US20190379274A1 - System and method for providing resonance damping - Google Patents
System and method for providing resonance damping Download PDFInfo
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- US20190379274A1 US20190379274A1 US16/374,347 US201916374347A US2019379274A1 US 20190379274 A1 US20190379274 A1 US 20190379274A1 US 201916374347 A US201916374347 A US 201916374347A US 2019379274 A1 US2019379274 A1 US 2019379274A1
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- damping element
- link
- bus
- damping
- link conductor
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/14—Arrangements for reducing ripples from dc input or output
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J1/00—Circuit arrangements for dc mains or dc distribution networks
- H02J1/02—Arrangements for reducing harmonics or ripples
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M5/00—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
- H02M5/40—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc
- H02M5/42—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters
Definitions
- the present disclosure relates generally to damping systems, and, more particularly to systems and methods for providing DC bus resonance damping.
- bus capacitors form resonant circuits with other bus capacitors, high currents flow at and around resonant frequencies, which could lead to significant losses in the bus capacitors and interconnecting conductors if left unaddressed. Such concerns are particularly pronounced in devices with capacitors which have very low internal resistance.
- a system for providing resonance damping comprises a power generation circuit configured to supply power to a direct current (DC) bus.
- the DC bus comprises a first link conductor and a second link conductor.
- Each of the first link conductor and the second link conductor are arranged such that a current induced in either of the first link conductor or the second link conductor generates a corresponding magnetic field having a plurality of magnetic flux lines that extend in a direction generally perpendicular to a first direction of current flow.
- At least two power conversion circuits are coupled to the DC bus.
- a damping element coupled to or arranged proximate to one or both of the first link conductor and the second link conductor, wherein the damping element is arranged such that the plurality of magnetic flux lines induces a plurality of eddy currents having a second direction of current flow in at least one surface of the damping element to provide resonance damping of the system.
- FIG. 1 is a block diagram of a system for controlling a motor according to an embodiment
- FIG. 2 is a schematic illustration of a dual inverter system including a direct current bus and a damping element according to an embodiment
- FIG. 3A is a perspective view of a damping element according to an embodiment
- FIG. 3B is a perspective view of a damping element according to an embodiment
- FIG. 3C is a perspective view of a damping element according to an embodiment
- FIG. 3D is a side view of the damping element of FIG. 3A according to an embodiment
- FIG. 3E is a perspective view of a damping element according to an embodiment
- FIG. 4A is a schematic illustration of a dual inverter system including a direct current bus and a damping element according to an embodiment
- FIG. 4B is a side cross-section view of the direct current bus and damping element of FIG. 4A according to an embodiment
- FIG. 5A is a schematic illustration of a dual inverter system including a direct current bus and a damping element according to an embodiment
- FIG. 5B is a schematic illustration of a damping element arranged in the dual inverter system of FIG. 5A according to an embodiment.
- the system 100 can comprise a power generation circuit 102 , which can include a direct current (DC) power source, electrically coupled to a filtering circuit 104 , at least one damping element 106 and, an electronic circuit such as a power inversion circuit 108 via a DC bus 150 .
- the power generation circuit 102 can also comprise an alternating current (AC) power source coupled to a converter device that supplies the required DC power to the DC bus 150 .
- AC alternating current
- the filtering circuit 104 can be arranged at an input of the power inversion circuit 108 to reduce unwanted noise and/or the magnitude of ripple voltages presented on the DC bus 150 .
- the filtering circuit 104 can include a capacitive element coupled in series with a resistive element (refer, e.g., to FIG. 2 ), but may vary in other embodiments.
- the filtering circuit 10 can comprise multiple bus capacitors, inductive elements, RC filters, or other suitable filtering components.
- At least one damping element 106 can be electrically coupled to the power inversion circuit 108 and can be arranged to provide damping of resonant frequencies.
- the damping element 106 can be coupled to or disposed in parallel relation between respective DC link conductors.
- the power inversion circuit 108 can comprise one or more inverters ( FIG. 2 ) that are configured to perform switching operations to convert the DC bus voltage to an AC output (e.g., a three-phase AC output) for use by an external load such as the motor 165 , which can include an asynchronous or synchronous electric machine.
- FIG. 1 is provided merely for illustrative and exemplary purposes and is in no way intended to limit the present disclosure or its applications.
- the arrangement and/or structural configuration of system 100 can and will vary.
- system 100 can comprise a variety of damping elements and circuit configurations, or fewer or more circuit components.
- system 100 can further comprise overprotection circuitry that is used monitor general bus utilization as well as overload conditions.
- system 100 is scalable in size and performance (i.e., component sizing and power density can be increased or decreased) based on application and/or specification requirements.
- the dual inverter system 200 can comprise a first power inversion circuit 208 a coupled in parallel with a second power inversion circuit 208 b via DC link conductors 251 a, 251 b, 253 a, 253 b, each of which is arranged to supply the required AC output to the respective electric machines 265 a, 265 b.
- each the power inversion circuits 208 a, 208 b are shown as including filtering circuits 204 a, 204 b and power switching circuits 207 a, 207 b.
- the power switching circuits 207 a, 207 b can comprise a plurality of switching devices that are configured to generate a specific phase output (e.g., U-phase, V-phase, W-phase) that is supplied to an input of a respective one of the electric machines 265 a and 265 b.
- a specific phase output e.g., U-phase, V-phase, W-phase
- each of the filtering circuits 204 a and 204 b can comprise at least one bus capacitor 212 a, 212 b coupled in series with an equivalent series resistor 210 a, 210 b between the positive and negative link conductors 251 a, 251 b, 253 a, 253 b ( FIG. 2 ).
- the DC bus i.e., DC bus 250 , 252
- the DC bus 250 , 252 can be electrically coupled to the bus capacitor 212 a or 212 b through the first and second link conductors 251 b and 253 b.
- a resonant circuit can be formed between the filtering components (e.g., capacitors 212 a, 212 b ) arranged in the filtering circuits 204 a and 204 b and an inductive element 256 of, e.g., the link conductor 251 a or 253 a.
- the filtering components e.g., capacitors 212 a, 212 b
- an inductive element 256 of, e.g., the link conductor 251 a or 253 a.
- a damping element 206 can be coupled to the DC bus 250 , 252 and is arranged to prevent strong resonant coupling of the filtering components of the resonant circuit.
- the damping element 206 can be configured to damp high frequency currents that could be stimulated at the input of each of the power inversion circuits 265 a, 265 b when resonant conditions exist.
- the damping element 206 can comprise a variety of suitable configurations, as will be discussed in further detail with reference to FIGS. 3A-5 , which can be selected based on application and/or design specifications.
- a damping element 306 can comprise a first tubular structure 320 a and a second tubular structure 320 b that are arranged to enclose an outer periphery of a respective DC link conductor 351 a, 351 b, 353 a, 353 b.
- Each of the first and the second tubular structures 320 a and 320 b can comprise a metallic material or other suitable materials that is capable of conducting eddy currents to facilitate heat dissipation.
- the first tubular structure 320 a can be arranged to enclose the first DC link conductors 351 a, 353 a, and the second tubular structure 320 b can be sized to accommodate and enclose the second DC link conductors 351 b, 353 b.
- the structural arrangement of the tubular structures 320 a and 320 b can vary according to design and specification requirements.
- each of the tubular structures 320 a and 320 b can comprise a metal tube having an inner cross-section that corresponds to a geometrical configuration of the outer periphery of the DC link conductors 351 a, 351 b, 353 a, and 353 b.
- the damping element can comprise one or more non-continuous structures such as those illustrated in FIGS. 3C and 3D .
- a damping element 308 can comprise a non-continuous structure such as tubular structures 322 a, 322 b each having ferromagnetic or non-ferromagnetic properties, and a gapped portion 327 formed therein ( FIG. 3C ).
- Such an arrangement is particularly advantageous, for example, when the tubular structures 322 a, 322 b comprise ferromagnetic materials because it allows for the cutoff frequency of the damping element 308 to be tuned.
- a damping element 310 is shown.
- the damping element 310 can comprise tubular structures having two or more of structural elements such as structural units 324 a, 326 a and 324 b, 326 b adjacently arranged in spaced relation to one another. Similar to the above embodiment discussed with reference to FIG. 3C , the non-continuous structural arrangement and ferromagnetic properties of the structural units 324 a, 326 a, 324 b, 326 b allows for more effective tuning of the cutoff frequency of the damping element 310 , and also provides for easier manufacturing and assembling.
- the damping element 312 can comprise one or more tubular structures 328 a, 328 b coupled together via a coupling element, which, e.g., can include a shorting strap 325 ( FIGS. 3A and 3B ), or a metallic element 329 ( FIG. 3E ) such as a metal plate (refer, e.g., to FIG. 4A ).
- a coupling element which, e.g., can include a shorting strap 325 ( FIGS. 3A and 3B ), or a metallic element 329 ( FIG. 3E ) such as a metal plate (refer, e.g., to FIG. 4A ).
- the energy dissipated in the damping effect will not heat the DC link conductors themselves (i.e., it will be thermally decoupled).
- the heat dissipation of the damping effect will transfer to the first and second tubular structures 320 a, 320 b rather than to the DC link conductors 351 a, 351 b, 353 a, 353 b of the DC bus 350 , 352 .
- system 400 can comprise a damping element 406 comprising a plate 420 (e.g., a metal plate).
- the plate 420 can comprise ferromagnetic, non-ferromagnetic, or other suitable materials and can be arranged to intercept magnetic flux generated by the DC link conductors 451 a, 451 b, 453 a, 453 b.
- the plate 420 can be arranged such that at least one surface of the plate 420 is arranged generally perpendicular to the magnetic flux lines 453 generated by the DC link conductors 451 a, 451 b, 453 a, 453 b.
- the DC link conductors 451 a, 451 b, 453 a, 453 b are arranged such that a current induced in the conductors generates a corresponding magnetic field having the plurality of magnetic flux lines 453 that extend generally perpendicular to a first direction of current flow (e.g., in a x-direction).
- a first direction of current flow e.g., in a x-direction
- This allows for the maximum induction of eddy currents having a second direction of current flow as indicated by the circular lines 424 in FIG. 4A , which, in some embodiments, can be opposite that of the first direction of current flow.
- the heat dissipation will exist in the plate 420 rather than couple to the DC link conductors 451 a, 451 b, 453 a, 453 b (i.e., the plate 420 will be thermally decoupled from the DC link conductors).
- induction is the form of energy transfer, it is the time rate of change of the magnetic flux that creates a proportional response in the DC link conductors 451 a, 451 b, 453 a, 453 b, which, in turn, permits the transmission of lower frequency signals while impeding higher frequency AC signals.
- a DC bus 550 , 552 and corresponding damping element 506 for a dual inverter system 500 is shown according to an embodiment.
- FIG. 5A a schematic illustration of the dual inverter system 500 is shown and the damping element 506 is shown in FIG. 5B .
- the damping element 506 of system 500 can comprise an electrical transfer device 520 coupled to at least one DC link conductor (e.g., DC link conductor 553 ) of the DC bus 550 , 552 .
- the DC bus 550 , 552 can be electrically coupled to the bus capacitor 512 a, 512 b through the link conductors 553 , 554 .
- the respective bus capacitors 512 a, 512 b can be collectively arranged with one or more switching circuits (e.g., power switching circuit 507 a, 507 b ) to form a first power inversion circuit 508 a and a second power inversion circuit 508 b.
- the electrical transfer device 520 can comprise a ferromagnetic core 522 or other suitable electronic devices.
- the primary circuit portion 524 is shown by winding 522 , but the secondary circuit portion 526 is the core itself ( 522 ) and the eddy currents generated therein.
- the electrical transfer device 520 can comprise a transformer having a gapped core of predetermined dimensions that is configured to prevent magnetic saturation.
- the DC link conductor 553 can be wound around the primary circuit portion 524 of the ferromagnetic core 522 , which can comprise a non-laminated solid core composed of a conductive material.
- a changing current in the DC link conductor 553 will induce strong eddy currents in the ferromagnetic core 522 such that power losses resulting from the eddy currents would operate to damp the system.
- the DC link conductor 553 will be thermally insulated from the ferromagnetic core 522 .
- a technical effect of one or more of the example embodiments disclosed herein is a system for damping DC bus resonance.
- the system is particularly advantageous in that it utilizes the generation of eddy currents to provide resonance damping of the system.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Abstract
Description
- The present disclosure relates generally to damping systems, and, more particularly to systems and methods for providing DC bus resonance damping.
- In electrical power conversion applications, power switching devices such as voltage source inverters are often used due to their increased efficiency and high power densities. Such power conversion is achieved through the continuous and rapid connection and disconnection of power inputs to achieve desired power outputs. A concern, however, is that high levels of noise are generated due to the rapid switching. Because bus capacitors form resonant circuits with other bus capacitors, high currents flow at and around resonant frequencies, which could lead to significant losses in the bus capacitors and interconnecting conductors if left unaddressed. Such concerns are particularly pronounced in devices with capacitors which have very low internal resistance.
- Therefore, to address such concerns, there is a need in the art for a low cost system that is capable of transmitting desirable lower frequency power while damping unwanted higher frequency resonance.
- According to an aspect of the present disclosure, a system for providing resonance damping is provided. The system comprises a power generation circuit configured to supply power to a direct current (DC) bus. The DC bus comprises a first link conductor and a second link conductor. Each of the first link conductor and the second link conductor are arranged such that a current induced in either of the first link conductor or the second link conductor generates a corresponding magnetic field having a plurality of magnetic flux lines that extend in a direction generally perpendicular to a first direction of current flow. At least two power conversion circuits are coupled to the DC bus. A damping element coupled to or arranged proximate to one or both of the first link conductor and the second link conductor, wherein the damping element is arranged such that the plurality of magnetic flux lines induces a plurality of eddy currents having a second direction of current flow in at least one surface of the damping element to provide resonance damping of the system.
- Other features and aspects will become apparent by consideration of the detailed description and accompanying drawings.
- The detailed description of the drawings refers to the accompanying figures in which:
-
FIG. 1 is a block diagram of a system for controlling a motor according to an embodiment; -
FIG. 2 is a schematic illustration of a dual inverter system including a direct current bus and a damping element according to an embodiment; -
FIG. 3A is a perspective view of a damping element according to an embodiment; -
FIG. 3B is a perspective view of a damping element according to an embodiment; -
FIG. 3C is a perspective view of a damping element according to an embodiment; -
FIG. 3D is a side view of the damping element ofFIG. 3A according to an embodiment; -
FIG. 3E is a perspective view of a damping element according to an embodiment; -
FIG. 4A is a schematic illustration of a dual inverter system including a direct current bus and a damping element according to an embodiment; -
FIG. 4B is a side cross-section view of the direct current bus and damping element ofFIG. 4A according to an embodiment; -
FIG. 5A is a schematic illustration of a dual inverter system including a direct current bus and a damping element according to an embodiment; and -
FIG. 5B is a schematic illustration of a damping element arranged in the dual inverter system ofFIG. 5A according to an embodiment. - Referring to
FIG. 1 , asystem 100 for controlling amotor 165 is shown according to an embodiment. Thesystem 100 can comprise apower generation circuit 102, which can include a direct current (DC) power source, electrically coupled to afiltering circuit 104, at least onedamping element 106 and, an electronic circuit such as apower inversion circuit 108 via aDC bus 150. Although not shown, in other embodiments, thepower generation circuit 102 can also comprise an alternating current (AC) power source coupled to a converter device that supplies the required DC power to theDC bus 150. - As depicted in
FIG. 1 , thefiltering circuit 104 can be arranged at an input of thepower inversion circuit 108 to reduce unwanted noise and/or the magnitude of ripple voltages presented on theDC bus 150. In some embodiments, thefiltering circuit 104 can include a capacitive element coupled in series with a resistive element (refer, e.g., toFIG. 2 ), but may vary in other embodiments. For example, in other embodiments, the filtering circuit 10 can comprise multiple bus capacitors, inductive elements, RC filters, or other suitable filtering components. - At least one
damping element 106 can be electrically coupled to thepower inversion circuit 108 and can be arranged to provide damping of resonant frequencies. For example, as will be discussed in further detail with reference toFIGS. 3A-5B , thedamping element 106 can be coupled to or disposed in parallel relation between respective DC link conductors. In some embodiments, thepower inversion circuit 108 can comprise one or more inverters (FIG. 2 ) that are configured to perform switching operations to convert the DC bus voltage to an AC output (e.g., a three-phase AC output) for use by an external load such as themotor 165, which can include an asynchronous or synchronous electric machine. - As will be appreciated by those skilled in the art,
FIG. 1 is provided merely for illustrative and exemplary purposes and is in no way intended to limit the present disclosure or its applications. In other embodiments, the arrangement and/or structural configuration ofsystem 100 can and will vary. For example, as will be discussed herein,system 100 can comprise a variety of damping elements and circuit configurations, or fewer or more circuit components. Additionally, in some embodiments,system 100 can further comprise overprotection circuitry that is used monitor general bus utilization as well as overload conditions. Further,system 100 is scalable in size and performance (i.e., component sizing and power density can be increased or decreased) based on application and/or specification requirements. - Referring now to
FIG. 2 , a schematic illustration of aDC bus dual inverter system 200 is shown according to an embodiment. In embodiments, thedual inverter system 200 can comprise a firstpower inversion circuit 208 a coupled in parallel with a secondpower inversion circuit 208 b viaDC link conductors electric machines - For simplification purposes, in
FIG. 2 , each thepower inversion circuits filtering circuits power switching circuits power switching circuits electric machines FIG. 1 , each of thefiltering circuits bus capacitor equivalent series resistor negative link conductors FIG. 2 ). For example, as shown inFIG. 2 , the DC bus (i.e.,DC bus 250, 252) can be electrically coupled to thebus capacitor second link conductors capacitors filtering circuits inductive element 256 of, e.g., thelink conductor - A damping
element 206 can be coupled to theDC bus element 206 can be configured to damp high frequency currents that could be stimulated at the input of each of thepower inversion circuits element 206 can comprise a variety of suitable configurations, as will be discussed in further detail with reference toFIGS. 3A-5 , which can be selected based on application and/or design specifications. - Referring to
FIGS. 3A-3E , various embodiments of the dampingelement 206 are shown. In some embodiments, referring now toFIGS. 3A and 3B , a dampingelement 306 can comprise a firsttubular structure 320 a and a secondtubular structure 320 b that are arranged to enclose an outer periphery of a respectiveDC link conductor tubular structures - As depicted in
FIGS. 3A and 3B , the firsttubular structure 320 a can be arranged to enclose the firstDC link conductors tubular structure 320 b can be sized to accommodate and enclose the secondDC link conductors tubular structures tubular structures DC link conductors - In other embodiments, the damping element can comprise one or more non-continuous structures such as those illustrated in
FIGS. 3C and 3D . For example, in one embodiment, a dampingelement 308 can comprise a non-continuous structure such astubular structures gapped portion 327 formed therein (FIG. 3C ). Such an arrangement is particularly advantageous, for example, when thetubular structures element 308 to be tuned. - In
FIG. 3D , a dampingelement 310 is shown. In some embodiments, the dampingelement 310 can comprise tubular structures having two or more of structural elements such asstructural units FIG. 3C , the non-continuous structural arrangement and ferromagnetic properties of thestructural units element 310, and also provides for easier manufacturing and assembling. - Referring now to
FIG. 3E , a dampingelement 312 is shown, which is substantially similar to the dampingelement 306 discussed with reference toFIG. 3A . The dampingelement 312 can comprise one or moretubular structures FIGS. 3A and 3B ), or a metallic element 329 (FIG. 3E ) such as a metal plate (refer, e.g., toFIG. 4A ). - Irrespective of the particular embodiments discussed with reference to
FIGS. 3A-3E , it should be noted that, in either of the embodiments, the energy dissipated in the damping effect will not heat the DC link conductors themselves (i.e., it will be thermally decoupled). For example, the heat dissipation of the damping effect will transfer to the first and secondtubular structures DC link conductors DC bus - Referring now to
FIGS. 4A-4B , aDC bus power converter system 400 is shown according to an embodiment. Thedual converter system 400 is substantially similar to thedual inverter system 200, therefore similar features will not be discussed in detail. In the embodiment ofFIG. 4A ,system 400 can comprise a damping element 406 comprising a plate 420 (e.g., a metal plate). Theplate 420 can comprise ferromagnetic, non-ferromagnetic, or other suitable materials and can be arranged to intercept magnetic flux generated by theDC link conductors - As depicted in
FIGS. 4A and 4B , theplate 420 can be arranged such that at least one surface of theplate 420 is arranged generally perpendicular to the magnetic flux lines 453 generated by theDC link conductors DC link conductors circular lines 424 inFIG. 4A , which, in some embodiments, can be opposite that of the first direction of current flow. - Additionally, as a result of the eddy currents being induced in the
plate 420, the heat dissipation will exist in theplate 420 rather than couple to theDC link conductors plate 420 will be thermally decoupled from the DC link conductors). Further, because induction is the form of energy transfer, it is the time rate of change of the magnetic flux that creates a proportional response in theDC link conductors - Referring to
FIGS. 5A and 5B , aDC bus element 506 for adual inverter system 500 is shown according to an embodiment. InFIG. 5A , a schematic illustration of thedual inverter system 500 is shown and the dampingelement 506 is shown inFIG. 5B . It should be noted that thedual inverter system 500 is substantially similar tosystems 200, therefore like reference numerals will be used to describe similar features and components. In contrast tosystem 200, the dampingelement 506 ofsystem 500 can comprise anelectrical transfer device 520 coupled to at least one DC link conductor (e.g., DC link conductor 553) of theDC bus DC bus bus capacitor link conductors 553, 554. As shown inFIG. 5A , therespective bus capacitors power switching circuit power inversion circuit 508 a and a secondpower inversion circuit 508 b. - In some embodiments, the
electrical transfer device 520 can comprise aferromagnetic core 522 or other suitable electronic devices. Theprimary circuit portion 524 is shown by winding 522, but thesecondary circuit portion 526 is the core itself (522) and the eddy currents generated therein. In other embodiments, theelectrical transfer device 520 can comprise a transformer having a gapped core of predetermined dimensions that is configured to prevent magnetic saturation. - As shown in
FIG. 5B , the DC link conductor 553 can be wound around theprimary circuit portion 524 of theferromagnetic core 522, which can comprise a non-laminated solid core composed of a conductive material. In such an arrangement, a changing current in the DC link conductor 553 will induce strong eddy currents in theferromagnetic core 522 such that power losses resulting from the eddy currents would operate to damp the system. Further, similar to the embodiments discussed above with reference toFIGS. 3A and 4A , the DC link conductor 553 will be thermally insulated from theferromagnetic core 522. - Without in any way limiting the scope, interpretation, or application of the claims appearing below, a technical effect of one or more of the example embodiments disclosed herein is a system for damping DC bus resonance. The system is particularly advantageous in that it utilizes the generation of eddy currents to provide resonance damping of the system.
- While the above describes example embodiments of the present disclosure, these descriptions should not be viewed in a limiting sense. Rather, other variations and modifications may be made without departing from the scope and spirit of the present disclosure as defined in the appended claims.
Claims (19)
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US16/374,347 US10523108B1 (en) | 2018-06-08 | 2019-04-03 | System and method for providing resonance damping |
DE102019208081.2A DE102019208081A1 (en) | 2018-06-08 | 2019-06-04 | SYSTEM AND METHOD FOR PROVIDING RESONANCE DAMPING |
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US201862682612P | 2018-06-08 | 2018-06-08 | |
US16/374,347 US10523108B1 (en) | 2018-06-08 | 2019-04-03 | System and method for providing resonance damping |
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US4434376A (en) | 1979-07-23 | 1984-02-28 | Electric Power Research Institute, Inc. | Method and means for damping subsynchronous oscillations and DC offset in an AC power system |
JPH0265601A (en) | 1988-08-29 | 1990-03-06 | Toshiba Corp | Power conversion device for vehicle |
US5132894A (en) | 1990-09-10 | 1992-07-21 | Sundstrand Corporation | Electric power generating system with active damping |
DE59008677D1 (en) * | 1990-12-10 | 1995-04-13 | Asea Brown Boveri | Method and device for eliminating or reducing harmonics and / or resonance vibrations. |
US6473284B1 (en) | 2000-09-06 | 2002-10-29 | General Electric Company | Low-power dc-to-dc converter having high overvoltage protection |
US6842351B2 (en) * | 2003-02-20 | 2005-01-11 | Sun Microsystems, Inc. | Method and apparatus for I/O resonance compensation |
EP1663519A1 (en) | 2003-03-03 | 2006-06-07 | Adaptive Materials Technology Oy | A damping and actuating apparatus comprising magnetostrictive material, a vibration dampening device and use of said apparatus |
US7054173B2 (en) | 2003-05-07 | 2006-05-30 | Toshiba International Corporation | Circuit with DC filter having a link fuse serially connected between a pair of capacitors |
GB0328072D0 (en) * | 2003-12-03 | 2004-01-07 | South Bank Univ Entpr Ltd | Stacked transformer |
US7164263B2 (en) | 2004-01-16 | 2007-01-16 | Fieldmetrics, Inc. | Current sensor |
GB0716442D0 (en) | 2007-08-23 | 2007-10-03 | Qinetiq Ltd | Composite material |
US7990097B2 (en) * | 2008-09-29 | 2011-08-02 | Rockwell Automation Technologies, Inc. | Power conversion system and method for active damping of common mode resonance |
US8536730B2 (en) * | 2010-07-12 | 2013-09-17 | Hamilton Sundstrand Corporation | Electric power generating and distribution system comprising a decoupling filter and a solid state power controller |
US8917160B2 (en) | 2011-03-21 | 2014-12-23 | Sony Corporation | RFID module |
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