US20130008626A1 - Heat dissipating apparatus for data storage device - Google Patents

Heat dissipating apparatus for data storage device Download PDF

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Publication number
US20130008626A1
US20130008626A1 US13/411,910 US201213411910A US2013008626A1 US 20130008626 A1 US20130008626 A1 US 20130008626A1 US 201213411910 A US201213411910 A US 201213411910A US 2013008626 A1 US2013008626 A1 US 2013008626A1
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US
United States
Prior art keywords
heat dissipating
panel
data storage
mounting bracket
dissipating panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/411,910
Inventor
Chih-Hang Chao
Wei-Cheng Cheng
Chih-Hsiang Chiang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAO, CHIH-HANG, CHENG, Wei-cheng, CHIANG, CHIH-HSIANG
Publication of US20130008626A1 publication Critical patent/US20130008626A1/en
Abandoned legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406Reducing the influence of the temperature
    • G11B33/1426Reducing the influence of the temperature by cooling plates, e.g. fins
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/187Mounting of fixed and removable disk drives

Definitions

  • the present disclosure relates to heat dissipating apparatuses for data storage devices, and particularly to a heat dissipating apparatus for a data storage device.
  • data storage devices such as hard disk drives, floppy disk drives, and optical drives are secured to and stacked in a mounting bracket of a computer enclosure.
  • the storage devices can generate a large amount of heat after being on for awhile. The heat can linger in the mounting bracket because of gaps between storage devices being too narrow.
  • FIG. 1 is an exploded, isometric view of an embodiment of a heat dissipating apparatus and two data storage devices.
  • FIG. 2 is an assemble view of the heat dissipating apparatus of FIG. 1 .
  • FIG. 3 is a cross-sectional view of the heat dissipating apparatus of FIG. 2 , taken along the line III-III.
  • FIG. 4 is an assembled view of the heat dissipating apparatus and the two data storage devices of FIG. 1 .
  • a heat dissipating apparatus in accordance with an embodiment comprises a mounting bracket 10 and a dissipating structure 30 .
  • the heat dissipating apparatus is configured for dissipating heat from two data storage devices 50 .
  • the data storage devices 50 may be any two of hard disk drives, floppy disk drives, and compact disc-read only memory drives.
  • the bracket 10 comprises two side plates 11 , a top plate 13 , and a rear plate 14 connected to the two side plates 11 .
  • the top plate 13 is substantially parallel to the rear plate 14
  • the top plate 13 and the rear plate 14 are substantially perpendicular to the two side plates 11 .
  • each of the two side plates 11 , the top plate 13 , and the rear plate 14 are substantially rectangular.
  • the dissipating structure 30 comprises a heat first dissipating panel 31 , a second heat dissipating panel 33 , and a plurality of heat dissipating pieces 35 located between the first heat dissipating panel 31 and the second heat dissipating panel 33 .
  • each of the heat dissipating pieces 35 is substantially perpendicular to the first heat dissipating panel 31 and the second heat dissipating panel 33 , the first heat dissipating panel 31 is substantially parallel to the second heat dissipating panel 33 , the first heat dissipating panel 31 , the second heat dissipating panel 33 and each of the heat dissipating pieces 35 are substantially rectangular.
  • the dissipating structure 30 is configured to be secured to the mounting bracket 10 by welding or some other known means.
  • the mounting bracket 10 is divided into two receiving portions 111 by the dissipating structure 30 .
  • Each of the receiving portions 111 is configured for receiving each of the data storage devices 50 .
  • Each of the side plates 11 defines two securing holes 113 .
  • each of the first heat dissipating panel 31 and the second heat dissipating panel 33 is substantially perpendicular to the side plates 11 , and each of the heat dissipating pieces 35 is parallel to the side plates 11 .
  • Each data storage device 50 comprises two first sidewalls 51 , two second sidewalls 53 , a top wall 55 , and a rear wall (not shown) opposite to the top wall 55 .
  • Each of the second sidewalls 53 is connected to each of the first sidewalls 51 , and each of the second sidewalls 53 is substantially perpendicular to the first sidewalls 51 .
  • Each of the first sidewalls 51 defines two screw holes 511 corresponding to the two securing holes 113 of the each data storage device 50 .
  • the data storage devices 50 are inserted into the corresponding receiving portions 111 , until the screw holes 511 align with the securing holes 113 .
  • the top wall 55 of first data storage device 50 abuts the top plate 13
  • the rear wall of the first data storage device 50 abuts the first heat dissipating panel 31 .
  • the top wall 55 of a second data storage device 50 abuts the second heat dissipating panel 33
  • the rear wall of the second data storage device 50 abuts the rear plate 14 .
  • Fasteners 57 such as screws, are engaged in the securing holes 113 and the corresponding screw holes 511 , thereby, the data storage devices 50 are secured to the mounting bracket 10 .
  • the heat generated from the data storage devices 50 is delivered to the dissipating structure 30 , and can be dissipated by the first heat dissipating panel 31 , the second heat dissipating panel 33 and the heat dissipating pieces 35 .
  • the heat generated from the data storage devices 50 can be dissipated effectively out of the mounting bracket 10 .

Abstract

A heat dissipating apparatus for a data storage device includes a mounting bracket, and a dissipating structure. The mounting bracket is configured for securing the data storage device. The dissipating structure includes a first heat dissipating panel, a second heat dissipating panel, and a plurality of heat dissipating pieces located between the first heat dissipating panel and the second heat dissipating panel. Each of the first heat dissipating panel and the second heat dissipating panel is secured to the mounting bracket. The data storage device abuts the first heat dissipating panel or the second heat dissipating panel.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to heat dissipating apparatuses for data storage devices, and particularly to a heat dissipating apparatus for a data storage device.
  • 2. Description of Related Art
  • In many computers, data storage devices, such as hard disk drives, floppy disk drives, and optical drives are secured to and stacked in a mounting bracket of a computer enclosure. The storage devices can generate a large amount of heat after being on for awhile. The heat can linger in the mounting bracket because of gaps between storage devices being too narrow.
  • Therefore, there is room for improvement within the art.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of an embodiment of a heat dissipating apparatus and two data storage devices.
  • FIG. 2 is an assemble view of the heat dissipating apparatus of FIG. 1.
  • FIG. 3 is a cross-sectional view of the heat dissipating apparatus of FIG. 2, taken along the line III-III.
  • FIG. 4 is an assembled view of the heat dissipating apparatus and the two data storage devices of FIG. 1.
  • DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • Referring to FIG. 1, a heat dissipating apparatus in accordance with an embodiment comprises a mounting bracket 10 and a dissipating structure 30. The heat dissipating apparatus is configured for dissipating heat from two data storage devices 50. In one embodiment, the data storage devices 50 may be any two of hard disk drives, floppy disk drives, and compact disc-read only memory drives.
  • Referring to FIG. 1, the bracket 10 comprises two side plates 11, a top plate 13, and a rear plate 14 connected to the two side plates 11. In one embodiment, the top plate 13 is substantially parallel to the rear plate 14, and the top plate 13 and the rear plate 14 are substantially perpendicular to the two side plates 11. In the embodiment, each of the two side plates 11, the top plate 13, and the rear plate 14 are substantially rectangular.
  • Referring to FIGS. 1-3, the dissipating structure 30 comprises a heat first dissipating panel 31, a second heat dissipating panel 33, and a plurality of heat dissipating pieces 35 located between the first heat dissipating panel 31 and the second heat dissipating panel 33. In one embodiment, each of the heat dissipating pieces 35 is substantially perpendicular to the first heat dissipating panel 31 and the second heat dissipating panel 33, the first heat dissipating panel 31 is substantially parallel to the second heat dissipating panel 33, the first heat dissipating panel 31, the second heat dissipating panel 33 and each of the heat dissipating pieces 35 are substantially rectangular.
  • The dissipating structure 30 is configured to be secured to the mounting bracket 10 by welding or some other known means. The mounting bracket 10 is divided into two receiving portions 111 by the dissipating structure 30. Each of the receiving portions 111 is configured for receiving each of the data storage devices 50. Each of the side plates 11 defines two securing holes 113. In one embodiment, each of the first heat dissipating panel 31 and the second heat dissipating panel 33 is substantially perpendicular to the side plates 11, and each of the heat dissipating pieces 35 is parallel to the side plates 11.
  • Each data storage device 50 comprises two first sidewalls 51, two second sidewalls 53, a top wall 55, and a rear wall (not shown) opposite to the top wall 55. Each of the second sidewalls 53 is connected to each of the first sidewalls 51, and each of the second sidewalls 53 is substantially perpendicular to the first sidewalls 51. Each of the first sidewalls 51 defines two screw holes 511 corresponding to the two securing holes 113 of the each data storage device 50.
  • Referring to FIG. 4, in assembly, the data storage devices 50 are inserted into the corresponding receiving portions 111, until the screw holes 511 align with the securing holes 113. The top wall 55 of first data storage device 50 abuts the top plate 13, and the rear wall of the first data storage device 50 abuts the first heat dissipating panel 31. The top wall 55 of a second data storage device 50 abuts the second heat dissipating panel 33, and the rear wall of the second data storage device 50 abuts the rear plate 14. Fasteners 57, such as screws, are engaged in the securing holes 113 and the corresponding screw holes 511, thereby, the data storage devices 50 are secured to the mounting bracket 10.
  • In use, the heat generated from the data storage devices 50 is delivered to the dissipating structure 30, and can be dissipated by the first heat dissipating panel 31, the second heat dissipating panel 33 and the heat dissipating pieces 35. Thus, the heat generated from the data storage devices 50 can be dissipated effectively out of the mounting bracket 10.
  • It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (14)

1. A heat dissipating apparatus for two data storage devices comprising:
a mounting bracket;
a dissipating structure, the dissipating structure comprising a first heat dissipating panel, a second heat dissipating panel and a plurality of heat dissipating pieces located between the first heat dissipating panel and the second heat dissipating panel, and the first heat dissipating panel and the second heat dissipating panel connected to the mounting bracket;
wherein the mounting bracket is configured to receive the two data storage device such that each of the two data storage devices abuts each of the first heat dissipating panel and the second heat dissipating panel.
2. The heat dissipating apparatus of claim 1, wherein the mounting bracket is divided into two receiving portions by the dissipating structure, and each of the two receiving portions is configured to receive in each of the two data storage devices.
3. The heat dissipating apparatus of claim 1, wherein each of the plurality of heat dissipating pieces is substantially perpendicular to each of the first heat dissipating panel and the second heat dissipating panel.
4. The heat dissipating apparatus of claim 3, wherein the first heat dissipating panel is substantially paralleled to the second heat dissipating panel.
5. The heat dissipating apparatus of claim 4, wherein each of the first heat dissipating panel and the second heat dissipating panel is substantially rectangular.
6. The heat dissipating apparatus of claim 1, wherein the mounting bracket comprises two side plates, each of the first heat dissipating panel and the second heat dissipating panel is substantially perpendicular to the two side plates.
7. The heat dissipating apparatus of claim 6, wherein each of the plurality of heat dissipating pieces is substantially parallel to each of the two side plates.
8. The heat dissipating apparatus of claim 1, wherein each of the plurality of heat dissipating pieces is substantially rectangular.
9. A heat dissipating apparatus comprising:
a mounting bracket;
a dissipating structure located in the mounting bracket and dividing the mounting bracket into two receiving portions, each of the two receiving portions configured for receiving each of two data storage devices, the dissipating structure comprising a first heat dissipating panel, a second heat dissipating panel and a plurality of heat dissipating pieces located between the first heat dissipating panel and the second heat dissipating panel, the first heat dissipating panel and the second heat dissipating panel secured to the mounting bracket.
10. The heat dissipating apparatus of claim 9, wherein each of the plurality of heat dissipating pieces is substantially perpendicular to each of the first heat dissipating panel and the second heat dissipating panel.
11. The heat dissipating apparatus of claim 9, wherein the first heat dissipating panel is substantially paralleled with the second heat dissipating panel.
12. The heat dissipating apparatus of claim 9, wherein each of the first heat dissipating panel and the second heat dissipating panel is substantially rectangular.
13. The heat dissipating apparatus of claim 9, wherein the mounting bracket comprises two side plates, each of the first heat dissipating panel and the second heat dissipating panel is substantially perpendicular to the two side plates.
14. The heat dissipating apparatus of claim 13, wherein each of the plurality of heat dissipating pieces is substantially parallel to each of the two side plates.
US13/411,910 2011-07-07 2012-03-05 Heat dissipating apparatus for data storage device Abandoned US20130008626A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100123993 2011-07-07
TW100123993A TW201304669A (en) 2011-07-07 2011-07-07 Heat dissipating apparatus for storage

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200174533A1 (en) * 2017-03-17 2020-06-04 Intel Corporation Solid state memory case with enhanced cooling
US20220248569A1 (en) * 2019-09-20 2022-08-04 Samsung Electronics Co., Ltd. Solid state drive apparatus and data storage apparatus including the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424916A (en) * 1989-07-28 1995-06-13 The Charles Stark Draper Laboratory, Inc. Combination conductive and convective heatsink
US7099153B2 (en) * 2002-10-10 2006-08-29 Sony Computer Entertainment Inc. Heat dissipating structure for an electronic device
US7443669B2 (en) * 2006-12-26 2008-10-28 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device for data storage device
US7742298B2 (en) * 2007-09-07 2010-06-22 Digital-Logic Ag Passively cooled computer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424916A (en) * 1989-07-28 1995-06-13 The Charles Stark Draper Laboratory, Inc. Combination conductive and convective heatsink
US7099153B2 (en) * 2002-10-10 2006-08-29 Sony Computer Entertainment Inc. Heat dissipating structure for an electronic device
US7443669B2 (en) * 2006-12-26 2008-10-28 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device for data storage device
US7742298B2 (en) * 2007-09-07 2010-06-22 Digital-Logic Ag Passively cooled computer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200174533A1 (en) * 2017-03-17 2020-06-04 Intel Corporation Solid state memory case with enhanced cooling
US10937464B2 (en) * 2017-03-17 2021-03-02 Intel Corporation Solid state memory case with enhanced cooling
US20220248569A1 (en) * 2019-09-20 2022-08-04 Samsung Electronics Co., Ltd. Solid state drive apparatus and data storage apparatus including the same
US11800686B2 (en) * 2019-09-20 2023-10-24 Samsung Electronics Co., Ltd. Solid state drive apparatus and data storage apparatus including the same

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHAO, CHIH-HANG;CHENG, WEI-CHENG;CHIANG, CHIH-HSIANG;REEL/FRAME:027804/0883

Effective date: 20120302

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION