US20120183678A1 - Blackened electromagnetic interference shield glass and method of producing the same - Google Patents
Blackened electromagnetic interference shield glass and method of producing the same Download PDFInfo
- Publication number
- US20120183678A1 US20120183678A1 US13/436,333 US201213436333A US2012183678A1 US 20120183678 A1 US20120183678 A1 US 20120183678A1 US 201213436333 A US201213436333 A US 201213436333A US 2012183678 A1 US2012183678 A1 US 2012183678A1
- Authority
- US
- United States
- Prior art keywords
- glass
- electromagnetic interference
- interference shield
- producing
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/44—Optical arrangements or shielding arrangements, e.g. filters, black matrices, light reflecting means or electromagnetic shielding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Definitions
- the present invention relates to a method of producing an electromagnetic interference shield glass wherein low specific resistance is maintained in order to sufficiently show an electromagnetic interference shield function and contrast of a display device is not affected due to blackening treatment, and an electromagnetic interference shield glass that is produced by using the same.
- a mesh pattern that is made of a copper material is manufactured by using a photo-lithography process.
- the photolithography process is complicated and the cost of the raw material is high, the production cost is high and is most costly in respects to raw material of the PDP filter.
- FPD Full Panel Display
- the use of the conductive paste comprising the metal powder has been developed.
- the conductive pattern is printed by using conductive paste according to the offset printing process, light from the PDP and external light is reflected due to a gloss of metal, which negatively affects contrast. Therefore, there is a need to perform the blackening treatment of the conductive pattern.
- the present invention provides a method of producing an electromagnetic interference shield glass in which an interface between a conductive pattern and a glass substrate is blackened through a firing process to fix the conductive pattern without a separate blackening treatment and an increase in surface resistance.
- a film type of electromagnetic interference shield unit is not used and a electromagnetic interference shield unit is directly formed on a surface of glass, so as to simplify a structure or a production process.
- a firing process is sufficiently performed while a firing temperature is freely controlled without the limit of the firing temperature.
- a blackened electromagnetic interference shield glass that comprises the electromagnetic interference shield unit having the optimum conductivity, and a method of producing the same.
- an electromagnetic interference shield glass and a method of producing the same, in which an interface between a printed conductive pattern and a glass substrate is blackened without an increase in surface resistance to avoid a problem of contrast caused by a luster of metal.
- the present invention provides a method of producing a blackened electromagnetic interference shield glass, which comprises (a) forming a conductive pattern on at least one side of a front side and a rear side of glass by using a conductive paste, and (b) firing the glass on which the conductive pattern is formed.
- the type of conductive paste is not limited, but the conductive paste may comprise one or more metal powders selected from the group consisting of copper, silver, gold, and aluminum, an organic binder resin solution in which a polymer binder is dissolved in an organic solvent, and a glass frit that is used to improve an adhesion strength between a paste and a glass substrate.
- the conductive paste that comprises a silver (Ag) component having excellent electric conductivity and low specific resistance as a metal component and the colored glass frit for blackening treatment.
- the conductive paste comprise 70 to 90 wt % of metal powder, 0.1 to 15 wt % of colored glass frit, and 5 to 30 wt % of organic binder resin solution (it means the solution in which the polymer binder is dissolved in the organic solvent, and the amount of the polymer binder is in the range of 3 to 20 wt % of the total weight of the organic solvent and the polymer binder).
- the conductive paste may be prepared, for example, by adding the colored glass frit, and the metal powder after the polymer binder is dissolved in the organic solvent to prepare the organic binder resin solution, kneading them, and uniformly dispersing the agglomerated metal powder and glass frit by using a three-stage roll mill.
- the organic solvent be selected from the group consisting of butyl carbitol acetate, carbitol acetate, cyclohexanone, cellosolve acetate, terpineol, and diethylene glycol monobutyl ether.
- the polymer binder functions to maintain the shape of the conductive pattern when the conductive pattern is formed by using the conductive paste, and a cellulose resin, an acryl resin, a vinyl resin and the like may be used.
- the glass frit that is uniformly added to the paste is melted at a predetermined temperature or more to move toward the glass substrate and be fused, thus improving the adhesion strength between the conductive paste and the glass substrate.
- the temperature is less than 400° C.
- the metal powder that is contained in the conductive paste for example, the silver component
- the temperature is more than 700° C.
- a distortion point is formed according to the bending or the surface unevenness of the glass. Thus, it is difficult to use the paste for displays.
- the glass substrate on which the conductive pattern is formed is fired at preferably in the range of 500 to 700° C. so as to satisfy the condition of the tempered glass.
- the firing time may be reduced as the firing temperature is increased, and in the range of about 3 to 30 min and preferably in the range of about 3 to 10 min in consideration of the productivity.
- the conductive pattern is formed by using the conductive paste comprising the metal component
- light on the PDP module or external light is reflected due to a gloss of metal, which negatively affects the contrast.
- it is required to perform the blackening treatment.
- a printing process may be performed wherein carbon black or the black dye is added to the conductive paste to make the paste black.
- the specific resistance of the carbon black is high as compared to silver, and the black dye is non-conductive. Accordingly, the carbon black or the dye acts as an impurity in the paste, thus causing an increase in surface resistance of the final product and problems in performance of the electromagnetic interference shield.
- the conductive paste that comprises the colored glass frit is produced, printed on the glass substrate to form the conductive pattern, and fired at a high temperature to blacken the interface between the conductive pattern and the glass substrate without an increase in surface resistance.
- the coloring component is not limited to the black color, and any color comprising an achromatic color such as a gray color or a brown color may be used as long as the color can cause the blackening effect while the color does not provide the sense of unwelcome to human.
- the coloring component such as MnO 2 , Fe 2 O 3 , NiO, CoO, CuO and the like is colored on the typical glass frit.
- the glass frit is fluidized and thus moved toward the surface of the glass substrate due to the gravity.
- the coloring component may be moved in conjunction with the fluidized glass fit toward the surface of the glass substrate to make the interface between the conductive paste and the glass substrate black.
- the coloring component is not uniformly distributed in the conductive paste, an increase in the surface resistance doe not occur.
- the conductive pattern may be formed by using a printing process.
- a process of printing the conductive pattern on the surface of the glass may be selected from the group consisting of an offset printing process, a screen printing process, a gravure printing process, and an inkjet printing process, but is not limited thereto. Any printing process that is known in the art may be used as long as the printing can be directly performed on the surface of the glass.
- the offset printing process comprises filling a concave part of a flat plate that comprises concave and convex parts with the conductive paste; bringing the flat plate into contact with a printing blanket to transfer the conductive paste from the concave part of the flat plate to the printing blanket; and bringing the printing blanket into contact with a surface of a glass to transfer the conductive paste from the printing blanket to the surface of the glass to form the electromagnetic interference shield unit having the conductive pattern.
- the conductive paste may be transferred onto the surface of the glass by using the convex part instead of the concave part according to a typical offset printing process.
- an electromagnetic interference shield glass that comprises a glass, and a conductive pattern that is formed on at least one side of a front side and a rear side of the glass and comprises a colored glass frit.
- An interface between the conductive pattern and the glass substrate is blackened by firing the glass on which the conductive pattern is formed.
- Still another embodiment of the present invention provides a PDP filter that comprises the electromagnetic interference shield glass, and at least one film that is selected from the group consisting of an anti-reflection film, a near infrared ray shielding film, and a color correction film.
- a further embodiment of the present invention provides a PDP device that comprises the PDP filter.
- Ethyl cellulose that was the polymer binder was dissolved in butyl carbitol acetate so that the total weight of ethyl cellulose and butyl carbitol acetate was 10 wt % to prepare an organic binder resin solution.
- the weight of the organic binder resin solution was 20 wt % based on the total weight of the paste.
- the colored glass frit that had the basic composition of Bi 2 O 3 —ZnO—B 2 O 3 and comprised CoO as the coloring component was added to the organic binder resin solution in an amount of 5 wt % based on the total weight of the paste, the silver powder was added to the organic binder resin solution in an amount of 75 wt % based on the total weight of the paste, and the kneading was performed. Next, the agglomerated silver powder and glass fit were uniformly dispersed by using a three-stage roll mill, and it was confirmed that the paste dispersed by using the roll mill had the shape. Subsequently, the resulting paste was recovered.
- the silver paste that was prepared by using the above method was applied on the glass substrate by using the engraving offset printing process to form the conductive pattern, fired at 600° C. for 10 min, and cooled to normal temperature to produce the electromagnetic interference shield glass having the blackened conductive pattern.
- the surface resistance and the blackening degree were evaluated.
- the surface resistance was obtained by using MCP-T600 manufactured by Mitsubishi Chemical, Co., Ltd.
- the blackening degree L was obtained by calculating the L value from the reflectivity after the reflectivity of the conductive pattern was measured by using UV-3600 manufactured by Shimadzu, Corp., and the results are described in Table 1.
- the conductive paste was prepared by using the same process as Example, except that the black glass frit was not added but the typical glass frit having the basic composition of Bi 2 O 3 —ZnO—B 2 O 3 was added during the preparation of the conductive paste.
- the conductive pattern was formed on the surface of the glass by using the prepared conductive paste according to the same printing process as that of Example, and then fired. Then, the blackening degree and the surface resistance were measured by using the same method as Example.
- the conductive paste was prepared by using the same process as Example, except that the black glass frit was not added but the typical glass frit having the basic composition of Bi 2 O 3 —ZnO—B 2 O 3 and CoO as the black pigment were added during the preparation of the conductive paste.
- the content of the organic binder resin solution was 15 wt %
- the content of the glass frit was 5 wt %
- the content of CoO was 5 wt %
- the content of the silver powder was 75 wt %.
- the conductive pattern was formed on the surface of the glass by using the prepared conductive paste according to the same printing process as that of Example, and then fired. Then, the blackening degree and the surface resistance were measured by using the same method as Example.
- the surface resistance was 0.1 Q/ ⁇
- the blackening degree L was 29.0 (the lower the blackening degree L is, the more black the glass is). That is, in the case of the electromagnetic interference shield glass that was produced in Comparative Example 1, since the conductive pasts having the different glass frits were used, the surface resistance was 0.1 Q/ ⁇ which was not changed. However, it could be seen that the blackening degree L was increased by about 2 times as compared to Example. In addition, in the case of when the blackening treatment was performed by using the black pigment of Comparative Example 2, the blackening degree L was similar to that of Example.
- the blackening degree is significantly increased without an increase in the surface resistance.
Abstract
Method of producing an electromagnetic interference shield glass, which comprises (a) forming a conductive pattern on at least one side of a front side and a rear side of the glass by using a conductive paste comprising a colored glass frit, and (b) firing the conductive pattern to blacken the conductive pattern, and a blackened electromagnetic interference shield glass.
Description
- The present invention relates to a method of producing an electromagnetic interference shield glass wherein low specific resistance is maintained in order to sufficiently show an electromagnetic interference shield function and contrast of a display device is not affected due to blackening treatment, and an electromagnetic interference shield glass that is produced by using the same.
- This application claims priority from Korea Patent Application No. 10-2007-32871 filed on Apr. 3, 2007 in the KIPO, the disclosure of which is incorporated herein by reference in its entirety.
- In the related art, in order to shield the harmful electromagnetic wave from the PDP, a mesh pattern that is made of a copper material is manufactured by using a photo-lithography process. However, since the photolithography process is complicated and the cost of the raw material is high, the production cost is high and is most costly in respects to raw material of the PDP filter. However, since the competition of PDPs and LCDs is deepened in a FPD (Flat Panel Display) market, it is required to develop a low-priced raw material, and a technology has been developed to print a mesh pattern by using a conductive paste through a printing process such as a screen printing process, an offset printing process or the like.
- It is necessary to sufficiently reduce the specific resistance of the conductive paste that is used to perform the printing so that the characteristics of the electromagnetic interference shield film produced by using the printing process are sufficiently realized.
- In order to achieve this, the use of the conductive paste comprising the metal powder has been developed. However, when the conductive pattern is printed by using conductive paste according to the offset printing process, light from the PDP and external light is reflected due to a gloss of metal, which negatively affects contrast. Therefore, there is a need to perform the blackening treatment of the conductive pattern.
- It is an object of the present invention to provide a method of producing an electromagnetic interference shield glass, which can easily blacken a conductive pattern formed on a glass substrate by using a printing method, and a blackened electromagnetic interference shield glass.
- It is another object of the present invention to provide a PDP filter that is produced by additionally attaching an anti-reflection film, a near infrared ray shielding film, a color correction film or the like to a blackened electromagnetic interference shield glass, and a PDP device comprising the same.
- In order to accomplish the above objects, the present invention provides a method of producing an electromagnetic interference shield glass in which an interface between a conductive pattern and a glass substrate is blackened through a firing process to fix the conductive pattern without a separate blackening treatment and an increase in surface resistance.
