US20190013421A1 - Composition for forming solar cell electrode and electrode prepared using the same - Google Patents
Composition for forming solar cell electrode and electrode prepared using the same Download PDFInfo
- Publication number
- US20190013421A1 US20190013421A1 US15/950,625 US201815950625A US2019013421A1 US 20190013421 A1 US20190013421 A1 US 20190013421A1 US 201815950625 A US201815950625 A US 201815950625A US 2019013421 A1 US2019013421 A1 US 2019013421A1
- Authority
- US
- United States
- Prior art keywords
- mol
- composition
- glass frit
- solar cell
- tellurium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 68
- 239000011521 glass Substances 0.000 claims abstract description 51
- 239000000843 powder Substances 0.000 claims abstract description 27
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 25
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 24
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 24
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 21
- 239000011733 molybdenum Substances 0.000 claims abstract description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011572 manganese Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 4
- 239000013008 thixotropic agent Substances 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000012963 UV stabilizer Substances 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 3
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052792 caesium Inorganic materials 0.000 claims description 3
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 claims description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 229910052712 strontium Inorganic materials 0.000 claims description 3
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 31
- 230000000052 comparative effect Effects 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 16
- 239000002245 particle Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000012086 standard solution Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- DFGKGUXTPFWHIX-UHFFFAOYSA-N 6-[2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]acetyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)C1=CC2=C(NC(O2)=O)C=C1 DFGKGUXTPFWHIX-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000896 Ethulose Polymers 0.000 description 1
- 239000001859 Ethyl hydroxyethyl cellulose Substances 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229910009369 Zn Mg Inorganic materials 0.000 description 1
- FHKPLLOSJHHKNU-INIZCTEOSA-N [(3S)-3-[8-(1-ethyl-5-methylpyrazol-4-yl)-9-methylpurin-6-yl]oxypyrrolidin-1-yl]-(oxan-4-yl)methanone Chemical compound C(C)N1N=CC(=C1C)C=1N(C2=NC=NC(=C2N=1)O[C@@H]1CN(CC1)C(=O)C1CCOCC1)C FHKPLLOSJHHKNU-INIZCTEOSA-N 0.000 description 1
- -1 acrylate ester Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000019326 ethyl hydroxyethyl cellulose Nutrition 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010812 external standard method Methods 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940032007 methylethyl ketone Drugs 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002525 ultrasonication Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/06—Frit compositions, i.e. in a powdered or comminuted form containing halogen
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
- C03C8/12—Frit compositions, i.e. in a powdered or comminuted form containing lead containing titanium or zirconium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- Embodiments relate to a composition for solar cell electrodes and an electrode fabricated using the same.
- Solar cells generate electricity using the photovoltaic effect of a p-n junction which converts photons of sunlight into electricity.
- a solar cell front and rear electrodes are formed on upper and lower surfaces of a semiconductor wafer or substrate having a p-n junction, respectively. Then, the photovoltaic effect at the p-n junction is induced by sunlight entering the semiconductor wafer and electrons generated by the photovoltaic effect at the p-n junction provide electric current to the outside through the electrodes.
- the electrodes of the solar cell are formed on the wafer by applying, patterning, and baking an electrode composition.
- Embodiments are directed to a composition for solar cell electrodes, the composition including a conductive powder, a glass frit containing bismuth (Bi), tellurium (Te), and molybdenum (Mo), and an organic vehicle.
- the glass frit has a molar ratio of bismuth (Bi) to tellurium (Te) of about 1:7 to about 1:800 and contains about 0.1 mol % to about 40 mol % of molybdenum (Mo).
- a total amount of bismuth (Bi) and tellurium (Te) in the glass frit may range from about 25 mol % to about 75 mol %.
- a molar ratio of bismuth (Bi) to tellurium (Te) in the glass frit may be about 1:7.5 to about 1:70.
- the glass frit may contain about 1 mol % to about 10 mol % of molybdenum (Mo).
- the glass frit may contain about 25 mol % to about 70 mol % of the tellurium (Te), and about 1 mol % to about 40 mol % of the molybdenum (Mo).
- the glass frit may further contain at least one of lead (Pb), zinc (Zn), lithium (Li), sodium (Na), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), silicon (Si), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), copper (Cu), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), aluminum (Al), and boron (B).
- The may include about 60 wt % to about 95 wt % of the conductive powder, about 0.1 wt % to about 20 wt % of the glass frit, and about 1 wt % to about 30 wt % of the organic vehicle.
- the composition may include at least one additive selected from a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an anti-foaming agent, a pigment, a UV stabilizer, an antioxidant, and a coupling agent.
- a dispersant selected from a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an anti-foaming agent, a pigment, a UV stabilizer, an antioxidant, and a coupling agent.
- a solar cell electrode may be fabricated using the composition.
- the FIGURE illustrates a schematic view of a solar cell according to an embodiment.
- metal oxide refers to a single metal oxide or a plurality of metal oxides.
- ‘X to Y’ as used herein to represent a range of a certain value means ‘more than or equal to X and less than or equal to Y’.
- the content (mol %) of each elemental metal included in a glass frit may be measured by inductively coupled plasma-optical emission spectrometry (ICP-OES).
- ICP-OES may include pre-treating a sample, preparing a standard solution, and calculating the content of each elemental metal in the sample by measuring and converting the concentration of an analysis target.
- a predetermined amount of the sample may be dissolved in an acid solution and then heated for carbonization.
- the acid solution may include, for example, a sulfuric acid (H 2 SO 4 ) solution.
- the carbonized sample may be diluted with a solvent such as distilled water or hydrogen peroxide (H 2 O 2 ) to an appropriate extent that allows analysis of the analysis target.
- a solvent such as distilled water or hydrogen peroxide (H 2 O 2 )
- the carbonized sample may be diluted about 10,000 fold.
- the pre-treated sample may be calibrated using a standard solution, for example, an analysis target standard solution for measuring elements.
- calculation of the mole content of each element in the glass frit can be accomplished by introducing the standard solution into the ICP-OES tester and plotting a calibration curve using an external standard method, followed by measuring and converting the concentration (ppm) of each elemental metal in the pre-treated sample using the ICP-OES tester.
- a composition for solar cell electrodes includes a conductive powder, a glass frit containing bismuth (Bi), tellurium (Te), and molybdenum (Mo), and an organic vehicle, wherein the glass frit has a molar ratio of bismuth (Bi) to tellurium (Te) of about 1:7 to about 1:800 and contains about 0.1 mol % to about 40 mol % of molybdenum (Mo).
- the conductive powder may serve to impart electrical conductivity to the composition for solar cell electrodes.
- the composition for solar cell electrodes according to embodiments may include a metal powder such as silver (Ag) powder or aluminum (Al) powder as the conductive powder.
- the conductive powder may be silver powder.
- the conductive powder may have a nanometer or micrometer-scale particle size.
- the conductive powder may be silver powder having a particle diameter of dozens to several hundred nanometers or having a particle diameter of several to dozens of micrometers.
- the conductive powder may be a mixture of two or more types of silver powder having different particle sizes.
- the conductive powder may have a suitable particle shape such as a spherical, flake or amorphous particle shape.
- the conductive powder may have an average particle diameter (D50) of about 0.1 ⁇ m to about 10 ⁇ m, or, for example, about 0.5 ⁇ m to about 5 ⁇ m. Within this range of average particle diameter, the composition can reduce contact resistance and line resistance of a solar cell.
- the average particle diameter may be measured using, for example, a Model 1064D particle size analyzer (CILAS Co., Ltd.) after dispersing the conductive powder in isopropyl alcohol (IPA) at 25° C. for 3 minutes via ultrasonication.
- IPA isopropyl alcohol
- the conductive powder may be present in an amount of about 60 wt % to about 95 wt %, or, for example, about 70 wt % to about 90 wt % in the composition for solar cell electrodes. Within this range, the composition can improve conversion efficiency of a solar cell and can be easily prepared in paste form.
- the conductive powder may be present in an amount of about 60 wt %, 61 wt %, 62 wt %, 63 wt %, 64 wt %, 65 wt %, 66 wt %, 67 wt %, 68 wt %, 69 wt %, 70 wt %, 71 wt %, 72 wt %, 73 wt %, 74 wt %, 75 wt %, 76 wt %, 77 wt %, 78 wt %, 79 wt %, 80 wt %, 81 wt %, 82 wt %, 83 wt %, 84 wt %, 85 wt %, 86 wt %, 87 wt %, 88 wt %, 89 wt %, 90 wt %,
- the glass frit may serve to form silver crystal grains in an emitter region by etching an anti-reflection layer and melting the conductive powder during a baking process of the composition for solar cell electrodes.
- the glass frit may improve adhesion of the conductive powder to a wafer and may become softened to decrease the baking temperature during the baking process.
- the glass frit contains bismuth (Bi), tellurium (Te), and molybdenum (Mo), wherein a molar ratio of bismuth (Bi) to tellurium (Te) ranges from about 1:7 to about 1:800 and wherein molybdenum (Mo) is present in an amount of about 0.1 mol % to about 40 mol % in the glass frit.
- the composition for solar cell electrodes may be easily formed into an electrode.
- the composition have good moldability, while improving the aspect ratio of the electrode.
- the glass frit may have a molar ratio of bismuth (Bi) to tellurium (Te) of, for example, about 1:7.5 to about 1:70.
- the glass frit may improve an open-circuit voltage (Voc) without reduction in serial resistance (Rs).
- Molybdenum (Mo) may be present in an amount of, for example, about 1 mol % to about 10 mol % in the glass frit.
- a total amount of bismuth (Bi) and tellurium (Te) in the glass frit may range from about 25 mol % to about 75 mol %, or, for example, about 35 mol % to about 70 mol %, or, for example, about 56 mol % to about 66 mol %. Within these ranges, the glass frit may prevent spreading of an electrode during baking of the composition for solar cell electrodes, such that the electrode may have a high aspect ratio.
- a total amount of bismuth (Bi) and tellurium (Te) in the glass frit may be about 25 mol %, 26 mol %, 27 mol %, 28 mol %, 29 mol %, 30 mol %, 31 mol %, 32 mol %, 33 mol %, 34 mol %, 35 mol %, 36 mol %, 37 mol %, 38 mol %, 39 mol %, 40 mol %, 41 mol %, 42 mol %, 43 mol %, 44 mol %, 45 mol %, 46 mol %, 47 mol %, 48 mol %, 49 mol %, 50 mol %, 51 mol %, 52 mol %, 53 mol %, 54 mol %, 55 mol %, 56 mol %, 57 mol %, 58 mol %, 59 mol %, 60 mol %, 61 mol %,
- the glass frit may contain about 0.05 mol % to about 35 mol % of bismuth (Bi), about 25 mol % to about 70 mol % of tellurium (Te), and about 1 mol % to about 40 mol % of molybdenum (Mo). Within this range, the glass frit may improve the aspect ratio of an electrode while enhancing electrical properties of the electrode such as open-circuit voltage (Voc) and serial resistance (Rs).
- the glass frit may contain, for example, about 0.6 mol % to about 30 mol %, or, for example, about 1 mol % to about 10 mol % of bismuth (Bi) and about 45 mol % to about 70 mol %, or, for example, about 50 mol % to about 66 mol % of tellurium (Te).
- the glass frit may contain bismuth (Bi) in an amount of about 0.05 wt %, 0.1 wt %, 0.2 wt %, 0.3 wt %, 0.4 wt %, 0.5 wt %, 0.6 wt %, 0.7 wt %, 0.8 wt %, 0.9 wt %, 1 wt %, 2 wt %, 3 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, 10 wt %, 11 wt %, 12 wt %, 13 wt %, 14 wt %, 15 wt %, 16 wt %, 17 wt %, 18 wt %, 19 wt %, 20 wt %, 21 wt %, 22 wt %, 0.5
- the glass frit may contain tellurium (Te) in an amount of, for example, about 45 wt %, 46 wt %, 47 wt %, 48 wt %, 49 wt %, 50 wt %, 51 wt %, 52 wt %, 53 wt %, 54 wt %, 55 wt %, 56 wt %, 57 wt %, 58 wt %, 59 wt %, 60 wt %, 61 wt %, 62 wt %, 63 wt %, 64 wt %, 65 wt %, 66 wt %, 67 wt %, 68 wt %, 69 wt %, or 70 wt %.
- Te tellurium
- the glass frit may contain molybdenum (Mo) in an amount of, for example, about 0.1 wt %, 0.2 wt %, 0.3 wt %, 0.4 wt %, 0.5 wt %, 0.6 wt %, 0.7 wt %, 0.8 wt %, 0.9 wt %, 1 wt %, 2 wt %, 3 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, 10 wt %, 11 wt %, 12 wt %, 13 wt %, 14 wt %, 15 wt %, 16 wt %, 17 wt %, 18 wt %, 19 wt %, 20 wt %, 21 wt %, 22 wt %, 23 wt
- the glass frit may further include at least one of lead (Pb), zinc (Zn), lithium (Li), sodium (Na), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), silicon (Si), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), copper (Cu), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), aluminum (Al), and boron (B).
- the glass frit may further comprise at least one of lithium (Li), silicon (Si), zinc (Zn), and manganese (Mn).
- the glass frit may be prepared by a suitable method.
- the glass frit may be prepared by mixing the aforementioned components using a ball mill or a planetary mill, melting the mixture at about 900° C. to about 1300° C., and quenching the melted mixture to 25° C., followed by pulverizing the obtained product using a disk mill, a planetary mill or the like.
- the glass frit may be present in an amount of about 0.1 wt % to about 20 wt %, or, for example, about 0.5 wt % to about 10 wt % in the composition for solar cell electrodes. Within these ranges, the glass frit may secure stability of a p-n junction under various sheet resistances, minimize resistance, and ultimately improve the efficiency of a solar cell.
- the glass frit may be present in an amount of about 0.1 wt %, 0.5 wt %, 1 wt %, 1.5 wt %, 2 wt %, 2.5 wt %, 3 wt %, 3.5 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, 10 wt %, 11 wt %, 12 wt %, 13 wt %, 14 wt %, 15 wt %, 16 wt %, 17 wt %, 18 wt %, 19 wt %, or 20 wt % in the composition for solar cell electrodes.
- the organic vehicle may impart suitable viscosity and rheological characteristics for printing to the composition for solar cell electrodes through mechanical mixing with inorganic components of the composition.
- the organic vehicle may be a suitable organic vehicle used in a composition for solar cell electrodes.
- the organic vehicle may include a binder resin, a solvent, or the like.
- the binder resin may be selected from acrylate resins or cellulose resins.
- ethyl cellulose may be used as the binder resin.
- the binder resin may be selected from among ethyl hydroxyethyl cellulose, nitrocellulose, blends of ethyl cellulose and phenol resins, alkyd resins, phenol resins, acrylate ester resins, xylene resins, polybutane resins, polyester resins, urea resins, melamine resins, vinyl acetate resins, wood rosin, polymethacrylates of alcohols, or the like.
- the solvent may be selected from, for example, hexane, toluene, ethyl cellosolve, cyclohexanone, butyl cellosolve, butyl carbitol (diethylene glycol monobutyl ether), dibutyl carbitol (diethylene glycol dibutyl ether), butyl carbitol acetate (diethylene glycol monobutyl ether acetate), propylene glycol monomethyl ether, hexylene glycol, terpineol, methylethylketone, benzylalcohol, ⁇ -butyrolactone, or ethyl lactate. These may be used alone or as a mixture thereof.
- the organic vehicle may be present in an amount of about 1 wt % to about 30 wt % in the composition for solar cell electrodes. Within this range, the organic vehicle may provide sufficient adhesive strength and good printability to the composition. For example, the organic vehicle may be present in an amount of about 1 wt %, 2 wt %, 3 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, 10 wt %, 11 wt %, 12 wt %, 13 wt %, 14 wt %, 15 wt %, 16 wt %, 17 wt %, 18 wt %, 19 wt %, 20 wt %, 21 wt %, 22 wt %, 23 wt %, 24 wt %, 25 wt %, 26 wt %, 27 wt
- the composition for solar cell electrodes may further include a suitable additive to enhance fluidity, process properties and stability, as desired.
- the additive may include a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an anti-foaming agent, a pigment, a UV stabilizer, an antioxidant, a coupling agent, or the like. These may be used alone or as mixtures thereof.
- the additive may be present in an amount of about 0.1 wt % to about 5 wt % based on the total weight of the composition for solar cell electrodes, although the content of the additive may be varied, as desired.
- the additive may be present in an amount of about 0.1 wt %, 0.2 wt %, 0.3 wt %, 0.4 wt %, 0.5 wt %, 0.6 wt %, 0.7 wt %, 0.8 wt %, 0.9 wt %, 1 wt %, 1.5 wt %, 2 wt %, 2.5 wt %, 3 wt %, 3.5 wt %, 4 wt %, 4.5 wt %, or 5 wt % based on the total weight of the composition for solar cell electrodes.
- Embodiments further relate to an electrode formed of the composition for solar cell electrodes and a solar cell including the same.
- the FIGURE illustrates a solar cell in accordance with an embodiment.
- a solar cell 100 may include a substrate 10 , a front electrode 23 formed on a front surface of the substrate 10 , and a rear electrode 21 formed on a back surface of the substrate 10 .
- the substrate 10 may be a substrate with a p-n junction formed thereon.
- the substrate 10 may include a semiconductor substrate 11 and an emitter 12 .
- the substrate 10 may be a substrate prepared by doping one surface of a p-type semiconductor substrate 11 with an n-type dopant to form an n-type emitter 12 .
- the substrate 10 may be a substrate prepared by doping one surface of an n-type semiconductor substrate 11 with a p-type dopant to form a p-type emitter 12 .
- the semiconductor substrate 11 may be either a p-type substrate or an n-type substrate.
- the p-type substrate may be a semiconductor substrate 11 doped with a p-type dopant
- the n-type substrate may be a semiconductor substrate 11 doped with an n-type dopant.
- a surface of such a substrate through which light enters the substrate is referred to as a “front surface” (light receiving surface).
- a surface of the substrate opposite the front surface is referred to as a “back surface”.
- the semiconductor substrate 11 may be formed of crystalline silicon or a compound semiconductor.
- the crystalline silicon may be monocrystalline or polycrystalline.
- a silicon wafer may be used as an example of the crystalline silicon.
- the p-type dopant may be a material that includes a group III element such as boron, aluminum, or gallium.
- the n-type dopant may be a material that includes a group V element, such as phosphorus, arsenic or antimony.
- the front electrode 23 and/or the rear electrode 21 may be fabricated using the composition for solar cell electrodes according to embodiments.
- the front electrode 23 may be fabricated using the composition including silver powder as the conductive powder
- the rear electrode 21 may be fabricated using the composition including aluminum powder as the conductive powder.
- the front electrode 23 may be formed by printing the composition for solar cell electrodes onto the emitter 12 , followed by baking
- the rear electrode 21 may be formed by applying the composition for solar cell electrodes to the back surface of the semiconductor substrate 11 , followed by baking.
- ethylcellulose As an organic binder, 3.0 wt % of ethylcellulose (STD4, Dow Chemical Company) was sufficiently dissolved in 6.5 wt % of butyl carbitol at 60° C., and then 86.9 wt % of spherical silver powder (AG-4-8, Dowa Hightech Co., Ltd.) having an average particle diameter of 2.0 ⁇ m, 3.1 wt % of a glass frit having an average particle diameter of 1.0 ⁇ m and containing elemental metals in amounts as listed in Table 1, 0.2 wt % of a dispersant BYK102 (BYK-chemie), and 0.3 wt % of a thixotropic agent Thixatrol ST (Elementis Co., Ltd.) were added to the binder solution, followed by mixing and kneading in a 3-roll kneader, thereby preparing a composition for solar cell electrodes.
- SPD4 spherical
- a composition for solar cell electrodes was prepared in the same manner as in Example 1 except that glass frits described in Table 1 were used.
- Example 2 0.05 62.95 4 16 3 10 4 — — 100 1:1259 Comp.
- Example 3 5 67.95 0.05 10 3 10 4 — — 100 1:13.6 Comp.
- Example 4 0.5 27.5 45 10 3 10 4 — — 100 1:55 Comp.
- Example 5 3 56 — 20 3 10 4 4 — 100 1:18.7 Comp.
- Example 6 3 56 — 20 3 10 4 — 4 100 1:18.7 Comp.
- Each composition for solar cell electrodes prepared in Examples and Comparative Examples was deposited onto a front surface of a wafer by screen printing in a predetermined pattern, followed by drying in an IR drying furnace.
- a cell formed according to this procedure was subjected to baking at 600° C. to 900° C. for 60 to 210 seconds in a belt-type baking furnace, and then evaluated as to contact resistance (Rc), serial resistance (Rs), and open-circuit voltage (Voc) using a TLM (Transfer Length Method) tester. Results are shown in Table 2.
- Each composition for solar cell electrodes prepared in Examples and Comparative Examples was deposited onto a front surface of a wafer by screen printing in a predetermined pattern, followed by drying in an IR drying furnace. Then, an aluminum paste was printed onto a back surface of the wafer and dried in the same manner as above.
- a cell formed according to this procedure was subjected to baking at 400° C. to 900° C. for 30 to 180 seconds in a belt-type baking furnace, and then evaluated as to fill factor (FF, %) and conversion efficiency (Eff. %) using a solar cell efficiency tester CT-801 (Pasan Co., Ltd.). Results are shown in Table 2.
- a printing mask (Sanli Precision Ind.) having an opening rate of 82% and an electrode pattern linewidth of 26 ⁇ m was placed on a semiconductor substrate, and then each composition for solar cell electrodes prepared in Examples and Comparative Examples was placed on the printing mask, followed by drying in an IR drying furnace subsequent to printing the composition onto the semiconductor substrate through squeezing. Then, an aluminum paste was printed onto a back surface of the semiconductor substrate and dried in the same manner as above.
- a cell formed according to this procedure was subjected to baking at 950° C. for 45 seconds in a belt-type baking furnace, thereby obtaining a solar cell.
- the solar cell electrodes of Comparative Examples 1 and 2 in which the molar ratio of bismuth to tellurium was outside the range set forth herein, exhibited high contact resistance and serial resistance and low open-circuit voltage.
- the solar cell electrodes of Comparative Examples 3 to 4 in which the content of molybdenum was outside the range set forth herein, had a low aspect ratio while exhibiting considerably high contact resistance or poor fill factor and conversion efficiency.
- a conductive paste composition including a conductive powder, a glass frit, and an organic vehicle is used as an electrode composition.
- the glass frit serves to melt an anti-reflection film on a semiconductor wafer, thereby establishing electrical contact between the conductive powder and the wafer.
- the glass frit affects not only electrical characteristics of a solar cell, such as open-circuit voltage (Voc) and serial resistance (Rs) of an electrode formed of the electrode composition, but also an aspect ratio of the electrode upon which conversion efficiency and fill factor of the solar cell depend.
- electrical characteristics of a solar cell such as open-circuit voltage (Voc) and serial resistance (Rs) of an electrode formed of the electrode composition, but also an aspect ratio of the electrode upon which conversion efficiency and fill factor of the solar cell depend.
- composition for solar cell electrodes which can improve an aspect ratio of an electrode formed thereof as well as electrical characteristics of the electrode, such as open-circuit voltage (Voc) and serial resistance (Rs) is desirable.
- Embodiments provide a composition for solar cell electrodes that can improve an aspect ratio of an electrode formed thereof as well as electrical characteristics of the electrode, such as open-circuit voltage (Voc) and serial resistance (Rs), and an electrode fabricated using the same. Conversion efficiency and fill factor of a solar cell may be thereby improved.
- An electrode may be fabricated using the composition.
Abstract
Description
- Korean Patent Application No. 10-2017-0086149, filed on Jul. 6, 2017, in the Korean Intellectual Property Office, and entitled: “Composition for Forming Solar Cell Electrode and Electrode Prepared Using the Same,” is incorporated by reference herein in its entirety.
- Embodiments relate to a composition for solar cell electrodes and an electrode fabricated using the same.
- Solar cells generate electricity using the photovoltaic effect of a p-n junction which converts photons of sunlight into electricity. In a solar cell, front and rear electrodes are formed on upper and lower surfaces of a semiconductor wafer or substrate having a p-n junction, respectively. Then, the photovoltaic effect at the p-n junction is induced by sunlight entering the semiconductor wafer and electrons generated by the photovoltaic effect at the p-n junction provide electric current to the outside through the electrodes. The electrodes of the solar cell are formed on the wafer by applying, patterning, and baking an electrode composition.
- Embodiments are directed to a composition for solar cell electrodes, the composition including a conductive powder, a glass frit containing bismuth (Bi), tellurium (Te), and molybdenum (Mo), and an organic vehicle. The glass frit has a molar ratio of bismuth (Bi) to tellurium (Te) of about 1:7 to about 1:800 and contains about 0.1 mol % to about 40 mol % of molybdenum (Mo).
- A total amount of bismuth (Bi) and tellurium (Te) in the glass frit may range from about 25 mol % to about 75 mol %.
- A molar ratio of bismuth (Bi) to tellurium (Te) in the glass frit may be about 1:7.5 to about 1:70.
- The glass frit may contain about 1 mol % to about 10 mol % of molybdenum (Mo).
- The glass frit may contain about 25 mol % to about 70 mol % of the tellurium (Te), and about 1 mol % to about 40 mol % of the molybdenum (Mo).
- The glass frit may further contain at least one of lead (Pb), zinc (Zn), lithium (Li), sodium (Na), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), silicon (Si), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), copper (Cu), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), aluminum (Al), and boron (B).
- The may include about 60 wt % to about 95 wt % of the conductive powder, about 0.1 wt % to about 20 wt % of the glass frit, and about 1 wt % to about 30 wt % of the organic vehicle.
- The composition may include at least one additive selected from a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an anti-foaming agent, a pigment, a UV stabilizer, an antioxidant, and a coupling agent.
- A solar cell electrode may be fabricated using the composition.
- Features will become apparent to those of skill in the art by describing in detail exemplary embodiments with reference to the attached drawing in which:
- The FIGURE illustrates a schematic view of a solar cell according to an embodiment.
- Example embodiments will now be described more fully hereinafter with reference to the accompanying drawing; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey exemplary implementations to those skilled in the art.
- In the drawing FIGURE, the dimensions of layers and regions may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout.
- In construing elements of embodiments, it is regarded to include an error range even though there is no distinctive description.
- As used herein, the term “metal oxide” refers to a single metal oxide or a plurality of metal oxides.
- Further, ‘X to Y’, as used herein to represent a range of a certain value means ‘more than or equal to X and less than or equal to Y’.
- Herein, the content (mol %) of each elemental metal included in a glass frit may be measured by inductively coupled plasma-optical emission spectrometry (ICP-OES). For example, ICP-OES may include pre-treating a sample, preparing a standard solution, and calculating the content of each elemental metal in the sample by measuring and converting the concentration of an analysis target. In operation of pre-treating a sample, a predetermined amount of the sample may be dissolved in an acid solution and then heated for carbonization. The acid solution may include, for example, a sulfuric acid (H2SO4) solution. The carbonized sample may be diluted with a solvent such as distilled water or hydrogen peroxide (H2O2) to an appropriate extent that allows analysis of the analysis target. In view of element detection capability of an ICP-OES tester, the carbonized sample may be diluted about 10,000 fold. In measurement with the ICP-OES tester, the pre-treated sample may be calibrated using a standard solution, for example, an analysis target standard solution for measuring elements. By way of example, calculation of the mole content of each element in the glass frit can be accomplished by introducing the standard solution into the ICP-OES tester and plotting a calibration curve using an external standard method, followed by measuring and converting the concentration (ppm) of each elemental metal in the pre-treated sample using the ICP-OES tester.
- Composition for Solar Cell Electrodes
- A composition for solar cell electrodes includes a conductive powder, a glass frit containing bismuth (Bi), tellurium (Te), and molybdenum (Mo), and an organic vehicle, wherein the glass frit has a molar ratio of bismuth (Bi) to tellurium (Te) of about 1:7 to about 1:800 and contains about 0.1 mol % to about 40 mol % of molybdenum (Mo).
- Now, each component of the composition for solar cell electrodes according embodiments will be described in more detail.
- Conductive Powder
- The conductive powder may serve to impart electrical conductivity to the composition for solar cell electrodes. The composition for solar cell electrodes according to embodiments may include a metal powder such as silver (Ag) powder or aluminum (Al) powder as the conductive powder. For example, the conductive powder may be silver powder. The conductive powder may have a nanometer or micrometer-scale particle size. For example, the conductive powder may be silver powder having a particle diameter of dozens to several hundred nanometers or having a particle diameter of several to dozens of micrometers. In some implementations, the conductive powder may be a mixture of two or more types of silver powder having different particle sizes.
- The conductive powder may have a suitable particle shape such as a spherical, flake or amorphous particle shape.
- The conductive powder may have an average particle diameter (D50) of about 0.1 μm to about 10 μm, or, for example, about 0.5 μm to about 5 μm. Within this range of average particle diameter, the composition can reduce contact resistance and line resistance of a solar cell. The average particle diameter may be measured using, for example, a Model 1064D particle size analyzer (CILAS Co., Ltd.) after dispersing the conductive powder in isopropyl alcohol (IPA) at 25° C. for 3 minutes via ultrasonication.
- The conductive powder may be present in an amount of about 60 wt % to about 95 wt %, or, for example, about 70 wt % to about 90 wt % in the composition for solar cell electrodes. Within this range, the composition can improve conversion efficiency of a solar cell and can be easily prepared in paste form. For example, the conductive powder may be present in an amount of about 60 wt %, 61 wt %, 62 wt %, 63 wt %, 64 wt %, 65 wt %, 66 wt %, 67 wt %, 68 wt %, 69 wt %, 70 wt %, 71 wt %, 72 wt %, 73 wt %, 74 wt %, 75 wt %, 76 wt %, 77 wt %, 78 wt %, 79 wt %, 80 wt %, 81 wt %, 82 wt %, 83 wt %, 84 wt %, 85 wt %, 86 wt %, 87 wt %, 88 wt %, 89 wt %, 90 wt %, 91 wt %, 92 wt %, 93 wt %, 94 wt %, or 95 wt % in the composition for solar cell electrodes.
- Glass Frit
- The glass frit may serve to form silver crystal grains in an emitter region by etching an anti-reflection layer and melting the conductive powder during a baking process of the composition for solar cell electrodes. The glass frit may improve adhesion of the conductive powder to a wafer and may become softened to decrease the baking temperature during the baking process.
- The glass frit contains bismuth (Bi), tellurium (Te), and molybdenum (Mo), wherein a molar ratio of bismuth (Bi) to tellurium (Te) ranges from about 1:7 to about 1:800 and wherein molybdenum (Mo) is present in an amount of about 0.1 mol % to about 40 mol % in the glass frit.
- When the molar ratio of bismuth (Bi) to tellurium (Te) ranges from about 1:7 to about 1:800, the composition for solar cell electrodes may be easily formed into an electrode. For example, the composition have good moldability, while improving the aspect ratio of the electrode. The glass frit may have a molar ratio of bismuth (Bi) to tellurium (Te) of, for example, about 1:7.5 to about 1:70.
- When molybdenum (Mo) is present in an amount of about 0.1 mol % to about 40 mol % in the glass frit, the glass frit may improve an open-circuit voltage (Voc) without reduction in serial resistance (Rs). Molybdenum (Mo) may be present in an amount of, for example, about 1 mol % to about 10 mol % in the glass frit.
- In addition, a total amount of bismuth (Bi) and tellurium (Te) in the glass frit may range from about 25 mol % to about 75 mol %, or, for example, about 35 mol % to about 70 mol %, or, for example, about 56 mol % to about 66 mol %. Within these ranges, the glass frit may prevent spreading of an electrode during baking of the composition for solar cell electrodes, such that the electrode may have a high aspect ratio. For example, a total amount of bismuth (Bi) and tellurium (Te) in the glass frit may be about 25 mol %, 26 mol %, 27 mol %, 28 mol %, 29 mol %, 30 mol %, 31 mol %, 32 mol %, 33 mol %, 34 mol %, 35 mol %, 36 mol %, 37 mol %, 38 mol %, 39 mol %, 40 mol %, 41 mol %, 42 mol %, 43 mol %, 44 mol %, 45 mol %, 46 mol %, 47 mol %, 48 mol %, 49 mol %, 50 mol %, 51 mol %, 52 mol %, 53 mol %, 54 mol %, 55 mol %, 56 mol %, 57 mol %, 58 mol %, 59 mol %, 60 mol %, 61 mol %, 62 mol %, 63 mol %, 64 mol %, 65 mol %, 66 mol %, 67 mol %, 68 mol %, 69 mol %, 70 mol %, 71 mol %, 72 mol %, 73 mol %, 74 mol %, or 75 mol %.
- The glass frit may contain about 0.05 mol % to about 35 mol % of bismuth (Bi), about 25 mol % to about 70 mol % of tellurium (Te), and about 1 mol % to about 40 mol % of molybdenum (Mo). Within this range, the glass frit may improve the aspect ratio of an electrode while enhancing electrical properties of the electrode such as open-circuit voltage (Voc) and serial resistance (Rs). The glass frit may contain, for example, about 0.6 mol % to about 30 mol %, or, for example, about 1 mol % to about 10 mol % of bismuth (Bi) and about 45 mol % to about 70 mol %, or, for example, about 50 mol % to about 66 mol % of tellurium (Te).
- For example, the glass frit may contain bismuth (Bi) in an amount of about 0.05 wt %, 0.1 wt %, 0.2 wt %, 0.3 wt %, 0.4 wt %, 0.5 wt %, 0.6 wt %, 0.7 wt %, 0.8 wt %, 0.9 wt %, 1 wt %, 2 wt %, 3 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, 10 wt %, 11 wt %, 12 wt %, 13 wt %, 14 wt %, 15 wt %, 16 wt %, 17 wt %, 18 wt %, 19 wt %, 20 wt %, 21 wt %, 22 wt %, 23 wt %, 24 wt %, 25 wt %, 26 wt %, 27 wt %, 28 wt %, 29 wt %, 30 wt %, 31 wt %, 32 wt %, 33 wt %, 34 wt % or 35 wt %.
- The glass frit may contain tellurium (Te) in an amount of, for example, about 45 wt %, 46 wt %, 47 wt %, 48 wt %, 49 wt %, 50 wt %, 51 wt %, 52 wt %, 53 wt %, 54 wt %, 55 wt %, 56 wt %, 57 wt %, 58 wt %, 59 wt %, 60 wt %, 61 wt %, 62 wt %, 63 wt %, 64 wt %, 65 wt %, 66 wt %, 67 wt %, 68 wt %, 69 wt %, or 70 wt %.
- The glass frit may contain molybdenum (Mo) in an amount of, for example, about 0.1 wt %, 0.2 wt %, 0.3 wt %, 0.4 wt %, 0.5 wt %, 0.6 wt %, 0.7 wt %, 0.8 wt %, 0.9 wt %, 1 wt %, 2 wt %, 3 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, 10 wt %, 11 wt %, 12 wt %, 13 wt %, 14 wt %, 15 wt %, 16 wt %, 17 wt %, 18 wt %, 19 wt %, 20 wt %, 21 wt %, 22 wt %, 23 wt %, 24 wt %, 25 wt %, 26 wt %, 27 wt %, 28 wt %, 29 wt %, 30 wt %, 31 wt %, 32 wt %, 33 wt %, 34 wt %, 35 wt %, 36 wt %, 37 wt %, 38 wt %, 39 wt %, or 40 wt %.
- The glass frit may further include at least one of lead (Pb), zinc (Zn), lithium (Li), sodium (Na), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), silicon (Si), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), copper (Cu), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), aluminum (Al), and boron (B).
- For example, the glass frit may further comprise at least one of lithium (Li), silicon (Si), zinc (Zn), and manganese (Mn).
- The glass frit may be prepared by a suitable method. For example, the glass frit may be prepared by mixing the aforementioned components using a ball mill or a planetary mill, melting the mixture at about 900° C. to about 1300° C., and quenching the melted mixture to 25° C., followed by pulverizing the obtained product using a disk mill, a planetary mill or the like.
- The glass frit may be present in an amount of about 0.1 wt % to about 20 wt %, or, for example, about 0.5 wt % to about 10 wt % in the composition for solar cell electrodes. Within these ranges, the glass frit may secure stability of a p-n junction under various sheet resistances, minimize resistance, and ultimately improve the efficiency of a solar cell. For example, the glass frit may be present in an amount of about 0.1 wt %, 0.5 wt %, 1 wt %, 1.5 wt %, 2 wt %, 2.5 wt %, 3 wt %, 3.5 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, 10 wt %, 11 wt %, 12 wt %, 13 wt %, 14 wt %, 15 wt %, 16 wt %, 17 wt %, 18 wt %, 19 wt %, or 20 wt % in the composition for solar cell electrodes.
- Organic Vehicle
- The organic vehicle may impart suitable viscosity and rheological characteristics for printing to the composition for solar cell electrodes through mechanical mixing with inorganic components of the composition.
- The organic vehicle may be a suitable organic vehicle used in a composition for solar cell electrodes. The organic vehicle may include a binder resin, a solvent, or the like.
- The binder resin may be selected from acrylate resins or cellulose resins. For example, ethyl cellulose may be used as the binder resin. In some implementations, the binder resin may be selected from among ethyl hydroxyethyl cellulose, nitrocellulose, blends of ethyl cellulose and phenol resins, alkyd resins, phenol resins, acrylate ester resins, xylene resins, polybutane resins, polyester resins, urea resins, melamine resins, vinyl acetate resins, wood rosin, polymethacrylates of alcohols, or the like.
- The solvent may be selected from, for example, hexane, toluene, ethyl cellosolve, cyclohexanone, butyl cellosolve, butyl carbitol (diethylene glycol monobutyl ether), dibutyl carbitol (diethylene glycol dibutyl ether), butyl carbitol acetate (diethylene glycol monobutyl ether acetate), propylene glycol monomethyl ether, hexylene glycol, terpineol, methylethylketone, benzylalcohol, γ-butyrolactone, or ethyl lactate. These may be used alone or as a mixture thereof.
- The organic vehicle may be present in an amount of about 1 wt % to about 30 wt % in the composition for solar cell electrodes. Within this range, the organic vehicle may provide sufficient adhesive strength and good printability to the composition. For example, the organic vehicle may be present in an amount of about 1 wt %, 2 wt %, 3 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, 10 wt %, 11 wt %, 12 wt %, 13 wt %, 14 wt %, 15 wt %, 16 wt %, 17 wt %, 18 wt %, 19 wt %, 20 wt %, 21 wt %, 22 wt %, 23 wt %, 24 wt %, 25 wt %, 26 wt %, 27 wt %, 28 wt %, 29 wt %, or 30 wt % in the composition for solar cell electrodes.
- Additives
- The composition for solar cell electrodes according to embodiments may further include a suitable additive to enhance fluidity, process properties and stability, as desired. The additive may include a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an anti-foaming agent, a pigment, a UV stabilizer, an antioxidant, a coupling agent, or the like. These may be used alone or as mixtures thereof. The additive may be present in an amount of about 0.1 wt % to about 5 wt % based on the total weight of the composition for solar cell electrodes, although the content of the additive may be varied, as desired. For example, the additive may be present in an amount of about 0.1 wt %, 0.2 wt %, 0.3 wt %, 0.4 wt %, 0.5 wt %, 0.6 wt %, 0.7 wt %, 0.8 wt %, 0.9 wt %, 1 wt %, 1.5 wt %, 2 wt %, 2.5 wt %, 3 wt %, 3.5 wt %, 4 wt %, 4.5 wt %, or 5 wt % based on the total weight of the composition for solar cell electrodes.
- Solar Cell Electrode and Solar Cell Including the Same
- Embodiments further relate to an electrode formed of the composition for solar cell electrodes and a solar cell including the same. The FIGURE illustrates a solar cell in accordance with an embodiment.
- Referring to the FIGURE, a
solar cell 100 may include asubstrate 10, afront electrode 23 formed on a front surface of thesubstrate 10, and arear electrode 21 formed on a back surface of thesubstrate 10. - The
substrate 10 may be a substrate with a p-n junction formed thereon. For example, thesubstrate 10 may include asemiconductor substrate 11 and anemitter 12. Thesubstrate 10 may be a substrate prepared by doping one surface of a p-type semiconductor substrate 11 with an n-type dopant to form an n-type emitter 12. In some implementations, thesubstrate 10 may be a substrate prepared by doping one surface of an n-type semiconductor substrate 11 with a p-type dopant to form a p-type emitter 12. Thesemiconductor substrate 11 may be either a p-type substrate or an n-type substrate. The p-type substrate may be asemiconductor substrate 11 doped with a p-type dopant, and the n-type substrate may be asemiconductor substrate 11 doped with an n-type dopant. - In description of the
substrate 10, thesemiconductor substrate 11, or the like, a surface of such a substrate through which light enters the substrate is referred to as a “front surface” (light receiving surface). In addition, a surface of the substrate opposite the front surface is referred to as a “back surface”. - In an embodiment, the
semiconductor substrate 11 may be formed of crystalline silicon or a compound semiconductor. Here, the crystalline silicon may be monocrystalline or polycrystalline. As an example of the crystalline silicon, a silicon wafer may be used. - The p-type dopant may be a material that includes a group III element such as boron, aluminum, or gallium. The n-type dopant may be a material that includes a group V element, such as phosphorus, arsenic or antimony.
- The
front electrode 23 and/or therear electrode 21 may be fabricated using the composition for solar cell electrodes according to embodiments. For example, thefront electrode 23 may be fabricated using the composition including silver powder as the conductive powder, and therear electrode 21 may be fabricated using the composition including aluminum powder as the conductive powder. Thefront electrode 23 may be formed by printing the composition for solar cell electrodes onto theemitter 12, followed by baking, and therear electrode 21 may be formed by applying the composition for solar cell electrodes to the back surface of thesemiconductor substrate 11, followed by baking. - Next, embodiments will be described in more detail with reference to examples. The following Examples and Comparative Examples are provided in order to highlight characteristics of one or more embodiments, but it will be understood that the Examples and Comparative Examples are not to be construed as limiting the scope of the embodiments, nor are the Comparative Examples to be construed as being outside the scope of the embodiments. Further, it will be understood that the embodiments are not limited to the particular details described in the Examples and Comparative Examples.
- As an organic binder, 3.0 wt % of ethylcellulose (STD4, Dow Chemical Company) was sufficiently dissolved in 6.5 wt % of butyl carbitol at 60° C., and then 86.9 wt % of spherical silver powder (AG-4-8, Dowa Hightech Co., Ltd.) having an average particle diameter of 2.0 μm, 3.1 wt % of a glass frit having an average particle diameter of 1.0 μm and containing elemental metals in amounts as listed in Table 1, 0.2 wt % of a dispersant BYK102 (BYK-chemie), and 0.3 wt % of a thixotropic agent Thixatrol ST (Elementis Co., Ltd.) were added to the binder solution, followed by mixing and kneading in a 3-roll kneader, thereby preparing a composition for solar cell electrodes.
- A composition for solar cell electrodes was prepared in the same manner as in Example 1 except that glass frits described in Table 1 were used.
-
TABLE 1 Molar ratio Bi Te Mo Li Si Zn Mg Cr Al Total Bi:Te Example 1 3 56 4 20 3 10 4 — — 100 1:18.7 Example 2 8 56 4 15 3 10 4 — — 100 1:7 Example 3 0.8 56 4 22.2 3 10 4 — — 100 1:70 Example 4 0.07 56 4 22.93 3 10 4 — — 100 1:800 Example 5 3 65 1 14 3 10 4 — — 100 1:21.7 Example 6 3 58 8 14 3 10 4 — — 100 1:19.3 Example 7 3 26 40 14 3 10 4 — — 100 1:8.7 Comp. Example 1 10 53 4 16 3 10 4 — — 100 1:5.3 Comp. Example 2 0.05 62.95 4 16 3 10 4 — — 100 1:1259 Comp. Example 3 5 67.95 0.05 10 3 10 4 — — 100 1:13.6 Comp. Example 4 0.5 27.5 45 10 3 10 4 — — 100 1:55 Comp. Example 5 3 56 — 20 3 10 4 4 — 100 1:18.7 Comp. Example 6 3 56 — 20 3 10 4 — 4 100 1:18.7 Comp. Example 7 12 68.5 0.5 7 3 5 4 — — 100 1:5.7 (unit: mol %) - Property Evaluation
- (1) Contact Resistance (Rc, Unit: mΩ), Serial Resistance (Rs, Unit: mΩ), Open-Circuit Voltage (Voc, Unit: mV):
- Each composition for solar cell electrodes prepared in Examples and Comparative Examples was deposited onto a front surface of a wafer by screen printing in a predetermined pattern, followed by drying in an IR drying furnace. A cell formed according to this procedure was subjected to baking at 600° C. to 900° C. for 60 to 210 seconds in a belt-type baking furnace, and then evaluated as to contact resistance (Rc), serial resistance (Rs), and open-circuit voltage (Voc) using a TLM (Transfer Length Method) tester. Results are shown in Table 2.
- (2) Fill Factor (%) and Efficiency (%):
- Each composition for solar cell electrodes prepared in Examples and Comparative Examples was deposited onto a front surface of a wafer by screen printing in a predetermined pattern, followed by drying in an IR drying furnace. Then, an aluminum paste was printed onto a back surface of the wafer and dried in the same manner as above. A cell formed according to this procedure was subjected to baking at 400° C. to 900° C. for 30 to 180 seconds in a belt-type baking furnace, and then evaluated as to fill factor (FF, %) and conversion efficiency (Eff. %) using a solar cell efficiency tester CT-801 (Pasan Co., Ltd.). Results are shown in Table 2.
- (3) Linewidth (μm), Thickness (μm), Aspect Ratio:
- A printing mask (Sanli Precision Ind.) having an opening rate of 82% and an electrode pattern linewidth of 26 μm was placed on a semiconductor substrate, and then each composition for solar cell electrodes prepared in Examples and Comparative Examples was placed on the printing mask, followed by drying in an IR drying furnace subsequent to printing the composition onto the semiconductor substrate through squeezing. Then, an aluminum paste was printed onto a back surface of the semiconductor substrate and dried in the same manner as above. A cell formed according to this procedure was subjected to baking at 950° C. for 45 seconds in a belt-type baking furnace, thereby obtaining a solar cell.
- The linewidth, thickness, and aspect ratio of the electrodes of the obtained solar cells were measured using a three-dimensional measuring instrument (VK Analyzer, KEYENCE Corporation). Results are shown in Table 2.
-
TABLE 2 Contact Serial resistance resistance Open-circuit Eff. Linewidth Thickness Aspect (mΩ) (mΩ) voltage (mV) FF (%) (%) (μm) (μm) ratio Example 1 0.225 2.59 642.47 79.18 18.24 51.458 17.561 0.341 Example 2 0.247 2.62 643.14 78.99 18.20 57.694 16.852 0.292 Example 3 0.271 2.80 642.76 78.94 18.22 48.023 17.358 0.361 Example 4 0.308 2.96 642.55 78.92 18.17 47.578 17.021 0.358 Example 5 0.310 2.96 640.22 78.92 18.16 59.368 16.911 0.285 Example 6 0.299 2.85 642.75 78.93 18.20 56.487 16.898 0.299 Example 7 0.318 3.04 639.77 78.92 18.14 52.658 16.687 0.317 Comparative 0.325 3.05 639.66 78.88 18.10 61.587 16.325 0.265 Example 1 Comparative 0.340 3.09 639.39 78.86 18.09 60.878 16.854 0.277 Example 2 Comparative 0.339 3.08 639.47 78.88 18.10 64.221 16.321 0.254 Example 3 Comparative 0.431 3.50 633.36 78.11 17.85 62.328 16.574 0.266 Example 4 Comparative 0.432 3.55 633.11 77.82 17.83 50.214 17.436 0.347 Example 5 Comparative 0.552 3.68 631.67 77.78 17.80 51.087 17.532 0.343 Example 6 Comparative 0.398 3.41 635.88 78.31 17.90 71.587 15.932 0.223 Example 7 - As shown in Table 2, it can be seen that the solar cell electrode fabricated using a composition for solar cell electrodes according to embodiments in which the molar ratio of bismuth to tellurium and the content (mol %) of molybdenum fell within the ranges set forth herein exhibited improved open-circuit voltage without an increase in resistance while having a high aspect ratio.
- Conversely, the solar cell electrodes of Comparative Examples 1 and 2, in which the molar ratio of bismuth to tellurium was outside the range set forth herein, exhibited high contact resistance and serial resistance and low open-circuit voltage. The solar cell electrodes of Comparative Examples 3 to 4, in which the content of molybdenum was outside the range set forth herein, had a low aspect ratio while exhibiting considerably high contact resistance or poor fill factor and conversion efficiency. The solar cell electrodes of Comparative Examples 5 to 6, which were free from molybdenum, exhibited high contact resistance and serial resistance.
- By way of summation and review, as an electrode composition, a conductive paste composition including a conductive powder, a glass frit, and an organic vehicle is used. The glass frit serves to melt an anti-reflection film on a semiconductor wafer, thereby establishing electrical contact between the conductive powder and the wafer.
- Particularly, the glass frit affects not only electrical characteristics of a solar cell, such as open-circuit voltage (Voc) and serial resistance (Rs) of an electrode formed of the electrode composition, but also an aspect ratio of the electrode upon which conversion efficiency and fill factor of the solar cell depend.
- Therefore, a composition for solar cell electrodes which can improve an aspect ratio of an electrode formed thereof as well as electrical characteristics of the electrode, such as open-circuit voltage (Voc) and serial resistance (Rs) is desirable.
- Embodiments provide a composition for solar cell electrodes that can improve an aspect ratio of an electrode formed thereof as well as electrical characteristics of the electrode, such as open-circuit voltage (Voc) and serial resistance (Rs), and an electrode fabricated using the same. Conversion efficiency and fill factor of a solar cell may be thereby improved. An electrode may be fabricated using the composition.
- Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated. Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope thereof as set forth in the following claims.
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170086149A KR20190005464A (en) | 2017-07-06 | 2017-07-06 | Composition for forming solar cell electrode and electrode prepared using the same |
KR10-2017-0086149 | 2017-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20190013421A1 true US20190013421A1 (en) | 2019-01-10 |
Family
ID=64903369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/950,625 Abandoned US20190013421A1 (en) | 2017-07-06 | 2018-04-11 | Composition for forming solar cell electrode and electrode prepared using the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US20190013421A1 (en) |
KR (1) | KR20190005464A (en) |
CN (1) | CN109215834A (en) |
TW (1) | TWI731236B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7385169B2 (en) * | 2019-06-26 | 2023-11-22 | 日本電気硝子株式会社 | Glass compositions and sealing materials |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110095240A1 (en) * | 2009-10-28 | 2011-04-28 | Masami Nakamura | Conductive paste for forming a solar cell electrode |
US20140008587A1 (en) * | 2011-04-21 | 2014-01-09 | Hiroshi Yoshida | Conductive paste |
EP2899761A1 (en) * | 2012-09-18 | 2015-07-29 | Murata Manufacturing Co., Ltd. | Conductive paste and solar cell |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009247220A (en) * | 2008-04-01 | 2009-10-29 | Seikagaku Kogyo Co Ltd | Carrier for gene subtraction and use thereof |
KR101696985B1 (en) * | 2014-12-30 | 2017-01-17 | 삼성에스디아이 주식회사 | Composition for forming solar cell electrode and electrode prepared using the same |
KR101859017B1 (en) * | 2015-12-02 | 2018-05-17 | 삼성에스디아이 주식회사 | Method of forming electrode, electrode manufactured therefrom and solar cell |
-
2017
- 2017-07-06 KR KR1020170086149A patent/KR20190005464A/en not_active Application Discontinuation
-
2018
- 2018-04-11 US US15/950,625 patent/US20190013421A1/en not_active Abandoned
- 2018-04-26 TW TW107114211A patent/TWI731236B/en active
- 2018-05-14 CN CN201810455191.9A patent/CN109215834A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110095240A1 (en) * | 2009-10-28 | 2011-04-28 | Masami Nakamura | Conductive paste for forming a solar cell electrode |
JP2011096747A (en) * | 2009-10-28 | 2011-05-12 | Shoei Chem Ind Co | Conductive paste for forming solar cell electrode |
US20140008587A1 (en) * | 2011-04-21 | 2014-01-09 | Hiroshi Yoshida | Conductive paste |
EP2899761A1 (en) * | 2012-09-18 | 2015-07-29 | Murata Manufacturing Co., Ltd. | Conductive paste and solar cell |
Also Published As
Publication number | Publication date |
---|---|
KR20190005464A (en) | 2019-01-16 |
TW201906794A (en) | 2019-02-16 |
TWI731236B (en) | 2021-06-21 |
CN109215834A (en) | 2019-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9997648B2 (en) | Composition for solar cell electrode and electrode prepared using the same | |
US10566471B2 (en) | Composition for solar cell electrodes and electrode fabricated using the same | |
US9911872B2 (en) | Composition for forming electrode of solar cell, and electrode manufactured using same | |
US10315950B2 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
KR101982412B1 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
US9944802B2 (en) | Composition for forming solar cell electrode and electrode produced from same | |
KR101731674B1 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
US20150179296A1 (en) | Composition for solar cell electrodes and electrode fabricated using the same | |
US20190013421A1 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
US10439080B2 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
TWI686362B (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
CN109935641B (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
TWI648239B (en) | a composition of a P-type solar cell electrode, an electrode prepared using the composition, and a P-type solar cell prepared using the composition | |
US10570054B2 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
US20190292092A1 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
US20200203538A1 (en) | Method for forming solar cell electrode and solar cell | |
US20190035951A1 (en) | Composition for solar cell electrode and electrode prepared using the same | |
TW201618317A (en) | Solar cell including electrode formed on high sheet resistance wafer | |
TW201925124A (en) | Composition for forming solar cell electrode and electrode prepared using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SAMSUNG SDI CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KOO, HYUN JIN;KIM, MIN JAE;PARK, YOUNG KI;AND OTHERS;REEL/FRAME:045507/0933 Effective date: 20180404 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: ADVISORY ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: CHANGZHOU FUSION NEW MATERIAL CO. LTD, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SAMSUNG SDI CO., LTD.;REEL/FRAME:056005/0177 Effective date: 20210330 |