US20140001084A1

US20140001084A1 - Packing device for lcd module

Info

Publication number: US20140001084A1
Application number: US13/577,753
Authority: US
Inventors: Zhilin Zhao
Original assignee: Shenzhen China Star Optoelectronics Technology Co Ltd
Current assignee: TCL China Star Optoelectronics Technology Co Ltd
Priority date: 2012-07-02
Filing date: 2012-07-09
Publication date: 2014-01-02

Abstract

The present disclosure relates to the field of packing, and more particularly to a packing device for a liquid crystal display (LCD) module. The packing device includes an outer case and an inner buffer element; the inner buffer element at least includes an upper buffer element and a lower buffer element which are oppositely disposed; the upper buffer element and the lower buffer element are configured with a fixing cavity for fixing the LCD module; the upper buffer element is configured with a connecting structure connected with an adjacent upper buffer element; the lower buffer element is configured with a connecting structure connected with an adjacent lower buffer element. In the present disclosure, the upper buffer element is configured with a connecting structure which is connected with an adjacent upper buffer element; the lower buffer element is configured with a connecting structure which is connected with an adjacent lower buffer element; thus, the upper buffer element and the lower buffer element can be configured with a few fixing cavities, and even one fixing cavity; then, packing number is flexibly adjusted in a joining expanded mode; thus, the mode can be suitable for packing a few samples and packing a large batch of products.

Description

TECHNICAL FIELD

The present disclosure relates to the field of packing, and more particularly to a packing device for a liquid crystal display (LCD) module.

BACKGROUND

Electronic products have characteristics of complexity, high value, and high update speed, etc. Complicated supply relationships exist among manufacturers. For the typical production and marketing modes of the electronic products, the production of parts, and the assembly of finished products and semifinished products are conducted in different places and accomplished by different manufacturers. Thus, the parts, the semi-finished products, etc., of the electronic products have to be transported among the manufacturers. Taking the field of liquid crystal displays (LCDs) as an example, the LCD module, a circuit board, a backlight module, etc., may be required to be transported from manufacturing places to assembly places, resulting in the problems of packing and transportation.
The typical packing mode adopted for the LCD module is that: the LCD module is put into an antistatic bag and then packed into a packing case; the packing case is internally configured with an inner buffer element; the inner buffer element performs the function of buffer protection and is configured with a slot used for fixing the LCD module. For example, the technical scheme of adopting the above-mentioned packing mode is disclosed in Chinese Patent Application No. CN201120387217.4, with filing date of Oct. 12, 2011 and title of a packing body of an LCD panel module; the size of the inner buffer element corresponds to the size of the outer case; to accommodate LCD modules as many as possible for the outer case, the inner buffer element is configured with many slots; thus, the volume of the inner buffer element is also large; when a small amount of samples are required to be transported, the original package is not applicable, casing waste and inflexibility.

SUMMARY

In view of the above-described problems, the aim of the present disclosure is to provide a packing device for a liquid crystal display (LCD) module capable of flexibly changing packing number.
The technical scheme of the present disclosure is that: a packing device for an LCD module comprises an outer case and an inner buffer element; the inner buffer element at least comprises an upper buffer element and a lower buffer element which are oppositely disposed; the upper buffer element and the lower buffer element are separately configured with a fixing cavity for fixing the LCD module; the upper buffer element is configured with a connecting structure which is connected with an adjacent upper buffer element; the lower buffer element is configured with a connecting structure which is connected with an adjacent lower buffer element; the upper buffer element and the lower buffer element are only configured with one fixing cavity; the fixing cavity of the upper buffer element is an open structure, and forms an integral fixing cavity with the adjacent upper buffer element; the fixing cavity of the lower buffer element is an open structure, and forms an integral fixing cavity with the adjacent lower buffer element; the connecting structure on the upper buffer element comprises slots and insert blocks; the slots and the insert blocks are respectively arranged on two side surfaces of the upper buffer element and are respectively used for connecting two upper buffer elements adjacent to the upper buffer element; the connecting structure on the lower buffer element comprises slots and insert blocks; the slots and the insert blocks are respectively arranged on two side surfaces of the lower buffer element and are respectively used for connecting two lower buffer elements adjacent to the lower buffer element; the slots and insert blocks are three in number and triangularly distributed; cross section shapes of the slots and the insert blocks are rectangular; the slots or the insert blocks are configured with chamfers convenient for inserting the insert blocks into the slots.
Another technical scheme of the present disclosure is that: a packing device for an LCD module comprises an outer case and an inner buffer element; the inner buffer element at least comprises an upper buffer element and a lower buffer element which are oppositely disposed; the upper buffer element and the lower buffer element are separately configured with a fixing cavity for fixing the LCD module; the upper buffer element is configured with a connecting structure which is connected with an adjacent upper buffer element; the lower buffer element is configured with a connecting structure which is connected with an adjacent lower buffer element.
In one example, the upper buffer element and the lower buffer element are only configured with one fixing cavity. Thus, only one LCD module can be packed, which is especially suitable for packing samples.
In one example, the fixing cavity of the upper buffer element is an open structure, and forms an integral fixing cavity with the adjacent upper buffer element. The inner buffer element has a simple shape and is convenient for manufacturing; a flat structure is not easy to damage; meanwhile, on the premise of ensuring the original buffer effect, material can be saved; thus, cost is controlled.
In one example, the fixing cavity of the lower buffer element is an open structure, and forms an integral fixing cavity with the adjacent lower buffer element. The inner buffer element has a simple shape and is convenient for manufacturing; a flat structure is not easy to damage; meanwhile, on the premise of ensuring the original buffer effect, material can be saved; thus, cost is controlled.
In one example, the connecting structure on the upper buffer element comprises slots and insert blocks; the slots and the insert blocks are respectively arranged on two side surfaces of the upper buffer element and are respectively used for connecting two upper buffer elements adjacent to the upper buffer element.
In one example, the connecting structure on the lower buffer element comprises slots and insert blocks; the slots and the insert blocks are respectively arranged on two side surfaces of the lower buffer element and are respectively used for connecting two lower buffer elements adjacent to the lower buffer element.
In one example, the slots and insert blocks are three in number and triangularly distributed. Thus, the slots and the insert blocks are connected more stably and reliably, and are not easy to fall off
In one example, cross section shapes of the slots and the insert blocks are circular or rectangular.
In one example, the slots or the insert blocks are configured with chamfers convenient for inserting the insert blocks into the slots.
In one example, each group of inner buffer element comprises two upper buffer elements and two lower buffer elements which are distributed on four corners of the LCD module. Because the inner buffer element is a split structure used for fix the four corners of the LCD module, less material is used by the inner buffer element and the cost is further controlled.
The present disclosure has the advantages that: the inner buffer element of the packing device for the LCD module of the present disclosure at least comprises an upper buffer element and a lower buffer element which are oppositely disposed; the upper buffer element and the lower buffer element are configured with a fixing cavity for fixing the LCD module; the upper buffer element is configured with a connecting structure which is connected with an adjacent upper buffer element; the lower buffer element is configured with a connecting structure which is connected with an adjacent lower buffer element; thus, the upper buffer element and the lower buffer element can be configured with a few fixing cavities, and even one fixing cavity; then, packing number is flexibly adjusted in a joining expanded mode; thus, the mode can be suitable for packing a few samples and packing a large batch of products; the outer case of the present disclosure can be adjusted according to the volume of the inner buffer element.

BRIEF DESCRIPTION OF FIGURES

FIG. 1 is a schematic diagram of a usage state of a packing device of example 1 for an LCD module of the present disclosure;

FIG. 2 is a schematic diagram of a back surface of an upper buffer element of a packing device of example 1 for an LCD module of the present disclosure;

FIG. 3 is a schematic diagram of a usage state of a packing device of example 2 for an LCD module of the present disclosure;

FIG. 4 is a schematic diagram of another usage state of a packing device of example 2 for an LCD module of the present disclosure;

FIG. 5 is a schematic diagram of a front surface of an upper buffer element of the present disclosure;

FIG. 6 is a schematic diagram of a back surface of an upper buffer element of the present disclosure; and

FIG. 7 is an assembly diagram of an upper buffer element and an adjacent upper buffer element of the present disclosure.

Legends: 1. LCD module; 2. upper buffer element; 21. slot; 22. insert block; 23. fixing cavity; 3. lower buffer element.

DETAILED DESCRIPTION

The present disclosure discloses a packing device for a liquid crystal display (LCD) module. As shown in FIG. 1 and FIG. 2, in a first example, the packing device for the LCD module comprises an outer case (not shown in the figure) and an inner buffer element; the inner buffer element at least comprises an upper buffer element 2 and a lower buffer element 3 which are oppositely disposed; the upper buffer element 2 and the lower buffer element 3 are separately configured with a fixing cavity 23 for fixing the LCD module; the upper buffer element 2 is configured with a connecting structure which is connected with an adjacent upper buffer element 2; the lower buffer element 3 is configured with a connecting structure which is connected with an adjacent lower buffer element 3.
The packing device for the LCD module of the present disclosure is packed in a vertical putting mode. The inner buffer element at least comprises the upper buffer element 2 and the lower buffer element 3 which are oppositely disposed. The upper buffer element 2 and the lower buffer element 3 are separately configured with a fixing cavity 23 for fixing the LCD module; the upper buffer element 2 is configured with a connecting structure which is connected with an adjacent upper buffer element 2; the lower buffer element 3 is configured with a connecting structure which is connected with an adjacent lower buffer element 3; thus, the upper buffer element and the lower buffer element can be configured with a few fixing cavities 23, and even one fixing cavity 23; then, packing number is flexibly adjusted in a joining expanded mode; thus, the mode can be suitable for packing a few samples and packing a large batch of products; the outer case of the present disclosure can be adjusted according to the volume of the inner buffer element.
In the example, the upper buffer element 2 and the lower buffer element 3 are only configured with one fixing cavity 23; thus, only one LCD module can be packed, which is especially suitable for packing samples.
In the example, the connecting structure on the upper buffer element 2 comprises slots 21 and insert blocks 22; the connecting structure on the lower buffer element also comprises slots and insert blocks; after the insert blocks are inserted into the slots, the insert blocks and the slots are connected.
In a second example , the packing device for the LCD module of the present disclosure is the exemplary example of the present disclosure. As shown in FIG. 3 to FIG. 7, it is different from the first example that the fixing cavity 23 of the upper buffer element 2 is an open structure, and forms an integral fixing cavity 23 with the adjacent upper buffer element 2; the fixing cavity of the lower buffer element is also an open structure, and forms an integral fixing cavity with the adjacent lower buffer element.
Because the fixing cavity is used for accommodating the LCD module, one or two surfaces are in an open state generally; the open structure of the fixing cavity of the upper buffer element and the lower buffer element means that one or two additional surfaces are also in an open state on the basis that one or two original surfaces are in an open state. In the example, two surfaces in the open state are used for accommodating the LCD module, and one surface is in an open state.
In the example, beneficial effects in the first example can be obtained; additionally, because the inner buffer element has a simple shape, it is convenient for manufacturing; a flat structure is not easy to damage; meanwhile, on the premise of ensuring the original buffer effect, material can be saved; thus, cost is controlled. Moreover, even if the sizes of LCD modules are different, as long as the thicknesses of the LCD modules are close, the same packing device can be adopted, namely that the same packing device can be used for many kinds of LCD modules; thus, the universality of packing materials is improved and storage cost and management cost of the materials are reduced.
In the example, each group of inner buffer element comprises two upper buffer elements 2 and two lower buffer elements 3 which are distributed on four corners of the LCD module 1. Because the inner buffer element is a split structure which fixes the four corners of the LCD module, less material is used by the inner buffer element and the cost is further controlled. In the example, the upper buffer element and the lower buffer element on the diagonal have the same shape and can be shared; thus, only two sets of dies are required to be developed. Furthermore, four buffer elements can also be made into the same shape; only one set of dies are required to be developed; packing can be accomplished by using individual material; thus, manufacturing cost is further reduced.
In the example, the connecting structure on the upper buffer element 2 comprises slots 21 and insert blocks 22; the slots 21 and the insert blocks 22 are respectively arranged on two side surfaces of the upper buffer element 2, respectively used for connecting two upper buffer elements adjacent to the upper buffer element 2, and can be assembled conveniently and quickly.
In the example, the connecting structure on the lower buffer element also comprises slots and insert blocks; the slots and the insert blocks are respectively arranged on two side surfaces of the lower buffer element, respectively used for connecting two lower buffer elements adjacent to the lower buffer element, and can be assembled conveniently and quickly.
In the example, three slots and three insert blocks are triangularly distributed. Thus, the slots and the insert blocks are connected more stably and reliably, and are not easy to fall off. The cross section shapes of the slots and the insert blocks are preferably circular or rectangular; the slots or the insert blocks are configured with chamfers convenient for inserting the insert blocks into the slots.
In the present disclosure, the inner buffer element can be made of foaming material, such as EPP, EPE, or EPS, etc., can also be made of PP, HDPE, ABS, etc., in an injection molding or blow molding mode, and can also be made of lumber and paper products.
The present disclosure is described in detail in accordance with the above contents with the specific exemplary examples. However, this present disclosure is not limited to the specific examples. For the ordinary technical personnel of the technical field of the present disclosure, on the premise of keeping the conception of the present disclosure, the technical personnel can also make simple deductions or replacements, and all of which should be considered to belong to the protection scope of the present disclosure.

Claims

1. A packing device for a liquid crystal display (LCD) module, comprising:

an inner buffer element comprising an upper buffer element and a lower buffer element; and

wherein the upper buffer element and the lower buffer element are oppositely disposed;

wherein the upper buffer element and the lower buffer element comprise a fixing cavity to fix the LCD module;

wherein the upper buffer element comprises a connecting structure, the upper buffer element is connected with an adjacent upper buffer element by the connecting structure, and the lower buffer element comprises a connecting structure, the lower buffer element is connected with an adjacent lower buffer element by the connecting structure;

wherein the upper buffer element and the lower buffer element only comprise one fixing cavity;

the fixing cavity of the upper buffer element is an integral fixing cavity; the fixing cavity of the lower buffer element is an integral fixing cavity;

wherein the connecting structure on the upper buffer element comprises slots and insert blocks;

the slots and the insert blocks are respectively arranged on two side surfaces of the upper buffer element and are respectively used to connect two upper buffer elements adjacent to the upper buffer element; and

wherein the connecting structure on the lower buffer element comprises slots and insert blocks;

the slots and the insert blocks are respectively arranged on two side surfaces of the lower buffer element and are respectively used to connect two lower buffer elements adjacent to the lower buffer element; the slots and the insert blocks are three in number and triangularly distributed; cross section shapes of the slots and the insert blocks are rectangular; and the slots or the insert blocks comprise chamfers convenient for inserting the insert blocks into the slots.

2. A packing device for a liquid crystal display (LCD) module, comprising:

wherein the upper buffer element and the lower buffer element comprise a fixing cavity for fixing the LCD module, the upper buffer element and the lower buffer element only comprise one fixing cavity, the fixing cavity is an integral fixing cavity;

wherein the upper buffer element comprise a connecting structure, the upper buffer element is connected with an adjacent upper buffer element by the connecting structure; and

wherein the lower buffer element comprises a connecting structure, the lower buffer element is connected with an adjacent lower buffer element by the connecting structure.

3-7. (canceled)

8. The packing device for the LCD module of claim 2, wherein the connecting structure on the upper buffer element comprises slots and insert blocks, the slots and the insert blocks are respectively arranged on two side surfaces of the upper buffer element and are respectively used to connect two upper buffer elements adjacent to the upper buffer element.

9. The packing device for the LCD module of claim 2, wherein the connecting structure on the lower buffer element comprises slots and insert blocks; the slots and the insert blocks are respectively arranged on two side surfaces of the lower buffer element and are respectively used to connect two lower buffer elements adjacent to the lower buffer element.

10. The packing device for the LCD module of claim 8, wherein the slots and the insert blocks are three in number and triangularly distributed.

11. The packing device for the LCD module of claim 9, wherein the slots and the insert blocks are three in number and triangularly distributed.

12. The packing device for the LCD module of claim 8, wherein cross section shapes of the slots and the insert blocks are circular or rectangular.

13. The packing device for the LCD module of claim 9, wherein cross section shapes of the slots and the insert blocks are circular or rectangular.

14. The packing device for the LCD module of claim 8, wherein the slots or the insert blocks comprise chamfers convenient for inserting the insert blocks into the slots.

15. The packing device for the LCD module of claim 9, wherein the slots or the insert blocks comprise chamfers convenient for inserting the insert blocks into the slots.

16. The packing device for the LCD module of claim 2, wherein each group of inner buffer element comprises two upper buffer elements and two lower buffer elements distributed on four corners of the LCD module.

17. The packing device for the LCD module of claim 2, wherein each group of inner buffer element comprises two upper buffer elements and two lower buffer elements distributed on four corners of the LCD module.