US20150270231A1 - Package of environmental sensitive element - Google Patents
Package of environmental sensitive element Download PDFInfo
- Publication number
- US20150270231A1 US20150270231A1 US14/730,253 US201514730253A US2015270231A1 US 20150270231 A1 US20150270231 A1 US 20150270231A1 US 201514730253 A US201514730253 A US 201514730253A US 2015270231 A1 US2015270231 A1 US 2015270231A1
- Authority
- US
- United States
- Prior art keywords
- flexible
- package
- sensitive element
- thin film
- environmental sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007613 environmental effect Effects 0.000 title claims abstract description 143
- 239000010409 thin film Substances 0.000 claims abstract description 193
- 238000004806 packaging method and process Methods 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 43
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- -1 naphthalene-1-yl Chemical group 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 4
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 claims description 4
- 229910019015 Mg-Ag Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910003023 Mg-Al Inorganic materials 0.000 claims description 2
- 229910004205 SiNX Inorganic materials 0.000 claims description 2
- 229910020286 SiOxNy Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 150000004699 copper complex Chemical class 0.000 claims description 2
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten(VI) oxide Inorganic materials O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 229910010272 inorganic material Inorganic materials 0.000 claims 3
- 239000011147 inorganic material Substances 0.000 claims 3
- 239000000565 sealant Substances 0.000 description 17
- 230000001154 acute effect Effects 0.000 description 14
- 238000005452 bending Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- UHVLDCDWBKWDDN-UHFFFAOYSA-N n-phenyl-n-[4-[4-(n-pyren-2-ylanilino)phenyl]phenyl]pyren-2-amine Chemical group C1=CC=CC=C1N(C=1C=C2C=CC3=CC=CC4=CC=C(C2=C43)C=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C3C=CC4=CC=CC5=CC=C(C3=C54)C=2)C=C1 UHVLDCDWBKWDDN-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- UQTKIWUIJXSADC-UHFFFAOYSA-N 1-N-[4-[4-[4-(dinaphthalen-1-ylamino)-N-naphthalen-1-ylanilino]phenyl]phenyl]-1-N,4-N,4-N-trinaphthalen-1-ylbenzene-1,4-diamine Chemical compound C1=CC=C2C(N(C=3C=CC(=CC=3)N(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)C3=CC=C(C=C3)C3=CC=C(C=C3)N(C=3C=CC(=CC=3)N(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 UQTKIWUIJXSADC-UHFFFAOYSA-N 0.000 description 1
- LQRAULANJCQXAM-UHFFFAOYSA-N 1-n,5-n-dinaphthalen-1-yl-1-n,5-n-diphenylnaphthalene-1,5-diamine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC(=C2C=CC=1)N(C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)C1=CC=CC2=CC=CC=C12 LQRAULANJCQXAM-UHFFFAOYSA-N 0.000 description 1
- MVLOINQUZSPUJS-UHFFFAOYSA-N 2-n,2-n,6-n,6-n-tetrakis(4-methylphenyl)naphthalene-2,6-diamine Chemical compound C1=CC(C)=CC=C1N(C=1C=C2C=CC(=CC2=CC=1)N(C=1C=CC(C)=CC=1)C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 MVLOINQUZSPUJS-UHFFFAOYSA-N 0.000 description 1
- MATLFWDVOBGZFG-UHFFFAOYSA-N 2-n,2-n,6-n,6-n-tetranaphthalen-1-ylnaphthalene-2,6-diamine Chemical compound C1=CC=C2C(N(C=3C=C4C=CC(=CC4=CC=3)N(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 MATLFWDVOBGZFG-UHFFFAOYSA-N 0.000 description 1
- VXJRNCUNIBHMKV-UHFFFAOYSA-N 2-n,6-n-dinaphthalen-1-yl-2-n,6-n-dinaphthalen-2-ylnaphthalene-2,6-diamine Chemical compound C1=CC=C2C(N(C=3C=C4C=CC(=CC4=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C4=CC=CC=C4C=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=CC2=C1 VXJRNCUNIBHMKV-UHFFFAOYSA-N 0.000 description 1
- CINYXYWQPZSTOT-UHFFFAOYSA-N 3-[3-[3,5-bis(3-pyridin-3-ylphenyl)phenyl]phenyl]pyridine Chemical compound C1=CN=CC(C=2C=C(C=CC=2)C=2C=C(C=C(C=2)C=2C=C(C=CC=2)C=2C=NC=CC=2)C=2C=C(C=CC=2)C=2C=NC=CC=2)=C1 CINYXYWQPZSTOT-UHFFFAOYSA-N 0.000 description 1
- OGGKVJMNFFSDEV-UHFFFAOYSA-N 3-methyl-n-[4-[4-(n-(3-methylphenyl)anilino)phenyl]phenyl]-n-phenylaniline Chemical group CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 OGGKVJMNFFSDEV-UHFFFAOYSA-N 0.000 description 1
- IIIFDGMMJHGOJB-UHFFFAOYSA-N 4-N-naphthalen-1-yl-1-N-(1-naphthalen-1-ylcyclohexa-2,4-dien-1-yl)-4-N-[4-[4-[N-naphthalen-1-yl-4-[(1-naphthalen-1-ylcyclohexa-2,4-dien-1-yl)amino]anilino]phenyl]phenyl]benzene-1,4-diamine Chemical compound C1C=CC=CC1(C=1C2=CC=CC=C2C=CC=1)NC1=CC=C(N(C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(NC3(C=CC=CC3)C=3C4=CC=CC=C4C=CC=3)=CC=2)C=2C3=CC=CC=C3C=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IIIFDGMMJHGOJB-UHFFFAOYSA-N 0.000 description 1
- PCJBLJBFFVNJEG-UHFFFAOYSA-N 4-N-naphthalen-1-yl-4-N-[4-[4-[N-naphthalen-1-yl-4-(2-naphthalen-1-ylanilino)anilino]phenyl]phenyl]-1-N-(2-naphthalen-1-ylphenyl)benzene-1,4-diamine Chemical compound C1=CC=C2C(C3=CC=CC=C3NC=3C=CC(=CC=3)N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=CC(NC=4C(=CC=CC=4)C=4C5=CC=CC=C5C=CC=4)=CC=3)C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 PCJBLJBFFVNJEG-UHFFFAOYSA-N 0.000 description 1
- AHDTYXOIJHCGKH-UHFFFAOYSA-N 4-[[4-(dimethylamino)-2-methylphenyl]-phenylmethyl]-n,n,3-trimethylaniline Chemical compound CC1=CC(N(C)C)=CC=C1C(C=1C(=CC(=CC=1)N(C)C)C)C1=CC=CC=C1 AHDTYXOIJHCGKH-UHFFFAOYSA-N 0.000 description 1
- YXYUIABODWXVIK-UHFFFAOYSA-N 4-methyl-n,n-bis(4-methylphenyl)aniline Chemical compound C1=CC(C)=CC=C1N(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 YXYUIABODWXVIK-UHFFFAOYSA-N 0.000 description 1
- MEIBOBDKQKIBJH-UHFFFAOYSA-N 4-methyl-n-[4-[1-[4-(4-methyl-n-(4-methylphenyl)anilino)phenyl]-4-phenylcyclohexyl]phenyl]-n-(4-methylphenyl)aniline Chemical compound C1=CC(C)=CC=C1N(C=1C=CC(=CC=1)C1(CCC(CC1)C=1C=CC=CC=1)C=1C=CC(=CC=1)N(C=1C=CC(C)=CC=1)C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 MEIBOBDKQKIBJH-UHFFFAOYSA-N 0.000 description 1
- ZOKIJILZFXPFTO-UHFFFAOYSA-N 4-methyl-n-[4-[1-[4-(4-methyl-n-(4-methylphenyl)anilino)phenyl]cyclohexyl]phenyl]-n-(4-methylphenyl)aniline Chemical compound C1=CC(C)=CC=C1N(C=1C=CC(=CC=1)C1(CCCCC1)C=1C=CC(=CC=1)N(C=1C=CC(C)=CC=1)C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 ZOKIJILZFXPFTO-UHFFFAOYSA-N 0.000 description 1
- LQYYDWJDEVKDGB-UHFFFAOYSA-N 4-methyl-n-[4-[2-[4-[2-[4-(4-methyl-n-(4-methylphenyl)anilino)phenyl]ethenyl]phenyl]ethenyl]phenyl]-n-(4-methylphenyl)aniline Chemical compound C1=CC(C)=CC=C1N(C=1C=CC(C=CC=2C=CC(C=CC=3C=CC(=CC=3)N(C=3C=CC(C)=CC=3)C=3C=CC(C)=CC=3)=CC=2)=CC=1)C1=CC=C(C)C=C1 LQYYDWJDEVKDGB-UHFFFAOYSA-N 0.000 description 1
- QYNTUCBQEHUHCS-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n-[4-[4-(n-[4-(n-(3-methylphenyl)anilino)phenyl]anilino)phenyl]phenyl]-1-n,4-n-diphenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 QYNTUCBQEHUHCS-UHFFFAOYSA-N 0.000 description 1
- VIJYEGDOKCKUOL-UHFFFAOYSA-N 9-phenylcarbazole Chemical compound C1=CC=CC=C1N1C2=CC=CC=C2C2=CC=CC=C21 VIJYEGDOKCKUOL-UHFFFAOYSA-N 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- DWHUCVHMSFNQFI-UHFFFAOYSA-N N-[4-[4-(N-coronen-1-ylanilino)phenyl]phenyl]-N-phenylcoronen-1-amine Chemical group C1=CC=CC=C1N(C=1C2=CC=C3C=CC4=CC=C5C=CC6=CC=C(C7=C6C5=C4C3=C72)C=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=C4C=CC5=CC=C6C=CC7=CC=C(C8=C7C6=C5C4=C83)C=2)C=C1 DWHUCVHMSFNQFI-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910018594 Si-Cu Inorganic materials 0.000 description 1
- 229910008465 Si—Cu Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- DCZNSJVFOQPSRV-UHFFFAOYSA-N n,n-diphenyl-4-[4-(n-phenylanilino)phenyl]aniline Chemical group C1=CC=CC=C1N(C=1C=CC(=CC=1)C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 DCZNSJVFOQPSRV-UHFFFAOYSA-N 0.000 description 1
- PNDZMQXAYSNTMT-UHFFFAOYSA-N n-(4-naphthalen-1-ylphenyl)-4-[4-(n-(4-naphthalen-1-ylphenyl)anilino)phenyl]-n-phenylaniline Chemical group C1=CC=CC=C1N(C=1C=CC(=CC=1)C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 PNDZMQXAYSNTMT-UHFFFAOYSA-N 0.000 description 1
- CLTPAQDLCMKBIS-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-1-ylamino)phenyl]phenyl]-n-naphthalen-1-ylnaphthalen-1-amine Chemical group C1=CC=C2C(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 CLTPAQDLCMKBIS-UHFFFAOYSA-N 0.000 description 1
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical group C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 1
- TXDKXSVLBIJODL-UHFFFAOYSA-N n-[4-[4-(n-anthracen-9-ylanilino)phenyl]phenyl]-n-phenylanthracen-9-amine Chemical group C1=CC=CC=C1N(C=1C2=CC=CC=C2C=C2C=CC=CC2=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=C3C=CC=CC3=2)C=C1 TXDKXSVLBIJODL-UHFFFAOYSA-N 0.000 description 1
- OMQCLPPEEURTMR-UHFFFAOYSA-N n-[4-[4-(n-fluoranthen-8-ylanilino)phenyl]phenyl]-n-phenylfluoranthen-8-amine Chemical group C1=CC=CC=C1N(C=1C=C2C(C=3C=CC=C4C=CC=C2C=34)=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C3C(C=4C=CC=C5C=CC=C3C=45)=CC=2)C=C1 OMQCLPPEEURTMR-UHFFFAOYSA-N 0.000 description 1
- BLFVVZKSHYCRDR-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-2-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-2-amine Chemical group C1=CC=CC=C1N(C=1C=C2C=CC=CC2=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C3C=CC=CC3=CC=2)C=C1 BLFVVZKSHYCRDR-UHFFFAOYSA-N 0.000 description 1
- LUBWJINDFCNHLI-UHFFFAOYSA-N n-[4-[4-(n-perylen-2-ylanilino)phenyl]phenyl]-n-phenylperylen-2-amine Chemical group C1=CC=CC=C1N(C=1C=C2C=3C=CC=C4C=CC=C(C=34)C=3C=CC=C(C2=3)C=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C3C=4C=CC=C5C=CC=C(C=45)C=4C=CC=C(C3=4)C=2)C=C1 LUBWJINDFCNHLI-UHFFFAOYSA-N 0.000 description 1
- TUPXWIUQIGEYST-UHFFFAOYSA-N n-[4-[4-(n-phenanthren-2-ylanilino)phenyl]phenyl]-n-phenylphenanthren-2-amine Chemical group C1=CC=CC=C1N(C=1C=C2C(C3=CC=CC=C3C=C2)=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C3C(C4=CC=CC=C4C=C3)=CC=2)C=C1 TUPXWIUQIGEYST-UHFFFAOYSA-N 0.000 description 1
- GNLSNQQRNOQFBK-UHFFFAOYSA-N n-[4-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical group C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 GNLSNQQRNOQFBK-UHFFFAOYSA-N 0.000 description 1
- QCILFNGBMCSVTF-UHFFFAOYSA-N n-[4-[4-[4-(n-anthracen-1-ylanilino)phenyl]phenyl]phenyl]-n-phenylanthracen-1-amine Chemical group C1=CC=CC=C1N(C=1C2=CC3=CC=CC=C3C=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC4=CC=CC=C4C=C3C=CC=2)C=C1 QCILFNGBMCSVTF-UHFFFAOYSA-N 0.000 description 1
- NBHXGUASDDSHGV-UHFFFAOYSA-N n-[4-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical group C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 NBHXGUASDDSHGV-UHFFFAOYSA-N 0.000 description 1
- RJSTZCQRFUSBJV-UHFFFAOYSA-N n-[4-[4-[n-(1,2-dihydroacenaphthylen-3-yl)anilino]phenyl]phenyl]-n-phenyl-1,2-dihydroacenaphthylen-3-amine Chemical group C1=CC(C2=3)=CC=CC=3CCC2=C1N(C=1C=CC(=CC=1)C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=2CCC3=CC=CC(C=23)=CC=1)C1=CC=CC=C1 RJSTZCQRFUSBJV-UHFFFAOYSA-N 0.000 description 1
- RYZPDEZIQWOVPJ-UHFFFAOYSA-N n-naphthalen-1-yl-n-[4-[4-[naphthalen-1-yl(naphthalen-2-yl)amino]phenyl]phenyl]naphthalen-2-amine Chemical group C1=CC=C2C(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C4=CC=CC=C4C=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=CC2=C1 RYZPDEZIQWOVPJ-UHFFFAOYSA-N 0.000 description 1
- SBMXAWJSNIAHFR-UHFFFAOYSA-N n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(NC=3C=C4C=CC=CC4=CC=3)=CC=C21 SBMXAWJSNIAHFR-UHFFFAOYSA-N 0.000 description 1
- FWRJQLUJZULBFM-UHFFFAOYSA-N n-phenyl-n-[4-[4-(n-tetracen-2-ylanilino)phenyl]phenyl]tetracen-2-amine Chemical group C1=CC=CC=C1N(C=1C=C2C=C3C=C4C=CC=CC4=CC3=CC2=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C3C=C4C=C5C=CC=CC5=CC4=CC3=CC=2)C=C1 FWRJQLUJZULBFM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GPRIERYVMZVKTC-UHFFFAOYSA-N p-quaterphenyl Chemical group C1=CC=CC=C1C1=CC=C(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=C1 GPRIERYVMZVKTC-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H01L27/3237—
-
- H01L51/52—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2101/00—Properties of the organic materials covered by group H10K85/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present disclosure relates to a package of an environmental sensitive element, and more particularly to a package of an environmental sensitive element having a flexible sacrificial layer.
- the flexible substrates Compared with normal rigid substrates, the flexible substrates have a wider range of applications due to their advantages of flexibility, ease of carriage, safety, and wider product application range.
- the drawbacks of the flexible substrate include poor resistance to heat, moisture, oxygen, and chemicals and large thermal expansion coefficient. Since typical flexible substrates cannot entirely avoid the transmission of water vapor and oxygen, devices on these substrates experience accelerated aging. Consequently, these short-lived devices fail to meet their commercial needs.
- the flexible substrate has flexibility, when the flexible substrate is bent, the OLED structure will be damaged by bending force. Thus, the OLED device cannot normally operate.
- the polymer is used as the packaging material for the organic electro-emitting element.
- the resistance to moisture and the oxygen of the polymer is relatively better, the conventional technologies never consider the delaminating problem while the OLED device is bent. Therefore, how to improve the delaminating phenomenon of the OLED device while it is bent is one of the immediate problems to be resolved in the current flexibility of the OLED device.
- the present disclosure provides a package of an environmental sensitive element, wherein the package includes a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure.
- the environmental sensitive element is disposed on the flexible substrate.
- the flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films, and the bonding strength between two adjacent second thin films is equal to or lower than the bonding strength between two adjacent first thin films.
- the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.
- the present disclosure provides a package of an environmental sensitive element, wherein the package includes a flexible substrate, an environmental sensitive element, at least one flexible sacrificial layer and a packaging structure.
- the environmental sensitive element is disposed on the flexible substrate.
- the flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element comprises a plurality of first thin films, and the flexible sacrificial layer includes a plurality of second thin films, and the bonding strength between two adjacent second thin films is equal to or lower than the bonding strength between two adjacent first thin films.
- the second thin films in the flexible sacrificial layer comprise at least one sacrificial thin film and at least one flexible protecting thin film.
- the at least one sacrificial thin film is disposed on the first thin films, wherein the material of the at least one sacrificial thin film includes organic small molecular material with the molecular weight about 10 g/mol ⁇ 5000 g/mol or organic oligomers with the molecular weight about 500 g/mol ⁇ 9000 g/mol.
- the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.
- the present disclosure provides a package of an environmental sensitive element, wherein the package includes a flexible substrate, an environmental sensitive element, a first packaging structure and a first flexible sacrificial layer.
- the environmental sensitive element is disposed on the flexible substrate.
- the first packaging structure covers the environmental sensitive element.
- the first flexible sacrificial layer is disposed on the first packaging structure, and the first flexible sacrificial layer and the environmental sensitive element are located on two opposite sides of the first packaging structure, wherein the environmental sensitive element comprises a plurality of first thin films, the first flexible sacrificial layer includes a plurality of second thin films, and the bonding strength between two adjacent second thin films is equal to or lower than the bonding strength between two adjacent first thin films.
- FIG. 1A , FIG. 1B , FIG. 1C and FIG. 1D are the cross-sectional views of a package of an environmental sensitive element according to the first embodiment of the present disclosure.
- FIG. 2A and FIG. 2B are the cross-sectional views of a package of an environmental sensitive element according to the second embodiment of the present disclosure.
- FIG. 3A and FIG. 3B are the cross-sectional views of a package of an environmental sensitive element according to the third embodiment of the present disclosure.
- FIG. 4A is the cross-sectional view of a package of an environmental sensitive element according to the fourth embodiment of the present disclosure.
- FIG. 4B is the top view of the package of the environmental sensitive element in FIG. 4A .
- FIG. 5A is the cross-sectional view of a package of an environmental sensitive element according to the fifth embodiment of the present disclosure.
- FIG. 5B is the top view of the package of the environmental sensitive element in FIG. 5A .
- FIG. 6A is the cross-sectional view of a package of an environmental sensitive element according to the sixth embodiment of the present disclosure.
- FIG. 6B is the top view of the package of the environmental sensitive element in FIG. 6A .
- FIG. 7 is the cross-sectional view of a package of an environmental sensitive element according to the seventh embodiment of the present disclosure.
- FIG. 8 is the cross-sectional view of a package of an environmental sensitive element according to the eighth embodiment of the present disclosure.
- FIG. 9 is the cross-sectional view of a package of an environmental sensitive element according to the ninth embodiment of the present disclosure.
- FIG. 10 is the cross-sectional view of a package of an environmental sensitive element according to the tenth embodiment of the present disclosure.
- FIG. 11 is the cross-sectional view of a package of an environmental sensitive element according to the eleventh embodiment of the present disclosure.
- FIG. 12 is the cross-sectional view of a package of an environmental sensitive element according to the twelfth embodiment of the present disclosure.
- FIG. 1A and FIG. 1B are the cross-sectional views of a package of an environmental sensitive element according to the second embodiment of the present disclosure.
- a package 100 of an environmental sensitive element of the present embodiment includes a flexible substrate 110 , an environmental sensitive element 120 , a flexible sacrificial layer 130 and a packaging structure 140 .
- the environmental sensitive element 120 is disposed on the flexible substrate 110 .
- the flexible sacrificial layer 130 is disposed on the environmental sensitive element 120 , wherein the environmental sensitive element 120 includes a plurality of first thin films (DM, B, T) and the flexible sacrificial layer 130 includes a plurality of second thin films ( 132 and 134 ) which are stacked on each other.
- DM, B, T first thin films
- second thin films 132 and 134
- the bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films (DM, B, T).
- the packaging structure 140 covers the environmental sensitive element 120 and the flexible sacrificial layer 130 .
- material of the flexible substrate 110 can be, for example, plastic material such as PE plastic, PMMA, PC (polycarbonate) or PI (polyimide).
- the PE plastic can be the flexible plastic material such as PEC, PEN and PES.
- the material of the flexible substrate 110 comprises metal foil.
- the environmental sensitive element 120 comprises a bottom electrode layer B, a displaying medium DM and a top electrode layer T.
- the bottom electrode layer B is disposed on the flexible substrate 110
- the displaying medium DM is disposed on bottom electrode layer B
- the top electrode layer T is disposed on the displaying medium DM.
- the displaying medium DM is composed of a hole injection layer HIL, a hole transporting layer HTL, an organic electro-emitting layer EML and an electron transporting layer ETL.
- the hole injection layer HIL is disposed on the bottom electrode layer B, the hole transporting layer HTL is disposed on the hole injection layer HIL, the organic electro-emitting layer EML is disposed on the hole transporting layer HTL, and the electron transporting layer ETL is disposed on the organic electro-emitting layer EML. Furthermore, the top electrode layer T is disposed on the electron transporting layer ETL.
- the environmental sensitive element 120 of the present embodiment can be an active matrix element or a passive matrix element.
- the bottom electrode layer B can be, for example, a pixel electrode of the thin film transistor array and the top electrode layer can be, for example, a common electrode.
- the displaying medium between each of the pixel electrodes and the common electrode can be individually driven to emit lights.
- the bottom electrode layer B and the top electrode layer are the stripe electrodes, and the bottom electrode layer B and the top electrode layer T are arranged in an interlacing manner. Meanwhile, the displaying medium located at the crossover section where each of the top electrode layer T interlaces the bottom electrode layer B can be individually driven to emit lights.
- the extending direction of the bottom electrode layer B can be, for example, substantially perpendicular to the extending direction of the top electrode layer T.
- the flexible sacrificial layer 130 comprises a sacrificial thin film 132 and a flexible protecting thin film 134 , wherein the sacrificial thin film 132 is configured on the top electrode layer T of the environmental sensitive element 120 and the flexible protecting thin film 134 is configured on the sacrificial thin film 132 .
- the sacrificial thin film 132 of the present embodiment is connected to the top electrode layer T, but the flexible protecting thin film 134 is disconnected to the top electrode layer T.
- the flexible protecting thin film 134 disposed on the sacrificial thin film 132 can be connected to the top electrode layer T.
- the bonding strength between the sacrificial thin film 132 and the top electrode layer T is substantially equal to or lower than the bonding strength between two adjacent first thin films (DM, B and T) so that the delaminating phenomenon hardly happens between the adjacent first thin films (DM, B and T) but easily happens on the interface between the sacrificial thin film 132 and the top electrode layer T and on the interface between the sacrificial thin film 132 and the flexible protecting thin film 134 when the package of the environmental sensitive element is bent. Therefore, the sacrificial thin film 132 and the flexible protecting thin film 134 can effectively protect the first thin films (DM, B and T) from having delaminating phenomenon during the package is bent.
- the flexible sacrificial layer 130 further has a UV cutting function so as to increase the life time of the environmental sensitive element 120 .
- the flexible sacrificial layer 130 further has a light out coupling function so as to increase the light efficiency of the environmental sensitive element 120 .
- the material of the sacrificial thin films 132 includes organic small molecular compounds, organic oligomers, metal or organic-inorganic co-evaporated material.
- the molecular weight of the aforementioned organic small molecular material is about 10 g/mol ⁇ 5000 g/mol and the organic small molecular material includes Alq3 (Tris-(8-hydroxyquinoline)aluminum), alpha-NPB (N,N′-Dis(naphthalene-1-yl)-N,N′-diphenyl-benzidine), CuPc (Phalocyanine copper complex).
- the molecular weight of the organic oligomers is about 500 g/mol ⁇ 9000 g/mol and the organic oligomers include Phenylene Vinylene Oligomers or Fluorene Oligomers.
- the molecular weight of metal or organic-inorganic co-evaporated material is about 3 g/mol ⁇ 500 g/mol.
- the aforementioned metal can be, for example, Al, Ag, Be, Cr, Cu, Co, Fe, Ge, Ir, In, Mo, Mn, Mg, Ni, Nb, Pb, Pd, Pt, Ru, Rh, Sn, Si, Sb, Se, Ti, Ta, Te, V, W, Zr, Zn, Mg—Ag, Al—Si, Al—Si—Cu, Au/Ge, Au—Be, Au—Ge—N, Ni—Cr, Pb—sn or In—Sn.
- the material of the sacrificial thin film 132 further includes a single or a mixture of aromatic tertiary amine compounds.
- the aromatic tertiary amine compounds may be 1,1-bis(4-di-p-tolylaminophenyl)cyclohexane, 1,1-bis(4-di-p-tolylaminophenyl)-4-phenylcyclohexane, 1,5-bis[N-(1-naphthyl)-N-phenylamino]naphthalene, 2,6-bis(di-p-tolylamino)naphthalene, 2,6-bis[di-(1-naphthyl)amino]naphthalene, 2,6-bis[N-(1-naphthyl)-N-(2-naphthyl)amino]naphthalene, 2,6-bis[N,N-di(2-naphthy
- the material of the flexible protecting thin film 134 comprises indium tin oxide (ITO), indium zinc oxide (IZO), aluminum doped zinc oxide (AZO), WO 3 , MoO 3 , SiO x , SiN x , SiO x N y , Al 2 O 3 , Al, Ag, Mg—Ag or Mg—Al.
- ITO indium tin oxide
- IZO indium zinc oxide
- AZO aluminum doped zinc oxide
- WO 3 MoO 3
- SiO x , SiN x , SiO x N y , Al 2 O 3 , Al, Ag, Mg—Ag or Mg—Al the materials of the sacrificial thin film 132 and the flexible protecting thin film 134 in the flexible sacrificial layer 130 are selected from different material groups such that the bonding strength between the sacrificial thin film 132 and the flexible protecting thin film 134 is substantially equal to or smaller than the bonding strength between the adjacent first thin films (DM,
- the packaging structure 140 comprises a sealant 142 , an adhesion layer 144 and a flexible cover 146 .
- the sealant 142 is disposed on the flexible substrate 110 to encircle the environmental sensitive element 120 and the flexible sacrificial layer 130 .
- the adhesion layer 144 is disposed within the sealant 142 to cover the environmental sensitive element 120 and the flexible sacrificial layer 130 .
- the flexible cover 146 is connected with the sealant 142 and the adhesion layer 144 .
- the packaging structure 140 can also be other types of structure.
- the packaging structure can comprise an adhesion layer 144 and a flexible cover 146 , wherein the adhesion layer 144 covers the environmental sensitive element 120 and the flexible sacrificial layer 130 , and the flexible cover 146 is connected to the adhesion layer 144 .
- the packaging structure 140 ′ with other packaging structure type is used in the present embodiment.
- the packaging structure 140 ′ can comprise a plurality of package thin films.
- the package thin films include a plurality of organic package thin films 148 a and a plurality of inorganic package thin films 148 b .
- the organic thin films 148 a and the inorganic thin films 148 b are stacked on one another to provide a relatively better moisture-proof ability.
- the packaging structure 140 ′′ with other packaging structure type is used in the present embodiment.
- the packaging structure 140 ′′ can comprise a sealant 142 , an adhesion layer 144 , a flexible cover 146 , at least one layer of organic package thin films 148 a and at least one layer of inorganic package thin films 148 b .
- the organic thin films 148 a and the inorganic thin films 148 b are stacked on one another to provide a relatively better moisture-proof ability.
- the sealant 142 is disposed on the flexible substrate 110 to encircle the environmental sensitive element 120 and the flexible sacrificial layer 130 .
- the adhesion layer 144 is disposed within the sealant 142 to cover the organic package thin films 148 a , the inorganic package thin films 148 b and the flexible sacrificial layer 130 . Further, the flexible cover 146 is connected with the sealant 142 and the adhesion layer 144 .
- organic package thin films 148 a and the inorganic package thin film 148 b can be arranged alone or alternately stacked on one another.
- the material of the top electrode layer T can be, for example, as same as the material of the flexible protecting thin film 134
- the material of the sacrificial thin film 132 can be, for example, as same as the material of the hole transporting layer HTL. Therefore, the process for forming the flexible sacrificial layer 130 can be integrated with the process for forming the environmental sensitive element 120 . In other words, the flexible sacrificial layer 130 and the environmental sensitive element 120 can be manufactured in the same process chamber without further modifying the current process procedure.
- FIG. 2A and FIG. 2B are the cross-sectional views of a package of an environmental sensitive element according to the second embodiment of the present disclosure.
- the package 100 a of the environmental sensitive element of the present embodiment is similar to the package 100 of the environmental sensitive element of the first embodiment. More clearly, the thin film structure of the flexible sacrificial layer 130 a in the package 100 a is different from that of the flexible sacrificial layer 130 in the package 100 .
- the flexible sacrificial layer 130 a comprises a plurality of sacrificial thin films 132 and a plurality of flexible protecting thin films 134 , wherein the sacrificial thin films 132 and the flexible protecting thin films 134 are alternately stacked on one another and are configured on the top electrode layer T of the environmental sensitive element 120 and the bottommost sacrificial thin film 132 is connected to the top electrode layer T.
- the flexible protecting thin films 134 of the present embodiment are disconnected to the top electrode layer T.
- FIG. 3A and FIG. 3B are the cross-sectional views of a package of an environmental sensitive element according to the third embodiment of the present disclosure.
- the package 100 b of the environmental sensitive element of the present embodiment is similar to the package 100 a of the environmental sensitive element of the second embodiment. More clearly, the thin film structure of the flexible sacrificial layer 130 b in the package 100 b is different from that of the flexible sacrificial layer 130 a in the package 100 a .
- the flexible sacrificial layer 130 b comprises a plurality of sacrificial thin films 132 and a plurality of flexible protecting thin films 134 , wherein the sacrificial thin films 132 and the flexible protecting thin films 134 are alternately stacked on one another and are configured on the top electrode layer T of the environmental sensitive element 120 and the bottommost sacrificial thin film 132 and all of the flexible protecting thin films 134 are connected to the top electrode layer T.
- Table 1 is a detailed explanation of the structure of the package of the environmental sensitive element, wherein illuminant area of the package is about 0.3 centimeter ⁇ 0.3 centimeter.
- the package of the environmental sensitive element manufactured according to the standards of the experimental group I and control group I is normally lighting on before it goes through the bending test. After the bending test (the package is bent for 500 times with a radius of curvature of about 5 centimeter), the package of the environmental sensitive element of the control group I can not light on.
- the package of the environmental sensitive element of the experimental group I is driven by a voltage of 4V to light on with a brightness about 820 Cd/m ⁇ 2 and a light emitting efficiency about 14.0 Cd/A before it goes through the bending test.
- the package of the environmental sensitive element of the experimental group I is driven by a voltage of 4V to light on with a brightness about 793 Cd/m ⁇ 2 and a light emitting efficiency about 13.9 Cd/A.
- the light emitting efficiency of the package of the environmental sensitive element of the experimental group I does not significantly decayed.
- FIG. 4A is the cross-sectional view of a package of an environmental sensitive element according to the fourth embodiment of the present disclosure.
- FIG. 4B is the top view of the package of the environmental sensitive element in FIG. 4A .
- the package 100 c of the environmental sensitive element of the present embodiment is similar to the package 100 of the environmental sensitive element of the first embodiment.
- the first packaging structure 140 ′ covers the environmental sensitive element 120 and a first flexible sacrificial layer 150 is disposed on the first packaging structure 140 ′, wherein the environmental sensitive element 120 and the first flexible sacrificial layer 150 are located on two opposite sides of the first packaging structure 140 ′.
- the first packaging structure 140 ′ comprises at least one layer of organic package thin films 148 a and at least one layer of inorganic package thin films 148 b.
- the first flexible sacrificial layer 150 comprises a first sacrificial thin film 152 and a first flexible protecting thin film 154 , wherein the first sacrificial thin film 152 is configured on the first packaging structure 140 ′ and the first flexible protecting thin film 154 is configured on the first sacrificial thin film 152 .
- the first sacrificial thin film 152 of the present embodiment is connected to the first packaging structure 140 ′, but the first flexible protecting thin film 154 is disconnected to the first packaging structure 140 ′.
- the first flexible protecting thin film 154 disposed on the first sacrificial thin film 152 can be connected to the first packaging structure 140 ′.
- the bonding strength between the first sacrificial thin film 152 and the first packaging structure 140 ′ is substantially equal to or lower than the bonding strength between two adjacent first thin films (DM, B and T) so that the delaminating phenomenon hardly happens between the adjacent first thin films (DM, B and T) but easily happens on the interface between the first sacrificial thin film 152 and the first packaging structure 140 ′ and on the interface between the first sacrificial thin film 152 and the first flexible protecting thin film 154 when the package of the environmental sensitive element is bent. Therefore, the first sacrificial thin film 152 and the first flexible protecting thin film 154 can effectively protect the first thin films (DM, B and T) from having delaminating phenomenon during the package is bent.
- first flexible sacrificial layer 150 further has a UV cutting function so as to increase the life time of the environmental sensitive element 120 .
- first flexible sacrificial layer 150 further has a light out coupling function so as to increase the light efficiency of the environmental sensitive element 120 .
- the material of the first sacrificial thin film 152 is identical to the material of the sacrificial thin film 132
- the material of the first flexible protecting thin film 154 is identical to the material of the flexible protecting thin film 134 . It should be noticed that the materials of the first sacrificial thin film 152 and the first flexible protecting thin film 154 in the first flexible sacrificial layer 150 are selected from different material groups such that the bonding strength between the first sacrificial thin film 152 and the first flexible protecting thin film 154 is substantially equal to or smaller than the bonding strength between the adjacent first thin films (DM, B and T).
- the first flexible sacrificial layer 150 is greater than the size of the environmental sensitive element 120 in the present embodiment. However, in other embodiments, the size of the first flexible sacrificial layer 150 can be equal to the size of the environmental sensitive element 120 .
- FIG. 5A is the cross-sectional view of a package of an environmental sensitive element according to the fifth embodiment of the present disclosure.
- FIG. 5B is the top view of the package of the environmental sensitive element in FIG. 5A .
- the package 100 d of the environmental sensitive element of the present embodiment is similar to the package 100 c of the environmental sensitive element of the fourth embodiment.
- the package 100 d of the environmental sensitive element of the present embodiment further comprises a second packaging structure 160 covering the environmental sensitive element 120 , the first packaging structure 140 ′ and the first flexible sacrificial layer 150 .
- the second packaging structure 160 comprises a sealant 162 , an adhesion layer 164 and a flexible cover 166 .
- the sealant 162 is disposed on the flexible substrate 110 to encircle the environmental sensitive element 120 and the first flexible sacrificial layer 150 .
- the adhesion layer 164 is disposed within the sealant 162 to cover the environmental sensitive element 120 and the first flexible sacrificial layer 150 . Further, the flexible cover 166 is connected with the sealant 162 and the adhesion layer 164 .
- the sealant 162 of the second packaging structure 160 has a continuous pattern encircling the environmental sensitive element 120 .
- the sealant 162 of the second packaging structure 160 may have a non-continuous pattern encircling the environmental sensitive element 120 .
- the sealant 162 may includes a plurality of patterns separated from each other, wherein the separated patterns are arranged in a continuous form so as to encircle the environmental sensitive element 120 .
- the material of the sealant 162 and the material of the adhesion layer 164 are different in the present embodiment. However, in other embodiments, the material of the sealant 162 and the material of the adhesion layer 164 may be identical.
- FIG. 6A is the cross-sectional view of a package of an environmental sensitive element according to the sixth embodiment of the present disclosure.
- FIG. 6B is the top view of the package of the environmental sensitive element in FIG. 6A .
- the package 100 e of the environmental sensitive element of the present embodiment is similar to the package 100 d of the environmental sensitive element of the fifth embodiment.
- the adhesion layer 164 of a second packaging structure 160 ′ is a film type adhesive.
- the adhesion layer 164 covers the environmental sensitive element 120 and the first flexible sacrificial layer 150 .
- the flexible cover 166 is connected with the adhesion layer 164 .
- FIG. 7 is the cross-sectional view of a package of an environmental sensitive element according to the seventh embodiment of the present disclosure.
- the package 100 f of the environmental sensitive element of the present embodiment is similar to the package 100 c of the environmental sensitive element of the fourth embodiment.
- the thin film structure of the first flexible sacrificial layer 150 a in the package 100 f is different from that of the first flexible sacrificial layer 150 in the package 100 c .
- the first flexible sacrificial layer 150 a comprises a plurality of first sacrificial thin films 152 and a plurality of first flexible protecting thin films 154 , wherein the first sacrificial thin films 152 and the first flexible protecting thin films 154 are alternately stacked on one another and are configured on the first packaging structure 140 ′ and the bottommost first sacrificial thin film 152 is connected to the first packaging structure 140 ′. Moreover, as shown in FIG. 7 , the first flexible protecting thin films 154 of the present embodiment are disconnected to the first packaging structure 140 ′.
- FIG. 8 is the cross-sectional view of a package of an environmental sensitive element according to the eighth embodiment of the present disclosure.
- the package 100 g of the environmental sensitive element of the present embodiment is similar to the package 100 f of the environmental sensitive element in FIG. 7 .
- the thin film structure of the first flexible sacrificial layer 150 b in the package 100 g is different from that of the first flexible sacrificial layer 150 a in the package 100 f .
- the first flexible sacrificial layer 150 b comprises a plurality of first sacrificial thin films 152 and a plurality of first flexible protecting thin films 154 , wherein the first sacrificial thin films 152 and the first flexible protecting thin films 154 are alternately stacked on one another and are configured on the first packaging structure 140 ′ and the bottommost first sacrificial thin film 152 and the bottommost first flexible protecting thin films 154 are connected to the first packaging structure 140 ′.
- FIG. 9 is the cross-sectional view of a package of an environmental sensitive element according to the ninth embodiment of the present disclosure.
- the package 100 h of the environmental sensitive element of the present embodiment is similar to the package 100 c of the environmental sensitive element of the fourth embodiment.
- the package 100 h further comprises a second flexible sacrificial layer 160 disposed on the environmental sensitive element 120 .
- the second flexible sacrificial layer 170 comprises a second sacrificial thin film 172 and a second flexible protecting thin film 174 , wherein the second sacrificial thin film 172 is configure on the top electrode layer T of the environmental sensitive element 120 and the second flexible protecting thin film 174 is configured on the second sacrificial thin film 172 .
- the second sacrificial thin film 172 of the present embodiment is connected to the top electrode layer T, but the second flexible protecting thin film 174 is disconnected to the top electrode layer T.
- the second flexible protecting thin film 174 disposed on the second sacrificial thin film 172 can be connected to the top electrode layer T.
- the material of the second sacrificial thin film 172 is identical to the material of the sacrificial thin film 132
- the material of the second flexible protecting thin film 174 is identical to the material of the flexible protecting thin film 134 . It should be noticed that the materials of the second sacrificial thin film 172 and the second flexible protecting thin film 174 in the second flexible sacrificial layer 170 are selected from different material groups such that the bonding strength between the second sacrificial thin film 172 and the second flexible protecting thin film 174 is substantially equal to or smaller than the bonding strength between the adjacent first thin films (DM, B and T).
- the bonding strength between the second sacrificial thin film 172 and the top electrode layer T is substantially equal to or lower than the bonding strength between two adjacent first thin films (DM, B and T) so that the delaminating phenomenon hardly happens between the adjacent first thin films (DM, B and T) but easily happens on the interface between the second sacrificial thin film 172 and the top electrode layer T and on the interface between the second sacrificial thin film 172 and the second flexible protecting thin film 174 when the package of the environmental sensitive element is bent. Therefore, the second sacrificial thin film 172 and the second flexible protecting thin film 174 can effectively protect the first thin films (DM, B and T) from having delaminating phenomenon during the package is bent.
- the second flexible sacrificial layer 170 further has a UV cutting function so as to increase the life time of the environmental sensitive element 120 .
- the second flexible sacrificial layer 170 further has a light out coupling function so as to increase the light efficiency of the environmental sensitive element 120 .
- FIG. 10 is the cross-sectional view of a package of an environmental sensitive element according to the tenth embodiment of the present disclosure.
- the package 100 i of the environmental sensitive element of the present embodiment is similar to the package 100 h of the environmental sensitive element of the ninth embodiment.
- the package 100 i of the environmental sensitive element of the present embodiment further comprises a second packaging structure 160 covering the environmental sensitive element 120 , the first packaging structure 140 ′, the first flexible sacrificial layer 150 and the second flexible sacrificial layer 170 .
- FIG. 11 is the cross-sectional view of a package of an environmental sensitive element according to the eleventh embodiment of the present disclosure.
- the package 100 j of the environmental sensitive element of the present embodiment is similar to the package 100 h of the environmental sensitive element of the ninth embodiment.
- the thin film structure of the first flexible sacrificial layer 150 a in the package 100 j is different from that of the first flexible sacrificial layer 150 in the package 100 h .
- the first flexible sacrificial layer 150 a comprises a plurality of first sacrificial thin films 152 and a plurality of first flexible protecting thin films 154 , wherein the first sacrificial thin films 152 and the first flexible protecting thin films 154 are alternately stacked on one another and are configured on the first packaging structure 140 ′ and the bottommost first sacrificial thin film 152 is connected to the first packaging structure 140 ′. Moreover, as shown in FIG. 10 , the first flexible protecting thin films 154 of the present embodiment are disconnected to the first packaging structure 140 ′.
- the second flexible sacrificial layer 170 a comprises a plurality of second sacrificial thin films 172 and a plurality of second flexible protecting thin films 174 , wherein the second sacrificial thin films 172 and the second flexible protecting thin films 174 are alternately stacked on one another and are configured on the environmental sensitive element 120 , and the bottommost second sacrificial thin film 172 is connected to the environmental sensitive element 120 .
- the second flexible protecting thin films 174 of the present embodiment are disconnected to the environmental sensitive element 120 .
- FIG. 12 is the cross-sectional view of a package of an environmental sensitive element according to the twelfth embodiment of the present disclosure.
- the package 100 k of the environmental sensitive element of the present embodiment is similar to the package 100 j of the environmental sensitive element of the eleventh embodiment.
- the thin film structures of the first flexible sacrificial layer 150 b in the package 100 k is different from that of the first flexible sacrificial layer 150 a in the package 100 j .
- the bottommost first sacrificial thin film 152 and the bottommost first flexible protecting thin film 154 are connected to the first packaging structure 140 ′.
- the thin film structure of the second flexible sacrificial layer 170 b in the package 100 k is different from that of the second flexible sacrificial layer 170 a in the package 100 j .
- the bottommost second sacrificial thin film 172 and the bottommost second flexible protecting thin film 174 are connected to the environmental sensitive element 120 .
- the flexible sacrificial layer with various types is formed on the environmental sensitive element, when the environmental sensitive element is exaggeratedly bent, the delaminating happens in the flexible sacrificial layer. Therefore, the environmental sensitive element can be prevented from the delaminating phenomenon due to being bent and the structure of the environmental sensitive element can be prevented from being damaged during it is bent.
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Abstract
Description
- This application is a divisional application of U.S. application Ser. No. 13/867,136, filed on Apr. 22, 2013, now allowed. The prior U.S. application Ser. No. 13/867,136 is a continuation-in-part application of and claims the priority benefit of U.S. application Ser. No. 12/703,155, filed on Feb. 9, 2010, U.S. Pat. No. 8,446,730, which claims the priority benefit of Taiwan application serial no. 98131092, filed on Sep. 15, 2009. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
- 1. Technical Field
- The present disclosure relates to a package of an environmental sensitive element, and more particularly to a package of an environmental sensitive element having a flexible sacrificial layer.
- 2. Description of Related Art
- Compared with normal rigid substrates, the flexible substrates have a wider range of applications due to their advantages of flexibility, ease of carriage, safety, and wider product application range. However, the drawbacks of the flexible substrate include poor resistance to heat, moisture, oxygen, and chemicals and large thermal expansion coefficient. Since typical flexible substrates cannot entirely avoid the transmission of water vapor and oxygen, devices on these substrates experience accelerated aging. Consequently, these short-lived devices fail to meet their commercial needs. Besides, since the flexible substrate has flexibility, when the flexible substrate is bent, the OLED structure will be damaged by bending force. Thus, the OLED device cannot normally operate.
- In the conventional technologies, such as those described in the U.S. Pat. No. 6,624,568 and in the US Patent Publication No. 2007/0049155, the polymer is used as the packaging material for the organic electro-emitting element. Although the resistance to moisture and the oxygen of the polymer is relatively better, the conventional technologies never consider the delaminating problem while the OLED device is bent. Therefore, how to improve the delaminating phenomenon of the OLED device while it is bent is one of the immediate problems to be resolved in the current flexibility of the OLED device.
- The present disclosure provides a package of an environmental sensitive element, wherein the package includes a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films, and the bonding strength between two adjacent second thin films is equal to or lower than the bonding strength between two adjacent first thin films. The packaging structure covers the environmental sensitive element and the flexible sacrificial layer.
- The present disclosure provides a package of an environmental sensitive element, wherein the package includes a flexible substrate, an environmental sensitive element, at least one flexible sacrificial layer and a packaging structure. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element comprises a plurality of first thin films, and the flexible sacrificial layer includes a plurality of second thin films, and the bonding strength between two adjacent second thin films is equal to or lower than the bonding strength between two adjacent first thin films. The second thin films in the flexible sacrificial layer comprise at least one sacrificial thin film and at least one flexible protecting thin film. The at least one sacrificial thin film is disposed on the first thin films, wherein the material of the at least one sacrificial thin film includes organic small molecular material with the molecular weight about 10 g/mol˜5000 g/mol or organic oligomers with the molecular weight about 500 g/mol˜9000 g/mol. The packaging structure covers the environmental sensitive element and the flexible sacrificial layer.
- The present disclosure provides a package of an environmental sensitive element, wherein the package includes a flexible substrate, an environmental sensitive element, a first packaging structure and a first flexible sacrificial layer. The environmental sensitive element is disposed on the flexible substrate. The first packaging structure covers the environmental sensitive element. The first flexible sacrificial layer is disposed on the first packaging structure, and the first flexible sacrificial layer and the environmental sensitive element are located on two opposite sides of the first packaging structure, wherein the environmental sensitive element comprises a plurality of first thin films, the first flexible sacrificial layer includes a plurality of second thin films, and the bonding strength between two adjacent second thin films is equal to or lower than the bonding strength between two adjacent first thin films.
- In order to make the aforementioned and other features and advantages of the disclosure more comprehensible, embodiments accompanying figures are described in detail below.
- The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification.
- The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
-
FIG. 1A ,FIG. 1B ,FIG. 1C andFIG. 1D are the cross-sectional views of a package of an environmental sensitive element according to the first embodiment of the present disclosure. -
FIG. 2A andFIG. 2B are the cross-sectional views of a package of an environmental sensitive element according to the second embodiment of the present disclosure. -
FIG. 3A andFIG. 3B are the cross-sectional views of a package of an environmental sensitive element according to the third embodiment of the present disclosure. -
FIG. 4A is the cross-sectional view of a package of an environmental sensitive element according to the fourth embodiment of the present disclosure. -
FIG. 4B is the top view of the package of the environmental sensitive element inFIG. 4A . -
FIG. 5A is the cross-sectional view of a package of an environmental sensitive element according to the fifth embodiment of the present disclosure. -
FIG. 5B is the top view of the package of the environmental sensitive element inFIG. 5A . -
FIG. 6A is the cross-sectional view of a package of an environmental sensitive element according to the sixth embodiment of the present disclosure. -
FIG. 6B is the top view of the package of the environmental sensitive element inFIG. 6A . -
FIG. 7 is the cross-sectional view of a package of an environmental sensitive element according to the seventh embodiment of the present disclosure. -
FIG. 8 is the cross-sectional view of a package of an environmental sensitive element according to the eighth embodiment of the present disclosure. -
FIG. 9 is the cross-sectional view of a package of an environmental sensitive element according to the ninth embodiment of the present disclosure. -
FIG. 10 is the cross-sectional view of a package of an environmental sensitive element according to the tenth embodiment of the present disclosure. -
FIG. 11 is the cross-sectional view of a package of an environmental sensitive element according to the eleventh embodiment of the present disclosure. -
FIG. 12 is the cross-sectional view of a package of an environmental sensitive element according to the twelfth embodiment of the present disclosure. -
FIG. 1A andFIG. 1B are the cross-sectional views of a package of an environmental sensitive element according to the second embodiment of the present disclosure. As shown inFIG. 1A andFIG. 1B , apackage 100 of an environmental sensitive element of the present embodiment includes aflexible substrate 110, an environmentalsensitive element 120, a flexiblesacrificial layer 130 and apackaging structure 140. The environmentalsensitive element 120 is disposed on theflexible substrate 110. The flexiblesacrificial layer 130 is disposed on the environmentalsensitive element 120, wherein the environmentalsensitive element 120 includes a plurality of first thin films (DM, B, T) and the flexiblesacrificial layer 130 includes a plurality of second thin films (132 and 134) which are stacked on each other. Further, the bonding strength between two adjacent second thin films (132 and 134) is substantially equal to or lower than the bonding strength between two adjacent first thin films (DM, B, T). Thepackaging structure 140 covers the environmentalsensitive element 120 and the flexiblesacrificial layer 130. - In the present embodiment, material of the
flexible substrate 110 can be, for example, plastic material such as PE plastic, PMMA, PC (polycarbonate) or PI (polyimide). For instance, the PE plastic can be the flexible plastic material such as PEC, PEN and PES. Moreover, the material of theflexible substrate 110 comprises metal foil. - As shown in
FIG. 1A , the environmentalsensitive element 120 comprises a bottom electrode layer B, a displaying medium DM and a top electrode layer T. The bottom electrode layer B is disposed on theflexible substrate 110, the displaying medium DM is disposed on bottom electrode layer B and the top electrode layer T is disposed on the displaying medium DM. More clearly, the displaying medium DM is composed of a hole injection layer HIL, a hole transporting layer HTL, an organic electro-emitting layer EML and an electron transporting layer ETL. The hole injection layer HIL is disposed on the bottom electrode layer B, the hole transporting layer HTL is disposed on the hole injection layer HIL, the organic electro-emitting layer EML is disposed on the hole transporting layer HTL, and the electron transporting layer ETL is disposed on the organic electro-emitting layer EML. Furthermore, the top electrode layer T is disposed on the electron transporting layer ETL. - The environmental
sensitive element 120 of the present embodiment can be an active matrix element or a passive matrix element. When the environmentalsensitive element 120 is the active matrix element, the bottom electrode layer B can be, for example, a pixel electrode of the thin film transistor array and the top electrode layer can be, for example, a common electrode. Meanwhile, the displaying medium between each of the pixel electrodes and the common electrode can be individually driven to emit lights. When the environmentalsensitive element 120 is the passive matrix element, the bottom electrode layer B and the top electrode layer are the stripe electrodes, and the bottom electrode layer B and the top electrode layer T are arranged in an interlacing manner. Meanwhile, the displaying medium located at the crossover section where each of the top electrode layer T interlaces the bottom electrode layer B can be individually driven to emit lights. In the present embodiment, the extending direction of the bottom electrode layer B can be, for example, substantially perpendicular to the extending direction of the top electrode layer T. - As shown in
FIG. 1A , the flexiblesacrificial layer 130 comprises a sacrificialthin film 132 and a flexible protectingthin film 134, wherein the sacrificialthin film 132 is configured on the top electrode layer T of the environmentalsensitive element 120 and the flexible protectingthin film 134 is configured on the sacrificialthin film 132. It should be noticed that, the sacrificialthin film 132 of the present embodiment is connected to the top electrode layer T, but the flexible protectingthin film 134 is disconnected to the top electrode layer T. However, in other embodiments of the present disclosure, the flexible protectingthin film 134 disposed on the sacrificialthin film 132 can be connected to the top electrode layer T. The bonding strength between the sacrificialthin film 132 and the top electrode layer T is substantially equal to or lower than the bonding strength between two adjacent first thin films (DM, B and T) so that the delaminating phenomenon hardly happens between the adjacent first thin films (DM, B and T) but easily happens on the interface between the sacrificialthin film 132 and the top electrode layer T and on the interface between the sacrificialthin film 132 and the flexible protectingthin film 134 when the package of the environmental sensitive element is bent. Therefore, the sacrificialthin film 132 and the flexible protectingthin film 134 can effectively protect the first thin films (DM, B and T) from having delaminating phenomenon during the package is bent. In addition, the flexiblesacrificial layer 130 further has a UV cutting function so as to increase the life time of the environmentalsensitive element 120. And also the flexiblesacrificial layer 130 further has a light out coupling function so as to increase the light efficiency of the environmentalsensitive element 120. - In the present embodiment, the material of the sacrificial
thin films 132 includes organic small molecular compounds, organic oligomers, metal or organic-inorganic co-evaporated material. The molecular weight of the aforementioned organic small molecular material is about 10 g/mol˜5000 g/mol and the organic small molecular material includes Alq3 (Tris-(8-hydroxyquinoline)aluminum), alpha-NPB (N,N′-Dis(naphthalene-1-yl)-N,N′-diphenyl-benzidine), CuPc (Phalocyanine copper complex). The molecular weight of the organic oligomers is about 500 g/mol˜9000 g/mol and the organic oligomers include Phenylene Vinylene Oligomers or Fluorene Oligomers. The molecular weight of metal or organic-inorganic co-evaporated material is about 3 g/mol˜500 g/mol. More clearly, the aforementioned metal can be, for example, Al, Ag, Be, Cr, Cu, Co, Fe, Ge, Ir, In, Mo, Mn, Mg, Ni, Nb, Pb, Pd, Pt, Ru, Rh, Sn, Si, Sb, Se, Ti, Ta, Te, V, W, Zr, Zn, Mg—Ag, Al—Si, Al—Si—Cu, Au/Ge, Au—Be, Au—Ge—N, Ni—Cr, Pb—sn or In—Sn. - In addition, the material of the sacrificial
thin film 132 further includes a single or a mixture of aromatic tertiary amine compounds. More clearly, the aromatic tertiary amine compounds may be 1,1-bis(4-di-p-tolylaminophenyl)cyclohexane, 1,1-bis(4-di-p-tolylaminophenyl)-4-phenylcyclohexane, 1,5-bis[N-(1-naphthyl)-N-phenylamino]naphthalene, 2,6-bis(di-p-tolylamino)naphthalene, 2,6-bis[di-(1-naphthyl)amino]naphthalene, 2,6-bis[N-(1-naphthyl)-N-(2-naphthyl)amino]naphthalene, 2,6-bis[N,N-di(2-naphthyl)amine]fluorene, 4-(di-p-tolylamino)-4′-[4 (di-p-tolylamino)-styryl]stilbene, 4,4′-bis(diphenylamino)quadriphenyl, 4,4″-bis[N-(1-anthryl)-N-phenylamino]-p-terphenyl, 4,4′-bis[N-(1-coronenyl)-N-phenylamino]biphenyl, 4,4′-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (NPB), 4,4′-bis[N-(1-naphthyl)-N-(2-naphthyl)amino]biphenyl (TNB), 4,4″-bis[N-(1-naphthyl)-N-phenylamino]p-terphenyl, 4,4′-bis[N-(2-naphthacenyl)-N-phenylamino]biphenyl, 4,4′-bis[N-(2-naphthyl)-N-phenylamino]biphenyl, 4,4′-bis[N-(2-perylenyl)-N-phenylamino]biphenyl, 4,4′-bis[N-(2-phenanthryl)-N-phenylamino]biphenyl, 4,4′-bis[N-(2-pyrenyl)-N-phenyl amino]biphenyl, 4,4′-bis[N-(3-acenaphthenyl)-N-phenylamino]biphenyl, 4,4′-bis[N-(3-methylphenyl)-N-phenylamino]biphenyl (TPD), 4,4′-bis[N-(8-fluoranthenyl)-N-phenylamino]biphenyl, 4,4′-bis[N-(9-anthryl)-N-phenylamino]biphenyl, 4,4′-bis {N-phenyl-N-[4-(1-naphthyl)-phenyl]amino}biphenyl, 4,4′-bis[N-phenyl-N-(2-pyrenyl)amino]biphenyl, 4,4′,4″-tris[(3-methylphenyl)phenylamino]triphenylamine (m-TDATA), Bis(4-dimethylamino-2-methylphenyl)-phenylmethane, N-phenylcarbazole, N,N′-bis[4-([1,1′-biphenyl]-4-ylphenylamino)phenyl]-N,N′-di-1-napthalenyl-[1,1′-biphenyl]-4,4′-diamine, N,N′-bis[4-(di-1-naphthalenylamino)phenyl]-N,N′-di-1-naphthalenyl-[1,1′-biphenyl]-4,4′-diamine, N,N′-bis[4-[(3-methylphenyl)phenylamino]phenyl]-N,N′-diphenyl-[1,1′-biphenyl]-4,4′-diamine, N,N-bis[4-(diphenylamino)phenyl]-N′,N′-dipheny-[1,1′-biphenyl]-4,4′-diamine, N,N′-di-1-naphthalenyl-N,N′-bis[4-(1-naphthalenylphenylamino)phenyl]-[1,1′-biphenyl]-4,4′-diamine, N,N′-di-1-naphthalenyl-N,N′-bis[4-(2-naphthalenylphenylamino)phenyl]-[1,1′-biphenyl]-4,4′-diamine, N,N,N-tri(p-tolyl)amine, N,N,N′,N′-tetra-p-tolyl-4-4′-diaminobiphenyl, N,N,N′,N′-tetraphenyl-4,4′-diaminobiphenyl, N,N,N′,N′-tetra-1-naphthyl-4,4′-diaminobiphenyl, N,N,N′,N′-tetra-2-naphthyl-4,4′-diaminobiphenyl, or N,N,N′,N′-tetra(2-naphthyl)-4,4″-diamino-p-terphenyl. - Moreover, the material of the flexible protecting
thin film 134 comprises indium tin oxide (ITO), indium zinc oxide (IZO), aluminum doped zinc oxide (AZO), WO3, MoO3, SiOx, SiNx, SiOxNy, Al2O3, Al, Ag, Mg—Ag or Mg—Al. It should be noticed that the materials of the sacrificialthin film 132 and the flexible protectingthin film 134 in the flexiblesacrificial layer 130 are selected from different material groups such that the bonding strength between the sacrificialthin film 132 and the flexible protectingthin film 134 is substantially equal to or smaller than the bonding strength between the adjacent first thin films (DM, B and T). - As shown in
FIG. 1A , thepackaging structure 140 comprises asealant 142, anadhesion layer 144 and aflexible cover 146. Thesealant 142 is disposed on theflexible substrate 110 to encircle the environmentalsensitive element 120 and the flexiblesacrificial layer 130. Theadhesion layer 144 is disposed within thesealant 142 to cover the environmentalsensitive element 120 and the flexiblesacrificial layer 130. Further, theflexible cover 146 is connected with thesealant 142 and theadhesion layer 144. - As shown in
FIG. 1B , thepackaging structure 140 can also be other types of structure. For instance, the packaging structure can comprise anadhesion layer 144 and aflexible cover 146, wherein theadhesion layer 144 covers the environmentalsensitive element 120 and the flexiblesacrificial layer 130, and theflexible cover 146 is connected to theadhesion layer 144. - As shown in
FIG. 1C , thepackaging structure 140′ with other packaging structure type is used in the present embodiment. For instance, thepackaging structure 140′ can comprise a plurality of package thin films. The package thin films include a plurality of organic packagethin films 148 a and a plurality of inorganic packagethin films 148 b. The organicthin films 148 a and the inorganicthin films 148 b are stacked on one another to provide a relatively better moisture-proof ability. - As shown in
FIG. 1D , thepackaging structure 140″ with other packaging structure type is used in the present embodiment. For instance, thepackaging structure 140″ can comprise asealant 142, anadhesion layer 144, aflexible cover 146, at least one layer of organic packagethin films 148 a and at least one layer of inorganic packagethin films 148 b. The organicthin films 148 a and the inorganicthin films 148 b are stacked on one another to provide a relatively better moisture-proof ability. Thesealant 142 is disposed on theflexible substrate 110 to encircle the environmentalsensitive element 120 and the flexiblesacrificial layer 130. Theadhesion layer 144 is disposed within thesealant 142 to cover the organic packagethin films 148 a, the inorganic packagethin films 148 b and the flexiblesacrificial layer 130. Further, theflexible cover 146 is connected with thesealant 142 and theadhesion layer 144. - It should be noticed that the aforementioned organic package
thin films 148 a and the inorganic packagethin film 148 b can be arranged alone or alternately stacked on one another. - In a present embodiment, the material of the top electrode layer T can be, for example, as same as the material of the flexible protecting
thin film 134, and the material of the sacrificialthin film 132 can be, for example, as same as the material of the hole transporting layer HTL. Therefore, the process for forming the flexiblesacrificial layer 130 can be integrated with the process for forming the environmentalsensitive element 120. In other words, the flexiblesacrificial layer 130 and the environmentalsensitive element 120 can be manufactured in the same process chamber without further modifying the current process procedure. -
FIG. 2A andFIG. 2B are the cross-sectional views of a package of an environmental sensitive element according to the second embodiment of the present disclosure. As shown inFIG. 2A andFIG. 2B , thepackage 100 a of the environmental sensitive element of the present embodiment is similar to thepackage 100 of the environmental sensitive element of the first embodiment. More clearly, the thin film structure of the flexiblesacrificial layer 130 a in thepackage 100 a is different from that of the flexiblesacrificial layer 130 in thepackage 100. The flexiblesacrificial layer 130 a comprises a plurality of sacrificialthin films 132 and a plurality of flexible protectingthin films 134, wherein the sacrificialthin films 132 and the flexible protectingthin films 134 are alternately stacked on one another and are configured on the top electrode layer T of the environmentalsensitive element 120 and the bottommost sacrificialthin film 132 is connected to the top electrode layer T. - Moreover, the flexible protecting
thin films 134 of the present embodiment are disconnected to the top electrode layer T. -
FIG. 3A andFIG. 3B are the cross-sectional views of a package of an environmental sensitive element according to the third embodiment of the present disclosure. As shown inFIG. 3A andFIG. 3B , thepackage 100 b of the environmental sensitive element of the present embodiment is similar to thepackage 100 a of the environmental sensitive element of the second embodiment. More clearly, the thin film structure of the flexiblesacrificial layer 130 b in thepackage 100 b is different from that of the flexiblesacrificial layer 130 a in thepackage 100 a. The flexiblesacrificial layer 130 b comprises a plurality of sacrificialthin films 132 and a plurality of flexible protectingthin films 134, wherein the sacrificialthin films 132 and the flexible protectingthin films 134 are alternately stacked on one another and are configured on the top electrode layer T of the environmentalsensitive element 120 and the bottommost sacrificialthin film 132 and all of the flexible protectingthin films 134 are connected to the top electrode layer T. - Table 1 is a detailed explanation of the structure of the package of the environmental sensitive element, wherein illuminant area of the package is about 0.3 centimeter×0.3 centimeter.
-
TABLE 1 Flexible Lower EML EIL/top Structure Upper Substrate Electrode HTL (Dopant:Host) ETL electrode Layer Substrate Experimental PES ITO NPB Ir(ppy)3 CBP Bphen LiF5{acute over (Å)}/ NPB/Al Metal group I 200{acute over (Å)} 7% 300{acute over (Å)} 300{acute over (Å)} Al 1500{acute over (Å)} 1500{acute over (Å)}/ Foil 1500{acute over (Å)} Control PES ITO NPB Ir(ppy)3 CBP Bphen LiF5{acute over (Å)}/ NPB/Al Metal group I 200{acute over (Å)} 7% 300{acute over (Å)} 300{acute over (Å)} Al 1500{acute over (Å)} 0{acute over (Å)}/0{acute over (Å)} Foil - The package of the environmental sensitive element manufactured according to the standards of the experimental group I and control group I is normally lighting on before it goes through the bending test. After the bending test (the package is bent for 500 times with a radius of curvature of about 5 centimeter), the package of the environmental sensitive element of the control group I can not light on. The package of the environmental sensitive element of the experimental group I is driven by a voltage of 4V to light on with a brightness about 820 Cd/m̂2 and a light emitting efficiency about 14.0 Cd/A before it goes through the bending test. After the bending test (the package is bent for 500 times with a radius of curvature of about 5 centimeter), the package of the environmental sensitive element of the experimental group I is driven by a voltage of 4V to light on with a brightness about 793 Cd/m̂2 and a light emitting efficiency about 13.9 Cd/A. Obviously, the light emitting efficiency of the package of the environmental sensitive element of the experimental group I (i.e., one of the embodiments of the present disclosure) does not significantly decayed.
-
FIG. 4A is the cross-sectional view of a package of an environmental sensitive element according to the fourth embodiment of the present disclosure.FIG. 4B is the top view of the package of the environmental sensitive element inFIG. 4A . As shown inFIG. 4A andFIG. 4B , thepackage 100 c of the environmental sensitive element of the present embodiment is similar to thepackage 100 of the environmental sensitive element of the first embodiment. Specifically, thefirst packaging structure 140′ covers the environmentalsensitive element 120 and a first flexiblesacrificial layer 150 is disposed on thefirst packaging structure 140′, wherein the environmentalsensitive element 120 and the first flexiblesacrificial layer 150 are located on two opposite sides of thefirst packaging structure 140′. Thefirst packaging structure 140′ comprises at least one layer of organic packagethin films 148 a and at least one layer of inorganic packagethin films 148 b. - As shown in
FIG. 4A , the first flexiblesacrificial layer 150 comprises a first sacrificialthin film 152 and a first flexible protectingthin film 154, wherein the first sacrificialthin film 152 is configured on thefirst packaging structure 140′ and the first flexible protectingthin film 154 is configured on the first sacrificialthin film 152. It should be noticed that, the first sacrificialthin film 152 of the present embodiment is connected to thefirst packaging structure 140′, but the first flexible protectingthin film 154 is disconnected to thefirst packaging structure 140′. In other embodiments of the present disclosure, the first flexible protectingthin film 154 disposed on the first sacrificialthin film 152 can be connected to thefirst packaging structure 140′. The bonding strength between the first sacrificialthin film 152 and thefirst packaging structure 140′ is substantially equal to or lower than the bonding strength between two adjacent first thin films (DM, B and T) so that the delaminating phenomenon hardly happens between the adjacent first thin films (DM, B and T) but easily happens on the interface between the first sacrificialthin film 152 and thefirst packaging structure 140′ and on the interface between the first sacrificialthin film 152 and the first flexible protectingthin film 154 when the package of the environmental sensitive element is bent. Therefore, the first sacrificialthin film 152 and the first flexible protectingthin film 154 can effectively protect the first thin films (DM, B and T) from having delaminating phenomenon during the package is bent. In addition, the first flexiblesacrificial layer 150 further has a UV cutting function so as to increase the life time of the environmentalsensitive element 120. And also the first flexiblesacrificial layer 150 further has a light out coupling function so as to increase the light efficiency of the environmentalsensitive element 120. - In the present embodiment, the material of the first sacrificial
thin film 152 is identical to the material of the sacrificialthin film 132, and the material of the first flexible protectingthin film 154 is identical to the material of the flexible protectingthin film 134. It should be noticed that the materials of the first sacrificialthin film 152 and the first flexible protectingthin film 154 in the first flexiblesacrificial layer 150 are selected from different material groups such that the bonding strength between the first sacrificialthin film 152 and the first flexible protectingthin film 154 is substantially equal to or smaller than the bonding strength between the adjacent first thin films (DM, B and T). - As shown in
FIG. 4A andFIG. 4B , the first flexiblesacrificial layer 150 is greater than the size of the environmentalsensitive element 120 in the present embodiment. However, in other embodiments, the size of the first flexiblesacrificial layer 150 can be equal to the size of the environmentalsensitive element 120. -
FIG. 5A is the cross-sectional view of a package of an environmental sensitive element according to the fifth embodiment of the present disclosure.FIG. 5B is the top view of the package of the environmental sensitive element inFIG. 5A . As shown inFIG. 5A andFIG. 5B , thepackage 100 d of the environmental sensitive element of the present embodiment is similar to thepackage 100 c of the environmental sensitive element of the fourth embodiment. Specifically, thepackage 100 d of the environmental sensitive element of the present embodiment further comprises asecond packaging structure 160 covering the environmentalsensitive element 120, thefirst packaging structure 140′ and the first flexiblesacrificial layer 150. Thesecond packaging structure 160 comprises asealant 162, anadhesion layer 164 and aflexible cover 166. Thesealant 162 is disposed on theflexible substrate 110 to encircle the environmentalsensitive element 120 and the first flexiblesacrificial layer 150. Theadhesion layer 164 is disposed within thesealant 162 to cover the environmentalsensitive element 120 and the first flexiblesacrificial layer 150. Further, theflexible cover 166 is connected with thesealant 162 and theadhesion layer 164. - As shown in
FIG. 5A andFIG. 5B , thesealant 162 of thesecond packaging structure 160 has a continuous pattern encircling the environmentalsensitive element 120. However, in other embodiments, thesealant 162 of thesecond packaging structure 160 may have a non-continuous pattern encircling the environmentalsensitive element 120. For example, thesealant 162 may includes a plurality of patterns separated from each other, wherein the separated patterns are arranged in a continuous form so as to encircle the environmentalsensitive element 120. In addition, the material of thesealant 162 and the material of theadhesion layer 164 are different in the present embodiment. However, in other embodiments, the material of thesealant 162 and the material of theadhesion layer 164 may be identical. -
FIG. 6A is the cross-sectional view of a package of an environmental sensitive element according to the sixth embodiment of the present disclosure.FIG. 6B is the top view of the package of the environmental sensitive element inFIG. 6A . As shown inFIG. 6A andFIG. 6B , thepackage 100 e of the environmental sensitive element of the present embodiment is similar to thepackage 100 d of the environmental sensitive element of the fifth embodiment. Specifically, theadhesion layer 164 of asecond packaging structure 160′ is a film type adhesive. Theadhesion layer 164 covers the environmentalsensitive element 120 and the first flexiblesacrificial layer 150. Further, theflexible cover 166 is connected with theadhesion layer 164. -
FIG. 7 is the cross-sectional view of a package of an environmental sensitive element according to the seventh embodiment of the present disclosure. As shown inFIG. 7 , thepackage 100 f of the environmental sensitive element of the present embodiment is similar to thepackage 100 c of the environmental sensitive element of the fourth embodiment. Specifically, the thin film structure of the first flexiblesacrificial layer 150 a in thepackage 100 f is different from that of the first flexiblesacrificial layer 150 in thepackage 100 c. The first flexiblesacrificial layer 150 a comprises a plurality of first sacrificialthin films 152 and a plurality of first flexible protectingthin films 154, wherein the first sacrificialthin films 152 and the first flexible protectingthin films 154 are alternately stacked on one another and are configured on thefirst packaging structure 140′ and the bottommost first sacrificialthin film 152 is connected to thefirst packaging structure 140′. Moreover, as shown inFIG. 7 , the first flexible protectingthin films 154 of the present embodiment are disconnected to thefirst packaging structure 140′. -
FIG. 8 is the cross-sectional view of a package of an environmental sensitive element according to the eighth embodiment of the present disclosure. As shown inFIG. 8 , thepackage 100 g of the environmental sensitive element of the present embodiment is similar to thepackage 100 f of the environmental sensitive element inFIG. 7 . Specifically, the thin film structure of the first flexiblesacrificial layer 150 b in thepackage 100 g is different from that of the first flexiblesacrificial layer 150 a in thepackage 100 f. The first flexiblesacrificial layer 150 b comprises a plurality of first sacrificialthin films 152 and a plurality of first flexible protectingthin films 154, wherein the first sacrificialthin films 152 and the first flexible protectingthin films 154 are alternately stacked on one another and are configured on thefirst packaging structure 140′ and the bottommost first sacrificialthin film 152 and the bottommost first flexible protectingthin films 154 are connected to thefirst packaging structure 140′. -
FIG. 9 is the cross-sectional view of a package of an environmental sensitive element according to the ninth embodiment of the present disclosure. As shown inFIG. 9 , thepackage 100 h of the environmental sensitive element of the present embodiment is similar to thepackage 100 c of the environmental sensitive element of the fourth embodiment. Specifically, thepackage 100 h further comprises a second flexiblesacrificial layer 160 disposed on the environmentalsensitive element 120. - As shown in
FIG. 9 , the second flexiblesacrificial layer 170 comprises a second sacrificialthin film 172 and a second flexible protectingthin film 174, wherein the second sacrificialthin film 172 is configure on the top electrode layer T of the environmentalsensitive element 120 and the second flexible protectingthin film 174 is configured on the second sacrificialthin film 172. It should be noticed that, the second sacrificialthin film 172 of the present embodiment is connected to the top electrode layer T, but the second flexible protectingthin film 174 is disconnected to the top electrode layer T. However, in other embodiments of the present disclosure, the second flexible protectingthin film 174 disposed on the second sacrificialthin film 172 can be connected to the top electrode layer T. - In the present embodiment, the material of the second sacrificial
thin film 172 is identical to the material of the sacrificialthin film 132, and the material of the second flexible protectingthin film 174 is identical to the material of the flexible protectingthin film 134. It should be noticed that the materials of the second sacrificialthin film 172 and the second flexible protectingthin film 174 in the second flexiblesacrificial layer 170 are selected from different material groups such that the bonding strength between the second sacrificialthin film 172 and the second flexible protectingthin film 174 is substantially equal to or smaller than the bonding strength between the adjacent first thin films (DM, B and T). - Further, the bonding strength between the second sacrificial
thin film 172 and the top electrode layer T is substantially equal to or lower than the bonding strength between two adjacent first thin films (DM, B and T) so that the delaminating phenomenon hardly happens between the adjacent first thin films (DM, B and T) but easily happens on the interface between the second sacrificialthin film 172 and the top electrode layer T and on the interface between the second sacrificialthin film 172 and the second flexible protectingthin film 174 when the package of the environmental sensitive element is bent. Therefore, the second sacrificialthin film 172 and the second flexible protectingthin film 174 can effectively protect the first thin films (DM, B and T) from having delaminating phenomenon during the package is bent. In addition, the second flexiblesacrificial layer 170 further has a UV cutting function so as to increase the life time of the environmentalsensitive element 120. And also the second flexiblesacrificial layer 170 further has a light out coupling function so as to increase the light efficiency of the environmentalsensitive element 120. -
FIG. 10 is the cross-sectional view of a package of an environmental sensitive element according to the tenth embodiment of the present disclosure. As shown in FIG. 10, thepackage 100 i of the environmental sensitive element of the present embodiment is similar to thepackage 100 h of the environmental sensitive element of the ninth embodiment. Specifically, thepackage 100 i of the environmental sensitive element of the present embodiment further comprises asecond packaging structure 160 covering the environmentalsensitive element 120, thefirst packaging structure 140′, the first flexiblesacrificial layer 150 and the second flexiblesacrificial layer 170. -
FIG. 11 is the cross-sectional view of a package of an environmental sensitive element according to the eleventh embodiment of the present disclosure. As shown inFIG. 11 , thepackage 100 j of the environmental sensitive element of the present embodiment is similar to thepackage 100 h of the environmental sensitive element of the ninth embodiment. Specifically, the thin film structure of the first flexiblesacrificial layer 150 a in thepackage 100 j is different from that of the first flexiblesacrificial layer 150 in thepackage 100 h. The first flexiblesacrificial layer 150 a comprises a plurality of first sacrificialthin films 152 and a plurality of first flexible protectingthin films 154, wherein the first sacrificialthin films 152 and the first flexible protectingthin films 154 are alternately stacked on one another and are configured on thefirst packaging structure 140′ and the bottommost first sacrificialthin film 152 is connected to thefirst packaging structure 140′. Moreover, as shown inFIG. 10 , the first flexible protectingthin films 154 of the present embodiment are disconnected to thefirst packaging structure 140′. - Furthermore, the thin film structure of the second flexible
sacrificial layer 170 a in thepackage 100 j is different from that of the second flexiblesacrificial layer 170 in thepackage 100 h. The second flexiblesacrificial layer 170 a comprises a plurality of second sacrificialthin films 172 and a plurality of second flexible protectingthin films 174, wherein the second sacrificialthin films 172 and the second flexible protectingthin films 174 are alternately stacked on one another and are configured on the environmentalsensitive element 120, and the bottommost second sacrificialthin film 172 is connected to the environmentalsensitive element 120. Moreover, as shown inFIG. 10 , the second flexible protectingthin films 174 of the present embodiment are disconnected to the environmentalsensitive element 120. -
FIG. 12 is the cross-sectional view of a package of an environmental sensitive element according to the twelfth embodiment of the present disclosure. As shown inFIG. 12 , thepackage 100 k of the environmental sensitive element of the present embodiment is similar to thepackage 100 j of the environmental sensitive element of the eleventh embodiment. Specifically, the thin film structures of the first flexiblesacrificial layer 150 b in thepackage 100 k is different from that of the first flexiblesacrificial layer 150 a in thepackage 100 j. The bottommost first sacrificialthin film 152 and the bottommost first flexible protectingthin film 154 are connected to thefirst packaging structure 140′. - Furthermore, the thin film structure of the second flexible
sacrificial layer 170 b in thepackage 100 k is different from that of the second flexiblesacrificial layer 170 a in thepackage 100 j. The bottommost second sacrificialthin film 172 and the bottommost second flexible protectingthin film 174 are connected to the environmentalsensitive element 120. - According to the above embodiments and the experimental example, since the flexible sacrificial layer with various types is formed on the environmental sensitive element, when the environmental sensitive element is exaggeratedly bent, the delaminating happens in the flexible sacrificial layer. Therefore, the environmental sensitive element can be prevented from the delaminating phenomenon due to being bent and the structure of the environmental sensitive element can be prevented from being damaged during it is bent.
Claims (10)
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US14/730,253 US9224700B2 (en) | 2009-09-15 | 2015-06-04 | Package of environmental sensitive element |
US14/948,394 US9660218B2 (en) | 2009-09-15 | 2015-11-23 | Package of environmental sensitive element |
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TW098131092A TWI407535B (en) | 2009-09-15 | 2009-09-15 | Package of environmental sensitive element |
TW98131092A | 2009-09-15 | ||
TW98131092 | 2009-09-15 | ||
US12/703,155 US8446730B2 (en) | 2009-09-15 | 2010-02-09 | Package of environmental sensitive element |
US13/867,136 US9101005B2 (en) | 2009-09-15 | 2013-04-22 | Package of environmental sensitive element |
US14/730,253 US9224700B2 (en) | 2009-09-15 | 2015-06-04 | Package of environmental sensitive element |
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US14/948,394 Continuation-In-Part US9660218B2 (en) | 2009-09-15 | 2015-11-23 | Package of environmental sensitive element |
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