US20140202682A1 - Apparatus for stripping optical fibers and optical fiber assemblies - Google Patents
Apparatus for stripping optical fibers and optical fiber assemblies Download PDFInfo
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- US20140202682A1 US20140202682A1 US14/027,876 US201314027876A US2014202682A1 US 20140202682 A1 US20140202682 A1 US 20140202682A1 US 201314027876 A US201314027876 A US 201314027876A US 2014202682 A1 US2014202682 A1 US 2014202682A1
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- Prior art keywords
- optical fiber
- polymer material
- carrier
- polymer
- substrate
- Prior art date
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Links
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- 230000000712 assembly Effects 0.000 title description 4
- 238000000429 assembly Methods 0.000 title description 4
- 239000002861 polymer material Substances 0.000 claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 239000007769 metal material Substances 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
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- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims description 28
- 239000011248 coating agent Substances 0.000 claims description 25
- 239000000835 fiber Substances 0.000 claims description 22
- 239000004642 Polyimide Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 18
- 229920001721 polyimide Polymers 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000011253 protective coating Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 32
- 238000000034 method Methods 0.000 description 21
- 229920000642 polymer Polymers 0.000 description 21
- 238000005253 cladding Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 229910001084 galinstan Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
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- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
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- 229920006259 thermoplastic polyimide Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
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- 239000002998 adhesive polymer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/12—Means for transmitting measuring-signals or control signals from the well to the surface, or from the surface to the well, e.g. for logging while drilling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/245—Removing protective coverings of light guides before coupling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
Definitions
- Optical fibers find use in a variety of applications. For example, in the drilling and completion industry, optical fibers are utilized to provide communication between components and to measure various conditions and component parameters in a downhole environment as well parameters of downhole components. Exemplary optical fiber sensors include temperature sensors and strain sensors, which can be used to monitor deformation in downhole components. In some applications, optical fibers are coated with protective layers and may also be bonded to substrates. Portions of an optical fiber coating and/or substrate bonding material may be removed, for example, so that the optical fiber can be terminated. The coating and/or bonding material may also be removed so that the optical fiber can be spliced or connected to another fiber, or connected to a signal source or detector.
- Typical methods of stripping polymer coatings, such as polyimide, from optical fibers include either burning of the coating using an open flame, or dipping of the fiber into vials of heated acid. These methods pose potential problems by the nature of the chemicals used and fire hazards.
- An apparatus for performing a downhole operation includes: a carrier configured to be deployed in a borehole in an earth formation; and an optical fiber assembly disposed at the carrier, the optical fiber assembly including an optical fiber and a polymer material bonded to a length of the optical fiber.
- a portion of the polymer material has been removed by: disposing a liquid metallic material proximate to the polymer material, the polymer material being bonded to the optical fiber; heating the liquid metallic material to a temperature sufficient to burn the polymer material and de-bond the polymer material from a surface of the optical fiber; and removing the polymer material and liquid metal from the surface of the optical fiber.
- FIG. 1 is a perspective view of an embodiment of a fiber optic assembly including a polymer coated optical fiber adhered to a substrate;
- FIG. 2 is a cross-sectional view of another embodiment of the fiber optic assembly of FIG. 1 ;
- FIG. 3 is a cross-sectional view of a cable including a fiber optic assembly adhered to a cable member via a polymer material;
- FIG. 4 is a flow chart illustrating an embodiment of a method of removing a polymer material from an optical fiber and/or substrate adhered to the optical fiber;
- FIG. 5 is a cross-sectional view of an apparatus for removing a polymer material from an optical fiber and/or substrate adhered to the optical fiber.
- An exemplary method includes contacting or otherwise applying a metallic liquid (e.g., gallinstan) to a polymer coating and/or adhesive, and heating the polymer coating to a temperature sufficient to burn or corrode the polymer coating and allow the polymer coating to be removed from the optical fiber and/or substrate.
- a metallic liquid e.g., gallinstan
- a length of a polymer coated optical fiber or fiber optic cable is immersed in a heated liquid metal, wherein the polymer material is burned and de-bonded from the optical fiber. The de-bonded polymer is then rinsed or cleaned off to expose the length of optical fiber.
- FIGS. 1-3 illustrate examples of fiber optic assemblies that include polymer materials (e.g., polyimide materials) that are configured as a coating around an optical fiber and/or an adhesive to bond the optical fiber to a substrate.
- an exemplary fiber optic assembly 10 includes an optical fiber 12 that is adhered to at least a portion of a substrate 14 .
- the substrate is made from a metallic material such as stainless steel or aluminum.
- the optical fiber 12 has protective polymer material 16 that is bonded to the optical fiber 12 and is configured as a coating or outer layer.
- the polymer material 16 may also be bonded to the substrate 14 and thereby acts as an adhesive to secure the optical fiber 12 to the substrate 14 .
- the optical fiber 12 may be bonded directly to the substrate 14 via the polymer coating 16 and/or via additional polymer material that is bonded to the coating and the substrate 14 .
- optical fiber 12 is configured as an optical fiber sensor including a core having one or more measurement locations such as fiber Bragg gratings (FBG) located along the length of the optical fiber sensor 12 .
- Other measurement units may include lengths or regions of the optical fiber sensor 12 utilized for the detection of intrinsic scattering such as Rayleigh, Raman or Brillouin scattering signals.
- the substrate 14 may be any member deformable by a force and/or pressure, and need not take the specific shapes and configurations described herein.
- the fiber optic assembly 10 in this embodiment is configured to estimate various parameters exerted at various locations on the substrate 14 and/or the fiber 12 . Examples of such parameters include external and internal parameters such as strain, pressure and other forces.
- the optical fiber 12 is adhered to the substrate 14 via a polyimide material, which may include a polyimide coating or an additional layer of polyimide that is fused to the polyimide coating and adhered to the substrate 14 .
- a polyimide material may include a polyimide coating or an additional layer of polyimide that is fused to the polyimide coating and adhered to the substrate 14 .
- Exemplary polyimides include polyimides having a high glass transition temperature (Tg), such as a Tg greater than about 250 degrees C.
- the polyimide materials have a Tg that is greater than temperatures found in a downhole environment. Examples of such polyimide materials include thermoplastic polyimides (TPI) such as polyetheretherketone (PEEK), and composite polyimide materials such as composite polyimide/acrylate materials.
- TPI thermoplastic polyimides
- PEEK polyetheretherketone
- composite polyimide materials such as composite polyimide/acrylate materials.
- the optical fiber 12 includes a core for transmission of optical signals, such as a silica core, and a cladding such as a doped silica cladding.
- the polyimide coating is adhered directly to the exterior surface of the cladding.
- the optical fiber 12 consists of only three layers, i.e., the core, the cladding and a polyimide material that acts as both a protective coating and an adhesive to secure the optical fiber 12 in a fixed position relative to the substrate 14 .
- FIG. 2 illustrates another example of the fiber optic assembly 10 .
- one or more optical fiber sensors 12 having a polymer coating material 16 are adhered via the polymer coating 16 to a tubular substrate 14 .
- the tubular substrate include sections of a carrier such as a borehole string, drill string or production string configured to be disposed in a borehole in an earth formation.
- the fiber optic assembly 10 in one embodiment, is incorporated into a fiber optic cable 20 .
- the cable 20 may be configured as a strain sensing cable that is disposed with a deformable component such as a borehole string or downhole tool to measure parameters such as strain and deformation of the component. Other parameters such as temperature and pressure may also be measured using the cable 20 .
- the cable 20 includes one or more optical fibers 12 disposed on and adhered to one or more metallic members, such as a central member or cable core 22 .
- the optical fibers 12 are adhered via the polymer material 16 to a surface of the core 22 .
- a protective outer cable wall 24 is disposed about the optical fibers 12 and the cable core 22 .
- the cable core 22 includes passages or grooves 26 extending along the cable core 22 surface, for example, in an axial or helical path.
- the optical fibers 12 are disposed in and adhered to surfaces of the grooves 26 via their respective polyimide coatings.
- the cable core 22 may be a solid core or may be configured to accommodate additional cable components, such as additional core members, conductive wires and additional optical fibers.
- the cable core 22 may have additional grooves or spaces disposed near its surface, or may be hollow to accommodate the additional components.
- the components and configurations of the cables are not limited to the embodiments described herein.
- the cable 20 may include other components such as additional electrical conductors for supplying power or communication.
- the type or configuration of the substrates is not limited.
- all of the embodiments described herein can allow for the incorporation of additional optical fibers for other sensing technologies such as, but not limited to, distributed temperature sensing (DTS), acoustic sensing, and single point pressure/temperature sensing.
- DTS distributed temperature sensing
- acoustic sensing acoustic sensing
- single point pressure/temperature sensing single point pressure/temperature sensing.
- the exemplary cables 20 described herein include multiple optical fibers 12 , although the number and configurations of the optical fibers 12 are not so limited.
- the substrate 14 is includes as at least part of a component of a subterranean well drilling, evaluation, exploration and/or production system.
- the component may include a borehole string configured to be disposed in a borehole that penetrates an earth formation.
- the borehole string can include one or more pipe sections or coiled tubing that extend downward into the borehole.
- Other components may include a drill bit assembly, a bottomhole assembly (BHA), and downhole tools for various processes including drilling, hydrocarbon production, and formation evaluation (FE) for measuring one or more physical quantities in or around a borehole.
- the optical fiber 12 can be configured as a pressure, strain and/or force sensor, such as an optical fiber sensor and/or a strain sensing cable 20 .
- the optical fiber 12 and/or cable 20 may also include capability for communicating between components and/or a surface processing unit.
- FIG. 4 illustrates a method 30 of removing a polymer material, such as a polymer coating and/or adhesive material, from an optical fiber.
- the method 30 includes one or more stages 31 - 34 .
- the method 30 is described in conjunction with the optical fiber 12 , the substrate 14 and/or components of the cable 20 , the method 30 is not limited to use with these embodiments.
- the method 30 includes the execution of all of stages 31 - 34 in the order described. However, certain stages may be omitted, stages may be added, or the order of the stages changed.
- a liquid metallic material is applied to an optical fiber having a polymer coating and/or an optical fiber assembly including an optical fiber bonded to a substrate.
- the liquid metallic material is disposed proximate to or contacted with a surface of the polymer coating (or adhesive polymer material) and/or a surface of the substrate.
- an “optical fiber assembly” may include either at least one optical fiber having a polymer coating or a fiber optic assembly including at least one optical fiber adhered or bonded to a substrate.
- the liquid metallic material includes any liquid conductive metallic material.
- the metallic material is liquid at room temperature.
- gallinstan examples include metals such as indium, gallium and mercury, and alloys of metals such as indium, gallium, tin and bismuth.
- the substrate includes a flat or relatively flat metal plate
- applying the liquid metallic material includes pouring the liquid metallic material over the length of the optical fiber that is to be removed.
- the liquid metallic material is held in a container and the optical fiber or fiber optic assembly (e.g., optical fiber 12 , fiber optic assembly 10 and/or cable 20 ) is dipped or otherwise inserted into the liquid metallic material.
- the liquid metallic material is heated to a temperature sufficient to burn the polymer material and de-bond the polymer material from a surface of the optical fiber and/or the substrate. Heating may be performed by any suitable device or method, such as by contacting the substrate to a resistive heating element (either directly or indirectly via another metal). In one embodiment, heating is performed by applying an inductive heater to the liquid metallic material.
- the liquid metallic material may be disposed in an inductive furnace or disposed in a heat resistant container and disposed within a conductive coil.
- the liquid metallic material reaches the sufficient temperature and thereby heats the polymer material to the sufficient temperature.
- the liquid metallic material is gallinstan, which is heated to a temperature at or above about 600 degrees C. The polymer material burns at this temperate and loses its bond with the optical fiber and/or substrate.
- the de-bonded polymer material is removed from the optical fiber and/or substrate. This may be accomplished by any desired cleaning method, such as by rinsing with a suitable liquid or cleaning with alcohol. In one embodiment, the optical fiber, substrate and liquid metallic material is allowed to cool (e.g., to room temperature) prior to removing the polymer.
- FIG. 5 illustrates an exemplary apparatus 40 for removing polymer coatings and/or adhesives from optical fibers and fiber optic assemblies.
- Use of the apparatus 40 is described herein in conjunction with an optical fiber 12 having a polymer coating 16 , however, the apparatus may be used with any fiber optic assembly having a polymer material, such as the fiber optic assembly 10 and the cable 20 .
- the apparatus 40 includes a liquid metallic material 42 disposed in a container 44 .
- the container 44 is disposed in an induction heater 46 including an electrically conductive coil 48 that is wrapped around the container 44 .
- the coil 48 is electrically connected to a power source and/or controller 50 configured to apply a selected current to the coil 48 .
- the container 44 is a separate container, such as a heat resistant tube, that can be lowered into the coil 48 .
- the optical fiber 12 can be lowered into the liquid metallic material 42 , which is heated to a temperature sufficient to burn the polymer coating 16 either prior to or after lowering the optical fiber 12 .
- the optical fiber 12 is removed and cleaned.
- the optical fiber 12 is lowered or dipped into the liquid metallic material, removed, and then lowered into a space surrounded by the coil 48 for heating.
- the methods described herein provide various advantages over existing methods and devices.
- the methods described herein include using a liquid metallic material to burn the polymer coating (and/or adhesive) and remove that polymer coating.
- Such methods are safer than prior art methods as they do not involve the use of an open flame, and also do not involve the use of corrosive and potentially dangerous materials such as sulfuric acid.
- various analyses and/or analytical components may be used, including digital and/or analog systems.
- the apparatus may have components such as a processor, storage media, memory, input, output, communications link (wired, wireless, pulsed mud, optical or other), user interfaces, software programs, signal processors (digital or analog) and other such components (such as resistors, capacitors, inductors and others) to provide for operation and analyses of the apparatus and methods disclosed herein in any of several manners well-appreciated in the art.
- teachings may be, but need not be, implemented in conjunction with a set of computer executable instructions stored on a computer readable medium, including memory (ROMs, RAMs), optical (CD-ROMs), or magnetic (disks, hard drives), or any other type that when executed causes a computer to implement the method of the present invention.
- ROMs, RAMs random access memory
- CD-ROMs compact disc-read only memory
- magnetic (disks, hard drives) any other type that when executed causes a computer to implement the method of the present invention.
- These instructions may provide for equipment operation, control, data collection and analysis and other functions deemed relevant by a system designer, owner, user or other such personnel, in addition to the functions described in this disclosure.
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Abstract
An apparatus for performing a downhole operation includes: a carrier configured to be deployed in a borehole in an earth formation; and an optical fiber assembly disposed at the carrier, the optical fiber assembly including an optical fiber and a polymer material bonded to a length of the optical fiber. A portion of the polymer material has been removed by: disposing a liquid metallic material proximate to the polymer material, the polymer material being bonded to the optical fiber; heating the liquid metallic material to a temperature sufficient to burn the polymer material and de-bond the polymer material from a surface of the optical fiber; and removing the polymer material and liquid metal from the surface of the optical fiber.
Description
- This application is a divisional of co-pending U.S. patent application Ser. No. 13/197,373, filed Aug. 3, 2011 “METHOD AND APPARATUS FOR STRIPPING OPTICAL FIBERS AND OPTICAL FIBER ASSEMBLIES”, by Lambert et al., which is hereby incorporated herein by reference in its entirety.
- Optical fibers find use in a variety of applications. For example, in the drilling and completion industry, optical fibers are utilized to provide communication between components and to measure various conditions and component parameters in a downhole environment as well parameters of downhole components. Exemplary optical fiber sensors include temperature sensors and strain sensors, which can be used to monitor deformation in downhole components. In some applications, optical fibers are coated with protective layers and may also be bonded to substrates. Portions of an optical fiber coating and/or substrate bonding material may be removed, for example, so that the optical fiber can be terminated. The coating and/or bonding material may also be removed so that the optical fiber can be spliced or connected to another fiber, or connected to a signal source or detector.
- Typical methods of stripping polymer coatings, such as polyimide, from optical fibers include either burning of the coating using an open flame, or dipping of the fiber into vials of heated acid. These methods pose potential problems by the nature of the chemicals used and fire hazards.
- An apparatus for performing a downhole operation includes: a carrier configured to be deployed in a borehole in an earth formation; and an optical fiber assembly disposed at the carrier, the optical fiber assembly including an optical fiber and a polymer material bonded to a length of the optical fiber. A portion of the polymer material has been removed by: disposing a liquid metallic material proximate to the polymer material, the polymer material being bonded to the optical fiber; heating the liquid metallic material to a temperature sufficient to burn the polymer material and de-bond the polymer material from a surface of the optical fiber; and removing the polymer material and liquid metal from the surface of the optical fiber.
- These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
-
FIG. 1 is a perspective view of an embodiment of a fiber optic assembly including a polymer coated optical fiber adhered to a substrate; -
FIG. 2 is a cross-sectional view of another embodiment of the fiber optic assembly ofFIG. 1 ; -
FIG. 3 is a cross-sectional view of a cable including a fiber optic assembly adhered to a cable member via a polymer material; -
FIG. 4 is a flow chart illustrating an embodiment of a method of removing a polymer material from an optical fiber and/or substrate adhered to the optical fiber; and -
FIG. 5 is a cross-sectional view of an apparatus for removing a polymer material from an optical fiber and/or substrate adhered to the optical fiber. - Described herein are methods and apparatuses for removing polymer materials from optical fibers and/or optical fiber assemblies such as fiber optic cables. An exemplary method includes contacting or otherwise applying a metallic liquid (e.g., gallinstan) to a polymer coating and/or adhesive, and heating the polymer coating to a temperature sufficient to burn or corrode the polymer coating and allow the polymer coating to be removed from the optical fiber and/or substrate. In one example, a length of a polymer coated optical fiber or fiber optic cable is immersed in a heated liquid metal, wherein the polymer material is burned and de-bonded from the optical fiber. The de-bonded polymer is then rinsed or cleaned off to expose the length of optical fiber.
-
FIGS. 1-3 illustrate examples of fiber optic assemblies that include polymer materials (e.g., polyimide materials) that are configured as a coating around an optical fiber and/or an adhesive to bond the optical fiber to a substrate. Referring toFIG. 1 , an exemplary fiberoptic assembly 10 includes anoptical fiber 12 that is adhered to at least a portion of asubstrate 14. In one embodiment, the substrate is made from a metallic material such as stainless steel or aluminum. Theoptical fiber 12 hasprotective polymer material 16 that is bonded to theoptical fiber 12 and is configured as a coating or outer layer. Thepolymer material 16 may also be bonded to thesubstrate 14 and thereby acts as an adhesive to secure theoptical fiber 12 to thesubstrate 14. Theoptical fiber 12 may be bonded directly to thesubstrate 14 via thepolymer coating 16 and/or via additional polymer material that is bonded to the coating and thesubstrate 14. - In one embodiment,
optical fiber 12 is configured as an optical fiber sensor including a core having one or more measurement locations such as fiber Bragg gratings (FBG) located along the length of theoptical fiber sensor 12. Other measurement units may include lengths or regions of theoptical fiber sensor 12 utilized for the detection of intrinsic scattering such as Rayleigh, Raman or Brillouin scattering signals. Thesubstrate 14 may be any member deformable by a force and/or pressure, and need not take the specific shapes and configurations described herein. The fiberoptic assembly 10 in this embodiment is configured to estimate various parameters exerted at various locations on thesubstrate 14 and/or thefiber 12. Examples of such parameters include external and internal parameters such as strain, pressure and other forces. - In one embodiment, the
optical fiber 12 is adhered to thesubstrate 14 via a polyimide material, which may include a polyimide coating or an additional layer of polyimide that is fused to the polyimide coating and adhered to thesubstrate 14. Exemplary polyimides include polyimides having a high glass transition temperature (Tg), such as a Tg greater than about 250 degrees C. In one embodiment, the polyimide materials have a Tg that is greater than temperatures found in a downhole environment. Examples of such polyimide materials include thermoplastic polyimides (TPI) such as polyetheretherketone (PEEK), and composite polyimide materials such as composite polyimide/acrylate materials. - The
optical fiber 12 includes a core for transmission of optical signals, such as a silica core, and a cladding such as a doped silica cladding. In one embodiment, the polyimide coating is adhered directly to the exterior surface of the cladding. Thus, in this embodiment, theoptical fiber 12 consists of only three layers, i.e., the core, the cladding and a polyimide material that acts as both a protective coating and an adhesive to secure theoptical fiber 12 in a fixed position relative to thesubstrate 14. -
FIG. 2 illustrates another example of the fiberoptic assembly 10. In this embodiment, one or moreoptical fiber sensors 12 having apolymer coating material 16 are adhered via thepolymer coating 16 to atubular substrate 14. Examples of the tubular substrate include sections of a carrier such as a borehole string, drill string or production string configured to be disposed in a borehole in an earth formation. - Referring to
