US20140209273A1 - Buckle and heat dissipation module having the same - Google Patents

Buckle and heat dissipation module having the same Download PDF

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Publication number
US20140209273A1
US20140209273A1 US13/754,889 US201313754889A US2014209273A1 US 20140209273 A1 US20140209273 A1 US 20140209273A1 US 201313754889 A US201313754889 A US 201313754889A US 2014209273 A1 US2014209273 A1 US 2014209273A1
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US
United States
Prior art keywords
cylinder
heat dissipation
dissipation module
elastic connecting
connecting piece
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Abandoned
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US13/754,889
Inventor
Yung-Lin Hsu
Kuan-Yu Liu
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SilverStone Tech Co Ltd
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SilverStone Tech Co Ltd
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Filing date
Publication date
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Priority to US13/754,889 priority Critical patent/US20140209273A1/en
Assigned to SILVERSTONE TECHNOLOGY CO., LTD. reassignment SILVERSTONE TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSU, YUNG-LIN, LIU, KUAN-YU
Publication of US20140209273A1 publication Critical patent/US20140209273A1/en
Abandoned legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007Auxiliary supports for elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08Fluid driving means, e.g. pumps, fans
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipation module, and in particular to a heat dissipation module which is easy for installation and the buckle thereof.
  • Heat dissipation modules are commonly used in electronic thermal field.
  • a conventional heat dissipation module includes a fin stack and a fan.
  • the fin stack includes fins connected to a heat-conductive plate by a heat pipe.
  • the heat-conductive plate contacts a heat source.
  • the heat source could be a CPU (central processing unit) or a GPU (graphics processing unit). Heat generated by the heat source spreads in the heat-conductive plate. The heat is transferred to the fins through the heat pipe, and further dissipated into atmosphere via forced air convention.
  • the fin stack has to be locked with the fan.
  • Buckles are commonly used for connection between the fin stack and the fan. Because the fan is firmly connected with the fin stack, it is usually difficult to remove buckles from the fin stack.
  • This invention provides a heat dissipation module and a buckle thereof, wherein the fan and the fin stack of the heat dissipation module could be easily assembled or disassembled.
  • the heat dissipation module includes a fin stack, a fan and a plurality of buckles.
  • the fin stack includes a plurality of fins arranged at interval and in parallel with each other, wherein a notch is formed at an edge of each fin and notches of the fins are in alignment.
  • the fan includes a plurality of through holes.
  • Each buckle includes an elastic connecting piece, a first cylinder and a second cylinder. An extension portion is formed at one end of the elastic connecting piece. A lateral side of the first cylinder connects the extension portion. The second cylinder vertically extends from the other end of the elastic connecting piece. The first cylinder is snapped on corresponding notches. The second cylinder is received in a corresponding through hole. Whereby, the first cylinder could be easily assembled with the corresponding notches and easily disassembled.
  • the first cylinder is formed with a plurality of flanges arranged at interval and in parallel with each other, and one fin is engaged between two adjacent flanges.
  • An axis of the first cylinder and an axis of the second cylinder are perpendicular with each other.
  • the extension portion is bent with respect to the elastic connecting piece.
  • the second cylinder has a tapered portion to plug on the corresponding through hole.
  • the tapered portion is in a cone shape, a taper direction of the tapered portion is the same as an extending direction of the second cylinder.
  • the fan includes a frame.
  • the through holes are formed on the frame.
  • the fan is locked with the fin stack by the first cylinder. Moreover, the first cylinder could be easily removed from corresponding notches via pulling the extension portion. Whereby, the heat dissipation module and the buckle of the present invention amend the disadvantage of prior technologies.
  • FIG. 1 is a schematic view showing the preferred embodiment of the present invention
  • FIG. 2 is an explosion diagram showing the preferred embodiment of the present invention
  • FIG. 3 is a schematic view showing the fan and the buckles in the preferred embodiment of the present invention.
  • FIG. 4 is a schematic view showing the buckle in the preferred embodiment of the present invention.
  • FIG. 5 is a schematic view showing the buckles in the preferred embodiment of the present invention in another viewpoint
  • FIG. 6 is the section view of the heat dissipation module shown in FIG. 1 ;
  • FIG. 7 is a schematic view showing the buckle which is bent in the preferred embodiment of the present invention.
  • FIG. 8 is the partially enlarged view of the heat dissipation module shown in FIG. 6 .
  • the first embodiment of the present invention provides a heat dissipation module including a fin stack 100 , a fan 200 and a plurality of buckles 300 .
  • the buckles are used for firmly locking the fan 200 on the fin stack 100 .
  • the fin stack 100 preferably includes fins 110 , heat pipes 120 and a heat-conductive plate 130 .
  • the fins 110 are made of metal with superior heat transfer efficiency.
  • the fins 110 could be made of aluminum or copper.
  • the fins 110 are arranged at interval and in parallel with each other.
  • a notch 111 is punched at the edge of each fin 110 , and the notches 111 of the fins 110 are arranged in alignment.
  • each fin 110 is preferably punched six heat-conductive holes 112 .
  • the number of the heat pipes 120 corresponds with the number of the heat-conductive holes 112 .
  • the fin stack 100 preferably includes three U-shaped heat pipes 120 , wherein each end of the heat pipe 120 is received in a corresponded heat conductive hole 112 , whereby the heat pipes 120 connect the fins 110 .
  • the heat-conductive plate 130 connects the central segment of each heat pipe 120 .
  • the fan 200 includes a frame 210 and a fan wheel 220 which is set in the frame 210 .
  • the frame 210 is of a rectangular-piece shape. Through holes 211 are provided on the frame 210 . In the present embodiment, four through holes 211 are provided at the four corners of the frame 210 .
  • the heat dissipation module of the present invention includes four buckles 300 corresponding to each through hole 211 .
  • Each buckle 300 is integrally molded by elastic material which is preferably silicon or rubber.
  • the buckle 300 includes an elastic connecting piece 310 , a first cylinder 320 and a second cylinder 330 .
  • the elastic connecting piece 310 is of a bar shape.
  • An extension portion 311 is formed at one end of the elastic connecting piece 310 .
  • a lateral side of the first cylinder 320 is connected to the extension portion 311 .
  • a plurality of flanges 321 are parallel arranged on the lateral face of the first cylinder 320 .
  • Each flange 321 surrounds the lateral side of the first cylinder 320 .
  • four flanges 321 are provided on each first cylinder 320 , but the number of the flange 321 on each first cylinder 320 is not a limitation of the present invention.
  • the second cylinder 330 is perpendicularly extends from the other end of the elastic connecting piece 310 .
  • the first cylinder 320 and the second cylinder 330 are provided on opposite lateral faces of the elastic connecting piece 310 .
  • the first cylinder 320 and the second cylinder 330 are perpendicular with each other.
  • the second cylinder 330 has a conic tapered portion 331 to plug on the corresponding through hole 211 .
  • a taper direction of the tapered portion 331 is the same as an extending direction of the second cylinder 330 .
  • the tapered portion 331 has a tip 332 and a blunt end 333 , and the outer diameter of the blunt end 333 is larger than the inner diameter of the through hole 211 .
  • the second cylinder 330 is received in the through hole 211 of the fan 200 .
  • the tip 332 of the tapered portion 331 is inserted into the corresponding through hole 211 in advance, and then the blunt end 333 of the tapered portion 331 is elastically pressed by the inner wall of the through hole 211 to facilitate the entrance of the blunt end 333 .
  • the blunt end 333 of the tapered portion 331 restores resiliently and sticks in the through hole 211 . Therefore, the buckle 300 is fixed on the fan 200 .
  • the elastic connecting piece 310 is bent with respect to the elastic connecting piece to make the first cylinder 320 be snapped on corresponding notches 111 at the edges of the fins 110 .
  • the first cylinder 310 is snapped on three aligned notches 111 .
  • Each fin is engaged between two adjacent flanges 321 , and the three fins 110 are engaged with four flanges 321 .
  • the fin stack 100 and the fan 200 are connected by buckles 300 which are made of elastic materials. Therefore, the buckles 300 would not damage the fins 110 while the fin group 100 and the fan 200 are assembled or disassembled. Moreover, the fan 200 could be easily set on the fin stack 100 by means of snapping the first cylinder 320 into the notch 111 of the fin 110 . While the first cylinder 320 is pulled, the fins 110 could be protected by the flanges 321 to prevent from being damaged by the first cylinder 320 . Furthermore, each first cylinder 320 could be pulled out from the notches 111 by pulling the extension portion 311 . Accordingly, the fan 200 could be easily removed from the fin stack 100 . Therefore, in the present invention, the fin stack 100 and the fan 200 could be firmly connected by the buckles 300 and could be easily disassembled.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation module includes a fin stack, a fan and buckles. The fin stack includes fins arranged at interval and in parallel with each other, wherein a notch is formed at an edge of each fin and the notches of the fins are in alignment. The fan includes through holes. Each buckle includes an elastic connecting piece, a first cylinder and a second cylinder. An extension portion is formed at one end of the elastic connecting piece. A lateral side of the first cylinder connects the extension portion. The second cylinder vertically extends from the other end of the elastic connecting piece. The first cylinder is snapped on corresponding notches. The second cylinder is received in a corresponding through hole. Whereby, the first cylinder could be easily snapped on and removed from the notch.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat dissipation module, and in particular to a heat dissipation module which is easy for installation and the buckle thereof.
  • 2. Description of Prior Art
  • Heat dissipation modules are commonly used in electronic thermal field. Generally, a conventional heat dissipation module includes a fin stack and a fan. The fin stack includes fins connected to a heat-conductive plate by a heat pipe. The heat-conductive plate contacts a heat source. For example, the heat source could be a CPU (central processing unit) or a GPU (graphics processing unit). Heat generated by the heat source spreads in the heat-conductive plate. The heat is transferred to the fins through the heat pipe, and further dissipated into atmosphere via forced air convention.
  • Therefore, the fin stack has to be locked with the fan. Buckles are commonly used for connection between the fin stack and the fan. Because the fan is firmly connected with the fin stack, it is usually difficult to remove buckles from the fin stack.
  • For example, the buckles mentioned in patents TW M300837 and TW M342542 are difficult to be removed from the fin stack. Hence, the parts of a conventional heat dissipation module may be damaged by operators in production lines or consumers when assemble the heat dissipation module.
  • SUMMARY OF THE INVENTION
  • This invention provides a heat dissipation module and a buckle thereof, wherein the fan and the fin stack of the heat dissipation module could be easily assembled or disassembled.
  • The heat dissipation module includes a fin stack, a fan and a plurality of buckles. The fin stack includes a plurality of fins arranged at interval and in parallel with each other, wherein a notch is formed at an edge of each fin and notches of the fins are in alignment. The fan includes a plurality of through holes. Each buckle includes an elastic connecting piece, a first cylinder and a second cylinder. An extension portion is formed at one end of the elastic connecting piece. A lateral side of the first cylinder connects the extension portion. The second cylinder vertically extends from the other end of the elastic connecting piece. The first cylinder is snapped on corresponding notches. The second cylinder is received in a corresponding through hole. Whereby, the first cylinder could be easily assembled with the corresponding notches and easily disassembled.
  • Furthermore, the first cylinder is formed with a plurality of flanges arranged at interval and in parallel with each other, and one fin is engaged between two adjacent flanges. An axis of the first cylinder and an axis of the second cylinder are perpendicular with each other. The extension portion is bent with respect to the elastic connecting piece. The second cylinder has a tapered portion to plug on the corresponding through hole. The tapered portion is in a cone shape, a taper direction of the tapered portion is the same as an extending direction of the second cylinder. The fan includes a frame. The through holes are formed on the frame.
  • The fan is locked with the fin stack by the first cylinder. Moreover, the first cylinder could be easily removed from corresponding notches via pulling the extension portion. Whereby, the heat dissipation module and the buckle of the present invention amend the disadvantage of prior technologies.
  • BRIEF DESCRIPTION OF DRAWING
  • FIG. 1 is a schematic view showing the preferred embodiment of the present invention;
  • FIG. 2 is an explosion diagram showing the preferred embodiment of the present invention;
  • FIG. 3 is a schematic view showing the fan and the buckles in the preferred embodiment of the present invention;
  • FIG. 4 is a schematic view showing the buckle in the preferred embodiment of the present invention;
  • FIG. 5 is a schematic view showing the buckles in the preferred embodiment of the present invention in another viewpoint;
  • FIG. 6 is the section view of the heat dissipation module shown in FIG. 1;
  • FIG. 7 is a schematic view showing the buckle which is bent in the preferred embodiment of the present invention;
  • FIG. 8 is the partially enlarged view of the heat dissipation module shown in FIG. 6.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Please refer to FIG. 1 and FIG. 2. The first embodiment of the present invention provides a heat dissipation module including a fin stack 100, a fan 200 and a plurality of buckles 300. The buckles are used for firmly locking the fan 200 on the fin stack 100.
  • Please refer to FIG. 2. The fin stack 100 preferably includes fins 110, heat pipes 120 and a heat-conductive plate 130. The fins 110 are made of metal with superior heat transfer efficiency. For example, the fins 110 could be made of aluminum or copper. The fins 110 are arranged at interval and in parallel with each other. In each fin 110, a notch 111 is punched at the edge of each fin 110, and the notches 111 of the fins 110 are arranged in alignment. In this embodiment, each fin 110 is preferably punched six heat-conductive holes 112. The number of the heat pipes 120 corresponds with the number of the heat-conductive holes 112. The fin stack 100 preferably includes three U-shaped heat pipes 120, wherein each end of the heat pipe 120 is received in a corresponded heat conductive hole 112, whereby the heat pipes 120 connect the fins 110. The heat-conductive plate 130 connects the central segment of each heat pipe 120.
  • Please refer to FIG. 3. The fan 200 includes a frame 210 and a fan wheel 220 which is set in the frame 210. The frame 210 is of a rectangular-piece shape. Through holes 211 are provided on the frame 210. In the present embodiment, four through holes 211 are provided at the four corners of the frame 210.
  • Please refer to FIG. 3 to FIG. 5. In the present embodiment, the heat dissipation module of the present invention includes four buckles 300 corresponding to each through hole 211. Each buckle 300 is integrally molded by elastic material which is preferably silicon or rubber. The buckle 300 includes an elastic connecting piece 310, a first cylinder 320 and a second cylinder 330. The elastic connecting piece 310 is of a bar shape. An extension portion 311 is formed at one end of the elastic connecting piece 310. A lateral side of the first cylinder 320 is connected to the extension portion 311. A plurality of flanges 321 are parallel arranged on the lateral face of the first cylinder 320. Each flange 321 surrounds the lateral side of the first cylinder 320. In the present embodiment, four flanges 321 are provided on each first cylinder 320, but the number of the flange 321 on each first cylinder 320 is not a limitation of the present invention. The second cylinder 330 is perpendicularly extends from the other end of the elastic connecting piece 310. In the present embodiment, the first cylinder 320 and the second cylinder 330 are provided on opposite lateral faces of the elastic connecting piece 310. Furthermore, the first cylinder 320 and the second cylinder 330 are perpendicular with each other. The second cylinder 330 has a conic tapered portion 331 to plug on the corresponding through hole 211. A taper direction of the tapered portion 331 is the same as an extending direction of the second cylinder 330. In the present embodiment, the tapered portion 331 has a tip 332 and a blunt end 333, and the outer diameter of the blunt end 333 is larger than the inner diameter of the through hole 211.
  • Please refer to FIG. 6 to FIG. 8. The second cylinder 330 is received in the through hole 211 of the fan 200. The tip 332 of the tapered portion 331 is inserted into the corresponding through hole 211 in advance, and then the blunt end 333 of the tapered portion 331 is elastically pressed by the inner wall of the through hole 211 to facilitate the entrance of the blunt end 333. After passing through the through hole 211, the blunt end 333 of the tapered portion 331 restores resiliently and sticks in the through hole 211. Therefore, the buckle 300 is fixed on the fan 200. The elastic connecting piece 310 is bent with respect to the elastic connecting piece to make the first cylinder 320 be snapped on corresponding notches 111 at the edges of the fins 110. In the present embodiment the first cylinder 310 is snapped on three aligned notches 111. Each fin is engaged between two adjacent flanges 321, and the three fins 110 are engaged with four flanges 321.
  • In the present invention, the fin stack 100 and the fan 200 are connected by buckles 300 which are made of elastic materials. Therefore, the buckles 300 would not damage the fins 110 while the fin group 100 and the fan 200 are assembled or disassembled. Moreover, the fan 200 could be easily set on the fin stack 100 by means of snapping the first cylinder 320 into the notch 111 of the fin 110. While the first cylinder 320 is pulled, the fins 110 could be protected by the flanges 321 to prevent from being damaged by the first cylinder 320. Furthermore, each first cylinder 320 could be pulled out from the notches 111 by pulling the extension portion 311. Accordingly, the fan 200 could be easily removed from the fin stack 100. Therefore, in the present invention, the fin stack 100 and the fan 200 could be firmly connected by the buckles 300 and could be easily disassembled.
  • Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (11)

What is claimed is:
1. A heat dissipation module, comprising:
a fin stack comprising a plurality of fins arranged at interval and in parallel with each other, wherein a notch is formed at an edge of each fin and notches of the fins are in alignment;
a fan comprising a plurality of through holes; and
a plurality of buckles;
wherein each buckle comprises an elastic connecting piece, a first cylinder and a second cylinder, an extension portion is formed at one end of the elastic connecting piece, a lateral side of the first cylinder connects the extension portion, the second cylinder vertically extends from the other end of the elastic connecting piece, the first cylinder is snapped on corresponding notches, and the second cylinder is received in a corresponding through hole.
2. The heat dissipation module according to claim 1, wherein the first cylinder is formed with a plurality of flanges arranged at interval and in parallel with each other, and one fin is engaged between two adjacent flanges.
3. The heat dissipation module according to claim 1, wherein an axis of the first cylinder and an axis of the second cylinder are perpendicular with each other.
4. The heat dissipation module according to claim 1, wherein the extension portion is bent with respect to the elastic connecting piece.
5. The heat dissipation module according to claim 2, wherein the extension portion is bent with respect to the elastic connecting piece.
6. The heat dissipation module according to claim 3, wherein the extension portion is bent with respect to the elastic connecting piece.
7. The heat dissipation module according to claim 1, wherein the second cylinder has a tapered portion to plug on the corresponding through hole.
8. The heat dissipation module according to claim 7, wherein the tapered portion is in a cone shape, a taper direction of the tapered portion is the same as an extending direction of the second cylinder.
9. The heat dissipation module according to claim 1, wherein the fan comprises a frame, and the through holes are formed on the frame.
10. A buckle comprising:
an elastic connecting pieces having an extension portion formed at one end;
a first cylinder having a lateral side connecting the extension portion; and
a second cylinder vertically extending from the other end of the elastic connecting piece.
11. The buckle according to claim 10, wherein the second cylinder has a tapered portion and a taper direction of the tapered portion is the same as an extending direction of the second cylinder.
US13/754,889 2013-01-30 2013-01-30 Buckle and heat dissipation module having the same Abandoned US20140209273A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108398993A (en) * 2018-04-28 2018-08-14 北京中科寒武纪科技有限公司 Radiator
US11227987B2 (en) * 2017-06-08 2022-01-18 Lg Innotek Co., Ltd. Heat conversion device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392885B1 (en) * 2001-03-13 2002-05-21 Foxconn Precision Components Co., Ltd. Fan holder
US20040000398A1 (en) * 2002-06-28 2004-01-01 Lee Hsieh Kun Heat dissipation assembly with fan mounting device
TWM300837U (en) * 2006-05-25 2006-11-11 Xinruilian Science & Technolog Heat dissipation apparatus with shock-absorbing structure
US20100002389A1 (en) * 2008-07-01 2010-01-07 Xigmatek Co., Ltd. Fan fastener
US20110127006A1 (en) * 2009-12-02 2011-06-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN202008993U (en) * 2011-03-02 2011-10-12 深圳市研派科技有限公司 Novel elastic connecting piece for fixing fan
US20120067554A1 (en) * 2010-09-17 2012-03-22 Cooler Master Co., Ltd. Snap-in fan seat and heat sink having the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392885B1 (en) * 2001-03-13 2002-05-21 Foxconn Precision Components Co., Ltd. Fan holder
US20040000398A1 (en) * 2002-06-28 2004-01-01 Lee Hsieh Kun Heat dissipation assembly with fan mounting device
TWM300837U (en) * 2006-05-25 2006-11-11 Xinruilian Science & Technolog Heat dissipation apparatus with shock-absorbing structure
US20100002389A1 (en) * 2008-07-01 2010-01-07 Xigmatek Co., Ltd. Fan fastener
US20110127006A1 (en) * 2009-12-02 2011-06-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20120067554A1 (en) * 2010-09-17 2012-03-22 Cooler Master Co., Ltd. Snap-in fan seat and heat sink having the same
CN202008993U (en) * 2011-03-02 2011-10-12 深圳市研派科技有限公司 Novel elastic connecting piece for fixing fan

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11227987B2 (en) * 2017-06-08 2022-01-18 Lg Innotek Co., Ltd. Heat conversion device
CN108398993A (en) * 2018-04-28 2018-08-14 北京中科寒武纪科技有限公司 Radiator
EP3561429A3 (en) * 2018-04-28 2019-11-13 Cambricon Technologies Corporation Limited Heat dissipation device
US11758688B2 (en) * 2018-04-28 2023-09-12 Cambricon Technologies Corporation Limited Heat dissipation device

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