US20180127618A1 - Buffered slurry formulation for cobalt cmp - Google Patents
Buffered slurry formulation for cobalt cmp Download PDFInfo
- Publication number
- US20180127618A1 US20180127618A1 US15/797,685 US201715797685A US2018127618A1 US 20180127618 A1 US20180127618 A1 US 20180127618A1 US 201715797685 A US201715797685 A US 201715797685A US 2018127618 A1 US2018127618 A1 US 2018127618A1
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- US
- United States
- Prior art keywords
- acid
- polishing composition
- tris
- polishing
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 74
- 239000010941 cobalt Substances 0.000 title claims description 29
- 229910017052 cobalt Inorganic materials 0.000 title claims description 29
- 239000002002 slurry Substances 0.000 title description 32
- 238000009472 formulation Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 claims abstract description 89
- 230000003139 buffering effect Effects 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 17
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- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 28
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- 239000007983 Tris buffer Substances 0.000 claims description 17
- OWMVSZAMULFTJU-UHFFFAOYSA-N bis-tris Chemical compound OCCN(CCO)C(CO)(CO)CO OWMVSZAMULFTJU-UHFFFAOYSA-N 0.000 claims description 17
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- 239000000758 substrate Substances 0.000 claims description 8
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- UXFQFBNBSPQBJW-UHFFFAOYSA-N 2-amino-2-methylpropane-1,3-diol Chemical compound OCC(N)(C)CO UXFQFBNBSPQBJW-UHFFFAOYSA-N 0.000 claims description 6
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Definitions
- the present invention relates generally to the field of polishing compositions.
- polishing compositions comprising an abrasive and a buffering material, wherein the buffering material comprises a first component and a second component; the first component comprises a Lewis acid or a Bronsted-Lowry acid; and the second component comprises a compound devoid of a carboxylic acid moiety, with a pKa of about 6 to about 9 and wherein the difference between the pKa and the pH of the polishing composition at point of use is less than 1.
- the abrasive comprises alumina, silica, or a combination thereof.
- the abrasive is present in an amount of about 0.01 wt. % to about 10 wt. %.
- the silica is precipitated silica.
- the first component comprises acetic acid, ADA, bicine, boric acid, citric acid, 5,5-diethylbarbituric acid, EDTA, formic acid, glycine, glycylglycine, lactic acid, maleic acid, malic acid, phosphoric acid, picolinic acid, potassium hydrogen phthalate, potassium hydrogen tartrate, tricine, succinic acid, taurine, or a combination of two or more thereof.
- the first component comprises a di- or tri-carboxylic acid.
- the di- or tri-carboxylic acid is citric acid, malic acid, maleic acid, potassium hydrogen phthalate, potassium hydrogen tartrate, or succinic acid.
- the first component is present in an amount of about 0.01 wt. % to about 1 wt. %.
- the second component comprises ammonia, ACES, AMP, AMPD, AMPSO, BES, Bis-Tris, Bis-Tris-Propane, CAPSO, CHES, diethanolamine, DIPSO, EPPS, ethanolamine, N-ethylmorpholine, HEPBS, HEPES, HEPPSO, L-histidine, hydrazine, imidazole, MES, methylamine, N-methyldiethanolamine, MOBS, MOPS, MOPSO, morpholine, PIPES, piperazine, phosphate salt, POPSO, dihydrogen phosphate salt, potassium hydroxide, pyridine, hydrogen phosphate salt, TABS, TAPS, TAPSO, TEA, TES, Tris, or a combination of two or more thereof.
- the second component comprises Tris, Bis-Tris, CHES, TAPS, TAPSO, HEPES, TES, MOPS, PIPES, or MES. In some embodiments, the second component comprises Tris, Bis-Tris, or CHES. In some embodiments, the second component is present in an amount of about 0.1 wt. % to about 4 wt. %. In some embodiments, the polishing composition further comprises a polishing accelerator. In some embodiments, the polishing accelerator is present in an amount of about 0.1 wt. % to about 10 wt. %. In some embodiments, the polishing accelerator is an amino acid. In some embodiments, the amino acid is glycine.
- the polishing composition further comprises an oxidizer.
- the oxidizer is present in an amount of about 0.1 wt. % to about 4 wt. %.
- the oxidizer is hydrogen peroxide.
- the pH of the polishing composition at point of use is about 6 to about 9.
- the polishing composition further comprises a pH adjustor.
- the pH adjustor is a base.
- the base is potassium hydroxide or ammonium hydroxide.
- the polishing composition is devoid of any corrosion inhibitor.
- the polishing composition is devoid of any triazole-based corrosion inhibitor.
- polishing compositions comprising an abrasive and a buffering material, wherein the pH of the polishing composition is about 6 to about 9.
- the abrasive comprises alumina, silica, or a combination thereof.
- the abrasive is present in an amount of about 0.01 wt. % to about 10 wt. %.
- the silica is precipitated silica.
- the buffering material comprises one or more compounds selected from the group consisting of acetate salt, acetic acid, boric acid, ACES, AMP, AMPD, AMPSO, BES, bicine, Bis-Tris, Bis-Tris-Propane, borate salt, boric acid, cacodylate salt, CAPSO, CHES, citrate salt, citric acid, diethanolamine, 5,5-diethylbarbituric acid, DIPSO, EDTA, EPPS, ethanolamine, N-ethylmorpholine, formate salt, formic acid, glycine, glycylglycine, HEPBS, HEPES, HEPPSO, L-histidine, hydrazine, imidazole, lactic acid, malate salt, maleate salt, maleic acid, malic acid, MES, methylamine, N-methyldiethanolamine, MOBS, MOPS, MOPSO, morpholine, PIPES, piperazine, phosphate salt
- the buffering material is present in an amount of about 0.01 wt. % to about 4 wt. %.
- the polishing composition further comprises a polishing accelerator. In some embodiments, the polishing accelerator is present in an amount of about 0.1 wt. % to about 10 wt. %.
- the polishing accelerator is an amino acid. In some embodiments, the amino acid is glycine.
- the polishing composition further comprises an oxidizer. In some embodiments, the oxidizer is present in an amount of about 0.1 wt. % to about 4 wt. %. In some embodiments, the oxidizer is hydrogen peroxide.
- the pH of the polishing composition at point of use is about 6 to about 9.
- the polishing composition further comprises a pH adjustor.
- the pH adjustor is a base.
- the base is potassium hydroxide or ammonium hydroxide.
- the polishing composition is devoid of any corrosion inhibitor. In some embodiments, the polishing composition is devoid of any triazole-based corrosion inhibitor.
- methods of cobalt chemical-mechanical polishing comprising applying a polishing composition disclosed herein to a substrate comprising cobalt.
- a polishing composition disclosed herein for cobalt chemical-mechanical polishing is disclosed herein for cobalt chemical-mechanical polishing.
- provided herein are methods of stabilizing the cobalt removal rate in a chemical-mechanical polishing process for a substrate comprising cobalt, the method comprising applying a polishing composition disclosed herein to the substrate.
- FIG. 1 depicts the changes in pH and cobalt removal rate during a 7-day pot life study of a comparative polishing slurry.
- FIG. 2 depicts the changes in cobalt removal rate during a 7-day pot life study of the slurry of FIG. 1 with an analogous slurry wherein hydrogen peroxide is added only immediately before use (i.e., polishing).
- FIG. 3 depicts the changes in pH during a 7-day pot life study of the slurry of FIG. 1 with an analogous slurry wherein hydrogen peroxide is added only immediately before use (i.e., polishing).
- FIG. 4 depicts a 7-day pot life study and effects on pH and cobalt removal rate of a non-limiting example of a polishing composition disclosed herein.
- FIG. 5 depicts a 7-day pot life study and total inorganic cobalt concentration of the polishing composition of FIG. 4 .
