US20130236662A1 - High Performance Organic, Inorganic Or Hybrid Seals - Google Patents
High Performance Organic, Inorganic Or Hybrid Seals Download PDFInfo
- Publication number
- US20130236662A1 US20130236662A1 US13/795,116 US201313795116A US2013236662A1 US 20130236662 A1 US20130236662 A1 US 20130236662A1 US 201313795116 A US201313795116 A US 201313795116A US 2013236662 A1 US2013236662 A1 US 2013236662A1
- Authority
- US
- United States
- Prior art keywords
- stainless steel
- glass
- metal
- substrates
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 92
- 239000002184 metal Substances 0.000 claims abstract description 92
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000011521 glass Substances 0.000 claims abstract description 75
- 239000000463 material Substances 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 47
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 39
- 239000000956 alloy Substances 0.000 claims abstract description 39
- 239000000843 powder Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 229910001220 stainless steel Inorganic materials 0.000 claims description 66
- 239000010935 stainless steel Substances 0.000 claims description 66
- 238000010438 heat treatment Methods 0.000 claims description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- -1 eglass Substances 0.000 claims description 12
- 239000003566 sealing material Substances 0.000 claims description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 239000011368 organic material Substances 0.000 claims description 9
- 229920003023 plastic Polymers 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 9
- 239000004984 smart glass Substances 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010954 inorganic particle Substances 0.000 claims description 7
- 239000010445 mica Substances 0.000 claims description 7
- 229910052618 mica group Inorganic materials 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 6
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 claims description 6
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000002241 glass-ceramic Substances 0.000 claims description 5
- 230000006698 induction Effects 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 239000002274 desiccant Substances 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002808 molecular sieve Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 4
- 238000010345 tape casting Methods 0.000 claims description 4
- 239000010457 zeolite Substances 0.000 claims description 4
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 claims description 3
- 239000010963 304 stainless steel Substances 0.000 claims description 3
- 229910000619 316 stainless steel Inorganic materials 0.000 claims description 3
- 229910000984 420 stainless steel Inorganic materials 0.000 claims description 3
- 239000010965 430 stainless steel Substances 0.000 claims description 3
- 229910000825 440 stainless steel Inorganic materials 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910001374 Invar Inorganic materials 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910003271 Ni-Fe Inorganic materials 0.000 claims description 3
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 3
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229920006397 acrylic thermoplastic Polymers 0.000 claims description 3
- 239000005354 aluminosilicate glass Substances 0.000 claims description 3
- FRHBOQMZUOWXQL-UHFFFAOYSA-L ammonium ferric citrate Chemical compound [NH4+].[Fe+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FRHBOQMZUOWXQL-UHFFFAOYSA-L 0.000 claims description 3
- 239000001110 calcium chloride Substances 0.000 claims description 3
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229960004642 ferric ammonium citrate Drugs 0.000 claims description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 3
- 229910001026 inconel Inorganic materials 0.000 claims description 3
- 229910001055 inconels 600 Inorganic materials 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 229920000592 inorganic polymer Polymers 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004313 iron ammonium citrate Substances 0.000 claims description 3
- 235000000011 iron ammonium citrate Nutrition 0.000 claims description 3
- 229910000833 kovar Inorganic materials 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 229910001629 magnesium chloride Inorganic materials 0.000 claims description 3
- PALNZFJYSCMLBK-UHFFFAOYSA-K magnesium;potassium;trichloride;hexahydrate Chemical compound O.O.O.O.O.O.[Mg+2].[Cl-].[Cl-].[Cl-].[K+] PALNZFJYSCMLBK-UHFFFAOYSA-K 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 239000002159 nanocrystal Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 3
- 229910000160 potassium phosphate Inorganic materials 0.000 claims description 3
- 235000011009 potassium phosphates Nutrition 0.000 claims description 3
- 239000002096 quantum dot Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 239000005341 toughened glass Substances 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 239000011592 zinc chloride Substances 0.000 claims description 3
- 235000005074 zinc chloride Nutrition 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 244000043261 Hevea brasiliensis Species 0.000 claims description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000007977 PBT buffer Substances 0.000 claims description 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 229920002873 Polyethylenimine Polymers 0.000 claims description 2
- 229920000491 Polyphenylsulfone Polymers 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 239000005385 borate glass Substances 0.000 claims description 2
- 239000005388 borosilicate glass Substances 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 238000004132 cross linking Methods 0.000 claims description 2
- 239000004703 cross-linked polyethylene Substances 0.000 claims description 2
- 238000003618 dip coating Methods 0.000 claims description 2
- 238000004924 electrostatic deposition Methods 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 229920002313 fluoropolymer Polymers 0.000 claims description 2
- 239000004811 fluoropolymer Substances 0.000 claims description 2
- 229920001903 high density polyethylene Polymers 0.000 claims description 2
- 239000004700 high-density polyethylene Substances 0.000 claims description 2
- 229920000554 ionomer Polymers 0.000 claims description 2
- 229920001684 low density polyethylene Polymers 0.000 claims description 2
- 239000004702 low-density polyethylene Substances 0.000 claims description 2
- 229920003052 natural elastomer Polymers 0.000 claims description 2
- 229920001194 natural rubber Polymers 0.000 claims description 2
- 229920001778 nylon Polymers 0.000 claims description 2
- 239000005365 phosphate glass Substances 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920006393 polyether sulfone Polymers 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000005033 polyvinylidene chloride Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 2
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 claims description 2
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 claims description 2
- 241001136239 Cymbidium hybrid cultivar Species 0.000 claims 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical group [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- 239000005345 chemically strengthened glass Substances 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000006133 sodium aluminosilicate glass Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 12
- 238000007789 sealing Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000005358 alkali aluminosilicate glass Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000012812 sealant material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 241000282575 Gorilla Species 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000005352 borofloat Substances 0.000 description 1
- 239000011153 ceramic matrix composite Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004952 furnace firing Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920013657 polymer matrix composite Polymers 0.000 description 1
- 239000011160 polymer matrix composite Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/08—Joining glass to glass by processes other than fusing with the aid of intervening metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Definitions
- the invention describes a new method for creating hybrid edge seals using metal, alloy, powder coated metal and other conductive surfaces in between two substrates. These inventions describe different materials, seal designs, and geometries of hybrid seals based on polymeric powder coatings and glass powder coatings on conductive surfaces.
