US20160172103A1 - Electronic component and method of manufacturing the same - Google Patents
Electronic component and method of manufacturing the same Download PDFInfo
- Publication number
- US20160172103A1 US20160172103A1 US14/936,433 US201514936433A US2016172103A1 US 20160172103 A1 US20160172103 A1 US 20160172103A1 US 201514936433 A US201514936433 A US 201514936433A US 2016172103 A1 US2016172103 A1 US 2016172103A1
- Authority
- US
- United States
- Prior art keywords
- thickness
- electronic component
- magnetic body
- lead
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 229910000859 α-Fe Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 239000002923 metal particle Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Definitions
- the present disclosure relates to an electronic component and a method of manufacturing the same.
- An inductor, an electronic component, is a representative passive element configuring an electronic circuit, together with a resistor and a capacitor to remove noise.
- a thin film type inductor is manufactured by forming coil patterns by a plating process, hardening a magnetic powder-resin composite in which a magnetic powder and a resin are mixed with each other to manufacture a magnetic body, and then forming external electrodes on outer surfaces of the magnetic body.
- One aspect of the present disclosure may provide an electronic component having reduced problems such as breakage defects, and the like which may be caused at the time of manufacturing a slimmed electronic component by sufficiently securing a region of a magnetic body around coil patterns, and a method having efficient manufacturing of the electronic component.
- an electronic component may include a magnetic body, and a coil pattern embedded in the magnetic body, the coil pattern including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body.
- the lead parts may include regions having different thicknesses, and thicknesses of at least portions of the lead parts having a relatively thin thickness may be thinner than thicknesses of the internal coil parts.
- Portions of the lead parts having a relatively thick thickness may have the same thicknesses as thicknesses of the internal coil parts.
- the lead parts may have a step shape.
- Thicknesses of the portions of the lead parts having the relatively thin thickness may be formed relatively close to an outer region of the magnetic body.
- a thickness of the internal coil part is a and a thickness of the portion of the lead part having the relatively thin thickness is b, 0.6 ⁇ b/a ⁇ 1 may be satisfied.
- a thickness of a cover region covering an upper portion or a lower portion of the coil pattern in the magnetic body may be 150 ⁇ m or less.
- the coil pattern may be formed by a plating process.
- the coil pattern may include a first coil pattern disposed on one surface of an insulating substrate and a second coil pattern disposed on the other surface of the insulating substrate opposing the one surface of the insulating substrate.
- the electronic component may further include external electrodes disposed on outer surfaces of the magnetic body and connected to the lead parts.
- the magnetic body may include a magnetic metal powder and a thermosetting resin.
- a method of manufacturing an electronic component may include forming coil patterns on an insulating substrate, and providing magnetic sheets on an upper surface and a lower surface of the insulating substrate on which the coil patterns are formed, to form a magnetic body.
- the coil patterns may include internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and exposed to surfaces of the magnetic body, and the lead parts may include regions having different thicknesses and thicknesses of at least portions of the lead parts having a relatively thin thickness may be thinner than thicknesses of the internal coil parts.
- Portions of the lead parts having a relatively thick thickness may have the same thicknesses as thicknesses of the internal coil parts.
- the lead parts may be formed in a step shape.
- the portions of the lead parts having the relatively thin thickness may be formed relatively close to an outer region of the magnetic body.
- a thickness of the internal coil part is a and a thickness of the portion of the lead part having the relatively thin thickness is b, 0.6 ⁇ b/a ⁇ 1 may be satisfied.
- a plating process may be performed.
- the method of manufacturing an electronic component may further include forming external electrodes on outer surfaces of the magnetic body to be connected to the lead parts.
- FIG. 1 is a schematic perspective view illustrating an electronic component according to an exemplary embodiment in the present disclosure so that coil patterns of the electronic component are visible.
- FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1 .
- FIG. 3 is a schematic process flow chart describing a manufacturing process of an electronic component according to an exemplary embodiment in the present disclosure.
- an electronic component according to an exemplary embodiment particularly a thin film type inductor, will be described as an example.
- the electronic component according to the exemplary embodiment is not limited thereto.
- FIG. 1 is a schematic perspective view illustrating an electronic component according to an exemplary embodiment so that internal coil patterns of the electronic component are visible and FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1 .
- FIGS. 1 and 2 as an example of an electronic component, a thin film type inductor used in a power line, or the like, of a power supply circuit is disclosed.
- the electronic component 100 may include a magnetic body 50 , coil patterns 61 and 62 embedded in the magnetic body 50 , and first and second external electrodes 81 and 82 disposed on outer surfaces of the magnetic body 50 and connected to the coil patterns 61 and 62 .
- a “length” direction refers to an “L” direction of FIG. 1
- a “width” direction refers to a “W” direction of FIG. 1
- a “thickness” direction refers to a “T” direction of FIG. 1 .
- the shape of the magnetic body 50 may form a shape of the electronic component 100 and may be formed of any material that exhibits magnetic properties.
- the magnetic body 50 may be formed by providing ferrite or magnetic metal particles in a resin part.
- the ferrite may be made of an Mn—Zn-based ferrite, an Ni—Zn-based ferrite, an Ni—Zn—Cu-based ferrite, an Mn—Mg-based ferrite, a Ba-based ferrite, an Li-based ferrite, or the like, and the magnetic body 50 may have a form in which the above-mentioned ferrite particles are dispersed in a resin such as epoxy, polyimide, or the like.
- the magnetic metal particles may contain any one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), aluminum (Al), and nickel (Ni).
- the magnetic metal particles may be an Fe—Si—B—Cr based amorphous metal, but are not limited thereto.
- the magnetic metal particles may have a diameter of about 0.1 ⁇ m to 30 ⁇ m, and the magnetic body 50 may have a form in which the above-mentioned magnetic metal particles are dispersed in the resin such as epoxy, polyimide, or the like, similar to the ferrite described above.
- the first coil pattern 61 may be disposed on one surface of an insulating substrate 20 disposed in the magnetic body 50
- the second coil pattern 62 may be disposed on the other surface of the insulating substrate 20 opposing one surface of the insulating substrate 20
- the first and second coil patterns 61 and 62 may be electrically connected to each other through a via (not illustrated) formed to penetrate through the insulating substrate 20 .
- the insulating substrate 20 may be, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal based soft magnetic substrate, or the like.
- the insulating substrate 20 may have a through-hole formed in a central portion thereof so as to penetrate through the central portion thereof, wherein the through-hole may be filled with magnetic material to form a core part 55 .
- the core part 55 filled with the magnetic material may be formed, thereby improving performance of a thin film type inductor.
- the first and second coil patterns 61 and 62 may each be formed in a spiral shape and may include internal coil parts 41 and 42 serving as a main region of a coil, and lead parts 46 and 47 connected to ends of the internal coil parts 41 and 42 and exposed to surfaces of the magnetic body 50 .
- the lead parts 46 and 47 may be formed by extending one end portion of each of the internal coil parts 41 and 42 , and may be exposed to surfaces of the magnetic body 50 so as to be connected to the external electrodes 81 and 82 disposed on the outer surfaces of the magnetic body 50 .
- the first and second coil patterns 61 and 62 and a via may be formed of a material including a metal having excellent electrical conductivity, and may be formed of silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or alloys thereof.
- the first and second coil patterns 61 and 62 may be formed by performing an electroplating method.
- other processes known in the art may also be used as long as they have a similar effect.
- a thickness b of some regions of the lead parts 46 and 47 may be formed to be thinner than a thickness a of the internal coil parts 41 and 42 .
- an amount (or a volume) of the magnetic body 50 present around the lead parts 46 and 47 may be decreased.
- the lead parts 46 and 47 may become vulnerable to the processes such as cutting, polishing, or the like, thereby increasing a defect rate.
- stress caused by the above-mentioned equipment may be transferred to the internal coil parts 41 and 42 .
- the amount of the magnetic body 50 present around a cut region is small, for instance, the magnetic body 50 is thin, an influence of the above-mentioned stress may be increased.
- the lead parts 46 and 47 may be formed to be relatively thin, and a region occupied by the magnetic body 50 around the lead parts 46 and 47 may be further secured.
- the relatively increased region of the magnetic body 50 may significantly reduce the influence of the stress on the internal coil regions in the following process as described above, thereby contributing to improve performance and reliability of the electronic component.
- the lead parts 46 and 47 may also include a region formed to be relatively thick, instead of forming the lead parts 46 and 47 to have the same thickness.
- the lead parts 46 and 47 may include the relatively thick region, and thus coupling force between the lead parts 46 and 47 and the magnetic body 50 may be increased, and electric resistance in an overall region of the lead parts 46 and may be reduced, thereby helping to improve electrical characteristics.
- the region having the relatively thick thickness of the lead part 46 or 47 may be formed to have the same thickness a as that of the internal coil part.
- the lead parts 46 and 47 may be formed in a step shape. In this case, as described above, the region having the relatively thin thickness of the lead part 46 or 47 may be formed to be relatively close to an outer region of the magnetic body 50 .
- a positive effect of the lead parts 46 and 47 which are formed to be relatively thin may be further increased as the thickness of the magnetic body 50 is thin.
- a case in which the magnetic body 50 is thin may be defined, for example, as a form in which a thickness e of cover regions covering an upper portion and a lower portion of the coil patterns 61 and 62 in the magnetic body 50 is about 150 ⁇ m or less.
- the thickness of the lead parts 46 and 47 may be thin, the internal coil parts 41 and 42 may be protected, but an area in which the internal coil parts 41 and 42 contact the external electrodes 81 and 82 may be decreased, thereby deteriorating electrical characteristics.
- a ratio of the region having the relatively thick thickness in each of the lead parts 46 and 47 may need to be determined by taking account of an effect according to an increase in a volume of the magnetic body 50 , an adhesive strength improvement effect of the lead parts 46 and 47 and the magnetic body 50 , and the like.
- the thickness and width of the lead parts 46 and 47 may be appropriately determined by comparing the thickness and width with the internal coil parts 41 and 42 .
- the thickness of the coil patterns when the thickness of each of the internal coil parts 41 and 42 is a and a thickness of a thin region of the thickness of the lead part 46 or 47 is b, the thickness of the coil patterns may satisfy 0.6 ⁇ b/a ⁇ 1.
- a width of the coil patterns when an overall width of each of the lead parts 46 and 47 is c and a width of the region having the relatively thin thickness of the lead part 46 or 47 is d, a width of the coil patterns may satisfy 0.6 ⁇ d/c ⁇ 1.
- the internal coil parts 41 and 42 and the lead parts 46 and 47 may be formed by a plating process. If the internal coil parts 41 and 42 and the lead parts 46 and 47 are formed by performing the plating process, the thickness of the lead parts 46 and 47 may be appropriately adjusted by adjusting current density, concentration of a plating solution, plating speed, or the like.
- FIG. 3 is a process flow chart schematically describing a manufacturing process of an electronic component according to an exemplary embodiment. The method of manufacturing an electronic component in FIG. 3 will be described with reference to FIGS. 1 and 2 .
- coil patterns 61 and 62 may be formed on an insulating substrate 20 .
- a plating may be used, but is not necessarily used.
- the coil patterns 61 and 62 may include the internal coil parts 41 and 42 of the spiral shape, and the lead parts 46 and 47 formed by extending one end portion of each of the internal coil parts 41 and 42 .
- the thickness b of the lead parts 46 and 47 may be formed to be thinner than the thickness a of the internal coil parts 41 and 42 , thereby securing sufficient stability in the following process.
- the internal coil parts 41 and 42 and the lead parts 46 and 47 may be formed by performing the plating process, and the thickness b of the outermost region exposed to the outside of the lead parts 46 and 47 may be implemented to be thinner than the thickness a of the internal coil parts 41 and 42 by adjusting current density, concentration of a plating solution, plating speed, or the like.
- an insulating film (not illustrated) coating the coil patterns 61 and 62 may be formed, wherein the insulating film may be formed by a known method such as a screen printing method, an exposure and development method of a photo-resist (PR), a spray applying method, or the like.
- the magnetic sheets may be stacked on upper and lower surfaces of the insulating substrate 20 on which the coil patterns 61 and 62 are formed, and the stacked magnetic sheets may then be compressed and cured to form the magnetic body 50 .
- the magnetic sheets may be manufactured in a sheet shape by preparing slurry by mixtures of magnetic metal powder, and organic materials such as a binder, a solvent, and the like, applying the slurry at a thickness of several tens of micrometers onto carrier films by a doctor blade method, and then drying the slurry.
- a central portion of the insulating substrate 20 may be removed by performing a mechanical drilling process, a laser drilling, sandblasting, a punching process, or the like to form a core part hole, and the core part hole may be filled with the magnetic material in the process of stacking, compressing and curing the magnetic sheets to form the core part 55 .
- the first and second external electrodes 81 and 82 may be formed on the outer surfaces of the magnetic body 50 so as to be connected, respectively, to the lead parts 46 and 47 exposed to surfaces of the magnetic body 50 .
- the external electrodes 81 and 82 may be formed of a paste containing a metal having excellent electrical conductivity, such as a conductive paste containing nickel (Ni), copper (Cu), tin (Sn), or silver (Ag), or alloys thereof.
- plated layers (not illustrated) may be further formed on the external electrodes 81 and 82 .
- the plated layers may contain one or more selected from a group consisting of nickel (Ni), copper (Cu), and tin (Sn).
- a nickel (Ni) layer and a tin (Sn) layer may be sequentially formed.
- the electronic component having reduced problems such as breakage defects and the like which may be caused at the time of manufacturing the slimmed electronic component may be provided, and further, a method having efficient manufacturing of the electronic component may be provided.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
- This application claims the benefit of priority to Korean Patent Application No. 10-2014-0179809, filed on Dec. 12, 2014 with the Korean Intellectual Property Office, the entirety of which is incorporated herein by reference.
- The present disclosure relates to an electronic component and a method of manufacturing the same.
- An inductor, an electronic component, is a representative passive element configuring an electronic circuit, together with a resistor and a capacitor to remove noise.
- A thin film type inductor is manufactured by forming coil patterns by a plating process, hardening a magnetic powder-resin composite in which a magnetic powder and a resin are mixed with each other to manufacture a magnetic body, and then forming external electrodes on outer surfaces of the magnetic body.
- In the case of a thin film type inductor, in accordance with recent changes to devices, such as increasing complexity, multifunctionalization, slimming, or the like, attempts to slim inductors continue. Thus, technology in which high performance and reliability can be secured despite the trend toward slimness of electronic components is required.
- One aspect of the present disclosure may provide an electronic component having reduced problems such as breakage defects, and the like which may be caused at the time of manufacturing a slimmed electronic component by sufficiently securing a region of a magnetic body around coil patterns, and a method having efficient manufacturing of the electronic component.
- According to one aspect of the present disclosure, an electronic component may include a magnetic body, and a coil pattern embedded in the magnetic body, the coil pattern including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. The lead parts may include regions having different thicknesses, and thicknesses of at least portions of the lead parts having a relatively thin thickness may be thinner than thicknesses of the internal coil parts.
- Portions of the lead parts having a relatively thick thickness may have the same thicknesses as thicknesses of the internal coil parts.
- The lead parts may have a step shape.
- Thicknesses of the portions of the lead parts having the relatively thin thickness may be formed relatively close to an outer region of the magnetic body.
- When a thickness of the internal coil part is a and a thickness of the portion of the lead part having the relatively thin thickness is b, 0.6≦b/a<1 may be satisfied.
- When a width of the lead part is c and a width of the portion of the lead part having the relatively thin thickness is d, 0.6<d/c<1 may be satisfied.
- A thickness of a cover region covering an upper portion or a lower portion of the coil pattern in the magnetic body may be 150 μm or less.
- The coil pattern may be formed by a plating process.
- The coil pattern may include a first coil pattern disposed on one surface of an insulating substrate and a second coil pattern disposed on the other surface of the insulating substrate opposing the one surface of the insulating substrate.
- The electronic component may further include external electrodes disposed on outer surfaces of the magnetic body and connected to the lead parts.
- The magnetic body may include a magnetic metal powder and a thermosetting resin.
- According to another aspect of the present disclosure, a method of manufacturing an electronic component may include forming coil patterns on an insulating substrate, and providing magnetic sheets on an upper surface and a lower surface of the insulating substrate on which the coil patterns are formed, to form a magnetic body. The coil patterns may include internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and exposed to surfaces of the magnetic body, and the lead parts may include regions having different thicknesses and thicknesses of at least portions of the lead parts having a relatively thin thickness may be thinner than thicknesses of the internal coil parts.
- Portions of the lead parts having a relatively thick thickness may have the same thicknesses as thicknesses of the internal coil parts.
- The lead parts may be formed in a step shape.
- The portions of the lead parts having the relatively thin thickness may be formed relatively close to an outer region of the magnetic body.
- When a thickness of the internal coil part is a and a thickness of the portion of the lead part having the relatively thin thickness is b, 0.6≦b/a<1 may be satisfied.
- When a width of the lead part is c and a width of the portion of the lead part having the relatively thin thickness is d, 0.6<d/c<1 may be satisfied.
- In the forming of the coil patterns, a plating process may be performed.
- The method of manufacturing an electronic component may further include forming external electrodes on outer surfaces of the magnetic body to be connected to the lead parts.
- The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.
-
FIG. 1 is a schematic perspective view illustrating an electronic component according to an exemplary embodiment in the present disclosure so that coil patterns of the electronic component are visible. -
FIG. 2 is a cross-sectional view taken along line I-I′ ofFIG. 1 . -
FIG. 3 is a schematic process flow chart describing a manufacturing process of an electronic component according to an exemplary embodiment in the present disclosure. - Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
- The disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
- In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.
- Electronic Component
- Hereinafter, an electronic component according to an exemplary embodiment, particularly a thin film type inductor, will be described as an example. However, the electronic component according to the exemplary embodiment is not limited thereto.
-
FIG. 1 is a schematic perspective view illustrating an electronic component according to an exemplary embodiment so that internal coil patterns of the electronic component are visible andFIG. 2 is a cross-sectional view taken along line I-I′ ofFIG. 1 . Referring toFIGS. 1 and 2 , as an example of an electronic component, a thin film type inductor used in a power line, or the like, of a power supply circuit is disclosed. - The
electronic component 100, according to an exemplary embodiment, may include amagnetic body 50,coil patterns magnetic body 50, and first and secondexternal electrodes magnetic body 50 and connected to thecoil patterns - In
FIG. 1 , a “length” direction refers to an “L” direction ofFIG. 1 , a “width” direction refers to a “W” direction ofFIG. 1 , and a “thickness” direction refers to a “T” direction ofFIG. 1 . - The shape of the
magnetic body 50 may form a shape of theelectronic component 100 and may be formed of any material that exhibits magnetic properties. For example, themagnetic body 50 may be formed by providing ferrite or magnetic metal particles in a resin part. - As a specific example of the above-mentioned materials, the ferrite may be made of an Mn—Zn-based ferrite, an Ni—Zn-based ferrite, an Ni—Zn—Cu-based ferrite, an Mn—Mg-based ferrite, a Ba-based ferrite, an Li-based ferrite, or the like, and the
magnetic body 50 may have a form in which the above-mentioned ferrite particles are dispersed in a resin such as epoxy, polyimide, or the like. - In addition, the magnetic metal particles may contain any one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), aluminum (Al), and nickel (Ni). For example, the magnetic metal particles may be an Fe—Si—B—Cr based amorphous metal, but are not limited thereto. The magnetic metal particles may have a diameter of about 0.1 μm to 30 μm, and the
magnetic body 50 may have a form in which the above-mentioned magnetic metal particles are dispersed in the resin such as epoxy, polyimide, or the like, similar to the ferrite described above. - As illustrated in
FIGS. 1 and 2 , thefirst coil pattern 61 may be disposed on one surface of aninsulating substrate 20 disposed in themagnetic body 50, and thesecond coil pattern 62 may be disposed on the other surface of theinsulating substrate 20 opposing one surface of theinsulating substrate 20. In this case, the first andsecond coil patterns insulating substrate 20. - The
insulating substrate 20 may be, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal based soft magnetic substrate, or the like. Theinsulating substrate 20 may have a through-hole formed in a central portion thereof so as to penetrate through the central portion thereof, wherein the through-hole may be filled with magnetic material to form acore part 55. As such, thecore part 55 filled with the magnetic material may be formed, thereby improving performance of a thin film type inductor. - The first and
second coil patterns internal coil parts lead parts internal coil parts magnetic body 50. In this case, thelead parts internal coil parts magnetic body 50 so as to be connected to theexternal electrodes magnetic body 50. - The first and
second coil patterns second coil patterns second coil patterns - According to the present exemplary embodiment, a thickness b of some regions of the
lead parts internal coil parts lead parts magnetic body 50 present around thelead parts magnetic body 50 is decreased, thelead parts magnetic body 50 is cut into electronic components having a size corresponding thereto using a blade, a saw, or the like, stress caused by the above-mentioned equipment may be transferred to theinternal coil parts magnetic body 50 present around a cut region is small, for instance, themagnetic body 50 is thin, an influence of the above-mentioned stress may be increased. - By taking the above-mentioned problems into account, according to the present exemplary embodiment, the
lead parts magnetic body 50 around thelead parts magnetic body 50 may significantly reduce the influence of the stress on the internal coil regions in the following process as described above, thereby contributing to improve performance and reliability of the electronic component. - Further, according to an exemplary embodiment, the
lead parts lead parts lead parts lead parts magnetic body 50 may be increased, and electric resistance in an overall region of thelead parts 46 and may be reduced, thereby helping to improve electrical characteristics. In this case, as illustrated inFIG. 2 , the region having the relatively thick thickness of thelead part lead parts lead part magnetic body 50. - As described above, a positive effect of the
lead parts magnetic body 50 is thin. Here, a case in which themagnetic body 50 is thin may be defined, for example, as a form in which a thickness e of cover regions covering an upper portion and a lower portion of thecoil patterns magnetic body 50 is about 150 μm or less. - As such, as the thickness of the
lead parts internal coil parts internal coil parts external electrodes lead parts magnetic body 50, an adhesive strength improvement effect of thelead parts magnetic body 50, and the like. In this respect, the thickness and width of thelead parts internal coil parts internal coil parts lead part lead parts lead part lead parts internal coil parts lead parts - Meanwhile, the
internal coil parts lead parts internal coil parts lead parts lead parts - Method of Manufacturing Electronic Component
-
FIG. 3 is a process flow chart schematically describing a manufacturing process of an electronic component according to an exemplary embodiment. The method of manufacturing an electronic component inFIG. 3 will be described with reference toFIGS. 1 and 2 . - First,
coil patterns substrate 20. Here, a plating may be used, but is not necessarily used. As described above, thecoil patterns internal coil parts lead parts internal coil parts - As described above, according to the present exemplary embodiment, the thickness b of the
lead parts internal coil parts internal coil parts lead parts lead parts internal coil parts - Meanwhile, although not illustrated in
FIGS. 1 and 2 , in order to further protect thecoil patterns coil patterns - Next, the magnetic sheets may be stacked on upper and lower surfaces of the insulating
substrate 20 on which thecoil patterns magnetic body 50. The magnetic sheets may be manufactured in a sheet shape by preparing slurry by mixtures of magnetic metal powder, and organic materials such as a binder, a solvent, and the like, applying the slurry at a thickness of several tens of micrometers onto carrier films by a doctor blade method, and then drying the slurry. - A central portion of the insulating
substrate 20 may be removed by performing a mechanical drilling process, a laser drilling, sandblasting, a punching process, or the like to form a core part hole, and the core part hole may be filled with the magnetic material in the process of stacking, compressing and curing the magnetic sheets to form thecore part 55. - Next, the first and second
external electrodes magnetic body 50 so as to be connected, respectively, to thelead parts magnetic body 50. Theexternal electrodes external electrodes - A description of features overlapping those of the electronic component according to the exemplary embodiment described above except for the above-mentioned description will be omitted.
- As set forth above, according to an exemplary embodiment, the electronic component having reduced problems such as breakage defects and the like which may be caused at the time of manufacturing the slimmed electronic component may be provided, and further, a method having efficient manufacturing of the electronic component may be provided.
- While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims.
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/412,880 US10546681B2 (en) | 2014-12-12 | 2019-05-15 | Electronic component having lead part including regions having different thicknesses and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140179809A KR101792317B1 (en) | 2014-12-12 | 2014-12-12 | Chip electronic component and manufacturing method thereof |
KR10-2014-0179809 | 2014-12-12 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/412,880 Continuation US10546681B2 (en) | 2014-12-12 | 2019-05-15 | Electronic component having lead part including regions having different thicknesses and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
US20160172103A1 true US20160172103A1 (en) | 2016-06-16 |
US10332667B2 US10332667B2 (en) | 2019-06-25 |
Family
ID=56111829
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/936,433 Active 2035-12-01 US10332667B2 (en) | 2014-12-12 | 2015-11-09 | Electronic component having lead part including regions having different thicknesses and method of manufacturing the same |
US16/412,880 Active US10546681B2 (en) | 2014-12-12 | 2019-05-15 | Electronic component having lead part including regions having different thicknesses and method of manufacturing the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/412,880 Active US10546681B2 (en) | 2014-12-12 | 2019-05-15 | Electronic component having lead part including regions having different thicknesses and method of manufacturing the same |
Country Status (3)
Country | Link |
---|---|
US (2) | US10332667B2 (en) |
KR (1) | KR101792317B1 (en) |
CN (2) | CN110556241B (en) |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160172102A1 (en) * | 2014-12-12 | 2016-06-16 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
JP2018207093A (en) * | 2017-06-01 | 2018-12-27 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Coil component |
JP2020010011A (en) * | 2018-07-05 | 2020-01-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Coil component |
US20200027638A1 (en) * | 2018-07-17 | 2020-01-23 | Murata Manufacturing Co., Ltd. | Inductor component |
JP2020017716A (en) * | 2018-07-27 | 2020-01-30 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Coil component |
CN110970208A (en) * | 2018-09-28 | 2020-04-07 | 三星电机株式会社 | Coil electronic component |
US10847308B2 (en) | 2017-06-01 | 2020-11-24 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
CN112117088A (en) * | 2019-06-21 | 2020-12-22 | 三星电机株式会社 | Coil electronic component |
US20200402704A1 (en) * | 2019-06-21 | 2020-12-24 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
US20210183564A1 (en) * | 2019-12-12 | 2021-06-17 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20210202161A1 (en) * | 2019-12-27 | 2021-07-01 | Murata Manufacturing Co., Ltd. | Multilayer coil component |
US20210375529A1 (en) * | 2020-05-26 | 2021-12-02 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20220068545A1 (en) * | 2020-09-01 | 2022-03-03 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11270835B2 (en) | 2018-07-20 | 2022-03-08 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20220102061A1 (en) * | 2020-09-25 | 2022-03-31 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11315719B2 (en) | 2018-04-10 | 2022-04-26 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing a coil component |
US11335496B2 (en) | 2018-07-10 | 2022-05-17 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20220181072A1 (en) * | 2020-12-08 | 2022-06-09 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11521784B2 (en) | 2018-10-02 | 2022-12-06 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11908612B2 (en) * | 2018-12-17 | 2024-02-20 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102464202B1 (en) | 2016-08-31 | 2022-11-04 | 비쉐이 데일 일렉트로닉스, 엘엘씨 | Inductor with high current coil with low DC resistance |
KR102080650B1 (en) * | 2018-09-21 | 2020-02-24 | 삼성전기주식회사 | Coil component and manufacturing method for the same |
US11948724B2 (en) | 2021-06-18 | 2024-04-02 | Vishay Dale Electronics, Llc | Method for making a multi-thickness electro-magnetic device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050068150A1 (en) * | 2002-10-31 | 2005-03-31 | Nobuya Matsutani | Inductance part and electronic device using the same |
US6912115B2 (en) * | 2003-10-30 | 2005-06-28 | Tdk Corporation | Multilayer capacitor |
US20060214759A1 (en) * | 2005-03-23 | 2006-09-28 | Sumida Corporation | Inductor |
US20090278649A1 (en) * | 2003-11-28 | 2009-11-12 | Tsuyoshi Tatsukawa | Laminated Ceramic Electronic Component and Method for Producing the Same |
US20130162382A1 (en) * | 2011-12-22 | 2013-06-27 | C/O Samsung Electro-Mechanics Co., Ltd. | Chip inductor and method for manufacturing the same |
US20130249662A1 (en) * | 2012-03-26 | 2013-09-26 | Tdk Corporation | Planar coil element |
US20130341758A1 (en) * | 2012-05-31 | 2013-12-26 | Samsung Electro-Mechanics Co., Ltd. | Chip inductor |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3767437B2 (en) * | 2001-09-05 | 2006-04-19 | 株式会社村田製作所 | Multilayer type common mode choke coil |
JP2003229311A (en) * | 2002-01-31 | 2003-08-15 | Tdk Corp | Coil-enclosed powder magnetic core, method of manufacturing the same, and coil and method of manufacturing the coil |
JP4132844B2 (en) * | 2002-01-31 | 2008-08-13 | 東洋製罐株式会社 | Web folding method and apparatus |
JP2007067214A (en) | 2005-08-31 | 2007-03-15 | Taiyo Yuden Co Ltd | Power inductor |
JP2007123307A (en) * | 2005-10-25 | 2007-05-17 | Matsushita Electric Ind Co Ltd | Choke coil |
JP4028884B1 (en) | 2006-11-01 | 2007-12-26 | Tdk株式会社 | Coil parts |
JP2008192673A (en) * | 2007-02-01 | 2008-08-21 | Matsushita Electric Ind Co Ltd | Inductance component |
JP5084459B2 (en) * | 2007-11-15 | 2012-11-28 | 太陽誘電株式会社 | Inductor and manufacturing method thereof |
JP2011071457A (en) * | 2008-12-22 | 2011-04-07 | Tdk Corp | Electronic component and manufacturing method of electronic component |
CN102044323A (en) * | 2009-10-19 | 2011-05-04 | 深圳振华富电子有限公司 | Laminated chip inductor |
CN101819853B (en) * | 2010-04-29 | 2012-05-09 | 深圳顺络电子股份有限公司 | Method for manufacturing bank wound coil component |
TWI566265B (en) * | 2010-07-23 | 2017-01-11 | 乾坤科技股份有限公司 | Coil device |
JP5195876B2 (en) * | 2010-11-10 | 2013-05-15 | Tdk株式会社 | Coil component and manufacturing method thereof |
CN102568779B (en) * | 2010-12-13 | 2015-03-25 | 阿尔卑斯绿色器件株式会社 | Inductance element |
JP5895424B2 (en) * | 2011-09-27 | 2016-03-30 | Tdk株式会社 | Multilayer coil parts |
WO2013103044A1 (en) * | 2012-01-06 | 2013-07-11 | 株式会社村田製作所 | Electronic component |
-
2014
- 2014-12-12 KR KR1020140179809A patent/KR101792317B1/en active IP Right Grant
-
2015
- 2015-11-09 US US14/936,433 patent/US10332667B2/en active Active
- 2015-11-25 CN CN201910884417.1A patent/CN110556241B/en active Active
- 2015-11-25 CN CN201510829901.6A patent/CN105702428B/en active Active
-
2019
- 2019-05-15 US US16/412,880 patent/US10546681B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050068150A1 (en) * | 2002-10-31 | 2005-03-31 | Nobuya Matsutani | Inductance part and electronic device using the same |
US7212094B2 (en) * | 2002-10-31 | 2007-05-01 | Matsushita Electric Industrial Co., Ltd. | Inductive components and electronic devices using the same |
US6912115B2 (en) * | 2003-10-30 | 2005-06-28 | Tdk Corporation | Multilayer capacitor |
US20090278649A1 (en) * | 2003-11-28 | 2009-11-12 | Tsuyoshi Tatsukawa | Laminated Ceramic Electronic Component and Method for Producing the Same |
US20060214759A1 (en) * | 2005-03-23 | 2006-09-28 | Sumida Corporation | Inductor |
US20130162382A1 (en) * | 2011-12-22 | 2013-06-27 | C/O Samsung Electro-Mechanics Co., Ltd. | Chip inductor and method for manufacturing the same |
US20130249662A1 (en) * | 2012-03-26 | 2013-09-26 | Tdk Corporation | Planar coil element |
US20130341758A1 (en) * | 2012-05-31 | 2013-12-26 | Samsung Electro-Mechanics Co., Ltd. | Chip inductor |
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160172102A1 (en) * | 2014-12-12 | 2016-06-16 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
US10141097B2 (en) * | 2014-12-12 | 2018-11-27 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
US10923264B2 (en) | 2014-12-12 | 2021-02-16 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
JP2018207093A (en) * | 2017-06-01 | 2018-12-27 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Coil component |
US10847308B2 (en) | 2017-06-01 | 2020-11-24 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11315719B2 (en) | 2018-04-10 | 2022-04-26 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing a coil component |
JP2020010011A (en) * | 2018-07-05 | 2020-01-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Coil component |
JP7332086B2 (en) | 2018-07-05 | 2023-08-23 | サムソン エレクトロ-メカニックス カンパニーリミテッド. | coil parts |
US11335496B2 (en) | 2018-07-10 | 2022-05-17 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20200027638A1 (en) * | 2018-07-17 | 2020-01-23 | Murata Manufacturing Co., Ltd. | Inductor component |
US11610712B2 (en) * | 2018-07-17 | 2023-03-21 | Murata Manufacturing Co., Ltd. | Inductor component |
US11270835B2 (en) | 2018-07-20 | 2022-03-08 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11367561B2 (en) | 2018-07-27 | 2022-06-21 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
JP2020017716A (en) * | 2018-07-27 | 2020-01-30 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Coil component |
US11264161B2 (en) * | 2018-09-28 | 2022-03-01 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
CN110970208A (en) * | 2018-09-28 | 2020-04-07 | 三星电机株式会社 | Coil electronic component |
US11521784B2 (en) | 2018-10-02 | 2022-12-06 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11908612B2 (en) * | 2018-12-17 | 2024-02-20 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11694838B2 (en) * | 2019-06-21 | 2023-07-04 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
US11830654B2 (en) * | 2019-06-21 | 2023-11-28 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
US20200402699A1 (en) * | 2019-06-21 | 2020-12-24 | Samsung Electro Mechanics Co., Ltd. | Coil electronic component |
US20200402704A1 (en) * | 2019-06-21 | 2020-12-24 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
CN112117088A (en) * | 2019-06-21 | 2020-12-22 | 三星电机株式会社 | Coil electronic component |
US11562850B2 (en) * | 2019-12-12 | 2023-01-24 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20210183564A1 (en) * | 2019-12-12 | 2021-06-17 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20210202161A1 (en) * | 2019-12-27 | 2021-07-01 | Murata Manufacturing Co., Ltd. | Multilayer coil component |
US20210375529A1 (en) * | 2020-05-26 | 2021-12-02 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11901112B2 (en) * | 2020-05-26 | 2024-02-13 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20220068545A1 (en) * | 2020-09-01 | 2022-03-03 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11942256B2 (en) * | 2020-09-01 | 2024-03-26 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20220102061A1 (en) * | 2020-09-25 | 2022-03-31 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US11942264B2 (en) * | 2020-09-25 | 2024-03-26 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US20220181072A1 (en) * | 2020-12-08 | 2022-06-09 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
Also Published As
Publication number | Publication date |
---|---|
KR20160071958A (en) | 2016-06-22 |
US10332667B2 (en) | 2019-06-25 |
CN110556241B (en) | 2022-07-15 |
US20190267178A1 (en) | 2019-08-29 |
CN110556241A (en) | 2019-12-10 |
CN105702428B (en) | 2019-10-18 |
CN105702428A (en) | 2016-06-22 |
KR101792317B1 (en) | 2017-11-01 |
US10546681B2 (en) | 2020-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10546681B2 (en) | Electronic component having lead part including regions having different thicknesses and method of manufacturing the same | |
US20210043375A1 (en) | Coil electronic component and method of manufacturing the same | |
US20160189840A1 (en) | Electronic component and method of manufacturing the same | |
US10923264B2 (en) | Electronic component and method of manufacturing the same | |
US10847303B2 (en) | Coil component | |
US10256039B2 (en) | Coil electronic component and method for manufacturing the same | |
US10515750B2 (en) | Coil electronic component with distance between lead portion and coil pattern greater than distance between adjacent coil patterns | |
US10141099B2 (en) | Electronic component and manufacturing method thereof | |
KR101719914B1 (en) | Coil electronic component and manufacturing method thereof | |
US20160351320A1 (en) | Coil electronic component | |
US9899149B2 (en) | Electronic component and method of manufacturing the same | |
US10115518B2 (en) | Coil electronic component | |
US20190252113A1 (en) | Electronic component | |
US20160172097A1 (en) | Electronic component and method of manufacturing the same | |
KR101792468B1 (en) | Chip electronic component and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JEONG, DONG JIN;LEE, KYUNG SEOP;CHOI, YONG UN;AND OTHERS;REEL/FRAME:036996/0517 Effective date: 20151024 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |