US20190074381A1 - Device comprising 2d material - Google Patents

Device comprising 2d material Download PDF

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Publication number
US20190074381A1
US20190074381A1 US16/120,726 US201816120726A US2019074381A1 US 20190074381 A1 US20190074381 A1 US 20190074381A1 US 201816120726 A US201816120726 A US 201816120726A US 2019074381 A1 US2019074381 A1 US 2019074381A1
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Prior art keywords
substrate
material pattern
layer
pattern
electrode
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Abandoned
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US16/120,726
Inventor
Tae-jin Park
Jin-Bum Kim
Bong-Soo Kim
Kyu-Pil Lee
Hyeong-Sun HONG
Yoo-Sang Hwang
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HWANG, YOO-SANG, HONG, HYEONG-SUN, KIM, BONG-SOO, LEE, KYU-PIL, KIM, JIN-BUM, PARK, TAE-JIN
Publication of US20190074381A1 publication Critical patent/US20190074381A1/en
Abandoned legal-status Critical Current

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    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/88—Tunnel-effect diodes
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02488—Insulating materials
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02494—Structure
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66015—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene
    • H01L29/66037—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66045—Field-effect transistors

Definitions

  • Inventive concepts relate to a device including a two-dimensional (2D) material, and more particularly, to a vertical transistor device, a fin transistor device, a tunneling device, and a buried transistor device including a 2D material.
  • the 2D materials may be formed to have only a single atomic layer or several atomic layers.
  • the 2D materials have a small thickness of several nanometers or less and may have better electrical, optical, thermal, and chemical characteristics than existing materials having a 3D crystal structure, and thus the 2D materials have attracted attention as new materials for electronic and optical devices.
  • Inventive concepts provide a device including a two-dimensional (2D) material.
  • a device includes a substrate, a first electrode on the substrate, an insulating pattern on the substrate, a second electrode on an upper end of the insulating pattern, a 2D material layer along a side surface of the insulating pattern, a gate insulating layer covering the 2D material layer, and a gate electrode contacting the gate insulating layer.
  • the insulating pattern may extend from the first electrode in a direction substantially vertical to the substrate.
  • the 2D material layer may include at least one atomic layer of a 2D material that is substantially parallel to the side surface of the insulating pattern.
  • a device includes a substrate, a channel structure on the substrate, a first electrode and a second electrode on the substrate, a gate electrode on the substrate, and a gate insulating layer between the channel structure and the gate electrode.
  • the channel structure may extend in a first direction that is parallel to the substrate.
  • the first electrode and a second electrode respectively may be located at both ends of the channel structure.
  • the gate electrode may extend in a second direction that is parallel to the substrate and the gate electrode may intersect the channel structure.
  • the channel structure may include an insulating pattern and a 2D material layer on a surface of the insulating pattern.
  • the 2D material layer may include at least one atomic layer of a 2D material that is parallel to the surface of the insulating pattern.
  • a device includes a substrate, an insulating pattern on the substrate, one pair of 2D material layers on side surfaces of the insulating pattern, a first electrode, and a second electrode.
  • Each of the one pair of 2D material layers may include at least one atomic layer of a 2D material that may be parallel to the side surface of the insulating pattern.
  • the one pair of 2D material layers may include a first 2D material layer and second 2D material layer spaced apart from each other in a first direction that may be parallel to the substrate by interposing the insulating pattern therebetween.
  • the first electrode may contact the first 2D material layer.
  • the second electrode may contact the second 2D material layer.
  • a device includes a substrate including a recess, a 2D material pattern on the substrate, a gate structure contacting the 2D material pattern, a first electrode contacting a first end of the 2D material pattern, and a second electrode contacting a second end of the 2D material pattern.
  • the recess may be recessed from a main surface of the substrate and may extend in a first direction.
  • the 2D material pattern may intersect the recess of the substrate and may extend in a second direction.
  • the gate structure may contact the 2D material pattern and may extend in the first direction along the recess of the substrate.
  • the first electrode may contact a first end of the 2D material pattern.
  • the second electrode may contact a second end of the 2D material pattern.
  • the 2D material pattern may include atomic layers that are parallel to a surface of the substrate.
  • a device includes a substrate including a recess, a 2D material on the substrate, a gate structure intersecting the 2D material pattern, a first electrode contacting a first end of the 2D material pattern, and a second electrode contacting a second end of the 2D material pattern.
  • the recess may be recessed from a main surface of the substrate and may extend in a first direction.
  • the 2D material pattern may extend in the first direction along the recess of the substrate.
  • the gate structure may intersect the 2D material pattern and may extend in a second direction.
  • the first electrode may contact a first end of the 2D material pattern.
  • the second electrode may contact a second end of the 2D material pattern.
  • the 2D material pattern may include a first portion and a second portion. The first portion may be on a lower surface of the recess of the substrate and the second portion may be on a side surface of the recess of the substrate.
  • a device may include a substrate including a fin protruding from a main surface of the substrate and extending in a first direction, a 2D material pattern on the substrate and extending in the first direction along the fin, a gate structure intersecting the 2D material pattern and extending in a second direction, a first electrode contacting a first end of the 2D material pattern, and a second electrode contacting a second end of the 2D material pattern.
  • the 2D material pattern may include a first portion on an upper surface of the fin of the substrate and a second portion on a side surface of the fin of the substrate.
  • FIGS. 1A and 1B are cross-sectional views of a device including a two-dimensional (2D) material, according to an embodiment of inventive concepts, FIG. 1B being a cross-sectional view taken along line AA′ of FIG. 1A ;
  • FIGS. 2A and 2B are cross-sectional views of a device including a 2D material, according to an embodiment of inventive concepts, FIG. 2B being a cross-sectional view taken along line AA′ of FIG. 2A ;
  • FIGS. 3A and 3B are cross-sectional views of a device including a 2D material, according to an embodiment of inventive concepts, FIG. 3B being a cross-sectional view taken along line AA′ of FIG. 3A ;
  • FIGS. 4A and 4B are cross-sectional views of a device including a 2D material, according to an embodiment of inventive concepts, FIG. 4B being a cross-sectional view taken along line AA′ of FIG. 4A ;
  • FIG. 5A is a perspective view of a device including a 2D material, according to an embodiment of inventive concepts
  • FIG. 5B is a cross-sectional view taken along line AA′ of FIG. 5A ;
  • FIG. 6A is a perspective view of a device including a 2D material, according to an embodiment of inventive concepts
  • FIG. 6B is a cross-sectional view taken along line AA′ of FIG. 6A ;
  • FIGS. 7A and 7B are cross-sectional views of a device including a 2D material, according to an embodiment of inventive concepts, FIG. 7B being a cross-sectional view taken along line AA′ of FIG. 7A ;
  • FIG. 8A is a top view of a device including a 2D material, according to an embodiment of inventive concepts
  • FIG. 8B is a cross-sectional view taken along line AA′ of FIG. 8A ;
  • FIG. 8C is a cross-sectional view taken along line BB′ of FIG. 8A ;
  • FIG. 9A is a top view of a device including a 2D material, according to an embodiment of inventive concepts.
  • FIG. 9B is a cross-sectional view taken along line AA′ of FIG. 9A ;
  • FIG. 9C is a cross-sectional view taken along line BB′ of FIG. 9A ;
  • FIG. 10A is a top view of a device including a 2D material, according to an embodiment of inventive concepts
  • FIG. 10B is a cross-sectional view taken along line AA′ of FIG. 10A ;
  • FIG. 10C is a cross-sectional view taken along line BB′ of FIG. 10A ;
  • FIGS. 11A to 11H are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts
  • FIGS. 12A to 12E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts
  • FIGS. 13A to 13F are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts
  • FIGS. 14A to 14D are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts
  • FIGS. 15A to 15E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • FIGS. 16A to 16E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • FIGS. 1A and 1B are cross-sectional views of a device 100 including a two-dimensional (2D) material, according to an embodiment of inventive concepts, FIG. 1B being a cross-sectional view taken along line AA′ of FIG. 1A .
  • the device 100 including a 2D material may include a substrate 110 , a first electrode 120 , a second electrode 140 , an insulating pattern 130 , a 2D material layer 150 , a gate insulating layer 160 , and a gate electrode 170 .
  • the device 100 may be a vertical transistor.
  • the substrate 110 may include a semiconductor material, glass, or plastic.
  • the semiconductor material may include a IV group semiconductor material, a III-V group semiconductor material, or a II-VI group semiconductor material.
  • the IV group semiconductor material may include, for example, silicon (Si), germanium (Ge), or Si—Ge.
  • the III-V group semiconductor material may include, for example, gallium arsenide (GaAs), indium phosphide (InP), GaP, InAs, Indium antimonide (InSb), or InGaAs.
  • the II-VI group semiconductor material may include, for example, zinc telluride (ZnTe) or cadmium sulfide (CdS).
  • the substrate 110 including the semiconductor material may be a bulk wafer or an epitaxial layer.
  • the first electrode 120 may be located on the substrate 110 .
  • the second electrode 140 may be located at an upper end of the insulating pattern 130 .
  • the first electrode 120 and the second electrode 140 may independently include a metal, a metal nitride, or a combination thereof.
  • the metal may include, for example, tungsten (W), copper (Cu), gold (Au), silver (Ag), titanium (Ti), tantalum (Ta), ruthenium (Ru), or cobalt (Co).
  • the metal nitride may include, for example, titanium nitride (TiN), TaN, CoN, or WN. According to some embodiments, an area of a cross-section of the first electrode 120 that is parallel to the substrate 110 may differ from an area of a cross-section of the second electrode 140 that is parallel to the substrate 110 .
  • a first inter-layer insulating layer 125 may cover a side wall of the first electrode 120 .
  • the first electrode 120 may penetrate through the first inter-layer insulating layer 125 .
  • the first inter-layer insulating layer 125 may include an insulating material selected from among (or such as), for example, silicon oxide, silicon nitride, and silicon oxynitride.
  • a third inter-layer insulating layer 145 may be located around the second electrode 140 .
  • the second electrode 140 may penetrate through the third inter-layer insulating layer 145 (see FIG. 2A ).
  • the third inter-layer insulating layer 145 may include an insulating material selected from among (or such as), for example, silicon oxide, silicon nitride, and silicon oxynitride.
  • the insulating pattern 130 may extend from the first electrode 120 to the second electrode 140 in a direction vertical to the substrate 110 .
  • FIG. 1B shows that a cross-section of the insulating pattern 130 that is parallel to the substrate 110 is rectangular, a shape of the cross-section of the insulating pattern 130 is not limited thereto.
  • the insulating pattern 130 may include an insulating material which may form a 2D material by reacting with another chemical material. According to some embodiments, the insulating pattern 130 may include metal oxides, particularly, transition metal oxides.
  • the insulating pattern 130 may include, for example, tungsten oxides, copper oxides, nickel oxides, molybdenum oxides, titanium oxides, vanadium oxides, zirconium oxides, hafnium oxides, palladium oxides, platinum oxides, niobium oxides, tantalum oxides, technetium oxides, or rhenium oxides.
  • the insulating pattern 130 may include a transition metal dioxide selected from among (or such as) molybdenum dioxide (MoO 2 ), tungsten dioxide (WO 2 ), and the like.
  • the 2D material layer 150 may be located on a side wall of the insulating pattern 130 .
  • the 2D material layer 150 may surround the entire side wall of the insulating pattern 130 . That is, the 2D material layer 150 may be formed on all of four side surfaces forming the side wall of the insulating pattern 130 .
  • the 2D material layer 150 may extend from the first electrode 120 to the second electrode 140 in a direction substantially vertical to the substrate 110 along the side wall of the insulating pattern 130 .
  • the 2D material layer 150 may include a 2D material selected from among (or such as) graphene, hexagonal boron nitride (h-BN), transition metal dichalcogenide (TMDC), and the like.
  • the TMDC has a chemical formula of MX 2 , where M denotes a transition metal selected from among (or such as) molybdenum (Mo), W, nickel (Ni), Ti, vanadium (V), zirconium (Zr), hafnium (Hf), palladium (Pd), platinum (Pt), niobium (Nb), Ta, technetium (Tc), rhenium (Re), and the like, and X denotes a chalcogen element selected from among sulfur (S), selenium (Se), tellurium (Te), and the like.
  • the 2D material layer 150 may be formed by a reaction between the insulating pattern 130 and a chemical material.
  • the 2D material layer 150 and the insulating pattern 130 may include a same transition metal element.
  • the 2D material layer 150 may include molybdenum disulfide (MoS 2 ), and the insulating pattern 130 may include MoO 2 .
  • the 2D material layer 150 may be doped in an n or p type.
  • the 2D material layer 150 may include at least one atomic layer of a 2D material.
  • the 2D material layer 150 may include one or tens of atomic layers (e.g., in a range of 1 to 90, 1 to 30, 1 to 10, and/or 1-3 atomic layers).
  • the plurality of atomic layers may be parallel to each other.
  • Each atomic layer forming the 2D material layer 150 may be parallel to the side wall of the insulating pattern 130 .
  • the side wall of the insulating pattern 130 may be substantially vertical to the substrate 110
  • the atomic layer of a 2D material may be substantially vertical to the substrate 110 .
  • the 2D material layer 150 may be a semiconductor. Band-gap energy of the 2D material layer 150 may vary according to the number of atomic layers forming the 2D material layer 150 . An increase in the number of atomic layers forming the 2D material layer 150 may cause a decrease in the band-gap energy of the 2D material layer 150 . That is, an increase in a thickness of the 2D material layer 150 may cause a decrease in the band-gap energy of the 2D material layer 150 . Band-gap energy of a material forming the insulating pattern 130 may be greater than the band-gap energy of the 2D material layer 150 .
  • band-gap energy of MoO 2 forming the insulating pattern 130 may be about 3.9 eV or higher, and the band-gap energy of the 2D material layer 150 including one atomic layer of MoS 2 may be about 2.1 eV or lower that is lower than the band-gap energy of MoO 2 forming the insulating pattern 130 .
  • the band-gap energy of the 2D material layer 150 may further decrease.
  • the gate insulating layer 160 may cover the 2D material layer 150 . As shown in FIG. 1B , the gate insulating layer 160 may surround the circumference of the 2D material layer 150 . The gate insulating layer 160 may be in contact with the first electrode 120 and the second electrode 140 .
  • the gate insulating layer 160 may include an insulating material selected from among (or such as), for example, HfO 2 , ZrO 2 , lanthanum oxide (LaO 3 ), Ta 2 O 5 , TiO 2 , yttrium oxide (Y 2 O 3 ), and aluminum oxide (Al 2 O 3 ).
  • the gate electrode 170 may be located around the gate insulating layer 160 .
  • the gate electrode 170 may be in contact with the gate insulating layer 160 .
  • the gate electrode 170 may be an all-around gate type. That is, the gate electrode 170 may surround the circumference of the gate insulating layer 160 .
  • the gate electrode 170 may include a metal selected from among (or such as), for example, Ti, Ta, Al, W, Ru, Ni, Mo, Hf, Ni, Co, Pt, and Pd or a nitride of the metal.
  • the gate electrode 170 may be spaced apart from the second electrode 140 by a second inter-layer insulating layer 180 .
  • the second inter-layer insulating layer 180 may include an insulating material selected from among (or such as), for example, silicon oxide, silicon nitride, and silicon oxynitride.
  • a fourth inter-layer insulating layer may be further included under the gate electrode 170 . That is, the fourth inter-layer insulating layer (not shown) may be further included between a lower surface of the gate electrode 170 and the gate insulating layer 160 . Like the second inter-layer insulating layer 180 , the fourth inter-layer insulating layer (not shown) may include an insulating material selected from among (or such as) silicon oxide, silicon nitride, silicon oxynitride, and the like.
  • FIGS. 2A and 2B are cross-sectional views of a device 200 including a 2D material, according to an embodiment of inventive concepts, FIG. 2B being a cross-sectional view taken along line AA′ of FIG. 2A .
  • FIGS. 1A and 1B differ from the embodiment described with reference to FIGS. 1A and 1B will be described.
  • the gate electrode 170 included in the device 200 including a 2D material may be a dual gate type. That is, the gate electrode 170 may include a first gate electrode in contact with one side of the gate insulating layer 160 and a second gate electrode in contact with the other side of the gate insulating layer 160 . The first gate electrode and the second gate electrode may be spaced from each other by interposing the insulating pattern 130 , the 2D material layer 150 , and the gate insulating layer 160 .
  • FIGS. 3A and 3B are cross-sectional views of a device 300 including a 2D material, according to an embodiment of inventive concepts, FIG. 3B being a cross-sectional view taken along line AA′ of FIG. 3A .
  • FIGS. 1A and 1B differ from the embodiment described with reference to FIGS. 1A and 1B will be described.
  • the gate electrode 170 included in the device 300 including a 2D material may be a single gate type. That is, the gate electrode 170 may be located at one side of the gate insulating layer 160 .
  • FIGS. 4A and 4B are cross-sectional views of a device 400 including a 2D material, according to an embodiment of inventive concepts, FIG. 4B being a cross-sectional view taken along line AA′ of FIG. 4A .
  • FIGS. 1A and 1B differ from the embodiment described with reference to FIGS. 1A and 1B.
  • the 2D material layer 150 may be located on not only the side wall of the insulating pattern 130 but also an upper surface thereof. That is, the 2D material layer 150 may be located between the second electrode 140 and the insulating pattern 130 . According to some embodiments, a portion of the 2D material layer 150 that is located on the upper surface of the insulating pattern 130 may be thinner than a portion of the 2D material layer 150 that is located on the side wall of the insulating pattern 130 .
  • FIG. 5A is a perspective view of a device 500 including a 2D material, according to an embodiment of inventive concepts.
  • FIG. 5B is a cross-sectional view taken along line AA′ of FIG. 5A .
  • the device 500 including a 2D material may include a channel structure 510 , the first electrode 120 , the second electrode 140 , the gate electrode 170 , and the gate insulating layer 160 .
  • the device 500 may be a fin transistor.
  • the channel structure 510 may extend in a first direction X that is parallel to the substrate 110 .
  • the channel structure 510 may include the insulating pattern 130 and the 2D material layer 150 .
  • the insulating pattern 130 may extend in the first direction X that is parallel to the substrate 110 .
  • the 2D material layer 150 may be located on a surface of the insulating pattern 130 .
  • the 2D material layer 150 may include, for example, a first portion 151 on the upper surface of the insulating pattern 130 and a second portion 152 on a side surface of the insulating pattern 130 .
  • the atomic layer forming the 2D material layer 150 may be parallel to the surface of the insulating pattern 130 .
  • the atomic layer may be parallel to the upper surface of the insulating pattern 130 , inside the first portion 151 of the 2D material layer 150 .
  • the upper surface of the insulating pattern 130 may be substantially parallel to the substrate 110 , and in this case, the atomic layer may be substantially parallel to the substrate 110 , inside the first portion 151 of the 2D material layer 150 .
  • the atomic layer may be parallel to the side wall of the insulating pattern 130 , inside the second portion 152 of the 2D material layer 150 .
  • the side wall of the insulating pattern 130 may be substantially vertical to the substrate 110 , and in this case, the atomic layer may be substantially vertical to the substrate 110 , inside the second portion 152 of the 2D material layer 150 .
  • the first electrode 120 and the second electrode 140 may be respectively located on both ends of the channel structure 510 .
  • the first electrode 120 and the second electrode 140 may be electrically connected to the 2D material layer 150 of the channel structure 510 .
  • the gate electrode 170 may pass above the channel structure 510 .
  • the gate electrode 170 may extend in a second direction Y that is parallel to the substrate 110 and intersect with the channel structure 510 .
  • the gate insulating layer 160 may be located between the channel structure 510 and the gate electrode 170 .
  • the gate insulating layer 160 may be in contact with side surfaces and an upper surface of the channel structure 510 .
  • a description of respective constituent materials of the substrate 110 , the insulating pattern 130 , the 2D material layer 150 , the first electrode 120 , the second electrode 140 , the gate electrode 170 , and the gate insulating layer 160 is the same as described with reference to FIGS. 1A and 1B .
  • FIG. 6A is a perspective view of a device 600 including a 2D material, according to an embodiment of inventive concepts.
  • FIG. 6B is a cross-sectional view taken along line AA′ of FIG. 6A .
  • the device 600 including a 2D material may further include a device isolation film 620 .
  • the device isolation film 620 may include an insulating material selected from among (or such as) silicon oxide, silicon nitride, silicon oxynitride, and the like.
  • An upper surface of the device isolation film 620 may be lower than the upper surface of the insulating pattern 130 . That is, the insulating pattern 130 may protrude from the device isolation film 620 .
  • the device isolation film 620 may cover a portion of the side wall of the insulating pattern 130 .
  • the device isolation film 620 may not cover the other portion of the side wall of the insulating pattern 130 and the upper surface of the insulating pattern 130 .
  • the 2D material layer 150 may be located on the portion of the side wall of the insulating pattern 130 , which is not covered by the device isolation film 620 , and the upper surface of the insulating pattern 130 .
  • FIGS. 7A and 7B are cross-sectional views of a device 700 including a 2D material, according to an embodiment of inventive concepts, FIG. 7B being a cross-sectional view taken along line AA′ of FIG. 7A .
  • the device 700 including a 2D material may include the substrate 110 , the insulating pattern 130 , one pair of 2D material layers 150 , the first electrode 120 , and the second electrode 140 .
  • the device 700 may be a tunneling device.
  • the insulating pattern 130 is located on the substrate 110 .
  • the one pair of 2D material layers 150 are located on the side wall of the insulating pattern 130 .
  • the one pair of 2D material layers 150 are spaced apart from each other in the first direction X by the insulating pattern 130 .
  • the first electrode 120 is in contact with one of the one pair of 2D material layers 150
  • the second electrode 140 is in contact with the other one of the one pair of 2D material layers 150 . That is, the first electrode 120 and the second electrode 140 are spaced apart from each other in the first direction X by interposing the insulating pattern 130 and the one pair of 2D material layers 150 therebetween.
  • a width W 1 of the first electrode 120 in the second direction Y may be substantially the same as a width W 2 of the insulating pattern 130 in the second direction Y.
  • a height H 1 of first electrode 120 in a third direction Z may be substantially the same as a height H 2 of the insulating pattern 130 in the third direction Z.
  • the device 700 may further include the first inter-layer insulating layer 125 .
  • the first inter-layer insulating layer 125 may be located on the substrate 110 .
  • the first electrode 120 , the second electrode 140 , and the 2D material layers 150 may be located on the first inter-layer insulating layer 125 .
  • the insulating pattern 130 may be located on the first inter-layer insulating layer 125 .
  • the insulating pattern 130 may extend from the substrate 110 in a direction substantially vertical to the substrate 110 and penetrate through the first inter-layer insulating layer 125 .
  • the device 700 may further include the second inter-layer insulating layer 180 .
  • the second inter-layer insulating layer 180 may cover a side wall of the insulating pattern 130 , the first electrode 120 , and the second electrode 140 .
  • a detailed description of materials forming the substrate 110 , the insulating pattern 130 , the 2D material layer 150 , the first electrode 120 , the second electrode 140 , the first inter-layer insulating layer 125 , and the second inter-layer insulating layer 180 is the same as described with reference to FIGS. 1A and 1B .
  • FIG. 8A is a top view of a device 800 including a 2D material, according to an embodiment of inventive concepts.
  • FIG. 8B is a cross-sectional view taken along line AA′ of FIG. 8A .
  • FIG. 8C is a cross-sectional view taken along line BB′ of FIG. 8A .
  • the device 800 including a 2D material may include the substrate 110 , a 2D material pattern 850 , a gate structure GS, the first electrode 120 , and the second electrode 140 .
  • the device 800 may be a buried transistor.
  • the substrate 110 may have a recess 110 R recessed from a main surface of the substrate 110 and extending in the first direction X.
  • the 2D material pattern 850 may extend in the second direction Y.
  • the 2D material pattern 850 may intersect with the recess 110 R of the substrate 110 .
  • the 2D material pattern 850 may include a 2D material selected from among (or such as) a TMDC and the like.
  • the 2D material pattern 850 may have atomic layers that are parallel to a surface of the substrate 110 .
  • the 2D material pattern 850 may include a first portion 851 on a lower surface of the recess 110 R of the substrate 110 , a second portion 852 on a side surface of the recess 110 R of the substrate 110 , and a third portion 853 on the main surface of the substrate 110 .
  • the atomic layers may be substantially parallel to the lower surface of the recess 110 R of the substrate 110 , inside the first portion 851 of the 2D material pattern 850 .
  • the atomic layers may be substantially parallel to the side surface of the recess 110 R of the substrate 110 , inside the second portion 852 of the 2D material pattern 850 .
  • the atomic layers may be substantially parallel to the main surface of the substrate 110 , inside the third portion 853 of the 2D material pattern 850 .
  • the lower surface of the recess 110 R of the substrate 110 may be substantially orthogonal to the side surface of the recess 110 R of the substrate 110 .
  • the atomic layers may be substantially vertical to the main surface of the substrate 110 , inside the second portion 852 of the 2D material pattern 850 .
  • the gate structure GS may extend in the first direction X along the recess 110 R of the substrate 110 .
  • the gate structure GS may include the gate insulating layer 160 and the gate electrode 170 .
  • the gate structure GS may be in contact with the first portion 851 of the 2D material pattern 850 .
  • the gate structure GS may be further in contact with the third portion 853 of the 2D material pattern 850 .
  • the first electrode 120 may be in contact with one end of the 2D material pattern 850 .
  • the second electrode 140 may be in contact with the other end of the 2D material pattern 850 .
  • FIG. 9A is a top view of a device 900 including a 2D material, according to an embodiment of inventive concepts.
  • FIG. 9B is a cross-sectional view taken along line AA′ of FIG. 9A .
  • FIG. 9C is a cross-sectional view taken along line BB′ of FIG. 9A .
  • the device 900 including a 2D material may be a buried transistor.
  • differences between the device 800 including a 2D material, according to the embodiment shown in FIGS. 8A to 8C , and the device 900 including a 2D material, according to the present embodiment, will be described.
  • the 2D material pattern 850 may extend in the first direction X along the recess 110 R of the substrate 110 .
  • the 2D material pattern 850 may include the first portion 851 on the lower surface of the recess 110 R of the substrate 110 and the second portion 852 on the side surface of the recess 110 R of the substrate 110 .
  • the gate structure GS may intersect with the 2D material pattern 850 and extend in the second direction Y.
  • the gate structure GS may be in contact with the first portion 851 and the second portion 852 of the 2D material pattern 850 .
  • the gate structure GS may be in contact with the main surface of the substrate 110 .
  • FIG. 10A is a top view of a device 1000 including a 2D material, according to an embodiment of inventive concepts.
  • FIG. 10B is a cross-sectional view taken along line AA′ of FIG. 10A .
  • FIG. 10C is a cross-sectional view taken along line BB′ of FIG. 10A .
  • the device 1000 including a 2D material may be a fin transistor.
  • differences between the device 900 including a 2D material, according to the embodiment shown in FIGS. 9A to 9C , and the device 1000 including a 2D material, according to the present embodiment, will be described.
  • the substrate 110 may have a fin 110 F protruding from the main surface of the substrate 110 and extending in the first direction X.
  • the 2D material pattern 850 may extend in the first direction X along the fin 110 F of the substrate 110 .
  • the 2D material pattern 850 may include the first portion 851 on an upper surface of the fin 110 F of the substrate 110 and the second portion 852 on a side surface of the fin 110 F of the substrate 110 .
  • the 2D material pattern 850 may further include the third portion 853 on the main surface of the substrate 110 .
  • the atomic layers may be substantially parallel to the upper surface of the fin 110 F of the substrate 110 , inside the first portion 851 of the 2D material pattern 850 .
  • the atomic layers may be substantially parallel to the side surface of the fin 110 F of the substrate 110 , inside the second portion 852 of the 2D material pattern 850 .
  • the upper surface of the fin 110 F of the substrate 110 may be substantially orthogonal to the side surface of the fin 110 F of the substrate 110 .
  • the atomic layers may be substantially vertical to the main surface of the substrate 110 , inside the second portion 852 of the 2D material pattern 850 .
  • the gate structure GS may intersect with the 2D material pattern 850 and extend in the second direction Y.
  • the gate structure GS may be in contact with the first portion 851 , the second portion 852 , and the third portion 853 of the 2D material pattern 850 .
  • FIGS. 11A to 11H are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • the first electrode 120 and the first inter-layer insulating layer 125 are formed on the substrate 110 .
  • the insulating pattern 130 is formed on the first electrode 120 .
  • the 2D material layer 150 may be formed on a surface of the insulating pattern 130 .
  • the 2D material layer 150 may be formed by a reaction between a chemical material and the surface of the insulating pattern 130 .
  • the 2D material layer 150 including a TMDC may be formed by a reaction between a chemical material including a chalcogen element and the surface of the insulating pattern 130 including a transition metal or a transition metal oxide.
  • the 2D material layer 150 including MoS 2 may be formed by a sulfurization reaction between the surface of the insulating pattern 130 including MoO 2 and sulfur (S) steam.
  • a process temperature during the sulfurization reaction between MoO 2 and sulfur (S) steam may be lower than a sublimation temperature of MoO 2 .
  • a reaction temperature may be about 400° C. to about 1100° C. Since MoO 2 maintains a solid phase at the reaction temperature, the 2D material layer 150 including MoS 2 with a uniform thickness may be formed on the surface of the insulating pattern 130 . Due to strong Mo—O bonding, the 2D material layer 150 may be formed with a uniform and small thickness.
  • the number of atomic layers forming the 2D material layer 150 increases, and thus the thickness of the 2D material layer 150 to be formed may be adjusted by adjusting the reaction time.
  • the band-gap energy of the 2D material layer 150 may be adjusted by adjusting the thickness of the 2D material layer 150 .
  • the gate insulating layer 160 covering the 2D material layer 150 is formed.
  • the gate insulating layer 160 may be formed by, for example atomic layer deposition.
  • the gate electrode 170 is formed on the gate insulating layer 160 .
  • the gate electrode 170 may be formed by, for example, forming a gate layer (not shown) and patterning the gate layer (not shown). According to an embodiment, the gate electrode 170 may be patterned in an all-around type. In the forming the gate layer (not shown), for example, chemical vapor deposition, plasma chemical vapor deposition, or atomic layer deposition may be used. In the patterning the gate layer (not shown), for example, an etch-back process may be used.
  • the second inter-layer insulating layer 180 is formed on the gate electrode 170 .
  • the second inter-layer insulating layer 180 may be formed by, for example, chemical vapor deposition or plasma chemical vapor deposition.
  • a portion of the second inter-layer insulating layer 180 , a portion of the gate insulating layer 160 , and a portion of the 2D material layer 150 may be removed such that the upper surface of the insulating pattern 130 is exposed.
  • a portion of the 2D material layer 150 which is formed on the upper surface of the insulating pattern 130 , may be removed. In the removal, for example, chemical mechanical polishing (CMP) may be used.
  • CMP chemical mechanical polishing
  • the second electrode 140 is formed on the upper surface of the insulating pattern 130 .
  • the second electrode 140 may be formed so as to be electrically connected to the 2D material layer 150 .
  • the device 100 including a 2D material may be manufactured.
  • the device 200 including a 2D material may be manufactured.
  • the device 300 including a 2D material may be manufactured.
  • the device 400 including a 2D material may be manufactured.
  • FIGS. 12A to 12E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • the insulating pattern 130 is formed on the substrate 110 .
  • a detailed description of the forming the insulating pattern 130 is the same as described with reference to FIG. 11B .
  • the device isolation film 620 is formed on the substrate 110 .
  • the device isolation film 620 may be formed with a lower height than a height of the insulating pattern 130 such that a portion of the insulating pattern 130 may be not covered by the device isolation film 620 .
  • the device isolation film 620 may be formed by, for example, chemical vapor deposition, plasma chemical vapor deposition, or a thermal oxidation process.
  • the 2D material layer 150 is formed on a surface of the insulating pattern 130 .
  • the channel structure 510 including the insulating pattern 130 and the 2D material layer 150 is formed.
  • the 2D material layer 150 may be formed only on a surface of the insulating pattern 130 , which is not covered by the device isolation film 620 .
  • the 2D material layer 150 may be formed on an upper surface and a portion of a side wall of the insulating pattern 130 . A detailed description of the forming the 2D material layer 150 is the same as described with reference to FIG. 11C .
  • the gate insulating layer 160 is formed on the 2D material layer 150 .
  • the gate electrode 170 is formed on the gate insulating layer 160 .
  • a detailed description of the forming the gate electrode 170 is the same as described with reference to FIG. 11E .
  • the first electrode 120 (see FIG. 5A ) and the second electrode 140 (see FIG. 5A ) are respectively formed on both ends of the channel structure 510 .
  • the first electrode 120 (see FIG. 5A ) and the second electrode 140 (see FIG. 5A ) may be formed between the forming the 2D material layer 150 , which is shown in FIG. 12C , and the forming the gate insulating layer 160 , which is shown in FIG. 12D .
  • the device 600 including a 2D material may be manufactured.
  • the gate insulating layer 160 and the gate electrode 170 may be formed by a replacement gate method. For example, a sacrificial gate structure (not shown) is first formed, and then an inter-layer insulating layer (not shown) covering a side wall of the sacrificial gate structure (not shown) is formed. Thereafter, the sacrificial gate structure (not shown) is removed, and the gate insulating layer 160 and the gate electrode 170 may be formed in a space from which the sacrificial gate structure (not shown) has been removed.
  • the device 500 including a 2D material may be manufactured.
  • FIGS. 13A to 13F are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • the first inter-layer insulating layer 125 is formed on the substrate 110 .
  • the first inter-layer insulating layer 125 may be formed by, for example, atomic layer deposition, thermal oxidation, chemical vapor deposition, or plasma chemical vapor deposition.
  • the insulating pattern 130 is formed on the first inter-layer insulating layer 125 .
  • a detailed description of the forming the insulating pattern 130 is the same as described with reference to FIG. 11B .
  • the 2D material layer 150 is formed on a surface of the insulating pattern 130 .
  • a detailed description of the forming the 2D material layer 150 is the same as described with reference to FIG. 11C .
  • an electrode pattern EP is formed on the 2D material layer 150 .
  • the second inter-layer insulating layer 180 is formed on the electrode pattern EP.
  • the second inter-layer insulating layer 180 may be formed by, for example, chemical vapor deposition or plasma chemical vapor deposition.
  • a portion of the second inter-layer insulating layer 180 , the electrode pattern EP, and the 2D material layer 150 is removed such that an upper surface of the insulating pattern 130 is exposed.
  • a polishing process selected from among (or such as) CMP and the like may be used.
  • the portion of the electrode pattern EP the first electrode 120 and the second electrode 140 may be formed.
  • the 2D material layer 150 which is formed on the upper surface of the insulating pattern 130 , one pair of 2D material layers 150 located on a side wall of the insulating pattern 130 and separated from each other may be formed.
  • the device 700 including a 2D material may be manufactured.
  • FIGS. 14A to 14D are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • the substrate 110 having the recess 110 R extending in the first direction X may be provided.
  • a material pattern 1410 extending in the second direction Y may be formed on the substrate 110 .
  • the material pattern 1410 may include a material which may react with a chemical material to thereby form a 2D material.
  • the material pattern 1410 may include a transition metal oxide or a transition metal.
  • the material pattern 1410 may include, for example, MoO 2 , MoO 3 , or Mo.
  • the material pattern 1410 may be substituted with the 2D material pattern 850 .
  • the material pattern 1410 may react with a reactant including a chalcogen-group element.
  • the reactant may be, for example, sulfur (S) steam.
  • the gate structure GS, the first electrode 120 , and the second electrode 140 may be formed on the 2D material pattern 850 .
  • the device 800 including a 2D material may be manufactured.
  • FIGS. 15A to 15E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • the substrate 110 having the recess 110 R extending in the first direction X may be provided.
  • a material layer 1510 may be formed on the substrate 110 .
  • the material layer 1510 may include a material which may react with a chemical material to thereby form a 2D material.
  • the material layer 1510 may include a transition metal oxide or a transition metal.
  • the material layer 1510 may include, for example, MoO 2 , MoO 3 , or Mo.
  • the material layer 1510 may be substituted with a 2D material layer 1520 .
  • the material layer 1510 may react with a reactant including a chalcogen-group element.
  • the reactant may be, for example, sulfur (S) steam.
  • the 2D material layer 1520 may include a first portion 1521 on a lower surface of the recess 110 R of the substrate 110 , a second portion 1522 on a side surface of the recess 110 R of the substrate 110 , and a third portion 1523 on a main surface of the substrate 110 .
  • the 2D material pattern 850 may be formed by removing the third portion 1523 of the 2D material layer 1520 , which is formed on the main surface of the substrate 110 .
  • the removing the third portion 1523 (see FIG. 15C ) of the 2D material layer 1520 may include forming a cover layer 1540 on the 2D material layer 1520 and polishing a portion of the cover layer 1540 and the third portion 1523 (see FIG. 15C ) of the 2D material layer 1520 such that the main surface of the substrate 110 is exposed.
  • the gate structure GS, the first electrode (see FIGS. 9A and 9C ), and the second electrode 140 (see FIGS. 9A and 9C ) may be formed on the 2D material pattern 850 .
  • the device 900 including a 2D material may be manufactured.
  • FIGS. 16A to 16E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • the substrate 110 having the fin 110 F extending in the first direction X may be provided.
  • the material layer 1510 may be formed on the substrate 110 .
  • the material layer 1510 may be substituted to the 2D material layer 1520 .
  • the 2D material pattern 850 may be formed by removing a portion of the 2D material layer 1520 .
  • the gate structure GS, the first electrode (see FIGS. 10A and 10C ), and the second electrode 140 (see FIGS. 10A and 10C ) may be formed on the 2D material pattern 850 .
  • the device 1000 including a 2D material may be manufactured.
  • inventive concepts should be considered in descriptive sense only and not for purposes of limitation, and the scope of the technical idea of inventive concepts is not limited by the embodiments.
  • the protection scope of inventive concepts should be analysed by the following claims, and it should be analysed that all technical ideas within the scope equivalent to the protection scope are included in the right scope of inventive concepts.

Abstract

A device including a two-dimensional (2D) material includes a substrate including a recess recessed from a main surface of the substrate and extending in a first direction, a 2D material pattern on the substrate and intersecting with the recess of the substrate, a gate structure contacting the 2D material pattern and extending in the first direction along the recess of the substrate, a first electrode contacting a first end of the 2D material pattern, and a second electrode contacting a second end of the 2D material pattern. The 2D material pattern extends in a second direction and includes atomic layers that are parallel to a surface of the substrate.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application claims the benefit of Korean Patent Application No. 10-2017-0112493, filed on Sep. 4, 2017, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
    • BACKGROUND
  • Inventive concepts relate to a device including a two-dimensional (2D) material, and more particularly, to a vertical transistor device, a fin transistor device, a tunneling device, and a buried transistor device including a 2D material.
  • Since the success of separation of graphene from graphite, much research into 2D materials including graphene, hexagonal boron nitride (h-BN), and transition metal dichalcogenide (TMDC) has been conducted. The 2D materials may be formed to have only a single atomic layer or several atomic layers. The 2D materials have a small thickness of several nanometers or less and may have better electrical, optical, thermal, and chemical characteristics than existing materials having a 3D crystal structure, and thus the 2D materials have attracted attention as new materials for electronic and optical devices.
    • SUMMARY
  • Inventive concepts provide a device including a two-dimensional (2D) material.
  • According to an aspect of inventive concepts, a device includes a substrate, a first electrode on the substrate, an insulating pattern on the substrate, a second electrode on an upper end of the insulating pattern, a 2D material layer along a side surface of the insulating pattern, a gate insulating layer covering the 2D material layer, and a gate electrode contacting the gate insulating layer. The insulating pattern may extend from the first electrode in a direction substantially vertical to the substrate. The 2D material layer may include at least one atomic layer of a 2D material that is substantially parallel to the side surface of the insulating pattern.
  • According to another aspect of inventive concepts, a device includes a substrate, a channel structure on the substrate, a first electrode and a second electrode on the substrate, a gate electrode on the substrate, and a gate insulating layer between the channel structure and the gate electrode. The channel structure may extend in a first direction that is parallel to the substrate. The first electrode and a second electrode respectively may be located at both ends of the channel structure. The gate electrode may extend in a second direction that is parallel to the substrate and the gate electrode may intersect the channel structure. The channel structure may include an insulating pattern and a 2D material layer on a surface of the insulating pattern. The 2D material layer may include at least one atomic layer of a 2D material that is parallel to the surface of the insulating pattern.
  • According to another aspect of inventive concepts, a device includes a substrate, an insulating pattern on the substrate, one pair of 2D material layers on side surfaces of the insulating pattern, a first electrode, and a second electrode. Each of the one pair of 2D material layers may include at least one atomic layer of a 2D material that may be parallel to the side surface of the insulating pattern. The one pair of 2D material layers may include a first 2D material layer and second 2D material layer spaced apart from each other in a first direction that may be parallel to the substrate by interposing the insulating pattern therebetween. The first electrode may contact the first 2D material layer. The second electrode may contact the second 2D material layer.
  • According to another aspect of inventive concepts, a device includes a substrate including a recess, a 2D material pattern on the substrate, a gate structure contacting the 2D material pattern, a first electrode contacting a first end of the 2D material pattern, and a second electrode contacting a second end of the 2D material pattern. The recess may be recessed from a main surface of the substrate and may extend in a first direction. The 2D material pattern may intersect the recess of the substrate and may extend in a second direction. The gate structure may contact the 2D material pattern and may extend in the first direction along the recess of the substrate. The first electrode may contact a first end of the 2D material pattern. The second electrode may contact a second end of the 2D material pattern. The 2D material pattern may include atomic layers that are parallel to a surface of the substrate.
  • According to another aspect of inventive concepts, a device includes a substrate including a recess, a 2D material on the substrate, a gate structure intersecting the 2D material pattern, a first electrode contacting a first end of the 2D material pattern, and a second electrode contacting a second end of the 2D material pattern. The recess may be recessed from a main surface of the substrate and may extend in a first direction. The 2D material pattern may extend in the first direction along the recess of the substrate. The gate structure may intersect the 2D material pattern and may extend in a second direction. The first electrode may contact a first end of the 2D material pattern. The second electrode may contact a second end of the 2D material pattern. The 2D material pattern may include a first portion and a second portion. The first portion may be on a lower surface of the recess of the substrate and the second portion may be on a side surface of the recess of the substrate.
  • According to another aspect of inventive concepts, a device may include a substrate including a fin protruding from a main surface of the substrate and extending in a first direction, a 2D material pattern on the substrate and extending in the first direction along the fin, a gate structure intersecting the 2D material pattern and extending in a second direction, a first electrode contacting a first end of the 2D material pattern, and a second electrode contacting a second end of the 2D material pattern. The 2D material pattern may include a first portion on an upper surface of the fin of the substrate and a second portion on a side surface of the fin of the substrate.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Embodiments of inventive concepts will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:
  • FIGS. 1A and 1B are cross-sectional views of a device including a two-dimensional (2D) material, according to an embodiment of inventive concepts, FIG. 1B being a cross-sectional view taken along line AA′ of FIG. 1A;
  • FIGS. 2A and 2B are cross-sectional views of a device including a 2D material, according to an embodiment of inventive concepts, FIG. 2B being a cross-sectional view taken along line AA′ of FIG. 2A;
  • FIGS. 3A and 3B are cross-sectional views of a device including a 2D material, according to an embodiment of inventive concepts, FIG. 3B being a cross-sectional view taken along line AA′ of FIG. 3A;
  • FIGS. 4A and 4B are cross-sectional views of a device including a 2D material, according to an embodiment of inventive concepts, FIG. 4B being a cross-sectional view taken along line AA′ of FIG. 4A;
  • FIG. 5A is a perspective view of a device including a 2D material, according to an embodiment of inventive concepts;
  • FIG. 5B is a cross-sectional view taken along line AA′ of FIG. 5A;
  • FIG. 6A is a perspective view of a device including a 2D material, according to an embodiment of inventive concepts;
  • FIG. 6B is a cross-sectional view taken along line AA′ of FIG. 6A;
  • FIGS. 7A and 7B are cross-sectional views of a device including a 2D material, according to an embodiment of inventive concepts, FIG. 7B being a cross-sectional view taken along line AA′ of FIG. 7A;
  • FIG. 8A is a top view of a device including a 2D material, according to an embodiment of inventive concepts;
  • FIG. 8B is a cross-sectional view taken along line AA′ of FIG. 8A;
  • FIG. 8C is a cross-sectional view taken along line BB′ of FIG. 8A;
  • FIG. 9A is a top view of a device including a 2D material, according to an embodiment of inventive concepts;
  • FIG. 9B is a cross-sectional view taken along line AA′ of FIG. 9A;
  • FIG. 9C is a cross-sectional view taken along line BB′ of FIG. 9A;
  • FIG. 10A is a top view of a device including a 2D material, according to an embodiment of inventive concepts;
  • FIG. 10B is a cross-sectional view taken along line AA′ of FIG. 10A;
  • FIG. 10C is a cross-sectional view taken along line BB′ of FIG. 10A;
  • FIGS. 11A to 11H are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts;
  • FIGS. 12A to 12E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts;
  • FIGS. 13A to 13F are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts;
  • FIGS. 14A to 14D are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts;
  • FIGS. 15A to 15E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts; and
  • FIGS. 16A to 16E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
    •  DETAILED DESCRIPTION
  • When the term “substantially” is used in this specification in connection with a numerical value, it is intended that the associated numerical value include a tolerance of ±10% around the stated numerical value unless the context indicates otherwise.
  • FIGS. 1A and 1B are cross-sectional views of a device 100 including a two-dimensional (2D) material, according to an embodiment of inventive concepts, FIG. 1B being a cross-sectional view taken along line AA′ of FIG. 1A.
  • Referring to FIG. 1A, the device 100 including a 2D material, according to an embodiment of inventive concepts, may include a substrate 110, a first electrode 120, a second electrode 140, an insulating pattern 130, a 2D material layer 150, a gate insulating layer 160, and a gate electrode 170. The device 100 may be a vertical transistor.
  • The substrate 110 may include a semiconductor material, glass, or plastic. The semiconductor material may include a IV group semiconductor material, a III-V group semiconductor material, or a II-VI group semiconductor material. The IV group semiconductor material may include, for example, silicon (Si), germanium (Ge), or Si—Ge. The III-V group semiconductor material may include, for example, gallium arsenide (GaAs), indium phosphide (InP), GaP, InAs, Indium antimonide (InSb), or InGaAs. The II-VI group semiconductor material may include, for example, zinc telluride (ZnTe) or cadmium sulfide (CdS). The substrate 110 including the semiconductor material may be a bulk wafer or an epitaxial layer.
  • The first electrode 120 may be located on the substrate 110. The second electrode 140 may be located at an upper end of the insulating pattern 130. The first electrode 120 and the second electrode 140 may independently include a metal, a metal nitride, or a combination thereof. The metal may include, for example, tungsten (W), copper (Cu), gold (Au), silver (Ag), titanium (Ti), tantalum (Ta), ruthenium (Ru), or cobalt (Co). The metal nitride may include, for example, titanium nitride (TiN), TaN, CoN, or WN. According to some embodiments, an area of a cross-section of the first electrode 120 that is parallel to the substrate 110 may differ from an area of a cross-section of the second electrode 140 that is parallel to the substrate 110.
  • According to some embodiments, a first inter-layer insulating layer 125 may cover a side wall of the first electrode 120. The first electrode 120 may penetrate through the first inter-layer insulating layer 125. The first inter-layer insulating layer 125 may include an insulating material selected from among (or such as), for example, silicon oxide, silicon nitride, and silicon oxynitride.
  • According to some embodiments, like the first electrode 120, a third inter-layer insulating layer 145 (see FIG. 2A) may be located around the second electrode 140. The second electrode 140 may penetrate through the third inter-layer insulating layer 145 (see FIG. 2A). The third inter-layer insulating layer 145 (see FIG. 2A) may include an insulating material selected from among (or such as), for example, silicon oxide, silicon nitride, and silicon oxynitride.
  • The insulating pattern 130 may extend from the first electrode 120 to the second electrode 140 in a direction vertical to the substrate 110. Although FIG. 1B shows that a cross-section of the insulating pattern 130 that is parallel to the substrate 110 is rectangular, a shape of the cross-section of the insulating pattern 130 is not limited thereto. The insulating pattern 130 may include an insulating material which may form a 2D material by reacting with another chemical material. According to some embodiments, the insulating pattern 130 may include metal oxides, particularly, transition metal oxides. The insulating pattern 130 may include, for example, tungsten oxides, copper oxides, nickel oxides, molybdenum oxides, titanium oxides, vanadium oxides, zirconium oxides, hafnium oxides, palladium oxides, platinum oxides, niobium oxides, tantalum oxides, technetium oxides, or rhenium oxides. According to some embodiments, the insulating pattern 130 may include a transition metal dioxide selected from among (or such as) molybdenum dioxide (MoO2), tungsten dioxide (WO2), and the like.
  • The 2D material layer 150 may be located on a side wall of the insulating pattern 130. The 2D material layer 150 may surround the entire side wall of the insulating pattern 130. That is, the 2D material layer 150 may be formed on all of four side surfaces forming the side wall of the insulating pattern 130. The 2D material layer 150 may extend from the first electrode 120 to the second electrode 140 in a direction substantially vertical to the substrate 110 along the side wall of the insulating pattern 130. The 2D material layer 150 may include a 2D material selected from among (or such as) graphene, hexagonal boron nitride (h-BN), transition metal dichalcogenide (TMDC), and the like. The TMDC has a chemical formula of MX2, where M denotes a transition metal selected from among (or such as) molybdenum (Mo), W, nickel (Ni), Ti, vanadium (V), zirconium (Zr), hafnium (Hf), palladium (Pd), platinum (Pt), niobium (Nb), Ta, technetium (Tc), rhenium (Re), and the like, and X denotes a chalcogen element selected from among sulfur (S), selenium (Se), tellurium (Te), and the like. The 2D material layer 150 may be formed by a reaction between the insulating pattern 130 and a chemical material. According to some embodiments, the 2D material layer 150 and the insulating pattern 130 may include a same transition metal element. For example, the 2D material layer 150 may include molybdenum disulfide (MoS2), and the insulating pattern 130 may include MoO2. In addition, the 2D material layer 150 may be doped in an n or p type.
  • The 2D material layer 150 may include at least one atomic layer of a 2D material. According to some embodiments, the 2D material layer 150 may include one or tens of atomic layers (e.g., in a range of 1 to 90, 1 to 30, 1 to 10, and/or 1-3 atomic layers). When the 2D material layer 150 has a plurality of atomic layers, the plurality of atomic layers may be parallel to each other. Each atomic layer forming the 2D material layer 150 may be parallel to the side wall of the insulating pattern 130. The side wall of the insulating pattern 130 may be substantially vertical to the substrate 110, and the atomic layer of a 2D material may be substantially vertical to the substrate 110.
  • The 2D material layer 150 may be a semiconductor. Band-gap energy of the 2D material layer 150 may vary according to the number of atomic layers forming the 2D material layer 150. An increase in the number of atomic layers forming the 2D material layer 150 may cause a decrease in the band-gap energy of the 2D material layer 150. That is, an increase in a thickness of the 2D material layer 150 may cause a decrease in the band-gap energy of the 2D material layer 150. Band-gap energy of a material forming the insulating pattern 130 may be greater than the band-gap energy of the 2D material layer 150. For example, band-gap energy of MoO2 forming the insulating pattern 130 may be about 3.9 eV or higher, and the band-gap energy of the 2D material layer 150 including one atomic layer of MoS2 may be about 2.1 eV or lower that is lower than the band-gap energy of MoO2 forming the insulating pattern 130. As the number of atomic layers forming the 2D material layer 150 increase, the band-gap energy of the 2D material layer 150 may further decrease.
  • The gate insulating layer 160 may cover the 2D material layer 150. As shown in FIG. 1B, the gate insulating layer 160 may surround the circumference of the 2D material layer 150. The gate insulating layer 160 may be in contact with the first electrode 120 and the second electrode 140. The gate insulating layer 160 may include an insulating material selected from among (or such as), for example, HfO2, ZrO2, lanthanum oxide (LaO3), Ta2O5, TiO2, yttrium oxide (Y2O3), and aluminum oxide (Al2O3).
  • The gate electrode 170 may be located around the gate insulating layer 160. The gate electrode 170 may be in contact with the gate insulating layer 160. According to one embodiment of inventive concepts, the gate electrode 170 may be an all-around gate type. That is, the gate electrode 170 may surround the circumference of the gate insulating layer 160. The gate electrode 170 may include a metal selected from among (or such as), for example, Ti, Ta, Al, W, Ru, Ni, Mo, Hf, Ni, Co, Pt, and Pd or a nitride of the metal.
  • According to some embodiments, the gate electrode 170 may be spaced apart from the second electrode 140 by a second inter-layer insulating layer 180. The second inter-layer insulating layer 180 may include an insulating material selected from among (or such as), for example, silicon oxide, silicon nitride, and silicon oxynitride.
  • According to some embodiments, a fourth inter-layer insulating layer (not shown) may be further included under the gate electrode 170. That is, the fourth inter-layer insulating layer (not shown) may be further included between a lower surface of the gate electrode 170 and the gate insulating layer 160. Like the second inter-layer insulating layer 180, the fourth inter-layer insulating layer (not shown) may include an insulating material selected from among (or such as) silicon oxide, silicon nitride, silicon oxynitride, and the like.
  • FIGS. 2A and 2B are cross-sectional views of a device 200 including a 2D material, according to an embodiment of inventive concepts, FIG. 2B being a cross-sectional view taken along line AA′ of FIG. 2A. Hereinafter, differences from the embodiment described with reference to FIGS. 1A and 1B will be described.
  • Referring to FIGS. 2A and 2B, the gate electrode 170 included in the device 200 including a 2D material, according to an embodiment of inventive concepts, may be a dual gate type. That is, the gate electrode 170 may include a first gate electrode in contact with one side of the gate insulating layer 160 and a second gate electrode in contact with the other side of the gate insulating layer 160. The first gate electrode and the second gate electrode may be spaced from each other by interposing the insulating pattern 130, the 2D material layer 150, and the gate insulating layer 160.
  • FIGS. 3A and 3B are cross-sectional views of a device 300 including a 2D material, according to an embodiment of inventive concepts, FIG. 3B being a cross-sectional view taken along line AA′ of FIG. 3A. Hereinafter, differences from the embodiment described with reference to FIGS. 1A and 1B will be described.
  • Referring to FIGS. 3A and 3B, the gate electrode 170 included in the device 300 including a 2D material, according to an embodiment of inventive concepts, may be a single gate type. That is, the gate electrode 170 may be located at one side of the gate insulating layer 160.
  • FIGS. 4A and 4B are cross-sectional views of a device 400 including a 2D material, according to an embodiment of inventive concepts, FIG. 4B being a cross-sectional view taken along line AA′ of FIG. 4A. Hereinafter, differences from the embodiment described with reference to FIGS. 1A and 1B will be described.
  • Referring to FIGS. 4A and 4B, the 2D material layer 150 may be located on not only the side wall of the insulating pattern 130 but also an upper surface thereof. That is, the 2D material layer 150 may be located between the second electrode 140 and the insulating pattern 130. According to some embodiments, a portion of the 2D material layer 150 that is located on the upper surface of the insulating pattern 130 may be thinner than a portion of the 2D material layer 150 that is located on the side wall of the insulating pattern 130.
  • FIG. 5A is a perspective view of a device 500 including a 2D material, according to an embodiment of inventive concepts. FIG. 5B is a cross-sectional view taken along line AA′ of FIG. 5A.
  • The device 500 including a 2D material, according to an embodiment of inventive concepts, may include a channel structure 510, the first electrode 120, the second electrode 140, the gate electrode 170, and the gate insulating layer 160. The device 500 may be a fin transistor.
  • The channel structure 510 may extend in a first direction X that is parallel to the substrate 110. The channel structure 510 may include the insulating pattern 130 and the 2D material layer 150. The insulating pattern 130 may extend in the first direction X that is parallel to the substrate 110. The 2D material layer 150 may be located on a surface of the insulating pattern 130. The 2D material layer 150 may include, for example, a first portion 151 on the upper surface of the insulating pattern 130 and a second portion 152 on a side surface of the insulating pattern 130. The atomic layer forming the 2D material layer 150 may be parallel to the surface of the insulating pattern 130. For example, the atomic layer may be parallel to the upper surface of the insulating pattern 130, inside the first portion 151 of the 2D material layer 150. The upper surface of the insulating pattern 130 may be substantially parallel to the substrate 110, and in this case, the atomic layer may be substantially parallel to the substrate 110, inside the first portion 151 of the 2D material layer 150. In addition, the atomic layer may be parallel to the side wall of the insulating pattern 130, inside the second portion 152 of the 2D material layer 150. The side wall of the insulating pattern 130 may be substantially vertical to the substrate 110, and in this case, the atomic layer may be substantially vertical to the substrate 110, inside the second portion 152 of the 2D material layer 150.
  • The first electrode 120 and the second electrode 140 may be respectively located on both ends of the channel structure 510. The first electrode 120 and the second electrode 140 may be electrically connected to the 2D material layer 150 of the channel structure 510.
  • The gate electrode 170 may pass above the channel structure 510. The gate electrode 170 may extend in a second direction Y that is parallel to the substrate 110 and intersect with the channel structure 510. The gate insulating layer 160 may be located between the channel structure 510 and the gate electrode 170. The gate insulating layer 160 may be in contact with side surfaces and an upper surface of the channel structure 510.
  • A description of respective constituent materials of the substrate 110, the insulating pattern 130, the 2D material layer 150, the first electrode 120, the second electrode 140, the gate electrode 170, and the gate insulating layer 160 is the same as described with reference to FIGS. 1A and 1B.
  • FIG. 6A is a perspective view of a device 600 including a 2D material, according to an embodiment of inventive concepts. FIG. 6B is a cross-sectional view taken along line AA′ of FIG. 6A. Hereinafter, differences from the embodiment described with reference to FIGS. 5A and 5B will be described.
  • Referring to FIGS. 6A and 6B, the device 600 including a 2D material, according to an embodiment of inventive concepts, may further include a device isolation film 620. The device isolation film 620 may include an insulating material selected from among (or such as) silicon oxide, silicon nitride, silicon oxynitride, and the like.
  • An upper surface of the device isolation film 620 may be lower than the upper surface of the insulating pattern 130. That is, the insulating pattern 130 may protrude from the device isolation film 620. The device isolation film 620 may cover a portion of the side wall of the insulating pattern 130. The device isolation film 620 may not cover the other portion of the side wall of the insulating pattern 130 and the upper surface of the insulating pattern 130. The 2D material layer 150 may be located on the portion of the side wall of the insulating pattern 130, which is not covered by the device isolation film 620, and the upper surface of the insulating pattern 130.
  • FIGS. 7A and 7B are cross-sectional views of a device 700 including a 2D material, according to an embodiment of inventive concepts, FIG. 7B being a cross-sectional view taken along line AA′ of FIG. 7A.
  • The device 700 including a 2D material, according to an embodiment of inventive concepts, may include the substrate 110, the insulating pattern 130, one pair of 2D material layers 150, the first electrode 120, and the second electrode 140. The device 700 may be a tunneling device.
  • The insulating pattern 130 is located on the substrate 110. The one pair of 2D material layers 150 are located on the side wall of the insulating pattern 130. The one pair of 2D material layers 150 are spaced apart from each other in the first direction X by the insulating pattern 130. The first electrode 120 is in contact with one of the one pair of 2D material layers 150, and the second electrode 140 is in contact with the other one of the one pair of 2D material layers 150. That is, the first electrode 120 and the second electrode 140 are spaced apart from each other in the first direction X by interposing the insulating pattern 130 and the one pair of 2D material layers 150 therebetween.
  • A width W1 of the first electrode 120 in the second direction Y may be substantially the same as a width W2 of the insulating pattern 130 in the second direction Y. In addition, a height H1 of first electrode 120 in a third direction Z may be substantially the same as a height H2 of the insulating pattern 130 in the third direction Z.
  • According to some embodiments, the device 700 may further include the first inter-layer insulating layer 125. The first inter-layer insulating layer 125 may be located on the substrate 110. The first electrode 120, the second electrode 140, and the 2D material layers 150 may be located on the first inter-layer insulating layer 125. As shown in FIG. 7A, the insulating pattern 130 may be located on the first inter-layer insulating layer 125. Unlike FIG. 7A, the insulating pattern 130 may extend from the substrate 110 in a direction substantially vertical to the substrate 110 and penetrate through the first inter-layer insulating layer 125.
  • According to some embodiments, the device 700 may further include the second inter-layer insulating layer 180. The second inter-layer insulating layer 180 may cover a side wall of the insulating pattern 130, the first electrode 120, and the second electrode 140.
  • A detailed description of materials forming the substrate 110, the insulating pattern 130, the 2D material layer 150, the first electrode 120, the second electrode 140, the first inter-layer insulating layer 125, and the second inter-layer insulating layer 180 is the same as described with reference to FIGS. 1A and 1B.
  • FIG. 8A is a top view of a device 800 including a 2D material, according to an embodiment of inventive concepts. FIG. 8B is a cross-sectional view taken along line AA′ of FIG. 8A. FIG. 8C is a cross-sectional view taken along line BB′ of FIG. 8A.
  • Referring to FIGS. 8A, 8B, and 8C, the device 800 including a 2D material, according to an embodiment of inventive concepts, may include the substrate 110, a 2D material pattern 850, a gate structure GS, the first electrode 120, and the second electrode 140. The device 800 may be a buried transistor.
  • The substrate 110 may have a recess 110R recessed from a main surface of the substrate 110 and extending in the first direction X. The 2D material pattern 850 may extend in the second direction Y. The 2D material pattern 850 may intersect with the recess 110R of the substrate 110. The 2D material pattern 850 may include a 2D material selected from among (or such as) a TMDC and the like. The 2D material pattern 850 may have atomic layers that are parallel to a surface of the substrate 110. For example, the 2D material pattern 850 may include a first portion 851 on a lower surface of the recess 110R of the substrate 110, a second portion 852 on a side surface of the recess 110R of the substrate 110, and a third portion 853 on the main surface of the substrate 110. The atomic layers may be substantially parallel to the lower surface of the recess 110R of the substrate 110, inside the first portion 851 of the 2D material pattern 850. The atomic layers may be substantially parallel to the side surface of the recess 110R of the substrate 110, inside the second portion 852 of the 2D material pattern 850. The atomic layers may be substantially parallel to the main surface of the substrate 110, inside the third portion 853 of the 2D material pattern 850. According to some embodiments, the lower surface of the recess 110R of the substrate 110 may be substantially orthogonal to the side surface of the recess 110R of the substrate 110. In this case, the atomic layers may be substantially vertical to the main surface of the substrate 110, inside the second portion 852 of the 2D material pattern 850.
  • The gate structure GS may extend in the first direction X along the recess 110R of the substrate 110. The gate structure GS may include the gate insulating layer 160 and the gate electrode 170. The gate structure GS may be in contact with the first portion 851 of the 2D material pattern 850. According to some embodiments, the gate structure GS may be further in contact with the third portion 853 of the 2D material pattern 850. The first electrode 120 may be in contact with one end of the 2D material pattern 850. The second electrode 140 may be in contact with the other end of the 2D material pattern 850.
  • FIG. 9A is a top view of a device 900 including a 2D material, according to an embodiment of inventive concepts. FIG. 9B is a cross-sectional view taken along line AA′ of FIG. 9A. FIG. 9C is a cross-sectional view taken along line BB′ of FIG. 9A.
  • The device 900 including a 2D material, according to an embodiment of inventive concepts, may be a buried transistor. Hereinafter, differences between the device 800 including a 2D material, according to the embodiment shown in FIGS. 8A to 8C, and the device 900 including a 2D material, according to the present embodiment, will be described.
  • Referring to FIGS. 9A to 9C, the 2D material pattern 850 may extend in the first direction X along the recess 110R of the substrate 110. The 2D material pattern 850 may include the first portion 851 on the lower surface of the recess 110R of the substrate 110 and the second portion 852 on the side surface of the recess 110R of the substrate 110. The gate structure GS may intersect with the 2D material pattern 850 and extend in the second direction Y. The gate structure GS may be in contact with the first portion 851 and the second portion 852 of the 2D material pattern 850. In addition, the gate structure GS may be in contact with the main surface of the substrate 110.
  • FIG. 10A is a top view of a device 1000 including a 2D material, according to an embodiment of inventive concepts. FIG. 10B is a cross-sectional view taken along line AA′ of FIG. 10A. FIG. 10C is a cross-sectional view taken along line BB′ of FIG. 10A.
  • The device 1000 including a 2D material, according to an embodiment of inventive concepts, may be a fin transistor. Hereinafter, differences between the device 900 including a 2D material, according to the embodiment shown in FIGS. 9A to 9C, and the device 1000 including a 2D material, according to the present embodiment, will be described.
  • The substrate 110 may have a fin 110F protruding from the main surface of the substrate 110 and extending in the first direction X. The 2D material pattern 850 may extend in the first direction X along the fin 110F of the substrate 110. The 2D material pattern 850 may include the first portion 851 on an upper surface of the fin 110F of the substrate 110 and the second portion 852 on a side surface of the fin 110F of the substrate 110. According to some embodiments, the 2D material pattern 850 may further include the third portion 853 on the main surface of the substrate 110. The atomic layers may be substantially parallel to the upper surface of the fin 110F of the substrate 110, inside the first portion 851 of the 2D material pattern 850. The atomic layers may be substantially parallel to the side surface of the fin 110F of the substrate 110, inside the second portion 852 of the 2D material pattern 850. According to some embodiments, the upper surface of the fin 110F of the substrate 110 may be substantially orthogonal to the side surface of the fin 110F of the substrate 110. In this case, the atomic layers may be substantially vertical to the main surface of the substrate 110, inside the second portion 852 of the 2D material pattern 850. The gate structure GS may intersect with the 2D material pattern 850 and extend in the second direction Y. The gate structure GS may be in contact with the first portion 851, the second portion 852, and the third portion 853 of the 2D material pattern 850.
  • FIGS. 11A to 11H are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • Referring to FIG. 11A, the first electrode 120 and the first inter-layer insulating layer 125 are formed on the substrate 110.
  • Referring to FIG. 11B, the insulating pattern 130 is formed on the first electrode 120.
  • Referring to FIG. 11C, the 2D material layer 150 may be formed on a surface of the insulating pattern 130. The 2D material layer 150 may be formed by a reaction between a chemical material and the surface of the insulating pattern 130. For example, the 2D material layer 150 including a TMDC may be formed by a reaction between a chemical material including a chalcogen element and the surface of the insulating pattern 130 including a transition metal or a transition metal oxide. In detail, the 2D material layer 150 including MoS2 may be formed by a sulfurization reaction between the surface of the insulating pattern 130 including MoO2 and sulfur (S) steam. A process temperature during the sulfurization reaction between MoO2 and sulfur (S) steam may be lower than a sublimation temperature of MoO2. For example, a reaction temperature may be about 400° C. to about 1100° C. Since MoO2 maintains a solid phase at the reaction temperature, the 2D material layer 150 including MoS2 with a uniform thickness may be formed on the surface of the insulating pattern 130. Due to strong Mo—O bonding, the 2D material layer 150 may be formed with a uniform and small thickness. In addition, as a reaction time increases, the number of atomic layers forming the 2D material layer 150 increases, and thus the thickness of the 2D material layer 150 to be formed may be adjusted by adjusting the reaction time. The band-gap energy of the 2D material layer 150 may be adjusted by adjusting the thickness of the 2D material layer 150.
  • Referring to FIG. 11D, the gate insulating layer 160 covering the 2D material layer 150 is formed. The gate insulating layer 160 may be formed by, for example atomic layer deposition.
  • Referring to FIG. 11E, the gate electrode 170 is formed on the gate insulating layer 160. The gate electrode 170 may be formed by, for example, forming a gate layer (not shown) and patterning the gate layer (not shown). According to an embodiment, the gate electrode 170 may be patterned in an all-around type. In the forming the gate layer (not shown), for example, chemical vapor deposition, plasma chemical vapor deposition, or atomic layer deposition may be used. In the patterning the gate layer (not shown), for example, an etch-back process may be used.
  • Referring to FIG. 11F, the second inter-layer insulating layer 180 is formed on the gate electrode 170. The second inter-layer insulating layer 180 may be formed by, for example, chemical vapor deposition or plasma chemical vapor deposition.
  • Referring to FIG. 11G, a portion of the second inter-layer insulating layer 180, a portion of the gate insulating layer 160, and a portion of the 2D material layer 150 may be removed such that the upper surface of the insulating pattern 130 is exposed. A portion of the 2D material layer 150, which is formed on the upper surface of the insulating pattern 130, may be removed. In the removal, for example, chemical mechanical polishing (CMP) may be used.
  • Referring to FIG. 11H, the second electrode 140 is formed on the upper surface of the insulating pattern 130. The second electrode 140 may be formed so as to be electrically connected to the 2D material layer 150.
  • According to the processes shown in FIGS. 11A to 11H, the device 100 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 1A and 1B, may be manufactured.
  • When the gate electrode 170 is formed in a dual gate type in the forming the gate electrode 170, which is shown in FIG. 11E, the device 200 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 2A and 2B, may be manufactured.
  • When the gate electrode 170 is formed in a single gate type in the forming the gate electrode 170, which is shown in FIG. 11F, the device 300 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 3A and 3B, may be manufactured.
  • When the portion of the 2D material layer 150, which is formed on the upper surface of the insulating pattern 130, is not removed or is partially removed in the operation shown in FIG. 11G, the device 400 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 4A and 4B, may be manufactured.
  • FIGS. 12A to 12E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • Referring to 12A, the insulating pattern 130 is formed on the substrate 110. A detailed description of the forming the insulating pattern 130 is the same as described with reference to FIG. 11B.
  • Referring to 12B, the device isolation film 620 is formed on the substrate 110. The device isolation film 620 may be formed with a lower height than a height of the insulating pattern 130 such that a portion of the insulating pattern 130 may be not covered by the device isolation film 620. The device isolation film 620 may be formed by, for example, chemical vapor deposition, plasma chemical vapor deposition, or a thermal oxidation process.
  • Referring to 12C, the 2D material layer 150 is formed on a surface of the insulating pattern 130. By doing this, the channel structure 510 including the insulating pattern 130 and the 2D material layer 150 is formed. According to some embodiments, the 2D material layer 150 may be formed only on a surface of the insulating pattern 130, which is not covered by the device isolation film 620. For example, as shown in FIG. 12C, the 2D material layer 150 may be formed on an upper surface and a portion of a side wall of the insulating pattern 130. A detailed description of the forming the 2D material layer 150 is the same as described with reference to FIG. 11C.
  • Referring to 12D, the gate insulating layer 160 is formed on the 2D material layer 150.
  • Referring to 12E, the gate electrode 170 is formed on the gate insulating layer 160. A detailed description of the forming the gate electrode 170 is the same as described with reference to FIG. 11E. Thereafter, the first electrode 120 (see FIG. 5A) and the second electrode 140 (see FIG. 5A) are respectively formed on both ends of the channel structure 510. According to some embodiments, the first electrode 120 (see FIG. 5A) and the second electrode 140 (see FIG. 5A) may be formed between the forming the 2D material layer 150, which is shown in FIG. 12C, and the forming the gate insulating layer 160, which is shown in FIG. 12D.
  • According to the processes shown in FIGS. 12A to 12E, the device 600 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 6A and 6B, may be manufactured.
  • According to some embodiments, unlike FIGS. 12D and 12E, the gate insulating layer 160 and the gate electrode 170 may be formed by a replacement gate method. For example, a sacrificial gate structure (not shown) is first formed, and then an inter-layer insulating layer (not shown) covering a side wall of the sacrificial gate structure (not shown) is formed. Thereafter, the sacrificial gate structure (not shown) is removed, and the gate insulating layer 160 and the gate electrode 170 may be formed in a space from which the sacrificial gate structure (not shown) has been removed.
  • When the forming the device isolation film 620, which is shown in FIG. 12B, is omitted, the device 500 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 5A and 5B, may be manufactured.
  • FIGS. 13A to 13F are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • Referring to FIG. 13A, the first inter-layer insulating layer 125 is formed on the substrate 110. The first inter-layer insulating layer 125 may be formed by, for example, atomic layer deposition, thermal oxidation, chemical vapor deposition, or plasma chemical vapor deposition.
  • Referring to FIG. 13B, the insulating pattern 130 is formed on the first inter-layer insulating layer 125. A detailed description of the forming the insulating pattern 130 is the same as described with reference to FIG. 11B.
  • Referring to FIG. 13C, the 2D material layer 150 is formed on a surface of the insulating pattern 130. A detailed description of the forming the 2D material layer 150 is the same as described with reference to FIG. 11C.
  • Referring to 13D, an electrode pattern EP is formed on the 2D material layer 150.
  • Referring to 13E, the second inter-layer insulating layer 180 is formed on the electrode pattern EP. The second inter-layer insulating layer 180 may be formed by, for example, chemical vapor deposition or plasma chemical vapor deposition.
  • Referring to 13F, a portion of the second inter-layer insulating layer 180, the electrode pattern EP, and the 2D material layer 150 is removed such that an upper surface of the insulating pattern 130 is exposed. For example, a polishing process selected from among (or such as) CMP and the like may be used. By removing the portion of the electrode pattern EP, the first electrode 120 and the second electrode 140 may be formed. By removing a portion of the 2D material layer 150, which is formed on the upper surface of the insulating pattern 130, one pair of 2D material layers 150 located on a side wall of the insulating pattern 130 and separated from each other may be formed.
  • According to the processes shown in FIGS. 13A to 13F, the device 700 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 7A and 7B, may be manufactured.
  • FIGS. 14A to 14D are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • Referring to FIG. 14A, the substrate 110 having the recess 110R extending in the first direction X may be provided.
  • Referring to FIG. 14B, a material pattern 1410 extending in the second direction Y may be formed on the substrate 110. The material pattern 1410 may include a material which may react with a chemical material to thereby form a 2D material. For example, the material pattern 1410 may include a transition metal oxide or a transition metal. The material pattern 1410 may include, for example, MoO2, MoO3, or Mo.
  • Referring to FIG. 14C, the material pattern 1410 (see FIG. 14B) may be substituted with the 2D material pattern 850. For example, the material pattern 1410 (see FIG. 14B) may react with a reactant including a chalcogen-group element. The reactant may be, for example, sulfur (S) steam.
  • Referring to FIG. 14D, the gate structure GS, the first electrode 120, and the second electrode 140 may be formed on the 2D material pattern 850.
  • According to the processes shown in FIGS. 14A to 14D, the device 800 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 8A to 8C, may be manufactured.
  • FIGS. 15A to 15E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • Referring to FIG. 15A, the substrate 110 having the recess 110R extending in the first direction X may be provided.
  • Referring to FIG. 15B, a material layer 1510 may be formed on the substrate 110. The material layer 1510 may include a material which may react with a chemical material to thereby form a 2D material. For example, the material layer 1510 may include a transition metal oxide or a transition metal. The material layer 1510 may include, for example, MoO2, MoO3, or Mo.
  • Referring to FIG. 15C, the material layer 1510 may be substituted with a 2D material layer 1520. For example, the material layer 1510 may react with a reactant including a chalcogen-group element. The reactant may be, for example, sulfur (S) steam. The 2D material layer 1520 may include a first portion 1521 on a lower surface of the recess 110R of the substrate 110, a second portion 1522 on a side surface of the recess 110R of the substrate 110, and a third portion 1523 on a main surface of the substrate 110.
  • Referring to FIG. 15D, the 2D material pattern 850 may be formed by removing the third portion 1523 of the 2D material layer 1520, which is formed on the main surface of the substrate 110. For example, the removing the third portion 1523 (see FIG. 15C) of the 2D material layer 1520 may include forming a cover layer 1540 on the 2D material layer 1520 and polishing a portion of the cover layer 1540 and the third portion 1523 (see FIG. 15C) of the 2D material layer 1520 such that the main surface of the substrate 110 is exposed.
  • Referring to FIG. 15E, the gate structure GS, the first electrode (see FIGS. 9A and 9C), and the second electrode 140 (see FIGS. 9A and 9C) may be formed on the 2D material pattern 850.
  • According to the processes shown in FIGS. 15A to 15E, the device 900 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 9A to 9C, may be manufactured.
  • FIGS. 16A to 16E are cross-sectional views for describing a method of manufacturing a device including a 2D material, according to an embodiment of inventive concepts.
  • Referring to FIG. 16A, the substrate 110 having the fin 110F extending in the first direction X may be provided.
  • Referring to FIG. 16B, the material layer 1510 may be formed on the substrate 110.
  • Referring to FIG. 16C, the material layer 1510 may be substituted to the 2D material layer 1520.
  • Referring to FIG. 16D, the 2D material pattern 850 may be formed by removing a portion of the 2D material layer 1520.
  • Referring to FIG. 16E, the gate structure GS, the first electrode (see FIGS. 10A and 10C), and the second electrode 140 (see FIGS. 10A and 10C) may be formed on the 2D material pattern 850.
  • According to the processes shown in FIGS. 16A to 16E, the device 1000 including a 2D material, according to the embodiment of inventive concepts which is shown in FIGS. 10A to 10C, may be manufactured.
  • The embodiments disclosed in inventive concepts should be considered in descriptive sense only and not for purposes of limitation, and the scope of the technical idea of inventive concepts is not limited by the embodiments. The protection scope of inventive concepts should be analysed by the following claims, and it should be analysed that all technical ideas within the scope equivalent to the protection scope are included in the right scope of inventive concepts.

Claims (20)

What is claimed is:
1. A device comprising a two-dimensional (2D) material, comprising:
a substrate including a recess, the recess being recessed from a main surface of the substrate and extending in a first direction;
a 2D material pattern on the substrate, the 2D material pattern intersecting the recess of the substrate, the 2D material pattern extending in a second direction, the 2D material pattern including atomic layers that are parallel to a surface of the substrate;
a gate structure contacting the 2D material pattern, the gate structure extending in the first direction along the recess of the substrate;
a first electrode contacting a first end of the 2D material pattern; and
a second electrode contacting a second end of the 2D material pattern.
2. The device of claim 1, wherein the 2D material pattern includes a transition metal dichalcogenide.
3. The device of claim 1, wherein
the 2D material pattern includes a first portion, a second portion, and a third portion,
the first portion of the 2D material pattern is on a lower surface of the recess of the substrate,
the second portion of the 2D material pattern is on a side surface of the recess of the substrate, and
the third portion of the 2D material pattern is on the main surface of the substrate.
4. The device of claim 3, wherein
the atomic layers of the 2D material pattern, inside the first portion of the 2D material pattern, are substantially parallel to the lower surface of the recess of the substrate,
the atomic layers of the 2D material pattern, inside the second portion of the 2D material pattern, are substantially parallel to the side surface of the recess of the substrate, and
the atomic layers of the 2D material pattern, inside the third portion of the 2D material pattern, are substantially parallel to the main surface of the substrate.
5. The device of claim 3, wherein
the lower surface of the recess of the substrate is substantially orthogonal to the side surface of the recess of the substrate, and
the atomic layers of the 2D material pattern, inside the second portion of the 2D material pattern, are substantially vertical to the main surface of the substrate.
6. The device of claim 3, wherein the gate structure contacts the first portion of the 2D material pattern.
7. The device of claim 6, wherein the gate structure contacts the second portion of the 2D material pattern.
8. The device of claim 7, wherein the gate structure contacts the third portion of the 2D material pattern.
9. A device comprising a two-dimensional (2D) material, comprising:
a substrate including a recess, the recess being recessed from a main surface of the substrate and extending in a first direction;
a 2D material pattern on the substrate, the 2D material pattern extending in the first direction along the recess of the substrate, the 2D material pattern including a first portion and a second portion, the first portion being on a lower surface of the recess of the substrate, and the second portion on a side surface of the recess of the substrate;
a gate structure intersecting the 2D material pattern, the gate structure extending in a second direction;
a first electrode contacting a first end of the 2D material pattern; and
a second electrode contacting a second end of the 2D material pattern.
10. The device of claim 9, wherein
the 2D material pattern includes atomic layers,
the atomic layers of the 2D material pattern, inside the first portion of the 2D material pattern, are substantially parallel to the lower surface of the recess of the substrate, and
the atomic layers of the 2D material pattern, inside the second portion of the 2D material pattern, are substantially parallel to the side surface of the recess of the substrate.
11. The device of claim 9, wherein
the lower surface of the recess of the substrate is substantially orthogonal to the side surface of the recess of the substrate, and
the atomic layers of the 2D material pattern, inside the second portion of the 2D material pattern, are substantially vertical to the main surface of the substrate.
12. The device of claim 9, wherein the gate structure contacts the first portion of the 2D material pattern and the second portion of the 2D material pattern.
13. The device of claim 12, wherein the gate structure contacts the main surface of the substrate.
14. The device of claim 9, wherein the 2D material pattern includes a transition metal dichalcogenide.
15. A device comprising a two-dimensional (2D) material, comprising:
a substrate including a fin protruding from a main surface of the substrate, the fin extending in a first direction;
a 2D material pattern on the substrate, the 2D material pattern extending in the first direction along the fin, the 2D material pattern including a first portion and a second portion, the first portion being on an upper surface of the fin of the substrate, and the second portion being on a side surface of the fin of the substrate;
a gate structure on the substrate, the gate structure intersecting the 2D material pattern and extending in a second direction;
a first electrode contacting a first end of the 2D material pattern; and
a second electrode contacting a second end of the 2D material pattern.
16. The device of claim 15, wherein
the 2D material pattern further includes a third portion, and
the third portion is on the main surface of the substrate.
17. The device of claim 15, wherein
the 2D material pattern includes atomic layers,
the atomic layers of the 2D material pattern, inside the first portion of the 2D material pattern, are substantially parallel to the upper surface of the fin of the substrate, and
the atomic layers of the 2D material pattern, inside the second portion of the 2D material pattern, are substantially parallel to the side surface of the fin of the substrate.
18. The device of claim 15, wherein
the upper surface of the fin of the substrate is substantially orthogonal to the side surface of the fin of the substrate,
the 2D material pattern includes atomic layers,
the atomic layers of the 2D material pattern are, inside the second portion of the 2D material pattern, are substantially vertical to the main surface of the substrate.
19. The device of claim 15, wherein the gate structure contacts the first portion of the 2D material pattern and the second portion of the 2D material pattern.
20. The device of claim 15, wherein the 2D material pattern includes a transition metal dichalcogenide.
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