- Laser sealing is a widely investigated selective sealing process, among various selective heating processes such as laser sealing, induction heating, microwave heating, broadband IR (Infrared) lamp heating, and focused IR heating. Even in all these selective heating methods unwanted heating of substrates does occur.
- Conventional frit-based laser sealing processed involve absorption of an Infra-Red (IR) laser light by an absorber such as pigment or colored frit in the seal system. Accordingly, the IR absorption (i.e., heating) occurs at the top interface—the interface between a substrate and the seal material. Owing to the thickness and mass of material to be heated, the amount of heat supplied must be relatively high.
- Conventional laser sealing processes involve absorption of IR radiation by an appropriate pigment or colored frit in the sealant material.
- Deposited seals are typically about 60% or less of their theoretical density before melting/sintering. Therefore, significant dimensional changes are to be expected during laser processing (or any related localized energy deposition process) to form the seal.
- the process can be time consuming because such a large mass of material must be heated, which can be problematic.
- conventional frit based laser sealing material includes an organic binder which can provide contamination within a cavity formed by the sealed substrates from combustion of the binder upon heating.
- the resulting seal may also have large voids and bubbles that could reduce the strength of the seal. Since most of the heat is generated at the substrate/seal material interface, it is more likely that the seal material and the substrate plate may crack. Similar problems arise in other selective sealing processes where IR, visible or UV lights are used for sealing.
- glass to glass sealing In many of the practically useful applications of glass to glass sealing, such as encapsulation of solar cells (crystalline silicon as well as thin film based cadmium telluride (CdTe), copper indium gallium selenides (CIGS), polymeric, or flexible), OLED packaging, displays, touch screens and Vacuum Insulated Glass (VIG) window sealing, and architectural or automotive window sealing, there exists a need to use tempered glasses in many instances. Glasses lose their temper when heated above about 350° C. in conventional furnace firing of sealing glass materials. Therefore, there exists a need to selectively heat the seal material alone and to effect the bonding to the base glasses/substrates without significantly heating the base glasses/substrates. Similarly there exists a need to selectively heat the seal material alone and to effect the bonding to the base glasses/or glass to metal seals without significantly heating the base glasses.
- tempered glasses Glasses lose their temper when heated above about 350° C. in conventional furnace firing of sealing glass materials. Therefore, there exists a need to selectively heat the seal material
- the following is contemplated: (1) hybrid edge seal using powder coating (polymeric and glass based) on metals and other conductive surfaces, (2) localized curing of the powder coatings using a conduction mechanism, and (3) minimizing moisture and oxygen ingress by using metal/alloy spacer as bulk of the edge seal.
- An embodiment of the invention is a method of locally heating a sealing material to produce a hermetic seal, comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material, (c) contacting the seal material to the at least two substrates and at least partially surrounding the metal object, and (d) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates, whereby a seal between the substrates results.
- An embodiment of the invention is a device including a seal, the device formed by a method of locally heating a sealing material comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material between the two substrates and at least partially surrounding the metal object, and (c) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates.
- FIG. 1 is an exploded view of the components used in a sealed object of the invention.
- FIG. 2 is an exploded view of the components used in a sealed object of the invention.
- FIG. 3 depicts an embodiment of the invention including two glass plates with a metal sheet sealed there between.
- FIG. 4 depicts an embodiment of the invention having a metal wire sealed between two glass plates.
- the present invention provides materials, seal designs, geometries and process steps for making hermetic seals, and simplifying the manufacture of hermetic seals which are used to protect active layers of electronic devices such as solar cells, LEDs, OLEDs, plasma display panels and the like.
- a variety of substrates including those made of glass, metal, ceramic, or plastics, as well as those constituting active devices may be sealed together by this invention to create a hermetic seal in devices such as display devices (flat panel screens, LED screens, LCD screens, plasma display panels), organic light emitting diodes (OLEDs), solar cells and solar cell panels, and even windows for both architectural and automotive applications.
- the substrates may be coated with a coating such as conductive coated glass, indium tin oxide, aluminum doped zinc oxide, sputtered metals, antireflective coatings, SiN X coatings, Si 3 N 4 coatings, conductive polymer coatings on glass, and combinations thereof.
- An embodiment of the invention is a method of locally heating a sealing material to produce a seal, comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material, (c) contacting the seal material to the at least two substrates and at least partially surrounding the metal object, and (d) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates, whereby a seal between the substrates results.
- An embodiment of the invention is a device including a seal, the device formed by a method of locally heating a sealing material comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material between the two substrates and at least partially surrounding the metal object, and (c) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates.
- This invention describes a durable powder coating technique (with metal as a spacer) to use as a barrier coating material to (a) increase moisture resistance of an edge seal, (b) engineer glass-resin and metal-resin interface to obtain films with excellent barrier properties, (c) formulate edge seals with excellent moisture resistance to enhance the useful life of solar and other active devices, (d) selectively heat metal/glass interfaces through conduction of heat from thermal or induction heating of metal far away from the glass; (this will reduce manufacturing time and cost) as well as (e) significantly reduce curing time using thermal conduction through metallic surface in module manufacturing to reduce module costs.
- the advantages of this approach include (a) use of polymer chemistries besides EVA with excellent UV and outdoor stability by use of a variety of powder coatings both polymeric and glass based, (b) use of metal/alloy spacer to reduce moisture and oxygen ingress, (c) use of proven deposition methods like electrostatic deposition or wet deposition, (d) faster and localized curing by simple use of conduction mechanism, (e) suitability of time-temperature curing cycles for PV module manufacturing at 150° C. for 1-10 minutes, (f) potential to formulate back side film with desired reflective by using powder coated metal.
- the seals may be hermetic, with a hermeticity as measured by helium leak rate of less than 10 ⁇ 5 atm*cc*sec ⁇ 1 , preferably less than 10 ⁇ 7 atm*cc*sec ⁇ 1 , more preferably less than 10 ⁇ 8 atm*cc*sec ⁇ 1 .
- the substrates can be, broadly speaking, glass, ceramic, glass-ceramic, metal, or polymeric. They are independently selected. Composite substrates are also suitable, for example polymer matrix composites, polymer glass composites, metal matrix composites, or ceramic matrix composites.
- the substrates may be any of metal, glass, glass-ceramics, very low expansion glass ceramics, ceramics, window glass, low expansion borosilicate glass Borofloat® 33 glass, aluminosilicate glass, surface strengthened alkali aluminosilicate glass ion exchanged alkali aluminosilicate glass (such as Corning Gorilla® Glass), tempered glass, surface strengthened metal coated glass e.g. silver layer for charging to powder coat, conductive substrates, conductive oxides, indium tin oxide, fluorinated tin oxide, transparent conductive oxides, coated substrates and conductive polymers.
- the substrates may have a coating.
- Exemplary coated substrates include metal coated glass, wherein at least one metal is selected from the group consisting of silver, copper, tin, and aluminum is applied to a glass plate in a pattern selected from the group consisting of full covering, partial covering, and conductive traces.
- Yet another embodiment of this invention involves at least one glass plate being tempered.
- Yet another embodiment of this invention is where at least one glass plate is a prelaminated glass assembly.
- Yet another embodiment of this invention includes at least one glass plate being coated with conductive coatings such as transparent conductive oxide (TCO) using indium-tin oxide (ITO) material.
- conductive coatings such as transparent conductive oxide (TCO) using indium-tin oxide (ITO) material.
- the seal material can be organic, inorganic, a hybrid of organic and inorganic, or glasses having a melting point less than 500° C.
- in/organic will be used to mean “organic and/or inorganic.”
- the hybrid sealant system could have inorganic materials ratio in the range of 5-95 vol % based on the volume of organic material, preferably 10-90 vol % more preferably 20-80 vol % even more preferably 30-60 vol % organic material and 40-70 vol % inorganic material.
- the organic seal material can be any organic material that is solid at or near room temperature most broadly thermoplastics and thermosets.
- the organic seal material is applied by electrostatic coating to the metal object.
- the organic seal material is applied by electrostatic application, powder coating, spray coating, dip coating doctor blading, stenciling, or ink jet printing on at least one of the metal object and the substrates. A mask may be used.
- Suitable organic materials include thermoplastics, thermosets, ionomers, HDPE, LDPE, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polytetrafluoroethylene, acrylics, PMMA, silicones, polyesters, epoxies, epoxypolyesters, polyurethanes, halogenated plastics, condensation plastics, polyaddition plastics, cross-linking plastics, fluoropolymers, PTFE, polyamides, polycarbonates, nylons, natural rubber, styrene-butadiene rubber, PVB, PI, SRP, TPI, PAI, HTS, PFSA, PEEK, PPSU, PEI, PESU, PSU, LCP, PARA, HPN, PPS, PPA, PC, PPC, COC, ABS, PVC Alloys, PEX, PVDC, PBT, ET, POM, glycidyl methacrylate (GMA), or trigly
- Polyesters such as powder coatings sold by AkzoNobel under the Interpon® trademark are suitable.
- any of the following Interpon® branded products are suitable: AkzoNobel 158C121, AkzoNobel 4JC01QF, AkzoNobel 4LC01QF, AkzoNobel 4LC07QF, AkzoNobel 8A200Q, AkzoNobel 8A201Q, AkzoNobel 8A2174, AkzoNobel 8A226A, AkzoNobel 8D200Q, AkzoNobel 8D 201Q, AkzoNobel 8D202Q; AkzoNobel 8D203Q, AkzoNobel 8J200Q, AkzoNobel 8J201Q, AkzoNobel 8J202Q, AkzoNobel 8J203Q, AkzoNobel 8K200Q, AkzoNobel 8K201Q, AkzoNobel 8K202Q, AkzoNobel 8K203Q, AkzoNobel 8K204K, Ak
- PVB polyvinyl butyral
- Butvar® trademark available from Solutia, St. Louis, Mo.
- Liquid Nails® available from Akzo Nobel, Strongsville, Ohio.
- inorganic materials usually particulate, are suitable in the seal.
- inorganic materials usually particulate, are suitable in the seal.
- mica sheets or flakes
- index matched glass powders glass chemistry is not critical, however Na—B—Si and B—Si glass are preferred
- hygroscopic inorganic additives such as zeolites, molecular sieves and other desiccant materials
- metal powders or flakes up to 5 microns.
- Metalized PET/Mylar with metals such as aluminum are also suitable.
- a variety of metals can be used, for example aluminum, copper, nickel, iron, stainless steel, 102 stainless steel, 201 stainless steel, 202 stainless steel, 300 series stainless steel, 302 stainless steel, 304 stainless steel, 308 stainless steel, 309 stainless steel, 316 stainless steel, 321 stainless steel, 405 stainless steel, 408 stainless steel, 409 stainless steel, 410 stainless steel, 416 stainless steel, 420 stainless steel, 430 stainless steel, 439 stainless steel, 440 stainless steel, 446 stainless steel, 501 stainless steel, 502 stainless steel, 630 stainless steel, 2205 stainless steel, 2304 stainless steel, 2507 stainless steel, Ni—Fe alloys, Ni—Cr alloys, chromium, molybdenum, tungsten, Invar, Kovar, Alloy 36, and Alloy 42, Alloy 42-6, Alloy 48, Alloy 49, Alloy 52, Alloy 600, Alloy 625, Inconel, Alloy 718, Nickel 200, Nickel 201, Nickel 205, Nickel 233
- the inorganic seal material may be a plurality of inorganic particles coated with any organic material disclosed herein.
- the inorganic particles may be any of metal, glass, metal oxides, silica, quartz, cements, inorganic polymers, mica sheets, mica flakes, glass powders, Na—B—Si glass, B—Si glass, hygroscopic inorganic additives, zeolites, molecular sieves, desiccant materials, calcium chloride, calcium sulfate, magnesium chloride, zinc chloride, potassium carbonate, potassium phosphate, carnallite, ferric ammonium citrate, potassium hydroxide, and sodium hydroxide, metal powders up to 5 microns, metal flakes up to 5 microns.
- the inorganic particle sizes (D 50 ) can range from 0.1 to 2000 microns, and possibly 5-1000 microns, 10-500 microns, 20-400 microns, 25-250 microns, 30-200 microns, or 0.5-80 microns, alternately 1-100 microns, 5-90 microns and 10-80 microns.
- the longest dimension is typically defined to be length.
- Aspect ratio is defined herein as length to thickness (longest to shortest dimension of a flake).
- the desired aspect ratio is greater than five, preferably greater than 10, more preferably greater than 20, still more preferably greater than 50, even more preferably greater than 100, and alternatively, 2-50, 2-100, 5-100 and 10-20.
- the particles can have shapes such as high sphericity, low sphericity, irregular, equant, ellipsoidal, tabular, cylindrical, flake, whisker and wire geometries.
- Suitable seal glasses include those having a melting point less than 600° C., preferably less than 550° C., more preferably less than 500° C., selected from the group consisting of vanadate glasses, lead glasses, tin glasses, phosphate glasses, borate glasses, bismuth glasses, telluride glasses, thallate glasses and Sn—Zn—P glasses.
- the hybrid organic-inorganic composite can be applied as either a paste or a tape using standard deposition/application procedures or as a preform such as gasket seal. That is a preform of the seal can be made separately out of this hybrid organic-inorganic matrix composite. Subsequently the preform can be placed in place between the surfaces to be sealed to make the seals.
- the glass flake loaded curable organic material can be applied to at least one substrate by a procedure selected from the group consisting of tape casting, doctor blading, layer by layer application, screen printing, spraying, ink jet printing and combinations thereof.
- the metal object can be a sheet, plate, foil, wire or metal item having another shape.
- the metal object is used for conducting heat to the seal material in order to heat it and melt/flow the organic portion.
- the metal object may be aluminum, copper, nickel, iron, stainless steel, 102 stainless steel, 201 stainless steel, 202 stainless steel, 300 series stainless steel, 302 stainless steel, 304 stainless steel, 308 stainless steel, 309 stainless steel, 316 stainless steel, 321 stainless steel, 405 stainless steel, 408 stainless steel, 409 stainless steel, 410 stainless steel, 416 stainless steel, 420 stainless steel, 430 stainless steel, 439 stainless steel, 440 stainless steel, 446 stainless steel, 501 stainless steel, 502 stainless steel, 2205 stainless steel, 2304 stainless steel, 2507 stainless steel, 630 stainless steel, Ni—Fe alloys, Ni—Cr alloys, chromium, molybdenum, tungsten, Invar, Kovar, Alloy 36, and Alloy 42, Alloy 42-6, Alloy 48, All
- An active layer is an electric or electronic device that is protected by the substrates and the seals of the invention. Suitable active layers include vacuum insulated glass, solar cell contact, solar cell, solar cell module, organic PV device, plasma display device, nanocrystal display, electrochromic device, electrochromic material system, sensors, suspended particle device, micro-blind, liquid crystal device, smart window, switchable window, smart glass, eglass, quantum dot devices, thermolelectric devices, batteries, LED, SED, FED, OLED, LCD, DLP, FLD, IMOD, TDEL, QDLED, TMOS, TPD, LCL, LPD, OLET, and combinations thereof.
- An embodiment of the invention is a method of forming a seal between two substrates.
- the method may result in a device including a seal, the device formed by a method of locally heating a sealing material comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material between the two substrates and at least partially surrounding the metal object, and (c) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates.
- the device may be any active layer disclosed herein.
- assembly 100 includes substrates 110 and 120 , which are used with metal frame 130 .
- Metal frame 130 is coated with powder coating layers 140 and 150 .
- Metal frame 130 matches the dimensions of substrates 110 and 120 .
- Metal frame 130 includes a cut out space 135 .
- Layers 110 , 140 , 130 , 150 , and 120 are pressed together and metal frame 130 is heated in order to flow powder coating layers 140 and 150 to effect adhesion and seal between metal frame 130 and substrates 110 and 120 .
- a cavity inside the now sealed substrates 110 and 120 with metal frame 130 now results and may house an active layer.
- assembly 200 includes substrates 210 and 220 , which are used with metal frame 230 .
- Metal frame 230 is coated with powder coating layers 240 and 250 .
- Metal frame 230 is larger than dimension of substrates 210 and 220 , yet includes cutout 235 .
- Powder coating layers 240 and 240 are sized to match the dimensions of substrates 210 and 220 , accounting for cutout 235 .
- Layers 210 , 240 , 230 , 250 , and 220 are pressed together and metal frame 230 is heated in order to flow powder coating layers 240 and 250 to effect adhesion and create a seal between metal frame 230 and substrates 210 and 220 .
- a cavity inside the now sealed substrates 210 and 220 with metal frame 230 now results and may house an active layer.
- the portions of metal frame 230 that extend beyond substrates 210 and 220 may or may not be removed later.
- FIG. 3 is a depiction of the end result of the process depicted in FIG. 1 where 310 and 320 are the two substrates and 330 is the seal of the invention.
- FIG. 4 is an alternate embodiment where instead of a metal plate, a wire 430 is used to effect heating between substrates 410 and 420 .
- the portion of the wire extending beyond the cover of the substrates may be later removed.
- Preheating may be used to locally heat a portion of the sealant material prior to the main heating.
- sealing materials can be applied to the same substrate (top or bottom) and selectively sealed to the other plate with or without preheating the firing the sealing materials.
- Preheating may be undertaken with a laser or induction heating.
- Preheating may be undertaken to a temperature of, for example, 175-225° C. Details on induction heating may be found in PCT patent application PCT/US2012/054709, which is hereby incorporated by reference.
- a stated range of “1 to 10” should be considered to include any and all subranges between (and inclusive of) the minimum value of 1 and the maximum value of 10; that is, all subranges beginning with a minimum value of 1 or more and ending with a maximum value of 10 or less, e.g., 1.0 to 2.7, 3.3 to 8.9, 5.7 to 10, or individual values like 3.14159, 5.17, 8.07 or 9.58 for example.
- ranges are used as shorthand for describing each and every value that is within the range. Any value within the range can be selected as a terminus of a subrange within the range.
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Abstract
Description
- 1. Field of Invention
- The invention describes a new method for creating hybrid edge seals using metal, alloy, powder coated metal and other conductive surfaces in between two substrates. These inventions describe different materials, seal designs, and geometries of hybrid seals based on polymeric powder coatings and glass powder coatings on conductive surfaces.
- 2. Description of Related Art
- Many conventional heating methods suffer the problem of overheating substrates in the effort to heat and flow a seal material. Further much energy is wasted due to unwanted heating of the entire mass of substrates. Therefore, selective sealing methods wherein the seal material alone is heated are attractive from energy saving point of view.
- Laser sealing is a widely investigated selective sealing process, among various selective heating processes such as laser sealing, induction heating, microwave heating, broadband IR (Infrared) lamp heating, and focused IR heating. Even in all these selective heating methods unwanted heating of substrates does occur. Conventional frit-based laser sealing processed involve absorption of an Infra-Red (IR) laser light by an absorber such as pigment or colored frit in the seal system. Accordingly, the IR absorption (i.e., heating) occurs at the top interface—the interface between a substrate and the seal material. Owing to the thickness and mass of material to be heated, the amount of heat supplied must be relatively high. Conventional laser sealing processes involve absorption of IR radiation by an appropriate pigment or colored frit in the sealant material. Deposited seals are typically about 60% or less of their theoretical density before melting/sintering. Therefore, significant dimensional changes are to be expected during laser processing (or any related localized energy deposition process) to form the seal. The process can be time consuming because such a large mass of material must be heated, which can be problematic. For example, conventional frit based laser sealing material includes an organic binder which can provide contamination within a cavity formed by the sealed substrates from combustion of the binder upon heating. The resulting seal may also have large voids and bubbles that could reduce the strength of the seal. Since most of the heat is generated at the substrate/seal material interface, it is more likely that the seal material and the substrate plate may crack. Similar problems arise in other selective sealing processes where IR, visible or UV lights are used for sealing.
- In many of the practically useful applications of glass to glass sealing, such as encapsulation of solar cells (crystalline silicon as well as thin film based cadmium telluride (CdTe), copper indium gallium selenides (CIGS), polymeric, or flexible), OLED packaging, displays, touch screens and Vacuum Insulated Glass (VIG) window sealing, and architectural or automotive window sealing, there exists a need to use tempered glasses in many instances. Glasses lose their temper when heated above about 350° C. in conventional furnace firing of sealing glass materials. Therefore, there exists a need to selectively heat the seal material alone and to effect the bonding to the base glasses/substrates without significantly heating the base glasses/substrates. Similarly there exists a need to selectively heat the seal material alone and to effect the bonding to the base glasses/or glass to metal seals without significantly heating the base glasses.
- Accordingly improvements are sought in selective sealing processes.
- There is an urgent need for moisture barrier films and edge seals for thin film, crystalline silicon solar cell modules, optoelectronic devices (e.g., LEDs, OLEDS), displays (such as plasma display panel (PDP) and Microdisplays), and vacuum insulated glass windows (VIG) and assemblies. The lifespan of solar devices could be increased by protecting it from moisture and oxygen ingress which in turn will reduce the levelized cost of energy (LCOE). Similarly the service life of VIG windows in providing insulation of thermal conduction can be extended if the seals are effectively impervious to moisture and gas.
- In this invention the following is contemplated: (1) hybrid edge seal using powder coating (polymeric and glass based) on metals and other conductive surfaces, (2) localized curing of the powder coatings using a conduction mechanism, and (3) minimizing moisture and oxygen ingress by using metal/alloy spacer as bulk of the edge seal.
- An embodiment of the invention is a method of locally heating a sealing material to produce a hermetic seal, comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material, (c) contacting the seal material to the at least two substrates and at least partially surrounding the metal object, and (d) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates, whereby a seal between the substrates results.
- An embodiment of the invention is a device including a seal, the device formed by a method of locally heating a sealing material comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material between the two substrates and at least partially surrounding the metal object, and (c) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates.
-
FIG. 1 is an exploded view of the components used in a sealed object of the invention. -
FIG. 2 is an exploded view of the components used in a sealed object of the invention. -
FIG. 3 depicts an embodiment of the invention including two glass plates with a metal sheet sealed there between. -
FIG. 4 depicts an embodiment of the invention having a metal wire sealed between two glass plates. - The present invention provides materials, seal designs, geometries and process steps for making hermetic seals, and simplifying the manufacture of hermetic seals which are used to protect active layers of electronic devices such as solar cells, LEDs, OLEDs, plasma display panels and the like.
- A variety of substrates including those made of glass, metal, ceramic, or plastics, as well as those constituting active devices may be sealed together by this invention to create a hermetic seal in devices such as display devices (flat panel screens, LED screens, LCD screens, plasma display panels), organic light emitting diodes (OLEDs), solar cells and solar cell panels, and even windows for both architectural and automotive applications. The substrates may be coated with a coating such as conductive coated glass, indium tin oxide, aluminum doped zinc oxide, sputtered metals, antireflective coatings, SiNX coatings, Si3N4 coatings, conductive polymer coatings on glass, and combinations thereof.
- An embodiment of the invention is a method of locally heating a sealing material to produce a seal, comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material, (c) contacting the seal material to the at least two substrates and at least partially surrounding the metal object, and (d) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates, whereby a seal between the substrates results.
- An embodiment of the invention is a device including a seal, the device formed by a method of locally heating a sealing material comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material between the two substrates and at least partially surrounding the metal object, and (c) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates.
- This invention describes a durable powder coating technique (with metal as a spacer) to use as a barrier coating material to (a) increase moisture resistance of an edge seal, (b) engineer glass-resin and metal-resin interface to obtain films with excellent barrier properties, (c) formulate edge seals with excellent moisture resistance to enhance the useful life of solar and other active devices, (d) selectively heat metal/glass interfaces through conduction of heat from thermal or induction heating of metal far away from the glass; (this will reduce manufacturing time and cost) as well as (e) significantly reduce curing time using thermal conduction through metallic surface in module manufacturing to reduce module costs.
- The advantages of this approach include (a) use of polymer chemistries besides EVA with excellent UV and outdoor stability by use of a variety of powder coatings both polymeric and glass based, (b) use of metal/alloy spacer to reduce moisture and oxygen ingress, (c) use of proven deposition methods like electrostatic deposition or wet deposition, (d) faster and localized curing by simple use of conduction mechanism, (e) suitability of time-temperature curing cycles for PV module manufacturing at 150° C. for 1-10 minutes, (f) potential to formulate back side film with desired reflective by using powder coated metal.
- The seals may be hermetic, with a hermeticity as measured by helium leak rate of less than 10−5 atm*cc*sec−1, preferably less than 10−7 atm*cc*sec−1, more preferably less than 10−8 atm*cc*sec−1.
- The major components of the invention are set forth hereinbelow.
- Substrate.
- The substrates can be, broadly speaking, glass, ceramic, glass-ceramic, metal, or polymeric. They are independently selected. Composite substrates are also suitable, for example polymer matrix composites, polymer glass composites, metal matrix composites, or ceramic matrix composites. In particular the substrates may be any of metal, glass, glass-ceramics, very low expansion glass ceramics, ceramics, window glass, low expansion borosilicate glass Borofloat® 33 glass, aluminosilicate glass, surface strengthened alkali aluminosilicate glass ion exchanged alkali aluminosilicate glass (such as Corning Gorilla® Glass), tempered glass, surface strengthened metal coated glass e.g. silver layer for charging to powder coat, conductive substrates, conductive oxides, indium tin oxide, fluorinated tin oxide, transparent conductive oxides, coated substrates and conductive polymers.
- The substrates may have a coating. Exemplary coated substrates include metal coated glass, wherein at least one metal is selected from the group consisting of silver, copper, tin, and aluminum is applied to a glass plate in a pattern selected from the group consisting of full covering, partial covering, and conductive traces.
- Yet another embodiment of this invention involves at least one glass plate being tempered.
- Yet another embodiment of this invention is where at least one glass plate is a prelaminated glass assembly.
- Yet another embodiment of this invention includes at least one glass plate being coated with conductive coatings such as transparent conductive oxide (TCO) using indium-tin oxide (ITO) material.
- Seal.
- The seal material can be organic, inorganic, a hybrid of organic and inorganic, or glasses having a melting point less than 500° C. In some instances the abbreviation “in/organic” will be used to mean “organic and/or inorganic.”
- The hybrid sealant system could have inorganic materials ratio in the range of 5-95 vol % based on the volume of organic material, preferably 10-90 vol % more preferably 20-80 vol % even more preferably 30-60 vol % organic material and 40-70 vol % inorganic material.
- Organic Seal Material.
- The organic seal material can be any organic material that is solid at or near room temperature most broadly thermoplastics and thermosets. In a preferred embodiment, the organic seal material is applied by electrostatic coating to the metal object. In another preferred embodiment, the organic seal material is applied by electrostatic application, powder coating, spray coating, dip coating doctor blading, stenciling, or ink jet printing on at least one of the metal object and the substrates. A mask may be used.
- Suitable organic materials include thermoplastics, thermosets, ionomers, HDPE, LDPE, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polytetrafluoroethylene, acrylics, PMMA, silicones, polyesters, epoxies, epoxypolyesters, polyurethanes, halogenated plastics, condensation plastics, polyaddition plastics, cross-linking plastics, fluoropolymers, PTFE, polyamides, polycarbonates, nylons, natural rubber, styrene-butadiene rubber, PVB, PI, SRP, TPI, PAI, HTS, PFSA, PEEK, PPSU, PEI, PESU, PSU, LCP, PARA, HPN, PPS, PPA, PC, PPC, COC, ABS, PVC Alloys, PEX, PVDC, PBT, ET, POM, glycidyl methacrylate (GMA), or triglycidyl isocyanurate (TGIC). GMA acrylics are preferred.
- Polyesters such as powder coatings sold by AkzoNobel under the Interpon® trademark are suitable. For example any of the following Interpon® branded products are suitable: AkzoNobel 158C121, AkzoNobel 4JC01QF, AkzoNobel 4LC01QF, AkzoNobel 4LC07QF, AkzoNobel 8A200Q, AkzoNobel 8A201Q, AkzoNobel 8A2174, AkzoNobel 8A226A, AkzoNobel 8D200Q, AkzoNobel 8D 201Q, AkzoNobel 8D202Q; AkzoNobel 8D203Q, AkzoNobel 8J200Q, AkzoNobel 8J201Q, AkzoNobel 8J202Q, AkzoNobel 8J203Q, AkzoNobel 8K200Q, AkzoNobel 8K201Q, AkzoNobel 8K202Q, AkzoNobel 8K203Q, AkzoNobel 8K204K, AkzoNobel 8L200Q and other coatings sold under the Interpon name, and combinations thereof.
- Other suitable organic materials, either as the organic matrix into which the inorganic particles are mixed, or as the functional coatings on the inorganic particles, include polyvinyl butyral (PVB) such those sold under the Butvar® trademark, available from Solutia, St. Louis, Mo., or Liquid Nails®, available from Akzo Nobel, Strongsville, Ohio.
- Inorganic Seal Materials.
- A variety of inorganic materials, usually particulate, are suitable in the seal. For example, (a) mica (sheets or flakes), (b) index matched glass powders (glass chemistry is not critical, however Na—B—Si and B—Si glass are preferred) and (c) hygroscopic inorganic additives such as zeolites, molecular sieves and other desiccant materials, (d) metal powders or flakes (up to 5 microns). Metalized PET/Mylar with metals such as aluminum are also suitable.
- A variety of metals can be used, for example aluminum, copper, nickel, iron, stainless steel, 102 stainless steel, 201 stainless steel, 202 stainless steel, 300 series stainless steel, 302 stainless steel, 304 stainless steel, 308 stainless steel, 309 stainless steel, 316 stainless steel, 321 stainless steel, 405 stainless steel, 408 stainless steel, 409 stainless steel, 410 stainless steel, 416 stainless steel, 420 stainless steel, 430 stainless steel, 439 stainless steel, 440 stainless steel, 446 stainless steel, 501 stainless steel, 502 stainless steel, 630 stainless steel, 2205 stainless steel, 2304 stainless steel, 2507 stainless steel, Ni—Fe alloys, Ni—Cr alloys, chromium, molybdenum, tungsten, Invar, Kovar, Alloy 36, and Alloy 42, Alloy 42-6, Alloy 48, Alloy 49, Alloy 52, Alloy 600, Alloy 625, Inconel, Alloy 718, Nickel 200, Nickel 201, Nickel 205, Nickel 233, Nickel 270, aluminum alloys such as AL1050, AL1060, AL1100, AL3003, AL6063, AL5052, AL514, AL6061, AL384, AL2024, Tin, any of the foregoing coated in a polymer, any of the foregoing coated in any organic material disclosed elsewhere herein, and solders or alloys of any two or more of the foregoing.
- The inorganic seal material may be a plurality of inorganic particles coated with any organic material disclosed herein. For example, the inorganic particles may be any of metal, glass, metal oxides, silica, quartz, cements, inorganic polymers, mica sheets, mica flakes, glass powders, Na—B—Si glass, B—Si glass, hygroscopic inorganic additives, zeolites, molecular sieves, desiccant materials, calcium chloride, calcium sulfate, magnesium chloride, zinc chloride, potassium carbonate, potassium phosphate, carnallite, ferric ammonium citrate, potassium hydroxide, and sodium hydroxide, metal powders up to 5 microns, metal flakes up to 5 microns.
- In general the inorganic particle sizes (D50) can range from 0.1 to 2000 microns, and possibly 5-1000 microns, 10-500 microns, 20-400 microns, 25-250 microns, 30-200 microns, or 0.5-80 microns, alternately 1-100 microns, 5-90 microns and 10-80 microns. The longest dimension is typically defined to be length. Aspect ratio is defined herein as length to thickness (longest to shortest dimension of a flake). The desired aspect ratio is greater than five, preferably greater than 10, more preferably greater than 20, still more preferably greater than 50, even more preferably greater than 100, and alternatively, 2-50, 2-100, 5-100 and 10-20. The particles can have shapes such as high sphericity, low sphericity, irregular, equant, ellipsoidal, tabular, cylindrical, flake, whisker and wire geometries.
- Seal Glasses:
- Suitable seal glasses include those having a melting point less than 600° C., preferably less than 550° C., more preferably less than 500° C., selected from the group consisting of vanadate glasses, lead glasses, tin glasses, phosphate glasses, borate glasses, bismuth glasses, telluride glasses, thallate glasses and Sn—Zn—P glasses.
- The hybrid organic-inorganic composite can be applied as either a paste or a tape using standard deposition/application procedures or as a preform such as gasket seal. That is a preform of the seal can be made separately out of this hybrid organic-inorganic matrix composite. Subsequently the preform can be placed in place between the surfaces to be sealed to make the seals. The glass flake loaded curable organic material can be applied to at least one substrate by a procedure selected from the group consisting of tape casting, doctor blading, layer by layer application, screen printing, spraying, ink jet printing and combinations thereof.
- Metal object. The metal object can be a sheet, plate, foil, wire or metal item having another shape. The metal object is used for conducting heat to the seal material in order to heat it and melt/flow the organic portion. The metal object may be aluminum, copper, nickel, iron, stainless steel, 102 stainless steel, 201 stainless steel, 202 stainless steel, 300 series stainless steel, 302 stainless steel, 304 stainless steel, 308 stainless steel, 309 stainless steel, 316 stainless steel, 321 stainless steel, 405 stainless steel, 408 stainless steel, 409 stainless steel, 410 stainless steel, 416 stainless steel, 420 stainless steel, 430 stainless steel, 439 stainless steel, 440 stainless steel, 446 stainless steel, 501 stainless steel, 502 stainless steel, 2205 stainless steel, 2304 stainless steel, 2507 stainless steel, 630 stainless steel, Ni—Fe alloys, Ni—Cr alloys, chromium, molybdenum, tungsten, Invar, Kovar, Alloy 36, and Alloy 42, Alloy 42-6, Alloy 48, Alloy 49, Alloy 52, Alloy 600, Alloy 625, Inconel, Alloy 718,
Nickel 200, Nickel 201, Nickel 205, Nickel 233, Nickel 270, aluminum alloys such as AL1050, AL1060, AL1100, AL3003, AL6063, AL5052, AL514, AL6061, AL384, AL2024, Tin, and alloys of any two or more of the foregoing. - Active Layer. An active layer is an electric or electronic device that is protected by the substrates and the seals of the invention. Suitable active layers include vacuum insulated glass, solar cell contact, solar cell, solar cell module, organic PV device, plasma display device, nanocrystal display, electrochromic device, electrochromic material system, sensors, suspended particle device, micro-blind, liquid crystal device, smart window, switchable window, smart glass, eglass, quantum dot devices, thermolelectric devices, batteries, LED, SED, FED, OLED, LCD, DLP, FLD, IMOD, TDEL, QDLED, TMOS, TPD, LCL, LPD, OLET, and combinations thereof.
- Method.
- An embodiment of the invention is a method of forming a seal between two substrates. The method may result in a device including a seal, the device formed by a method of locally heating a sealing material comprising: (a) providing a metal object between at least two substrates; (b) providing a seal material between the two substrates and at least partially surrounding the metal object, and (c) heating the metal object to heat the seal material to a temperature of at least 125° C., wherein the substrate temperature remains at least 20° C. below the temperature attained in the seal, to flow the seal material between the substrates. The device may be any active layer disclosed herein.
- In one embodiment, in
FIG. 1 ,assembly 100 includessubstrates metal frame 130.Metal frame 130 is coated with powder coating layers 140 and 150.Metal frame 130 matches the dimensions ofsubstrates Metal frame 130 includes a cut outspace 135.Layers metal frame 130 is heated in order to flow powder coating layers 140 and 150 to effect adhesion and seal betweenmetal frame 130 andsubstrates substrates metal frame 130 now results and may house an active layer. - In another embodiment, in
FIG. 2 ,assembly 200 includessubstrates metal frame 230.Metal frame 230 is coated with powder coating layers 240 and 250.Metal frame 230 is larger than dimension ofsubstrates cutout 235. Powder coating layers 240 and 240 are sized to match the dimensions ofsubstrates cutout 235.Layers metal frame 230 is heated in order to flow powder coating layers 240 and 250 to effect adhesion and create a seal betweenmetal frame 230 andsubstrates substrates metal frame 230 that extend beyondsubstrates -
FIG. 3 is a depiction of the end result of the process depicted inFIG. 1 where 310 and 320 are the two substrates and 330 is the seal of the invention. -
FIG. 4 is an alternate embodiment where instead of a metal plate, awire 430 is used to effect heating betweensubstrates - Preheating may be used to locally heat a portion of the sealant material prior to the main heating. Similarly it is envisioned that sealing materials can be applied to the same substrate (top or bottom) and selectively sealed to the other plate with or without preheating the firing the sealing materials. Preheating may be undertaken with a laser or induction heating. Preheating may be undertaken to a temperature of, for example, 175-225° C. Details on induction heating may be found in PCT patent application PCT/US2012/054709, which is hereby incorporated by reference.
- Details about aspects of the invention can be found in one or more of the following United States patent applications, all of which are incorporated herein by reference: Ser. Nos. 10/864,304; 10/988,208; 11/131,919; 11/145,538; 11/384,838; 11/774,632; 11/846,552; 12/097,823; 12/298,956; 12/573,209; 61/324,356; 61/328,258; 61/366,568; and 61/366,578.
- The term “comprising” provides support for “consisting essentially of” and “consisting of:” It is envisioned that an individual numerical value for a parameter, temperature, weight, percentage, etc., disclosed herein in any form, such as presented in a table, provides support for the use of such value as the endpoint of a range. A range may be bounded by two such values. In a single embodiment, more than one glass composition can be used, and compositions comprising amounts and ranges from different columns among the tables are also envisioned.
- Certain embodiments of the invention are envisioned where at least some percentages, temperatures, times, and ranges of other values are preceded by the modifier “about.” All compositional percentages are by weight and are given for a blend prior to firing. Numerical ranges of oxides or other ingredients that are bounded by zero on the lower end (for example, 0-10 mole % ZnO) are intended to provide support for the concept “up to [the upper limit],” for example “up to 10 mole % ZrO2” as well as a positive recitation that the ingredient in question is present in an amount that does not exceed the upper limit.
- Each numerical range disclosed herein that is bounded by zero, has, as an alternative embodiment, a lower bound of 0.1% instead of zero. All ranges disclosed herein are to be understood to encompass the beginning and ending range values and any and all subranges therein. For example, a stated range of “1 to 10” should be considered to include any and all subranges between (and inclusive of) the minimum value of 1 and the maximum value of 10; that is, all subranges beginning with a minimum value of 1 or more and ending with a maximum value of 10 or less, e.g., 1.0 to 2.7, 3.3 to 8.9, 5.7 to 10, or individual values like 3.14159, 5.17, 8.07 or 9.58 for example. In other words, ranges are used as shorthand for describing each and every value that is within the range. Any value within the range can be selected as a terminus of a subrange within the range.
Claims (24)
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US13/795,116 US20130236662A1 (en) | 2012-03-12 | 2013-03-12 | High Performance Organic, Inorganic Or Hybrid Seals |
US15/904,524 US10800138B2 (en) | 2012-03-12 | 2018-02-26 | High performance organic, inorganic or hybrid seals |
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US13/795,116 US20130236662A1 (en) | 2012-03-12 | 2013-03-12 | High Performance Organic, Inorganic Or Hybrid Seals |
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US15/904,524 Active 2033-06-17 US10800138B2 (en) | 2012-03-12 | 2018-02-26 | High performance organic, inorganic or hybrid seals |
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US20140242306A1 (en) * | 2012-02-27 | 2014-08-28 | Corning Incorporated | LOW Tg GLASS GASKET FOR HERMETIC SEALING APPLICATIONS |
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