US20180149960A1 - Photomask and a fabrication method therefor - Google Patents
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- US20180149960A1 US20180149960A1 US15/399,205 US201715399205A US2018149960A1 US 20180149960 A1 US20180149960 A1 US 20180149960A1 US 201715399205 A US201715399205 A US 201715399205A US 2018149960 A1 US2018149960 A1 US 2018149960A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/28—Phase shift masks [PSM]; PSM blanks; Preparation thereof with three or more diverse phases on the same PSM; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0335—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0338—Process specially adapted to improve the resolution of the mask
Definitions
- Photolithography is utilized in the fabrication of semiconductor devices to transfer a pattern onto a wafer. Based on various integrated circuit (IC) layouts, patterns are transferred from a photomask to a surface of the wafer.
- the photomasks also called reticles, are made of quartz or glass with one or more metallic materials deposited on one side to prevent light penetration.
- resolution enhancement techniques such as optical proximity correction (OPC), off-axis illumination (OAI), double dipole lithography (DDL) and phase-shift mask (PSM), are developed to improve depth of focus (DOF) and therefore to achieve a better pattern transfer onto the wafer.
- FIG. 1A is a flow chart of a method of fabricating a photomask in accordance with one or more embodiments.
- FIG. 1B is a flow chart of a method of forming a phase shifter in accordance with one or more embodiments.
- FIGS. 2A-2E are cross-sectional views of a photomask at various stages of production in accordance with one or more embodiments.
- FIG. 3 is a cross-sectional view of a photomask in accordance with one or more embodiments.
- FIG. 4 is a cross-sectional view of a photomask in accordance with one or more embodiments.
- first and second features are formed in direct contact
- additional features may be formed between the first and second features, such that the first and second features may not be in direct contact
- present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.
- the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
- the apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
- the PSM is categorized into an alternating PSM or an attenuated PSM.
- the alternating PSM induces the phase shift of light by adjusting a thickness of a clear region.
- the attenuated PSM allows a small percentage of light to penetrate through a dark region.
- each PSM includes molybdenum silicide (MoSi) as a phase shifter. Defects such as crystal haze and particles are generated after a series process including UV exposure, baking and cleaning by sulfuric acid and ammonia, thereby causing a greater CD error and decreasing manufacturing yield.
- MoSi molybdenum silicide
- the phase shifter in order to reduce a growth of crystal haze, a combination of a semiconductor layer, such as silicon, and a dielectric layer, such as silicon dioxide, is used in place of MoSi.
- the phase shifter includes from 2 to 12 semiconductor/dielectric layer pairs. Based on a control of etch selectivities, such a phase shifter has an improved profile during an etch process and a reduced CD loss during the photolithography process.
- a bottom layer of the phase shifter has a relatively lower etch rate during the etch process.
- an unetched protrusion is formed between the phase shifter and a transparent substrate. The unetched protrusion enhances a physical damage resistance of the phase shifter to a subsequent clean process.
- FIG. 1A is a flow chart of a method 100 A of fabricating a photomask in accordance with one or more embodiments.
- Method 100 A includes operation 110 in which a phase shifter is deposited over a light transmitting substrate.
- a selected single wavelength or waveband is intended to penetrate through the light transmitting substrate.
- the light transmitting substrate is deemed transparent under near ultra violet (NUV) wavelengths (e.g., less than 365 nanometers (nm)).
- NUV near ultra violet
- the light transmitting substrate is deemed transparent under deep ultra violet (DUV) wavelengths (e.g., less than 284 nm). In some embodiments, the light transmitting substrate is deemed transparent under argon fluoride (ArF) laser (e.g., 193 nm).
- the phase shifter also referred to as a semi-light transparent phase shifter, is used to change a phase of light transmitted by the light transmitting substrate.
- the phase shifter includes a plurality of semiconductor layers and a plurality of dielectric layers arranged in an alternating fashion. The semiconductor layer and the dielectric layer have different etch selectivities. In some embodiments, the formation of the phase shifter includes a deposition process and an etch process performed cyclically.
- FIG. 1B is a flow chart of a method 100 B of forming a phase shifter in accordance with one or more embodiments.
- Method 100 B includes operation 112 in which a first semiconductor layer is deposited over the light transmitting substrate.
- the first semiconductor layer is used to endure an ion bombardment and therefore prevent a bottom portion of the phase shifter from being over etched.
- the first semiconductor layer includes silicon, germanium, silicon germanium, silicon carbide or another suitable material.
- the formation of the first semiconductor includes a deposition process, such as a chemical vapor deposition (CVD).
- CVD chemical vapor deposition
- At least one first dielectric layer and at least one second semiconductor layer are deposited, in an alternating fashion, over the first semiconductor layer.
- each of the second semiconductor layers includes the same material.
- at least one second semiconductor layer is different from the first semiconductor layer or another second semiconductor layer.
- each of the at least one second semiconductor layer includes the same material as the first semiconductor layer.
- the first semiconductor layer includes silicon and the at least one second semiconductor layer includes germanium.
- the formation process of the second semiconductor layer includes plasma-enhanced CVD (PECVD), high-density plasma CVD (HDPCVD), low pressure CVD (LPCVD) or another suitable process.
- the at least one first dielectric layer includes a single dielectric layer. In some embodiments, the at least one first dielectric layer includes multiple dielectric layers adjacent one another, for example, a silicon nitride layer and a silicon oxide layer without an intervening semiconductor layer. In some embodiments, the formation of the at least one first dielectric layer includes the same deposition process as that used to form the second semiconductor layer. In some embodiments, the formation of the at least one first dielectric layer includes a different deposition process from that used to form the second semiconductor layer. For example, the first dielectric layer uses a CVD process and the second semiconductor layer uses an atomic layer deposition (ALD) process. In some embodiments, each of the at least one first dielectric layer is formed by the same process.
- ALD atomic layer deposition
- At least one of the first dielectric layer is formed by a different process from another. In some embodiments, each of the at least one first dielectric layer has a same material. In some embodiments, at least one of the at least one first dielectric layer has a different material from another of the at least one first dielectric layer. In some embodiments, each of the at least one first dielectric layer is a single dielectric layer. In some embodiments, each of the at least one first dielectric layer includes multiple dielectric layers adjacent one another. In some embodiments, at least one of the at least one first dielectric layer is a single dielectric layer and another of the at least one first dielectric layer includes multiple dielectric layers adjacent one another.
- a second dielectric layer is deposited over the at least one first dielectric layer and the at least one second semiconductor layer.
- the second dielectric layer includes the same material as each of the at least one first dielectric layer.
- the second dielectric layer includes a different material from at least one of the at least one the first dielectric layer.
- the formation of the second dielectric layer is the same as that used to form the at least one first dielectric layer.
- the formation of the second dielectric layer is different from that used to form the at least one first dielectric marital.
- second dielectric layer uses a CVD process and the at least one first dielectric uses an ALD process. Based on the photolithographic parameters, a thickness and a refraction index of the phase shifter is determined by selecting the material and formation of the first semiconductor layer, the at least one second semiconductor layer, the at least one first dielectric layer and the second dielectric layer.
- FIG. 2A is a cross-sectional view of a photomask 200 following operation 110 in accordance with one or more embodiments.
- Photomask 200 includes a light transmitting substrate 210 and a phase shifter 220 .
- light transmitting substrate 210 is formed of glass, fused silica, quartz, calcium fluoride, sapphire or another suitable material.
- a thickness of light transmitting substrate 210 ranges from about 0.09 inches for a five-inch mask to about 0.25 inches for a six-inch mask If the thickness is too small, photomask 200 will be fragile and a risk of cracking or breaking during handling photomask 200 increases, in some instances. If the thickness is too great, a cost of light transmitting substrate 210 will increase without a significant increase in functionality, in some instances.
- Phase shifter 220 includes a first semiconductor layer 222 , a first dielectric layer 224 , a second semiconductor layer 226 and a second dielectric layer 228 .
- photomask 200 includes one or more semiconductor layers or dielectric layers stacked between second semiconductor layer 226 and second dielectric layer 228 in an alternating fashion.
- phase shifter 220 has from 2 to 12 semiconductor/dielectric pairs, collectively referred to as pairs P. If a quantity of pairs P is too small, a sidewall of a subsequently etched phase shifter 220 will have a notch or have a tapered shape, in some instances. If a quantity of pairs P is too great, a cost of manufacturing phase shifter 220 will increase without a significant increase in functionality, in some instances.
- first semiconductor layer 222 , second semiconductor layer 226 and other semiconductor layers within phase shifter 220 independently include silicon, germanium, silicon germanium, silicon carbide or another suitable material.
- first dielectric layer 224 , second dielectric layer 228 and other dielectric layers within phase shifter 220 collectively referred to as dielectric layers D, independently include silicon dioxide, silicon nitride, silicon oxynitride or another suitable material.
- each layer of dielectric layer D includes a single layer.
- each layer of dielectric layers D includes multiple layers, for example, a combination of silicon dioxide and silicon nitride.
- each layer of semiconductor layers S is silicon
- each layer of dielectric layer D includes silicon dioxide or silicon nitride.
- the formation of phase shifter 220 includes a deposition process, such as ALD or CVD.
- a thickness of each semiconductor layer S independently ranges from about 1 nm to about 5 nm. If the thickness is too small, phase shifter 220 will suffer more damage during the subsequent clean or etch process, in some instances. If the thickness is too great, a transmittance of phase shifter 220 will decrease, in some instances.
- each of semiconductor layer S has the same thickness. In some embodiments, at least one of semiconductor layer S has a different thickness from another semiconductor layer. In some embodiments, a thickness of each dielectric layer D independently ranges from about 10 nm to about 20 nm. If the thickness of a dielectric layer is too great, a sidewall of the subsequently etched phase shifter 220 will be irregular, in some instances.
- each of dielectric layer D has the same thickness. In some embodiments, at least one of dielectric layer D has a different thickness from another dielectric layer.
- a total transmission rate incident light of phase shifter 220 ranges of from about 6% to 18%, in some instances. If the transmission rate is too great or too small, an intensity amplitude of phase-shifted light will be too much or insufficient, so the resolution enhancement of the image to be transferred will decrease, in some instances.
- semiconductor layers S have a lower etch rate than dielectric layer D.
- silicon endures greater ion bombardments than silicon dioxide or silicon nitride, silicon has a lower etch rate than silicon dioxide or silicon nitride. Therefore, the sidewall profile is improved because of a multilayer structure with a combination of silicon and silicon dioxide/silicon nitride.
- a ratio of etch rates between dielectric layer D and semiconductor layer S ranges from about 1.5 to about 2.5. If the ratio is too great, a loss of dielectric layer D will increase resulting in distortion of the image to be transferred, in some instances. If the ratio is too small, a manufacturing cost of photomask 200 will increase, in some instances.
- a shading layer is deposited over the phase shifter.
- the shading layer acts as a light absorber in the photomask.
- the shading layer includes a metal material.
- the shading layer includes a metal material and an oxide material.
- the shading layer includes a metal material and a metal oxide gradient.
- the metal oxide gradient or a metal is used to reduce reflectivity during the photolithography process.
- FIG. 2B is a cross-sectional view of photomask 200 following operation 120 in accordance with one or more embodiments.
- a shading layer 230 also referred to as an opaque layer, is over phase shifter 220 .
- shading layer 230 includes chromium, chromium oxide, chromium oxynitride or another suitable material.
- the formation of shading layer 230 includes a deposition process, such as sputtering, CVD, physical vapor deposition (PVD), ALD or another suitable process.
- a thickness of shading layer 230 is based on various designs of photomasks.
- the thickness of shading layer 230 ranges from about 40 nm to about 65 nm, in some instances. If the thickness is too great, an intensity of phase-shifted light penetrating through shading layer 230 decreases, in some instances. If the thickness is too small, a side lobe of the photoresist will be affected by phase-shifted light resulting in distortion of the image to be transferred, in some instances. In some embodiments, when photomask 200 is an alternating PSM, the thickness of shading layer 230 is greater than 100 nm, in some instances. If the thickness is too small, an amount of light absorption will be insufficient, in some instances.
- an ability of light phase shifter 220 and/or shading layer 230 to absorb or block the passage of light is based on various designs of photomasks. For example, for the alternating PSM, the optical density of a combination of shading layer 230 and phase shifter 220 is greater than 3. If the optical density is too small, the light blockage will be insufficient, in some instances.
- method 100 A continues with operation 130 in which a first portion of the shading layer and a portion of the phase shifter are removed to expose a portion of the light transmitting substrate.
- a first mask layer is formed over the shading layer to define a first pattern.
- a first portion of the shading layer and a portion of the phase shifter thereunder are removed to expose a portion of the light transmitting substrate.
- Such formation includes a photolithography and an etch process.
- the removal of the first portion of the shading layer and the portion of the phase shifter thereunder uses laser-beam writing to expose the portion of the light transmitting substrate.
- FIG. 2C is a cross-sectional view of photomask 200 following operation 130 in accordance with one or more embodiments.
- a first photoresist is formed and patterned over shading layer 230 , followed by an etch process to remove a first portion of shading layer 230 .
- shading layer 230 is used as a hard mask for a removal of a portion of phase shifter 220 .
- a portion of light transmitting substrate 210 is exposed.
- the portion of shading layer 230 and the portion of phase shifter 220 are removed in the same etch process.
- a region 240 of an exposed light transmitting substrate 210 s is referred to as a clear tone and a region 242 of phase shifter 220 and shading layer 230 is referred to as a dark tone.
- photomask 200 is referred to as the attenuated PSM.
- the etch process includes a dry etching, such as a plasma etching, a wet etching or a combination of the dry etching and the wet etching.
- an etchant gas includes a fluorine-containing gas (e.g., CF 4 , SF 6 , CH 2 F 2 , CHF 3 , and/or C 2 F 6 ), chlorine-containing gas (e.g., Cl 2 , CHCl 3 , CCl 4 , and/or BCl 3 ), bromine-containing gas (e.g., HBr and/or CHBR 3 ), or another suitable gases.
- a fluorine-containing gas e.g., CF 4 , SF 6 , CH 2 F 2 , CHF 3 , and/or C 2 F 6
- chlorine-containing gas e.g., Cl 2 , CHCl 3 , CCl 4 , and/or BCl 3
- bromine-containing gas e.g., HBr and/or CHBR 3
- the etchant gas is a mixture of SF 6 and oxygen
- silicon has a relatively lower etch rate than silicon nitride and silicon dioxide.
- photomask 200 has an improved sidewall profile relative to a conventional MoSi phase shifter, which helps to enhance the resolution and reduce CD error during the semiconductor manufacturing.
- the removal process uses laser-beam writing.
- an undesired CD growth of photomask 200 is smaller than 0.1 nm and an undesired CD loss of photomask 200 is smaller than 0.1 nm.
- each photomask 200 is able to produce at least 25,000 wafers.
- FIG. 2D is a schematic cross-sectional view of photomask 200 in accordance with one or more embodiments.
- a portion of unetched first semiconductor layer 222 also referred to as a protrusion 222 ′, extends from a sidewall of first semiconductor layer 222 over light transmitting substrate 210 .
- protrusion 222 ′ has a tapered profile.
- a thickness and a width of protrusion 222 ′ ranges from about 0.1 nm to about 1 nm. If the thickness or the width is too great, a contrast between clear tone region 240 and dark tone region 242 will decrease, in some instances.
- each of semiconductor layer S forms a protrusion after the ion bombardment process. Similar to protrusion 222 ′, each protrusion of semiconductor layer S has a thickness ranging from about 0.1 nm to about 1 nm and a width ranging from about 0.1 nm to about 1 nm.
- method 100 A continues with an optional operation 140 in which a portion of the light transmitting substrate is removed.
- a second mask layer is formed over the shading layer and the exposed portion of the light transmitting substrate to define a second pattern.
- a portion of the light transmitting substrate is removed to form a recess.
- Such formation includes a photolithography and an etch process.
- FIG. 2E is a cross-sectional view of photomask 200 following operation 140 in accordance with one or more embodiments.
- a second photoresist is formed and patterned over shading layer 230 and exposed light transmitting substrate 210 s , followed by an etch process to remove a portion of light transmitting substrate 210 .
- a recess 250 is formed in light transmitting substrate 210 .
- the removal of light transmitting substrate 210 uses the same process as the removal of shading layer 230 or phase shifter 220 .
- the removal of light transmitting substrate 210 uses a different process from the removal of shading layer 230 and phase shifter 220 .
- a depth of recess 250 is selected based on a refraction index of light transmitting substrate and wavelength of incident light to realize a phase shift. In some embodiment, the depth of recess 250 ranges from about 1 nm to about 4 nm. A greater or smaller depth negatively affects a resolution of photomask 200 , in some instances.
- recess 250 is referred to as a phase shifting tone 244
- exposed portion of light transmitting substrate 210 s is referred to a clear tone
- a region of stacked phase shifter 220 and shading layer 230 is referred to as a dark tone 246 .
- shading layer 230 is partially or completely removed.
- protrusion 222 ′ (best seen in FIG. 2D ) is at a sidewall of recess 250 . Protrusion 222 ′ has a sufficiently small roughness to avoid impacting the resolution of photomask 200 .
- FIG. 3 is a cross-sectional view of a photomask 300 in accordance with one or more embodiments.
- Photomask 300 is similar to photomask 200 , like elements have a same reference number increased by 100.
- a shading layer 330 is between a light transmitting substrate 310 and a phase shifter 320 .
- the formation of shading layer 330 and phase shifter 320 is the same as the formation of shading layer 230 and phase shifter 220 .
- Photomask 300 is formed by adjusting an order of operations in method 100 A, in some embodiments. For example, operation 120 is performed prior to operation 110 .
- FIG. 4 is a cross-sectional view of a photomask 400 in accordance with one or more embodiments.
- Photomask 400 is similar to photomask 200 , like elements have a same reference number increased by 200.
- a shading layer 430 is between a light transmitting substrate 410 and a phase shifter 420 .
- a recess 450 is formed in light transmitting substrate 410 to form a tri-tone PSM, in some instances. In some embodiments, the formation of recess 450 is the same as the formation of recess 250 .
- recess 450 is referred to a phase shifting tone region 444
- unetched light transmitting substrate 410 s is referred to a clear tone region 440
- a region of stacked phase shifter 420 and shading layer 430 is referred to as a dark tone region 446 .
- photomasks 200 - 400 will undergo further processing to complete fabrication.
- a third mask layer is formed over the photomask to define a third pattern.
- a passivation layer is optionally deposited over photomasks 200 - 400 after operation 130 or 140 or (depending on various designs of photomasks) to repair defects generated during the manufacturing process.
- phase shifter helps keep a sidewall profile of phase shifter, resulting in an improved CD pattern during the photolithography process.
- a transmittance of the phase shifter is adjustable by various combinations of the semiconductor layer and dielectric layer.
- the semiconductor layer, such as silicon and the dielectric layer, such as silicon dioxide, help reduce CD increase caused by oxidation and reduce a risk of haze caused during clean process.
- an un-etched protrusion of the bottom semiconductor layer enhances a damage resistance caused by a wet clean process, resulting in a reduced manufacturing cost and production yield.
- One aspect of this description relates to a method of fabricating a photomask.
- the method includes depositing a phase shifter over a light transmitting substrate, depositing a shading layer over the light transmitting substrate, and removing a portion of the shading layer and a portion of the phase shifter to expose a portion of the light transmitting substrate.
- the phase shifter having at least two semiconductor layers and at least two dielectric layers.
- Another aspect of this description relates to a method of fabricating a reticle.
- the method includes depositing a bottom silicon layer over a transparent substrate, depositing at least one silicon/dielectric pair over the bottom silicon layer, depositing a top dielectric layer over the at least one silicon/dielectric pair, depositing an opaque layer over the top dielectric layer, and removing a portion of the opaque layer, a portion of the top dielectric layer, a portion of the at least one silicon/dielectric pair and the bottom silicon layer to expose a portion of the transparent substrate.
- the PSM includes a light transmitting substrate, and a phase shifter over the light transmitting substrate.
- the phase shifter has from 2 to 12 pairs of semiconductor layers and dielectric layers stacked in an alternating fashion.
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Abstract
Description
- Photolithography is utilized in the fabrication of semiconductor devices to transfer a pattern onto a wafer. Based on various integrated circuit (IC) layouts, patterns are transferred from a photomask to a surface of the wafer. The photomasks, also called reticles, are made of quartz or glass with one or more metallic materials deposited on one side to prevent light penetration. As dimensions decrease and density in IC chips increases, resolution enhancement techniques, such as optical proximity correction (OPC), off-axis illumination (OAI), double dipole lithography (DDL) and phase-shift mask (PSM), are developed to improve depth of focus (DOF) and therefore to achieve a better pattern transfer onto the wafer.
- Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
-
FIG. 1A is a flow chart of a method of fabricating a photomask in accordance with one or more embodiments. -
FIG. 1B is a flow chart of a method of forming a phase shifter in accordance with one or more embodiments. -
FIGS. 2A-2E are cross-sectional views of a photomask at various stages of production in accordance with one or more embodiments. -
FIG. 3 is a cross-sectional view of a photomask in accordance with one or more embodiments. -
FIG. 4 is a cross-sectional view of a photomask in accordance with one or more embodiments. - The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components, values, operations, materials, arrangements, or the like, are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. Other components, values, operations, materials, arrangements, or the like, are contemplated. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
- As semiconductor device feature sizes have decreased to be smaller than a wavelength of light used in photolithography processes, the ability of manufacturing the minimum feature size, also called critical dimensions (CD), become sensitive to optical fringing of light passing through a photomask or a reticle. Because of constructive and destructive interference effects, also referred to as diffraction, photoresist at an edge of a defined pattern is exposed under undesired light, resulting in a distortion in a pattern transferred to a wafer. In order to enhance a resolution during the image transfer, a phase shift mask (PSM) is used to shift a phase of selected light passing through the photomask or the reticle by π (180 degrees), thereby the undesired light is scattered or offset by the destructive interference. Removing the undesired light helps to improve the precision of the image transfer. Typically, the PSM is categorized into an alternating PSM or an attenuated PSM. The alternating PSM induces the phase shift of light by adjusting a thickness of a clear region. The attenuated PSM allows a small percentage of light to penetrate through a dark region. In some instances, each PSM includes molybdenum silicide (MoSi) as a phase shifter. Defects such as crystal haze and particles are generated after a series process including UV exposure, baking and cleaning by sulfuric acid and ammonia, thereby causing a greater CD error and decreasing manufacturing yield.
- In some embodiments, in order to reduce a growth of crystal haze, a combination of a semiconductor layer, such as silicon, and a dielectric layer, such as silicon dioxide, is used in place of MoSi. In some embodiments, the phase shifter includes from 2 to 12 semiconductor/dielectric layer pairs. Based on a control of etch selectivities, such a phase shifter has an improved profile during an etch process and a reduced CD loss during the photolithography process. In some embodiments, a bottom layer of the phase shifter has a relatively lower etch rate during the etch process. As a result, an unetched protrusion is formed between the phase shifter and a transparent substrate. The unetched protrusion enhances a physical damage resistance of the phase shifter to a subsequent clean process.
-
FIG. 1A is a flow chart of amethod 100A of fabricating a photomask in accordance with one or more embodiments. One of ordinary skill in the art would understand that additional operations are able to be performed before, during, and/or aftermethod 100A depicted inFIG. 1A , in some embodiments.Method 100A includesoperation 110 in which a phase shifter is deposited over a light transmitting substrate. A selected single wavelength or waveband is intended to penetrate through the light transmitting substrate. In some embodiments, the light transmitting substrate is deemed transparent under near ultra violet (NUV) wavelengths (e.g., less than 365 nanometers (nm)). In some embodiments, the light transmitting substrate is deemed transparent under deep ultra violet (DUV) wavelengths (e.g., less than 284 nm). In some embodiments, the light transmitting substrate is deemed transparent under argon fluoride (ArF) laser (e.g., 193 nm). The phase shifter, also referred to as a semi-light transparent phase shifter, is used to change a phase of light transmitted by the light transmitting substrate. The phase shifter includes a plurality of semiconductor layers and a plurality of dielectric layers arranged in an alternating fashion. The semiconductor layer and the dielectric layer have different etch selectivities. In some embodiments, the formation of the phase shifter includes a deposition process and an etch process performed cyclically. -
FIG. 1B is a flow chart of amethod 100B of forming a phase shifter in accordance with one or more embodiments. One of ordinary skill in the art would understand that additional operations are able to be performed before, during, and/or aftermethod 100B depicted inFIG. 1B , in some embodiments.Method 100B includesoperation 112 in which a first semiconductor layer is deposited over the light transmitting substrate. The first semiconductor layer is used to endure an ion bombardment and therefore prevent a bottom portion of the phase shifter from being over etched. In some embodiments, the first semiconductor layer includes silicon, germanium, silicon germanium, silicon carbide or another suitable material. In some embodiments, the formation of the first semiconductor includes a deposition process, such as a chemical vapor deposition (CVD). - In
operation 114, at least one first dielectric layer and at least one second semiconductor layer are deposited, in an alternating fashion, over the first semiconductor layer. When more than one second semiconductor layer is deposited, in some embodiments, each of the second semiconductor layers includes the same material. In some embodiments, at least one second semiconductor layer is different from the first semiconductor layer or another second semiconductor layer. In some embodiments, each of the at least one second semiconductor layer includes the same material as the first semiconductor layer. For example, the first semiconductor layer includes silicon and the at least one second semiconductor layer includes germanium. In some embodiments, the formation process of the second semiconductor layer includes plasma-enhanced CVD (PECVD), high-density plasma CVD (HDPCVD), low pressure CVD (LPCVD) or another suitable process. - In some embodiments, the at least one first dielectric layer includes a single dielectric layer. In some embodiments, the at least one first dielectric layer includes multiple dielectric layers adjacent one another, for example, a silicon nitride layer and a silicon oxide layer without an intervening semiconductor layer. In some embodiments, the formation of the at least one first dielectric layer includes the same deposition process as that used to form the second semiconductor layer. In some embodiments, the formation of the at least one first dielectric layer includes a different deposition process from that used to form the second semiconductor layer. For example, the first dielectric layer uses a CVD process and the second semiconductor layer uses an atomic layer deposition (ALD) process. In some embodiments, each of the at least one first dielectric layer is formed by the same process. In some embodiments, at least one of the first dielectric layer is formed by a different process from another. In some embodiments, each of the at least one first dielectric layer has a same material. In some embodiments, at least one of the at least one first dielectric layer has a different material from another of the at least one first dielectric layer. In some embodiments, each of the at least one first dielectric layer is a single dielectric layer. In some embodiments, each of the at least one first dielectric layer includes multiple dielectric layers adjacent one another. In some embodiments, at least one of the at least one first dielectric layer is a single dielectric layer and another of the at least one first dielectric layer includes multiple dielectric layers adjacent one another.
- In
operation 116, a second dielectric layer is deposited over the at least one first dielectric layer and the at least one second semiconductor layer. In some embodiments, the second dielectric layer includes the same material as each of the at least one first dielectric layer. In some embodiments, the second dielectric layer includes a different material from at least one of the at least one the first dielectric layer. In some embodiments, the formation of the second dielectric layer is the same as that used to form the at least one first dielectric layer. In some embodiments, the formation of the second dielectric layer is different from that used to form the at least one first dielectric marital. For example, second dielectric layer uses a CVD process and the at least one first dielectric uses an ALD process. Based on the photolithographic parameters, a thickness and a refraction index of the phase shifter is determined by selecting the material and formation of the first semiconductor layer, the at least one second semiconductor layer, the at least one first dielectric layer and the second dielectric layer. -
FIG. 2A is a cross-sectional view of aphotomask 200 followingoperation 110 in accordance with one or more embodiments.Photomask 200 includes alight transmitting substrate 210 and aphase shifter 220. In some embodiments,light transmitting substrate 210 is formed of glass, fused silica, quartz, calcium fluoride, sapphire or another suitable material. In some embodiments, a thickness oflight transmitting substrate 210 ranges from about 0.09 inches for a five-inch mask to about 0.25 inches for a six-inch mask If the thickness is too small,photomask 200 will be fragile and a risk of cracking or breaking duringhandling photomask 200 increases, in some instances. If the thickness is too great, a cost oflight transmitting substrate 210 will increase without a significant increase in functionality, in some instances. -
Phase shifter 220 includes afirst semiconductor layer 222, a firstdielectric layer 224, asecond semiconductor layer 226 and asecond dielectric layer 228. In some embodiments,photomask 200 includes one or more semiconductor layers or dielectric layers stacked betweensecond semiconductor layer 226 and seconddielectric layer 228 in an alternating fashion. In some embodiments, including layers 222-228,phase shifter 220 has from 2 to 12 semiconductor/dielectric pairs, collectively referred to as pairs P. If a quantity of pairs P is too small, a sidewall of a subsequently etchedphase shifter 220 will have a notch or have a tapered shape, in some instances. If a quantity of pairs P is too great, a cost ofmanufacturing phase shifter 220 will increase without a significant increase in functionality, in some instances. - In some embodiments,
first semiconductor layer 222,second semiconductor layer 226 and other semiconductor layers withinphase shifter 220, collectively referred to as semiconductor layers S, independently include silicon, germanium, silicon germanium, silicon carbide or another suitable material. In some embodiments, firstdielectric layer 224,second dielectric layer 228 and other dielectric layers withinphase shifter 220, collectively referred to as dielectric layers D, independently include silicon dioxide, silicon nitride, silicon oxynitride or another suitable material. In some embodiments, each layer of dielectric layer D includes a single layer. In some embodiments, each layer of dielectric layers D includes multiple layers, for example, a combination of silicon dioxide and silicon nitride. The quantity of pairs P and the material selected for semiconductor layers S and for dielectric layers D are adjustable based on various parameters required in the photolithography process, such as transmittance, optical density, refractive index or critical dimension (CD) loss. In at least one embodiment where each layer of semiconductor layers S is silicon, each layer of dielectric layer D includes silicon dioxide or silicon nitride. The formation ofphase shifter 220 includes a deposition process, such as ALD or CVD. - In some embodiments, a thickness of each semiconductor layer S independently ranges from about 1 nm to about 5 nm. If the thickness is too small,
phase shifter 220 will suffer more damage during the subsequent clean or etch process, in some instances. If the thickness is too great, a transmittance ofphase shifter 220 will decrease, in some instances. In some embodiments, each of semiconductor layer S has the same thickness. In some embodiments, at least one of semiconductor layer S has a different thickness from another semiconductor layer. In some embodiments, a thickness of each dielectric layer D independently ranges from about 10 nm to about 20 nm. If the thickness of a dielectric layer is too great, a sidewall of the subsequently etchedphase shifter 220 will be irregular, in some instances. If the thickness of a dielectric layer is too small, an optical property ofphase shifter 220 will be hard to control, in some instances. In some embodiments, each of dielectric layer D has the same thickness. In some embodiments, at least one of dielectric layer D has a different thickness from another dielectric layer. In some embodiments, whenphotomask 200 is an attenuated PSM, a total transmission rate incident light ofphase shifter 220 ranges of from about 6% to 18%, in some instances. If the transmission rate is too great or too small, an intensity amplitude of phase-shifted light will be too much or insufficient, so the resolution enhancement of the image to be transferred will decrease, in some instances. Based on the inherent physical property and etching method, semiconductor layers S have a lower etch rate than dielectric layer D. For example, during a dry etch process, because silicon endures greater ion bombardments than silicon dioxide or silicon nitride, silicon has a lower etch rate than silicon dioxide or silicon nitride. Therefore, the sidewall profile is improved because of a multilayer structure with a combination of silicon and silicon dioxide/silicon nitride. In some embodiments, a ratio of etch rates between dielectric layer D and semiconductor layer S ranges from about 1.5 to about 2.5. If the ratio is too great, a loss of dielectric layer D will increase resulting in distortion of the image to be transferred, in some instances. If the ratio is too small, a manufacturing cost ofphotomask 200 will increase, in some instances. - Returning to
FIG. 1A ,method 100A continues withoperation 120 in which a shading layer is deposited over the phase shifter. The shading layer acts as a light absorber in the photomask. In some embodiments, the shading layer includes a metal material. In some embodiments, the shading layer includes a metal material and an oxide material. In some embodiments, the shading layer includes a metal material and a metal oxide gradient. In some embodiments, the metal oxide gradient or a metal is used to reduce reflectivity during the photolithography process. -
FIG. 2B is a cross-sectional view ofphotomask 200 followingoperation 120 in accordance with one or more embodiments. Ashading layer 230, also referred to as an opaque layer, is overphase shifter 220. In some embodiments,shading layer 230 includes chromium, chromium oxide, chromium oxynitride or another suitable material. The formation ofshading layer 230 includes a deposition process, such as sputtering, CVD, physical vapor deposition (PVD), ALD or another suitable process. A thickness ofshading layer 230 is based on various designs of photomasks. In some embodiments, whenphotomask 200 is the attenuated PSM, the thickness ofshading layer 230 ranges from about 40 nm to about 65 nm, in some instances. If the thickness is too great, an intensity of phase-shifted light penetrating throughshading layer 230 decreases, in some instances. If the thickness is too small, a side lobe of the photoresist will be affected by phase-shifted light resulting in distortion of the image to be transferred, in some instances. In some embodiments, whenphotomask 200 is an alternating PSM, the thickness ofshading layer 230 is greater than 100 nm, in some instances. If the thickness is too small, an amount of light absorption will be insufficient, in some instances. Similarly, an ability oflight phase shifter 220 and/orshading layer 230 to absorb or block the passage of light, also referred to as an optical density, is based on various designs of photomasks. For example, for the alternating PSM, the optical density of a combination ofshading layer 230 andphase shifter 220 is greater than 3. If the optical density is too small, the light blockage will be insufficient, in some instances. - Returning to
FIG. 1A ,method 100A continues withoperation 130 in which a first portion of the shading layer and a portion of the phase shifter are removed to expose a portion of the light transmitting substrate. In some embodiments, a first mask layer is formed over the shading layer to define a first pattern. Next, a first portion of the shading layer and a portion of the phase shifter thereunder are removed to expose a portion of the light transmitting substrate. Such formation includes a photolithography and an etch process. In some embodiments, the removal of the first portion of the shading layer and the portion of the phase shifter thereunder uses laser-beam writing to expose the portion of the light transmitting substrate. -
FIG. 2C is a cross-sectional view ofphotomask 200 followingoperation 130 in accordance with one or more embodiments. In some embodiments, a first photoresist is formed and patterned overshading layer 230, followed by an etch process to remove a first portion ofshading layer 230. Next,shading layer 230 is used as a hard mask for a removal of a portion ofphase shifter 220. As a result, a portion oflight transmitting substrate 210 is exposed. Alternatively, the portion ofshading layer 230 and the portion ofphase shifter 220 are removed in the same etch process. In some embodiments, aregion 240 of an exposedlight transmitting substrate 210 s is referred to as a clear tone and aregion 242 ofphase shifter 220 andshading layer 230 is referred to as a dark tone. In some embodiments, afteroperation 130,photomask 200 is referred to as the attenuated PSM. In some embodiments, the etch process includes a dry etching, such as a plasma etching, a wet etching or a combination of the dry etching and the wet etching. In some embodiment where the etch process is a plasma etching, an etchant gas includes a fluorine-containing gas (e.g., CF4, SF6, CH2F2, CHF3, and/or C2F6), chlorine-containing gas (e.g., Cl2, CHCl3, CCl4, and/or BCl3), bromine-containing gas (e.g., HBr and/or CHBR3), or another suitable gases. For example, when the etchant gas is a mixture of SF6 and oxygen, silicon has a relatively lower etch rate than silicon nitride and silicon dioxide. Because semiconductor layer S has a lower etch rate than dielectric layer D, semiconductor layer S acts as an ion-bombardment barrier during the etch process, in some instances. Therefore,photomask 200 has an improved sidewall profile relative to a conventional MoSi phase shifter, which helps to enhance the resolution and reduce CD error during the semiconductor manufacturing. In some embodiments, the removal process uses laser-beam writing. - In some embodiments, under an exposure energy of around 48,000 Joules, compared to layout designed patterns, an undesired CD growth of
photomask 200 is smaller than 0.1 nm and an undesired CD loss ofphotomask 200 is smaller than 0.1 nm. In some embodiments, under an exposure energy of around 8,000 Joules, eachphotomask 200 is able to produce at least 25,000 wafers. -
FIG. 2D is a schematic cross-sectional view ofphotomask 200 in accordance with one or more embodiments. After the removal process, a portion of unetchedfirst semiconductor layer 222, also referred to as aprotrusion 222′, extends from a sidewall offirst semiconductor layer 222 over light transmittingsubstrate 210. In some embodiments,protrusion 222′ has a tapered profile. In some embodiments whereprotrusion 222′ has a tapered profile, a thickness and a width ofprotrusion 222′ ranges from about 0.1 nm to about 1 nm. If the thickness or the width is too great, a contrast betweenclear tone region 240 anddark tone region 242 will decrease, in some instances. If the thickness or the width is too small, a physical resistance during a subsequent clean or etch process will decrease, increasing a risk of collapse ofphase shifter 220, in some embodiments. In some embodiments, each of semiconductor layer S forms a protrusion after the ion bombardment process. Similar to protrusion 222′, each protrusion of semiconductor layer S has a thickness ranging from about 0.1 nm to about 1 nm and a width ranging from about 0.1 nm to about 1 nm. - Returning to
FIG. 1A ,method 100A continues with anoptional operation 140 in which a portion of the light transmitting substrate is removed. In some embodiments, a second mask layer is formed over the shading layer and the exposed portion of the light transmitting substrate to define a second pattern. Next, a portion of the light transmitting substrate is removed to form a recess. Such formation includes a photolithography and an etch process. -
FIG. 2E is a cross-sectional view ofphotomask 200 followingoperation 140 in accordance with one or more embodiments. A second photoresist is formed and patterned overshading layer 230 and exposedlight transmitting substrate 210 s, followed by an etch process to remove a portion oflight transmitting substrate 210. As a result, arecess 250 is formed inlight transmitting substrate 210. In some embodiments, the removal oflight transmitting substrate 210 uses the same process as the removal ofshading layer 230 orphase shifter 220. In some embodiments, the removal oflight transmitting substrate 210 uses a different process from the removal ofshading layer 230 andphase shifter 220. A depth ofrecess 250 is selected based on a refraction index of light transmitting substrate and wavelength of incident light to realize a phase shift. In some embodiment, the depth ofrecess 250 ranges from about 1 nm to about 4 nm. A greater or smaller depth negatively affects a resolution ofphotomask 200, in some instances. In some embodiments, whenphotomask 200 is a tri-tone PSM,recess 250 is referred to as aphase shifting tone 244, exposed portion oflight transmitting substrate 210 s is referred to a clear tone, and a region ofstacked phase shifter 220 andshading layer 230 is referred to as adark tone 246. In some embodiments, according to different manufacturing requirements,shading layer 230 is partially or completely removed. In some embodiments,protrusion 222′ (best seen inFIG. 2D ) is at a sidewall ofrecess 250.Protrusion 222′ has a sufficiently small roughness to avoid impacting the resolution ofphotomask 200. -
FIG. 3 is a cross-sectional view of aphotomask 300 in accordance with one or more embodiments.Photomask 300 is similar tophotomask 200, like elements have a same reference number increased by 100. In contrast withphotomask 200, ashading layer 330 is between alight transmitting substrate 310 and aphase shifter 320. In some embodiments, the formation ofshading layer 330 andphase shifter 320 is the same as the formation ofshading layer 230 andphase shifter 220.Photomask 300 is formed by adjusting an order of operations inmethod 100A, in some embodiments. For example,operation 120 is performed prior tooperation 110. -
FIG. 4 is a cross-sectional view of aphotomask 400 in accordance with one or more embodiments.Photomask 400 is similar tophotomask 200, like elements have a same reference number increased by 200. In contrast with photomask 200 (best see inFIG. 2E ), ashading layer 430 is between alight transmitting substrate 410 and aphase shifter 420. Similar tophotomask 200, arecess 450 is formed inlight transmitting substrate 410 to form a tri-tone PSM, in some instances. In some embodiments, the formation ofrecess 450 is the same as the formation ofrecess 250. In some embodiments,recess 450 is referred to a phase shiftingtone region 444, unetchedlight transmitting substrate 410 s is referred to aclear tone region 440, and a region ofstacked phase shifter 420 andshading layer 430 is referred to as adark tone region 446. - One of ordinary skill in the art would understand that photomasks 200-400 will undergo further processing to complete fabrication. For example, in at least one embodiment, a third mask layer is formed over the photomask to define a third pattern. As another example, a passivation layer is optionally deposited over photomasks 200-400 after
operation - The insertion of semiconductor layers with a relatively lower etch rate than dielectric layers helps keep a sidewall profile of phase shifter, resulting in an improved CD pattern during the photolithography process. In addition, a transmittance of the phase shifter is adjustable by various combinations of the semiconductor layer and dielectric layer. Further, comparing to molybdenum silicide-based material, the semiconductor layer, such as silicon, and the dielectric layer, such as silicon dioxide, help reduce CD increase caused by oxidation and reduce a risk of haze caused during clean process. Moreover, an un-etched protrusion of the bottom semiconductor layer enhances a damage resistance caused by a wet clean process, resulting in a reduced manufacturing cost and production yield.
- One aspect of this description relates to a method of fabricating a photomask. The method includes depositing a phase shifter over a light transmitting substrate, depositing a shading layer over the light transmitting substrate, and removing a portion of the shading layer and a portion of the phase shifter to expose a portion of the light transmitting substrate. The phase shifter having at least two semiconductor layers and at least two dielectric layers.
- Another aspect of this description relates to a method of fabricating a reticle. The method includes depositing a bottom silicon layer over a transparent substrate, depositing at least one silicon/dielectric pair over the bottom silicon layer, depositing a top dielectric layer over the at least one silicon/dielectric pair, depositing an opaque layer over the top dielectric layer, and removing a portion of the opaque layer, a portion of the top dielectric layer, a portion of the at least one silicon/dielectric pair and the bottom silicon layer to expose a portion of the transparent substrate.
- Still another aspect of this description relates to a PSM. The PSM includes a light transmitting substrate, and a phase shifter over the light transmitting substrate. The phase shifter has from 2 to 12 pairs of semiconductor layers and dielectric layers stacked in an alternating fashion.
- The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (20)
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TW106108047A TW201820023A (en) | 2016-11-29 | 2017-03-10 | Phase shift mask, method of fabricating photomask and method of fabricating reticle |
CN201710156122.3A CN108132578A (en) | 2016-11-29 | 2017-03-16 | Phase shifting mask, the method for making photomask and the method for making mask |
US16/504,831 US10852634B2 (en) | 2016-11-29 | 2019-07-08 | Phase shifter mask |
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