US20160204221A1 - Bottom-up metal gate formation on replacement metal gate finfet devices - Google Patents
Bottom-up metal gate formation on replacement metal gate finfet devices Download PDFInfo
- Publication number
- US20160204221A1 US20160204221A1 US14/592,042 US201514592042A US2016204221A1 US 20160204221 A1 US20160204221 A1 US 20160204221A1 US 201514592042 A US201514592042 A US 201514592042A US 2016204221 A1 US2016204221 A1 US 2016204221A1
- Authority
- US
- United States
- Prior art keywords
- trench
- metal
- gate
- work function
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 92
- 239000002184 metal Substances 0.000 title claims abstract description 92
- 230000015572 biosynthetic process Effects 0.000 title description 43
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000003989 dielectric material Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000000151 deposition Methods 0.000 claims abstract description 9
- 230000005669 field effect Effects 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
- H01L29/6681—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET using dummy structures having essentially the same shape as the semiconductor body, e.g. to provide stability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28079—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a single metal, e.g. Ta, W, Mo, Al
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28088—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a composite, e.g. TiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
- H01L29/7851—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET with the body tied to the substrate
Definitions
- the present invention relates to metal gate formation, and more specifically, to metal gate formation on replacement metal gate fin field effect transistor (finFET) devices.
- finFET replacement metal gate fin field effect transistor
- a replacement metal gate (RMG) process architecture is a gate last versus a gate first architecture.
- RMG finFET device fabrication typically includes initially forming a dummy gate structure that is subsequently removed to form a gate pocket after spacer etch and source/drain epitaxy merge.
- a high dielectric constant (high-k) layer, work function metal, and gate metal are filled into the gate pocket, and chemical-mechanical planarization (CMP) is performed to planarize the topology.
- CMP chemical-mechanical planarization
- the gate metal material is then recessed partially and a dielectric cap is formed through damascene processing.
- a method of fabricating a replacement metal gate in a transistor device includes forming a dummy gate structure over a substrate, the dummy gate structure surrounded by an insulating layer; removing the dummy gate structure so as to expose a trench within the insulating layer; conformally depositing a dielectric material layer and a work function metal layer over a the insulating layer and in the trench and removing the dielectric material layer and the work function metal layer from a tip surface of the insulating layer; recessing the work function metal layer below a top of the trench; and selectively forming a gate metal only on exposed surfaces of the work function metal layer.
- a method of fabricating a fin field effect transistor (finFET) device includes forming a substrate; forming a fin connecting a source region and a drain region over the substrate; forming a dummy gate structure over a substrate, the dummy gate structure surrounded by an insulating layer; removing the dummy gate structure so as to expose a trench within the insulating layer; conformally depositing a dielectric material layer and a work function metal layer over a the insulating layer and in the trench and removing the dielectric material layer and the work function metal layer from a tip surface of the insulating layer; recessing the work function metal layer below a top of the trench; and selectively forming a gate metal only on exposed surfaces of the work function metal layer.
- FIG. 1 is a top-down view of a finFET device fabricated according to an embodiment of the invention
- FIG. 2 is a cross-sectional view of a stage in the formation of an exemplary finFET device according to an embodiment of the invention
- FIG. 3 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to an embodiment of the invention.
- FIG. 4 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 5 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention.
- FIG. 6 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 7 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention.
- FIG. 8 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 9 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention.
- FIG. 10 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 11 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention.
- FIG. 12 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 13 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention.
- FIG. 14 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 15 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention.
- FIG. 16 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 17 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention.
- FIG. 18 is a cross-sectional view of another stage in the formation of an exemplary finFET according to an embodiment of the invention.
- part of the fabrication of an RMG finFET device involves forming a partial recess in the metal gate for formation of a dielectric cap. This partial recessing of the gate metal can present a challenge from the standpoint of the reactive ion etch (RIE) required.
- RIE reactive ion etch
- conventional gate metal fill techniques may result in a seam or void within the gate metal layer.
- Embodiments of the RMG finFET device and process of fabricating the device detailed herein include bottom-up formation through selective metal growth.
- FIG. 1 is a top-down view of a finFET device 100 fabricated according to an embodiment of the invention.
- the conducting channel between the source and gate is wrapped in a silicon fin 125 and finFETs are generally known.
- the description herein focuses on the differences in fabrication of a gate region 101 .
- ILD inter-level dielectric
- Two fins 125 wrapped in silicon, for example, are shown with source 102 and drain 103 sides in the exemplary finFET device 100 . In alternate embodiments, one or a different number of fins 125 may be formed.
- the gate region 101 is shown in the top-down view of FIG. 1 .
- the gate region 101 is formed by removing and replacing a dummy gate 140 ( FIG. 2 ) with the gate metal 190 ( FIGS. 14, 15 ).
- embodiments of the invention relate to bottom-up formation of the replacement gate 101 through growth of the gate metal 190 .
- Two figures are shown for each stage of the processing to illustrate two different gate widths. The stages shown in subsequent figures are cross sectional views across the gate as indicated by A-A.
- the cross-sections indicated by A-A and B-B are both detailed in FIG. 1 .
- the cross-section indicated by A-A is through a fin 125 .
- the cross-sectional structure 104 includes a substrate 110 with a silicon layer 130 representing the fin 125 above it.
- the ILD 120 forms a trench in which the gate region 101 is formed.
- the cross-section indicated by B-B is through the gate region 101 .
- the cross-sectional structure 105 includes a substrate 110 with ILD 120 formed above and also including the trench in which the gate region 101 is formed.
- FIGS. 2 through 18 show cross-sectional views at A-A.
- FIG. 2 is a cross-sectional view of a stage 200 - 1 in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 3 is a cross-sectional view of the stage 200 - 2 in the formation of another exemplary finFET device according to an embodiment of the invention.
- the trench 121 is wider in stage 200 - 2 shown in FIG. 3 than the trench 121 shown in FIG. 2 .
- a silicon layer 130 indicating the fin 125 is shown as being formed on the substrate 110 .
- a trench 121 is formed in the ILD 120 .
- the silicon layer 130 may represent an epitaxial merge of the fins 125 shown in FIG. 1 .
- a dummy gate 140 of a poly-silicon or amorphous-silicon is shown beneath a gate hardmask 150 in the trench 121 of the ILD 120 .
- An oxide layer 145 which may be the same material as the ILD 120 or a different oxide is beneath the dummy gate 140 .
- the gate hardmask 155 is above the dummy gate 140 .
- the same material as the gate hardmask 155 or a different material may acts as a sidewall spacer 150 between the dummy gate 140 and the ILD 120 based on etching.
- the material of the gate hardmask 155 may be silicon nitride (SiN).
- SiN silicon nitride
- the stages 200 - 1 and 200 - 2 shown in FIGS. 2 and 3 are considered the initial stages in the formation of a finFET device 100 , because stages preceding stages 200 - 1 and 200 - 2 are the same as those of prior finFET device formation processes.
- FIG. 4 is a cross-sectional view of another stage 300 - 1 in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 5 is a cross-sectional view of the stage 300 - 2 in the formation of another exemplary finFET device according to another embodiment of the invention.
- the oxide layer 145 , dummy gate 140 , and gate hardmask 155 are pulled to result in the stages 300 - 1 and 300 - 2 .
- a dry etch is first performed to etch back the hardmask 155 (which may have some effect on the sidewall spacer 150 , as well).
- a wet etch is performed to etch the dummy gate 140 and oxide layer 145 .
- the sidewall spacer 150 which may be somewhat shortened by the dry etch process, is left as shown in FIGS. 4 and 5 .
- FIG. 6 is a cross-sectional view of another stage 400 - 1 in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 7 is a cross-sectional view of the stage 400 - 2 in the formation of another exemplary finFET device according to another embodiment of the invention.
- a high dielectric constant (high-k) dielectric layer 160 and a work function metal 170 are deposited conformally along the gate hardmask 150 and on a surface of the silicon layer 130 .
- a blanket conformal deposition is followed by CMP down to the ILD 120 .
- Exemplary materials used for the dielectric layer 160 include hafnium oxide (HfO 2 ), aluminum oxide (Al 2 O 3 ), a hafnium silicate (HfSiO x ), zirconium dioxide (ZrO 2 ), or a hafnium zirconate (HfZrO x ).
- the work function metal 170 may be tantalum nitride (TaN), titanium nitride (TiN), titanium aluminum carbide (TiAlC), or TiC, for example.
- FIG. 8 is a cross-sectional view of another stage 500 - 1 in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 9 is a cross-sectional view of the stage 500 - 2 in the formation of another exemplary finFET device according to another embodiment of the invention.
- An organic planarizing layer (OPL) 180 is deposited and etched back below the top of the trench 121 , as shown in FIGS. 8 and 9 , so that the OPL 180 is recessed in the trench coated with the work function metal 170 .
- the OPL 180 is a photoresist-like material used to reduce the topography.
- An organic dielectric layer (ODL) may be used as an OPL 180 .
- FIG. 1 is deposited and etched back below the top of the trench 121 , as shown in FIGS. 8 and 9 , so that the OPL 180 is recessed in the trench coated with the work function metal 170 .
- the OPL 180 is a photoresist-like material
- FIG. 10 is a cross-sectional view of another stage 600 - 1 in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 11 is a cross-sectional view of the stage 600 - 2 in the formation of another exemplary finFET device according to another embodiment of the invention.
- the work function metal 170 is etched to be partially recessed to the level of the recessed OPL 180 .
- FIG. 12 is a cross-sectional view of another stage 700 - 1 in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 13 is a cross-sectional view of the stage 700 - 2 in the formation of another exemplary finFET device according to another embodiment of the invention.
- the OPL 180 is stripped leaving the recessed work function metal 170 exposed.
- the OPL 180 may be stripped with a gas including carbon dioxide, for example.
- FIG. 14 is a cross-sectional view of another stage 800 - 1 in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 15 is a cross-sectional view of the stage 800 - 2 in the formation of another exemplary finFET device according to another embodiment of the invention.
- a gate metal 190 is grown via selective metal growth on the work function metal 170 surface.
- FIGS. 14 and 15 illustrate a key difference in the embodiments described herein as compared with current processes for forming the replacement gate.
- the gate metal 190 is grown via selective metal growth such that deposition and etching via RIE is not required according to the embodiments.
- the work function metal 170 acts as a seeding layer that the gate metal 190 cannot grow without, such that the gate metal 190 grows only on the surfaces of the workfunction metal 170 .
- the gate metal 190 can be grown to be recessed, as well, without requiring any etching.
- the gate metal 190 may be tungsten (W), aluminum (Al), cobalt (Co), phosphorous (P), or boron (B), for example.
- the gate metal 190 may instead be W, P, or B doped with Co, for example.
- stages 800 - 1 and 800 - 2 indicate that when the trench 121 is sufficiently narrow (as in stage 800 - 1 ), growth of the gate metal 190 will result in a continuous fill. That is, the growth of the gate metal 190 at the two sides of the trench 121 in the cross-sectional view shown in FIG. 14 will be close enough to form a continuous gate metal 190 layer as shown. To the contrary, the growth of the gate metal 190 at the two sides of the trench 121 in the cross-sectional view shown in FIG. 15 will be sufficiently separated such that a gap 191 will result.
- FIG. 16 is a cross-sectional view of another stage 900 - 1 in the formation of an exemplary finFET device according to an embodiment of the invention.
- FIG. 17 is a cross-sectional view of the stage 900 - 2 in the formation of another exemplary finFET device according to another embodiment of the invention.
- a dielectric cap 195 is formed over the gate metal 190 in a damascene process.
- the dielectric cap 195 may be a silicon nitride (SiN) material.
- the SiN material may be formed at a temperature below 500 degrees Celsius.
- the dielectric cap 195 fills the gap 191 , as well. As noted above, no such gap 191 is present in the embodiment shown in FIGS.
- FIG. 18 is a cross-sectional view of another stage 1000 in the formation of an exemplary finFET 100 according to an embodiment of the invention.
- This stage 1000 applies to the finFET device with the relatively wider gate 101 (and, thus, the gap 191 ).
- the dielectric cap 195 is removed and a tungsten (W) 197 refill is performed as shown.
- This W 197 fill provides the necessary gate conductivity that cannot be achieved with the gap 191 .
Abstract
Description
- The present invention relates to metal gate formation, and more specifically, to metal gate formation on replacement metal gate fin field effect transistor (finFET) devices.
- Generally, a replacement metal gate (RMG) process architecture is a gate last versus a gate first architecture. RMG finFET device fabrication typically includes initially forming a dummy gate structure that is subsequently removed to form a gate pocket after spacer etch and source/drain epitaxy merge. A high dielectric constant (high-k) layer, work function metal, and gate metal are filled into the gate pocket, and chemical-mechanical planarization (CMP) is performed to planarize the topology. The gate metal material is then recessed partially and a dielectric cap is formed through damascene processing.
- According to one embodiment of the present invention, a method of fabricating a replacement metal gate in a transistor device includes forming a dummy gate structure over a substrate, the dummy gate structure surrounded by an insulating layer; removing the dummy gate structure so as to expose a trench within the insulating layer; conformally depositing a dielectric material layer and a work function metal layer over a the insulating layer and in the trench and removing the dielectric material layer and the work function metal layer from a tip surface of the insulating layer; recessing the work function metal layer below a top of the trench; and selectively forming a gate metal only on exposed surfaces of the work function metal layer.
- According to another embodiment, a method of fabricating a fin field effect transistor (finFET) device includes forming a substrate; forming a fin connecting a source region and a drain region over the substrate; forming a dummy gate structure over a substrate, the dummy gate structure surrounded by an insulating layer; removing the dummy gate structure so as to expose a trench within the insulating layer; conformally depositing a dielectric material layer and a work function metal layer over a the insulating layer and in the trench and removing the dielectric material layer and the work function metal layer from a tip surface of the insulating layer; recessing the work function metal layer below a top of the trench; and selectively forming a gate metal only on exposed surfaces of the work function metal layer.
- Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.
- The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
-
FIG. 1 is a top-down view of a finFET device fabricated according to an embodiment of the invention; -
FIG. 2 is a cross-sectional view of a stage in the formation of an exemplary finFET device according to an embodiment of the invention; -
FIG. 3 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to an embodiment of the invention; -
FIG. 4 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention; -
FIG. 5 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention; -
FIG. 6 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention; -
FIG. 7 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention; -
FIG. 8 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention; -
FIG. 9 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention; -
FIG. 10 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention; -
FIG. 11 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention; -
FIG. 12 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention; -
FIG. 13 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention; -
FIG. 14 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention; -
FIG. 15 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention; -
FIG. 16 is a cross-sectional view of another stage in the formation of an exemplary finFET device according to an embodiment of the invention; -
FIG. 17 is a cross-sectional view of the stage in the formation of another exemplary finFET device according to another embodiment of the invention; and -
FIG. 18 is a cross-sectional view of another stage in the formation of an exemplary finFET according to an embodiment of the invention. - As noted above, part of the fabrication of an RMG finFET device involves forming a partial recess in the metal gate for formation of a dielectric cap. This partial recessing of the gate metal can present a challenge from the standpoint of the reactive ion etch (RIE) required. In addition, conventional gate metal fill techniques may result in a seam or void within the gate metal layer. Embodiments of the RMG finFET device and process of fabricating the device detailed herein include bottom-up formation through selective metal growth.
-
FIG. 1 is a top-down view of afinFET device 100 fabricated according to an embodiment of the invention. The conducting channel between the source and gate is wrapped in asilicon fin 125 and finFETs are generally known. The description herein focuses on the differences in fabrication of agate region 101. An inter-level dielectric (ILD) 120 including a dielectric material such as silicon oxide or silicon nitride, for example, forms the trench in which thegate region 101 is formed. Twofins 125 wrapped in silicon, for example, are shown withsource 102 and drain 103 sides in theexemplary finFET device 100. In alternate embodiments, one or a different number offins 125 may be formed. Thegate region 101 is shown in the top-down view ofFIG. 1 . Generally, in both currently used processes and according to embodiments of the invention, thegate region 101 is formed by removing and replacing a dummy gate 140 (FIG. 2 ) with the gate metal 190 (FIGS. 14, 15 ). As further detailed below with reference toFIGS. 2 through 18 , embodiments of the invention relate to bottom-up formation of thereplacement gate 101 through growth of thegate metal 190. Two figures are shown for each stage of the processing to illustrate two different gate widths. The stages shown in subsequent figures are cross sectional views across the gate as indicated by A-A. - The cross-sections indicated by A-A and B-B are both detailed in
FIG. 1 . The cross-section indicated by A-A is through afin 125. Thecross-sectional structure 104 includes asubstrate 110 with asilicon layer 130 representing thefin 125 above it. The ILD 120 forms a trench in which thegate region 101 is formed. The cross-section indicated by B-B is through thegate region 101. Thecross-sectional structure 105 includes asubstrate 110 with ILD 120 formed above and also including the trench in which thegate region 101 is formed. Thegate region 101 and its formation are further detailed below. As noted above,FIGS. 2 through 18 show cross-sectional views at A-A. -
FIG. 2 is a cross-sectional view of a stage 200-1 in the formation of an exemplary finFET device according to an embodiment of the invention.FIG. 3 is a cross-sectional view of the stage 200-2 in the formation of another exemplary finFET device according to an embodiment of the invention. Thetrench 121 is wider in stage 200-2 shown inFIG. 3 than thetrench 121 shown inFIG. 2 . In both stages 200-1 and 200-2 shown inFIGS. 2 and 3 , respectively, asilicon layer 130 indicating thefin 125 is shown as being formed on thesubstrate 110. Above the fin 125 (silicon layer 130), atrench 121 is formed in the ILD 120. Thesilicon layer 130 may represent an epitaxial merge of thefins 125 shown inFIG. 1 . Adummy gate 140 of a poly-silicon or amorphous-silicon is shown beneath agate hardmask 150 in thetrench 121 of the ILD 120. Anoxide layer 145, which may be the same material as the ILD 120 or a different oxide is beneath thedummy gate 140. As shown inFIGS. 2 and 3 , thegate hardmask 155 is above thedummy gate 140. The same material as thegate hardmask 155 or a different material may acts as asidewall spacer 150 between thedummy gate 140 and theILD 120 based on etching. The material of thegate hardmask 155 may be silicon nitride (SiN). For purposes of explaining the embodiments herein, the stages 200-1 and 200-2 shown inFIGS. 2 and 3 are considered the initial stages in the formation of afinFET device 100, because stages preceding stages 200-1 and 200-2 are the same as those of prior finFET device formation processes. -
FIG. 4 is a cross-sectional view of another stage 300-1 in the formation of an exemplary finFET device according to an embodiment of the invention.FIG. 5 is a cross-sectional view of the stage 300-2 in the formation of another exemplary finFET device according to another embodiment of the invention. AsFIGS. 4 and 5 indicate, theoxide layer 145,dummy gate 140, andgate hardmask 155 are pulled to result in the stages 300-1 and 300-2. Specifically, a dry etch is first performed to etch back the hardmask 155 (which may have some effect on thesidewall spacer 150, as well). Then, a wet etch is performed to etch thedummy gate 140 andoxide layer 145. Thesidewall spacer 150, which may be somewhat shortened by the dry etch process, is left as shown inFIGS. 4 and 5 . -
FIG. 6 is a cross-sectional view of another stage 400-1 in the formation of an exemplary finFET device according to an embodiment of the invention.FIG. 7 is a cross-sectional view of the stage 400-2 in the formation of another exemplary finFET device according to another embodiment of the invention. AsFIGS. 6 and 7 indicate, a high dielectric constant (high-k)dielectric layer 160 and awork function metal 170 are deposited conformally along thegate hardmask 150 and on a surface of thesilicon layer 130. A blanket conformal deposition is followed by CMP down to theILD 120. Exemplary materials used for thedielectric layer 160 include hafnium oxide (HfO2), aluminum oxide (Al2O3), a hafnium silicate (HfSiOx), zirconium dioxide (ZrO2), or a hafnium zirconate (HfZrOx). Thework function metal 170 may be tantalum nitride (TaN), titanium nitride (TiN), titanium aluminum carbide (TiAlC), or TiC, for example. -
FIG. 8 is a cross-sectional view of another stage 500-1 in the formation of an exemplary finFET device according to an embodiment of the invention.FIG. 9 is a cross-sectional view of the stage 500-2 in the formation of another exemplary finFET device according to another embodiment of the invention. An organic planarizing layer (OPL) 180 is deposited and etched back below the top of thetrench 121, as shown inFIGS. 8 and 9 , so that theOPL 180 is recessed in the trench coated with thework function metal 170. TheOPL 180 is a photoresist-like material used to reduce the topography. An organic dielectric layer (ODL) may be used as anOPL 180.FIG. 10 is a cross-sectional view of another stage 600-1 in the formation of an exemplary finFET device according to an embodiment of the invention.FIG. 11 is a cross-sectional view of the stage 600-2 in the formation of another exemplary finFET device according to another embodiment of the invention. Thework function metal 170 is etched to be partially recessed to the level of the recessedOPL 180.FIG. 12 is a cross-sectional view of another stage 700-1 in the formation of an exemplary finFET device according to an embodiment of the invention.FIG. 13 is a cross-sectional view of the stage 700-2 in the formation of another exemplary finFET device according to another embodiment of the invention. TheOPL 180 is stripped leaving the recessedwork function metal 170 exposed. TheOPL 180 may be stripped with a gas including carbon dioxide, for example. -
FIG. 14 is a cross-sectional view of another stage 800-1 in the formation of an exemplary finFET device according to an embodiment of the invention.FIG. 15 is a cross-sectional view of the stage 800-2 in the formation of another exemplary finFET device according to another embodiment of the invention. Agate metal 190 is grown via selective metal growth on thework function metal 170 surface.FIGS. 14 and 15 illustrate a key difference in the embodiments described herein as compared with current processes for forming the replacement gate. Thegate metal 190 is grown via selective metal growth such that deposition and etching via RIE is not required according to the embodiments. That is, thework function metal 170 acts as a seeding layer that thegate metal 190 cannot grow without, such that thegate metal 190 grows only on the surfaces of theworkfunction metal 170. Thus, due to recessing thework function metal 170 at stages 600-1 and 600-2, thegate metal 190 can be grown to be recessed, as well, without requiring any etching. Thegate metal 190 may be tungsten (W), aluminum (Al), cobalt (Co), phosphorous (P), or boron (B), for example. Thegate metal 190 may instead be W, P, or B doped with Co, for example. As a comparison of stages 800-1 and 800-2 indicates, when thetrench 121 is sufficiently narrow (as in stage 800-1), growth of thegate metal 190 will result in a continuous fill. That is, the growth of thegate metal 190 at the two sides of thetrench 121 in the cross-sectional view shown inFIG. 14 will be close enough to form acontinuous gate metal 190 layer as shown. To the contrary, the growth of thegate metal 190 at the two sides of thetrench 121 in the cross-sectional view shown inFIG. 15 will be sufficiently separated such that agap 191 will result. -
FIG. 16 is a cross-sectional view of another stage 900-1 in the formation of an exemplary finFET device according to an embodiment of the invention.FIG. 17 is a cross-sectional view of the stage 900-2 in the formation of another exemplary finFET device according to another embodiment of the invention. Adielectric cap 195 is formed over thegate metal 190 in a damascene process. Thedielectric cap 195 may be a silicon nitride (SiN) material. The SiN material may be formed at a temperature below 500 degrees Celsius. AsFIG. 17 shows, thedielectric cap 195 fills thegap 191, as well. As noted above, nosuch gap 191 is present in the embodiment shown inFIGS. 14 and 16 such that thedielectric cap 195 is formed above acontinuous gate metal 190 layer.FIG. 18 is a cross-sectional view of anotherstage 1000 in the formation of anexemplary finFET 100 according to an embodiment of the invention. Thisstage 1000 applies to the finFET device with the relatively wider gate 101 (and, thus, the gap 191). Thedielectric cap 195 is removed and a tungsten (W) 197 refill is performed as shown. ThisW 197 fill provides the necessary gate conductivity that cannot be achieved with thegap 191. - The processes detailed above not only address the challenges associated with obtaining a recessed gate metal but also prevent voids in the gate metal region. That is, conventional gate metal fill techniques are susceptible to developing a seam or void in the gate metal fill. Based on the selective growth described above (and the W fill according to some embodiments), a continuous gate metal layer without any seams or voids is obtained.
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one more other features, integers, steps, operations, element components, and/or groups thereof.
- The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated
- The flow diagrams depicted herein are just one example. There may be many variations to this diagram or the steps (or operations) described therein without departing from the spirit of the invention. For instance, the steps may be performed in a differing order or steps may be added, deleted or modified. All of these variations are considered a part of the claimed invention.
- While the preferred embodiment to the invention had been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.
- The descriptions of the various embodiments of the present invention have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (16)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/592,042 US9379221B1 (en) | 2015-01-08 | 2015-01-08 | Bottom-up metal gate formation on replacement metal gate finFET devices |
GB1706263.9A GB2549621B (en) | 2015-01-08 | 2016-01-04 | Bottom-up metal gate formation on replacement metal gate finfet devices |
CN201680005203.7A CN107112217B (en) | 2015-01-08 | 2016-01-04 | Manufacturing method of replacement metal gate, finFET device and manufacturing method of finFET device |
JP2017530173A JP6688301B2 (en) | 2015-01-08 | 2016-01-04 | Method of manufacturing a replacement metal gate in a transistor device, fin field effect transistor device and method of manufacturing the same |
PCT/IB2016/050022 WO2016110793A1 (en) | 2015-01-08 | 2016-01-04 | Bottom-up metal gate formation on replacement metal gate finfet devices |
DE112016000182.7T DE112016000182B4 (en) | 2015-01-08 | 2016-01-04 | Bottom-up metal gate formation on finfet devices with a replacement metal gate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/592,042 US9379221B1 (en) | 2015-01-08 | 2015-01-08 | Bottom-up metal gate formation on replacement metal gate finFET devices |
Publications (2)
Publication Number | Publication Date |
---|---|
US9379221B1 US9379221B1 (en) | 2016-06-28 |
US20160204221A1 true US20160204221A1 (en) | 2016-07-14 |
Family
ID=56136484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/592,042 Active US9379221B1 (en) | 2015-01-08 | 2015-01-08 | Bottom-up metal gate formation on replacement metal gate finFET devices |
Country Status (6)
Country | Link |
---|---|
US (1) | US9379221B1 (en) |
JP (1) | JP6688301B2 (en) |
CN (1) | CN107112217B (en) |
DE (1) | DE112016000182B4 (en) |
GB (1) | GB2549621B (en) |
WO (1) | WO2016110793A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170256640A1 (en) * | 2015-07-01 | 2017-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor Device Structure and Method for Forming the Same |
US20180175165A1 (en) * | 2016-12-15 | 2018-06-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Etching Back and Selective Deposition of Metal Gate |
US10217839B2 (en) | 2017-03-24 | 2019-02-26 | Globalfoundries Inc. | Field effect transistor (FET) with a gate having a recessed work function metal layer and method of forming the FET |
US10263113B2 (en) | 2016-08-03 | 2019-04-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
US20220278224A1 (en) * | 2016-12-15 | 2022-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etching Back and Selective Deposition of Metal Gate |
TWI826443B (en) * | 2018-08-14 | 2023-12-21 | 南韓商三星電子股份有限公司 | Semiconductor device |
US11862453B2 (en) | 2020-08-27 | 2024-01-02 | Marvell Asia Pte, Ltd. | Gate stack for metal gate transistor |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10014180B1 (en) | 2017-08-21 | 2018-07-03 | Globalfoundries Inc. | Tungsten gate and method for forming |
US10164053B1 (en) * | 2017-08-31 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
US10204828B1 (en) | 2018-02-09 | 2019-02-12 | International Business Machines Corporation | Enabling low resistance gates and contacts integrated with bilayer dielectrics |
CN110164760B (en) * | 2018-02-12 | 2021-05-04 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
JP7195106B2 (en) * | 2018-10-12 | 2022-12-23 | 東京エレクトロン株式会社 | Film forming method and substrate processing system |
US11721695B2 (en) * | 2021-07-16 | 2023-08-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal gate stacks and methods of fabricating the same in multi-gate field-effect transistors |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5300813A (en) | 1992-02-26 | 1994-04-05 | International Business Machines Corporation | Refractory metal capped low resistivity metal conductor lines and vias |
US5262354A (en) * | 1992-02-26 | 1993-11-16 | International Business Machines Corporation | Refractory metal capped low resistivity metal conductor lines and vias |
US5695810A (en) | 1996-11-20 | 1997-12-09 | Cornell Research Foundation, Inc. | Use of cobalt tungsten phosphide as a barrier material for copper metallization |
US6342733B1 (en) | 1999-07-27 | 2002-01-29 | International Business Machines Corporation | Reduced electromigration and stressed induced migration of Cu wires by surface coating |
US6706625B1 (en) | 2002-12-06 | 2004-03-16 | Chartered Semiconductor Manufacturing Ltd. | Copper recess formation using chemical process for fabricating barrier cap for lines and vias |
US6975032B2 (en) | 2002-12-16 | 2005-12-13 | International Business Machines Corporation | Copper recess process with application to selective capping and electroless plating |
US6967131B2 (en) | 2003-10-29 | 2005-11-22 | International Business Machines Corp. | Field effect transistor with electroplated metal gate |
US8193641B2 (en) * | 2006-05-09 | 2012-06-05 | Intel Corporation | Recessed workfunction metal in CMOS transistor gates |
US8013401B2 (en) | 2007-03-15 | 2011-09-06 | Intel Corporation | Selectively depositing aluminum in a replacement metal gate process |
US8350335B2 (en) * | 2007-04-18 | 2013-01-08 | Sony Corporation | Semiconductor device including off-set spacers formed as a portion of the sidewall |
US8779530B2 (en) | 2009-12-21 | 2014-07-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal gate structure of a field effect transistor |
US8088685B2 (en) | 2010-02-09 | 2012-01-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integration of bottom-up metal film deposition |
US8373239B2 (en) | 2010-06-08 | 2013-02-12 | International Business Machines Corporation | Structure and method for replacement gate MOSFET with self-aligned contact using sacrificial mandrel dielectric |
DE102010030756B4 (en) | 2010-06-30 | 2013-06-06 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | An exchange gate method for large ε metal gate stacks based on a non-conforming inter-layer dielectric |
DE102011005639B4 (en) | 2011-03-16 | 2016-05-25 | GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG | Reduce the defect rate during the deposition of a channel semiconductor alloy into an in situ lowered active area |
KR101850703B1 (en) * | 2011-05-17 | 2018-04-23 | 삼성전자 주식회사 | Semiconductor device and method for fabricating the device |
US8629007B2 (en) | 2011-07-14 | 2014-01-14 | International Business Machines Corporation | Method of improving replacement metal gate fill |
US8557666B2 (en) | 2011-09-13 | 2013-10-15 | GlobalFoundries, Inc. | Methods for fabricating integrated circuits |
US8772168B2 (en) * | 2012-01-19 | 2014-07-08 | Globalfoundries Singapore Pte. Ltd. | Formation of the dielectric cap layer for a replacement gate structure |
KR101929185B1 (en) | 2012-05-02 | 2018-12-17 | 삼성전자 주식회사 | Method for manufacturing semiconductor device |
KR101909091B1 (en) | 2012-05-11 | 2018-10-17 | 삼성전자 주식회사 | Semiconductor device and fabricating method thereof |
US8679909B2 (en) * | 2012-06-08 | 2014-03-25 | Globalfoundries Singapore Pte. Ltd. | Recessing and capping of gate structures with varying metal compositions |
US8507979B1 (en) * | 2012-07-31 | 2013-08-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor integrated circuit with metal gate |
CN103915386B (en) * | 2013-01-08 | 2017-05-17 | 中芯国际集成电路制造(上海)有限公司 | Cmos transistor and forming method thereof |
KR101996244B1 (en) * | 2013-06-27 | 2019-07-05 | 삼성전자 주식회사 | Method for fabricating semiconductor device |
US9018711B1 (en) * | 2013-10-17 | 2015-04-28 | Globalfoundries Inc. | Selective growth of a work-function metal in a replacement metal gate of a semiconductor device |
-
2015
- 2015-01-08 US US14/592,042 patent/US9379221B1/en active Active
-
2016
- 2016-01-04 GB GB1706263.9A patent/GB2549621B/en active Active
- 2016-01-04 DE DE112016000182.7T patent/DE112016000182B4/en active Active
- 2016-01-04 CN CN201680005203.7A patent/CN107112217B/en active Active
- 2016-01-04 JP JP2017530173A patent/JP6688301B2/en active Active
- 2016-01-04 WO PCT/IB2016/050022 patent/WO2016110793A1/en active Application Filing
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10790394B2 (en) | 2015-07-01 | 2020-09-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device structure and method for forming the same |
US11532748B2 (en) | 2015-07-01 | 2022-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device structure and method for forming the same |
US20170256640A1 (en) * | 2015-07-01 | 2017-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor Device Structure and Method for Forming the Same |
US10269963B2 (en) * | 2015-07-01 | 2019-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device structure and method for forming the same |
US10868188B2 (en) | 2016-08-03 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
TWI659514B (en) * | 2016-08-03 | 2019-05-11 | 台灣積體電路製造股份有限公司 | Semiconductor device and manufacturing method thereof |
US11855217B2 (en) | 2016-08-03 | 2023-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device having a conductive contact in direct contact with an upper surface and a sidewall of a gate metal layer |
US10516052B2 (en) | 2016-08-03 | 2019-12-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
US10263113B2 (en) | 2016-08-03 | 2019-04-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
US10879370B2 (en) * | 2016-12-15 | 2020-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Etching back and selective deposition of metal gate |
US20180175165A1 (en) * | 2016-12-15 | 2018-06-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Etching Back and Selective Deposition of Metal Gate |
US20220278224A1 (en) * | 2016-12-15 | 2022-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etching Back and Selective Deposition of Metal Gate |
US11380774B2 (en) * | 2016-12-15 | 2022-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Etching back and selective deposition of metal gate |
TWI668744B (en) * | 2016-12-15 | 2019-08-11 | 台灣積體電路製造股份有限公司 | Semiconductor devices and methods for forming the same |
US10217839B2 (en) | 2017-03-24 | 2019-02-26 | Globalfoundries Inc. | Field effect transistor (FET) with a gate having a recessed work function metal layer and method of forming the FET |
TWI826443B (en) * | 2018-08-14 | 2023-12-21 | 南韓商三星電子股份有限公司 | Semiconductor device |
US11862453B2 (en) | 2020-08-27 | 2024-01-02 | Marvell Asia Pte, Ltd. | Gate stack for metal gate transistor |
Also Published As
Publication number | Publication date |
---|---|
JP2018506170A (en) | 2018-03-01 |
GB201706263D0 (en) | 2017-06-07 |
CN107112217A (en) | 2017-08-29 |
GB2549621A (en) | 2017-10-25 |
DE112016000182B4 (en) | 2023-10-05 |
JP6688301B2 (en) | 2020-04-28 |
DE112016000182T5 (en) | 2017-08-24 |
GB2549621B (en) | 2018-06-13 |
CN107112217B (en) | 2020-07-31 |
US9379221B1 (en) | 2016-06-28 |
WO2016110793A1 (en) | 2016-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9379221B1 (en) | Bottom-up metal gate formation on replacement metal gate finFET devices | |
US10121786B2 (en) | FinFET with U-shaped channel and S/D epitaxial cladding extending under gate spacers | |
US10347719B2 (en) | Nanosheet transistors on bulk material | |
US9653573B2 (en) | Replacement metal gate including dielectric gate material | |
US9490129B2 (en) | Integrated circuits having improved gate structures and methods for fabricating same | |
US9391075B2 (en) | Integrated circuit and method for fabricating the same having a replacement gate structure | |
US9466494B2 (en) | Selective growth for high-aspect ration metal fill | |
US9431514B2 (en) | FinFET device having a high germanium content fin structure and method of making same | |
CN109727916A (en) | The manufacturing method of semiconductor device | |
US9660050B1 (en) | Replacement low-k spacer | |
US8936979B2 (en) | Semiconductor devices having improved gate height uniformity and methods for fabricating same | |
US9147696B2 (en) | Devices and methods of forming finFETs with self aligned fin formation | |
US9536985B2 (en) | Epitaxial growth of material on source/drain regions of FinFET structure | |
US20160172380A1 (en) | Modified fin cut after epitaxial growth | |
US10529862B2 (en) | Semiconductor device and method of forming semiconductor fin thereof | |
US10153341B2 (en) | Method of forming internal spacer for nanowires | |
US11569361B2 (en) | Nanosheet transistors with wrap around contact | |
US10504998B2 (en) | Semiconductor structure and method of forming the same | |
US20190198399A1 (en) | Vertical FET with Various Gate Lengths by an Oxidation Process |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HE, HONG;LI, JUNTAO;WANG, JUNLI;AND OTHERS;SIGNING DATES FROM 20150105 TO 20150107;REEL/FRAME:034662/0629 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |