US20140341389A1 - Headset microphone boom assembly - Google Patents
Headset microphone boom assembly Download PDFInfo
- Publication number
- US20140341389A1 US20140341389A1 US14/028,986 US201314028986A US2014341389A1 US 20140341389 A1 US20140341389 A1 US 20140341389A1 US 201314028986 A US201314028986 A US 201314028986A US 2014341389 A1 US2014341389 A1 US 2014341389A1
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- United States
- Prior art keywords
- microphone
- boom
- printed circuit
- flexible printed
- headset
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1075—Mountings of transducers in earphones or headphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
- H04R1/326—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only for microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Definitions
- Arrangements described herein relate to headsets and, more particularly, to headset microphone booms.
- a headset typically includes one or two speakers mounted in a housing to be positioned adjacent a user's ear, or ears, and one or more microphones to detect spoken utterances produced by the user and optionally background noise.
- Some headsets are configured to communicate with audio devices or systems, such as mobile phones or computers, via wired connections.
- headsets may be configured to communicate with such audio devices or systems via a wireless link, such as a Bluetooth® radio frequency link.
- FIG. 1 depicts a headset, which is useful for understanding various arrangements described herein.
- FIG. 2 depicts an enlarged exploded view of a microphone boom of the headset of FIG. 1 , which is useful for understanding various arrangements described herein.
- FIG. 3 depicts an enlarged section view of a distal portion of the microphone boom of the headset of FIG. 1 , taken along section line 3 - 3 , in accordance with one arrangement described herein.
- FIG. 4 depicts an enlarged section view of a distal portion of the microphone boom of the headset of FIG. 1 , taken along section line 3 - 3 , in accordance with another arrangement described herein.
- FIG. 5 depicts an enlarged section view of a near portion of the microphone boom of the headset of FIG. 1 , taken along section line 3 - 3 , which is useful for understanding various arrangements described herein.
- FIG. 6 is a flowchart presenting a method of assembling a boom, which is useful for understanding various arrangements described herein.
- FIG. 1 depicts a headset 100 , which is useful for understanding various arrangements described herein.
- the headset can be configured to communicate with audio devices or systems via a wired connection, a wireless link such as a Bluetooth® radio frequency (RF) link, a personal area network, or via any other suitable communication medium.
- RF radio frequency
- the headset 100 can include at least one audio transducer, such as a speaker 105 configured to be placed proximate to a user's ear. Further, the headset 100 can include a microphone boom assembly (hereinafter “boom”) 110 comprising a boom housing 112 in which at least two microphone transducers (hereinafter “microphones”) 115 , 120 are mounted in a microphone chamber 145 defined at a distal portion 150 of the boom 110 , the portion 150 being distal with respect to a body housing (e.g., a main housing) 170 of the headset 100 .
- the distal portion 150 of the boom 110 can be wider than a near portion 155 of the boom 110 in order to accommodate the microphones 115 , 120 within the microphone chamber 145 of the boom housing 112 .
- the first microphone 115 can be positioned proximate to a first aperture 135 defined in a first side 125 of the boom housing 112 where the microphone chamber 145 is located and the second microphone 120 can be positioned proximate to a second aperture 140 defined in a second side 130 of the boom housing 112 where the microphone chamber 145 is located.
- the second side 130 and the first side 125 can be on opposite sides of the chamber 145 .
- at least a portion of the second side 130 can be generally parallel to at least a portion of the first side 125 .
- the first and second sides 125 , 130 can be separated by a third side 160 and a fourth side 165 , which four sides together define the boom housing 112 , including the microphone chamber 145 .
- Acoustic signals can propagate to the first microphone 115 through the first aperture 135 , and the first microphone 115 can be configured to detect such acoustic signals.
- acoustic signals can propagate to the second microphone 120 through the second aperture 140 , and the second microphone 120 can be configured to detect such acoustic signals.
- the first microphone 115 can primarily detect spoken utterances and other sounds generated by a user wearing the headset 100
- the second microphone 120 can detect background noise, which can be processed by a suitable processor or controller to implement noise cancelling functions.
- the boom 110 can be substantially linear along the second side 130 , or the boom 110 can be curved to place the first aperture 135 closer to the user's face.
- the side 130 can be convex.
- the near portion 155 of the boom 110 can be configured to slidably engage the body housing 170 of the headset 100 .
- the boom 110 can be selectively moved relative to the body housing 170 along an axis 175 between a retracted position and an extended position. In the retracted position, at least part of the near portion 155 of the boom 110 can retract into the body housing 170 of the headset 100 . In the extended position, at least part of the near portion 155 of the boom can extend away from the body housing 170 of the headset 100 .
- a user can slidably adjust the position of the boom 110 as desired.
- FIG. 2 depicts an enlarged exploded view of the boom 110 of FIG. 1 , which is useful for understanding various arrangements described herein.
- the boom 110 can include first structural member 202 defining the first side 125 and a second structural member 204 defining the second side 130 . Together, the structural members 202 , 204 can define the boom housing 112 .
- the first structural member 202 can be made of metal, plastic or any other suitable material.
- the second structural member 204 also can be made of metal, plastic or any other suitable material.
- the first structural member 202 can be made of injection molded plastic and the second structural member 204 can be made of injection molded metal.
- the injection molded plastic can have a thickness of approximately 0.75 mm and the injection molded metal can have a thickness of approximately 0.6 mm, though the present arrangements are not limited in this regard.
- the first aperture 135 can be defined in the first structural member 202 and the second aperture 140 can be defined in the second structural member 204 .
- the first structural member 202 and/or the second structural member 204 can be configured in shape to define the microphone chamber 145 at the distal portion 150 of the boom 110 where the microphones 115 , 120 are positioned within the boom 110 .
- the boom 110 further can include a flexible printed circuit (hereinafter “flex”) 210 mounted between the first and second structural members 202 , 204 .
- the flex 210 can electrically connect the microphones 115 , 120 to a suitable processor or controller of the headset 100 ( FIG. 1 ), for example a processor or controller within the body housing 170 of the headset 100 .
- the flex 210 can include a first side 214 and a second side 216 .
- printed circuit traces can be disposed on and/or or beneath both sides 214 , 216 of a flex body.
- the second side 216 can be generally parallel and opposite to the first side 214 .
- the flex 210 can be a flex strip having a body manufactured of at least one flexible dielectric substrate, such as a flexible polymer film, which in one arrangement, provides the thickness of the flex 210 (i.e., the distance between the sides 214 , 216 ) to be approximately 0.15 mm, or thinner, though the present arrangements are not limited in this regard.
- the flexible polymer film can be a polyamide film, which suitably withstands high temperatures applied during soldering processes used to connect components to the flex 210 .
- the flex 210 could be a rigid-flex circuit strip having a body manufactured of one or more rigid substrates, for example polytetrafluoroethylene, and one or more flexible substrates which are laminated into a semi-rigid structure in which one or more bends may be formed.
- the first microphone 115 can be connected (e.g., both electrically connected and physically attached) to the first side 214 of the flex 210 at a first location and the second microphone 120 can be connected (e.g., both electrically connected and physically attached) to the second side 216 of the flex 210 at a second location.
- the microphones 115 , 120 can be soldered to the flex 115 .
- the first microphone 115 can be carried on the first side 214 of the flex 210 and the second microphone 120 can be carried on the second side 216 of the flex 210 , thus creating a microphone assembly which is carried in the boom 110 .
- the flex 210 can be bent to achieve a desired shape.
- the flex 210 can be mounted into the boom 110 with a bend 218 in the flex 210 positioned between the location where the first microphone 115 is connected to the flex 210 and the location where the second microphone 120 is connected to the flex 210 .
- the bend 218 can be generally S-shaped.
- both microphones 115 , 120 can be bottom ported or both microphones 115 , 120 can be top ported.
- the exclusive use of bottom ported microphones, or the exclusive use of top ported microphones allows the same microphone type to be used for both the microphones 115 , 120 .
- the first microphone 115 can be bottom ported and the second microphone 120 can be top ported, or the first microphone 115 can be top ported and the second microphone 120 can be bottom ported.
- a bottom ported microphone is a microphone configured to detect acoustic signals from a side of the microphone that connects the microphone to a printed circuit board.
- a top ported microphone is a microphone configured to detect acoustic signals from a side of the microphone opposite from the side that connects the microphone to a printed circuit board.
- Bottom ported microphones typically have a lower profile than top ported microphones. For example, one type of bottom ported microphone has a thickness of approximately 0.9 mm, while one type of top ported microphone has a thickness of approximately 1.1 mm. Nonetheless, microphones may be available with thinner profiles, and the present arrangements are not limited in this regard.
- an aperture ( 302 of FIG. 3 —not shown in FIG. 2 ) can be defined in the flex 210 , aligned with an acoustic port of the first microphone 115 , through which acoustic signals propagate to the first microphone 115 .
- Such aperture can align with at least a portion of the aperture 135 .
- an aperture 220 can be defined in the flex 210 , aligned with an acoustic port of the second microphone 120 , through which acoustic signals propagate to the second microphone 120 .
- the aperture 220 can align with at least a portion of the aperture 140 .
- the apertures 302 , 220 need not be defined in the flex 210 .
- the boom 110 further can include a first boom mesh 230 configured to allow flow of acoustic signals through the mesh, while keeping dust out of the first microphone 115 .
- the first boom mesh 230 can be positioned between the first structural member 202 and a first adhesive 232 .
- the first adhesive 232 can be configured to adhere the side 216 of the flex 210 , at the location where the first microphone 115 is connected, to the first boom mesh 230 , and thus to the first structural member 202 .
- the first adhesive 232 can be positioned on the side 216 immediately opposite where the first microphone 115 is connected to the flex 210 on the side 214 .
- An aperture 234 can be defined in the first adhesive 232 to allow passage of acoustic signals through the first adhesive 232 to the first microphone 115 .
- the boom 110 further can include a second boom mesh 240 configured to allow flow of acoustic signals through the mesh, while keeping dust out of the second microphone 120 .
- the second boom mesh 240 can be positioned between the second structural member 204 and a second adhesive 242 .
- the second adhesive 242 can be configured to adhere the side 214 of the flex 210 , at the location where the second microphone 120 is connected, to the second boom mesh 240 , and thus to the second structural member 204 .
- An aperture 244 can be defined in the second adhesive 242 to allow passage of acoustic signals through the second adhesive 242 to the second microphone 120 .
- a third adhesive 250 can be provided to attach the second side 216 of the flex 210 to the first structural member 202 .
- a fourth adhesive 252 can be provided to attach the first side 214 of the flex 210 to the second structural member 204 .
- the flex 210 can be mounted into the boom 110 with a generally U-shaped bend 222 , allowing the flex 210 to bend around the first structural member 202 and connect to a connector in the body housing 170 of the headset 100 ( FIG. 1 ) that provides an electrical connection to the processor or controller.
- an end portion 224 of the flex 210 can be configured to engage the connector.
- the U-shaped bend 222 allows boom 110 to be moved between the retracted position and the extended position while the flex 210 maintains connection to the connector, and thus the processor or controller.
- the U-shaped bend 222 is not stationary on the flex 210 . As the boom 110 is extended or retracted, the flex 210 can adjust accordingly.
- Various tabs (or ribs) 160 , 162 can be defined on the first structural member 202 to guide positioning of the various components 115 , 120 , 210 , 230 , 232 , 240 , 242 within the microphone chamber 145 .
- various tabs (or ribs) 164 can be defined on the first structural member 202 to guide positioning of the flex 210 in the near portion 155 of the boom 110 .
- An aperture 260 can be defined in the first structural member 202 into which a magnet 272 may be inserted.
- the magnet 272 can provide a level of resistance between the boom 110 and the body housing 170 (shown in FIG. 1 ) to hold the boom 110 into a desired position when the position of the boom 110 is adjusted with respect to the body housing 170 .
- the magnet 272 also can trigger a Hall effect sensor (not shown) to generate one or more signals processed by a processor (or controller) to determine the position of the boom 110 with respect to the body housing 170 .
- FIG. 3 depicts an enlarged section view of the distal portion 150 of the boom 110 of FIG. 1 , taken along section line 3 - 3 , in accordance with one arrangement described herein.
- the distal portion 150 is the portion of the boom 110 defining the microphone chamber 145
- the various components 115 , 120 , 210 , 230 , 232 , 240 , 242 can be positioned within the microphone chamber 145 defined between the first structural member 202 and the second structural member 204 .
- FIG. 3 further depicts the aperture 302 in the flex 210 not shown in FIG. 2 .
- the microphones 115 , 120 are bottom ported microphones.
- an acoustic port 304 can be defined in the first microphone 115 to receive acoustic signals
- an acoustic port 306 can be defined in the second microphone 120 to receive acoustic signals.
- the aperture 302 in the flex 210 can be aligned with the acoustic port 304 of the first microphone 115
- the aperture 244 defined in the flex 210 can be aligned with the acoustic port 306 of the second microphone 120 .
- the flex 210 can be mounted into the boom 110 with a bend 218 , for example a generally S-shaped bend, formed in the flex 210 and positioned between the location where the first microphone 115 is connected to the flex 210 and the location where the second microphone 120 is connected to the flex 210 .
- a portion of the flex 210 where the first microphone 115 is connected to the flex 210 can be positioned between the first microphone 115 and the first structural member 202 , for example between the first microphone 115 and the first adhesive 232 .
- a portion of the flex 210 where the second microphone 120 is connected to the flex 210 can be positioned between the second microphone 120 and the second structural member 204 , for example between the first microphone 115 and the second adhesive 242 .
- the thickness 300 of the distal portion 150 of the boom 110 , between the opposing sides 125 , 130 can be equal to or less than approximately 2.8 mm, which is less than one-half of the width of a conventional boom which uses two microphones ported through opposing sides of the boom.
- the present arrangements are not limited to the dimension, however.
- FIG. 4 depicts an enlarged section view of the distal portion 150 of the boom 110 of FIG. 1 , taken along section line 3 - 3 , in accordance with another arrangement described herein.
- the distal portion 150 is the portion of the boom 110 defining the microphone chamber 145
- the various components 115 , 120 , 210 , 230 , 232 , 240 , 242 can be positioned within the microphone chamber 145 defined between the first structural member 202 and the second structural member 204 .
- the microphones 115 , 120 are top ported microphones. Since the microphones 115 , 120 are top ported, apertures need not be defined in the flex 210 to pass acoustic signals to the microphones 115 , 120 . Instead, an acoustic port 402 can be defined in a first side 404 of the first microphone 115 opposing a second side 406 of the first microphone 115 connecting the first microphone 115 to the flexible printed circuit board 210 . Similarly, an acoustic port 408 can be defined in a first side 410 of the second microphone 120 opposing a second side 412 of the second microphone 120 connecting the second microphone 120 to the flexible printed circuit board 210 ,
- the flex 210 can be mounted into the boom 110 with a bend 420 , such as a generally S-shaped bend, formed in the flex 210 and positioned between the location where the first microphone 115 is connected to the flex 210 and the location where the second microphone 120 is connected to the flex 210 .
- a portion of the flex 210 where the first microphone 115 is connected to the flex 210 can be positioned between the first microphone 115 and the second structural member 204 , for example between the first microphone 115 and the second boom mesh 240 .
- a portion of the flex 210 where the second microphone 120 is connected to the flex 210 can be positioned between the second microphone 120 and the first structural member 202 , for example between the first microphone 115 and the first boom mesh 230 .
- the flex 210 can be mounted into the boom 110 with another bend 404 following the contour of the first structural member 202 .
- the first adhesive 232 can adhere the first microphone 115 to the first boom mesh 230 , and thus to the first structural member 202 .
- the second adhesive 242 can adhere the second microphone 120 to the second boom mesh 240 , and thus to the second structural member 204 .
- the thickness 400 of the distal portion 150 of the boom 110 can be equal to or less than approximately 3.0 mm. The present arrangements are not limited to this dimension, however.
- FIG. 5 depicts an enlarged section view of the near portion 155 of the boom 110 of FIG. 1 , taken along section line 3 - 3 , which is useful for understanding various arrangements described herein.
- the flex 210 can be positioned between the first structural member 202 and the second structural member 204 .
- the flex 210 can be adhered to the first structural member using the third adhesive 250 and adhered to the second structural member using the fourth adhesive 252 .
- the thickness 500 of the near portion 155 of the boom 110 between the sides 125 , 130 , can be equal to or less than approximately 1.7 mm, though the present arrangements are not limited in this regard.
- a magnet 272 can be positioned within the aperture 270 , and can trigger a Hall effect sensor (not shown) to allow the controller or processor to determine the position of the boom 110 .
- the magnetic field generated by the magnet 272 can induce a signal on one or more circuit traces in the portion 502 of the flex 210 . This signal can be detected by the Hall effect sensor and processed to determine the position of the boom 110 with respect to the body housing 170 of the headset 100 .
- FIG. 6 is a flowchart presenting a method 600 of assembling a boom, which is useful for understanding various arrangements described herein.
- a first microphone can be connected to a first side of a flexible printed circuit board at a first location.
- a second microphone can be connected to a second side of the flexible printed circuit board at a second location, the second side of the flexible printed circuit board generally parallel and opposite to the first side of the flexible printed circuit board.
- the flexible circuit board can be mounted into the microphone boom, wherein the first microphone is positioned proximate to a first aperture defined in a first side of the microphone boom through which acoustic signals propagate to the first microphone, the second microphone is positioned proximate to a second aperture defined in a second side of the microphone through which the acoustic signals propagate to the second microphone, and a bend is formed in the flexible printed circuit board, the generally bend positioned between the first location and the second location.
- if may be construed to mean “when” or “upon” or “in response to determining” or “in response to detecting,” depending on the context.
- phrase “if it is determined” or “if [a stated condition or event] is detected” may be construed to mean “upon determining” or “in response to determining” or “upon detecting [the stated condition or event]” or “in response to detecting [the stated condition or event],” depending on the context.
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Abstract
Description
- This application claims the benefit of application No. 61/823,707, filed on May 15, 2013, which is fully incorporated herein by reference.
- Arrangements described herein relate to headsets and, more particularly, to headset microphone booms.
- A headset typically includes one or two speakers mounted in a housing to be positioned adjacent a user's ear, or ears, and one or more microphones to detect spoken utterances produced by the user and optionally background noise. Some headsets are configured to communicate with audio devices or systems, such as mobile phones or computers, via wired connections. In other arrangements, headsets may be configured to communicate with such audio devices or systems via a wireless link, such as a Bluetooth® radio frequency link.
-
FIG. 1 depicts a headset, which is useful for understanding various arrangements described herein. -
FIG. 2 depicts an enlarged exploded view of a microphone boom of the headset ofFIG. 1 , which is useful for understanding various arrangements described herein. -
FIG. 3 depicts an enlarged section view of a distal portion of the microphone boom of the headset ofFIG. 1 , taken along section line 3-3, in accordance with one arrangement described herein. -
FIG. 4 depicts an enlarged section view of a distal portion of the microphone boom of the headset ofFIG. 1 , taken along section line 3-3, in accordance with another arrangement described herein. -
FIG. 5 depicts an enlarged section view of a near portion of the microphone boom of the headset ofFIG. 1 , taken along section line 3-3, which is useful for understanding various arrangements described herein. -
FIG. 6 is a flowchart presenting a method of assembling a boom, which is useful for understanding various arrangements described herein. - While the specification concludes with claims defining features of the embodiments described herein that are regarded as novel, it is believed that these embodiments will be better understood from a consideration of the description in conjunction with the drawings. As required, detailed arrangements of the present embodiments are disclosed herein; however, it is to be understood that the disclosed arrangements are merely exemplary of the embodiments, which can be embodied in various forms. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present embodiments in virtually any appropriately detailed structure. Further, the terms and phrases used herein are not intended to be limiting but rather to provide an understandable description of the present arrangements.
- It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numbers may be repeated among the figures to indicate corresponding or analogous features.
-
FIG. 1 depicts aheadset 100, which is useful for understanding various arrangements described herein. The headset can be configured to communicate with audio devices or systems via a wired connection, a wireless link such as a Bluetooth® radio frequency (RF) link, a personal area network, or via any other suitable communication medium. - The
headset 100 can include at least one audio transducer, such as aspeaker 105 configured to be placed proximate to a user's ear. Further, theheadset 100 can include a microphone boom assembly (hereinafter “boom”) 110 comprising aboom housing 112 in which at least two microphone transducers (hereinafter “microphones”) 115, 120 are mounted in amicrophone chamber 145 defined at adistal portion 150 of theboom 110, theportion 150 being distal with respect to a body housing (e.g., a main housing) 170 of theheadset 100. Thedistal portion 150 of theboom 110 can be wider than anear portion 155 of theboom 110 in order to accommodate themicrophones microphone chamber 145 of theboom housing 112. - The
first microphone 115 can be positioned proximate to afirst aperture 135 defined in afirst side 125 of theboom housing 112 where themicrophone chamber 145 is located and thesecond microphone 120 can be positioned proximate to asecond aperture 140 defined in asecond side 130 of theboom housing 112 where themicrophone chamber 145 is located. Thesecond side 130 and thefirst side 125 can be on opposite sides of thechamber 145. In illustration, at least a portion of thesecond side 130 can be generally parallel to at least a portion of thefirst side 125. The first andsecond sides third side 160 and afourth side 165, which four sides together define theboom housing 112, including themicrophone chamber 145. - Acoustic signals can propagate to the
first microphone 115 through thefirst aperture 135, and thefirst microphone 115 can be configured to detect such acoustic signals. Similarly, acoustic signals can propagate to thesecond microphone 120 through thesecond aperture 140, and thesecond microphone 120 can be configured to detect such acoustic signals. Accordingly, thefirst microphone 115 can primarily detect spoken utterances and other sounds generated by a user wearing theheadset 100, and thesecond microphone 120 can detect background noise, which can be processed by a suitable processor or controller to implement noise cancelling functions. - The
boom 110 can be substantially linear along thesecond side 130, or theboom 110 can be curved to place thefirst aperture 135 closer to the user's face. For example, theside 130 can be convex. Further, thenear portion 155 of theboom 110 can be configured to slidably engage thebody housing 170 of theheadset 100. In this regard, theboom 110 can be selectively moved relative to thebody housing 170 along anaxis 175 between a retracted position and an extended position. In the retracted position, at least part of thenear portion 155 of theboom 110 can retract into thebody housing 170 of theheadset 100. In the extended position, at least part of thenear portion 155 of the boom can extend away from thebody housing 170 of theheadset 100. Thus, a user can slidably adjust the position of theboom 110 as desired. -
FIG. 2 depicts an enlarged exploded view of theboom 110 ofFIG. 1 , which is useful for understanding various arrangements described herein. Theboom 110 can include firststructural member 202 defining thefirst side 125 and a secondstructural member 204 defining thesecond side 130. Together, thestructural members boom housing 112. The firststructural member 202 can be made of metal, plastic or any other suitable material. The secondstructural member 204 also can be made of metal, plastic or any other suitable material. For example, the firststructural member 202 can be made of injection molded plastic and the secondstructural member 204 can be made of injection molded metal. In one arrangement, the injection molded plastic can have a thickness of approximately 0.75 mm and the injection molded metal can have a thickness of approximately 0.6 mm, though the present arrangements are not limited in this regard. - The
first aperture 135 can be defined in the firststructural member 202 and thesecond aperture 140 can be defined in the secondstructural member 204. The firststructural member 202 and/or the secondstructural member 204 can be configured in shape to define themicrophone chamber 145 at thedistal portion 150 of theboom 110 where themicrophones boom 110. - The
boom 110 further can include a flexible printed circuit (hereinafter “flex”) 210 mounted between the first and secondstructural members flex 210 can electrically connect themicrophones FIG. 1 ), for example a processor or controller within thebody housing 170 of theheadset 100. Theflex 210 can include afirst side 214 and asecond side 216. In one arrangement, printed circuit traces can be disposed on and/or or beneath bothsides second side 216 can be generally parallel and opposite to thefirst side 214. Theflex 210 can be a flex strip having a body manufactured of at least one flexible dielectric substrate, such as a flexible polymer film, which in one arrangement, provides the thickness of the flex 210 (i.e., the distance between thesides 214, 216) to be approximately 0.15 mm, or thinner, though the present arrangements are not limited in this regard. In one arrangement, the flexible polymer film can be a polyamide film, which suitably withstands high temperatures applied during soldering processes used to connect components to theflex 210. In another arrangement, theflex 210 could be a rigid-flex circuit strip having a body manufactured of one or more rigid substrates, for example polytetrafluoroethylene, and one or more flexible substrates which are laminated into a semi-rigid structure in which one or more bends may be formed. - The
first microphone 115 can be connected (e.g., both electrically connected and physically attached) to thefirst side 214 of theflex 210 at a first location and thesecond microphone 120 can be connected (e.g., both electrically connected and physically attached) to thesecond side 216 of theflex 210 at a second location. For example, themicrophones flex 115. In this regard, thefirst microphone 115 can be carried on thefirst side 214 of theflex 210 and thesecond microphone 120 can be carried on thesecond side 216 of theflex 210, thus creating a microphone assembly which is carried in theboom 110. Being flexible, theflex 210 can be bent to achieve a desired shape. For instance, theflex 210 can be mounted into theboom 110 with abend 218 in theflex 210 positioned between the location where thefirst microphone 115 is connected to theflex 210 and the location where thesecond microphone 120 is connected to theflex 210. Thebend 218 can be generally S-shaped. - Accordingly, even though the
microphones opposite sides flex 210, and ported throughopposite sides boom housing 112, the distance between thesides boom 110 where themicrophone chamber 145 is located can be the same as the distance would be if only one microphone were used. Moreover, rather than requiring the use both of a bottom ported microphone and a top ported microphone, bothmicrophones microphones microphones first microphone 115 can be bottom ported and thesecond microphone 120 can be top ported, or thefirst microphone 115 can be top ported and thesecond microphone 120 can be bottom ported. - A bottom ported microphone is a microphone configured to detect acoustic signals from a side of the microphone that connects the microphone to a printed circuit board. A top ported microphone is a microphone configured to detect acoustic signals from a side of the microphone opposite from the side that connects the microphone to a printed circuit board. Bottom ported microphones typically have a lower profile than top ported microphones. For example, one type of bottom ported microphone has a thickness of approximately 0.9 mm, while one type of top ported microphone has a thickness of approximately 1.1 mm. Nonetheless, microphones may be available with thinner profiles, and the present arrangements are not limited in this regard.
- In the case that the
microphones FIG. 2 ) can be defined in theflex 210, aligned with an acoustic port of thefirst microphone 115, through which acoustic signals propagate to thefirst microphone 115. Such aperture can align with at least a portion of theaperture 135. Similarly, anaperture 220 can be defined in theflex 210, aligned with an acoustic port of thesecond microphone 120, through which acoustic signals propagate to thesecond microphone 120. Theaperture 220 can align with at least a portion of theaperture 140. In the case that the microphones are top ported microphones, theapertures flex 210. - The
boom 110 further can include afirst boom mesh 230 configured to allow flow of acoustic signals through the mesh, while keeping dust out of thefirst microphone 115. Thefirst boom mesh 230 can be positioned between the firststructural member 202 and afirst adhesive 232. Thefirst adhesive 232 can be configured to adhere theside 216 of theflex 210, at the location where thefirst microphone 115 is connected, to thefirst boom mesh 230, and thus to the firststructural member 202. Thefirst adhesive 232 can be positioned on theside 216 immediately opposite where thefirst microphone 115 is connected to theflex 210 on theside 214. Anaperture 234 can be defined in thefirst adhesive 232 to allow passage of acoustic signals through thefirst adhesive 232 to thefirst microphone 115. - The
boom 110 further can include asecond boom mesh 240 configured to allow flow of acoustic signals through the mesh, while keeping dust out of thesecond microphone 120. Thesecond boom mesh 240 can be positioned between the secondstructural member 204 and asecond adhesive 242. Thesecond adhesive 242 can be configured to adhere theside 214 of theflex 210, at the location where thesecond microphone 120 is connected, to thesecond boom mesh 240, and thus to the secondstructural member 204. Anaperture 244 can be defined in thesecond adhesive 242 to allow passage of acoustic signals through thesecond adhesive 242 to thesecond microphone 120. Athird adhesive 250 can be provided to attach thesecond side 216 of theflex 210 to the firststructural member 202. Similarly, afourth adhesive 252 can be provided to attach thefirst side 214 of theflex 210 to the secondstructural member 204. - The
flex 210 can be mounted into theboom 110 with a generallyU-shaped bend 222, allowing theflex 210 to bend around the firststructural member 202 and connect to a connector in thebody housing 170 of the headset 100 (FIG. 1 ) that provides an electrical connection to the processor or controller. In illustration, anend portion 224 of theflex 210 can be configured to engage the connector. TheU-shaped bend 222 allowsboom 110 to be moved between the retracted position and the extended position while theflex 210 maintains connection to the connector, and thus the processor or controller. In this regard, theU-shaped bend 222 is not stationary on theflex 210. As theboom 110 is extended or retracted, theflex 210 can adjust accordingly. - Various tabs (or ribs) 160, 162 can be defined on the first
structural member 202 to guide positioning of thevarious components microphone chamber 145. Similarly, various tabs (or ribs) 164 can be defined on the firststructural member 202 to guide positioning of theflex 210 in thenear portion 155 of theboom 110. - An aperture 260 can be defined in the first
structural member 202 into which amagnet 272 may be inserted. Themagnet 272 can provide a level of resistance between theboom 110 and the body housing 170 (shown inFIG. 1 ) to hold theboom 110 into a desired position when the position of theboom 110 is adjusted with respect to thebody housing 170. Themagnet 272 also can trigger a Hall effect sensor (not shown) to generate one or more signals processed by a processor (or controller) to determine the position of theboom 110 with respect to thebody housing 170. -
FIG. 3 depicts an enlarged section view of thedistal portion 150 of theboom 110 ofFIG. 1 , taken along section line 3-3, in accordance with one arrangement described herein. As noted, thedistal portion 150 is the portion of theboom 110 defining themicrophone chamber 145, and thevarious components microphone chamber 145 defined between the firststructural member 202 and the secondstructural member 204.FIG. 3 further depicts theaperture 302 in theflex 210 not shown inFIG. 2 . - In the arrangement depicted in
FIG. 3 , themicrophones acoustic port 304 can be defined in thefirst microphone 115 to receive acoustic signals, and anacoustic port 306 can be defined in thesecond microphone 120 to receive acoustic signals. Theaperture 302 in theflex 210 can be aligned with theacoustic port 304 of thefirst microphone 115, and theaperture 244 defined in theflex 210 can be aligned with theacoustic port 306 of thesecond microphone 120. - The
flex 210 can be mounted into theboom 110 with abend 218, for example a generally S-shaped bend, formed in theflex 210 and positioned between the location where thefirst microphone 115 is connected to theflex 210 and the location where thesecond microphone 120 is connected to theflex 210. A portion of theflex 210 where thefirst microphone 115 is connected to theflex 210 can be positioned between thefirst microphone 115 and the firststructural member 202, for example between thefirst microphone 115 and thefirst adhesive 232. Similarly, a portion of theflex 210 where thesecond microphone 120 is connected to theflex 210 can be positioned between thesecond microphone 120 and the secondstructural member 204, for example between thefirst microphone 115 and thesecond adhesive 242. - In one arrangement, the
thickness 300 of thedistal portion 150 of theboom 110, between the opposingsides -
FIG. 4 depicts an enlarged section view of thedistal portion 150 of theboom 110 ofFIG. 1 , taken along section line 3-3, in accordance with another arrangement described herein. As noted, thedistal portion 150 is the portion of theboom 110 defining themicrophone chamber 145, and thevarious components microphone chamber 145 defined between the firststructural member 202 and the secondstructural member 204. - In the arrangement depicted in
FIG. 4 , themicrophones microphones flex 210 to pass acoustic signals to themicrophones acoustic port 402 can be defined in afirst side 404 of thefirst microphone 115 opposing asecond side 406 of thefirst microphone 115 connecting thefirst microphone 115 to the flexible printedcircuit board 210. Similarly, anacoustic port 408 can be defined in afirst side 410 of thesecond microphone 120 opposing asecond side 412 of thesecond microphone 120 connecting thesecond microphone 120 to the flexible printedcircuit board 210, - Again, the
flex 210 can be mounted into theboom 110 with abend 420, such as a generally S-shaped bend, formed in theflex 210 and positioned between the location where thefirst microphone 115 is connected to theflex 210 and the location where thesecond microphone 120 is connected to theflex 210. In contrast toFIG. 3 , a portion of theflex 210 where thefirst microphone 115 is connected to theflex 210 can be positioned between thefirst microphone 115 and the secondstructural member 204, for example between thefirst microphone 115 and thesecond boom mesh 240. Similarly, a portion of theflex 210 where thesecond microphone 120 is connected to theflex 210 can be positioned between thesecond microphone 120 and the firststructural member 202, for example between thefirst microphone 115 and thefirst boom mesh 230. Theflex 210 can be mounted into theboom 110 with anotherbend 404 following the contour of the firststructural member 202. - The
first adhesive 232 can adhere thefirst microphone 115 to thefirst boom mesh 230, and thus to the firststructural member 202. Thesecond adhesive 242 can adhere thesecond microphone 120 to thesecond boom mesh 240, and thus to the secondstructural member 204. In one arrangement, thethickness 400 of thedistal portion 150 of theboom 110, between the opposingsides -
FIG. 5 depicts an enlarged section view of thenear portion 155 of theboom 110 ofFIG. 1 , taken along section line 3-3, which is useful for understanding various arrangements described herein. In thenear portion 155 of the boom, theflex 210 can be positioned between the firststructural member 202 and the secondstructural member 204. Theflex 210 can be adhered to the first structural member using thethird adhesive 250 and adhered to the second structural member using thefourth adhesive 252. Thethickness 500 of thenear portion 155 of theboom 110, between thesides - As noted, a
magnet 272 can be positioned within theaperture 270, and can trigger a Hall effect sensor (not shown) to allow the controller or processor to determine the position of theboom 110. Specifically, as themagnet 272 moves past aportion 502 of theflex 210 external to theboom 110 when theboom 100 is moved relative to thebody housing 170 of the headset 100 (FIG. 1 ), the magnetic field generated by themagnet 272 can induce a signal on one or more circuit traces in theportion 502 of theflex 210. This signal can be detected by the Hall effect sensor and processed to determine the position of theboom 110 with respect to thebody housing 170 of theheadset 100. -
FIG. 6 is a flowchart presenting amethod 600 of assembling a boom, which is useful for understanding various arrangements described herein. Atstep 605, a first microphone can be connected to a first side of a flexible printed circuit board at a first location. Atstep 610, a second microphone can be connected to a second side of the flexible printed circuit board at a second location, the second side of the flexible printed circuit board generally parallel and opposite to the first side of the flexible printed circuit board. Atstep 615, the flexible circuit board can be mounted into the microphone boom, wherein the first microphone is positioned proximate to a first aperture defined in a first side of the microphone boom through which acoustic signals propagate to the first microphone, the second microphone is positioned proximate to a second aperture defined in a second side of the microphone through which the acoustic signals propagate to the second microphone, and a bend is formed in the flexible printed circuit board, the generally bend positioned between the first location and the second location. - Like numbers have been used to refer to the same items throughout this specification. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The terms “a” and “an,” as used herein, are defined as one or more than one. The term “plurality,” as used herein, is defined as two or more than two. The term “another,” as used herein, is defined as at least a second or more. The term “and/or” as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will also be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms, as these terms are only used to distinguish one element from another unless stated otherwise or the context indicates otherwise.
- Reference throughout this specification to “one arrangement,” “an arrangement,” or similar language means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one arrangement disclosed within this specification. Thus, appearances of the phrases “in one arrangement,” “in an arrangement,” and similar language throughout this specification may, but do not necessarily, all refer to the same arrangement.
- The term “if” may be construed to mean “when” or “upon” or “in response to determining” or “in response to detecting,” depending on the context. Similarly, the phrase “if it is determined” or “if [a stated condition or event] is detected” may be construed to mean “upon determining” or “in response to determining” or “upon detecting [the stated condition or event]” or “in response to detecting [the stated condition or event],” depending on the context.
- The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the embodiments disclosed within this specification have been presented for purposes of illustration and description, but are not intended to be exhaustive or limited to the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the embodiments of the invention. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the inventive arrangements for various embodiments with various modifications as are suited to the particular use contemplated.
- These embodiments can be embodied in other forms without departing from the spirit or essential attributes thereof. Accordingly, reference should be made to the following claims, rather than to the foregoing specification, as indicating the scope of the embodiments.
Claims (20)
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US14/028,986 US8976957B2 (en) | 2013-05-15 | 2013-09-17 | Headset microphone boom assembly |
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US201361823707P | 2013-05-15 | 2013-05-15 | |
US14/028,986 US8976957B2 (en) | 2013-05-15 | 2013-09-17 | Headset microphone boom assembly |
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US20140341389A1 true US20140341389A1 (en) | 2014-11-20 |
US8976957B2 US8976957B2 (en) | 2015-03-10 |
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US14/028,986 Active US8976957B2 (en) | 2013-05-15 | 2013-09-17 | Headset microphone boom assembly |
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CN109889936A (en) * | 2019-03-29 | 2019-06-14 | 宁波高新区敦和科技有限公司 | A kind of industry and civilian dual-purpose microphone |
CN113923548A (en) * | 2021-10-26 | 2022-01-11 | 深圳市冠平电子有限公司 | Microphone rod, earphone and microphone rod manufacturing method |
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US20180098145A1 (en) * | 2016-10-03 | 2018-04-05 | Vocollect, Inc. | Communication headsets and systems for mobile application control and power savings |
CN109889935A (en) * | 2019-03-04 | 2019-06-14 | 庄谦丰 | A kind of industry and civilian dual-purpose wireless microphone |
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CN114727189A (en) * | 2022-04-15 | 2022-07-08 | 天津大学 | Flexible split type bone conduction communication earphone |
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