US20160174369A1 - Super light weight electronic circuit and low power distribution in aircraft systems - Google Patents
Super light weight electronic circuit and low power distribution in aircraft systems Download PDFInfo
- Publication number
- US20160174369A1 US20160174369A1 US14/570,827 US201414570827A US2016174369A1 US 20160174369 A1 US20160174369 A1 US 20160174369A1 US 201414570827 A US201414570827 A US 201414570827A US 2016174369 A1 US2016174369 A1 US 2016174369A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- fuselage
- traces
- graphene
- aircraft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000002131 composite material Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 5
- 239000012212 insulator Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002135 nanosheet Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C1/00—Fuselages; Constructional features common to fuselages, wings, stabilising surfaces or the like
- B64C1/06—Frames; Stringers; Longerons ; Fuselage sections
- B64C1/061—Frames
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D2221/00—Electric power distribution systems onboard aircraft
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
Definitions
- This disclosure relates generally to electrical conductors, and more specifically, to highly conductive electrical circuits that are reduced in weight as compared to copper and aluminum wire conductor implementations that are equivalent in conductivity.
- Aircraft typically include thousands of feet of copper or aluminum wire embedded in an insulator. This wire requires a great deal of time for both manufacturing and installation, and contributes a great deal to the weight of the aircraft. Added weight results in a corresponding increase in fuel consumption and/or a decrease in payload capacity.
- a method for applying conductive traces to a structure to complete an electrical circuit One or more graphene traces are formed on a substrate. Then the substrate is applied to the structure such that one or more first portions of the electrical circuit are electrically connected to respective one or more second portions of the electrical circuit by respective ones of the one or more graphene traces.
- the substrate may be removed from the structure such that the graphene traces remain on the structure.
- the structure may comprise a fuselage of an aircraft.
- the fuselage of the aircraft may be formed from a composite material, and the substrate may be applied to the structure prior to curing of the composite material.
- the substrate may be applied to the structure prior to a complete formation of the fuselage, such that, after the fuselage is completely formed, the one or more graphene traces become embedded within the composite material forming the fuselage.
- the at least one of the one or more graphene traces may be used to conduct electrical signals and/or electrical power.
- the substrate may be bonded to the structure when applied so that the substrate acts as an insulator for the one or more graphene traces.
- the substrate may include additional electrical circuitry.
- the additional electrical circuitry may be one or more organic light emitting diodes.
- a method for applying conductive traces to a structure to complete an electrical circuit In another aspect, a method for applying conductive traces to a structure to complete an electrical circuit.
- One or more graphene traces is formed on a substrate.
- the substrate is applied to the structure such that one or more first portions of the electrical circuit are electrically connected to respective one or more second portions of the electrical circuit by respective ones of the one or more graphene traces. Finally, the substrate is removed from the structure such that the graphene traces remain on the structure.
- a system for electrically coupling two portions of one or more electrical circuits includes a substrate and one or more graphene traces formed on the substrate. Each of the one or more graphene traces is adapted to electrically couple a first portion of a respective one of the one or more electrical circuits to a second portion of the respective one of the one or more electrical circuits.
- the system may further include additional electrical circuitry formed on the substrate. The additional electrical circuitry may be one or more organic light emitting diodes.
- at least one portion of the one or more electrical circuits may be mounted on an interior surface of an aircraft fuselage.
- FIG. 1 is a diagram showing graphene traces on an interior surface of an aircraft fuselage according to an embodiment of the present disclosure.
- FIG. 2 is a diagram showing graphene traces pre-printed on a substrate roll according to an aspect of the present disclosure.
- Graphene is a one-atom-thick planar sheet of sp 2 -bonded carbon atoms that are densely packed in a honeycomb (hexagonal) crystal lattice. Graphene has a density of approximately 1.7 g/cm 3 . Graphene is strong, light, nearly transparent and an excellent conductor of heat and electricity. The carbon/carbon bond length in graphene can be as thick as 0.142 nanometers. Graphene nanosheets are formed from layers of graphene. Graphene has a high carrier mobility and low noise susceptibility and thus is quite useful in electronic circuits.
- conductive traces 110 formed from graphene nanosheets are bonded to the inner surface of a fuselage 100 of an aircraft to complete a number of electrical circuits.
- Such conductive traces 110 may provide low-voltage power to interior cabin lighting 120 and to window heaters 130 from a power source.
- the conductive traces 110 may also pass electrical signals to other electrical equipment within the aircraft, for example, digital audio and/or video signals for entertainment systems, electrical power for emergency lighting systems, etc. from a main distribution point.
- the conductive traces 110 formed from graphene nanosheets may replace any of the conventional wiring in an aircraft used for such purposes.
- the graphene traces 210 may be formed on an appropriate substrate 200 as a single roll 220 of graphene decals, with all circuit traces pre-printed on the substrate 200 of such rolls.
- Substrate 200 may be formed from, for example, carbon fiber tape, fiberglass tape or Kevlar tape. These rolls 220 can bonded to structures (such as the fuselage 100 in FIG. 1 ).
- the substrate 200 may be removed, leaving the graphene traces 210 behind on the surface of such structure.
- the graphene traces 210 can withstand high temperature curing of a composite in an auto clave, making this circuitry desirable for use with fuselages formed from composite materials.
- the original substrate 200 can also be bonded to the structure and serve as a protective layer for the graphene traces 210 (e.g., for insulation purposes).
- the rolls 220 may be bonded to a fuselage formed from a composite during manufacturing of such fuselage such that, after substrate 200 is removed, formation of the fuselage continues and the graphene traces 210 become embedded within the composite material.
- the graphene traces 210 are pre-printed on a bare substrate 200 that is formed into a roll 220 .
- the graphene traces 210 may be preprinted on substrates which also include other types of circuits, e.g., OLEDs (organic light emitting diodes), P-OLEDs (polymer organic light emitting diodes), etc., such that the substrate, when mounted on the inner surface of the fuselage, can provide additional functionality, e.g., interior lighting, based on the included additional circuits.
- graphene traces as opposed to conventional copper or aluminum wiring, can provide significant savings in both weight and manufacturing costs.
- These circuits based on graphene traces can be embedded in an aircraft fuselage formed from either a composite material or a metal material, and in other structures formed from composites and/or metal.
- the elimination of conventional copper or aluminum wiring provides a significant weight savings and a significant reduction in the manufacturing and assembly process of the aircraft. This results in both a significant reduction in cost of each aircraft and an improved per mile revenue for each aircraft because of fuel savings achieved by the lighter aircraft.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Carbon And Carbon Compounds (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
- This disclosure relates generally to electrical conductors, and more specifically, to highly conductive electrical circuits that are reduced in weight as compared to copper and aluminum wire conductor implementations that are equivalent in conductivity.
- It is a continuing goal to reduce the cost and weight of aircraft, spacecraft, and many other devices that include one or more electrical functions. Aircraft, for example, typically include thousands of feet of copper or aluminum wire embedded in an insulator. This wire requires a great deal of time for both manufacturing and installation, and contributes a great deal to the weight of the aircraft. Added weight results in a corresponding increase in fuel consumption and/or a decrease in payload capacity.
- In most existing applications, electrical power, current, and electrical signals are typically conducted through wires or cables using copper or aluminum as the conductive medium. In these applications, the amount of power, current, and signal strength are inherently limited by the electrical resistivity of the conducting materials, such as copper and aluminum, used to implement the electrical path. In addition, since copper and aluminum conductors include a resistance, current flowing through such conductors causes the wire to generate heat. A conductor with a lower resistance per unit area will tend to reduce the amount of heat generated (and electrical energy lost due to such generated heat) within a system.
- Accordingly, there is a need for an electrical conductor for use in aircraft which overcomes the drawbacks of conventional copper and aluminum conductors.
- In one aspect, a method for applying conductive traces to a structure to complete an electrical circuit. One or more graphene traces are formed on a substrate. Then the substrate is applied to the structure such that one or more first portions of the electrical circuit are electrically connected to respective one or more second portions of the electrical circuit by respective ones of the one or more graphene traces.
- In a further embodiment, the substrate may be removed from the structure such that the graphene traces remain on the structure. In addition, the structure may comprise a fuselage of an aircraft. Further, the fuselage of the aircraft may be formed from a composite material, and the substrate may be applied to the structure prior to curing of the composite material. Alternatively, when the fuselage of the aircraft is formed from a composite material, the substrate may be applied to the structure prior to a complete formation of the fuselage, such that, after the fuselage is completely formed, the one or more graphene traces become embedded within the composite material forming the fuselage. The at least one of the one or more graphene traces may be used to conduct electrical signals and/or electrical power. The substrate may be bonded to the structure when applied so that the substrate acts as an insulator for the one or more graphene traces. Still further, the substrate may include additional electrical circuitry. The additional electrical circuitry may be one or more organic light emitting diodes.
- In another aspect, a method for applying conductive traces to a structure to complete an electrical circuit. One or more graphene traces is formed on a substrate. The substrate is applied to the structure such that one or more first portions of the electrical circuit are electrically connected to respective one or more second portions of the electrical circuit by respective ones of the one or more graphene traces. Finally, the substrate is removed from the structure such that the graphene traces remain on the structure.
- In a still further aspect, a system for electrically coupling two portions of one or more electrical circuits. The system includes a substrate and one or more graphene traces formed on the substrate. Each of the one or more graphene traces is adapted to electrically couple a first portion of a respective one of the one or more electrical circuits to a second portion of the respective one of the one or more electrical circuits. The system may further include additional electrical circuitry formed on the substrate. The additional electrical circuitry may be one or more organic light emitting diodes. Finally, at least one portion of the one or more electrical circuits may be mounted on an interior surface of an aircraft fuselage.
- The features, functions, and advantages that have been discussed can be achieved independently in various embodiments or may be combined in yet other embodiments, further details of which can be seen with reference to the following description and drawings.
- The following detailed description, given by way of example and not intended to limit the present disclosure solely thereto, will best be understood in conjunction with the accompanying drawings in which:
-
FIG. 1 is a diagram showing graphene traces on an interior surface of an aircraft fuselage according to an embodiment of the present disclosure; and -
FIG. 2 is a diagram showing graphene traces pre-printed on a substrate roll according to an aspect of the present disclosure. - In the present disclosure, like reference numbers refer to like elements throughout the drawings, which illustrate various exemplary embodiments of the present disclosure.
- Graphene is a one-atom-thick planar sheet of sp2-bonded carbon atoms that are densely packed in a honeycomb (hexagonal) crystal lattice. Graphene has a density of approximately 1.7 g/cm3. Graphene is strong, light, nearly transparent and an excellent conductor of heat and electricity. The carbon/carbon bond length in graphene can be as thick as 0.142 nanometers. Graphene nanosheets are formed from layers of graphene. Graphene has a high carrier mobility and low noise susceptibility and thus is quite useful in electronic circuits.
- Referring now to
FIG. 1 , according to the present disclosure,conductive traces 110 formed from graphene nanosheets are bonded to the inner surface of afuselage 100 of an aircraft to complete a number of electrical circuits. Suchconductive traces 110 may provide low-voltage power tointerior cabin lighting 120 and towindow heaters 130 from a power source. In addition, theconductive traces 110 may also pass electrical signals to other electrical equipment within the aircraft, for example, digital audio and/or video signals for entertainment systems, electrical power for emergency lighting systems, etc. from a main distribution point. As one of ordinary skill in the art will readily recognize, theconductive traces 110 formed from graphene nanosheets may replace any of the conventional wiring in an aircraft used for such purposes. - Referring now to
FIG. 2 , thegraphene traces 210 may be formed on an appropriate substrate 200 as asingle roll 220 of graphene decals, with all circuit traces pre-printed on the substrate 200 of such rolls. Substrate 200 may be formed from, for example, carbon fiber tape, fiberglass tape or Kevlar tape. Theserolls 220 can bonded to structures (such as thefuselage 100 inFIG. 1 ). In one embodiment, the substrate 200 may be removed, leaving the graphene traces 210 behind on the surface of such structure. Notably, because graphene can stand high temperature, the graphene traces 210 can withstand high temperature curing of a composite in an auto clave, making this circuitry desirable for use with fuselages formed from composite materials. In another embodiment, the original substrate 200 can also be bonded to the structure and serve as a protective layer for the graphene traces 210 (e.g., for insulation purposes). In a still further embodiment, therolls 220 may be bonded to a fuselage formed from a composite during manufacturing of such fuselage such that, after substrate 200 is removed, formation of the fuselage continues and thegraphene traces 210 become embedded within the composite material. - In
FIG. 2 , thegraphene traces 210 are pre-printed on a bare substrate 200 that is formed into aroll 220. In the alternative, thegraphene traces 210 may be preprinted on substrates which also include other types of circuits, e.g., OLEDs (organic light emitting diodes), P-OLEDs (polymer organic light emitting diodes), etc., such that the substrate, when mounted on the inner surface of the fuselage, can provide additional functionality, e.g., interior lighting, based on the included additional circuits. - The use of graphene traces, as opposed to conventional copper or aluminum wiring, can provide significant savings in both weight and manufacturing costs. These circuits based on graphene traces can be embedded in an aircraft fuselage formed from either a composite material or a metal material, and in other structures formed from composites and/or metal. The elimination of conventional copper or aluminum wiring provides a significant weight savings and a significant reduction in the manufacturing and assembly process of the aircraft. This results in both a significant reduction in cost of each aircraft and an improved per mile revenue for each aircraft because of fuel savings achieved by the lighter aircraft.
- Although the present disclosure has been particularly shown and described with reference to the disclosed embodiments and various aspects thereof, it will be appreciated by those of ordinary skill in the art that various changes and modifications may be made without departing from the spirit and scope of the disclosure. It is intended that the appended claims be interpreted as including the embodiments described herein, the alternatives mentioned above, and all equivalents thereto.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/570,827 US9386694B1 (en) | 2014-12-15 | 2014-12-15 | Super light weight electronic circuit and low power distribution in aircraft systems |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/570,827 US9386694B1 (en) | 2014-12-15 | 2014-12-15 | Super light weight electronic circuit and low power distribution in aircraft systems |
Publications (2)
Publication Number | Publication Date |
---|---|
US20160174369A1 true US20160174369A1 (en) | 2016-06-16 |
US9386694B1 US9386694B1 (en) | 2016-07-05 |
Family
ID=56112553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/570,827 Active 2035-03-02 US9386694B1 (en) | 2014-12-15 | 2014-12-15 | Super light weight electronic circuit and low power distribution in aircraft systems |
Country Status (1)
Country | Link |
---|---|
US (1) | US9386694B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160377872A1 (en) * | 2015-06-29 | 2016-12-29 | Erin Hurbi | Graphene in optical systems |
US20170028947A1 (en) * | 2015-07-28 | 2017-02-02 | Airbus Operations Limited | Vehicle fairing including an electrical routing |
US20180288832A1 (en) * | 2017-04-03 | 2018-10-04 | The Boeing Company | Heating Electronic Dimmable Windows |
US20220009613A1 (en) * | 2020-07-10 | 2022-01-13 | Aerion Intellectual Property Management Corporation | Aircraft body section with multilayer electrically conductive structure and methods of fabrication |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8813352B2 (en) | 2007-05-17 | 2014-08-26 | The Boeing Company | Methods for fabricating a conductor |
US8163205B2 (en) | 2008-08-12 | 2012-04-24 | The Boeing Company | Durable transparent conductors on polymeric substrates |
US7897876B2 (en) | 2009-01-05 | 2011-03-01 | The Boeing Company | Carbon-nanotube/graphene-platelet-enhanced, high-conductivity wire |
US8450202B1 (en) | 2009-11-05 | 2013-05-28 | The Boeing Company | Nanotube electronics templated self-assembly |
US8263843B2 (en) | 2009-11-06 | 2012-09-11 | The Boeing Company | Graphene nanoplatelet metal matrix |
TW201203651A (en) | 2010-04-27 | 2012-01-16 | Orthogonal Inc | Method for forming a multicolor OLED device |
TW201347167A (en) | 2012-05-15 | 2013-11-16 | Innocom Tech Shenzhen Co Ltd | Organic light emitting diode display |
KR20140013492A (en) * | 2012-07-24 | 2014-02-05 | 삼성전기주식회사 | Printed circuit board and method for manufacturing of printed circuit board |
US9066426B2 (en) * | 2013-03-28 | 2015-06-23 | Nanchang O-Film Tech. Co., Ltd. | Transparent conductive film |
CN103943651B (en) * | 2013-08-29 | 2017-09-12 | 上海天马微电子有限公司 | OLED display device and corresponding flexible circuit board |
US9234633B2 (en) * | 2014-01-21 | 2016-01-12 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Method for manufacturing LED light bar and LED light bar thereof |
-
2014
- 2014-12-15 US US14/570,827 patent/US9386694B1/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160377872A1 (en) * | 2015-06-29 | 2016-12-29 | Erin Hurbi | Graphene in optical systems |
US10156726B2 (en) * | 2015-06-29 | 2018-12-18 | Microsoft Technology Licensing, Llc | Graphene in optical systems |
US20170028947A1 (en) * | 2015-07-28 | 2017-02-02 | Airbus Operations Limited | Vehicle fairing including an electrical routing |
US10752191B2 (en) * | 2015-07-28 | 2020-08-25 | Airbus Operations Limited | Vehicle fairing including an electrical routing |
US20180288832A1 (en) * | 2017-04-03 | 2018-10-04 | The Boeing Company | Heating Electronic Dimmable Windows |
US20220009613A1 (en) * | 2020-07-10 | 2022-01-13 | Aerion Intellectual Property Management Corporation | Aircraft body section with multilayer electrically conductive structure and methods of fabrication |
Also Published As
Publication number | Publication date |
---|---|
US9386694B1 (en) | 2016-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9386694B1 (en) | Super light weight electronic circuit and low power distribution in aircraft systems | |
US7729100B2 (en) | Lightning conductor system for wind generator blades comprising carbon fibre laminates | |
US10986699B2 (en) | Thermally conductive, electrically insulating protection layer for de-icing heaters | |
US9198232B2 (en) | Nanostructure-based heating devices and methods of use | |
JP6466459B2 (en) | Electrical conductor and method of forming electrical conductor | |
US20100020461A1 (en) | Lightning Protection System for Aircraft Composite Structure | |
TW200739817A (en) | Semiconductor device and a method of increasing a resistance value of an electric fuse | |
CA2677311A1 (en) | Aircraft assembly and method for manufacturing the same | |
CN102261310A (en) | Wind turbine blade with a conductively doped coating for lightning protection of the wind turbine blade and method for manufacturing the wind turbine blade | |
US20190381763A1 (en) | Graphite composite film and method for producing same | |
ES2884900T3 (en) | Procedure for installing printed cables in aircraft cable collector systems, and composite element with an integrated cable collector system | |
US8497423B2 (en) | High voltage DC tether | |
Kumar et al. | Enhanced through-thickness electrical conductivity and lightning strike damage response of interleaved vertically aligned short carbon fiber composites | |
CN104194664A (en) | Conductive tape | |
CN104051079A (en) | Method for manufacturing conductive wires and cables containing mechanical exfoliation graphene | |
CN103531272A (en) | Light radiation-resistant high-performance transmission cable for aerospace | |
GB201210733D0 (en) | Structual integrated wiring loom | |
US10410759B2 (en) | Conductive device intended to be mounted on the surface of parts made of composite materials | |
CN103756587A (en) | High-reliability double-sided screen protector | |
CN104252886A (en) | Wind energy cable | |
WO2015139736A1 (en) | A method for manufacturing a high-power cable | |
US20130180753A1 (en) | Self-supporting cable | |
TW201405585A (en) | Conductive sheet and method for producing the same and electronic parts | |
CN202373333U (en) | Lead special for lunar vehicle | |
Xu et al. | Signal transmission along Cu-graphene heterogeneous interconnects |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: THE BOEING COMPANY, ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SAFAI, MORTEZA;REEL/FRAME:034510/0193 Effective date: 20141215 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |