US20130248144A1 - Fan module - Google Patents
Fan module Download PDFInfo
- Publication number
- US20130248144A1 US20130248144A1 US13/429,936 US201213429936A US2013248144A1 US 20130248144 A1 US20130248144 A1 US 20130248144A1 US 201213429936 A US201213429936 A US 201213429936A US 2013248144 A1 US2013248144 A1 US 2013248144A1
- Authority
- US
- United States
- Prior art keywords
- heat
- air
- fan module
- fan
- radiation unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A fan module includes a heat transfer unit, a heat radiation unit, and at least one cross-flow fan. The heat radiation unit has an air-in side and an air-out side. The cross-flow fan is located against the heat radiation unit, and includes a frame and a centrifugal fan blade assembly. The frame has an air outlet, a plurality of air inlets, and a plurality of frame sections. The frame sections respectively have a receiving recess therein, and the receiving recesses are communicable with one another to together define a receiving space for receiving the centrifugal fan blade assembly therein. With the above arrangements, the cross-flow fan can create increased air flow volume, the space occupied by the fan module can be reduced, and upgraded heat dissipation performance can be achieved.
Description
- The present invention relates to a fan module, and more particularly to a fan module that allows at least one cross-flow fan to create largely increased air flow volume, has reduced overall volume, provides upgraded heat dissipation performance, and effectively overcomes the problems of vibration and noise caused by excessively long blades as found in the conventional fan module.
- Due to the constant progress in the electronic technological fields, the density of transistors on various kinds of chips, such as the central processing unit and other executing elements, also increases to enable faster data processing speed. However, more power is consumed and more heat is produced by these chips during high-speed operation thereof. For the central processing unit to work stably, it has become an important issue as how to develop a high-efficient heat dissipation means for dissipating the produced heat.
- To maintain high-efficient heat dissipating function, it is inevitable to keep increasing the volume and accordingly the weight of the heat dissipation means. However, in the design of currently very popular notebook computers, tablet computers, smart mobile phones, smart hand-held electronic devices and the like, the limited internal space thereof is always a bottleneck to the heat dissipation means design.
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FIG. 1 shows aconventional fan module 1, which includes acentrifugal fan 10, aheat pipe 11, and aheat radiation unit 12. Theconventional fan module 1 uses thecentrifugal fan 10 to produce flowing air, which carries away heat absorbed by theheat radiation unit 12 to thereby achieve the purpose of lowering temperature. The performance of thefan module 1 is determined by the air pressure and air flow volume produced by thecentrifugal fan 10 as well as the area of theheat radiation unit 12 available for heat exchange. When theheat radiation unit 12 has larger heat exchange area by having longer radiation fins, better heat removal effect can be achieved. However, the long radiating fins tend to increase the overall volume of the fan module, and a big fan module just fails to meet the demands for compact, slim and light weight notebook computers and the like. - To meet the demands for compact, slim, and light weight electronic devices, all related elements of the electronic devices are minimized in dimensions. That is, the centrifugal fan in the fan module must also be miniaturized. However, the air flow volume that can be produced by the volume-reduced centrifugal fan is also reduced to largely adversely affect the heat removal effect thereof. Further, the miniaturized centrifugal fan usually has thin but large-area fan blades, which tend to produce more vibration and noise when the centrifugal fan operates.
- As a result, it has become a target of many related manufacturers to effectively upgrade the performance of the heat radiation unit without increasing the volume thereof.
- In brief, the conventional fan module has the following disadvantages: (1) having a relatively big volume; (2) providing low heat dissipation ability; and (3) tending to produce vibration and noise during operation thereof.
- It is therefore tried by the inventor to develop an improved fan module to overcome the drawbacks in the conventional fan module.
- A primary object of the present invention is to effectively solve the above-mentioned problems by providing a fan module having at least one cross-flow fan, so that the fan module can have reduced volume while the cross-flow fan can create largely increased air flow volume.
- Another object of the present invention is to provide a fan module that provides upgraded heat dissipation performance and effectively overcomes the problems of vibration and noise caused by swaying of excessively long blades.
