hole transport material. The hole injection material and the hole transport material may be known materials.
- The hole transport material may include, but not limited to, e.g., carbazole-based derivatives, e.g., n-phenyl carbazole, polyvinyl carbazole, etc., fluorine-based derivatives, triphenylamine-based derivatives, e.g., TPD(N,N-bis(3-methylphenyl)-N,N-diphenyl[1,1-biphenyl]-4,4′-diamine), TCTA(4,4′,4″-tris(N-carbazolyl)triphenylamine), etc., NPB(N,N′-di(1-naphthyl)-N,N′-diphenylbenzidine), or TAPC(4,4′-Cyclohexylidene bis[N,N-bis(4-methylphenyl)benzenamine]). The hole injection material may include, but not limited to, at least one of a phthalocyanine compound such as copper phthalocyanine, DNTPD (N,N′-diphenyl-N,N′-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4′-diamine), m-MTDATA(4,4′,4″-tris(3-methylphenylphenylamino)triphenylamine), TDATA(4,4′4″-Tris(N,N-diphenylamino)triphenylamine), 2TNATA(4,4′,4″-tris{N,-(2-naphthyl)-N-phenylamino}-triphenylamine), PEDOT/PSS(Poly(3,4-ethylenedioxythiophene)/Poly(4-styrenesulfonate), PANI/DBSA(Polyaniline/Dodecylbenzenesulfonic acid), PANI/CSA(Polyaniline/Camphor sulfonicacid), PANI/PSS((Polyaniline)/Poly(4-styrenesulfonate), etc.
- Each of the first and second hole control layers HCL1 and HCL2 may be formed by similar process of forming the first and second light emitting layers EML1 and EML2. For instance, each of the first and second hole control layers HCL1 and HCL2 may be formed by various methods, e.g., a vacuum deposition method, a spin coating method, a cast method, an LB (Langmuir-Blodgett) method, an inkjet printing method, a laser printing method, an LITI (Laser Induced Thermal Imaging) method, etc.
- Meanwhile, each of the first and second hole control layers HCL1 and HCL2 may include a hole block layer corresponding to the hole block area. In this case, each of the first and second hole control layers HCL1 and HCL2 may include a hole block material. In addition, each of the first and second hole control layers HCL1 and HCL2 may further include an electric charge generating material.
- The first electron control layer ECL1 is disposed between the first light emitting layer EML1 and the conductive
thin film layer 230. The electrons generated by the conductivethin film layer 230 are provided to the first light emitting layer EML1 through the first electron control layer ECL1. - The second electron control layer ECL2 is disposed between the second light emitting layer EML2 and the
second electrode 250. When thesecond electrode 250 is a cathode electrode layer, the electrons injected from thesecond electrode 250 are provided to the second light emitting layer EML2 through the insulatinglayer 300 and the second electron control layer ECL2. - Each of the first and second electron control layers ECL1 and ECL2 may correspond to at least one of an electron injection area, an electron transport area, and a hole block area. Each of the first and second electron control layers ECL1 and ECL2 may have a single-layer structure of a single material or plural different materials or a multi-layer structure of layers formed of different materials.
- For instance, each of the first and second electron control layers ECL1 and ECL2 may include at least one of an electron injection layer corresponding to the electron injection layer, an electron transport layer corresponding to the electron transport area, and a single layer having an electron injection function and an electron transport function.
- Each of the first and second electron control layers ECL1 and ECL2 may include at least one of an electron transport material and an electron injection material. For instance, the electron transport material may include, but not limited to, Alq3(Tris(8-hydroxyquinolinato)aluminum), TPBi(1,3,5-Tri(1-phenyl-1H-benzo[d]imidazol-2-yl)phenyl), BCP(2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline), Bphen(4,7-Diphenyl-1,10-phenanthroline), TAZ(3-(4-Biphenylyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole), NTAZ(4-(Naphthalen-1-yl)-3,5-diphenyl-4H-1,2,4-triazole), tBu-PBD(2-(4-Biphenylyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole), BAlq(Bis(2-methyl-8-quinolinolato-N1,O8)-(1,1′-Biphenyl-4-olato)aluminum), Bebq2(berylliumbis(benzoquinolin-10-olate), ADN(9,10-di(naphthalene-2-yl)anthracene), or a compound thereof.
- In addition, the electron injection material may include a lanthanide-based metal, e.g., LiF, LiQ (Lithium quinolate), Li2O, BaO, NaCl, CsF, Yb, etc., or a metal halide, e.g., RbCl, RbI, etc., but it should not be limited thereto or thereby. The electron transport layer may include a mixture of an electron transport material and an organo metal salt with insulating property.
- The organo metal salt has an energy band gap of about 4 eV or more. In detail, the organo metal salt may include, e.g., metal acetate, metal benzoate, metal acetoacetate, metal acetylacetonate, or metal stearate.
- Each of the first and second electron control layers ECL1 and ECL2 may be formed by various methods, e.g., a vacuum deposition method, a spin coating method, a cast method, an LB (Langmuir-Blodgett) method, an inkjet printing method, a laser printing method, an LITI (Laser Induced Thermal Imaging) method, etc.
- The organic
light emitting element 200 according to the present disclosure should not be limited to the above-mentioned structure and function. For instance, the organiclight emitting element 200 may include three light emitting units and two conductive thin film layers interposed between the three light emitting units. In this structure, the insulatinglayer 300 may insulate the two conductive thin film layers from thesecond electrode 250. - As an example, the insulating
layer 300 corresponds to a separate component disposed on the secondlight emitting unit 240, but the present disclosure should not be limited thereto or thereby. That is, the insulatinglayer 300 may be provided as a layer that performs a function of the secondlight emitting unit 240. For instance, the insulatinglayer 300 may correspond to the electron injection area, and the second electron control layer ECL2 of the secondlight emitting unit 240 may include the electron transport area and the hole block area. In this structure, the insulatinglayer 300 may perform a function of the electron injection area of the secondlight emitting unit 240. Similarly, the insulatinglayer 300 may be not only the electron injection area but also the electron transport area and the hole block area. In addition, in the case that the organiclight emitting element 200 has the inverted structure, the insulatinglayer 300 may be one of the hole injection area, the hole transport area, and the electron block area. - The insulating
layer 300 may include, for example, at least one of LiQ and LiF. As an example, in the non-inverted structure, the insulatinglayer 300 may include the host material of the first and second hole control layers HCL1 and HCL2 to block the injection/transport of the electrons or a material of the first and second electron control layers ECL1 and ECL2, which has a low electron conductivity. Accordingly, the electrons injected from thefirst electrode part 251 that is the cathode are blocked, and thus the lateral leakage current may be effectively prevented. - The insulating
layer 300 has a thickness of about 1 nm to about 10 nm. When the thickness of the insulatinglayer 300 is smaller than about 1 nm, the insulatinglayer 300 may not be sufficiently thick to properly perform an insulating function with respect to the conductivethin film layer 230 in the first area A1 (refer toFIG. 3A ). When the thickness of the insulatinglayer 300 exceeds about 10 nm, the insulatinglayer 300 may be too thick to perform the function of the electron injection/transport with respect to the secondlight emitting unit 240 in the second area A2 (refer toFIG. 3A ). - As an example, in the inverted structure, the insulating
layer 300 may include the host material of the first and second electron control layers ECL1 and ECL2 to block the injection/transport of the holes or a material of the first and second hole control layers HCL1 and HCL2, which has a low hole conductivity. Accordingly, the holes injected from thefirst electrode part 251 that is the anode are blocked, and thus the lateral leakage current may be effectively prevented. -
FIGS. 8A to 8F are cross-sectional views showing stages in a method of manufacturing a display panel according to an exemplary embodiment. - Referring to
FIG. 8A , the pixel circuit layer PC is formed on the base substrate BS, and the first insulating layer IL1 is formed on the pixel circuit layer PC. A driving contact hole CNT_Dr is formed through the first insulating layer IL1. A portion of the pixel circuit layer PC is exposed through the driving contact hole CNT_Dr. - Referring to
FIG. 8B , thefirst electrode 210 and theauxiliary electrode 100 are formed on the first insulating layer IL1. As described above, the first end of thefirst electrode 210 is disposed in the driving contact hole CNT_Dr formed through the first insulating layer IL1 and makes contact with the pixel circuit layer PC. The second end of thefirst electrode 210 extends from the first end of thefirst electrode 210 and is disposed in the second area A2. Theauxiliary electrode 100 is spaced apart from thefirst electrode 210 and disposed in the first area - Al.
- As shown in
FIG. 8C , the pixel definition layer PDL is formed on thefirst electrode 210 and theauxiliary electrode 100. Then, the firstlight emitting unit 220, the conductivethin film layer 230, and the secondlight emitting unit 240 are sequentially formed on the pixel definition layer PDL, thefirst electrode 210, and theauxiliary electrode 100. - Referring to
FIG. 8D , the first contact hole CNT1 is formed in the first area A1. The first contact hole CNT1 is formed by removing portions (hereinafter, referred to as “removed layers”) of the firstlight emitting unit 220, the conductivethin film layer 230, and the secondlight emitting unit 240 in the first area A1 to expose a portion, e.g., of the upper surface, of the firstauxiliary electrode 100. As an example, since the removed layers are removed, the first, second, and third exposingsurfaces surfaces 221 through 241 are lateral surfaces facing the interior of the first contact hole CNT1 and defining a sidewall of the first contact hole CNT1. - Referring to
FIG. 8E , the insulatinglayer 300 is formed, e.g., conformally, on the secondlight emitting unit 240. Thefirst part 310 is formed, e.g., conformally, in the first contact hole CNT1 and makes contact with the exposedauxiliary electrode 100. Then, as shown inFIG. 8F , thefirst electrode part 251 and the second insulating layer IL2 are formed on the insulatinglayer 300. -
FIGS. 9A to 9C are cross-sectional views showing stages in a method of manufacturing a display panel according to an exemplary embodiment. - Referring to
FIG. 9A , components including the pixel circuit layer PC, the insulatinglayer 300, and elements disposed between the pixel circuit layer PC and the insulatinglayer 300 are sequentially stacked on the base substrate BS. A method of stacking the pixel circuit layer PC, the insulatinglayer 300, and elements disposed between the pixel circuit layer PC and the insulatinglayer 300 are the same as the manufacturing method described with reference toFIGS. 8A to 8E , and thus details thereof will be omitted. - Referring to
FIG. 9B , the second contact hole CNT2 is formed through the insulatinglayer 300. The second contact hole CNT2 is formed by removing a portion of thefirst part 310 in the first area A1 to expose a portion of theauxiliary electrode 100. As an example, the portion of thefirst part 310 may be removed by using a laser drilling method. When the portion of thefirst part 310 is removed, the fourth exposingsurface 301 is formed. - As shown in
FIG. 9C , thesecond electrode 250 is formed on the insulatinglayer 300. Thefirst electrode part 251 makes contact with theauxiliary electrode 100 exposed through the second contact hole CNT2. The second insulating layer IL2 is formed on thesecond electrode 250. - By way of summation and review, the present disclosure provides a display panel capable of preventing poor emission of an organic light emitting element due to a lateral leakage current. The present disclosure also provides a method of manufacturing the display panel, as well as a display device having the display panel.
- That is, according to embodiments, a insulating layer is disposed between the conductive thin film layer and the second electrode to insulate the conductive thin film layer from the second electrode. Accordingly, the lateral leakage current may be prevented from flowing through the conductive thin film layer, and defect in light emission of the organic light emitting element may be prevented from occurring due to the lateral leakage current.
- Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated. Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.
Claims (13)
1. A display panel comprising:
a base substrate including:
a display area including a first area and a second area; and
a non-display area adjacent to the display area;
an auxiliary electrode on the first area of the base substrate;
a first electrode on the second area of the base substrate;
a first light emitting unit on the auxiliary electrode and the first electrode;
a conductive thin film layer on the first light emitting unit;
a second light emitting unit on the conductive thin film layer;
an insulating layer on the second light emitting unit; and
a second electrode on the insulating layer,
wherein the insulating layer includes a first part covering a first contact hole that penetrates the first light emitting unit, the conductive thin film layer, and the second light emitting unit, which overlap with the first area, to expose a portion of the auxiliary electrode, and
wherein a portion of the first part insulates the second electrode from the conductive thin film layer.
2. The display panel of claim 1 , wherein the portion of the first part is in contact with an exposing surface of the conductive thin film layer, which defines a portion of the first contact hole.
3. The display panel of claim 1 , wherein another portion of the first part is in contact with the auxiliary electrode.
4. The display panel of claim 1 , wherein the insulating layer further includes:
a second part overlapping with the first electrode; and
a third part between the first part and the second part.
5. The display panel of claim 4 , further comprising a pixel definition layer between the first electrode and the auxiliary electrode,
wherein at least a portion of the third part overlaps with the pixel definition layer.
6. The display panel of claim 1 , wherein the insulating layer is spaced apart from the first electrode.
7. The display panel of claim 1 , wherein the first light emitting unit generates first light, and the second light emitting unit generates light having a color different from a color of the first light.
8. The display panel of claim 1 , wherein a resistance of the insulating layer is greater than a resistance of the conductive thin film layer.
9. The display panel of claim 1 , wherein a thickness of the insulating layer is 10 nm or less.
10. The display panel of claim 1 , wherein the insulating layer includes at least one of LiF and LiQ.
11. A display panel comprising:
a base substrate including:
a display area including a first area and a second area; and
a non-display area adjacent to the display area;
an auxiliary electrode on the first area of the base substrate;
a first electrode on the second area of the base substrate;
a first light emitting unit on the auxiliary electrode and the first electrode;
a conductive thin film layer on the first light emitting unit;
a second light emitting unit on the conductive thin film layer;
an insulating layer on the second light emitting unit; and
a second electrode on the insulating layer,
wherein the insulating layer includes a first part covering a first contact hole that penetrates the first light emitting unit, the conductive thin film layer, and the second light emitting unit, which overlap with the first area, and is defined by exposed side surfaces,
wherein the first contact hole exposes a portion of the auxiliary electrode, and
wherein a portion of the first part is in contact with a side surface of the second electrode, which defines a portion of the first contact hole.
12. The display panel of claim 11 , wherein the portion of the first part is in contact with an exposing surface of the conductive thin film layer, which defines a portion of the first contact hole.
13. The display panel of claim 11 , wherein another portion of the first part is in contact with the auxiliary electrode.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/593,060 US10600986B1 (en) | 2016-07-18 | 2019-10-04 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
US16/820,072 US10991903B2 (en) | 2016-07-18 | 2020-03-16 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2016-0090947 | 2016-07-18 | ||
KR1020160090947A KR102543639B1 (en) | 2016-07-18 | 2016-07-18 | Display panel, manufacturing method thereof and display apparatus having the same |
US15/646,362 US10020461B2 (en) | 2016-07-18 | 2017-07-11 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
US16/020,572 US10439161B2 (en) | 2016-07-18 | 2018-06-27 | Method of manufacturing a display panel capable of preventing a defect in light emission of an organic light emitting element |
US16/593,060 US10600986B1 (en) | 2016-07-18 | 2019-10-04 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/020,572 Continuation US10439161B2 (en) | 2016-07-18 | 2018-06-27 | Method of manufacturing a display panel capable of preventing a defect in light emission of an organic light emitting element |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/820,072 Continuation US10991903B2 (en) | 2016-07-18 | 2020-03-16 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
Publications (2)
Publication Number | Publication Date |
---|---|
US20200075884A1 true US20200075884A1 (en) | 2020-03-05 |
US10600986B1 US10600986B1 (en) | 2020-03-24 |
Family
ID=59350732
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/646,362 Active US10020461B2 (en) | 2016-07-18 | 2017-07-11 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
US16/020,572 Active US10439161B2 (en) | 2016-07-18 | 2018-06-27 | Method of manufacturing a display panel capable of preventing a defect in light emission of an organic light emitting element |
US16/593,060 Active US10600986B1 (en) | 2016-07-18 | 2019-10-04 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
US16/820,072 Active US10991903B2 (en) | 2016-07-18 | 2020-03-16 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/646,362 Active US10020461B2 (en) | 2016-07-18 | 2017-07-11 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
US16/020,572 Active US10439161B2 (en) | 2016-07-18 | 2018-06-27 | Method of manufacturing a display panel capable of preventing a defect in light emission of an organic light emitting element |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/820,072 Active US10991903B2 (en) | 2016-07-18 | 2020-03-16 | Display panel capable of preventing a defect in light emission of an organic light emitting element |
Country Status (6)
Country | Link |
---|---|
US (4) | US10020461B2 (en) |
EP (1) | EP3273499B1 (en) |
JP (1) | JP6875218B2 (en) |
KR (3) | KR102543639B1 (en) |
CN (2) | CN113299843B (en) |
TW (1) | TWI762495B (en) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111628101A (en) | 2015-10-26 | 2020-09-04 | Oti照明公司 | Method for patterning a surface overlayer and device comprising a patterned overlayer |
KR102470303B1 (en) * | 2015-10-27 | 2022-11-28 | 삼성디스플레이 주식회사 | Organic electroluminescent device and display device including the same |
KR102543639B1 (en) * | 2016-07-18 | 2023-06-15 | 삼성디스플레이 주식회사 | Display panel, manufacturing method thereof and display apparatus having the same |
CN118215324A (en) | 2016-12-02 | 2024-06-18 | Oti照明公司 | Device comprising a conductive coating disposed over an emission region and method thereof |
JP2020518107A (en) | 2017-04-26 | 2020-06-18 | オーティーアイ ルミオニクス インコーポレーテッドOti Lumionics Inc. | Method for patterning a coating on a surface and device containing the patterned coating |
CN116997204A (en) | 2017-05-17 | 2023-11-03 | Oti照明公司 | Method for selectively depositing conductive coating on patterned coating and device comprising conductive coating |
CN107359263A (en) * | 2017-07-12 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of organic EL display panel and preparation method, display device |
US11751415B2 (en) | 2018-02-02 | 2023-09-05 | Oti Lumionics Inc. | Materials for forming a nucleation-inhibiting coating and devices incorporating same |
EP3766100A4 (en) * | 2018-03-12 | 2021-11-03 | BOE Technology Group Co., Ltd. | Organic light emitting diode array substrate, display panel and display apparatus, and fabricating method thereof |
JP7320851B2 (en) | 2018-05-07 | 2023-08-04 | オーティーアイ ルミオニクス インコーポレーテッド | Methods for providing auxiliary electrodes and devices containing auxiliary electrodes |
CN109004005B (en) * | 2018-07-24 | 2020-12-11 | 云谷(固安)科技有限公司 | Display panel, manufacturing method thereof and display device |
KR102469187B1 (en) * | 2018-09-04 | 2022-11-21 | 삼성디스플레이 주식회사 | Display device and method for manufacturing the same |
KR20200037891A (en) * | 2018-10-01 | 2020-04-10 | 삼성디스플레이 주식회사 | Organic light emitting diode display device |
KR20200066503A (en) * | 2018-11-30 | 2020-06-10 | 삼성디스플레이 주식회사 | Display panel |
KR102624516B1 (en) * | 2018-12-04 | 2024-01-16 | 삼성디스플레이 주식회사 | Display device and method of manufacturing display device |
KR102075741B1 (en) * | 2018-12-17 | 2020-02-10 | 엘지디스플레이 주식회사 | Display panel |
KR20200091059A (en) * | 2019-01-21 | 2020-07-30 | 삼성디스플레이 주식회사 | Organic light emitting display device and method manufacturing the same |
KR20210149058A (en) | 2019-03-07 | 2021-12-08 | 오티아이 루미오닉스 인크. | Material for forming nucleation inhibiting coating and device comprising same |
KR20220009961A (en) | 2019-04-18 | 2022-01-25 | 오티아이 루미오닉스 인크. | Material for forming nucleation inhibiting coating and device comprising same |
CN110048022B (en) * | 2019-04-22 | 2020-08-04 | 深圳市华星光电半导体显示技术有限公司 | O L ED device and preparation method thereof |
CN110071156B (en) * | 2019-04-28 | 2022-04-26 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
JP2022532144A (en) | 2019-05-08 | 2022-07-13 | オーティーアイ ルミオニクス インコーポレーテッド | Materials for forming nucleation-suppressing coatings and devices incorporating them |
US11832473B2 (en) | 2019-06-26 | 2023-11-28 | Oti Lumionics Inc. | Optoelectronic device including light transmissive regions, with light diffraction characteristics |
JP7386556B2 (en) | 2019-06-26 | 2023-11-27 | オーティーアイ ルミオニクス インコーポレーテッド | Optoelectronic devices containing optically transparent regions with applications related to optical diffraction properties |
US20220278299A1 (en) | 2019-08-09 | 2022-09-01 | Oti Lumionics Inc. | Opto-electronic device including an auxiliary electrode and a partition |
KR20210042216A (en) | 2019-10-08 | 2021-04-19 | 삼성디스플레이 주식회사 | Display device |
CN110739338B (en) * | 2019-10-24 | 2022-11-29 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display panel |
JP7432353B2 (en) * | 2019-12-19 | 2024-02-16 | 株式会社ジャパンディスプレイ | display device |
KR20210138842A (en) | 2020-05-12 | 2021-11-22 | 삼성디스플레이 주식회사 | Display apparatus |
CN112117357B (en) * | 2020-09-17 | 2022-03-22 | 厦门天马微电子有限公司 | Display panel, preparation method thereof and display device |
WO2022123431A1 (en) | 2020-12-07 | 2022-06-16 | Oti Lumionics Inc. | Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating |
KR20230058200A (en) * | 2021-10-22 | 2023-05-03 | 삼성디스플레이 주식회사 | Display panel, electronic apparatus including the same and method of manufacturing display panel |
CN113936597B (en) * | 2021-10-26 | 2023-08-25 | 京东方科技集团股份有限公司 | Display panel, display device and brightness compensation method |
CN115275058B (en) * | 2022-07-29 | 2024-01-19 | 武汉华星光电半导体显示技术有限公司 | Display panel and display terminal |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7520790B2 (en) | 2003-09-19 | 2009-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of display device |
JP2005327674A (en) | 2004-05-17 | 2005-11-24 | Sharp Corp | Organic electroluminescent display element, display device having the same, and manufacturing method thereof |
KR100875103B1 (en) * | 2007-11-16 | 2008-12-19 | 삼성모바일디스플레이주식회사 | Organic light emitting display |
WO2010070798A1 (en) | 2008-12-18 | 2010-06-24 | パナソニック株式会社 | Organic electroluminescent display device and method for manufacturing same |
KR101094282B1 (en) | 2009-12-04 | 2011-12-19 | 삼성모바일디스플레이주식회사 | Organic light emitting diode device |
KR101810047B1 (en) * | 2011-07-28 | 2017-12-19 | 삼성디스플레이 주식회사 | Organic light emitting display device and manufacturing method of the same |
KR101976133B1 (en) * | 2012-11-20 | 2019-05-08 | 삼성디스플레이 주식회사 | Display device |
KR101560272B1 (en) * | 2013-02-25 | 2015-10-15 | 삼성디스플레이 주식회사 | Organic light emitting display device and manufacturing method of the same |
KR20150009126A (en) | 2013-07-15 | 2015-01-26 | 삼성디스플레이 주식회사 | Organic light emitting diode display and method for manufacturing the same |
CN104752476B (en) * | 2013-12-31 | 2018-05-22 | 乐金显示有限公司 | Organic light-emitting display device and its manufacturing method |
JP2015138746A (en) | 2014-01-24 | 2015-07-30 | ソニー株式会社 | Organic el element, display device, and lighting device |
KR102145759B1 (en) | 2014-03-27 | 2020-08-20 | 엘지디스플레이 주식회사 | Organic Light Emitting Device |
KR101640803B1 (en) * | 2014-09-26 | 2016-07-20 | 엘지디스플레이 주식회사 | Organic Light Emitting Diode Display Device and Method of Fabricating the Same |
KR102399414B1 (en) * | 2014-12-30 | 2022-05-18 | 엘지디스플레이 주식회사 | Organic Light Emitting Diode Display Having Multi-Layer Stack Structure |
KR102642369B1 (en) * | 2016-03-25 | 2024-03-05 | 삼성디스플레이 주식회사 | Organic light emitting display device and method of manufacturing the organic light emitting display device |
EP3240036B1 (en) * | 2016-04-29 | 2024-05-01 | LG Display Co., Ltd. | Organic light-emitting display device and method of manufacturing the same |
KR102543639B1 (en) * | 2016-07-18 | 2023-06-15 | 삼성디스플레이 주식회사 | Display panel, manufacturing method thereof and display apparatus having the same |
-
2016
- 2016-07-18 KR KR1020160090947A patent/KR102543639B1/en active IP Right Grant
-
2017
- 2017-07-11 US US15/646,362 patent/US10020461B2/en active Active
- 2017-07-13 EP EP17181296.9A patent/EP3273499B1/en active Active
- 2017-07-14 CN CN202110565627.1A patent/CN113299843B/en active Active
- 2017-07-14 JP JP2017138055A patent/JP6875218B2/en active Active
- 2017-07-14 CN CN201710573759.2A patent/CN107634147B/en active Active
- 2017-07-18 TW TW106123941A patent/TWI762495B/en active
-
2018
- 2018-06-27 US US16/020,572 patent/US10439161B2/en active Active
-
2019
- 2019-10-04 US US16/593,060 patent/US10600986B1/en active Active
-
2020
- 2020-03-16 US US16/820,072 patent/US10991903B2/en active Active
-
2023
- 2023-06-08 KR KR1020230073720A patent/KR102674437B1/en active IP Right Grant
-
2024
- 2024-06-05 KR KR1020240073509A patent/KR20240096435A/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20200220099A1 (en) | 2020-07-09 |
CN113299843A (en) | 2021-08-24 |
KR20230088321A (en) | 2023-06-19 |
CN113299843B (en) | 2024-08-20 |
US10439161B2 (en) | 2019-10-08 |
CN107634147A (en) | 2018-01-26 |
EP3273499A1 (en) | 2018-01-24 |
KR20240096435A (en) | 2024-06-26 |
EP3273499B1 (en) | 2022-09-14 |
KR102674437B1 (en) | 2024-06-13 |
US10991903B2 (en) | 2021-04-27 |
KR102543639B1 (en) | 2023-06-15 |
US20180019434A1 (en) | 2018-01-18 |
US20180309085A1 (en) | 2018-10-25 |
JP2018014323A (en) | 2018-01-25 |
TW201807468A (en) | 2018-03-01 |
US10600986B1 (en) | 2020-03-24 |
US10020461B2 (en) | 2018-07-10 |
JP6875218B2 (en) | 2021-05-19 |
TWI762495B (en) | 2022-05-01 |
KR20180009441A (en) | 2018-01-29 |
CN107634147B (en) | 2021-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10991903B2 (en) | Display panel capable of preventing a defect in light emission of an organic light emitting element | |
US10297652B2 (en) | Display panel and method for manufacturing the same | |
US9614015B2 (en) | Method for fabricating display device and display device | |
US10573840B2 (en) | Organic light emitting diode and organic light emitting display panel having the same | |
US9419240B2 (en) | Organic light emitting transistor and display device having the same | |
US20170033306A1 (en) | Organic light emitting pixel and organic light emitting display device including the same | |
KR20170132018A (en) | Organic light emitting display device | |
KR20180075958A (en) | Organic light emitting display device | |
US9673413B2 (en) | Organic light-emitting device and display apparatus including the same | |
KR102673969B1 (en) | Organic light emitting diode display | |
KR20170003829A (en) | Organic light emitting display device and method of manufacturing organic light emitting display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |