US20190182605A1 - Electronic device - Google Patents

Electronic device Download PDF

Info

Publication number
US20190182605A1
US20190182605A1 US16/212,820 US201816212820A US2019182605A1 US 20190182605 A1 US20190182605 A1 US 20190182605A1 US 201816212820 A US201816212820 A US 201816212820A US 2019182605 A1 US2019182605 A1 US 2019182605A1
Authority
US
United States
Prior art keywords
substrate
elastic body
electronic device
microphones
support member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US16/212,820
Other versions
US10560785B2 (en
Inventor
Mikio Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Onkyo Technology KK
Original Assignee
Onkyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Onkyo Corp filed Critical Onkyo Corp
Assigned to ONKYO CORPORATION reassignment ONKYO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MORITA, MIKIO
Publication of US20190182605A1 publication Critical patent/US20190182605A1/en
Application granted granted Critical
Publication of US10560785B2 publication Critical patent/US10560785B2/en
Assigned to ONKYO HOME ENTERTAINMENT CORPORATION reassignment ONKYO HOME ENTERTAINMENT CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: ONKYO KABUSHIKI KAISHA DBA ONKYO CORPORATION
Assigned to ONKYO TECHNOLOGY KABUSHIKI KAISHA reassignment ONKYO TECHNOLOGY KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ONKYO HOME ENTERTAINMENT CORPORATION
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • B32B1/08—Tubular products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0278—Polyurethane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/536—Hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
    • H04R1/406—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/029—Manufacturing aspects of enclosures transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
    • H04R2201/401—2D or 3D arrays of transducers

