US20140225294A1 - Subfloor component and method of manufacturing same - Google Patents
Subfloor component and method of manufacturing same Download PDFInfo
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- US20140225294A1 US20140225294A1 US14/054,498 US201314054498A US2014225294A1 US 20140225294 A1 US20140225294 A1 US 20140225294A1 US 201314054498 A US201314054498 A US 201314054498A US 2014225294 A1 US2014225294 A1 US 2014225294A1
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/26—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/02—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of definite length, i.e. discrete articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/3415—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/36—Feeding the material to be shaped
- B29C44/38—Feeding the material to be shaped into a closed space, i.e. to make articles of definite length
- B29C44/44—Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in solid form
- B29C44/445—Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in solid form in the form of expandable granules, particles or beads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/70—Drying or keeping dry, e.g. by air vents
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B5/00—Floors; Floor construction with regard to insulation; Connections specially adapted therefor
- E04B5/48—Special adaptations of floors for incorporating ducts, e.g. for heating or ventilating
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- E—FIXED CONSTRUCTIONS
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- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/02038—Flooring or floor layers composed of a number of similar elements characterised by tongue and groove connections between neighbouring flooring elements
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- E—FIXED CONSTRUCTIONS
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- E04F15/02194—Flooring consisting of a number of elements carried by a non-rollable common support plate or grid
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- E04F15/06—Flooring or floor layers composed of a number of similar elements of metal, whether or not in combination with other material
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- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/08—Flooring or floor layers composed of a number of similar elements only of stone or stone-like material, e.g. ceramics, concrete; of glass or with a top layer of stone or stone-like material, e.g. ceramics, concrete or glass
- E04F15/082—Flooring or floor layers composed of a number of similar elements only of stone or stone-like material, e.g. ceramics, concrete; of glass or with a top layer of stone or stone-like material, e.g. ceramics, concrete or glass with a top layer of stone or stone-like material, e.g. ceramics, concrete or glass in combination with a lower layer of other material
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins
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- E—FIXED CONSTRUCTIONS
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- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/105—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of organic plastics with or without reinforcements or filling materials
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- E—FIXED CONSTRUCTIONS
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- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
- E04F15/185—Underlayers in the form of studded or ribbed plates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2025/00—Use of polymers of vinyl-aromatic compounds or derivatives thereof as moulding material
- B29K2025/04—Polymers of styrene
- B29K2025/06—PS, i.e. polystyrene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/04—Condition, form or state of moulded material or of the material to be shaped cellular or porous
- B29K2105/048—Expandable particles, beads or granules
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0068—Permeability to liquids; Adsorption
- B29K2995/0069—Permeability to liquids; Adsorption non-permeable
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29L2009/00—Layered products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/10—Building elements, e.g. bricks, blocks, tiles, panels, posts, beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/046—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/26—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
- E04C2/284—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/26—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
- E04C2/284—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating
- E04C2/292—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating composed of insulating material and sheet metal
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/02161—Floor elements with grooved main surface
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- E—FIXED CONSTRUCTIONS
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- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2201/00—Joining sheets or plates or panels
- E04F2201/01—Joining sheets, plates or panels with edges in abutting relationship
- E04F2201/0107—Joining sheets, plates or panels with edges in abutting relationship by moving the sheets, plates or panels substantially in their own plane, perpendicular to the abutting edges
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- E04F2201/0511—Strips or bars, e.g. nailing strips
Definitions
- the following is directed in general to building construction and renovation, and more particularly to a subfloor component and a method of manufacturing a subfloor component.
- a subfloor component is a panel or other component meant to be placed on top of a concrete floor or other foundation before a finished floor of, for example, hardwood or tile is installed.
- the subfloor component may have projections for permitting the flow of moisture underneath the component so as to prevent moisture from standing underneath the subfloor component and causing problems with mold. While subfloor components of varying types are known, improvements are desirable.
- the subfloor component has a moisture-resistant film that conforms to the pedestals of the panel, such the when the pedestals are facing downwards against, for example, a concrete floor, moisture can travel along the concrete floor between the pedestals (ie. along channels formed by the grooves of the panel and the concrete floor) without seeping into the foam of the panel itself.
- Enabling the moisture to travel along the channels enables drainage of the moisture that is on the concrete floor below the panel towards the edges of the panels, rather than form standing-water puddles on the concrete floor.
- the attaching of the moisture-resistant film to the pedestals of the panel provides structural integrity to particularly the foam pedestals of the panel.
- a subfloor component is being transported, or while the subfloor component is being compressed against, for example, a concrete floor during normal use, pieces of foam do not tend to break loose of the panel.
- the moisture-resistant film in addition to preventing ingress of moisture into the panel, tends to keep the foam pedestals intact.
- the moisture-resistant film is fused to the panel, providing an even more integral structure.
- the hardboard layer on the second surface of the panel provides a flat, integrated surface upon which to overlay further flooring made of wood, linoleum, ceramic, stone, cork, bamboo, eucalyptus or other material.
- the hardboard layer against the foam panel provides the combination of flatness, impact-absorption, sound absorption, insulation and resiliency suited well for floors in dwellings.
- each subfloor component may be installed on a concrete floor simply by setting them down on a concrete floor adjacent to each other, or even somewhat spaced from each other.
- each subfloor component is shaped to connect to another subfloor component by way of tongues and grooves on respective edges of the hardboard layer.
- the subfloor components that are so interconnected can provide an overall more uniform surface flatness across subfloor components and discourage shifting of the subfloor components. This can be useful for overlaying further flooring.
- Other structures for interconnecting subfloor components may be employed. For example, pieces of dowel may be inserted into holes in the edges of the hardboard layers that are being installed adjacent to each other, with the dowel spanning between the adjacent subfloor components.
- a wing of a connector may be inserted into the groove, and another wing of the connector inserted into a groove of an adjacent hardboard layer.
- the wings may be dimensioned to frictionally engage the interior of the groove, and may have barbs for the frictional engagement.
- a method of manufacturing a subfloor component comprising providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming a panel having, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel; placing a moisture-resistant film into the mold against the pedestal-forming structures; placing heat-expandable beads into the mold against the moisture-resistant film opposite the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes both the film and the expanding beads to enter into conform to the pedestal-forming structures thereby to form the pedestals of the panel with the moisture-resistant film fused thereto; removing the panel with the fused moisture-resistant film from the mold; and attaching a hardboard layer to the second face of the panel.
- Having the beads and the film in the mold at the same time provides the opportunity for the film to fuse to the panel while the panel itself is being formed, and also causes the film to tightly conform to the pedestals at the same time.
- Providing fusing and conforming at the same time as panel formation is advantageous for expediting and simplifying the manufacturing of the subfloor component.
- a method of manufacturing a subfloor component comprising: providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel; placing heat-expandable beads into the mold; applying heat to the mold to expand the heat-expandable beads to form the panel with the pedestals; placing a moisture-resistant film adjacent to the pedestals; applying heat to fuse the film to at least the pedestals; and attaching a hardboard layer to the second face of the panel.
- FIG. 1 is a perspective view of the underside of one embodiment of a subfloor component
- FIG. 2 is a bottom view of the subfloor component of FIG. 1 ;
- FIG. 3 is a side view of the subfloor component of FIG. 1 ;
- FIG. 4 is an end view of the subfloor component of FIG. 1 ;
- FIG. 5 is a top view of the subfloor component of FIG. 1 ;
- FIG. 6 is a perspective view of the underside of another embodiment of a subfloor component
- FIG. 7 is a bottom view of the subfloor component of FIG. 6 ;
- FIG. 8 is a side view of the subfloor component of FIG. 6 ;
- FIG. 9 is an end view of the subfloor component of FIG. 6 ;
- FIG. 10 is a top view of the subfloor component of FIG. 6 ;
- FIG. 11 is a bottom view of another embodiment of a subfloor component
- FIG. 12 is a side view of the subfloor component of FIG. 11 ;
- FIG. 13 is an end view of the subfloor component of FIG. 11 ;
- FIG. 14 is a top view of the subfloor component of FIG. 11 ;
- FIG. 15 is a bottom view of another embodiment of a subfloor component
- FIG. 16 is a side view of the subfloor component of FIG. 15 ;
- FIG. 17 is an end view of the subfloor component of FIG. 15 ;
- FIG. 18 is a top view of the subfloor component of FIG. 15 ;
- FIG. 19 is a bottom view of another embodiment of a subfloor component
- FIG. 20 is a side view of the subfloor component of FIG. 19 ;
- FIG. 21 is an end view of the subfloor component of FIG. 19 ;
- FIG. 22 is a top view of the subfloor component of FIG. 19 ;
- FIG. 23 is a bottom view of another embodiment of a subfloor component
- FIG. 24 is a side view of the subfloor component of FIG. 22 ;
- FIG. 25 is an end view of the subfloor component of FIG. 22 ;
- FIG. 26 is a top view of the subfloor component of FIG. 22 ;
- FIG. 27 is a bottom view of another embodiment of a subfloor component
- FIG. 28 is a side view of the subfloor component of FIG. 27 ;
- FIG. 29 is an end view of the subfloor component of FIG. 28 ;
- FIG. 30 is a top view of the subfloor component of FIG. 29 ;
- FIG. 31 is a bottom view of another embodiment of a subfloor component
- FIG. 32 is a side view of the subfloor component of FIG. 31 ;
- FIG. 33 is an end view of the subfloor component of FIG. 31 ;
- FIG. 34 is a top view of the subfloor component of FIG. 31 .
- FIG. 35 is a perspective view of a moisture-resistant film layer being placed against pedestal-forming structures that are within one of the components of a mold structure during manufacture of the subfloor component of FIG. 1 ;
- FIG. 36 is a perspective view of expandable polystyrene beads being poured into the mold structure atop the moisture-resistant film layer;
- FIG. 37 is a perspective view of a mold structure being closed prior to applying heat to the mold
- FIG. 38 is a cutaway view of the end of the mold structure enclosing the moisture-resistant film layer and the expandable polystyrene beads while the mold structure is being heated;
- FIG. 39 is a perspective view of the insulating foam panel having been formed with pedestals within the mold and the moisture-resistant film layer fused to the panel's pedestals;
- FIG. 40 is a perspective view of the hardboard layer being aligned with the face of the insulating foam panel that is opposite to the panel's pedestals;
- FIG. 41 is a perspective view of the subfloor component having been formed
- FIG. 42 is a flowchart of steps in a method for manufacturing a subfloor component.
- FIG. 43 is a flowchart of steps in an alternative method for manufacturing a subfloor component.
- Subfloor component 10 is rectangular in shape, and includes a hardboard panel 12 , an insulating foam panel 14 , and a moisture-resistant film 16 .
- the insulating foam panel 14 includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 that have walls that extend into the insulating foam panel 14 from the first face toward the second face.
- the moisture-resistant film 16 is attached to the first face of the panel and conforms to the pedestals 17 .
- the hardboard layer 12 is on the second face of the panel, which is opposite the panel 14 from the first face.
- the hardboard panel 12 is oriented strand board (OSB), a material well-known to be employed in building construction.
- OSB oriented strand board
- the insulating foam panel 14 is formed of expanded polystyrene (EPS), and the hardboard panel 12 is glued to the insulating foam panel 14 .
- the moisture-resistant film 16 is a thin layer of high-impact polystyrene.
- the moisture-resistant film 16 is fused to the insulating foam panel 14 such that the moisture-resistant film 16 is affixed to the top and wall of the pedestals 17 as well as to the bottom of the grooves.
- the subfloor component 10 is to be placed on a foundation floor or other such structure with the pedestals 17 downwards and with the moisture-resistant film 16 between the insulating foam layer 14 and the foundation floor. Moisture on the foundation floor is able to pass between the pedestals 17 and can contact the moisture-resistant film 16 in order to drain away from underneath the subfloor component 10 .
- the moisture-resistant film layer 16 effectively resists the passage of moisture into the insulating foam panel 14 from the foundation floor thereby keeping the insulating foam panel 14 suitably dry.
- the pedestals 17 which are shaped as squares, each have four (4) walls meeting at four (4) edges and four (4) top corners. Particularly the top corners and also the edges are most prone to being broken away during transportation, installation, or usage.
- the present inventor has discovered that, particularly for a subfloor component 10 that will be experiencing various physical pressures from above, advantages are gained by employing a moisture-resistant film 16 that not only resists moisture reaching the insulating foam panel 16 but conforms to the pedestals in order to provide drainage and also increase the structural integrity of the pedestals 17 . In this way, physical pressures both during construction (workers, wheel barrows, other machinery) and when construction is complete (home owners, employees, couches, filing cabinets etc.) can be better withstood by the pedestals 17 .
- the walls of the intersecting grooves have a height of about 15 millimetres, giving the pedestals 17 a corresponding height.
- other heights are possible.
- other embodiments may provide heights of between about 15 millimetres to about 20 millimetres.
- the intersecting grooves have a width of about 15 millimetres, giving the pedestals 17 a corresponding spacing.
- other widths are possible.
- other embodiments may provide widths of between about 15 millimetres to about 20 millimetres. It will be understood that having all grooves have the same width is not required.
- FIGS. 6 through 10 show a subfloor component 10 a according to another embodiment.
- Subfloor component 10 a is square in shape, and includes a hardboard panel 12 a , an insulating foam panel 14 a , and a moisture-resistant film 16 a .
- the insulating foam panel 14 a includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 a that have walls that extend into the insulating foam panel 14 a from the first face toward the second face.
- the moisture-resistant film 16 a is attached to the first face of the panel and conforms to the pedestals 17 a .
- the hardboard layer 12 a is on the second face of the panel, which is opposite the panel 14 a from the first face.
- subfloor component 10 a is similar to subfloor component 10 , but is square instead of rectangular.
- FIGS. 11 through 14 show a subfloor component 10 b according to another embodiment.
- Subfloor component 10 b is square in shape, and includes a hardboard panel 12 b , an insulating foam panel 14 b , and a moisture-resistant film 16 b .
- the insulating foam panel 14 b includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 b that have walls that extend into the insulating foam panel 14 b from the first face toward the second face.
- the moisture-resistant film 16 b is attached to the first face of the panel and conforms to the pedestals 17 b .
- the hardboard layer 12 b is on the second face of the panel, which is opposite the panel 14 b from the first face.
- subfloor component 10 b is similar to subfloor component 10 , but is square instead of rectangular.
- each of the pedestals 17 b are circular, rather than square.
- the pedestals 17 b being circular means that each pedestal 17 b only has one wall, and thus there are no top corners. Because pedestal 17 b does not have any top corners, breakage due to handling or use of the subfloor component 10 b is even less likely.
- FIGS. 15 through 18 show a subfloor component 10 c according to another embodiment.
- Subfloor component 10 c is square in shape, and includes a hardboard panel 12 c , an insulating foam panel 14 c , and a moisture-resistant film 16 c .
- the insulating foam panel 14 c includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 c that have walls that extend into the insulating foam panel 14 c from the first face toward the second face.
- the moisture-resistant film 16 c is attached to the first face of the panel and conforms to the pedestals 17 c .
- the hardboard layer 12 c is on the second face of the panel, which is opposite the panel 14 c from the first face.
- subfloor component 10 c is similar to subfloor component 10 , but is square instead of rectangular.
- each of the pedestals 17 c are oval-shaped, rather than square.
- the pedestals 17 c being oval-shaped means that each pedestal 17 c only has one wall, and thus there are no top corners. Because pedestal 17 c does not have any top corners, breakage due to handling or use of the subfloor component 10 c is less likely.
- FIGS. 19 through 22 show a subfloor component 10 d according to another embodiment.
- Subfloor component 10 d is square in shape, and includes a hardboard panel 12 d , an insulating foam panel 14 d , and a moisture-resistant film 16 d .
- the insulating foam panel 14 d includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 d that have walls that extend into the insulating foam panel 14 d from the first face toward the second face.
- the moisture-resistant film 16 d is attached to the first face of the panel and conforms to the pedestals 17 d .
- the hardboard layer 12 a is on the second face of the panel, which is opposite the panel 14 d from the first face.
- subfloor component 10 d is similar to subfloor component 10 , but is square instead of rectangular.
- pedestals 17 d there are two different sizes of pedestals 17 d , namely a thin rectangle and a thick rectangle.
- FIGS. 23 through 26 show a subfloor component 10 d according to another embodiment.
- Subfloor component 10 e is square in shape, and includes a hardboard panel 12 e , an insulating foam panel 14 e , and a moisture-resistant film 16 e .
- the insulating foam panel 14 e includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 e that have walls that extend into the insulating foam panel 14 e from the first face toward the second face.
- the moisture-resistant film 16 e is attached to the first face of the panel and conforms to the pedestals 17 e .
- the hardboard layer 12 e is on the second face of the panel, which is opposite the panel 14 e from the first face.
- subfloor component 10 e is similar to subfloor component 10 , but is square instead of rectangular.
- the pedestals 17 e are diamond-shaped.
- FIGS. 27 through 30 show a subfloor component 10 f according to another embodiment.
- Subfloor component 10 f is square in shape, and includes a hardboard panel 12 f , an insulating foam panel 14 f , and a moisture-resistant film 16 f .
- the insulating foam panel 14 f includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 f that have walls that extend into the insulating foam panel 14 f from the first face toward the second face.
- the moisture-resistant film 16 f is attached to the first face of the panel and conforms to the pedestals 17 f
- the hardboard layer 12 f is on the second face of the panel, which is opposite the panel 14 f from the first face.
- subfloor component 10 f is similar to subfloor component 10 , but is square instead of rectangular.
- the pedestals 17 f are all rectangles.
- FIGS. 31 through 34 show a subfloor component 10 g according to another embodiment.
- Subfloor component 10 g is square in shape, and includes a hardboard panel 12 g , an insulating foam panel 14 g , and a moisture-resistant film 16 g .
- the insulating foam panel 14 g includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 g that have walls that extend into the insulating foam panel 14 g from the first face toward the second face.
- the moisture-resistant film 16 g is attached to the first face of the panel and conforms to the pedestals 17 g .
- the hardboard layer 12 g is on the second face of the panel, which is opposite the panel 14 g from the first face.
- subfloor component 10 g is similar to subfloor component 10 , but is square instead of rectangular.
- the pedestals 17 g are all hexagons.
- the various subfloor components described herein may generally be used alongside each other in a particular installation, provided that the overall thicknesses of two different panels are similar, and provided that using differently-shaped pedestals in two different subfloor components does not unduly impede the flow of moisture beneath the subfloor components.
- the hardboard layer of adjacent subfloor components have tongue and groove configurations along the edges which abut against each other, such that the tongue of one panel can be received within the groove of the adjacent panel.
- the tongues/grooves may have square, rectangular configurations with or without rounded distal corners.
- FIG. 42 shows a flowchart of steps of a method of manufacturing a subfloor component such as subfloor component 10 described above.
- the treatment of the materials involved in the steps are illustrated in FIGS. 35 through 41 .
- a mold structure is shown have a top portion 50 and a bottom portion 52 . It will be understood that the terms top and bottom may be interchanged with left and right, for example, in the case of a mold structure that stands vertically.
- a generally-flat piece of moisture-resistant film 16 is placed within the bottom portion 52 of the mold structure on top of and therefore adjacent to pedestal-forming structures 54 (step 100 ), as shown in FIG. 35 .
- the pedestal forming structures 52 are part of the mold structure and have a shape corresponding to the shape of the desired pedestals 17 .
- heat-expandable beads 56 are then placed into the mold structure on top of the moisture-resistant film 16 (step 200 ), as shown in FIG. 36 .
- the heat-expandable beads are thus placed against a side of the moisture-resistant film 16 that is opposite the pedestal forming structures 54 . As shown in FIG.
- the mold structure is then closed.
- heat is then applied to the mold structure (step 300 ) so as to cause the heat-expandable beads 56 to expand and fuse together.
- the pressure of the expansion causes both the moisture-resistant film 16 and the expanding beads 56 to enter into and conform to the pedestal-forming structures 54 , as shown in the cutaway view of FIG. 38 .
- the moisture-resistant film being of high-impact polystyrene fuses at its surface under the applied heat to the facing surface of the insulating foam panel 14 being formed.
- the combination is then removed from the mold structure (step 400 ).
- the hardboard layer 12 is then adhered to the combination that was removed from the mold structure (step 500 ), thereby to form the subfloor component 10 .
- FIG. 43 shows a flowchart of steps of an alternative method of manufacturing a subfloor component such as subfloor component 10 described above.
- This method is similar to the method described above, and can be implemented so as to use the same mold structure as described above. However, the method differs in that the film is placed into the mold after the foam panel is formed, and the film is then fused to the formed panel, rather than fused to the panel while the panel is being formed.
- heat-expandable beads 56 are placed within the bottom portion 52 of the mold structure on top of and within the pedestal-forming structures 54 (step 600 ). With the heat-expandable beads 56 inside the bottom portion 52 of the mold structure in this way, they are between top 50 and bottom 52 portions, and the mold structure is then closed.
- heat is then applied to the mold structure (step 700 ) so as to cause the heat-expandable beads 56 to expand and fuse together to form an insulating foam panel 14 . While the heat-expandable beads 56 are expanding to form the insulating foam panel 14 , the pressure of the expansion causes the expanding beads 56 to enter into and conform to the pedestal-forming structures 54 .
- the mold structure is opened and a generally-flat piece of moisture resistant film 16 is then placed within the bottom portion of the mold structure on top of and therefore adjacent to the pedestals 17 of the panel that has been formed (step 800 ).
- the mold is then closed again with both the moisture-resistant film 16 and the formed panel 14 inside.
- the pedestals 17 of the formed foam panel 14 press against the moisture-resistant film 16 so as to cause the moisture-resistant film 16 to enter into and conform to the pedestal-forming structures 54 of the mold structure.
- step 900 heat is then again applied to the mold structure (step 900 ) so as to cause the moisture-resistant film 16 to fuse at its surface under the applied heat to the facing surface of the insulating foam panel 14 that has been formed, in such a way that the moisture-resistant film 16 conforms to, and fuses to, the formed pedestals 17 .
- the combination is then removed from the mold structure (step 1000 ).
- the hardboard layer 12 is then adhered to the combination that was removed from the mold structure (step 1100 ), thereby to form the subfloor component 10 .
- subfloor components 10 may be laid adjacent to each other on a concrete floor or other foundation as described above. This may be done without connecting the subfloor components 10 to each other. However, as discussed, advantages lie in connecting adjacent subfloor components 10 in some manner so as to resist movement of the adjacent subfloor components 10 relative to one another.
- FIG. 44 there is shown an elevational sectional end view of two subfloor components 10 having hardboard layers 12 each with a respective groove 70 . Instead of a tongue/groove configuration, the grooves 70 have openings that face each other, and respective wings 82 of a separate connector 80 may be inserted into the grooves 70 . The wings 82 of the connector 80 extend outward in opposite directions from a central body 84 of the connector 80 .
- the central body 84 of the connector is rectangular in cross-section and, in this embodiment, the wings 82 and central body 84 have a length extending inwards (into the page, ie., along the floor).
- barbs 86 extend from each of the wings 82 for frictionally engaging, or “gripping”, the insides of the grooves 70 to help with resisting of sliding of the connector 80 relative to the subfloor components 10 . While the barb configuration makes it easy for an installer to insert a connector into grooves, alternatively, the wings 82 may be dimensioned to have no barbs but simply to have a thickness that provides frictional engagement with the inside of the grooves.
- the connector 80 may be made entirely of plastic, metal, or another suitable material, and may be a unitary device or be made of two or more interconnected pieces.
- the length of the connector 80 may be less than, the same as, or greater than the corresponding length of a particular subfloor component 10 .
- a connector 80 functions to align the hardboard layers 12 and thereby keep the adjacent subfloor components 10 into which it is inserted from shifting relative to each other thereby providing a more unitary subfloor, and generally on the same plane as each other.
- each of the ends of hardboard layers 12 are recessed slightly from the facing ends of the foam panels 14 so as to accommodate the central body 84 of the connector 80 in a way that permits the facing ends of the foam panels 14 to generally contact each other despite the insertion of the connector 80 between the hardboard layers 12 . That is, each hardboard layer 12 is recessed an amount corresponding to half the thickness of the central body 84 of the connector 80 .
- one of the hardboard layers 12 may be recessed an amount corresponding to the entire thickness of the central body 84 of the connector 80 , rather than just half of the thickness, while the hardboard layer 12 that faces the recessed layer is not recessed at all with respect to its corresponding foam panel 14 .
- the central body 84 of the connector 80 is accommodated entirely by the recession of one of the hardboard layers 12 .
- Other configurations for accommodating a central body 84 are possible.
- a connector may be provided that has no central body 84 but that simply consists of wings 82 with barbs 86 .
- the hardboard layers 12 could therefore be arranged to contact each other in a manner such as is described above for adjacent facing ends of the foam panels 14 .
- the moisture-resistant film may be made of other materials, such as polyethylene, or ABS (Acrylonitrile Butadiene Styrene).
- materials for the hardboard layer may be selected from plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board. Other materials, provided that they may be adhered to the insulating foam panel and provide a suitable amount of rigidity, may be employed for a hardboard layer.
- pedestals are generally uniformly distributed across the insulating foam panel, alternatives may be provided having pedestals that are not so uniformly distributed.
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Abstract
A method of manufacturing a subfloor component comprises providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel; placing heat-expandable beads into the mold; applying heat to the mold to expand the heat-expandable beads to form the panel with the pedestals; placing a moisture-resistant film adjacent to the pedestals; applying heat to fuse the film to at least the pedestals; and attaching a hardboard layer to the second face of the panel.
Description
- This application is a divisional application of U.S. application Ser. No. 13/489,712 filed on Jun. 6, 2012, which is a continuation-in-part of U.S. patent application Ser. No. 13/412,038 filed on Mar. 5, 2012.
- The following is directed in general to building construction and renovation, and more particularly to a subfloor component and a method of manufacturing a subfloor component.
- A subfloor component is a panel or other component meant to be placed on top of a concrete floor or other foundation before a finished floor of, for example, hardwood or tile is installed. The subfloor component may have projections for permitting the flow of moisture underneath the component so as to prevent moisture from standing underneath the subfloor component and causing problems with mold. While subfloor components of varying types are known, improvements are desirable.
- According to an aspect, there is provided a subfloor component comprising an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves to define, in cross-section, a plurality of pedestals having walls that extend into the panel from the first face toward the second face; a moisture-resistant film attached to the first face of the panel and that conforms to the pedestals; and a hardboard layer on the second face of the panel.
- Advantageously, the subfloor component has a moisture-resistant film that conforms to the pedestals of the panel, such the when the pedestals are facing downwards against, for example, a concrete floor, moisture can travel along the concrete floor between the pedestals (ie. along channels formed by the grooves of the panel and the concrete floor) without seeping into the foam of the panel itself.
- Enabling the moisture to travel along the channels enables drainage of the moisture that is on the concrete floor below the panel towards the edges of the panels, rather than form standing-water puddles on the concrete floor.
- The attaching of the moisture-resistant film to the pedestals of the panel provides structural integrity to particularly the foam pedestals of the panel. Thus, while a subfloor component is being transported, or while the subfloor component is being compressed against, for example, a concrete floor during normal use, pieces of foam do not tend to break loose of the panel. In other words, the moisture-resistant film, in addition to preventing ingress of moisture into the panel, tends to keep the foam pedestals intact.
- In one embodiment, the moisture-resistant film is fused to the panel, providing an even more integral structure.
- The hardboard layer on the second surface of the panel provides a flat, integrated surface upon which to overlay further flooring made of wood, linoleum, ceramic, stone, cork, bamboo, eucalyptus or other material. The hardboard layer against the foam panel provides the combination of flatness, impact-absorption, sound absorption, insulation and resiliency suited well for floors in dwellings.
- Multiple subfloor components may be installed on a concrete floor simply by setting them down on a concrete floor adjacent to each other, or even somewhat spaced from each other. However, in one embodiment, each subfloor component is shaped to connect to another subfloor component by way of tongues and grooves on respective edges of the hardboard layer. The subfloor components that are so interconnected can provide an overall more uniform surface flatness across subfloor components and discourage shifting of the subfloor components. This can be useful for overlaying further flooring. Other structures for interconnecting subfloor components may be employed. For example, pieces of dowel may be inserted into holes in the edges of the hardboard layers that are being installed adjacent to each other, with the dowel spanning between the adjacent subfloor components.
- In one aspect, a wing of a connector may be inserted into the groove, and another wing of the connector inserted into a groove of an adjacent hardboard layer. The wings may be dimensioned to frictionally engage the interior of the groove, and may have barbs for the frictional engagement.
- According to another aspect, there is provided a method of manufacturing a subfloor component, comprising providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming a panel having, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel; placing a moisture-resistant film into the mold against the pedestal-forming structures; placing heat-expandable beads into the mold against the moisture-resistant film opposite the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes both the film and the expanding beads to enter into conform to the pedestal-forming structures thereby to form the pedestals of the panel with the moisture-resistant film fused thereto; removing the panel with the fused moisture-resistant film from the mold; and attaching a hardboard layer to the second face of the panel.
- Having the beads and the film in the mold at the same time provides the opportunity for the film to fuse to the panel while the panel itself is being formed, and also causes the film to tightly conform to the pedestals at the same time. Providing fusing and conforming at the same time as panel formation is advantageous for expediting and simplifying the manufacturing of the subfloor component.
- According to another aspect, there is provided a method of manufacturing a subfloor component, comprising: providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel; placing heat-expandable beads into the mold; applying heat to the mold to expand the heat-expandable beads to form the panel with the pedestals; placing a moisture-resistant film adjacent to the pedestals; applying heat to fuse the film to at least the pedestals; and attaching a hardboard layer to the second face of the panel.
- These together with other aspects and advantages, which will be subsequently apparent, reside in the details of construction and operation as more fully hereinafter described and claimed, reference being had to the accompanying drawings forming a part hereof, wherein like numerals refer to like parts throughout.
- A detailed description of the preferred embodiment is set forth in detail below, with reference to the following drawings, in which:
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FIG. 1 is a perspective view of the underside of one embodiment of a subfloor component; -
FIG. 2 is a bottom view of the subfloor component ofFIG. 1 ; -
FIG. 3 is a side view of the subfloor component ofFIG. 1 ; -
FIG. 4 is an end view of the subfloor component ofFIG. 1 ; -
FIG. 5 is a top view of the subfloor component ofFIG. 1 ; -
FIG. 6 is a perspective view of the underside of another embodiment of a subfloor component; -
FIG. 7 is a bottom view of the subfloor component ofFIG. 6 ; -
FIG. 8 is a side view of the subfloor component ofFIG. 6 ; -
FIG. 9 is an end view of the subfloor component ofFIG. 6 ; -
FIG. 10 is a top view of the subfloor component ofFIG. 6 ; -
FIG. 11 is a bottom view of another embodiment of a subfloor component; -
FIG. 12 is a side view of the subfloor component ofFIG. 11 ; -
FIG. 13 is an end view of the subfloor component ofFIG. 11 ; -
FIG. 14 is a top view of the subfloor component ofFIG. 11 ; -
FIG. 15 is a bottom view of another embodiment of a subfloor component; -
FIG. 16 is a side view of the subfloor component ofFIG. 15 ; -
FIG. 17 is an end view of the subfloor component ofFIG. 15 ; -
FIG. 18 is a top view of the subfloor component ofFIG. 15 ; -
FIG. 19 is a bottom view of another embodiment of a subfloor component; -
FIG. 20 is a side view of the subfloor component ofFIG. 19 ; -
FIG. 21 is an end view of the subfloor component ofFIG. 19 ; -
FIG. 22 is a top view of the subfloor component ofFIG. 19 ; -
FIG. 23 is a bottom view of another embodiment of a subfloor component; -
FIG. 24 is a side view of the subfloor component ofFIG. 22 ; -
FIG. 25 is an end view of the subfloor component ofFIG. 22 ; -
FIG. 26 is a top view of the subfloor component ofFIG. 22 ; -
FIG. 27 is a bottom view of another embodiment of a subfloor component; -
FIG. 28 is a side view of the subfloor component ofFIG. 27 ; -
FIG. 29 is an end view of the subfloor component ofFIG. 28 ; -
FIG. 30 is a top view of the subfloor component ofFIG. 29 ; -
FIG. 31 is a bottom view of another embodiment of a subfloor component; -
FIG. 32 is a side view of the subfloor component ofFIG. 31 ; -
FIG. 33 is an end view of the subfloor component ofFIG. 31 ; -
FIG. 34 is a top view of the subfloor component ofFIG. 31 . -
FIG. 35 is a perspective view of a moisture-resistant film layer being placed against pedestal-forming structures that are within one of the components of a mold structure during manufacture of the subfloor component ofFIG. 1 ; -
FIG. 36 is a perspective view of expandable polystyrene beads being poured into the mold structure atop the moisture-resistant film layer; -
FIG. 37 is a perspective view of a mold structure being closed prior to applying heat to the mold; -
FIG. 38 is a cutaway view of the end of the mold structure enclosing the moisture-resistant film layer and the expandable polystyrene beads while the mold structure is being heated; -
FIG. 39 is a perspective view of the insulating foam panel having been formed with pedestals within the mold and the moisture-resistant film layer fused to the panel's pedestals; -
FIG. 40 is a perspective view of the hardboard layer being aligned with the face of the insulating foam panel that is opposite to the panel's pedestals; and -
FIG. 41 is a perspective view of the subfloor component having been formed; -
FIG. 42 is a flowchart of steps in a method for manufacturing a subfloor component; and -
FIG. 43 is a flowchart of steps in an alternative method for manufacturing a subfloor component. - In
FIGS. 1 through 5 , there is shown asubfloor component 10 according to an embodiment.Subfloor component 10 is rectangular in shape, and includes ahardboard panel 12, an insulatingfoam panel 14, and a moisture-resistant film 16. The insulatingfoam panel 14 includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section,multiple pedestals 17 that have walls that extend into the insulatingfoam panel 14 from the first face toward the second face. The moisture-resistant film 16 is attached to the first face of the panel and conforms to thepedestals 17. Thehardboard layer 12 is on the second face of the panel, which is opposite thepanel 14 from the first face. - In this embodiment, the
hardboard panel 12 is oriented strand board (OSB), a material well-known to be employed in building construction. Also in this embodiment, the insulatingfoam panel 14 is formed of expanded polystyrene (EPS), and thehardboard panel 12 is glued to the insulatingfoam panel 14. Furthermore, in this embodiment the moisture-resistant film 16 is a thin layer of high-impact polystyrene. - In this embodiment, the moisture-
resistant film 16 is fused to the insulatingfoam panel 14 such that the moisture-resistant film 16 is affixed to the top and wall of thepedestals 17 as well as to the bottom of the grooves. Thesubfloor component 10 is to be placed on a foundation floor or other such structure with thepedestals 17 downwards and with the moisture-resistant film 16 between the insulatingfoam layer 14 and the foundation floor. Moisture on the foundation floor is able to pass between thepedestals 17 and can contact the moisture-resistant film 16 in order to drain away from underneath thesubfloor component 10. The moisture-resistant film layer 16 effectively resists the passage of moisture into the insulatingfoam panel 14 from the foundation floor thereby keeping the insulatingfoam panel 14 suitably dry. - The fusing of the moisture-
resistant film 16 and the insulatingfoam panel 14 enables thepedestals 17 to which the moisture-resistant film is conforming to have increased resistance to breakage. As would be understood, as useful as expanded EPS is for insulation, it can be brittle. In this embodiment, thepedestals 17, which are shaped as squares, each have four (4) walls meeting at four (4) edges and four (4) top corners. Particularly the top corners and also the edges are most prone to being broken away during transportation, installation, or usage. The present inventor has discovered that, particularly for asubfloor component 10 that will be experiencing various physical pressures from above, advantages are gained by employing a moisture-resistant film 16 that not only resists moisture reaching the insulatingfoam panel 16 but conforms to the pedestals in order to provide drainage and also increase the structural integrity of thepedestals 17. In this way, physical pressures both during construction (workers, wheel barrows, other machinery) and when construction is complete (home owners, employees, couches, filing cabinets etc.) can be better withstood by thepedestals 17. - In this embodiment, the walls of the intersecting grooves have a height of about 15 millimetres, giving the
pedestals 17 a corresponding height. However, other heights are possible. For example, other embodiments may provide heights of between about 15 millimetres to about 20 millimetres. Furthermore, in this embodiment, the intersecting grooves have a width of about 15 millimetres, giving thepedestals 17 a corresponding spacing. However, other widths are possible. For example, other embodiments may provide widths of between about 15 millimetres to about 20 millimetres. It will be understood that having all grooves have the same width is not required. - While the above-described
subfloor component 10 can be useful for many purposes, the present inventor has also developed additional embodiments. For example,FIGS. 6 through 10 show asubfloor component 10 a according to another embodiment.Subfloor component 10 a is square in shape, and includes ahardboard panel 12 a, an insulatingfoam panel 14 a, and a moisture-resistant film 16 a. Like the embodiment described inFIGS. 1 through 5 , the insulatingfoam panel 14 a includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section,multiple pedestals 17 a that have walls that extend into the insulatingfoam panel 14 a from the first face toward the second face. The moisture-resistant film 16 a is attached to the first face of the panel and conforms to thepedestals 17 a. Thehardboard layer 12 a is on the second face of the panel, which is opposite thepanel 14 a from the first face. As can be seen,subfloor component 10 a is similar tosubfloor component 10, but is square instead of rectangular. -
FIGS. 11 through 14 show asubfloor component 10 b according to another embodiment.Subfloor component 10 b is square in shape, and includes ahardboard panel 12 b, an insulatingfoam panel 14 b, and a moisture-resistant film 16 b. Like the embodiment described inFIGS. 1 through 5 , the insulatingfoam panel 14 b includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section,multiple pedestals 17 b that have walls that extend into the insulatingfoam panel 14 b from the first face toward the second face. The moisture-resistant film 16 b is attached to the first face of the panel and conforms to thepedestals 17 b. Thehardboard layer 12 b is on the second face of the panel, which is opposite thepanel 14 b from the first face. As can be seen,subfloor component 10 b is similar tosubfloor component 10, but is square instead of rectangular. Furthermore, each of thepedestals 17 b are circular, rather than square. Thepedestals 17 b being circular means that eachpedestal 17 b only has one wall, and thus there are no top corners. Becausepedestal 17 b does not have any top corners, breakage due to handling or use of thesubfloor component 10 b is even less likely. -
FIGS. 15 through 18 show asubfloor component 10 c according to another embodiment.Subfloor component 10 c is square in shape, and includes ahardboard panel 12 c, an insulatingfoam panel 14 c, and a moisture-resistant film 16 c. Like the embodiment described inFIGS. 1 through 5 , the insulatingfoam panel 14 c includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section,multiple pedestals 17 c that have walls that extend into the insulatingfoam panel 14 c from the first face toward the second face. The moisture-resistant film 16 c is attached to the first face of the panel and conforms to thepedestals 17 c. Thehardboard layer 12 c is on the second face of the panel, which is opposite thepanel 14 c from the first face. As can be seen,subfloor component 10 c is similar tosubfloor component 10, but is square instead of rectangular. Furthermore, each of thepedestals 17 c are oval-shaped, rather than square. Thepedestals 17 c being oval-shaped means that eachpedestal 17 c only has one wall, and thus there are no top corners. Becausepedestal 17 c does not have any top corners, breakage due to handling or use of thesubfloor component 10 c is less likely. -
FIGS. 19 through 22 show asubfloor component 10 d according to another embodiment.Subfloor component 10 d is square in shape, and includes ahardboard panel 12 d, an insulatingfoam panel 14 d, and a moisture-resistant film 16 d. Like the embodiment described inFIGS. 1 through 5 , the insulatingfoam panel 14 d includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section,multiple pedestals 17 d that have walls that extend into the insulatingfoam panel 14 d from the first face toward the second face. The moisture-resistant film 16 d is attached to the first face of the panel and conforms to thepedestals 17 d. Thehardboard layer 12 a is on the second face of the panel, which is opposite thepanel 14 d from the first face. As can be seen,subfloor component 10 d is similar tosubfloor component 10, but is square instead of rectangular. Furthermore, there are two different sizes ofpedestals 17 d, namely a thin rectangle and a thick rectangle. -
FIGS. 23 through 26 show asubfloor component 10 d according to another embodiment.Subfloor component 10 e is square in shape, and includes ahardboard panel 12 e, an insulatingfoam panel 14 e, and a moisture-resistant film 16 e. Like the embodiment described inFIGS. 1 through 5 , the insulatingfoam panel 14 e includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section,multiple pedestals 17 e that have walls that extend into the insulatingfoam panel 14 e from the first face toward the second face. The moisture-resistant film 16 e is attached to the first face of the panel and conforms to thepedestals 17 e. Thehardboard layer 12 e is on the second face of the panel, which is opposite thepanel 14 e from the first face. As can be seen,subfloor component 10 e is similar tosubfloor component 10, but is square instead of rectangular. Furthermore, thepedestals 17 e are diamond-shaped. -
FIGS. 27 through 30 show asubfloor component 10 f according to another embodiment.Subfloor component 10 f is square in shape, and includes ahardboard panel 12 f, an insulatingfoam panel 14 f, and a moisture-resistant film 16 f. Like the embodiment described inFIGS. 1 through 5 , the insulatingfoam panel 14 f includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section,multiple pedestals 17 f that have walls that extend into the insulatingfoam panel 14 f from the first face toward the second face. The moisture-resistant film 16 f is attached to the first face of the panel and conforms to thepedestals 17 f Thehardboard layer 12 f is on the second face of the panel, which is opposite thepanel 14 f from the first face. As can be seen,subfloor component 10 f is similar tosubfloor component 10, but is square instead of rectangular. Furthermore, thepedestals 17 f are all rectangles. -
FIGS. 31 through 34 show asubfloor component 10 g according to another embodiment.Subfloor component 10 g is square in shape, and includes ahardboard panel 12 g, an insulatingfoam panel 14 g, and a moisture-resistant film 16 g. Like the embodiment described inFIGS. 1 through 5 , the insulatingfoam panel 14 g includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section,multiple pedestals 17 g that have walls that extend into the insulatingfoam panel 14 g from the first face toward the second face. The moisture-resistant film 16 g is attached to the first face of the panel and conforms to thepedestals 17 g. Thehardboard layer 12 g is on the second face of the panel, which is opposite thepanel 14 g from the first face. As can be seen,subfloor component 10 g is similar tosubfloor component 10, but is square instead of rectangular. Furthermore, thepedestals 17 g are all hexagons. - It will be understood that a subfloor component with pedestals of different shapes, including others not disclosed above, or mixtures of differently-shaped pedestals such as those described above, may be provided.
- The various subfloor components described herein may generally be used alongside each other in a particular installation, provided that the overall thicknesses of two different panels are similar, and provided that using differently-shaped pedestals in two different subfloor components does not unduly impede the flow of moisture beneath the subfloor components. In one embodiment, the hardboard layer of adjacent subfloor components have tongue and groove configurations along the edges which abut against each other, such that the tongue of one panel can be received within the groove of the adjacent panel. The tongues/grooves may have square, rectangular configurations with or without rounded distal corners.
-
FIG. 42 shows a flowchart of steps of a method of manufacturing a subfloor component such assubfloor component 10 described above. The treatment of the materials involved in the steps are illustrated inFIGS. 35 through 41 . InFIG. 35 , a mold structure is shown have atop portion 50 and abottom portion 52. It will be understood that the terms top and bottom may be interchanged with left and right, for example, in the case of a mold structure that stands vertically. - First, a generally-flat piece of moisture-
resistant film 16 is placed within thebottom portion 52 of the mold structure on top of and therefore adjacent to pedestal-forming structures 54 (step 100), as shown inFIG. 35 . Thepedestal forming structures 52 are part of the mold structure and have a shape corresponding to the shape of the desired pedestals 17. With the moisture-resistant film 16 adjacent to the pedestal-formingstructures 54, heat-expandable beads 56 are then placed into the mold structure on top of the moisture-resistant film 16 (step 200), as shown inFIG. 36 . The heat-expandable beads are thus placed against a side of the moisture-resistant film 16 that is opposite thepedestal forming structures 54. As shown inFIG. 37 , with the moisture-resistant film 16 and the heat-expandable beads 56 within the mold structure between top 50 and bottom 52 portions, the mold structure is then closed. At this point, heat is then applied to the mold structure (step 300) so as to cause the heat-expandable beads 56 to expand and fuse together. While the heat-expandable beads 56 are expanding to form the insulatingfoam panel 14, the pressure of the expansion causes both the moisture-resistant film 16 and the expandingbeads 56 to enter into and conform to the pedestal-formingstructures 54, as shown in the cutaway view ofFIG. 38 . The moisture-resistant film being of high-impact polystyrene fuses at its surface under the applied heat to the facing surface of the insulatingfoam panel 14 being formed. - With the insulating
foam panel 14 having been formed withpedestals 17 and having been fused to moisture-resistant film 16, as shown inFIG. 39 , the combination is then removed from the mold structure (step 400). As shown inFIGS. 40 and 41 , thehardboard layer 12 is then adhered to the combination that was removed from the mold structure (step 500), thereby to form thesubfloor component 10. -
FIG. 43 shows a flowchart of steps of an alternative method of manufacturing a subfloor component such assubfloor component 10 described above. This method is similar to the method described above, and can be implemented so as to use the same mold structure as described above. However, the method differs in that the film is placed into the mold after the foam panel is formed, and the film is then fused to the formed panel, rather than fused to the panel while the panel is being formed. Turning toFIG. 43 , heat-expandable beads 56 are placed within thebottom portion 52 of the mold structure on top of and within the pedestal-forming structures 54 (step 600). With the heat-expandable beads 56 inside thebottom portion 52 of the mold structure in this way, they are between top 50 and bottom 52 portions, and the mold structure is then closed. At this point, heat is then applied to the mold structure (step 700) so as to cause the heat-expandable beads 56 to expand and fuse together to form an insulatingfoam panel 14. While the heat-expandable beads 56 are expanding to form the insulatingfoam panel 14, the pressure of the expansion causes the expandingbeads 56 to enter into and conform to the pedestal-formingstructures 54. - With the insulating
foam panel 14 having been formed withpedestals 17, the mold structure is opened and a generally-flat piece of moistureresistant film 16 is then placed within the bottom portion of the mold structure on top of and therefore adjacent to thepedestals 17 of the panel that has been formed (step 800). The mold is then closed again with both the moisture-resistant film 16 and the formedpanel 14 inside. Thepedestals 17 of the formedfoam panel 14 press against the moisture-resistant film 16 so as to cause the moisture-resistant film 16 to enter into and conform to the pedestal-formingstructures 54 of the mold structure. At this point, heat is then again applied to the mold structure (step 900) so as to cause the moisture-resistant film 16 to fuse at its surface under the applied heat to the facing surface of the insulatingfoam panel 14 that has been formed, in such a way that the moisture-resistant film 16 conforms to, and fuses to, the formed pedestals 17. - With the insulating
foam panel 14 having been formed withpedestals 17 and the moisture-resistant film 16 having been fused to thefoam panel 14, as shown inFIG. 39 , the combination is then removed from the mold structure (step 1000). Thehardboard layer 12 is then adhered to the combination that was removed from the mold structure (step 1100), thereby to form thesubfloor component 10. - As discussed above,
subfloor components 10 may be laid adjacent to each other on a concrete floor or other foundation as described above. This may be done without connecting thesubfloor components 10 to each other. However, as discussed, advantages lie in connectingadjacent subfloor components 10 in some manner so as to resist movement of theadjacent subfloor components 10 relative to one another. Turning now toFIG. 44 , there is shown an elevational sectional end view of twosubfloor components 10 havinghardboard layers 12 each with arespective groove 70. Instead of a tongue/groove configuration, thegrooves 70 have openings that face each other, andrespective wings 82 of aseparate connector 80 may be inserted into thegrooves 70. Thewings 82 of theconnector 80 extend outward in opposite directions from acentral body 84 of theconnector 80. Thecentral body 84 of the connector is rectangular in cross-section and, in this embodiment, thewings 82 andcentral body 84 have a length extending inwards (into the page, ie., along the floor). In this embodiment,barbs 86 extend from each of thewings 82 for frictionally engaging, or “gripping”, the insides of thegrooves 70 to help with resisting of sliding of theconnector 80 relative to thesubfloor components 10. While the barb configuration makes it easy for an installer to insert a connector into grooves, alternatively, thewings 82 may be dimensioned to have no barbs but simply to have a thickness that provides frictional engagement with the inside of the grooves. - The
connector 80 may be made entirely of plastic, metal, or another suitable material, and may be a unitary device or be made of two or more interconnected pieces. - The length of the
connector 80 may be less than, the same as, or greater than the corresponding length of aparticular subfloor component 10. Aconnector 80 functions to align the hardboard layers 12 and thereby keep theadjacent subfloor components 10 into which it is inserted from shifting relative to each other thereby providing a more unitary subfloor, and generally on the same plane as each other. It will be noted that each of the ends of hardboard layers 12 are recessed slightly from the facing ends of thefoam panels 14 so as to accommodate thecentral body 84 of theconnector 80 in a way that permits the facing ends of thefoam panels 14 to generally contact each other despite the insertion of theconnector 80 between the hardboard layers 12. That is, eachhardboard layer 12 is recessed an amount corresponding to half the thickness of thecentral body 84 of theconnector 80. - In an alternative configuration, one of the hardboard layers 12 may be recessed an amount corresponding to the entire thickness of the
central body 84 of theconnector 80, rather than just half of the thickness, while thehardboard layer 12 that faces the recessed layer is not recessed at all with respect to itscorresponding foam panel 14. In this way, thecentral body 84 of theconnector 80 is accommodated entirely by the recession of one of the hardboard layers 12. Other configurations for accommodating acentral body 84 are possible. - In another alternative configuration, a connector may be provided that has no
central body 84 but that simply consists ofwings 82 withbarbs 86. With such a configuration, there may be a less rigid connection between hardboard layers 12. Advantageously, however, there would be no requirement for recession of one or both hardboard layers 12 to accommodate a central body in this case, and the hardboard layers 12 could therefore be arranged to contact each other in a manner such as is described above for adjacent facing ends of thefoam panels 14. - The many features and advantages of the invention are apparent from the detailed specification and, thus, it is intended by the appended claims to cover all such features and advantages of the invention that fall within the true purpose of the invention. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the invention to the exact operation illustrated and described, and accordingly all suitable modifications and equivalents may be resorted to, falling within the purpose and scope of the invention.
- For example, the moisture-resistant film may be made of other materials, such as polyethylene, or ABS (Acrylonitrile Butadiene Styrene). Furthermore, materials for the hardboard layer may be selected from plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board. Other materials, provided that they may be adhered to the insulating foam panel and provide a suitable amount of rigidity, may be employed for a hardboard layer.
- Furthermore, while in the embodiments disclosed above the pedestals are generally uniformly distributed across the insulating foam panel, alternatives may be provided having pedestals that are not so uniformly distributed.
Claims (14)
1. A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;
placing a moisture-resistant film into the mold adjacent to the pedestal-forming structures;
placing heat-expandable beads into the mold against the moisture-resistant film opposite the pedestal-forming structures;
applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes both the film and the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel with the moisture-resistant film fused thereto;
removing the panel with the fused moisture-resistant film from the mold; and
attaching a hardboard layer to the second face of the panel.
2. The method of claim 1 , wherein heat-expandable beads are expandable polystyrene (EPS) beads.
3. The method of claim 2 , wherein the moisture-resistant film comprises a material selected from the group consisting of: high-impact polystyrene, polyethylene, and ABS (Acrylonitrile Butadiene Styrene).
4. The method of claim 1 , wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel.
5. The method of claim 1 , wherein the hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
6. The method of claim 1 , further comprising:
shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
7. A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;
placing heat-expandable beads into the mold;
applying heat to the mold to expand the heat-expandable beads to form the panel with the pedestals;
placing a moisture-resistant film adjacent to the pedestals;
applying heat to fuse the film to at least the pedestals; and
attaching a hardboard layer to the second face of the panel.
8. The method of claim 7 , wherein the placing a moisture-resistant film adjacent to the pedestals comprises placing the moisture-resistant film within the mold adjacent to the pedestals, and the applying heat to fuse the film to at least the pedestals comprises applying heat to the mold to fuse the film to at least the pedestals.
9. The method of claim 7 , wherein heat-expandable beads are expandable polystyrene (EPS) beads.
10. The method of claim 9 , wherein the moisture-resistant film comprises a material selected from the group consisting of: high-impact polystyrene, polyethylene, and ABS (Acrylonitrile Butadiene Styrene).
11. The method of claim 7 , wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel.
12. The method of claim 7 , wherein the hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
13. The method of claim 7 , further comprising:
shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
14. The method of claim 7 , further comprising:
shaping the hardboard layer with at least one groove.
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US20150315801A1 (en) | 2015-11-05 |
US20130227904A1 (en) | 2013-09-05 |
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CA2779036C (en) | 2015-04-28 |
CA2779036A1 (en) | 2013-09-05 |
EP2636817A3 (en) | 2014-05-14 |
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