US20140075959A1

US20140075959A1 - Evaporative cooler apparatus and method

Info

Publication number: US20140075959A1
Application number: US13/621,777
Authority: US
Inventors: Donald John Lenkszus; Terrence M. Mcdermott
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-09-17
Filing date: 2012-09-17
Publication date: 2014-03-20

Abstract

A water cooler kit is provided for use with an evaporative cooler of a type comprising at least one cooling pad, a water reservoir, a water inlet to supply water to the reservoir from a water supply at least one conduit for distributing water onto said at least one cooling pad, a fan for moving air through said cooling pad, and a pump for transferring water from said reservoir to said conduit. The water cooler kit comprises a cooling plate disposed in the reservoir, a heat dissipating structure disposed outside of the evaporative cooler, and a heat transferring thermal conductor between the cooling plate and the heat dissipating structure to transfer heat from the cooling plate to the heat dissipating structure so that heat is extracted from water in the reservoir and dissipated outside the evaporative cooler.

Description

FIELD OF THE INVENTION

The present invention relates to evaporative coolers of the type used to cool homes and other buildings through an evaporative cooling effect.

BACKGROUND OF THE INVENTION

There are two basic types of evaporative air coolers (EAC's) used to cool homes, schools, and commercial buildings, direct and indirect. They can be used separately or in combination.
Evaporative coolers employ a fan or blower to draw an air stream across water saturated pads or drums. The evaporating water withdraws the latent heat of vaporization from the airstream, thus cooling air.
The fan in a direct evaporative cooler moves a supply air stream past a wetted media, which adds moisture to the supply air stream to accomplish the evaporative cooling effect. This effect uses the heat of vaporization of the water to reduce the dry-bulb temperature.
The indirect evaporative cooler uses a heat exchanger to separate the moist evaporative cooled air (or water) from the drier room air. The main difference in the application of these two types of evaporative coolers is that a direct evaporative cooler uses 100% outside air for proper operation.
Each evaporative cooler typically comprises a metal, plastic or fiberglass housing and frame, a supply fan or blower, water holding sump, water circulation pump, water distribution tubing, electric connections and a wetted pad. These pads provide the surfaces from which the water evaporates, and are commonly made of aspen shavings, paper or plastic media. Evaporative coolers typically use a small fractional horsepower pump to raise the water and spray it over the pads, then gravity and capillary action wet the entire pad.
The efficiency of evaporative coolers depends to large extent upon the temperature of the supplied water, with efficiency increasing as water temperature drops. Additionally, a lower water temperature allows lower humidity to be maintained in the room air.
In prior art attempts to cool water in evaporative cooler reservoirs, the heat extracted from water is typically dumped back into the air stream in the evaporative cooler. This leads to the problem that although the water is cooled and the cooled water is sprayed onto the evaporative pads, the heat that is removed from the water is dumped into the cooled air moving through the evaporative cooler, thereby significantly reducing if not eliminating any advantage provided by cooling the reservoir water.

SUMMARY OF THE INVENTION

It is one object of the present invention to provide a new and improved evaporative cooler.
It is another object of the present invention to provide a method and apparatus to provide cooled water to an evaporative cooler.
The embodiments of the invention provide a water cooler adapted for convenient retrofit installation to existing evaporative coolers. The principles of the invention may be utilized in original equipment evaporative coolers.
A water cooler kit is provided for use with an evaporative cooler of a type comprising at least one cooling pad, a water reservoir, a water inlet to supply water to the reservoir from a water supply at least one conduit for distributing water onto said at least one cooling pad, a fan for moving air through said cooling pad, and a pump for transferring water from said reservoir to said conduit. The water cooler kit comprises a cooling plate disposed in the reservoir, a heat dissipating structure disposed outside of the evaporative cooler, and a heat transferring thermal conductor between the cooling plate and the heat dissipating structure to transfer heat from the cooling plate to the heat dissipating structure so that heat is extracted from water in the reservoir and dissipated outside the evaporative cooler.
In one embodiment, the cooling plate comprises a refrigerated cooling plate. The cooling plate may comprise a plurality of protrusions to enhance heat transfer.
In another embodiment the cooling plate comprises a thermoelectric cooling structure. The thermoelectric cooling structure may also comprise a plurality of protrusions to enhance heat transfer.
In various embodiments, the water cooler further comprises a cooled conduit connectable between said water supply and said water reservoir to cool water supplied to said reservoir.
In certain embodiments the cooled conduit is carried by the cooling plate. The cooled conduit may comprise a serpentine flow passage. The serpentine flow passage may be carried on a surface of the cooling plate or within the cooling plate.
In yet further embodiments, the heat transferring thermal conductor comprises a heat pipe.
In still further embodiments, the heat dissipating structure may comprise one of a refrigerated plate and a thermoelectric cooling device. In those embodiments, the heat dissipating structure may further comprise the cooled conduit is carried by the cooling plate. The cooled conduit may comprise a serpentine flow passage.
The water cooler kit may further comprise at least one thermostat to control operation of the temperature of the water in the reservoir and in the serpentine flow passage.
An embodiment of an evaporative cooler comprises: a frame holding at least one cooling pad, a water reservoir, at least one conduit for distributing water onto the at least one cooling pad, a blower for moving air through said cooling pad, a pump for transferring water from the reservoir to the conduit, and a water cooler. The water cooler comprises a cooling plate disposed in the reservoir; a heat dissipating structure disposed outside of the evaporative cooler; and a heat transferring thermal conductor between the cooling plate and the heat dissipating structure such that heat is transferred from the cooling plate to the heat dissipating structure so that heat is extracted from the reservoir and dissipated in the environment outside the evaporative cooler.
In various embodiments, the cooling plate comprises a refrigerated cooling plate or a thermoelectric cooling structure. The cooling plate may comprise a plurality of protrusions.
The evaporative cooler may comprises a water inlet for supplying water from a water supply to the reservoir and the water cooler may comprise a cooled conduit connectable between the water supply and the water reservoir to cool water supplied to the reservoir. In various embodiments, the cooled conduit is carried by the cooler plate. The cooled conduit may comprise a serpentine flow passage carried by the cooling plate. The serpentine flow passage may be carried on a surface of said cooling plate. The serpentine flow passage may alternatively be carried within the cooling plate.
The water cooler may comprise a thermostat to control operation of the cooling plate. The thermostatic element may be carried by the cooling plate.
The heat transfer structure of the water cooler may comprise a heat pipe.
In various embodiments, the heat dissipating structure comprises a refrigerated plate. A heat pipe may thermally couple the refrigerated plate and the cooling plate.
Another embodiment of an evaporative cooler comprises at least one cooling pad, a water reservoir, at least one conduit for distributing water onto the at least one cooling pad, a blower for moving air through the cooling pad, and a pump for transferring water from the reservoir to the conduit. The evaporative cooler further comprises a water cooler comprising: a cooling plate disposed in the reservoir; a heat dissipating structure disposed outside of the evaporative cooler; and a heat transferring thermal conductor between the cooling plate and the heat dissipating structure such that heat is transferred from the cooling plate to the heat dissipating structure so that heat is extracted from the reservoir and dissipated outside the evaporative cooler. The evaporative cooler further comprises sequence control apparatus to control the water cooler, pump and blower such that the water cooler is energized to cool water in the reservoir and to energize the pump to wet the at least one cooling pad prior to energizing the blower.
In one embodiment, the water cooler is energized prior to energizing the pump to cool water in the reservoir so that the cooling pad is wetted with cooled water before energizing the blower.
In another embodiment, a thermostat/control apparatus is coupled to the sequence control apparatus to initiate operation of the sequence control apparatus. The sequence control apparatus may include an interface to a telephone connection, and/or an interface to the internet or another network such as a local area network or a wide area network, and/or to a wireless receiver such that operation of the evaporative cooler including the water cooler may be controlled remotely.
A method of operating an evaporative cooler comprises: cooling water in a water reservoir, dissipating heat extracted from the water with a heat dissipating structure located outside the evaporative cooler, and wetting an evaporative cooling medium with the cooled water.
In one embodiment the method further comprises cooling the water prior to energizing a blower to generate an air stream flowing through the wetted evaporative cooling medium.
In another embodiment the method comprises: wetting the evaporative cooling medium by pumping water from the reservoir to the evaporative cooling medium, and energizing a pump to provide water to the evaporative cooling medium subsequent to cooling the water.
In various embodiments, the method comprises controlling operation of the evaporative cooler remotely.
In accordance with another embodiment, apparatus is provided to control an evaporative cooler comprising a water reservoir, a pump, an evaporative cooling medium, a fan for drawing an air steam into engagement with the evaporative cooling medium, and a water cooler for cooling water in the reservoir. The apparatus comprises sequence control apparatus comprising: a first output to control energizing and de-energizing the fan; a second output to control energizing and de-energizing the pump; and a third output to control energizing and de-energizing the water cooler. The sequence control apparatus is operable to control the sequence of operation of the water cooler, the pump, and the fan.
In accordance with an embodiment, the apparatus comprises control apparatus coupled to the sequence control apparatus to initiate operational sequences by the sequence control apparatus. The control apparatus may comprise one or more interfaces to receive commands from remote locations. The commands are utilized by the control apparatus to initiate the operational sequences. The one or more interfaces provide coupling to one or more of a wide area network, a local area network, a wireless receiver, and a telephone connection.

BRIEF DESCRIPTION OF THE DRAWING

The invention will be better understood from a reading of the following description in conjunction with the drawing figures in which like designators identify like elements and in which:

FIG. 1 illustrates a typical prior art evaporative cooler;

FIG. 2 illustrates in block diagram form an embodiment of the invention;

FIG. 3 is a block diagram;

FIG. 4 is a top view of a cooling plate;

FIG. 5 is a side view of the cooling plate of FIG. 4;

FIG. 6 is a top view of a water supply cooling plate;

FIG. 7 is a side view of an embodiment of a cooling plate construction;

FIG. 8 is a side view of a heat dissipater;

FIG. 9 is a right side view of the heat dissipater of FIG. 8;

FIG. 10 illustrates another embodiment;

FIG. 11 is a schematic view of a further embodiment;

FIG. 12 is a top view of the embodiment of FIG. 11;

FIG. 13 is a side view of the embodiment of FIG. 11;

FIG. 14 is a bottom view of the embodiment of FIG. 11;

FIG. 15 is a cross-sectional view of the embodiment of FIG. 11 taken along lines 13-13 of FIG. 13;

FIG. 16 illustrates another embodiment; and

FIG. 17 illustrates methodology of operation of a portion of the embodiment of FIG. 16.

DETAILED DESCRIPTION

FIG. 1 illustrates, in cross section, a representative evaporative cooler 100 of a type to which the invention may be advantageously applied.
Evaporative cooler 100 includes an enclosure structure or frame 101. One or more evaporative pads 103 are supported by structure 101.
Evaporative cooler 100 includes a water supply reservoir 105 that is typically filled with water maintained at a predetermined level by a water supply line 107 and a float valve assembly 109. A pump 111 circulates water from reservoir 105 to evaporative pads 103 via a water distribution line 113. Water distribution line 113 may be of any conventional design that distributes water to evaporative pads 103. In some constructions, water distribution line 113 comprises spray heads to spread water along the entire top of evaporative pads 103. The water flows down evaporative pads 103 to reservoir 105. As hot air is drawn though evaporative pads 103 by a blower 115, and water evaporates from pads 103, the hot air is cooled. Blower 115 draws the cooled air into duct 117 that distributes the cooled air into the house or other structure. Blower 115 receives power from electrical control 119.
It will be understood by those skilled in the art that evaporative cooler 100 is merely representative and that it is not intended to limit the invention to the particular structure shown.
As shown in FIG. 2, one embodiment of a water cooler kit 200 in accordance with the principles of the invention includes a cooling plate 201 that is disposed within a water reservoir 105. A heat dissipating structure 203 is disposed outside of structure 101 of evaporative cooler 100. A heat transfer thermal conductor 205 provides thermal communication between cooling plate 201 and heat dissipating structure 203.
By separating cooling plate 201 from heat dissipating structure 203, heat that is extracted from water in reservoir 105 is removed from the confines of evaporative cooler 100.
As noted herein above, in prior art attempts to cool water in evaporative cooler reservoirs, the heat extracted from water is typically dumped back into the air stream in the evaporative cooler. This leads to the problem that although the water is cooled and the cooled water is sprayed onto the evaporative pads, the heat that is removed from the water is dumped into the cooled air moving through the evaporative cooler, thereby significantly reducing if not eliminating any advantage provided by cooling the reservoir water.
The embodiment shown in FIG. 2 significantly improves upon the prior art arrangements by transferring heat extracted from water in a reservoir 105 to apparatus external to evaporative cooler 100.
Water cooler kit 200 also includes a temperature sensing and control unit or thermostat 211 that is set at a temperature such that the water in reservoir 105 is not cooled to a low temperature such that the water will freeze as a result of the cooling action of kit 200. Thermostat 211 typically is set to deactivate cooling when the temperature of cooling plate 201 is 40° F. or less.
When evaporative cooler 100 is operating, a substantially continuous flow of water is provided to reservoir 105 to replace evaporated water. Because tap water is used to provide the fresh water supply, the tap water may not be cold, and may be significantly higher than the temperature of water that returns to reservoir 105 from evaporative pads 103. The result is that the temperature of water in reservoir 105 may be warmed by the tap water.
To further assure that water delivered to evaporative pad 103 is cooled to an appropriate level, the embodiment of FIG. 3 provides pre-cooling of water supplied to evaporative cooler 100. A water supply cooler 207 cools the tap water. Water supply cooler 207 is shown separate from cooling plate 201.
It will be apparent to those skilled in the art that although water supply cooler 207 is shown separate from cooling plate 201, water supply cooler 207 may be combined with or integrated with cooling plate 201.
Water supply cooler 207 is coupled to heat dissipating structure 203 by heat transfer thermal connector 205.
In embodiments of the invention in which water supply cooler 207 is separate from cooling plate 201 a separate temperature control or thermostat 213 is provided. Thermostat 213 is set to prevent the temperature of water supply cooler 207 from going below a predetermined temperature, e.g., 40° F., to assure that water flowing through water supply cooler 207 does not freeze.
In embodiments of the invention in which water supply cooler 207 is integrated with cooling plate 201, a single thermostat 211 may be utilized.
FIGS. 4 and 5 illustrate an embodiment of cooling plate 201. Cooling plate 201 comprises a material of high thermal conductivity, e.g., a metal. Cooling plate 201 includes a plurality of surface structures, protrusions, or fins 501 to enhance heat transfer from water in water reservoir 105 to cooling plate 201. Although fins 501 are shown in FIG. 5, it will be appreciated by those skilled in the art that the particular configuration may be any configuration that enhances thermal transfer.
Although the surface structures or fins 501 are shown on only one surface, such surface structures or fins 501 may be present on more than one surface of cooling plate 201. Still further the heat transfer enhancing structures may be different on different surfaces of cooling plate 201.
Plate 201 also carries adjustable feet 401, 403, 405, 407 to support cooling plate 201 in reservoir 105.
Turning now to FIG. 6, water supply cooling plate 207 is constructed of material of high thermal conductivity, e.g., metal. Water supply cooling plate 207 has a water inlet 601 and a water outlet 603. A flow passage 605 couples water inlet 601 and water outlet 603. Flow passage 605 follows a serpentine course to provide maximum cooling to water flowing therein.
Flow passage 605 may be carried on one surface of water supply cooling plate 207. Alternatively, flow passage 605 may be carried within water supply cooling plate 207. Water supply cooling plate 207 may be constructed of multi-part construction. For example, water supply cooling plate 207 may comprise an upper plate and a lower plate with at least one of the upper or lower plate having a flow channel formed on the surface that mates with the other plate. The flow channel may be of a serpentine configuration, a “U” configuration or other configuration that enhances the heat transfer of fluid flowing therein. In a particularly advantageous configuration, the mating surfaces of both upper and lower plates have corresponding flow channels. The flow channels may have surface discontinuities formed therein to further enhance heat transfer to cool water flowing therein.
As pointed out herein above, water supply cooling plate 207 may be integrated with cooling plate 201 to form a unitary construction that provides cooling to water in reservoir 105 and to water flowing from a water supply into reservoir 105.
Turning now to FIG. 7, cooling plate 203 carries a thermoelectric cooling device 701 on its top surface. Thermoelectric cooling devices or “Peltier” devices are well known in the art and have the advantages of being solid-state devices operable off of low voltage direct current. As with all solid state devices, thermoelectric cooling devices are highly reliable and have long operational lives.
Thermoelectric cooling device 701 has its cooling surface 703 in thermal engagement with cooling plate 201 and its hot surface 705 in thermal engagement with heat transfer thermal conductor 205.
Heat transfer thermal conductor 205 may be a flexible thermal conductor, a heat pipe, or any other type of structure that efficiently transfers thermal energy from surface 705 to heat dissipater 203.
Heat dissipater 203 may be a finned thermal dissipater of a type well known in the art.
Turning now to FIGS. 8 and 9, an embodiment of heat dissipater 203 is shown. Heat dissipater 203 comprises a thermoelectric cooling device 801. Thermoelectric cooling device 801 has a cooling surface 803 and a hot surface 805 when powered from an electric power source 831 that is not shown. A power controller 833 is disposed between power source 831 and thermoelectric cooling device 801. Power controller is coupled to thermostat 211 to thereby control operation of thermoelectric cooling device 801.
Cooling surface 803 is in thermal engagement with heat transfer thermal conductor 205 to provide cooling to 201.
In embodiments in which a water supply cooling plate 207 is provided, cooling surface 803 also provides cooling to water supply cooling plate 201 and an additional thermostat 213 is also couple to power controller 833.
Hot surface 805 is in thermal engagement with a heat dissipating structure 807. In the embodiment shown, heat dissipating structure 807 comprises a surface structure to dissipate heat into the ambient air. As shown in FIG. 9, the surface structure comprises a plurality heat dissipating fins 809.
Turning now to FIG. 10, a particularly advantageous further embodiment of the invention is shown. In this embodiment, a thermoelectric cooling device is uses in accordance with the embodiment shown in FIG. 7 or FIG. 8.
Because thermoelectric cooling devices utilize low voltage direct current, advantageous use may be made of photovoltaic solar panels 1001. Photovoltaic solar panels can be configured to provide the low voltage direct current directly to thermoelectric cooling devices. Utilizing solar panels as part of the power source for thermoelectric cooling devices can further reduce the operating cost of cooling evaporative cooler water.
Power controller 831 may also provide control of battery backup and energy storage for solar panel 1001 and it may also provide for automatic switching to commercial alternating current power.
In a further embodiment, a refrigeration circuit is utilized rather than a thermoelectric module. FIG. 11 illustrates a schematic diagram of a refrigeration circuit 1100 that may be advantageously utilized. Refrigeration circuit 1100 is divided into a first portion 1101 and a second portion 1103.
First portion 1101 comprises a compressor 1105 having a suction line 1107 and a discharge line 1109. A condenser 1111 is provided in discharge line 1109 for condensing the compressed refrigerant vapor coming from the compressor 1105. An expansion valve 1113 is provided for flashing a portion of pressurized liquid refrigerant into a vapor thereby lowering the temperature and pressure of the remaining un-vaporized refrigerant.
Second portion 1103 of refrigeration circuit 1100 comprises an evaporator assembly 1115 connected between discharge line 1109 and suction line 1107.
Gaseous refrigerant is compressed, condensed to a liquid and then expanded, in the form of a liquid spray into evaporator assembly 1115. Heat transferred into the liquid refrigerant causes it to evaporate. The evaporated refrigerant passes through suction line 1107 back to compressor 1105.
Evaporator assembly 1115 is an aluminum roll-bond evaporator plate 1117 of a type commercially available. Evaporator plate 1117 comprises a flat sheet of aluminum containing an integral serpentine refrigerant passage 1119. It will be appreciated by those skilled in the art that other materials could also be used to construct the evaporator plate 1117 such as aluminum alloys, copper or other suitably conductive metals.
Commercially available roll-bond evaporator plate 1117 is of a type fabricated by rolling together two sheets of aluminum, applying heat and pressure during the rolling process such that the two sheets are effectively welded together into a single sheet. By applying a special coating (sometimes referred to as “weld stop”) between the sheets prior to the rolling/welding operation, it is possible to prevent the two sheets from welding together in the areas where the coating is applied. Thus by applying the coating in a serpentine pattern, it is possible to create a serpentine-shaped unwelded region within this welded part. By subsequently applying hydraulic pressure to this unwelded region, it is possible to inflate the unwelded serpentine region to form a serpentine passage through the plate. Thus a plate with an integral serpentine passage can be created in a very cost-effective manner. This type of evaporator is commonly used in domestic refrigerator applications where low cost is of extreme importance.
Except for the serpentine refrigerant passage 1119, evaporator plate 1117 is primarily flat. Evaporator plate 1117 is coupled to condenser 1111 and suction line 1107.
A power control circuit 1131 controls application of power to compressor 1105. Power control circuit 1105 is coupled to thermostat 211 to control the temperature of cooling plate 201.
Turning to FIGS. 12 through 15, heat dissipating structure 203 comprises a cold roll-bond evaporator plate 1117 in thermal engagement with heat transfer thermal connector 205. Heat dissipating structure 203 is carried in insulating support structure 1205.
Support structure 1205 also carries compressor 1105 disposed in a box 1215. It will be appreciated by those skilled in the art that compressor 1105 may be positioned at other locations proximate evaporator plate 1117.
Condenser 1111 is carried below box 1215. It will be appreciated by those skilled in the art that condenser 1111 may disposed at other locations proximate cold roll-bond evaporator plate 1117.
In operation, refrigeration circuit 1100 cools evaporator plate 1117 which in turn is thermally coupled to cooling plate 201 via heat transfer thermal connector 205. The result is that heat is transferred from cooling plate 201 to evaporator plate 1117, which in turn transfers the heat to condenser 1111.
A particularly advantageous embodiment of the invention is shown in FIG. 16. Evaporative cooler 100 includes an enclosure structure or frame 101. One or more evaporative pads 103 are supported by structure 101.
Evaporative cooler 100 includes a water supply reservoir 105 that is typically filled with water maintained at a predetermined level by a water supply line 107 and a float valve assembly 109. A pump 111 circulates water from reservoir 105 to evaporative pads 103 via a water distribution line 113. Water distribution line 113 may be of any conventional design that distributes water to evaporative pads 103. In some constructions, water distribution line 113 comprises spray heads to spread water along the entire top of evaporative pads 103. The water flows down evaporative pads 103 to reservoir 105. As hot air is drawn though evaporative pads 103 by a blower 115, and water evaporates from pads 103, the hot air is cooled. Blower 115 draws the cooled air into duct 117 that distributes the cooled air into the house or other structure. Blower 115 comprises a motor M. Electrical power is sourced to motor M from electrical source 119.
It will be understood by those skilled in the art that evaporative cooler 100 is merely representative and that it is not intended to limit the invention to the particular structure shown.
Water cooler 200 includes a cooling plate 201 disposed within water reservoir 105. Heat dissipating structure 203 is disposed outside structure 101 of evaporative cooler 100. A heat transfer thermal conductor 205 provides thermal communication between cooling plate 201 and heat dissipating structure 203. Power control circuit 831, when energized operates as described hereinabove.
As described hereinabove, by separating cooling plate 201 from heat dissipating structure 203, heat that is extracted from water in reservoir 105 is removed from the confines of evaporative cooler 100.
The embodiment shown in FIG. 16 advantageously includes control apparatus comprising a thermostat/control 1601, a sequence control 1603 and timer 1605 and power control circuit 831. Power control circuit 831 is described hereinabove. Thermostat/control 1601 may be used to turn evaporative cooler 100 on or off, and may also include a temperature control or thermostat that is utilized to maintain a constant predetermined temperature. Thermostat/control 1601 is mounted within the structure to be cooled and may include an integral temperature sensor, however, in certain embodiments, the temperature sensor 1607 may be located separate from the thermostat/control 1601.
Thermostat/control 1601 is coupled to sequence control apparatus 1603. Sequence control apparatus 1603 is coupled to a power control circuit 831, blower motor M, and pump 111. A timer circuit 1605 is coupled to sequence control apparatus 1603 and is utilized by sequence control apparatus 1603 to generate timed control signals. Sequence control 1603 may comprise a microcontroller in various embodiments.
Turning now to FIG. 17 the operation of thermostat/control 1601 and sequence control apparatus 1603 is shown.
At step 1701, a call for cooling is provided to sequence control apparatus 1603. The call for cooling output may be generated when a thermostat determines that the temperature is above a preselected level and/or an evaporative cooler cooling switch is switched to “cooling on”. In addition, the call for cooling output may be provided from a remote location via an interface 1605 that provides for remote control of the sequence control apparatus. Interface 1605 may be coupled to a wired or wireless telephone 1611, or to an Internet interface 1613, or to a wireless receiver 1615, or may be coupled via various known means to other control sources. Sequence control apparatus 1603 starts cooling the water in reservoir 105 at step 1703 by energizing water chiller 200 before causing blower motor M to be energized. In one embodiment, sequence control apparatus 1603 is programmed such that after the water in reservoir 105 reaches a predetermined temperature, or after a predetermined time period, sequence control 1603 turns pump 111 on at step 1705 to wet cooler pads 103. By turning pump 111 on, the evaporative cooler pads 103 are wetted with pre-chilled water.
Sequence control apparatus 1603 may alternatively be programmed such that both water chiller 200 and pump 111 are energized at the same time to both wet pads 103 and to cool water supplied to the pads 103. After a second predetermined time period, blower motor M is energized at step 1707. The second predetermined time period may be set or adjusted in sequence control apparatus 1603.
When temperature sensor 1607 indicates that a preset temperature is reached at step 1709, sequence control apparatus 1603 de-energizes blower motor M at step 1711, de-energizes pump 111 at step 1713 and turns of water cooler 200 at step 1715.
Sequence control apparatus 1603 may be programmed such that blower motor M is turned off, but pump 111 and water cooler 200 remain energized, such that cool water is continuously used to wet pads 103 as long as evaporative cooler 100 is activated.
Sequence control apparatus 1603 may be programmed such that when blower motor M is de-energized, pump 111 is also de-energized but water cooler 200 remains energized, or remains energized for a predetermined time period such that water in reservoir 115 remains cooled.
The invention has been described in terms of various embodiments. It will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments shown and described without departing from the spirit or scope of the invention. It is intended that the embodiments shown and described are illustrative of the principles of the invention and that the invention not be limited to such embodiments. It is intended that the invention be limited in scope only by the claims appended hereto.

Claims

1. A water cooler kit for use with an evaporative cooler comprising a frame holding at least one cooling pad, a water reservoir, at least one conduit for distributing water onto said at least one cooling pad, a fan for moving air through said cooling pad, and a pump for transferring water from said reservoir to said conduit, said water cooler kit comprising:

a refrigerated cooling plate disposed in said reservoir to cool water in said reservoir below the temperature of ambient air outside said evaporative cooler;

a heat dissipating structure disposed outside of said evaporative cooler; and

a heat transferring thermal conductor between said refrigerated cooling plate and said heat dissipating structure to transfer heat from said refrigerated cooling plate to said heat dissipating structure so that heat is extracted from said reservoir and dissipated outside said evaporative cooler.

2. A water cooler kit in accordance with claim 1, wherein:

said refrigerated cooling plate comprises an evaporator.

3. A water cooler kit in accordance with claim 1, wherein:

said refrigerated cooling plate comprises a thermoelectric cooling structure.

4. A water cooler kit in accordance with claim 1, wherein:

said refrigerated cooling plate comprises a plurality of protrusions.

5. A water cooler kit in accordance with claim 4, wherein:

said refrigerated cooling plate comprises an evaporator.

6. A water cooler kit in accordance with claim 4, wherein:

said refrigerated cooling plate comprises a thermoelectric cooling structure.

7. A water cooler kit in accordance with claim 1, wherein:

said evaporative cooler comprises a water inlet for supplying water from a water supply to said reservoir and said kit comprises:

a cooled conduit connectable between said water supply and said water reservoir to cool water supplied to said reservoir.

8. A water cooler kit in accordance with claim 7, wherein:

said cooled conduit is carried by said refrigerated cooling plate.

9. A water cooler kit in accordance with claim 8, wherein:

said cooled conduit comprises a serpentine flow passage carried by said refrigerated cooling plate.

10. A water cooler kit in accordance with claim 9, wherein:

said refrigerated cooling plate comprises an evaporator.

11. A water cooler kit in accordance with claim 1, wherein:

said refrigerated cooling plate comprises a thermoelectric cooling structure.

12. A water cooler kit in accordance with claim 9, wherein:

said serpentine flow passage is carried on a surface of said refrigerated cooling plate.

13. A water cooler kit in accordance with claim 9, wherein:

said serpentine flow passage is carried within said refrigerated cooling plate.

14. A water cooler kit in accordance with claim 1, comprising:

a thermostat to control operation of said refrigerated cooling plate.

15. A water cooler kit in accordance with claim 1, comprising:

a thermostatic element carried by said cooling plate to control operation of said refrigerated cooling plate.

16. A water cooler kit in accordance with claim 1, comprising:

adjustable supports carried by said refrigerated cooling plate for adjusting the position of said cooling plate in said reservoir.

17. A water cooler kit in accordance with claim 1, wherein:

said heat transferring thermal conductor comprises a heat pipe.

18. A water cooler kit in accordance with claim 1, wherein:

said heat dissipating structure comprises a refrigerated plate in thermal communication with said refrigerated cooling plate.

19. A water cooler kit in accordance with claim 18, comprising:

a heat pipe thermally coupling said refrigerated plate and said refrigerated cooling plate.

20. A water cooler kit in accordance with claim 1, wherein:

said heat dissipating structure comprises a thermoelectric cooling device in thermal communication with said refrigerated cooling plate.

21. A water cooler kit in accordance with claim 20, comprising:

a heat pipe thermally coupling said thermoelectric cooling device and said refrigerated cooling plate.

22. An evaporative cooler comprising:

an evaporative cooling medium;

a water reservoir;

at least one conduit for distributing water onto said evaporative cooling medium;

a fan for moving air through said cooling medium;

a pump for transferring water from said reservoir to said conduit;

a water cooler comprising:

a refrigerated cooling plate disposed in said reservoir to cool water in said reservoir to a temperature below the temperature of said air;

a heat dissipating structure disposed outside of said evaporative cooler; and

a heat transferring thermal conductor between said refrigerated cooling plate and said heat dissipating structure such that heat is transferred from said cooling plate to said heat dissipating structure so that heat is extracted from said reservoir and dissipated outside said evaporative cooler.

23. An evaporative cooler in accordance with claim 22, comprising:

control apparatus operable to provide sequenced operation of said water cooler, said pump and said fan.

24. An evaporative cooler in accordance with claim 22, comprising:

control apparatus operable to provide for remote control of said evaporative cooler.

25. A method of operating an evaporative cooler comprising a water reservoir, a pump, a fan, and an evaporative cooling medium, said method comprising:

cooling water in said water reservoir with a refrigerated cooling plate to a temperature below the temperature of ambient air outside said evaporative cooler;

dissipating beat extracted from said water by said refrigerated cooling plate with a heat dissipating structure located outside the evaporative cooler; and

wetting said evaporative cooling medium with the cooled water.

26. A method in accordance with claim 25, comprising:

energizing said fan to generate an air stream flowing through the wetted evaporative cooling medium; and

performing said cooling water step prior to said energizing step.

27. A method in accordance with claim 25, comprising:

pumping water from the reservoir to said evaporative cooling medium to wet said evaporative cooling medium; and

performing said pumping step subsequent to cooling said water.

28. A method in accordance with claim 25, comprising:

controlling operation of said evaporative cooler remotely.

29. Apparatus for controlling an evaporative cooler comprising a water reservoir, a pump, an evaporative cooling medium, a fan for drawing an air steam into engagement with said evaporative cooling medium, and a water cooler for cooling water in said reservoir, said apparatus comprising:

sequence control apparatus, said sequence control apparatus comprising:

a first output to control energizing and de-energizing said fan;

a second output to control energizing and de-energizing said pump; and

a third output to control energizing and de-energizing said water cooler;

said sequence control apparatus operable to control the sequence of operation of said water cooler, said pump and said fan.

30. Apparatus in accordance with claim 29, comprising:

control apparatus coupled to said sequence control apparatus to initiate operational sequences by said sequence control apparatus.

31. Apparatus in accordance with claim 30, wherein:

said control apparatus comprises one or more interfaces to receive commands from remote locations, said commands utilized by said control apparatus to initiate said operational sequences.

32. Apparatus in accordance with claim 31, wherein:

said one or more interfaces provide coupling to one or more of a wide area network, a local area network, a wireless receiver, a telephone connection.

33. A water cooler kit for use with an evaporative cooler comprising a frame holding at least one cooling pad, a water reservoir, at least one conduit for distributing water onto said at least one cooling pad, a fan for moving air through said cooling pad, and a pump for transferring water from said reservoir to said conduit, said water cooler kit comprising:

a refrigerated cooling plate disposed in said evaporative cooler to cool water in said reservoir below the temperature of ambient air outside said evaporative cooler, said refrigerated cooling plate comprising one of a thermoelectric device, an evaporator plate, a cooling plate thermally coupled to a cooling portion of a thermoelectric device, and a cooling plate thermally coupled to an evaporator;

a heat dissipating structure disposed outside of said evaporative cooler; and

a heat transferring thermal conductor between said refrigerated cooling plate and said heat dissipating structure to transfer heat from said refrigerated cooling plate to said heat dissipating structure to extract heat from said reservoir and dissipated outside said evaporative cooler.

34. A water cooler kit in accordance with claim 33, comprising:

said heat dissipating structure comprises one of heat dissipating fins; heat dissipating fins with a fan; a thermoelectric device, a refrigeration condenser, and an evaporator and condenser.

35. A water cooler kit in accordance with claim 34, wherein:

a refrigerated conduit connectable between said water supply and said water reservoir to cool water supplied to said reservoir.

36. A water cooler kit in accordance with claim 35, comprising:

said refrigerated conduit is thermally coupled to one of a thermoelectric device, an evaporator plate, a cooling plate thermally coupled to a cooling portion of a thermoelectric device, and a cooling plate thermally coupled to an evaporator.

37. A water cooler kit in accordance with claim 35, wherein:

said refrigerated conduit comprises a serpentine passage for water to flow to said reservoir.