US20140353711A1 - Optical semiconductor lighting apparatus - Google Patents
Optical semiconductor lighting apparatus Download PDFInfo
- Publication number
- US20140353711A1 US20140353711A1 US14/464,185 US201414464185A US2014353711A1 US 20140353711 A1 US20140353711 A1 US 20140353711A1 US 201414464185 A US201414464185 A US 201414464185A US 2014353711 A1 US2014353711 A1 US 2014353711A1
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- United States
- Prior art keywords
- optical
- groove
- lighting apparatus
- sealing body
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 230000003287 optical effect Effects 0.000 title claims abstract description 90
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000007789 sealing Methods 0.000 claims abstract description 51
- 230000005489 elastic deformation Effects 0.000 claims description 8
- 239000000126 substance Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus that can prevent penetration of moisture, particles, dust or the like and can improve the durability and connectivity thereof in its entirety.
- optical semiconductors using a light source such as a light emitting diode (LED), an organic LED, a laser diode, and an organic electroluminescent diode, have low power consumption, long lifespan, superior durability, and high luminance. Due to these advantages, the optical semiconductors have recently attracted attention as an illumination component.
- a light source such as a light emitting diode (LED), an organic LED, a laser diode, and an organic electroluminescent diode
- a lighting apparatus using the optical semiconductor as a light source includes a housing accommodating a light emitting module in which a plurality of optical semiconductors are arrayed, and an optical cover facing the optical semiconductors and finishing one opened surface of the housing.
- the optical cover is fixed to the housing by press-fitting a sealing member, such as an O-ring, of which the cross-section is a “ ” or “C” shape along edges thereof.
- the present invention has been made in an effort to solve the above problems, and provides an optical semiconductor lighting apparatus that can prevent penetration of moisture and foreign substances and improve the durability thereof in its entirety.
- an optical semiconductor lighting apparatus includes: a light emitting module including a semiconductor optical device; a housing including the light emitting module; a first sealing body connected to a groove recessed in a polygonal or closed-curve shape of the housing; a first optical cover covering an outer edge of the groove and a top surface of the housing; a first rib formed on a top surface of the first sealing body along a forming direction of the first sealing body; and a pair of second ribs formed in parallel along both edges of a bottom surface of the first sealing body.
- the first rib may come into contact with the first optical cover and allow elastic deformation.
- the pair of second ribs may come into contact with a bottom surface of the groove and allows elastic deformation.
- the first sealing body may allow elastic deformation between the first and second ribs according to a load and pressure of the first optical cover.
- the housing may further include a first stepped portion formed with a height difference along the outer edge of the groove, and an edge of the first optical cover may come into contact with the first stepped portion.
- the housing may further include a first stepped portion formed with a height difference along the outer edge of the groove, and a thickness of the first optical cover may be equal to a height of the first stepped portion protruding from the outer edge of the groove.
- the housing may further include: a first stepped portion formed with a height difference along the outer edge of the groove; a second stepped portion formed with a height difference on a top surface of the first stepped portion; and a cover press ring pressing an edge of the first optical cover, which comes into contact with the first stepped portion, and the top surface of the first stepped portion.
- An edge of the cover press ring may come into contact with the second stepped portion.
- a thickness of the first optical cover may be equal to a height of the first stepped portion protruding from the outer edge of the groove.
- a thickness of the cover press ring may be equal to a height of the second stepped portion protruding from the first stepped portion.
- the housing may further include: a first stepped portion formed with a height difference along the outer edge of the groove; a second stepped portion formed with a height difference on a top surface of the first stepped portion; an outer cover covering a top surface of the second stepped portion and one side of the housing; and a second sealing body disposed on a top surface of the second stepped portion and covered by the outer cover, an edge of the first optical cover comes into contact with the first stepped portion, and a thickness of the first optical cover is equal to a height of the first stepped portion protruding from the outer edge of the groove.
- the housing may further include a cover press ring pressing an edge of the first optical cover, which comes into contact with the first stepped portion, and a top surface of the first stepped portion.
- a thickness of the cover press ring may be equal to a height of the second stepped portion protruding from the first stepped portion.
- An edge of the cover press ring may come into contact with the second stepped portion.
- the second sealing body may press a top surface of the second stepped portion and an upper portion of the cover press ring.
- the housing may further include: a first stepped portion formed with a height difference along the outer edge of the groove; a second stepped portion formed with a height difference on a top surface of the first stepped portion; an outer cover covering a top surface of the second stepped portion and a side of the housing; and a positioning rib formed on the outer cover along a forming direction of the outer cover.
- the housing may further include a second optical cover fixed inside the positioning rib.
- semiconductor optical device refers to an LED chip or the like that includes or uses optical semiconductor.
- the “semiconductor optical device” may include a package-level device with various types of optical semiconductor as well as the above-mentioned LED chip.
- FIG. 1 is a cross-sectional conceptual diagram illustrating an overall configuration of an optical semiconductor lighting apparatus according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional conceptual diagram illustrating pre-modification states of a first sealing body and first and second ribs, which are essential components of the optical semiconductor lighting apparatus according to the embodiment of the present invention.
- FIG. 1 is a cross-sectional conceptual diagram illustrating an overall configuration of an optical semiconductor lighting apparatus according to an embodiment of the present invention
- FIG. 2 is a cross-sectional conceptual diagram illustrating pre-modification states of a first sealing body and first and second ribs, which are essential components of the optical semiconductor lighting apparatus according to the embodiment of the present invention.
- the optical semiconductor lighting apparatus includes a light emitting module 100 , a housing 200 , a first sealing body 300 , a first optical cover 400 , a first rib 310 , and a second rib 320 .
- the light emitting module 100 includes one or more semiconductor optical devices 101 operating as a light source, a circuit board, and a driving circuit (not illustrated) for driving the semiconductor optical devices 101 .
- the housing 200 accommodates the light emitting module 100 , and provides a space for mounting the first sealing body 300 and the first optical cover 400 to be described below.
- the first sealing body 300 is coupled to a groove 201 recessed in the housing 200 along edges of the light emitting module 100 in a polygonal or closed-curve shape.
- the first sealing body 300 is provided for maintaining sealing while preventing moisture and foreign substances from flowing into the light emitting module 100 through the inside of the housing 200 .
- the first optical cover 400 covers the outer edge of the groove 201 and the top surface of the housing 200 .
- the first optical cover 400 prevents inflow of moisture and foreign substances and protects the light emitting module 100 such as the semiconductor optical devices 101 from the exterior by covering the opened top surface of the housing 200 .
- the first optical cover 400 performs an optical function of diffusing or reducing light emitted from the semiconductor optical devices 101 .
- the first rib 310 is formed on the top surface of the first sealing body 300 along a forming direction of the first sealing body 300 .
- the first rib 310 is integrally formed with the first sealing body 300 and is formed using the same material as the first sealing body 300 .
- the first rib 310 primarily disperses and supports a force and pressure applied from the edge of the first optical cover 400 while coming into contact with the first optical cover 400 .
- the second rib 320 is provided with a pair of ribs formed in parallel along both edges of the bottom surface of the first sealing body 300 .
- the second rib 320 is integrally formed with the first sealing body 300 and is formed using the same material as the first sealing body 300 .
- the second rib 320 secondarily disperses and supports a force and pressure applied from the edge of the first optical cover 400 while coming into contact with the groove 201 .
- the first and second ribs 310 and 320 are formed from the first sealing body 300 as described above, and maintain sealing while appropriately dispersing and supporting a force and pressure applied along a vertical direction of the first sealing body 300 .
- first rib 310 comes into contact with the first optical cover 400 and allows elastic deformation in a state of FIG. 2 , as shown in the enlarged portion of FIG. 1 .
- the pair of second ribs 320 comes into contact with the bottom surface 201 b of the groove 201 and allows elastic deformation in a state of FIG. 2 , as shown in the enlarged portion of FIG. 1 .
- the first sealing body 300 allows elastic deformation in a state of FIG. 2 , as shown in the enlarged portion of FIG. 1 , according to a load and pressure of the first optical cover 400 between the first and second ribs 310 and 320 .
- the housing 200 further includes a first stepped portion 210 formed with a height difference along the outer edge of the groove 201 in order for connection of the first optical cover 400 and sealing maintenance.
- the edge of the first optical cover 400 may come into contact with the first stepped portion 210 .
- a thickness of the first optical cover 400 may be equal to a height of the first stepped portion 210 protruding from the outer edge of the groove 201 .
- the housing 200 may further include a second stepped portion 220 and a cover press ring 230 .
- the second stepped portion 220 is formed on the first stepped portion with a height difference with respect to the first stepped portion 210 .
- the cover press ring 230 presses the edge of the first optical cover 400 coming into contact with the first stepped portion 210 , and the top surface of the first stepped portion 210 .
- the edge of the cover press ring 230 comes into contact with the second stepped portion 220 , and the cover press ring 230 presses the first optical cover 400 while coming into close contact with the first optical cover 400 , thereby avoiding the inconvenience of coupling with bolts along the edge of the first optical cover 400 .
- the cover press ring 230 presses the edge of the first optical cover 400 , which comes into contact with the first stepped portion 210 , and the top surface of the first stepped portion 210 .
- a thickness of the cover press ring 230 is equal to a height of the second stepped portion 220 protruding from the first stepped portion, and the edge of the cover press ring 230 comes into contact with the second stepped portion 220 .
- the housing 200 may include an outer cover 240 covering the top surface of the second stepped portion 220 and the side of the housing 200 , and a second sealing body 250 disposed on the top surface of the stepped portion 220 and covered by the outer cover 240 .
- the outer cover 240 prevents moisture from flowing from the ceiling to the light emitting module 100 .
- a positioning rib 242 may be further formed on the outer cover 240 along a forming direction of the outer cover 240 . Therefore, a second optical cover 260 may be additionally mounted inside the positioning rib 242 .
- the positioning rib 242 allows a user to perform operations while checking and determining an accurate installation position of the optical component, such as the second optical cover 260 , with his/her naked eye.
- the positioning rib 242 prevents the fixing material from flowing into the light emitting module 100 and allows the installation of additional optical components.
- the second sealing body 250 secondarily blocks moisture and foreign substances introduced through the outer cover 240 , and protects the entire apparatus by absorbing or dispersing external shocks applied to the first optical cover 400 .
- the second sealing body 250 is configured to press the top surface of the second stepped portion 220 and the upper portion of the cover press ring 230 .
- the basic technical spirit of the present invention is to provide the optical semiconductor lighting apparatus according to the present invention can prevent penetration of moisture and foreign substances, and improve the durability of the entire apparatus.
- the first sealing body primarily maintains sealing, it is possible to fundamentally prevent inflow of moisture or foreign substances.
- the first and second ribs formed on the top and bottom surfaces of the first sealing body effectively distribute and support the pressure and force applied to the edges and entire surfaces of the first optical cover to be connected to the housing. Therefore, the durability of the entire apparatus can be improved.
- optical semiconductor lighting apparatus of the present invention can be used for a long time without degradation in sealing performance, products with high reliability can be supplied to consumers.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
An optical semiconductor lighting apparatus includes a housing including a groove, a light-emitting module disposed in the housing, the light-emitting module including a semiconductor optical device, a sealing body disposed in the groove, the sealing body including a main portion and a first rib extending from the main portion, and an optical cover disposed on the housing and covering the groove and the light-emitting module, wherein a first open space is disposed between the optical cover, the first rib, the main portion of the sealing body, and a side surface of the groove.
Description
- This application is a continuation of U.S. patent application Ser. No. 13/920,350, filed on Jun. 18, 2013, and claims priority from and the benefit of Korean Patent Application No. 10-2013-0049419, filed on May 2, 2013, which are incorporated herein by reference for all purposes as if fully set forth herein.
- 1. Field
- The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus that can prevent penetration of moisture, particles, dust or the like and can improve the durability and connectivity thereof in its entirety.
- 2. Discussion of the Background
- As compared with incandescent bulbs and fluorescent lamps, optical semiconductors using a light source, such as a light emitting diode (LED), an organic LED, a laser diode, and an organic electroluminescent diode, have low power consumption, long lifespan, superior durability, and high luminance. Due to these advantages, the optical semiconductors have recently attracted attention as an illumination component.
- Generally, a lighting apparatus using the optical semiconductor as a light source includes a housing accommodating a light emitting module in which a plurality of optical semiconductors are arrayed, and an optical cover facing the optical semiconductors and finishing one opened surface of the housing.
-
- However, such a sealing member contracts or expands according to external environment change such as temperature or pressure, causing a problem in sealing maintenance.
- Therefore, there is an urgent need for apparatuses that can solve the above problems, prevent penetration of moisture and foreign substances, and improve the durability thereof in their entirety.
- The present invention has been made in an effort to solve the above problems, and provides an optical semiconductor lighting apparatus that can prevent penetration of moisture and foreign substances and improve the durability thereof in its entirety.
- According to an embodiment of the present invention, an optical semiconductor lighting apparatus includes: a light emitting module including a semiconductor optical device; a housing including the light emitting module; a first sealing body connected to a groove recessed in a polygonal or closed-curve shape of the housing; a first optical cover covering an outer edge of the groove and a top surface of the housing; a first rib formed on a top surface of the first sealing body along a forming direction of the first sealing body; and a pair of second ribs formed in parallel along both edges of a bottom surface of the first sealing body.
- The first rib may come into contact with the first optical cover and allow elastic deformation.
- The pair of second ribs may come into contact with a bottom surface of the groove and allows elastic deformation.
- The first sealing body may allow elastic deformation between the first and second ribs according to a load and pressure of the first optical cover.
- The housing may further include a first stepped portion formed with a height difference along the outer edge of the groove, and an edge of the first optical cover may come into contact with the first stepped portion.
- The housing may further include a first stepped portion formed with a height difference along the outer edge of the groove, and a thickness of the first optical cover may be equal to a height of the first stepped portion protruding from the outer edge of the groove.
- The housing may further include: a first stepped portion formed with a height difference along the outer edge of the groove; a second stepped portion formed with a height difference on a top surface of the first stepped portion; and a cover press ring pressing an edge of the first optical cover, which comes into contact with the first stepped portion, and the top surface of the first stepped portion.
- An edge of the cover press ring may come into contact with the second stepped portion. A thickness of the first optical cover may be equal to a height of the first stepped portion protruding from the outer edge of the groove. A thickness of the cover press ring may be equal to a height of the second stepped portion protruding from the first stepped portion.
- The housing may further include: a first stepped portion formed with a height difference along the outer edge of the groove; a second stepped portion formed with a height difference on a top surface of the first stepped portion; an outer cover covering a top surface of the second stepped portion and one side of the housing; and a second sealing body disposed on a top surface of the second stepped portion and covered by the outer cover, an edge of the first optical cover comes into contact with the first stepped portion, and a thickness of the first optical cover is equal to a height of the first stepped portion protruding from the outer edge of the groove.
- The housing may further include a cover press ring pressing an edge of the first optical cover, which comes into contact with the first stepped portion, and a top surface of the first stepped portion. A thickness of the cover press ring may be equal to a height of the second stepped portion protruding from the first stepped portion. An edge of the cover press ring may come into contact with the second stepped portion. The second sealing body may press a top surface of the second stepped portion and an upper portion of the cover press ring.
- The housing may further include: a first stepped portion formed with a height difference along the outer edge of the groove; a second stepped portion formed with a height difference on a top surface of the first stepped portion; an outer cover covering a top surface of the second stepped portion and a side of the housing; and a positioning rib formed on the outer cover along a forming direction of the outer cover.
- The housing may further include a second optical cover fixed inside the positioning rib.
- In addition, the term “semiconductor optical device” as used in claims and detailed description refers to an LED chip or the like that includes or uses optical semiconductor.
- The “semiconductor optical device” may include a package-level device with various types of optical semiconductor as well as the above-mentioned LED chip.
- The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention.
-
FIG. 1 is a cross-sectional conceptual diagram illustrating an overall configuration of an optical semiconductor lighting apparatus according to an embodiment of the present invention. -
FIG. 2 is a cross-sectional conceptual diagram illustrating pre-modification states of a first sealing body and first and second ribs, which are essential components of the optical semiconductor lighting apparatus according to the embodiment of the present invention. - Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Throughout the disclosure, like reference numerals refer to like parts throughout the drawings and embodiments of the present invention.
- Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
-
FIG. 1 is a cross-sectional conceptual diagram illustrating an overall configuration of an optical semiconductor lighting apparatus according to an embodiment of the present invention, andFIG. 2 is a cross-sectional conceptual diagram illustrating pre-modification states of a first sealing body and first and second ribs, which are essential components of the optical semiconductor lighting apparatus according to the embodiment of the present invention. - As illustrated in
FIGS. 1 and 2 , the optical semiconductor lighting apparatus includes alight emitting module 100, ahousing 200, afirst sealing body 300, a firstoptical cover 400, afirst rib 310, and asecond rib 320. - The
light emitting module 100 includes one or more semiconductoroptical devices 101 operating as a light source, a circuit board, and a driving circuit (not illustrated) for driving the semiconductoroptical devices 101. - The
housing 200 accommodates thelight emitting module 100, and provides a space for mounting thefirst sealing body 300 and the firstoptical cover 400 to be described below. - The
first sealing body 300 is coupled to agroove 201 recessed in thehousing 200 along edges of thelight emitting module 100 in a polygonal or closed-curve shape. The first sealingbody 300 is provided for maintaining sealing while preventing moisture and foreign substances from flowing into thelight emitting module 100 through the inside of thehousing 200. - The first
optical cover 400 covers the outer edge of thegroove 201 and the top surface of thehousing 200. The firstoptical cover 400 prevents inflow of moisture and foreign substances and protects thelight emitting module 100 such as the semiconductoroptical devices 101 from the exterior by covering the opened top surface of thehousing 200. In addition, the firstoptical cover 400 performs an optical function of diffusing or reducing light emitted from the semiconductoroptical devices 101. - The
first rib 310 is formed on the top surface of the first sealingbody 300 along a forming direction of the first sealingbody 300. Thefirst rib 310 is integrally formed with the first sealingbody 300 and is formed using the same material as thefirst sealing body 300. Thefirst rib 310 primarily disperses and supports a force and pressure applied from the edge of the firstoptical cover 400 while coming into contact with the firstoptical cover 400. - The
second rib 320 is provided with a pair of ribs formed in parallel along both edges of the bottom surface of thefirst sealing body 300. Thesecond rib 320 is integrally formed with the first sealingbody 300 and is formed using the same material as thefirst sealing body 300. Thesecond rib 320 secondarily disperses and supports a force and pressure applied from the edge of the firstoptical cover 400 while coming into contact with thegroove 201. - In addition to the above-described embodiment, the following various embodiments can also be applied to the present invention.
- The first and
second ribs first sealing body 300 as described above, and maintain sealing while appropriately dispersing and supporting a force and pressure applied along a vertical direction of thefirst sealing body 300. - That is, the
first rib 310 comes into contact with the firstoptical cover 400 and allows elastic deformation in a state ofFIG. 2 , as shown in the enlarged portion ofFIG. 1 . The pair ofsecond ribs 320 comes into contact with thebottom surface 201 b of thegroove 201 and allows elastic deformation in a state ofFIG. 2 , as shown in the enlarged portion ofFIG. 1 . - In this case, the
first sealing body 300 allows elastic deformation in a state ofFIG. 2 , as shown in the enlarged portion ofFIG. 1 , according to a load and pressure of the firstoptical cover 400 between the first andsecond ribs - On the other hand, the
housing 200 further includes a first steppedportion 210 formed with a height difference along the outer edge of thegroove 201 in order for connection of the firstoptical cover 400 and sealing maintenance. The edge of the firstoptical cover 400 may come into contact with the first steppedportion 210. - A thickness of the first
optical cover 400 may be equal to a height of the first steppedportion 210 protruding from the outer edge of thegroove 201. - In this case, the
housing 200 may further include a second steppedportion 220 and acover press ring 230. The second steppedportion 220 is formed on the first stepped portion with a height difference with respect to the first steppedportion 210. Thecover press ring 230 presses the edge of the firstoptical cover 400 coming into contact with the first steppedportion 210, and the top surface of the first steppedportion 210. - The edge of the
cover press ring 230 comes into contact with the second steppedportion 220, and thecover press ring 230 presses the firstoptical cover 400 while coming into close contact with the firstoptical cover 400, thereby avoiding the inconvenience of coupling with bolts along the edge of the firstoptical cover 400. - The
cover press ring 230 presses the edge of the firstoptical cover 400, which comes into contact with the first steppedportion 210, and the top surface of the first steppedportion 210. A thickness of thecover press ring 230 is equal to a height of the second steppedportion 220 protruding from the first stepped portion, and the edge of thecover press ring 230 comes into contact with the second steppedportion 220. - On the other hand, the
housing 200 may include anouter cover 240 covering the top surface of the second steppedportion 220 and the side of thehousing 200, and asecond sealing body 250 disposed on the top surface of the steppedportion 220 and covered by theouter cover 240. - When a general-purpose lighting apparatus as well as a lighting apparatus such as canopy light is mounted in the
housing 200, in particular, when a ceiling-recessed lighting apparatus is used, theouter cover 240 prevents moisture from flowing from the ceiling to thelight emitting module 100. - In the
outer cover 240, apositioning rib 242 may be further formed on theouter cover 240 along a forming direction of theouter cover 240. Therefore, a secondoptical cover 260 may be additionally mounted inside thepositioning rib 242. - That is, the
positioning rib 242 allows a user to perform operations while checking and determining an accurate installation position of the optical component, such as the secondoptical cover 260, with his/her naked eye. - When a fixing material, such as silicon, is coated along the edge of the second
optical cover 260 so as to fix the secondoptical cover 260, thepositioning rib 242 prevents the fixing material from flowing into thelight emitting module 100 and allows the installation of additional optical components. - The
second sealing body 250 secondarily blocks moisture and foreign substances introduced through theouter cover 240, and protects the entire apparatus by absorbing or dispersing external shocks applied to the firstoptical cover 400. - For this purpose, the
second sealing body 250 is configured to press the top surface of the second steppedportion 220 and the upper portion of thecover press ring 230. - As described above, the basic technical spirit of the present invention is to provide the optical semiconductor lighting apparatus according to the present invention can prevent penetration of moisture and foreign substances, and improve the durability of the entire apparatus.
- The above-described configurations according to the present invention can obtain the following effects.
- First, since the first sealing body primarily maintains sealing, it is possible to fundamentally prevent inflow of moisture or foreign substances. In addition, while allowing elastic deformation, the first and second ribs formed on the top and bottom surfaces of the first sealing body effectively distribute and support the pressure and force applied to the edges and entire surfaces of the first optical cover to be connected to the housing. Therefore, the durability of the entire apparatus can be improved.
- In particular, since the optical semiconductor lighting apparatus of the present invention can be used for a long time without degradation in sealing performance, products with high reliability can be supplied to consumers.
- While the embodiments of the present invention have been described with reference to the specific embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims.
Claims (11)
1. An optical semiconductor lighting apparatus, comprising:
a housing comprising a groove;
a light-emitting module disposed in the housing, the light-emitting module comprising a semiconductor optical device;
a sealing body disposed in the groove, the sealing body comprising a main portion and a first rib extending from the main portion; and
an optical cover disposed on the housing and covering the groove and the light-emitting module,
wherein a first open space is disposed between the optical cover, the first rib, the main portion of the sealing body, and a side surface of the groove.
2. The optical semiconductor lighting apparatus of claim 1 , wherein the first rib extends from a top surface of the main portion of the sealing body along a forming direction of the sealing body.
3. The optical semiconductor lighting apparatus of claim 2 , wherein the first rib contacts the optical cover.
4. The optical semiconductor lighting apparatus of claim 1 , wherein a pair of second ribs extend in parallel from both edges of a bottom surface of the main portion of the sealing body.
5. The optical semiconductor lighting apparatus of claim 4 , wherein a second open space is disposed between the second ribs, the bottom surface of the main portion of the first sealing body, and a bottom surface of the groove.
6. The optical semiconductor lighting apparatus of claim 1 , wherein the sealing body is configured to elastically deform according to a load and pressure on the optical cover.
7. The optical semiconductor lighting apparatus of claim 5 , wherein the first and second open spaces accommodate elastic deformation of the sealing body in the groove.
8. The optical semiconductor lighting apparatus of claim 5 , wherein the first open space and the second open space are disposed on opposing sides of the sealing body.
9. An optical semiconductor lighting apparatus, comprising:
a light-emitting module comprising a semiconductor optical device;
a housing supporting the light-emitting module, the housing comprising a groove disposed around the light-emitting module;
an optical cover disposed on the housing and covering the light-emitting module and the groove; and
a sealing element disposed in the groove and comprising a body and a first rib that extends from the body and contacts the first optical cover, such that the body is spaced apart from the optical cover by a first air gap disposed on opposing sides of the first rib.
10. The optical semiconductor lighting apparatus of claim 9 , wherein the sealing element further comprises second ribs extending from opposing sides of the body and contacting the bottom of the groove, such that a second air gap is formed between the body and the bottom of the groove.
11. The optical semiconductor lighting apparatus of claim 9 , wherein the first air gap and the second air gap are disposed on opposing sides of the body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/464,185 US20140353711A1 (en) | 2013-05-02 | 2014-08-20 | Optical semiconductor lighting apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130049419A KR20140130884A (en) | 2013-05-02 | 2013-05-02 | Optical semiconductor illuminating apparatus |
KR10-2013-0049419 | 2013-05-02 | ||
US13/920,350 US8841690B1 (en) | 2013-05-02 | 2013-06-18 | Optical semiconductor lighting apparatus |
US14/464,185 US20140353711A1 (en) | 2013-05-02 | 2014-08-20 | Optical semiconductor lighting apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/920,350 Continuation US8841690B1 (en) | 2013-05-02 | 2013-06-18 | Optical semiconductor lighting apparatus |
Publications (1)
Publication Number | Publication Date |
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US20140353711A1 true US20140353711A1 (en) | 2014-12-04 |
Family
ID=51541571
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US13/920,350 Expired - Fee Related US8841690B1 (en) | 2013-05-02 | 2013-06-18 | Optical semiconductor lighting apparatus |
US14/464,185 Abandoned US20140353711A1 (en) | 2013-05-02 | 2014-08-20 | Optical semiconductor lighting apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US13/920,350 Expired - Fee Related US8841690B1 (en) | 2013-05-02 | 2013-06-18 | Optical semiconductor lighting apparatus |
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US (2) | US8841690B1 (en) |
KR (1) | KR20140130884A (en) |
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CN110890450A (en) * | 2018-09-11 | 2020-03-17 | 丰田合成株式会社 | Light emitting device |
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JP6539950B2 (en) * | 2014-06-17 | 2019-07-10 | 日亜化学工業株式会社 | Light emitting device and method of manufacturing light emitting device |
JP6520174B2 (en) * | 2015-02-10 | 2019-05-29 | 株式会社リコー | Housing structure, optical scanning device and image forming apparatus |
PL226400B1 (en) * | 2015-03-18 | 2017-07-31 | Krzysztof Skiba | Lighting installation |
CN105226172B (en) * | 2015-09-08 | 2017-07-14 | 李峰 | Waterproof encapsulation structure and its it is integrally formed handling process |
JP6493769B2 (en) * | 2017-02-15 | 2019-04-03 | カシオ計算機株式会社 | Light source device, projection device, and method of assembling light source device |
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Also Published As
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US8841690B1 (en) | 2014-09-23 |
KR20140130884A (en) | 2014-11-12 |
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