US20180166584A9 - Thin Film Transistor, Array Substrate, Method for Manufacturing the Same, and Display Device - Google Patents

Thin Film Transistor, Array Substrate, Method for Manufacturing the Same, and Display Device Download PDF

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US20180166584A9
US20180166584A9 US15/169,021 US201615169021A US2018166584A9 US 20180166584 A9 US20180166584 A9 US 20180166584A9 US 201615169021 A US201615169021 A US 201615169021A US 2018166584 A9 US2018166584 A9 US 2018166584A9
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drain
source
semiconductor layer
diffusion barrier
thin film
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US20170345943A1 (en
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Junhao HAN
Bingkun YIN
Jun Ma
Min Zhang
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651—Silicon transistors
    • H01L29/7866—Non-monocrystalline silicon transistors
    • H01L29/78663—Amorphous silicon transistors
    • H01L29/78669—Amorphous silicon transistors with inverted-type structure, e.g. with bottom gate
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/6675—Amorphous silicon or polysilicon transistors
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
    • H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
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    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H01L29/456—Ohmic electrodes on silicon
    • H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/6675—Amorphous silicon or polysilicon transistors
    • H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
    • H01L29/7845—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being a conductive material, e.g. silicided S/D or Gate
    • H—ELECTRICITY
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H—ELECTRICITY
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651—Silicon transistors
    • H01L29/7866—Non-monocrystalline silicon transistors
    • H01L29/78663—Amorphous silicon transistors

Definitions

  • Embodiments of the present disclosure relate to a technical field of electronic technology, especially relate to a thin film transistor, an array substrate, a method for manufacturing the same, and a display device.
  • switch-on current the current of an active layer while a Thin Film Transistor (TFT) is turned on by applying voltage to a gate
  • switch-on resistance R on the resistance of the TFT while it is turned on
  • an array substrate is produced by using a back-channel-etched bottom-gate TFT, and the switch-on resistance of the TFT is described by the model shown in FIG. 1 , that is:
  • R on 2* R ⁇ +2* R ⁇ +R c .
  • R on is the switch-on resistance of the TFT
  • R ⁇ is an ohmic contact resistance between an active layer 01 and a source 02 (or a drain 03 )
  • R ⁇ is a longitudinal resistance of the active layer 01
  • R c is a channel resistance while the TFT is turned on. It can be seen that, the switch-on resistance R on of the TFT can be reduced effectively by reducing R ⁇ , R ⁇ or R c .
  • the channel resistance R c may be reduced by increasing the ratio of width to length (W/L) of the TFT channel.
  • W/L of the TFT channel is greater than a certain threshold, an aperture ratio of a display device (the ratio of the effective transmission area to the whole area) will be decreased, accordingly, an energy consumption of the display device will be increased.
  • a method for manufacturing a thin film transistor which comprises: forming a source and drain on a base substrate and forming a semiconductor layer; between forming the source and drain and forming the semiconductor layer, the method further comprises: forming a diffusion barrier layer, wherein metal atoms diffused from the source and drain and passing through the diffusion barrier layer react with a part of the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed.
  • a method for manufacturing an array substrate which comprises the above method for manufacturing the thin film transistor.
  • a thin film transistor which comprises: a base substrate, a source and drain disposed on the base substrate, a diffusion barrier layer disposed on the source and drain, a semiconductor layer disposed on the diffusion barrier layer, wherein metal atoms diffused from the source and drain and passing through the diffusion barrier layer react with a part of the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed.
  • an array substrate which comprises the above thin film transistor.
  • a display device which comprises the above array substrate.
  • FIG. 1 schematically illustrates a model of switch-on resistance of a TFT
  • FIG. 2 is a flow chart of a method for manufacturing an array substrate according to an embodiment of the present disclosure
  • FIG. 3 to FIG. 6 schematically illustrate an array substrate in every step of a method for manufacturing an array substrate according to an embodiment of the present disclosure
  • FIG. 7 schematically illustrates a model of switch-on resistance of a TFT according to an embodiment of the present disclosure
  • FIG. 8 is another flow chart of a method for manufacturing an array substrate according to an embodiment of the present disclosure.
  • An embodiment of the present disclosure provides a method for manufacturing a thin film transistor, which comprises: forming a source, a drain and a semiconductor layer on a base substrate.
  • the source and drain contain metal atoms being capable of diffusing; the material of the semiconductor layer is amorphous silicon.
  • the method further comprises: forming a diffusion barrier layer, the diffusion barrier layer is configured to reduce the diffusion ability of metal atoms diffused from the source and drain to the semiconductor layer, such that the metal atoms passing through the diffusion barrier layer contact and react with the amorphous silicon in the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed.
  • the metal transition layer containing metal silicide is formed at the interface of the diffusion barrier layer and the semiconductor layer near the source and drain. Because of the low resistivity of the metal silicide, the ohmic contact resistance formed between the semiconductor layer and the source/drain of the TFT is reduced effectively, as a result, the switch-on resistance of the TFT is reduced while the aperture ratio of the display device is guaranteed, and the switch-on current of the TFT is increased.
  • sequence of the steps of forming the source and drain, the semiconductor layer and the diffusion barrier layer on the base substrate is not limited in the embodiments of the present disclosure.
  • sequence of the steps of forming the source and drain, the semiconductor layer and the diffusion barrier layer on the base substrate is not limited in the embodiments of the present disclosure.
  • a gate and a gate insulation layer are formed on a base substrate; then a semiconductor layer is formed on the gate insulation layer; next, a diffusion barrier layer is formed on the semiconductor layer; finally, a source and a drain are formed on the diffusion barrier layer.
  • Second scheme a gate and a gate insulation layer are formed on a base substrate; then a source and a drain are formed on the gate insulation layer; next, a diffusion barrier layer is formed on the source, the drain and the gate insulation layer; finally, a semiconductor layer is formed on the diffusion barrier layer.
  • a method for manufacturing the thin film transistor is elaborated below by taking the second scheme as an example, the method comprises:
  • a gate 11 is formed on a base substrate 10 and a gate insulation layer 12 is formed on the gate 11 .
  • the source and drain contain metal atoms being capable of diffusing.
  • the source 13 and the drain 14 are formed on the gate insulation layer 12 by a single patterning process.
  • the metal copper has a high thermal conductivity and lower resistivity, it is considered to be an ideal connection material. Meanwhile, copper has a significant diffusion effect, that is, copper atom has a high diffusion rate in most of mediums. In order to avoid a higher ohmic contact resistance due to the excessive diffusion of the copper atom from the source and drain to an active layer to be formed in the following step, a step 103 is further performed.
  • step 102 subsequently forming a diffusion barrier layer and a semiconductor layer on base substrate having the above structure in step 102 .
  • the material of the semiconductor layer is amorphous silicon; the diffusion barrier layer is configured to reduce the diffusion ability of metal atoms diffused from the source and drain to the semiconductor layer.
  • the material of the diffusion barrier layer comprises at least one of tantalum nitride, titanium nitride, molybdenum nitride, silicon oxynitride, or silicon oxide.
  • a diffusion barrier layer 15 and a semiconductor layer 16 are formed in this order on the base substrate 10 having the structure shown in FIG. 4 .
  • a metal transition layer 17 containing metal silicide for example, Cu 3 Si, etc.
  • a part of the semiconductor layer 16 becomes the metal transition layer 17 , and another part of the semiconductor layer 16 serves as an active layer of the TFT.
  • the metal transition layer 17 is formed in the part of the semiconductor layer 16 near the diffusion barrier layer 15 .
  • the metal transition layer 17 of the metal silicide plays an ideal role to reduce the ohmic contact resistance.
  • the metal transition layer 17 is formed only at the position of the diffusion barrier layer 15 corresponding to the source 13 and the drain 14 and contacting with the semiconductor layer 16 .
  • FIG. 7 schematically illustrates a model of switch-on resistance of a TFT according to an embodiment of the present disclosure.
  • the ohmic contact resistance R ⁇ is generated when the metal transition layer 17 contacts with the semiconductor layer 16 .
  • the ohmic contact resistance R ⁇ is reduced effectively, and a longitudinal resistance of the active layer R ⁇ is omitted.
  • the switch-on resistance of the TFT is reduced, and the switch-on current of the TFT is increased.
  • a step 104 may be performed after the step 103 , for example, the step 104 comprises:
  • the annealing process refers to a heat treatment process of a metal, herein, the base substrate is heated to a certain temperature, kept at the temperature for a period of time, and cooled at an appropriate rate (usually cooled slowly, and sometimes cooled by control).
  • the base substrate shown in FIG. 5 is annealed at a temperature from 200° C. to 450° C., then the reaction between the copper atoms diffused from the diffusion barrier layer 15 and the amorphous silicon in the semiconductor layer 16 is accelerated, and the metal transition layer 17 containing metal silicide is formed.
  • An embodiment of the present disclosure provides a method for manufacturing a thin film transistor, which comprises: forming a diffusion barrier layer between a step of forming the source and drain and a step of forming the semiconductor layer; the diffusion barrier layer is configured to reduce the diffusion ability of metal atoms diffused from the source and drain to the semiconductor layer (that is, to block a part of the diffused metal atoms). In this way, the metal atoms passing through the diffusion barrier layer contact and react with the amorphous silicon in the semiconductor layer, and a metal transition layer containing metal silicide is formed at the interface of the diffusion barrier layer and the semiconductor layer.
  • the ohmic contact resistance formed between the semiconductor layer and the source (or the drain) of the TFT is reduced effectively, as a result, the switch-on resistance of the TFT is reduced while the aperture ratio of the display device is guaranteed, and the switch-on current of the TFT is increased.
  • an embodiment of the present disclosure further provides a thin film transistor, which comprises:
  • a diffusion barrier layer 15 disposed on the source 13 and the drain 14 ;
  • a semiconductor layer 16 disposed on the diffusion barrier layer 15 herein, metal atoms passing through the diffusion barrier layer 15 react with the amorphous silicon in a part of the semiconductor layer 16 near the source 13 and the drain 14 , and a metal transition layer 17 containing metal silicide is formed.
  • the source 13 and drain 14 contain metal atoms being capable of diffusing, for example, cooper atoms.
  • the diffusion barrier layer 15 is configured to reduce the diffusion ability of metal atoms diffused from the source 13 and drain 14 to the semiconductor layer 16 to be formed in the following step.
  • the material of the semiconductor layer 16 is amorphous silicon.
  • the thin film transistor further comprises: a gate and a gate insulation layer, or other layer structures.
  • the configuration of the TFT may be designed by those skilled in the art according to the real situation, it is not limited in the embodiments of the invention.
  • the semiconductor layer 16 is formed on the base substrate firstly, then the diffusion barrier layer 15 is formed on the semiconductor layer 16 , and finally the source 13 and drain 14 are formed on the diffusion barrier layer 15 .
  • This configuration also allows metal atoms passing through the diffusion barrier layer 15 to react with the amorphous silicon in a part of the semiconductor layer 16 near the source 13 and drain 14 , and a metal transition layer 17 containing metal silicide is formed.
  • An embodiment of the present disclosure further provides a method for manufacturing an array substrate, which comprises any of the above methods of manufacturing the thin film transistor.
  • An embodiment of the present disclosure further provides an array substrate, which comprises the above thin film transistor.
  • An embodiment of the present disclosure further provides a display device, which comprises the above array substrate.
  • the display device may be a liquid crystal display panel, an electronic paper display panel, an OLED display panel, a mobile phone, a tablet computer, a TV, a display, a notebook computer, a digital photo frame, a navigation equipment or any other product or component with display function.
  • Embodiments of the present disclosure provide a thin film transistor, an array substrate, a method for manufacturing the same, and a display device.
  • a diffusion barrier layer is formed between the source/drain and the semiconductor layer.
  • the diffusion barrier layer is configured to reduce the diffusion ability of metal atoms diffused from the source and drain to the semiconductor layer; in this way, metal atoms passing through the diffusion barrier layer contact and react with the amorphous silicon in the semiconductor layer, and a metal transition layer containing metal silicide is formed at the interface of the diffusion barrier layer and the semiconductor layer.
  • the ohmic contact resistance formed between the semiconductor layer and the source-drain of the TFT is reduced effectively, as a result, the switch-on resistance of the TFT is reduced while the aperture ratio of the display device is guaranteed, and the switch-on current of the TFT is increased.

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  • Computer Hardware Design (AREA)
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Abstract

Disclosed is a thin film transistor, an array substrate, a method for manufacturing the same, and a display device. The method includes: forming a source and drain on a base substrate and forming a semiconductor layer. Between the step of forming the source and drain and the step of forming the semiconductor layer, the method further includes: forming a diffusion barrier layer. Metal atoms diffused from the source and drain and passing through the diffusion barrier layer react with a part of the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed.

Description

  • This application claims priority to and the benefit of Chinese Patent Application No. 201510332661.9 filed on Jun. 15, 2015, which application is incorporated herein in its entirety.
    • TECHNICAL FIELD
  • Embodiments of the present disclosure relate to a technical field of electronic technology, especially relate to a thin film transistor, an array substrate, a method for manufacturing the same, and a display device.
    • BACKGROUND
  • In the field of liquid crystal displays, switch-on current (the current of an active layer while a Thin Film Transistor (TFT) is turned on by applying voltage to a gate) of the TFT is of great significance to TFT's performance and is inversely proportional to a resistance of the TFT while it is turned on (that is, switch-on resistance Ron).
  • Typically, an array substrate is produced by using a back-channel-etched bottom-gate TFT, and the switch-on resistance of the TFT is described by the model shown in FIG. 1, that is:

  • R on=2*R Ω+2*R ν +R c.
  • Wherein Ron is the switch-on resistance of the TFT, RΩ is an ohmic contact resistance between an active layer 01 and a source 02 (or a drain 03), Rν is a longitudinal resistance of the active layer 01, Rc is a channel resistance while the TFT is turned on. It can be seen that, the switch-on resistance Ron of the TFT can be reduced effectively by reducing RΩ, Rν or Rc.
  • Currently, in order to obtain a higher value of the switch-on current, the channel resistance Rc may be reduced by increasing the ratio of width to length (W/L) of the TFT channel. However, when the W/L of the TFT channel is greater than a certain threshold, an aperture ratio of a display device (the ratio of the effective transmission area to the whole area) will be decreased, accordingly, an energy consumption of the display device will be increased.
    • SUMMARY
  • In first respect of the present disclosure, there is provided a method for manufacturing a thin film transistor, which comprises: forming a source and drain on a base substrate and forming a semiconductor layer; between forming the source and drain and forming the semiconductor layer, the method further comprises: forming a diffusion barrier layer, wherein metal atoms diffused from the source and drain and passing through the diffusion barrier layer react with a part of the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed.
  • In second respect of the present disclosure, there is provided a method for manufacturing an array substrate, which comprises the above method for manufacturing the thin film transistor.
  • In third respect of the present disclosure, there is provided a thin film transistor, which comprises: a base substrate, a source and drain disposed on the base substrate, a diffusion barrier layer disposed on the source and drain, a semiconductor layer disposed on the diffusion barrier layer, wherein metal atoms diffused from the source and drain and passing through the diffusion barrier layer react with a part of the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed.
  • In forth respect of the present disclosure, there is provided an array substrate, which comprises the above thin film transistor.
  • In fifth respect of the present disclosure, there is provided a display device, which comprises the above array substrate.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • In order to clearly illustrate the technical solution of the embodiments of the invention, the drawings of the embodiments will be briefly described in the following; it is obvious that the described drawings are only related to some embodiments of the invention and thus are not limitative of the invention.
  • FIG. 1 schematically illustrates a model of switch-on resistance of a TFT;
  • FIG. 2 is a flow chart of a method for manufacturing an array substrate according to an embodiment of the present disclosure;
  • FIG. 3 to FIG. 6 schematically illustrate an array substrate in every step of a method for manufacturing an array substrate according to an embodiment of the present disclosure;
  • FIG. 7 schematically illustrates a model of switch-on resistance of a TFT according to an embodiment of the present disclosure;
  • FIG. 8 is another flow chart of a method for manufacturing an array substrate according to an embodiment of the present disclosure.
    •  DETAILED DESCRIPTION
  • In order to make objects, technical details and advantages of the embodiments of the invention apparent, the technical solutions of the embodiments will be described in a clearly and fully understandable way in connection with the drawings related to the embodiments of the invention. Apparently, the described embodiments are just a part but not all of the embodiments of the invention. Based on the described embodiments herein, those skilled in the art can obtain other embodiment(s), without any inventive work, which should be within the scope of the invention.
  • Unless otherwise defined, all the technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms “first,” “second,” etc., which are used in the description and the claims of the present application for invention, are not intended to indicate any sequence, amount or importance, but distinguish various components. The terms “comprises,” “comprising,” “includes,” “including,” etc., are intended to specify that the elements or the objects stated before these terms encompass the elements or the objects and equivalents thereof listed after these terms, but do not preclude the other elements or objects. The phrases “connect”, “connected”, etc., are not intended to define a physical connection or mechanical connection, but may include an electrical connection, directly or indirectly. “On,” “under,” “right,” “left” and the like are only used to indicate relative position relationship, and when the position of the object which is described is changed, the relative position relationship may be changed accordingly.
  • An embodiment of the present disclosure provides a method for manufacturing a thin film transistor, which comprises: forming a source, a drain and a semiconductor layer on a base substrate. For example, the source and drain contain metal atoms being capable of diffusing; the material of the semiconductor layer is amorphous silicon. Between a step of forming the source and drain and a step of forming the semiconductor layer, the method further comprises: forming a diffusion barrier layer, the diffusion barrier layer is configured to reduce the diffusion ability of metal atoms diffused from the source and drain to the semiconductor layer, such that the metal atoms passing through the diffusion barrier layer contact and react with the amorphous silicon in the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed.
  • In this way, the metal transition layer containing metal silicide is formed at the interface of the diffusion barrier layer and the semiconductor layer near the source and drain. Because of the low resistivity of the metal silicide, the ohmic contact resistance formed between the semiconductor layer and the source/drain of the TFT is reduced effectively, as a result, the switch-on resistance of the TFT is reduced while the aperture ratio of the display device is guaranteed, and the switch-on current of the TFT is increased.
  • It should be noted that the sequence of the steps of forming the source and drain, the semiconductor layer and the diffusion barrier layer on the base substrate is not limited in the embodiments of the present disclosure. For example, there is provided two optional exemplarily implements as below.
  • First scheme: a gate and a gate insulation layer are formed on a base substrate; then a semiconductor layer is formed on the gate insulation layer; next, a diffusion barrier layer is formed on the semiconductor layer; finally, a source and a drain are formed on the diffusion barrier layer.
  • Second scheme: a gate and a gate insulation layer are formed on a base substrate; then a source and a drain are formed on the gate insulation layer; next, a diffusion barrier layer is formed on the source, the drain and the gate insulation layer; finally, a semiconductor layer is formed on the diffusion barrier layer.
  • Exemplarily, as illustrated in FIG. 2, a method for manufacturing the thin film transistor is elaborated below by taking the second scheme as an example, the method comprises:
  • 101. subsequently forming a gate and a gate insulation layer on a base substrate.
  • For example, as illustrated in FIG. 3, a gate 11 is formed on a base substrate 10 and a gate insulation layer 12 is formed on the gate 11.
  • 102. forming a source and a drain on the gate insulation layer, the source and drain contain metal atoms being capable of diffusing.
  • For example, as illustrated in FIG. 4, the source 13 and the drain 14 are formed on the gate insulation layer 12 by a single patterning process.
  • Because the metal copper has a high thermal conductivity and lower resistivity, it is considered to be an ideal connection material. Meanwhile, copper has a significant diffusion effect, that is, copper atom has a high diffusion rate in most of mediums. In order to avoid a higher ohmic contact resistance due to the excessive diffusion of the copper atom from the source and drain to an active layer to be formed in the following step, a step 103 is further performed.
  • 103. subsequently forming a diffusion barrier layer and a semiconductor layer on base substrate having the above structure in step 102.
  • For example, the material of the semiconductor layer is amorphous silicon; the diffusion barrier layer is configured to reduce the diffusion ability of metal atoms diffused from the source and drain to the semiconductor layer.
  • For example, the material of the diffusion barrier layer comprises at least one of tantalum nitride, titanium nitride, molybdenum nitride, silicon oxynitride, or silicon oxide.
  • For example, as illustrated in FIG. 5, a diffusion barrier layer 15 and a semiconductor layer 16 are formed in this order on the base substrate 10 having the structure shown in FIG. 4. Taking copper atoms in the source 13 and the drain 14 as an example, because copper atom has a stronger diffusion ability, only a part of copper atoms is blocked by the diffusion barrier layer 15, other copper atoms passing through the diffusion barrier layer 15 may contact and react with the amorphous silicon of the semiconductor layer near the source 13 and the drain 14. As illustrated in FIG. 6, a metal transition layer 17 containing metal silicide (for example, Cu3Si, etc.) is formed at the interface of the diffusion barrier layer 15 and the semiconductor layer 16. At this time, a part of the semiconductor layer 16 becomes the metal transition layer 17, and another part of the semiconductor layer 16 serves as an active layer of the TFT. In other words, the metal transition layer 17 is formed in the part of the semiconductor layer 16 near the diffusion barrier layer 15.
  • Thus, because the metal silicide has good adhesion with the silicon and has low resistivity, the metal transition layer 17 of the metal silicide plays an ideal role to reduce the ohmic contact resistance.
  • It should be noted, because the copper atoms in the source 13 and the drain 14 are blocked by the diffusion barrier layer 15, the metal transition layer 17 is formed only at the position of the diffusion barrier layer 15 corresponding to the source 13 and the drain 14 and contacting with the semiconductor layer 16.
  • FIG. 7 schematically illustrates a model of switch-on resistance of a TFT according to an embodiment of the present disclosure. The ohmic contact resistance RΩ is generated when the metal transition layer 17 contacts with the semiconductor layer 16. The channel resistance Rc is generated when the TFT is turned on, that is, a switch-on resistance of the TFT Ron=2*RΩ+Rc. In comparison of the model of FIG. 1, the ohmic contact resistance RΩ is reduced effectively, and a longitudinal resistance of the active layer Rν is omitted. As a result, the switch-on resistance of the TFT is reduced, and the switch-on current of the TFT is increased.
  • Additionally, as illustrated in FIG. 8, a step 104 may be performed after the step 103, for example, the step 104 comprises:
  • 104. annealing the base substrate obtained from the step 103.
  • The annealing process refers to a heat treatment process of a metal, herein, the base substrate is heated to a certain temperature, kept at the temperature for a period of time, and cooled at an appropriate rate (usually cooled slowly, and sometimes cooled by control).
  • In order to accelerate the diffusion rate of the metal atoms, for example, of the copper atoms, the base substrate shown in FIG. 5 is annealed at a temperature from 200° C. to 450° C., then the reaction between the copper atoms diffused from the diffusion barrier layer 15 and the amorphous silicon in the semiconductor layer 16 is accelerated, and the metal transition layer 17 containing metal silicide is formed.
  • An embodiment of the present disclosure provides a method for manufacturing a thin film transistor, which comprises: forming a diffusion barrier layer between a step of forming the source and drain and a step of forming the semiconductor layer; the diffusion barrier layer is configured to reduce the diffusion ability of metal atoms diffused from the source and drain to the semiconductor layer (that is, to block a part of the diffused metal atoms). In this way, the metal atoms passing through the diffusion barrier layer contact and react with the amorphous silicon in the semiconductor layer, and a metal transition layer containing metal silicide is formed at the interface of the diffusion barrier layer and the semiconductor layer. Because of the low resistivity of the metal silicide, the ohmic contact resistance formed between the semiconductor layer and the source (or the drain) of the TFT is reduced effectively, as a result, the switch-on resistance of the TFT is reduced while the aperture ratio of the display device is guaranteed, and the switch-on current of the TFT is increased.
  • As illustrated in FIG. 6, an embodiment of the present disclosure further provides a thin film transistor, which comprises:
  • a base substrate 10;
  • a source 13 and a drain 14 disposed on the base substrate 10;
  • a diffusion barrier layer 15 disposed on the source 13 and the drain 14;
  • a semiconductor layer 16 disposed on the diffusion barrier layer 15, herein, metal atoms passing through the diffusion barrier layer 15 react with the amorphous silicon in a part of the semiconductor layer 16 near the source 13 and the drain 14, and a metal transition layer 17 containing metal silicide is formed.
  • In at least some of the embodiments of the present disclosure, the source 13 and drain 14 contain metal atoms being capable of diffusing, for example, cooper atoms. The diffusion barrier layer 15 is configured to reduce the diffusion ability of metal atoms diffused from the source 13 and drain 14 to the semiconductor layer 16 to be formed in the following step. The material of the semiconductor layer 16 is amorphous silicon.
  • In at least some of the embodiments of the present disclosure, the thin film transistor further comprises: a gate and a gate insulation layer, or other layer structures. The configuration of the TFT may be designed by those skilled in the art according to the real situation, it is not limited in the embodiments of the invention.
  • For example, the semiconductor layer 16 is formed on the base substrate firstly, then the diffusion barrier layer 15 is formed on the semiconductor layer 16, and finally the source 13 and drain 14 are formed on the diffusion barrier layer 15. This configuration also allows metal atoms passing through the diffusion barrier layer 15 to react with the amorphous silicon in a part of the semiconductor layer 16 near the source 13 and drain 14, and a metal transition layer 17 containing metal silicide is formed.
  • An embodiment of the present disclosure further provides a method for manufacturing an array substrate, which comprises any of the above methods of manufacturing the thin film transistor.
  • An embodiment of the present disclosure further provides an array substrate, which comprises the above thin film transistor.
  • An embodiment of the present disclosure further provides a display device, which comprises the above array substrate. The display device may be a liquid crystal display panel, an electronic paper display panel, an OLED display panel, a mobile phone, a tablet computer, a TV, a display, a notebook computer, a digital photo frame, a navigation equipment or any other product or component with display function.
  • Embodiments of the present disclosure provide a thin film transistor, an array substrate, a method for manufacturing the same, and a display device. A diffusion barrier layer is formed between the source/drain and the semiconductor layer. The diffusion barrier layer is configured to reduce the diffusion ability of metal atoms diffused from the source and drain to the semiconductor layer; in this way, metal atoms passing through the diffusion barrier layer contact and react with the amorphous silicon in the semiconductor layer, and a metal transition layer containing metal silicide is formed at the interface of the diffusion barrier layer and the semiconductor layer. Because of the low resistivity of the metal silicide, the ohmic contact resistance formed between the semiconductor layer and the source-drain of the TFT is reduced effectively, as a result, the switch-on resistance of the TFT is reduced while the aperture ratio of the display device is guaranteed, and the switch-on current of the TFT is increased.
  • The specific features, structures, materials, or characteristics described in the disclosure may be combined in any one or more embodiments or examples in a suitable way.
  • What is described above is related to the illustrative embodiments of the disclosure only and not limitative to the scope of the disclosure; the scopes of the disclosure are defined by the accompanying claims.
  • The present application claims the priority of Chinese patent application No. 201510332661.9 filed on Jun. 15, 2015, the disclosure of which is incorporated by reference herein in its entirety.

Claims (18)

1. A method for manufacturing a thin film transistor, comprising:
forming a source and drain on a base substrate;
forming a semiconductor layer; and
between forming the source and drain and forming the semiconductor layer, the method further comprises:
forming a diffusion barrier layer, wherein metal atoms diffused from the source and drain and passing through the diffusion barrier layer react with a part of the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed, wherein the metal silicide comprises the metal atoms diffused from the source and drain.
2. The method for manufacturing the thin film transistor according to claim 1, wherein a material of the semiconductor layer is amorphous silicon.
3. The method for manufacturing the thin film transistor according to claim 2, wherein the diffusion barrier layer is formed between the source and drain and the semiconductor layer, and the diffusion barrier layer is configured to block a part of the metal atoms diffused from the source and drain to the semiconductor layer.
4. The method for manufacturing the thin film transistor according to claim 1, wherein the metal transition layer is formed in a part of the semiconductor layer near the diffusion barrier layer.
5. The method for manufacturing the thin film transistor according to claim 1, wherein the metal atom is copper atom.
6. The method for manufacturing the thin film transistor according to claim 2, wherein a material of the diffusion barrier layer comprises at least one of tantalum nitride, titanium nitride, molybdenum nitride, silicon oxynitride, or silicon oxide.
7. The method for manufacturing the thin film transistor according to claim 2, wherein after forming the diffusion barrier layer, the method further comprises:
annealing the base substrate on which the source and drain, the diffusion barrier layer and the semiconductor layer are formed, such that the reaction between the metal atoms passing through the diffusion barrier layer and the amorphous silicon in the semiconductor layer is accelerated, and the metal transition layer containing metal silicide is formed.
8. The method for manufacturing the thin film transistor according to claim 7, wherein the base substrate is annealed at a temperature from 200° C. to 450° C.
9. The method for manufacturing the thin film transistor according to claim 1, wherein the source and drain, the semiconductor layer, and the diffusion barrier layer is formed in this order:
forming the source and drain on the substrate;
forming the diffusion barrier layer overlaying the source and drain; and
forming the semiconductor layer on the diffusion barrier layer.
10. A method for manufacturing an array substrate, comprising the method for manufacturing the thin film transistor according to claim 1.
11. A thin film transistor, comprising:
a base substrate;
a source and drain disposed on the base substrate;
a diffusion barrier layer disposed on the source and drain; and
a semiconductor layer disposed on the diffusion barrier layer, wherein metal atoms diffused from the source and drain and passing through the diffusion barrier layer react with a part of the semiconductor layer near the source and drain, and a metal transition layer containing metal silicide is formed,
wherein the metal silicide comprises the metal atoms diffused from the source and drain.
12. The thin film transistor according to claim 11, wherein a material of the semiconductor layer is amorphous silicon.
13. The thin film transistor according to claim 12, wherein the diffusion barrier layer is configured to block a part of the metal atoms diffused from the source and drain to the semiconductor layer.
14. The thin film transistor according to claim 11, wherein the metal transition layer is formed in a part of the semiconductor layer near the diffusion barrier layer.
15. An array substrate, comprising the thin film transistor according to claim 11.
16. A display device, comprising the array substrate according to claim 15.
17. The method for manufacturing the thin film transistor according to claim 1, wherein the part of the semiconductor layer near the source and drain is a part of the semiconductor layer nearer to the source and drain than to a gap between the source and drain.
18. The thin film transistor according to claim 11, wherein the part of the semiconductor layer near the source and drain is a part of the semiconductor layer nearer to the source and drain than to a gap between the source and drain
US15/169,021 2015-06-15 2016-05-31 Thin film transistor, array substrate, method for manufacturing the same, and display device Expired - Fee Related US10658516B2 (en)

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