US20140363315A1 - Electronic device and air blower - Google Patents

Electronic device and air blower Download PDF

Info

Publication number
US20140363315A1
US20140363315A1 US14/010,544 US201314010544A US2014363315A1 US 20140363315 A1 US20140363315 A1 US 20140363315A1 US 201314010544 A US201314010544 A US 201314010544A US 2014363315 A1 US2014363315 A1 US 2014363315A1
Authority
US
United States
Prior art keywords
sidewall
inner sidewall
base
shaped
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/010,544
Other languages
English (en)
Inventor
Qiang Chen
Jian Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD. reassignment HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, QIANG, LUO, JIAN
Publication of US20140363315A1 publication Critical patent/US20140363315A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
    • F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
    • F04F5/14—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid
    • F04F5/16—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation

Definitions

  • the present disclosure relates to electronic devices, and particularly to an electronic device with an air blower.
  • Electronic devices such as computers, are increasingly used in more fields.
  • the electronic components generate a lot of heat in housings of the electronic devices.
  • a method for dissipating the heat is to use fans.
  • the airflow generated by the fans is often too weak to dissipate heat efficiently.
  • FIG. 1 is an assembled, isometric view of an embodiment of an electronic device, wherein the electronic device includes an air blower.
  • FIG. 2 is an enlarged view of the air blower of FIG. 1 .
  • FIG. 3 is a cross-sectional view taken along the line III-III of FIG. 2 .
  • FIG. 4 is similar to FIG. 2 , but showing the direction of airflow.
  • an embodiment of an electronic device 10 includes a housing 20 , and an air blower 100 arranged in the housing 20 .
  • the housing 20 includes a front wall 21 , a rear wall 22 , a bottom wall 23 , a top wall 24 , and two sidewalls 25 (one of the sidewalls 25 not shown in the figures).
  • a motherboard 30 is set on one of the sidewalls 25 .
  • a power supply unit 40 is arranged on an upper portion of the rear wall 22 .
  • a hard disk drive (HDD) bracket 50 for receiving a plurality of HDDs is arranged on a middle of an inner side of the front wall 21 .
  • the front wall 21 defines a plurality of first vents 211 .
  • the rear wall 22 defines a plurality of second vents 221 .
  • the bottom wall 23 defines a plurality of third vents 231 adjacent to the front wall 21 .
  • the air blower 100 includes a base 101 , a fan 102 received in the base 101 , and an air duct 103 located on the base 101 and enclosing the HDD bracket 50 .
  • the base 101 is substantially box-shaped, and includes a substantially rectangular bottom plate 1011 , and four side plates 1012 extending up from four sides of the bottom plate 1011 .
  • the bottom plate 1011 defines a plurality of through slots 1013 aligning with the third vents 231 .
  • the fan 102 is arranged on an inner side of one of the side plates 1012 .
  • the air duct 103 is substantially rectangular frame shaped and includes a substantially rectangular frame shaped outer sidewall 1031 , a substantially rectangular frame shaped inner sidewall 1032 , and two connecting plates 1033 respectively connected to front sides and rear sides of the outer sidewall 1031 and the inner sidewall 1032 for closing the outer sidewall 1031 and the inner sidewall 1032 .
  • the outer sidewall 1031 , the inner sidewall 1032 , and the connecting plates 1033 cooperatively form a substantially rectangular air channel 1030 .
  • the outer sidewall 1031 defines an inlet 1034 in a bottom, and the inlet 1034 communicates with the base 101 .
  • a rectangular frame shaped outlet portion 1035 is formed at a front side of an outer surface of the inner sidewall 1032 .
  • the outlet portion 1035 defines an outlet channel 1037 communicating with the air channel 1030 .
  • the outlet portion 1035 defines a frame-shaped outlet 1036 communicating with the outlet channel 1037 .
  • An area of the outlet 1036 is less than an area of the inlet 10
  • a first part of airflow 60 coming from outside of the housing 20 flows into the base 101 through the third vents 231 and the through slots 1013 , flows into the air channel 1030 through the inlet 1034 , flows through the outlet channel 1037 , and then flows out of the air blower 100 from the outlet 1036 , to form four parts of second airflow 80 along four inner surfaces of the inner sidewall 1032 .
  • the four parts of second airflow 80 are forced out of the inner sidewall 1032 and vacuumizes in the inner frame 1032 to form a third airflow 90 flowing from front to rear in the inner frame 1032 , to cool the HDD bracket 50 , the motherboard 30 , and the power supply unit 40 .
  • the third airflow 90 guides a fourth airflow 70 entering the housing 20 through the first vents 211 , to helps cool the HDD bracket 50 , the motherboard 30 , and the power supply unit 40 , and then flows out of the housing 20 from the second vents 221 .
  • the electronic device 10 utilizes the air blower 100 to increase airflow, which dissipates heat more effectively.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US14/010,544 2013-06-06 2013-08-27 Electronic device and air blower Abandoned US20140363315A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2013102230234 2013-06-06
CN201310223023.4A CN104238676A (zh) 2013-06-06 2013-06-06 机箱及其吹风装置

Publications (1)

Publication Number Publication Date
US20140363315A1 true US20140363315A1 (en) 2014-12-11

Family

ID=52005629

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/010,544 Abandoned US20140363315A1 (en) 2013-06-06 2013-08-27 Electronic device and air blower

Country Status (4)

Country Link
US (1) US20140363315A1 (zh)
JP (1) JP2014239221A (zh)
CN (1) CN104238676A (zh)
TW (1) TW201448710A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106402046A (zh) * 2016-11-29 2017-02-15 苏州华业检测技术服务有限公司 一种无扇叶式发动机冷却风扇

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437297B1 (en) 2018-03-15 2019-10-08 Quanta Computer Inc. Air jet embedded chassis

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US5361188A (en) * 1990-10-24 1994-11-01 Hitachi Ltd. Cooling apparatus of electronic equipment
US5422787A (en) * 1992-09-28 1995-06-06 Energy Innovations, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
US5428503A (en) * 1992-03-24 1995-06-27 Hitachi, Ltd. Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
US6086476A (en) * 1998-07-31 2000-07-11 Compaq Computer Corporation Method and apparatus for cooling and acoustic noise reduction in a computer
US20050174732A1 (en) * 2004-02-06 2005-08-11 Fang-Cheng Lin Main unit of a computer
US20100097754A1 (en) * 2008-10-22 2010-04-22 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Computer enclosure with airflow guide
US20120044634A1 (en) * 2010-08-17 2012-02-23 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus
US8199500B2 (en) * 2009-01-28 2012-06-12 Funai Electric Co., Ltd. Heat radiation mechanism of electronic apparatus and electronic apparatus
US8644019B2 (en) * 2011-12-02 2014-02-04 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Electronic device with cooling module

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US5361188A (en) * 1990-10-24 1994-11-01 Hitachi Ltd. Cooling apparatus of electronic equipment
US5428503A (en) * 1992-03-24 1995-06-27 Hitachi, Ltd. Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
US5422787A (en) * 1992-09-28 1995-06-06 Energy Innovations, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
US6086476A (en) * 1998-07-31 2000-07-11 Compaq Computer Corporation Method and apparatus for cooling and acoustic noise reduction in a computer
US20050174732A1 (en) * 2004-02-06 2005-08-11 Fang-Cheng Lin Main unit of a computer
US20100097754A1 (en) * 2008-10-22 2010-04-22 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Computer enclosure with airflow guide
US8199500B2 (en) * 2009-01-28 2012-06-12 Funai Electric Co., Ltd. Heat radiation mechanism of electronic apparatus and electronic apparatus
US20120044634A1 (en) * 2010-08-17 2012-02-23 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus
US8644019B2 (en) * 2011-12-02 2014-02-04 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Electronic device with cooling module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106402046A (zh) * 2016-11-29 2017-02-15 苏州华业检测技术服务有限公司 一种无扇叶式发动机冷却风扇

Also Published As

Publication number Publication date
CN104238676A (zh) 2014-12-24
TW201448710A (zh) 2014-12-16
JP2014239221A (ja) 2014-12-18

Similar Documents

Publication Publication Date Title
US9229498B2 (en) Electronic device with heat dissipation equipment
US8395892B2 (en) Air duct and computer system with the air duct
US8300405B2 (en) Airflow duct
US8363401B2 (en) Air guiding device and heat dissipation system having same
US8072753B2 (en) Computer system
US20120327589A1 (en) Computer system with airflow guiding duct
US8917503B2 (en) Heat dissipation device
US20140036439A1 (en) Electronic device
US8164900B2 (en) Enclosure of electronic device
US20140036433A1 (en) Airflow guiding member and electronic device having the airflow guiding member
US20120140405A1 (en) Heat dissipation system
US20120224324A1 (en) Elctronic device with heat and dust dissipation mechanism
US8737070B2 (en) Heat dissipation system
US9690338B2 (en) Electronic device with cooling facility
US8737060B2 (en) Computer system with airflow guiding duct
US20160224077A1 (en) Enclosure of electronic device
US8644019B2 (en) Electronic device with cooling module
US8587940B2 (en) Server with fan module
US20130148297A1 (en) Electronic device with air duct
US20140218864A1 (en) Electronic device with cooling assembly
US20130277010A1 (en) Heat dissipating apparatus with air duct
US20120293957A1 (en) Heat dissipating system for computer
US20120044641A1 (en) Electronic device
US20150049435A1 (en) Electronic device
US20140363315A1 (en) Electronic device and air blower

Legal Events

Date Code Title Description
AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, QIANG;LUO, JIAN;REEL/FRAME:031086/0047

Effective date: 20130823

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, QIANG;LUO, JIAN;REEL/FRAME:031086/0047

Effective date: 20130823

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION