US20120160468A1 - Local Thermal Management - Google Patents

Local Thermal Management Download PDF

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Publication number
US20120160468A1
US20120160468A1 US13/383,504 US201013383504A US2012160468A1 US 20120160468 A1 US20120160468 A1 US 20120160468A1 US 201013383504 A US201013383504 A US 201013383504A US 2012160468 A1 US2012160468 A1 US 2012160468A1
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Prior art keywords
heat
region
interconnector
component
heat shield
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Abandoned
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US13/383,504
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English (en)
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Andreas Larsson
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Sinvent AS
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Sinvent AS
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Assigned to SINVENT AS reassignment SINVENT AS ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LARSSON, ANDREAS
Publication of US20120160468A1 publication Critical patent/US20120160468A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
    • F01N13/00—Exhaust or silencing apparatus characterised by constructional features ; Exhaust or silencing apparatus, or parts thereof, having pertinent characteristics not provided for in, or of interest apart from, groups F01N1/00 - F01N5/00, F01N9/00, F01N11/00
    • F01N13/008—Mounting or arrangement of exhaust sensors in or on exhaust apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
    • F01N2260/00—Exhaust treating devices having provisions not otherwise provided for
    • F01N2260/02—Exhaust treating devices having provisions not otherwise provided for for cooling the device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
    • F01N2260/00—Exhaust treating devices having provisions not otherwise provided for
    • F01N2260/20—Exhaust treating devices having provisions not otherwise provided for for heat or sound protection, e.g. using a shield or specially shaped outer surface of exhaust device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
    • F01N2560/00—Exhaust systems with means for detecting or measuring exhaust gas components or characteristics
    • F01N2560/05—Exhaust systems with means for detecting or measuring exhaust gas components or characteristics the means being a particulate sensor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
    • F01N2560/00—Exhaust systems with means for detecting or measuring exhaust gas components or characteristics
    • F01N2560/20—Sensor having heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention concerns an apparatus and a method for thermal management of a component in a first region, which may be hot or cold compared to a surrounding second region.
  • Soot deposited on top of a common finger electrode structure changes the electrical resistance of the electrode, which can be monitored, i.e. soot can be detected. This information can be used in a monitoring system to indicate when a filter is full or damaged and regeneration or replacement is required.
  • thermophoresis The particle velocity for thermophoresis is directly proportional to the temperature gradient between the hot gas and the cooler sensor area.
  • a high temperature gradient in the sensor vicinity is believed to increase the sensitivity of a sensor in a low soot concentration environment, as more soot will be deposited.
  • Preliminary results show that a temperature difference of 50-70° C. between the sensor surface and the hot gases is sufficient for a thermophoresis based soot sensor to work.
  • the exhaust pipe may provide an excellent heat sink for a thermophoresis based sensor disposed in the hotter gases within the pipe.
  • a reasonably good thermal conductor e.g. a alumina sensor substrate
  • an alumina sensor substrate quickly accumulates heat from the ambient gas, and approach the gas temperature.
  • the resulting temperature gradient within the substrate will be sharp and located close to the exhaust pipe wall.
  • the remaining parts including the sensor surface at the substrate tip inside the pipe and away from the pipe wall, will have a temperature very close to that of the gas.
  • the substrate even when the sensor substrate is a reasonably good heat conductor, and even if the temperature difference between the exhaust gases and the exhaust pipe is considerably greater than the 50-70° C. required for a thermophoresis based sensor to work, the substrate alone will not provide the cooler surface required for such a sensor.
  • Insulating parts of the substrate from direct exposure to the gas has shown that the temperature gradient within the alumina extends further away from the exhaust pipe wall. I.e. the sensor surface temperature, at the tip, will be reduced.
  • Thermophoresis can also be used to detect particle contents in the exhaust gases from a combustion oven, as it is a suitable method to detect low particle concentrations in hot gases.
  • the exhaust gas temperature may exceed 300° C., and the pipe diameter and other dimensions are generally larger than in the previous example.
  • a sensor needs to be put into the hot gases away from a colder exhaust conduit. The sensor must provide a cool surface, and there is still limited space available for any bulky insulation or cooling equipment. Local active cooling may be expensive and/or inadequate with respect to size requirements.
  • thermal management can be employed in the process to regenerate the sensor surface from the above examples:
  • soot deposits the soot sensor looses its sensitivity.
  • reliable and accurate measurements over time may be required in applications such as long time monitoring of a particular filter status, for monitoring a diesel engine exhaust gas system, etc.
  • Particles can be removed by cremation, i.e. by increasing the sensor surface temperature to transform the particles to combustion gases and ash, e.g. to a surface temperature above 600° C.
  • Conducting the required power through the sensor and/or sensor electronics may burn off sensor elements and/or wiring as well as soot and other particles.
  • a temperature increase in the sensor area is required without increasing the temperature in the wires above the melting point of the electrical insulation materials, the bonding etc.
  • a substantial amount of the supplied heat energy should be provided by a secondary heat path. Additional heat may be supplied locally through the sensor area, as long as it does not exceed the limits for the sensor and/or the electronics, etc.
  • Another example involve a movable component that needs a temporary motion in an icy environment, e.g. a ship in the Arctic, where sea spray and temperatures below 0° C. build layers of ice on rigging and deck equipment.
  • Ice will hamper movable parts from operating properly. Water has a considerable heat capacity, impeding the progress of melting. Obviously, the melting process can be speeded up and energy consumption held at a minimum by heating the components locally. This can be achieved by local thermal management, in particular by heating the component to a temperature above 0° C. while the surrounding ice is exposed to minimal heat transfer from the supplied power.
  • Electric resistors of various forms are typically used for such local heating applications.
  • An electric resistor emits heat when an electric current passes though, and can generally be adapted to the application at hand in an easy manner.
  • special care must be taken when using electricity in applications like this. Among other things, proper electric insulation must be provided to ensure that no part of the electric circuit comes into contact with water at any point in time. In areas with explosion hazard, use of electricity may be prohibited.
  • thermal management of the component from a region outside the cold area, including the ice, without use of electricity will be highly advantageous for this type of application.
  • local thermal management with a minimum of power losses will be advantageous.
  • an objective of the present invention is to provide thermal management of a component mounted on an interconnector, where the component, e.g. a sensor or a moving part, is disposed in a first thermal region and thermally connected to a second thermal region by the interconnector.
  • the component e.g. a sensor or a moving part
  • Areas of use include providing efficient particle deposition by thermophoresis and other applications where a comparatively small region it to be managed thermally with respect to its surroundings.
  • This objective is achieved by providing an apparatus and a method for thermal management of a component in a first region, wherein an interconnector connects the component thermally to a second heat region, wherein a thermally conducting heat shield encloses the interconnector from a position within the first region, in close proximity to the component, to the second region, and that at least one heat unit is thermally connected to at least one of the heat shield and the interconnector within the second region.
  • the basic idea behind the invention is to utilize the relative thermal resistance of different parallel heat paths.
  • the heat shield When heat enters the heat shield from a hot surrounding first region, e.g. hot gas, the heat shield conducts heat more efficiently than the medium encapsulated by the heat shield. Thus, the heat tends to follow the path provided by the heat shield i.e. the path with low thermal resistance, rather than dissipating through it and enter the encapsulated region, where an interconnector is to be kept at a lower temperature.
  • the heat from the heat shield is dissipated through a proper heat unit, in this case a heat sink, at a suitable location in connection with the second region, rather than heating the encapsulated region.
  • a proper heat unit in this case a heat sink
  • a heat unit in the form of a heat source provides the thermally conductive heat shield with heat, e.g. for cremation of deposited particles as discussed above
  • heat is conducted through the heat shield to the component location.
  • heat is also radiated from the heat shield to the surrounding environment, and in one embodiment, the top face of the heat shield can have a parabolic shape that concentrates radiation from the heat shield to the sensor area, heating the sensor surface. It is noted that in a practical soot sensor, all or part of the heat required to burn off soot may be provided through the interconnector, and that providing heat through the heat shield in the above example is for illustrative purposes only.
  • Another way of heating the component within the first region is by connecting a heat source in the second region to the interconnector, which conducts heat to the component.
  • the heat shield will shield the interconnector from the first region, which is now a cold region relative to the hotter second region.
  • This may be an energy efficient way of heating a component to a desired temperature, e.g. the movable part encapsulated in ice or burning soot off of a sensor surface as discussed above.
  • a desired temperature e.g. the movable part encapsulated in ice or burning soot off of a sensor surface as discussed above.
  • heat shield When the heat shield is disposed in a first region which is colder than the second region, e.g. when the heat shield is enclosed in ice, heat emanated from a hot interconnector enters the heat shield from the inside. If the heat shield conducts heat more efficiently than the surrounding medium, e.g. ice, the heat is again conducted to a proper heat sink. In this case the heat could be used to heat the interconnector, rather than, for example, unnecessary melting of the ice.
  • FIG. 1 is a perspective view of a heat shield and interconnector assembly
  • FIG. 2 indicates the interior of the assembly in FIG. 1 .
  • FIG. 3 a,b are side views of the assembly in FIG. 1 , seen from angles 90° apart
  • FIG. 4 is a top view of the assembly of the previous figures
  • FIG. 5 shows a cross section taken along the line A-A in FIG. 4
  • FIG. 6 a - c are schematic views of a first embodiment
  • FIG. 7 a - c are schematic views of a second embodiment
  • FIG. 8 is a schematic view showing convection in a heat shield
  • FIG. 9 a, b are schematic views of a third embodiment
  • FIG. 10 is a schematic view of an embodiment with extra support
  • FIG. 11 is a perspective view of the embodiment in FIG. 10
  • FIG. 12 is an enlarged, cross sectional view of a detail on FIG. 2
  • FIGS. 1-5 illustrates preferred embodiments of the present disclosure through several views and cross sections viewed from different angles.
  • the component to be thermally managed is represented by 120 , and is mounted on or is a part of an interconnector 110 .
  • a thermally conducting heat shield 130 encloses the interconnector 110 up to the component 120 that is required to be exposed to a first region.
  • first and second region refer to distinct thermal regions, i.e. regardless whether the regions are otherwise connected and regardless of their other properties.
  • the part referenced by 220 in FIG. 1 is a fitting, which can either be a thermal conductor or insulator in the context of thermal management and this disclosure.
  • the main purpose for fitting 220 is to mechanically connect the interconnector 110 to the heat shield 130 and/or provide a seal, separating the first region from the interior of the heat shield.
  • the parts represented by numeral 220 throughout the description, claims and drawings have different functions like; fastening or sealing one part to another, e.g. the heat shield 130 to the interconnector 110 Parts, e.g.
  • CTE coefficients of thermal expansion
  • an insulator or more precisely an element with a low thermal conductivity, may intentionally be inserted between elements to reduce thermal flow e.g. between the heat shield and the interconnector.
  • parts acting as thermal resistors in the context of thermal management are here collectively referenced by numeral 210 , regardless of their other functions as adhesives, sealants, adaptors for thermal expansion, lids, other structural elements, etc.
  • the contact area at the interconnection between the heat shield and the component and/or the interconnector can be small or even omitted from the design.
  • the present invention therefore provides a viable way to minimizing or eliminating CTE mismatch.
  • the first region can be the interior of a conduit or container for a hot or cold flowing or stationary fluid, in which the component 120 is inserted.
  • the figures show a part of a conduit wall 200 separating the first and second thermal regions.
  • the first region is simply the region above the conduit wall 200
  • the second region is the area below the conduit wall 200 .
  • the component 120 to be thermally managed can be enclosed in a solid, e.g. ice or an alloy, in which case there is no need for a physical wall 200 .
  • a physical container or conduit would obviously have some structured design and a temperature gradient separating the first and second regions. As this structure and temperature gradient are irrelevant for the present disclosure, they are simply not shown.
  • FIGS. 6 a - c is schematic views of various embodiments, in which the heat shield 130 is open towards the second region. This is mainly meant to indicate that the ambient fluid can provide sufficient thermal insulation between the interconnector 110 and the heat shield 130 . In some applications, this ambient fluid will be air or some other gas. However, any ambient fluid could enter the cavity within the open heat shield in FIGS. 6 a - c .
  • a component 120 might be disposed in fluid, represented by the first region, having a pressure of several hundred bars.
  • a typical well tool, represented by the second region may be filled with a clean liquid, e.g. mineral oil.
  • the clean mineral oil will be mechanically isolated from the surrounding oil well, while the pressure can be, but does not have to be balanced to that of the surrounding fluids.
  • the liquid within the well tool (second region) will have low compressibility and is expected to provide sufficient thermal insulation for the purposes of the concrete application of the present invention.
  • the interconnector 110 and heat shield 130 share a heat unit 300 , which may be a heat sink or a heat source depending on the application; heating or cooling the component.
  • a thermal resistor 210 is shown between the heat shield 130 and the conduit wall 200 , to indicate that the heat may not flow effectively to the conduit wall 200 in all applications. In fact, the conduit wall may not even exist in all applications. This is the case when, for example, a heat shield is enclosed in ice.
  • thermal resistor 210 /fitting 220 shown in FIG. 1 and several other thermal resistors and/or fittings are omitted from the schematic views in FIG. 6 a - 9 b .
  • parts may be joined by an adhesive or a mechanical connection, or require some means to allow for differences in thermal expansion coefficient, both of which change the thermal resistance. See also the description of FIG. 1 .
  • FIG. 6 b illustrates a combination in which the interconnector 110 and heat shield 130 are connected to separate heat units 300 and 301 .
  • Either of the heat units 300 , 301 may be a heat sink or a heat source.
  • the heat unit 301 connected to the interconnector 110 , would be a heat source providing heat to melt the ice around the component 120
  • the heat unit 300 connected to the heat shield 130
  • the heat unit 300 would be a heat sink to dissipate excess heat, to prevent unintentional and energy consuming melting of ice.
  • the medium or lack of medium (vacuum) enclosed by the heat shield 130 is transparent to heat radiation (IR), the interior surfaces may be surface treated to reduce heat from being transferred by radiation between them, e.g. polish them to be reflective.
  • IR heat radiation
  • FIG. 6 c shows a special case of FIG. 6 b , in which the conduit wall 200 doubles as a heat unit 300 for the heat shield 130 .
  • the component 120 would be the sensor area required to be kept 50-70° C. below the ⁇ 300° C. of the exhaust gases.
  • the first region would be the interior of the exhaust pipe, or strictly speaking, the region where the sensor element 120 is inserted into the gas flow, some distance away from the exhaust pipe wall.
  • the second region would be the general region from the exhaust pipe and radially outwards from it.
  • the heat unit 301 would be a heat sink to cool the component 120 rather than a heat source to heat the component as in the previous example.
  • the exhaust pipe, represented by the conduit wall 200 may be an excellent heat sink 300 for the heat shield 130 because
  • FIGS. 7 a - c show configurations similar to the ones in FIGS. 6 a - c respectively, but where the heat shields in FIG. 7 are closed towards the second region. Typically the interior is escaped to generate a substantially lower pressure, or “vacuum”.
  • the walls inside the cavity are typically polished to be reflective. Both the vacuum and the reflective surfaces provide a reduction of heat transfer between the heat shield and the interconnector.
  • FIG. 7 a illustrates a configuration with low thermal resistance between the interconnector 110 and the heat shield 130
  • FIGS. 7 b and 7 c show a thermal resistor or insulator between the interconnector 110 and the heat shield 130
  • a fitting 220 or a thermal resistor or insulator 210 may be present between the interconnector and heat shield in the upper part of the schematic views, including FIGS. 6 a - 9 b.
  • Such fittings, resistors or insulators are merely not shown in the schematic figures.
  • the heat shield can be filled with a gas or a liquid.
  • FIG. 8 is intended to illustrate that the fluid can be circulated within the cavity of the heat shield 130 when required.
  • the circulation may be provided by a pump (not shown) circulating fluid, e.g. a fan circulating air in an open configuration as shown in FIGS. 6 a - c or a pump circulating a liquid in a closed configuration as shown in FIGS. 7 a - c .
  • Boundary conditions at the interconnector 110 and heat shield 130 can also cause natural convection in the cavity, When the configuration is closed, it is important that too much heat does not accumulate within the circulating fluid.
  • an external heat sink would typically be provided to cool the circulating fluid as it passes the bottom lid in FIG. 8 , and the bottom wall would preferably be good heat conductor rather than the insulator indicated in FIG. 8 .
  • circulation may be in the opposite direction of the one that shown in FIG. 8 , i.e. into the cavity adjacent the interconnector 110 and in the outward direction along the heat shield 130 .
  • FIGS. 9 a, b illustrates that the interior of the heat shield can be a medium or combination of any media of any phase, including solid or granular media.
  • the requirement for a solid medium may be determined by a structural mechanics point of view, e.g. to withstand extensive mechanical loads.
  • the interior can be filled with a mechanically strong solid or granular medium with a large heat capacity, e.g. titanium. In this way, a large, but short temperature change in the first region will only slightly affect the overall temperature of the encapsulated medium.
  • FIGS. 10 and 11 show the embodiment of FIGS. 1-5 with a support 140 disposed between the interconnector 110 and the heat shield 130 in order to provide mechanical stability or rigidity to the structure. It is readily understood that several such supports may be disposed if needed.
  • FIG. 12 is an enlarged view of the top of the heat shield/interconnector assembly.
  • the fitting 220 between the interconnector 110 and the heat shield 130 is apparent.
  • the reference numeral 120 points to a sensor assembly covered by an extension of the shield 130 .
  • the sensing surface can be in contact with the gases.
  • the component, including a sensor may be entirely encapsulated. It should be noted that any sensor 120 may be protected by a cover and/or an extension of the shield 130 in this manner.
  • a medium with a large heat capacity will act as a method to control and reduce temperature fluctuations within the component.
  • any combination of a heat shield 130 open or closed to a surrounding second region, filled with air, another gas, liquid, a solid or granular material can be used in different applications. Any of these combinations can further be configured with a heat shield 130 connected to a heat sink or heat source 300 , 301 .
  • the heat sink 300 , 301 may be, but does not have to be, the heat sink 300 , 301 that dissipate heat from an interconnector 110 , or heat source 300 , 301 that provide heat to an interconnector 110 and/or a heat shield 130 . Any of these variants may, in turn, be combined with any interconnector 110 and component 120 which is to be thermally managed.
  • the medium within the heat shield 130 is generally chosen to avoid heat transfer between the interconnector 110 and the heat shield 130 , but may be chosen to inhibit thermal exchange between the interconnector 110 and the heat shield 130 .
  • Elements 210 and 220 with a different thermal conductivity than adjacent elements may be required between any elements of the structure, e.g. to compensate for differences in thermal expansion.
  • Surface treatment may be used to minimize heat transfer between the interconnector 110 and the heat shield 130 e.g. reflecting surfaces. Obviously, the application determines the exact embodiment of the invention.
US13/383,504 2009-07-20 2010-07-20 Local Thermal Management Abandoned US20120160468A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NO20092713 2009-07-20
NO20092713A NO330346B1 (no) 2009-07-20 2009-07-20 Lokal termisk styring
PCT/NO2010/000288 WO2011010936A1 (en) 2009-07-20 2010-07-20 Local thermal management

Publications (1)

Publication Number Publication Date
US20120160468A1 true US20120160468A1 (en) 2012-06-28

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US13/383,504 Abandoned US20120160468A1 (en) 2009-07-20 2010-07-20 Local Thermal Management

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US (1) US20120160468A1 (no)
EP (1) EP2457423B1 (no)
JP (1) JP5368636B2 (no)
CN (1) CN102474997B (no)
BR (1) BR112012001214A2 (no)
NO (1) NO330346B1 (no)
WO (1) WO2011010936A1 (no)

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US20160265644A1 (en) * 2015-03-10 2016-09-15 Ford Global Technologies, Llc Insulated vehicle wall structures
DE102018123326B3 (de) * 2018-09-21 2020-02-06 Dr. Neumann Peltier-Technik Gmbh Sensoranordnung
US11136237B2 (en) 2018-09-25 2021-10-05 Infineon Technologies Ag Device for suppressing stray radiation
US11137293B2 (en) * 2018-01-31 2021-10-05 Abb Power Grids Switzerland Ag Wound electrical component with printed electronics sensor
US11400872B1 (en) 2021-05-07 2022-08-02 Caterpillar Inc. Heat shield assembly for exhaust treatment system

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US20160265644A1 (en) * 2015-03-10 2016-09-15 Ford Global Technologies, Llc Insulated vehicle wall structures
US10352430B2 (en) * 2015-03-10 2019-07-16 Ford Global Technologies, Llc Insulated vehicle wall structures
US11137293B2 (en) * 2018-01-31 2021-10-05 Abb Power Grids Switzerland Ag Wound electrical component with printed electronics sensor
DE102018123326B3 (de) * 2018-09-21 2020-02-06 Dr. Neumann Peltier-Technik Gmbh Sensoranordnung
US11136237B2 (en) 2018-09-25 2021-10-05 Infineon Technologies Ag Device for suppressing stray radiation
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EP2457423A1 (en) 2012-05-30
JP5368636B2 (ja) 2013-12-18
BR112012001214A2 (pt) 2018-03-13
EP2457423A4 (en) 2015-12-16
CN102474997A (zh) 2012-05-23
JP2012533751A (ja) 2012-12-27
NO20092713A1 (no) 2011-01-21
EP2457423B1 (en) 2017-07-05
WO2011010936A1 (en) 2011-01-27
CN102474997B (zh) 2014-12-03
NO330346B1 (no) 2011-03-28

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