FIG. 3 , the fiberoptic assembly 10, in one embodiment, is incorporated into a fiberoptic cable 20. Thecable 20 may be configured as a strain sensing cable that is disposed with a deformable component such as a borehole string or downhole tool to measure parameters such as strain and deformation of the component. Other parameters such as temperature and pressure may also be measured using thecable 20. - The
cable 20 includes one or moreoptical fibers 12 disposed on and adhered to one or more metallic members, such as a central member orcable core 22. Theoptical fibers 12 are adhered via thepolymer material 16 to a surface of thecore 22. A protectiveouter cable wall 24 is disposed about theoptical fibers 12 and thecable core 22. - In one embodiment, the
cable core 22 includes passages orgrooves 26 extending along thecable core 22 surface, for example, in an axial or helical path. Theoptical fibers 12 are disposed in and adhered to surfaces of thegrooves 26 via their respective polyimide coatings. Thecable core 22 may be a solid core or may be configured to accommodate additional cable components, such as additional core members, conductive wires and additional optical fibers. For example, thecable core 22 may have additional grooves or spaces disposed near its surface, or may be hollow to accommodate the additional components. - The components and configurations of the cables are not limited to the embodiments described herein. For example, the
cable 20 may include other components such as additional electrical conductors for supplying power or communication. Furthermore, the type or configuration of the substrates is not limited. For example, all of the embodiments described herein can allow for the incorporation of additional optical fibers for other sensing technologies such as, but not limited to, distributed temperature sensing (DTS), acoustic sensing, and single point pressure/temperature sensing. Theexemplary cables 20 described herein include multipleoptical fibers 12, although the number and configurations of theoptical fibers 12 are not so limited. - In one embodiment, the
substrate 14 is includes as at least part of a component of a subterranean well drilling, evaluation, exploration and/or production system. The component may include a borehole string configured to be disposed in a borehole that penetrates an earth formation. The borehole string can include one or more pipe sections or coiled tubing that extend downward into the borehole. Other components may include a drill bit assembly, a bottomhole assembly (BHA), and downhole tools for various processes including drilling, hydrocarbon production, and formation evaluation (FE) for measuring one or more physical quantities in or around a borehole. Theoptical fiber 12 can be configured as a pressure, strain and/or force sensor, such as an optical fiber sensor and/or astrain sensing cable 20. Theoptical fiber 12 and/orcable 20 may also include capability for communicating between components and/or a surface processing unit. -
FIG. 4 illustrates amethod 30 of removing a polymer material, such as a polymer coating and/or adhesive material, from an optical fiber. Themethod 30 includes one or more stages 31-34. Although themethod 30 is described in conjunction with theoptical fiber 12, thesubstrate 14 and/or components of thecable 20, themethod 30 is not limited to use with these embodiments. In one embodiment, themethod 30 includes the execution of all of stages 31-34 in the order described. However, certain stages may be omitted, stages may be added, or the order of the stages changed. - In the
first stage 31, a liquid metallic material is applied to an optical fiber having a polymer coating and/or an optical fiber assembly including an optical fiber bonded to a substrate. For example, the liquid metallic material is disposed proximate to or contacted with a surface of the polymer coating (or adhesive polymer material) and/or a surface of the substrate. As referred to herein, an “optical fiber assembly” may include either at least one optical fiber having a polymer coating or a fiber optic assembly including at least one optical fiber adhered or bonded to a substrate. - The liquid metallic material includes any liquid conductive metallic material. In one embodiment, the metallic material is liquid at room temperature. On example of the liquid metallic material is gallinstan. Other examples include metals such as indium, gallium and mercury, and alloys of metals such as indium, gallium, tin and bismuth.
- In one embodiment, the substrate includes a flat or relatively flat metal plate, and applying the liquid metallic material includes pouring the liquid metallic material over the length of the optical fiber that is to be removed. In one embodiment, the liquid metallic material is held in a container and the optical fiber or fiber optic assembly (e.g.,
optical fiber 12,fiber optic assembly 10 and/or cable 20) is dipped or otherwise inserted into the liquid metallic material. - In the
second stage 32, the liquid metallic material is heated to a temperature sufficient to burn the polymer material and de-bond the polymer material from a surface of the optical fiber and/or the substrate. Heating may be performed by any suitable device or method, such as by contacting the substrate to a resistive heating element (either directly or indirectly via another metal). In one embodiment, heating is performed by applying an inductive heater to the liquid metallic material. For example, the liquid metallic material may be disposed in an inductive furnace or disposed in a heat resistant container and disposed within a conductive coil. - In the
third stage 33, the liquid metallic material reaches the sufficient temperature and thereby heats the polymer material to the sufficient temperature. For example, the liquid metallic material is gallinstan, which is heated to a temperature at or above about 600 degrees C. The polymer material burns at this temperate and loses its bond with the optical fiber and/or substrate. - In the
fourth stage 34, the de-bonded polymer material is removed from the optical fiber and/or substrate. This may be accomplished by any desired cleaning method, such as by rinsing with a suitable liquid or cleaning with alcohol. In one embodiment, the optical fiber, substrate and liquid metallic material is allowed to cool (e.g., to room temperature) prior to removing the polymer. -
FIG. 5 illustrates anexemplary apparatus 40 for removing polymer coatings and/or adhesives from optical fibers and fiber optic assemblies. Use of theapparatus 40 is described herein in conjunction with anoptical fiber 12 having apolymer coating 16, however, the apparatus may be used with any fiber optic assembly having a polymer material, such as thefiber optic assembly 10 and thecable 20. - The
apparatus 40 includes a liquidmetallic material 42 disposed in acontainer 44. In one embodiment, thecontainer 44 is disposed in aninduction heater 46 including an electricallyconductive coil 48 that is wrapped around thecontainer 44. Thecoil 48 is electrically connected to a power source and/orcontroller 50 configured to apply a selected current to thecoil 48. In other embodiments, thecontainer 44 is a separate container, such as a heat resistant tube, that can be lowered into thecoil 48. - In conjunction with the
apparatus 40, theoptical fiber 12 can be lowered into the liquidmetallic material 42, which is heated to a temperature sufficient to burn thepolymer coating 16 either prior to or after lowering theoptical fiber 12. After the polymer material has burned and de-bonded from theoptical fiber 12, theoptical fiber 12 is removed and cleaned. In one embodiment, theoptical fiber 12 is lowered or dipped into the liquid metallic material, removed, and then lowered into a space surrounded by thecoil 48 for heating. - The apparatuses and methods described herein provide various advantages over existing methods and devices. For example, the methods described herein include using a liquid metallic material to burn the polymer coating (and/or adhesive) and remove that polymer coating. Such methods are safer than prior art methods as they do not involve the use of an open flame, and also do not involve the use of corrosive and potentially dangerous materials such as sulfuric acid.
- In connection with the teachings herein, various analyses and/or analytical components may be used, including digital and/or analog systems. The apparatus may have components such as a processor, storage media, memory, input, output, communications link (wired, wireless, pulsed mud, optical or other), user interfaces, software programs, signal processors (digital or analog) and other such components (such as resistors, capacitors, inductors and others) to provide for operation and analyses of the apparatus and methods disclosed herein in any of several manners well-appreciated in the art. It is considered that these teachings may be, but need not be, implemented in conjunction with a set of computer executable instructions stored on a computer readable medium, including memory (ROMs, RAMs), optical (CD-ROMs), or magnetic (disks, hard drives), or any other type that when executed causes a computer to implement the method of the present invention. These instructions may provide for equipment operation, control, data collection and analysis and other functions deemed relevant by a system designer, owner, user or other such personnel, in addition to the functions described in this disclosure.
- While the invention has been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications will be appreciated by those skilled in the art to adapt a particular instrument, situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this invention.
Claims (8)
1. An apparatus for performing a downhole operation comprising:
a carrier configured to be deployed in a borehole in an earth formation; and
an optical fiber assembly disposed at the carrier, the optical fiber assembly including an optical fiber and a polymer material bonded to a length of the optical fiber, a portion of the polymer material having been removed by:
disposing a liquid metallic material proximate to the polymer material, the polymer material being bonded to the optical fiber;
heating the liquid metallic material to a temperature sufficient to burn the polymer material and de-bond the polymer material from a surface of the optical fiber; and
removing the polymer material and liquid metal from the surface of the optical fiber.
2. The apparatus of claim 1 , wherein the polymer material is a polyimide material.
3. The apparatus of claim 1 , wherein the polymer material is selected from at least one of an optical fiber coating and an adhesive material configured to adhere the optical fiber to the carrier.
4. The apparatus of claim 3 , wherein the carrier is a metallic component of a fiber optical cable.
5. The apparatus of claim 3 , wherein the carrier is a borehole string.
6. The apparatus of claim 3 , wherein disposing includes applying the liquid metallic material to a surface of the polymer material and a portion of a surface of the carrier.
7. The apparatus of claim 6 , wherein applying includes immersing a portion of the polymer material and the optical fiber into a container containing the liquid metallic material.
8. The apparatus of claim 1 , wherein the polymer material includes:
a protective coating surrounding the optical fiber, the protective coating made from a polyimide material; and
an adhesive configured to adhere the optical fiber to the carrier, the adhesive made from the polyimide material.
Priority Applications (1)
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US14/027,876 US20140202682A1 (en) | 2011-08-03 | 2013-09-16 | Apparatus for stripping optical fibers and optical fiber assemblies |
Applications Claiming Priority (2)
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US13/197,373 US8557052B2 (en) | 2011-08-03 | 2011-08-03 | Method and apparatus for stripping optical fibers and optical fiber assemblies |
US14/027,876 US20140202682A1 (en) | 2011-08-03 | 2013-09-16 | Apparatus for stripping optical fibers and optical fiber assemblies |
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US13/197,373 Division US8557052B2 (en) | 2011-08-03 | 2011-08-03 | Method and apparatus for stripping optical fibers and optical fiber assemblies |
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US20140202682A1 true US20140202682A1 (en) | 2014-07-24 |
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US13/197,373 Expired - Fee Related US8557052B2 (en) | 2011-08-03 | 2011-08-03 | Method and apparatus for stripping optical fibers and optical fiber assemblies |
US14/027,876 Abandoned US20140202682A1 (en) | 2011-08-03 | 2013-09-16 | Apparatus for stripping optical fibers and optical fiber assemblies |
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US13/197,373 Expired - Fee Related US8557052B2 (en) | 2011-08-03 | 2011-08-03 | Method and apparatus for stripping optical fibers and optical fiber assemblies |
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US20150129751A1 (en) | 2013-11-12 | 2015-05-14 | Baker Hughes Incorporated | Distributed sensing system employing a film adhesive |
US20160040527A1 (en) * | 2014-08-06 | 2016-02-11 | Baker Hughes Incorporated | Strain locked fiber optic cable and methods of manufacture |
US20160223775A1 (en) * | 2015-01-30 | 2016-08-04 | Corning Optical Communications LLC | Fiber stripping methods and apparatus |
US10018782B2 (en) | 2015-05-28 | 2018-07-10 | Corning Optical Communications LLC | Optical fiber stripping methods and apparatus |
US9604261B2 (en) * | 2015-06-30 | 2017-03-28 | Corning Optical Communications LLC | Monitoring of optical fiber stripping |
US10634847B2 (en) | 2016-05-27 | 2020-04-28 | Corning Optical Communications LLC | Optical fiber coating stripping through relayed thermal radiation |
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US5948202A (en) * | 1994-02-03 | 1999-09-07 | Corning Incorporated | Method for removing a protective coating from optical fibers and making a photonic device |
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US8317972B2 (en) * | 2006-11-30 | 2012-11-27 | Corning Incorporated | Method and apparatus for optical fiber coating removal |
-
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- 2011-08-03 US US13/197,373 patent/US8557052B2/en not_active Expired - Fee Related
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- 2013-09-16 US US14/027,876 patent/US20140202682A1/en not_active Abandoned
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US5344702A (en) * | 1990-09-14 | 1994-09-06 | Hoechst Celanese Corp. | Coated fibers |
US5968283A (en) * | 1996-10-25 | 1999-10-19 | Lucent Technologies Inc. | Method for heat stripping optical fibers |
US6268911B1 (en) * | 1997-05-02 | 2001-07-31 | Baker Hughes Incorporated | Monitoring of downhole parameters and tools utilizing fiber optics |
WO2006097772A1 (en) * | 2005-03-16 | 2006-09-21 | Philip Head | Well bore sensing |
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US8557052B2 (en) | 2013-10-15 |
US20130032177A1 (en) | 2013-02-07 |
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