US20130118712A1 - Dual coil with adapter to move between redundant and non-redundant high performance heat exchanger - Google Patents

Dual coil with adapter to move between redundant and non-redundant high performance heat exchanger Download PDF

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Publication number
US20130118712A1
US20130118712A1 US13/296,207 US201113296207A US2013118712A1 US 20130118712 A1 US20130118712 A1 US 20130118712A1 US 201113296207 A US201113296207 A US 201113296207A US 2013118712 A1 US2013118712 A1 US 2013118712A1
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Prior art keywords
heat exchange
exchange coil
liquid
coils
coil
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Granted
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US13/296,207
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US9295182B2 (en
Inventor
Madhusudan K. Iyengar
Roger R. Schmidt
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International Business Machines Corp
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International Business Machines Corp
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Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION reassignment INTERNATIONAL BUSINESS MACHINES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IYENGAR, MADHUSUDAN K., SCHMIDT, ROGER R.
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20618—Air circulating in different modes under control of air guidance flaps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/04—Arrangements of conduits common to different heat exchange sections, the conduits having channels for different circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention is directed towards the cooling of server racks with liquid heat exchanging devices, and more particularly to the use of a redundant liquid cooling system for server racks.
  • Data centers have been developed to centralize management of network devices.
  • Data centers often include server racks, which contain multiple servers in one storage unit. Servers in each server rack produce heat that may be carried away from the data center by air flow through the server rack. The heat carried in the air flow may increase the temperature of the data center.
  • a variety of cooling techniques can be implemented to maintain cooler temperatures in the data center.
  • An example embodiment of the present invention is an apparatus for controlling the redundancy of a cooling system for a server rack.
  • the apparatus includes an adapter configured to couple together two heat exchange coils into one heat exchange unit.
  • the heat exchange unit is configured to interface with one liquid cooling circuit.
  • Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit.
  • FIG. 1 Another example embodiment of the present invention is a rear door heat exchanger for controlling the redundancy of a cooling system for a server rack.
  • the rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit.
  • the rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit.
  • the heat exchange unit is configured to interface with one liquid cooling circuit.
  • the system includes a cooling system having at least two liquid cooling circuits.
  • the system also includes a rear door heat exchanger connected to the cooling system.
  • the rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit.
  • the rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit.
  • the heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system.
  • Yet another example embodiment of the invention is a method of controlling the redundancy of a cooling system for a server rack.
  • the method includes coupling by an adapter two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit.
  • the adapter couples the two heat exchange coils such that the two heat exchange coils become one heat exchange unit.
  • the heat exchange unit is configured to interface with one liquid cooling circuit.
  • FIG. 1 shows an example embodiment of an apparatus for controlling the redundancy of a cooling system for a server rack.
  • FIG. 2 shows an example embodiment of a system for cooling air flow through a server rack.
  • FIG. 3 shows an example embodiment of two heat exchange coils positioned side-by-side.
  • FIG. 4 shows an example embodiment of two heat exchange coils intertwined.
  • FIG. 5 shows an example embodiment of a rear door heat exchanger with a cooling failure.
  • FIG. 6 shows an example embodiment of a method of controlling the redundancy of a cooling system for a server rack.
  • embodiments of the present invention include an apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack.
  • FIG. 1 shows an example embodiment of an apparatus 102 for controlling the redundancy of a cooling system for a server rack.
  • the apparatus 102 may include an adapter 104 configured to couple together two heat exchange coils into one heat exchange unit.
  • the adapter 104 is adjustable such that the two heat exchange coils can be uncoupled.
  • the adapter 104 includes quick connect fittings 108 for coupling and uncoupling the adapter 104 to the heat exchange coils.
  • the adapter, heat exchange coils, heat exchange unit, and cooling system are further described below.
  • FIG. 2 shows an example embodiment of a system 202 for cooling air flow through a server rack 204 .
  • the system 202 includes a cooling system 206 having at least two liquid cooling circuits 208 .
  • the cooling system includes a plurality of server racks 204 .
  • the cooling system 206 may include coolant supplied to the plurality of server racks 204 from the liquid cooling circuits 208 .
  • Each liquid cooling circuit may include two coolant lines 210 and 212 .
  • the first coolant line 210 may receive coolant from the plurality of server racks 204 and the second coolant line 212 may supply coolant to the plurality of server racks 204 .
  • each liquid cooling circuit 208 includes a coolant pump 214 .
  • the coolant pump 214 may be enclosed within a coolant distribution unit 216 . Furthermore, each coolant pump 214 may also couple to a chiller supply line 218 from a chiller plant 220 . Further still, each coolant pump 214 may couple to an independent power supply line 222 .
  • the system 202 may include a rear door heat exchanger (RDHx) 224 connected to the cooling system 206 .
  • the rear door heat exchanger 224 includes two heat exchange coils 226 .
  • the rear door heat exchanger 224 may be a dual coil RDHx packaged in a monolithic assembly.
  • at least one of the two heat exchange coils 226 includes a set of horizontal tubes coupled to a set of vertical air cooling fins.
  • Each heat exchange coil 226 may be carried by the server rack 204 and configured to interface with a different liquid cooling circuit 208 .
  • the system 202 includes an adapter 104 configured to couple together the two heat exchange coils 226 into one heat exchange unit 228 .
  • the heat exchange unit 228 may be configured to interface with one liquid cooling circuit 208 from the cooling system 206 .
  • the adapter 104 may be used, for example, if a data center does not require the redundancy offered by a dual coil RDHx or is not equipped with more than one liquid cooling circuit 208 .
  • the adapter 104 may be provided to convert a dual coil RDHx to a non-redundant RDHx.
  • the adapter 104 may also be used if there is a failure along one of the liquid coolant circuits 208 , or if one of the two heat exchange coils 226 fails. In such cases, the redundancy in the system 202 may ensure the server rack's 204 exhaust air will continue to be cooled.
  • the adapter 104 is described in further detail above.
  • one of the two heat exchange coils 226 b is positioned after the other heat exchange coil 226 a in a direction 230 from a front 232 of the server rack to a rear 234 of the server rack.
  • FIG. 3 shows an example embodiment of two heat exchange coils 226 .
  • the two heat exchange coils 226 may be positioned side-by-side in a plane perpendicular to a direction (into the page as shown from the perspective of FIG. 3 ) from a front door of the server rack to a rear door of the server rack.
  • the two exchange coils 226 each may be substantially half of a width of the server rack.
  • each of the two heat exchange coils 226 includes a liquid intake port 302 to receive liquid into the heat exchange coil 226 and a liquid exit port 304 to send liquid out of the heat exchange coil 226 .
  • the adapter 104 may be configured to couple together the liquid intake port 302 of one heat exchange coil 226 a and the liquid intake port 302 of the other heat exchange coil 226 b, the liquid exit port 304 of one heat exchange coil 226 a and the liquid exit port 304 of the other heat exchange coil 226 b, or the liquid exit port 304 of one of the two heat exchange coils 226 a and the liquid intake port 302 of the other heat exchange coil 226 b.
  • the liquid intake port 302 and liquid exit port 304 both include quick connect fittings.
  • the adapter 104 may also include quick connect fittings to interface with the liquid intake port 302 and liquid exit port 304 .
  • at least one of the two heat exchange coils includes a set of horizontal tubes 306 coupled to a set of vertical air cooling fins 308 .
  • the two heat exchange coils 226 may be proximate an air filter 310 configured to force cabinet exhaust air through vertical air cooling fins 308 .
  • the air filter 310 can therefore be used to prevent exhaust air from bypassing the two heat exchange coils 226 .
  • the air filter 310 may be constructed from, for example, plastic, foam material, and/or sheet metal.
  • FIG. 4 shows another example embodiment of two heat exchange coils 226 .
  • at least one of the two heat exchange coils 226 includes a set of horizontal tubes 306 coupled to a set of vertical air cooling fins 308 .
  • the two heat exchange coils 226 may be proximate an air filter 310 as described above.
  • the two heat exchange coils 226 may be intertwined with each other by staggering one heat exchange coil 226 a with the other heat exchange coil 226 b.
  • FIG. 5 shows an example embodiment of a rear door heat exchanger 224 with a cooling failure.
  • the rear door heat exchanger 224 includes an isolation device 502 configured to thermally isolate one heat exchange coil 226 b from the other heat exchange coil 226 a.
  • the rear door heat exchanger 224 includes an air flow diversion device 504 configured to divert an air flow through the server rack away from the one heat exchange coil 226 b towards the other heat exchange coil 226 a.
  • the air flow diversion device 504 is a set of louvers. The louvers may be in a closed position, as shown covering heat exchange coil 226 b , or in an open position, as shown partially in front of heat exchange coil 226 a.
  • the closed louvers may act as an air barrier, diverting exhaust air from the malfunctioning heat exchange coil 226 b with the cooling failure to the functioning heat exchange coil 226 a.
  • the isolation device 502 and air flow diversion device 504 are embodied in a solid flap configured to block and isolate one heat exchange coil and force the flow of all of the exhaust air through the other heat exchange coil.
  • At least one of the two heat exchange coils 226 may include a set of horizontal tubes 306 coupled to a set of vertical air cooling fins. Additionally, it is noted that the two heat exchange coils 226 may be proximate an air filter.
  • FIG. 6 shows an example embodiment of a method 602 of controlling the redundancy of a cooling system for a server rack.
  • the method 602 may include a coil positioning step 604 .
  • the coil positioning step 604 includes positioning one of two heat exchange coils after the other heat exchange coil in a direction from a front of a server rack to a rear of a server rack.
  • the coil positioning step 604 includes positioning the two heat exchange coils side-by-side in a plane perpendicular to a direction from a front door of the server rack to a rear door of the server rack.
  • the two exchange coils each may be substantially half of a width of the server rack.
  • the coil positioning step 604 includes intertwining the two heat exchange coils with each other by staggering one heat exchange coil with the other heat exchange coil.
  • the two exchange coils may be part of a rear door heat exchanger described in further detail above.
  • the method 602 may include a coupling step 606 of coupling by an adapter two heat exchange coils.
  • the two heat exchange coils are coupled such that the two heat exchange coils become one heat exchange unit configured to interface with one liquid cooling circuit.
  • Each of the two heat exchange coils may include a liquid intake port to receive liquid into the heat exchange coil and a liquid exit port to send liquid out of the heat exchange coil.
  • the coupling step 606 includes coupling together by the adapter the liquid intake port of one heat exchange coil and the liquid intake port of the other heat exchange coil, the liquid exit port of one heat exchange coil and the liquid exit port of the other heat exchange coil, or the liquid exit port of one heat exchange coil and the liquid intake port of the other heat exchange coil.
  • the adapter is described in greater detail above.
  • method 602 includes an uncoupling step 608 of uncoupling the two heat exchange coils by adjusting the adapter.
  • the adapter and heat exchange coils include quick connect fittings. Uncoupling and coupling may be performed by actuating the quick connect fittings.
  • at least one of the two heat exchange coils includes a set of horizontal tubes coupled to a set of vertical air cooling fins.
  • method 602 includes a heat exchange coil isolation step 612 of positioning an isolation device to isolate one heat exchange coil from the other heat exchange coil.
  • Method 602 may also include an air flow diversion step 614 of positioning an air flow diversion device to divert air flow through the server rack away from one heat exchange coil towards the other heat exchange coil.
  • the isolation device and air flow diversion device are described further above.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack. The system includes a cooling system having at least two liquid cooling circuits. The system also includes a rear door heat exchanger connected to the cooling system. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system.

Description

    BACKGROUND
  • The present invention is directed towards the cooling of server racks with liquid heat exchanging devices, and more particularly to the use of a redundant liquid cooling system for server racks.
  • Modern electronic devices continue to grow smaller and denser to optimize speed and minimize power requirements. With the increase of electronic communication and the spread of networks, data centers have been developed to centralize management of network devices. Data centers often include server racks, which contain multiple servers in one storage unit. Servers in each server rack produce heat that may be carried away from the data center by air flow through the server rack. The heat carried in the air flow may increase the temperature of the data center. A variety of cooling techniques can be implemented to maintain cooler temperatures in the data center.
    • BRIEF SUMMARY
  • An example embodiment of the present invention is an apparatus for controlling the redundancy of a cooling system for a server rack. The apparatus includes an adapter configured to couple together two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit.
  • Another example embodiment of the present invention is a rear door heat exchanger for controlling the redundancy of a cooling system for a server rack. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit.
  • Another example embodiment of the invention is a system for cooling air flow through a server rack. The system includes a cooling system having at least two liquid cooling circuits. The system also includes a rear door heat exchanger connected to the cooling system. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system.
  • Yet another example embodiment of the invention is a method of controlling the redundancy of a cooling system for a server rack. The method includes coupling by an adapter two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The adapter couples the two heat exchange coils such that the two heat exchange coils become one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
  • FIG. 1 shows an example embodiment of an apparatus for controlling the redundancy of a cooling system for a server rack.
  • FIG. 2 shows an example embodiment of a system for cooling air flow through a server rack.
  • FIG. 3 shows an example embodiment of two heat exchange coils positioned side-by-side.
  • FIG. 4 shows an example embodiment of two heat exchange coils intertwined.
  • FIG. 5 shows an example embodiment of a rear door heat exchanger with a cooling failure.
  • FIG. 6 shows an example embodiment of a method of controlling the redundancy of a cooling system for a server rack.
    •  DETAILED DESCRIPTION
  • The present invention is described with reference to embodiments of the invention. Throughout the description of the invention reference is made to FIGS. 1-6. As discussed in detail below, embodiments of the present invention include an apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack.
  • FIG. 1 shows an example embodiment of an apparatus 102 for controlling the redundancy of a cooling system for a server rack. The apparatus 102 may include an adapter 104 configured to couple together two heat exchange coils into one heat exchange unit. In one embodiment, the adapter 104 is adjustable such that the two heat exchange coils can be uncoupled. In one embodiment, the adapter 104 includes quick connect fittings 108 for coupling and uncoupling the adapter 104 to the heat exchange coils. The adapter, heat exchange coils, heat exchange unit, and cooling system are further described below.
  • FIG. 2 shows an example embodiment of a system 202 for cooling air flow through a server rack 204. In one embodiment, the system 202 includes a cooling system 206 having at least two liquid cooling circuits 208. In one embodiment, the cooling system includes a plurality of server racks 204. The cooling system 206 may include coolant supplied to the plurality of server racks 204 from the liquid cooling circuits 208. Each liquid cooling circuit may include two coolant lines 210 and 212. The first coolant line 210 may receive coolant from the plurality of server racks 204 and the second coolant line 212 may supply coolant to the plurality of server racks 204. In one embodiment, each liquid cooling circuit 208 includes a coolant pump 214. The coolant pump 214 may be enclosed within a coolant distribution unit 216. Furthermore, each coolant pump 214 may also couple to a chiller supply line 218 from a chiller plant 220. Further still, each coolant pump 214 may couple to an independent power supply line 222.
  • The system 202 may include a rear door heat exchanger (RDHx) 224 connected to the cooling system 206. In one embodiment, the rear door heat exchanger 224 includes two heat exchange coils 226. For example, the rear door heat exchanger 224 may be a dual coil RDHx packaged in a monolithic assembly. In one embodiment, at least one of the two heat exchange coils 226 includes a set of horizontal tubes coupled to a set of vertical air cooling fins. Each heat exchange coil 226 may be carried by the server rack 204 and configured to interface with a different liquid cooling circuit 208. In one embodiment, the system 202 includes an adapter 104 configured to couple together the two heat exchange coils 226 into one heat exchange unit 228. The heat exchange unit 228 may be configured to interface with one liquid cooling circuit 208 from the cooling system 206. The adapter 104 may be used, for example, if a data center does not require the redundancy offered by a dual coil RDHx or is not equipped with more than one liquid cooling circuit 208. The adapter 104 may be provided to convert a dual coil RDHx to a non-redundant RDHx. The adapter 104 may also be used if there is a failure along one of the liquid coolant circuits 208, or if one of the two heat exchange coils 226 fails. In such cases, the redundancy in the system 202 may ensure the server rack's 204 exhaust air will continue to be cooled. The adapter 104 is described in further detail above. In one embodiment, one of the two heat exchange coils 226 b is positioned after the other heat exchange coil 226 a in a direction 230 from a front 232 of the server rack to a rear 234 of the server rack.
  • FIG. 3 shows an example embodiment of two heat exchange coils 226. The two heat exchange coils 226 may be positioned side-by-side in a plane perpendicular to a direction (into the page as shown from the perspective of FIG. 3) from a front door of the server rack to a rear door of the server rack. The two exchange coils 226 each may be substantially half of a width of the server rack.
  • In one embodiment, each of the two heat exchange coils 226 includes a liquid intake port 302 to receive liquid into the heat exchange coil 226 and a liquid exit port 304 to send liquid out of the heat exchange coil 226. The adapter 104 may be configured to couple together the liquid intake port 302 of one heat exchange coil 226 a and the liquid intake port 302 of the other heat exchange coil 226 b, the liquid exit port 304 of one heat exchange coil 226 a and the liquid exit port 304 of the other heat exchange coil 226 b, or the liquid exit port 304 of one of the two heat exchange coils 226 a and the liquid intake port 302 of the other heat exchange coil 226 b. In one embodiment, the liquid intake port 302 and liquid exit port 304 both include quick connect fittings. The adapter 104 may also include quick connect fittings to interface with the liquid intake port 302 and liquid exit port 304. In one embodiment, at least one of the two heat exchange coils includes a set of horizontal tubes 306 coupled to a set of vertical air cooling fins 308.
  • The two heat exchange coils 226 may be proximate an air filter 310 configured to force cabinet exhaust air through vertical air cooling fins 308. The air filter 310 can therefore be used to prevent exhaust air from bypassing the two heat exchange coils 226. The air filter 310 may be constructed from, for example, plastic, foam material, and/or sheet metal.
  • FIG. 4 shows another example embodiment of two heat exchange coils 226. In one embodiment, at least one of the two heat exchange coils 226 includes a set of horizontal tubes 306 coupled to a set of vertical air cooling fins 308. The two heat exchange coils 226 may be proximate an air filter 310 as described above. The two heat exchange coils 226 may be intertwined with each other by staggering one heat exchange coil 226 a with the other heat exchange coil 226 b.
  • FIG. 5 shows an example embodiment of a rear door heat exchanger 224 with a cooling failure. In one embodiment, the rear door heat exchanger 224 includes an isolation device 502 configured to thermally isolate one heat exchange coil 226 b from the other heat exchange coil 226 a. In one embodiment, the rear door heat exchanger 224 includes an air flow diversion device 504 configured to divert an air flow through the server rack away from the one heat exchange coil 226 b towards the other heat exchange coil 226 a. In one embodiment, the air flow diversion device 504 is a set of louvers. The louvers may be in a closed position, as shown covering heat exchange coil 226 b, or in an open position, as shown partially in front of heat exchange coil 226 a. The closed louvers may act as an air barrier, diverting exhaust air from the malfunctioning heat exchange coil 226 b with the cooling failure to the functioning heat exchange coil 226 a. In one embodiment, the isolation device 502 and air flow diversion device 504 are embodied in a solid flap configured to block and isolate one heat exchange coil and force the flow of all of the exhaust air through the other heat exchange coil.
  • Though not completely shown in FIG. 5, it is understood that at least one of the two heat exchange coils 226 may include a set of horizontal tubes 306 coupled to a set of vertical air cooling fins. Additionally, it is noted that the two heat exchange coils 226 may be proximate an air filter. These elements, though not shown in FIG. 5 for the sake of maintaining discernability, are described above.
  • FIG. 6 shows an example embodiment of a method 602 of controlling the redundancy of a cooling system for a server rack. The method 602 may include a coil positioning step 604. In one embodiment, the coil positioning step 604 includes positioning one of two heat exchange coils after the other heat exchange coil in a direction from a front of a server rack to a rear of a server rack. In another embodiment, the coil positioning step 604 includes positioning the two heat exchange coils side-by-side in a plane perpendicular to a direction from a front door of the server rack to a rear door of the server rack. The two exchange coils each may be substantially half of a width of the server rack. In yet another embodiment, the coil positioning step 604 includes intertwining the two heat exchange coils with each other by staggering one heat exchange coil with the other heat exchange coil. The two exchange coils may be part of a rear door heat exchanger described in further detail above.
  • The method 602 may include a coupling step 606 of coupling by an adapter two heat exchange coils. In one embodiment, the two heat exchange coils are coupled such that the two heat exchange coils become one heat exchange unit configured to interface with one liquid cooling circuit. Each of the two heat exchange coils may include a liquid intake port to receive liquid into the heat exchange coil and a liquid exit port to send liquid out of the heat exchange coil. In one embodiment, the coupling step 606 includes coupling together by the adapter the liquid intake port of one heat exchange coil and the liquid intake port of the other heat exchange coil, the liquid exit port of one heat exchange coil and the liquid exit port of the other heat exchange coil, or the liquid exit port of one heat exchange coil and the liquid intake port of the other heat exchange coil. The adapter is described in greater detail above.
  • In one embodiment, method 602 includes an uncoupling step 608 of uncoupling the two heat exchange coils by adjusting the adapter. In one embodiment, the adapter and heat exchange coils include quick connect fittings. Uncoupling and coupling may be performed by actuating the quick connect fittings. In one embodiment, at least one of the two heat exchange coils includes a set of horizontal tubes coupled to a set of vertical air cooling fins.
  • In one embodiment, method 602 includes a heat exchange coil isolation step 612 of positioning an isolation device to isolate one heat exchange coil from the other heat exchange coil. Method 602 may also include an air flow diversion step 614 of positioning an air flow diversion device to divert air flow through the server rack away from one heat exchange coil towards the other heat exchange coil. The isolation device and air flow diversion device are described further above.
  • While the preferred embodiments to the invention have been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements that fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.

Claims (20)

What is claimed is:
1. An apparatus for controlling the redundancy of a cooling system for a server rack, the apparatus comprising:
an adapter configured to couple together two heat exchange coils into one heat exchange unit, the heat exchange unit configured to interface with one liquid cooling circuit, each heat exchange coil carried by the server rack and configured to interface with a different liquid cooling circuit.
2. The apparatus of claim 1, wherein the adapter is adjustable such that the two heat exchange coils can be uncoupled.
3. A rear door heat exchanger for controlling the redundancy of a cooling system for a server rack, the rear door heat exchanger comprising:
two heat exchange coils, each heat exchange coil being carried by the server rack and configured to interface with a different liquid cooling circuit; and
an adapter configured to couple together the two heat exchange coils into one heat exchange unit, the heat exchange unit configured to interface with one liquid cooling circuit.
4. The rear door heat exchanger of claim 3, wherein the adapter is adjustable such that the two heat exchange coils can be uncoupled.
5. The rear door heat exchanger of claim 3, wherein each of the two heat exchange coils includes a liquid intake port to receive liquid into the heat exchange coil and a liquid exit port to send liquid out of the heat exchange coil, wherein the adapter is configured to couple together at least one of:
the liquid intake port of one heat exchange coil and the liquid intake port of the other heat exchange coil;
the liquid exit port of one heat exchange coil and the liquid exit port of the other heat exchange coil; and
the liquid exit port of one heat exchange coil and the liquid intake port of the other heat exchange coil.
6. The rear door heat exchanger of claim 3, wherein at least one of the two heat exchange coils includes a set of horizontal tubes coupled to a set of vertical air cooling fins.
7. The rear door heat exchanger of claim 3, wherein the two heat exchange coils are intertwined with each other by staggering one heat exchange coil with the other heat exchange coil.
8. The rear door heat exchanger of claim 3, further comprising:
an isolation device configured to thermally isolate one heat exchange coil from the other heat exchange coil; and
an air flow diversion device configured to divert an air flow through the server rack away from the one heat exchange coil towards the other heat exchange coil.
9. A system for cooling air flow through a server rack, the system comprising:
a cooling system having at least two liquid cooling circuits; and
a rear door heat exchanger connected to the cooling system, the rear door heat exchanger including:
two heat exchange coils, each heat exchange coil carried by the server rack and configured to interface with a different liquid cooling circuit; and
an adapter configured to couple together the two heat exchange coils into one heat exchange unit configured to interface with one liquid cooling circuit from the cooling system.
10. The system of claim 9, wherein the adapter is adjustable such that the two heat exchange coils can be uncoupled.
11. The system of claim 9, wherein each of the two heat exchange coils includes a liquid intake port to receive liquid into the heat exchange coil and a liquid exit port to send liquid out of the heat exchange coil, wherein the adapter is configured to couple together at least one of:
the liquid intake port of one heat exchange coil and the liquid intake port of the other heat exchange coil;
the liquid exit port of one heat exchange coil and the liquid exit port of the other heat exchange coil; and
the liquid exit port of one heat exchange coil and the liquid intake port of the other heat exchange coil.
12. The system of claim 9, wherein at least one of the two heat exchange coils includes a set of horizontal tubes coupled to a set of vertical air cooling fins.
13. The system of claim 9, wherein the two heat exchange coils are positioned side-by-side in a plane perpendicular to a direction from a front door of the server rack to a rear door of the server rack, the two exchange coils each being substantially half of a width of the server rack.
14. A method of controlling the redundancy of a cooling system for a server rack, comprising:
coupling by an adapter two heat exchange coils, each heat exchange coil carried by the server rack and configured to interface with a different liquid cooling circuit, such that the two heat exchange coils become one heat exchange unit configured to interface with one liquid cooling circuit.
15. The method of claim 14, further comprising:
uncoupling the two heat exchange coils by adjusting the adapter.
16. The method of claim 14, wherein each of the two heat exchange coils includes a liquid intake port to receive liquid into the heat exchange coil and a liquid exit port to send liquid out of the heat exchange coil, the method further comprising:
coupling together by the adapter at least one of the liquid intake port of one heat exchange coil and the liquid intake port of the other heat exchange coil, the liquid exit port of one heat exchange coil and the liquid exit port of the other heat exchange coil, and the liquid exit port of one heat exchange coil and the liquid intake port of the other heat exchange coil.
17. The method of claim 14, wherein at least one of the two heat exchange coils includes a set of horizontal tubes coupled to a set of vertical air cooling fins.
18. The method of claim 14, further comprising:
positioning one of the two heat exchange coils after the other heat exchange coil in a direction from a front of the server rack to a rear of the server rack.
19. The method of claim 14, further comprising:
intertwining the two heat exchange coils with each other by staggering one heat exchange coil with the other heat exchange coil.
20. The method of claim 14, further comprising:
positioning an isolation device to isolate one heat exchange coil from the other heat exchange coil; and
positioning an air flow diversion device to divert air flow through the server rack away from the one heat exchange coil towards the other heat exchange coil.
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014229065A (en) * 2013-05-22 2014-12-08 株式会社Ｎｔｔファシリティーズ Device cooling system and control method thereof
US20140362520A1 (en) * 2013-06-06 2014-12-11 International Business Machines Corporation Dynamic surface area expansion in a rear door heat exchanger
CN109732282A (en) * 2019-01-09 2019-05-10 南京华新消防设备制造有限公司 A kind of no-welding assembling process of seamless fire resistant doorsets
EP3787385A1 (en) * 2019-08-26 2021-03-03 Ovh Cooling arrangement for a rack hosting electronic equipment and at least one fan
US11202392B2 (en) * 2019-10-16 2021-12-14 International Business Machines Corporation Multi-coolant heat exchanger for an electronics rack
US11212942B2 (en) 2019-08-26 2021-12-28 Ovh Cooling arrangement for autonomous cooling of a rack
US11280565B2 (en) * 2019-03-13 2022-03-22 Wistron Corp. Adapting device and heat dissipation system having the same
GB2610393A (en) * 2021-09-01 2023-03-08 New Nordic Data Cooling Aps Computer or information technology rack hall cooling equipment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11137805B2 (en) 2019-06-14 2021-10-05 Klinge Corporation Dual redundant cooling system for a container
US12108571B2 (en) 2021-05-06 2024-10-01 Rolls-Royce North American Technologies Inc. Electronics cabinet cooling system

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2355289A (en) * 1943-06-30 1944-08-08 Gen Motors Corp Refrigerating apparatus
US3392541A (en) * 1967-02-06 1968-07-16 Larkin Coils Inc Plural compressor reverse cycle refrigeration or heat pump system
US3966673A (en) * 1972-07-13 1976-06-29 Dynamit Nobel Aktiengesellschaft Polyvinylchloride polymer inhibited against release of hydrogen chloride at elevated temperature
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US4949218A (en) * 1989-02-01 1990-08-14 Fujitsu Limited Cabinet with built-in cooling system
US6181557B1 (en) * 1999-10-29 2001-01-30 Motorola, Inc. Electronic component, method of cooling, and damper therefor
US20020035845A1 (en) * 1999-10-22 2002-03-28 David Smolinsky Heating and refrigeration systems using refrigerant mass flow
US6819563B1 (en) * 2003-07-02 2004-11-16 International Business Machines Corporation Method and system for cooling electronics racks using pre-cooled air
US6955055B2 (en) * 2001-03-27 2005-10-18 Knuerr Ag Housing for accommodating at least one energy accumulator device
US20050242580A1 (en) * 2004-04-26 2005-11-03 Manuli Automotive S.P.A. Quick-coupling connector for pipes of climate-control, refrigeration and similar systems
US20070215215A1 (en) * 2003-01-07 2007-09-20 Arentsen Robert P Isolation valve with rotatable flange
US20080011463A1 (en) * 2006-07-17 2008-01-17 Advanced Distributor Products Llc Dual flow heat exchanger header
US20080093054A1 (en) * 2006-08-29 2008-04-24 Tilton Charles L Manifold for a Two-Phase Cooling System
US20080158815A1 (en) * 2006-08-25 2008-07-03 International Business Machines Corporation Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow
US7434412B1 (en) * 2005-10-27 2008-10-14 Sun Microsystems, Inc. Computer equipment temperature control system and methods for operating the same
US7477514B2 (en) * 2007-05-04 2009-01-13 International Business Machines Corporation Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US20090268404A1 (en) * 2008-04-23 2009-10-29 International Business Machines Corporation Energy efficient apparatus and method for cooling an electronics rack
US20110232889A1 (en) * 2010-03-23 2011-09-29 International Business Machines Corporation Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger
US8789394B2 (en) * 2010-12-22 2014-07-29 Du Pont-Toray Company, Ltd. Resin-coated glove

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7647787B2 (en) 2004-04-22 2010-01-19 Hewlett-Packard Development Company, L.P. Upgradeable, modular data center cooling apparatus
US20050241802A1 (en) 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. Liquid loop with flexible fan assembly
US7187549B2 (en) 2004-06-30 2007-03-06 Teradyne, Inc. Heat exchange apparatus with parallel flow
WO2008039773A2 (en) 2006-09-25 2008-04-03 Rackable Systems, Inc. Container-based data center
US7564685B2 (en) 2006-12-29 2009-07-21 Google Inc. Motherboards with integrated cooling
US20080266726A1 (en) 2007-04-27 2008-10-30 Vance Murakami Cooling system for electrical devices
US8051672B2 (en) 2007-08-30 2011-11-08 Afco Systems Fluid cooled cabinet for electronic equipment
US7757506B2 (en) 2007-11-19 2010-07-20 International Business Machines Corporation System and method for facilitating cooling of a liquid-cooled electronics rack
US7646603B2 (en) 2008-02-13 2010-01-12 International Business Machines Corporation Noise-reducing attachment apparatus for heat exchanger door of an electronics rack of a data center

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2355289A (en) * 1943-06-30 1944-08-08 Gen Motors Corp Refrigerating apparatus
US3392541A (en) * 1967-02-06 1968-07-16 Larkin Coils Inc Plural compressor reverse cycle refrigeration or heat pump system
US3966673A (en) * 1972-07-13 1976-06-29 Dynamit Nobel Aktiengesellschaft Polyvinylchloride polymer inhibited against release of hydrogen chloride at elevated temperature
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US4949218A (en) * 1989-02-01 1990-08-14 Fujitsu Limited Cabinet with built-in cooling system
US20020035845A1 (en) * 1999-10-22 2002-03-28 David Smolinsky Heating and refrigeration systems using refrigerant mass flow
US6181557B1 (en) * 1999-10-29 2001-01-30 Motorola, Inc. Electronic component, method of cooling, and damper therefor
US6955055B2 (en) * 2001-03-27 2005-10-18 Knuerr Ag Housing for accommodating at least one energy accumulator device
US20070215215A1 (en) * 2003-01-07 2007-09-20 Arentsen Robert P Isolation valve with rotatable flange
US6819563B1 (en) * 2003-07-02 2004-11-16 International Business Machines Corporation Method and system for cooling electronics racks using pre-cooled air
US20050242580A1 (en) * 2004-04-26 2005-11-03 Manuli Automotive S.P.A. Quick-coupling connector for pipes of climate-control, refrigeration and similar systems
US7434412B1 (en) * 2005-10-27 2008-10-14 Sun Microsystems, Inc. Computer equipment temperature control system and methods for operating the same
US20080011463A1 (en) * 2006-07-17 2008-01-17 Advanced Distributor Products Llc Dual flow heat exchanger header
US20080158815A1 (en) * 2006-08-25 2008-07-03 International Business Machines Corporation Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow
US20080093054A1 (en) * 2006-08-29 2008-04-24 Tilton Charles L Manifold for a Two-Phase Cooling System
US7477514B2 (en) * 2007-05-04 2009-01-13 International Business Machines Corporation Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US20090268404A1 (en) * 2008-04-23 2009-10-29 International Business Machines Corporation Energy efficient apparatus and method for cooling an electronics rack
US7791882B2 (en) * 2008-04-23 2010-09-07 International Business Machines Corporation Energy efficient apparatus and method for cooling an electronics rack
US20110232889A1 (en) * 2010-03-23 2011-09-29 International Business Machines Corporation Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger
US8789384B2 (en) * 2010-03-23 2014-07-29 International Business Machines Corporation Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger
US8789394B2 (en) * 2010-12-22 2014-07-29 Du Pont-Toray Company, Ltd. Resin-coated glove

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014229065A (en) * 2013-05-22 2014-12-08 株式会社Ｎｔｔファシリティーズ Device cooling system and control method thereof
US20140362520A1 (en) * 2013-06-06 2014-12-11 International Business Machines Corporation Dynamic surface area expansion in a rear door heat exchanger
US9507393B2 (en) * 2013-06-06 2016-11-29 Lenovo Enterprise Solutions PTE. LTD. Dynamic surface area expansion in a rear door heat exchanger
CN109732282A (en) * 2019-01-09 2019-05-10 南京华新消防设备制造有限公司 A kind of no-welding assembling process of seamless fire resistant doorsets
US11280565B2 (en) * 2019-03-13 2022-03-22 Wistron Corp. Adapting device and heat dissipation system having the same
EP3787385A1 (en) * 2019-08-26 2021-03-03 Ovh Cooling arrangement for a rack hosting electronic equipment and at least one fan
US11212942B2 (en) 2019-08-26 2021-12-28 Ovh Cooling arrangement for autonomous cooling of a rack
US11765864B2 (en) 2019-08-26 2023-09-19 Ovh Cooling arrangement for a rack hosting electronic equipment and at least one fan
US11202392B2 (en) * 2019-10-16 2021-12-14 International Business Machines Corporation Multi-coolant heat exchanger for an electronics rack
GB2610393A (en) * 2021-09-01 2023-03-08 New Nordic Data Cooling Aps Computer or information technology rack hall cooling equipment
WO2023030675A1 (en) * 2021-09-01 2023-03-09 New Nordic Data Cooling Aps Computer or information technology rack hall cooling equipment

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