- FIG. 6 depicts a 7-day pot life study and effects on cobalt removal rate of non-limiting examples of a polishing composition disclosed herein.
- polishing compositions for cobalt chemical-mechanical polishing CMP
- the polishing compositions described herein exhibit more stabilized pH than previously disclosed polishing compositions.
- the polishing compositions described herein exhibit more stabilized cobalt removal rate than previously disclosed polishing compositions.
- the polishing compositions described herein exhibit more stabilized pH as well as more stabilized cobalt removal rate than previously disclosed polishing compositions.
- the polishing compositions described herein exhibit better shelf life than previously reported polishing compositions.
- polishing compositions comprising an abrasive and a buffering material, wherein the pH of the polishing composition is about 6 to about 9.
- polishing compositions comprising an abrasive and a buffering material, wherein the buffering material comprises a first component and a second component; the first component comprises a Lewis acid or a Bronsted-Lowry acid; and the second component comprises a compound devoid of a carboxylic acid moiety, with a pKa of about 6 to about 9 and wherein the difference between the pKa and the pH of the polishing composition at point of use is less than 1.
- the polishing composition comprises an abrasive and a buffering material, wherein the buffering material comprises malic acid and Tris.
- the polishing composition comprises an abrasive and a buffering material, wherein the buffering material comprises malic acid and Bis-Tris. In some embodiments, the polishing composition comprises an abrasive and a buffering material, wherein the buffering material comprises malic acid and CHES. In further embodiments, the abrasive comprises precipitated silica.
- abrasives include, but are not limited to alumina, silica, or combinations thereof.
- Silica includes precipitated silica, also typically called colloidal silica.
- the abrasive is present in an amount of about 0.01 wt. % to about 10 wt. %. This includes amounts of about 0.01 wt. % to about 8 wt. %, about 0.01 wt. % to about 5 wt. %, about 0.01 wt. % to about 3 wt. %, about 0.01 wt. % to about 1 wt. %, about 0.05 wt. % to about 10 wt. %, about 0.05 wt. % to about 8 wt. %, about 0.05 wt. % to about 5 wt. %, about 0.05 wt. % to about 3 wt.
- % about 0.05 wt. % to about 1 wt. %, about 0.1 wt. % to about 10 wt. %, about 0.1 wt. % to about 8 wt. %, about 0.1 wt. % to about 5 wt. %, about 0.1 wt. % to about 3 wt. %, about 0.1 wt. % to about 1 wt. %, about 0.5 wt. % to about 10 wt. %, about 0.5 wt. % to about 8 wt. %, about 0.5 wt. % to about 5 wt. %, about 0.5 wt. % to about 3 wt.
- the abrasive is present in an amount of at least about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, or 10 wt. %, including increments therein.
- the abrasive is present in an amount of about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, or 10 wt. %, including increments therein.
- the buffering material comprises a first component and a second component.
- Illustrative first components include, but are not limited to, ADA (N-(2-acetamido)-iminodiacetic acid), acetic acid, bicine (N,N-bis(2-hydroxyethyl)glycine), boric acid, citric acid, 5,5-diethylbarbituric acid, EDTA, formic acid, glycine, glycylglycine, lactic acid, maleic acid, malic acid, phosphoric acid, picolinic acid, potassium hydrogen phthalate, potassium hydrogen tartrate, tricine (N-tris(hydroxymethyl)methylglycine), succinic acid, taurine, or a combination of two or more thereof.
- ADA N-(2-acetamido)-iminodiacetic acid
- acetic acid acetic acid
- bicine N,N-bis(2-hydroxyethyl)glycine
- boric acid citric acid
- 5,5-diethylbarbituric acid EDTA
- formic acid
- the first component comprises a di- or tri-carboxylic acid.
- the di- or tri-carboxylic acid is selected from the group consisting of citric acid, malic acid, maleic acid, potassium hydrogen phthalate, potassium hydrogen tartrate, succinic acid, or a combination of any two or more thereof.
- the first component comprises malic acid.
- the first component is present in an amount of about 0.01 wt. % to about 1 wt. %. This includes about 0.03 wt. % to about 1 wt. %, about 0.05 wt. % to about 1 wt. %, about 0.07 wt. % to about 1 wt. %, about 0.1 wt. % to about 1 wt. %, about 0.15 wt. % to about 1 wt. %, about 0.2 wt. % to about 1 wt. %, about 0.25 wt. % to about 1 wt. %, about 0.3 wt. % to about 1 wt.
- the first component is present in an amount of at least about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, or 1 wt. %, including increments therein.
- the first component is present in an amount of about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, or 1 wt. %, including increments therein.
- Illustrative second components include, but are not limited to, ammonia, ACES (N-(2-acetamido)-aminoethanesulfonic acid), AMP (2-amino-2-methyl-1-propanol), AMPD (2-amino-2-methyl-1,3-propanediol), AMPSO (N-(1,1-dimethyl-2-hydroxyethyl)-3-amino-2-hydroxypropanesulfonic acid), BES (N,N-bis-(2-hydroxyethyl)-2-aminoethanesulfonic acid), Bis-Tris ([bis-(2-hydroxyethyl)-imino]-tris-(hydroxymethylmethane)), Bis-Tris-Propane (1,3-bis[tris(hydroxymethyl)-methylamino]propane), CAPSO (3-(cyclohexylamino)-2-hydroxy-1-propanesulfonic acid), CHES (cyclohexylamino
- the second component comprises Tris, Bis-Tris, CHES, TAPS, TAPSO, HEPES, TES, MOPS, PIPES, or IVIES. In some embodiments, the second component comprises Tris, Bis-Tris, or CHES. In some embodiments, the second component comprises Tris. In some embodiments, the second component comprises Bis-Tris. In some embodiments, the second component comprises CHES.
- the second component is present in an amount of about 0.1 wt. % to about 4 wt. %. This includes about 0.3 wt. % to about 3 wt. %, about 0.5 wt. % to about 3 wt. %, about 0.7 wt. % to about 3 wt. %, about 1 wt. % to about 3 wt. %, about 2 wt. % to about 3 wt. %, about 0.1 wt. % to about 2 wt. %, about 0.1 wt. % to about 3 wt. %, 0.3 wt. % to about 2 wt. %, about 0.5 wt.
- % to about 2 wt. % about 0.7 wt. % to about 2 wt. %, about 1 wt. % to about 2 wt. %, about 0.1 wt. % to about 1 wt. %, 0.3 wt. % to about 1 wt. %, about 0.5 wt. % to about 1 wt. %, or about 0.7 wt. % to about 1 wt. %.
- the second component is present in an amount of at least about 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6. 3.7, 3.8, 3.9, or 4.0 wt. %, including increments therein.
- the second component is present in an amount of about 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6. 3.7, 3.8, 3.9, or 4.0 wt. %, including increments therein.
- the first component comprises a Lewis acid or a Bronsted-Lowry acid
- the second component comprises a compound devoid of a carboxylic acid moiety, with a pKa of about 6 to about 9.
- the first component comprises malic acid and the second component comprises Tris.
- the first component comprises malic acid and the second component comprises Bis-Tris.
- the first component comprises malic acid and the second component comprises CHES.
