US20140231877A1 - Collector-up bipolar junction transistors in bicmos technology - Google Patents
Collector-up bipolar junction transistors in bicmos technology Download PDFInfo
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- US20140231877A1 US20140231877A1 US13/769,500 US201313769500A US2014231877A1 US 20140231877 A1 US20140231877 A1 US 20140231877A1 US 201313769500 A US201313769500 A US 201313769500A US 2014231877 A1 US2014231877 A1 US 2014231877A1
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66242—Heterojunction transistors [HBT]
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/26—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
- H01L29/267—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
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- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
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- H—ELECTRICITY
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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Definitions
- the invention relates generally to semiconductor device fabrication and, in particular, to bipolar junction transistors, fabrication methods for bipolar junction transistors, and design structures for a bipolar junction transistor.
- Bipolar junction transistors are typically found in demanding types of integrated circuits, especially integrated circuits destined for high-frequency applications.
- One specific application for bipolar junction transistors is in radiofrequency integrated circuits (RFICs), which are found in wireless communications systems, power amplifiers in cellular telephones, and other varieties of high-speed integrated circuits.
- RFICs radiofrequency integrated circuits
- Bipolar junction transistors may also be combined with complementary metal-oxide-semiconductor (CMOS) field effect transistors in bipolar complementary metal-oxide-semiconductor (BiCMOS) integrated circuits, which take advantage of the positive characteristics of both transistor types in the construction of the integrated circuit.
- CMOS complementary metal-oxide-semiconductor
- bipolar junction transistors constitute three-terminal electronic devices constituted by three semiconductor regions, namely an emitter, a base, and a collector.
- An NPN bipolar junction transistor includes two regions of n-type semiconductor material constituting the emitter and collector, and a region of p-type semiconductor material sandwiched between the two regions of n-type semiconductor material to constitute the base.
- a PNP bipolar junction transistor has two regions of p-type semiconductor material constituting the emitter and collector, and a region of n-type semiconductor material sandwiched between two regions of p-type semiconductor material to constitute the base.
- the differing conductivity types of the emitter, base, and collector form a pair of p-n junctions, namely a collector-base junction and an emitter-base junction.
- a voltage applied across the emitter-base junction of a bipolar junction transistor controls the movement of charge carriers that produce charge flow between the collector and emitters of the bipolar junction transistor.
- a method for fabricating a bipolar junction transistor.
- the method includes forming an emitter in a device region and forming an intrinsic base layer on the emitter. After the emitter is formed, a collector is formed that is separated from the emitter by the intrinsic base layer.
- the device region is comprised of a first semiconductor material having a first electronic bandgap
- the collector is comprised of a second semiconductor material having a second electronic bandgap greater than the first electronic bandgap.
- a device structure for a bipolar junction transistor.
- the device structure includes a device region comprised of a first semiconductor material having a first electronic bandgap, an emitter in the device region, an intrinsic base on the emitter, and a collector separated from the emitter by the intrinsic base.
- the collector is comprised of a second semiconductor material having a second electronic bandgap greater than the first electronic bandgap.
- a hardware description language (HDL) design structure is encoded on a machine-readable data storage medium.
- the HDL design structure comprises elements that, when processed in a computer-aided design system, generates a machine-executable representation of a device structure for a bipolar junction transistor.
- the HDL design structure includes a device region comprised of a first semiconductor material having a first electronic bandgap, an emitter in the device region, an intrinsic base on the emitter, and a collector separated from the emitter by the intrinsic base.
- the collector is comprised of a second semiconductor material having a second electronic bandgap greater than the first electronic bandgap.
- the HDL design structure may comprise a netlist.
- the HDL design structure may also reside on storage medium as a data format used for the exchange of layout data of integrated circuits.
- the HDL design structure may reside in a programmable gate array.
- FIGS. 1-8 are cross-sectional views of a portion of a substrate at successive fabrication stages of a processing method for fabricating a device structure in accordance with an embodiment of the invention.
- FIG. 9 is a flow diagram of a design process used in semiconductor design, manufacture, and/or test.
- a substrate 10 includes trench isolation structures 12 that circumscribe and electrically isolate a device region 14 used in the fabrication of a bipolar junction transistor 80 ( FIG. 8 ).
- the substrate 10 may be any suitable bulk substrate comprising a semiconductor material that a person having ordinary skill in the art would recognize as suitable for forming an integrated circuit.
- substrate 10 may be comprised of a wafer of a monocrystalline silicon-containing material, such as single crystal silicon with a (100) crystal lattice orientation.
- the semiconductor material comprising substrate 10 may be lightly doped with an impurity to alter its electrical properties and may also include an optional epitaxial layer.
- the top surface of the device region 14 is coextensive with a top surface 10 a of the substrate 10 .
- the trench isolation structures 12 may be isolation structures formed by a shallow trench isolation (STI) technique that relies on a lithography and dry etching process to define closed-bottomed trenches in substrate 10 , deposit an electrical insulator to fill the trenches, and planarize the electrical insulator relative to the top surface 10 a of the substrate 10 using a chemical mechanical polishing (CMP) process.
- the electrical insulator may be comprised of an oxide of silicon, such as densified tetraethylorthosilicate (TEOS) deposited by chemical vapor deposition (CVD).
- TEOS densified tetraethylorthosilicate
- CVD chemical vapor deposition
- the trench isolation structures 12 have a top surface 12 a that is nominally coplanar with or slightly below the top surface 10 a of the substrate 10 .
- the device region 14 includes an emitter 18 and a subemitter 20 formed as impurity-doped regions of the same conductivity type.
- a top surface of the emitter 18 may be coextensive with the top surface 10 a of the substrate 10 and device region 14 .
- the sidewall 13 encircles or surrounds the emitter 18 and device region 14 . More specifically, the sidewall 13 is an interior surface of the trench isolation structures 12 that is coextensive with the device region 14 .
- the emitter 18 is at least partially beneath the top surface 10 a of the device region 14 and, preferably, is completely below the top surface 10 a.
- the emitter 18 and subemitter 20 may be formed by introducing an impurity species to supply an electrically-active dopant.
- the emitter 18 and the subemitter 20 may be formed by separate ion implantations of an n-type impurity species from Group V of the Periodic Table (e.g., phosphorus (P), arsenic (As), or antimony (Sb)) effective to impart an n-type conductivity and, thereafter, annealing to activate the impurity species and alleviate implantation damage.
- an n-type impurity species from Group V of the Periodic Table (e.g., phosphorus (P), arsenic (As), or antimony (Sb)) effective to impart an n-type conductivity and, thereafter, annealing to activate the impurity species and alleviate implantation damage.
- P phosphorus
- As arsenic
- Sb antimony
- the subemitter 20 may be formed by a high-current ion implantation of an n-type impurity species followed by a lengthy, high temperature thermal anneal that dopes a thickness of the substrate 10 before the optional epitaxial layer is formed. During stages of the process flow subsequent to implantation, the dopant in the emitter 18 may diffuse laterally and vertically such that substantially the entire central portion of device region 14 becomes impurity doped and, as a result, is structurally and electrically continuous with the subemitter 20 .
- An intrinsic base layer 22 is formed as a continuous additive layer on the top surface 10 a of substrate 10 .
- the intrinsic base layer 22 is coupled with the emitter 18 .
- the intrinsic base layer 22 may be comprised of a semiconductor material, such as silicon-germanium (SiGe) including silicon (Si) and germanium (Ge) in an alloy with the silicon content ranging from 95 atomic percent to 50 atomic percent and the germanium content ranging from 5 atomic percent to 50 atomic percent.
- the germanium content of the intrinsic base layer 22 may be uniform or the germanium content of intrinsic base layer 22 may be graded and/or stepped across the thickness of intrinsic base layer 22 .
- a thickness of the intrinsic base layer 22 may not contain any germanium and may be entirely comprised of silicon (Si).
- the intrinsic base layer 22 may be doped with one or more impurity species, such as boron and/or carbon.
- Intrinsic base layer 22 may be formed using a low temperature epitaxial (LTE) growth process, such as vapor phase epitaxy (VPE) that may be conducted at a growth temperature ranging from 400° C. to 850° C.
- LTE low temperature epitaxial
- VPE vapor phase epitaxy
- the epitaxial growth process may be non-selective as single crystal semiconductor material (e.g., single crystal silicon or SiGe) is epitaxially grown or deposited onto any exposed crystalline surface such as the exposed top surface 10 a of device region 14 , and non-monocrystalline semiconductor material (e.g., polysilicon or polycrystalline SiGe) is deposited non-epitaxially onto the non-crystalline material of the trench isolation structures 12 .
- the single-crystal semiconductor material of the device region 14 serves as a crystalline template for the growth of at least the section of intrinsic base layer 22 that is coextensive with the device region 14 .
- a base dielectric layer 24 is formed on a top surface 22 a of intrinsic base layer 22 and, in the representative embodiment, directly contacts the top surface 22 a .
- the base dielectric layer 24 may be comprised of an electrical insulator with a dielectric constant (e.g., a permittivity) characteristic of a dielectric material.
- the base dielectric layer 24 may be comprised of a high temperature oxide (HTO) deposited using rapid thermal process (RTP) at temperatures of 500° C. or higher.
- RTP rapid thermal process
- the base dielectric layer 24 may be comprised of oxide formed by a different deposition process, thermal oxidation of silicon (e.g., oxidation at high pressure with steam (HIPDX)), or a combination of these processes.
- a sacrificial layer 26 is deposited on the top surface 24 a of the base dielectric layer 24 .
- the sacrificial layer 26 may be comprised of polysilicon or amorphous silicon deposited by CVD using either silane or disilane as a silicon source.
- a cap layer 28 is applied on a top surface 26 a of sacrificial layer 26 and may be comprised of a different material type, e.g., silicon dioxide, than sacrificial layer 26 and that is not etched by the selective etching process applied subsequently in the process flow.
- a plurality of trenches 29 , 30 and a plurality of trenches 31 , 32 are formed that extend from a top surface of the cap layer 28 completely through the cap layer 28 , the sacrificial layer 26 , the base dielectric layer 24 , the intrinsic base layer 22 , and into the device region 14 .
- Trench 29 includes sidewalls 29 a joined by a bottom surface 29 b
- trench 30 includes sidewalls 30 a joined by a bottom surface 30 b
- trench 31 includes sidewalls 31 a joined by a bottom surface 31 b
- trench 32 includes sidewalls 32 a joined by a bottom surface 32 b
- the bottom surfaces 29 b , 30 b , 31 b , 32 b are at a shallower depth than the bottom surface of the trench isolation structures 12 relative to the top surface 10 a
- the sidewalls 29 a - 32 a are oriented with a substantially vertical and parallel alignment, and may be oriented at respective right angles relative (i.e., perpendicular) to the top surface 10 a of substrate 10 . Additional trenches like trenches 29 , 30 and additional trenches like trenches 31 , 32 may be provided in each trench group.
- the emitter 18 is positioned between the portions of trenches 30 , 31 in the device region 14 , and is characterized by a width w 1 .
- Sections 33 a , 33 b of the device region 14 which may have the same conductivity type as the emitter 18 , are disposed between the trenches 29 , 32 and the sidewall 13 of the trench isolation structures 12 .
- Section 33 a of the device region 14 is coextensive with the sidewall 13 and with the outer sidewall 29 a of trench 29 .
- Section 33 b of the device region 14 is coextensive with the sidewall 13 and with the outer sidewall 32 a of trench 32 .
- the sections 33 a , 33 b of the device region 14 are characterized by a width dimension, w 1 .
- the adjacent sidewalls 29 a , 30 a of trenches 29 , 30 are separated by a width, w 3 , of the material of device region 14 .
- the adjacent sidewalls 3 la, 32 a of trenches 31 , 32 are also separated by the width, w 3 , of the material of device region 14 .
- An overlying interior section 16 of the intrinsic base layer 22 which directly contacts the emitter 18 in the representative embodiment, also has the width, w 1 .
- the trenches 29 - 32 may comprise linear open volumes that are aligned parallel to each other and separated by strips of semiconductor material of the device region 14 .
- the trenches 29 - 32 do not have a closed geometrical shape.
- trenches 29 , 32 and trenches 30 , 31 may join or may be joined by additional trenches to define a closed geometrical shape that surrounds or encircles the collector 18 .
- the sections 33 a , 33 b of the device region 14 would likewise join or be joined by additional portions of the device region 14 so that the sections 33 a , 33 b surround or encircle the trenches 29 , 32 .
- the trenches 29 - 32 may be formed using a photolithography process and a non-selective etching process.
- a mask layer (not shown) may be applied on the top surface of the cap layer 28 .
- the mask layer may comprise a photoresist that is applied as a layer by a spin coating process, pre-baked, exposed to a radiation projected through a photomask, baked after exposure, and developed with a chemical developer to form an etch mask that includes a pattern of openings coinciding with the intended locations of the trenches 29 - 32 .
- the pattern of openings is transferred from the mask layer to the sacrificial layer 26 , the base dielectric layer 24 , the intrinsic base layer 22 , and the emitter 18 to define the trenches 29 - 32 by the non-selective etching process.
- the non-selective etching process may comprise a wet etching process or a dry etching process, such as reactive-ion etching (RIE) that produces vertical sidewalls 29 a - 32 a .
- RIE reactive-ion etching
- the non-selective etching process which may be conducted in a single etching step or multiple steps, relies on one or more etch chemistries that remove the materials of the cap layer 28 , the sacrificial layer 26 , the base dielectric layer 24 , the intrinsic base layer 22 , and the emitter 18 , and may comprise a timed etch.
- the mask layer is removed in response to forming the trenches 29 - 32 . If comprised of a photoresist, the mask layer may then be removed by ashing or solvent stripping, followed by a conventional cleaning process.
- the substrate 10 When formed, the substrate 10 may be rotationally oriented in the lithography tool used to pattern the mask layer in the photolithography process using a feature on the substrate, such as a notch at a peripheral edge, as an angular reference. Alignment marks on the substrate 10 and photomask may also be aligned in the photolithography tool to assist in rotationally orienting the substrate 10 .
- the openings subsequently formed in the patterned mask layer are aligned with a crystallographic plane or orientation of the crystalline semiconductor material of substrate 10 .
- the openings may be oriented parallel to the [100] directions of a single crystal silicon substrate.
- the preferential alignment is transferred by the etching process from the openings in the mask to the portion of the trenches 29 - 32 in the device region 14 .
- the trench sidewalls 29 a - 32 a are each aligned with a crystallographic plane or orientation of the crystalline semiconductor material of substrate 10 .
- trenches 34 , 35 are formed in the device region 14 by modifying the sections of trenches 29 - 32 within the device region 14 .
- trenches 29 , 30 are enlarged and merged by etching the semiconductor material of device region 14 bordering trenches 29 , 30 ( FIG. 2 ) to define trench 34
- trenches 31 , 32 are enlarged and merged by etching the semiconductor material of device region 14 bordering trenches 31 , 32 ( FIG. 2 ) to define trench 35 .
- Trenches 34 , 35 are wider than the residual sections of trenches 29 - 32 remaining in the intrinsic base layer 22 .
- Trench 34 includes an exterior sidewall 36 and an interior sidewall 37 in the device region 14 that are continuous with the residual sections of trenches 29 , 30 in the intrinsic base layer 22 .
- Trench 35 includes an exterior sidewall 38 and an interior sidewall 39 in the device region 14 that are continuous with the residual sections of trenches 31 , 32 in the intrinsic base layer 22 .
- Trenches 34 , 35 surround the collector 18 and, more specifically, sidewalls 37 , 39 are coextensive with (i.e., define a boundary of) the collector 18 .
- Sidewalls 36 - 39 have a non-perpendicular (i.e., inclined) orientation relative to the top surface 10 a .
- each of the sidewalls 36 - 39 becomes inclined at an angle, a, relative to the top surface 10 a of substrate 10 and relative to the sidewalls 29 a - 32 a of the sections of trenches 29 - 32 that remain in the intrinsic base layer 22 .
- the depth of the trenches 34 , 35 may be slightly increased relative to the original depth of trenches 29 - 32 by the anisotropic etching process.
- the bottom surfaces 34 a , 35 a of trenches 34 , 35 may be slightly deeper than the bottom surfaces 29 b - 32 b.
- the trenches 34 , 35 may be created with an orientation-dependent etching process, called an anisotropic etching process herein, that may have different etch rates for different crystallographic directions in a semiconductor and/or that may have different etch rates for semiconductors of different doping or different compositions.
- the anisotropic etching process etches the semiconductor material of the device region 14 bordering the sidewalls 29 a - 32 a of trenches 29 - 32 ( FIG. 3 ) in all crystallographic directions, but at significantly different etching rates for different crystal directions or planes.
- silicon etching in TMAH is relatively slow for (111) crystal planes compared to other directions, such as (100) planes or (110) planes.
- the etch pattern formed by the anisotropic etching process proceeds along the crystal planes of higher etching rate and is eventually terminated by the crystal planes of lower etching rate.
- the absolute etch rates in each crystallographic direction and the relative etch rate in different crystallographic directions may be dependent upon factors such as solution strength (i.e., concentration) and solution temperature of the etchant.
- the etch time for exposure to the etchant may be selected to be adequate to produce a targeted change in sidewall geometrical shape.
- the anisotropic etching process may be a wet chemical etching process that uses an etchant comprising tetramethylammonium hydroxide (TMAH), ammonium hydroxide (NH 4 OH), ethylenediamine pyrocatechol (EDP), or potassium hydroxide (KOH).
- TMAH tetramethylammonium hydroxide
- NH 4 OH ammonium hydroxide
- EDP ethylenediamine pyrocatechol
- KOH potassium hydroxide
- the sidewalls 29 a - 32 a are aligned with crystallographically equivalent (110) planes before the anisotropic etching process is performed.
- the sidewalls 36 - 39 of the trenches 34 , 35 may be inclined at a nominal angle, a, of 45° relative to the top surface 10 a.
- the anisotropic etching process removes the semiconductor material of the device region 14 of substrate 10 at a considerably higher rate than the semiconductor material comprising at least a portion of the intrinsic base layer 22 and at a considerably higher rate than the electrical insulators comprising the base dielectric layer 24 and trench isolation structures 12 .
- the intrinsic base layer 22 may be comprised of silicon that may include a varying composition with germanium of various contents over different thicknesses in a stepped and/or graded profile.
- a portion of the intrinsic base layer 22 adjacent to the emitter 18 may be comprised of silicon without germanium and another portion of the intrinsic base layer 22 separated from the emitter 18 by the silicon portion may be comprised of silicon-germanium.
- the sections 90 , 92 , 94 , 96 may reflect removal of the silicon portion and the non-removal or minimal removal of the silicon-germanium portion. Because of the etch selectivity, the sidewalls 29 a - 32 a of trenches 29 - 32 each extending through the intrinsic base layer 22 may nominally retain their original separation, and remain nominally vertical and perpendicular to the top surface 10 a.
- Sections 90 , 92 of the intrinsic base layer 22 are undercut by the partial removal of the device region 14 and, depending on the composition (e.g., silicon without added germanium over a thickness adjacent to the collector 18 ), the partial removal of the intrinsic base layer 22 .
- the undercutting reduces the distance between the interior sidewalls 37 , 39 so that a width, w 4 , of the emitter 18 laterally between the interior sidewalls 37 , 39 and proximate to the intrinsic base layer 22 is reduced in comparison with the initial width, w 3 .
- sections 94 , 96 of the intrinsic base layer 22 are undercut by the selective etching that supplies the inclination of the interior sidewalls 36 , 38 .
- At least a portion of the interior section 16 of the intrinsic base layer 22 retains the width, w 1 , which is greater than the width, w 4 . Assuming equivalent lengths for the interior section 16 of the intrinsic base layer 22 and the collector 18 , then the area of the interior section 16 of the intrinsic base layer 22 is larger than the confronting area of the collector 18 .
- isolation structures 42 , 43 comprised of an electrical insulator are formed in the trenches 34 , 35 .
- a dielectric layer 40 is applied that fills the trenches 34 , 35 respective portions of the electrical insulator.
- the dielectric layer 40 also deposits on the top surface 26 a of the sacrificial layer 26 .
- the dielectric layer 40 may comprise any suitable organic or inorganic dielectric material, which may be an electrical insulator characterized by an electrical resistivity at room temperature of greater than 10 10 ( ⁇ -m).
- dielectric layer 40 may include, but are not limited to, silicon dioxide (SiO 2 ), fluorine-doped silicon glass (FSG), and combinations of these dielectric materials.
- dielectric layer 40 may comprise a low-k dielectric material characterized by a relative permittivity or dielectric constant smaller than the SiO 2 dielectric constant of approximately 3.9.
- Candidate low-k dielectric materials for dielectric layer 40 include, but are not limited to, porous and nonporous spun-on organic low-k dielectrics, such as spin-on spun-on aromatic thermoset polymer resins like polyarylenes, porous and nonporous inorganic low-k dielectrics, such as organosilicate glasses, hydrogen-enriched silicon oxycarbide (SiCOH), and carbon-doped oxides, and combinations of these and other organic and inorganic dielectrics.
- porous and nonporous spun-on organic low-k dielectrics such as spin-on spun-on aromatic thermoset polymer resins like polyarylenes
- porous and nonporous inorganic low-k dielectrics such as organosilicate glasses, hydrogen-enriched silicon oxycarbide (SiCOH), and carbon-doped oxides, and combinations of these and other organic and inorganic dielectrics.
- Dielectric layer 40 may be deposited by any number of techniques including, but not limited to, sputtering, spin-on application, or CVD.
- the dielectric layer 40 may be comprised of an oxide of silicon (e.g., SiO 2 ) that may be deposited by low pressure chemical vapor phase deposition (LPCVD) using a silicon source of either silane or a mixture of silane with nitrogen.
- LPCVD low pressure chemical vapor phase deposition
- the substrate temperature during LPCVD may range from 600° C. to 650° C. and the process chamber pressure during LPCVD may be constrained in a range between 25 Pa and 150 Pa.
- isolation structures 42 , 43 may include subsurface voids 86 , 88 that are introduced into the constituent dielectric material during deposition.
- the voids 86 , 88 operate to lower the composite dielectric constant of the dielectric material comprising isolation structures 42 , 43 .
- the voids 86 , 88 each represent one or more empty spaces devoid of solid matter.
- the voids 86 , 88 may have an effective dielectric constant of approximately unity (about 1 . 0 ) and may be filled by air at or near atmospheric pressure, filled by another gas at or near atmospheric pressure, or contain air or gas below atmospheric pressure (e.g., a partial vacuum) in the completed microelectronic structure.
- the voids 86 , 88 are preferably buried at a depth within the isolation structures 42 , 43 and beneath the top surface 40 a of the dielectric layer 40 such that the voids 86 , 88 remain sealed during subsequent processing steps.
- the dielectric layer 40 is removed from the top surface 26 a of the sacrificial layer 26 , but not from within the trenches 34 , 35 , by a wet etching process or a dry etching process that may be end-pointed based upon exposure of the sacrificial layer 26 or may alternatively be timed. If the dielectric layer 40 is comprised of an oxide of silicon, then RIE or an oxide etch, such as buffered hydrofluoric acid or diluted hydrofluoric acid, may be employed to remove the dielectric layer 40 from the top surface 26 a of sacrificial layer 26 .
- the isolation structures 42 , 43 of the dielectric layer 40 inside the trenches 34 , 35 may be recessed relative to the top surface 26 a of the sacrificial layer 26 but are not removed by the etching process.
- the isolation structures 42 , 43 reproduce the geometrical shape of the trenches 34 , 35 within the device region 14 and are nominally identical to each other.
- Isolation structure 42 has a top surface 42 a , a bottom surface 42 b , and sidewalls 44 a , 44 b that are inclined at angle, a.
- Sidewall 44 a is separated by the section 33 a of the device region 14 from the interior sidewall 13 of the adjacent trench isolation structure 12 .
- the sidewalls 44 a , 44 b of isolation structure 42 diverge in a direction toward the top surface 10 a such that the width of the isolation structure 42 increases in a direction away from the bottom surface 42 b .
- Isolation structure 43 has a top surface 43 a , a bottom surface 43 b , and sidewalls 45 a , 45 b that are inclined at angle, a.
- Sidewall 45 a is separated by the section 33 b of the device region 14 from the interior sidewall 13 of the adjacent trench isolation structure 12 .
- the sidewalls 45 a , 45 b of isolation structure 43 diverge in a direction toward the top surface 10 a such that the width of the isolation structure 43 increases in a direction away from the bottom surface 43 b .
- the collector 18 At or slightly above the top surface 10 a , the collector 18 has the width w 2 because of the inclined sidewalls 44 b , 45 b .
- the inclination of the sidewalls 44 b , 45 b of the isolation structures 42 , 43 relative to the top surface 10 a of the device region 14 may operate to reduce a surface area of a top surface of the emitter 18 relative to a surface area of a contacting surface of a subsequently-formed intrinsic base that is in direct contact with the emitter 18 .
- Isolation structures 42 , 43 surround the emitter 18 and, more specifically, sidewalls 44 b , 45 b are coextensive with (i.e., define a boundary of) the emitter 18 .
- the trench isolation structures 12 are not coextensive with the emitter 18 and, instead, the isolation structures 42 , 43 are laterally positioned between the trench isolation structures 12 and the emitter 18 . Hence, the trench isolation structures 12 do not define the boundaries of the emitter 18 .
- the isolation structures 42 , 43 may comprise lengths of electrical insulator that are aligned parallel to each other. In this embodiment, the isolation structures 42 , 43 do not define a closed geometrical shape. In an alternative embodiment, the isolation structures 42 , 43 may join or may be joined by additional trenches so that the isolation structures 42 , 43 surround or encircle the interior portion of the emitter 18 to form a closed geometrical shape.
- the shallow trench isolation structures 12 extend to a depth, d 1 , measured relative to the top surface 10 a of the substrate 10 and device region 14 .
- the isolation structures 42 , 43 and the trenches 34 , 35 in which the isolation structures 42 , 43 are formed extend to depth, d 2 , measured relative to the top surface 10 a of the substrate 10 and device region 14 .
- the depth, d 2 is shallower than the depth, d 1 .
- the depth difference facilitates the coupling of the sections 33 a , 33 b by the subemitter 20 with the emitter 18 as the subemitter 20 can extend laterally beneath the isolation structures 42 , 43 to provide the coupling.
- the sacrificial layer 26 is removed by, for example, a wet etching process or a dry etching process.
- the sacrificial layer 26 may be partially or completely removed by an etching process, such as a dry etching process or a wet etching process (e.g., an aqueous mixture of nitric acid (HNO 3 ) and hydrofluoric acid (HF)).
- a dry etching process e.g., an aqueous mixture of nitric acid (HNO 3 ) and hydrofluoric acid (HF)
- the base dielectric layer 24 may operate as an etch stop for the removal of the sacrificial layer 26 if the materials comprising the sacrificial layer 26 and base dielectric layer 24 are selected such that the sacrificial layer 26 can be selectively etched relative to base dielectric layer 24 .
- the base dielectric layer 24 is exposed in field regions surrounding the trenches 29 - 32 .
- extrinsic base layer 46 is formed on the top surface 24 a of the base dielectric layer 24 .
- the extrinsic base layer 46 may be comprised of polycrystalline semiconductor material (e.g., polysilicon or polycrystalline SiGe) deposited by CVD process. If the extrinsic base layer 46 is comprised of SiGe, the concentration of Ge may have a graded or an abrupt profile and may include additional layers, such as a Si cap.
- the extrinsic base layer 46 may be in situ doped with a concentration of a dopant, such as an impurity species from Group III of the Periodic Table (e.g., boron) effective to impart p-type conductivity.
- a dopant such as an impurity species from Group III of the Periodic Table (e.g., boron) effective to impart p-type conductivity.
- the entire extrinsic base layer 46 is comprised of polycrystalline or amorphous semiconductor material.
- Dielectric layers 48 , 50 , 52 are then formed in a stack on the extrinsic base layer 46 .
- Dielectric layer 48 which is formed on a top surface 46 a of extrinsic base layer 46 , may directly contact the top surface 46 a .
- Dielectric layer 50 which is formed on a top surface 48 a of dielectric layer 48 , may directly contact the top surface 48 a .
- Dielectric layer 52 which is formed on a top surface 50 a of dielectric layer 50 , may directly contact the top surface 50 a .
- Dielectric layer 48 and dielectric layer 52 may be comprised of the same electrical insulator, such as SiO 2 deposited by CVD.
- Dielectric layer 50 may be comprised of an electrical insulator, such as silicon nitride (Si 3 N 4 ) deposited using CVD, characterized by a different etch selectivity than dielectric layers 48 , 52 .
- Dielectric layers 48 , 50 , 52 are patterned using photolithography and etching processes to define an opening 54 aligned with the emitter 18 .
- a patterned etch mask (not shown) is applied to the dielectric layer 52 .
- the etch mask may be a photoresist layer comprised of a sacrificial organic material applied by spin coating to the top surface 52 a of dielectric layer 52 .
- the photolithography process that patterns the photoresist layer exposes the photoresist to radiation imaged through a photomask and develops the resulting latent feature pattern in the exposed photoresist to define a window at the intended location for the opening 54 .
- the etching process which may be RIE, forms the opening 54 in the dielectric layers 48 , 50 , 52 by sequentially removing regions of each of the dielectric layers 48 , 50 , 52 unprotected by the etch mask.
- the etching process which may be conducted in a single etching step or multiple steps, relies on one or more etch chemistries that remove the individual dielectric layers 48 , 50 , 52 and may comprise one or more discrete timed or end-pointed etches.
- the opening 54 is extended by a controlled etching process, such as RIE, partially extended through the thickness of the extrinsic base layer 46 .
- RIE a controlled etching process
- the top surface 46 a of extrinsic base layer 46 is recessed (i.e., in a different plane) relative to a plane containing the top surface 46 a of the extrinsic base layer 46 in masked regions.
- the etch mask is removed. If comprised of photoresist, the etch mask may be removed by oxygen plasma ashing or chemical stripping.
- Spacers 56 , 57 are formed on the vertical sidewalls of the layers 46 , 48 , 50 , 52 bounding the opening 54 and extend vertically to the base of the opening 54 .
- the spacers 56 , 57 may directly contact the recessed top surface 46 a of extrinsic base layer 46 .
- the spacers 56 , 57 may be formed by depositing a conformal layer comprised of an electrical insulator, such as Si 3 N 4 deposited by CVD, and shaping the conformal layer with an anisotropic etching process, such as RIE, that preferentially removes the electrical insulator from horizontal surfaces.
- the opening 54 is extended in depth completely through the raised region of extrinsic base layer 46 using an anisotropic etching process, such as RIE.
- the etching process removes the material of extrinsic base layer 46 selectively (e.g., at a higher etch rate) to the materials comprising the spacers 56 , 57 and the base dielectric layer 24 .
- the etching process stops on the base dielectric layer 24 .
- Unetched sections 47 , 49 of extrinsic base layer 46 remain adjacent to the opening 54 and beneath the spacers 56 , 57 .
- the opening 54 is then extended in depth through the base dielectric layer 24 by an isotropic etching process, such as a wet chemical etch, that stops on the intrinsic base layer 22 .
- the wet chemical etching process may use either dilute hydrofluoric (DHF) or buffered hydrofluoric (BHF) as an etchant.
- DHF dilute hydrofluoric
- BHF buffered hydrofluoric
- the removal of this region of base dielectric layer 24 exposes the top surface 22 a of intrinsic base layer 22 over a portion of the interior section 16 and defines cavities between the sections 47 , 49 of extrinsic base layer 46 and the intrinsic base layer 22 .
- the isotropic etching process removes the material of base dielectric layer 24 selectively to the materials comprising the spacers 56 , 57 , the extrinsic base layer 46 , and the intrinsic base layer 22 .
- a semiconductor layer 58 is formed as an additive layer on the top surface 22 a of the intrinsic base layer 22 and, in the representative embodiment, is directly formed on the top surface 22 a .
- the semiconductor layer 58 may be comprised of semiconductor material deposited or grown in an epitaxial relationship with the intrinsic base layer 22 .
- the semiconductor material comprising the semiconductor layer 58 may be doped during or following deposition, or may be alternatively undoped.
- the semiconductor layer 58 may have a different composition than either the intrinsic base layer 22 or the extrinsic base layer 46 .
- the semiconductor material of semiconductor layer 58 nucleates on the semiconductor material of the intrinsic base layer 22 and acquires the crystalline state of the intrinsic base layer 22 .
- Sections of the semiconductor layer 58 occupy the cavities between the sections 47 , 49 of extrinsic base layer 46 and the intrinsic base layer 22 . These sections define a link electrically and physically coupling the intrinsic base layer 22 and the extrinsic base layer 46 to provide a direct connection for current flow between the extrinsic base layer 46 and the intrinsic base layer 22 .
- the semiconductor layer 58 may be considered to comprise a portion of the intrinsic base layer 22 .
- spacers 70 , 71 and spacers 72 , 73 are formed on the spacers 56 , 57 with spacers 72 , 73 intervening between spacers 70 , 71 and spacers 56 , 57 .
- Spacers 72 , 73 may be comprised of a dielectric material that is electrically insulating, such as SiO 2 .
- Spacers 70 , 71 may likewise be comprised of a dielectric material that is electrically insulating, such as Si 3 N 4 .
- a collector 74 of the bipolar junction transistor 80 is formed inside the opening 54 .
- the collector 74 may be formed from a layer of semiconductor material that is deposited and then patterned using lithography and etching processes.
- the lithography process may utilize photoresist and photolithography to form an etch mask that protects only a strip of the semiconductor material registered with the opening 54 .
- An etching process that stops on the material of layer 50 is selected to fashion the collector 74 from the protected strip of semiconductor material. The etch mask is subsequently removed.
- the collector 74 at least partially occupies the opening 54 and, in the representative embodiment, fully occupies the opening 54 .
- the collector 74 is electrically and physically coupled with the intrinsic base layer 22 by the semiconductor layer 58 .
- the bottom part of the collector 74 which is located inside the opening 54 , directly contacts the top surface 58 a of the semiconductor layer 58 and indirectly contacts the top surface 22 a of intrinsic base layer 22 because the semiconductor layer 58 intervenes.
- the collector 74 is at least partially above the top surface 10 a of the device region 14 and is preferably entirely above the top surface 10 a .
- a head of the collector 74 protrudes out of the opening 54 and includes lateral arms that overlap with the top surface 50 a of dielectric layer 50 .
- the non-conductive spacers 56 , 57 , and 70 - 73 encircle or surround the collector 74 for electrically isolating the collector 74 from the extrinsic base layer 46 .
- Dielectric layers 48 , 50 are patterned using the same etch mask used to form the collector 74 , and an etching process, such as RIE, with suitable etch chemistries. The etch mask is subsequently removed. Layers 22 , 24 , 46 are then patterned with photolithography and etching processes to define an extrinsic base 82 and an intrinsic base 84 of the bipolar junction transistor 80 from the extrinsic base layer 46 and intrinsic base layer 22 separated by a section of the base dielectric layer 24 . An etch mask is applied for use in a patterning process that relies on an etching process, such as RIE, with respective etch chemistries appropriate to etch the layers 22 , 24 , 46 . Following the etching process, the etch mask is removed.
- an etching process such as RIE
- the collector 74 may be comprised of one or more layers of semiconductor material selected to provide a given electronic bandgap.
- the collector 74 may be formed from a wide bandgap semiconductor material having an electronic bandgap larger than 1.1 electron volts (eV), which is the nominal electronic bandgap of silicon, and less than or equal to 6.3 eV, which is the nominal electronic bandgap of aluminium phosphide (A 1 P).
- Representative semiconductor materials for the collector 74 include, but are not limited to, carbon-doped silicon (Si:C), binary III-V semiconductors such as gallium phosphide (GaP) or AlP, binary II-VI semiconductors such as zinc sulfide (ZnS), tertiary III-V semiconductors such as gallium-arsenide-phosphide (GaAsP) or aluminum-arsenide-phosphide (AlAsP), tertiary II-VI semiconductors such as zinc-selenium-sulfide (ZnSeS) or zinc-magnesium-sulfide (ZnMgS), and quaternary semiconductors.
- Si:C carbon-doped silicon
- binary III-V semiconductors such as gallium phosphide (GaP) or AlP
- binary II-VI semiconductors such as zinc sulfide (ZnS)
- tertiary III-V semiconductors such as gallium-arsen
- the bandgap of, for example, tertiary III-V and II-VI semiconductors may be engineered by selecting a composition and/or layering during heteroepitaxy and may be influenced by strain incorporated into the lattice structure due to lattice mismatch during heteroepitaxy. If the semiconductor materials of device region 14 and semiconductor layer 58 are single crystal silicon, then forming the collector 74 from AlP may provide a close lattice constant match and promote heteroepitaxy.
- the semiconductor material constituting the collector 74 may comprise one or more layers of material formed by an epitaxial growth process, such VPE or molecular beam epitaxy (MBE), such that the semiconductor material constituting the collector 74 has an epitaxial relationship with the semiconductor material of the semiconductor layer 58 and with the semiconductor material of the intrinsic base layer 22 .
- the intrinsic base layer 22 establishes the crystalline template for the epitaxial growth.
- the bipolar junction transistor 80 comprises a heterojunction bipolar transistor in which the semiconductor materials of the emitter 18 , intrinsic base 84 , and collector 74 have different values of electronic bandgap and, in particular, the electronic bandgap for the semiconductor material of the collector 74 is greater than the electronic bandgap of the semiconductor material of the substrate 10 and device region 14 .
- the electronic bandgap of the collector 74 may be greater than 1.1 electron volts (eV) and less than or equal to 6.3 eV, and the electronic bandgap of the substrate 10 and device region 14 may be nominally equal to 1.1 eV.
- the substrate 10 and device region 14 may be comprised of single crystal silicon with a nominal bandgap equal to 1.1 eV and the collector 74 may be comprised of a semiconductor material other than silicon with a bandgap greater than 1.1 eV and less than or equal to 6.3 eV.
- the wide bandgap semiconductor material of the collector 74 may supply an enhanced breakdown voltage for power devices in comparison with device constructions in which the collector is formed in the device region 14 .
- the collector 74 is formed as a concluding step in the representative process flow forming the bipolar junction transistor 80 .
- the collector 74 can incorporate a higher concentration of defects that is tolerable to the device functionality as compared with collectors of conventional device constructions which are formed using the substrate.
- the bipolar junction transistor 80 has a vertical architecture in which the intrinsic base 84 is located between the collector 74 and the emitter 18 , and the collector 74 , the intrinsic base 84 , and the emitter 18 are vertically arranged.
- the conductivity types of the semiconductor material constituting the collector 74 and the semiconductor materials constituting extrinsic base 82 and intrinsic base 84 are opposite.
- One p-n junction is defined at the interface between the collector 74 and the intrinsic base 84 .
- Another p-n junction is defined at the interface between the emitter 18 and the intrinsic base 84 .
- the collector 74 is electrically and physically coupled with the intrinsic base 84 by the semiconductor layer 58 across a surface area that is not impacted by the inclination of the respective interior sidewalls 44 b , 45 b of isolation structures 42 , 43 .
- the surface area across which the collector 74 is indirectly coupled with the intrinsic base 84 may vary and be optimized independent of the surface area across which the emitter 18 is directly coupled with the intrinsic base 84 .
- the emitter 18 can have a critical dimension that is less than or equal to the critical dimension of the collector 74 .
- the surface area of a bottom surface of the intrinsic base 84 is smaller than the coextensive area of a top surface of the emitter 18 due to the inclination of the sidewalls 44 b , 45 b of the isolation structures 42 , 43 relative to the top surface of the device region 14 .
- CMOS complementary metal-oxide-semiconductor
- Standard silicidation and standard back-end-of-line (BEOL) processing follows, which includes formation of contacts and wiring for the local interconnect structure, and formation of dielectric layers, via plugs, and wiring for an interconnect structure coupled by the interconnect wiring with the bipolar junction transistor 80 , as well as other similar contacts for additional device structures like bipolar junction transistor 80 and CMOS transistors (not shown) included in other circuitry fabricated on the substrate 10 .
- Other active and passive circuit elements such as diodes, resistors, capacitors, varactors, and inductors, may be fabricated on substrate 10 and available for use in the BiCMOS integrated circuit.
- a contact 60 is coupled with the emitter 18 by the subemitter 20 and sections 33 a , 33 b of the device region 14 .
- the presence of the isolation structures 42 , 43 and sections 33 a , 33 b of device region 14 permits the emitter 18 to be contacted inside the sidewall 13 (i.e., the inner perimeter) of the trench isolation structures 12 .
- the extrinsic base 82 is contacted by a contact 62
- the collector 74 is contacted by a contact 64 .
- FIG. 9 shows a block diagram of an exemplary design flow 100 used for example, in semiconductor IC logic design, simulation, test, layout, and manufacture.
- Design flow 100 includes processes, machines and/or mechanisms for processing design structures or devices to generate logically or otherwise functionally equivalent representations of the design structures and/or devices described above and shown in FIG. 8 .
- the design structures processed and/or generated by design flow 100 may be encoded on machine-readable transmission or storage media to include data and/or instructions that when executed or otherwise processed on a data processing system generate a logically, structurally, mechanically, or otherwise functionally equivalent representation of hardware components, circuits, devices, or systems.
- Machines include, but are not limited to, any machine used in an IC design process, such as designing, manufacturing, or simulating a circuit, component, device, or system.
- machines may include: lithography machines, machines and/or equipment for generating masks (e.g. e-beam writers), computers or equipment for simulating design structures, any apparatus used in the manufacturing or test process, or any machines for programming functionally equivalent representations of the design structures into any medium (e.g. a machine for programming a programmable gate array).
- Design flow 100 may vary depending on the type of representation being designed. For example, a design flow 100 for building an application specific IC (ASIC) may differ from a design flow 100 for designing a standard component or from a design flow 100 for instantiating the design into a programmable array, for example a programmable gate array (PGA) or a field programmable gate array (FPGA) offered by Altera® Inc. or Xilinx® Inc.
- ASIC application specific IC
- PGA programmable gate array
- FPGA field programmable gate array
- FIG. 9 illustrates multiple such design structures including an input design structure 102 that is preferably processed by a design process 104 .
- Design structure 102 may be a logical simulation design structure generated and processed by design process 104 to produce a logically equivalent functional representation of a hardware device.
- Design structure 102 may also or alternatively comprise data and/or program instructions that when processed by design process 104 , generate a functional representation of the physical structure of a hardware device. Whether representing functional and/or structural design features, design structure 102 may be generated using electronic computer-aided design (ECAD) such as implemented by a core developer/designer.
- ECAD electronic computer-aided design
- design structure 102 When encoded on a machine-readable data transmission, gate array, or storage medium, design structure 102 may be accessed and processed by one or more hardware and/or software modules within design process 104 to simulate or otherwise functionally represent an electronic component, circuit, electronic or logic module, apparatus, device, or system such as those shown in FIG. 8 .
- design structure 102 may comprise files or other data structures including human and/or machine-readable source code, compiled structures, and computer-executable code structures that when processed by a design or simulation data processing system, functionally simulate or otherwise represent circuits or other levels of hardware logic design.
- data structures may include hardware-description language (HDL) design entities or other data structures conforming to and/or compatible with lower-level HDL design languages such as Verilog and VHDL, and/or higher level design languages such as C or C++.
- HDL hardware-description language
- Design process 104 preferably employs and incorporates hardware and/or software modules for synthesizing, translating, or otherwise processing a design/simulation functional equivalent of the components, circuits, devices, or logic structures shown in FIG. 8 to generate a netlist 106 which may contain design structures such as design structure 102 .
- Netlist 106 may comprise, for example, compiled or otherwise processed data structures representing a list of wires, discrete components, logic gates, control circuits, I/O devices, models, etc. that describes the connections to other elements and circuits in an integrated circuit design.
- Netlist 106 may be synthesized using an iterative process in which netlist 106 is resynthesized one or more times depending on design specifications and parameters for the device.
- netlist 106 may be recorded on a machine-readable data storage medium or programmed into a programmable gate array.
- the medium may be a non-volatile storage medium such as a magnetic or optical disk drive, a programmable gate array, a compact flash, or other flash memory. Additionally, or in the alternative, the medium may be a system or cache memory, buffer space, or electrically or optically conductive devices and materials on which data packets may be transmitted and intermediately stored via the Internet, or other networking suitable means.
- Design process 104 may include hardware and software modules for processing a variety of input data structure types including netlist 106 .
- data structure types may reside, for example, within library elements 108 and include a set of commonly used elements, circuits, and devices, including models, layouts, and symbolic representations, for a given manufacturing technology (e.g., different technology nodes, 32 nm, 45 nm, 90 nm, etc.).
- the data structure types may further include design specifications 110 , characterization data 112 , verification data 114 , design rules 116 , and test data files 118 which may include input test patterns, output test results, and other testing information.
- Design process 104 may further include, for example, standard mechanical design processes such as stress analysis, thermal analysis, mechanical event simulation, process simulation for operations such as casting, molding, and die press forming, etc.
- standard mechanical design processes such as stress analysis, thermal analysis, mechanical event simulation, process simulation for operations such as casting, molding, and die press forming, etc.
- One of ordinary skill in the art of mechanical design can appreciate the extent of possible mechanical design tools and applications used in design process 104 without deviating from the scope and spirit of the invention.
- Design process 104 may also include modules for performing standard circuit design processes such as timing analysis, verification, design rule checking, place and route operations, etc.
- Design process 104 employs and incorporates logic and physical design tools such as HDL compilers and simulation model build tools to process design structure 102 together with some or all of the depicted supporting data structures along with any additional mechanical design or data (if applicable), to generate a second design structure 120 .
- Design structure 120 resides on a storage medium or programmable gate array in a data format used for the exchange of data of mechanical devices and structures (e.g. information stored in an IGES, DXF, Parasolid XT, JT, DRG, or any other suitable format for storing or rendering such mechanical design structures).
- design structure 120 preferably comprises one or more files, data structures, or other computer-encoded data or instructions that reside on transmission or data storage media and that when processed by an ECAD system generate a logically or otherwise functionally equivalent form of one or more of the embodiments of the invention shown in FIG. 8 .
- design structure 120 may comprise a compiled, executable HDL simulation model that functionally simulates the devices shown in FIG. 8 .
- Design structure 120 may also employ a data format used for the exchange of layout data of integrated circuits and/or symbolic data format (e.g. information stored in a GDSII (GDS 2 ), GL 1 , OASIS, map files, or any other suitable format for storing such design data structures).
- Design structure 120 may comprise information such as, for example, symbolic data, map files, test data files, design content files, manufacturing data, layout parameters, wires, levels of metal, vias, shapes, data for routing through the manufacturing line, and any other data required by a manufacturer or other designer/developer to produce a device or structure as described above and shown in FIG. 8 .
- Design structure 120 may then proceed to a stage 122 where, for example, design structure 120 : proceeds to tape-out, is released to manufacturing, is released to a mask house, is sent to another design house, is sent back to the customer, etc.
- the method as described above is used in the fabrication of integrated circuit chips.
- the resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form.
- the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections).
- the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product.
- the end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.
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Abstract
Description
- The invention relates generally to semiconductor device fabrication and, in particular, to bipolar junction transistors, fabrication methods for bipolar junction transistors, and design structures for a bipolar junction transistor.
- Bipolar junction transistors are typically found in demanding types of integrated circuits, especially integrated circuits destined for high-frequency applications. One specific application for bipolar junction transistors is in radiofrequency integrated circuits (RFICs), which are found in wireless communications systems, power amplifiers in cellular telephones, and other varieties of high-speed integrated circuits. Bipolar junction transistors may also be combined with complementary metal-oxide-semiconductor (CMOS) field effect transistors in bipolar complementary metal-oxide-semiconductor (BiCMOS) integrated circuits, which take advantage of the positive characteristics of both transistor types in the construction of the integrated circuit.
- Conventional bipolar junction transistors constitute three-terminal electronic devices constituted by three semiconductor regions, namely an emitter, a base, and a collector. An NPN bipolar junction transistor includes two regions of n-type semiconductor material constituting the emitter and collector, and a region of p-type semiconductor material sandwiched between the two regions of n-type semiconductor material to constitute the base. A PNP bipolar junction transistor has two regions of p-type semiconductor material constituting the emitter and collector, and a region of n-type semiconductor material sandwiched between two regions of p-type semiconductor material to constitute the base. Generally, the differing conductivity types of the emitter, base, and collector form a pair of p-n junctions, namely a collector-base junction and an emitter-base junction. A voltage applied across the emitter-base junction of a bipolar junction transistor controls the movement of charge carriers that produce charge flow between the collector and emitters of the bipolar junction transistor.
- Improved device structures, fabrication methods, and design structures are needed that enhance the device performance of bipolar junction transistors.
- In an embodiment of the invention, a method is provided for fabricating a bipolar junction transistor. The method includes forming an emitter in a device region and forming an intrinsic base layer on the emitter. After the emitter is formed, a collector is formed that is separated from the emitter by the intrinsic base layer. The device region is comprised of a first semiconductor material having a first electronic bandgap, and the collector is comprised of a second semiconductor material having a second electronic bandgap greater than the first electronic bandgap.
- In an embodiment of the invention, a device structure is provided for a bipolar junction transistor. The device structure includes a device region comprised of a first semiconductor material having a first electronic bandgap, an emitter in the device region, an intrinsic base on the emitter, and a collector separated from the emitter by the intrinsic base. The collector is comprised of a second semiconductor material having a second electronic bandgap greater than the first electronic bandgap.
- In an embodiment of the invention, a hardware description language (HDL) design structure is encoded on a machine-readable data storage medium. The HDL design structure comprises elements that, when processed in a computer-aided design system, generates a machine-executable representation of a device structure for a bipolar junction transistor. The HDL design structure includes a device region comprised of a first semiconductor material having a first electronic bandgap, an emitter in the device region, an intrinsic base on the emitter, and a collector separated from the emitter by the intrinsic base. The collector is comprised of a second semiconductor material having a second electronic bandgap greater than the first electronic bandgap. The HDL design structure may comprise a netlist. The HDL design structure may also reside on storage medium as a data format used for the exchange of layout data of integrated circuits. The HDL design structure may reside in a programmable gate array.
- The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various embodiments of the invention and, together with a general description of the invention given above and the detailed description of the embodiments given below, serve to explain the embodiments of the invention.
-
FIGS. 1-8 are cross-sectional views of a portion of a substrate at successive fabrication stages of a processing method for fabricating a device structure in accordance with an embodiment of the invention. -
FIG. 9 is a flow diagram of a design process used in semiconductor design, manufacture, and/or test. - With reference to
FIG. 1 and in accordance with an embodiment of the invention, asubstrate 10 includestrench isolation structures 12 that circumscribe and electrically isolate adevice region 14 used in the fabrication of a bipolar junction transistor 80 (FIG. 8 ). Thesubstrate 10 may be any suitable bulk substrate comprising a semiconductor material that a person having ordinary skill in the art would recognize as suitable for forming an integrated circuit. For example,substrate 10 may be comprised of a wafer of a monocrystalline silicon-containing material, such as single crystal silicon with a (100) crystal lattice orientation. The semiconductormaterial comprising substrate 10 may be lightly doped with an impurity to alter its electrical properties and may also include an optional epitaxial layer. The top surface of thedevice region 14 is coextensive with atop surface 10 a of thesubstrate 10. - The
trench isolation structures 12 may be isolation structures formed by a shallow trench isolation (STI) technique that relies on a lithography and dry etching process to define closed-bottomed trenches insubstrate 10, deposit an electrical insulator to fill the trenches, and planarize the electrical insulator relative to thetop surface 10 a of thesubstrate 10 using a chemical mechanical polishing (CMP) process. The electrical insulator may be comprised of an oxide of silicon, such as densified tetraethylorthosilicate (TEOS) deposited by chemical vapor deposition (CVD). Thetrench isolation structures 12 have atop surface 12 a that is nominally coplanar with or slightly below thetop surface 10 a of thesubstrate 10. - The
device region 14 includes anemitter 18 and asubemitter 20 formed as impurity-doped regions of the same conductivity type. A top surface of theemitter 18 may be coextensive with thetop surface 10 a of thesubstrate 10 anddevice region 14. Thesidewall 13 encircles or surrounds theemitter 18 anddevice region 14. More specifically, thesidewall 13 is an interior surface of thetrench isolation structures 12 that is coextensive with thedevice region 14. Theemitter 18 is at least partially beneath thetop surface 10 a of thedevice region 14 and, preferably, is completely below thetop surface 10 a. - The
emitter 18 andsubemitter 20 may be formed by introducing an impurity species to supply an electrically-active dopant. In one embodiment, theemitter 18 and thesubemitter 20 may be formed by separate ion implantations of an n-type impurity species from Group V of the Periodic Table (e.g., phosphorus (P), arsenic (As), or antimony (Sb)) effective to impart an n-type conductivity and, thereafter, annealing to activate the impurity species and alleviate implantation damage. Thesubemitter 20 may be formed by a high-current ion implantation of an n-type impurity species followed by a lengthy, high temperature thermal anneal that dopes a thickness of thesubstrate 10 before the optional epitaxial layer is formed. During stages of the process flow subsequent to implantation, the dopant in theemitter 18 may diffuse laterally and vertically such that substantially the entire central portion ofdevice region 14 becomes impurity doped and, as a result, is structurally and electrically continuous with thesubemitter 20. - An
intrinsic base layer 22 is formed as a continuous additive layer on thetop surface 10 a ofsubstrate 10. Theintrinsic base layer 22 is coupled with theemitter 18. Theintrinsic base layer 22 may be comprised of a semiconductor material, such as silicon-germanium (SiGe) including silicon (Si) and germanium (Ge) in an alloy with the silicon content ranging from 95 atomic percent to 50 atomic percent and the germanium content ranging from 5 atomic percent to 50 atomic percent. The germanium content of theintrinsic base layer 22 may be uniform or the germanium content ofintrinsic base layer 22 may be graded and/or stepped across the thickness ofintrinsic base layer 22. If the germanium content is stepped, a thickness of theintrinsic base layer 22, such as a thickness directly contacting theemitter 18, may not contain any germanium and may be entirely comprised of silicon (Si). Theintrinsic base layer 22 may be doped with one or more impurity species, such as boron and/or carbon. -
Intrinsic base layer 22 may be formed using a low temperature epitaxial (LTE) growth process, such as vapor phase epitaxy (VPE) that may be conducted at a growth temperature ranging from 400° C. to 850° C. The epitaxial growth process may be non-selective as single crystal semiconductor material (e.g., single crystal silicon or SiGe) is epitaxially grown or deposited onto any exposed crystalline surface such as the exposedtop surface 10 a ofdevice region 14, and non-monocrystalline semiconductor material (e.g., polysilicon or polycrystalline SiGe) is deposited non-epitaxially onto the non-crystalline material of thetrench isolation structures 12. For example, the single-crystal semiconductor material of thedevice region 14 serves as a crystalline template for the growth of at least the section ofintrinsic base layer 22 that is coextensive with thedevice region 14. - A base
dielectric layer 24 is formed on atop surface 22 a ofintrinsic base layer 22 and, in the representative embodiment, directly contacts thetop surface 22 a. The basedielectric layer 24 may be comprised of an electrical insulator with a dielectric constant (e.g., a permittivity) characteristic of a dielectric material. In one embodiment, the basedielectric layer 24 may be comprised of a high temperature oxide (HTO) deposited using rapid thermal process (RTP) at temperatures of 500° C. or higher. Alternatively, the basedielectric layer 24 may be comprised of oxide formed by a different deposition process, thermal oxidation of silicon (e.g., oxidation at high pressure with steam (HIPDX)), or a combination of these processes. - A
sacrificial layer 26 is deposited on thetop surface 24 a of the basedielectric layer 24. In a representative embodiment, thesacrificial layer 26 may be comprised of polysilicon or amorphous silicon deposited by CVD using either silane or disilane as a silicon source. Acap layer 28 is applied on atop surface 26 a ofsacrificial layer 26 and may be comprised of a different material type, e.g., silicon dioxide, thansacrificial layer 26 and that is not etched by the selective etching process applied subsequently in the process flow. - With reference to
FIG. 2 in which like reference numerals refer to like features inFIG. 1 and at a subsequent fabrication stage of the processing method, a plurality oftrenches trenches cap layer 28 completely through thecap layer 28, thesacrificial layer 26, the basedielectric layer 24, theintrinsic base layer 22, and into thedevice region 14.Trench 29 includessidewalls 29 a joined by abottom surface 29 b,trench 30 includessidewalls 30 a joined by abottom surface 30 b,trench 31 includessidewalls 31 a joined by abottom surface 31 b, andtrench 32 includessidewalls 32 a joined by abottom surface 32 b. The bottom surfaces 29 b, 30 b, 31 b, 32 b are at a shallower depth than the bottom surface of thetrench isolation structures 12 relative to thetop surface 10 a. Thesidewalls 29 a-32 a are oriented with a substantially vertical and parallel alignment, and may be oriented at respective right angles relative (i.e., perpendicular) to thetop surface 10 a ofsubstrate 10. Additional trenches liketrenches trenches - The
emitter 18 is positioned between the portions oftrenches device region 14, and is characterized by a width w1.Sections device region 14, which may have the same conductivity type as theemitter 18, are disposed between thetrenches sidewall 13 of thetrench isolation structures 12.Section 33 a of thedevice region 14 is coextensive with thesidewall 13 and with theouter sidewall 29 a oftrench 29.Section 33 b of thedevice region 14 is coextensive with thesidewall 13 and with theouter sidewall 32 a oftrench 32. Thesections device region 14 are characterized by a width dimension, w1. Theadjacent sidewalls trenches device region 14. In the representative embodiment, the adjacent sidewalls 3 la, 32 a oftrenches device region 14. An overlyinginterior section 16 of theintrinsic base layer 22, which directly contacts theemitter 18 in the representative embodiment, also has the width, w1. - In one embodiment, the trenches 29-32 may comprise linear open volumes that are aligned parallel to each other and separated by strips of semiconductor material of the
device region 14. In this embodiment, the trenches 29-32 do not have a closed geometrical shape. In an alternative embodiment,trenches trenches collector 18. Thesections device region 14 would likewise join or be joined by additional portions of thedevice region 14 so that thesections trenches - The trenches 29-32 may be formed using a photolithography process and a non-selective etching process. To that end, a mask layer (not shown) may be applied on the top surface of the
cap layer 28. The mask layer may comprise a photoresist that is applied as a layer by a spin coating process, pre-baked, exposed to a radiation projected through a photomask, baked after exposure, and developed with a chemical developer to form an etch mask that includes a pattern of openings coinciding with the intended locations of the trenches 29-32. The pattern of openings is transferred from the mask layer to thesacrificial layer 26, thebase dielectric layer 24, theintrinsic base layer 22, and theemitter 18 to define the trenches 29-32 by the non-selective etching process. The non-selective etching process may comprise a wet etching process or a dry etching process, such as reactive-ion etching (RIE) that producesvertical sidewalls 29 a-32 a. The non-selective etching process, which may be conducted in a single etching step or multiple steps, relies on one or more etch chemistries that remove the materials of thecap layer 28, thesacrificial layer 26, thebase dielectric layer 24, theintrinsic base layer 22, and theemitter 18, and may comprise a timed etch. The mask layer is removed in response to forming the trenches 29-32. If comprised of a photoresist, the mask layer may then be removed by ashing or solvent stripping, followed by a conventional cleaning process. - When formed, the
substrate 10 may be rotationally oriented in the lithography tool used to pattern the mask layer in the photolithography process using a feature on the substrate, such as a notch at a peripheral edge, as an angular reference. Alignment marks on thesubstrate 10 and photomask may also be aligned in the photolithography tool to assist in rotationally orienting thesubstrate 10. The openings subsequently formed in the patterned mask layer are aligned with a crystallographic plane or orientation of the crystalline semiconductor material ofsubstrate 10. For example, the openings may be oriented parallel to the [100] directions of a single crystal silicon substrate. The preferential alignment is transferred by the etching process from the openings in the mask to the portion of the trenches 29-32 in thedevice region 14. In particular, thetrench sidewalls 29 a-32 a are each aligned with a crystallographic plane or orientation of the crystalline semiconductor material ofsubstrate 10. - With reference to
FIG. 3 in which like reference numerals refer to like features inFIG. 2 and at a subsequent fabrication stage of the processing method,trenches device region 14 by modifying the sections of trenches 29-32 within thedevice region 14. Specifically,trenches device region 14 borderingtrenches 29, 30 (FIG. 2 ) to definetrench 34, andtrenches device region 14 borderingtrenches 31, 32 (FIG. 2 ) to definetrench 35.Trenches intrinsic base layer 22. -
Trench 34 includes anexterior sidewall 36 and aninterior sidewall 37 in thedevice region 14 that are continuous with the residual sections oftrenches intrinsic base layer 22.Trench 35 includes anexterior sidewall 38 and aninterior sidewall 39 in thedevice region 14 that are continuous with the residual sections oftrenches intrinsic base layer 22.Trenches collector 18 and, more specifically, sidewalls 37, 39 are coextensive with (i.e., define a boundary of) thecollector 18. Sidewalls 36-39 have a non-perpendicular (i.e., inclined) orientation relative to thetop surface 10 a. In particular, each of the sidewalls 36-39 becomes inclined at an angle, a, relative to thetop surface 10 a ofsubstrate 10 and relative to thesidewalls 29 a-32 a of the sections of trenches 29-32 that remain in theintrinsic base layer 22. The depth of thetrenches trenches - The
trenches device region 14 bordering thesidewalls 29 a-32 a of trenches 29-32 (FIG. 3 ) in all crystallographic directions, but at significantly different etching rates for different crystal directions or planes. For example, silicon etching in TMAH is relatively slow for (111) crystal planes compared to other directions, such as (100) planes or (110) planes. Therefore, the etch pattern formed by the anisotropic etching process proceeds along the crystal planes of higher etching rate and is eventually terminated by the crystal planes of lower etching rate. The absolute etch rates in each crystallographic direction and the relative etch rate in different crystallographic directions may be dependent upon factors such as solution strength (i.e., concentration) and solution temperature of the etchant. The etch time for exposure to the etchant may be selected to be adequate to produce a targeted change in sidewall geometrical shape. In one embodiment, the anisotropic etching process may be a wet chemical etching process that uses an etchant comprising tetramethylammonium hydroxide (TMAH), ammonium hydroxide (NH4OH), ethylenediamine pyrocatechol (EDP), or potassium hydroxide (KOH). - In a representative embodiment in which the
substrate 10 is single crystal silicon having a [100] surface normal and the trenches 29-32 in thedevice region 14 are aligned with a [100] direction, thesidewalls 29 a-32 a are aligned with crystallographically equivalent (110) planes before the anisotropic etching process is performed. After a given timed etch, the sidewalls 36-39 of thetrenches top surface 10 a. - The anisotropic etching process removes the semiconductor material of the
device region 14 ofsubstrate 10 at a considerably higher rate than the semiconductor material comprising at least a portion of theintrinsic base layer 22 and at a considerably higher rate than the electrical insulators comprising thebase dielectric layer 24 andtrench isolation structures 12. In particular, theintrinsic base layer 22 may be comprised of silicon that may include a varying composition with germanium of various contents over different thicknesses in a stepped and/or graded profile. For example, a portion of theintrinsic base layer 22 adjacent to theemitter 18 may be comprised of silicon without germanium and another portion of theintrinsic base layer 22 separated from theemitter 18 by the silicon portion may be comprised of silicon-germanium. If the silicon portion has a higher etch rate than the silicon-germanium portion during the anisotropic etching process of theintrinsic base layer 22 and the silicon-germanium portion is not etched or minimally etched, then thesections sidewalls 29 a-32 a of trenches 29-32 each extending through theintrinsic base layer 22 may nominally retain their original separation, and remain nominally vertical and perpendicular to thetop surface 10 a. -
Sections intrinsic base layer 22 are undercut by the partial removal of thedevice region 14 and, depending on the composition (e.g., silicon without added germanium over a thickness adjacent to the collector 18), the partial removal of theintrinsic base layer 22. The undercutting reduces the distance between theinterior sidewalls emitter 18 laterally between theinterior sidewalls intrinsic base layer 22 is reduced in comparison with the initial width, w3. Similarly,sections intrinsic base layer 22 are undercut by the selective etching that supplies the inclination of theinterior sidewalls interior section 16 of theintrinsic base layer 22 retains the width, w1, which is greater than the width, w4. Assuming equivalent lengths for theinterior section 16 of theintrinsic base layer 22 and thecollector 18, then the area of theinterior section 16 of theintrinsic base layer 22 is larger than the confronting area of thecollector 18. - With reference to
FIG. 4 in which like reference numerals refer to like features inFIG. 3 and at a subsequent fabrication stage of the processing method,isolation structures trenches dielectric layer 40 is applied that fills thetrenches dielectric layer 40 also deposits on thetop surface 26 a of thesacrificial layer 26. Thedielectric layer 40 may comprise any suitable organic or inorganic dielectric material, which may be an electrical insulator characterized by an electrical resistivity at room temperature of greater than 1010(Ω-m). Candidate inorganic dielectric materials fordielectric layer 40 may include, but are not limited to, silicon dioxide (SiO2), fluorine-doped silicon glass (FSG), and combinations of these dielectric materials. Alternatively,dielectric layer 40 may comprise a low-k dielectric material characterized by a relative permittivity or dielectric constant smaller than the SiO2 dielectric constant of approximately 3.9. Candidate low-k dielectric materials fordielectric layer 40 include, but are not limited to, porous and nonporous spun-on organic low-k dielectrics, such as spin-on spun-on aromatic thermoset polymer resins like polyarylenes, porous and nonporous inorganic low-k dielectrics, such as organosilicate glasses, hydrogen-enriched silicon oxycarbide (SiCOH), and carbon-doped oxides, and combinations of these and other organic and inorganic dielectrics. -
Dielectric layer 40 may be deposited by any number of techniques including, but not limited to, sputtering, spin-on application, or CVD. In one specific embodiment, thedielectric layer 40 may be comprised of an oxide of silicon (e.g., SiO2) that may be deposited by low pressure chemical vapor phase deposition (LPCVD) using a silicon source of either silane or a mixture of silane with nitrogen. For example, the substrate temperature during LPCVD may range from 600° C. to 650° C. and the process chamber pressure during LPCVD may be constrained in a range between 25 Pa and 150 Pa. - In the representative embodiment,
isolation structures voids isolation structures voids voids voids isolation structures top surface 40 a of thedielectric layer 40 such that thevoids - With reference to
FIG. 5 in which like reference numerals refer to like features inFIG. 4 and at a subsequent fabrication stage of the processing method, thedielectric layer 40 is removed from thetop surface 26 a of thesacrificial layer 26, but not from within thetrenches sacrificial layer 26 or may alternatively be timed. If thedielectric layer 40 is comprised of an oxide of silicon, then RIE or an oxide etch, such as buffered hydrofluoric acid or diluted hydrofluoric acid, may be employed to remove thedielectric layer 40 from thetop surface 26 a ofsacrificial layer 26. Theisolation structures dielectric layer 40 inside thetrenches top surface 26 a of thesacrificial layer 26 but are not removed by the etching process. - The
isolation structures trenches device region 14 and are nominally identical to each other.Isolation structure 42 has atop surface 42 a, abottom surface 42 b, and sidewalls 44 a, 44 b that are inclined at angle, a.Sidewall 44 a is separated by thesection 33 a of thedevice region 14 from theinterior sidewall 13 of the adjacenttrench isolation structure 12. The sidewalls 44 a, 44 b ofisolation structure 42 diverge in a direction toward thetop surface 10 a such that the width of theisolation structure 42 increases in a direction away from thebottom surface 42 b.Isolation structure 43 has atop surface 43 a, abottom surface 43 b, and sidewalls 45 a, 45 b that are inclined at angle, a.Sidewall 45 a is separated by thesection 33 b of thedevice region 14 from theinterior sidewall 13 of the adjacenttrench isolation structure 12. The sidewalls 45 a, 45 b ofisolation structure 43 diverge in a direction toward thetop surface 10 a such that the width of theisolation structure 43 increases in a direction away from thebottom surface 43 b. At or slightly above thetop surface 10 a, thecollector 18 has the width w2 because of theinclined sidewalls isolation structures top surface 10 a of thedevice region 14 may operate to reduce a surface area of a top surface of theemitter 18 relative to a surface area of a contacting surface of a subsequently-formed intrinsic base that is in direct contact with theemitter 18. -
Isolation structures emitter 18 and, more specifically, sidewalls 44 b, 45 b are coextensive with (i.e., define a boundary of) theemitter 18. Thetrench isolation structures 12 are not coextensive with theemitter 18 and, instead, theisolation structures trench isolation structures 12 and theemitter 18. Hence, thetrench isolation structures 12 do not define the boundaries of theemitter 18. - In one embodiment, the
isolation structures isolation structures isolation structures isolation structures emitter 18 to form a closed geometrical shape. - The shallow
trench isolation structures 12 extend to a depth, d1, measured relative to thetop surface 10 a of thesubstrate 10 anddevice region 14. Theisolation structures trenches isolation structures top surface 10 a of thesubstrate 10 anddevice region 14. The depth, d2 is shallower than the depth, d1. The depth difference facilitates the coupling of thesections subemitter 20 with theemitter 18 as thesubemitter 20 can extend laterally beneath theisolation structures - With reference to
FIG. 6 in which like reference numerals refer to like features inFIG. 5 and at a subsequent fabrication stage of the processing method, thesacrificial layer 26 is removed by, for example, a wet etching process or a dry etching process. In particular, if thesacrificial layer 26 is comprised of polysilicon, thesacrificial layer 26 may be partially or completely removed by an etching process, such as a dry etching process or a wet etching process (e.g., an aqueous mixture of nitric acid (HNO3) and hydrofluoric acid (HF)). Thebase dielectric layer 24 may operate as an etch stop for the removal of thesacrificial layer 26 if the materials comprising thesacrificial layer 26 andbase dielectric layer 24 are selected such that thesacrificial layer 26 can be selectively etched relative to basedielectric layer 24. Thebase dielectric layer 24 is exposed in field regions surrounding the trenches 29-32. - An
extrinsic base layer 46 is formed on thetop surface 24 a of thebase dielectric layer 24. In one embodiment, theextrinsic base layer 46 may be comprised of polycrystalline semiconductor material (e.g., polysilicon or polycrystalline SiGe) deposited by CVD process. If theextrinsic base layer 46 is comprised of SiGe, the concentration of Ge may have a graded or an abrupt profile and may include additional layers, such as a Si cap. Theextrinsic base layer 46 may be in situ doped with a concentration of a dopant, such as an impurity species from Group III of the Periodic Table (e.g., boron) effective to impart p-type conductivity. As a consequence of the deposition process and the non-crystalline nature ofbase dielectric layer 24 on whichextrinsic base layer 46 is formed, the entireextrinsic base layer 46 is comprised of polycrystalline or amorphous semiconductor material. -
Dielectric layers extrinsic base layer 46.Dielectric layer 48, which is formed on atop surface 46 a ofextrinsic base layer 46, may directly contact thetop surface 46 a.Dielectric layer 50, which is formed on atop surface 48 a ofdielectric layer 48, may directly contact thetop surface 48 a.Dielectric layer 52, which is formed on atop surface 50 a ofdielectric layer 50, may directly contact thetop surface 50 a.Dielectric layer 48 anddielectric layer 52 may be comprised of the same electrical insulator, such as SiO2 deposited by CVD.Dielectric layer 50 may be comprised of an electrical insulator, such as silicon nitride (Si3N4) deposited using CVD, characterized by a different etch selectivity thandielectric layers -
Dielectric layers opening 54 aligned with theemitter 18. To that end, a patterned etch mask (not shown) is applied to thedielectric layer 52. In one embodiment, the etch mask may be a photoresist layer comprised of a sacrificial organic material applied by spin coating to thetop surface 52 a ofdielectric layer 52. The photolithography process that patterns the photoresist layer exposes the photoresist to radiation imaged through a photomask and develops the resulting latent feature pattern in the exposed photoresist to define a window at the intended location for theopening 54. The etching process, which may be RIE, forms theopening 54 in thedielectric layers dielectric layers - The
opening 54 is extended by a controlled etching process, such as RIE, partially extended through the thickness of theextrinsic base layer 46. After etching, thetop surface 46 a ofextrinsic base layer 46 is recessed (i.e., in a different plane) relative to a plane containing thetop surface 46 a of theextrinsic base layer 46 in masked regions. After theopening 54 is formed, the etch mask is removed. If comprised of photoresist, the etch mask may be removed by oxygen plasma ashing or chemical stripping. -
Spacers layers opening 54 and extend vertically to the base of theopening 54. Thespacers top surface 46 a ofextrinsic base layer 46. Thespacers - With reference to
FIG. 7 in which like reference numerals refer to like features inFIG. 6 and at a subsequent fabrication stage of the processing method, theopening 54, as narrowed by the presence of thespacers extrinsic base layer 46 using an anisotropic etching process, such as RIE. The etching process removes the material ofextrinsic base layer 46 selectively (e.g., at a higher etch rate) to the materials comprising thespacers base dielectric layer 24. The etching process stops on thebase dielectric layer 24.Unetched sections extrinsic base layer 46 remain adjacent to theopening 54 and beneath thespacers - The
opening 54 is then extended in depth through thebase dielectric layer 24 by an isotropic etching process, such as a wet chemical etch, that stops on theintrinsic base layer 22. If thebase dielectric layer 24 is comprised of SiO2, the wet chemical etching process may use either dilute hydrofluoric (DHF) or buffered hydrofluoric (BHF) as an etchant. The removal of this region ofbase dielectric layer 24 exposes thetop surface 22 a ofintrinsic base layer 22 over a portion of theinterior section 16 and defines cavities between thesections extrinsic base layer 46 and theintrinsic base layer 22. The isotropic etching process removes the material ofbase dielectric layer 24 selectively to the materials comprising thespacers extrinsic base layer 46, and theintrinsic base layer 22. - A
semiconductor layer 58 is formed as an additive layer on thetop surface 22 a of theintrinsic base layer 22 and, in the representative embodiment, is directly formed on thetop surface 22 a. Thesemiconductor layer 58 may be comprised of semiconductor material deposited or grown in an epitaxial relationship with theintrinsic base layer 22. The semiconductor material comprising thesemiconductor layer 58 may be doped during or following deposition, or may be alternatively undoped. Thesemiconductor layer 58 may have a different composition than either theintrinsic base layer 22 or theextrinsic base layer 46. During the deposition process, the semiconductor material ofsemiconductor layer 58 nucleates on the semiconductor material of theintrinsic base layer 22 and acquires the crystalline state of theintrinsic base layer 22. Sections of thesemiconductor layer 58 occupy the cavities between thesections extrinsic base layer 46 and theintrinsic base layer 22. These sections define a link electrically and physically coupling theintrinsic base layer 22 and theextrinsic base layer 46 to provide a direct connection for current flow between theextrinsic base layer 46 and theintrinsic base layer 22. Thesemiconductor layer 58 may be considered to comprise a portion of theintrinsic base layer 22. - With reference to
FIG. 8 in which like reference numerals refer to like features inFIG. 7 and at a subsequent fabrication stage of the processing method, spacers 70, 71 andspacers spacers spacers spacers spacers Spacers Spacers - A
collector 74 of thebipolar junction transistor 80 is formed inside theopening 54. Thecollector 74 may be formed from a layer of semiconductor material that is deposited and then patterned using lithography and etching processes. The lithography process may utilize photoresist and photolithography to form an etch mask that protects only a strip of the semiconductor material registered with theopening 54. An etching process that stops on the material oflayer 50 is selected to fashion thecollector 74 from the protected strip of semiconductor material. The etch mask is subsequently removed. - The
collector 74 at least partially occupies theopening 54 and, in the representative embodiment, fully occupies theopening 54. Thecollector 74 is electrically and physically coupled with theintrinsic base layer 22 by thesemiconductor layer 58. The bottom part of thecollector 74, which is located inside theopening 54, directly contacts thetop surface 58 a of thesemiconductor layer 58 and indirectly contacts thetop surface 22 a ofintrinsic base layer 22 because thesemiconductor layer 58 intervenes. As such, thecollector 74 is at least partially above thetop surface 10 a of thedevice region 14 and is preferably entirely above thetop surface 10 a. A head of thecollector 74 protrudes out of theopening 54 and includes lateral arms that overlap with thetop surface 50 a ofdielectric layer 50. Thenon-conductive spacers collector 74 for electrically isolating thecollector 74 from theextrinsic base layer 46. -
Dielectric layers collector 74, and an etching process, such as RIE, with suitable etch chemistries. The etch mask is subsequently removed.Layers extrinsic base 82 and anintrinsic base 84 of thebipolar junction transistor 80 from theextrinsic base layer 46 andintrinsic base layer 22 separated by a section of thebase dielectric layer 24. An etch mask is applied for use in a patterning process that relies on an etching process, such as RIE, with respective etch chemistries appropriate to etch thelayers - The
collector 74 may be comprised of one or more layers of semiconductor material selected to provide a given electronic bandgap. In one embodiment, thecollector 74 may be formed from a wide bandgap semiconductor material having an electronic bandgap larger than 1.1 electron volts (eV), which is the nominal electronic bandgap of silicon, and less than or equal to 6.3 eV, which is the nominal electronic bandgap of aluminium phosphide (A1P). Representative semiconductor materials for thecollector 74 include, but are not limited to, carbon-doped silicon (Si:C), binary III-V semiconductors such as gallium phosphide (GaP) or AlP, binary II-VI semiconductors such as zinc sulfide (ZnS), tertiary III-V semiconductors such as gallium-arsenide-phosphide (GaAsP) or aluminum-arsenide-phosphide (AlAsP), tertiary II-VI semiconductors such as zinc-selenium-sulfide (ZnSeS) or zinc-magnesium-sulfide (ZnMgS), and quaternary semiconductors. The bandgap of, for example, tertiary III-V and II-VI semiconductors may be engineered by selecting a composition and/or layering during heteroepitaxy and may be influenced by strain incorporated into the lattice structure due to lattice mismatch during heteroepitaxy. If the semiconductor materials ofdevice region 14 andsemiconductor layer 58 are single crystal silicon, then forming thecollector 74 from AlP may provide a close lattice constant match and promote heteroepitaxy. - The semiconductor material constituting the
collector 74 may comprise one or more layers of material formed by an epitaxial growth process, such VPE or molecular beam epitaxy (MBE), such that the semiconductor material constituting thecollector 74 has an epitaxial relationship with the semiconductor material of thesemiconductor layer 58 and with the semiconductor material of theintrinsic base layer 22. In an embodiment in which thesemiconductor layer 58 is absent and thecollector 74 directly contacts theintrinsic base layer 22, theintrinsic base layer 22 establishes the crystalline template for the epitaxial growth. - Forming the
collector 74 after theemitter 18 andintrinsic base 84 provides the flexibility in material selection, and contrasts with the limited ability to tailor the material in device structures having the collector in thedevice region 14. Thebipolar junction transistor 80 comprises a heterojunction bipolar transistor in which the semiconductor materials of theemitter 18,intrinsic base 84, andcollector 74 have different values of electronic bandgap and, in particular, the electronic bandgap for the semiconductor material of thecollector 74 is greater than the electronic bandgap of the semiconductor material of thesubstrate 10 anddevice region 14. In one embodiment, the electronic bandgap of thecollector 74 may be greater than 1.1 electron volts (eV) and less than or equal to 6.3 eV, and the electronic bandgap of thesubstrate 10 anddevice region 14 may be nominally equal to 1.1 eV. In another embodiment, thesubstrate 10 anddevice region 14 may be comprised of single crystal silicon with a nominal bandgap equal to 1.1 eV and thecollector 74 may be comprised of a semiconductor material other than silicon with a bandgap greater than 1.1 eV and less than or equal to 6.3 eV. The wide bandgap semiconductor material of thecollector 74 may supply an enhanced breakdown voltage for power devices in comparison with device constructions in which the collector is formed in thedevice region 14. - The
collector 74 is formed as a concluding step in the representative process flow forming thebipolar junction transistor 80. As a result, thecollector 74 can incorporate a higher concentration of defects that is tolerable to the device functionality as compared with collectors of conventional device constructions which are formed using the substrate. - After patterning, the
bipolar junction transistor 80 has a vertical architecture in which theintrinsic base 84 is located between thecollector 74 and theemitter 18, and thecollector 74, theintrinsic base 84, and theemitter 18 are vertically arranged. The conductivity types of the semiconductor material constituting thecollector 74 and the semiconductor materials constitutingextrinsic base 82 andintrinsic base 84 are opposite. One p-n junction is defined at the interface between thecollector 74 and theintrinsic base 84. Another p-n junction is defined at the interface between theemitter 18 and theintrinsic base 84. - The
collector 74 is electrically and physically coupled with theintrinsic base 84 by thesemiconductor layer 58 across a surface area that is not impacted by the inclination of the respectiveinterior sidewalls isolation structures collector 74 is indirectly coupled with theintrinsic base 84 may vary and be optimized independent of the surface area across which theemitter 18 is directly coupled with theintrinsic base 84. As a result, theemitter 18 can have a critical dimension that is less than or equal to the critical dimension of thecollector 74. In one embodiment, the surface area of a bottom surface of theintrinsic base 84 is smaller than the coextensive area of a top surface of theemitter 18 due to the inclination of the sidewalls 44 b, 45 b of theisolation structures device region 14. - During the front-end-of-line (FEOL) portion of the fabrication process, the device structure of the
bipolar junction transistor 80 is replicated across at least a portion of the surface area of thesubstrate 10. In BiCMOS integrated circuits, complementary metal-oxide-semiconductor (CMOS) transistors (not shown) may be formed using other regions of thesubstrate 10. As a result, both bipolar and CMOS transistors may be available on thesame substrate 10. - Standard silicidation and standard back-end-of-line (BEOL) processing follows, which includes formation of contacts and wiring for the local interconnect structure, and formation of dielectric layers, via plugs, and wiring for an interconnect structure coupled by the interconnect wiring with the
bipolar junction transistor 80, as well as other similar contacts for additional device structures likebipolar junction transistor 80 and CMOS transistors (not shown) included in other circuitry fabricated on thesubstrate 10. Other active and passive circuit elements, such as diodes, resistors, capacitors, varactors, and inductors, may be fabricated onsubstrate 10 and available for use in the BiCMOS integrated circuit. - A
contact 60 is coupled with theemitter 18 by the subemitter 20 andsections device region 14. The presence of theisolation structures sections device region 14 permits theemitter 18 to be contacted inside the sidewall 13 (i.e., the inner perimeter) of thetrench isolation structures 12. Theextrinsic base 82 is contacted by acontact 62, and thecollector 74 is contacted by acontact 64. -
FIG. 9 shows a block diagram of anexemplary design flow 100 used for example, in semiconductor IC logic design, simulation, test, layout, and manufacture.Design flow 100 includes processes, machines and/or mechanisms for processing design structures or devices to generate logically or otherwise functionally equivalent representations of the design structures and/or devices described above and shown inFIG. 8 . The design structures processed and/or generated bydesign flow 100 may be encoded on machine-readable transmission or storage media to include data and/or instructions that when executed or otherwise processed on a data processing system generate a logically, structurally, mechanically, or otherwise functionally equivalent representation of hardware components, circuits, devices, or systems. Machines include, but are not limited to, any machine used in an IC design process, such as designing, manufacturing, or simulating a circuit, component, device, or system. For example, machines may include: lithography machines, machines and/or equipment for generating masks (e.g. e-beam writers), computers or equipment for simulating design structures, any apparatus used in the manufacturing or test process, or any machines for programming functionally equivalent representations of the design structures into any medium (e.g. a machine for programming a programmable gate array). -
Design flow 100 may vary depending on the type of representation being designed. For example, adesign flow 100 for building an application specific IC (ASIC) may differ from adesign flow 100 for designing a standard component or from adesign flow 100 for instantiating the design into a programmable array, for example a programmable gate array (PGA) or a field programmable gate array (FPGA) offered by Altera® Inc. or Xilinx® Inc. -
FIG. 9 illustrates multiple such design structures including aninput design structure 102 that is preferably processed by adesign process 104.Design structure 102 may be a logical simulation design structure generated and processed bydesign process 104 to produce a logically equivalent functional representation of a hardware device.Design structure 102 may also or alternatively comprise data and/or program instructions that when processed bydesign process 104, generate a functional representation of the physical structure of a hardware device. Whether representing functional and/or structural design features,design structure 102 may be generated using electronic computer-aided design (ECAD) such as implemented by a core developer/designer. When encoded on a machine-readable data transmission, gate array, or storage medium,design structure 102 may be accessed and processed by one or more hardware and/or software modules withindesign process 104 to simulate or otherwise functionally represent an electronic component, circuit, electronic or logic module, apparatus, device, or system such as those shown inFIG. 8 . As such,design structure 102 may comprise files or other data structures including human and/or machine-readable source code, compiled structures, and computer-executable code structures that when processed by a design or simulation data processing system, functionally simulate or otherwise represent circuits or other levels of hardware logic design. Such data structures may include hardware-description language (HDL) design entities or other data structures conforming to and/or compatible with lower-level HDL design languages such as Verilog and VHDL, and/or higher level design languages such as C or C++. -
Design process 104 preferably employs and incorporates hardware and/or software modules for synthesizing, translating, or otherwise processing a design/simulation functional equivalent of the components, circuits, devices, or logic structures shown inFIG. 8 to generate anetlist 106 which may contain design structures such asdesign structure 102.Netlist 106 may comprise, for example, compiled or otherwise processed data structures representing a list of wires, discrete components, logic gates, control circuits, I/O devices, models, etc. that describes the connections to other elements and circuits in an integrated circuit design.Netlist 106 may be synthesized using an iterative process in which netlist 106 is resynthesized one or more times depending on design specifications and parameters for the device. As with other design structure types described herein,netlist 106 may be recorded on a machine-readable data storage medium or programmed into a programmable gate array. The medium may be a non-volatile storage medium such as a magnetic or optical disk drive, a programmable gate array, a compact flash, or other flash memory. Additionally, or in the alternative, the medium may be a system or cache memory, buffer space, or electrically or optically conductive devices and materials on which data packets may be transmitted and intermediately stored via the Internet, or other networking suitable means. -
Design process 104 may include hardware and software modules for processing a variety of input data structuretypes including netlist 106. Such data structure types may reside, for example, withinlibrary elements 108 and include a set of commonly used elements, circuits, and devices, including models, layouts, and symbolic representations, for a given manufacturing technology (e.g., different technology nodes, 32 nm, 45 nm, 90 nm, etc.). The data structure types may further includedesign specifications 110,characterization data 112,verification data 114,design rules 116, and test data files 118 which may include input test patterns, output test results, and other testing information.Design process 104 may further include, for example, standard mechanical design processes such as stress analysis, thermal analysis, mechanical event simulation, process simulation for operations such as casting, molding, and die press forming, etc. One of ordinary skill in the art of mechanical design can appreciate the extent of possible mechanical design tools and applications used indesign process 104 without deviating from the scope and spirit of the invention.Design process 104 may also include modules for performing standard circuit design processes such as timing analysis, verification, design rule checking, place and route operations, etc. -
Design process 104 employs and incorporates logic and physical design tools such as HDL compilers and simulation model build tools to processdesign structure 102 together with some or all of the depicted supporting data structures along with any additional mechanical design or data (if applicable), to generate asecond design structure 120.Design structure 120 resides on a storage medium or programmable gate array in a data format used for the exchange of data of mechanical devices and structures (e.g. information stored in an IGES, DXF, Parasolid XT, JT, DRG, or any other suitable format for storing or rendering such mechanical design structures). Similar to designstructure 102,design structure 120 preferably comprises one or more files, data structures, or other computer-encoded data or instructions that reside on transmission or data storage media and that when processed by an ECAD system generate a logically or otherwise functionally equivalent form of one or more of the embodiments of the invention shown inFIG. 8 . In one embodiment,design structure 120 may comprise a compiled, executable HDL simulation model that functionally simulates the devices shown inFIG. 8 . -
Design structure 120 may also employ a data format used for the exchange of layout data of integrated circuits and/or symbolic data format (e.g. information stored in a GDSII (GDS2), GL1, OASIS, map files, or any other suitable format for storing such design data structures).Design structure 120 may comprise information such as, for example, symbolic data, map files, test data files, design content files, manufacturing data, layout parameters, wires, levels of metal, vias, shapes, data for routing through the manufacturing line, and any other data required by a manufacturer or other designer/developer to produce a device or structure as described above and shown inFIG. 8 .Design structure 120 may then proceed to astage 122 where, for example, design structure 120: proceeds to tape-out, is released to manufacturing, is released to a mask house, is sent to another design house, is sent back to the customer, etc. - The method as described above is used in the fabrication of integrated circuit chips. The resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form. In the latter case, the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections). In any case the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product. The end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.
- It will be understood that when an element is described as being “connected” or “coupled” to or with another element, it can be directly connected or coupled to the other element or, instead, one or more intervening elements may be present. In contrast, when an element is described as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. When an element is described as being “indirectly connected” or “indirectly coupled” to another element, there is at least one intervening element present.
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof
- The descriptions of the various embodiments of the present invention have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
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CN102456727A (en) | 2010-10-25 | 2012-05-16 | 上海华虹Nec电子有限公司 | Low collector/base capacitance SiGe heterojunction bipolar transistor structure and manufacturing method thereof |
US8232156B2 (en) * | 2010-11-04 | 2012-07-31 | International Business Machines Corporation | Vertical heterojunction bipolar transistors with reduced base-collector junction capacitance |
US8603885B2 (en) * | 2011-01-04 | 2013-12-10 | International Business Machines Corporation | Flat response device structures for bipolar junction transistors |
US8536012B2 (en) | 2011-07-06 | 2013-09-17 | International Business Machines Corporation | Bipolar junction transistors with a link region connecting the intrinsic and extrinsic bases |
-
2013
- 2013-02-18 US US13/769,500 patent/US8796149B1/en active Active
-
2014
- 2014-03-28 US US14/228,890 patent/US20140231878A1/en not_active Abandoned
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US20140284758A1 (en) * | 2013-03-20 | 2014-09-25 | International Business Machines Corporation | Self-aligned bipolar junction transistors |
US8927381B2 (en) * | 2013-03-20 | 2015-01-06 | International Business Machines Corporation | Self-aligned bipolar junction transistors |
US20150008558A1 (en) * | 2013-03-20 | 2015-01-08 | International Business Machines Corporation | Self-aligned bipolar junction transistors |
US9349845B2 (en) * | 2013-03-20 | 2016-05-24 | Globalfoundries Inc. | Self-aligned bipolar junction transistors |
US20150137186A1 (en) * | 2013-11-19 | 2015-05-21 | International Business Machines Corporation | Formation of an asymmetric trench in a semiconductor substrate and a bipolar semiconductor device having an asymmetric trench isolation region |
US9059233B2 (en) * | 2013-11-19 | 2015-06-16 | International Business Machines Corporation | Formation of an asymmetric trench in a semiconductor substrate and a bipolar semiconductor device having an asymmetric trench isolation region |
US9231089B2 (en) | 2013-11-19 | 2016-01-05 | International Business Machines Corporation | Formation of an asymmetric trench in a semiconductor substrate and a bipolar semiconductor device having an asymmetric trench isolation region |
US9368608B1 (en) | 2015-06-25 | 2016-06-14 | Globalfoundries Inc. | Heterojunction bipolar transistor with improved performance and breakdown voltage |
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US20140231878A1 (en) | 2014-08-21 |
US8796149B1 (en) | 2014-08-05 |
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