- That is, a film type of electromagnetic interference shield unit is not used and a electromagnetic interference shield unit is directly formed on a surface of glass, so as to simplify a structure or a production process. In particular, a firing process is sufficiently performed while a firing temperature is freely controlled without the limit of the firing temperature. Thus, it is possible to provide a blackened electromagnetic interference shield glass that comprises the electromagnetic interference shield unit having the optimum conductivity, and a method of producing the same.
- According to the present invention, there is provided an electromagnetic interference shield glass and a method of producing the same, in which an interface between a printed conductive pattern and a glass substrate is blackened without an increase in surface resistance to avoid a problem of contrast caused by a luster of metal.
- In addition, since a blackening treatment is performed during a firing process to fix a conductive pattern on the glass substrate, a separate blackening process is unnecessary. Thus, an improvement in the productivity can be achieved through the simplification of the production process and the device of the electromagnetic interference shield glass.
- The present invention provides a method of producing a blackened electromagnetic interference shield glass, which comprises (a) forming a conductive pattern on at least one side of a front side and a rear side of glass by using a conductive paste, and (b) firing the glass on which the conductive pattern is formed.
- The type of conductive paste is not limited, but the conductive paste may comprise one or more metal powders selected from the group consisting of copper, silver, gold, and aluminum, an organic binder resin solution in which a polymer binder is dissolved in an organic solvent, and a glass frit that is used to improve an adhesion strength between a paste and a glass substrate. In particular, it is preferable to use the conductive paste that comprises a silver (Ag) component having excellent electric conductivity and low specific resistance as a metal component and the colored glass frit for blackening treatment.
- It is preferable that the conductive paste comprise 70 to 90 wt % of metal powder, 0.1 to 15 wt % of colored glass frit, and 5 to 30 wt % of organic binder resin solution (it means the solution in which the polymer binder is dissolved in the organic solvent, and the amount of the polymer binder is in the range of 3 to 20 wt % of the total weight of the organic solvent and the polymer binder).
- The conductive paste may be prepared, for example, by adding the colored glass frit, and the metal powder after the polymer binder is dissolved in the organic solvent to prepare the organic binder resin solution, kneading them, and uniformly dispersing the agglomerated metal powder and glass frit by using a three-stage roll mill.
- It is preferable that the organic solvent be selected from the group consisting of butyl carbitol acetate, carbitol acetate, cyclohexanone, cellosolve acetate, terpineol, and diethylene glycol monobutyl ether.
- The polymer binder functions to maintain the shape of the conductive pattern when the conductive pattern is formed by using the conductive paste, and a cellulose resin, an acryl resin, a vinyl resin and the like may be used.
- If the conductive pattern is formed on the glass substrate and then fired at the temperature in the range of 400 to 700° C., the glass frit that is uniformly added to the paste is melted at a predetermined temperature or more to move toward the glass substrate and be fused, thus improving the adhesion strength between the conductive paste and the glass substrate. In the case of when the temperature is less than 400° C., there is a problem in that the metal powder that is contained in the conductive paste, for example, the silver component, is melted to be fused on the glass substrate. In the case of when the temperature is more than 700° C., a distortion point is formed according to the bending or the surface unevenness of the glass. Thus, it is difficult to use the paste for displays.
- In addition, the glass substrate on which the conductive pattern is formed is fired at preferably in the range of 500 to 700° C. so as to satisfy the condition of the tempered glass.
- The firing time may be reduced as the firing temperature is increased, and in the range of about 3 to 30 min and preferably in the range of about 3 to 10 min in consideration of the productivity.
- When the conductive pattern is formed by using the conductive paste comprising the metal component, light on the PDP module or external light is reflected due to a gloss of metal, which negatively affects the contrast. Thus, in order to avoid this, it is required to perform the blackening treatment. A printing process may be performed wherein carbon black or the black dye is added to the conductive paste to make the paste black. However, the specific resistance of the carbon black is high as compared to silver, and the black dye is non-conductive. Accordingly, the carbon black or the dye acts as an impurity in the paste, thus causing an increase in surface resistance of the final product and problems in performance of the electromagnetic interference shield.
- According to the present invention, the conductive paste that comprises the colored glass frit is produced, printed on the glass substrate to form the conductive pattern, and fired at a high temperature to blacken the interface between the conductive pattern and the glass substrate without an increase in surface resistance.
- The coloring component is not limited to the black color, and any color comprising an achromatic color such as a gray color or a brown color may be used as long as the color can cause the blackening effect while the color does not provide the sense of unwelcome to human.
- In the colored glass frit, the coloring component such as MnO2, Fe2O3, NiO, CoO, CuO and the like is colored on the typical glass frit. In the case of when the conductive paste to which the colored glass frit is added is fired, the glass frit is fluidized and thus moved toward the surface of the glass substrate due to the gravity. In connection with this, the coloring component may be moved in conjunction with the fluidized glass fit toward the surface of the glass substrate to make the interface between the conductive paste and the glass substrate black. In addition, since the coloring component is not uniformly distributed in the conductive paste, an increase in the surface resistance doe not occur.
- In the above (a), the conductive pattern may be formed by using a printing process. A process of printing the conductive pattern on the surface of the glass may be selected from the group consisting of an offset printing process, a screen printing process, a gravure printing process, and an inkjet printing process, but is not limited thereto. Any printing process that is known in the art may be used as long as the printing can be directly performed on the surface of the glass.
- In connection with this, the offset printing process comprises filling a concave part of a flat plate that comprises concave and convex parts with the conductive paste; bringing the flat plate into contact with a printing blanket to transfer the conductive paste from the concave part of the flat plate to the printing blanket; and bringing the printing blanket into contact with a surface of a glass to transfer the conductive paste from the printing blanket to the surface of the glass to form the electromagnetic interference shield unit having the conductive pattern. In connection with this, the conductive paste may be transferred onto the surface of the glass by using the convex part instead of the concave part according to a typical offset printing process.
- Another embodiment of the present invention provides an electromagnetic interference shield glass that comprises a glass, and a conductive pattern that is formed on at least one side of a front side and a rear side of the glass and comprises a colored glass frit. An interface between the conductive pattern and the glass substrate is blackened by firing the glass on which the conductive pattern is formed.
- Still another embodiment of the present invention provides a PDP filter that comprises the electromagnetic interference shield glass, and at least one film that is selected from the group consisting of an anti-reflection film, a near infrared ray shielding film, and a color correction film.
- In addition, a further embodiment of the present invention provides a PDP device that comprises the PDP filter.
- A better understanding of the present invention may be obtained in light of the following Examples which are set forth to illustrate, but are not to be construed to limit the present invention.
- (1) Preparation of the Conductive Paste
- Ethyl cellulose that was the polymer binder was dissolved in butyl carbitol acetate so that the total weight of ethyl cellulose and butyl carbitol acetate was 10 wt % to prepare an organic binder resin solution. The weight of the organic binder resin solution was 20 wt % based on the total weight of the paste. The colored glass frit that had the basic composition of Bi2O3—ZnO—B2O3 and comprised CoO as the coloring component was added to the organic binder resin solution in an amount of 5 wt % based on the total weight of the paste, the silver powder was added to the organic binder resin solution in an amount of 75 wt % based on the total weight of the paste, and the kneading was performed. Next, the agglomerated silver powder and glass fit were uniformly dispersed by using a three-stage roll mill, and it was confirmed that the paste dispersed by using the roll mill had the shape. Subsequently, the resulting paste was recovered.
- (2) Printing and Firing of the Conductive Pattern
- The silver paste that was prepared by using the above method was applied on the glass substrate by using the engraving offset printing process to form the conductive pattern, fired at 600° C. for 10 min, and cooled to normal temperature to produce the electromagnetic interference shield glass having the blackened conductive pattern.
- (3) Evaluation of the Blackening Degree and the Surface Resistance
- In respects to the products that were produced in Example, the surface resistance and the blackening degree were evaluated. In respects to the surface resistance, the surface resistance was obtained by using MCP-T600 manufactured by Mitsubishi Chemical, Co., Ltd., the blackening degree L was obtained by calculating the L value from the reflectivity after the reflectivity of the conductive pattern was measured by using UV-3600 manufactured by Shimadzu, Corp., and the results are described in Table 1.
- The conductive paste was prepared by using the same process as Example, except that the black glass frit was not added but the typical glass frit having the basic composition of Bi2O3—ZnO—B2O3 was added during the preparation of the conductive paste.
- In addition, the conductive pattern was formed on the surface of the glass by using the prepared conductive paste according to the same printing process as that of Example, and then fired. Then, the blackening degree and the surface resistance were measured by using the same method as Example.
- The results are described in Table 1 in conjunction with the results of Example.
- The conductive paste was prepared by using the same process as Example, except that the black glass frit was not added but the typical glass frit having the basic composition of Bi2O3—ZnO—B2O3 and CoO as the black pigment were added during the preparation of the conductive paste. With respect to the ratio, the content of the organic binder resin solution was 15 wt %, the content of the glass frit was 5 wt %, the content of CoO was 5 wt %, and the content of the silver powder was 75 wt %.
- In addition, the conductive pattern was formed on the surface of the glass by using the prepared conductive paste according to the same printing process as that of Example, and then fired. Then, the blackening degree and the surface resistance were measured by using the same method as Example.
- The results are described in Table 1 in conjunction with the results of Example.
-
TABLE 1 Surface Blackening resistance (Ω/□) degree (L) Example 0.1 29.0 Comparative Example 1 0.1 51.0 Comparative Example 2 0.3 31.0 - As shown in Table 1, in the case of the electromagnetic interference shield glass according to the present invention, the surface resistance was 0.1 Q/□, and the blackening degree L was 29.0 (the lower the blackening degree L is, the more black the glass is). That is, in the case of the electromagnetic interference shield glass that was produced in Comparative Example 1, since the conductive pasts having the different glass frits were used, the surface resistance was 0.1 Q/□ which was not changed. However, it could be seen that the blackening degree L was increased by about 2 times as compared to Example. In addition, in the case of when the blackening treatment was performed by using the black pigment of Comparative Example 2, the blackening degree L was similar to that of Example. However, since the black pigment acted as the impurity, even though the weights of the powders of Example and Comparative Example were the same as each other in terms of wt %, it could be seen that the surface resistance was increased to 0.3 Q/□ by 3 times.
- Therefore, in the case of the electromagnetic interference shield glass that is subjected to the blackening treatment according to the present invention, it can be seen that the blackening degree is significantly increased without an increase in the surface resistance.
Claims (9)
1. A method of producing a blackened electromagnetic interference shield glass, which comprises:
(a) forming a conductive pattern on at least one side of a front side and a rear side of glass by using a conductive paste comprising a colored glass frit; and
(b) firing the glass on which the conductive pattern is formed.
2. The method of producing a blackened electromagnetic interference shield glass as set forth in claim 1 , wherein the conductive paste is prepared by dispersing a polymer binder, a colored glass frit and one or more metal powders selected from the group consisting of silver, copper, gold, and aluminum in an organic solvent.
3. The method of producing a blackened electromagnetic interference shield glass as set forth in claim 2 , wherein the organic solvent is selected from the group consisting of butyl carbitol acetate, carbitol acetate, cyclohexanone, cellosolve acetate, terpineol, and diethylene glycol monobutyl ether.
4. The method of producing a blackened electromagnetic interference shield glass as set forth in claim 2 , wherein the conductive paste comprises 70 to 90 wt % of metal powder, 0.1 to 15 wt % of colored glass frit, and 5 to 30 wt % of organic binder resin solution in which the polymer binder is dissolved in the organic solvent, and the amount of the polymer binder is in the range of 3 to 20 wt % of the total weight of the organic solvent and the polymer binder.
5. The method of producing a blackened electromagnetic interference shield glass as set forth in claim 1 , wherein in the (a), a conductive pattern is formed by using the printing process.
6. The method of producing a blackened electromagnetic interference shield glass as set forth in claim 5 , wherein the printing process is selected from the group consisting of an offset printing process, an inkjet printing process, and a screen printing process.
7. The method of producing a blackened electromagnetic interference shield glass as set forth in claim 6 , wherein the offset printing process comprises:
(a) filling a concave part of a flat plate that comprises concave and convex parts with the conductive paste;
(b) bringing the flat plate into contact with a printing blanket to transfer the conductive paste from the concave part of the flat plate to the printing blanket; and
(c) bringing the printing blanket into contact with a surface of a glass to transfer the conductive paste from the printing blanket to the surface of the glass to form the conductive pattern on the surface of the glass.
8. The method of producing a blackened electromagnetic interference shield glass as set forth in claim 1 , wherein the firing is performed at the temperature in the range of 400 to 700° C.
