US20120180986A1

US20120180986A1 - Modular cooling and heating systems

Info

Publication number: US20120180986A1
Application number: US13/008,085
Authority: US
Inventors: Thomas J. Mathews
Original assignee: BASELINEUS
Current assignee: BASELINEUS
Priority date: 2011-01-18
Filing date: 2011-01-18
Publication date: 2012-07-19

Abstract

A module for use in a cooling and heating system includes an enclosure having a number of cartridge-receiving slots and at least one cartridge interchangeably disposed in one of the slots. The cartridge contains components for producing chilled fluid. The system can include a refrigerated load that is supplied with chilled fluid from the cartridge and a heat sink to which the cartridge rejects heat. The cooling and heating system can be configured to have at least one refrigeration circuit charged with a refrigerant and including a compressor, a condenser, an expansion device, and a heat exchanger, and at least one secondary cooling circuit charged with a coolant and including the heat exchanger, and a cooling coil. Heat is transferred from the coolant to the refrigerant in the heat exchanger. The system further includes a heating circuit for transferring heat from the condenser to a heating load.

Description

BACKGROUND OF THE INVENTION

This invention relates generally to cooling and heating and more particularly to modular cooling and heating systems for use in many types of facilities.
Various commercial refrigerated fixtures, such as refrigerators, freezers, refrigerated display cases, walk-in storage coolers and freezers, cold pans and wells, and the like, are widely used in many settings. Restaurants, corporate office cafeterias, and other food service facilities, for example, typically have a number of refrigerated fixtures located in food preparation areas and in food serving areas. Such food service facilities commonly use self-contained, stand alone refrigerated fixtures, remote refrigerated fixtures (in which compressor systems of individual refrigerated fixtures are placed in locations remote from the fixtures at facility sites such as back rooms, roofs, or building exterior areas), or a combination of self-contained and remote fixtures. Facilities using refrigerated fixtures typically also have requirements for air conditioning, space heating and domestic hot water heating.
Self-contained refrigerated fixtures have drawbacks when used in food preparation or serving areas as they are often noisy and reject heat into the surrounding occupied eating or food preparation spaces, which rejected heat often must be removed via facility air conditioning systems. They also have very poor energy efficiency, and maintenance of the fixtures in food preparation and serving areas is difficult. Remote refrigerated fixtures do remove the noise, heat rejection, and a portion of required refrigeration maintenance activities from the food preparation and serving areas, but still have relatively poor efficiency, require a substantial refrigerant charge, can be more difficult to maintain and operate properly, and have much higher initial cost than self-contained fixtures. And while having generally better energy efficiency than self-contained fixtures, remote refrigerated fixtures still have high energy consumption.
Accordingly, there is a need for a system that can efficiently and economically meet the refrigeration, air conditioning and heating requirements for many types of facilities.

SUMMARY OF THE INVENTION

The above-mentioned need is met by the present invention, one embodiment of which includes a module for use in a modular cooling and heating system. The module includes an enclosure having a number of cartridge-receiving slots, an electronic controller mounted to the enclosure, and at least one cartridge interchangeably disposed in one of the cartridge-receiving slots so as to make an electrical connection with the electronic controller. The cartridge contains components for producing chilled fluid. The system can include a refrigerated load that is supplied with chilled fluid from the cartridge and a heat sink to which the cartridge rejects heat.
The cooling and heating system can be configured to have at least one refrigeration circuit charged with a refrigerant and including a compressor, a condenser, an expansion device, and a heat exchanger all connected together in series flow communication, and at least one secondary cooling circuit charged with a coolant and including the heat exchanger, a pump, and a cooling coil all connected together in series flow communication. Heat is transferred from the coolant to the refrigerant in the heat exchanger. The cooling and heating system further includes a heating circuit charged with a heat transfer fluid and including the condenser, at least one heating load, and another pump for circulating the heat transfer fluid between the condenser and the heating load. Heat is transferred to the heat transfer fluid in the condenser, and heat is transferred from the heat transfer fluid to the heating load.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a cooling and heating system.

FIG. 2 is an isometric view of a module from the cooling and heating system of FIG. 1.

FIG. 3 is a schematic view of a first embodiment of a cooling and heating system.

FIG. 4 is a schematic view of a second embodiment of a cooling and heating system.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to centralized, modular cooling and heating systems that are capable of providing cooling for one or more refrigeration fixtures, cooling to meet space cooling requirements and self-contained refrigerated fixture condensing water, and heating for various facility heating loads such as domestic hot water heating and space heating. Although not so limited, the centralized, modular cooling and heating systems of the present invention are particularly well suited for use in restaurants, cafeterias, and other food service facilities having refrigerated fixtures located in their food preparation and/or serving areas. As will be described in more detail below, most of the system components are combined in one or more modules sited in a centralized location either within or outside of the food preparation and serving areas.
Referring to the drawings wherein identical reference numerals denote the same elements throughout the various views, FIG. 1 shows a modular cooling and heating system having at least one module 2, two refrigerated loads 3 and a heat sink 4. Typical refrigerated loads include refrigerated fixture cooling coils, HVAC cooling coils, and water-cooled, self-contained refrigerated fixture condensers. The heat sink 4 can include one or more heating loads or sinks such as domestic hot water heating, facility space heating, outdoor air-cooled fluid coolers, outdoor evaporative fluid coolers, and water-cooled heat exchangers with cooling water supplied by others from building cooler towers or other sources. FIG. 1 shows one module with two refrigerated loads and one heat sink by way of example only. It should be noted that a heating and cooling system in accordance with the present invention can include more than one module in conjunction with any number of refrigerated loads and heat sinks.
The module 2 comprises an enclosure 5 containing two interchangeable cartridges 6 and an electrical power and control panel 7. Two cartridges are shown by way of example only, and it should be noted that a different number of cartridges could be used. In the illustrated embodiment, each cartridge 6 supplies chilled fluid to a corresponding one of the refrigerated loads 3 and rejects heat to the heat sink 4. Each cartridge 6 can provide either medium temperature (“MT”) cooling fluid for refrigeration applications or high temperature (“HT”) cooling fluid for space cooling and condensing cooling fluid for low temperature refrigerated fixtures with fluid-cooled self-contained refrigeration units. The terms “medium temperature” and “high temperature” are used herein in a relative sense only, meaning a high temperature cartridge provides chilled fluid at generally higher temperatures than a medium temperature cartridge. For example, a medium temperature cartridge might provide chilled fluid temperatures in a range of 10-20 degrees F., while a high temperature cartridge might provide chilled fluid temperatures in a range of 35-50 degrees F.
Referring to FIG. 2, one possible configuration for the module 2 is shown in more detail. In this configuration, the enclosure 5 is a vertical cabinet having two support positions or slots 8, one above the other, for interchangeably receiving the cartridges 6. The electrical power and control panel 7, which includes an electronic controller, is located above the slots 8. The enclosure 5 includes electrical connectors (not shown) such as Molex connectors for connecting a cartridge 6 to the electrical power and control panel 7 when the cartridge 6 is inserted into one of the slots 8. Each cartridge 6 comprises various components mounted on a base plate 9. As described in more detail below, the components can include one or more compressors, a condenser, an expansion device, a chiller heat exchanger and a pump, plus interconnecting piping and basic electro-mechanical safety controls. Also included are connectors (not shown in FIG. 2) for making fluid connections between module cartridges and system piping and valving external to the module 2.
The module 2 can use a number of interchangeable cartridges of different capacities and application types (e.g., high temperature or medium temperature). The cartridges 6 deployed in the module 2 are selected based on the heating and cooling load requirements for the facility. The cartridges are of standard layout and manufacturing design and generally vary only in the size of the compressor and other major components and the resulting cooling and heating capacity. Cartridges are interchangeably disposed in the slots 8. That is, the cartridges 6 can be easily slid into the slots 8 and also are easily removed, either for service or for replacement with another cartridge to change the configuration or capacity of the module 2.
This arrangement allows for mixing and matching of modules and cartridges to accurately and efficiently meet the full range of heating and cooling requirements of the facility, from the lowest load requirement during periods of facility inactivity to the peak requirement during periods of high facility usage/activity. For example, depending on required capacity, one or two cartridges 6 are slid into one or two of the slots 8. When using two cartridges, the module 2 can have one MT cartridge and one HT cartridge, two MT cartridges, or two HT cartridges, as required by the particular facility loads. As mentioned above, a modular cooling and heating system may contain as many modules as required without limit, and each module may contain any combination of MT and HT cartridges to provide the total capacity and capacity modulation ability required by the food service facility refrigeration and space cooling needs.
FIG. 3 shows one embodiment of a centralized, modular cooling and heating system 10 including a medium temperature refrigeration circuit 12, a medium temperature secondary cooling circuit 14, a high temperature refrigeration circuit 16, a high temperature secondary cooling circuit 18, and a heating circuit 20. As used herein, a “high temperature circuit” generally operates at a higher temperature than a “medium temperature circuit.”
The medium temperature refrigeration circuit 12 includes a compressor 22, a condenser 24 (having first and second inlets 26 and 28 and first and second outlets 30 and 32), an expansion device 34, and a chiller heat exchanger 36 (having first and second inlets 38 and 40 and first and second outlets 42 and 44), all connected together, in the order recited, in closed-loop, serial flow communication. The medium temperature refrigeration circuit 12 is charged with a suitable refrigerant that is compressed in the compressor 22. Compressed vapor-phase refrigerant is discharged to the first inlet 26 of the condenser 24, where it is cooled and condenses. Liquid refrigerant discharged from the first outlet 30 of the condenser 24 flows through the expansion device 34, expanding while it does so. The refrigerant exits the expansion device 34 and flows through the chiller heat exchanger 36, entering via the first inlet 38 and exiting from the first outlet 42. The refrigerant exits the chiller heat exchanger 36 in a superheated gaseous state and flows back to the inlet of the compressor 22 via a suction line 46, where the cycle is repeated.
The medium temperature secondary cooling circuit 14 includes the chiller heat exchanger 36 (which is a part of both the medium temperature refrigeration circuit 12 and the medium temperature secondary cooling circuit 14), a pump 48 and a cooling coil 50 all connected together, in the order recited, in closed-loop, serial flow communication. As depicted by dashed line in FIG. 3, the compressor 22, the condenser 24, the expansion device 34, the chiller heat exchanger 36 and the pump 48 make up a medium temperature cartridge 6′. The medium temperature secondary cooling circuit 14 is charged with a suitable coolant fluid, such as a propylene glycol-water solution or the like. Coolant passes through the chiller heat exchanger 36, entering via the second inlet 40 and exiting from the second outlet 44, where it is cooled by the refrigerant that is also passing through the chiller heat exchanger 36. That is, heat is transferred from the coolant to the refrigerant in the chiller heat exchanger 36. As depicted in FIG. 3, the chiller heat exchanger 36 has a counter-flow design in which the coolant and the refrigerant flow in opposite directions through the chiller heat exchanger 36 to optimize heat transfer. The coolant is pumped via the pump 48 to the cooling coil 50. It should be noted that while FIG. 3 shows the pump 48 as being on the outlet side of the chiller heat exchanger 36, the pump 48 alternatively could be located on the inlet side of the chiller heat exchanger 36. The cooling coil 50 is deployed to provide cooling to any suitable cooling load. For example, the cooling coil 50 could be deployed in a refrigerated fixture located in a food preparation or serving area of a food service facility for cooling the refrigerated compartment(s) thereof.
The high temperature refrigeration circuit 16 (which is similar to the medium temperature refrigeration circuit 12 but operates at a higher temperature as mentioned above) includes a compressor 52, a condenser 54 (having first and second inlets 56 and 58 and first and second outlets 60 and 62), an expansion device 64, and a chiller heat exchanger 66 (having first and second inlets 68 and 70 and first and second outlets 72 and 74) all connected together, in the order recited, in closed-loop, serial flow communication. The high temperature refrigeration circuit 16 is charged with a suitable refrigerant that is compressed in the compressor 52. Compressed vapor-phase refrigerant is discharged to the first inlet 56 of the condenser 54, where it is cooled and condenses. Liquid refrigerant discharged from the first outlet 60 of the condenser 54 flows through the expansion device 64, expanding while it does so. The refrigerant exits the expansion device 64 and flows through the chiller heat exchanger 66, entering via the first inlet 68 and exiting from the first outlet 72. The refrigerant exits the chiller heat exchanger 66 in a superheated gaseous state and flows back to the inlet of the compressor 52 via a suction line 76, where the cycle is repeated.
The high temperature secondary cooling circuit 18 includes the chiller heat exchanger 66 (which is a part of both the high temperature refrigeration circuit 16 and the high temperature secondary cooling circuit 18), a pump 78 and a cooling coil 80 all connected together, in the order recited, in closed-loop, serial flow communication. As depicted by dashed line in FIG. 3, the compressor 52, the condenser 54, the expansion device 64, the chiller heat exchanger 66 and the pump 78 make up a high temperature cartridge 6″. The high temperature secondary cooling circuit 18 is charged with a suitable coolant fluid, such as a propylene glycol-water solution or the like. Coolant passes through the chiller heat exchanger 66, entering via the second inlet 70 and exiting from the second outlet 74, where it is cooled by the refrigerant that is also passing through the chiller heat exchanger 66. That is, heat is transferred from the coolant to the refrigerant in the chiller heat exchanger 66. Like the previously-mentioned chiller heat exchanger 36, the chiller heat exchanger 66 can employ a counter-flow design. The coolant is pumped via the pump 78 to the cooling coil 80. It should be noted that while FIG. 3 shows the pump 78 as being on the outlet side of the chiller heat exchanger 66, the pump 78 alternatively could be located on the inlet side of the chiller heat exchanger 66. The cooling coil 80 is deployed to provide cooling to any suitable cooling load. For example, the cooling coil 80 could be deployed as a part of the HVAC system of a facility to provide air conditioning for the facility. The cooling coil 80 could be deployed to a condenser for a low temperature refrigerated fixture located in the facility.
The heating circuit 20 accepts heat rejected from the refrigeration circuits 12 and 16 and uses this heat for various heating demands throughout a facility, such as space heating, domestic hot water heating and the like. The heating circuit 20 is charged with a suitable heat transfer fluid such as a propylene glycol-water solution or the like and includes the condensers 24 and 54 and two heating loads, a hydronic heating system 82 and a domestic hot water heater 84, in flow communication with the condensers 24 and 54. The two heating loads depicted in FIG. 3 are shown by way of example only, as different types and combinations of heating loads, including a single heating load, could be used. A fluid cooling loop including the condensers 24 and 54 and a fluid cooler 86 (having an inlet 88 and an outlet 90) in flow communication with the condensers 24 and 54 is provided in parallel to the heating circuit 20. A pump 92 is provided for circulating heat transfer fluid between the condensers 24 and 54 and the heating loads 82 and 84 and/or the fluid cooler 86. The fluid cooler 86 can comprise any suitable implementation, such as an air-cooled fluid cooler, an evaporative fluid cooler, a cooling tower, cooling tower water or chilled water from a third party source, and the like.
The heating circuit 20 further includes a pair of heat reclamation valves 94 and 96, which are both three-way valves that can be operated to selectively direct heat transfer fluid discharged from the second outlets 32, 62 of the condensers 24 and 54 to the heating loads 82 and 84 and/or the fluid cooler 86. Heat reclamation valve 94 has an inlet 98 connected to the second outlet 32 of the condenser 24, and the other heat reclamation valve 96 has an inlet 100 connected to the second outlet 62 of the condenser 54. Each of the heat reclamation valves 94 and 96 has a first outlet 102, 104 connected to the heating loads 82 and 84 and a second outlet 106, 108 connected to the inlet 88 of the fluid cooler 86. The heat reclamation valves 94 and 96 can be of the on/off type, where all of the fluid entering the inlet is discharged through one or the other of the two outlets so that all of the fluid is directed to either the heating loads 82 and 84 or the fluid cooler 86. Alternatively, the heat reclamation valves 94 and 96 can be of the modulating type where the fluid entering the inlet can be split between the two outlets. In this case, a first portion of the fluid entering the inlet is directed to the heating loads 82 and 84 and a second portion of the fluid is directed to the fluid cooler 86. The pump 92 circulates heat transfer fluid through the condensers 24 and 54, through the heat reclamation valves 94 and 96, and to the heating loads 82 and 84 and/or the fluid cooler 86, depending on the settings of the valves 94 and 96. Heat is transferred to the heat transfer fluid in the condensers 24 and 54, and heat is transferred from the heat transfer fluid in the heating loads 82 and 84 and/or the fluid cooler 86.
The heating circuit 20 also includes a return control valve 110 that selectively returns heat transfer fluid discharged by the heating loads 82 and 84 either directly to the condensers 24 and 54 or first to the fluid cooler 86 and then to the condensers 24 and 54. The return control valve 110 is a three-way valve having an inlet 112 connected to the heating load discharge, a first outlet 114 connected to the inlet of the pump 92 and a second outlet 116 connected to the inlet 88 of the fluid cooler 86. Like the heat reclamation valves 94 and 96, the return control valve 110 can be of the on/off type or the modulating type. Generally, if the heat transfer fluid returning from the heating loads 82 and 84 is sufficiently cool (i.e., as cool as necessary for current condenser operating conditions), then the return control valve 110 will be operated to direct the heat transfer fluid directly to the condensers 24 and 54. If the heat transfer fluid returning from the heating loads 82 and 84 is not sufficiently cool, then the return control valve 110 will be operated to direct the heat transfer fluid to the fluid cooler 86, where the heat transfer fluid will be further cooled before flowing to the condensers 24 and 54.
Referring to FIG. 4, another embodiment of a modular cooling and heating system 10′ is shown. The cooling and heating system 10′ is similar to the cooling and heating system 10 of FIG. 3 in that it includes a medium temperature refrigeration circuit 12, a medium temperature secondary cooling circuit 14, a high temperature refrigeration circuit 16, a high temperature secondary cooling circuit 18, and a heating circuit 20 having a fluid cooling loop. These elements are essentially the same as the corresponding elements in the cooling and heating system 10 of FIG. 3, which are described above, and are thus not described in detail again.
The cooling and heating system 10′ of FIG. 4 further includes a “heat pump” circuit 118 for extracting heat from outdoor ambient air. The heat pump circuit 118 includes a heat exchanger 120 (having first and second inlets 122 and 124 and first and second outlets 126 and 128) and a heat pump control valve 130. The heat pump control valve 130 is a three-way valve having an inlet 132 connected to the outlet 90 of the fluid cooler 86, a first outlet 134 connected to the first inlet 122 of the heat exchanger 120, and a second outlet 136 connected to the pump 92. The heat pump control valve 130 can be of the on/off type or the modulating type and is operated to direct heat transfer fluid discharged from the fluid cooler 86 through the heat exchanger 120. The first outlet 126 of the heat exchanger 120 is connected to the inlet 88 of the fluid cooler 86 via a pump 138, although the pump 138 alternatively could be located on the outlet side of the fluid cooler 86.
The second inlet 124 of the heat exchanger 120 is connected to receive chilled coolant from the medium temperature secondary cooling circuit 14. Specifically, a portion of the chilled coolant is diverted from the medium temperature secondary cooling circuit 14 upstream of the cooling coil 50 to the second inlet 124 of the heat exchanger 120, while the remainder of the chilled coolant flows to the cooling coil 50. This could be accomplished in a number of ways, such as providing a diverting valve upstream of the cooling coil 50. The diverted portion of the chilled coolant passes through the heat exchanger 120 and is heated by the heat transfer fluid also passing through the heat exchanger 120. The coolant exits the heat exchanger 120 through the second outlet 128 and is returned to the medium temperature secondary cooling circuit 14, between the cooling coil 50 and the chiller heat exchanger 36. Heating the coolant in this manner increases the cooling load on the medium temperature secondary cooling circuit 14, which causes the medium temperature secondary cooling circuit 14 to do more work and present more heat to the condenser 24 of the medium temperature refrigeration circuit 12. This additional heat is then available to be recovered by the heating circuit 20. Heat pump capacity can be further increased by driving the chilled coolant temperature of the medium temperature secondary cooling circuit 14 lower and lower, thereby reducing efficiency and causing the compressor 22 of the medium temperature refrigeration circuit 12 to work harder and put more heat into the system. At some point, like all heat pump systems, the efficiency will approach the efficiency of electric heat, suggesting a switch to backup electric resistance or gas-fired fluid heaters. The heat pump circuit 118 would be most beneficial in locations where outside ambient temperatures are such that a space heating requirement greater than what can be met with normal system operation would occur a relatively low number of hours per year.
While specific embodiments of the present invention have been described, it should be noted that various modifications thereto can be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A module for use in a cooling and heating system, said module comprising:

an enclosure having a number of cartridge-receiving slots;

an electronic controller mounted to said enclosure; and

a cartridge interchangeably disposed in a first one of said cartridge-receiving slots so as to make an electrical connection with said electronic controller, wherein said cartridge includes a compressor, a condenser and a chiller heat exchanger.

2. The module of claim 1 wherein said compressor, said condenser and said chiller heat exchanger are mounted on a base plate.

3. The module of claim 2 wherein said cartridge further includes an expansion device and a pump mounted on said base plate.

4. The module of claim 1 further comprising a further cartridge interchangeably disposed in a second one of said cartridge-receiving slots so as to make an electrical connection with said electronic controller, wherein said further cartridge includes a compressor, a condenser and a chiller heat exchanger.

5. The module of claim 1 wherein said enclosure is a vertical cabinet.

6. A modular cooling and heating system comprising:

at least one module, said module comprising an enclosure having a number of cartridge-receiving slots; an electronic controller mounted to said enclosure; and a cartridge interchangeably disposed in a first one of said cartridge-receiving slots so as to make an electrical connection with said electronic controller, wherein said cartridge includes a compressor, a condenser and a chiller heat exchanger;

a refrigerated load wherein said cartridge supplies chilled fluid to said refrigerated load; and

a heat sink wherein said cartridge rejects heat to said heat sink.

7. The modular cooling and heating system of claim 6 further comprising:

a second cartridge interchangeably disposed in a second one of said cartridge-receiving slots so as to make an electrical connection with said electronic controller, wherein said second cartridge includes a compressor, a condenser and a chiller heat exchanger; and

a second refrigerated load wherein said second cartridge supplies chilled fluid to said second refrigerated load.

8. The modular cooling and heating system of claim 7 wherein said second cartridge rejects heat to said heat sink.

9. The modular cooling and heating system of claim 7 further comprising a second heat sink, wherein said second cartridge rejects heat to said second heat sink.

10. The modular cooling and heating system of claim 6 wherein said refrigerated load is selected from the group consisting of refrigerated fixture cooling coils, HVAC cooling coils, and water-cooled, self-contained refrigerated fixture condensers.

11. The modular cooling and heating system of claim 6 wherein said heat sink is a heating load selected from the group consisting of domestic hot water heating, facility space heating, outdoor air-cooled fluid coolers, outdoor evaporative fluid coolers, and water-cooled heat exchangers.

12. A modular cooling and heating system comprising:

a first refrigeration circuit charged with a refrigerant and comprising a first compressor, a first condenser, a first expansion device, and a first heat exchanger all connected together in series flow communication;

a first secondary cooling circuit charged with a coolant and comprising said first heat exchanger, and a first cooling coil all connected together in series flow communication, wherein heat is transferred from said coolant to said refrigerant in said first heat exchanger; and

a heating circuit charged with a heat transfer fluid and comprising said first condenser, at least one heating load, and a pump for circulating said heat transfer fluid between said first condenser and said heating load, wherein heat is transferred to said heat transfer fluid in said first condenser and heat is transferred from said heat transfer fluid in said heating load.

13. The modular cooling and heating system of claim 12 further comprising:

a second refrigeration circuit charged with a refrigerant and comprising a second compressor, a second condenser, a second expansion device, and a second heat exchanger all connected together in series flow communication;

a second secondary cooling circuit charged with a coolant and comprising said second heat exchanger, and a second cooling coil all connected together in series flow communication, wherein heat is transferred from said coolant of said second secondary cooling circuit to said refrigerant of said second refrigeration circuit in said second heat exchanger; and

wherein said heating circuit further comprises said second condenser and said pump also circulates said heat transfer fluid between said second condenser and said heating load, and wherein heat is transferred to said heat transfer fluid in said second condenser.

14. The modular cooling and heating system of claim 13 wherein said first refrigeration circuit operates at a higher temperature than said second refrigeration circuit.

15. The modular cooling and heating system of claim 12 further comprising:

a fluid cooler having an inlet and an outlet, said outlet of said fluid cooler being connected to an inlet of said first condenser; and

a first three-way valve having an inlet connected to an outlet of said first condenser, a first outlet connected to said heating load, and a second outlet connected to said inlet of said fluid cooler, said first three-way valve being able to selectively direct heat transfer fluid being discharged from said outlet of said first condenser to said heating load and/or said fluid cooler.

16. The modular cooling and heating system of claim 15 further comprising:

a third heat exchanger having first and second inlets and first and second outlets, said first outlet of said third heat exchanger being connected to said inlet of said fluid cooler, said second inlet of said third heat exchanger being connected to receive coolant diverted from said first secondary cooling circuit, and said second outlet of said third heat exchanger being connected to return coolant to said first secondary cooling circuit; and

a second three-way valve having an inlet connected to said outlet of said fluid cooler, a first outlet connected to said first inlet of said third heat exchanger, and a second outlet connected to said inlet of said first condenser, said second three-way valve being able to selectively direct heat transfer fluid being discharged from said outlet of said fluid cooler to said third heat exchanger and/or said first condenser.

17. The modular cooling and heating system of claim 16 further comprising a pump for circulating said heat transfer fluid through said third heat exchanger and said fluid cooler.

18. The modular cooling and heating system of claim 12 wherein said heating load is a hydronic heating system.

19. The modular cooling and heating system of claim 12 wherein said heating load is a hot water heater.