- the buffering material comprises one or more compounds selected from the group consisting of acetate salt, acetic acid, boric acid, ACES, AMP, AMPD, AMPSO, BES, bicine, Bis-Tris, Bis-Tris-Propane, borate salt, boric acid, cacodylate salt, CAPSO, CHES, citrate salt, citric acid, diethanolamine, 5,5-diethylbarbituric acid, DIPSO, EDTA, EPPS, ethanolamine, N-ethylmorpholine, formate salt, formic acid, glycine, glycylglycine, HEPBS, HEPES, HEPPSO, L-histidine, hydrazine, imidazole, lactic acid, malate salt, maleate salt, maleic acid, malic acid, MES, methylamine, N-methyldiethanolamine, MOBS, MOPS, MOPSO, morpholine, PIPES, piperazine, phosphate salt
- the buffering material is present in an amount of about 0.01 wt. % to about 4 wt. %. This includes about 0.01 wt. % to about 3 wt. %, about 0.03 wt. % to about 3 wt. %, about 0.05 wt. % to about 3 wt. %, about 0.07 wt. % to about 3 wt. %, about 0.1 wt. % to about 3 wt. %, about 0.2 wt. % to about 3 wt. %, about 0.3 wt. % to about 3 wt. %, about 0.4 wt. % to about 3 wt.
- wt. % about 1.5 wt. % to about 3 wt. %, about 1.6 wt. % to about 3 wt. %, about 1.7 wt. % to about 3 wt. %, about 1.8 wt. % to about 3 wt. %, about 1.9 wt. % to about 3 wt. %, about 2 wt. % to about 3 wt. %, about 2.1 wt. % to about 3 wt. %, about 2.2 wt. % to about 3 wt. %, about 2.3 wt. % to about 3 wt. %, about 2.4 wt. % to about 3 wt.
- wt. % about 0.3 wt. % to about 2 wt. %, about 0.4 wt. % to about 2 wt. %, about 0.5 wt. % to about 2 wt. %, about 0.6 wt. % to about 2 wt. %, about 0.7 wt. % to about 3 wt. %, about 0.8 wt. % to about 2 wt. %, about 0.9 wt. % to about 2 wt. %, about 1 wt. % to about 2 wt. %, about 1.1 wt. % to about 2 wt. %, about 1.2 wt. % to about 2 wt.
- wt. % about 1.3 wt. % to about 2 wt. %, about 1.4 wt. % to about 2 wt. %, about 1.5 wt. % to about 2 wt. %, about 1.6 wt. % to about 2 wt. %, about 1.7 wt. % to about 2 wt. %, about 1.8 wt. % to about 2 wt. %, about 1.9 wt. % to about 2 wt. %, about 0.01 wt. % to about 1 wt. %, about 0.03 wt. % to about 1 wt. %, 0.05 wt. % to about 1 wt.
- % 0.07 wt. % to about 1 wt. %, 0.1 wt. % to about 1 wt. %, 0.15 wt. % to about 1 wt. %, 0.2 wt. % to about 1 wt. %, 0.25 wt. % to about 1 wt. %, 0.3 wt. % to about 1 wt. %, 0.35 wt. % to about 1 wt. %, 0.4 wt. % to about 1 wt. %, 0.45 wt. % to about 1 wt. %, 0.5 wt. % to about 1 wt. %, 0.55 wt.
- % to about 1 wt. % 0.6 wt. % to about 1 wt. %, 0.65 wt. % to about 1 wt. %, 0.7 wt. % to about 1 wt. %, 0.75 wt. % to about 1 wt. %, 0.8 wt. % to about 1 wt. %, 0.85 wt. % to about 1 wt. %, about 0.03 wt. % to about 0.75 wt. %, about 0.05 wt. % to about 0.75 wt. %, about 0.07 wt. % to about 0.75 wt. %, about 0.1 wt.
- % to about 0.75 wt. % about 0.15 wt. % to about 0.75 wt. %, about 0.2 wt. % to about 0.75 wt. %, about 0.25 wt. % to about 0.75 wt. %, about 0.3 wt. % to about 0.75 wt. %, about 0.35 wt. % to about 0.75 wt. %, about 0.4 wt. % to about 0.75 wt. %, about 0.45 wt. % to about 0.75 wt. %, or about 0.5 wt. % to about 0.75 wt. %.
- the buffering material is present in an amount of at least about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6. 3.7, 3.8, or 3.9 wt. %, including increments therein.
- the buffering material is present in an amount of about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6. 3.7, 3.8, 3.9, or 4.0 wt. %, including increments therein.
- the polishing composition further comprises a polishing accelerator.
- the polishing accelerator is present in an amount of about 0.1 wt. % to about 10 wt. %. This includes about 0.1 wt. % to about 9 wt. %, about 0.1 wt. % to about 8 wt. %, about 0.1 wt. % to about 7 wt. %, about 0.1 wt. % to about 6 wt. %, about 0.1 wt. % to about 5 wt. %, about 0.1 wt. % to about 4 wt. %, about 0.1 wt. % to about 3 wt.
- % about 0.1 wt. % to about 2 wt. %, about 0.1 wt. % to about 1 wt. %, about 0.1 wt. % to about 0.8 wt. %, about 0.1 wt. % to about 0.5 wt. %, about 0.5 wt. % to about 10 wt. %, about 0.5 wt. % to about 9 wt. %, about 0.5 wt. % to about 8 wt. %, about 0.5 wt. % to about 7 wt. %, about 0.5 wt. % to about 6 wt. %, about 0.5 wt. % to about 5 wt.
- % about 0.5 wt. % to about 4 wt. %, about 0.5 wt. % to about 3 wt. %, about 0.5 wt. % to about 2 wt. %, about 0.5 wt. % to about 1 wt. %, about 0.5 wt. % to about 0.8 wt. %, about 1 wt. % to about 10 wt. %, about 1 wt. % to about 9 wt. %, about 1 wt. % to about 8 wt. %, about 1 wt. % to about 7 wt. %, about 1 wt. % to about 6 wt.
- the polishing accelerator is present in an amount of at least about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5.0, 5.5, 6.0, 6.5, 7.0, 7.5, 8.0, 8.5, 9.0, 9.5, or 10.0 wt. %, including increments therein.
- the polishing accelerator is present in an amount of about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5.0, 5.5, 6.0, 6.5, 7.0, 7.5, 8.0, 8.5, 9.0, 9.5, or 10.0 wt. %, including increments therein.
- the polishing accelerator is an amino acid.
- the amino acid is glycine.
- the polishing composition further comprises an oxidizer.
- the oxidizer is present in an amount of about 0.1 wt. % to about 4 wt. %. This includes about 0.3 wt. % to about 4 wt. %, about 0.5 wt. % to about 4 wt. %, about 0.7 wt. % to about 4 wt. %, about 1 wt. % to about 4 wt. %, about 2 wt. % to about 4 wt. %, about 3 wt. % to about 4 wt. %, about 0.1 wt. % to about 3 wt. %, about 0.3 wt.
- % to about 3 wt. % about 0.5 wt. % to about 3 wt. %, about 0.7 wt. % to about 3 wt. %, about 1 wt. % to about 3 wt. %, about 2 wt. % to about 3 wt. %, about 0.1 wt. % to about 2 wt. %, 0.3 wt. % to about 2 wt. %, about 0.5 wt. % to about 2 wt. %, about 0.7 wt. % to about 2 wt. %, about 1 wt. % to about 2 wt. %, about 0.1 wt.
- the oxidizer is present in an amount of at least about 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, or 4 wt. %, including increments therein.
- the oxidizer is present in an amount of about 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, or 4 wt. %, including increments therein.
- the oxidizer is hydrogen peroxide.
- the pH of the polishing composition at point of use is about 6 to about 9. This includes a pH of about 6 to about 8, about 6 to about 7, about 7 to about 9, about 7 to about 8, or about 8 to about 9.
- the pH of the polishing composition may be adjusted during preparation of the raw slurry by adding a pH adjustor.
- the pH adjustor is a base.
- the base is potassium hydroxide or ammonium hydroxide.
- the base is potassium hydroxide.
- the base is ammonium hydroxide.
- the pH adjustor is an acid.
- the polishing composition is devoid of any triazole-based corrosion inhibitor. In some embodiments, the polishing composition is devoid of any corrosion inhibitor.
- CMP cobalt chemical-mechanical polishing
- polishing composition as described herein for cobalt CMP.
- a polishing composition described herein the substrate is a wafer.
- cobalt is located on an outer layer of the wafer.
- the polishing composition removes cobalt but does not remove silicon-containing dielectric (e.g., SiO 2 , SiN, SiC, SiOC, SiCN).
- the wafer comprises one or more adhesion and/or barrier layers containing one or more of titanium nitride (TiN), tantalum nitride (TaN), Ti, and Ta, located between the cobalt layer and the interlayered dielectric (ILD).
- TiN titanium nitride
- TaN tantalum nitride
- Ti titanium
- TaN tantalum nitride
- Ti titanium
- Ta tantalum nitride
- Ta located between the cobalt layer and the interlayered dielectric
- one or more adhesion and/or barrier layers are left intact after the CMP process.
- a glycine-based slurry A (Table 1) was examined in a pot life study in ambient air environment ( FIG. 1 ).
- Slurry A was mixed with deionized water and hydrogen peroxide at day 0 (bench top polisher; 250 rpm platen rotation speed; 90 mL/min slurry flow rate; 0.68% H 2 O 2 ; Fujibo H7000 pad; dilution factor: 3.3 ⁇ ).
- a pH drop as well as a cobalt removal rate increase was observed after 7 days.
- the comparative slurry A was further examined under conditions with or without a nitrogen purge.
- the pot life study conducted under a nitrogen atmosphere exhibited minimal pH change and maintained its cobalt removal rate. Without being bound to any one particular theory, it is believed that the carbon dioxide in air dissolves in the composition and decreases the pH during the pot life.
- Slurry A (as described in Example 1), but further comprising malic acid and Tris (pKa of 8.06 at 25° C.), was prepared (Table 1) and examined. As concentration of the buffering material increased, less change in cobalt removal rate was observed ( FIG. 4 ). The concentration of total inorganic carbon (TIC) was also examined ( FIG. 5 ) for this buffering material-containing slurry A and the slurries from FIGS. 2 and 3 .
- TIC total inorganic carbon
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Abstract
Description
- This application claims the benefit of and priority to U.S. Provisional Patent Application No. 62/419,356, filed Nov. 8, 2016, which is hereby expressly incorporated by reference in its entirety.
- The present invention relates generally to the field of polishing compositions.
- In one aspect, provided herein are polishing compositions comprising an abrasive and a buffering material, wherein the buffering material comprises a first component and a second component; the first component comprises a Lewis acid or a Bronsted-Lowry acid; and the second component comprises a compound devoid of a carboxylic acid moiety, with a pKa of about 6 to about 9 and wherein the difference between the pKa and the pH of the polishing composition at point of use is less than 1. In some embodiments, the abrasive comprises alumina, silica, or a combination thereof. In some embodiments, the abrasive is present in an amount of about 0.01 wt. % to about 10 wt. %. In some embodiments, the silica is precipitated silica. In some embodiments, the first component comprises acetic acid, ADA, bicine, boric acid, citric acid, 5,5-diethylbarbituric acid, EDTA, formic acid, glycine, glycylglycine, lactic acid, maleic acid, malic acid, phosphoric acid, picolinic acid, potassium hydrogen phthalate, potassium hydrogen tartrate, tricine, succinic acid, taurine, or a combination of two or more thereof. In some embodiments, the first component comprises a di- or tri-carboxylic acid. In some embodiments, the di- or tri-carboxylic acid is citric acid, malic acid, maleic acid, potassium hydrogen phthalate, potassium hydrogen tartrate, or succinic acid. In some embodiments, the first component is present in an amount of about 0.01 wt. % to about 1 wt. %. In some embodiments, the second component comprises ammonia, ACES, AMP, AMPD, AMPSO, BES, Bis-Tris, Bis-Tris-Propane, CAPSO, CHES, diethanolamine, DIPSO, EPPS, ethanolamine, N-ethylmorpholine, HEPBS, HEPES, HEPPSO, L-histidine, hydrazine, imidazole, MES, methylamine, N-methyldiethanolamine, MOBS, MOPS, MOPSO, morpholine, PIPES, piperazine, phosphate salt, POPSO, dihydrogen phosphate salt, potassium hydroxide, pyridine, hydrogen phosphate salt, TABS, TAPS, TAPSO, TEA, TES, Tris, or a combination of two or more thereof. In some embodiments, the second component comprises Tris, Bis-Tris, CHES, TAPS, TAPSO, HEPES, TES, MOPS, PIPES, or MES. In some embodiments, the second component comprises Tris, Bis-Tris, or CHES. In some embodiments, the second component is present in an amount of about 0.1 wt. % to about 4 wt. %. In some embodiments, the polishing composition further comprises a polishing accelerator. In some embodiments, the polishing accelerator is present in an amount of about 0.1 wt. % to about 10 wt. %. In some embodiments, the polishing accelerator is an amino acid. In some embodiments, the amino acid is glycine. In some embodiments, the polishing composition further comprises an oxidizer. In some embodiments, the oxidizer is present in an amount of about 0.1 wt. % to about 4 wt. %. In some embodiments, the oxidizer is hydrogen peroxide. In some embodiments, the pH of the polishing composition at point of use is about 6 to about 9. In some embodiments, the polishing composition further comprises a pH adjustor. In some embodiments, the pH adjustor is a base. In some embodiments, the base is potassium hydroxide or ammonium hydroxide. In some embodiments, the polishing composition is devoid of any corrosion inhibitor. In some embodiments, the polishing composition is devoid of any triazole-based corrosion inhibitor.
- In another aspect, provided herein are polishing compositions comprising an abrasive and a buffering material, wherein the pH of the polishing composition is about 6 to about 9. In some embodiments, the abrasive comprises alumina, silica, or a combination thereof. In some embodiments, the abrasive is present in an amount of about 0.01 wt. % to about 10 wt. %. In some embodiments, the silica is precipitated silica. In some embodiments, the buffering material comprises one or more compounds selected from the group consisting of acetate salt, acetic acid, boric acid, ACES, AMP, AMPD, AMPSO, BES, bicine, Bis-Tris, Bis-Tris-Propane, borate salt, boric acid, cacodylate salt, CAPSO, CHES, citrate salt, citric acid, diethanolamine, 5,5-diethylbarbituric acid, DIPSO, EDTA, EPPS, ethanolamine, N-ethylmorpholine, formate salt, formic acid, glycine, glycylglycine, HEPBS, HEPES, HEPPSO, L-histidine, hydrazine, imidazole, lactic acid, malate salt, maleate salt, maleic acid, malic acid, MES, methylamine, N-methyldiethanolamine, MOBS, MOPS, MOPSO, morpholine, PIPES, piperazine, phosphate salt, phosphoric acid, picolinic acid, POPSO, dihydrogen phosphate salt, potassium hydrogen phthalate, potassium hydrogen tartrate, potassium hydroxide, propionate, pyridine, hydrogen phosphate salt, sodium tetraborate decahydrate, TABS, TAPS, TAPSO, TEA, TES, tetraoxalate, tricine, trimethylamine, Tris, succinate salt, succinic acid, and taurine. In some embodiments, the buffering material is present in an amount of about 0.01 wt. % to about 4 wt. %. In some embodiments, the polishing composition further comprises a polishing accelerator. In some embodiments, the polishing accelerator is present in an amount of about 0.1 wt. % to about 10 wt. %. In some embodiments, the polishing accelerator is an amino acid. In some embodiments, the amino acid is glycine. In some embodiments, the polishing composition further comprises an oxidizer. In some embodiments, the oxidizer is present in an amount of about 0.1 wt. % to about 4 wt. %. In some embodiments, the oxidizer is hydrogen peroxide. In some embodiments, the pH of the polishing composition at point of use is about 6 to about 9. In some embodiments, the polishing composition further comprises a pH adjustor. In some embodiments, the pH adjustor is a base. In some embodiments, the base is potassium hydroxide or ammonium hydroxide. In some embodiments, the polishing composition is devoid of any corrosion inhibitor. In some embodiments, the polishing composition is devoid of any triazole-based corrosion inhibitor.
- In another aspect, provided herein are methods of cobalt chemical-mechanical polishing comprising applying a polishing composition disclosed herein to a substrate comprising cobalt.
- In another aspect, provided herein are uses of a polishing composition disclosed herein for cobalt chemical-mechanical polishing.
- In another aspect, provided herein are methods of stabilizing the cobalt removal rate in a chemical-mechanical polishing process for a substrate comprising cobalt, the method comprising applying a polishing composition disclosed herein to the substrate.
-
FIG. 1 depicts the changes in pH and cobalt removal rate during a 7-day pot life study of a comparative polishing slurry. -
FIG. 2 depicts the changes in cobalt removal rate during a 7-day pot life study of the slurry ofFIG. 1 with an analogous slurry wherein hydrogen peroxide is added only immediately before use (i.e., polishing). -
FIG. 3 depicts the changes in pH during a 7-day pot life study of the slurry ofFIG. 1 with an analogous slurry wherein hydrogen peroxide is added only immediately before use (i.e., polishing). -
FIG. 4 depicts a 7-day pot life study and effects on pH and cobalt removal rate of a non-limiting example of a polishing composition disclosed herein. -
FIG. 5 depicts a 7-day pot life study and total inorganic cobalt concentration of the polishing composition ofFIG. 4 . -
FIG. 6 depicts a 7-day pot life study and effects on cobalt removal rate of non-limiting examples of a polishing composition disclosed herein. - Various embodiments are described hereinafter. It should be noted that the specific embodiments are not intended as an exhaustive description or as a limitation to the broader aspects discussed herein. One aspect described in conjunction with a particular embodiment is not necessarily limited to that embodiment and can be practiced with any other embodiment(s).
- As used herein, “about” will be understood by persons of ordinary skill in the art and will vary to some extent depending upon the context in which it is used. If there are uses of the term which are not clear to persons of ordinary skill in the art, given the context in which it is used, “about” will mean up to plus or minus 10% of the particular term.
- The use of the terms “a” and “an” and “the” and similar referents in the context of describing the elements (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. Recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., “such as”) provided herein, is intended merely to better illuminate the embodiments and does not pose a limitation on the scope of the claims unless otherwise stated. No language in the specification should be construed as indicating any non-claimed element as essential.
- Provided herein, in one aspect, are polishing compositions for cobalt chemical-mechanical polishing (CMP). In some embodiments, the polishing compositions described herein exhibit more stabilized pH than previously disclosed polishing compositions. In some embodiments, the polishing compositions described herein exhibit more stabilized cobalt removal rate than previously disclosed polishing compositions. In some embodiments, the polishing compositions described herein exhibit more stabilized pH as well as more stabilized cobalt removal rate than previously disclosed polishing compositions. In further embodiments, the polishing compositions described herein exhibit better shelf life than previously reported polishing compositions.
- Also provided herein, in another aspect, are polishing compositions comprising an abrasive and a buffering material, wherein the pH of the polishing composition is about 6 to about 9.
- Also provided herein, in another aspect, are polishing compositions comprising an abrasive and a buffering material, wherein the buffering material comprises a first component and a second component; the first component comprises a Lewis acid or a Bronsted-Lowry acid; and the second component comprises a compound devoid of a carboxylic acid moiety, with a pKa of about 6 to about 9 and wherein the difference between the pKa and the pH of the polishing composition at point of use is less than 1. In some embodiments, the polishing composition comprises an abrasive and a buffering material, wherein the buffering material comprises malic acid and Tris. In some embodiments, the polishing composition comprises an abrasive and a buffering material, wherein the buffering material comprises malic acid and Bis-Tris. In some embodiments, the polishing composition comprises an abrasive and a buffering material, wherein the buffering material comprises malic acid and CHES. In further embodiments, the abrasive comprises precipitated silica.
- Examples of abrasives include, but are not limited to alumina, silica, or combinations thereof. Silica includes precipitated silica, also typically called colloidal silica.
- In some embodiments, the abrasive is present in an amount of about 0.01 wt. % to about 10 wt. %. This includes amounts of about 0.01 wt. % to about 8 wt. %, about 0.01 wt. % to about 5 wt. %, about 0.01 wt. % to about 3 wt. %, about 0.01 wt. % to about 1 wt. %, about 0.05 wt. % to about 10 wt. %, about 0.05 wt. % to about 8 wt. %, about 0.05 wt. % to about 5 wt. %, about 0.05 wt. % to about 3 wt. %, about 0.05 wt. % to about 1 wt. %, about 0.1 wt. % to about 10 wt. %, about 0.1 wt. % to about 8 wt. %, about 0.1 wt. % to about 5 wt. %, about 0.1 wt. % to about 3 wt. %, about 0.1 wt. % to about 1 wt. %, about 0.5 wt. % to about 10 wt. %, about 0.5 wt. % to about 8 wt. %, about 0.5 wt. % to about 5 wt. %, about 0.5 wt. % to about 3 wt. %, about 0.5 wt. % to about 1 wt. %, about 1 wt. % to about 10 wt. %, about 1 wt. % to about 8 wt. %, about 1 wt. % to about 5 wt. %, or about 1 wt. % to about 3 wt. %. In some embodiments, the abrasive is present in an amount of at least about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, or 10 wt. %, including increments therein. In some embodiments, the abrasive is present in an amount of about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, or 10 wt. %, including increments therein.
- In some embodiments, the buffering material comprises a first component and a second component.
- Illustrative first components include, but are not limited to, ADA (N-(2-acetamido)-iminodiacetic acid), acetic acid, bicine (N,N-bis(2-hydroxyethyl)glycine), boric acid, citric acid, 5,5-diethylbarbituric acid, EDTA, formic acid, glycine, glycylglycine, lactic acid, maleic acid, malic acid, phosphoric acid, picolinic acid, potassium hydrogen phthalate, potassium hydrogen tartrate, tricine (N-tris(hydroxymethyl)methylglycine), succinic acid, taurine, or a combination of two or more thereof. In some embodiments, the first component comprises a di- or tri-carboxylic acid. In further embodiments, the di- or tri-carboxylic acid is selected from the group consisting of citric acid, malic acid, maleic acid, potassium hydrogen phthalate, potassium hydrogen tartrate, succinic acid, or a combination of any two or more thereof. In some embodiments, the first component comprises malic acid.
- In some embodiments, the first component is present in an amount of about 0.01 wt. % to about 1 wt. %. This includes about 0.03 wt. % to about 1 wt. %, about 0.05 wt. % to about 1 wt. %, about 0.07 wt. % to about 1 wt. %, about 0.1 wt. % to about 1 wt. %, about 0.15 wt. % to about 1 wt. %, about 0.2 wt. % to about 1 wt. %, about 0.25 wt. % to about 1 wt. %, about 0.3 wt. % to about 1 wt. %, about 0.35 wt. % to about 1 wt. %, about 0.4 wt. % to about 1 wt. %, about 0.45 wt. % to about 1 wt. %, about 0.5 wt. % to about 1 wt. %, about 0.55 wt. % to about 1 wt. %, about 0.6 wt. % to about 1 wt. %, about 0.65 wt. % to about 1 wt. %, about 0.7 wt. % to about 1 wt. %, about 0.75 wt. % to about 1 wt. %, about 0.8 wt. % to about 1 wt. %, about 0.85 wt. % to about 1 wt. %, about 0.03 wt. % to about 0.75 wt. %, about 0.05 wt. % to about 0.75 wt. %, about 0.07 wt. % to about 0.75 wt. %, about 0.1 wt. % to about 0.75 wt. %, about 0.15 wt. % to about 0.75 wt. %, about 0.2 wt. % to about 0.75 wt. %, about 0.25 wt. % to about 0.75 wt. %, about 0.3 wt. % to about 0.75 wt. %, about 0.35 wt. % to about 0.75 wt. %, about 0.4 wt. % to about 0.75 wt. %, about 0.45 wt. % to about 0.75 wt. %, or about 0.5 wt. % to about 0.75 wt. %. In some embodiments, the first component is present in an amount of at least about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, or 1 wt. %, including increments therein. In some embodiments, the first component is present in an amount of about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, or 1 wt. %, including increments therein.
- Illustrative second components include, but are not limited to, ammonia, ACES (N-(2-acetamido)-aminoethanesulfonic acid), AMP (2-amino-2-methyl-1-propanol), AMPD (2-amino-2-methyl-1,3-propanediol), AMPSO (N-(1,1-dimethyl-2-hydroxyethyl)-3-amino-2-hydroxypropanesulfonic acid), BES (N,N-bis-(2-hydroxyethyl)-2-aminoethanesulfonic acid), Bis-Tris ([bis-(2-hydroxyethyl)-imino]-tris-(hydroxymethylmethane)), Bis-Tris-Propane (1,3-bis[tris(hydroxymethyl)-methylamino]propane), CAPSO (3-(cyclohexylamino)-2-hydroxy-1-propanesulfonic acid), CHES (cyclohexylaminoethanesulfonic acid), diethanolamine, DIPSO (3-[N-bis(hydroxyethyl)amino]-2-hydroxypropanesulfonic acid), EPPS (N-(2-hydroxyethyl)-piperazine-N′-3-propanesulfonic acid), ethanolamine, N-ethylmorpholine, HEPBS (N-(2-hydroxyethyl)piperazine-N′-(4-butanesulfonic acid)), HEPES (N-(2-hydroxyethyl)-piperazine-N′-ethanesulfonic acid), HEPPSO (N-(2-hydroxyethyl)-piperazine-N′-2-hydroxypropanesulfonic acid), L-histidine, hydrazine, imidazole, MES (2-(N-morpholino)ethanesulfonic acid), methylamine, N-methyldiethanolamine, MOBS (4-(N-morpholino)butanesulfonic acid), MOPS (3-(N-morpholino)propanesulfonic acid), MOPSO, morpholine, PIPES (piperazine-N,N′-bis(2-ethanesulfonic acid)), piperazine, phosphate salt, POPSO (piperazine-N,N′-bis(2-hydroxypropanesulfonic acid)), dihydrogen phosphate salt, potassium hydroxide, pyridine, hydrogen phosphate salt, TABS (N-tris(hydroxymethyl)methyl-4-aminobutanesulfonic acid), TAPS (3-{[tris(hydroxymethyl)-methyl]-amino}-propanesulfonic acid), TAPSO (3-[N-tris(hydroxymethyl)-methylamino]-2-hydroxypropanesulfonic acid), TEA (triethanolamine), TES (2-{[tris(hydroxymethyl)methyl]amino}ethanesulfonic acid), Tris (tris(hydroxymethyl)methylamine), or a combination of any two or more thereof. In some embodiments, the second component comprises Tris, Bis-Tris, CHES, TAPS, TAPSO, HEPES, TES, MOPS, PIPES, or IVIES. In some embodiments, the second component comprises Tris, Bis-Tris, or CHES. In some embodiments, the second component comprises Tris. In some embodiments, the second component comprises Bis-Tris. In some embodiments, the second component comprises CHES.
- In some embodiments, the second component is present in an amount of about 0.1 wt. % to about 4 wt. %. This includes about 0.3 wt. % to about 3 wt. %, about 0.5 wt. % to about 3 wt. %, about 0.7 wt. % to about 3 wt. %, about 1 wt. % to about 3 wt. %, about 2 wt. % to about 3 wt. %, about 0.1 wt. % to about 2 wt. %, about 0.1 wt. % to about 3 wt. %, 0.3 wt. % to about 2 wt. %, about 0.5 wt. % to about 2 wt. %, about 0.7 wt. % to about 2 wt. %, about 1 wt. % to about 2 wt. %, about 0.1 wt. % to about 1 wt. %, 0.3 wt. % to about 1 wt. %, about 0.5 wt. % to about 1 wt. %, or about 0.7 wt. % to about 1 wt. %. In some embodiments, the second component is present in an amount of at least about 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6. 3.7, 3.8, 3.9, or 4.0 wt. %, including increments therein. In some embodiments, the second component is present in an amount of about 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6. 3.7, 3.8, 3.9, or 4.0 wt. %, including increments therein.
- In some embodiments, the first component comprises a Lewis acid or a Bronsted-Lowry acid, and the second component comprises a compound devoid of a carboxylic acid moiety, with a pKa of about 6 to about 9. In some embodiments, the first component comprises malic acid and the second component comprises Tris. In some embodiments, the first component comprises malic acid and the second component comprises Bis-Tris. In some embodiments, the first component comprises malic acid and the second component comprises CHES.
- In some embodiments, the buffering material comprises one or more compounds selected from the group consisting of acetate salt, acetic acid, boric acid, ACES, AMP, AMPD, AMPSO, BES, bicine, Bis-Tris, Bis-Tris-Propane, borate salt, boric acid, cacodylate salt, CAPSO, CHES, citrate salt, citric acid, diethanolamine, 5,5-diethylbarbituric acid, DIPSO, EDTA, EPPS, ethanolamine, N-ethylmorpholine, formate salt, formic acid, glycine, glycylglycine, HEPBS, HEPES, HEPPSO, L-histidine, hydrazine, imidazole, lactic acid, malate salt, maleate salt, maleic acid, malic acid, MES, methylamine, N-methyldiethanolamine, MOBS, MOPS, MOPSO, morpholine, PIPES, piperazine, phosphate salt, phosphoric acid, picolinic acid, POPSO, dihydrogen phosphate salt, potassium hydrogen phthalate, potassium hydrogen tartrate, potassium hydroxide, propionate, pyridine, hydrogen phosphate salt, sodium tetraborate decahydrate, TABS, TAPS, TAPSO, TEA, TES, tetraoxalate, tricine, trimethylamine, Tris, succinate salt, succinic acid, and taurine. In further embodiments, the buffering material is present in an amount of about 0.01 wt. % to about 4 wt. %. This includes about 0.01 wt. % to about 3 wt. %, about 0.03 wt. % to about 3 wt. %, about 0.05 wt. % to about 3 wt. %, about 0.07 wt. % to about 3 wt. %, about 0.1 wt. % to about 3 wt. %, about 0.2 wt. % to about 3 wt. %, about 0.3 wt. % to about 3 wt. %, about 0.4 wt. % to about 3 wt. %, about 0.5 wt. % to about 3 wt. %, about 0.6 wt. % to about 3 wt. %, about 0.7 wt. % to about 3 wt. %, about 0.8 wt. % to about 3 wt. %, about 0.9 wt. % to about 3 wt. %, about 1 wt. % to about 3 wt. %, about 1.1 wt. % to about 3 wt. %, about 1.2 wt. % to about 3 wt. %, about 1.3 wt. % to about 3 wt. %, about 1.4 wt. % to about 3 wt. %, about 1.5 wt. % to about 3 wt. %, about 1.6 wt. % to about 3 wt. %, about 1.7 wt. % to about 3 wt. %, about 1.8 wt. % to about 3 wt. %, about 1.9 wt. % to about 3 wt. %, about 2 wt. % to about 3 wt. %, about 2.1 wt. % to about 3 wt. %, about 2.2 wt. % to about 3 wt. %, about 2.3 wt. % to about 3 wt. %, about 2.4 wt. % to about 3 wt. %, about 2.5 wt. % to about 3 wt. %, about 2.6 wt. % to about 3 wt. %, about 2.7 wt. % to about 3 wt. %, about 2.8 wt. % to about 3 wt. %, about 2.9 wt. % to about 3 wt. %, 0.03 wt. % to about 2 wt. %, about 0.05 wt. % to about 2 wt. %, about 0.07 wt. % to about 2 wt. %, about 0.1 wt. % to about 2 wt. %, about 0.2 wt. % to about 2 wt. %, about 0.3 wt. % to about 2 wt. %, about 0.4 wt. % to about 2 wt. %, about 0.5 wt. % to about 2 wt. %, about 0.6 wt. % to about 2 wt. %, about 0.7 wt. % to about 3 wt. %, about 0.8 wt. % to about 2 wt. %, about 0.9 wt. % to about 2 wt. %, about 1 wt. % to about 2 wt. %, about 1.1 wt. % to about 2 wt. %, about 1.2 wt. % to about 2 wt. %, about 1.3 wt. % to about 2 wt. %, about 1.4 wt. % to about 2 wt. %, about 1.5 wt. % to about 2 wt. %, about 1.6 wt. % to about 2 wt. %, about 1.7 wt. % to about 2 wt. %, about 1.8 wt. % to about 2 wt. %, about 1.9 wt. % to about 2 wt. %, about 0.01 wt. % to about 1 wt. %, about 0.03 wt. % to about 1 wt. %, 0.05 wt. % to about 1 wt. %, 0.07 wt. % to about 1 wt. %, 0.1 wt. % to about 1 wt. %, 0.15 wt. % to about 1 wt. %, 0.2 wt. % to about 1 wt. %, 0.25 wt. % to about 1 wt. %, 0.3 wt. % to about 1 wt. %, 0.35 wt. % to about 1 wt. %, 0.4 wt. % to about 1 wt. %, 0.45 wt. % to about 1 wt. %, 0.5 wt. % to about 1 wt. %, 0.55 wt. % to about 1 wt. %, 0.6 wt. % to about 1 wt. %, 0.65 wt. % to about 1 wt. %, 0.7 wt. % to about 1 wt. %, 0.75 wt. % to about 1 wt. %, 0.8 wt. % to about 1 wt. %, 0.85 wt. % to about 1 wt. %, about 0.03 wt. % to about 0.75 wt. %, about 0.05 wt. % to about 0.75 wt. %, about 0.07 wt. % to about 0.75 wt. %, about 0.1 wt. % to about 0.75 wt. %, about 0.15 wt. % to about 0.75 wt. %, about 0.2 wt. % to about 0.75 wt. %, about 0.25 wt. % to about 0.75 wt. %, about 0.3 wt. % to about 0.75 wt. %, about 0.35 wt. % to about 0.75 wt. %, about 0.4 wt. % to about 0.75 wt. %, about 0.45 wt. % to about 0.75 wt. %, or about 0.5 wt. % to about 0.75 wt. %. In some embodiments, the buffering material is present in an amount of at least about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6. 3.7, 3.8, or 3.9 wt. %, including increments therein. In some embodiments, the buffering material is present in an amount of about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6. 3.7, 3.8, 3.9, or 4.0 wt. %, including increments therein.
- In some embodiments, the polishing composition further comprises a polishing accelerator. In some embodiments, the polishing accelerator is present in an amount of about 0.1 wt. % to about 10 wt. %. This includes about 0.1 wt. % to about 9 wt. %, about 0.1 wt. % to about 8 wt. %, about 0.1 wt. % to about 7 wt. %, about 0.1 wt. % to about 6 wt. %, about 0.1 wt. % to about 5 wt. %, about 0.1 wt. % to about 4 wt. %, about 0.1 wt. % to about 3 wt. %, about 0.1 wt. % to about 2 wt. %, about 0.1 wt. % to about 1 wt. %, about 0.1 wt. % to about 0.8 wt. %, about 0.1 wt. % to about 0.5 wt. %, about 0.5 wt. % to about 10 wt. %, about 0.5 wt. % to about 9 wt. %, about 0.5 wt. % to about 8 wt. %, about 0.5 wt. % to about 7 wt. %, about 0.5 wt. % to about 6 wt. %, about 0.5 wt. % to about 5 wt. %, about 0.5 wt. % to about 4 wt. %, about 0.5 wt. % to about 3 wt. %, about 0.5 wt. % to about 2 wt. %, about 0.5 wt. % to about 1 wt. %, about 0.5 wt. % to about 0.8 wt. %, about 1 wt. % to about 10 wt. %, about 1 wt. % to about 9 wt. %, about 1 wt. % to about 8 wt. %, about 1 wt. % to about 7 wt. %, about 1 wt. % to about 6 wt. %, about 1 wt. % to about 5 wt. %, about 1 wt. % to about 4 wt. %, about 1 wt. % to about 3 wt. %, about 1 wt. % to about 2 wt. %, about 3 wt. % to about 9 wt. %, about 3 wt. % to about 8 wt. %, about 3 wt. % to about 7 wt. %, about 3 wt. % to about 6 wt. %, about 3 wt. % to about 5 wt. %, about 3 wt. % to about 4 wt. %, or about 5 wt. % to about 10 wt. %. In some embodiments, the polishing accelerator is present in an amount of at least about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5.0, 5.5, 6.0, 6.5, 7.0, 7.5, 8.0, 8.5, 9.0, 9.5, or 10.0 wt. %, including increments therein. In some embodiments, the polishing accelerator is present in an amount of about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5.0, 5.5, 6.0, 6.5, 7.0, 7.5, 8.0, 8.5, 9.0, 9.5, or 10.0 wt. %, including increments therein. In some embodiments, the polishing accelerator is an amino acid. In further embodiments, the amino acid is glycine.
- In some embodiments, the polishing composition further comprises an oxidizer. In some embodiments, the oxidizer is present in an amount of about 0.1 wt. % to about 4 wt. %. This includes about 0.3 wt. % to about 4 wt. %, about 0.5 wt. % to about 4 wt. %, about 0.7 wt. % to about 4 wt. %, about 1 wt. % to about 4 wt. %, about 2 wt. % to about 4 wt. %, about 3 wt. % to about 4 wt. %, about 0.1 wt. % to about 3 wt. %, about 0.3 wt. % to about 3 wt. %, about 0.5 wt. % to about 3 wt. %, about 0.7 wt. % to about 3 wt. %, about 1 wt. % to about 3 wt. %, about 2 wt. % to about 3 wt. %, about 0.1 wt. % to about 2 wt. %, 0.3 wt. % to about 2 wt. %, about 0.5 wt. % to about 2 wt. %, about 0.7 wt. % to about 2 wt. %, about 1 wt. % to about 2 wt. %, about 0.1 wt. % to about 1 wt. %, 0.3 wt. % to about 1 wt. %, about 0.5 wt. % to about 1 wt. %, or about 0.7 wt. % to about 1 wt. %. In some embodiments, the oxidizer is present in an amount of at least about 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, or 4 wt. %, including increments therein. In some embodiments, the oxidizer is present in an amount of about 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, or 4 wt. %, including increments therein. In some embodiments, the oxidizer is hydrogen peroxide.
- In some embodiments, the pH of the polishing composition at point of use is about 6 to about 9. This includes a pH of about 6 to about 8, about 6 to about 7, about 7 to about 9, about 7 to about 8, or about 8 to about 9. The pH of the polishing composition may be adjusted during preparation of the raw slurry by adding a pH adjustor. In some embodiments, the pH adjustor is a base. In still further embodiments, the base is potassium hydroxide or ammonium hydroxide. In some embodiments, the base is potassium hydroxide. In some embodiments, the base is ammonium hydroxide. In some embodiments, the pH adjustor is an acid.
- In some embodiments, the polishing composition is devoid of any triazole-based corrosion inhibitor. In some embodiments, the polishing composition is devoid of any corrosion inhibitor.
- Methods/Uses
- Provided herein, in another aspect, are methods of cobalt chemical-mechanical polishing (CMP) comprising applying a polishing composition described herein.
- Provided herein, in another aspect, are uses of a polishing composition as described herein for cobalt CMP.
- Provided herein, in another aspect, are methods of stabilizing the cobalt removal rate in a CMP process for a substrate comprising cobalt, the method comprising applying a polishing composition described herein. In some embodiments, the substrate is a wafer. In further embodiments, cobalt is located on an outer layer of the wafer. In some embodiments, the polishing composition removes cobalt but does not remove silicon-containing dielectric (e.g., SiO2, SiN, SiC, SiOC, SiCN). In some embodiments, the wafer comprises one or more adhesion and/or barrier layers containing one or more of titanium nitride (TiN), tantalum nitride (TaN), Ti, and Ta, located between the cobalt layer and the interlayered dielectric (ILD). In further embodiments, one or more adhesion and/or barrier layers are left intact after the CMP process.
- The present invention, thus generally described, will be understood more readily by reference to the following examples, which are provided by way of illustration and are not intended to be limiting of the present invention.
- A glycine-based slurry A (Table 1) was examined in a pot life study in ambient air environment (
FIG. 1 ). Slurry A was mixed with deionized water and hydrogen peroxide at day 0 (bench top polisher; 250 rpm platen rotation speed; 90 mL/min slurry flow rate; 0.68% H2O2; Fujibo H7000 pad; dilution factor: 3.3×). A pH drop as well as a cobalt removal rate increase was observed after 7 days. - The comparative slurry A was further examined under conditions with or without a nitrogen purge. The pot life study conducted under a nitrogen atmosphere exhibited minimal pH change and maintained its cobalt removal rate. Without being bound to any one particular theory, it is believed that the carbon dioxide in air dissolves in the composition and decreases the pH during the pot life.
- The effect of the presence of hydrogen peroxide under ambient air conditions was also examined. Hydrogen peroxide was either added from
day 0 or added immediately prior to testing (FIGS. 2 and 3 ). The results suggest that the presence of hydrogen peroxide fromday 0 results in a pH drop and an increase in cobalt removal rate when the slurry is maintained under air. - Slurry A (as described in Example 1), but further comprising malic acid and Tris (pKa of 8.06 at 25° C.), was prepared (Table 1) and examined. As concentration of the buffering material increased, less change in cobalt removal rate was observed (
FIG. 4 ). The concentration of total inorganic carbon (TIC) was also examined (FIG. 5 ) for this buffering material-containing slurry A and the slurries fromFIGS. 2 and 3 . -
TABLE 1 Slurry Slurry A Slurry A -(with Tris) pH (raw slurry) 8.1 8.1 particle 1.38% 1.38% KOH 0.05% 0.05% glycine 3.64% 3.64% potassium 0.004% 0.004% laurate biocide 0.032% 0.032% malic acid — 0.31% Tris — 0.92% - Two slurries similar to slurry A (as described in Example 1), but further comprising malic acid and either Bis-Tris (pKa of 6.48 at 25° C.) or CHES (pKa of 9.50 at 25° C.), were prepared (Table 2) and examined. These slurries were compared with Slurry A and the slurry of Example 2. The slurries with malic acid and Tris, Bis-Tris, or CHES all maintained removal rates during a seven-day pot life study (
FIG. 6 ), suggesting that the inclusion of buffering material is essential to avoid change in removal rate during the pot life study. Note: point of use (POU) sample included hydrogen peroxide (at POU) of 0.68 wt. % and a dilution factor of 3.3× by weight. conditions for the pot-life study: benchtop polisher, 150 rpm, 90 mL/min, 1.06 psi, Fujibo H7000 pad, coupon: 1.5 in×1.5 in. -
TABLE 2 Slurry Slurry A - (with Bis-Tris) Slurry A - (with CHES) pH (raw slurry) 6.5 8.6 particle 1.38% 1.38% KOH — 0.45% glycine 3.64% 3.64% potassium 0.004% 0.004% laurate biocide 0.032% 0.032% malic acid 3.97% 0.31% Bis-Tris 1.58% — CHES — 1.57% - While certain embodiments have been illustrated and described, it should be understood that changes and modifications can be made therein in accordance with ordinary skill in the art without departing from the technology in its broader aspects as defined in the following claims.
- The embodiments, illustratively described herein may suitably be practiced in the absence of any element or elements, limitation or limitations, not specifically disclosed herein. Thus, for example, the terms “comprising,” “including,” “containing,” etc. shall be read expansively and without limitation. Additionally, the terms and expressions employed herein have been used as terms of description and not of limitation, and there is no intention in the use of such terms and expressions of excluding any equivalents of the features shown and described or portions thereof, but it is recognized that various modifications are possible within the scope of the claimed technology. Additionally, the phrase “consisting essentially of” will be understood to include those elements specifically recited and those additional elements that do not materially affect the basic and novel characteristics of the claimed technology. The phrase “consisting of” excludes any element not specified.
- The present disclosure is not to be limited in terms of the particular embodiments described in this application. Many modifications and variations can be made without departing from its spirit and scope, as will be apparent to those skilled in the art. Functionally equivalent methods and compositions within the scope of the disclosure, in addition to those enumerated herein, will be apparent to those skilled in the art from the foregoing descriptions. Such modifications and variations are intended to fall within the scope of the appended claims. The present disclosure is to be limited only by the terms of the appended claims, along with the full scope of equivalents to which such claims are entitled. It is to be understood that this disclosure is not limited to particular methods, reagents, compounds, or compositions, which can of course vary. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting.
- In addition, where features or aspects of the disclosure are described in terms of Markush groups, those skilled in the art will recognize that the disclosure is also thereby described in terms of any individual member or subgroup of members of the Markush group.
- As will be understood by one skilled in the art, for any and all purposes, particularly in terms of providing a written description, all ranges disclosed herein also encompass any and all possible subranges and combinations of subranges thereof. Any listed range can be easily recognized as sufficiently describing and enabling the same range being broken down into at least equal halves, thirds, quarters, fifths, tenths, etc. As a non-limiting example, each range discussed herein can be readily broken down into a lower third, middle third and upper third, etc. As will also be understood by one skilled in the art all language such as “up to,” “at least,” “greater than,” “less than,” and the like, include the number recited and refer to ranges which can be subsequently broken down into subranges as discussed above. Finally, as will be understood by one skilled in the art, a range includes each individual member.
- All publications, patent applications, issued patents, and other documents referred to in this specification are herein incorporated by reference as if each individual publication, patent application, issued patent, or other document was specifically and individually indicated to be incorporated by reference in its entirety. Definitions that are contained in text incorporated by reference are excluded to the extent that they contradict definitions in this disclosure.
- Other embodiments are set forth in the following claims.
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CN102304327A (en) | 2011-07-05 | 2012-01-04 | 复旦大学 | Polishing solution based on metal Co for polishing process |
US20130186850A1 (en) | 2012-01-24 | 2013-07-25 | Applied Materials, Inc. | Slurry for cobalt applications |
KR102160024B1 (en) | 2013-02-28 | 2020-09-25 | 가부시키가이샤 후지미인코퍼레이티드 | Polishing slurry for cobalt removal |
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US20040152309A1 (en) * | 2003-02-03 | 2004-08-05 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
US20150184029A1 (en) * | 2007-09-21 | 2015-07-02 | Cabot Microelectronics Corporation | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
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