US20170366897A1 - Microphone board for far field automatic speech recognition - Google Patents

Microphone board for far field automatic speech recognition Download PDF

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Publication number
US20170366897A1
US20170366897A1 US15/388,275 US201615388275A US2017366897A1 US 20170366897 A1 US20170366897 A1 US 20170366897A1 US 201615388275 A US201615388275 A US 201615388275A US 2017366897 A1 US2017366897 A1 US 2017366897A1
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Prior art keywords
microphones
circle
connections
microphone
line
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US15/388,275
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Robert Azarewicz
Adam Kupryjanow
Lukasz Kurylo
Przemyslaw Maziewski
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Intel Corp
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Intel Corp
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Priority to US15/388,275 priority Critical patent/US20170366897A1/en
Assigned to INTEL CORPORATION reassignment INTEL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AZAREWICZ, ROBERT, KUPRYJANOW, Adam, KURYLO, LUKASZ, MAZIEWSKI, Przemyslaw
Publication of US20170366897A1 publication Critical patent/US20170366897A1/en
Abandoned legal-status Critical Current

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    • G10LSPEECH ANALYSIS TECHNIQUES OR SPEECH SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING TECHNIQUES; SPEECH OR AUDIO CODING OR DECODING
    • G10L21/00Speech or voice signal processing techniques to produce another audible or non-audible signal, e.g. visual or tactile, in order to modify its quality or its intelligibility
    • G10L21/02Speech enhancement, e.g. noise reduction or echo cancellation
    • G10L21/0316Speech enhancement, e.g. noise reduction or echo cancellation by changing the amplitude
    • G10L21/0324Details of processing therefor
    • G10L21/034Automatic adjustment
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    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04Structural association of microphone with electric circuitry therefor
    • GPHYSICS
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    • G10LSPEECH ANALYSIS TECHNIQUES OR SPEECH SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING TECHNIQUES; SPEECH OR AUDIO CODING OR DECODING
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    • G10L25/21Speech or voice analysis techniques not restricted to a single one of groups G10L15/00 - G10L21/00 characterised by the type of extracted parameters the extracted parameters being power information
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    • G10L25/48Speech or voice analysis techniques not restricted to a single one of groups G10L15/00 - G10L21/00 specially adapted for particular use
    • G10L25/51Speech or voice analysis techniques not restricted to a single one of groups G10L15/00 - G10L21/00 specially adapted for particular use for comparison or discrimination
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/40Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
    • H04R1/406Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006Interconnection of transducer parts
    • GPHYSICS
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    • G10LSPEECH ANALYSIS TECHNIQUES OR SPEECH SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING TECHNIQUES; SPEECH OR AUDIO CODING OR DECODING
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    • G10L15/28Constructional details of speech recognition systems
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    • G10L21/00Speech or voice signal processing techniques to produce another audible or non-audible signal, e.g. visual or tactile, in order to modify its quality or its intelligibility
    • G10L21/02Speech enhancement, e.g. noise reduction or echo cancellation
    • G10L21/0208Noise filtering
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    • GPHYSICS
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    • G10L21/00Speech or voice signal processing techniques to produce another audible or non-audible signal, e.g. visual or tactile, in order to modify its quality or its intelligibility
    • G10L21/02Speech enhancement, e.g. noise reduction or echo cancellation
    • G10L21/0208Noise filtering
    • G10L21/0216Noise filtering characterised by the method used for estimating noise
    • G10L2021/02161Number of inputs available containing the signal or the noise to be suppressed
    • G10L2021/02166Microphone arrays; Beamforming
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/40Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
    • H04R2201/4012D or 3D arrays of transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/40Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
    • H04R2201/403Linear arrays of transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00Details of connection covered by H04R, not provided for in its groups
    • H04R2420/07Applications of wireless loudspeakers or wireless microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00Circuits for transducers, loudspeakers or microphones
    • H04R3/005Circuits for transducers, loudspeakers or microphones for combining the signals of two or more microphones

Definitions

  • Embodiments described herein generally relate to automatic speech recognition (ASR) and more specifically to a microphone board for far field ASR.
  • ASR automatic speech recognition
  • ASR involves a machine-based collection of techniques to understand human languages.
  • ASR is interdisciplinary, often involving microphone, analog to digital conversion, frequency processing, database, and artificial intelligence technologies to convert the spoken word into textual or machine readable representations of not only what said (e.g., a transcript) but also what was meant (e.g., semantic understanding) by a human speaker.
  • Far field ASR involves techniques to decrease a word error rate (WER) in utterances made a greater distance to a microphone, or microphone array, than traditionally accounted for in ASR processing pipelines. Such distance often decreases the signal to noise (SNR) ration and thus increases WER in traditional ASR systems.
  • WER word error rate
  • SNR signal to noise
  • FIG. 1 is an example of a smart home gateway housing, according to an embodiment.
  • FIG. 2 illustrates an example of a microphone printed circuit board, according to an embodiment.
  • FIG. 3 is a top view of an example of a microphone board housing, according to an embodiment.
  • FIG. 4 is a cross sectional view of an example of a microphone board housing, according to an embodiment.
  • FIG. 5 illustrates an example configuration to isolate a microphone board, according to an embodiment.
  • FIG. 6 illustrates an example of mounting a microphone board to a housing, according to an embodiment.
  • FIG. 7 is an example of a method for making a microphone board for far field automatic speech recognition, according to an embodiment.
  • FIG. 8 is a block diagram illustrating an example of a machine upon which one or more embodiments may be implemented.
  • Embodiments and examples herein general described a number of systems, devices, and techniques for enhancing far field ASR via a microphone board. It is understood, however, that the systems, devices, and techniques are examples illustrating the underlying concepts.
  • a factor that may contribute to far field ASR performance includes the number of microphones, their characteristics and configuration, as well as microphone mounting techniques.
  • a microphone array that was demonstrated to improve far field ASR performance.
  • both circular and linear microphone arrays are combined.
  • Such a combination of arrays allows the simultaneous use of beam-forming techniques designed for linearly arranged microphones and beam-forming techniques designed for circularly arranged microphones.
  • PPF phased-based beam-forming
  • MVDR Minimum Variance Distortionless Response
  • the microphones may be mounted (e.g., to the housing) to reduce (e.g., minimize) leakage between microphones as well as microphone-loudspeaker or microphone-enclosure coupling.
  • reduce e.g., minimize
  • the described microphone apparatus improves audio capabilities to enhance far field ASR.
  • FIG. 1 is an example of a smart home gateway housing 105 , according to an embodiment. As illustrated, the circles atop the housing are lumens 110 behind which are housed microphones (as illustrated there are eight microphones). The dashed lines illustrate microphones in a linear arrangement 115 as well as in a circular arrangement 120 .
  • the smart home gateway 105 includes a first plurality of microphones along a circumference of a circle 120 on a surface.
  • This microphone arrangement may be referred to as a circular array or circular microphone array.
  • the surface is the top of the smart home gateway 105 , however, another surface, such as the side of a wall mounted device may also be used.
  • the number of microphones in the first plurality of microphones is an even number.
  • the first plurality of microphones includes six microphones.
  • the microphones used may be bottom ported silicon digital transducers.
  • a Knowles digital MEMS with PDM output may be used.
  • other manufactures e.g. Akustica, Cirrus, STMicro
  • other interfaces e.g. I2S
  • porting e.g. top
  • the smart home gateway 105 may also include a second plurality of microphones along a line 115 on the surface. This arrangement may be referred to as a linear array or linear microphone array. In an example, the number of microphones in the second plurality of microphones is an even number. In an example, the second plurality of microphones includes four microphones. In an example, the total of the first plurality of microphones and the second plurality of microphones is eight.
  • the line 115 intersects the circle 120 .
  • the line 115 terminates on the circle 120 .
  • the line 115 has a length equal to a diameter of the circle 120 , as illustrated here.
  • the relationship between the line 115 and the circle 120 provides a known relationship between these microphone array geometries that may be exploited for different ASR processing purposes.
  • the microphones may be compactly placed on the surface while still gaining the benefit of the multiple microphone array geometries.
  • at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • the line is wholly within the circle. The inclusion of one or more microphones in both (or more) microphone arrays efficiently uses the available space while still permitting multiple array geometries for far field ASR processing, such as beamforming, noise mitigation, etc.
  • the smart home gateway 105 also includes a first set of connections to the first plurality of microphones and a second set of connections to the second plurality of microphones. These sets of connections are at least a logical link between the microphones and other processing elements. A non-logical link, such as an individual wire leading to each microphone in the first plurality of microphones may also be used. However, the microphones may be connected via a bus, or other interlink, and encode individual signals with a microphone identification (ID) or the like to form a logical set of connections. These connections permit downstream processors to identify the source microphone of a signal in order to perform processing, such as phase based beamforming. In an example, the connection is labeled, or otherwise identifiable, by its microphone's position in an array (e.g., whether the array is linear, an index in the array or other positioning within the array).
  • ID microphone identification
  • the smart home gateway 105 also includes a connector to provide the first set connections and the second set of connections to an external entity.
  • an external entity is any component that uses data derived from the microphone signals, including unaltered audio signals directly from the microphones, via the connector.
  • the microphone arrays may be installed on a number of devices and interoperate with devices produced, for example, by other manufacturers without modification.
  • the smart home gateway 105 may include a cover affixed to the surface with a first fastener and a first vibration dampener and the surface is itself affixed to the housing of the device via a second fastener and a second vibration dampener.
  • the smart gateway 105 in FIG. 1 illustrates the combination of the cover and the housing to the surface.
  • the vibration dampener has rubber-like properties (e.g., a viscoelastic material).
  • elastomers such as saturated rubbers (e.g., polyisoprene, polybutadiene, chloroprene, butyl rubber, styrene-butadiene rubber, nitrile rubber, etc.), saturated rubbers (e.g., ethylene propylene rubber, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers, perfluoroelastomers, polyether block amides, chlorosulfonated polyethylene, ethylene-vinyl acetate, etc.), among others.
  • saturated rubbers e.g., polyisoprene, polybutadiene, chloroprene, butyl rubber, styrene-butadiene rubber, nitrile rubber, etc.
  • saturated rubbers e.g., ethylene propylene rubber, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroe
  • the first fastener and the second fastener are the same.
  • a single element such as a bolt, secures the cover to the surface and to the housing.
  • the first and second fastener being of the same type (which they may be even if they are separate fasteners).
  • at least one of the first fastener or the second fastener is a screw, a clip, bolt, pin, or tie.
  • a gap, or space may exist between microphones between the cover and the housing. That is, sound entering a lumen 110 for a first microphone may also pass through this space to a second microphone.
  • the first vibration dampener seals space between the surface and a microphone when secured by the first fastener. This arrangement reduces acoustical leakage between microphones and lumens 110 .
  • the combination linear and circular microphone arrays and mounting the microphones to inhibit leakage improve far field ASR performance over current microphone arrays.
  • the devices that use only a circular microphone array does not allow use of beam-forming techniques for linearly arranged microphones.
  • beamforming helps to reduce noise, improve voice quality, and thus improve ASR performance.
  • reducing acoustical leakage and coupling improves signal quality for beam-forming techniques and acoustical echo cancellation.
  • FIGS. 2-6 provide some additional detail of the components discussed above.
  • FIG. 2 illustrates a corresponding printed circuit board (PCB) 205 to the housing 105 of FIG. 1 .
  • the PCB 205 is the surface discussed above.
  • the microphone 210 is a part of a circular array
  • microphone 215 is a part of a linear array
  • microphone 220 is a part of both the circular and linear arrays.
  • FIG. 3 illustrates an example design for a cover 305 (top view) as mentioned in FIG. 1 , according to an embodiment.
  • the darkly shaded small circles 310 represent the inlet holes (e.g., lumens) for the microphones.
  • Other holes e.g., small lightly shaded circles 320 on the left or the large shade circles 315 in the middle
  • Inter-microphone leakage may be reduced if the housing, surface 205 , or cover 305 ensures that only one inlet hole (e.g., lumen) leads to a selected microphone.
  • no other direct or indirect paths to the selected microphone are allowed.
  • sound may be transmitted through certain materials, such as the mounting between the housing and the surface.
  • FIGS. 4-6 illustrate some example solutions to address these issues.
  • FIG. 4 is a cross sectional view of an example of a microphone board housing, according to an embodiment.
  • the microphone PCB 415 is isolated from the external housing 405 (here illustrated as being both the housing the cover as discussed above) using an acoustical isolation layer 410 .
  • the acoustical isolation layer 410 is a rubber (or rubber-like) material from one to two millimeters (mm) in thickness. This arrangement helps ensure that the lumen through which sound arrives at the microphone is controlled and consistent.
  • FIG. 5 illustrates an example of just such an arrangement.
  • the additional isolation may include ten to fifteen millimeter GMS-012 air foam layer 520 on the bottom of the microphone PCB 515 and above the housing 525 .
  • the acoustical isolation layer 510 will include a channel between a microphone and its corresponding lumen 530 .
  • Isolating a mounting fastener such as screws
  • a mounting with screws is depicted in the example of FIG. 6 .
  • the screws 610 interface the microphone board 620 (with microphone 605 ) to the housing 630 and is buffered by the elastomer material in layer one 615 and layer two 625 .
  • the protective material (layers one 615 and two 625 ) and the microphone board 620 are arranged such that, when tightened, the screw heads are not touching the microphone PCB 620 due to the elastomer.
  • the PCB 620 is shaped to allow the rubber-like material 615 to fill-in the space between the screw head and the PCB 620 .
  • FIG. 7 is an example of a method 700 for making a microphone board for far field automatic speech recognition, according to an embodiment.
  • the operations of the method 700 are performed on electronic hardware, such as that described above or below (e.g., circuits).
  • a first plurality of microphones is disposed along a circumference of a circle on a surface.
  • the first plurality of microphones includes six microphones.
  • a second plurality of microphones is disposed along a line on the surface.
  • the second plurality of microphones includes four microphones.
  • the total of the first plurality of microphones and the second plurality of microphones is eight.
  • the first plurality of microphones has an even number of microphones.
  • the first plurality of microphones has more than two microphones.
  • the second plurality of microphones has an even number of microphones.
  • the line intersects the circle. In an example the line terminates on the circle. In an example the line has a length equal to a diameter of the circle. In an example, at least one microphone is in the first plurality of microphones and is in the second plurality of microphones. In an example the line is wholly within the circle.
  • first connections to the first plurality of microphones are grouped together.
  • second connections to the second plurality of microphones are grouped together.
  • the first connections and the second connections are provided to an external entity via a connector.
  • the operations of the method 700 may be optionally extended to include affixing a cover to the surface with a first fastener and a first vibration dampener; and affixing the surface to a housing with a second fastener and a second vibration dampener.
  • the vibration dampener is an elastomer.
  • the first fastener and the second fastener are the same.
  • the first fastener and the second fastener are a screw.
  • the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • FIG. 8 illustrates a block diagram of an example machine 800 upon which any one or more of the techniques (e.g., methodologies) discussed herein may perform.
  • the machine 800 may operate as a standalone device or may be connected (e.g., networked) to other machines.
  • the machine 800 may operate in the capacity of a server machine, a client machine, or both in server-client network environments.
  • the machine 800 may act as a peer machine in peer-to-peer (P2P) (or other distributed) network environment.
  • P2P peer-to-peer
  • the machine 800 may be a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a mobile telephone, a web appliance, or any machine capable of executing instructions (sequential or otherwise) that specify actions to be taken by that machine.
  • PC personal computer
  • PDA personal digital assistant
  • STB set-top box
  • PDA personal digital assistant
  • mobile telephone a web appliance
  • machine shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein, such as cloud computing, software as a service (SaaS), other computer cluster configurations.
  • SaaS software as a service
  • Circuitry is a collection of circuits implemented in tangible entities that include hardware (e.g., simple circuits, gates, logic, etc.). Circuitry membership may be flexible over time and underlying hardware variability. Circuitries include members that may, alone or in combination, perform specified operations when operating. In an example, hardware of the circuitry may be immutably designed to carry out a specific operation (e.g., hardwired).
  • the hardware of the circuitry may include variably connected physical components (e.g., execution units, transistors, simple circuits, etc.) including a computer readable medium physically modified (e.g., magnetically, electrically, moveable placement of invariant massed particles, etc.) to encode instructions of the specific operation.
  • a computer readable medium physically modified (e.g., magnetically, electrically, moveable placement of invariant massed particles, etc.) to encode instructions of the specific operation.
  • the instructions enable embedded hardware (e.g., the execution units or a loading mechanism) to create members of the circuitry in hardware via the variable connections to carry out portions of the specific operation when in operation.
  • the computer readable medium is communicatively coupled to the other components of the circuitry when the device is operating.
  • any of the physical components may be used in more than one member of more than one circuitry.
  • execution units may be used in a first circuit of a first circuitry at one point in time and reused by a second circuit in the first circuitry, or by a third circuit in a second circuitry at a different time.
  • Machine 800 may include a hardware processor 802 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 804 and a static memory 806 , some or all of which may communicate with each other via an interlink (e.g., bus) 808 .
  • the machine 800 may further include a display unit 810 , an alphanumeric input device 812 (e.g., a keyboard), and a user interface (UI) navigation device 814 (e.g., a mouse).
  • the display unit 810 , input device 812 and UI navigation device 814 may be a touch screen display.
  • the machine 800 may additionally include a storage device (e.g., drive unit) 816 , a signal generation device 818 (e.g., a speaker), a network interface device 820 , and one or more sensors 821 , such as a global positioning system (GPS) sensor, compass, accelerometer, or other sensor.
  • the machine 800 may include an output controller 828 , such as a serial (e.g., universal serial bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection to communicate or control one or more peripheral devices (e.g., a printer, card reader, etc.).
  • a serial e.g., universal serial bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection to communicate or control one or more peripheral devices (e.g., a printer, card reader, etc.).
  • USB universal serial bus
  • the storage device 816 may include a machine readable medium 822 on which is stored one or more sets of data structures or instructions 824 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein.
  • the instructions 824 may also reside, completely or at least partially, within the main memory 804 , within static memory 806 , or within the hardware processor 802 during execution thereof by the machine 800 .
  • one or any combination of the hardware processor 802 , the main memory 804 , the static memory 806 , or the storage device 816 may constitute machine readable media.
  • machine readable medium 822 is illustrated as a single medium, the term “machine readable medium” may include a single medium or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) configured to store the one or more instructions 824 .
  • machine readable medium may include a single medium or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) configured to store the one or more instructions 824 .
  • machine readable medium may include any medium that is capable of storing, encoding, or carrying instructions for execution by the machine 800 and that cause the machine 800 to perform any one or more of the techniques of the present disclosure, or that is capable of storing, encoding or carrying data structures used by or associated with such instructions.
  • Non-limiting machine readable medium examples may include solid-state memories, and optical and magnetic media.
  • a massed machine readable medium comprises a machine readable medium with a plurality of particles having invariant (e.g., rest) mass. Accordingly, massed machine-readable media are not transitory propagating signals.
  • massed machine readable media may include: non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices, magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.
  • non-volatile memory such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices
  • EPROM Electrically Programmable Read-Only Memory
  • EEPROM Electrically Erasable Programmable Read-Only Memory
  • flash memory devices e.g., electrically Erasable Programmable Read-Only Memory (EEPROM)
  • EPROM Electrically Programmable Read-Only Memory
  • EEPROM Electrically Erasable Programmable Read-Only Memory
  • flash memory devices e.g., electrical
  • the instructions 824 may further be transmitted or received over a communications network 826 using a transmission medium via the network interface device 820 utilizing any one of a number of transfer protocols (e.g., frame relay, internet protocol (IP), transmission control protocol (TCP), user datagram protocol (UDP), hypertext transfer protocol (HTTP), etc.).
  • transfer protocols e.g., frame relay, internet protocol (IP), transmission control protocol (TCP), user datagram protocol (UDP), hypertext transfer protocol (HTTP), etc.
  • Example communication networks may include a local area network (LAN), a wide area network (WAN), a packet data network (e.g., the Internet), mobile telephone networks (e.g., cellular networks), Plain Old Telephone (POTS) networks, and wireless data networks (e.g., Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards known as Wi-Fi®, IEEE 802.16 family of standards known as WiMax®), IEEE 802.15.4 family of standards, peer-to-peer (P2P) networks, among others.
  • the network interface device 820 may include one or more physical jacks (e.g., Ethernet, coaxial, or phone jacks) or one or more antennas to connect to the communications network 826 .
  • the network interface device 820 may include a plurality of antennas to wirelessly communicate using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) techniques.
  • SIMO single-input multiple-output
  • MIMO multiple-input multiple-output
  • MISO multiple-input single-output
  • transmission medium shall be taken to include any intangible medium that is capable of storing, encoding or carrying instructions for execution by the machine 800 , and includes digital or analog communications signals or other intangible medium to facilitate communication of such software.
  • Example 1 is a device for creating a far-field microphone array, the device comprising: a first plurality of microphones along a circumference of a circle on a surface of the device; a second plurality of microphones along a line on the surface; a first set of connections to the first plurality of microphones; a second set of connections to the second plurality of microphones; and a connector to provide the first connections and the second connections to an external entity of the surface.
  • Example 2 the subject matter of Example 1 optionally includes wherein the line intersects the circle.
  • Example 3 the subject matter of Example 2 optionally includes wherein the line terminates on the circle.
  • Example 4 the subject matter of Example 3 optionally includes wherein the line has a length equal to a diameter of the circle.
  • Example 5 the subject matter of any one or more of Examples 3-4 optionally include wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • Example 6 the subject matter of any one or more of Examples 1-5 optionally include wherein the line is wholly within the circle.
  • Example 7 the subject matter of any one or more of Examples 1-6 optionally include wherein the first plurality of microphones includes six microphones.
  • Example 8 the subject matter of any one or more of Examples 1-7 optionally include wherein the second plurality of microphones includes four microphones.
  • Example 9 the subject matter of any one or more of Examples 1-8 optionally include wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
  • Example 10 the subject matter of any one or more of Examples 1-9 optionally include a cover affixed to the surface with a first fastener and a first vibration dampener; and a housing affixed to the surface with a second fastener and a second vibration dampener.
  • Example 11 the subject matter of Example 10 optionally includes wherein the vibration dampener has rubber-like properties.
  • Example 12 the subject matter of any one or more of Examples 10-11 optionally include wherein the first fastener and the second fastener are the same and are a screw.
  • Example 13 the subject matter of any one or more of Examples 10-12 optionally include wherein the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • Example 14 is at least one machine readable medium including instructions for creating a far-field microphone array, the instructions, when executed by a machine, causing the machine to perform operations comprising: disposing a first plurality of microphones along a circumference of a circle on a surface; disposing a second plurality of microphones along a line on the surface; grouping first connections to the first plurality of microphones together; grouping second connections to the second plurality of microphones together, and providing the first connections and the second connections to an external entity of the surface via a connector.
  • Example 15 the subject matter of Example 14 optionally includes wherein the line intersects the circle.
  • Example 16 the subject matter of Example 15 optionally includes wherein the line terminates on the circle.
  • Example 17 the subject matter of Example 16 optionally includes wherein the line has a length equal to a diameter of the circle.
  • Example 18 the subject matter of any one or more of Examples 16-17 optionally include wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • Example 19 the subject matter of any one or more of Examples 14-18 optionally include wherein the line is wholly within the circle.
  • Example 20 the subject matter of any one or more of Examples 14-19 optionally include wherein the first plurality of microphones includes six microphones.
  • Example 21 the subject matter of any one or more of Examples 14-20 optionally include wherein the second plurality of microphones includes four microphones.
  • Example 22 the subject matter of any one or more of Examples 14-21 optionally include wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
  • Example 23 the subject matter of any one or more of Examples 14-22 optionally include wherein the operations comprise: affixing a cover to the surface with a first fastener and a first vibration dampener; and affixing the surface to a housing with a second fastener and a second vibration dampener.
  • Example 24 the subject matter of Example 23 optionally includes wherein the vibration dampener has rubber-like properties.
  • Example 25 the subject matter of any one or more of Examples 23-24 optionally include wherein the first fastener and the second fastener are the same and are a screw.
  • Example 26 the subject matter of any one or more of Examples 23-25 optionally include wherein the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • Example 27 is a method for creating a far-field microphone array, the method comprising: disposing a first plurality of microphones along a circumference of a circle on a surface; disposing a second plurality of microphones along a line on the surface; grouping first connections to the first plurality of microphones together; grouping second connections to the second plurality of microphones together; and providing the first connections and the second connections to an external entity of the surface via a connector.
  • Example 28 the subject matter of Example 27 optionally includes wherein the line intersects the circle.
  • Example 29 the subject matter of Example 28 optionally includes wherein the line terminates on the circle.
  • Example 30 the subject matter of Example 29 optionally includes wherein the line has a length equal to a diameter of the circle.
  • Example 31 the subject matter of any one or more of Examples 29-30 optionally include wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • Example 32 the subject matter of any one or more of Examples 27-31 optionally include wherein the line is wholly within the circle.
  • Example 33 the subject matter of any one or more of Examples 27-32 optionally include wherein the first plurality of microphones includes six microphones.
  • Example 34 the subject matter of any one or more of Examples 27-33 optionally include wherein the second plurality of microphones includes four microphones.
  • Example 35 the subject matter of any one or more of Examples 27-34 optionally include wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
  • Example 36 the subject matter of any one or more of Examples 27-35 optionally include affixing a cover to the surface with a first fastener and a first vibration dampener; and affixing the surface to a housing with a second fastener and a second vibration dampener.
  • Example 37 the subject matter of Example 36 optionally includes wherein the vibration dampener with rubber-like properties.
  • Example 38 the subject matter of any one or more of Examples 36-37 optionally include wherein the first fastener and the second fastener are the same and are a screw.
  • Example 39 the subject matter of any one or more of Examples 36-38 optionally include wherein the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • Example 40 is a system including means to perform any of methods 27-39.
  • Example 41 is at least one machine readable medium including instructions that, when executed by a machine, cause the machine to perform any of methods 27-39.
  • Example 42 is a system for creating a far-field microphone array, the system comprising: means for disposing a first plurality of microphones along a circumference of a circle on a surface; means for disposing a second plurality of microphones along a line on the surface; means for grouping first connections to the first plurality of microphones together; means for grouping second connections to the second plurality of microphones together; and means for providing the first connections and the second connections to an external entity of the surface via a connector.
  • Example 43 the subject matter of Example 42 optionally includes wherein the line intersects the circle.
  • Example 44 the subject matter of Example 43 optionally includes wherein the line terminates on the circle.
  • Example 45 the subject matter of Example 44 optionally includes wherein the line has a length equal to a diameter of the circle.
  • Example 46 the subject matter of any one or more of Examples 44-45 optionally include wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • Example 47 the subject matter of any one or more of Examples 42-46 optionally include wherein the line is wholly within the circle.
  • Example 48 the subject matter of any one or more of Examples 42-47 optionally include wherein the first plurality of microphones includes six microphones.
  • Example 49 the subject matter of any one or more of Examples 42-48 optionally include wherein the second plurality of microphones includes four microphones.
  • Example 50 the subject matter of any one or more of Examples 42-49 optionally include wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
  • Example 51 the subject matter of any one or more of Examples 42-50 optionally include means for affixing a cover to the surface with a first fastener and a first vibration dampener; and means for affixing the surface to a housing with a second fastener and a second vibration dampener.
  • Example 52 the subject matter of Example 51 optionally includes wherein the vibration dampener with rubber-like properties.
  • Example 53 the subject matter of any one or more of Examples 51-52 optionally include wherein the first fastener and the second fastener are the same and are a screw.
  • Example 54 the subject matter of any one or more of Examples 51-53 optionally include wherein the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of“at least one” or “one or more.”
  • the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated.

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Abstract

System and techniques for a microphone board for far field automatic speech recognition are described herein. The microphone board may include a first plurality of microphones disposed along a circumference of a circle on a surface and a second plurality of microphones disposed along a line on the surface. First connections to the first plurality of microphones may be grouped together and second connections to the second plurality of microphones are grouped together. The first connections and the second connections may be provided to an external entity of the surface via a connector.

Description

    CLAIM OF PRIORITY
  • This patent application claims the benefit of priority, under 35 U.S.C. §119, to U.S. Provisional Application Ser. No. 62/350,507, titled “FAR FIELD AUTOMATIC SPEECH RECOGNITION” and filed on Jun. 15, 2016, the entirety of which is hereby incorporated by reference herein.
  • TECHNICAL FIELD
  • Embodiments described herein generally relate to automatic speech recognition (ASR) and more specifically to a microphone board for far field ASR.
  • BACKGROUND
  • ASR involves a machine-based collection of techniques to understand human languages. ASR is interdisciplinary, often involving microphone, analog to digital conversion, frequency processing, database, and artificial intelligence technologies to convert the spoken word into textual or machine readable representations of not only what said (e.g., a transcript) but also what was meant (e.g., semantic understanding) by a human speaker. Far field ASR involves techniques to decrease a word error rate (WER) in utterances made a greater distance to a microphone, or microphone array, than traditionally accounted for in ASR processing pipelines. Such distance often decreases the signal to noise (SNR) ration and thus increases WER in traditional ASR systems. As used herein, far field ASR involves distances more than half meter from the microphone.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • In the drawings, which are not necessarily drawn to scale, like numerals may describe similar components in different views. Like numerals having different letter suffixes may represent different instances of similar components. The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed in the present document.
  • FIG. 1 is an example of a smart home gateway housing, according to an embodiment.
  • FIG. 2 illustrates an example of a microphone printed circuit board, according to an embodiment.
  • FIG. 3 is a top view of an example of a microphone board housing, according to an embodiment.
  • FIG. 4 is a cross sectional view of an example of a microphone board housing, according to an embodiment.
  • FIG. 5 illustrates an example configuration to isolate a microphone board, according to an embodiment.
  • FIG. 6 illustrates an example of mounting a microphone board to a housing, according to an embodiment.
  • FIG. 7 is an example of a method for making a microphone board for far field automatic speech recognition, according to an embodiment.
  • FIG. 8 is a block diagram illustrating an example of a machine upon which one or more embodiments may be implemented.
  • DETAILED DESCRIPTION
  • Embodiments and examples herein general described a number of systems, devices, and techniques for enhancing far field ASR via a microphone board. It is understood, however, that the systems, devices, and techniques are examples illustrating the underlying concepts.
  • A factor that may contribute to far field ASR performance includes the number of microphones, their characteristics and configuration, as well as microphone mounting techniques. Here we describe a microphone array that was demonstrated to improve far field ASR performance. In an example, both circular and linear microphone arrays are combined. Such a combination of arrays allows the simultaneous use of beam-forming techniques designed for linearly arranged microphones and beam-forming techniques designed for circularly arranged microphones. For the linear arrangement, one may use a phased-based beam-forming (PBF) technique, such as that discussed in US20150078571. For the circularly arranged microphones, one may use, for example, the Minimum Variance Distortionless Response (MVDR) beam-forming technique. In an example, the microphones may be mounted (e.g., to the housing) to reduce (e.g., minimize) leakage between microphones as well as microphone-loudspeaker or microphone-enclosure coupling. By combining microphone arrays and addressing acoustical leakage, the described microphone apparatus improves audio capabilities to enhance far field ASR.
  • FIG. 1 is an example of a smart home gateway housing 105, according to an embodiment. As illustrated, the circles atop the housing are lumens 110 behind which are housed microphones (as illustrated there are eight microphones). The dashed lines illustrate microphones in a linear arrangement 115 as well as in a circular arrangement 120.
  • The smart home gateway 105 includes a first plurality of microphones along a circumference of a circle 120 on a surface. This microphone arrangement may be referred to as a circular array or circular microphone array. As illustrated here, the surface is the top of the smart home gateway 105, however, another surface, such as the side of a wall mounted device may also be used. In an example, the number of microphones in the first plurality of microphones is an even number. In an example, the first plurality of microphones includes six microphones.
  • In an example, the microphones used may be bottom ported silicon digital transducers. For example, a Knowles digital MEMS with PDM output may be used. However, other manufactures (e.g. Akustica, Cirrus, STMicro) with other interfaces (e.g. I2S) or porting (e.g. top) may be used as well.
  • The smart home gateway 105 may also include a second plurality of microphones along a line 115 on the surface. This arrangement may be referred to as a linear array or linear microphone array. In an example, the number of microphones in the second plurality of microphones is an even number. In an example, the second plurality of microphones includes four microphones. In an example, the total of the first plurality of microphones and the second plurality of microphones is eight.
  • In an example, the line 115 intersects the circle 120. In an example, the line 115 terminates on the circle 120. In an example, the line 115 has a length equal to a diameter of the circle 120, as illustrated here. The relationship between the line 115 and the circle 120 provides a known relationship between these microphone array geometries that may be exploited for different ASR processing purposes. By intersecting the line 115 with the circle 120, the microphones may be compactly placed on the surface while still gaining the benefit of the multiple microphone array geometries. In an example, at least one microphone is in the first plurality of microphones and is in the second plurality of microphones. In an example, the line is wholly within the circle. The inclusion of one or more microphones in both (or more) microphone arrays efficiently uses the available space while still permitting multiple array geometries for far field ASR processing, such as beamforming, noise mitigation, etc.
  • The smart home gateway 105 also includes a first set of connections to the first plurality of microphones and a second set of connections to the second plurality of microphones. These sets of connections are at least a logical link between the microphones and other processing elements. A non-logical link, such as an individual wire leading to each microphone in the first plurality of microphones may also be used. However, the microphones may be connected via a bus, or other interlink, and encode individual signals with a microphone identification (ID) or the like to form a logical set of connections. These connections permit downstream processors to identify the source microphone of a signal in order to perform processing, such as phase based beamforming. In an example, the connection is labeled, or otherwise identifiable, by its microphone's position in an array (e.g., whether the array is linear, an index in the array or other positioning within the array).
  • The smart home gateway 105 also includes a connector to provide the first set connections and the second set of connections to an external entity. As used here, an external entity is any component that uses data derived from the microphone signals, including unaltered audio signals directly from the microphones, via the connector. Thus, the microphone arrays may be installed on a number of devices and interoperate with devices produced, for example, by other manufacturers without modification.
  • In an example, the smart home gateway 105 may include a cover affixed to the surface with a first fastener and a first vibration dampener and the surface is itself affixed to the housing of the device via a second fastener and a second vibration dampener. As illustrated, the smart gateway 105 in FIG. 1 illustrates the combination of the cover and the housing to the surface. In an example, the vibration dampener has rubber-like properties (e.g., a viscoelastic material). Generally, such rubber-like properties are found in elastomers, such as saturated rubbers (e.g., polyisoprene, polybutadiene, chloroprene, butyl rubber, styrene-butadiene rubber, nitrile rubber, etc.), saturated rubbers (e.g., ethylene propylene rubber, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers, perfluoroelastomers, polyether block amides, chlorosulfonated polyethylene, ethylene-vinyl acetate, etc.), among others.
  • In an example, the first fastener and the second fastener are the same. In this example, a single element, such as a bolt, secures the cover to the surface and to the housing. This is not to be confused with the first and second fastener being of the same type (which they may be even if they are separate fasteners). In an example, at least one of the first fastener or the second fastener is a screw, a clip, bolt, pin, or tie. In the example arrangement of a single fastener, a gap, or space, may exist between microphones between the cover and the housing. That is, sound entering a lumen 110 for a first microphone may also pass through this space to a second microphone. Such cross lumen 110 sound transmission may impair a variety of far field ASR processing operations. Thus, in an example, the first vibration dampener seals space between the surface and a microphone when secured by the first fastener. This arrangement reduces acoustical leakage between microphones and lumens 110.
  • The combination linear and circular microphone arrays and mounting the microphones to inhibit leakage improve far field ASR performance over current microphone arrays. For example, the devices that use only a circular microphone array does not allow use of beam-forming techniques for linearly arranged microphones. Such beamforming helps to reduce noise, improve voice quality, and thus improve ASR performance. Further, reducing acoustical leakage and coupling (e.g., between the housing and different microphones) improves signal quality for beam-forming techniques and acoustical echo cancellation.
  • FIGS. 2-6 provide some additional detail of the components discussed above. FIG. 2 illustrates a corresponding printed circuit board (PCB) 205 to the housing 105 of FIG. 1. Here, the PCB 205 is the surface discussed above. Further, the microphone 210 is a part of a circular array, microphone 215 is a part of a linear array, and microphone 220 is a part of both the circular and linear arrays.
  • FIG. 3 illustrates an example design for a cover 305 (top view) as mentioned in FIG. 1, according to an embodiment. The darkly shaded small circles 310 represent the inlet holes (e.g., lumens) for the microphones. Other holes (e.g., small lightly shaded circles 320 on the left or the large shade circles 315 in the middle) may be added for esthetic purposes but should not create additional microphones inlets in order to control the microphone response to sound. Inter-microphone leakage may be reduced if the housing, surface 205, or cover 305 ensures that only one inlet hole (e.g., lumen) leads to a selected microphone. Thus, in an example, no other direct or indirect paths to the selected microphone are allowed. Further, sound may be transmitted through certain materials, such as the mounting between the housing and the surface. FIGS. 4-6 illustrate some example solutions to address these issues.
  • FIG. 4 is a cross sectional view of an example of a microphone board housing, according to an embodiment. In FIG. 4, the microphone PCB 415 is isolated from the external housing 405 (here illustrated as being both the housing the cover as discussed above) using an acoustical isolation layer 410. In an example, the acoustical isolation layer 410 is a rubber (or rubber-like) material from one to two millimeters (mm) in thickness. This arrangement helps ensure that the lumen through which sound arrives at the microphone is controlled and consistent.
  • Leakage from an internal loudspeaker (assuming the device uses one) to the microphones may be reduced via additional isolation. FIG. 5 illustrates an example of just such an arrangement. In an example, the additional isolation may include ten to fifteen millimeter GMS-012 air foam layer 520 on the bottom of the microphone PCB 515 and above the housing 525. In an example, there is also an acoustical isolation layer 510 between the PCB 515 and the cover 505. The acoustical isolation layer 510 will include a channel between a microphone and its corresponding lumen 530.
  • Isolating a mounting fastener, such as screws, may be used to further reduce leakage. An example of such a mounting with screws is depicted in the example of FIG. 6. In FIG. 6, the screws 610 interface the microphone board 620 (with microphone 605) to the housing 630 and is buffered by the elastomer material in layer one 615 and layer two 625. Such an interface reduces vibrations transfer from the screw 610 itself to the microphone board 620. In an example, the protective material (layers one 615 and two 625) and the microphone board 620 are arranged such that, when tightened, the screw heads are not touching the microphone PCB 620 due to the elastomer. In this example, illustrated in FIG. 6, the PCB 620 is shaped to allow the rubber-like material 615 to fill-in the space between the screw head and the PCB 620.
  • Using either the combination linear and circular microphone arrays or the isolating mounting improves microphone and microphone array performance, thus leading to good quality microphone signals. These signals may be further processed, as described above, with the far field pre-processing pipeline. When both the microphone board and the pre-processing pipeline are combined, large improvements to far field ASR performance may be achieved. From the evidence, it is clear that these systems and techniques lower WERs, leading to improved ASR performance.
  • FIG. 7 is an example of a method 700 for making a microphone board for far field automatic speech recognition, according to an embodiment. The operations of the method 700 are performed on electronic hardware, such as that described above or below (e.g., circuits).
  • At operation 705, a first plurality of microphones is disposed along a circumference of a circle on a surface. In an example, the first plurality of microphones includes six microphones.
  • At operation 710, a second plurality of microphones is disposed along a line on the surface. In an example, the second plurality of microphones includes four microphones. In an example the total of the first plurality of microphones and the second plurality of microphones is eight. In an example the first plurality of microphones has an even number of microphones. In an example the first plurality of microphones has more than two microphones. In an example the second plurality of microphones has an even number of microphones.
  • In an example the line intersects the circle. In an example the line terminates on the circle. In an example the line has a length equal to a diameter of the circle. In an example, at least one microphone is in the first plurality of microphones and is in the second plurality of microphones. In an example the line is wholly within the circle.
  • At operation 715, first connections to the first plurality of microphones are grouped together.
  • At operation 720, second connections to the second plurality of microphones are grouped together.
  • At operation 725, the first connections and the second connections are provided to an external entity via a connector.
  • The operations of the method 700 may be optionally extended to include affixing a cover to the surface with a first fastener and a first vibration dampener; and affixing the surface to a housing with a second fastener and a second vibration dampener. In an example the vibration dampener is an elastomer. In an example the first fastener and the second fastener are the same. In an example the first fastener and the second fastener are a screw. In an example the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • FIG. 8 illustrates a block diagram of an example machine 800 upon which any one or more of the techniques (e.g., methodologies) discussed herein may perform. In alternative embodiments, the machine 800 may operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, the machine 800 may operate in the capacity of a server machine, a client machine, or both in server-client network environments. In an example, the machine 800 may act as a peer machine in peer-to-peer (P2P) (or other distributed) network environment. The machine 800 may be a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a mobile telephone, a web appliance, or any machine capable of executing instructions (sequential or otherwise) that specify actions to be taken by that machine. Further, while only a single machine is illustrated, the term “machine” shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein, such as cloud computing, software as a service (SaaS), other computer cluster configurations.
  • Examples, as described herein, may include, or may operate by, logic or a number of components, or mechanisms. Circuitry is a collection of circuits implemented in tangible entities that include hardware (e.g., simple circuits, gates, logic, etc.). Circuitry membership may be flexible over time and underlying hardware variability. Circuitries include members that may, alone or in combination, perform specified operations when operating. In an example, hardware of the circuitry may be immutably designed to carry out a specific operation (e.g., hardwired). In an example, the hardware of the circuitry may include variably connected physical components (e.g., execution units, transistors, simple circuits, etc.) including a computer readable medium physically modified (e.g., magnetically, electrically, moveable placement of invariant massed particles, etc.) to encode instructions of the specific operation. In connecting the physical components, the underlying electrical properties of a hardware constituent are changed, for example, from an insulator to a conductor or vice versa. The instructions enable embedded hardware (e.g., the execution units or a loading mechanism) to create members of the circuitry in hardware via the variable connections to carry out portions of the specific operation when in operation. Accordingly, the computer readable medium is communicatively coupled to the other components of the circuitry when the device is operating. In an example, any of the physical components may be used in more than one member of more than one circuitry. For example, under operation, execution units may be used in a first circuit of a first circuitry at one point in time and reused by a second circuit in the first circuitry, or by a third circuit in a second circuitry at a different time.
  • Machine (e.g., computer system) 800 may include a hardware processor 802 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 804 and a static memory 806, some or all of which may communicate with each other via an interlink (e.g., bus) 808. The machine 800 may further include a display unit 810, an alphanumeric input device 812 (e.g., a keyboard), and a user interface (UI) navigation device 814 (e.g., a mouse). In an example, the display unit 810, input device 812 and UI navigation device 814 may be a touch screen display. The machine 800 may additionally include a storage device (e.g., drive unit) 816, a signal generation device 818 (e.g., a speaker), a network interface device 820, and one or more sensors 821, such as a global positioning system (GPS) sensor, compass, accelerometer, or other sensor. The machine 800 may include an output controller 828, such as a serial (e.g., universal serial bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection to communicate or control one or more peripheral devices (e.g., a printer, card reader, etc.).
  • The storage device 816 may include a machine readable medium 822 on which is stored one or more sets of data structures or instructions 824 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein. The instructions 824 may also reside, completely or at least partially, within the main memory 804, within static memory 806, or within the hardware processor 802 during execution thereof by the machine 800. In an example, one or any combination of the hardware processor 802, the main memory 804, the static memory 806, or the storage device 816 may constitute machine readable media.
  • While the machine readable medium 822 is illustrated as a single medium, the term “machine readable medium” may include a single medium or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) configured to store the one or more instructions 824.
  • The term “machine readable medium” may include any medium that is capable of storing, encoding, or carrying instructions for execution by the machine 800 and that cause the machine 800 to perform any one or more of the techniques of the present disclosure, or that is capable of storing, encoding or carrying data structures used by or associated with such instructions. Non-limiting machine readable medium examples may include solid-state memories, and optical and magnetic media. In an example, a massed machine readable medium comprises a machine readable medium with a plurality of particles having invariant (e.g., rest) mass. Accordingly, massed machine-readable media are not transitory propagating signals. Specific examples of massed machine readable media may include: non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices, magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.
  • The instructions 824 may further be transmitted or received over a communications network 826 using a transmission medium via the network interface device 820 utilizing any one of a number of transfer protocols (e.g., frame relay, internet protocol (IP), transmission control protocol (TCP), user datagram protocol (UDP), hypertext transfer protocol (HTTP), etc.). Example communication networks may include a local area network (LAN), a wide area network (WAN), a packet data network (e.g., the Internet), mobile telephone networks (e.g., cellular networks), Plain Old Telephone (POTS) networks, and wireless data networks (e.g., Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards known as Wi-Fi®, IEEE 802.16 family of standards known as WiMax®), IEEE 802.15.4 family of standards, peer-to-peer (P2P) networks, among others. In an example, the network interface device 820 may include one or more physical jacks (e.g., Ethernet, coaxial, or phone jacks) or one or more antennas to connect to the communications network 826. In an example, the network interface device 820 may include a plurality of antennas to wirelessly communicate using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) techniques. The term “transmission medium” shall be taken to include any intangible medium that is capable of storing, encoding or carrying instructions for execution by the machine 800, and includes digital or analog communications signals or other intangible medium to facilitate communication of such software.
  • Additional Notes & Examples
  • Example 1 is a device for creating a far-field microphone array, the device comprising: a first plurality of microphones along a circumference of a circle on a surface of the device; a second plurality of microphones along a line on the surface; a first set of connections to the first plurality of microphones; a second set of connections to the second plurality of microphones; and a connector to provide the first connections and the second connections to an external entity of the surface.
  • In Example 2, the subject matter of Example 1 optionally includes wherein the line intersects the circle.
  • In Example 3, the subject matter of Example 2 optionally includes wherein the line terminates on the circle.
  • In Example 4, the subject matter of Example 3 optionally includes wherein the line has a length equal to a diameter of the circle.
  • In Example 5, the subject matter of any one or more of Examples 3-4 optionally include wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • In Example 6, the subject matter of any one or more of Examples 1-5 optionally include wherein the line is wholly within the circle.
  • In Example 7, the subject matter of any one or more of Examples 1-6 optionally include wherein the first plurality of microphones includes six microphones.
  • In Example 8, the subject matter of any one or more of Examples 1-7 optionally include wherein the second plurality of microphones includes four microphones.
  • In Example 9, the subject matter of any one or more of Examples 1-8 optionally include wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
  • In Example 10, the subject matter of any one or more of Examples 1-9 optionally include a cover affixed to the surface with a first fastener and a first vibration dampener; and a housing affixed to the surface with a second fastener and a second vibration dampener.
  • In Example 11, the subject matter of Example 10 optionally includes wherein the vibration dampener has rubber-like properties.
  • In Example 12, the subject matter of any one or more of Examples 10-11 optionally include wherein the first fastener and the second fastener are the same and are a screw.
  • In Example 13, the subject matter of any one or more of Examples 10-12 optionally include wherein the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • Example 14 is at least one machine readable medium including instructions for creating a far-field microphone array, the instructions, when executed by a machine, causing the machine to perform operations comprising: disposing a first plurality of microphones along a circumference of a circle on a surface; disposing a second plurality of microphones along a line on the surface; grouping first connections to the first plurality of microphones together; grouping second connections to the second plurality of microphones together, and providing the first connections and the second connections to an external entity of the surface via a connector.
  • In Example 15, the subject matter of Example 14 optionally includes wherein the line intersects the circle.
  • In Example 16, the subject matter of Example 15 optionally includes wherein the line terminates on the circle.
  • In Example 17, the subject matter of Example 16 optionally includes wherein the line has a length equal to a diameter of the circle.
  • In Example 18, the subject matter of any one or more of Examples 16-17 optionally include wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • In Example 19, the subject matter of any one or more of Examples 14-18 optionally include wherein the line is wholly within the circle.
  • In Example 20, the subject matter of any one or more of Examples 14-19 optionally include wherein the first plurality of microphones includes six microphones.
  • In Example 21, the subject matter of any one or more of Examples 14-20 optionally include wherein the second plurality of microphones includes four microphones.
  • In Example 22, the subject matter of any one or more of Examples 14-21 optionally include wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
  • In Example 23, the subject matter of any one or more of Examples 14-22 optionally include wherein the operations comprise: affixing a cover to the surface with a first fastener and a first vibration dampener; and affixing the surface to a housing with a second fastener and a second vibration dampener.
  • In Example 24, the subject matter of Example 23 optionally includes wherein the vibration dampener has rubber-like properties.
  • In Example 25, the subject matter of any one or more of Examples 23-24 optionally include wherein the first fastener and the second fastener are the same and are a screw.
  • In Example 26, the subject matter of any one or more of Examples 23-25 optionally include wherein the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • Example 27 is a method for creating a far-field microphone array, the method comprising: disposing a first plurality of microphones along a circumference of a circle on a surface; disposing a second plurality of microphones along a line on the surface; grouping first connections to the first plurality of microphones together; grouping second connections to the second plurality of microphones together; and providing the first connections and the second connections to an external entity of the surface via a connector.
  • In Example 28, the subject matter of Example 27 optionally includes wherein the line intersects the circle.
  • In Example 29, the subject matter of Example 28 optionally includes wherein the line terminates on the circle.
  • In Example 30, the subject matter of Example 29 optionally includes wherein the line has a length equal to a diameter of the circle.
  • In Example 31, the subject matter of any one or more of Examples 29-30 optionally include wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • In Example 32, the subject matter of any one or more of Examples 27-31 optionally include wherein the line is wholly within the circle.
  • In Example 33, the subject matter of any one or more of Examples 27-32 optionally include wherein the first plurality of microphones includes six microphones.
  • In Example 34, the subject matter of any one or more of Examples 27-33 optionally include wherein the second plurality of microphones includes four microphones.
  • In Example 35, the subject matter of any one or more of Examples 27-34 optionally include wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
  • In Example 36, the subject matter of any one or more of Examples 27-35 optionally include affixing a cover to the surface with a first fastener and a first vibration dampener; and affixing the surface to a housing with a second fastener and a second vibration dampener.
  • In Example 37, the subject matter of Example 36 optionally includes wherein the vibration dampener with rubber-like properties.
  • In Example 38, the subject matter of any one or more of Examples 36-37 optionally include wherein the first fastener and the second fastener are the same and are a screw.
  • In Example 39, the subject matter of any one or more of Examples 36-38 optionally include wherein the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • Example 40 is a system including means to perform any of methods 27-39.
  • Example 41 is at least one machine readable medium including instructions that, when executed by a machine, cause the machine to perform any of methods 27-39.
  • Example 42 is a system for creating a far-field microphone array, the system comprising: means for disposing a first plurality of microphones along a circumference of a circle on a surface; means for disposing a second plurality of microphones along a line on the surface; means for grouping first connections to the first plurality of microphones together; means for grouping second connections to the second plurality of microphones together; and means for providing the first connections and the second connections to an external entity of the surface via a connector.
  • In Example 43, the subject matter of Example 42 optionally includes wherein the line intersects the circle.
  • In Example 44, the subject matter of Example 43 optionally includes wherein the line terminates on the circle.
  • In Example 45, the subject matter of Example 44 optionally includes wherein the line has a length equal to a diameter of the circle.
  • In Example 46, the subject matter of any one or more of Examples 44-45 optionally include wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
  • In Example 47, the subject matter of any one or more of Examples 42-46 optionally include wherein the line is wholly within the circle.
  • In Example 48, the subject matter of any one or more of Examples 42-47 optionally include wherein the first plurality of microphones includes six microphones.
  • In Example 49, the subject matter of any one or more of Examples 42-48 optionally include wherein the second plurality of microphones includes four microphones.
  • In Example 50, the subject matter of any one or more of Examples 42-49 optionally include wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
  • In Example 51, the subject matter of any one or more of Examples 42-50 optionally include means for affixing a cover to the surface with a first fastener and a first vibration dampener; and means for affixing the surface to a housing with a second fastener and a second vibration dampener.
  • In Example 52, the subject matter of Example 51 optionally includes wherein the vibration dampener with rubber-like properties.
  • In Example 53, the subject matter of any one or more of Examples 51-52 optionally include wherein the first fastener and the second fastener are the same and are a screw.
  • In Example 54, the subject matter of any one or more of Examples 51-53 optionally include wherein the first vibration dampener seals space between the surface and a microphone when secured by the first fastener.
  • The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments that may be practiced. These embodiments are also referred to herein as “examples.” Such examples may include elements in addition to those shown or described. However, the present inventors also contemplate examples in which only those elements shown or described are provided. Moreover, the present inventors also contemplate examples using any combination or permutation of those elements shown or described (or one or more aspects thereof), either with respect to a particular example (or one or more aspects thereof), or with respect to other examples (or one or more aspects thereof) shown or described herein.
  • All publications, patents, and patent documents referred to in this document are incorporated by reference herein in their entirety, as though individually incorporated by reference. In the event of inconsistent usages between this document and those documents so incorporated by reference, the usage in the incorporated reference(s) should be considered supplementary to that of this document; for irreconcilable inconsistencies, the usage in this document controls.
  • In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of“at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, device, article, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.
  • The above description is intended to be illustrative, and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments may be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is to allow the reader to quickly ascertain the nature of the technical disclosure and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment. The scope of the embodiments should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims (24)

What is claimed is:
1. A device for creating a far-field microphone array, the device comprising:
a first plurality of microphones along a circumference of a circle on a surface of the device;
a second plurality of microphones along a line on the surface;
a first set of connections to the first plurality of microphones;
a second set of connections to the second plurality of microphones; and
a connector to provide the first connections and the second connections to an external entity of the surface.
2. The device of claim 1, wherein the line intersects the circle.
3. The device of claim 2, wherein the line terminates on the circle.
4. The device of claim 3, wherein the line has a length equal to a diameter of the circle.
5. The device of claim 3, wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
6. The device of claim 1, wherein the line is wholly within the circle.
7. The device of claim 1, wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
8. The device of claim 1, comprising:
a cover affixed to the surface with a first fastener and a first vibration dampener; and
a housing affixed to the surface with a second fastener and a second vibration dampener.
9. At least one machine readable medium including instructions for creating a far-field microphone array, the instructions, when executed by a machine, causing the machine to perform operations comprising:
disposing a first plurality of microphones along a circumference of a circle on a surface;
disposing a second plurality of microphones along a line on the surface;
grouping first connections to the first plurality of microphones together;
grouping second connections to the second plurality of microphones together; and
providing the first connections and the second connections to an external entity of the surface via a connector.
10. The at least one machine readable medium of claim 9, wherein the line intersects the circle.
11. The at least one machine readable medium of claim 10, wherein the line terminates on the circle.
12. The at least one machine readable medium of claim 11, wherein the line has a length equal to a diameter of the circle.
13. The at least one machine readable medium of claim 11, wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
14. The at least one machine readable medium of claim 9, wherein the line is wholly within the circle.
15. The at least one machine readable medium of claim 9, wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
16. The at least one machine readable medium of claim 9, wherein the operations comprise:
affixing a cover to the surface with a first fastener and a first vibration dampener; and
affixing the surface to a housing with a second fastener and a second vibration dampener.
17. A method for creating a far-field microphone array, the method comprising:
disposing a first plurality of microphones along a circumference of a circle on a surface;
disposing a second plurality of microphones along a line on the surface;
grouping first connections to the first plurality of microphones together;
grouping second connections to the second plurality of microphones together; and
providing the first connections and the second connections to an external entity of the surface via a connector.
18. The method of claim 17, wherein the line intersects the circle.
19. The method of claim 18, wherein the line terminates on the circle.
20. The method of claim 19, wherein the line has a length equal to a diameter of the circle.
21. The method of claim 19, wherein at least one microphone is in the first plurality of microphones and is in the second plurality of microphones.
22. The method of claim 17, wherein the line is wholly within the circle.
23. The method of claim 17, wherein the total of the first plurality of microphones and the second plurality of microphones is eight, wherein the first plurality of microphones has an even number of microphones, wherein the first plurality of microphones has more than two microphones, and wherein the second plurality of microphones has an even number of microphones.
24. The method of claim 17, comprising:
affixing a cover to the surface with a first fastener and a first vibration dampener; and
affixing the surface to a housing with a second fastener and a second vibration dampener.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170365255A1 (en) * 2016-06-15 2017-12-21 Adam Kupryjanow Far field automatic speech recognition pre-processing
EP3576426A1 (en) * 2018-05-31 2019-12-04 Harman International Industries, Incorporated Low compexity multi-channel smart loudspeaker with voice control
USD920137S1 (en) * 2018-03-07 2021-05-25 Intel Corporation Acoustic imaging device

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107290711A (en) * 2016-03-30 2017-10-24 芋头科技(杭州)有限公司 A kind of voice is sought to system and method
US11037330B2 (en) * 2017-04-08 2021-06-15 Intel Corporation Low rank matrix compression
US10403299B2 (en) * 2017-06-02 2019-09-03 Apple Inc. Multi-channel speech signal enhancement for robust voice trigger detection and automatic speech recognition
CN109979476B (en) * 2017-12-28 2021-05-14 电信科学技术研究院 Method and device for removing reverberation of voice
US10313786B1 (en) * 2018-03-20 2019-06-04 Cisco Technology, Inc. Beamforming and gainsharing mixing of small circular array of bidirectional microphones
US20190324117A1 (en) * 2018-04-24 2019-10-24 Mediatek Inc. Content aware audio source localization
US10586538B2 (en) * 2018-04-25 2020-03-10 Comcast Cable Comminications, LLC Microphone array beamforming control
US10573301B2 (en) 2018-05-18 2020-02-25 Intel Corporation Neural network based time-frequency mask estimation and beamforming for speech pre-processing
CN110491403B (en) 2018-11-30 2022-03-04 腾讯科技(深圳)有限公司 Audio signal processing method, device, medium and audio interaction equipment
US11902758B2 (en) * 2018-12-21 2024-02-13 Gn Audio A/S Method of compensating a processed audio signal
CN109524004B (en) * 2018-12-29 2022-03-08 思必驰科技股份有限公司 Method for realizing parallel transmission of multi-channel audio and data, external voice interaction device and system
CN109767769B (en) 2019-02-21 2020-12-22 珠海格力电器股份有限公司 Voice recognition method and device, storage medium and air conditioner
GB201902812D0 (en) * 2019-03-01 2019-04-17 Nokia Technologies Oy Wind noise reduction in parametric audio
CN110310655B (en) * 2019-04-22 2021-10-22 广州视源电子科技股份有限公司 Microphone signal processing method, device, equipment and storage medium
KR20200132613A (en) 2019-05-16 2020-11-25 삼성전자주식회사 Method and apparatus for speech recognition with wake on voice
KR20210017252A (en) 2019-08-07 2021-02-17 삼성전자주식회사 Method for processing audio sound based on multi-channel and an electronic device
CN111341345B (en) * 2020-05-21 2021-04-02 深圳市友杰智新科技有限公司 Control method and device of voice equipment, voice equipment and storage medium
CN112887877B (en) * 2021-01-28 2023-09-08 歌尔科技有限公司 Audio parameter setting method and device, electronic equipment and storage medium

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098865B2 (en) * 2002-03-15 2006-08-29 Bruel And Kjaer Sound And Vibration Measurement A/S Beam forming array of transducers
US7602931B2 (en) * 2004-05-18 2009-10-13 Kabushiki Kaisha Audio-Technica Gasket for reducing electromagnetic interference in a boundary microphone
US20110164760A1 (en) * 2009-12-10 2011-07-07 FUNAI ELECTRIC CO., LTD. (a corporation of Japan) Sound source tracking device
US8243951B2 (en) * 2005-12-19 2012-08-14 Yamaha Corporation Sound emission and collection device
US8861756B2 (en) * 2010-09-24 2014-10-14 LI Creative Technologies, Inc. Microphone array system
US8903106B2 (en) * 2007-07-09 2014-12-02 Mh Acoustics Llc Augmented elliptical microphone array
US20150117672A1 (en) * 2013-10-25 2015-04-30 Harman Becker Automotive Systems Gmbh Microphone array
US20160142620A1 (en) * 2013-02-15 2016-05-19 Panasonic Intellectual Property Management Co., Ltd. Directionality control system, calibration method, horizontal deviation angle computation method, and directionality control method
US9456276B1 (en) * 2014-09-30 2016-09-27 Amazon Technologies, Inc. Parameter selection for audio beamforming
US20170064441A1 (en) * 2015-08-31 2017-03-02 Panasonic Intellectual Property Management Co., Ltd. Sound source localization apparatus
US20170264999A1 (en) * 2014-12-15 2017-09-14 Panasonic Intellectual Property Management C., Ltd. Microphone array, monitoring system, and sound pickup setting method
US9843851B2 (en) * 2015-05-22 2017-12-12 Amazon Technologies, Inc. Portable speaker system

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07109560B2 (en) * 1990-11-30 1995-11-22 富士通テン株式会社 Voice recognizer
US6453289B1 (en) * 1998-07-24 2002-09-17 Hughes Electronics Corporation Method of noise reduction for speech codecs
US6314396B1 (en) * 1998-11-06 2001-11-06 International Business Machines Corporation Automatic gain control in a speech recognition system
JP3180786B2 (en) * 1998-11-27 2001-06-25 日本電気株式会社 Audio encoding method and audio encoding device
US6314394B1 (en) * 1999-05-27 2001-11-06 Lear Corporation Adaptive signal separation system and method
US6122331A (en) * 1999-06-14 2000-09-19 Atmel Corporation Digital automatic gain control
KR100304666B1 (en) * 1999-08-28 2001-11-01 윤종용 Speech enhancement method
US6636829B1 (en) * 1999-09-22 2003-10-21 Mindspeed Technologies, Inc. Speech communication system and method for handling lost frames
JP2004537233A (en) 2001-07-20 2004-12-09 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Acoustic reinforcement system with echo suppression circuit and loudspeaker beamformer
KR20040019362A (en) 2001-07-20 2004-03-05 코닌클리케 필립스 일렉트로닉스 엔.브이. Sound reinforcement system having an multi microphone echo suppressor as post processor
JP3984842B2 (en) * 2002-03-12 2007-10-03 松下電器産業株式会社 Howling control device
CA2388439A1 (en) * 2002-05-31 2003-11-30 Voiceage Corporation A method and device for efficient frame erasure concealment in linear predictive based speech codecs
US6798380B2 (en) * 2003-02-05 2004-09-28 University Of Florida Research Foundation, Inc. Robust capon beamforming
US7039200B2 (en) * 2003-03-31 2006-05-02 Microsoft Corporation System and process for time delay estimation in the presence of correlated noise and reverberation
DE60325699D1 (en) 2003-05-13 2009-02-26 Harman Becker Automotive Sys Method and system for adaptive compensation of microphone inequalities
US7415117B2 (en) 2004-03-02 2008-08-19 Microsoft Corporation System and method for beamforming using a microphone array
DE602007011594D1 (en) * 2006-04-27 2011-02-10 Dolby Lab Licensing Corp SOUND AMPLIFICATION WITH RECORDING OF PUBLIC EVENTS ON THE BASIS OF SPECIFIC VOLUME
EP1885154B1 (en) 2006-08-01 2013-07-03 Nuance Communications, Inc. Dereverberation of microphone signals
CN101192862B (en) * 2006-11-30 2013-01-16 昂达博思公司 Method and device for automatic gain control in wireless communication system
GB0703275D0 (en) * 2007-02-20 2007-03-28 Skype Ltd Method of estimating noise levels in a communication system
US8488803B2 (en) 2007-05-25 2013-07-16 Aliphcom Wind suppression/replacement component for use with electronic systems
KR100905586B1 (en) * 2007-05-28 2009-07-02 삼성전자주식회사 System and method of estimating microphone performance for recognizing remote voice in robot
JP5075664B2 (en) * 2008-02-15 2012-11-21 株式会社東芝 Spoken dialogue apparatus and support method
JP5102165B2 (en) 2008-09-22 2012-12-19 株式会社デンソー Radar equipment
US8032236B2 (en) * 2008-09-30 2011-10-04 Rockwell Automation Technologies, Inc. Asymetrical process parameter control system and method
CN101986386B (en) * 2009-07-29 2012-09-26 比亚迪股份有限公司 Method and device for eliminating voice background noise
US20110188671A1 (en) * 2009-10-15 2011-08-04 Georgia Tech Research Corporation Adaptive gain control based on signal-to-noise ratio for noise suppression
TWI415117B (en) 2009-12-25 2013-11-11 Univ Nat Chiao Tung Dereverberation and noise redution method for microphone array and apparatus using the same
US8798278B2 (en) * 2010-09-28 2014-08-05 Bose Corporation Dynamic gain adjustment based on signal to ambient noise level
US9100734B2 (en) 2010-10-22 2015-08-04 Qualcomm Incorporated Systems, methods, apparatus, and computer-readable media for far-field multi-source tracking and separation
KR20120128542A (en) 2011-05-11 2012-11-27 삼성전자주식회사 Method and apparatus for processing multi-channel de-correlation for cancelling multi-channel acoustic echo
FR2976710B1 (en) 2011-06-20 2013-07-05 Parrot DEBRISING METHOD FOR MULTI-MICROPHONE AUDIO EQUIPMENT, IN PARTICULAR FOR A HANDS-FREE TELEPHONY SYSTEM
WO2013166080A1 (en) * 2012-04-30 2013-11-07 Creative Technology Ltd A universal reconfigurable echo cancellation system
IN2015DN00484A (en) 2012-07-27 2015-06-26 Sony Corp
US9584642B2 (en) * 2013-03-12 2017-02-28 Google Technology Holdings LLC Apparatus with adaptive acoustic echo control for speakerphone mode
US9338551B2 (en) * 2013-03-15 2016-05-10 Broadcom Corporation Multi-microphone source tracking and noise suppression
US9449594B2 (en) 2013-09-17 2016-09-20 Intel Corporation Adaptive phase difference based noise reduction for automatic speech recognition (ASR)
US9571930B2 (en) * 2013-12-24 2017-02-14 Intel Corporation Audio data detection with a computing device
US9124234B1 (en) * 2014-04-11 2015-09-01 Entropic Communications, LLC. Method and apparatus for adaptive automatic gain control
JP2016169358A (en) * 2014-07-24 2016-09-23 セントラル硝子株式会社 Curable silicone resin composition and cured product of the same, and optical semiconductor device using them
US9997170B2 (en) 2014-10-07 2018-06-12 Samsung Electronics Co., Ltd. Electronic device and reverberation removal method therefor
US20160150315A1 (en) * 2014-11-20 2016-05-26 GM Global Technology Operations LLC System and method for echo cancellation
US9390723B1 (en) * 2014-12-11 2016-07-12 Amazon Technologies, Inc. Efficient dereverberation in networked audio systems
US9800279B2 (en) * 2015-02-16 2017-10-24 Samsung Electronics Co., Ltd. Method and apparatus for automatic gain control in wireless receiver
CN104810021B (en) * 2015-05-11 2017-08-18 百度在线网络技术(北京)有限公司 The pre-treating method and device recognized applied to far field
CN105355210B (en) * 2015-10-30 2020-06-23 百度在线网络技术(北京)有限公司 Preprocessing method and device for far-field speech recognition
US9754605B1 (en) * 2016-06-09 2017-09-05 Amazon Technologies, Inc. Step-size control for multi-channel acoustic echo canceller
US20170366897A1 (en) * 2016-06-15 2017-12-21 Robert Azarewicz Microphone board for far field automatic speech recognition

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098865B2 (en) * 2002-03-15 2006-08-29 Bruel And Kjaer Sound And Vibration Measurement A/S Beam forming array of transducers
US7602931B2 (en) * 2004-05-18 2009-10-13 Kabushiki Kaisha Audio-Technica Gasket for reducing electromagnetic interference in a boundary microphone
US8243951B2 (en) * 2005-12-19 2012-08-14 Yamaha Corporation Sound emission and collection device
US8903106B2 (en) * 2007-07-09 2014-12-02 Mh Acoustics Llc Augmented elliptical microphone array
US20110164760A1 (en) * 2009-12-10 2011-07-07 FUNAI ELECTRIC CO., LTD. (a corporation of Japan) Sound source tracking device
US8861756B2 (en) * 2010-09-24 2014-10-14 LI Creative Technologies, Inc. Microphone array system
US20160142620A1 (en) * 2013-02-15 2016-05-19 Panasonic Intellectual Property Management Co., Ltd. Directionality control system, calibration method, horizontal deviation angle computation method, and directionality control method
US20150117672A1 (en) * 2013-10-25 2015-04-30 Harman Becker Automotive Systems Gmbh Microphone array
US9456276B1 (en) * 2014-09-30 2016-09-27 Amazon Technologies, Inc. Parameter selection for audio beamforming
US20170264999A1 (en) * 2014-12-15 2017-09-14 Panasonic Intellectual Property Management C., Ltd. Microphone array, monitoring system, and sound pickup setting method
US9843851B2 (en) * 2015-05-22 2017-12-12 Amazon Technologies, Inc. Portable speaker system
US20170064441A1 (en) * 2015-08-31 2017-03-02 Panasonic Intellectual Property Management Co., Ltd. Sound source localization apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170365255A1 (en) * 2016-06-15 2017-12-21 Adam Kupryjanow Far field automatic speech recognition pre-processing
US10657983B2 (en) 2016-06-15 2020-05-19 Intel Corporation Automatic gain control for speech recognition
USD920137S1 (en) * 2018-03-07 2021-05-25 Intel Corporation Acoustic imaging device
EP3576426A1 (en) * 2018-05-31 2019-12-04 Harman International Industries, Incorporated Low compexity multi-channel smart loudspeaker with voice control
CN110557710A (en) * 2018-05-31 2019-12-10 哈曼国际工业有限公司 low complexity multi-channel intelligent loudspeaker with voice control
US10667071B2 (en) 2018-05-31 2020-05-26 Harman International Industries, Incorporated Low complexity multi-channel smart loudspeaker with voice control

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