9-16. (canceled)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/436,333 US20120183678A1 (en) | 2007-04-03 | 2012-03-30 | Blackened electromagnetic interference shield glass and method of producing the same |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070032871A KR100863408B1 (en) | 2007-04-03 | 2007-04-03 | Emi shield glass with blackened conductive pattern and a method for preparation thereof |
KR2007-0032871 | 2007-04-03 | ||
PCT/KR2008/001853 WO2008120952A1 (en) | 2007-04-03 | 2008-04-02 | Blackened electromagnetic interference shield glass and method of producing the same |
US45050709A | 2009-09-29 | 2009-09-29 | |
US13/436,333 US20120183678A1 (en) | 2007-04-03 | 2012-03-30 | Blackened electromagnetic interference shield glass and method of producing the same |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2008/001853 Division WO2008120952A1 (en) | 2007-04-03 | 2008-04-02 | Blackened electromagnetic interference shield glass and method of producing the same |
US45050709A Division | 2007-04-03 | 2009-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120183678A1 true US20120183678A1 (en) | 2012-07-19 |
Family
ID=39808476
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/450,507 Active 2028-08-10 US8168300B2 (en) | 2007-04-03 | 2008-04-02 | Blackened electromagnetic interference shield glass and method of producing the same |
US13/436,333 Abandoned US20120183678A1 (en) | 2007-04-03 | 2012-03-30 | Blackened electromagnetic interference shield glass and method of producing the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/450,507 Active 2028-08-10 US8168300B2 (en) | 2007-04-03 | 2008-04-02 | Blackened electromagnetic interference shield glass and method of producing the same |
Country Status (6)
Country | Link |
---|---|
US (2) | US8168300B2 (en) |
EP (1) | EP2132970B1 (en) |
JP (1) | JP5061233B2 (en) |
KR (1) | KR100863408B1 (en) |
CN (1) | CN101653055B (en) |
WO (1) | WO2008120952A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101669175A (en) | 2007-05-10 | 2010-03-10 | Lg化学株式会社 | Emi shield glass with blackened conductive pattern and a method for preparation thereof |
KR101245278B1 (en) * | 2009-08-07 | 2013-03-19 | 주식회사 엘지화학 | Conductive substrate and method for manufacturing the same |
TWI431790B (en) * | 2011-09-01 | 2014-03-21 | Gintech Energy Corp | Solar energy cell |
US10031612B2 (en) * | 2013-10-09 | 2018-07-24 | Noritake Co., Limited | Capacitive touch switch panel |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5174925A (en) * | 1990-04-12 | 1992-12-29 | Matsushita Electric Industrial Co., Ltd. | Conductive ink composition and method of forming a conductive thick film pattern |
US6355187B1 (en) * | 1998-07-28 | 2002-03-12 | Murata Manufacturing Co., Ltd. | Conductive paste and glass circuit substrate |
US20020170730A1 (en) * | 2001-03-08 | 2002-11-21 | Sumitomo Chemical Company, Limited | Electromagnetic shielding plate and method for producing the same |
WO2006009051A1 (en) * | 2004-07-22 | 2006-01-26 | Toray Industries, Inc. | Photosensitive paste and method for producing member for display panel |
WO2006126499A1 (en) * | 2005-05-25 | 2006-11-30 | Sumitomo Electric Industries, Ltd. | Conductive paste and wiring board using it |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000040462A (en) * | 1998-07-23 | 2000-02-08 | Toray Ind Inc | Manufacture of display substrate |
JP2000260336A (en) | 1999-01-06 | 2000-09-22 | Toray Ind Inc | Substrate for display and its manufacture |
JP2002057490A (en) * | 2000-08-09 | 2002-02-22 | Sumitomo Rubber Ind Ltd | Translucent electromagnetic wave shielding member and its producing method |
KR101021735B1 (en) * | 2002-08-08 | 2011-03-15 | 다이니폰 인사츠 가부시키가이샤 | Electromagnetic shielding sheet and method for manufacturing same |
KR20040085762A (en) * | 2003-04-01 | 2004-10-08 | 엘지전자 주식회사 | Method for fabricating electromagnetic wave shilding film and display panel module using the same, and fabricating method tererof |
KR100509764B1 (en) * | 2003-04-10 | 2005-08-25 | 엘지전자 주식회사 | Electromagnetic wave shilding filter and method for fabricating the same |
JP2005101595A (en) * | 2003-09-03 | 2005-04-14 | Bridgestone Corp | Plasma display panel filter |
JP2006286708A (en) * | 2005-03-31 | 2006-10-19 | Toray Ind Inc | Electromagnetic shield plate and its manufacturing method |
KR100709186B1 (en) * | 2005-06-29 | 2007-04-18 | 삼성에스디아이 주식회사 | Composition for performing electrode of plasma display panel, electrode prepared from the same, and plasma display panel comprising the electrode |
KR100781326B1 (en) * | 2006-11-24 | 2007-11-30 | 제일모직주식회사 | Composition of paste for fabricating the electrode and plasma display panel thereby |
-
2007
- 2007-04-03 KR KR1020070032871A patent/KR100863408B1/en active IP Right Grant
-
2008
- 2008-04-02 CN CN2008800108216A patent/CN101653055B/en active Active
- 2008-04-02 EP EP08741103.9A patent/EP2132970B1/en active Active
- 2008-04-02 US US12/450,507 patent/US8168300B2/en active Active
- 2008-04-02 WO PCT/KR2008/001853 patent/WO2008120952A1/en active Application Filing
- 2008-04-02 JP JP2010502019A patent/JP5061233B2/en active Active
-
2012
- 2012-03-30 US US13/436,333 patent/US20120183678A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5174925A (en) * | 1990-04-12 | 1992-12-29 | Matsushita Electric Industrial Co., Ltd. | Conductive ink composition and method of forming a conductive thick film pattern |
US6355187B1 (en) * | 1998-07-28 | 2002-03-12 | Murata Manufacturing Co., Ltd. | Conductive paste and glass circuit substrate |
US20020170730A1 (en) * | 2001-03-08 | 2002-11-21 | Sumitomo Chemical Company, Limited | Electromagnetic shielding plate and method for producing the same |
WO2006009051A1 (en) * | 2004-07-22 | 2006-01-26 | Toray Industries, Inc. | Photosensitive paste and method for producing member for display panel |
US20090035452A1 (en) * | 2004-07-22 | 2009-02-05 | Toray Industries, Inc. | Photosensitive paste and manufacturing method of member for display panel |
WO2006126499A1 (en) * | 2005-05-25 | 2006-11-30 | Sumitomo Electric Industries, Ltd. | Conductive paste and wiring board using it |
US20090107707A1 (en) * | 2005-05-25 | 2009-04-30 | Sumitomo Electric Industries, Ltd. | Conductive Paste and Wiring Board Using It |
Also Published As
Publication number | Publication date |
---|---|
KR20080089983A (en) | 2008-10-08 |
EP2132970A1 (en) | 2009-12-16 |
EP2132970B1 (en) | 2013-06-12 |
CN101653055A (en) | 2010-02-17 |
CN101653055B (en) | 2012-07-11 |
JP5061233B2 (en) | 2012-10-31 |
WO2008120952A1 (en) | 2008-10-09 |
US20100109978A1 (en) | 2010-05-06 |
EP2132970A4 (en) | 2012-01-18 |
US8168300B2 (en) | 2012-05-01 |
JP2010524228A (en) | 2010-07-15 |
KR100863408B1 (en) | 2008-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6717048B2 (en) | Electromagnetic shielding plate and method for producing the same | |
KR101050137B1 (en) | Method for producing a conductive pattern and the conductive pattern produced thereby | |
US20120183678A1 (en) | Blackened electromagnetic interference shield glass and method of producing the same | |
US6994806B2 (en) | Conductive paste | |
CN104891810A (en) | Glass glaze coloring composite material, glaze coloring glass plate and application of glass glaze coloring composite material | |
US20100117504A1 (en) | Emi shield glass with blackened conductive pattern and a method for preparation thereof | |
JP2001354447A (en) | Ceramic paste and windowpane with light shielding film using the same | |
US5352479A (en) | Method for forming an electrode | |
EP2132969B1 (en) | Electromagnetic interference shield glass with blackened conductive pattern and method of producing the same | |
KR20100032207A (en) | Method for manufacturing conductive pattern and conductive pattern manufactured by the method | |
JP5902496B2 (en) | Baking paste composition, laminated glass using the same, and method for producing laminated glass | |
KR101259158B1 (en) | Crystallizable frit composition for forming electrode | |
KR20050122500A (en) | Lead free black ceramic composition for filter and a filter prepared from the same | |
KR20080019841A (en) | Method for preparing emi shielding film and emi shielding film prepared by the method | |
KR20060000759A (en) | Lead free black ceramics composition for filter and a filter formed from the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: LG CHEM, LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIM, SEUNG WOOK;LEE, DONG-WOOK;CHUN, SANG-KI;AND OTHERS;REEL/FRAME:027969/0464 Effective date: 20090903 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |