US20200051482A1 - Redundant pixel layouts - Google Patents
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- US20200051482A1 US20200051482A1 US16/101,717 US201816101717A US2020051482A1 US 20200051482 A1 US20200051482 A1 US 20200051482A1 US 201816101717 A US201816101717 A US 201816101717A US 2020051482 A1 US2020051482 A1 US 2020051482A1
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Definitions
- the present invention relates generally to pixel arrangements in flat-panel color displays, for example active-matrix micro-LED displays.
- Flat-panel color displays comprise an array of pixels arranged in rows and columns over a display substrate.
- Each pixel in the array of pixels comprises one or more light emitters.
- the pixels typically comprise three color light emitters: a red-light emitter, a green-light emitter, and a blue-light emitter.
- Each pixel in an active-matrix display includes a local control-and-storage circuit that receives data from a display controller (often comprising a row controller that provides row-control signals to each row of pixels and a column controller) that provides column-data signals to each column of pixels). Once the pixel data is stored in each pixel, the pixel controller controls the light emitter(s) in the pixel to output the pixel data independently of other pixels.
- passive-matrix displays do not include a local control-and-storage circuit. Instead, rows of pixels are controlled at a time to emit light by external row and column controllers.
- LCDs liquid crystal displays
- OLED organic light-emitting diode
- LCDs use a backlight to generate light that is controlled by liquid crystal.
- OLED displays comprise thin layers of organic material to emit light in response to a current passing through the organic material layers.
- An example of such an active-matrix OLED display device is disclosed in U.S. Pat. No. 5,550,066.
- the pixels are made as large as possible to increase brightness and lifetime for the displays.
- Displays using inorganic light-emitting diodes (ILEDs) are also known.
- Typical flat-panel displays use thin-film electronic semiconductor materials (such as amorphous or polycrystalline silicon layers) coated on a display substrate to provide active-matrix control circuits for each pixel.
- the substrate and thin layer of semiconductor material can be photolithographically processed to define electronically active components, such as thin-film transistors.
- Transistors may also be formed in thin layers of organic materials.
- the display substrate is often made of glass, for example Corning Eagle or Jade glass designed for display applications.
- U.S. Pat. No. 7,943,491 Another method for providing an array of control circuits on a substrate is described in U.S. Pat. No. 7,943,491.
- small integrated circuits are formed on a semiconductor wafer.
- the small integrated circuits, or chiplets are released from the wafer by etching a layer formed beneath the circuits.
- a PDMS stamp is pressed against the wafer and the process side of the chiplets is adhered to the stamp.
- the chiplets are pressed against a destination substrate or backplane and adhered to the destination substrate.
- U.S. Pat. No. 8,722,458 entitled Optical Systems Fabricated by Printing - Based Assembly teaches transferring light-emitting, light-sensing, or light-collecting semiconductor elements from a wafer substrate to a destination substrate or backplane.
- Each pixel comprises a first subpixel and a redundant second subpixel.
- Each first subpixel comprises a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire.
- Each first light emitter is controlled by the first subpixel controller at least through the first-light-emitter wire.
- the second subpixel comprises a second-subpixel-controller location comprising electrical connections to the controller wires and a second-light-emitter location comprising a second-light-emitter wire.
- the first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.
- the second subpixel of the pixel comprises a second subpixel controller electrically connected to the controller wires in the second-subpixel-controller location and a second light emitter electrically connected to the second-light-emitter wire in the second-light-emitter location.
- the second light emitter is controlled by the second subpixel controller at least through the second-light-emitter wire.
- the first subpixel controller has an area that is greater than an area of the first light emitter or the second subpixel controller has an area that is greater than an area of the second light emitter, or both.
- the first subpixel is faulty.
- the second subpixel is faulty.
- a controller wire, the first-light-emitter wire, the second-light-emitter wire, a power wire, or a ground wire in a pixel is cut. In some embodiments, the cut wire is in a faulty subpixel.
- the first subpixel of each pixel comprises two or more first light emitters that each emit light of a different color from others of the first light emitters and the second subpixel of the at least one pixel comprises two or more second light emitters that each emit light of a different color from others of the second light emitters.
- the first light emitters of the pixel are adjacent and the second light emitters are adjacent, the first light emitters and the second light emitters are disposed in a common line, the first light emitters are disposed in a first line and the second light emitters are disposed in a second line different from the first line, the first light emitters are adjacent to the second light emitters, or the first light emitters are interdigitated with the second light emitters in a line.
- the first subpixel comprises a red first light emitter that emits red light, a green first light emitter that emits green light, and a blue first light emitter that emits blue light
- the second subpixel comprises a red second light emitter that emits red light, a green second light emitter that emits green light, and a blue second light emitter that emits blue light.
- the red first light emitter is adjacent to the blue second light emitter
- the green first light emitter is adjacent to the green second light emitter
- the blue first light emitter is adjacent to the red second light emitter.
- the red first light emitter is adjacent to the red second light emitter
- the green first light emitter is adjacent to the green second light emitter
- the blue first light emitter is adjacent to the blue second light emitter.
- the first light emitters are between the first subpixel controller and the second light emitters and the second light emitters are between the second subpixel controller and the first light emitters.
- the first subpixel controller has an area that is greater than the combined areas of the first light emitters or the second subpixel controller has an area that is greater than the combined areas of the second light emitters, or both.
- the first subpixel controller is adjacent to the second subpixel controller.
- the second subpixel is disposed in a rotated arrangement with respect to the first subpixel.
- the rotation can be 45 degrees, 90 degrees, 135 degrees, 180 degrees, 225 degrees, 270 degrees, or 315 degrees, or any other rotation.
- the redundant pixel layout comprises an array of pixel substrates disposed on or over the display substrate. Each pixel is disposed on or over a corresponding pixel substrate. Any one or all of the pixel substrates, the first subpixel controllers, or the first light emitters can each comprise a broken or separated tether. For the at least one pixel, any one or all of the second subpixel controllers and the second light emitters can each comprise a broken or separated tether.
- the redundant pixel layout comprises an array of first pixel substrates disposed on or over the display substrate and an array of second pixel substrates disposed on or over the display substrate.
- Each first subpixel is disposed on or over a corresponding first pixel substrate and each second subpixel is disposed on or over a corresponding second pixel substrate.
- Any one or all of the first pixel substrates, the second pixel substrates, the first subpixel controllers, or the first light emitters can each comprise a broken or separated tether.
- any one or all of the second subpixel controllers and the second light emitters can each comprise a broken or separated tether.
- no other light emitter or subpixel controller in the first subpixel is closer to the second-light-emitter location than the first light emitter.
- the first subpixels can each comprise a power wire and a ground wire and the method further comprises cutting at least one power wire, one ground wire, one controller wire, or the first-light-emitter wire in at least one bad first subpixel.
- the second subpixels in the array of pixels can be tested to identify second bad subpixels.
- the second subpixels can each comprise a power wire and a ground wire and the method can further comprise cutting at least one power wire, one ground wire, one controller wire, or the second-light-emitter wire in at least one bad second subpixel.
- a method of making a redundant pixel layout comprises providing a redundant pixel layout for a display and testing the first subpixels in the array of pixels to identify bad first subpixels. For each bad first subpixel, the method further comprises disposing a second subpixel controller electrically connected to the controller wires and a second light emitter electrically connected to the second-light-emitter wire, where the second light emitter is controlled by the second subpixel controller at least through the second-light-emitter wire.
- the first subpixels can each comprise a power wire and a ground wire and comprising cutting at least one power wire, one ground wire, one controller wire, or the first-light-emitter wire in at least one bad first subpixel.
- the present invention provides displays including arrays of pixels on a display substrate that are addressed using active-matrix-addressing methods.
- the systems can include a redundant layout and redundant components in pixels to improve manufacturability and visual quality.
- the systems can also employ small integrated circuits at a high resolution that are transfer printed to the display substrate.
- FIG. 1A is a schematic perspective of a display, according to illustrative embodiments of the present invention.
- FIG. 1B is a detail schematic of FIG. 1A , according to illustrative embodiments of the present invention.
- FIG. 1C is a detail schematic of FIG. 1A with a second subpixel controller and a second light emitter, according to illustrative embodiments of the present invention
- FIG. 2A is a schematic illustration of a pixel comprising three light emitters in a first subpixel and three light-emitter locations in a second subpixel, according to illustrative embodiments of the present invention
- FIG. 2B is a schematic illustration of a pixel comprising three light emitters in each subpixel, according to illustrative embodiments of the present invention.
- FIG. 3A is a schematic illustration of a pixel comprising a single row of light emitters, according to illustrative embodiments of the present invention.
- FIG. 3B is a schematic illustration of a pixel comprising a single row of light emitters and light-emitter locations, according to illustrative embodiments of the present invention.
- FIGS. 4A and 4B are schematic illustrations of rotated subpixels, according to illustrative embodiments of the present invention.
- FIGS. 4C and 4D are schematic illustrations of rotated subpixel locations, according to illustrative embodiments of the present invention.
- FIG. 5 is a plan view layout of a pixel corresponding to the schematic illustration of FIG. 2B , according to illustrative embodiments of the present invention.
- FIG. 6 is a plan view layout of a pixel corresponding to the schematic illustration of FIG. 3 , according to illustrative embodiments of the present invention.
- FIG. 7 is a micrograph of a constructed sub-pixel, according to illustrative embodiments of the present invention.
- FIG. 8 is a micrograph of a constructed pixel, according to illustrative embodiments of the present invention.
- FIG. 9 is a schematic perspective of a pixel disposed on a display substrate, according to illustrative embodiments of the present invention.
- FIG. 10 is a schematic perspective of a pixel disposed on a pixel substrate, according to illustrative embodiments of the present invention.
- FIG. 11 is a schematic perspective of subpixels disposed on corresponding pixel substrates, according to illustrative embodiments of the present invention.
- FIG. 12A is a schematic perspective of subpixels disposed on corresponding pixel substrates, according to illustrative embodiments of the present invention.
- FIG. 12B is a schematic perspective of a subpixel disposed on a pixel substrate and a subpixel location, according to illustrative embodiments of the present invention.
- FIG. 13 is a flow chart illustrating an exemplary method, according to illustrative embodiments of the present invention.
- FIG. 14 is a flow chart illustrating an exemplary method, according to illustrative embodiments of the present invention.
- the present invention provides, inter alia, structures and methods for an active-matrix display with small high-resolution elements that is tolerant of manufacturing and materials variability, particle contamination, and defects and that enables repair, thereby improving manufacturing yields and reducing costs. Moreover, certain embodiments of the present invention can provide improved visual color integration of multiple light emitters in a pixel that emit different colors of light. Certain embodiments of the present invention provide these advantages by providing redundant active-matrix controllers with redundant and adjacent light emitters in each pixel. In the event of a component failure in a pixel, redundant controllers or light emitters in the pixel can provide the operational capabilities of the failed component (e.g., wherein redundant controllers or light emitters continue to operate after failure of a component).
- redundant controllers and redundant light emitters are disposed in redundant locations and electrically connected in every pixel.
- pixels can be tested and electrical connections to faulty controllers or faulty light emitters (or both) can be cut.
- pixels with redundant controller locations and redundant light-emitter locations are tested to determine faulty pixels and redundant controllers and redundant light emitters disposed and electrically connected in locations of the faulty pixels to correct the fault.
- a redundant pixel layout 99 for a display 98 comprises a display substrate 10 and an array of pixels 20 disposed on or over display substrate 10 , as shown in FIG. 1A .
- each pixel 20 comprises a first subpixel 21 comprising a first subpixel controller 31 electrically connected to controller wires 70 and a first light emitter 41 electrically connected to a first-light-emitter wire 71 .
- First light emitter 41 is electrically controlled by first subpixel controller 31 at least through first-light-emitter wire 71 .
- First subpixel 21 can comprise more than one first-light-emitter wire 71 electrically connected to first light emitter 41 .
- Each pixel 20 further comprises a second subpixel 22 comprising a second-subpixel-controller location 33 comprising electrical connections to controller wires 70 and a second-light-emitter location 43 comprising electrical connections to a second-light-emitter wire 72 .
- Second subpixel 22 can comprise more than one second-light-emitter wire 72 having an electrical connection to second-light-emitter location 43 .
- Second subpixel 22 is redundant to first subpixel 21 , first light emitter 41 is adjacent to second-light-emitter location 43 , and first light emitter 41 and second-light-emitter location 43 are closer together than are any two pixels 20 in the array of pixels 20 .
- Pixels 20 are separated by a pixel distance D P (e.g., as shown in FIG. 1A ) and first light emitter 41 and second-light-emitter location 43 are separated by a light-emitter distance D E (e.g., as shown in FIGS. 1B, 1C ) in any direction or dimension D parallel to a surface of the display substrate 10 on which the pixels 20 are disposed ( FIG. 1A ).
- First subpixel controllers 31 and second subpixel controllers 32 are collectively referred to as subpixel controllers 30 ; first light emitters 41 and second light emitters 42 that emit light of any color are collectively referred to as light emitters 40 .
- Second-subpixel-controller locations 33 are elements comprising one or more control wires 70 (e.g., portion(s) thereof), one or more electrically conductive elements (e.g., contact pads 74 ), or both that are disposed on, in, or over display substrate 10 (e.g., an area or portion thereof) on, over, or in which second subpixel controllers 32 can be disposed such that when disposed, the second subpixel controllers 32 are electrically connected to controller wires 70 and contact pads 74 to operate as intended (e.g., to control one or more second light emitters 42 ).
- control wires 70 e.g., portion(s) thereof
- electrically conductive elements e.g., contact pads 74
- second-light-emitter locations 43 are elements comprising one or more second-light-emitter wires 72 (e.g., areas or portion(s) thereof), one or more electrically conductive elements (e.g., contact pads 74 ), or both disposed on, in, or over display substrate 10 (e.g., an area or portion thereof) on, over, or in which second light emitters 42 can be disposed such that when disposed, the second light emitters are electrically connected to second-light-emitter wire 72 and contact pads 74 to operate as intended (e.g., to emit light in response to control signals from a second subpixel controller 32 ).
- FIG. 1B illustrates a redundant pixel layout 99 with second-subpixel-controller location 33 and second-light-emitter location 43 shown with dashed lines.
- Contact pads 74 in first and second subpixels 21 , 22 are indicated as rectangles on display substrate 10 to indicate electrically conductive areas to which a second subpixel controller 32 or second light emitter 42 (or first subpixel controller 31 or first light emitter 41 ) could be electrically connected.
- Contact pads 74 are typically, but not necessarily, formed from electrically conductive metals such as aluminum, polysilicon, or transparent conductive oxides using masking and deposition processes known in the art.
- FIG. 1C illustrates a redundant pixel layout 99 with a second subpixel controller 32 disposed in second-subpixel-controller location 33 and a second light emitter 42 disposed in second-light-emitter location 43 .
- second subpixel 22 of the at least one pixel 20 comprises a second subpixel controller 32 electrically connected to controller wires 70 .
- Second subpixel 22 of the at least one pixel 20 further comprises a second light emitter 42 electrically connected to second-light-emitter wire 72 .
- Second light emitter 42 is controlled by second subpixel controller 32 at least through second-light-emitter wire 72 .
- contact pads 74 are illustrated with dashed lines to indicate that they are obscured by the presence of first and second subpixel controllers 31 , 32 and first and second light emitters 41 , 42 .
- Controller wires 70 can be electrically connected in common to both first and second subpixel controllers 31 , 32 since the second subpixel 22 is redundant to the first subpixel 21 .
- Controller wires 70 can refer to, but are not limited to, wires that are used to provide control signals and power or ground (e.g., row lines 14 , column lines 12 , power wire 16 , and ground wire 17 ) to first and second subpixels 21 , 22 .
- the word “line” also refers to a “wire” and vice versa. Both are electrical conductors that convey electrical signals, voltages, or currents.
- First subpixel controller 31 controls first light emitter 41 at least through first-light-emitter wire 71 .
- Ground wire 17 can be electrically connected to first light emitter 41 , second light emitter 42 , first subpixel controller 31 , and second subpixel controller 32 and can be considered any combination or all of a controller wire 70 , a first-light-emitter wire 71 , and a second-light-emitter wire 72 .
- First-light-emitter wire 71 is electrically connected to both first light emitter 41 and first subpixel controller 31 to enable first subpixel controller 31 to control first light emitter 41 .
- second-light-emitter wire 72 is electrically connected to both second-light-emitter location 43 and second-subpixel-controller location 33 to enable control of second light emitter 42 , as shown in FIG. 1B .
- second-light-emitter wire 72 is electrically connected to both second light emitter 42 and second subpixel controller 32 to enable second subpixel controller 32 to control second light emitter 42 .
- a second subpixel 22 is redundant to first subpixel 21 if the second subpixel 22 is intended to replicate and have substantially identical functions and components (e.g., within manufacturing tolerances) as the first subpixel 21 .
- a second subpixel 22 comprising a second-subpixel location is redundant to a first subpixel 21 if, when a second subpixel controller 32 is disposed in a second-pixel-controller location 33 and electrically connected to controller wires 70 and a second light emitter 42 is disposed in a second-light-emitter location 43 and electrically connected to second-light-emitter wire 72 , then the second subpixel 22 replicates and has substantially identical function to the first subpixel 21 .
- first subpixel 21 can be electrically connected in parallel with second subpixel 22 .
- second subpixel controller 32 is intended to be functionally identical to first subpixel controller 31 and second light emitter 42 is intended to be functionally identical to first light emitter 41 and second subpixel 22 is intended to be substantially identically electrically connected to the same inputs and outputs (if any) as first subpixel 21 .
- first and second subpixels 21 , 22 are operating properly, they will respond to the same input signals in the same way and at the same time to perform the same function.
- first subpixel 21 is defective, missing, or improperly connected to its electrical connections, a properly functional and electrically connected second subpixel 22 can operate in the place of first subpixel 21 , or vice versa.
- first subpixel 21 is faulty.
- second subpixel 22 is faulty.
- a controller wire 70 , first-light-emitter wire 71 , second-light-emitter wire 72 , a power wire 16 , or a ground wire 17 in a pixel 20 is cut (e.g., to prevent operation of a faulty subpixel).
- the cut wire is in a faulty first subpixel 21 or a faulty second subpixel 22 , or both.
- second subpixel 22 is redundant to first subpixel 21 because second subpixel 22 comprises a second subpixel location 32 comprising an element comprising electrical connections disposed in a portion or area of display substrate 10 that provide the same signals and electrical connections as those of first subpixel 21 .
- second subpixel location 32 comprising an element comprising electrical connections disposed in a portion or area of display substrate 10 that provide the same signals and electrical connections as those of first subpixel 21 .
- second subpixel 22 is redundant to first subpixel 21 because first subpixel controller 31 is substantially functionally identical to second subpixel controller 32 , first light emitter 41 is substantially functionally identical to second light emitter 42 , both first and second subpixel controllers 31 , 32 are electrically connected to power wire 16 , ground wire 17 , the same row line 14 , and the same column line 12 , and first and second light emitters 41 , 42 are electrically connected to ground wire 17 and a similar control signal from their respective subpixel controllers 30 .
- first and second subpixels 21 , 22 are substantially identically electrically connected and are intended to operate identically.
- substantially identical components, functionality, operation, and electrical connections need not be exactly identical. Those familiar with manufacturing process control will understand that variations in materials and processes will result in corresponding differences in structures and functions in manufactured devices.
- substantially identical components, functions, or connections are intended to operate identically but can differ in their operation within manufacturing variability and tolerances.
- first light emitter 41 can differ from substantially identical second light emitter 42 in efficiency, color of light emission, lifetime, and other operating characteristics or parameters if first and second light emitters 41 , 42 are designed and intended to be the same.
- elements e.g., light emitters 40 , subpixel controllers 30 , light-emitter locations 43 , or subpixel-controller locations 33 ) disposed on or over display substrate 10 within a common pixel 20 that are “adjacent” have no spatially intervening element (e.g., no spatially intervening functionally similar element) on or over display substrate 10 in a direction D substantially parallel to a surface of display substrate 10 on which the elements are disposed. Hence, no other element within a common pixel 20 is between adjacent elements on or over the surface of display substrate 10 .
- a first light emitter 41 in a first subpixel 21 is adjacent to a second light emitter 42 (or second-light-emitter location 43 ) in a second subpixel 22 in a common pixel 20 when there is no other first or second light emitter 41 , 42 (or first-light-emitter location or second light-emitter location 43 ) in the first or second subpixel 21 , 22 between them.
- no subpixel controller 30 is closer to the adjacent first and second light emitters 41 , 42 .
- elements are only “adjacent” when part of a common pixel 20 (i.e., the term is only applicable within a pixel 20 ).
- light emitters 40 in a common pixel 20 can be adjacent or subpixel controllers 30 in a common pixel 20 can be adjacent, but light emitters 40 in different pixels 20 cannot be adjacent and subpixel controllers 30 in different pixels 20 cannot be adjacent. Components in different pixels 20 are not considered adjacent. As used herein, adjacent components can only include subpixel controllers 30 , light emitters 40 , and light emitter locations 43 . Furthermore, controller wires 70 , first light-emitter wires 71 , and second light-emitter wires 72 are not considered adjacent and are not considered to intervene between adjacent light emitters 40 , light emitter locations 43 , subpixel controllers 30 , or subpixel-controller locations 33 , even if present.
- a first element e.g., light emitter 40 , light-emitter location 43 , subpixel controller 30 , or subpixel-controller location 33
- a second element e.g., light emitter, 40 , light-emitter location 43 , subpixel controller 30 , or subpixel-controller location 33
- the elements are equally close or closer together than any other element (e.g., light emitter 40 , light-emitter location 43 , subpixel controller 30 , or subpixel-controller location 33 ) is to the first element.
- a first light emitter 41 in a first subpixel 21 is adjacent to a second light emitter 42 in a second subpixel 22 when no element (e.g., light emitter 40 or subpixel controller 30 of any subpixel (e.g., first or second subpixels 21 , 22 )) is disposed therebetween and the second light emitter 42 is the closest element (e.g., of the second subpixel 22 ) to the first light emitter 41 (or, in some embodiments, is equally close to the first light emitter 42 as another light emitter 40 (e.g., in the first subpixel 21 or second subpixel 22 )).
- no element e.g., light emitter 40 or subpixel controller 30 of any subpixel (e.g., first or second subpixels 21 , 22 )
- the second light emitter 42 is the closest element (e.g., of the second subpixel 22 ) to the first light emitter 41 (or, in some embodiments, is equally close to the first light emitter 42 as another light emitter 40 (e.
- no other light emitter 40 is disposed between adjacent light emitters 40 (or corresponding locations) on or over the surface of display substrate 10 and in a direction D substantially parallel to a surface of display substrate 10 on which light emitters 40 are disposed (as shown in FIG. 1A ).
- no subpixel controller 30 is disposed between two adjacent light emitters 40 .
- adjacent subpixel controllers 30 have no spatially intervening other subpixel controller 30 or light emitter 40 disposed between the adjacent subpixel controllers 30 on or over display substrate 10 .
- FIG. 1C illustrates two adjacent light emitters 40 and two subpixel controllers 30 that are not adjacent.
- first and second light emitters 41 , 42 are disposed closer together on or over display substrate 10 and in a direction D substantially parallel to a surface of display substrate 10 on or over which the first and second light emitters 41 , 42 are disposed than are any two pixels 20 in an array of pixels 20 .
- first and second light emitters 41 , 42 are disposed closer together on or over display substrate 10 and in a direction D substantially parallel to a surface of display substrate 10 on or over which the first and second light emitters 41 , 42 are disposed than any two subpixel controllers 30 in different pixels 20 in the array of pixels 20 .
- an objective of certain embodiments of the present invention is to provide robust pixels 20 that can operate in the presence of failed subpixel controllers 30 or light emitters 40 , or both, and provide improved color integration of the light from pixels 20 , it is desirable that the redundant components operate electrically, optically, visually, and spatially identically.
- first and second light emitters 41 , 42 are less visually distinguishable and therefore more readily appear as a single light emitter 40 at a single light-emitter location.
- the human visual system is sensitive to visible spatial discontinuities or disruptions in regular structures, such as an array of pixels 20 in a display 98 .
- redundant second light emitters 42 that are not located in the same location as first light emitters 41 or in close proximity could be visible as an anomaly to a viewer.
- redundant second light emitters 42 By disposing redundant second light emitters 42 in a subpixel location adjacent to and very close to the location of a first light emitter 41 , any such visible anomalies or abnormalities are reduced or eliminated.
- active-matrix pixels 20 in display 98 can be controlled through row and column lines 14 , 12 that convey control and data signals from row and column controllers 94 , 92 under the direction of display or system controller 96 .
- Row, column, and system controllers 94 , 92 , 96 can be located on display substrate 10 or external to display 98 (as shown in FIG. 1A ) and electrically connected through buses 18 that provide electrical connections to the display substrate 10 .
- Row, column, and system controllers 94 , 92 , 96 can be integrated circuits that comprise a display controller.
- Buses 18 can be provided in ribbon cables and connectors, and row and column lines 14 , 12 can be formed on or in display substrate 10 using photolithographic methods and materials, for example to make metal wires or traces, as is known in the display industry.
- system controller 96 of display 98 provides control signals to row controllers 94 and data signals to column controllers 92 through bus 18 .
- Row and column controllers 94 , 92 distribute the signals over row and column lines 14 , 12 to pixels 20 to provide active-matrix control to the display 98 .
- the control and data signals are provided to second-subpixel-controller location 33 and second-light-emitter location 43 .
- the control and data signals are also received by first subpixel controller 31 and first subpixel controller 31 controls first light emitter 41 to emit light as desired.
- a fully functional display 98 as illustrated in FIG.
- the control and data signals are received by both first and second subpixel controllers 31 , 32 .
- First subpixel controller 31 controls first light emitter 41 to emit light as desired and second subpixel controller 32 controls second light emitter 42 to emit light as desired. Since, in some embodiments with no faults, both first and second subpixels 21 , 22 emit light, the display 98 can be calibrated, for example by system controller 96 to emit the desired amount of light, for example by specifying that first and second subpixels 21 , 22 of a pixel 20 each emit one half of the nominal amount of light so that when the two light emitters 40 (first and second light emitters 41 , 42 ) emit light, the desired, nominal amount of light is emitted from the pixel 20 .
- first subpixel 21 in a pixel 20 is faulty
- the second subpixel 22 can emit the desired amount of light from the pixel 20 , or vice versa.
- the control and data signals are received by both first and second subpixel controllers 31 , 32 .
- first subpixel controller 31 or first light emitter 41 is faulty (or, e.g., the controller wire 70 or first-light-emitter wire 71 is faulty)
- second subpixel controller 32 can control second light emitter 42 to emit light as desired from pixel 20 .
- first subpixel 21 can provide the light desired from pixel 20 .
- pixels 20 are tested to determine any faulty first or second subpixels 21 , 22 and the results of testing can be used to properly produce signals (e.g., from system controller 96 and/or first or second subpixel controllers 31 , 32 ) to drive first and second subpixels 21 , 22 .
- Display substrate 10 can be any suitable substrate having a surface on or over which pixels 20 , first and second subpixels 21 , 22 , subpixel controllers 30 , and light emitters 40 can be disposed, for example and without limitation, a substrate comprising glass, plastic, ceramic, quartz, sapphire, or a semiconductor as are used in the integrated circuit or display industry.
- Subpixel controllers 30 , system controller 96 , row controller 94 , and column controller 92 can be integrated circuits or discrete components and can be analog, digital, or mixed-signal circuits and can be silicon circuits made using integrated circuit methods and materials.
- Light emitters 40 can be light-emitting diodes such as inorganic light-emitting diodes (ILEDs).
- Light emitters 40 can be formed in any one or more of a variety of doped or undoped compound semiconductors, such as, for example and without limitation, one or more of GaN, InGaN, GaAs, AlGaAs, GaAsP, GaP, AlGaInP, SiC, CdSe, CdS, and ZnSe.
- doped or undoped compound semiconductors such as, for example and without limitation, one or more of GaN, InGaN, GaAs, AlGaAs, GaAsP, GaP, AlGaInP, SiC, CdSe, CdS, and ZnSe.
- subpixel controllers 30 , light emitters 40 , or both are provided in separate components with independent and separate substrates and are disposed on display substrate 10 , for example using surface mount technology and assembly or using transfer printing.
- subpixel controllers 30 or light emitters 40 comprise or are bare unpackaged die, integrated circuits, or unpackaged integrated circuits.
- subpixel controllers 30 or light emitters 40 can be or include one or more of electronic circuits, optical circuits, transducers, light-emitting diodes, micro-light-emitting diodes, sensors, capacitive sensors, touch sensors, photo-sensors, electromagnetic radiation sensors, and piezo-electric sensors.
- Transfer printing materials and methods can dispose very small devices on a substrate such as display substrate 10 , for example having at least one of a length and a width less than or equal to 200, 100, 50, 20, or 10 microns.
- a substrate such as display substrate 10
- such small devices can improve display resolution and the visual quality of display 98 by enabling the disposition of second light emitters 42 very close to first light emitters 41 , so that viewers cannot readily visually distinguish second light emitters 42 from first light emitters 41 and substantially preventing spatial visual anomalies from displays 98 using redundant second light emitters 42 to improve display 98 yields and visual quality.
- FIGS. 1A, 1B, and 1C illustrate pixels 20 with a single light emitter 40 in each of first and second subpixels 21 , 22 .
- first subpixel 21 comprises two or more first light emitters 41 , for example three first light emitters 41 (e.g., red first light emitter 41 R, green first light emitter 41 G, blue first light emitter 41 B) and second subpixel 22 comprises two or more second-light-emitter locations (e.g., red second-light-emitter location 43 R, green second-light-emitter location 43 G, blue second-light-emitter location 43 B) (e.g., as illustrated in FIG. 2A ).
- first light emitters 41 e.g., red first light emitter 41 R, green first light emitter 41 G, blue first light emitter 41 B
- second subpixel 22 comprises two or more second-light-emitter locations (e.g., red second-light-emitter location 43 R, green second-light-emitter location 43 G, blue second-
- second subpixel 22 comprises two or more light emitters 40 (e.g., red second light emitter 42 R, green second light emitter 42 G, blue second light emitter 42 B).
- first subpixel 21 of pixel 20 comprises two or more first light emitters 41 that each emit light of a different color from other first light emitters 41
- second subpixel 22 of pixel 20 comprises two or more second light emitters 42 that each emit light of a different color from other second light emitters 42 .
- two or more first light emitters 41 comprise a red first light emitter 41 R that emits red light, a green first light emitter 41 G that emits green light, and a blue first light emitter 41 B that emits blue light.
- two or more second light emitters 42 can comprise a red second light emitter 42 R that emits red light, a green second light emitter 42 G that emits green light, and a blue second light emitter 42 B that emits blue light.
- First light emitters 41 are disposed in a first line L 1 and second light emitters 42 are disposed in a second line L 2 different from but parallel to first line L 1 .
- first light emitters 41 are between second light emitters 42 and first subpixel controller 31 and second light emitters 42 are between second subpixel controller 32 and first light emitters 41 , providing a relatively square and compact pixel 20 area over display substrate 10 that can have a higher resolution and improved appearance.
- a first group of light emitters e.g., comprising red, green, and blue first light emitters 41 R, 41 G, 41 B
- a second group of second-light-emitter locations 43 e.g., comprising red, green, and blue second-light-emitter locations 43 R, 43 G, 43 B
- no light emitters 40 , light emitter locations 43 , or subpixel controllers 32 not in the first group or the second group are disposed therebetween.
- a first group of light emitters 40 (e.g., comprising red, green, and blue first light emitters 41 R, 41 G, 41 B) is adjacent to a second group of light emitters 40 (e.g., comprising red, green, and blue second light emitters 42 R, 42 G, 42 B) when no light emitters 40 , light emitter locations 43 , or subpixel controllers 32 not in the first group or the second group or are disposed therebetween.
- a group of light emitters 40 or light-emitter locations 43 is a set of light emitters 40 or light-emitter locations 43 or a combination thereof, respectively, that are electrically connected to a common subpixel controller or subpixel-controller location, respectively. Referring to FIG.
- first subpixel controller 31 is not adjacent second-subpixel-controller location 33 .
- first and second subpixel controllers 31 , 32 are not adjacent.
- red first light emitter 41 R is adjacent to blue second light emitter 42 B
- green first light emitter 41 G is adjacent to green second light emitter 42 G
- blue first light emitter 41 B is adjacent to red second light emitter 42 R.
- first light emitters 41 of pixel 20 are adjacent to second light emitters 42 of pixel 20 .
- This arrangement has the advantage of a more compact light emitting area for first and second light emitters 41 , 42 over display substrate 10 , improving color light integration of the entire pixel 20 .
- either first or second light emitters 41 , 42 are reordered so that red first light emitter 41 R is adjacent to red second light emitter 42 R, green first light emitter 41 G is adjacent to green second light emitter 42 G, and blue first light emitter 41 B is adjacent to blue second light emitter 42 B, thus providing a compact layout and disposing first and second light emitters 41 , 42 of each color closer.
- first light emitters 41 of pixel 20 and second light emitters 42 of pixel 20 are disposed in a common line L, red first and second light emitters 41 R, 42 R are adjacent, green first and second light emitters 41 G, 42 G are adjacent, and blue first and second light emitters 41 B, 42 B are adjacent, so that first light emitters 41 are interdigitated with second light emitters 42 in a pixel 20 .
- first and second subpixel controllers 31 , 32 are also adjacent.
- FIG. 3B shows a structure corresponding to FIG. 3A before second subpixel controller 32 and second light emitters 42 R, 42 G, 42 B have been disposed (e.g., second subpixel 22 comprises second-sub-pixel-controller location 33 and second-light-emitter locations 43 R, 43 G, 43 B).
- first subpixel controller 31 has an area that is greater than an area of first light emitter 41 or second subpixel controller 32 has an area that is greater than an area of second light emitter 42 , or both.
- first subpixel controller 31 has an area that is greater than the combined areas of all of the first light emitters 41
- second subpixel controller 32 has an area that is greater than the combined areas of all of the second light emitters 42 , or both.
- FIGS. 2A and 2B illustrate embodiments of the present invention in which second subpixel 22 is a redundant replica of first subpixel 21 rotated by 180 degrees about an axis perpendicular to a surface of display substrate 10 on which first and second subpixels 21 , 22 are disposed.
- second subpixel 22 can be a redundant replica of first subpixel 21 rotated by other amounts, for example by 90 degrees (shown in FIG. 4A ) or by 270 degrees (shown in FIG. 4B ). Other rotational amounts are also possible, for example 45 degrees, 135 degrees, 225 degrees, or 315 degrees, or any other rotation.
- FIGS. 4C and 4D show corresponding structures to FIGS.
- second subpixel 22 comprises second-subpixel-controller location 33 and second-light-emitter locations 43 R, 43 B, 43 G).
- FIG. 5 is an exemplary layout of the configuration illustrated in FIGS. 2A and 2B on a display substrate 10 and FIG. 6 is a layout of the configuration illustrated in FIG. 3 on a display substrate 10 , with power wire 16 (Vdd) as the common connection to the light emitters 40 , rather than the ground wire 17 .
- Vdd power wire 16
- FIGS. 2A and 2B using the FIG. 5 layout have been constructed, tested, and successfully operated.
- Certain exemplary embodiments of the present invention have been constructed using micro-transfer printing.
- components such as light emitters 40 or subpixel controllers 30 are constructed on substrates of native source wafers, for example crystalline semiconductors.
- the native substrates can be of different types, for example compound semiconductors for light emitters 40 (e.g., when light emitters 40 are inorganic light emitting diodes) and silicon for subpixel controllers 30 .
- the components are disposed over sacrificial portions separated by anchor portions of a sacrificial layer on the native wafers.
- the sacrificial portions are etched, for example with a liquid chemical etchant, to release the components from the native wafer leaving the components attached to the anchor portions by one or more tethers 60 .
- a stamp for example a PDMS stamp having a post for each component, is pressed against the components so that a component is adhered to each post, the stamp is removed so that the tethers 60 fracture or separate, leaving the components adhered to the stamp posts.
- the components on the posts are then pressed against a destination substrate to adhere the components to the destination substrate, and the stamp is removed, leaving components with fractured or separated tethers 60 on the destination substrate, where they can be further processed, for example photolithographically processed to electrically interconnect the components, or can be tested.
- FIG. 7 shows fractured tethers 60 of subpixel controller 30 and light emitters 40 R, 40 G, 40 B after the elements have been disposed on display substrate 10 by micro-transfer printing.
- FIG. 7 is a micrograph of a subpixel (e.g., first subpixel 21 or second subpixel 22 ), FIG. 8 is a micrograph of a complete pixel 20 , and FIG. 9 is a perspective of a pixel 20 from above display substrate 10 corresponding to FIGS. 2A, 2B, and 5 .
- light emitters 40 e.g., red light emitter 40 R, green light emitter 40 G, blue light emitter 40 B
- subpixel controllers 30 are disposed directly on display substrate 10 or layers disposed on display substrate 10 by micro-transfer printing light emitters 40 and subpixel controllers 30 from respective native source substrate wafers directly to display substrate 10 or layers disposed on display substrate 10 .
- one or more of light emitters 40 and subpixel controllers 30 can comprise one or more photolithographically defined electrodes for making appropriate electrical connection from the one or more of light emitters 40 or subpixel controllers 30 to electrical connections disposed on display substrate 10 .
- redundant pixel layout 99 comprises an array of pixel substrates 50 disposed on or over display substrate 10 .
- Each pixel 20 is disposed on or over a corresponding pixel substrate 50 and any one or all of first subpixel controllers 31 , first light emitters 41 , second subpixel controllers 32 , and second light emitters 42 can be micro-transfer printed from a source native wafer to pixel substrate 50 , can be adhered to pixel substrate 50 , for example with an adhesive such as a curable adhesive, and can each comprise a broken or separated tether 60 .
- Pixel substrates 50 are separate, distinct, and independent of display substrate 10 or any light emitter 40 substrate or subpixel controller 30 substrate and can be adhered to display substrate 10 , for example with an adhesive such as a curable adhesive.
- Pixel substrates 50 can be photolithographically processed (e.g., using fine lithography) to form wires on or in pixel substrates 50 to electrically interconnect the components disposed on pixel substrates 50 , for example controller wires 70 , first-light-emitter wire 71 , and second-light-emitter wire 72 .
- pixel substrates 50 can themselves be micro-transfer printed from a source wafer to display substrate 10 and can comprise a fractured or separated tether 60 .
- a second subpixel controller 32 is disposed on or in second-subpixel-controller location 33 on pixel substrate 50 and second light emitter(s) 42 (e.g., 42 R, 42 G, 42 B) are disposed on or in second-light-emitter location(s) 42 on pixel substrate 50 .
- second light emitter(s) 42 e.g., 42 R, 42 G, 42 B
- the redundant pixel layout 99 comprises an array of first subpixel substrates 51 disposed on or over display substrate 10 and an array of second subpixel substrates 52 disposed on or over the display substrate 10 .
- Each first subpixel 21 is disposed on or over a corresponding first subpixel substrate 51 and each second subpixel 22 is disposed on or over a corresponding second subpixel substrate 52 .
- Any one or all of first subpixel controllers 31 and first light emitters 41 can be micro-transfer printed from native source wafers to first subpixel substrate 51 , can be adhered to first subpixel substrate 51 with an adhesive such as a curable adhesive, and can comprise a broken (e.g., fractured) or separated tether 60 .
- any one or all of second subpixel controllers 32 and second light emitters 42 can be micro-transfer printed from native source wafers to second subpixel substrate 52 , can be adhered to second subpixel substrate 52 with an adhesive such as a curable adhesive, and can comprise a broken (e.g., fractured) or separated tether 60 .
- first subpixel substrates 51 are separate, distinct, and independent of display substrate 10 or any first light emitter 41 substrate or first subpixel controller 31 substrate, or any second subpixel substrate 52 .
- First subpixel substrate 51 can be photolithographically processed to form wires on or in first subpixel substrates 51 to electrically interconnect the components disposed on first subpixel substrates 51 , for example controller wires 70 and first-light-emitter wire 71 .
- second subpixel substrates 52 are separate, distinct, and independent of display substrate 10 or any second light emitter 42 substrate or second subpixel controller 32 substrate, or any first subpixel substrate 51 .
- Second subpixel substrate 52 can be photolithographically processed to form wires on or in second subpixel substrates 52 to electrically interconnect the components disposed on second subpixel substrates 52 , for example controller wires 70 and second-light-emitter wire 72 .
- first subpixel substrates 51 and second subpixel substrates 52 can be micro-transfer printed from a same or different native source wafers to display substrate 10 .
- one or more of light emitters 40 and subpixel controllers 30 comprise one or more connection posts for making appropriate electrical connection to electrical connections disposed on pixel substrate 50 (if present), subpixel substrate 51 , 52 (if present), or display substrate 10 .
- one or more of first light emitters 41 , second light emitters 42 , first subpixel controllers 31 , and second subpixel controllers 32 can comprise one or more connection posts for making appropriate electrical connection to electrical connections disposed on first subpixel substrate 51 or second subpixel substrate 52 . Connections posts, methods of fabrication, and methods for making electrical connection using connections posts are described in U.S. Patent Publication No. 2017/0048976 A1, the disclosure of which is hereby incorporated by reference in it is entirety.
- a pixel 20 comprising a pixel substrate 50 or first or second subpixel 21 , 22 comprising first or second subpixel substrates 51 , 52 , respectively, further comprises one or more connection posts extending from the substrate in a direction such that when transferred onto or over a display substrate 10 , the one or more connection posts extend toward display substrate 10 .
- pixel 20 or first or second subpixel 21 , 22 can be transferred (e.g., micro-transfer printed) onto display substrate 10 , which comprises electrical connections (e.g., one or more of controller wires 70 (e.g., power wire 16 , ground wire 17 , row line 14 , column line 12 ) and contact pads 74 ) such that upon transfer, pixel 20 or first or second subpixel 21 , 22 becomes electrically connected through the one or more connection posts to be operable as intended.
- a curable adhesive can be used between pixel substrate 50 or first or second subpixel substrate 51 , 52 and cured as a part of a transfer process to improve adhesion of pixel 20 or first or second subpixel 21 , 22 to display substrate 10 .
- curing of a curable adhesive can improve or cause electrical interconnection between pixel 20 or subpixel 21 , 22 , respectively.
- First-light-emitter wire(s) 71 and second-light-emitter wire(s) 72 can be pre-patterned on pixel substrate 50 or subpixel substrate 51 , 52 , respectively.
- Use of pixels 20 comprising a pixel substrate 50 and one or more connection posts or subpixels 21 , 22 comprising a first or second subpixel substrate 51 , 52 and one or more connection posts can reduce or eliminate the need to photolithographically form wires after transfer of pixels 20 or first or second subpixels 21 , 22 to a display substrate 10 thereby reducing manufacturing costs.
- FIG. 12A shows an illustrative embodiment in which ground wires 17 , power wires 16 , column wires 12 , and row wires 14 are pre-patterned on display substrate 10 and first subpixel 21 comprising first subpixel substrate 51 and second subpixel 22 comprising second subpixel substrate 52 are transferred to display substrate 10 such that upon transfer, all necessary electrical connections are present and made for pixel 20 to function as intended.
- ground wires 17 , power wires 16 , column wires 12 , and row wires 14 are shown to run underneath first pixel substrate 51 and second subpixel substrate 52 where electrical interconnection with the wires 70 occurs through connection posts (not shown) (e.g., corresponding electrical vias through first and second pixel substrates 51 , 52 ).
- connection posts not shown
- FIG. 12B shows an embodiment corresponding to FIG. 12A before disposition of second subpixel substrate 52 on which second subpixel controller 32 and second light emitters 42 R, 42 G, 42 B are disposed. Since row wires 14 , column wires 12 , power wires 16 , and ground wires 17 are disposed on display substrate 10 in such a way that, when second subpixel substrate 52 (having the necessary elements and interconnections disposed thereon) is disposed on display substrate 10 , second subpixel 22 will be operable as intended, second subpixel 22 is said to comprise a second-subpixel-controller location 33 and second-light-emitter location 43 .
- a method of making a redundant pixel layout 99 comprises providing a display substrate 10 in step 100 and disposing wires in locations in subpixel locations on or in display substrate 10 (e.g., controller wires 70 , first-light-emitter wire 71 , and second-light-emitter wire 72 ) in step 110 .
- display substrate 10 is provided with the wires formed on or in the display substrate 10 so that steps 100 and 110 are a common step performed at a same time.
- the wires can interconnect first subpixel controllers 31 and first light emitters 41 disposed on or over display substrate 10 in step 120 as well as interconnecting electrical connections (e.g., contact pads 74 ) in second-subpixel-controller locations 33 and second-light-emitter locations 43 .
- a second subpixel controller 32 electrically connected to the controller wires 70 in second-subpixel-controller location 33 and a second light emitter 42 electrically connected to second-light-emitter wire 72 in second-light-emitter location 43 is provided in step 130 .
- Second light emitter 42 is controlled by second subpixel controller 32 at least through second-light-emitter wire 72 .
- First and second subpixels 21 , 22 in the array of pixels 20 are tested in step 140 to identify bad first subpixels 21 , bad second subpixels 22 , or both.
- subpixel wires are cut to electrically isolate components in the bad first or second subpixels 21 , 22 , for example using a laser cutter.
- First subpixels 21 can each comprise a power wire 16 and a ground wire 17 , as well as controller wires 70 and first-light-emitter wire 71 , and at least one power wire 16 , one ground wire 17 , one controller wire 70 , or first-light-emitter wire 71 in at least one bad first subpixel 21 can be cut.
- second subpixels 22 can each comprise a power wire 16 and a ground wire 17 as well as controller wires 70 and second-light-emitter wire 72 , and at least one power wire 16 , one ground wire 17 , one controller wire 70 , or second-light-emitter wire 72 in at least one bad second subpixel 22 can be cut.
- display 98 Once display 98 is repaired, it can be put into operation in step 160 .
- one or more wires to a faulty subpixel can be, but are not necessarily, cut prior to operation.
- first subpixels 21 in the array of pixels 20 are tested in step 145 to determine faulty first subpixels 21 .
- a second subpixel controller 32 electrically connected to the controller wires 70 in second-subpixel-controller location 33 and a second light emitter 42 electrically connected to second-light-emitter wire 72 in second-light-emitter location 43 is provided in step 135 .
- Second light emitter 42 is controlled by second subpixel controller 32 at least through second-light-emitter wire 72 .
- subpixel wires are cut to electrically isolate components in the bad first subpixels 21 .
- First subpixels 21 can each comprise a power wire 16 and a ground wire 17 , as well as controller wires 70 and first-light-emitter wire 71 , and at least one power wire 16 , one ground wire 17 , one controller wire 70 , or first-light-emitter wire 71 in at least one bad first subpixel 21 can be cut. Once display 98 is repaired, it can be put into operation in step 160 . Generally, one or more wires to a faulty subpixel can be, but are not necessarily, cut prior to operation.
- Display substrate 10 can be a printed circuit board or a glass, metal, ceramic, resin, semiconductor, quartz, sapphire, or polymer substrate.
- Subpixel controllers 30 or light emitters 40 can be chiplets that are micro-transfer printed onto display substrate 10 .
- Electrically conductive row lines 14 , column lines 12 can be patterned wires, conductive traces, cured conductive ink, or other electrical conductors suitable for pattern-wise conducting electricity on a substrate and can be made of copper, silver, gold, aluminum, titanium, tantalum, conductive metal, transparent conductive oxides (TCOs) such as indium tin oxide, or any other conductive material.
- Conductive row lines 14 or column lines 12 can be patterned and interconnected or electrically isolated over display substrate 10 using photolithographic or printed circuit board techniques.
- controller wires 70 whether disposed on an intermediate substrate (e.g., a pixel substrate 50 or a first or second subpixel substrate 51 , 52 ) or a display substrate 10 can be formed lithographically. Controller wires 70 can be formed, for example, either before or after transfer of any one or combination of a pixel 20 , subpixel 21 , 22 , subpixel controller 30 , or light emitter 40 .
- controller wires 70 can be disposed in some embodiments at least partially (and in some embodiments exclusively) under, over, or on a side (e.g., wrapping up onto the side) of a light emitter 40 , subpixel controller 30 , pixel substrate 50 , or subpixel substrate 51 , 52 .
- Pixels 20 are matrix addressed through row and column lines 14 , 12 by supplying signals on the row and column lines 14 , 12 . Additional power wires 16 and ground wires 17 or other control signals can be provided to pixels 20 (not shown in FIG. 1 ). As will be clear to one of ordinary skill, wires as shown throughout the figures may only have a portion of certain wires (e.g., row and column lines 14 , 12 ) shown for simplicity (e.g., as in FIG. 9-11 , for example) with the understanding that the wire may continue beyond what is shown in order to properly electrically interconnect display 98 . Column lines 12 can be controlled by a column controller 92 through a bus 18 and row lines 14 can be controlled by a row controller 94 through another bus 18 .
- the buses 18 can be electrical buses, for example arrays of wires provided in a flexible, flat cable or rigid connectors.
- Row and column controllers 94 , 92 can, in turn, be controlled by a system controller 96 .
- light emitters 40 are inorganic light-emitting diodes or specifically inorganic micro-light-emitting diodes.
- row controller 94 and column controller 92 matrix address pixels 20 in display 98 .
- Row controller 94 selects a row by providing a row select signal (for example a voltage or a digital signal such as a digital HIGH value or a one) on row line 14 corresponding to the row of pixels 20 that are addressed.
- Column controller 92 provides data on column lines 12 and the data is combined with the row select signal (for example using a digital AND gate or a voltage differential between row and column lines 14 , 12 ) by subpixel controllers 30 to enter data into subpixel controllers 30 and cause light emitters 40 to operate and emit light.
- a row select signal for example a voltage or a digital signal such as a digital HIGH value or a one
- Column controller 92 provides data on column lines 12 and the data is combined with the row select signal (for example using a digital AND gate or a voltage differential between row and column lines 14 , 12 ) by subpixel controllers 30 to enter data into subpixel controllers 30 and cause light emitters 40 to operate and emit light.
- the data provided on column lines 12 can be provided by system controller 96 through column controller 92 , for example by shifting data values along a serial shift register until the data is aligned with the column of pixels 20 for which the data is intended for the selected row.
- System, row, and column controllers 96 , 94 , 92 can be digital integrated circuits with appropriate driver circuits, such as transistors, for providing electrical signals on row and column lines 14 , 12 .
- the terms “row” and “column” are arbitrary numelations that can be exchanged without affecting the functionality or structure of the present invention. Hence, the terms row and column can be interchanged without affecting the structure or operation of the present invention and are included in the present invention. Further, it is understood that the terms “first” and “second” as used herein throughout are arbitrary designations and any description of a “first” element or “second” element could likewise written as a corresponding description of a “second” element or “first” element, respectively.
- subpixel controllers 30 or light emitters 40 can be defective (or, as used interchangeably, “faulty” or “failed”), for example having failed circuitry or failed electrical connections to controller wires 70 or first- or second-light-emitter wires 71 , 72 .
- a failure can include, for example: (i) a shorted wire or one that is overly conductive; (ii) a non-conductive wire or an electrical open; (iii) a non-reactive or non-functional subpixel controller 30 or light emitter 40 ; (iv) an absent subpixel controller 30 or light emitter 40 such as one that failed to print or adhere adequately to display substrate 10 , pixel substrate 50 , or one of first and second subpixel substrate 51 , 52 , or is printed to a wrong location; (v) a subpixel controller 30 or light emitter 40 with unintended output, for example the wrong brightness, light output distribution, or color; or (vi) a subpixel controller 30 or light emitter 40 that functions only intermittently.
- a pixel 20 or subpixel 21 , 22 is tested to determine whether one or more of (i)-(vi) is true. Testing can be optical, electrical, or both optical and electrical testing.
- subpixel controllers 30 or light emitters 40 are small integrated circuits, for example chiplets, having a thin substrate with a thickness of only a few microns, for example less than or equal to 25 microns, less than or equal to 15 microns, or less than or equal to 10 microns, and at least one of a width and length of between 5-1000 microns (e.g., 5-10 microns, 10-50 microns, 50-100 microns, or 100-200 microns, 200-500 microns, or 500-1000 microns).
- 5-1000 microns e.g., 5-10 microns, 10-50 microns, 50-100 microns, or 100-200 microns, 200-500 microns, or 500-1000 microns.
- Such chiplets can be made in a source semiconductor wafer (e.g., a silicon or GaN wafer) having a process side and a back side used to handle and transport the wafer.
- Chiplets are formed using lithographic processes in an active layer on or in the process side of the source wafer.
- an empty release layer space is formed beneath the chiplets with tethers 60 connecting the chiplets to the source wafer in such a way that pressure applied against or tension applied to the chiplets breaks or separates the tethers 60 to release the chiplets from the source wafer, for example with a micro-transfer printing stamp.
- Lithographic processes for forming chiplets in a source wafer can be found in the integrated circuit art.
- the chiplets can be constructed using foundry fabrication processes used in the art. Layers of materials can be used, including materials such as metals, oxides, nitrides and other materials used in the integrated-circuit art.
- Each chiplet can be a complete semiconductor integrated circuit and can include, for example, transistors.
- the chiplets can have different sizes, for example, 1000 square microns or 10,000 square microns, 100,000 square microns, or 1 square mm, or larger, and can have variable aspect ratios, for example 1:1, 2:1, 5:1, or 10:1.
- the chiplets can be rectangular or can have other shapes.
- electrically conducting wires, such as controller wires 70 include patterned metal layers forming contact pads 74 .
- the contact pads 74 can be made using integrated circuit photolithographic methods.
- native source wafers can be provided with the chiplets, release layer, and tethers 60 already formed, or they can be constructed as part of a method in accordance with certain embodiments of the present invention.
- the chiplets can be constructed using foundry fabrication processes used in the art. Layers of materials can be used, including materials such as metals, oxides, nitrides and other materials used in the integrated-circuit art. Each chiplet can be a complete semiconductor integrated circuit and can include, for example, transistors.
- the chiplets can have different sizes, for example, 1000 square microns or 10,000 square microns, 100,000 square microns, or 1 square mm, or larger, and can have variable aspect ratios, for example 1:1, 2:1, 5:1, or 10:1.
- the chiplets can be rectangular or can have other shapes.
- a source wafer and chiplets and display substrate 10 can be made separately and at different times or in different temporal orders or locations and provided in various process states.
- Matrix-addressed systems can be constructed using display and thin-film manufacturing method independently of or in combination with micro-transfer printing methods, for example as are taught in U.S. Pat. No. 9,520,537 entitled Micro Assembled Micro LED Displays and Lighting Elements and in U.S. patent application Ser. No. 14/822,868 filed Sep. 25, 2014, entitled Compound Micro - Assembly Strategies and Devices , the contents of which are incorporated by reference herein in their entirety.
- a first layer on a second layer in some implementations means a first layer directly on and in contact with a second layer.
- a first layer on a second layer includes a first layer and a second layer with another layer therebetween.
Abstract
Description
- The present invention relates generally to pixel arrangements in flat-panel color displays, for example active-matrix micro-LED displays.
- Flat-panel color displays comprise an array of pixels arranged in rows and columns over a display substrate. Each pixel in the array of pixels comprises one or more light emitters. In color displays, the pixels typically comprise three color light emitters: a red-light emitter, a green-light emitter, and a blue-light emitter. Each pixel in an active-matrix display includes a local control-and-storage circuit that receives data from a display controller (often comprising a row controller that provides row-control signals to each row of pixels and a column controller) that provides column-data signals to each column of pixels). Once the pixel data is stored in each pixel, the pixel controller controls the light emitter(s) in the pixel to output the pixel data independently of other pixels. In contrast, passive-matrix displays do not include a local control-and-storage circuit. Instead, rows of pixels are controlled at a time to emit light by external row and column controllers.
- Conventional liquid crystal displays (LCDs) use a backlight to generate light that is controlled by liquid crystal. Organic light-emitting diode (OLED) displays comprise thin layers of organic material to emit light in response to a current passing through the organic material layers. An example of such an active-matrix OLED display device is disclosed in U.S. Pat. No. 5,550,066. In both LCD and OLED displays, the pixels are made as large as possible to increase brightness and lifetime for the displays. Displays using inorganic light-emitting diodes (ILEDs) are also known.
- Typical flat-panel displays use thin-film electronic semiconductor materials (such as amorphous or polycrystalline silicon layers) coated on a display substrate to provide active-matrix control circuits for each pixel. The substrate and thin layer of semiconductor material can be photolithographically processed to define electronically active components, such as thin-film transistors. Transistors may also be formed in thin layers of organic materials. In these devices, the display substrate is often made of glass, for example Corning Eagle or Jade glass designed for display applications.
- Another method for providing an array of control circuits on a substrate is described in U.S. Pat. No. 7,943,491. In an exemplary embodiment of this approach, small integrated circuits are formed on a semiconductor wafer. The small integrated circuits, or chiplets, are released from the wafer by etching a layer formed beneath the circuits. A PDMS stamp is pressed against the wafer and the process side of the chiplets is adhered to the stamp. The chiplets are pressed against a destination substrate or backplane and adhered to the destination substrate. In another example, U.S. Pat. No. 8,722,458 entitled Optical Systems Fabricated by Printing-Based Assembly teaches transferring light-emitting, light-sensing, or light-collecting semiconductor elements from a wafer substrate to a destination substrate or backplane.
- In some cases, however, not all of the elements are transferred from the wafer to the destination substrate by the stamp, for example due to process or material abnormalities or undesired particles on the stamp, the wafer, or the destination substrate. It is also possible that the elements themselves are defective due to materials or manufacturing process errors in the source wafer. Such problems can reduce manufacturing yields, increase product costs, and necessitate expensive repair or rework operations.
- There is a need, therefore, for matrix-addressed systems with small high-resolution elements and circuits that are tolerant of manufacturing and materials variability and particle contamination and enable repair.
- In one aspect, the present invention is directed to a redundant pixel layout for a display comprises a display substrate and an array of pixels disposed on or over the display substrate. Each pixel comprises a first subpixel and a redundant second subpixel. Each first subpixel comprises a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire. Each first light emitter is controlled by the first subpixel controller at least through the first-light-emitter wire. The second subpixel comprises a second-subpixel-controller location comprising electrical connections to the controller wires and a second-light-emitter location comprising a second-light-emitter wire. The first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.
- In some embodiments of the present invention, for at least one pixel in the array of pixels, the second subpixel of the pixel comprises a second subpixel controller electrically connected to the controller wires in the second-subpixel-controller location and a second light emitter electrically connected to the second-light-emitter wire in the second-light-emitter location. The second light emitter is controlled by the second subpixel controller at least through the second-light-emitter wire.
- In some embodiments of the present invention, for the at least one pixel, the first subpixel controller has an area that is greater than an area of the first light emitter or the second subpixel controller has an area that is greater than an area of the second light emitter, or both.
- In some embodiments of the present invention, for the at least one pixel, the first subpixel is faulty. In some embodiments of the present invention, for the at least one pixel, the second subpixel is faulty. In some embodiments of the present invention, for the at least one pixel, a controller wire, the first-light-emitter wire, the second-light-emitter wire, a power wire, or a ground wire in a pixel is cut. In some embodiments, the cut wire is in a faulty subpixel.
- In embodiments of the present invention, for the at least one pixel, the first subpixel of each pixel comprises two or more first light emitters that each emit light of a different color from others of the first light emitters and the second subpixel of the at least one pixel comprises two or more second light emitters that each emit light of a different color from others of the second light emitters.
- In embodiments of the present invention, for the at least one pixel, the first light emitters of the pixel are adjacent and the second light emitters are adjacent, the first light emitters and the second light emitters are disposed in a common line, the first light emitters are disposed in a first line and the second light emitters are disposed in a second line different from the first line, the first light emitters are adjacent to the second light emitters, or the first light emitters are interdigitated with the second light emitters in a line.
- In some embodiments of the present invention, for the at least one pixel, the first subpixel comprises a red first light emitter that emits red light, a green first light emitter that emits green light, and a blue first light emitter that emits blue light, and the second subpixel comprises a red second light emitter that emits red light, a green second light emitter that emits green light, and a blue second light emitter that emits blue light. In some configurations, the red first light emitter is adjacent to the blue second light emitter, the green first light emitter is adjacent to the green second light emitter, and the blue first light emitter is adjacent to the red second light emitter. In some configurations, the red first light emitter is adjacent to the red second light emitter, the green first light emitter is adjacent to the green second light emitter, and the blue first light emitter is adjacent to the blue second light emitter.
- In some embodiments of the present invention, for the at least one pixel, the first light emitters are between the first subpixel controller and the second light emitters and the second light emitters are between the second subpixel controller and the first light emitters.
- In some embodiments, for the at least one pixel, the first subpixel controller has an area that is greater than the combined areas of the first light emitters or the second subpixel controller has an area that is greater than the combined areas of the second light emitters, or both.
- In some embodiments of the present invention, the first subpixel controller is adjacent to the second subpixel controller.
- In some embodiments of the present invention, the second subpixel is disposed in a rotated arrangement with respect to the first subpixel. The rotation can be 45 degrees, 90 degrees, 135 degrees, 180 degrees, 225 degrees, 270 degrees, or 315 degrees, or any other rotation.
- In some embodiments of the present invention, the redundant pixel layout comprises an array of pixel substrates disposed on or over the display substrate. Each pixel is disposed on or over a corresponding pixel substrate. Any one or all of the pixel substrates, the first subpixel controllers, or the first light emitters can each comprise a broken or separated tether. For the at least one pixel, any one or all of the second subpixel controllers and the second light emitters can each comprise a broken or separated tether.
- In some embodiments of the present invention, the redundant pixel layout comprises an array of first pixel substrates disposed on or over the display substrate and an array of second pixel substrates disposed on or over the display substrate. Each first subpixel is disposed on or over a corresponding first pixel substrate and each second subpixel is disposed on or over a corresponding second pixel substrate. Any one or all of the first pixel substrates, the second pixel substrates, the first subpixel controllers, or the first light emitters can each comprise a broken or separated tether. For the at least one pixel, any one or all of the second subpixel controllers and the second light emitters can each comprise a broken or separated tether.
- In some embodiments, no other light emitter or subpixel controller in the first subpixel is closer to the second-light-emitter location than the first light emitter.
- In another aspect, the present invention is directed to a method of making a redundant pixel layout comprises providing a redundant pixel layout for a display. For each pixel in the array of pixels, the method further comprises providing a second subpixel controller electrically connected to the controller wires and a second light emitter electrically connected to the second-light-emitter wire, where the second light emitter is controlled by the second subpixel controller at least through the second-light-emitter wire, and testing the first subpixels in the array of pixels to identify bad first subpixels. The first subpixels can each comprise a power wire and a ground wire and the method further comprises cutting at least one power wire, one ground wire, one controller wire, or the first-light-emitter wire in at least one bad first subpixel. The second subpixels in the array of pixels can be tested to identify second bad subpixels. The second subpixels can each comprise a power wire and a ground wire and the method can further comprise cutting at least one power wire, one ground wire, one controller wire, or the second-light-emitter wire in at least one bad second subpixel.
- According to embodiments of the present invention, a method of making a redundant pixel layout comprises providing a redundant pixel layout for a display and testing the first subpixels in the array of pixels to identify bad first subpixels. For each bad first subpixel, the method further comprises disposing a second subpixel controller electrically connected to the controller wires and a second light emitter electrically connected to the second-light-emitter wire, where the second light emitter is controlled by the second subpixel controller at least through the second-light-emitter wire. The first subpixels can each comprise a power wire and a ground wire and comprising cutting at least one power wire, one ground wire, one controller wire, or the first-light-emitter wire in at least one bad first subpixel.
- The present invention provides displays including arrays of pixels on a display substrate that are addressed using active-matrix-addressing methods. The systems can include a redundant layout and redundant components in pixels to improve manufacturability and visual quality. The systems can also employ small integrated circuits at a high resolution that are transfer printed to the display substrate.
- The foregoing and other objects, aspects, features, and advantages of the present disclosure will become more apparent and better understood by referring to the following description taken in conjunction with the accompanying drawings, in which:
-
FIG. 1A is a schematic perspective of a display, according to illustrative embodiments of the present invention; -
FIG. 1B is a detail schematic ofFIG. 1A , according to illustrative embodiments of the present invention; -
FIG. 1C is a detail schematic ofFIG. 1A with a second subpixel controller and a second light emitter, according to illustrative embodiments of the present invention; -
FIG. 2A is a schematic illustration of a pixel comprising three light emitters in a first subpixel and three light-emitter locations in a second subpixel, according to illustrative embodiments of the present invention; -
FIG. 2B is a schematic illustration of a pixel comprising three light emitters in each subpixel, according to illustrative embodiments of the present invention; -
FIG. 3A is a schematic illustration of a pixel comprising a single row of light emitters, according to illustrative embodiments of the present invention; -
FIG. 3B is a schematic illustration of a pixel comprising a single row of light emitters and light-emitter locations, according to illustrative embodiments of the present invention; -
FIGS. 4A and 4B are schematic illustrations of rotated subpixels, according to illustrative embodiments of the present invention; -
FIGS. 4C and 4D are schematic illustrations of rotated subpixel locations, according to illustrative embodiments of the present invention; -
FIG. 5 is a plan view layout of a pixel corresponding to the schematic illustration ofFIG. 2B , according to illustrative embodiments of the present invention; -
FIG. 6 is a plan view layout of a pixel corresponding to the schematic illustration ofFIG. 3 , according to illustrative embodiments of the present invention; -
FIG. 7 is a micrograph of a constructed sub-pixel, according to illustrative embodiments of the present invention; -
FIG. 8 is a micrograph of a constructed pixel, according to illustrative embodiments of the present invention; -
FIG. 9 is a schematic perspective of a pixel disposed on a display substrate, according to illustrative embodiments of the present invention; -
FIG. 10 is a schematic perspective of a pixel disposed on a pixel substrate, according to illustrative embodiments of the present invention; -
FIG. 11 is a schematic perspective of subpixels disposed on corresponding pixel substrates, according to illustrative embodiments of the present invention; -
FIG. 12A is a schematic perspective of subpixels disposed on corresponding pixel substrates, according to illustrative embodiments of the present invention; -
FIG. 12B is a schematic perspective of a subpixel disposed on a pixel substrate and a subpixel location, according to illustrative embodiments of the present invention; -
FIG. 13 is a flow chart illustrating an exemplary method, according to illustrative embodiments of the present invention; and -
FIG. 14 is a flow chart illustrating an exemplary method, according to illustrative embodiments of the present invention. - The features and advantages of the present disclosure will become more apparent from the detailed description set forth below when taken in conjunction with the drawings, in which like reference characters identify corresponding elements throughout. In the drawings, like reference numbers generally indicate identical, functionally similar, and/or structurally similar elements. The figures are not drawn to scale since the variation in size of various elements in the Figures is too great to permit depiction to scale.
- The present invention provides, inter alia, structures and methods for an active-matrix display with small high-resolution elements that is tolerant of manufacturing and materials variability, particle contamination, and defects and that enables repair, thereby improving manufacturing yields and reducing costs. Moreover, certain embodiments of the present invention can provide improved visual color integration of multiple light emitters in a pixel that emit different colors of light. Certain embodiments of the present invention provide these advantages by providing redundant active-matrix controllers with redundant and adjacent light emitters in each pixel. In the event of a component failure in a pixel, redundant controllers or light emitters in the pixel can provide the operational capabilities of the failed component (e.g., wherein redundant controllers or light emitters continue to operate after failure of a component). In some embodiments, redundant controllers and redundant light emitters are disposed in redundant locations and electrically connected in every pixel. In certain embodiments, pixels can be tested and electrical connections to faulty controllers or faulty light emitters (or both) can be cut. In some embodiments, pixels with redundant controller locations and redundant light-emitter locations are tested to determine faulty pixels and redundant controllers and redundant light emitters disposed and electrically connected in locations of the faulty pixels to correct the fault.
- Referring to the perspective of
FIG. 1A and detail ofFIG. 1B , in some embodiments of the present invention, aredundant pixel layout 99 for adisplay 98 comprises adisplay substrate 10 and an array ofpixels 20 disposed on or overdisplay substrate 10, as shown inFIG. 1A . Referring toFIG. 1B , eachpixel 20 comprises afirst subpixel 21 comprising afirst subpixel controller 31 electrically connected tocontroller wires 70 and afirst light emitter 41 electrically connected to a first-light-emitter wire 71.First light emitter 41 is electrically controlled byfirst subpixel controller 31 at least through first-light-emitter wire 71.First subpixel 21 can comprise more than one first-light-emitter wire 71 electrically connected tofirst light emitter 41. Eachpixel 20 further comprises asecond subpixel 22 comprising a second-subpixel-controller location 33 comprising electrical connections tocontroller wires 70 and a second-light-emitter location 43 comprising electrical connections to a second-light-emitter wire 72.Second subpixel 22 can comprise more than one second-light-emitter wire 72 having an electrical connection to second-light-emitter location 43.Second subpixel 22 is redundant tofirst subpixel 21,first light emitter 41 is adjacent to second-light-emitter location 43, andfirst light emitter 41 and second-light-emitter location 43 are closer together than are any twopixels 20 in the array ofpixels 20.Pixels 20 are separated by a pixel distance DP (e.g., as shown inFIG. 1A ) andfirst light emitter 41 and second-light-emitter location 43 are separated by a light-emitter distance DE (e.g., as shown inFIGS. 1B, 1C ) in any direction or dimension D parallel to a surface of thedisplay substrate 10 on which thepixels 20 are disposed (FIG. 1A ). -
First subpixel controllers 31 andsecond subpixel controllers 32 are collectively referred to assubpixel controllers 30;first light emitters 41 and secondlight emitters 42 that emit light of any color are collectively referred to aslight emitters 40. - Second-subpixel-
controller locations 33 are elements comprising one or more control wires 70 (e.g., portion(s) thereof), one or more electrically conductive elements (e.g., contact pads 74), or both that are disposed on, in, or over display substrate 10 (e.g., an area or portion thereof) on, over, or in whichsecond subpixel controllers 32 can be disposed such that when disposed, thesecond subpixel controllers 32 are electrically connected tocontroller wires 70 andcontact pads 74 to operate as intended (e.g., to control one or more second light emitters 42). Similarly, second-light-emitter locations 43 are elements comprising one or more second-light-emitter wires 72 (e.g., areas or portion(s) thereof), one or more electrically conductive elements (e.g., contact pads 74), or both disposed on, in, or over display substrate 10 (e.g., an area or portion thereof) on, over, or in whichsecond light emitters 42 can be disposed such that when disposed, the second light emitters are electrically connected to second-light-emitter wire 72 andcontact pads 74 to operate as intended (e.g., to emit light in response to control signals from a second subpixel controller 32).FIG. 1B illustrates aredundant pixel layout 99 with second-subpixel-controller location 33 and second-light-emitter location 43 shown with dashed lines. Contactpads 74 in first andsecond subpixels display substrate 10 to indicate electrically conductive areas to which asecond subpixel controller 32 or second light emitter 42 (orfirst subpixel controller 31 or first light emitter 41) could be electrically connected. Contactpads 74 are typically, but not necessarily, formed from electrically conductive metals such as aluminum, polysilicon, or transparent conductive oxides using masking and deposition processes known in the art. -
FIG. 1C illustrates aredundant pixel layout 99 with asecond subpixel controller 32 disposed in second-subpixel-controller location 33 and asecond light emitter 42 disposed in second-light-emitter location 43. Thus, in some embodiments of the present invention, for at least onepixel 20 in an array ofpixels 20,second subpixel 22 of the at least onepixel 20 comprises asecond subpixel controller 32 electrically connected tocontroller wires 70.Second subpixel 22 of the at least onepixel 20 further comprises asecond light emitter 42 electrically connected to second-light-emitter wire 72.Second light emitter 42 is controlled bysecond subpixel controller 32 at least through second-light-emitter wire 72. InFIG. 1C ,contact pads 74 are illustrated with dashed lines to indicate that they are obscured by the presence of first andsecond subpixel controllers light emitters -
Controller wires 70 can be electrically connected in common to both first andsecond subpixel controllers second subpixel 22 is redundant to thefirst subpixel 21.Controller wires 70, as used herein, can refer to, but are not limited to, wires that are used to provide control signals and power or ground (e.g.,row lines 14, column lines 12,power wire 16, and ground wire 17) to first andsecond subpixels First subpixel controller 31 controlsfirst light emitter 41 at least through first-light-emitter wire 71.Ground wire 17 can be electrically connected tofirst light emitter 41,second light emitter 42,first subpixel controller 31, andsecond subpixel controller 32 and can be considered any combination or all of acontroller wire 70, a first-light-emitter wire 71, and a second-light-emitter wire 72. First-light-emitter wire 71 is electrically connected to bothfirst light emitter 41 andfirst subpixel controller 31 to enablefirst subpixel controller 31 to controlfirst light emitter 41. Similarly, second-light-emitter wire 72 is electrically connected to both second-light-emitter location 43 and second-subpixel-controller location 33 to enable control of secondlight emitter 42, as shown inFIG. 1B . As illustrated inFIG. 1C , second-light-emitter wire 72 is electrically connected to bothsecond light emitter 42 andsecond subpixel controller 32 to enablesecond subpixel controller 32 to controlsecond light emitter 42. - As used herein, a
second subpixel 22 is redundant tofirst subpixel 21 if thesecond subpixel 22 is intended to replicate and have substantially identical functions and components (e.g., within manufacturing tolerances) as thefirst subpixel 21. For example, in certain embodiments, asecond subpixel 22 comprising a second-subpixel location is redundant to afirst subpixel 21 if, when asecond subpixel controller 32 is disposed in a second-pixel-controller location 33 and electrically connected tocontroller wires 70 and asecond light emitter 42 is disposed in a second-light-emitter location 43 and electrically connected to second-light-emitter wire 72, then thesecond subpixel 22 replicates and has substantially identical function to thefirst subpixel 21. Thus,first subpixel 21 can be electrically connected in parallel withsecond subpixel 22. In some such embodiments,second subpixel controller 32 is intended to be functionally identical tofirst subpixel controller 31 andsecond light emitter 42 is intended to be functionally identical tofirst light emitter 41 andsecond subpixel 22 is intended to be substantially identically electrically connected to the same inputs and outputs (if any) asfirst subpixel 21. Thus, in certain embodiments, if both first andsecond subpixels - If
first subpixel 21 is defective, missing, or improperly connected to its electrical connections, a properly functional and electrically connectedsecond subpixel 22 can operate in the place offirst subpixel 21, or vice versa. In some embodiments of the present invention,first subpixel 21 is faulty. In some embodiments of the present invention,second subpixel 22 is faulty. In some embodiments of the present invention, acontroller wire 70, first-light-emitter wire 71, second-light-emitter wire 72, apower wire 16, or aground wire 17 in apixel 20 is cut (e.g., to prevent operation of a faulty subpixel). In some embodiments, the cut wire is in a faultyfirst subpixel 21 or a faultysecond subpixel 22, or both. - Referring to
FIG. 1B and discussed above,second subpixel 22 is redundant tofirst subpixel 21 becausesecond subpixel 22 comprises asecond subpixel location 32 comprising an element comprising electrical connections disposed in a portion or area ofdisplay substrate 10 that provide the same signals and electrical connections as those offirst subpixel 21. Referring toFIG. 1C ,second subpixel 22 is redundant tofirst subpixel 21 becausefirst subpixel controller 31 is substantially functionally identical tosecond subpixel controller 32,first light emitter 41 is substantially functionally identical tosecond light emitter 42, both first andsecond subpixel controllers power wire 16,ground wire 17, thesame row line 14, and thesame column line 12, and first and secondlight emitters ground wire 17 and a similar control signal from theirrespective subpixel controllers 30. Thus, first andsecond subpixels - According to some embodiments of the present invention, substantially identical components, functionality, operation, and electrical connections need not be exactly identical. Those familiar with manufacturing process control will understand that variations in materials and processes will result in corresponding differences in structures and functions in manufactured devices. As intended herein, “substantially identical” components, functions, or connections are intended to operate identically but can differ in their operation within manufacturing variability and tolerances. For example,
first light emitter 41 can differ from substantially identical secondlight emitter 42 in efficiency, color of light emission, lifetime, and other operating characteristics or parameters if first and secondlight emitters - As used herein, elements (e.g.,
light emitters 40,subpixel controllers 30, light-emitter locations 43, or subpixel-controller locations 33) disposed on or overdisplay substrate 10 within acommon pixel 20 that are “adjacent” have no spatially intervening element (e.g., no spatially intervening functionally similar element) on or overdisplay substrate 10 in a direction D substantially parallel to a surface ofdisplay substrate 10 on which the elements are disposed. Hence, no other element within acommon pixel 20 is between adjacent elements on or over the surface ofdisplay substrate 10. Thus, afirst light emitter 41 in afirst subpixel 21 is adjacent to a second light emitter 42 (or second-light-emitter location 43) in asecond subpixel 22 in acommon pixel 20 when there is no other first orsecond light emitter 41, 42 (or first-light-emitter location or second light-emitter location 43) in the first orsecond subpixel subpixel controller 30 is closer to the adjacent first and secondlight emitters light emitters 40 in acommon pixel 20 can be adjacent orsubpixel controllers 30 in acommon pixel 20 can be adjacent, butlight emitters 40 indifferent pixels 20 cannot be adjacent andsubpixel controllers 30 indifferent pixels 20 cannot be adjacent. Components indifferent pixels 20 are not considered adjacent. As used herein, adjacent components can only includesubpixel controllers 30,light emitters 40, andlight emitter locations 43. Furthermore,controller wires 70, first light-emitter wires 71, and second light-emitter wires 72 are not considered adjacent and are not considered to intervene between adjacentlight emitters 40,light emitter locations 43,subpixel controllers 30, or subpixel-controller locations 33, even if present. In some embodiments, a first element (e.g.,light emitter 40, light-emitter location 43,subpixel controller 30, or subpixel-controller location 33) is adjacent to a second element (e.g., light emitter, 40, light-emitter location 43,subpixel controller 30, or subpixel-controller location 33) when there is no other element (e.g.,light emitter 40, light-emitter location 43,subpixel controller 30, or subpixel-controller location 33) disposed therebetween and also the elements are equally close or closer together than any other element (e.g.,light emitter 40, light-emitter location 43,subpixel controller 30, or subpixel-controller location 33) is to the first element. In some embodiments, for example, afirst light emitter 41 in afirst subpixel 21 is adjacent to asecond light emitter 42 in asecond subpixel 22 when no element (e.g.,light emitter 40 orsubpixel controller 30 of any subpixel (e.g., first orsecond subpixels 21, 22)) is disposed therebetween and thesecond light emitter 42 is the closest element (e.g., of the second subpixel 22) to the first light emitter 41 (or, in some embodiments, is equally close to thefirst light emitter 42 as another light emitter 40 (e.g., in thefirst subpixel 21 or second subpixel 22)). - For example, according to some embodiments of the present invention and as shown in
FIG. 1C , no otherlight emitter 40 is disposed between adjacent light emitters 40 (or corresponding locations) on or over the surface ofdisplay substrate 10 and in a direction D substantially parallel to a surface ofdisplay substrate 10 on whichlight emitters 40 are disposed (as shown inFIG. 1A ). Furthermore, in this example, nosubpixel controller 30 is disposed between twoadjacent light emitters 40. Similarly,adjacent subpixel controllers 30 have no spatially interveningother subpixel controller 30 orlight emitter 40 disposed between theadjacent subpixel controllers 30 on or overdisplay substrate 10.FIG. 1C illustrates twoadjacent light emitters 40 and twosubpixel controllers 30 that are not adjacent. - According to some embodiments of the present invention, first and second
light emitters display substrate 10 and in a direction D substantially parallel to a surface ofdisplay substrate 10 on or over which the first and secondlight emitters pixels 20 in an array ofpixels 20. According to some embodiments, first and secondlight emitters display substrate 10 and in a direction D substantially parallel to a surface ofdisplay substrate 10 on or over which the first and secondlight emitters subpixel controllers 30 indifferent pixels 20 in the array ofpixels 20. Since an objective of certain embodiments of the present invention is to providerobust pixels 20 that can operate in the presence of failedsubpixel controllers 30 orlight emitters 40, or both, and provide improved color integration of the light frompixels 20, it is desirable that the redundant components operate electrically, optically, visually, and spatially identically. By disposing first and secondlight emitters light emitters single light emitter 40 at a single light-emitter location. As is well known in the art, the human visual system is sensitive to visible spatial discontinuities or disruptions in regular structures, such as an array ofpixels 20 in adisplay 98. Thus, redundant secondlight emitters 42 that are not located in the same location asfirst light emitters 41 or in close proximity could be visible as an anomaly to a viewer. By disposing redundant secondlight emitters 42 in a subpixel location adjacent to and very close to the location of afirst light emitter 41, any such visible anomalies or abnormalities are reduced or eliminated. - Referring to
FIG. 1A , active-matrix pixels 20 indisplay 98 can be controlled through row andcolumn lines column controllers system controller 96. Row, column, andsystem controllers display substrate 10 or external to display 98 (as shown inFIG. 1A ) and electrically connected throughbuses 18 that provide electrical connections to thedisplay substrate 10. Row, column, andsystem controllers Buses 18 can be provided in ribbon cables and connectors, and row andcolumn lines display substrate 10 using photolithographic methods and materials, for example to make metal wires or traces, as is known in the display industry. - In operation,
system controller 96 ofdisplay 98 provides control signals to rowcontrollers 94 and data signals tocolumn controllers 92 throughbus 18. Row andcolumn controllers column lines pixels 20 to provide active-matrix control to thedisplay 98. In a fullyfunctional display 98, as illustrated inFIG. 1B , the control and data signals are provided to second-subpixel-controller location 33 and second-light-emitter location 43. The control and data signals are also received byfirst subpixel controller 31 andfirst subpixel controller 31 controlsfirst light emitter 41 to emit light as desired. In a fullyfunctional display 98, as illustrated inFIG. 1C , the control and data signals are received by both first andsecond subpixel controllers First subpixel controller 31 controlsfirst light emitter 41 to emit light as desired andsecond subpixel controller 32 controls secondlight emitter 42 to emit light as desired. Since, in some embodiments with no faults, both first andsecond subpixels display 98 can be calibrated, for example bysystem controller 96 to emit the desired amount of light, for example by specifying that first andsecond subpixels pixel 20 each emit one half of the nominal amount of light so that when the two light emitters 40 (first and secondlight emitters 41, 42) emit light, the desired, nominal amount of light is emitted from thepixel 20. - If a
first subpixel 21 in apixel 20 is faulty, thesecond subpixel 22 can emit the desired amount of light from thepixel 20, or vice versa. In such embodiments, in operation the control and data signals are received by both first andsecond subpixel controllers first subpixel controller 31 orfirst light emitter 41 is faulty (or, e.g., thecontroller wire 70 or first-light-emitter wire 71 is faulty), light is not emitted as desired. However,second subpixel controller 32 can controlsecond light emitter 42 to emit light as desired frompixel 20. Similarly, ifsecond subpixel 22 is faulty,first subpixel 21 can provide the light desired frompixel 20. In some embodiments,pixels 20 are tested to determine any faulty first orsecond subpixels system controller 96 and/or first orsecond subpixel controllers 31, 32) to drive first andsecond subpixels -
Display substrate 10 can be any suitable substrate having a surface on or over whichpixels 20, first andsecond subpixels subpixel controllers 30, andlight emitters 40 can be disposed, for example and without limitation, a substrate comprising glass, plastic, ceramic, quartz, sapphire, or a semiconductor as are used in the integrated circuit or display industry.Subpixel controllers 30,system controller 96,row controller 94, andcolumn controller 92 can be integrated circuits or discrete components and can be analog, digital, or mixed-signal circuits and can be silicon circuits made using integrated circuit methods and materials.Light emitters 40 can be light-emitting diodes such as inorganic light-emitting diodes (ILEDs).Light emitters 40 can be formed in any one or more of a variety of doped or undoped compound semiconductors, such as, for example and without limitation, one or more of GaN, InGaN, GaAs, AlGaAs, GaAsP, GaP, AlGaInP, SiC, CdSe, CdS, and ZnSe. - In some embodiments,
subpixel controllers 30,light emitters 40, or both, are provided in separate components with independent and separate substrates and are disposed ondisplay substrate 10, for example using surface mount technology and assembly or using transfer printing. In some embodiments,subpixel controllers 30 orlight emitters 40 comprise or are bare unpackaged die, integrated circuits, or unpackaged integrated circuits. In some embodiments,subpixel controllers 30 orlight emitters 40 can be or include one or more of electronic circuits, optical circuits, transducers, light-emitting diodes, micro-light-emitting diodes, sensors, capacitive sensors, touch sensors, photo-sensors, electromagnetic radiation sensors, and piezo-electric sensors. - Transfer printing materials and methods can dispose very small devices on a substrate such as
display substrate 10, for example having at least one of a length and a width less than or equal to 200, 100, 50, 20, or 10 microns. According to some embodiments of the present invention, such small devices can improve display resolution and the visual quality ofdisplay 98 by enabling the disposition of secondlight emitters 42 very close tofirst light emitters 41, so that viewers cannot readily visually distinguish secondlight emitters 42 fromfirst light emitters 41 and substantially preventing spatial visual anomalies fromdisplays 98 using redundant secondlight emitters 42 to improvedisplay 98 yields and visual quality. -
FIGS. 1A, 1B, and 1C illustratepixels 20 with asingle light emitter 40 in each of first andsecond subpixels first subpixel 21 comprises two or morefirst light emitters 41, for example three first light emitters 41 (e.g., red firstlight emitter 41R, greenfirst light emitter 41G, bluefirst light emitter 41B) andsecond subpixel 22 comprises two or more second-light-emitter locations (e.g., red second-light-emitter location 43R, green second-light-emitter location 43G, blue second-light-emitter location 43B) (e.g., as illustrated inFIG. 2A ). - Referring to
FIG. 2B ,second subpixel 22 comprises two or more light emitters 40 (e.g., red secondlight emitter 42R, green secondlight emitter 42G, blue secondlight emitter 42B). In some such embodiments,first subpixel 21 ofpixel 20 comprises two or morefirst light emitters 41 that each emit light of a different color from otherfirst light emitters 41 andsecond subpixel 22 ofpixel 20 comprises two or more secondlight emitters 42 that each emit light of a different color from other secondlight emitters 42. In some embodiments of the present invention, two or morefirst light emitters 41 comprise a red firstlight emitter 41R that emits red light, a greenfirst light emitter 41G that emits green light, and a bluefirst light emitter 41B that emits blue light. Similarly, two or more secondlight emitters 42 can comprise a red secondlight emitter 42R that emits red light, a green secondlight emitter 42G that emits green light, and a blue secondlight emitter 42B that emits blue light. Firstlight emitters 41 are disposed in a first line L1 and secondlight emitters 42 are disposed in a second line L2 different from but parallel to first line L1. In some such embodiments,first light emitters 41 are between secondlight emitters 42 andfirst subpixel controller 31 and secondlight emitters 42 are betweensecond subpixel controller 32 andfirst light emitters 41, providing a relatively square andcompact pixel 20 area overdisplay substrate 10 that can have a higher resolution and improved appearance. - According to some embodiments of the present invention, for example as shown in
FIG. 2A , a first group of light emitters (e.g., comprising red, green, and bluefirst light emitters light emitters 40,light emitter locations 43, orsubpixel controllers 32 not in the first group or the second group are disposed therebetween. According to some embodiments of the present invention, for example as shown inFIG. 2B , a first group of light emitters 40 (e.g., comprising red, green, and bluefirst light emitters light emitters light emitters 40,light emitter locations 43, orsubpixel controllers 32 not in the first group or the second group or are disposed therebetween. A group oflight emitters 40 or light-emitter locations 43 is a set oflight emitters 40 or light-emitter locations 43 or a combination thereof, respectively, that are electrically connected to a common subpixel controller or subpixel-controller location, respectively. Referring toFIG. 2A ,first subpixel controller 31 is not adjacent second-subpixel-controller location 33. Referring toFIG. 2B , first andsecond subpixel controllers FIG. 2B , red firstlight emitter 41R is adjacent to blue secondlight emitter 42B, greenfirst light emitter 41G is adjacent to green secondlight emitter 42G, and bluefirst light emitter 41B is adjacent to red secondlight emitter 42R. Thus,first light emitters 41 ofpixel 20 are adjacent to secondlight emitters 42 ofpixel 20. This arrangement has the advantage of a more compact light emitting area for first and secondlight emitters display substrate 10, improving color light integration of theentire pixel 20. - In some embodiments, either first or second
light emitters light emitter 41R is adjacent to red secondlight emitter 42R, greenfirst light emitter 41G is adjacent to green secondlight emitter 42G, and bluefirst light emitter 41B is adjacent to blue secondlight emitter 42B, thus providing a compact layout and disposing first and secondlight emitters - Referring to
FIG. 3A , in some embodiments of the present invention,first light emitters 41 ofpixel 20 and secondlight emitters 42 ofpixel 20 are disposed in a common line L, red first and secondlight emitters second light emitters light emitters first light emitters 41 are interdigitated with secondlight emitters 42 in apixel 20. In the illustrative embodiment shown inFIG. 3A , first andsecond subpixel controllers light emitter 42R closer to red firstlight emitter 41R, locating redundant green secondlight emitter 42G closer to greenfirst light emitter 41G, and locating redundant blue secondlight emitter 42B closer to the bluefirst light emitter 41B.FIG. 3B shows a structure corresponding toFIG. 3A beforesecond subpixel controller 32 and secondlight emitters second subpixel 22 comprises second-sub-pixel-controller location 33 and second-light-emitter locations 43R, 43G, 43B). - Certain embodiments of the present invention provide advantages in manufacturing repair and yields, as well as in color integration from
light emitters 40 in apixel 20, for example enabled by micro-transfer printing very smalllight emitters 40 such as inorganic micro-LEDs. In some embodiments, for example as shown inFIG. 1C ,first subpixel controller 31 has an area that is greater than an area offirst light emitter 41 orsecond subpixel controller 32 has an area that is greater than an area of secondlight emitter 42, or both. According to some embodiments of the present invention, such as those shown inFIGS. 2 and 3 ,first subpixel controller 31 has an area that is greater than the combined areas of all of thefirst light emitters 41,second subpixel controller 32 has an area that is greater than the combined areas of all of the secondlight emitters 42, or both. -
FIGS. 2A and 2B illustrate embodiments of the present invention in whichsecond subpixel 22 is a redundant replica offirst subpixel 21 rotated by 180 degrees about an axis perpendicular to a surface ofdisplay substrate 10 on which first andsecond subpixels second subpixel 22 can be a redundant replica offirst subpixel 21 rotated by other amounts, for example by 90 degrees (shown inFIG. 4A ) or by 270 degrees (shown inFIG. 4B ). Other rotational amounts are also possible, for example 45 degrees, 135 degrees, 225 degrees, or 315 degrees, or any other rotation.FIGS. 4C and 4D show corresponding structures toFIGS. 4A and 4B beforesecond subpixel controller 32 and secondlight emitters second subpixel 22 comprises second-subpixel-controller location 33 and second-light-emitter locations 43R, 43B, 43G). -
FIG. 5 is an exemplary layout of the configuration illustrated inFIGS. 2A and 2B on adisplay substrate 10 andFIG. 6 is a layout of the configuration illustrated inFIG. 3 on adisplay substrate 10, with power wire 16 (Vdd) as the common connection to thelight emitters 40, rather than theground wire 17. Those knowledgeable in the electronic arts will understand that negative logic can be used rather than positive logic to implement electronic circuits. Embodiments according toFIGS. 2A and 2B using theFIG. 5 layout have been constructed, tested, and successfully operated. - Certain exemplary embodiments of the present invention have been constructed using micro-transfer printing. In an exemplary micro-transfer printing process, components such as
light emitters 40 orsubpixel controllers 30 are constructed on substrates of native source wafers, for example crystalline semiconductors. The native substrates can be of different types, for example compound semiconductors for light emitters 40 (e.g., whenlight emitters 40 are inorganic light emitting diodes) and silicon forsubpixel controllers 30. The components are disposed over sacrificial portions separated by anchor portions of a sacrificial layer on the native wafers. The sacrificial portions are etched, for example with a liquid chemical etchant, to release the components from the native wafer leaving the components attached to the anchor portions by one ormore tethers 60. A stamp, for example a PDMS stamp having a post for each component, is pressed against the components so that a component is adhered to each post, the stamp is removed so that thetethers 60 fracture or separate, leaving the components adhered to the stamp posts. The components on the posts are then pressed against a destination substrate to adhere the components to the destination substrate, and the stamp is removed, leaving components with fractured or separatedtethers 60 on the destination substrate, where they can be further processed, for example photolithographically processed to electrically interconnect the components, or can be tested.FIG. 7 shows fractured tethers 60 ofsubpixel controller 30 andlight emitters display substrate 10 by micro-transfer printing. -
FIG. 7 is a micrograph of a subpixel (e.g.,first subpixel 21 or second subpixel 22),FIG. 8 is a micrograph of acomplete pixel 20, andFIG. 9 is a perspective of apixel 20 from abovedisplay substrate 10 corresponding toFIGS. 2A, 2B, and 5 . In these illustrative embodiments, light emitters 40 (e.g., red light emitter 40R,green light emitter 40G,blue light emitter 40B) andsubpixel controllers 30 are disposed directly ondisplay substrate 10 or layers disposed ondisplay substrate 10 by micro-transfer printinglight emitters 40 andsubpixel controllers 30 from respective native source substrate wafers directly to displaysubstrate 10 or layers disposed ondisplay substrate 10. The structures illustrated inFIGS. 7 and 8 have been constructed and successfully operated according to certain embodiments of the present invention, using a power wire 16 (Vdd) as a common connection to thelight emitters 40, and as illustrated inFIGS. 5 and 6 , rather than aground wire 17 as inFIGS. 1-4 . In certain embodiments, for example as shown inFIG. 8 , one or more oflight emitters 40 andsubpixel controllers 30 can comprise one or more photolithographically defined electrodes for making appropriate electrical connection from the one or more oflight emitters 40 orsubpixel controllers 30 to electrical connections disposed ondisplay substrate 10. - In some embodiments of the present invention, referring to
FIG. 10 ,redundant pixel layout 99 comprises an array ofpixel substrates 50 disposed on or overdisplay substrate 10. Eachpixel 20 is disposed on or over a correspondingpixel substrate 50 and any one or all offirst subpixel controllers 31,first light emitters 41,second subpixel controllers 32, and secondlight emitters 42 can be micro-transfer printed from a source native wafer topixel substrate 50, can be adhered topixel substrate 50, for example with an adhesive such as a curable adhesive, and can each comprise a broken or separatedtether 60.Pixel substrates 50 are separate, distinct, and independent ofdisplay substrate 10 or anylight emitter 40 substrate orsubpixel controller 30 substrate and can be adhered to displaysubstrate 10, for example with an adhesive such as a curable adhesive.Pixel substrates 50 can be photolithographically processed (e.g., using fine lithography) to form wires on or inpixel substrates 50 to electrically interconnect the components disposed onpixel substrates 50, forexample controller wires 70, first-light-emitter wire 71, and second-light-emitter wire 72. In some embodiments,pixel substrates 50 can themselves be micro-transfer printed from a source wafer to displaysubstrate 10 and can comprise a fractured or separatedtether 60. For example, in some embodiments, when a faultyfirst subpixel 21 is determined, asecond subpixel controller 32 is disposed on or in second-subpixel-controller location 33 onpixel substrate 50 and second light emitter(s) 42 (e.g., 42R, 42G, 42B) are disposed on or in second-light-emitter location(s) 42 onpixel substrate 50. - In some embodiments of the present invention, referring to
FIG. 11 , theredundant pixel layout 99 comprises an array offirst subpixel substrates 51 disposed on or overdisplay substrate 10 and an array ofsecond subpixel substrates 52 disposed on or over thedisplay substrate 10. Eachfirst subpixel 21 is disposed on or over a correspondingfirst subpixel substrate 51 and eachsecond subpixel 22 is disposed on or over a correspondingsecond subpixel substrate 52. Any one or all offirst subpixel controllers 31 andfirst light emitters 41 can be micro-transfer printed from native source wafers tofirst subpixel substrate 51, can be adhered tofirst subpixel substrate 51 with an adhesive such as a curable adhesive, and can comprise a broken (e.g., fractured) or separatedtether 60. Similarly, any one or all ofsecond subpixel controllers 32 and secondlight emitters 42 can be micro-transfer printed from native source wafers tosecond subpixel substrate 52, can be adhered tosecond subpixel substrate 52 with an adhesive such as a curable adhesive, and can comprise a broken (e.g., fractured) or separatedtether 60. Thus,first subpixel substrates 51 are separate, distinct, and independent ofdisplay substrate 10 or anyfirst light emitter 41 substrate orfirst subpixel controller 31 substrate, or anysecond subpixel substrate 52.First subpixel substrate 51 can be photolithographically processed to form wires on or infirst subpixel substrates 51 to electrically interconnect the components disposed onfirst subpixel substrates 51, forexample controller wires 70 and first-light-emitter wire 71. Similarly,second subpixel substrates 52 are separate, distinct, and independent ofdisplay substrate 10 or anysecond light emitter 42 substrate orsecond subpixel controller 32 substrate, or anyfirst subpixel substrate 51.Second subpixel substrate 52 can be photolithographically processed to form wires on or insecond subpixel substrates 52 to electrically interconnect the components disposed onsecond subpixel substrates 52, forexample controller wires 70 and second-light-emitter wire 72. In some embodiments,first subpixel substrates 51 andsecond subpixel substrates 52 can be micro-transfer printed from a same or different native source wafers to displaysubstrate 10. - In certain embodiments, one or more of
light emitters 40 andsubpixel controllers 30 comprise one or more connection posts for making appropriate electrical connection to electrical connections disposed on pixel substrate 50 (if present),subpixel substrate 51, 52 (if present), ordisplay substrate 10. In certain embodiments, one or more offirst light emitters 41, secondlight emitters 42,first subpixel controllers 31, andsecond subpixel controllers 32 can comprise one or more connection posts for making appropriate electrical connection to electrical connections disposed onfirst subpixel substrate 51 orsecond subpixel substrate 52. Connections posts, methods of fabrication, and methods for making electrical connection using connections posts are described in U.S. Patent Publication No. 2017/0048976 A1, the disclosure of which is hereby incorporated by reference in it is entirety. - In some embodiments of the present invention, a
pixel 20 comprising apixel substrate 50 or first orsecond subpixel second subpixel substrates display substrate 10, the one or more connection posts extend towarddisplay substrate 10. In this way,pixel 20 or first orsecond subpixel display substrate 10, which comprises electrical connections (e.g., one or more of controller wires 70 (e.g.,power wire 16,ground wire 17,row line 14, column line 12) and contact pads 74) such that upon transfer,pixel 20 or first orsecond subpixel pixel substrate 50 or first orsecond subpixel substrate pixel 20 or first orsecond subpixel substrate 10. Optionally, curing of a curable adhesive can improve or cause electrical interconnection betweenpixel 20 orsubpixel pixel substrate 50 orsubpixel substrate pixels 20 comprising apixel substrate 50 and one or more connection posts orsubpixels second subpixel substrate pixels 20 or first orsecond subpixels display substrate 10 thereby reducing manufacturing costs. -
FIG. 12A shows an illustrative embodiment in whichground wires 17,power wires 16,column wires 12, androw wires 14 are pre-patterned ondisplay substrate 10 andfirst subpixel 21 comprisingfirst subpixel substrate 51 andsecond subpixel 22 comprisingsecond subpixel substrate 52 are transferred to displaysubstrate 10 such that upon transfer, all necessary electrical connections are present and made forpixel 20 to function as intended. In this illustrative embodiment,ground wires 17,power wires 16,column wires 12, androw wires 14 are shown to run underneathfirst pixel substrate 51 andsecond subpixel substrate 52 where electrical interconnection with thewires 70 occurs through connection posts (not shown) (e.g., corresponding electrical vias through first andsecond pixel substrates 51, 52).FIG. 12B shows an embodiment corresponding toFIG. 12A before disposition ofsecond subpixel substrate 52 on whichsecond subpixel controller 32 and secondlight emitters row wires 14,column wires 12,power wires 16, andground wires 17 are disposed ondisplay substrate 10 in such a way that, when second subpixel substrate 52 (having the necessary elements and interconnections disposed thereon) is disposed ondisplay substrate 10,second subpixel 22 will be operable as intended,second subpixel 22 is said to comprise a second-subpixel-controller location 33 and second-light-emitter location 43. - Referring to
FIGS. 13 and 14 , according to some embodiments of the present invention, a method of making aredundant pixel layout 99 comprises providing adisplay substrate 10 instep 100 and disposing wires in locations in subpixel locations on or in display substrate 10 (e.g.,controller wires 70, first-light-emitter wire 71, and second-light-emitter wire 72) instep 110. In some embodiments of the present invention,display substrate 10 is provided with the wires formed on or in thedisplay substrate 10 so thatsteps first subpixel controllers 31 andfirst light emitters 41 disposed on or overdisplay substrate 10 instep 120 as well as interconnecting electrical connections (e.g., contact pads 74) in second-subpixel-controller locations 33 and second-light-emitter locations 43. - Referring to
FIG. 13 , for eachpixel 20 in the array of pixels, asecond subpixel controller 32 electrically connected to thecontroller wires 70 in second-subpixel-controller location 33 and asecond light emitter 42 electrically connected to second-light-emitter wire 72 in second-light-emitter location 43 is provided instep 130.Second light emitter 42 is controlled bysecond subpixel controller 32 at least through second-light-emitter wire 72. First andsecond subpixels pixels 20 are tested instep 140 to identify badfirst subpixels 21, badsecond subpixels 22, or both. Inoptional step 150, subpixel wires are cut to electrically isolate components in the bad first orsecond subpixels First subpixels 21 can each comprise apower wire 16 and aground wire 17, as well ascontroller wires 70 and first-light-emitter wire 71, and at least onepower wire 16, oneground wire 17, onecontroller wire 70, or first-light-emitter wire 71 in at least one badfirst subpixel 21 can be cut. Similarly,second subpixels 22 can each comprise apower wire 16 and aground wire 17 as well ascontroller wires 70 and second-light-emitter wire 72, and at least onepower wire 16, oneground wire 17, onecontroller wire 70, or second-light-emitter wire 72 in at least one badsecond subpixel 22 can be cut. Oncedisplay 98 is repaired, it can be put into operation instep 160. Generally, one or more wires to a faulty subpixel can be, but are not necessarily, cut prior to operation. - Referring to
FIG. 14 ,first subpixels 21 in the array ofpixels 20 are tested instep 145 to determine faultyfirst subpixels 21. For eachfaulty subpixel 21, asecond subpixel controller 32 electrically connected to thecontroller wires 70 in second-subpixel-controller location 33 and asecond light emitter 42 electrically connected to second-light-emitter wire 72 in second-light-emitter location 43 is provided instep 135.Second light emitter 42 is controlled bysecond subpixel controller 32 at least through second-light-emitter wire 72. Inoptional step 150, subpixel wires are cut to electrically isolate components in the badfirst subpixels 21.First subpixels 21 can each comprise apower wire 16 and aground wire 17, as well ascontroller wires 70 and first-light-emitter wire 71, and at least onepower wire 16, oneground wire 17, onecontroller wire 70, or first-light-emitter wire 71 in at least one badfirst subpixel 21 can be cut. Oncedisplay 98 is repaired, it can be put into operation instep 160. Generally, one or more wires to a faulty subpixel can be, but are not necessarily, cut prior to operation. -
Display substrate 10 can be a printed circuit board or a glass, metal, ceramic, resin, semiconductor, quartz, sapphire, or polymer substrate.Subpixel controllers 30 orlight emitters 40 can be chiplets that are micro-transfer printed ontodisplay substrate 10. Electricallyconductive row lines 14, column lines 12 can be patterned wires, conductive traces, cured conductive ink, or other electrical conductors suitable for pattern-wise conducting electricity on a substrate and can be made of copper, silver, gold, aluminum, titanium, tantalum, conductive metal, transparent conductive oxides (TCOs) such as indium tin oxide, or any other conductive material. Conductive row lines 14 orcolumn lines 12 can be patterned and interconnected or electrically isolated overdisplay substrate 10 using photolithographic or printed circuit board techniques. Generally,controller wires 70, whether disposed on an intermediate substrate (e.g., apixel substrate 50 or a first orsecond subpixel substrate 51, 52) or adisplay substrate 10 can be formed lithographically.Controller wires 70 can be formed, for example, either before or after transfer of any one or combination of apixel 20,subpixel subpixel controller 30, orlight emitter 40. That is, one or more (e.g., all) ofcontroller wires 70 can be disposed in some embodiments at least partially (and in some embodiments exclusively) under, over, or on a side (e.g., wrapping up onto the side) of alight emitter 40,subpixel controller 30,pixel substrate 50, orsubpixel substrate -
Pixels 20 are matrix addressed through row andcolumn lines column lines Additional power wires 16 andground wires 17 or other control signals can be provided to pixels 20 (not shown inFIG. 1 ). As will be clear to one of ordinary skill, wires as shown throughout the figures may only have a portion of certain wires (e.g., row andcolumn lines 14, 12) shown for simplicity (e.g., as inFIG. 9-11 , for example) with the understanding that the wire may continue beyond what is shown in order to properly electricallyinterconnect display 98.Column lines 12 can be controlled by acolumn controller 92 through abus 18 androw lines 14 can be controlled by arow controller 94 through anotherbus 18. Thebuses 18 can be electrical buses, for example arrays of wires provided in a flexible, flat cable or rigid connectors. Row andcolumn controllers system controller 96. In some embodiments,light emitters 40 are inorganic light-emitting diodes or specifically inorganic micro-light-emitting diodes. - In operation,
row controller 94 andcolumn controller 92matrix address pixels 20 indisplay 98.Row controller 94 selects a row by providing a row select signal (for example a voltage or a digital signal such as a digital HIGH value or a one) onrow line 14 corresponding to the row ofpixels 20 that are addressed.Column controller 92 provides data oncolumn lines 12 and the data is combined with the row select signal (for example using a digital AND gate or a voltage differential between row andcolumn lines 14, 12) bysubpixel controllers 30 to enter data intosubpixel controllers 30 and causelight emitters 40 to operate and emit light. Thus, one row ofpixels 20 is addressed at one time. After one row ofpixels 20 are addressed, another row can be addressed in the same way, for example a neighboring row, until all of the rows have been addressed. The data provided oncolumn lines 12 can be provided bysystem controller 96 throughcolumn controller 92, for example by shifting data values along a serial shift register until the data is aligned with the column ofpixels 20 for which the data is intended for the selected row. System, row, andcolumn controllers column lines - As will be understood by those knowledgeable in the art, the terms “row” and “column” are arbitrary appellations that can be exchanged without affecting the functionality or structure of the present invention. Hence, the terms row and column can be interchanged without affecting the structure or operation of the present invention and are included in the present invention. Further, it is understood that the terms “first” and “second” as used herein throughout are arbitrary designations and any description of a “first” element or “second” element could likewise written as a corresponding description of a “second” element or “first” element, respectively.
- In some embodiments of the present invention,
subpixel controllers 30 orlight emitters 40 can be defective (or, as used interchangeably, “faulty” or “failed”), for example having failed circuitry or failed electrical connections tocontroller wires 70 or first- or second-light-emitter wires non-functional subpixel controller 30 orlight emitter 40; (iv) anabsent subpixel controller 30 orlight emitter 40 such as one that failed to print or adhere adequately to displaysubstrate 10,pixel substrate 50, or one of first andsecond subpixel substrate subpixel controller 30 orlight emitter 40 with unintended output, for example the wrong brightness, light output distribution, or color; or (vi) asubpixel controller 30 orlight emitter 40 that functions only intermittently. In certain embodiments, apixel 20 orsubpixel - In some embodiments of the present invention,
subpixel controllers 30 orlight emitters 40 are small integrated circuits, for example chiplets, having a thin substrate with a thickness of only a few microns, for example less than or equal to 25 microns, less than or equal to 15 microns, or less than or equal to 10 microns, and at least one of a width and length of between 5-1000 microns (e.g., 5-10 microns, 10-50 microns, 50-100 microns, or 100-200 microns, 200-500 microns, or 500-1000 microns). Such chiplets can be made in a source semiconductor wafer (e.g., a silicon or GaN wafer) having a process side and a back side used to handle and transport the wafer. Chiplets are formed using lithographic processes in an active layer on or in the process side of the source wafer. In certain embodiments, an empty release layer space is formed beneath the chiplets withtethers 60 connecting the chiplets to the source wafer in such a way that pressure applied against or tension applied to the chiplets breaks or separates thetethers 60 to release the chiplets from the source wafer, for example with a micro-transfer printing stamp. Methods of forming and transferring such structures are described, for example, in U.S. Pat. No. 8,889,485 the disclosure of which is incorporated by reference herein in its entirety. - Lithographic processes for forming chiplets in a source wafer, for example transistors, wires, and capacitors, can be found in the integrated circuit art. The chiplets can be constructed using foundry fabrication processes used in the art. Layers of materials can be used, including materials such as metals, oxides, nitrides and other materials used in the integrated-circuit art. Each chiplet can be a complete semiconductor integrated circuit and can include, for example, transistors. The chiplets can have different sizes, for example, 1000 square microns or 10,000 square microns, 100,000 square microns, or 1 square mm, or larger, and can have variable aspect ratios, for example 1:1, 2:1, 5:1, or 10:1. The chiplets can be rectangular or can have other shapes. In certain embodiments, electrically conducting wires, such as
controller wires 70, include patterned metal layers formingcontact pads 74. Thecontact pads 74 can be made using integrated circuit photolithographic methods. - According to some embodiments of the present invention, native source wafers can be provided with the chiplets, release layer, and tethers 60 already formed, or they can be constructed as part of a method in accordance with certain embodiments of the present invention.
- The chiplets can be constructed using foundry fabrication processes used in the art. Layers of materials can be used, including materials such as metals, oxides, nitrides and other materials used in the integrated-circuit art. Each chiplet can be a complete semiconductor integrated circuit and can include, for example, transistors. The chiplets can have different sizes, for example, 1000 square microns or 10,000 square microns, 100,000 square microns, or 1 square mm, or larger, and can have variable aspect ratios, for example 1:1, 2:1, 5:1, or 10:1. The chiplets can be rectangular or can have other shapes.
- A source wafer and chiplets and
display substrate 10 can be made separately and at different times or in different temporal orders or locations and provided in various process states. - Matrix-addressed systems according to certain embodiments of the present invention can be constructed using display and thin-film manufacturing method independently of or in combination with micro-transfer printing methods, for example as are taught in U.S. Pat. No. 9,520,537 entitled Micro Assembled Micro LED Displays and Lighting Elements and in U.S. patent application Ser. No. 14/822,868 filed Sep. 25, 2014, entitled Compound Micro-Assembly Strategies and Devices, the contents of which are incorporated by reference herein in their entirety.
- As is understood by those skilled in the art, the terms “over” and “under” are relative terms and can be interchanged in reference to different orientations of the layers, elements, and substrates included in the present invention. For example, a first layer on a second layer, in some implementations means a first layer directly on and in contact with a second layer. In other implementations a first layer on a second layer includes a first layer and a second layer with another layer therebetween.
- Having described certain implementations of embodiments, it will now become apparent to one of skill in the art that other implementations incorporating the concepts of the disclosure may be used. Therefore, the disclosure should not be limited to certain implementations, but rather should be limited only by the spirit and scope of the following claims.
- Throughout the description, where apparatus and systems are described as having, including, or comprising specific components, or where processes and methods are described as having, including, or comprising specific steps, it is contemplated that, additionally, there are apparatus, and systems of the disclosed technology that consist essentially of, or consist of, the recited components, and that there are processes and methods according to the disclosed technology that consist essentially of, or consist of, the recited processing steps.
- It should be understood that the order of steps or order for performing certain action is immaterial so long as the disclosed technology remains operable. Moreover, two or more steps or actions in some circumstances can be conducted simultaneously. The invention has been described in detail with particular reference to certain embodiments thereof, but it will be understood that variations and modifications can be effected within the spirit and scope of the invention.
-
- D direction/dimension
- DE light-emitter distance
- DP pixel distance
- L line
- L1 first line
- L2 second line
- 10 display substrate
- 12 column line/column wire
- 14 row line/row wire
- 16 power wire (Vdd)
- 17 ground wire
- 18 bus
- 20 pixel
- 21 first subpixel
- 22 second subpixel
- 30 subpixel controller
- 31 first subpixel controller
- 32 second subpixel controller
- 33 second-subpixel-controller location
- 40 light emitter
- 40R red light emitter
- 40G green light emitter
- 40B blue light emitter
- 41 first light emitter
- 41R red first light emitter
- 41G green first light emitter
- 41B blue first light emitter
- 42 second light emitter
- 42R red second light emitter
- 42G green second light emitter
- 42B blue second light emitter
- 43 second-light-emitter location
- 43R red second-light-emitter location
- 43G green second-light-emitter location
- 43B blue second-light-emitter location
- 50 pixel substrate
- 51 first subpixel substrate
- 52 second subpixel substrate
- 60 tether
- 70 controller wire
- 71 first-light-emitter wire
- 72 second-light-emitter wire
- 74 contact pad
- 92 column controller
- 94 row controller
- 96 system controller
- 98 display
- 99 redundant pixel layout
- 100 provide display substrate step
- 110 dispose wires in locations step
- 120 dispose first subpixels step
- 130 dispose second subpixels step
- 135 dispose second subpixels for faulty first subpixels step
- 140 test first and second subpixels step
- 145 test first subpixels step
- 150 cut wires for faulty subpixels step
- 160 operate display step
Claims (26)
Priority Applications (1)
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US16/101,717 US20200051482A1 (en) | 2018-08-13 | 2018-08-13 | Redundant pixel layouts |
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US16/101,717 US20200051482A1 (en) | 2018-08-13 | 2018-08-13 | Redundant pixel layouts |
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US20200051482A1 true US20200051482A1 (en) | 2020-02-13 |
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ID=69406312
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US16/101,717 Pending US20200051482A1 (en) | 2018-08-13 | 2018-08-13 | Redundant pixel layouts |
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US (1) | US20200051482A1 (en) |
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US10910355B2 (en) | 2018-04-30 | 2021-02-02 | X Display Company Technology Limited | Bezel-free displays |
US11127812B2 (en) | 2016-07-26 | 2021-09-21 | X Display Company Technology Limited | Devices with a single metal layer |
WO2022019200A1 (en) * | 2020-07-20 | 2022-01-27 | Agc株式会社 | Transparent display device and manufacturing method therefor |
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US20160343771A1 (en) * | 2014-09-25 | 2016-11-24 | X-Celeprint Limited | Small-aperture-ratio display with electrical component |
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US11127812B2 (en) | 2016-07-26 | 2021-09-21 | X Display Company Technology Limited | Devices with a single metal layer |
US11374086B2 (en) | 2016-07-26 | 2022-06-28 | X Display Company Technology Limited | Devices with a single metal layer |
US10910355B2 (en) | 2018-04-30 | 2021-02-02 | X Display Company Technology Limited | Bezel-free displays |
US11430774B2 (en) | 2018-04-30 | 2022-08-30 | X Display Company Technology Limited | Bezel-free displays |
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