US20120048512A1 - Data center and heat dissipating control system thereof - Google Patents
Data center and heat dissipating control system thereof Download PDFInfo
- Publication number
- US20120048512A1 US20120048512A1 US12/875,096 US87509610A US2012048512A1 US 20120048512 A1 US20120048512 A1 US 20120048512A1 US 87509610 A US87509610 A US 87509610A US 2012048512 A1 US2012048512 A1 US 2012048512A1
- Authority
- US
- United States
- Prior art keywords
- nozzles
- airflow
- cold
- heat dissipating
- data center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1497—Rooms for data centers; Shipping containers therefor
Definitions
- the present disclosure relates to data centers, and particularly to a container data center and a heat dissipating control system thereof.
- Data centers are centralized computing facilities that include many servers, often arranged on server racks or shelves, and one rack or shelf with some servers can be considered a server system.
- a data center there are some cold aisles and some hot aisles each defined between two adjacent server systems, and the cold aisles are used to supply cold airflow for the server systems.
- One common heat dissipating control system in the cold aisles is to arrange a lot of nozzles under the ground, and some cold airflow is supplied from under the ground and blow to the cold aisles through the nozzles.
- the heights of the cold airflow from the nozzles are generally the same, but the heat dissipating requirements of different servers in different height layers are different, for example, the heat dissipating requirement of a lower server is greater than the heat dissipating requirement of a higher server. Therefore, if the heights of the cold airflow are very high, the highest server which may not need so much cold airflow would waste more electricity than needed. Therefore, there is room for improvement in the art.
- FIG. 1 is a schematic view of an embodiment of a data center, the data center including a head dissipating control system.
- FIG. 2 is a partial, schematic view of the head dissipating control system of FIG. 1 , the head dissipating control system including a plurality of nozzles.
- FIG. 3 is a schematic view of one of the nozzles of FIG. 2 .
- an embodiment of a data center 100 includes a plurality of server systems 20 .
- the data center 100 is a container data center, and the server systems 20 are installed in a portable container 10 .
- the server systems 20 are arranged in two rows and the number of the server systems 20 is determined according to the size of the container 10 .
- each server system 20 respectively has a hot aisle 40 and a cold aisle 50 (large hollow arrows, identified as an outlined white arrow, stand for hot airflow, and small solid arrows identified as a small black arrow, stands for cold airflow in FIG. 2 ).
- a plurality of nozzles 30 are arranged under the ground, to supply cold airflow to the cold aisle 50 .
- some cold airflow generators (not shown) can also be used to generate cold airflow. These cold airflow generators fall within well-known technologies, and are therefore not described here.
- the cold airflow generators and the nozzles 30 compose a heat dissipating control system of the data center 100 .
- the nozzles 30 are arranged in a plurality of rows parallel to the server systems 20 (In FIG. 2 , only six rows are shown, and each row only uses one nozzle 30 to give an example).
- the heights of the cold airflow from the nozzles 30 form a step mode from the server systems 20 to the middle of cold aisle 50 . Namely, in the middle of the cold aisle 50 , the heights of cold airflow from the nozzles 30 are highest, and the heights of the cold airflow from the nozzles 30 nearest to the server systems 20 are lowest.
- the heat dissipating requirement of a lower server of the server systems 20 is greater than the heat dissipating requirement of a higher server of the server systems 20 , therefore, the step mode of the cold airflow in the cold aisle 50 can satisfy all of the servers of the server systems 20 and in the meanwhile save electricity.
- each nozzle 30 is a hollow circular truncated cone.
- An upper opening of the nozzle 30 is an airflow outlet 31 and a lower opening of the nozzle 30 is an airflow intake 32 .
- an initial speed of the cold airflow at the airflow outlet 31 is V1
- an shooting speed of the cold airflow at the airflow intake 32 is V2
- an area of the airflow outlet 31 is A1
- an area of the airflow intake 32 is A2
- a mass of the cold airflow is m
- the acceleration of gravity is g
- a height of the cold airflow from the nozzle 30 is h
- the initial speed V1 of the cold airflow at the airflow outlet 31 is known, therefore, the height h of the cold airflow from the nozzle 30 can be controlled by adjusting the relationship between the two areas A1 and A2 according the above last formula, which is very convenient.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A data center includes a portable container, a number of server systems, and a number of nozzles. The server systems are installed in the container. Two opposite sides of each server system are respectively a hot aisle and a cold aisle. The nozzles are arranged in the ground under the cold aisles to supply cold airflow. The nozzles of each cold aisle are arranged in a number of rows parallel to two adjacent server systems. Heights of the cold airflow from the nozzles of each cold aisle form a step mode from the two adjacent server systems to the middle of the corresponding cold aisle.
Description
- 1. Technical Field
- The present disclosure relates to data centers, and particularly to a container data center and a heat dissipating control system thereof.
- 2. Description of Related Art
- With increasing heavy duty use of on-line applications, the need for computer data centers has increased rapidly. Data centers are centralized computing facilities that include many servers, often arranged on server racks or shelves, and one rack or shelf with some servers can be considered a server system. In a data center, there are some cold aisles and some hot aisles each defined between two adjacent server systems, and the cold aisles are used to supply cold airflow for the server systems. One common heat dissipating control system in the cold aisles is to arrange a lot of nozzles under the ground, and some cold airflow is supplied from under the ground and blow to the cold aisles through the nozzles. The heights of the cold airflow from the nozzles are generally the same, but the heat dissipating requirements of different servers in different height layers are different, for example, the heat dissipating requirement of a lower server is greater than the heat dissipating requirement of a higher server. Therefore, if the heights of the cold airflow are very high, the highest server which may not need so much cold airflow would waste more electricity than needed. Therefore, there is room for improvement in the art.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is a schematic view of an embodiment of a data center, the data center including a head dissipating control system. -
FIG. 2 is a partial, schematic view of the head dissipating control system ofFIG. 1 , the head dissipating control system including a plurality of nozzles. -
FIG. 3 is a schematic view of one of the nozzles ofFIG. 2 . - The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to
FIG. 1 , an embodiment of adata center 100 includes a plurality ofserver systems 20. In one embodiment, thedata center 100 is a container data center, and theserver systems 20 are installed in aportable container 10. Theserver systems 20 are arranged in two rows and the number of theserver systems 20 is determined according to the size of thecontainer 10. - Referring to
FIG. 2 , in thedata center 100, two opposite sides of eachserver system 20 respectively has ahot aisle 40 and a cold aisle 50 (large hollow arrows, identified as an outlined white arrow, stand for hot airflow, and small solid arrows identified as a small black arrow, stands for cold airflow inFIG. 2 ). In thecold aisle 50, a plurality ofnozzles 30 are arranged under the ground, to supply cold airflow to thecold aisle 50. It may be understood that some cold airflow generators (not shown) can also be used to generate cold airflow. These cold airflow generators fall within well-known technologies, and are therefore not described here. The cold airflow generators and thenozzles 30 compose a heat dissipating control system of thedata center 100. - In one embodiment, the
nozzles 30 are arranged in a plurality of rows parallel to the server systems 20 (InFIG. 2 , only six rows are shown, and each row only uses onenozzle 30 to give an example). The heights of the cold airflow from thenozzles 30 form a step mode from theserver systems 20 to the middle ofcold aisle 50. Namely, in the middle of thecold aisle 50, the heights of cold airflow from thenozzles 30 are highest, and the heights of the cold airflow from thenozzles 30 nearest to theserver systems 20 are lowest. The heat dissipating requirement of a lower server of theserver systems 20 is greater than the heat dissipating requirement of a higher server of theserver systems 20, therefore, the step mode of the cold airflow in thecold aisle 50 can satisfy all of the servers of theserver systems 20 and in the meanwhile save electricity. - Referring to
FIG. 3 , to achieve the above step mode of the cold airflow in thecold aisle 50, the heights of the cold airflow from thenozzles 30 need to be controlled correctly. In one embodiment, eachnozzle 30 is a hollow circular truncated cone. An upper opening of thenozzle 30 is anairflow outlet 31 and a lower opening of thenozzle 30 is anairflow intake 32. Suppose an initial speed of the cold airflow at theairflow outlet 31 is V1, an shooting speed of the cold airflow at theairflow intake 32 is V2, an area of theairflow outlet 31 is A1, an area of theairflow intake 32 is A2, a mass of the cold airflow is m, the acceleration of gravity is g, a height of the cold airflow from thenozzle 30 is h, there are two formulas: -
A1*V1=A2*V2 -
1/2*m*V22 =m*g*h (friction ignored) -
Therefore: -
V2=A1*V1/A2; V2=√{square root over (2gh)} -
And -
h=(V1*A1/A2)2/2g. - As we know, the initial speed V1 of the cold airflow at the
airflow outlet 31 is known, therefore, the height h of the cold airflow from thenozzle 30 can be controlled by adjusting the relationship between the two areas A1 and A2 according the above last formula, which is very convenient. - It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (6)
1. A data center comprising:
a portable container;
a plurality of server systems installed in the container, wherein two opposite sides of each of the plurality of server systems respectively has a hot aisle and a cold aisle; and
a plurality of nozzles arranged in the ground under the cold aisles to supply cold airflow to the cold aisles, wherein the nozzles of each of the cold aisles are arranged in a plurality of rows parallel to two corresponding adjacent server systems, heights of the cold airflow from the nozzles of each of the cold aisles form a step mode from the two adjacent server systems to the middle of the corresponding cold aisle.
2. The data center of claim 1 , wherein each of the plurality of nozzles is a hollow circular truncated cone, an upper opening of each of the plurality of nozzles is an airflow outlet and a lower opening of each of the plurality of nozzles is an airflow intake.
3. The data center of claim 2 , wherein a height h of the cold airflow from one of the plurality of nozzles is adjusted by the following formula: h=(V1*A1/A2)2/2g, where V1 is an initial speed of the cold airflow at the airflow outlet, A1 is an area of the airflow outlet, A2 is an area of the airflow intake, g is the acceleration of gravity.
4. A heat dissipating control system used to dissipate heat for a server system, the heat dissipating control system comprising:
a plurality of nozzles arranged in the ground of one side of the server system, to supply cold airflow to the side of the sever system;
wherein the plurality of nozzles are arranged in a plurality of rows parallel to the server system, heights of the cold airflow from the plurality of nozzles form a step mode from the server system.
5. The heat dissipating control system of claim 4 , wherein each of the plurality of nozzles is a hollow circular truncated cone, an upper opening of each of the plurality of nozzles is an airflow outlet and a lower opening of each of the plurality of nozzles is an airflow intake.
6. The heat dissipating control system of claim 5 , wherein a height h of the cold airflow from one of the plurality of nozzles is adjusted by the following formula: h=(V1*A1/A2)2/2g, where V1 is an initial speed of the cold airflow at the airflow outlet, A1 is an area of the airflow outlet, A2 is an area of the airflow intake, g is the acceleration of gravity.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99128398 | 2010-08-25 | ||
TW99128398A TWI469729B (en) | 2010-08-25 | 2010-08-25 | Container data center and heat dissipating control system thereof |
Publications (1)
Publication Number | Publication Date |
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US20120048512A1 true US20120048512A1 (en) | 2012-03-01 |
Family
ID=45695577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/875,096 Abandoned US20120048512A1 (en) | 2010-08-25 | 2010-09-02 | Data center and heat dissipating control system thereof |
Country Status (2)
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US (1) | US20120048512A1 (en) |
TW (1) | TWI469729B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112272473A (en) * | 2020-10-28 | 2021-01-26 | 江西舜曙照明电器有限公司 | Aluminum alloy waterproof shell for LED power supply |
Citations (18)
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US5076152A (en) * | 1989-01-20 | 1991-12-31 | Schako Metallwarenfabrik Ferdinand Schad Kg | Apparatus for ventilation and removal of air |
US5121675A (en) * | 1989-02-04 | 1992-06-16 | Schako Metallwarenfabrik Ferdinand Schad Kg | Device for supplying air to and if need be evacuating air from a room |
JPH05164395A (en) * | 1991-04-30 | 1993-06-29 | Philip Morris Prod Inc | Ventilating device |
US5816908A (en) * | 1997-06-30 | 1998-10-06 | Chu Kuo Air-Con Engineering Co., Ltd. | Air shower for a clean room system |
US20010029163A1 (en) * | 2000-02-18 | 2001-10-11 | Rtkl Associates Inc. | Computer rack heat extraction device |
US6374627B1 (en) * | 2001-01-09 | 2002-04-23 | Donald J. Schumacher | Data center cooling system |
US7037189B2 (en) * | 2003-05-27 | 2006-05-02 | Mayekawa Mfg. Co., Ltd. | Air shutter and installation method thereof |
US20060168975A1 (en) * | 2005-01-28 | 2006-08-03 | Hewlett-Packard Development Company, L.P. | Thermal and power management apparatus |
US7226353B2 (en) * | 2004-01-13 | 2007-06-05 | Power Of 4, Llc | Cabinet for computer devices with air distribution device |
US20080144279A1 (en) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co., Ltd. | Heat sink |
US20090156114A1 (en) * | 2007-12-18 | 2009-06-18 | International Business Machines Corporation | Apparatus and method for facilitating air cooling of an electronics rack |
US20090173473A1 (en) * | 2002-03-28 | 2009-07-09 | American Power Conversion Corporation | Data center cooling |
US20090277605A1 (en) * | 2005-05-17 | 2009-11-12 | American Power Conversion Corporation | Cold aisle isolation |
US20100190430A1 (en) * | 2009-01-29 | 2010-07-29 | International Business Machines Corporation | Air permeable material for data center cooling |
US20100285730A1 (en) * | 2009-05-11 | 2010-11-11 | Minel Kupferberg | High velocity nozzle and windband assembly |
US20110053488A1 (en) * | 2008-01-18 | 2011-03-03 | Mpc Inc. | Control system for exhaust gas fan system |
US7990709B2 (en) * | 2009-09-23 | 2011-08-02 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics rack |
US8251785B2 (en) * | 2008-10-31 | 2012-08-28 | Cirrus Logic, Inc. | System and method for vertically stacked information handling system and infrastructure enclosures |
-
2010
- 2010-08-25 TW TW99128398A patent/TWI469729B/en not_active IP Right Cessation
- 2010-09-02 US US12/875,096 patent/US20120048512A1/en not_active Abandoned
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5076152A (en) * | 1989-01-20 | 1991-12-31 | Schako Metallwarenfabrik Ferdinand Schad Kg | Apparatus for ventilation and removal of air |
US5121675A (en) * | 1989-02-04 | 1992-06-16 | Schako Metallwarenfabrik Ferdinand Schad Kg | Device for supplying air to and if need be evacuating air from a room |
JPH05164395A (en) * | 1991-04-30 | 1993-06-29 | Philip Morris Prod Inc | Ventilating device |
US5816908A (en) * | 1997-06-30 | 1998-10-06 | Chu Kuo Air-Con Engineering Co., Ltd. | Air shower for a clean room system |
US20010029163A1 (en) * | 2000-02-18 | 2001-10-11 | Rtkl Associates Inc. | Computer rack heat extraction device |
US6374627B1 (en) * | 2001-01-09 | 2002-04-23 | Donald J. Schumacher | Data center cooling system |
US20090173473A1 (en) * | 2002-03-28 | 2009-07-09 | American Power Conversion Corporation | Data center cooling |
US7878889B2 (en) * | 2002-03-28 | 2011-02-01 | American Power Conversion Corporation | Data center cooling |
US7037189B2 (en) * | 2003-05-27 | 2006-05-02 | Mayekawa Mfg. Co., Ltd. | Air shutter and installation method thereof |
US7226353B2 (en) * | 2004-01-13 | 2007-06-05 | Power Of 4, Llc | Cabinet for computer devices with air distribution device |
US20060168975A1 (en) * | 2005-01-28 | 2006-08-03 | Hewlett-Packard Development Company, L.P. | Thermal and power management apparatus |
US20090277605A1 (en) * | 2005-05-17 | 2009-11-12 | American Power Conversion Corporation | Cold aisle isolation |
US20080144279A1 (en) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co., Ltd. | Heat sink |
US20090156114A1 (en) * | 2007-12-18 | 2009-06-18 | International Business Machines Corporation | Apparatus and method for facilitating air cooling of an electronics rack |
US20110053488A1 (en) * | 2008-01-18 | 2011-03-03 | Mpc Inc. | Control system for exhaust gas fan system |
US8251785B2 (en) * | 2008-10-31 | 2012-08-28 | Cirrus Logic, Inc. | System and method for vertically stacked information handling system and infrastructure enclosures |
US20100190430A1 (en) * | 2009-01-29 | 2010-07-29 | International Business Machines Corporation | Air permeable material for data center cooling |
US20100285730A1 (en) * | 2009-05-11 | 2010-11-11 | Minel Kupferberg | High velocity nozzle and windband assembly |
US7990709B2 (en) * | 2009-09-23 | 2011-08-02 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics rack |
Also Published As
Publication number | Publication date |
---|---|
TWI469729B (en) | 2015-01-11 |
TW201210456A (en) | 2012-03-01 |
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Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHAN, HUNG-CHOU;REEL/FRAME:024935/0098 Effective date: 20100901 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |