US20100321089A1 - Complementary high voltage switched current source integrated circuit - Google Patents
Complementary high voltage switched current source integrated circuit Download PDFInfo
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- US20100321089A1 US20100321089A1 US12/869,406 US86940610A US2010321089A1 US 20100321089 A1 US20100321089 A1 US 20100321089A1 US 86940610 A US86940610 A US 86940610A US 2010321089 A1 US2010321089 A1 US 2010321089A1
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- pair
- type mosfet
- coupled
- high voltage
- current source
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/021—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of more than one type of element or means, e.g. BIMOS, composite devices such as IGBT
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/217—Class D power amplifiers; Switching amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
- H03K17/6871—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors the output circuit comprising more than one controlled field-effect transistor
- H03K17/6872—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors the output circuit comprising more than one controlled field-effect transistor using complementary field-effect transistors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/64—Generators producing trains of pulses, i.e. finite sequences of pulses
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
- H03K5/01—Shaping pulses
- H03K5/04—Shaping pulses by increasing duration; by decreasing duration
- H03K5/05—Shaping pulses by increasing duration; by decreasing duration by the use of clock signals or other time reference signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
- G01S7/52019—Details of transmitters
- G01S7/5202—Details of transmitters for pulse systems
Definitions
- This invention relates generally to an ultrasound scanning image system, and more particularly, to an array of high voltage switched current sources for a high voltage ultrasound transmit pulse generator to excite the piezoelectric or capacitive-electrostatic elements in the ultrasound transducer probe in an ultrasound B-scan or a color image system.
- Ultrasound medical imaging or nondestructive testing (NDT) application have a growing demand for more sophisticated excitation waveforms and sequential scanning method for large number of piezoelectric or capacitive-electrostatic elements array.
- the commonly used ultrasound transmit pulse generator circuit generally consist of a pair of P-type and N-type high voltage power MOSFETs driven by a very fast and powerful gate driver circuit. Each channel of the pulse generator needs to produce high voltage and high current to charge or discharge the load capacitance at ultrasound frequency or speed.
- the load capacitance including the piezoelectric or capacitive-electrostatic elements and the cable equivalent capacitance, usually is quite large.
- the advanced harmonic ultrasound imaging technology requires that the waveform generated from this pulse generator contains the least amount of second harmonics as possible.
- a complementary high voltage switched current source circuit has a complementary current source pair, wherein a first of the current source pair is coupled to a positive voltage rail and a second of the current source pair is coupled to a negative voltage rail.
- a digital logic-level control interface circuit is coupled to the complementary current source pair and to the positive voltage rail and the negative voltage rail.
- a pair of high voltage switches is coupled to the a complementary current source pair and the digital logic-level control interface circuit and controlled by the digital control interface circuit.
- FIG. 1 is a schematic diagram illustrating a conventional prior art complementary MOSFETs ultrasound transmitter pulse generator in a typical ultrasound B-scan image system
- FIG. 2 is a schematic diagram illustrating a transmit pulse generate channels for a 2-level ultrasound transducer excitation waveform integrated device circuit
- FIG. 3 is a schematic diagram illustrating a circuit architecture topology of a 5-level ultrasound transducer excitation waveform integrated device circuit
- FIG. 4 is a schematic detail diagram illustrating a circuit architecture topology of an ultrasound pulse generator using N-type MOSFETs for both positive going and negative going current switches;
- FIG. 5 is a schematic detail diagram illustrating both output MOSFETs in the high voltage switched current source of the transmit pulse generator in FIG. 4 being replaced by bipolar transistors;
- FIG. 6 is a schematic detail diagram illustrating a smaller switched current source to control the output MOSFETs in the transmit pulse generator
- FIG. 7 is a schematic detail diagram illustrating both output MOSFETs in a high voltage switched current source of the transmit pulse generator in FIG. 6 replaced with bipolar transistors;
- FIG. 8 is a schematic detail diagram of a high voltage switched current source of the transmit pulse generator wherein the high voltage MOSFETs are source driven.
- FIG. 1 a schematic diagram illustrating a conventional prior art complementary MOSFETs ultrasound transmitter pulse generator 100 (hereinafter pulse generator 100 ) in a typical ultrasound B-scan image system is shown.
- pulse generator 100 the source terminals of the P-type MOSFET 104 and N-type MOSFET 111 are connected to the positive and negative high voltage power supply rail 105 and 110 respectively.
- the gate terminals of the P-type MOSFET 104 and N-type MOSFET 111 are each connected to one of a pair of gate coupling capacitors 115 .
- the pair of gate coupling capacitors 115 are driven by control waveforms 116 generated by a gate driver circuit.
- the pulse generator 100 has a pair of Zener diodes 101 and 114 .
- the Zener diodes 101 and 114 have a first terminal coupled to the positive and negative high voltage power supply rail 105 and 110 respectively and a second terminal coupled to one of the pair of gate coupling capacitors 115 .
- the Zener diodes 101 and 114 are in parallel with gate-source DC bias voltage resistors 102 and 113 respectively.
- the forward direction of the Zener diodes 101 and 114 serve as the fast DC restoring diodes function for the AC capacitor coupling gate driving circuit, while the Zener diodes break-down direction protecting the possible over voltage of MOSFET gate to source voltages.
- the pair of switching diodes 109 work as the revise voltage blocking as well as the ultrasound receiver isolation propose.
- the resistor 108 in parallel with the transducer 107 discharge the capacitance of the transducer back to zero voltage after the waveform transmitted.
- a typical waveform 106 is shown in the FIG. 1 .
- the P-type MOSFET is generally two to three times bigger the N-type MOSFET, when having complementary MOSFET pair in current ultrasound applications.
- the circuit 200 has a pair of gate coupling capacitors 215 A and 215 B. Each of the pair of gate coupling capacitors 215 has a first terminal coupled to a waveform 216 . Each of the coupling capacitors 215 is driven by the control waveform 216 which is generated by a gate driver circuit.
- the circuit 200 has a P-type MOSFET 204 and N-type MOSFET 211 each having drain, gate and source terminals. The gate terminals of the P-type MOSFET 204 and N-type MOSFET 211 are each connected to a second terminal of one of the pair of gate coupling capacitors 215 .
- the circuit 200 has a pair of Zener diodes 201 and 214 .
- the Zener diodes 201 and 214 have a first terminal coupled to the positive and negative high voltage power supply rail 205 and 210 respectively and a second terminal coupled to one of the pair of gate coupling capacitors 215 .
- the Zener diodes 101 and 114 are in parallel with gate-source DC bias voltage resistors 202 and 213 respectively.
- the Zener diodes 201 and 214 serve the same function as they are in FIG. 1 .
- the circuit 200 has a pair of switching diodes 209 .
- the switching diodes 209 each has a first terminal coupled to one of the drain terminals of the P-type MOSFET 204 and N-type MOSFET 211 and a second terminal coupled to a resistor 208 coupled in parallel with a transducer 207 .
- the circuit 200 uses two well matched depletion current control devices 203 and 212 in series with the source terminals of the P-type MOSFET 204 and N-type MOSFET 211 respectively and power supply rails 205 and 210 respectively.
- the addition of the control devices 203 and 212 provides much tight current matching between positive and negative going current when the MOSFET switch 204 or 211 is activated.
- the circuit 300 is formed of a plurality of circuits 200 coupled together. In the present embodiment, three circuits 200 are used wherein the circuits are numbered 301 , 302 and 303 .
- the voltage supplies 305 a and 310 a have different absolute voltage value as the 305 b and 310 b to generate four waveform levels, when the pulse generate circuit 301 is activated followed by activation of the circuit 302 .
- the “return to zero” function is provided by the third circuit 303 when the “supply voltage” rails are both connect to zero volt or ground.
- the typical waveform this circuit can generate is shown in the waveform 306 in the FIG. 3 .
- the circuit 400 has a pair of gate coupling capacitors 415 A and 415 B. Each of the pair of gate coupling capacitors 415 A and 415 B has a first terminal coupled to a waveform 216 . Each of the coupling capacitors 415 A and 415 B is driven by the control waveform 216 which is generated by a gate driver circuit.
- the circuit 400 uses small P-type MOSFETs 417 and small N-type MOSFET 419 with a pair of N-type MOSFET 404 and 411 .
- This arrangement replaces the complementary P-type MOSFET 204 and N-type MOSFET 211 of FIG. 2 .
- the benefit of this novel implementation is twofold. Not only does this configuration save lot of silicon area, since to approximately match the MOSFET voltage and current, the P-type MOSFET is generally two to three times bigger the N-type MOSFET, but it also reduces the gate driver current.
- the P-type MOSFETs 417 and 419 each have a gate terminal coupled to one the coupling capacitors 415 A and 415 B respectively. Each P-type MOSFET 417 and 419 is further coupled to a resistive element 418 and 420 respectively.
- the pair of N-type MOSFETs 404 and 411 are each connected in series with current control devices 403 and 412 respectively and power supply rails 405 and 410 respectively. Each of the pair of N-type MOSFETs 404 and 411 is further coupled to one of the P-type MOSFET 417 and 419 .
- the circuit 400 has a pair of Zener diodes 401 and 414 .
- the Zener diodes 401 and 414 have a first terminal coupled to the positive and negative high voltage power supply rail 405 and 410 respectively and a second terminal coupled to one of the pair of gate coupling capacitors 415 A or 415 B.
- the Zener diodes 401 and 414 are in parallel with gate-source DC bias voltage resistors 402 and 413 respectively.
- the Zener diodes 401 and 414 serve the same function as they do in the previous embodiments.
- the circuit 400 has a pair of switching diodes 409 .
- the switching diodes 409 each has a first terminal coupled to one of the N-type MOSFETs 404 or 411 and a second terminal coupled to a resistor 408 .
- the resistor 408 is coupled in parallel with a transducer 407 .
- the benefit of this novel implementation is twofold. Not only does this configuration save lot of silicon area, since to approximately match the MOSFET voltage and current, the P-type MOSFET is generally two to three times bigger the N-type MOSFET, but it also reduces the gate driver current.
- FIG. 5 another embodiment of a complementary switched current source circuit 500 is shown. This embodiment is similar to that shown in FIG. 4 , thus the differences will be discussed.
- two bipolar transistor devices 504 and 511 are used and replace the MOSFETs 404 and 411 in FIG. 4 .
- the bipolar transistor devices 504 and 511 By using the bipolar transistor devices 504 and 511 , one is able to further reduce the die size of the integrated circuit of the previous embodiments.
- circuit 600 uses smaller current sources 603 and 612 and smaller control switchers 617 and 619 for regulating the currents passing through the matched resistors 618 and 620 to control the matched output N-type of MOSFETs 604 and 611 , to generate the matched, or almost matched output charge/discharge currents via 609 diodes. Because of the current sources and control switches are both smaller, the present embodiment will further save the circuit silicon die area.
- FIG. 7 another complementary switched current source circuit 700 is disclosed.
- the circuit 700 is similar to that shown in FIG. 6 .
- the output MOSFETs 604 and 611 are replaced by bipolar transistors 704 and 711 .
- This topology can further save the circuit silicon die area in the integrated circuit.
- FIG. 8 another complementary switched current source circuit 800 is disclosed.
- the circuit 800 is similar to that shown in FIG. 6 .
- the output MOSFETs 804 and 811 are source-driven. That means that the output MOSFET gates are kept at a fixed gate voltages of +VG and ⁇ VG supplied by 821 and 822 .
- the source-driver circuit components 817 , 803 , 819 and 812 can be low voltage components.
- the circuit 800 not only saves the high voltage components, but also speed up the current rise and fall timings due to the source-driving topology.
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- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Electronic Switches (AREA)
Abstract
Description
- The present application is a divisional of pending U.S. patent application entitled: “COMPLEMENTARY HIGH VOLTAGE SWITCHED CURRENT SOURCE INTEGRATED CIRCUIT”, Ser. No. 12/434,862, filed May 4, 2009, and in the name of the same inventors.
- This invention relates generally to an ultrasound scanning image system, and more particularly, to an array of high voltage switched current sources for a high voltage ultrasound transmit pulse generator to excite the piezoelectric or capacitive-electrostatic elements in the ultrasound transducer probe in an ultrasound B-scan or a color image system.
- Ultrasound medical imaging or nondestructive testing (NDT) application have a growing demand for more sophisticated excitation waveforms and sequential scanning method for large number of piezoelectric or capacitive-electrostatic elements array. The commonly used ultrasound transmit pulse generator circuit generally consist of a pair of P-type and N-type high voltage power MOSFETs driven by a very fast and powerful gate driver circuit. Each channel of the pulse generator needs to produce high voltage and high current to charge or discharge the load capacitance at ultrasound frequency or speed. The load capacitance, including the piezoelectric or capacitive-electrostatic elements and the cable equivalent capacitance, usually is quite large. The advanced harmonic ultrasound imaging technology requires that the waveform generated from this pulse generator contains the least amount of second harmonics as possible.
- Therefore, a need existed to provide a system and method to overcome the above problem. The system and method it would be desirable to provide a transmit pulse generating circuit and method that can produce well matched rising and falling edges would allow registered users the ability of adding content, contests and promotions to web properties.
- A complementary high voltage switched current source circuit has a complementary current source pair, wherein a first of the current source pair is coupled to a positive voltage rail and a second of the current source pair is coupled to a negative voltage rail. A digital logic-level control interface circuit is coupled to the complementary current source pair and to the positive voltage rail and the negative voltage rail. A pair of high voltage switches is coupled to the a complementary current source pair and the digital logic-level control interface circuit and controlled by the digital control interface circuit.
- The present invention is best understood by reference to the following detailed description when read in conjunction with the accompanying drawings.
-
FIG. 1 is a schematic diagram illustrating a conventional prior art complementary MOSFETs ultrasound transmitter pulse generator in a typical ultrasound B-scan image system; -
FIG. 2 is a schematic diagram illustrating a transmit pulse generate channels for a 2-level ultrasound transducer excitation waveform integrated device circuit; -
FIG. 3 is a schematic diagram illustrating a circuit architecture topology of a 5-level ultrasound transducer excitation waveform integrated device circuit; -
FIG. 4 is a schematic detail diagram illustrating a circuit architecture topology of an ultrasound pulse generator using N-type MOSFETs for both positive going and negative going current switches; -
FIG. 5 is a schematic detail diagram illustrating both output MOSFETs in the high voltage switched current source of the transmit pulse generator inFIG. 4 being replaced by bipolar transistors; -
FIG. 6 is a schematic detail diagram illustrating a smaller switched current source to control the output MOSFETs in the transmit pulse generator; -
FIG. 7 is a schematic detail diagram illustrating both output MOSFETs in a high voltage switched current source of the transmit pulse generator inFIG. 6 replaced with bipolar transistors; and -
FIG. 8 is a schematic detail diagram of a high voltage switched current source of the transmit pulse generator wherein the high voltage MOSFETs are source driven. - Common reference numerals are used throughout the drawings and detailed description to indicate like elements.
- Referring to
FIG. 1 , a schematic diagram illustrating a conventional prior art complementary MOSFETs ultrasound transmitter pulse generator 100 (hereinafter pulse generator 100) in a typical ultrasound B-scan image system is shown. In thepulse generator 100, the source terminals of the P-type MOSFET 104 and N-type MOSFET 111 are connected to the positive and negative high voltagepower supply rail type MOSFET 104 and N-type MOSFET 111 are each connected to one of a pair ofgate coupling capacitors 115. The pair ofgate coupling capacitors 115 are driven bycontrol waveforms 116 generated by a gate driver circuit. - The
pulse generator 100 has a pair of Zenerdiodes diodes power supply rail gate coupling capacitors 115. The Zenerdiodes bias voltage resistors - The forward direction of the Zener
diodes switching diodes 109 work as the revise voltage blocking as well as the ultrasound receiver isolation propose. In the 2-level transmit pulse generator circuit theresistor 108 in parallel with thetransducer 107, discharge the capacitance of the transducer back to zero voltage after the waveform transmitted. Atypical waveform 106 is shown in theFIG. 1 . - In advanced ultrasound harmonic medical imaging systems, it is required to generate the least amount of second harmonics in the waveform as possible. Therefore to reduce the amount of second harmonics in the waveform, one should try and match the pulse rise and fall edges, as well as the pulse positive and negative duration timing and pulse amplitudes.
- Because of device physics, even using the most current up to date state of art manufacturing processes, it is extremely difficult and cost prohibitive to make matching P-type and N-type MOSFETs having the same size or same current or characteristics. Presently, to approximately match the MOSFET voltage and current, the P-type MOSFET is generally two to three times bigger the N-type MOSFET, when having complementary MOSFET pair in current ultrasound applications.
- Referring now to
FIG. 2 , one embodiment of a complementary switchedcurrent source circuit 200 is shown. Thecircuit 200 has a pair of gate coupling capacitors 215A and 215B. Each of the pair ofgate coupling capacitors 215 has a first terminal coupled to awaveform 216. Each of thecoupling capacitors 215 is driven by thecontrol waveform 216 which is generated by a gate driver circuit. Thecircuit 200 has a P-type MOSFET 204 and N-type MOSFET 211 each having drain, gate and source terminals. The gate terminals of the P-type MOSFET 204 and N-type MOSFET 211 are each connected to a second terminal of one of the pair ofgate coupling capacitors 215. Thecircuit 200 has a pair of Zenerdiodes diodes power supply rail gate coupling capacitors 215. The Zenerdiodes bias voltage resistors diodes FIG. 1 . Thecircuit 200 has a pair ofswitching diodes 209. Theswitching diodes 209 each has a first terminal coupled to one of the drain terminals of the P-type MOSFET 204 and N-type MOSFET 211 and a second terminal coupled to aresistor 208 coupled in parallel with atransducer 207. - The
circuit 200 uses two well matched depletioncurrent control devices type MOSFET 204 and N-type MOSFET 211 respectively andpower supply rails control devices MOSFET switch - Referring now to
FIG. 3 , a 5-level ultrasound transmitpulse generator circuit 300 is shown. Thecircuit 300 is formed of a plurality ofcircuits 200 coupled together. In the present embodiment, threecircuits 200 are used wherein the circuits are numbered 301, 302 and 303. The voltage supplies 305 a and 310 a have different absolute voltage value as the 305 b and 310 b to generate four waveform levels, when the pulse generatecircuit 301 is activated followed by activation of thecircuit 302. The “return to zero” function is provided by thethird circuit 303 when the “supply voltage” rails are both connect to zero volt or ground. The typical waveform this circuit can generate is shown in thewaveform 306 in theFIG. 3 . - Referring now to
FIG. 4 , a complementary switchedcurrent source circuit 400 is shown. Thecircuit 400 has a pair of gate coupling capacitors 415A and 415B. Each of the pair of gate coupling capacitors 415A and 415B has a first terminal coupled to awaveform 216. Each of the coupling capacitors 415A and 415B is driven by thecontrol waveform 216 which is generated by a gate driver circuit. - The
circuit 400 uses small P-type MOSFETs 417 and small N-type MOSFET 419 with a pair of N-type MOSFET type MOSFET 204 and N-type MOSFET 211 ofFIG. 2 . The benefit of this novel implementation is twofold. Not only does this configuration save lot of silicon area, since to approximately match the MOSFET voltage and current, the P-type MOSFET is generally two to three times bigger the N-type MOSFET, but it also reduces the gate driver current. - The P-
type MOSFETs type MOSFET resistive element type MOSFETs current control devices type MOSFETs type MOSFET - The
circuit 400 has a pair ofZener diodes Zener diodes power supply rail Zener diodes bias voltage resistors Zener diodes - The
circuit 400 has a pair of switchingdiodes 409. The switchingdiodes 409 each has a first terminal coupled to one of the N-type MOSFETs resistor 408. Theresistor 408 is coupled in parallel with atransducer 407. - As previously stated, the benefit of this novel implementation is twofold. Not only does this configuration save lot of silicon area, since to approximately match the MOSFET voltage and current, the P-type MOSFET is generally two to three times bigger the N-type MOSFET, but it also reduces the gate driver current.
- Referring to
FIG. 5 , another embodiment of a complementary switchedcurrent source circuit 500 is shown. This embodiment is similar to that shown inFIG. 4 , thus the differences will be discussed. In the present embodiment, twobipolar transistor devices 504 and 511 are used and replace theMOSFETs FIG. 4 . By using thebipolar transistor devices 504 and 511, one is able to further reduce the die size of the integrated circuit of the previous embodiments. - Referring now to
FIG. 6 , another complementary switchedcurrent source circuit 600 is disclosed. Thecircuit 600 is similar to that shown inFIG. 4 . However,circuit 600 uses smallercurrent sources smaller control switchers resistors MOSFETs - Referring now to
FIG. 7 , another complementary switchedcurrent source circuit 700 is disclosed. Thecircuit 700 is similar to that shown inFIG. 6 . In the present embodiment, theoutput MOSFETs bipolar transistors - Referring now to
FIG. 8 , another complementary switchedcurrent source circuit 800 is disclosed. Thecircuit 800 is similar to that shown inFIG. 6 . However, inFIG. 8 , theoutput MOSFETs driver circuit components circuit 800 not only saves the high voltage components, but also speed up the current rise and fall timings due to the source-driving topology. - While embodiments of the disclosure have been described in terms of various specific embodiments, those skilled in the art will recognize that the embodiments of the disclosure can be practiced with modifications within the spirit and scope of the claims.
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US12/869,406 US20100321089A1 (en) | 2009-05-04 | 2010-08-26 | Complementary high voltage switched current source integrated circuit |
US13/188,324 US8138805B2 (en) | 2009-05-04 | 2011-07-21 | Complementary high voltage switched current source integrated circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/434,862 US7956653B1 (en) | 2009-05-04 | 2009-05-04 | Complementary high voltage switched current source integrated circuit |
US12/869,406 US20100321089A1 (en) | 2009-05-04 | 2010-08-26 | Complementary high voltage switched current source integrated circuit |
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US12/434,862 Division US7956653B1 (en) | 2009-05-04 | 2009-05-04 | Complementary high voltage switched current source integrated circuit |
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US13/188,324 Division US8138805B2 (en) | 2009-05-04 | 2011-07-21 | Complementary high voltage switched current source integrated circuit |
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US20100321089A1 true US20100321089A1 (en) | 2010-12-23 |
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US12/434,862 Expired - Fee Related US7956653B1 (en) | 2009-05-04 | 2009-05-04 | Complementary high voltage switched current source integrated circuit |
US12/869,406 Abandoned US20100321089A1 (en) | 2009-05-04 | 2010-08-26 | Complementary high voltage switched current source integrated circuit |
US13/188,324 Expired - Fee Related US8138805B2 (en) | 2009-05-04 | 2011-07-21 | Complementary high voltage switched current source integrated circuit |
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Cited By (5)
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US20130105457A1 (en) * | 2011-08-30 | 2013-05-02 | Watlow Electric Manufacturing Company | Thermal array system |
EP2779456A1 (en) * | 2013-03-15 | 2014-09-17 | Dialog Semiconductor B.V. | Method for reducing overdrive need in mos switching and logic circuit |
TWI465040B (en) * | 2011-03-08 | 2014-12-11 | Etron Technology Inc | Output stage circuit for outputting a driving current varying with a process |
IT201900001023A1 (en) * | 2019-01-23 | 2020-07-23 | St Microelectronics Srl | PROCEDURE FOR DRIVING A CORRESPONDING CAPACITIVE LOAD, CIRCUIT AND DEVICE |
WO2022013017A1 (en) * | 2020-07-15 | 2022-01-20 | Prodrive Technologies Innovation Services B.V. | Voltage waveform generator for plasma assisted processing apparatuses |
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US7956653B1 (en) * | 2009-05-04 | 2011-06-07 | Supertex, Inc. | Complementary high voltage switched current source integrated circuit |
US9157897B2 (en) * | 2009-10-21 | 2015-10-13 | Texas Instruments Incorporated | High voltage ultrasound transmitter with gate protection diodes and intrinsic output zeroing |
US8542037B2 (en) * | 2012-01-23 | 2013-09-24 | Supertex, Inc. | Multi-level high voltage pulser integrated circuit using low voltage MOSFETs |
CN102769379B (en) * | 2012-07-23 | 2015-04-15 | 广州慧智微电子有限公司 | Positive and negative voltage generation circuit applicable to silicon-on-insulator (SOI) process |
US8648627B1 (en) * | 2012-08-16 | 2014-02-11 | Supertex, Inc. | Programmable ultrasound transmit beamformer integrated circuit and method |
ITMI20131752A1 (en) * | 2013-10-21 | 2015-04-22 | St Microelectronics Srl | TRANSMISSION / RECEPTION CHANNEL FOR ULTRASOUND APPLICATIONS |
JP6452981B2 (en) * | 2014-08-04 | 2019-01-16 | エイブリック株式会社 | Transmission drive circuit and semiconductor integrated circuit device |
CN105827224B (en) * | 2016-03-16 | 2018-09-25 | 中国科学院上海微系统与信息技术研究所 | A kind of high pressure simulation integrated switching circuit |
WO2018024834A1 (en) * | 2016-08-04 | 2018-02-08 | Koninklijke Philips N.V. | Ultrasound system front-end circuit for a 128-element array probe |
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US5572147A (en) * | 1995-09-08 | 1996-11-05 | United Microelectronics Corporation | Power supply voltage detector |
US5909134A (en) * | 1995-12-18 | 1999-06-01 | Lg Semicon Co., Ltd. | Clock generator for generating complementary clock signals with minimal time differences |
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US7956653B1 (en) * | 2009-05-04 | 2011-06-07 | Supertex, Inc. | Complementary high voltage switched current source integrated circuit |
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2009
- 2009-05-04 US US12/434,862 patent/US7956653B1/en not_active Expired - Fee Related
-
2010
- 2010-08-26 US US12/869,406 patent/US20100321089A1/en not_active Abandoned
-
2011
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI465040B (en) * | 2011-03-08 | 2014-12-11 | Etron Technology Inc | Output stage circuit for outputting a driving current varying with a process |
US20130105457A1 (en) * | 2011-08-30 | 2013-05-02 | Watlow Electric Manufacturing Company | Thermal array system |
US10002779B2 (en) * | 2011-08-30 | 2018-06-19 | Watlow Electric Manufacturing Company | Thermal array system |
EP2779456A1 (en) * | 2013-03-15 | 2014-09-17 | Dialog Semiconductor B.V. | Method for reducing overdrive need in mos switching and logic circuit |
US20140266326A1 (en) * | 2013-03-15 | 2014-09-18 | Dialog Semiconductor B.V. | Method for Reducing Overdrive Need in MOS Switching and Logic Circuit |
US9882563B2 (en) * | 2013-03-15 | 2018-01-30 | Dialog Semiconductor B.V. | Method for reducing overdrive need in MOS switching and logic circuit |
IT201900001023A1 (en) * | 2019-01-23 | 2020-07-23 | St Microelectronics Srl | PROCEDURE FOR DRIVING A CORRESPONDING CAPACITIVE LOAD, CIRCUIT AND DEVICE |
EP3687068A1 (en) * | 2019-01-23 | 2020-07-29 | STMicroelectronics Srl | A method of driving a capacitive load, corresponding circuit and device |
US11581892B2 (en) | 2019-01-23 | 2023-02-14 | Stmicroelectronics S.R.L. | Method of driving a capacitive load, corresponding circuit and device |
WO2022013017A1 (en) * | 2020-07-15 | 2022-01-20 | Prodrive Technologies Innovation Services B.V. | Voltage waveform generator for plasma assisted processing apparatuses |
NL2026071B1 (en) * | 2020-07-15 | 2022-03-18 | Prodrive Tech Bv | Voltage waveform generator for plasma assisted processing apparatuses |
Also Published As
Publication number | Publication date |
---|---|
US7956653B1 (en) | 2011-06-07 |
US8138805B2 (en) | 2012-03-20 |
US20110273224A1 (en) | 2011-11-10 |
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