US20140313669A1 - Liquid cooling system for modular electronic systems - Google Patents
Liquid cooling system for modular electronic systems Download PDFInfo
- Publication number
- US20140313669A1 US20140313669A1 US14/322,973 US201414322973A US2014313669A1 US 20140313669 A1 US20140313669 A1 US 20140313669A1 US 201414322973 A US201414322973 A US 201414322973A US 2014313669 A1 US2014313669 A1 US 2014313669A1
- Authority
- US
- United States
- Prior art keywords
- cooling body
- shelf
- electronic device
- integrated circuit
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the present invention relates to cooling systems and, more particularly, to a cooling system for integrated circuits of modular electronic devices and to modular electronic devices adapted to be cooled by such a system.
- the internal conduits supply cool fluid to, and remove hot fluid from, a heat transfer unit that is in permanent thermal contact with an integrated circuit (specifically, a processor) that is mounted on the circuit board.
- the internal conduits are provided with fittings for reversibly connecting the internal conduits to external conduits that supply cool fluid to the circuit board and send hot fluid to a heat exchanger to be cooled and recycled.
- Such cooling systems suffer from the disadvantage that the fittings are liable to leak, especially when one circuit board is swapped for another circuit board, thereby wasting cooling fluid and running the risk, if the cooling fluid is electrically conductive, of shorting out the integrated circuit.
- a system for cooling an integrated circuit of an electronic device including: (a) a cooling body; (b) a shelf, positioned relative to the cooling body for reversible insertion of the electronic device onto the shelf such that upon the reversible insertion, the cooling body comes into thermal contact with the integrated circuit; (c) an input conduit, in fluid communication with the cooling body, for introducing a fluid into the cooling body; and (d) an output conduit, in fluid communication with the cooling body, for receiving the fluid from the cooling body.
- an electronic device including: (a) a housing including a base; and (b) an integrated circuit, positioned on the base so that when the electronic device is reversibly inserted onto a shelf of a system that also includes a cooling body, the cooling body enters the housing and comes into thermal contact with the integrated circuit.
- a method of cooling an integrated circuit of an electronic device including the steps of (a) providing a cooling body and a shelf; (b) configuring the electronic device, and positioning the shelf relative to the cooling body, so that when the electronic device is inserted reversibly onto the shelf, the cooling body comes into thermal contact with the integrated circuit;(c)introducing a heat-absorbing fluid to the cooling body via an input conduit; (d) inserting the electronic device onto the shelf; and (e) withdrawing at least a portion of the fluid from the cooling body via an output conduit.
- a method of operating a pair of electronic devices including a respective integrated circuit, including the steps of: (a) providing a cooling body and a shelf; (b) configuring the electronic devices, and positioning the shelf relative to the cooling body, so that when either one of the electronic devices is inserted reversibly onto the shelf, the cooling body comes into thermal contact with the respective integrated circuit of that electronic device; (c) introducing a heat-absorbing fluid to the cooling body; (d) withdrawing at least a portion of the fluid from the cooling body via an output conduit; (e) inserting a first one of the electronic devices onto the shelf; (f) removing the first electronic device from the shelf; and (g) inserting a second one of the electronic devices onto the shelf.
- a basic system of the present invention for cooling an integrated circuit of an electronic device, includes a cooling body, a shelf, an input conduit and an output conduit.
- the shelf is positioned relative to the cooling body so that the electronic device can be reversibly inserted onto the shelf so that, when the electronic device is fully inserted onto the shelf, the cooling body comes into thermal contact with the integrated circuit.
- the input and output conduits are in fluid communication with the cooling body.
- the input conduit is for introducing a heat-absorbing fluid, i.e., a fluid having a lower temperature than the operating temperature of the integrated circuit, into the cooling body.
- the output conduit is for receiving the fluid from the cooling body.
- the system includes a barrier for guiding the insertion of the electronic device onto the shelf so that the cooling body comes into thermal contact with the integrated circuit.
- this barrier includes the backplane of the rack and the sides of the cooling body.
- the cooling body covers substantially all of the integrated circuit.
- the system also includes a mechanism for maintaining the cooling body in thermal contact with the integrated circuit.
- the system also includes a mechanism for protecting the integrated circuit from damage as the electronic device is inserted onto the shelf.
- the fluid could be a gas, but in practice the fluid almost always is a liquid because liquids have much higher heat capacities than gases.
- the input and output conduits are rigidly attached to the cooling body.
- the system also includes a heat exchanger, operatively coupled to the output conduit, for removing heat from the fluid that is received by the output conduit.
- the heat exchanger also recycles the cooled fluid to the input conduit.
- the system also includes a mechanism for forcing a gas such as air to flow past the output conduit.
- a gas such as air
- the gas also flows past the input conduit, but the main purpose of the gas flow is to cool the output conduit.
- a basic rack of the present invention includes several instances of the system.
- the basic rack also includes a supply conduit for supplying the fluid to the input conduits and a drain conduit for receiving the fluid from the output conduits.
- the rack also includes a heat exchanger, operatively coupled to the output conduits, for removing heat from the fluid that is received by the output conduits.
- the heat exchanger also recycles the cooled fluid to the input conduits.
- the rack also includes a mechanism for forcing a gas such as air to flow past the output conduits.
- a gas such as air
- the gas also flows past the input conduits, but the main purpose of the gas flow is to cool the output conduits.
- a basic electronic device of the present invention includes a housing and an integrated circuit.
- the housing includes a base.
- the integrated circuit is positioned on the base so that when the electronic device is reversibly inserted onto a shelf of a basic system of the present invention, the cooling body enters the housing and comes into thermal contact with the integrated circuit.
- the housing of the electronic device also includes a rearward gap.
- the cooling body enters the housing via the rearward gap and comes into thermal contact with the integrated circuit.
- the housing of the electronic device also includes a wall that includes a ventilation aperture.
- the housing of the electronic device also includes a top positioned relative to the base so as to maintain the cooling body in thermal contact with the integrated circuit after the electronic device has been inserted onto the shelf.
- the electronic device also includes a mechanism for protecting the integrated circuit from damage as the electronic device is inserted onto the shelf.
- a cooling body and a shelf are provided.
- the electronic device is configured, and the shelf is positioned relative to the cooling body, so that when the electronic device is inserted reversibly onto the shelf, the cooling body comes into thermal contact with the integrated circuit.
- a heat-absorbing fluid i.e., a fluid having a lower temperature than the operating temperature of the integrated circuit, is introduced to the cooling body via an input conduit, and the electronic device is inserted onto the shelf. At least a portion of the fluid is withdrawn from the cooling body via an output conduit.
- heat is withdrawn from the at least portion of the fluid that is withdrawn from the cooling body.
- the at least portion of the fluid from which the heat has been withdrawn is re-introduced to the cooling body.
- a gas is forced to flow past the output conduit.
- the electronic device may be removed from the shelf at any time subsequent to the insertion of the electronic device onto the shelf.
- a cooling body and a shelf are provided.
- the electronic devices are configured, and the shelf is positioned relative to the cooling body, so that when either one of the electronic devices is inserted reversibly onto the shelf, the cooling body comes into thermal contact with the respective integrated circuit of that electronic device.
- a heat-absorbing fluid is introduced to the cooling body via an input conduit, with at least a portion of the fluid being withdrawn from the cooling body via an output conduit, and a first one of the electronic devices is inserted onto the shelf. Later, the first electronic device is removed from, the shelf and the other electronic device is inserted onto the shelf.
- FIG. 1 is a partially cut-away perspective view of a rack of the present invention
- FIG. 2 shows the rack of FIG. 1 together with an electronic device of the present invention
- FIG. 3 is a cut-away side view of the rack of FIG. 1 with an electronic device of the present invention installed on one of the shelves;
- FIGS. 4A and 4B show two stages in the insertion of one embodiment of the electronic device onto a shelf of one embodiment of the rack;
- FIGS. 5A and 5B show two stages in the insertion of another embodiment of the electronic device onto a shelf of another embodiment of the rack.
- FIG. 1 is a partially cut-away perspective view of a rack 10 for the installation therein of six electronic devices such as electronic device 50 that is illustrated in FIG. 2 .
- Rack 10 includes six shelves 12 . Each shelf is provided with a respective cooling body 14 for cooling an integrated circuit of the electronic device that is mounted on the corresponding shelf 12 .
- Cooling bodies 14 are hollow boxes made of a thermally conductive material such as copper or aluminum. Each cooling body 14 is provided with an input conduit 16 for introducing a cooling fluid to cooling body 14 and an output conduit 18 for receiving the heated cooling fluid from cooling body 14 . In some embodiments, cooling body 14 is merely a box in which the cooling fluid flows freely. In other embodiments, cooling body 14 includes a spiral, helical or serpentine pipe that connects to input conduit 16 and to output conduit 18 and that occupies most of the interior of cooling body 14 by virtue of having a shape such as a spiral, helical or serpentine shape, and the flow of the cooling fluid within cooling body 14 is confined to the serpentine pipe.
- the cooling fluid typically is water.
- the cooling fluid could be a different fluid, for example a propylene-glycol-based antifreeze.
- Input conduits 16 are connected to a supply conduit 20 that supplies cool cooling fluid to input conduits 16 .
- Output conduits 18 are connected to a drain conduit 22 that receives hot cooling fluid from output conduits 18 .
- the hot cooling fluid is carried by drain conduit 22 to a heat exchanger 24 where the hot cooling fluid is cooled for recycling to cooling bodies 14 via supply conduit 20 and input conduits 16 .
- heat exchanger 24 is a radiator that uses forced air circulation to remove the heat from the cooling fluid.
- the circulation of the cooling fluid through conduits 16 , 18 , 20 and 22 and through heat exchanger 24 could be convective circulation, or alternatively could be forced circulation that is driven by a pump.
- the arrows in FIG. 1 show the direction of the circulation of the cooling fluid.
- Heat exchanger 24 could be physically separate from rack 10 (apart from being in fluid communication with conduits 20 and 22 ), and even, in a different room than rack 10 .
- Rack 10 also includes a backplane 26 . More details of backplane 26 are provided below in connection with FIG. 3 .
- FIG. 2 shows an electronic device 50 , for example a field replaceable unit, of a type that is adapted to have its integrated circuit 52 cooled by a cooling body 14 , positioned for insertion onto a shelf 12 .
- Device 50 includes a housing 54 that in turn includes a base 56 , a top 60 , two side walls 62 and a front wall 64 .
- the electronic components of device 50 include an integrated circuit 52 , on base 56 , that needs to be cooled by cooling body 14 .
- the electrical components of device 50 include two plugs 72 for plugging into backplane 26 as described below in connection with FIG. 3 .
- Device 50 is installed in rack 10 by being placed on the appropriate shelf 12 and being slid towards backplane 26 until cooling body 14 covers integrated circuit 52 .
- conduits 16 and 18 are sufficiently flexible to provide limited up and down movement of cooling body 14 , to facilitate the installation of device 50 onto shelf 12 with cooling body 14 covering integrated circuit 52 .
- FIG. 3 is a cut-away side view of rack 10 , showing two electronic devices 50 installed on one of shelves 12 . More precisely, only integrated circuits 52 and bases 56 of the electronic devices 50 , and one of plugs 72 of one of the electronic devices 50 , are shown in FIG. 3 .
- cooling body 14 rests on top of integrated circuit 52 , covering the entire top surface of integrated circuit 52 , and in thermal contact with integrated circuit 52 .
- Plug 72 is shown plugged into a backplane connector 28 of backplane 26 , for providing electrical power to electronic device 50 and for providing an avenue of wired communication between this electronic device 50 and other electronic devices 50 that are installed in rack 10 .
- the walls of plugs 72 that face each other define a gap 68 therebetween through which cooling body 14 passes to enter housing 54 as device 50 is inserted onto shelf 12 .
- gap 68 is about as wide as cooling body 14 , so that the inner side walls of plugs 72 serve as guides for the correct lateral positioning of device 50 on shelf 12 for cooling body 14 to cover integrated circuit 52 .
- Backplane 26 serves as a backstop for the insertion of device 50 onto shelf 12 to ensure that housing 50 is not inserted too far into rack 10 for cooling body 14 to cover integrated circuit 52 .
- Gap 68 is an example of what is termed a “rearward” gap in the appended claims, and is “rearward.” in the sense that gap 68 is in the portion of electronic device 50 that is inmost on rack 10 (closest to backplane 26 ) when electronic device 50 is installed on a shelf 12 of rack 10 .
- FIG. 3 also shows that the cooling provided by the cooling fluid is supplemented by forced air cooling induced by a fan 30 .
- the single-beaded arrows in FIG. 3 show the direction of the flow of the cooling air.
- the double-headed arrow in FIG. 3 indicates that conduits 16 and 18 are sufficiently flexible to provide limited up and down movement of cooling body 14 .
- front wall 64 of electronic device 50 includes ventilation holes 70 to facilitate the circulation. of cooling air into and out of housing 54 .
- FIGS. 1-3 show a rack 10 all of whose shelves 12 face in the same direction.
- the scope of the present invention also includes two-sided racks whose shelves face in opposite directions, away from a midplane that has the same functionality as backplane 26 : providing connectors for electrical power and avenues of wired communication for the electronic devices installed on the rack, and serving as a backstop for the insertion of the electronic devices so that the rack's cooling bodies cover the integrated circuits of the electronic devices.
- Electronic devices 50 are modular in the sense that not all shelves 12 need be occupied by electronic devices 50 . Indeed, FIG. 3 shows only two out of six shelves 12 occupied by electronic devices 50 .
- FIGS. 4A and 4B show two stages in the installation of one embodiment of electronic device 50 onto a shelf 12 of one embodiment of rack 10 .
- each cooling body 14 is provided with a curved forward shield 32 to keep cooling body 14 from damaging integrated circuit 52 as electronic device 50 is slid (rightward in FIGS. 4A and 4B ) onto shelf 12 .
- FIG. 4A shows the situation as integrated circuit 52 begins to come in contact with shield 32 .
- FIG. 4B shows the situation after the electronic device has been fully inserted onto shelf 12 with cooling body 14 now completely covering integrated circuit 52 .
- top 60 presses down on cooling body 14 to maintain the thermal contact between cooling body 14 and integrated circuit 52 .
- conduits 16 and 18 are flexible enough to allow integrated circuit 52 to be inserted beneath cooling body 14 , but are rigid enough to urge cooling body 14 downward to maintain the thermal contact of cooling body 14 with integrated circuit 52 once integrated circuit 52 has been inserted beneath cooling body 14 .
- FIGS. 5A and 5B show two stages in the installation of another embodiment of electronic device 50 onto a shelf 12 of another embodiment of rack 10 .
- a ramp 74 is installed rearward of integrated circuit 52 on base 56 of each electronic device SO to keep cooling body 14 from damaging integrated circuit 52 as electronic device 50 is slid (rightward in FIGS. 5A and 5B ) onto shelf 12 .
- conduits 16 and 18 are flexible enough to allow integrated circuit 52 to be inserted beneath cooling body 14 but are rigid enough to urge cooling body 14 downward to maintain the thermal contact of cooling body 14 with integrated circuit 52 once integrated circuit 52 has been inserted beneath cooling body 14 .
- That electronic device 50 is easily inserted onto shelf 12 and removed from shelf 12 makes it easy to replace a defective or obsolescent electronic device SO with a replacement electronic device 50 as needed.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- The present invention relates to cooling systems and, more particularly, to a cooling system for integrated circuits of modular electronic devices and to modular electronic devices adapted to be cooled by such a system.
- As the components of integrated circuits become ever smaller and faster, the heal: generated by these circuits increases, to the point that absent active cooling of the circuits, this heat is liable to damage or destroy the circuits. Fans for blowing air over integrated circuits to cool them long have been a feature of personal computers. Such forced air cooling is inadequate, in and of itself, for many modern integrated circuits. Therefore, liquids, such as water, that have much higher heat capacities than gases such as air, have begun to be used to cool integrated circuits. For example, Hamman, in U.S. Pat. No. 6,999,316, that is incorporated by reference for all, purposes as if fully set forth herein, teaches providing a printed circuit board with internal conduits for a cooling fluid. The internal conduits supply cool fluid to, and remove hot fluid from, a heat transfer unit that is in permanent thermal contact with an integrated circuit (specifically, a processor) that is mounted on the circuit board. The internal conduits are provided with fittings for reversibly connecting the internal conduits to external conduits that supply cool fluid to the circuit board and send hot fluid to a heat exchanger to be cooled and recycled. Such cooling systems suffer from the disadvantage that the fittings are liable to leak, especially when one circuit board is swapped for another circuit board, thereby wasting cooling fluid and running the risk, if the cooling fluid is electrically conductive, of shorting out the integrated circuit.
- It would be highly advantageous to have a cooling system for electronic devices that uses a fluid to cool the devices' integrated circuits without risking such leakage.
- According to the present invention there is provided a system for cooling an integrated circuit of an electronic device, including: (a) a cooling body; (b) a shelf, positioned relative to the cooling body for reversible insertion of the electronic device onto the shelf such that upon the reversible insertion, the cooling body comes into thermal contact with the integrated circuit; (c) an input conduit, in fluid communication with the cooling body, for introducing a fluid into the cooling body; and (d) an output conduit, in fluid communication with the cooling body, for receiving the fluid from the cooling body.
- According to the present invention there is provided an electronic device including: (a) a housing including a base; and (b) an integrated circuit, positioned on the base so that when the electronic device is reversibly inserted onto a shelf of a system that also includes a cooling body, the cooling body enters the housing and comes into thermal contact with the integrated circuit.
- According to the present invention there is provided a method of cooling an integrated circuit of an electronic device, including the steps of (a) providing a cooling body and a shelf; (b) configuring the electronic device, and positioning the shelf relative to the cooling body, so that when the electronic device is inserted reversibly onto the shelf, the cooling body comes into thermal contact with the integrated circuit;(c)introducing a heat-absorbing fluid to the cooling body via an input conduit; (d) inserting the electronic device onto the shelf; and (e) withdrawing at least a portion of the fluid from the cooling body via an output conduit.
- According to the present invention there is provided a method of operating a pair of electronic devices, each electronic device including a respective integrated circuit, including the steps of: (a) providing a cooling body and a shelf; (b) configuring the electronic devices, and positioning the shelf relative to the cooling body, so that when either one of the electronic devices is inserted reversibly onto the shelf, the cooling body comes into thermal contact with the respective integrated circuit of that electronic device; (c) introducing a heat-absorbing fluid to the cooling body; (d) withdrawing at least a portion of the fluid from the cooling body via an output conduit; (e) inserting a first one of the electronic devices onto the shelf; (f) removing the first electronic device from the shelf; and (g) inserting a second one of the electronic devices onto the shelf.
- A basic system of the present invention, for cooling an integrated circuit of an electronic device, includes a cooling body, a shelf, an input conduit and an output conduit. The shelf is positioned relative to the cooling body so that the electronic device can be reversibly inserted onto the shelf so that, when the electronic device is fully inserted onto the shelf, the cooling body comes into thermal contact with the integrated circuit. The input and output conduits are in fluid communication with the cooling body. The input conduit is for introducing a heat-absorbing fluid, i.e., a fluid having a lower temperature than the operating temperature of the integrated circuit, into the cooling body. The output conduit is for receiving the fluid from the cooling body.
- Preferably, the system includes a barrier for guiding the insertion of the electronic device onto the shelf so that the cooling body comes into thermal contact with the integrated circuit. In the preferred embodiments described below, this barrier includes the backplane of the rack and the sides of the cooling body.
- Preferably, after the electronic device has been fully inserted onto the shelf, the cooling body covers substantially all of the integrated circuit.
- Preferably, the system also includes a mechanism for maintaining the cooling body in thermal contact with the integrated circuit.
- Preferably, the system also includes a mechanism for protecting the integrated circuit from damage as the electronic device is inserted onto the shelf.
- In principle, the fluid could be a gas, but in practice the fluid almost always is a liquid because liquids have much higher heat capacities than gases.
- Preferably, the input and output conduits are rigidly attached to the cooling body.
- Preferably, the system also includes a heat exchanger, operatively coupled to the output conduit, for removing heat from the fluid that is received by the output conduit. Most preferably, the heat exchanger also recycles the cooled fluid to the input conduit.
- Preferably, the system also includes a mechanism for forcing a gas such as air to flow past the output conduit. Generally, the gas also flows past the input conduit, but the main purpose of the gas flow is to cool the output conduit.
- A basic rack of the present invention includes several instances of the system. The basic rack also includes a supply conduit for supplying the fluid to the input conduits and a drain conduit for receiving the fluid from the output conduits.
- Preferably, the rack also includes a heat exchanger, operatively coupled to the output conduits, for removing heat from the fluid that is received by the output conduits. Most preferably, the heat exchanger also recycles the cooled fluid to the input conduits.
- Preferably, the rack also includes a mechanism for forcing a gas such as air to flow past the output conduits. Generally, the gas also flows past the input conduits, but the main purpose of the gas flow is to cool the output conduits.
- A basic electronic device of the present invention includes a housing and an integrated circuit. The housing includes a base. The integrated circuit is positioned on the base so that when the electronic device is reversibly inserted onto a shelf of a basic system of the present invention, the cooling body enters the housing and comes into thermal contact with the integrated circuit.
- Preferably, the housing of the electronic device also includes a rearward gap. When the electronic device is reversibly inserted onto the shelf, the cooling body enters the housing via the rearward gap and comes into thermal contact with the integrated circuit.
- Preferably, the housing of the electronic device also includes a wall that includes a ventilation aperture.
- Preferably, the housing of the electronic device also includes a top positioned relative to the base so as to maintain the cooling body in thermal contact with the integrated circuit after the electronic device has been inserted onto the shelf.
- Preferably, the electronic device also includes a mechanism for protecting the integrated circuit from damage as the electronic device is inserted onto the shelf.
- In a basic method of cooling an integrated circuit of an electronic device, a cooling body and a shelf are provided. The electronic device is configured, and the shelf is positioned relative to the cooling body, so that when the electronic device is inserted reversibly onto the shelf, the cooling body comes into thermal contact with the integrated circuit. A heat-absorbing fluid, i.e., a fluid having a lower temperature than the operating temperature of the integrated circuit, is introduced to the cooling body via an input conduit, and the electronic device is inserted onto the shelf. At least a portion of the fluid is withdrawn from the cooling body via an output conduit.
- Preferably, heat is withdrawn from the at least portion of the fluid that is withdrawn from the cooling body. Most preferably, the at least portion of the fluid from which the heat has been withdrawn is re-introduced to the cooling body.
- Preferably, a gas is forced to flow past the output conduit.
- Because the electronic device, the cooling body and the shelf are configured for reversible insertion of the electronic device onto the shelf, the electronic device may be removed from the shelf at any time subsequent to the insertion of the electronic device onto the shelf.
- In a method of operating a pair of electronic devices, each of which includes a respective integrated circuit, a cooling body and a shelf are provided. The electronic devices are configured, and the shelf is positioned relative to the cooling body, so that when either one of the electronic devices is inserted reversibly onto the shelf, the cooling body comes into thermal contact with the respective integrated circuit of that electronic device. A heat-absorbing fluid is introduced to the cooling body via an input conduit, with at least a portion of the fluid being withdrawn from the cooling body via an output conduit, and a first one of the electronic devices is inserted onto the shelf. Later, the first electronic device is removed from, the shelf and the other electronic device is inserted onto the shelf.
- Various embodiments are herein described, by way of example only, with reference to the accompanying drawings, wherein:
-
FIG. 1 is a partially cut-away perspective view of a rack of the present invention; -
FIG. 2 shows the rack ofFIG. 1 together with an electronic device of the present invention; -
FIG. 3 is a cut-away side view of the rack ofFIG. 1 with an electronic device of the present invention installed on one of the shelves; -
FIGS. 4A and 4B show two stages in the insertion of one embodiment of the electronic device onto a shelf of one embodiment of the rack; -
FIGS. 5A and 5B show two stages in the insertion of another embodiment of the electronic device onto a shelf of another embodiment of the rack. - The principles and operation of a cooling system for electronic devices according to the present invention may be better understood with reference to the drawings and the accompanying description.
- Referring now to the drawings,
FIG. 1 is a partially cut-away perspective view of arack 10 for the installation therein of six electronic devices such aselectronic device 50 that is illustrated inFIG. 2 .Rack 10 includes sixshelves 12. Each shelf is provided with arespective cooling body 14 for cooling an integrated circuit of the electronic device that is mounted on thecorresponding shelf 12. - Cooling
bodies 14 are hollow boxes made of a thermally conductive material such as copper or aluminum. Each coolingbody 14 is provided with aninput conduit 16 for introducing a cooling fluid to coolingbody 14 and anoutput conduit 18 for receiving the heated cooling fluid from coolingbody 14. In some embodiments, coolingbody 14 is merely a box in which the cooling fluid flows freely. In other embodiments, coolingbody 14 includes a spiral, helical or serpentine pipe that connects to inputconduit 16 and tooutput conduit 18 and that occupies most of the interior of coolingbody 14 by virtue of having a shape such as a spiral, helical or serpentine shape, and the flow of the cooling fluid within coolingbody 14 is confined to the serpentine pipe. - The cooling fluid typically is water. In special applications, the cooling fluid could be a different fluid, for example a propylene-glycol-based antifreeze.
-
Input conduits 16 are connected to asupply conduit 20 that supplies cool cooling fluid to inputconduits 16.Output conduits 18 are connected to adrain conduit 22 that receives hot cooling fluid fromoutput conduits 18. The hot cooling fluid is carried bydrain conduit 22 to aheat exchanger 24 where the hot cooling fluid is cooled for recycling to coolingbodies 14 viasupply conduit 20 andinput conduits 16. Typically,heat exchanger 24 is a radiator that uses forced air circulation to remove the heat from the cooling fluid. The circulation of the cooling fluid throughconduits heat exchanger 24 could be convective circulation, or alternatively could be forced circulation that is driven by a pump. The arrows inFIG. 1 show the direction of the circulation of the cooling fluid. - It is not strictly necessary for
heat exchanger 24 to be mounted onrack 10.Heat exchanger 24 could be physically separate from rack 10 (apart from being in fluid communication withconduits 20 and 22), and even, in a different room thanrack 10. -
Rack 10 also includes abackplane 26. More details ofbackplane 26 are provided below in connection withFIG. 3 . -
FIG. 2 shows anelectronic device 50, for example a field replaceable unit, of a type that is adapted to have its integratedcircuit 52 cooled by a coolingbody 14, positioned for insertion onto ashelf 12.Device 50 includes ahousing 54 that in turn includes abase 56, a top 60, twoside walls 62 and afront wall 64. The electronic components ofdevice 50 include anintegrated circuit 52, onbase 56, that needs to be cooled by coolingbody 14. The electrical components ofdevice 50 include twoplugs 72 for plugging intobackplane 26 as described below in connection withFIG. 3 .Device 50 is installed inrack 10 by being placed on theappropriate shelf 12 and being slid towardsbackplane 26 until coolingbody 14 covers integratedcircuit 52. - The arrows in
FIG. 2 show thatconduits body 14, to facilitate the installation ofdevice 50 ontoshelf 12 with coolingbody 14 covering integratedcircuit 52. -
FIG. 3 is a cut-away side view ofrack 10, showing twoelectronic devices 50 installed on one ofshelves 12. More precisely, onlyintegrated circuits 52 andbases 56 of theelectronic devices 50, and one ofplugs 72 of one of theelectronic devices 50, are shown inFIG. 3 . In eachoccupied shelf 12, coolingbody 14 rests on top ofintegrated circuit 52, covering the entire top surface ofintegrated circuit 52, and in thermal contact withintegrated circuit 52.Plug 72 is shown plugged into abackplane connector 28 ofbackplane 26, for providing electrical power toelectronic device 50 and for providing an avenue of wired communication between thiselectronic device 50 and otherelectronic devices 50 that are installed inrack 10. - The walls of
plugs 72 that face each other define agap 68 therebetween through which coolingbody 14 passes to enterhousing 54 asdevice 50 is inserted ontoshelf 12. Preferably,gap 68 is about as wide as coolingbody 14, so that the inner side walls ofplugs 72 serve as guides for the correct lateral positioning ofdevice 50 onshelf 12 for coolingbody 14 to cover integratedcircuit 52.Backplane 26 serves as a backstop for the insertion ofdevice 50 ontoshelf 12 to ensure thathousing 50 is not inserted too far intorack 10 for coolingbody 14 to cover integratedcircuit 52. Hence,backplane 26, together with the lateral sides of coolingbody 14 that just fit intogap 68, guide the insertion ofelectronic device 50 ontoshelf 12 in a manner that guarantees that, afterelectronic device 50 is fully inserted ontoshelf 12, coolingbody 14 covers all ofintegrated circuit 52.Gap 68 is an example of what is termed a “rearward” gap in the appended claims, and is “rearward.” in the sense thatgap 68 is in the portion ofelectronic device 50 that is inmost on rack 10 (closest to backplane 26) whenelectronic device 50 is installed on ashelf 12 ofrack 10. -
FIG. 3 also shows that the cooling provided by the cooling fluid is supplemented by forced air cooling induced by afan 30. The single-beaded arrows inFIG. 3 show the direction of the flow of the cooling air. As inFIG. 2 , the double-headed arrow inFIG. 3 indicates thatconduits body 14. As shown inFIG. 2 ,front wall 64 ofelectronic device 50 includes ventilation holes 70 to facilitate the circulation. of cooling air into and out ofhousing 54. - For illustrational simplicity,
FIGS. 1-3 show arack 10 all of whoseshelves 12 face in the same direction. The scope of the present invention also includes two-sided racks whose shelves face in opposite directions, away from a midplane that has the same functionality as backplane 26: providing connectors for electrical power and avenues of wired communication for the electronic devices installed on the rack, and serving as a backstop for the insertion of the electronic devices so that the rack's cooling bodies cover the integrated circuits of the electronic devices. -
Electronic devices 50 are modular in the sense that not allshelves 12 need be occupied byelectronic devices 50. Indeed,FIG. 3 shows only two out of sixshelves 12 occupied byelectronic devices 50. -
FIGS. 4A and 4B show two stages in the installation of one embodiment ofelectronic device 50 onto ashelf 12 of one embodiment ofrack 10. In this embodiment ofrack 10, each coolingbody 14 is provided with a curvedforward shield 32 to keep coolingbody 14 from damaging integratedcircuit 52 aselectronic device 50 is slid (rightward inFIGS. 4A and 4B ) ontoshelf 12.FIG. 4A shows the situation asintegrated circuit 52 begins to come in contact withshield 32.FIG. 4B shows the situation after the electronic device has been fully inserted ontoshelf 12 with coolingbody 14 now completely covering integratedcircuit 52. In this embodiment, top 60 presses down on coolingbody 14 to maintain the thermal contact between coolingbody 14 and integratedcircuit 52. In the embodiment illustrated inFIG. 3 ,conduits integrated circuit 52 to be inserted beneath coolingbody 14, but are rigid enough to urge coolingbody 14 downward to maintain the thermal contact of coolingbody 14 withintegrated circuit 52 once integratedcircuit 52 has been inserted beneath coolingbody 14. -
FIGS. 5A and 5B show two stages in the installation of another embodiment ofelectronic device 50 onto ashelf 12 of another embodiment ofrack 10. In these embodiments, instead of providing shields on coolingbodies 14, aramp 74 is installed rearward ofintegrated circuit 52 onbase 56 of each electronic device SO to keep coolingbody 14 from damaging integratedcircuit 52 aselectronic device 50 is slid (rightward inFIGS. 5A and 5B ) ontoshelf 12. As in the embodiment illustrated inFIG. 3 , in this embodiment ofrack 10conduits integrated circuit 52 to be inserted beneath coolingbody 14 but are rigid enough to urge coolingbody 14 downward to maintain the thermal contact of coolingbody 14 withintegrated circuit 52 once integratedcircuit 52 has been inserted beneath coolingbody 14. - That
electronic device 50 is easily inserted ontoshelf 12 and removed fromshelf 12 makes it easy to replace a defective or obsolescent electronic device SO with a replacementelectronic device 50 as needed. - While the invention has been described with respect to a limited number of embodiments, it will be appreciated that many variations, modifications and other applications of the invention may be made. Therefore, the claimed invention as recited in the claims that follow is not limited to the embodiments described herein.
Claims (24)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/322,973 US8879258B1 (en) | 2011-09-26 | 2014-07-03 | Liquid cooling system for modular electronic systems |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/245,078 US8817473B2 (en) | 2011-09-26 | 2011-09-26 | Liquid cooling system for modular electronic systems |
US14/322,973 US8879258B1 (en) | 2011-09-26 | 2014-07-03 | Liquid cooling system for modular electronic systems |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/245,078 Continuation US8817473B2 (en) | 2011-09-26 | 2011-09-26 | Liquid cooling system for modular electronic systems |
Publications (2)
Publication Number | Publication Date |
---|---|
US20140313669A1 true US20140313669A1 (en) | 2014-10-23 |
US8879258B1 US8879258B1 (en) | 2014-11-04 |
Family
ID=47911064
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/245,078 Active 2032-08-08 US8817473B2 (en) | 2011-09-26 | 2011-09-26 | Liquid cooling system for modular electronic systems |
US14/322,973 Active US8879258B1 (en) | 2011-09-26 | 2014-07-03 | Liquid cooling system for modular electronic systems |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/245,078 Active 2032-08-08 US8817473B2 (en) | 2011-09-26 | 2011-09-26 | Liquid cooling system for modular electronic systems |
Country Status (2)
Country | Link |
---|---|
US (2) | US8817473B2 (en) |
CN (1) | CN103025126B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170127573A1 (en) * | 2015-11-04 | 2017-05-04 | Fujitsu Limited | Information processing device and container for data center |
US9801308B2 (en) * | 2016-03-09 | 2017-10-24 | Dell Products Lp | Managing cable connections and air flow in a data center |
US20170374768A1 (en) * | 2016-06-28 | 2017-12-28 | Dell Products, L.P. | Sled mounted processing nodes for an information handling system |
US20180014434A1 (en) * | 2016-07-07 | 2018-01-11 | Commscope Technologies Llc | Modular data center |
EP3292745A4 (en) * | 2015-05-07 | 2019-04-03 | DHK Storage LLC | Computer server heat regulation utilizing integrated precision air flow |
US20240130069A1 (en) * | 2022-10-18 | 2024-04-18 | Mellanox Technologies, Ltd. | Computing devices with improved thermal management |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2828694A1 (en) * | 2011-03-02 | 2012-09-07 | Earl Keisling | Space-saving high-density modular data pod systems and energy-efficient cooling systems |
US9439322B1 (en) * | 2014-01-09 | 2016-09-06 | Nautilus Data Technologies, Inc. | Modular data center deployment method and system for waterborne data center vessels |
WO2016027299A1 (en) * | 2014-08-18 | 2016-02-25 | 株式会社Murakumo | System, information processing device and rack |
US10356957B2 (en) * | 2014-10-31 | 2019-07-16 | Hewlett Packard Enterprise Development Lp | Adaptive cooling assembly |
CN106982535B (en) * | 2016-01-15 | 2019-11-15 | 中兴通讯股份有限公司 | The positive and negative exhausting air duct panel of veneer mends wind method and device |
SG11201807975UA (en) | 2016-03-16 | 2018-10-30 | Inertech Ip Llc | System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling |
JP6651967B2 (en) * | 2016-04-19 | 2020-02-19 | 富士通株式会社 | Liquid cooling server |
CA3031935A1 (en) * | 2016-07-25 | 2018-02-01 | Robert W. Jacobi | Modular system for heating and/or cooling requirements |
US10149411B2 (en) * | 2016-09-09 | 2018-12-04 | Seagate Technology Llc | Rack enclosure cooling systems and related methods |
US11147191B2 (en) | 2018-10-29 | 2021-10-12 | Quanta Computer Inc. | Liquid cooling with outdoor chiller rack system |
US11326830B2 (en) | 2019-03-22 | 2022-05-10 | Robert W. Jacobi | Multiple module modular systems for refrigeration |
US11357129B2 (en) * | 2019-11-19 | 2022-06-07 | Lockheed Martin Corporation | Mounting system with coolant connection having a self-sealing in-line valve and components and methods thereof |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4825337A (en) * | 1988-05-17 | 1989-04-25 | Prime Computer, Inc. | Circuit board thermal contact device |
US5640302A (en) * | 1992-06-29 | 1997-06-17 | Elonex Ip Holdings | Modular portable computer |
US6349035B1 (en) * | 2000-09-29 | 2002-02-19 | Compaq Information Technologies Group, L.P. | Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink |
US6643132B2 (en) * | 2002-01-04 | 2003-11-04 | Intel Corporation | Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system |
US6693797B2 (en) * | 2002-01-04 | 2004-02-17 | Intel Corporation | Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another |
US6776221B2 (en) * | 2001-09-20 | 2004-08-17 | Intel Corporation | Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component |
US6882533B2 (en) * | 2001-02-22 | 2005-04-19 | Hewlett-Packard Development Company, L.P. | Thermal connector for cooling electronics |
US7551488B2 (en) * | 2006-08-15 | 2009-06-23 | Oki Semiconductor Co., Ltd. | Semiconductor nonvolatile memory trimming technique for output characteristic control and redundancy repair |
US7733652B2 (en) * | 2008-09-17 | 2010-06-08 | Tyco Electronics Corporation | Heat sink assembly for a pluggable module |
US7869215B2 (en) * | 2009-04-08 | 2011-01-11 | Foxconn Technology Co., Ltd. | Portable electronic device incorporating extendable heat dissipation device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4321478B2 (en) * | 2005-03-31 | 2009-08-26 | 日本電気株式会社 | Information processing blade and information processing apparatus |
-
2011
- 2011-09-26 US US13/245,078 patent/US8817473B2/en active Active
-
2012
- 2012-06-29 CN CN201210220906.5A patent/CN103025126B/en active Active
-
2014
- 2014-07-03 US US14/322,973 patent/US8879258B1/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4825337A (en) * | 1988-05-17 | 1989-04-25 | Prime Computer, Inc. | Circuit board thermal contact device |
US5640302A (en) * | 1992-06-29 | 1997-06-17 | Elonex Ip Holdings | Modular portable computer |
US6349035B1 (en) * | 2000-09-29 | 2002-02-19 | Compaq Information Technologies Group, L.P. | Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink |
US6882533B2 (en) * | 2001-02-22 | 2005-04-19 | Hewlett-Packard Development Company, L.P. | Thermal connector for cooling electronics |
US6776221B2 (en) * | 2001-09-20 | 2004-08-17 | Intel Corporation | Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component |
US6643132B2 (en) * | 2002-01-04 | 2003-11-04 | Intel Corporation | Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system |
US6693797B2 (en) * | 2002-01-04 | 2004-02-17 | Intel Corporation | Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another |
US7551488B2 (en) * | 2006-08-15 | 2009-06-23 | Oki Semiconductor Co., Ltd. | Semiconductor nonvolatile memory trimming technique for output characteristic control and redundancy repair |
US7733652B2 (en) * | 2008-09-17 | 2010-06-08 | Tyco Electronics Corporation | Heat sink assembly for a pluggable module |
US7869215B2 (en) * | 2009-04-08 | 2011-01-11 | Foxconn Technology Co., Ltd. | Portable electronic device incorporating extendable heat dissipation device |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3292745A4 (en) * | 2015-05-07 | 2019-04-03 | DHK Storage LLC | Computer server heat regulation utilizing integrated precision air flow |
US20170127573A1 (en) * | 2015-11-04 | 2017-05-04 | Fujitsu Limited | Information processing device and container for data center |
US9854710B2 (en) * | 2015-11-04 | 2017-12-26 | Fujitsu Limited | Information processing device and container for data center |
US9801308B2 (en) * | 2016-03-09 | 2017-10-24 | Dell Products Lp | Managing cable connections and air flow in a data center |
US20170374768A1 (en) * | 2016-06-28 | 2017-12-28 | Dell Products, L.P. | Sled mounted processing nodes for an information handling system |
US10010008B2 (en) * | 2016-06-28 | 2018-06-26 | Dell Products, L.P. | Sled mounted processing nodes for an information handling system |
US20180014434A1 (en) * | 2016-07-07 | 2018-01-11 | Commscope Technologies Llc | Modular data center |
US10492341B2 (en) * | 2016-07-07 | 2019-11-26 | Commscope Technologies Llc | Modular data center |
US20240130069A1 (en) * | 2022-10-18 | 2024-04-18 | Mellanox Technologies, Ltd. | Computing devices with improved thermal management |
Also Published As
Publication number | Publication date |
---|---|
CN103025126B (en) | 2017-03-01 |
US8879258B1 (en) | 2014-11-04 |
US20130077238A1 (en) | 2013-03-28 |
US8817473B2 (en) | 2014-08-26 |
CN103025126A (en) | 2013-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8879258B1 (en) | Liquid cooling system for modular electronic systems | |
US9223360B2 (en) | Rack mounted liquid submersion cooled electronic system | |
US9591787B2 (en) | Selective clamping of electronics card to coolant-cooled structure | |
US9668382B2 (en) | Coolant distribution unit for a multi-node chassis | |
US10856446B2 (en) | Cooling for slot mounted electrical modules | |
US9743561B2 (en) | Liquid-cooled heat sink configured to facilitate drainage | |
US6829142B2 (en) | Cell thermal connector | |
CN102342192B (en) | Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof | |
US10705578B2 (en) | Heat removal from memory modules | |
US20150077937A1 (en) | Apparatus for cooling board mounted optical modules | |
US9089076B2 (en) | Cooling system for electronics | |
CN107743351A (en) | For providing the equipment, system and method for liquid cooling | |
JP7418572B2 (en) | Nozzle array and cooling module | |
US9949403B2 (en) | Method and device for cooling equipment provided with electronic boards, using at least one distinct fluid-cooled cooling board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
AS | Assignment |
Owner name: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT, ILLINOIS Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MELLANOX TECHNOLOGIES, LTD.;REEL/FRAME:037900/0720 Effective date: 20160222 Owner name: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MELLANOX TECHNOLOGIES, LTD.;REEL/FRAME:037900/0720 Effective date: 20160222 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551) Year of fee payment: 4 |
|
AS | Assignment |
Owner name: MELLANOX TECHNOLOGIES, LTD., ISRAEL Free format text: RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL AT REEL/FRAME NO. 37900/0720;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:046542/0792 Effective date: 20180709 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |