US20140020870A1 - Heat dissipation module with wind stop function - Google Patents
Heat dissipation module with wind stop function Download PDFInfo
- Publication number
- US20140020870A1 US20140020870A1 US13/553,479 US201213553479A US2014020870A1 US 20140020870 A1 US20140020870 A1 US 20140020870A1 US 201213553479 A US201213553479 A US 201213553479A US 2014020870 A1 US2014020870 A1 US 2014020870A1
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- United States
- Prior art keywords
- heat dissipation
- sidewall
- wind
- stop section
- dissipation module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 84
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/046—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being linear, e.g. corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
Definitions
- the present invention relates to a heat dissipation module. More particularly, the present invention relates to a heat dissipation module equipped with a centrifugal fan.
- a heat dissipation module equipped with a centrifugal fan is used in most notebook computers as their system coolers.
- the heat dissipation module includes a centrifugal fan, a heat pipe and a heat dissipation fin array.
- An first end of the heat pipe is used to connect with a heat source, e.g., a CPU, while a second opposite end of the heat pipe is used to connect with the heat dissipation fin array, thereby transferring heat from the heat source to the heat dissipation fin array.
- the heat dissipation fin array is fastened to an air outlet of the centrifugal fan. When an impeller of the centrifugal fan rotates, airflows carry the heat on the heat dissipation fin array out of the notebook computer.
- the notebook computers are designed to be thin and compact, the dissipation modules inside them are also designed to be thinner.
- the notebook computers are designed to be less than 20 mm in thickness, a gap between the dissipation module and a top cover or between the dissipation module and a bottom cover becomes narrower.
- the centrifugal fan may draw not enough input air from its axial air inlet and perform not very well in the heat dissipation efficiency.
- a heat dissipation module includes a centrifugal fan and a heat dissipation fin array.
- the centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein the radial air outlet is defined between a first sidewall and an opposite second sidewall with a tongue potion.
- the heat dissipation fin array is located at the radial air outlet of the centrifugal fan.
- the heat dissipation fin array and the radial air outlet substantially share an equal length L.
- the heat dissipation fin array has a middle wind stop section which is closer to the second sidewall than the first sidewall.
- the wind stop section has a length ranging from about 0.1 L to about 0.42 L.
- the length of the wind stop section is about 0.26 L.
- the wind stop section begins 0.48 L from the first sidewall and ends 0.74 L from the first sidewall.
- a heat pipe which has a first end connected with the heat dissipation fin array and a second opposite end connected with a heat source.
- the wind stop section is a wind-stop sponge contained within the heat dissipation fin array.
- the wind stop section is a wind-stop tape disposed at a side of the heat dissipation fin array which faces the radial air outlet.
- the wind stop section is a wind-stop tape disposed at a side of the heat dissipation fin array which faces away from the radial air outlet.
- the length of the wind stop section is about 0.1 L.
- the wind stop section begins 0.56 L from the first sidewall and ends 0.66 L from the first sidewall.
- the length of the wind stop section is about 0.42 L.
- the wind stop section begins 0.4 L from the first sidewall and ends 0.82 L from the first sidewall.
- the centrifugal fan comprises an impeller with multiple blades, and each blade has a free end curved forward in a rotation direction of the impeller.
- the heat dissipation module disclosed herein employs its wind-stop section on the heat dissipation fin array to deal with the reverse flow issue at the radial air outlet of the centrifugal fan, thereby resolving the hot spot issue on the heat dissipation module as well as the temperature over-spec. on the bottom cover of the notebook computer.
- FIG. 1 illustrates a perspective view of a heat dissipation module according to a first embodiment of this invention
- FIG. 2 illustrates a top view of the heat dissipation module in FIG. 1 with a wind stop section added and a top cover of the centrifugal fan removed;
- FIG. 3 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a second embodiment of this invention
- FIG. 4 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a third embodiment of this invention
- FIG. 5 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a fourth embodiment of this invention.
- FIG. 6 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a fifth embodiment of this invention.
- FIG. 1 illustrates a perspective view of a heat dissipation module according to a first embodiment of this invention.
- the heat dissipation module 100 illustrated in FIG. 1 is used in most notebook computers as their system cooler.
- the heat dissipation module 100 includes a centrifugal fan 102 , a heat pipe 110 and a heat dissipation fin array 112 .
- the heat dissipation fin array 112 includes multiple dissipation fins which are arranged in parallel with an airflow direction of a radial air outlet 102 a.
- a first end 110 a of the heat pipe 110 is used to connect with a heat source, e.g., a CPU, (not illustrated in the drawings) while a second opposite end 110 b of the heat pipe 110 is used to connect with the heat dissipation fin array 112 , thereby transferring heat from the first end 110 a to the second end 110 b and the heat dissipation fin array 112 .
- the heat dissipation fin array 112 is fastened to a radial air outlet 102 a of the centrifugal fan to 102 .
- a gap between the centrifugal fan 102 and a top cover of a notebook computer or between the centrifugal fan 102 and a bottom cover of the notebook computer becomes narrower.
- the centrifugal fan 102 is equipped an impeller 108 with multiple blades 108 a, and each blade 108 a has a free end 108 b curved forward in a rotation direction 120 of the impeller 108 (also referring to FIG. 2 ).
- a hot spot 113 is detected on the heat dissipation fin array 112 .
- This hot spot 113 results in a temperature over-spec. by about 10 degrees on the bottom cover of the notebook computer.
- FIG. 2 illustrates a top view of the heat dissipation module in FIG. 1 with a wind stop section added and a top cover of the centrifugal fan removed.
- the centrifugal fan 102 is equipped an impeller 108 with multiple blades 108 a, and each blade 108 a has a free end 108 b curved forward in a rotation direction 120 of the impeller 108 .
- a wind stop section 112 a is designed within the heat dissipation fin array 112 .
- the length L of the radial air outlet 102 a is used.
- the heat dissipation fin array 112 and the radial air outlet 102 a substantially share the equal length L.
- the wind stop section 112 a is middle within the heat dissipation fin array 112 and is closer to the second sidewall 102 b than the first sidewall 102 c.
- the wind stop section 112 a is a wind-stop sponge or other wind-stop materials contained within the heat dissipation fin array 112 .
- the wind stop section 112 a is about 0.26 L in length, which begins 0.48 L from the first sidewall 102 c and ends 0.74 L from the first sidewall 102 c.
- FIG. 3 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a second embodiment of this invention.
- FIG. 4 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a third embodiment of this invention. More searches have been conducted on the reverse flow issue for other types of centrifugal fans.
- the wind stop section varies within a range.
- a narrower wind stop section 112 a ′ is a wind-stop sponge or other wind-stop materials contained within the heat dissipation fin array 112 .
- the wind stop section 112 a ′ is about 0.1 L in length, which begins 0.56 L from the first sidewall 102 c and ends 0.66 L from the first sidewall 102 c.
- a wider wind stop section 112 a ′′ is a wind-stop sponge or other wind-stop materials contained within the heat dissipation fin array 112 .
- the wind stop section 112 a ′′ is about 0.42 L in length, which begins 0.4 L from the first sidewall 102 c and ends 0.82 L from the first sidewall 102 c. In sum, the wind stop section may have a length ranging from about 0.1 L to about 0.42 L.
- FIG. 5 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a fourth embodiment of this invention.
- FIG. 6 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a fifth embodiment of this invention.
- the wind-stop section is contained within the heat dissipation fin array 112 .
- the wind stop section 112 b is a wind-stop tape attached to a side of the heat dissipation fin array 112 which faces the radial air outlet 102 a of the centrifugal fan 102 .
- the wind stop section 112 c is a wind-stop tape attached to a side of the heat dissipation fin array which faces away from the radial air outlet 102 a of the centrifugal fan 102 .
- the reverse flow issue can be resolved so as to deal with the hot spot issue on the heat dissipation module as well as the temperature over-spec. on the bottom cover of the notebook computer.
- the heat dissipation module disclosed herein employs its wind-stop section on the heat dissipation fin array to deal with the reverse flow issue at the radial air outlet of the centrifugal fan, thereby resolving the hot spot issue on the heat dissipation module as well as the temperature over-spec. on the bottom cover of the notebook computer.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation module includes a centrifugal fan and a heat dissipation fin array. The centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein the radial air outlet is defined between a first sidewall and an opposite second sidewall with a tongue potion. The heat dissipation fin array is located at the radial air outlet of the centrifugal fan. The heat dissipation fin array and the radial air outlet substantially share an equal length L. The heat dissipation fin array has a middle wind stop section which is closer to the second sidewall than the first sidewall. The wind stop section has a length ranging from about 0.1 L to about 0.42 L.
Description
- 1. Field of Invention
- The present invention relates to a heat dissipation module. More particularly, the present invention relates to a heat dissipation module equipped with a centrifugal fan.
- 2. Description of Related Art
- A heat dissipation module equipped with a centrifugal fan is used in most notebook computers as their system coolers. The heat dissipation module includes a centrifugal fan, a heat pipe and a heat dissipation fin array. An first end of the heat pipe is used to connect with a heat source, e.g., a CPU, while a second opposite end of the heat pipe is used to connect with the heat dissipation fin array, thereby transferring heat from the heat source to the heat dissipation fin array. The heat dissipation fin array is fastened to an air outlet of the centrifugal fan. When an impeller of the centrifugal fan rotates, airflows carry the heat on the heat dissipation fin array out of the notebook computer.
- However, the notebook computers are designed to be thin and compact, the dissipation modules inside them are also designed to be thinner. When the notebook computers are designed to be less than 20 mm in thickness, a gap between the dissipation module and a top cover or between the dissipation module and a bottom cover becomes narrower. Thus, the centrifugal fan may draw not enough input air from its axial air inlet and perform not very well in the heat dissipation efficiency. For the forgoing reasons, there is a need for dealing the heat dissipation efficiency issue due to the thinner notebook computer design.
- It is therefore an objective of the present invention to provide a heat dissipation module with a wind stop function.
- In accordance with the foregoing and other objectives of the present invention, a heat dissipation module includes a centrifugal fan and a heat dissipation fin array. The centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein the radial air outlet is defined between a first sidewall and an opposite second sidewall with a tongue potion. The heat dissipation fin array is located at the radial air outlet of the centrifugal fan. The heat dissipation fin array and the radial air outlet substantially share an equal length L. The heat dissipation fin array has a middle wind stop section which is closer to the second sidewall than the first sidewall. The wind stop section has a length ranging from about 0.1 L to about 0.42 L.
- According to another embodiment disclosed herein, the length of the wind stop section is about 0.26 L.
- According to another embodiment disclosed herein, the wind stop section begins 0.48 L from the first sidewall and ends 0.74 L from the first sidewall.
- According to another embodiment disclosed herein, a heat pipe which has a first end connected with the heat dissipation fin array and a second opposite end connected with a heat source.
- According to another embodiment disclosed herein, the wind stop section is a wind-stop sponge contained within the heat dissipation fin array.
- According to another embodiment disclosed herein, the wind stop section is a wind-stop tape disposed at a side of the heat dissipation fin array which faces the radial air outlet.
- According to another embodiment disclosed herein, the wind stop section is a wind-stop tape disposed at a side of the heat dissipation fin array which faces away from the radial air outlet.
- According to another embodiment disclosed herein, the length of the wind stop section is about 0.1 L.
- According to another embodiment disclosed herein, the wind stop section begins 0.56 L from the first sidewall and ends 0.66 L from the first sidewall.
- According to another embodiment disclosed herein, the length of the wind stop section is about 0.42 L.
- According to another embodiment disclosed herein, the wind stop section begins 0.4 L from the first sidewall and ends 0.82 L from the first sidewall.
- According to another embodiment disclosed herein, the centrifugal fan comprises an impeller with multiple blades, and each blade has a free end curved forward in a rotation direction of the impeller.
- Thus, the heat dissipation module disclosed herein employs its wind-stop section on the heat dissipation fin array to deal with the reverse flow issue at the radial air outlet of the centrifugal fan, thereby resolving the hot spot issue on the heat dissipation module as well as the temperature over-spec. on the bottom cover of the notebook computer.
- It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
-
FIG. 1 illustrates a perspective view of a heat dissipation module according to a first embodiment of this invention; -
FIG. 2 illustrates a top view of the heat dissipation module inFIG. 1 with a wind stop section added and a top cover of the centrifugal fan removed; -
FIG. 3 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a second embodiment of this invention; -
FIG. 4 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a third embodiment of this invention; -
FIG. 5 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a fourth embodiment of this invention; and -
FIG. 6 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a fifth embodiment of this invention. - Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
-
FIG. 1 illustrates a perspective view of a heat dissipation module according to a first embodiment of this invention. Theheat dissipation module 100 illustrated in FIG. 1 is used in most notebook computers as their system cooler. Theheat dissipation module 100 includes acentrifugal fan 102, aheat pipe 110 and a heatdissipation fin array 112. The heatdissipation fin array 112 includes multiple dissipation fins which are arranged in parallel with an airflow direction of aradial air outlet 102 a. Afirst end 110 a of theheat pipe 110 is used to connect with a heat source, e.g., a CPU, (not illustrated in the drawings) while a secondopposite end 110 b of theheat pipe 110 is used to connect with the heatdissipation fin array 112, thereby transferring heat from thefirst end 110 a to thesecond end 110 b and the heatdissipation fin array 112. The heatdissipation fin array 112 is fastened to aradial air outlet 102 a of the centrifugal fan to 102. When animpeller 108 of thecentrifugal fan 102 rotates, airflows are drawn into thecentrifugal fan 102 from anaxial air inlet 102 b and output from theradial air outlet 102 a. Therefore, the heat upon the heatdissipation fin array 112 is carried out of the notebook computer by the airflows. - When a thickness of a notebook computer is less than 20 mm, i.e. a thickness of a present ultrabook computer, a gap between the
centrifugal fan 102 and a top cover of a notebook computer or between thecentrifugal fan 102 and a bottom cover of the notebook computer becomes narrower. Thecentrifugal fan 102 is equipped animpeller 108 withmultiple blades 108 a, and eachblade 108 a has afree end 108 b curved forward in arotation direction 120 of the impeller 108 (also referring toFIG. 2 ). When the notebook computer operates with a high load, e.g., playing a 3-D game or a 100% run CPU, ahot spot 113 is detected on the heatdissipation fin array 112. Thishot spot 113 results in a temperature over-spec. by about 10 degrees on the bottom cover of the notebook computer. - An extensive search has been conducted and the problem source has been found to be a
reverse flow 140 at theradial air outlet 102 a of thecentrifugal fan 102. When the gap between thecentrifugal fan 102 and a top cover of the notebook computer or between thecentrifugal fan 102 and a bottom cover of the notebook computer becomes too narrow, thecentrifugal fan 102 draws less airflows from its (upper or lower)axial air inlet 102 b, thereverse flow 140 occurs at theradial air outlet 102 a of thecentrifugal fan 102. Several solutions below are developed to deal with thereverse flow 140 at theradial air outlet 102 a. -
FIG. 2 illustrates a top view of the heat dissipation module inFIG. 1 with a wind stop section added and a top cover of the centrifugal fan removed. Thecentrifugal fan 102 is equipped animpeller 108 withmultiple blades 108 a, and eachblade 108 a has afree end 108 b curved forward in arotation direction 120 of theimpeller 108. In order to prevent the reverse flow issue at theradial air outlet 102 a, which is defined between afirst sidewall 102 c and an oppositesecond sidewall 102 b with atongue potion 102 d, awind stop section 112 a is designed within the heatdissipation fin array 112. In order to specifically define thewind stop section 112 a, the length L of theradial air outlet 102 a is used. In this embodiment, the heatdissipation fin array 112 and theradial air outlet 102 a substantially share the equal length L. Thewind stop section 112 a is middle within the heatdissipation fin array 112 and is closer to thesecond sidewall 102 b than thefirst sidewall 102 c. In this embodiment, thewind stop section 112 a is a wind-stop sponge or other wind-stop materials contained within the heatdissipation fin array 112. Thewind stop section 112 a is about 0.26 L in length, which begins 0.48 L from thefirst sidewall 102 c and ends 0.74 L from thefirst sidewall 102 c. -
FIG. 3 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a second embodiment of this invention.FIG. 4 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a third embodiment of this invention. More searches have been conducted on the reverse flow issue for other types of centrifugal fans. The wind stop section varies within a range. InFIG. 3 , a narrowerwind stop section 112 a′ is a wind-stop sponge or other wind-stop materials contained within the heatdissipation fin array 112. Thewind stop section 112 a′ is about 0.1 L in length, which begins 0.56 L from thefirst sidewall 102 c and ends 0.66 L from thefirst sidewall 102 c. InFIG. 4 , a widerwind stop section 112 a″ is a wind-stop sponge or other wind-stop materials contained within the heatdissipation fin array 112. Thewind stop section 112 a″ is about 0.42 L in length, which begins 0.4 L from thefirst sidewall 102 c and ends 0.82 L from thefirst sidewall 102 c. In sum, the wind stop section may have a length ranging from about 0.1 L to about 0.42 L. -
FIG. 5 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a fourth embodiment of this invention.FIG. 6 illustrates a top view of a heat dissipation module with a top cover of the centrifugal fan removed according to a fifth embodiment of this invention. In the first, second and third embodiments, the wind-stop section is contained within the heatdissipation fin array 112. In the fourth embodiment ofFIG. 5 , the wind stop section 112 b is a wind-stop tape attached to a side of the heatdissipation fin array 112 which faces theradial air outlet 102 a of thecentrifugal fan 102. In the fifth embodiment ofFIG. 6 , thewind stop section 112 c is a wind-stop tape attached to a side of the heat dissipation fin array which faces away from theradial air outlet 102 a of thecentrifugal fan 102. - With the wind stop section of the heat dissipation fin array, the reverse flow issue can be resolved so as to deal with the hot spot issue on the heat dissipation module as well as the temperature over-spec. on the bottom cover of the notebook computer.
- According to the above-discussed embodiments, the heat dissipation module disclosed herein employs its wind-stop section on the heat dissipation fin array to deal with the reverse flow issue at the radial air outlet of the centrifugal fan, thereby resolving the hot spot issue on the heat dissipation module as well as the temperature over-spec. on the bottom cover of the notebook computer.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (12)
1. A heat dissipation module comprising:
a centrifugal fan comprising at least one axial air inlet and a radial air outlet, wherein the radial air outlet is defined between a first sidewall and an opposite second sidewall with a tongue potion; and
a heat dissipation fin array disposed at the radial air outlet of the centrifugal fan, wherein the heat dissipation fin array and the radial air outlet substantially share an equal length L, the heat dissipation fin array has a middle wind stop section which is closer to the second sidewall than the first sidewall, the wind stop section has a length ranging from about 0.1 L to about 0.42 L.
2. The heat dissipation module of claim 1 , wherein the length of the wind stop section is about 0.26 L.
3. The heat dissipation module of claim 2 , wherein the wind stop section begins 0.48 L from the first sidewall and ends 0.74 L from the first sidewall.
4. The heat dissipation module of claim 1 further comprising a heat pipe which has a first end connected with the heat dissipation fin array and a second opposite end connected with a heat source.
5. The heat dissipation module of claim 1 , wherein the wind stop section is a wind-stop sponge contained within the heat dissipation fin array.
6. The heat dissipation module of claim 1 , wherein the wind stop section is a wind-stop tape disposed at a side of the heat dissipation fin array which faces the radial air outlet.
7. The heat dissipation module of claim 1 , wherein the wind stop section is a wind-stop tape disposed at a side of the heat dissipation fin array which faces away from the radial air outlet.
8. The heat dissipation module of claim 1 , wherein the length of the wind stop section is about 0.1 L.
9. The heat dissipation module of claim 8 , wherein the wind stop section begins 0.56 L from the first sidewall and ends 0.66 L from the first sidewall.
10. The heat dissipation module of claim 1 , wherein the length of the wind stop section is about 0.42 L.
11. The heat dissipation module of claim 10 , wherein the wind stop section begins 0.4 L from the first sidewall and ends 0.82 L from the first sidewall.
12. The heat dissipation module of claim 1 , wherein the centrifugal fan comprises an impeller with multiple blades, and each blade has a free end curved forward in a rotation direction of the impeller.
Priority Applications (1)
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US13/553,479 US20140020870A1 (en) | 2012-07-19 | 2012-07-19 | Heat dissipation module with wind stop function |
Applications Claiming Priority (1)
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US13/553,479 US20140020870A1 (en) | 2012-07-19 | 2012-07-19 | Heat dissipation module with wind stop function |
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US20140020870A1 true US20140020870A1 (en) | 2014-01-23 |
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US13/553,479 Abandoned US20140020870A1 (en) | 2012-07-19 | 2012-07-19 | Heat dissipation module with wind stop function |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023077727A1 (en) * | 2021-11-03 | 2023-05-11 | 广东美的智能科技有限公司 | Motor driver, motor driving system, and pick-and-place machine |
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US4116269A (en) * | 1975-04-28 | 1978-09-26 | Kabushiki Kaisha Komatsu Seisakusho | Engine radiator with means for noise reduction |
US20020108743A1 (en) * | 2000-12-11 | 2002-08-15 | Wirtz Richard A. | Porous media heat sink apparatus |
US6681845B1 (en) * | 2002-10-24 | 2004-01-27 | Chia Ching Yeh | Radiating module |
US20070227711A1 (en) * | 2006-03-28 | 2007-10-04 | Fujitsu Limited | Heat sink |
US20080135210A1 (en) * | 2006-12-08 | 2008-06-12 | Inventec Corporation | Heat dissipation module |
US7589962B1 (en) * | 1997-07-29 | 2009-09-15 | Intel Corporation | Apparatus for cooling a heat dissipating device located within a portable computer |
US20110247789A1 (en) * | 2010-04-07 | 2011-10-13 | Foxconn Technology Co., Ltd. | Heat dissipation device and centrifugal fan thereof |
-
2012
- 2012-07-19 US US13/553,479 patent/US20140020870A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US4116269A (en) * | 1975-04-28 | 1978-09-26 | Kabushiki Kaisha Komatsu Seisakusho | Engine radiator with means for noise reduction |
US7589962B1 (en) * | 1997-07-29 | 2009-09-15 | Intel Corporation | Apparatus for cooling a heat dissipating device located within a portable computer |
US20020108743A1 (en) * | 2000-12-11 | 2002-08-15 | Wirtz Richard A. | Porous media heat sink apparatus |
US6681845B1 (en) * | 2002-10-24 | 2004-01-27 | Chia Ching Yeh | Radiating module |
US20070227711A1 (en) * | 2006-03-28 | 2007-10-04 | Fujitsu Limited | Heat sink |
US20080135210A1 (en) * | 2006-12-08 | 2008-06-12 | Inventec Corporation | Heat dissipation module |
US20110247789A1 (en) * | 2010-04-07 | 2011-10-13 | Foxconn Technology Co., Ltd. | Heat dissipation device and centrifugal fan thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023077727A1 (en) * | 2021-11-03 | 2023-05-11 | 广东美的智能科技有限公司 | Motor driver, motor driving system, and pick-and-place machine |
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Owner name: QUANTA COMPUTER INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, YUN-JENG;LIN, MING-HSIEN;LIN, YU-HSUN;REEL/FRAME:028591/0631 Effective date: 20120719 |
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