US20130025827A1 - Cooling system for electronic device - Google Patents
Cooling system for electronic device Download PDFInfo
- Publication number
- US20130025827A1 US20130025827A1 US13/235,450 US201113235450A US2013025827A1 US 20130025827 A1 US20130025827 A1 US 20130025827A1 US 201113235450 A US201113235450 A US 201113235450A US 2013025827 A1 US2013025827 A1 US 2013025827A1
- Authority
- US
- United States
- Prior art keywords
- heat exchanger
- refrigerants
- refrigerant pipe
- cooling system
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
Definitions
- the present disclosure relates to cooling systems, and particularly, to a cooling system for an electronic device.
- Data centers are centralized computing facilities that include many servers, often arranged on server racks or shelves, and one rack or shelf with several servers can be considered a server system.
- server systems generate a lot of heat in the data centers, and a common method for dissipating the heat is to use air conditioners, which are very expensive. Therefore an energy-saving cooling system is needed.
- the FIGURE is a schematic block diagram of a cooling system of an electronic device, according to an exemplary embodiment.
- the cooling system includes a first heat exchanger 20 , a second heat exchanger 50 , a first refrigerant pipe 30 , a second refrigerant pipe 40 , and a pump 31 .
- the first and second refrigerant pipes 30 and 40 receive refrigerants, which can circulate in the first and second heat exchangers 20 and 50 .
- the electronic device 10 may be a container data center, which can generate a lot of heat.
- the first heat exchanger 20 is arranged in the electronic device 10 for cooling the electronic device 10 .
- the second heat exchanger 50 is used for cooling the refrigerants flowing through the second heat exchanger 50 by gasifying the liquefied gas 51 .
- the first refrigerant pipe 30 is connected between the first heat exchanger 20 and the second heat exchanger 50 , for transferring the refrigerants cooled by the second heat exchanger 50 to the first heat exchanger 20 , to cool the first heat exchanger 20 .
- the second refrigerant pipe 40 is connected between the first heat exchanger 20 and the second heat exchanger 50 , for transferring the refrigerants heated by the first heat exchanger 20 to the second heat exchanger 50 .
- the pump 31 is arranged between the first refrigerant pipe 30 and the second heat exchanger 50 , for circulating the refrigerants.
- the pump 31 is used for transferring the refrigerants cooled by the second heat exchanger 50 to the first refrigerant pipe 30 .
- the pump 31 can be arranged between the second refrigerant pipe 40 and the second heat exchanger 50 .
- the liquefied gas 51 is liquefied natural gas (LNG). Commonly, LNG is heated to a gaseous state for convenient use. In another embodiment, the liquefied gas 51 may be liquid nitrogen (LN).
- the second heat exchanger 50 receives heat medium, which is used for cooling the refrigerants flowing through the second heat exchanger 50 .
- the liquefied gas 51 flows into the second heat exchanger 50 through a gas inlet 52 .
- the liquefied gas 51 cools the heat medium, and then is exhausted through a gas outlet 53 .
- the heat medium is antifreeze composed of at least one of alcohol, glycol, propylene glycol, and glycerol.
- the cooling system cools the electronic device 10 by gasifying the liquefied gas 51 .
- the liquefied gas 51 is gasified by the heat of the electronic device 10 , which saves energy.
Abstract
A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The second heat exchanger is used for cooling the refrigerants by gasifying liquefied gas. The pump is used for circulating the refrigerants.
Description
- 1. Technical Field
- The present disclosure relates to cooling systems, and particularly, to a cooling system for an electronic device.
- 2. Description of Related Art
- With increasing heavy use of on-line applications, the need for computer data centers has increased rapidly. Data centers are centralized computing facilities that include many servers, often arranged on server racks or shelves, and one rack or shelf with several servers can be considered a server system. During operation, server systems generate a lot of heat in the data centers, and a common method for dissipating the heat is to use air conditioners, which are very expensive. Therefore an energy-saving cooling system is needed.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
- The FIGURE is a schematic block diagram of a cooling system of an electronic device, according to an exemplary embodiment.
- The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to the FIGURE, an embodiment of a cooling system is provided for cooling an
electronic device 10. The cooling system includes afirst heat exchanger 20, asecond heat exchanger 50, afirst refrigerant pipe 30, asecond refrigerant pipe 40, and apump 31. The first andsecond refrigerant pipes second heat exchangers - The
electronic device 10 may be a container data center, which can generate a lot of heat. - The
first heat exchanger 20 is arranged in theelectronic device 10 for cooling theelectronic device 10. - The
second heat exchanger 50 is used for cooling the refrigerants flowing through thesecond heat exchanger 50 by gasifying the liquefiedgas 51. - The
first refrigerant pipe 30 is connected between thefirst heat exchanger 20 and thesecond heat exchanger 50, for transferring the refrigerants cooled by thesecond heat exchanger 50 to thefirst heat exchanger 20, to cool thefirst heat exchanger 20. - The
second refrigerant pipe 40 is connected between thefirst heat exchanger 20 and thesecond heat exchanger 50, for transferring the refrigerants heated by thefirst heat exchanger 20 to thesecond heat exchanger 50. - The
pump 31 is arranged between thefirst refrigerant pipe 30 and thesecond heat exchanger 50, for circulating the refrigerants. In this embodiment, thepump 31 is used for transferring the refrigerants cooled by thesecond heat exchanger 50 to thefirst refrigerant pipe 30. In another embodiment, thepump 31 can be arranged between thesecond refrigerant pipe 40 and thesecond heat exchanger 50. - In this embodiment, the
liquefied gas 51 is liquefied natural gas (LNG). Commonly, LNG is heated to a gaseous state for convenient use. In another embodiment, theliquefied gas 51 may be liquid nitrogen (LN). - The
second heat exchanger 50 receives heat medium, which is used for cooling the refrigerants flowing through thesecond heat exchanger 50. The liquefiedgas 51 flows into thesecond heat exchanger 50 through agas inlet 52. The liquefiedgas 51 cools the heat medium, and then is exhausted through agas outlet 53. In this embodiment, the heat medium is antifreeze composed of at least one of alcohol, glycol, propylene glycol, and glycerol. - In this embodiment, the cooling system cools the
electronic device 10 by gasifying the liquefiedgas 51. In other words, theliquefied gas 51 is gasified by the heat of theelectronic device 10, which saves energy. - Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (5)
1. A cooling system for an electronic device, comprising:
a first heat exchanger for cooling the electronic device;
a second heat exchanger;
a pump connected to the second heat exchanger;
a first refrigerant pipe connected between the first heat exchanger and the pump; and
a second refrigerant pipe connected between the first heat exchanger and the second heat exchanger;
wherein the first heat exchanger, the second refrigerant pipe, the second heat exchanger, the pump, and the first refrigerant pipe together form a circulatory system for receiving refrigerants;
wherein the first refrigerant pipe is used for transferring refrigerants cooled by the second heat exchanger into the first heat exchanger, to cool the first heat exchanger;
wherein the second refrigerant pipe is used for transferring refrigerants heated by the first heat exchanger into the second heat exchanger;
wherein the pump is used for circulating refrigerants; and
wherein the second heat exchanger is used for cooling the refrigerants flowing through the second heat exchanger through gasification of liquefied gas.
2. The cooling system of claim 1 , wherein the liquefied gas is liquefied natural gas.
3. The cooling system of claim 1 , wherein the liquefied gas is liquid nitrogen.
4. The cooling system of claim 1 , wherein the second heat exchanger receives heat medium for transferring heat of the heated refrigerants to the liquefied gas.
5. The cooling system of claim 4 , wherein the heat medium is antifreeze.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100126691A TW201306454A (en) | 2011-07-27 | 2011-07-27 | Cooling system for electronic device |
TW100126691 | 2011-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130025827A1 true US20130025827A1 (en) | 2013-01-31 |
Family
ID=47596268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/235,450 Abandoned US20130025827A1 (en) | 2011-07-27 | 2011-09-18 | Cooling system for electronic device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20130025827A1 (en) |
TW (1) | TW201306454A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180027695A1 (en) * | 2016-07-25 | 2018-01-25 | Fujitsu Limited | Liquid cooling device, liquid cooling system, and control method of liquid cooling device |
US10936029B2 (en) | 2018-03-06 | 2021-03-02 | Acer Incorporated | Method for cooling a heat source by liquefied gas |
US11116112B2 (en) * | 2017-08-23 | 2021-09-07 | Keppel Offshore & Marine Technology Centre Pte Ltd | Cold energy recovery apparatus for a self-powered data centre |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110297530B (en) * | 2018-03-23 | 2022-08-30 | 宏碁股份有限公司 | Cooling method using liquefied gas |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3986340A (en) * | 1975-03-10 | 1976-10-19 | Bivins Jr Henry W | Method and apparatus for providing superheated gaseous fluid from a low temperature liquid supply |
US5660047A (en) * | 1995-09-15 | 1997-08-26 | American Air Liquide, Inc. | Refrigeration system and method for cooling a susceptor using a refrigeration system |
US20090077981A1 (en) * | 2007-09-21 | 2009-03-26 | Raytheon Company | Topping Cycle for a Sub-Ambient Cooling System |
-
2011
- 2011-07-27 TW TW100126691A patent/TW201306454A/en unknown
- 2011-09-18 US US13/235,450 patent/US20130025827A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3986340A (en) * | 1975-03-10 | 1976-10-19 | Bivins Jr Henry W | Method and apparatus for providing superheated gaseous fluid from a low temperature liquid supply |
US5660047A (en) * | 1995-09-15 | 1997-08-26 | American Air Liquide, Inc. | Refrigeration system and method for cooling a susceptor using a refrigeration system |
US20090077981A1 (en) * | 2007-09-21 | 2009-03-26 | Raytheon Company | Topping Cycle for a Sub-Ambient Cooling System |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180027695A1 (en) * | 2016-07-25 | 2018-01-25 | Fujitsu Limited | Liquid cooling device, liquid cooling system, and control method of liquid cooling device |
US10743438B2 (en) * | 2016-07-25 | 2020-08-11 | Fujitsu Limited | Liquid cooling device, liquid cooling system, and control method of liquid cooling device |
US11116112B2 (en) * | 2017-08-23 | 2021-09-07 | Keppel Offshore & Marine Technology Centre Pte Ltd | Cold energy recovery apparatus for a self-powered data centre |
US10936029B2 (en) | 2018-03-06 | 2021-03-02 | Acer Incorporated | Method for cooling a heat source by liquefied gas |
Also Published As
Publication number | Publication date |
---|---|
TW201306454A (en) | 2013-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SU, TSUNG-HAN;CHEN, CHUN-MING;REEL/FRAME:026923/0686 Effective date: 20110916 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |