US20180245199A1 - Mask frame assembly and method of manufacturing the same - Google Patents

Mask frame assembly and method of manufacturing the same Download PDF

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Publication number
US20180245199A1
US20180245199A1 US15/965,574 US201815965574A US2018245199A1 US 20180245199 A1 US20180245199 A1 US 20180245199A1 US 201815965574 A US201815965574 A US 201815965574A US 2018245199 A1 US2018245199 A1 US 2018245199A1
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United States
Prior art keywords
polymer film
frame assembly
mask frame
mask
polymer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US15/965,574
Inventor
Kie Hyun Nam
Hye Dong KIM
Sung Guk An
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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Publication date
Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Priority to US15/965,574 priority Critical patent/US20180245199A1/en
Publication of US20180245199A1 publication Critical patent/US20180245199A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • G03F1/14—
    • G03F1/16—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G03F1/86—Inspecting by charged particle beam [CPB]
    • H01L27/3223—
    • H01L51/0011—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the described technology generally relates to a mask frame assembly and a method of manufacturing the same.
  • OLED organic light-emitting diode
  • An OLED display includes an emission layer between a first electrode and a second electrode facing each other, and an intermediate layer including the emission layer.
  • the electrodes and intermediate layer may be formed in various ways, one of which is an independent deposition method.
  • an organic layer of a predetermined pattern is formed on a surface of a substrate where the organic layer and the like are to be formed, by closely adhering fine metal mask (FMM) having the same pattern as that of the organic layer and the like to be formed and depositing a deposition material such as the organic layer, on the surface of the substrate.
  • FMM fine metal mask
  • One inventive aspect is a mask frame assembly for manufacturing a display device such as an organic light emitting diode (OLED) display.
  • OLED organic light emitting diode
  • Another aspect is a method of manufacturing the mask frame assembly.
  • Another aspect is a mask frame assembly for depositing a deposition material onto a substrate, and a method of manufacturing the same.
  • Another aspect is a mask frame assembly which includes a frame having at least one opening portion, and a polymer film having plural slits combined to the frame.
  • the frame may include a metal.
  • the mask frame assembly may further include an adhesive layer being interposed between the frame and the polymer film and adhering the frame and the polymer film.
  • the polymer film may include at least one selected from polyimide, polyphenylene sulfide, polyaryletherketone (PAEK), and liquid crystal polymer.
  • PAEK polyaryletherketone
  • the polymer film may include a pattern portion, and the slit may be formed on the pattern portion.
  • the opening portion may be formed in a location corresponding to the pattern portion.
  • Another aspect is a method of manufacturing the mask frame assembly which includes an operation of coating a polymer solution on a glass, an operation of forming the polymer film by drying and hardening the polymer solution, an operation of combining the frame to the polymer film, an operation of desorbing the glass from the polymer film, and an operation of processing a slit on the polymer film.
  • the operation of combining the frame to the polymer film may include an operation of coating an adhesive layer on the polymer film, and an operation of combining the frame to the adhesive layer.
  • the operation of processing the slit on the polymer film may use laser patterning to process the slit.
  • the operation of processing the slit on the polymer film may use light exposure to process the slit.
  • Another aspect is a mask frame assembly for manufacturing a display device, the mask frame assembly comprising: a frame having at least one opening portion defined therein; and a polymer film having a plurality of slits defined therein and combined to the frame.
  • the frame is formed at least partially of a metal.
  • the above mask frame assembly further comprises an adhesive layer being interposed between the frame and the polymer film and adhering the frame and the polymer film.
  • the above mask frame assembly further comprises an adhesive layer being interposed between the frame and the polymer film and adhering the frame and the polymer film.
  • the polymer film comprises one or more of: polyimide, polyphenylene sulfide, polyaryletherketone, and liquid crystal polymer.
  • the polymer film comprises a pattern portion and the slits are formed on the pattern portion.
  • the pattern portion comprises a plurality of pattern portions, wherein the at least one opening portion comprises a plurality of opening portions, and wherein the number of the pattern portions is the same as the number of the opening portions.
  • the lengths and widths of the opening portions are substantially the same.
  • the opening portion is formed in a location corresponding to the pattern portion.
  • the opening portion is formed substantially directly below the pattern portion.
  • the thickness of the polymer film is in the range from about 10 ⁇ m to about 50 ⁇ m.
  • the polymer film has a coefficient of thermal expansion (CTE) of about 3 ppm/° C. or less.
  • Another aspect is a method of manufacturing a mask frame assembly for a display device, the method comprising: coating a polymer solution on a glass; drying and hardening the polymer solution so as to form a polymer film; combining a frame to the polymer film; desorbing the glass from the polymer film; and processing a plurality of slits on the polymer film.
  • the combining comprises coating an adhesive layer on the polymer film, and combining the frame to the adhesive layer.
  • the processing uses laser patterning and/or light exposure to process the slits.
  • the combining is performed while the polymer solution is being dried and hardened.
  • the polymer film has a plurality of pattern portions defined therein, wherein the frame has a plurality of opening portions defined therein, and wherein the number of the pattern portions is the same as the number of the opening portions.
  • the lengths and widths of the opening portions are substantially the same.
  • the combining comprises aligning the frame with the polymer film such that each of the opening portions is formed substantially directly below the corresponding pattern portion.
  • the thickness of the polymer film is in the range from about 10 ⁇ m to about 50 ⁇ m.
  • FIG. 1 is a perspective view illustrating a mask frame assembly according to an embodiment.
  • FIG. 2 is a side cross-sectional view of the mask frame assembly of FIG. 1 .
  • FIG. 3 is a side cross-sectional view of a mask frame assembly according to another embodiment.
  • FIG. 4 is a flowchart illustrating a method of manufacturing a mask frame assembly according to an embodiment.
  • FIG. 5A is a view illustrating an operation of coating a polymer solution on a glass.
  • FIG. 5B is a view illustrating an operation of forming a polymer film by drying and hardening the polymer solution.
  • FIG. 5C is a view illustrating an operation of combining a frame with the polymer film.
  • FIG. 5D is a view illustrating an operation of desorbing the glass from the polymer film.
  • FIG. 5E is a drawing illustrating an operation of processing slits on the polymer film.
  • a process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially at the same time or performed in an order opposite to the described order.
  • the term “substantially” includes the meanings of completely, almost completely or to any significant degree under some applications and in accordance with those skilled in the art.
  • “formed on” can also mean “formed over.”
  • the term “connected” includes an electrical connection.
  • FIG. 1 is an exploded perspective view illustrating a mask frame assembly according to an embodiment.
  • the mask frame assembly 10 includes a frame 100 and a polymer film 200 .
  • the frame 100 illustrated in FIG. 1 may be manufactured with a metal and have at least one opening portion 110 in a rectangular form, however, the spirit of an embodiment of which is not limited thereto, and may be formed in various forms, such as a circle or hexagon.
  • the length and widths of the opening portions 110 can be substantially the same.
  • the polymer film 200 has a pattern portion 210 a corresponding to the opening portion 110 of the frame 100 , and plural slits 210 b are formed on the pattern portion 210 a so as to allow a deposition material to pass through the slits in a deposition process.
  • the polymer film 200 may be formed of polymer materials, such as polyimide (PI), polyphenylene sulfide (PPS), polyaryletherketone (PAEK), or liquid crystal polymer.
  • PI polyimide
  • PPS polyphenylene sulfide
  • PAEK polyaryletherketone
  • liquid crystal polymer such as polyimide (PI), polyphenylene sulfide (PPS), polyaryletherketone (PAEK), or liquid crystal polymer.
  • PI polyimide
  • PPS polyphenylene sulfide
  • PAEK polyaryletherketone
  • liquid crystal polymer liquid crystal polymer.
  • polyimide used to manufacture the polymer film 200 has a coefficient of thermal expansion (CTE) of about 3 ppm/° C. or less, which means that it is possible to perform fine deposition processing even in the temperature of about 500° C. or higher.
  • CTE coefficient of thermal expansion
  • the polymer film 200 is manufactured by coating, drying, and hardening a polymer solution 200 a thinly on a glass 50 (see FIGS. 5A through 5D ).
  • a polymer film 200 becomes closely attached to a display substrate (not shown) by being pulled by an electrostatic chuck (not shown) with placing the display substrate (not shown) between the polymer film 200 and the electrostatic chuck (not shown).
  • the thickness of the polymer film 200 is appropriate for the thickness of the polymer film 200 . If the polymer film 200 is excessively thinner than needed, when the polymer film 200 becomes closely attached to the display substrate by the electrostatic chuck, the polymer film 200 may be torn or transformed. On the contrary, if the polymer film 200 is excessively thicker than needed, the polymer film 200 fails to become completely closely attached to the display substrate by the weight of the polymer film 200 itself, which causes a shadow phenomenon where a deposition material reaches a region beyond the region that the slit 210 b of the polymer film 200 defines in time of deposition, and a thickness distortion phenomenon of a deposition film.
  • the polymer film 200 is formed with an appropriate thickness to provide an optimum deposition process, in other words, if the polymer film 200 is manufactured in the thickness of about 10 to about 50 ⁇ m as described above, superfine deposition patterning is possible even on a large-scale substrate without damage, transformation, or sagging. However, depending on embodiments, it is possible that the thickness of the polymer film 200 is less than about 10 ⁇ m or greater than about 50 ⁇ m.
  • FIG. 2 is a side cross-sectional view of the mask frame assembly of FIG. 1 .
  • the mask frame assembly 10 is arranged so that the opening portions 110 of the frame 100 correspond to (e.g., located substantially directly below) the pattern portions 210 a of the polymer film 200 .
  • the frame 100 and the polymer film 200 may be combined in many ways, and the mask frame assembly 10 illustrated in FIG. 2 shows the state where the frame 100 has been combined with the polymer film 200 during the drying and hardening of the polymer film 200 .
  • FIG. 3 is a side cross-sectional view illustrating a mask frame assembly according to another embodiment.
  • the mask frame assembly 10 illustrates the state where the frame 100 is adhered on the polymer film 200 by further including an adhesive layer 300 between the frame 100 and the polymer film 200 .
  • an adhesive layer 300 silicone may be used.
  • an organic material deposition process As an organic material deposition process is repeatedly performed, an organic material gets accumulated and remains on the mask frame assembly 10 . If the organic material deposition process continues to be performed leaving the organic material accumulated on the mask frame assembly 10 as such, the above-referenced shadow phenomenon or the deposition film thickness distortion phenomenon appears.
  • the frame 100 and the polymer film 200 are combined with silicone, the attachment and detachment of the frame 100 and the polymer film 200 becomes facilitated, therefore, it is possible to perform an efficient organic material deposition process by rapidly attaching or detaching the polymer film 200 to or from the frame 100 .
  • the method of manufacturing the mask frame assembly 10 may include coating the polymer solution 200 a on the glass 50 in operation S 401 , drying and hardening the polymer solution 200 a in operation S 402 , combining the frame 100 to the polymer film 200 in operation S 403 , desorbing the glass 50 in operation S 404 , and processing a plurality of slits 210 b on the pattern portions 210 a of the polymer film 200 in operation S 405 .
  • polymer materials such as PI, PPS, PEEK, or liquid crystal polymer as recited above may be used as the material of the polymer solution 200 a.
  • the coating of the polymer solution 200 a on the glass 50 in operation S 401 is followed by the drying and hardening of the polymer solution 200 a in operation S 402 , the polymer film 200 is formed on the glass 50 (see FIG. 5B ).
  • the frame 100 and the polymer film 200 can be combined in two ways.
  • the frame 100 may be combined to the polymer solution 200 a before the polymer solution 200 a becomes substantially completely dried
  • FIG. 5C is a view illustrating the form of the frame 100 and the polymer film 200 combined as such.
  • the frame 100 and the polymer film 200 may be combined by coating the adhesive layer 300 on the polymer film 200 and then combining the frame 100 to the adhesive layer 300 .
  • Silicone may be used as the material of such an adhesive layer 300 , which has been described above, and therefore, detailed explanations thereof are omitted herein.
  • the slits 210 b are formed on the polymer film 200 in operation S 405 .
  • the slits 210 b of the polymer film 200 may be formed in various ways, but it is preferable to form the slits 210 b by a laser patterning method or a light exposure method.
  • the mask frame assembly and the method of manufacturing the same enables superfine deposition patterning and has the effect of improving the deposition film thickness distortion phenomenon by the sagging of a substrate or a mask.
  • the mask frame assembly can be used to deposit deposition materials to a display substrate to manufacture a display device such as OLEDs.

Abstract

A mask frame assembly for manufacturing a display device, and a method of manufacturing the mask frame assembly are disclosed. In one aspect, the mask frame assembly includes a frame having at least one opening portion defined therein. The mask frame assembly further includes a polymer film having a plurality of slits defined therein and combined to the frame.

Description

    INCORPORATION BY REFERENCE TO ANY PRIORITY APPLICATIONS
  • This application is a divisional of U.S. patent application Ser. No. 14/637,222, filed Mar. 3, 2015, which claims priority under 35 U.S.C. 119 of Korean Patent Application No. 10-2014-0076631, filed on Jun. 23, 2014, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein in their entireties.
    • BACKGROUND Field
  • The described technology generally relates to a mask frame assembly and a method of manufacturing the same.
    • Description of the Related Technology
  • Of display devices, organic light-emitting diode (OLED) displays have not only a wide viewing angle and an excellent contrast, but also a fast response rate, thereby being noted as next-generation displays.
  • An OLED display includes an emission layer between a first electrode and a second electrode facing each other, and an intermediate layer including the emission layer. Here, the electrodes and intermediate layer may be formed in various ways, one of which is an independent deposition method. In order to manufacture an OLED display using the independent deposition method, an organic layer of a predetermined pattern is formed on a surface of a substrate where the organic layer and the like are to be formed, by closely adhering fine metal mask (FMM) having the same pattern as that of the organic layer and the like to be formed and depositing a deposition material such as the organic layer, on the surface of the substrate.
    • SUMMARY OF CERTAIN INVENTIVE ASPECTS
  • One inventive aspect is a mask frame assembly for manufacturing a display device such as an organic light emitting diode (OLED) display.
  • Another aspect is a method of manufacturing the mask frame assembly.
  • Another aspect is a mask frame assembly for depositing a deposition material onto a substrate, and a method of manufacturing the same.
  • Another aspect is a mask frame assembly which includes a frame having at least one opening portion, and a polymer film having plural slits combined to the frame.
  • The frame may include a metal.
  • The mask frame assembly may further include an adhesive layer being interposed between the frame and the polymer film and adhering the frame and the polymer film.
  • Also, the polymer film may include at least one selected from polyimide, polyphenylene sulfide, polyaryletherketone (PAEK), and liquid crystal polymer.
  • Also, the polymer film may include a pattern portion, and the slit may be formed on the pattern portion.
  • Also, the opening portion may be formed in a location corresponding to the pattern portion.
  • Another aspect is a method of manufacturing the mask frame assembly which includes an operation of coating a polymer solution on a glass, an operation of forming the polymer film by drying and hardening the polymer solution, an operation of combining the frame to the polymer film, an operation of desorbing the glass from the polymer film, and an operation of processing a slit on the polymer film.
  • The operation of combining the frame to the polymer film may include an operation of coating an adhesive layer on the polymer film, and an operation of combining the frame to the adhesive layer.
  • The operation of processing the slit on the polymer film may use laser patterning to process the slit. The operation of processing the slit on the polymer film may use light exposure to process the slit.
  • Another aspect is a mask frame assembly for manufacturing a display device, the mask frame assembly comprising: a frame having at least one opening portion defined therein; and a polymer film having a plurality of slits defined therein and combined to the frame.
  • In the above mask frame assembly, the frame is formed at least partially of a metal. The above mask frame assembly further comprises an adhesive layer being interposed between the frame and the polymer film and adhering the frame and the polymer film. The above mask frame assembly further comprises an adhesive layer being interposed between the frame and the polymer film and adhering the frame and the polymer film. In the above mask frame assembly, the polymer film comprises one or more of: polyimide, polyphenylene sulfide, polyaryletherketone, and liquid crystal polymer. In the above mask frame assembly, the polymer film comprises a pattern portion and the slits are formed on the pattern portion.
  • In the above mask frame assembly, the pattern portion comprises a plurality of pattern portions, wherein the at least one opening portion comprises a plurality of opening portions, and wherein the number of the pattern portions is the same as the number of the opening portions. In the above mask frame assembly, the lengths and widths of the opening portions are substantially the same. In the above mask frame assembly, the opening portion is formed in a location corresponding to the pattern portion. In the above mask frame assembly, the opening portion is formed substantially directly below the pattern portion. In the above mask frame assembly, the thickness of the polymer film is in the range from about 10 μm to about 50 μm. In the above mask frame assembly, the polymer film has a coefficient of thermal expansion (CTE) of about 3 ppm/° C. or less.
  • Another aspect is a method of manufacturing a mask frame assembly for a display device, the method comprising: coating a polymer solution on a glass; drying and hardening the polymer solution so as to form a polymer film; combining a frame to the polymer film; desorbing the glass from the polymer film; and processing a plurality of slits on the polymer film.
  • In the above method, the combining comprises coating an adhesive layer on the polymer film, and combining the frame to the adhesive layer. In the above method, the processing uses laser patterning and/or light exposure to process the slits. In the above method, the combining is performed while the polymer solution is being dried and hardened. In the above method, the polymer film has a plurality of pattern portions defined therein, wherein the frame has a plurality of opening portions defined therein, and wherein the number of the pattern portions is the same as the number of the opening portions. In the above method, the lengths and widths of the opening portions are substantially the same. In the above method, the combining comprises aligning the frame with the polymer film such that each of the opening portions is formed substantially directly below the corresponding pattern portion. In the above method, the thickness of the polymer film is in the range from about 10 μm to about 50 μm.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view illustrating a mask frame assembly according to an embodiment.
  • FIG. 2 is a side cross-sectional view of the mask frame assembly of FIG. 1.
  • FIG. 3 is a side cross-sectional view of a mask frame assembly according to another embodiment.
  • FIG. 4 is a flowchart illustrating a method of manufacturing a mask frame assembly according to an embodiment.
  • FIG. 5A is a view illustrating an operation of coating a polymer solution on a glass.
  • FIG. 5B is a view illustrating an operation of forming a polymer film by drying and hardening the polymer solution.
  • FIG. 5C is a view illustrating an operation of combining a frame with the polymer film.
  • FIG. 5D is a view illustrating an operation of desorbing the glass from the polymer film.
  • FIG. 5E is a drawing illustrating an operation of processing slits on the polymer film.
    •  DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS
  • Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout, and thus their repeated description will be omitted.
  • It will be understood that when a component, such as a layer, a film, a region, or a plate, is referred to herein as being “on” another component, the component can be directly on the other component or intervening components may be present thereon. Also, sizes of components in the drawings may be exaggerated for convenience of explanation. In other words, since sizes and thicknesses of components in the drawings are arbitrarily illustrated for convenience of explanation, the following embodiments are not limited thereto.
  • Also, when an embodiment may be implemented differently, a process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially at the same time or performed in an order opposite to the described order. In this disclosure, the term “substantially” includes the meanings of completely, almost completely or to any significant degree under some applications and in accordance with those skilled in the art. Moreover, “formed on” can also mean “formed over.” The term “connected” includes an electrical connection.
  • Embodiments will be described with respect to the accompanying drawings. FIG. 1 is an exploded perspective view illustrating a mask frame assembly according to an embodiment.
  • First, referring to FIG. 1, the mask frame assembly 10 includes a frame 100 and a polymer film 200.
  • The frame 100 illustrated in FIG. 1 may be manufactured with a metal and have at least one opening portion 110 in a rectangular form, however, the spirit of an embodiment of which is not limited thereto, and may be formed in various forms, such as a circle or hexagon. The length and widths of the opening portions 110 can be substantially the same.
  • The polymer film 200 has a pattern portion 210 a corresponding to the opening portion 110 of the frame 100, and plural slits 210 b are formed on the pattern portion 210 a so as to allow a deposition material to pass through the slits in a deposition process.
  • The polymer film 200 may be formed of polymer materials, such as polyimide (PI), polyphenylene sulfide (PPS), polyaryletherketone (PAEK), or liquid crystal polymer. The above-referenced materials have an excellent thermal resistance, a small change in property from a low temperature to a high temperature, and a strong chemical resistance and abrasion resistance, as high-performance plastic, and may maintain stable performance in poor surroundings. For example, polyimide used to manufacture the polymer film 200 has a coefficient of thermal expansion (CTE) of about 3 ppm/° C. or less, which means that it is possible to perform fine deposition processing even in the temperature of about 500° C. or higher.
  • In some embodiments, the polymer film 200 is manufactured by coating, drying, and hardening a polymer solution 200 a thinly on a glass 50 (see FIGS. 5A through 5D). In a general deposition process, such a polymer film 200 becomes closely attached to a display substrate (not shown) by being pulled by an electrostatic chuck (not shown) with placing the display substrate (not shown) between the polymer film 200 and the electrostatic chuck (not shown).
  • Here, about 10 μm to about 50 μm is appropriate for the thickness of the polymer film 200. If the polymer film 200 is excessively thinner than needed, when the polymer film 200 becomes closely attached to the display substrate by the electrostatic chuck, the polymer film 200 may be torn or transformed. On the contrary, if the polymer film 200 is excessively thicker than needed, the polymer film 200 fails to become completely closely attached to the display substrate by the weight of the polymer film 200 itself, which causes a shadow phenomenon where a deposition material reaches a region beyond the region that the slit 210 b of the polymer film 200 defines in time of deposition, and a thickness distortion phenomenon of a deposition film. Accordingly, the polymer film 200 is formed with an appropriate thickness to provide an optimum deposition process, in other words, if the polymer film 200 is manufactured in the thickness of about 10 to about 50 μm as described above, superfine deposition patterning is possible even on a large-scale substrate without damage, transformation, or sagging. However, depending on embodiments, it is possible that the thickness of the polymer film 200 is less than about 10 μm or greater than about 50 μm.
  • Hereinafter, a combined structure of the frame 100 and the polymer film 200 will be described with reference to FIG. 2.
  • FIG. 2 is a side cross-sectional view of the mask frame assembly of FIG. 1.
  • Referring to FIG. 2, the mask frame assembly 10 is arranged so that the opening portions 110 of the frame 100 correspond to (e.g., located substantially directly below) the pattern portions 210 a of the polymer film 200. The frame 100 and the polymer film 200 may be combined in many ways, and the mask frame assembly 10 illustrated in FIG. 2 shows the state where the frame 100 has been combined with the polymer film 200 during the drying and hardening of the polymer film 200.
  • FIG. 3 is a side cross-sectional view illustrating a mask frame assembly according to another embodiment.
  • Referring to FIG. 3, the mask frame assembly 10 illustrates the state where the frame 100 is adhered on the polymer film 200 by further including an adhesive layer 300 between the frame 100 and the polymer film 200. For a material of the adhesive layer 300, silicone may be used.
  • Generally, as an organic material deposition process is repeatedly performed, an organic material gets accumulated and remains on the mask frame assembly 10. If the organic material deposition process continues to be performed leaving the organic material accumulated on the mask frame assembly 10 as such, the above-referenced shadow phenomenon or the deposition film thickness distortion phenomenon appears. Here, if the frame 100 and the polymer film 200 are combined with silicone, the attachment and detachment of the frame 100 and the polymer film 200 becomes facilitated, therefore, it is possible to perform an efficient organic material deposition process by rapidly attaching or detaching the polymer film 200 to or from the frame 100.
  • Hereinafter, a method of manufacturing the mask frame assembly 10 according to an embodiment will be described with reference to FIGS. 4, and 5A through 5E. Depending on the embodiment, additional states (operations) can be added, others removed, or the order of the states (operations) changed in FIG. 4.
  • Referring to the flowchart of FIG. 4, the method of manufacturing the mask frame assembly 10 may include coating the polymer solution 200 a on the glass 50 in operation S401, drying and hardening the polymer solution 200 a in operation S402, combining the frame 100 to the polymer film 200 in operation S403, desorbing the glass 50 in operation S404, and processing a plurality of slits 210 b on the pattern portions 210 a of the polymer film 200 in operation S405.
  • In coating the polymer solution 200 a in operation S401, polymer materials, such as PI, PPS, PEEK, or liquid crystal polymer as recited above may be used as the material of the polymer solution 200 a.
  • If the coating of the polymer solution 200 a on the glass 50 in operation S401 (see FIG. 5A) is followed by the drying and hardening of the polymer solution 200 a in operation S402, the polymer film 200 is formed on the glass 50 (see FIG. 5B).
  • The frame 100 and the polymer film 200 can be combined in two ways.
  • First, the frame 100 may be combined to the polymer solution 200 a before the polymer solution 200 a becomes substantially completely dried, and FIG. 5C is a view illustrating the form of the frame 100 and the polymer film 200 combined as such.
  • Otherwise, after the polymer solution 200 a coated on the frame 100 becomes substantially completely dried and hardened and turns into the polymer film 200, as illustrated in FIG. 3, the frame 100 and the polymer film 200 may be combined by coating the adhesive layer 300 on the polymer film 200 and then combining the frame 100 to the adhesive layer 300. Silicone may be used as the material of such an adhesive layer 300, which has been described above, and therefore, detailed explanations thereof are omitted herein.
  • After the frame 100 and the polymer film 200 are combined to each other as such, it is prepared to form the slits 210 b on the pattern portions 210 a of the polymer film 200 by desorbing the glass 50 in operation S404.
  • Finally, after the glass 50 is desorbed, the slits 210 b are formed on the polymer film 200 in operation S405. Here, the slits 210 b of the polymer film 200 may be formed in various ways, but it is preferable to form the slits 210 b by a laser patterning method or a light exposure method.
  • As described above, according to at least one of the above embodiments, the mask frame assembly and the method of manufacturing the same enables superfine deposition patterning and has the effect of improving the deposition film thickness distortion phenomenon by the sagging of a substrate or a mask. The mask frame assembly can be used to deposit deposition materials to a display substrate to manufacture a display device such as OLEDs.
  • While the inventive technology has been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.

Claims (12)

What is claimed is:
1. A mask frame assembly for manufacturing a display device, the mask frame assembly comprising:
a frame having at least one opening portion defined therein; and
a polymer film having a plurality of slits defined therein and combined to the frame.
2. The mask frame assembly of claim 1, wherein the frame is formed at least partially of a metal.
3. The mask frame assembly of claim 1, further comprising an adhesive layer being interposed between the frame and the polymer film and adhering the frame and the polymer film.
4. The mask frame assembly of claim 2, further comprising an adhesive layer being interposed between the frame and the polymer film and adhering the frame and the polymer film.
5. The mask frame assembly of claim 1, wherein the polymer film comprises one or more of: polyimide, polyphenylene sulfide, polyaryletherketone, and liquid crystal polymer.
6. The mask frame assembly of claim 5, wherein the polymer film comprises a pattern portion and the slits are formed on the pattern portion.
7. The mask frame assembly of claim 6, wherein the pattern portion comprises a plurality of pattern portions, wherein the at least one opening portion comprises a plurality of opening portions, and wherein the number of the pattern portions is the same as the number of the opening portions.
8. The mask frame assembly of claim 7, wherein the lengths and widths of the opening portions are substantially the same.
9. The mask frame assembly of claim 6, wherein the opening portion is formed in a location corresponding to the pattern portion.
10. The mask frame assembly of claim 9, wherein the opening portion is formed substantially directly below the pattern portion.
11. The mask frame assembly of claim 1, wherein the thickness of the polymer film is in the range from about 10 μm to about 50 μm.
12. The mask frame assembly of claim 1, wherein the polymer film has a coefficient of thermal expansion (CTE) of about 3 ppm/° C. or less.
US15/965,574 2014-06-23 2018-04-27 Mask frame assembly and method of manufacturing the same Abandoned US20180245199A1 (en)

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KR20210120944A (en) 2021-10-07
KR102354388B1 (en) 2022-01-24

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