Definitions

  • the present disclosure relates to an electronic device which includes a substrate.
  • a microphone for sound correction is provided.
  • a MEMS (Micro-Electrical-Mechanical) microphone is used as the microphone.
  • the MEMS microphone is mounted on a substrate. When the substrate on which the MEMS microphone is mounted vibrates, there is a problem that voice recognition accuracy drops by vibration.
  • JP 2012-138682 A it is attempted that transmission of vibration to the microphone unit is prevented by a first flexible member which is provided to adhere to the front surface side of the microphone unit and by a second flexible member which is provided to adhere to the back surface side of the microphone unit.
  • a switch for example, a tact switch
  • the substrate is pushed by switch push of a user. For this reason, for example, when the substrate is sandwiched and held by elastic bodies for vibration measure, it is necessary to operate without problem by push load caused by pushing the substrate.
  • the above problem is not described and suggested because the switch is not mounted on the substrate of the microphone unit in JP 2012-138682 A.
  • an electronic device comprising: a substrate; a first elastic body which is positioned on one surface of the substrate; and a second elastic body which is positioned under the other surface of the substrate and is harder than the first elastic body, wherein the first elastic body and the second elastic body sandwich and hold the substrate.
  • FIG. 1 is a perspective view illustrating the appearance of a speaker device according to an embodiment of the present disclosure.
  • FIG. 2 is a disassembly perspective view illustrating parts within an enclosure.
  • FIG. 3 is a disassembly perspective view illustrating parts within an enclosure.
  • FIG. 4 is an enlarged view of FIG. 2 .
  • FIG. 5 is an enlarged view of FIG. 3 .
  • FIG. 6 is a cross-sectional view of the upper part of the speaker device.
  • An objective of the present disclosure is to take measure of pushing a substrate and to prevent transmission of vibration to the substrate.
  • FIG. 1 is a perspective view illustrating the appearance of a speaker device according to an embodiment of the present disclosure.
  • the speaker device 1 (electronic device) includes a substantially cylindrical enclosure 2 .
  • the enclose 2 is made of resin, and has an enclosure 2 a of upper part and an enclosure 2 b of lower part.
  • a not shown speaker unit is provided within the enclosure 2 b.
  • FIG. 2 and FIG. 3 are disassembly perspective view illustrating parts within the enclosure 2 a .
  • FIG. 4 is an enlarged view of FIG. 2 .
  • FIG. 5 is an enlarged view of FIG. 3 .
  • FIG. 6 is a cross-sectional view of the upper part of the speaker device 1 .
  • the speaker device 1 has the enclosure 2 a , a substrate 3 , elastic bodies 4 and 5 , a support member 6 , microphones 7 , switches 8 , bolts 9 , and a sheet 10 .
  • four holes 11 for sound correction by the microphone 7 are provided at intervals of 90 degrees on circumference.
  • four bolt holes 12 are provided at intervals of 90 degrees on circumference.
  • the substrate 3 is formed in a substantially circular shape. On the upper surface (one surface) of the substrate 3 , three switches 8 are provided. On the lower surface (the other surface) of the substrate 3 , four microphones 7 are provided. In parts of the substrate 3 which face to insertion holes 13 of the below described support member 6 , notches 14 are provided. The four notches 14 are provided at intervals of 90 degrees on circumference.
  • holes 18 for sound correction by the microphones 7 are provided.
  • the four holes 18 are provided at intervals of 90 degrees on circumference.
  • the elastic body 4 (first elastic body) is a thin member of substantially circular shape, and is made of polyurethane form which has low resilience.
  • the elastic body 4 is made of PORON SR-S-40P.
  • the elastic body 4 is positioned on the upper surface of the substrate 3 .
  • holes are provided in the elastic body 4 . Therefore, the elastic body 4 is not positioned on the substrate 3 on which the switches 8 are provided.
  • notches 15 are provided in parts of the elastic body 4 which face to insertion holes 13 of the below described support member 6 .
  • the four notches 15 are provided at intervals of 90 degrees on circumference.
  • holes 19 for sound correction by the microphones 7 are provided at positions of the elastic body 4 to which the four holes 18 which are provided on the substrate 3 face.
  • the four holes 19 are provided at intervals of 90 degrees on circumference.
  • the elastic body 5 (second elastic body) is eight members which are positioned to face to a rim of the substrate 3 .
  • the elastic body 5 is positioned under the lower surface of the substrate 3 .
  • the elastic body 8 is hard type polyurethane form. Therefore, the elastic body 5 is harder than the elastic body 4 .
  • the elastic body 5 is made of PORON H-48.
  • the elastic body 5 is provided on the support member 6 . Further, the elastic body 5 is not positioned under the substrate 3 on which the microphones 7 are provided.
  • the elastic body 4 is positioned on the upper surface of the substrate 3
  • the elastic body 5 is positioned under the lower surface of the substrate 3
  • the elastic bodies 4 and 5 sandwich and hold the substrate 3 . Further, the microphones 7 are held by the elastic bodies 4 and 5 via the substrate 3 because the microphones 7 are provided on the lower surface of the substrate 3 .
  • the support member 6 is a substantially circular member, and is made of resin.
  • the four insertion holes 13 for inserting the bolts 9 are provided at intervals of 90 degrees.
  • recesses 16 are provided at positions which face to the microphones 7 which are provided on the lower surface of the substrate 3 .
  • the four recesses 16 are provided at intervals of 90 degrees.
  • the microphones 7 are provided on the lower surface of the substrate 3 .
  • the four microphones 7 are provided on the substrate 3 at intervals of 90 degrees on circumference thereof.
  • each of the microphones 7 is a MEMS microphone.
  • the switches 8 are provided on the upper surface of the substrate 3 .
  • the three switches 8 are provided on the center line of the substrate 3 .
  • each of the switches 8 is a tact switch.
  • the switches 8 are switches for receiving up or down of volume, and replay/pause of replay.
  • the sheet 10 is positioned on the upper surface of the elastic body 4 .
  • the sheet 10 is formed in a substantially circular shape.
  • the sheet 10 is made of silicon rubber (elastic member).
  • buttons 17 are provided on the center line.
  • the buttons 17 face to the switches 8 which are provided on the upper surface of the substrate 3 . Therefore, a user can operate the switches 8 by pushing the upper surface of the buttons 17 .
  • the enclosure 2 a , the elastic body 4 , the substrate 3 , the elastic body 5 , and the support member 6 are layered in this order.
  • the four bolts 9 which are inserted to the insertion holes 13 of the support member 6 from lower direction are screwed to the bolt holes 12 .
  • the notches 14 are provided at positions which face to the insertion holes 13 . Therefore, the substrate 3 is only held by the elastic bodies 4 and 5 , and floats from the other members. Further, the buttons 17 and the switches 8 are separated by a predetermined distance. Further, the microphones 7 are sandwiched and held by the elastic bodies 4 and 5 via the substrate 3 .
  • the switches 8 are provided on the substrate 3 , and the substrate 3 (the switches 8 ) is pushed by the user.
  • the elastic body 5 which is harder than the elastic body 4 is provided under the lower surface of the substrate 3 .
  • operation can be performed by push load caused by pushing the substrate 3 without problem. Further, transmission of vibration to the substrate 3 can be prevented because the elastic bodies 4 and 5 sandwich and hold the substrate 3 .
  • the microphones 7 are provided on the lower surface of the substrate 3 . Therefore, transmission of vibration to the microphones 7 is prevented because transmission of vibration to the substrate 3 is prevented.
  • the sheet 10 is made of an elastic member. Further, the buttons 17 which is provided on the sheet 10 and the switches 8 are separated. For this reason, it is difficult to transmit vibration to the substrate 3 .
  • the elastic bodies 4 and 5 sandwich and hold the microphones 7 via the substrate 3 . Therefore, the transmission of vibration to the microphones 7 can be prevented.
  • a speaker device is illustrated as an electronic device which includes a substrate.
  • a device may be the other electronic device as long as the device has a substrate.
  • the present disclosure can be suitably employed in an electronic device which includes a substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

An electronic device comprising: a substrate; a first elastic body which is positioned on one surface of the substrate; and a second elastic body which is positioned under the other surface of the substrate and is harder than the first elastic body, wherein the first elastic body and the second elastic body sandwich and hold the substrate.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application claims priority to Japanese Application No. 2017-236699, filed Dec. 11, 2017, the entire contents of which are incorporated herein by reference.
    • FIELD
  • The present disclosure relates to an electronic device which includes a substrate.
    • BACKGROUND
  • In recent years, an electronic device which has a voice recognition function that a device can be operated by voice is appearing. In such an electronic device, a microphone for sound correction is provided. For miniaturization of the electronic device, as the microphone, a MEMS (Micro-Electrical-Mechanical) microphone is used. The MEMS microphone is mounted on a substrate. When the substrate on which the MEMS microphone is mounted vibrates, there is a problem that voice recognition accuracy drops by vibration.
  • In JP 2012-138682 A, it is attempted that transmission of vibration to the microphone unit is prevented by a first flexible member which is provided to adhere to the front surface side of the microphone unit and by a second flexible member which is provided to adhere to the back surface side of the microphone unit.
  • Herein, a switch (for example, a tact switch) is provided on the substrate. The substrate is pushed by switch push of a user. For this reason, for example, when the substrate is sandwiched and held by elastic bodies for vibration measure, it is necessary to operate without problem by push load caused by pushing the substrate. However, the above problem is not described and suggested because the switch is not mounted on the substrate of the microphone unit in JP 2012-138682 A.
    • SUMMARY OF THE DISCLOSURE
  • According to one aspect of the disclosure, there is provided an electronic device comprising: a substrate; a first elastic body which is positioned on one surface of the substrate; and a second elastic body which is positioned under the other surface of the substrate and is harder than the first elastic body, wherein the first elastic body and the second elastic body sandwich and hold the substrate.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view illustrating the appearance of a speaker device according to an embodiment of the present disclosure.
  • FIG. 2 is a disassembly perspective view illustrating parts within an enclosure.
  • FIG. 3 is a disassembly perspective view illustrating parts within an enclosure.
  • FIG. 4 is an enlarged view of FIG. 2.
  • FIG. 5 is an enlarged view of FIG. 3.
  • FIG. 6 is a cross-sectional view of the upper part of the speaker device.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • An objective of the present disclosure is to take measure of pushing a substrate and to prevent transmission of vibration to the substrate.
  • An embodiment of the present disclosure is described below. FIG. 1 is a perspective view illustrating the appearance of a speaker device according to an embodiment of the present disclosure. The speaker device 1 (electronic device) includes a substantially cylindrical enclosure 2. The enclose 2 is made of resin, and has an enclosure 2 a of upper part and an enclosure 2 b of lower part. A not shown speaker unit is provided within the enclosure 2 b.
  • Each of FIG. 2 and FIG. 3 is a disassembly perspective view illustrating parts within the enclosure 2 a. In FIG. 2 and FIG. 3, up and down is reversed. FIG. 4 is an enlarged view of FIG. 2. FIG. 5 is an enlarged view of FIG. 3. FIG. 6 is a cross-sectional view of the upper part of the speaker device 1. As illustrated in figures, the speaker device 1 has the enclosure 2 a, a substrate 3, elastic bodies 4 and 5, a support member 6, microphones 7, switches 8, bolts 9, and a sheet 10.
  • In an upper surface of the enclosure 2 a, four holes 11 for sound correction by the microphone 7 are provided at intervals of 90 degrees on circumference. In the inside of the enclosure 2 a, four bolt holes 12 are provided at intervals of 90 degrees on circumference.
  • The substrate 3 is formed in a substantially circular shape. On the upper surface (one surface) of the substrate 3, three switches 8 are provided. On the lower surface (the other surface) of the substrate 3, four microphones 7 are provided. In parts of the substrate 3 which face to insertion holes 13 of the below described support member 6, notches 14 are provided. The four notches 14 are provided at intervals of 90 degrees on circumference.
  • At positions of the substrate 3 to which the four microphones 7 face, holes 18 for sound correction by the microphones 7 are provided. The four holes 18 are provided at intervals of 90 degrees on circumference.
  • The elastic body 4 (first elastic body) is a thin member of substantially circular shape, and is made of polyurethane form which has low resilience. For example, the elastic body 4 is made of PORON SR-S-40P. The elastic body 4 is positioned on the upper surface of the substrate 3. For example, in the elastic body 4, at positions to which the switches 8 and the other parts which are provided on the substrate 3 face, holes are provided. Therefore, the elastic body 4 is not positioned on the substrate 3 on which the switches 8 are provided. Further, in parts of the elastic body 4 which face to insertion holes 13 of the below described support member 6, notches 15 are provided. The four notches 15 are provided at intervals of 90 degrees on circumference. At positions of the elastic body 4 to which the four holes 18 which are provided on the substrate 3 face, holes 19 for sound correction by the microphones 7 are provided. The four holes 19 are provided at intervals of 90 degrees on circumference.
  • The elastic body 5 (second elastic body) is eight members which are positioned to face to a rim of the substrate 3. The elastic body 5 is positioned under the lower surface of the substrate 3. The elastic body 8 is hard type polyurethane form. Therefore, the elastic body 5 is harder than the elastic body 4. For example, the elastic body 5 is made of PORON H-48. The elastic body 5 is provided on the support member 6. Further, the elastic body 5 is not positioned under the substrate 3 on which the microphones 7 are provided. Herein, the elastic body 4 is positioned on the upper surface of the substrate 3, the elastic body 5 is positioned under the lower surface of the substrate 3, and the elastic bodies 4 and 5 sandwich and hold the substrate 3. Further, the microphones 7 are held by the elastic bodies 4 and 5 via the substrate 3 because the microphones 7 are provided on the lower surface of the substrate 3.
  • The support member 6 is a substantially circular member, and is made of resin. In the support member 6, the four insertion holes 13 for inserting the bolts 9 are provided at intervals of 90 degrees. Further, in the support member 6, recesses 16 are provided at positions which face to the microphones 7 which are provided on the lower surface of the substrate 3. The four recesses 16 are provided at intervals of 90 degrees.
  • The microphones 7 are provided on the lower surface of the substrate 3. The four microphones 7 are provided on the substrate 3 at intervals of 90 degrees on circumference thereof. For example, each of the microphones 7 is a MEMS microphone. The switches 8 are provided on the upper surface of the substrate 3. The three switches 8 are provided on the center line of the substrate 3. For example, each of the switches 8 is a tact switch. For example, the switches 8 are switches for receiving up or down of volume, and replay/pause of replay. The sheet 10 is positioned on the upper surface of the elastic body 4. The sheet 10 is formed in a substantially circular shape. For example, the sheet 10 is made of silicon rubber (elastic member). On the lower surface (the other surface) of the sheet 10, three convex buttons 17 are provided on the center line. The buttons 17 face to the switches 8 which are provided on the upper surface of the substrate 3. Therefore, a user can operate the switches 8 by pushing the upper surface of the buttons 17.
  • In the speaker device 1, the enclosure 2 a, the elastic body 4, the substrate 3, the elastic body 5, and the support member 6 are layered in this order. The four bolts 9 which are inserted to the insertion holes 13 of the support member 6 from lower direction are screwed to the bolt holes 12. As described above, in the substrate 3, the notches 14 are provided at positions which face to the insertion holes 13. Therefore, the substrate 3 is only held by the elastic bodies 4 and 5, and floats from the other members. Further, the buttons 17 and the switches 8 are separated by a predetermined distance. Further, the microphones 7 are sandwiched and held by the elastic bodies 4 and 5 via the substrate 3.
  • As described above, in the present embodiment, the switches 8 are provided on the substrate 3, and the substrate 3 (the switches 8) is pushed by the user. For this reason, in the present embodiment, the elastic body 5 which is harder than the elastic body 4 is provided under the lower surface of the substrate 3. Thus, operation can be performed by push load caused by pushing the substrate 3 without problem. Further, transmission of vibration to the substrate 3 can be prevented because the elastic bodies 4 and 5 sandwich and hold the substrate 3.
  • Further, in the present embodiment, the microphones 7 are provided on the lower surface of the substrate 3. Therefore, transmission of vibration to the microphones 7 is prevented because transmission of vibration to the substrate 3 is prevented.
  • Further, in the present embodiment, the sheet 10 is made of an elastic member. Further, the buttons 17 which is provided on the sheet 10 and the switches 8 are separated. For this reason, it is difficult to transmit vibration to the substrate 3.
  • Further, in the present embodiment, the elastic bodies 4 and 5 sandwich and hold the microphones 7 via the substrate 3. Therefore, the transmission of vibration to the microphones 7 can be prevented.
  • The embodiment of the present disclosure is described above, but the mode to which the present disclosure is applicable is not limited to the above embodiment and can be suitably varied without departing from the scope of the present disclosure as illustrated below.
  • In the above described embodiment, as an electronic device which includes a substrate, a speaker device is illustrated. Not limited to this, a device may be the other electronic device as long as the device has a substrate.
  • The present disclosure can be suitably employed in an electronic device which includes a substrate.

Claims (11)

What is claimed is:
1. An electronic device comprising:
a substrate;
a first elastic body which is positioned on one surface of the substrate; and
a second elastic body which is positioned under the other surface of the substrate and is harder than the first elastic body,
wherein the first elastic body and the second elastic body sandwich and hold the substrate.
2. The electronic device according to claim 1,
wherein the second elastic body is provided on a support member.
3. The electronic device according to claim 1,
wherein the second elastic body is positioned to face to rim of the substrate.
4. The electronic device according to claim 1 further comprising: a microphone which is provided on the other surface of the substrate.
5. The electronic device according to claim 4,
wherein the second elastic body is not positioned under the substrate on which the microphone is provided.
6. The electronic device according to any one of claim 1 further comprising: a switch which is provided on the one surface of the substrate.
7. The electronic device according to claim 6,
wherein the first elastic body is not positioned on the substrate on which the switch is provided.
8. The electronic device according to claim 1 further comprising: an enclosure which has a bolt hole,
wherein the enclosure, the first elastic body, the substrate, the second elastic body, and the support member are layered in this order,
in the support member, an insertion hole for inserting a bolt is provided,
in part of the substrate which faces to the insertion hole, a notch is provided, and
the bolt which is inserted to the insertion hole of the support member screws to the bolt hole.
9. The electronic device according to claim 1 further comprising: a sheet which is made of elastic member;
wherein a button is provided on the other surface of the sheet,
the sheet is positioned on one surface of the first elastic body, and
the button and the switch are separated from each other.
10. An electronic device comprising:
a microphone;
a first elastic body; and
a second elastic body which is harder than the first elastic body,
wherein the first elastic body and the second elastic body sandwich and hold the substrate.
11. The electronic device according to any one of claim 1 further comprising: a speaker unit.
US16/212,820 2017-12-11 2018-12-07 Electronic device Expired - Fee Related US10560785B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017236699A JP2019106581A (en) 2017-12-11 2017-12-11 Electronic device
JP2017-236699 2017-12-11

Publications (2)

Publication Number Publication Date
US20190182605A1 true US20190182605A1 (en) 2019-06-13
US10560785B2 US10560785B2 (en) 2020-02-11

Family

ID=66697596

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/212,820 Expired - Fee Related US10560785B2 (en) 2017-12-11 2018-12-07 Electronic device

Country Status (2)

Country Link
US (1) US10560785B2 (en)
JP (1) JP2019106581A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10848845B2 (en) * 2019-01-11 2020-11-24 Zilltek Technology (Shanghai) Corp. Microphone with mechanical switch function

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1011311S1 (en) * 2023-02-28 2024-01-16 Shenzhen See Me Here Electronic Co., Ltd Audio player

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5615273A (en) * 1992-09-29 1997-03-25 Unex Corporation Microphone assembly in a microphone boom of a headset
US5756359A (en) * 1995-02-23 1998-05-26 Behring Diagnostics Gmbh Decreased interference redox detection system
US5923750A (en) * 1993-08-18 1999-07-13 Telefonaktienbolaget Lm Ericsson Telephone handset
US6128393A (en) * 1998-02-27 2000-10-03 Kabushiki Kaisha Audio-Technica Microphone with shock-resistant means

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5342016Y2 (en) * 1973-10-30 1978-10-11
JP3192100B2 (en) * 1996-11-08 2001-07-23 株式会社オーディオテクニカ Microphone
JP2007207473A (en) * 2006-01-31 2007-08-16 Toshiba Corp Electronic apparatus
JP5528319B2 (en) 2010-12-24 2014-06-25 本田技研工業株式会社 Microphone system
JP5900121B2 (en) * 2012-04-10 2016-04-06 ブラザー工業株式会社 Sound equipment
JP5957279B2 (en) * 2012-05-01 2016-07-27 京セラ株式会社 Electronics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5615273A (en) * 1992-09-29 1997-03-25 Unex Corporation Microphone assembly in a microphone boom of a headset
US5923750A (en) * 1993-08-18 1999-07-13 Telefonaktienbolaget Lm Ericsson Telephone handset
US5756359A (en) * 1995-02-23 1998-05-26 Behring Diagnostics Gmbh Decreased interference redox detection system
US6128393A (en) * 1998-02-27 2000-10-03 Kabushiki Kaisha Audio-Technica Microphone with shock-resistant means

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10848845B2 (en) * 2019-01-11 2020-11-24 Zilltek Technology (Shanghai) Corp. Microphone with mechanical switch function

Also Published As

Publication number Publication date
JP2019106581A (en) 2019-06-27
US10560785B2 (en) 2020-02-11

Similar Documents

Publication Publication Date Title
US9891736B2 (en) Vibrating device and electronic device using same
US9900698B2 (en) Graphene composite acoustic diaphragm
JP6360902B2 (en) Electronics
US20170085994A1 (en) MEMS Acoustic Transducer, and Acoustic Transducer Assembly Having a Stopper Mechanism
US8442254B2 (en) Audio port configuration for compact electronic devices
US9520253B2 (en) Button, button arrangement and electronic device employing same
US20160181902A1 (en) Linear Vibrator
US10696545B2 (en) Transducer packaging
US20120050962A1 (en) Key assembly and electronic device using key assembly
US10462559B2 (en) Speaker box
JP6415706B2 (en) Electronic equipment with built-in acoustic electronic components
US10560785B2 (en) Electronic device
US20160205469A1 (en) Water proof speaker device
JP2017152945A (en) Electronic device
JP4486395B2 (en) Key sheet and key sheet fixing structure
US20040161130A1 (en) Electroacoustic transducer, and electronic device using the same
US10256055B2 (en) Push switch and electronic device including push switch
JP2015037199A (en) Sounding body module and electronic apparatus
US9066187B2 (en) Dual transducer with shared diaphragm
JP5258030B2 (en) Waterproof acoustic structure and electronic equipment
JP2007174588A (en) Headphone
EP3644621A1 (en) Active noise reduction loudspeaker component of headset
JP2021029003A (en) Acoustic device
JP2016046185A (en) Electronic apparatus
JP6175120B2 (en) Electronics

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

AS Assignment

Owner name: ONKYO CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MORITA, MIKIO;REEL/FRAME:047753/0005

Effective date: 20181115

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE

AS Assignment

Owner name: ONKYO HOME ENTERTAINMENT CORPORATION, JAPAN

Free format text: CHANGE OF NAME;ASSIGNOR:ONKYO KABUSHIKI KAISHA DBA ONKYO CORPORATION;REEL/FRAME:057862/0659

Effective date: 20201001

AS Assignment

Owner name: ONKYO TECHNOLOGY KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ONKYO HOME ENTERTAINMENT CORPORATION;REEL/FRAME:058163/0455

Effective date: 20210908

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20240211