- To achieve the above and other objects, the fan module according to the present invention includes a heat transfer unit, a heat radiation unit, and at least one cross-flow fan. The heat transfer unit has an end attached to a heat source. The heat radiation unit is connected to another opposite end of the heat transfer unit and has an air-in side and an air-out side communicable with the air-in side. The cross-flow fan is located against the heat radiation unit, and includes a frame and a centrifugal fan blade assembly. The frame has an air outlet facing toward the air-in side of the heat radiation unit, a plurality of air inlets, and a plurality of frame sections. The air inlets are respectively arranged between two adjacent frame sections and communicate with the air outlet. The frame sections are respectively configured as a receiving recess, and the receiving recesses are communicable with one another to together define a receiving space. The receiving space communicates with the air outlet and the air inlets, and is used to receive the centrifugal fan blade assembly therein.
- The fan module with the above design can be used in a limited space, and the cross-flow fan thereof not only creates largely increased air flow volume, but also enables effectively reduced volume of the fan module. Further, the problems of vibration and noise caused by the swaying long blades as found in the conventional fan module can also be effectively improved.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
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FIG. 1 is an assembled perspective view of a conventional fan module; -
FIG. 2A is an exploded perspective view of a fan module according to a first embodiment of the present invention; -
FIG. 2B is an assembled view ofFIG. 2A ; -
FIG. 3A is an exploded perspective view of a fan module according to a second embodiment of the present invention; -
FIG. 3B is an assembled view ofFIG. 3A ; and -
FIG. 4 is an exploded perspective view of a fan module according to a third embodiment of the present invention. - The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
- Please refer to
FIGS. 2A and 2B , which are exploded and assembled perspective views, respectively, of afan module 2 according to a first embodiment of the present invention. As shown, thefan module 2 in the first embodiment includes aheat transfer unit 20, aheat radiation unit 21, and at least onecross-flow fan 22. - The
heat transfer unit 20 includes a heat-absorbingsection 201 and a heat-dissipating section 202. The heat-absorbingsection 201 is attached to aheat source 24, such as a central processing unit, south bridge and north bridge chipsets, a graphics chip, or an executing unit. The heat-absorbingsection 201 absorbs heat produced by theheat source 24 and the absorbed heat is transferred to the heat-dissipatingsection 202. Theheat transfer unit 20 can be a heat pipe, a heat spreader, or any element capable of transferring heat. In the illustrated first embodiment, theheat transfer unit 20 is configured as a heat pipe but is not necessarily limited thereto. - The
heat radiation unit 21 is connected to the heat-dissipating section 202 of theheat transfer unit 20, and has an air-inside 213 and an air-outside 214 communicating with the air-inside 213. Theheat radiation unit 21 can be a radiating fin assembly, a heat sink, or any element capable of radiating heat. In the illustrated first embodiment, theheat radiation unit 21 is configured as a radiating fin assembly but is not necessarily limited thereto. In the first embodiment, theheat radiation unit 21 includes a plurality of radiatingfins 211, and any two adjacent radiatingfins 211 together define an air-guidingpassage 212 between them. All the air-guidingpassages 212 communicate with both of the air-inside 213 and the air-outside 214. - The
cross-flow fan 22 is located against theheat radiation unit 21, and includes aframe 221 and a centrifugalfan blade assembly 222. Theframe 221 has anair outlet 2212 facing toward the air-inside 213 of theheat radiation unit 21, a plurality ofair inlets 2211, and a plurality offrame sections 2213. Theair inlets 2211 are respectively arranged between twoadjacent frame sections 2213 and communicate with theair outlet 2212. Theframe sections 2213 are respectively configured as areceiving recess 2213 a, and the receivingrecesses 2213 a are communicable with one another to together define a receivingspace 2214. The receivingspace 2214 communicates with theair outlet 2212 and theair inlets 2211, and is used to receive the centrifugalfan blade assembly 222 therein. - The centrifugal
fan blade assembly 222 includes ashaft 2221 and a plurality ofimpellers 2223. The impellers respectively include a plurality ofblades 2223 a circumferentially spaced on theshaft 2221, and are separately received in the receivingrecesses 2213 a of theframe sections 2213. Theframe 221 further includes afirst end plate 2215 and asecond end plate 2216 that are separately located at two opposite ends of theframe 221. The first and thesecond end plate shaft hole 2217 provided thereon. Theshaft 2221 is sequentially extended through theimpellers 2223 with two opposite ends of theshaft 2221 extending into the two shaft holes 2217. - The
cross-flow fan 22 further includes amotor 23, which is arranged to one side of thefirst end plate 2215 or thesecond end plate 2216 and is connected to the centrifugalfan blade assembly 222 for driving the latter to rotate. When themotor 23 of thecross-flow fan 22 drives the centrifugalfan blade assembly 222 to rotate, air outside theframe 221 is guided into the receivingrecesses 2213 a via theair inlets 2211 to flow through thefan impellers 2223 before being blown out of theframe 221 via theair outlet 2212 and forced into theheat radiation unit 21 via the air-inside 213 thereof. The air forced into theheat radiation unit 21 flows through the air-guidingpassages 212 between the radiatingfins 211 toward the air-outside 214. The heat transferred from the heat-dissipatingsection 202 to the radiatingfins 211 will be carried away by the air to dissipate into external environment via the air-outside 214, so as to provide enhanced heat dissipation performance and achieve good heat dissipation effect. - With the design of the present invention, the centrifugal
fan blade assembly 222 and theshaft 2221 can still extend transversely in a limited mounting space, so that thecross-flow fan 22 not only creates largely increased air flow volume and accordingly upgraded heat dissipation performance, but also effectively enables reduced volume of thefan module 2. Further, the present invention also overcomes the problems of vibration and noise caused by the swaying long blades in the conventional fan module designed for increasing heat dissipation performance. -
FIGS. 3A and 3B are exploded and assembled perspective views, respectively, of a fan module according to a second embodiment of the present invention. As shown, the fan module in the second embodiment is generally structurally similar to the first embodiment, except that, in the second embodiment, thecross-flow fan 22 further includes at least oneside plate 2218, which is arranged at theair outlet 2212 of theframe 221 against the air-inside 213 of theheat radiation unit 21. When themotor 23 of thecross-flow fan 22 drives the centrifugalfan blade assembly 222 to rotate, air outside theframe 221 is guided into the receivingrecesses 2213 a via theair inlets 2211 to flow through thefan impellers 2223 before being blown out of theframe 221 and forced into theheat radiation unit 21 via the air-inside 213 thereof. The air forced into theheat radiation unit 21 flows through the air-guidingpassages 212 between the radiatingfins 211 toward the air-outside 214. Meanwhile, heat will be carried away from the radiatingfins 211 by the air to the air-outside 214 and be dissipated into external environment, so as to provide enhanced heat dissipation performance and achieve good heat dissipation effect. - Please refer to
FIG. 4 that is an assembled perspective view of a fan module according to a third embodiment of the present invention. As shown, the fan module in the third embodiment is generally structurally similar to the previous embodiments, except that, in the third embodiment, two or morecross-flow fans 22 are parallelly arranged side by side. With this arrangement, the heat can also be carried away from the radiatingfins 211 by air flows to the air-outside 214 of theheat radiation unit 21 and be dissipated into external environment to achieve the purpose of heat dissipation. In the illustrated third embodiment, twocross-flow fans 22 are shown. However, it is understood the number of thecross-flow fans 22 is not necessarily limited to two. - According to the above description, the fan module of the present invention is superior to the conventional one because it has largely reduced overall volume, eliminates the occurrence of vibration and noise during operation, and provides enhanced heat dissipation performance.
- The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims (10)
1. A fan module, comprising:
a heat transfer unit having an end attached to a heat source;
a heat radiation unit being connected to another opposite end of the heat transfer unit and having an air-in side and an air-out side communicable with the air-in side; and
at least one cross-flow fan being located against the heat radiation unit, and including a frame and a centrifugal fan blade assembly; the frame having an air outlet facing toward the air-in side of the heat radiation unit, a plurality of air inlets, and a plurality of frame sections; the air inlets being respectively arranged between two adjacent frame sections and communicating with the air outlet; the frame sections respectively having a receiving recess therein, and the receiving recesses being communicable with one another to together define a receiving space; and the receiving space communicating with the air outlet and the air inlets and being used to receive the centrifugal fan blade assembly therein.
2. The fan module as claimed in claim 1 , wherein the frame further includes a first end plate and a second end plate that are separately located at two opposite ends
3. The fan module as claimed in claim 2 , wherein the centrifugal fan blade assembly includes a shaft and a plurality of impellers; and the shaft being sequentially extended through the impellers with two opposite ends of the shaft extending into the two shaft holes.
4. The fan module as claimed in claim 3 , wherein the impellers respectively include a plurality of blades, and the blades on each of the impellers being circumferentially spaced on the shaft and received in a corresponding one of receiving recesses of the frame sections.
5. The fan module as claimed in claim 1 , wherein the heat transfer unit further includes a heat-absorbing section and a heat-dissipating section; the heat-absorbing section being attached to the heat source; and the heat radiation unit being connected to the heat-dissipating section.
6. The fan module as claimed in claim 1 , wherein the cross-flow fan further includes at least one side plate, which is arranged at the air outlet of the frame.
7. The fan module as claimed in claim 1 , wherein the heat radiation unit is selected from the group consisting of a radiating fin assembly, a heat sink, and any element capable of radiating heat.
8. The fan module as claimed in claim 1 , wherein the heat transfer unit is selected from the group consisting of a heat pipe, a heat spreader, and any element capable of transferring heat.
9. The fan module as claimed in claim 7 , wherein the heat radiation unit includes a plurality of radiating fins; any two adjacent ones of the radiating fins together defining an air-guiding passage between them; and the air-guiding passages communicating with both of the air-in side and the air-out side.
10. The fan module as claimed in claim 2 , wherein the cross-flow fan further includes a motor, which can be arranged to one side of the first end plate or the second end plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/429,936 US20130248144A1 (en) | 2012-03-26 | 2012-03-26 | Fan module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/429,936 US20130248144A1 (en) | 2012-03-26 | 2012-03-26 | Fan module |
Publications (1)
Publication Number | Publication Date |
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US20130248144A1 true US20130248144A1 (en) | 2013-09-26 |
Family
ID=49210685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/429,936 Abandoned US20130248144A1 (en) | 2012-03-26 | 2012-03-26 | Fan module |
Country Status (1)
Country | Link |
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US (1) | US20130248144A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2001834A (en) * | 1930-05-31 | 1935-05-21 | Clifford C Carson | Vertical unit heater |
US5573059A (en) * | 1994-02-21 | 1996-11-12 | Kabushiki Kaisha Toshiba | Air conditioning machine |
US6047765A (en) * | 1996-08-20 | 2000-04-11 | Zhan; Xiao | Cross flow cooling device for semiconductor components |
US6903928B2 (en) * | 2002-06-13 | 2005-06-07 | Rotys Inc. | Integrated crossflow cooler for electronic components |
-
2012
- 2012-03-26 US US13/429,936 patent/US20130248144A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2001834A (en) * | 1930-05-31 | 1935-05-21 | Clifford C Carson | Vertical unit heater |
US5573059A (en) * | 1994-02-21 | 1996-11-12 | Kabushiki Kaisha Toshiba | Air conditioning machine |
US6047765A (en) * | 1996-08-20 | 2000-04-11 | Zhan; Xiao | Cross flow cooling device for semiconductor components |
US6903928B2 (en) * | 2002-06-13 | 2005-06-07 | Rotys Inc. | Integrated crossflow cooler for electronic components |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHANG, BOR-HAW;CHANG, LIANG-JI;SIGNING DATES FROM 20120312 TO 20120313;REEL/FRAME:027927/0257 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |