US20140216692A1 - Heat dissipating devices and methods - Google Patents
Heat dissipating devices and methods Download PDFInfo
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- US20140216692A1 US20140216692A1 US14/240,241 US201114240241A US2014216692A1 US 20140216692 A1 US20140216692 A1 US 20140216692A1 US 201114240241 A US201114240241 A US 201114240241A US 2014216692 A1 US2014216692 A1 US 2014216692A1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
- H01L31/0521—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells using a gaseous or a liquid coolant, e.g. air flow ventilation, water circulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- Photovoltaic devices for converting the sun's energy to electrical energy can be used as a supplemental (or even primary) power source.
- the deployment of photovoltaic devices for commercial and residential electricity consumers is continuing to increase. Due to conversion efficiencies, however, photovoltaic devices often have a large “footprint” and consume valuable “real estate,” meaning that photovoltaic devices are often large in size and can take up substantial space on rooftops and/or at other installations. Therefore, recent development efforts have turned to concentrating photovoltaic devices (CPV), which use optics (e.g., mirrors or lenses) to focus the sun's energy onto smaller photovoltaic substrates.
- CPV photovoltaic devices
- the primary driver behind CPV is cost. The idea for CPV is to use relatively inexpensive optics in conjunction with a small amount of expensive, very high efficiency photovoltaics, providing an overall reduction in the cost to produce electricity.
- Concentrating photovoltaic devices convert a portion of the incoming energy from the sun into electricity, with the balance of energy being left to dissipate as heat during operation. If not properly dissipated, this heat can shorten the life span of various components and/or generally result in poor performance of the photovoltaic devices.
- thermal management systems are available for other heat generating devices, such as computer systems and electronics. These thermal management systems may include a heat sink and/or a cooling fan.
- the heat sink is positioned adjacent the electronic components generating the most heat to absorb this heat.
- a cooling fan may be positioned to blow air across the heat sink to dissipate heat into the surrounding environment. While cooling fans can often be effectively implemented in computer systems and other electronic devices because of the controlled environment, photovoltaic devices by their very nature are often located outdoors and thus subject to harsh environmental conditions. Fans may become corroded and/or inoperable. In addition, fans consume energy, counter to the main purpose of photovoltaic technology, and may not provide sufficient cooling for the high temperatures generated by concentrated photovoltaic devices.
- FIG. 1 a is a perspective view of an example heat dissipating device.
- FIG. 1 b is an exploded perspective view of the example heat dissipating device shown in FIG. 1 a.
- FIG. 1 c is a diagrammatic view illustrating operation of the example heat dissipating device shown in FIG. 1 a.
- FIG. 1 d shows an example operating environment for the heat dissipating device shown in FIG. 1 a.
- FIG. 2 a is a perspective view of another example heat dissipating device.
- FIG. 2 b is an exploded perspective view of the example heat dissipating device shown in FIG. 2 a.
- FIG. 2 c is a diagrammatic view illustrating operation of the example heat dissipating device shown in FIG. 2 a.
- FIG. 3 a is a perspective view of another example heat dissipating device.
- FIG. 3 b is an exploded perspective view of the example heat dissipating device shown in FIG. 3 a.
- FIG. 4 is a partial exploded perspective view of another example heat dissipating device.
- FIG. 5 is a perspective view of another example heat dissipating device.
- FIG. 6 is a side view of another example heat dissipating device.
- FIG. 7 is a bottom perspective view of another example heat dissipating device.
- FIG. 8 is a perspective view of another example heat dissipating device.
- FIGS. 9 a - c are side views of still other example heat dissipating devices.
- Concentrated photovoltaic devices generate large quantities of heat by the very nature of their operation (i.e., focusing the energy of the sun onto a relatively small area). It is noted that the photovoltaic devices do not “generate” heat. Rather, the heat energy represents a portion of the sun's energy that is not converted into electricity. This heat is absorbed by the photovoltaic and dissipated (transferred away from the photovoltaic) by conduction, convection, and radiation. Dissipation of the heat generated by photovoltaic devices may be employed to help prevent damage and enhance operation and lifetime of the devices. It is noted that the heat dissipating devices and methods described herein are not limiting to use with concentrating photovoltaic device, and may be implemented with other heat-generating devices (e.g., computer systems and other electronic devices).
- An example device includes an evaporation zone where a working fluid undergoes a change from a liquid phase to a vapor phase.
- a condensing zone interfaces with a heat sink in thermal communication with an external environment.
- the working fluid in the vapor phase changes back to the liquid phase in the condensing zone.
- a wick structure transports the working fluid in the liquid phase to the evaporation zone.
- the heat dissipating devices and methods operate in a nearly isothermal heat transfer mode (e.g., offering high thermal conductance), providing efficient heat transfer.
- the devices and methods also operate in a passive mode, with no moving parts or external power consumption.
- the devices may be manufactured in diverse and custom forms (e.g., tubular, flat, loop, and groove shapes, to name only a few examples), to fit a variety of geometries, and are relatively low weight.
- other applications also include, but are not limited to, electronics cooling, satellite thermal control, temperature calibration, and waste, heat recovery.
- the terms “includes” and “including” mean, but is not limited to, “includes” or “including” and “includes at least” or “including at least.”
- the term “based on” means “based on” and “based at least in part on.”
- FIG. 1 a is a perspective view of an example heat dissipating device 100 .
- FIG. 1 b is an exploded perspective view of the example heat dissipating device 100 shown in FIG. 1 a .
- the heat dissipating device 100 may include a body 105 .
- the body 105 may be sealed so that a working fluid 110 (see FIG. 1 c ) is contained therein.
- a photovoltaic substrate 101 a - b may be about 3 mm by 3 mm with a 50 mm by 50 mm aperture, as shown for example in FIG. 3 a (although the substrate can be scaled depending on use), and attached to the front and/or back side of the body 105 .
- Electrical leads 102 a - d are shown as these may be used to deliver electrical energy generated by the photovoltaic substrate 101 a - b to a storage device (e.g., battery), transmission line (e.g., an electric grid), or end-use (e.g., operating an electrical device).
- a storage device e.g., battery
- transmission line e.g., an electric grid
- end-use e.g., operating an electrical device.
- the body may include a front cover 115 a, a back cover 115 b, a frame 120 , a channel insert 125 , and a wick 130 .
- the body 105 may be assembled such that the wick 130 is provided adjacent the channel insert 125 in the frame 120 to form zones for the working fluid 110 (see FIG. 1 c ).
- the front cover 115 a and back cover 115 b may be assembled on the frame 120 to enclose the structure and form the body 105 of the heat dissipating device 100 .
- FIG. 1 c is a diagrammatic view illustrating operation of the example heat dissipating device 100 shown in FIG. 1 a .
- the working fluid 110 may be provided in a boundary 140 formed between an interior wall 121 of the frame 120 and an exterior wall 126 of the channel insert 125 .
- the working fluid 110 may be a liquid which can rapidly undergo phase change from a liquid to a vapor and back to a liquid again.
- Example working fluids 110 include, but not limited to, helium, nitrogen, ammonia, acetone, methanol, ethanol, water, and toluene, to name only a few examples.
- the specific working fluid 110 may be selected based on design considerations, such as thermal conductivity and boiling point. During use, the liquid phase working fluid 110 undergoes phase changes to absorb, transport, and release heat.
- the channel insert 125 and wick 130 within the body 105 forms an evaporation zone 145 a, where the working fluid 110 undergoes a phase change (illustrated by arrow 150 a ) from a liquid phase (illustrated by arrow 155 a ) to a vapor phase (illustrated by arrow 155 b ).
- the channel insert 125 and wick 130 within the body 105 also forms a condensation or condensing zone 145 b, where the working fluid 110 undergoes a phase change (illustrated by arrow 150 b ) from the vapor phase 155 b to the liquid phase 155 a.
- the condensing zone 145 b interfaces with a heat sink 160 in thermal communication with an external environment.
- the photovoltaic substrate 101 may generate heat. This heat may be transferred to the body 105 of the heat dissipating device 100 .
- the working fluid 110 absorbs the heat during the phase change 150 a from the liquid phase 155 a to the vapor phase 155 b.
- the wick 130 transports the working fluid to the evaporation zone 145 a.
- the working fluid 110 is then returned to the condensing zone 145 b , where the working fluid 110 releases heat as the working fluid 110 undergoes the phase change 150 b from the vapor phase 155 b to the liquid phase 155 a .
- Heat may be transferred to the heat sink 160 (as illustrated by arrows 165 ) and dissipated by the heat sink 160 to the external environment.
- the heat applied to the evaporation zone 145 a vaporizes the working fluid 110 to form a saturated or superheated vapor.
- the vapor pressure drives the vapor through adiabatic section to the condensing zone 145 b.
- the vapor condenses, relating heat to the heat sink 160 .
- Capillary pressure created by the wick 130 serves as a pumping mechanism to move the condensed working fluid back into the evaporation zone 145 a.
- the process is substantially continuous and cyclical during operation.
- the heat sink may include aluminum conduction plates.
- the aluminum conduction plates may have a thermal conductivity of about 500-1200 W/m-K and offers a low resistance (e.g., less than about 15° C./W.
- the aluminum conduction plates may also be relatively thin (e.g., about 4 mm thick). Use of this materials enables efficient heat removal (e.g., providing a heat flux of about 300 W/cm 2 ) in relatively flat configurations.
- Further operations may include transporting the working fluid 110 in an adiabatic zone 145 c with substantially no heat transfer. It is noted that there may be some heat transfer even in the adiabatic zone. However, it is intended that heat transfer occurs largely in the evaporation zone (i.e., heat absorbed by the working fluid) and the condensation zone (i.e., heat released by the working fluid into the heat sink), and that heat is transported by the working fluid in the adiabatic zone.
- Still further operations may include transporting heat away from a concentrating photovoltaic device using a high-rate thermodynamic cycle.
- Yet further operations may include recycling the working fluid through repeated condensation and capillary action.
- FIG. 1 d shows an example operating environment 170 for the heat dissipating device 100 shown in FIG. 1 a .
- the operating environment 170 includes arrays 175 a - d of concentrating photovoltaic devices. Any number of arrays 175 a - d may be provided, and each array 175 a - d may include any number of photovoltaic substrates 101 mounted on any number of heat dissipating devices 100 . Directing sunlight onto the photovoltaic substrates 101 is illustrated by the dashed lines in FIG. 1 d . It is noted that the end banks include photovoltaic substrates 101 on one side of the body 105 , and the middle banks include photovoltaic substrates 101 on both sides of the body 105 in this example.
- FIG. 1 d The configuration shown in FIG. 1 d is only intended to be illustrative and not limiting.
- a sub-support may be provided (e.g., a plastic or metal tray below the arrays).
- Other structures may also be provided as housing (not shown).
- the sun's rays are reflected by optics (e.g., mirrors) 180 onto the photovoltaic substrate 101 .
- the arrangement and configuration of the optics 180 is such that, in an example, the resulting concentration of the sun's rays onto a given area of the photovoltaic substrate 101 represents an increase of about 300 to 1200 times the energy of direct normal incident light of the sun.
- the heat dissipating device 100 is not limited to any particular optics arrangement and concentration of the sun's energy. The heat dissipating device 100 may be scaled to accommodate various concentrating arrangements.
- heat generated at the photovoltaic substrate 101 is absorbed by the working fluid 110 in the evaporation zone 145 a (see FIG. 1 c ).
- the working fluid 110 is then transported to the condensation zone 145 b, where the heat is transferred (as illustrated by arrows 165 in FIG. 1 c ) to the heat sink 160 .
- the heat sink 160 may include any suitable structure.
- the heat sink 160 is illustrated as a metal support structure for heat dissipating devices 100 and is provided beneath the optics 180 .
- the heat sink 160 includes a plurality of legs 161 a - e , which spread apart and away from the photovoltaic substrate 101 so that heat can be dissipated to the surrounding environment.
- Other configurations of the heat sink 160 are also contemplated.
- FIG. 2 a is a perspective view of another example heat dissipating device 200 .
- FIG. 2 b is an exploded perspective view of the example heat dissipating device 200 shown in FIG. 2 a .
- FIG. 2 c diagrammatic view illustrating operation of the example heat dissipating device 200 shown in FIG. 2 a.
- the heat dissipating device 200 may include a body 205 .
- the body 205 may be sealed so that a working fluid 210 (see FIG. 2 c ) is contained therein.
- a photovoltaic substrate 201 a-b may be attached to the front and/or back side of the body 205 .
- Electrical leads 202 a - d are shown as these may be used to deliver electrical energy generated by the photovoltaic substrate 201 a - b.
- the body may include a cover 215 , a sleeve or frame 220 , a wick 225 , and a channel insert 230 .
- the body 205 may be assembled such that the channel insert 230 is provided within the wick 225 , which is in turn provided in the frame 220 .
- the channel insert 230 has a hollow interior and is open on the top (see FIG. 2 c ).
- the cover 215 may be assembled on the frame 220 to enclose the structure and form the body 205 of the heat dissipating device 200 .
- the working fluid 210 may be provided in a boundary 240 formed within the frame 220 .
- the wick 225 and channel insert 230 within the body 205 forms an evaporation zone 245 a, where the working fluid 210 undergoes a phase change (illustrated by arrow 250 a ) from a liquid phase (illustrated by arrow 255 a ) to a vapor phase (illustrated by arrow 255 b ).
- the wick 225 and channel insert 230 within the body 205 also form a condensation or condensing zone 245 b, where the working fluid 210 undergoes a phase change (illustrated by arrow 255 b ) from the vapor phase 255 b to the liquid phase 255 a.
- the condensing zone 245 interfaces with a heat sink 260 in thermal communication with an external environment.
- the photovoltaic substrate 201 may generate heat. This heat may be transferred to the body 205 of the heat dissipating device 200 .
- the working fluid 210 absorbs the heat during the phase change 250 a from the liquid phase 255 a to the vapor phase 255 b.
- the wick 230 transports the working fluid through the evaporation zone 245 a.
- the working fluid 210 is then returned to the condensing zone 245 b , where the working fluid 210 releases heat as the working fluid 210 undergoes the phase change 250 b from the vapor phase 255 b to the liquid phase 255 a .
- Heat may be transferred to the heat sink 260 (as illustrated by arrows 265 ) and dissipated by the heat sink 260 to the external environment.
- the heat sink 260 may be similar to the heat sink 160 described above with reference to FIG. 1 d.
- FIGS. 3-7 Several examples of other heat dissipating devices will now be described with reference to FIGS. 3-7 . It is noted that 300 - 700 series reference numbers are used in FIGS. 3-7 , respectively, to describe similar components as already described above for FIGS. 1 and 2 . Therefore the description of each of these components may not be described again below. These additional examples are only illustrative and not intended to be limiting. Still other examples are also contemplated as will be readily appreciated by those having ordinary skill in the art after becoming familiar with the teachings herein.
- FIG. 3 a is a perspective view of another example heat dissipating device 300 .
- FIG. 3 b is an exploded perspective view of the example heat dissipating device 300 shown in FIG. 3 a.
- the heat dissipating device 300 may include a body 305 .
- the body 305 may be sealed so that a working fluid (not shown) is contained therein.
- a photovoltaic substrate 301 may be attached to the body 305 on a dielectric 306 .
- Electrical leads 302 a - b are shown as these may be used to deliver electrical energy generated by the photovoltaic substrate 301 .
- the body may include a cover 315 , a frame 320 , a channel structure 325 formed in the frame 320 , and a wick 330 .
- the body 305 may be assembled such that the wick 330 is provided over the channel structure 325 .
- the cover 315 may be assembled on the frame 320 to enclose the structure and form the body 305 of the heat dissipating device 300 .
- the working fluid may be provided in a boundary 340 formed within the frame 320 .
- the channel structure 325 and wick 330 within the body 305 forms an evaporation zone, where the working fluid undergoes a phase change from a liquid phase to a vapor phase.
- the channel structure 325 and wick 330 within the body 305 also forms a condensation or condensing zone, where the working fluid undergoes a phase change from the vapor phase to the liquid phase.
- the condensing zone interfaces with a heat sink 360 in thermal communication with an external environment.
- the heat sink 360 is formed as part of the body 305 .
- FIG. 4 is a partial exploded perspective view of another example heat dissipating device 400 .
- the heat dissipating device 400 may include a body 405 .
- the body 405 may be sealed so that a working fluid (not shown) is contained therein.
- a photovoltaic substrate 401 may be attached to the body 405 .
- Electrical leads 402 a - b are shown as these may be used to deliver electrical energy generated by the photovoltaic substrate 401 .
- the body may include a cover or cap 415 , a frame 420 , a channel structure 425 formed in the frame 420 .
- the channel structure 425 also functions as a wick to transport condensed fluid back to the evaporation zone behind the photovoltaic substrates.
- the body 405 may be assembled such that the channel structure 425 slides into the frame 420 .
- the cap 415 may be assembled on the frame 420 to enclose the structure and form the body 405 of the heat dissipating device 400 .
- the working fluid may be provided in a boundary formed within the frame 420 .
- the channel (and wick) structure 425 within the body 405 forms an evaporation zone, where the working fluid undergoes a phase change from a liquid phase to a vapor phase.
- the channel structure 425 within the body 305 also forms a condensation or condensing zone.
- the condensing zone is along the top face of the channel, where heat is dumped to the heat sink fins above. Again, the condensing zone is where the working fluid undergoes a phase change from the vapor phase to the liquid phase.
- the condensing zone interfaces with a heat sink 460 in thermal communication with an external environment.
- the heat sink 460 is formed as part of the body 305 .
- FIG. 5 is a perspective view of another example heat dissipating device 500 .
- the heat dissipating device 500 may include a body 505 .
- the body 405 may be sealed so that a working fluid (not shown) is contained therein.
- a photovoltaic substrate 501 may be attached to the body 505 .
- the body 505 in this embodiment is a simple block that interfaces to the cylindrical heat pipe, allowing simple conductive thermal communication between a flat PV and cylindrical heat pipe, which includes the working fluid and wick.
- a copper-water cylindrical design is perhaps the simplest and most “commodity-like” heatpipe configuration.
- the body may be configured similarly to any of the above-described examples, wherein the interior is fluidically connected to a pipe 502 , wherein the phase change from liquid to vapor occurs in the body 505 to absorb heat generated by the photovoltaic substrate 501 .
- the vapor is delivered adiabatically through the pipe 502 to a condensing zone formed adjacent the heat sink 560 , where the working fluid releases heat while undergoing a phase change from vapor liquid.
- the heat sink 560 is formed as a stack of disks. Other structures for the heat sink 560 are also contemplated.
- FIG. 6 is a side view of another example heat dissipating device 600 .
- the heat dissipating device 600 may include a body 605 .
- the body 605 is illustrated as a ‘box’ for purposes of simplifying the drawings, and may be sealed so that a working fluid (not shown) is contained therein as described above for other examples.
- a photovoltaic substrate 601 a and 601 b ) may be attached to the body 605 . It is noted that sunlight is reflected onto photovoltaic substrates 601 a and 601 b by optics not shown in FIG. 6 (refer to FIG.
- the body 605 may be configured similarly to any of the above-described examples, wherein the interior is fluidically connected to an interior channel 602 , wherein the phase change from liquid to vapor occurs in the body 605 to absorb heat generated by the photovoltaic substrate.
- the vapor is delivered adiabatically through the pipe 602 to a condensing zone formed within the heat sink 660 , where the working fluid releases heat while undergoing a phase change from vapor to liquid.
- the heat sink 660 is formed as a support structure for the optics 680 and includes interior channels 603 fluidically connected to the interior channel 602 . Fins 604 may also be provided to further enhance heat transfer to the surrounding environment. Other structures for the heat sink 660 are also contemplated.
- FIG. 7 is a bottom perspective view of another example heat dissipating device 700 .
- the heat dissipating device 700 may include a body 705 .
- the body 705 is illustrated as a ‘box’ for purposes of simplifying the drawings, and may be sealed so that a working fluid (not shown) is contained therein as described above for other examples.
- a photovoltaic substrate (not shown) may be attached to the body 705 .
- the body 705 may be configured similarly to any of the above-described examples, wherein the interior is fluidically connected to an interior channel, wherein the phase change from liquid to vapor occurs in the body 705 to absorb heat generated by the photovoltaic substrate.
- the vapor is delivered adiabatically through the pipe to a condensing zone formed within the heat sink 760 , where the working fluid releases heat while undergoing a phase change from vapor liquid.
- the heat sink 760 is contoured to the underside of the optics 780 and includes interior channels (not shown) fluidically connected to the interior channel of the body 705 .
- Other structures for the heat sink 760 are also contemplated.
- FIG. 8 is a perspective view of another example heat dissipating device 800 .
- This example utilizes a simple rectangular no-wick heat pipe configuration (although the heat pipe can incorporate a wick if desired).
- the heat pipe 800 may have a top portion 805 a - b , and a bottom or tab portion 806 a - b .
- the top and bottom portions may be rectangular in shape, or any other desired shape. The shape may depend at least to some extent on design considerations, such as the layout in a use environment.
- the photovoltaic substrates 801 a - b and electrical routing 802 a - c may be mounted to the body 805 a - b of the heat pipe 800 , and thus the heat path is as small as possible.
- the heat pipe 800 includes liquid and vapor zones within body 805 a - b . Heat that is concentrated on the photovoltaic substrates 801 a - b spreads very quickly through the rectangle and condenses in the upper section of the heat pipe 800 . After condensing, the liquid inside flows back down to the PV area.
- the design shown in FIG. 8 is laid out to accommodate the orientation of the photovoltaic substrates 801 a - b .
- the panels may be tilted at an angle determined to optimally collect solar insulation, and thus the photovoltaic substrates 801 a - b may be at the bottom of the heat pipe 800 with the liquid flowing to this region by means of gravity.
- Wickless heat pipes may be manufactured at low cost.
- the construction for these heat pipes can be simple.
- the liquid is water under higher pressure to allow liquid to evaporate at lower temperatures.
- the heat pipe body 805 may be made to have any desired alignment features, and thus tolerances, for assembly.
- liquid is provided within separate chambers, such as a single chamber for each body 805 a and 805 b.
- the heat pipe 800 can be configured as a single large body that may span multiple substrates 805 a - b .
- the particular design may depend at least to some extent on design considerations, such as allowing for differences in the thermal expansion of the optics and support structure. For example, if the optics and/or support structure are manufactured of plastic, then separate heat pipes may function better.
- the natural convection coefficient is higher, and thus provides faster heat removal and lower temperatures for better light energy to electrical energy conversion efficiency.
- FIGS. 9 a - c are side views of still other example heat dissipating devices.
- the heat dissipating devices 900 , 900 ′, and 900 ′′ include 900 -series reference numbers to correspond to parts that have already been described.
- the heat dissipating devices may include a body 905 in FIG. 9 a , 905 ′ in FIGS. 9 b , and 905 ′′ in FIG. 9 c .
- the body may be sealed so that a working fluid (not shown) is contained therein as described above for FIG. 8 .
- a photovoltaic substrate ( 901 , and 901 a - b ) may be attached to the body.
- the body may be configured so that the interior is fluidically connected to an interior channel 902 , 902 ′ and 902 ′′, wherein the phase change from liquid to vapor occurs in the body to absorb heat generated by the photovoltaic substrate.
- the vapor is delivered adiabatically through the channel 902 , 902 ′ and 902 ′′ to a condensing zone formed within the heat sinks shown according to different variations in FIGS. 9 a - c , where the working fluid releases heat while undergoing a phase change from vapor to liquid.
- the heat sink extends at least partially below the optics 980 , 980 ′ and 980 ′′ and may also include interior channels fluidically connected to the interior channels 902 , 902 ′ and 902 ′′. Fins 904 , 904 ′ and 904 ′′ may also be provided to further enhance heat transfer to the surrounding environment.
- the fins may or may not include channel structures therein. Other configurations for the heat sink are also contemplated.
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Abstract
Description
- Photovoltaic devices for converting the sun's energy to electrical energy can be used as a supplemental (or even primary) power source. The deployment of photovoltaic devices for commercial and residential electricity consumers is continuing to increase. Due to conversion efficiencies, however, photovoltaic devices often have a large “footprint” and consume valuable “real estate,” meaning that photovoltaic devices are often large in size and can take up substantial space on rooftops and/or at other installations. Therefore, recent development efforts have turned to concentrating photovoltaic devices (CPV), which use optics (e.g., mirrors or lenses) to focus the sun's energy onto smaller photovoltaic substrates. The primary driver behind CPV is cost. The idea for CPV is to use relatively inexpensive optics in conjunction with a small amount of expensive, very high efficiency photovoltaics, providing an overall reduction in the cost to produce electricity.
- Concentrating photovoltaic devices convert a portion of the incoming energy from the sun into electricity, with the balance of energy being left to dissipate as heat during operation. If not properly dissipated, this heat can shorten the life span of various components and/or generally result in poor performance of the photovoltaic devices.
- Various thermal management systems are available for other heat generating devices, such as computer systems and electronics. These thermal management systems may include a heat sink and/or a cooling fan. The heat sink is positioned adjacent the electronic components generating the most heat to absorb this heat. A cooling fan may be positioned to blow air across the heat sink to dissipate heat into the surrounding environment. While cooling fans can often be effectively implemented in computer systems and other electronic devices because of the controlled environment, photovoltaic devices by their very nature are often located outdoors and thus subject to harsh environmental conditions. Fans may become corroded and/or inoperable. In addition, fans consume energy, counter to the main purpose of photovoltaic technology, and may not provide sufficient cooling for the high temperatures generated by concentrated photovoltaic devices.
-
FIG. 1 a is a perspective view of an example heat dissipating device. -
FIG. 1 b is an exploded perspective view of the example heat dissipating device shown inFIG. 1 a. -
FIG. 1 c is a diagrammatic view illustrating operation of the example heat dissipating device shown inFIG. 1 a. -
FIG. 1 d shows an example operating environment for the heat dissipating device shown inFIG. 1 a. -
FIG. 2 a is a perspective view of another example heat dissipating device. -
FIG. 2 b is an exploded perspective view of the example heat dissipating device shown inFIG. 2 a. -
FIG. 2 c is a diagrammatic view illustrating operation of the example heat dissipating device shown inFIG. 2 a. -
FIG. 3 a is a perspective view of another example heat dissipating device. -
FIG. 3 b is an exploded perspective view of the example heat dissipating device shown inFIG. 3 a. -
FIG. 4 is a partial exploded perspective view of another example heat dissipating device. -
FIG. 5 is a perspective view of another example heat dissipating device. -
FIG. 6 is a side view of another example heat dissipating device. -
FIG. 7 is a bottom perspective view of another example heat dissipating device. -
FIG. 8 is a perspective view of another example heat dissipating device. -
FIGS. 9 a-c are side views of still other example heat dissipating devices. - Concentrated photovoltaic devices generate large quantities of heat by the very nature of their operation (i.e., focusing the energy of the sun onto a relatively small area). It is noted that the photovoltaic devices do not “generate” heat. Rather, the heat energy represents a portion of the sun's energy that is not converted into electricity. This heat is absorbed by the photovoltaic and dissipated (transferred away from the photovoltaic) by conduction, convection, and radiation. Dissipation of the heat generated by photovoltaic devices may be employed to help prevent damage and enhance operation and lifetime of the devices. It is noted that the heat dissipating devices and methods described herein are not limiting to use with concentrating photovoltaic device, and may be implemented with other heat-generating devices (e.g., computer systems and other electronic devices).
- Heat dissipating devices and methods are disclosed. An example device includes an evaporation zone where a working fluid undergoes a change from a liquid phase to a vapor phase. A condensing zone interfaces with a heat sink in thermal communication with an external environment. The working fluid in the vapor phase changes back to the liquid phase in the condensing zone. A wick structure transports the working fluid in the liquid phase to the evaporation zone.
- The heat dissipating devices and methods operate in a nearly isothermal heat transfer mode (e.g., offering high thermal conductance), providing efficient heat transfer. The devices and methods also operate in a passive mode, with no moving parts or external power consumption. The devices may be manufactured in diverse and custom forms (e.g., tubular, flat, loop, and groove shapes, to name only a few examples), to fit a variety of geometries, and are relatively low weight. In addition to use in the concentrating photovoltaics field, other applications also include, but are not limited to, electronics cooling, satellite thermal control, temperature calibration, and waste, heat recovery.
- Before continuing, it is noted that as used herein, the terms “includes” and “including” mean, but is not limited to, “includes” or “including” and “includes at least” or “including at least.” The term “based on” means “based on” and “based at least in part on.”
-
FIG. 1 a is a perspective view of an exampleheat dissipating device 100.FIG. 1 b is an exploded perspective view of the exampleheat dissipating device 100 shown inFIG. 1 a. Theheat dissipating device 100 may include abody 105. Thebody 105 may be sealed so that a working fluid 110 (seeFIG. 1 c) is contained therein. In an example, aphotovoltaic substrate 101 a-b may be about 3 mm by 3 mm with a 50 mm by 50 mm aperture, as shown for example inFIG. 3 a (although the substrate can be scaled depending on use), and attached to the front and/or back side of thebody 105. Electrical leads 102 a-d are shown as these may be used to deliver electrical energy generated by thephotovoltaic substrate 101 a-b to a storage device (e.g., battery), transmission line (e.g., an electric grid), or end-use (e.g., operating an electrical device). - The body may include a
front cover 115 a, aback cover 115 b, aframe 120, a channel insert 125, and awick 130. Thebody 105 may be assembled such that thewick 130 is provided adjacent thechannel insert 125 in theframe 120 to form zones for the working fluid 110 (seeFIG. 1 c).Thefront cover 115 a andback cover 115 b may be assembled on theframe 120 to enclose the structure and form thebody 105 of theheat dissipating device 100. -
FIG. 1 c is a diagrammatic view illustrating operation of the exampleheat dissipating device 100 shown inFIG. 1 a. The workingfluid 110 may be provided in aboundary 140 formed between aninterior wall 121 of theframe 120 and anexterior wall 126 of thechannel insert 125. The workingfluid 110 may be a liquid which can rapidly undergo phase change from a liquid to a vapor and back to a liquid again.Example working fluids 110 include, but not limited to, helium, nitrogen, ammonia, acetone, methanol, ethanol, water, and toluene, to name only a few examples. The specific workingfluid 110 may be selected based on design considerations, such as thermal conductivity and boiling point. During use, the liquidphase working fluid 110 undergoes phase changes to absorb, transport, and release heat. - In an example, the channel insert 125 and
wick 130 within thebody 105 forms anevaporation zone 145 a, where the workingfluid 110 undergoes a phase change (illustrated byarrow 150 a) from a liquid phase (illustrated by arrow 155 a) to a vapor phase (illustrated byarrow 155 b). Thechannel insert 125 andwick 130 within thebody 105 also forms a condensation or condensingzone 145 b, where the workingfluid 110 undergoes a phase change (illustrated byarrow 150 b) from thevapor phase 155 b to the liquid phase 155 a. The condensingzone 145 b interfaces with aheat sink 160 in thermal communication with an external environment. - During operation, the
photovoltaic substrate 101 may generate heat. This heat may be transferred to thebody 105 of theheat dissipating device 100. The workingfluid 110 absorbs the heat during thephase change 150 a from the liquid phase 155 a to thevapor phase 155 b. Thewick 130 transports the working fluid to theevaporation zone 145 a. - The working
fluid 110 is then returned to the condensingzone 145 b, where the workingfluid 110 releases heat as the workingfluid 110 undergoes thephase change 150 b from thevapor phase 155 b to the liquid phase 155 a. Heat may be transferred to the heat sink 160 (as illustrated by arrows 165) and dissipated by theheat sink 160 to the external environment. - More specifically, the heat applied to the
evaporation zone 145 a vaporizes the workingfluid 110 to form a saturated or superheated vapor. The vapor pressure drives the vapor through adiabatic section to the condensingzone 145 b. The vapor condenses, relating heat to theheat sink 160. Capillary pressure created by thewick 130 serves as a pumping mechanism to move the condensed working fluid back into theevaporation zone 145 a. The process is substantially continuous and cyclical during operation. - For purposes of illustration, the heat sink may include aluminum conduction plates. The aluminum conduction plates may have a thermal conductivity of about 500-1200 W/m-K and offers a low resistance (e.g., less than about 15° C./W. The aluminum conduction plates may also be relatively thin (e.g., about 4 mm thick). Use of this materials enables efficient heat removal (e.g., providing a heat flux of about 300 W/cm2) in relatively flat configurations.
- The operations shown and described herein are provided to illustrate example implementations. It is noted that the operations are not limited to the ordering shown. Still other operations may also be implemented.
- Further operations may include transporting the working
fluid 110 in an adiabatic zone 145 c with substantially no heat transfer. It is noted that there may be some heat transfer even in the adiabatic zone. However, it is intended that heat transfer occurs largely in the evaporation zone (i.e., heat absorbed by the working fluid) and the condensation zone (i.e., heat released by the working fluid into the heat sink), and that heat is transported by the working fluid in the adiabatic zone. - Still further operations may include transporting heat away from a concentrating photovoltaic device using a high-rate thermodynamic cycle. Yet further operations may include recycling the working fluid through repeated condensation and capillary action.
- Before continuing, it should be noted that the examples of the heat dissipating device, the components of the heat dissipating device, and the configuration described above are provided for purposes of illustration, and are not intended to be limiting. Other devices, components, and configurations are also contemplated.
-
FIG. 1 d shows anexample operating environment 170 for theheat dissipating device 100 shown inFIG. 1 a. In this example, the operatingenvironment 170 includes arrays 175 a-d of concentrating photovoltaic devices. Any number of arrays 175 a-d may be provided, and each array 175 a-d may include any number ofphotovoltaic substrates 101 mounted on any number ofheat dissipating devices 100. Directing sunlight onto thephotovoltaic substrates 101 is illustrated by the dashed lines inFIG. 1 d. It is noted that the end banks includephotovoltaic substrates 101 on one side of thebody 105, and the middle banks includephotovoltaic substrates 101 on both sides of thebody 105 in this example. - The configuration shown in
FIG. 1 d is only intended to be illustrative and not limiting. In other examples, a sub-support may be provided (e.g., a plastic or metal tray below the arrays). Other structures may also be provided as housing (not shown). - In the
example operating environment 170, the sun's rays are reflected by optics (e.g., mirrors) 180 onto thephotovoltaic substrate 101. The arrangement and configuration of theoptics 180 is such that, in an example, the resulting concentration of the sun's rays onto a given area of thephotovoltaic substrate 101 represents an increase of about 300 to 1200 times the energy of direct normal incident light of the sun. It is noted, however, that theheat dissipating device 100 is not limited to any particular optics arrangement and concentration of the sun's energy. Theheat dissipating device 100 may be scaled to accommodate various concentrating arrangements. - By way of the above illustration, it is understood that large quantities of heat may be generated, which should be quickly dissipated in order to help ensure continued and efficient conversion of the sun's energy into electricity. In this example, heat generated at the
photovoltaic substrate 101 is absorbed by the workingfluid 110 in theevaporation zone 145 a (seeFIG. 1 c). The workingfluid 110 is then transported to thecondensation zone 145 b, where the heat is transferred (as illustrated byarrows 165 inFIG. 1 c) to theheat sink 160. - The
heat sink 160 may include any suitable structure. InFIG. 1 d, theheat sink 160 is illustrated as a metal support structure forheat dissipating devices 100 and is provided beneath theoptics 180. Theheat sink 160 includes a plurality of legs 161 a-e, which spread apart and away from thephotovoltaic substrate 101 so that heat can be dissipated to the surrounding environment. Other configurations of theheat sink 160 are also contemplated. -
FIG. 2 a is a perspective view of another exampleheat dissipating device 200.FIG. 2 b is an exploded perspective view of the exampleheat dissipating device 200 shown inFIG. 2 a.FIG. 2 c diagrammatic view illustrating operation of the exampleheat dissipating device 200 shown inFIG. 2 a. - The
heat dissipating device 200 may include abody 205. Thebody 205 may be sealed so that a working fluid 210 (seeFIG. 2 c) is contained therein. In an example, aphotovoltaic substrate 201 a-b may be attached to the front and/or back side of thebody 205. Electrical leads 202 a-d are shown as these may be used to deliver electrical energy generated by thephotovoltaic substrate 201 a-b. - The body may include a
cover 215, a sleeve orframe 220, awick 225, and achannel insert 230. Thebody 205 may be assembled such that thechannel insert 230 is provided within thewick 225, which is in turn provided in theframe 220. Thechannel insert 230 has a hollow interior and is open on the top (seeFIG. 2 c). Thecover 215 may be assembled on theframe 220 to enclose the structure and form thebody 205 of theheat dissipating device 200. - The working
fluid 210 may be provided in a boundary 240 formed within theframe 220. Thewick 225 andchannel insert 230 within thebody 205 forms anevaporation zone 245 a, where the workingfluid 210 undergoes a phase change (illustrated by arrow 250 a) from a liquid phase (illustrated byarrow 255 a) to a vapor phase (illustrated by arrow 255 b). Thewick 225 andchannel insert 230 within thebody 205 also form a condensation or condensingzone 245 b, where the workingfluid 210 undergoes a phase change (illustrated by arrow 255 b) from the vapor phase 255 b to theliquid phase 255 a. The condensing zone 245 interfaces with aheat sink 260 in thermal communication with an external environment. - During operation, the
photovoltaic substrate 201 may generate heat. This heat may be transferred to thebody 205 of theheat dissipating device 200. The workingfluid 210 absorbs the heat during the phase change 250 a from theliquid phase 255 a to the vapor phase 255 b. Thewick 230 transports the working fluid through theevaporation zone 245 a. - The working
fluid 210 is then returned to the condensingzone 245 b, where the workingfluid 210 releases heat as the workingfluid 210 undergoes the phase change 250 b from the vapor phase 255 b to theliquid phase 255 a. Heat may be transferred to the heat sink 260 (as illustrated by arrows 265) and dissipated by theheat sink 260 to the external environment. For example, theheat sink 260 may be similar to theheat sink 160 described above with reference toFIG. 1 d. - Several examples of other heat dissipating devices will now be described with reference to
FIGS. 3-7 . It is noted that 300-700 series reference numbers are used inFIGS. 3-7 , respectively, to describe similar components as already described above forFIGS. 1 and 2 . Therefore the description of each of these components may not be described again below. These additional examples are only illustrative and not intended to be limiting. Still other examples are also contemplated as will be readily appreciated by those having ordinary skill in the art after becoming familiar with the teachings herein. -
FIG. 3 a is a perspective view of another exampleheat dissipating device 300.FIG. 3 b is an exploded perspective view of the exampleheat dissipating device 300 shown inFIG. 3 a. - The
heat dissipating device 300 may include abody 305. Thebody 305 may be sealed so that a working fluid (not shown) is contained therein. In an example, aphotovoltaic substrate 301 may be attached to thebody 305 on a dielectric 306. Electrical leads 302 a-b are shown as these may be used to deliver electrical energy generated by thephotovoltaic substrate 301. - The body may include a
cover 315, aframe 320, achannel structure 325 formed in theframe 320, and awick 330. Thebody 305 may be assembled such that thewick 330 is provided over thechannel structure 325. Thechannel structure 325. Thecover 315 may be assembled on theframe 320 to enclose the structure and form thebody 305 of theheat dissipating device 300. - The working fluid may be provided in a
boundary 340 formed within theframe 320. Thechannel structure 325 andwick 330 within thebody 305 forms an evaporation zone, where the working fluid undergoes a phase change from a liquid phase to a vapor phase. Thechannel structure 325 andwick 330 within thebody 305 also forms a condensation or condensing zone, where the working fluid undergoes a phase change from the vapor phase to the liquid phase. The condensing zone interfaces with aheat sink 360 in thermal communication with an external environment. In this example, theheat sink 360 is formed as part of thebody 305. -
FIG. 4 is a partial exploded perspective view of another exampleheat dissipating device 400. Theheat dissipating device 400 may include abody 405. Thebody 405 may be sealed so that a working fluid (not shown) is contained therein. In an example, aphotovoltaic substrate 401 may be attached to thebody 405. Electrical leads 402 a-b are shown as these may be used to deliver electrical energy generated by thephotovoltaic substrate 401. - The body may include a cover or
cap 415, aframe 420, achannel structure 425 formed in theframe 420. In this example, thechannel structure 425 also functions as a wick to transport condensed fluid back to the evaporation zone behind the photovoltaic substrates. Thebody 405 may be assembled such that thechannel structure 425 slides into theframe 420. Thecap 415 may be assembled on theframe 420 to enclose the structure and form thebody 405 of theheat dissipating device 400. - The working fluid may be provided in a boundary formed within the
frame 420. The channel (and wick)structure 425 within thebody 405 forms an evaporation zone, where the working fluid undergoes a phase change from a liquid phase to a vapor phase. Thechannel structure 425 within thebody 305 also forms a condensation or condensing zone. The condensing zone is along the top face of the channel, where heat is dumped to the heat sink fins above. Again, the condensing zone is where the working fluid undergoes a phase change from the vapor phase to the liquid phase. The condensing zone interfaces with aheat sink 460 in thermal communication with an external environment. In this example, theheat sink 460 is formed as part of thebody 305. -
FIG. 5 is a perspective view of another example heat dissipating device 500. The heat dissipating device 500 may include abody 505. Thebody 405 may be sealed so that a working fluid (not shown) is contained therein. In an example, aphotovoltaic substrate 501 may be attached to thebody 505. Thebody 505 in this embodiment is a simple block that interfaces to the cylindrical heat pipe, allowing simple conductive thermal communication between a flat PV and cylindrical heat pipe, which includes the working fluid and wick. A copper-water cylindrical design is perhaps the simplest and most “commodity-like” heatpipe configuration. The body may be configured similarly to any of the above-described examples, wherein the interior is fluidically connected to apipe 502, wherein the phase change from liquid to vapor occurs in thebody 505 to absorb heat generated by thephotovoltaic substrate 501. The vapor is delivered adiabatically through thepipe 502 to a condensing zone formed adjacent the heat sink 560, where the working fluid releases heat while undergoing a phase change from vapor liquid. In this example, the heat sink 560 is formed as a stack of disks. Other structures for the heat sink 560 are also contemplated. -
FIG. 6 is a side view of another exampleheat dissipating device 600. Theheat dissipating device 600 may include abody 605. Thebody 605 is illustrated as a ‘box’ for purposes of simplifying the drawings, and may be sealed so that a working fluid (not shown) is contained therein as described above for other examples. Again, a photovoltaic substrate (601 a and 601 b) may be attached to thebody 605. It is noted that sunlight is reflected ontophotovoltaic substrates FIG. 6 (refer toFIG. 1 d for an example).Thebody 605 may be configured similarly to any of the above-described examples, wherein the interior is fluidically connected to aninterior channel 602, wherein the phase change from liquid to vapor occurs in thebody 605 to absorb heat generated by the photovoltaic substrate. The vapor is delivered adiabatically through thepipe 602 to a condensing zone formed within theheat sink 660, where the working fluid releases heat while undergoing a phase change from vapor to liquid. In this example, theheat sink 660 is formed as a support structure for theoptics 680 and includesinterior channels 603 fluidically connected to theinterior channel 602.Fins 604 may also be provided to further enhance heat transfer to the surrounding environment. Other structures for theheat sink 660 are also contemplated. -
FIG. 7 is a bottom perspective view of another exampleheat dissipating device 700. Theheat dissipating device 700 may include abody 705. Thebody 705 is illustrated as a ‘box’ for purposes of simplifying the drawings, and may be sealed so that a working fluid (not shown) is contained therein as described above for other examples. Again, a photovoltaic substrate (not shown) may be attached to thebody 705. Thebody 705 may be configured similarly to any of the above-described examples, wherein the interior is fluidically connected to an interior channel, wherein the phase change from liquid to vapor occurs in thebody 705 to absorb heat generated by the photovoltaic substrate. The vapor is delivered adiabatically through the pipe to a condensing zone formed within theheat sink 760, where the working fluid releases heat while undergoing a phase change from vapor liquid. In this example, theheat sink 760 is contoured to the underside of theoptics 780 and includes interior channels (not shown) fluidically connected to the interior channel of thebody 705. Other structures for theheat sink 760 are also contemplated. -
FIG. 8 is a perspective view of another exampleheat dissipating device 800. This example utilizes a simple rectangular no-wick heat pipe configuration (although the heat pipe can incorporate a wick if desired). Theheat pipe 800 may have a top portion 805 a-b, and a bottom or tab portion 806 a-b. The top and bottom portions may be rectangular in shape, or any other desired shape. The shape may depend at least to some extent on design considerations, such as the layout in a use environment. - The photovoltaic substrates 801 a-b and electrical routing 802 a-c may be mounted to the body 805 a-b of the
heat pipe 800, and thus the heat path is as small as possible. In an example, theheat pipe 800 includes liquid and vapor zones within body 805 a-b. Heat that is concentrated on the photovoltaic substrates 801 a-b spreads very quickly through the rectangle and condenses in the upper section of theheat pipe 800. After condensing, the liquid inside flows back down to the PV area. - The design shown in
FIG. 8 is laid out to accommodate the orientation of the photovoltaic substrates 801 a-b. The panels may be tilted at an angle determined to optimally collect solar insulation, and thus the photovoltaic substrates 801 a-b may be at the bottom of theheat pipe 800 with the liquid flowing to this region by means of gravity. - Wickless heat pipes may be manufactured at low cost. The construction for these heat pipes can be simple. In an example, the liquid is water under higher pressure to allow liquid to evaporate at lower temperatures. The heat pipe body 805 may be made to have any desired alignment features, and thus tolerances, for assembly.
- In an example, liquid is provided within separate chambers, such as a single chamber for each
body 805 a and 805 b. In other examples, theheat pipe 800 can be configured as a single large body that may span multiple substrates 805 a-b. The particular design may depend at least to some extent on design considerations, such as allowing for differences in the thermal expansion of the optics and support structure. For example, if the optics and/or support structure are manufactured of plastic, then separate heat pipes may function better. - During operation, as heat dissipates on the top of the module, the natural convection coefficient is higher, and thus provides faster heat removal and lower temperatures for better light energy to electrical energy conversion efficiency.
-
FIGS. 9 a-c are side views of still other example heat dissipating devices. Theheat dissipating devices body 905 inFIG. 9 a, 905′ inFIGS. 9 b, and 905″ inFIG. 9 c. The body may be sealed so that a working fluid (not shown) is contained therein as described above forFIG. 8 . Again, a photovoltaic substrate (901, and 901 a-b) may be attached to the body. The body may be configured so that the interior is fluidically connected to aninterior channel channel FIGS. 9 a-c, where the working fluid releases heat while undergoing a phase change from vapor to liquid. In this example, the heat sink extends at least partially below theoptics interior channels Fins - It is noted that the examples shown and described are provided for purposes of illustration and are not intended to be limiting. Still other examples are also contemplated.
Claims (15)
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PCT/US2011/052180 WO2013043150A1 (en) | 2011-09-19 | 2011-09-19 | Heat dissipating devices and methods |
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US20140216692A1 true US20140216692A1 (en) | 2014-08-07 |
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US14/240,241 Abandoned US20140216692A1 (en) | 2011-09-19 | 2011-09-19 | Heat dissipating devices and methods |
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US10118717B2 (en) * | 2015-06-02 | 2018-11-06 | Airbus Defence And Space Sas | Artificial Satellite |
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US7532467B2 (en) * | 2006-10-11 | 2009-05-12 | Georgia Tech Research Corporation | Thermal management devices, systems, and methods |
US8859882B2 (en) * | 2008-09-30 | 2014-10-14 | Aerojet Rocketdyne Of De, Inc. | Solid state heat pipe heat rejection system for space power systems |
US20110041892A1 (en) * | 2009-08-21 | 2011-02-24 | Alexander Levin | Heat sink system for large-size photovoltaic receiver |
US20110048489A1 (en) * | 2009-09-01 | 2011-03-03 | Gabriel Karim M | Combined thermoelectric/photovoltaic device for high heat flux applications and method of making the same |
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2011
- 2011-09-19 US US14/240,241 patent/US20140216692A1/en not_active Abandoned
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US10118717B2 (en) * | 2015-06-02 | 2018-11-06 | Airbus Defence And Space Sas | Artificial Satellite |
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