US20170310059A1 - Header for a medical implant device, particularly for a pacemaker - Google Patents

Header for a medical implant device, particularly for a pacemaker Download PDF

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Publication number
US20170310059A1
US20170310059A1 US15/489,874 US201715489874A US2017310059A1 US 20170310059 A1 US20170310059 A1 US 20170310059A1 US 201715489874 A US201715489874 A US 201715489874A US 2017310059 A1 US2017310059 A1 US 2017310059A1
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United States
Prior art keywords
header
circuit board
medical implant
housing
implant device
Prior art date
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Abandoned
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US15/489,874
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English (en)
Inventor
Martin Henschel
Jan Litzke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Biotronik SE and Co KG
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Biotronik SE and Co KG
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Filing date
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Application filed by Biotronik SE and Co KG filed Critical Biotronik SE and Co KG
Assigned to BIOTRONIK SE & CO. KG reassignment BIOTRONIK SE & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HENSCHEL, MARTIN, LITZKE, JAN
Publication of US20170310059A1 publication Critical patent/US20170310059A1/en
Priority to US16/577,882 priority Critical patent/US11342717B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/0205—Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
    • A61B5/02055—Simultaneously evaluating both cardiovascular condition and temperature
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/103—Detecting, measuring or recording devices for testing the shape, pattern, colour, size or movement of the body or parts thereof, for diagnostic purposes
    • A61B5/11—Measuring movement of the entire body or parts thereof, e.g. head or hand tremor, mobility of a limb
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/14532—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring glucose, e.g. by tissue impedance measurement
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/14542—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring blood gases
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
    • A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
    • A61B5/686—Permanently implanted devices, e.g. pacemakers, other stimulators, biochips
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B7/00—Instruments for auscultation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
    • A61B90/39—Markers, e.g. radio-opaque or breast lesions markers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/362—Heart stimulators
    • A61N1/37—Monitoring; Protecting
    • A61N1/3718—Monitoring of or protection against external electromagnetic fields or currents
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3756—Casings with electrodes thereon, e.g. leadless stimulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5224—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases for medical use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6691—Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/58—Contacts spaced along longitudinal axis of engagement
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
    • A61B90/36—Image-producing devices or illumination devices not otherwise provided for
    • A61B2090/364—Correlation of different images or relation of image positions in respect to the body
    • A61B2090/367—Correlation of different images or relation of image positions in respect to the body creating a 3D dataset from 2D images using position information
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
    • A61B90/36—Image-producing devices or illumination devices not otherwise provided for
    • A61B90/37—Surgical systems with images on a monitor during operation
    • A61B2090/376—Surgical systems with images on a monitor during operation using X-rays, e.g. fluoroscopy
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
    • A61B90/39—Markers, e.g. radio-opaque or breast lesions markers
    • A61B2090/3966—Radiopaque markers visible in an X-ray image
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/021—Measuring pressure in heart or blood vessels
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/08—Detecting, measuring or recording devices for evaluating the respiratory organs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles

Definitions

  • This document concerns an invention relating generally to a header for a medical implant device, as well as to a medical implant device incorporating such a header.
  • a header also referred to as a connection housing, is used to connect electrode lines or at other lines to a circuit or other electrical components of a medical implant device.
  • a header usually includes a header housing which may be made out of an insulating (and preferably transparent) material, often a plastic material such as polyurethane (PU), polycarbonate (PC), and/or epoxy resin.
  • PU polyurethane
  • PC polycarbonate
  • epoxy resin epoxy resin
  • An exemplary version of the invention involves a medical implant device header configured for providing an electrical connection to a circuit of the medical implant device, particularly between an electrode and a medical implant device circuit situated in a housing of the medical implant device, wherein the header includes a circuit board; a header housing which encloses the circuit board and is configured to be connected to the housing of the medical implant device; and a sensor system provided on the circuit board.
  • a medical implant device header configured for providing an electrical connection to a circuit of the medical implant device, particularly between an electrode and a medical implant device circuit situated in a housing of the medical implant device, wherein the header includes a circuit board; a header housing which encloses the circuit board and is configured to be connected to the housing of the medical implant device; and a sensor system provided on the circuit board.
  • the header can achieve a higher degree of integration, allowing for easier automation of the assembly of the header and the medical implant device.
  • the header housing may be transparent, and can be made of the materials mentioned above, and/or of other suitable electrically insulating materials.
  • the header housing may include an externally accessible cavity for connecting components to the header that are to be electrically connected to the medical implant device header, e.g., one or more implantable electrode lines. These lines may be intracardial or epicardial electrode lines, nerve lines, or other lines. Other components may also or alternatively be connected to the medical implant device by way of the header.
  • the circuit board also referred to as “substrate”—may be made out of an insulating material, such as a ceramics (particularly biocompatible ceramics), liquid crystal polymers (LCP), polyether ether ketones (PEEK), polysulfones (PSU), or other suitable materials.
  • a ceramics particularly biocompatible ceramics
  • LCP liquid crystal polymers
  • PEEK polyether ether ketones
  • PSU polysulfones
  • Gold may be used as a material for circuit paths of the circuit board, particularly when ceramics material is used for the circuit board.
  • LTCC low temperature cofired ceramics
  • HTCC high temperature cofired ceramics
  • the circuit board may include one or more layers, and may be manufactured and processed using manufacturing methods associated with molded interconnect devices (MID). Such methods include, for example, two (or multi) component injection molding, hot stamping, laser direct structuring (LDS), mask processing techniques, in-mold film laminating, and Flamecon processing. Using such methods, it is possible to apply, integrate and electrically connect features such as conductor lines, connectors and contacts (for instance IS-1/DF-1 connectors, quadrupole connectors), a neurostimulator module, sensors, antennae, X-ray markers, and/or positioning markers (for assembly), all on and/or in the circuit board.
  • MID molded interconnect devices
  • the sensor system may be configured to measure one or more of: a quantity related to patient health status; blood glucose concentration; blood pressure; blood oxygen concentration; temperature; acceleration; patient posture; respiration; sound; and magnetic and/or electromagnetic field strength (or other field characteristics).
  • the sensor system may also or alternatively be configured to measure an optical or chemical parameter, or a genetic quantity.
  • the sensor system can include sensors located in other parts of the medical implant device, such as in the device body or the electrode lines, wherein the sensor system performs measurements using one sensor, more than one sensor or a combination of sensors.
  • the header can include at least one antenna for receiving or transmitting signals, the antenna being integrated into the circuit board, wherein the antenna includes layers integrated into the circuit board.
  • the antenna's receiving and transmitting capabilities can be significantly increased by including several stacked layers.
  • the circuit board may include color and/or symbolic markers for identifying connectors of the header.
  • the circuit board may include an x-ray marker for generating a defined contrast in an x-ray image of the header.
  • a filter for reducing electromagnetic interference such as interference caused by radiofrequency waves or by the high frequency field of an MRI (magnetic resonance imaging) machine, may be provided on the circuit board.
  • a converter for converting energy induced by MRI into photonic energy may be provided on the circuit board.
  • the converter may include a diode array for converting energy induced into the header and medical implant device into photonic energy, providing the medical implant device with improved MRI compatibility.
  • the circuit board may be a closed circuit board.
  • the circuit board may include an aperture, particularly a central aperture, particularly for the arrangement of connector contact members for making connections to electrical components of the header.
  • the circuit board may be manufactured via three-dimensional (3D) printing techniques, whereby ceramic, metallic and/or polymer carrier materials are printed with circuit traces and features.
  • the circuit board may include one or more optical markers, particularly for use in automated mounting, welding, and/or other assembly processes.
  • the circuit board may be formed by a multicomponent molding process, preferably a two-component molding process, such as molding processes associated with molded interconnect devices (MID).
  • a multicomponent molding process preferably a two-component molding process, such as molding processes associated with molded interconnect devices (MID).
  • MID molded interconnect devices
  • the circuit board may include contact pads for electrically connecting the circuit board to the medical implant device, particularly to the circuit of the medical implant device (e.g., to an electronic control unit of the medical implant device).
  • the circuit board may include structures for fixation of the circuit board in the housing of the header.
  • the header may include an electrically conducting connection assembly electrically connected to the circuit board and configured to be connected (preferably releasably connected) to an electrode or and/or other components for providing an electrically conducting connection between the electrode(s)/components and the circuit board.
  • the connection assembly preferably includes a DF-4 connector, an IS-4 connector, a DF-1 connector, and/or an IS-1 connector for making connection to the electrode(s)/component.
  • connection assembly may also include sealing, insulating and/or mounting components, preferably formed of a thermoplastic or a duroplastic material.
  • connection assembly may include pins configured to be plugged into corresponding openings of the circuit board, e.g., for making electrical contact and/or for fastening the connection assembly to the circuit board.
  • the connection assembly may be configured to be melted/fused on the circuit board for permanently fastening it to the circuit board.
  • connection assembly is preferably connected to the circuit board via a connector contact member, preferably a sheet metal contact member.
  • the connection assembly may be connected to the connector contact member by means of welding, crimping, soldering, plugging, gluing, or by using spring contacts.
  • the circuit board may be formed as a circumferential frame defining a central aperture as described above, wherein the frame includes opposing first and second frame regions integrally connected to each other by opposing third and fourth lateral frame regions so as to form the frame shape of the circuit board surrounding the central aperture of the circuit board.
  • the first and second frame regions may be connected to each other by connector contact members, e.g., elongated contact strips, via which the connection assembly may be electrically connected to the circuit board.
  • the connector contact members extend across the central aperture of the circuit board.
  • the connection assembly is a DF-4 module (i.e., it forms a DF-4 connector), wherein the header then includes four connector contact members in the form of elongated contact strips that extend across the central aperture.
  • the header may include two additional connector contact members extending from the second frame member, which can be positioned further away from the housing of the medical implant device than the first frame region (when the header housing and the medical implant device housing are connected to each other).
  • the additional connector contact members extend outwardly and away from the central aperture/circuit board, and are connected to an additional connection assembly forming an IS-1 connector.
  • the connection assembly and the additional connection assembly may be integrally or otherwise connected to each other, and/or may form a pre-mounted assembly.
  • the circuit board may include a through-hole in the second frame member for fixing and/or positioning of the connection assembly (and possibly any additional connection assembly) to the circuit board.
  • Contact pads for electrically connecting the circuit board to the medical implant device may be provided on the first frame region.
  • the circuit board may be embedded in the housing of the header in a casted material, i.e., a material cast around the circuit board by injection molding or any other suitable casting process).
  • the invention also encompasses a medical implant device (such as a pacemaker or biomonitor) including a housing for accommodating a circuit (which may include a battery, an electronic control unit, and/or other electrical components), and a header as described above, wherein the header housing is fastened to the housing of the medical implant device.
  • a medical implant device such as a pacemaker or biomonitor
  • a housing for accommodating a circuit which may include a battery, an electronic control unit, and/or other electrical components
  • a header housing as described above, wherein the header housing is fastened to the housing of the medical implant device.
  • the housing of the medical implant device may include a feedthrough by which the circuit board is electrically connected to the circuit of the medical implant device, for example, by an intermediate contact member.
  • the medical implant device circuit may therefore be contacted from outside the medical implant device housing, which is preferably hermetically sealed, without breaking the seal of the medical implant device housing.
  • the intermediate contact member which may take the form of a flat or angled sheet metal member, or a sheet metal member forming a sleeve, may be connected to the circuit board and/or the feedthrough by means of welding, crimping, soldering, plugging, gluing, or by making a spring contact.
  • the feedthrough may be defined by a feedthrough assembly including a carrier body with a top side and a bottom side, and an electrical contact body extending from both the top side and the bottom side of the carrier body.
  • the electrical contact body is angled and includes a first limb extending transversely to a second limb.
  • the electrical contact body is provided on an insulating body, which can extend through the carrier body to protrude from the top side of the carrier body, and can protrude from, be flush with, or be recessed within the bottom side of the carrier body.
  • the carrier body includes an opening next to the insulating body, wherein the opening can receive a positioning unit that locally positions the electrical contact body.
  • the positioning unit has a lower end aligned with a bottom side of the second limb of the electrical contact body, and an upper end protruding from the top side of the insulating body. Further details on a feedthrough assembly of this nature are provided in U.S. Pat. No. 8,920,198.
  • the feedthrough includes electrical connectors which represent separate electrical channels leading from separate electrical connections from the circuitry inside the medical implant device housing to the outside of the housing.
  • an integrated circuit is provided on the circuit board of the header, wherein the integrated circuit is configured to control the medical implant device.
  • the circuit in the medical implant device housing (which may be formed in whole or part of platinum) includes an energy source and/or a capacitor that may be encapsulated in the housing.
  • a multiplexer circuit may be provided on the circuit board of the header, with the multiplexer circuit including one or more input interfaces and output interfaces.
  • the input interfaces may each be electrically connected to an electrical connector of the feedthrough, and each output interface may be electrically coupled to one of the electrodes of the medical implant device.
  • signals from the circuit located inside the medical implant device housing may be transferred via the electrical connectors of the feedthrough, through the multiplexer circuit, and to the electrodes.
  • the multiplexer circuit is configured to switch each input interface to a designated electrical connector of the feedthrough, and switch each output interface to a designated electrode, and thereby establish the desired connection between the electrical connector of the feedthrough and the desired electrode.
  • a multiplexer circuit of this nature can allow reduction in the number of separate electric conductors in the header and the number of electrical connectors of the feedthrough.
  • the multiplexer circuit may use different operational methods. It can multiplex via electrical conductors by: application of logic elements are which operate as relays; using binary encoded signals for controlling the therapy; using frequency multiplexing, for example, by using an antenna of the medical implant device (whereby data for controlling therapy can be transmitted using frequencies different from those used for RF communication); and/or via serial data exchange, e.g. similar to Universal Serial Bus (USB) data exchange. Alternatively or additionally, it can multiplex via optical methods, as by transmitting the signals through fiber optic cables or other light-transmitting elements (including through transparent apertures/passages in the feedthrough), whereby infrared (IR) or other signals can be transmitted between the circuitry inside the medical implant device housing and the header.
  • IR infrared
  • the feedthrough electrical connectors, multiplexer circuit, and electrodes may carry signals different from therapy signals, such as (for example) data measured by the sensors.
  • the multiplexer circuit is encompassed by a biocompatible material to protect the circuit from body fluids.
  • a biocompatible material are resins and polymer materials, such as polysulfones, silicones, or glass.
  • the header housing may be integrally formed with the housing of the medical implant device.
  • the medical implant device may be a so-called leadless pacemaker and/or cardiac monitor that does not include external electrode lines, and rather uses internal electrode lines arranged in the header.
  • FIG. 1 shows an version of a header of a medical implant device in the form of a pace maker, wherein the header is connected to a housing of the medical implant device;
  • FIG. 2 shows the header according to FIG. 1 without its header housing
  • FIG. 3 shows a circuit board of the header
  • FIG. 4 shows a further illustration of the circuit board of FIG. 3 ;
  • FIG. 5 shows the header according to FIGS. 1 to 4 connected to a feedthrough assembly of the medical implant device
  • FIG. 6 shows a further version of a header/medical implant device according to the invention, wherein the header is integrally formed with the housing of the medical implant device which optionally merely houses the energy source of the device;
  • FIG. 7 shows a close up of an version of a circuit board according to the invention with a multiple layer structure.
  • FIGS. 1-5 shows a header 1 and a medical implant device 2 exemplifying the invention.
  • the header 1 is configured to provide an electrical connection of at least one electrode 3 ( FIG. 6 ) to a circuit 40 (which is not shown in detail) situated in a hermetically sealed housing 4 of the medical implant device 2 .
  • the header 1 includes at least one circuit board 20 , and a preferably transparent and electrically insulating header housing 10 which encloses the circuit board 20 and is configured to be connected to the housing 4 of the medical implant device 2 .
  • a sensor system 30 FIGS.
  • circuit board 20 is adapted to measure at least one of the following quantities: a quantity related to patient health status; blood glucose concentration; blood pressure; blood oxygen concentration; temperature; acceleration; patient posture; respiration; sound; and magnetic and/or electromagnetic field strength (or other field characteristics)
  • the circuit board 20 is flat, and is preferably formed as a circumferential frame defining a central aperture 203 (see particularly FIGS. 2-4 ).
  • the circuit board 20 includes opposing first and second frame regions 21 and 22 integrally connected to each other by opposing third and fourth lateral frame regions 23 , 24 , with these frame regions surrounding the central aperture 203 of the circuit board 20 .
  • the circuit board 20 is preferably formed out of a low temperature cofired ceramics (LTCC) material.
  • LTCC low temperature cofired ceramics
  • FIG. 2 depicts two connection assemblies 50 a , 50 b that may form a pre-mounted or integrally formed connection assembly 50 , and that provide (for example) a DF-4 connector 50 b and an IS-1 connector 50 a for connecting at least one electrode line.
  • the circuit board 20 includes a corresponding number of connector contact members 51 , 53 ( FIGS. 2-5 ) in the form of elongated metal contact strips.
  • To connect the circuit board 20 to the connection assembly (DF-4 connector) 50 b four of these connector contact members 51 extend from the first frame region 21 to the second frame region 22 across the aperture 203 , and are welded, soldered, or otherwise connected to contacts 52 provided on the DF-4 connector 50 b .
  • the connector contact members 51 are attached to first and second frame regions 21 , 22 of the circuit board 20 by means of projections 206 ( FIG. 3 ) which hold the members 51 in place.
  • connection assembly (IS-1 connector) 50 a two further connector contact members 53 protrude from the second frame member 22 outwardly away from the central aperture 203 , and are welded, soldered, or otherwise connected to corresponding contacts 54 ( FIGS. 2, 5 ) of the IS-1 connector.
  • the circuit board 20 includes a through-hole 204 ( FIGS. 2-5 ) on the second frame region 22 , which preferably includes a circular boundary section joined by a straight boundary section.
  • the circuit board 20 includes an antenna 28 for receiving or transmitting signals.
  • the antenna 28 extends in a meandering path around the central aperture 203 in multiple layers of the circuit board 20 .
  • FIG. 7 shows a close-up view of an exemplary version of the circuit board 20 , showing the layer structure including three layers 71 , 72 and 73 . Shown is a first top layer 71 , where an exemplary conductor trace is depicted. The deeper layers 72 and 73 are pointed out in FIG. 7 from on the side edge of circuit board 20 .
  • the circuit board includes indicia such as color and/or symbolic markers 29 , 31 for identifying the aforementioned connectors 50 a , 50 b of the header 1 .
  • the symbolic markers are implemented as alphanumeric text 31
  • the color markers are implemented as light-emitting diodes 29 , wherein diodes in different colors can indicate different contact states of the connectors 50 a , 50 b .
  • a red diode might glow when an improper contact is detected, and a green diode might glow when a proper contact has been established.
  • the circuit board preferably includes an x-ray marker 26 for generating a defined contrast in an x-ray image of the header 1 .
  • the header 1 preferably includes a filter on the circuit board 20 for reducing electromagnetic interference.
  • the header's circuit board 20 preferably also includes a converter for converting energy induced by MRI into photonic energy.
  • the circuit board 20 /converter may include a diode array for this purpose.
  • the filter and the converter may be located at any suitable place on the circuit board 20 , or may be implemented as separate components. In FIGS. 3-4 , the filter and the converter are included in the sensor system 30 .
  • the circuit board 20 preferably includes optical markers 25 for use in an automated mounting and/or welding process.
  • the markers can be used to determine the position and orientation of the circuit board 20 .
  • the circuit board 20 preferably includes contact pads 27 ( FIGS. 2-4 ), preferably on the first frame region 21 .
  • the contact pads 27 may be connected to the connector contact members 51 , preferably via internal multi-layer or single layer wiring 207 ( FIG. 3 ) within the circuit board 20 .
  • the contact pads 27 may be welded or soldered to (e.g., straight) pins 61 of a feedthrough 60 of the hermetically sealed housing 4 of the medical implant device 2 , wherein the pins 61 protrude out of the housing 2 and are aligned with the contact pads 27 .
  • FIG. 5 shows a version that uses a feedthrough assembly 60 as described in U.S. Pat. No. 8,920,198.
  • the feedthrough assembly 60 includes a carrier body 62 which bears an insulating body 63 , e.g., with the insulating body 63 inserted within an opening of the carrier body 62 , though the carrier body 62 and insulating body 63 could be integrally or differently formed.
  • the carrier body 62 which may be connected to a wall of the housing 4 in a sealed fashion, has a top side facing the circuit board 20 and a bottom side facing away from the top side and the circuit board 20 .
  • the insulating body 63 can be formed of a ceramic material, or alternatively a plastic or other non-conductive material.
  • the insulating body 63 preferably extends through the carrier body 62 , protrudes above and over the carrier body top side, and also preferably projects slightly beyond the bottom side to better electrically insulate the circuit board 20 from the medical implant device (not shown).
  • the bottom of the insulating body 63 could instead be aligned with the bottom side of the carrier body 62 , or could extend into the opening of the carrier body 62 by a distance less than the thickness of the carrier body 62 .
  • a positioning unit 68 shown in FIG. 5 as a pin, is oriented in a direction normal to the carrier body 62 and guided through an opening in the carrier body 62 .
  • the insulating body 63 includes receptacles arranged at regular intervals along the insulating body 63 for receiving contact bodies 65 .
  • the contact bodies 65 extend towards the contact pads 27 of the circuit board 20 through the carrier body 62 and the insulating body 63 .
  • Each contact body 65 includes a first limb 66 for contacting intermediate contact members 209 (e.g., metal strips) which are in turn welded, soldered, or otherwise attached to the contact pads 27 on the circuit board 20 .
  • each contact body 66 includes an integrally-connected second limb 67 , wherein the second limbs 67 are used to make contact with a circuit 40 ( FIG. 1 , e.g., a circuit board) in the housing 4 of the medical implant device 2 .
  • FIG. 6 shows another version of the header 1 and medical implant device 2 , wherein here an integrated circuit 210 that controls the medical implant device 2 is transferred into the header housing 10 .
  • the header housing 10 is integrally formed with the housing 4 of the medical implant device 2 , which now merely houses a battery 40 for supplying the device 2 with electrical energy.
  • the circuit board 20 of the header 1 which is embedded in the header housing 10 in a casted material 205 cast around the circuit board 20 , may be connected to the battery 40 via contact pads and metal strips extending therefrom.
  • the electrode 3 is integrated into the header housing 10 so that the electrode lines extend within the header housing 10 . Such an arrangement can be used as a so-called leadless pacemaker and/or biomonitor.

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US15/489,874 2016-04-26 2017-04-18 Header for a medical implant device, particularly for a pacemaker Abandoned US20170310059A1 (en)

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EP16166977.5A EP3238778B1 (de) 2016-04-26 2016-04-26 Vorsatz für eine medizinische implantatvorrichtung, insbesondere für einen schrittmacher
EP16166977.5-1666 2016-04-26

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US11342717B2 (en) 2022-05-24
US20200014152A1 (en) 2020-01-09
EP3238778B1 (de) 2019-06-12
EP3238778A1 (de) 2017-11-01

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