US20130033822A1 - Image acquisition apparatus and image acquisition system - Google Patents

Image acquisition apparatus and image acquisition system Download PDF

Info

Publication number
US20130033822A1
US20130033822A1 US13/563,538 US201213563538A US2013033822A1 US 20130033822 A1 US20130033822 A1 US 20130033822A1 US 201213563538 A US201213563538 A US 201213563538A US 2013033822 A1 US2013033822 A1 US 2013033822A1
Authority
US
United States
Prior art keywords
image
image acquisition
temperature
heat
acquisition apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/563,538
Other languages
English (en)
Inventor
Tomofumi Nishikawara
Yukio Tokuda
Hisashi Namba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Assigned to CANON KABUSHIKI KAISHA reassignment CANON KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOKUDA, YUKIO, NAMBA, HISASHI, NISHIKAWARA, TOMOFUMI
Publication of US20130033822A1 publication Critical patent/US20130033822A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/24—Base structure
    • G02B21/28—Base structure with cooling device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
    • G02B21/365—Control or image processing arrangements for digital or video microscopes

Definitions

  • the present invention relates to an image acquisition apparatus and an image acquisition system.
  • the image acquisition system includes an image acquisition apparatus (for example, a microscope) and a display apparatus.
  • the image acquisition apparatus captures an image of a subject, whereby it is possible to acquire a digital image and to display the digital image on the display apparatus in high resolution.
  • an image acquisition apparatus there is a requirement for capturing a subject in high resolution and at high speed. For this purpose, it is necessary to capture an image of as wide an area as possible of the subject in high resolution at a time.
  • Japanese Patent Application Laid-Open No. 2009-003016 an image acquisition apparatus which uses an objective lens of wide field of view and high resolution and in which an image sensor group is arranged within the field of view.
  • thermoelectric element is arranged on the back surface of the image sensor (the surface on the side opposite the imaging surface).
  • a Peltier element is employed as the thermoelectric element
  • an optical element such as an objective lens is designed in conformity with the temperature of the environment in which image acquisition is conducted (assuming, for example, a case where room temperature is approximately 20° C.).
  • Japanese Patent No. 03096038 proposes a construction in which, when a subject on a heat generation plate is observed in a high temperature condition, a protector forming an airflow is arranged between the objective lens and the heat generation plate so that the heat of the heat generation plate may not be transferred to the objective lens.
  • An aspect of the present invention is directed to an image acquisition apparatus including an image sensor and an optical element close to each other, wherein the influence due to heat transfer, such as radiation between the image sensor and the optical element, is suppressed, making it possible to acquire an image of high resolution.
  • an image acquisition apparatus includes an imaging optical system configured to form an image of a subject, an imaging unit including an image sensor configured to capture the image of the subject formed by the imaging optical system, a cooler thermally connected to the image sensor, and a heat-transfer reduction unit including an opaque portion located between the imaging optical system and the imaging unit, wherein the opaque portion includes an aperture through which incident light to the image sensor passes.
  • FIG. 1 illustrates the system configuration of an image acquisition system according to a first exemplary embodiment of the present invention.
  • FIGS. 2A and 2B are a top view and a sectional view of a prepared slide, respectively.
  • FIG. 3 is a sectional view of an objective lens.
  • FIG. 4 is a top view of an imaging unit.
  • FIGS. 5A and 5B are a schematic sectional view of the portion around the imaging unit and a plan view of a heat-transfer reduction unit, respectively, according to the first exemplary embodiment.
  • FIGS. 6A and 6B are a schematic sectional view of the portion around an imaging unit and a plan view of a heat-transfer reduction unit, respectively, according to a second exemplary embodiment of the present invention.
  • FIGS. 7A and 7B are a schematic sectional view of the portion around an imaging unit and a plan view of a heat-transfer reduction unit, respectively, according to a third exemplary embodiment of the present invention.
  • FIG. 1 is a diagram illustrating the system configuration of an image acquisition system 100 according to the first exemplary embodiment of the present invention.
  • the image acquisition system 100 is a system for acquiring an image of a subject (prepared slide) and displaying the image.
  • the image acquisition system includes a microscope 1 as an image acquisition apparatus for capturing an image of a prepared slide 30 , and a display device 3 for displaying a digital image acquired by the microscope 1 .
  • the microscope 1 has an illumination unit 10 for illuminating the prepared slide 30 , an objective lens 40 for performing image formation of the prepared slide 30 , and an imaging unit 50 for capturing an image of the prepared slide 30 .
  • a stage 20 is a member for retaining and moving the prepared slide 30 .
  • the illumination unit 10 includes a light source unit (not illustrated), and an illumination optical system (not illustrated) for guiding the light from the light source unit to the prepared slide 30 .
  • a light source of the light source unit it is possible to employ a white light source, a light-emitting diode (LED) light source, or the like.
  • the light source of the present exemplary embodiment is equipped with a light-emitting diode (LED) having the wavelength of each of the colors, red, green, and blue (RGB) .
  • RGB red, green, and blue
  • the stage 20 includes a retaining unit (not illustrated) retaining the prepared slide 30 , an XY-stage 22 configured to move the retaining unit in the XY-directions, and a Z-stage 24 configured to move the retaining unit in the Z-direction.
  • the Z-direction corresponds to the optical axis direction of the objective lens 40
  • the XY-directions correspond to directions perpendicular to the optical axis.
  • the XY-stage 22 and the Z-stage 24 are provided with apertures allowing passage of the light from the illumination unit 10 .
  • FIGS. 2A and 2B are a top view and a sectional view of the prepared slide 30 , respectively.
  • the prepared slide 30 which is an example of the subject, is composed of a cover glass 301 , a sample 302 , and a slide glass 303 .
  • the sample 302 e.g., a living body sample like a slice of tissue
  • a label (barcode) 333 on which the requisite information for controlling the prepared slide 30 (the sample 302 ), such as the identification number of the slide glass and the thickness of the cover glass, is recorded and may be attached to the slide glass 303 .
  • the object of image acquisition is the prepared slide 30 as the subject, the subject may also be, for example, a substrate or the like to be subjected to external inspection (inspection for adhesion of foreign matter, flaws, etc.).
  • FIG. 3 is a sectional view of the objective lens 40 .
  • the objective lens 40 is an imaging optical system for performing image formation on the imaging surface of the imaging unit 50 with the prepared slide 30 enlarged at a predetermined magnification. More specifically, as illustrated in FIG. 3 , the objective lens 40 includes lenses and a mirror, and is configured to perform image formation on an imaging surface B with an image on an object surface A. In the present exemplary embodiment, the objective lens 40 is arranged such that the prepared slide 30 and the imaging surface of the imaging unit 50 are optically conjugate to each other.
  • the object on the object surface A corresponds to the prepared slide 30
  • the imaging surface B corresponds to the surface of an imaging area 555 (illustrated in detail below) of the imaging unit 50 .
  • the numerical aperture (NA) on the object surface side of the object lens 40 is typically 0.7 or more.
  • the objective lens 40 is typically formed so as to be capable of performing image formation at one time at least over an area of 10 mm ⁇ 10 mm on the object surface.
  • the objective lens 40 is designed taking into account the temperature of the environment where the image acquisition is to be performed. For example, when the average ambient temperature is 20° C., the objective lens is designed using the value of 20° C. as a reference. In this case, the temperature of the objective lens 40 guaranteeing the requisite optical performance ranges from approximately 10° C. to 30° C., which is the range in which image acquisition is performed.
  • FIG. 4 is a top view of the imaging unit 50 .
  • the imaging unit 50 includes the imaging area 555 , which is composed of a plurality of two-dimensionally arranged image sensors 501 , thus enabling capturing an image of a region F of the image plane of the objective lens 40 at one time.
  • the imaging surface B illustrated in FIG. 3 is formed by the imaging area 555 .
  • Charge-coupled devices (CCDs), complementary metal oxide semiconductor (CMOS) sensors, or the like can be used as the image sensors 501 .
  • the number of image sensors mounted on the imaging unit 50 is determined based on the area of the image plane of the objective lens 40 . For example, it is possible to adopt a construction where only one image sensor is arranged.
  • the number of image sensors is determined based on the configuration of the image plane of the objective lens 40 , the configuration and construction of the image sensors, etc.
  • the imaging area 555 is implemented such that 5 ⁇ 4 CMOS sensors are arranged in the X-Y directions.
  • the imaging unit 50 there exists a base surface 542 around an imaging region 541 of each of the plurality of image sensors 501 . Thus, in the image acquired through one shooting by the imaging unit 50 , the portion corresponding to the gap between the imaging regions 541 is left out.
  • the stage 20 is moved, and imaging is performed a plurality of times while changing the positional relationship between the prepared slide 30 and the imaging area 555 , whereby it is possible to acquire an image of the sample 302 free from dropouts.
  • the imaging unit 50 is retained by a main body frame (not illustrated) or the lens barrel (not illustrated) of the objective lens 40 .
  • a control device 2 is includes a computer including a central processing unit (CPU), memory, a hard disk, etc.
  • the control device 2 performs imaging control, and processes the image data of the captured prepared slide 30 , thereby preparing a digital image. More specifically, the control device 2 performs position matching between the images captured a plurality of times while moving the stage 20 in the XY-directions, and connects the images together, thereby preparing an image of the sample 302 free from gaps. Further, in the image acquisition apparatus according to the present exemplary embodiment, an image of the sample 302 is captured for each of the colors RGB of the light from the light source unit, so that by the control device 2 combining the data on those images, a color image of the sample 302 is generated.
  • thermoelectric element is used as the cooler.
  • the cooling process is described in more detail below with reference to FIGS. 5A and 5B .
  • FIGS. 5A and 5B are a schematic sectional view of the portion around the imaging unit 50 and a plan view of the heat-transfer reduction unit, respectively, in the microscope 1 according to the present exemplary embodiment.
  • the image sensors 501 are thermally connected to Peltier elements 510 serving as the thermoelectric elements via substrates 502 , and are cooled by the Peltier elements 510 .
  • Each Peltier element 510 is held between the substrate 502 and a metal block 511 of high heat conductivity (e.g., copper, aluminum, or heat pipe), and is firmly fixed in position by a fixation member 503 , e.g., a screw.
  • a fixation member 503 e.g., a screw.
  • each Peltier element 510 is attached to the substrate 502 , and the high temperature side thereof is attached to the metal block 511 .
  • a heat conductive sheet or a heat conductive grease is provided or applied between the contact surfaces of the Peltier element 510 and of the substrate 502 and between the contact surfaces of the Peltier element 510 and of the metal block 511 .
  • a retaining portion 504 connects each metal block 511 and a surface plate 560 to retain the image sensors 501 .
  • Heat pipes 512 are provided between the metal blocks 511 and radiation fins 513 , transporting the heat generated in the image sensors 501 and the Peltier elements 510 to the radiation fins 513 to dissipate the heat.
  • the cooling method for the radiation fins 513 is selected as appropriate from a natural convection system, a forcible convection system using a blower, and a water cooling system according to the conditions such as the quantity of heat to be dissipated, temperature, and design space.
  • a lens 401 closest to the image sensors 501 is provided with a temperature sensor 514 .
  • a control unit 505 is electrically connected to the Peltier elements 510 and the temperature sensor 514 .
  • the control unit 505 controls the value of an electric current applied to the Peltier elements 510 based on temperature information from the temperature sensor 514 , whereby control is effected such that the image sensors 501 attain a desired control temperature T 1 .
  • the control temperature T 1 is a value determined as appropriate according to the specifications of the image sensors 501 . In the present exemplary embodiment, it is approximately 5° C.
  • An optical bench 560 is retained by a main body frame (not illustrated) or the lens barrel (not illustrated) of the objective lens 40 .
  • the Peltier elements 510 are used as the cooler for the image sensors 501 , it is also possible to form a cooler by a heat sink or a fin, and arrange this cooler on the substrate 502 to effect water cooling or air cooling.
  • the objective lens 40 undergoes optical design at the temperature T 2 (which, in the present exemplary embodiment, is approximately 20° C.) of the environment where image acquisition is performed.
  • T 2 which, in the present exemplary embodiment, is approximately 20° C.
  • a heat-transfer reduction unit is arranged between the image sensors 501 and the objective lens 40 .
  • the heat transfer between the image sensors 501 and the objective lens 40 is reduced, so that they can respectively be controlled to the desired temperatures T 1 and T 2 , making it possible to acquire an image of high quality.
  • the present exemplary embodiment employs, as the heat-transfer reduction unit, a vacuum heat insulation member 520 having a reflection film 522 constituting an opaque portion, whereby it is possible to suppress radiation and other forms of heat transfer.
  • the vacuum heat insulation member 520 is arranged between the image sensors 501 and the lens 401 .
  • the vacuum heat insulation member 520 forms inside a container a substantially vacuum closed space 523 .
  • the vacuum heat insulation member 520 is more advantageous than a heat insulation member of the type in which fluid (such as air or water) is caused to flow between the flat glasses 521 a and 521 b in that it allows a reduction in thickness.
  • the reflection film 522 is formed on the vacuum insulation member 520 as the opaque portion, thereby suppressing heat transfer due to radiation.
  • the reflection film 522 is formed on the surface of the flat glasses 521 a and 521 b except for the passage region where the incident light to the image sensors 501 is allowed to pass.
  • the reflection film 522 is provided with an aperture 524 allowing transmission of the incident light to the image sensors 501 .
  • the material of the reflection film 522 there is adopted an opaque material whose emissivity (radiation factor) is low (0.5 or less), so that it is possible to suppress heat transfer due to radiation by the reflection film 522 , making it possible to reduce the quantity of heat flowing from the flat glass 521 a to the flat glass 521 b.
  • the portion of the incident light 571 which does not undergo image formation on the image sensors 501 is reflected by the reflection film 522 , making it possible to prevent it from entering the image sensors 501 .
  • the portion where the light absorption film 525 is formed is not restricted to the lower surface of the flat glass 521 a. It may also be formed on the upper surface or side surfaces of the flat glass 521 b.
  • the vacuum heat insulation member 520 is provided, whereby it is possible to suppress heat transfer between the image sensors 501 and the lens 401 in close proximity to each other, and to control each of them to a desired temperature.
  • the heat-transfer reduction unit according to the present exemplary embodiment has the reflection film 522 provided with the aperture 524 allowing passage of the incident light to the image sensors 501 , whereby it is possible to suppress heat transfer due to radiation, making it possible to acquire an image of high quality.
  • FIGS. 6A and 6B are a schematic sectional view of a portion around the imaging unit 50 and a plan view of a heat-transfer reduction unit, respectively, in the microscope 1 according to the present exemplary embodiment.
  • the heat-transfer reduction unit has a heat generating heater 602 , which is an opaque portion, a temperature sensor 601 provided on the lens 401 , and a heater control unit 603 electrically connected to the heat generating heater 602 and the temperature sensor 601 .
  • a heat generating heater 602 it is possible to adopt a thin heater composed of a conductive plate, a conductive film, a conductor or the like.
  • the heat generating heater 602 is arranged so as to cover an area except for the passage region where the incident light to the image sensors 501 is allowed to pass.
  • the heat generating heater 602 is provided with an aperture 607 allowing passage of the incident light to the image sensors 501 , and is arranged on the lower surface of a transparent flat glass plate 604 (several mm thick) .
  • the heat generating heater 602 is formed of an opaque member such as a conductive plate, so that it is possible to suppress heat transfer through radiation between the image sensors 501 and the lens 401 in close proximity thereto.
  • the image sensors 501 are controlled to the desired temperature T 1 by using the Peltier elements 510 .
  • a case 606 formed by the flat glass plate 604 and a wall surface 605 surrounds the image sensors 501 and the Peltier elements 510 , and dry air 608 (air whose dew point is lower than the temperature T 1 ) is sealed within the case 606 . Accordingly, even if the control temperature T 1 of the image sensors 501 is lower than the dew point of the ambient air, there is no fear of generation of dew condensation.
  • the case 606 may be removed. Further, to suppress reflection of the portion of the incident light 571 which does not undergo image formation at the image sensors 501 , a light absorption film may be formed on the surface of the heat generating heater 602 .
  • the image acquisition apparatus it is possible to suppress the influence of heat transfer between the image sensors 501 and the lens 401 in close proximity thereto due to the heat-transfer reduction unit including the heat generating heater 602 provided with the aperture 607 allowing passage of the incident light to the image sensors 501 .
  • the heat-transfer reduction unit including the heat generating heater 602 provided with the aperture 607 allowing passage of the incident light to the image sensors 501 .
  • FIGS. 7A and 7B are a schematic sectional view of a portion around the imaging unit 50 and a plan view of the heat-transfer reduction unit, respectively, in the microscope 1 according to the present exemplary embodiment.
  • the heat-transfer reduction unit has a copper plate 705 , which is an opaque portion, the metal blocks 511 , the heat pipes 512 , the heat radiation fins 513 , temperature sensors 701 and 702 , a control unit 703 , and a heat radiation blower 704 .
  • the copper plate 705 is retained by the heat pipes 512 constituting the heat conduction members between the image sensors 501 and the lens 401 , and is provided with an aperture 706 allowing passage of the incident light to the image sensors 501 .
  • the copper plate 705 On the lower surface of the copper plate 705 , there is provided a light absorption film in order to suppress reflection of the portion of the incident light 571 which does not undergo image formation at the image sensors 501 .
  • the material of the copper plate 705 is not restricted to copper.
  • the plate may also be some other opaque highly heat conductive member such as an aluminum plate or a heat pipe. With this plate, it is possible to suppress heat transfer through radiation between the image sensors 501 and the lens 401 in close proximity thereto.
  • the heat radiation blower 704 is a cooling unit configured to promote heat radiation of the heat pipes 512 via the heat radiation fins 513 through forcible convection.
  • the heat radiation fan 704 is electrically connected to the control unit 703 , and the rotational frequency (RPM) of the heat radiation blower 704 is controlled by the control unit 703 based on temperature information from the temperature sensors 701 and 702 respectively mounted to the lens 401 and the substrate 502 .
  • RPM rotational frequency
  • an air cooling unit composed of the heat radiation blower 704 is used as the cooling unit, it is also possible to adopt a liquid cooling unit configured to control the flow rate of refrigerant in a circulation pump by the control unit 703 . Further, it is also possible to use, together with the cooling unit, a temperature controller.
  • the blower or the circulation pump cools the heat radiation fins 513 by supplying a temperature-controlled refrigerant (air or liquid) .
  • the heat pipes 512 are connected to the metal blocks 511 , which are in contact with the high temperature side of the Peltier elements 510 , which means they are thermally connected to the Peltier elements 510 . Accordingly, it is possible to transport the heat generated at the image sensors 501 and the Peltier elements 510 to the heat radiation fins 513 by the heat pipes 512 , thereby dissipating the heat.
  • the heat pipes 512 pass through the substrate 502 and are thermally connected to the copper plate 705 , so that they are thermally separated from the substrate 502 .
  • the temperature of the copper plate 705 is substantially the same as the temperature T 3 of the high temperature side of the Peltier elements 510 .
  • the temperature T 3 of the copperplate 705 can be controlled by the RPM of the heat radiation blower 704 .
  • the control unit 703 controls the RPM of the heat radiation blower 704 based on the temperature information from the temperature sensor 701 , whereby it is possible to control the temperature T 3 of the copper plate 705 such that the lens 401 is controlled to the control temperature T 2 , so that it is possible to suppress a reduction in the temperature of the lens 401 due to heat transfer and convection.
  • the temperature of the image sensors 501 can be controlled by the value of the electric current applied to the Peltier elements 510 .
  • the control unit 703 controls the current value based on the temperature sensor 702 such that the image sensors 501 are kept at the control temperature T 1 .
  • the image acquisition apparatus it is possible to reduce the influence of the heat transfer between the image sensors 501 and the lens 401 in close proximity thereto by the heat-transfer reduction unit including the copper plate 705 provided with the aperture 706 allowing passage of the incident light to the image sensors 501 . Accordingly, it is possible to respectively control the image sensors 501 and the lens 401 in close proximity thereto to the desired temperatures, so that it is possible to acquire an image of high quality. Further, the lens 401 is heated by utilizing the heat discharged from the image sensors 501 and the Peltier elements 510 , so that it is possible to achieve a reduction in power consumption for the temperature control as compared with the case of a heater.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mechanical Engineering (AREA)
  • Studio Devices (AREA)
  • Microscoopes, Condenser (AREA)
US13/563,538 2011-08-03 2012-07-31 Image acquisition apparatus and image acquisition system Abandoned US20130033822A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-170289 2011-08-03
JP2011170289A JP2013037033A (ja) 2011-08-03 2011-08-03 画像取得装置および画像取得システム

Publications (1)

Publication Number Publication Date
US20130033822A1 true US20130033822A1 (en) 2013-02-07

Family

ID=47626815

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/563,538 Abandoned US20130033822A1 (en) 2011-08-03 2012-07-31 Image acquisition apparatus and image acquisition system

Country Status (2)

Country Link
US (1) US20130033822A1 (enrdf_load_stackoverflow)
JP (1) JP2013037033A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150218612A1 (en) * 2014-02-06 2015-08-06 Tacount Exact Ltd. Apparatus, system and method for live bacteria microscopy
CN110049585A (zh) * 2019-04-30 2019-07-23 深圳市南航电子工业有限公司 一种视频设备及控制方法
US20190239367A1 (en) * 2016-06-20 2019-08-01 Schneider Electric Solar Inverters Usa, Inc. Systems and methods for humidity control in utility scale power inverters

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180075628A (ko) * 2015-10-28 2018-07-04 어플라이드 머티어리얼스, 인코포레이티드 기판 상의 재료의 프로세싱을 위한 장치, 프로세싱 장치를 위한 냉각 어레인지먼트, 그리고 기판 상에서 프로세싱되는 재료의 특성들을 측정하기 위한 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343018A (en) * 1992-10-30 1994-08-30 Wisconsin Alumni Research Foundation Microscope lens and stage heater with flexible objective lens casing heater sleeve
US6307590B1 (en) * 1997-01-30 2001-10-23 Fuji Photo Film Co., Ltd. Cooled CCD camera
US20030117523A1 (en) * 2001-11-29 2003-06-26 Olympus Optical Co., Ltd. Digital camera for an optical apparatus
US20040104998A1 (en) * 2002-11-25 2004-06-03 Carl-Zeiss-Stiftung Trading As Carl Zeiss Optical observation apparatus with video device
US6825978B2 (en) * 2002-04-04 2004-11-30 Hypervision, Inc. High sensitivity thermal radiation detection with an emission microscope with room temperature optics

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343018A (en) * 1992-10-30 1994-08-30 Wisconsin Alumni Research Foundation Microscope lens and stage heater with flexible objective lens casing heater sleeve
US6307590B1 (en) * 1997-01-30 2001-10-23 Fuji Photo Film Co., Ltd. Cooled CCD camera
US20030117523A1 (en) * 2001-11-29 2003-06-26 Olympus Optical Co., Ltd. Digital camera for an optical apparatus
US6825978B2 (en) * 2002-04-04 2004-11-30 Hypervision, Inc. High sensitivity thermal radiation detection with an emission microscope with room temperature optics
US20040104998A1 (en) * 2002-11-25 2004-06-03 Carl-Zeiss-Stiftung Trading As Carl Zeiss Optical observation apparatus with video device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150218612A1 (en) * 2014-02-06 2015-08-06 Tacount Exact Ltd. Apparatus, system and method for live bacteria microscopy
US20170240948A1 (en) * 2014-02-06 2017-08-24 Tacount Exact Ltd Apparatus, system and method for live bacteria microscopy
US20190239367A1 (en) * 2016-06-20 2019-08-01 Schneider Electric Solar Inverters Usa, Inc. Systems and methods for humidity control in utility scale power inverters
US10912237B2 (en) * 2016-06-20 2021-02-02 Schneider Electric Solar Inverters Usa, Inc. Systems and methods for humidity control in utility scale power inverters
CN110049585A (zh) * 2019-04-30 2019-07-23 深圳市南航电子工业有限公司 一种视频设备及控制方法

Also Published As

Publication number Publication date
JP2013037033A (ja) 2013-02-21

Similar Documents

Publication Publication Date Title
US9628731B2 (en) Image capture apparatus
US9335616B2 (en) Optical device utilized in laser projector
EP3828563B1 (en) Polished temperature-controlled stage
CN107078144B (zh) 加热图像传感器窗口
US20130033822A1 (en) Image acquisition apparatus and image acquisition system
TWI306983B (enrdf_load_stackoverflow)
JP7138967B2 (ja) 内視鏡カメラ装置
KR101383694B1 (ko) 방열형 라인스캔카메라
JP2017090576A (ja) 観察装置、及び、観察方法
US7795589B2 (en) Infrared sensor and method of calibrating the same
Arik et al. Effect of chip and bonding defects on the junction temperatures of high-brightness light-emitting diodes
CN104580843B (zh) 快速获取硅片光致发光影像的Si‑CCD照相机及方法
US7956625B1 (en) Undoped silicon heat spreader window
CN101907820A (zh) Dmd散热结构及其应用的投影机
US11808938B2 (en) Apparatus for measuring optical characteristics of a test optical element under low-temperature environment
US11363172B1 (en) Camera enclosure for thermal management
KR102350550B1 (ko) 암시야 조명 장치
US20220107355A1 (en) Substrate testing apparatus
CN113448150A (zh) 投影光机
JP2024088560A (ja) 冷却装置、投射型表示装置、および撮像装置
CN115712221A (zh) 光机模块
JP2004357109A (ja) フィルムスキャナ
CN107146800A (zh) 一种图像传感器的封装设计
JP2013117634A (ja) 顕微鏡装置および顕微鏡システム

Legal Events

Date Code Title Description
AS Assignment

Owner name: CANON KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NISHIKAWARA, TOMOFUMI;TOKUDA, YUKIO;NAMBA, HISASHI;SIGNING DATES FROM 20120717 TO 20120719;REEL/FRAME:029360/0321

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION