US20100314077A1 - Cooling system for a computer device - Google Patents
Cooling system for a computer device Download PDFInfo
- Publication number
- US20100314077A1 US20100314077A1 US12/789,690 US78969010A US2010314077A1 US 20100314077 A1 US20100314077 A1 US 20100314077A1 US 78969010 A US78969010 A US 78969010A US 2010314077 A1 US2010314077 A1 US 2010314077A1
- Authority
- US
- United States
- Prior art keywords
- fluid
- heat
- base unit
- cooling system
- containing passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling system for cooling a heat source includes: a base unit configured with a fluid containing passage therein; a heat-conductive fluid container mounted on a mounting side of the base unit, formed with a fluid-receiving space therein in spatial communication with the fluid containing passage in the base unit, and having an outer contacting side adapted to be placed in thermal contact with the heat source; and a heat exchanging fluid contained in the fluid-receiving space in the fluid container and the fluid containing passage in the base unit, the heat exchanging fluid being capable of changing into fluid vapor when absorbing heat generated by the heat source, the fluid vapor being capable of changing into fluid condensate when cooled.
Description
- This application claims priority of Taiwanese Application No. 098210312, filed on Jun. 10, 2009.
- 1. Field of the Invention
- The invention relates to a cooling system, and more particularly to a cooling system for a computer device.
- 2. Description of the Related Art
- Referring to
FIG. 1 , a conventionalwater cooling mechanism 14 is shown to be applied to acomputer device 10 that includes acomputer housing 11, amotherboard 12 disposed in thecomputer housing 11 and mounted with a central processing unit (CPU) 121, avideo card 13 and other chips (not shown) thereon. The conventionalwater cooling mechanism 14 includes a hollowheat dissipating body 143 attached directly to theCPU 121, aheat sink 141 disposed in thecomputer housing 11, aconduit unit 142 that is coupled between the heat-dissipatingbody 143 and theheat sink 141 and that contains water therein, and afan 144 mounted on theheat sink 141. Heat generated by theCPU 121 can be transferred to theheat sink 141 through heat exchange with the water contained in theconduit unit 142, and thefan 144 is operable to cool theheat sink 141. Therefore, heat dissipation of theCPU 121 is attained. - However, due to the presence of the
conduit unit 142, the assembly procedure of the conventionalwater cooling mechanism 14 is relatively complicated. Furthermore, when heat generated by the other chips is to be dissipated, additional conduits are required and occupy additional space in thecomputer housing 11. As a result, the conventionalwater cooling mechanism 14 is not suitable for a miniaturized computer device. - Therefore, the object of the present invention is to provide a cooling system that can provide a superior cooling effect and that can overcome the aforesaid drawbacks of the prior art.
- According to the present invention, there is provided a cooling system for cooling a heat source. The cooling system comprises:
- a base unit configured with a fluid containing passage therein and having a mounting side;
- a heat-conductive fluid container mounted on the mounting side of the base unit, formed with a fluid-receiving space therein in spatial communication with the fluid containing passage in the base unit, and having an outer contacting side adapted to be placed in thermal contact with the heat source; and
- a heat exchanging fluid contained in the fluid-receiving space in the fluid container and in the fluid containing passage in the base unit, the heat exchanging fluid being capable of changing into fluid vapor when absorbing heat generated by the heat source, the fluid vapor being capable of changing into fluid condensate when cooled.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:
-
FIG. 1 is a perspective view showing a conventional water cooling mechanism applied to a computer device; -
FIGS. 2 and 3 are perspective views showing a computer device provided with the preferred embodiment of a cooling system according to the present invention, wherein a cover plate is dispensed with inFIG. 2 ; -
FIG. 4 is an exploded perspective view showing the preferred embodiment; -
FIG. 5 is a schematic side view showing the preferred embodiment; and -
FIG. 6 is a schematic side view showing a base body of the preferred embodiment. - Referring to
FIGS. 2 and 3 , the preferred embodiment of a cooling system according to the present invention is shown to be applied to a computer device, such as a home computer, for cooling the computer device serving as a heat source. The computer device generally includes a motherboard mounted with a CPU, a plurality of memory cards, South-bridge chips and North-bridge chips thereon (not shown) and disposed in a housing. The cooling system includes arectangular base unit 20, a heat-conductive fluid container 3, a heat exchanging fluid (not shown), twoheat dissipating devices driving units 5. - Referring further to
FIGS. 4 to 6 , thebase unit 2 is configured with a fluid containing pas sage therein. In this embodiment, thebase unit 2 can be a part of a housing of the computer device, and includes arectangular base body 21 and acover body 22. Thebase body 21 is made of a heat-conductive material, such as aluminum, and has amounting side 211, and a connectingside 212 opposite to themounting side 211 and formed with a groove unit 20 (seeFIG. 4 ). Thecover body 22 is attached on the connectingside 212 of thebase body 21, and covers sealingly thegroove unit 20 such that thegroove unit 20 constitutes the fluid containing passage. Themounting side 211 of thebase body 21 is formed with a plurality ofopenings 201˜206 in spatial communication with the fluid containing passage in thebase unit 2, as shown inFIG. 6 . In this embodiment, thebase unit 2 is formed with first and second throughholes mounting side 211 to the connectingside 212. The motherboard of the computer device is disposed in the first throughhole 23, and is mounted to thebase body 21 through aplate body 8 fixed on the connectingside 212 of thebase body 21 and covering the first through hole 23 (seeFIG. 3 ). In this embodiment, thebase unit 2 has a thickness of about 3 cm, and is relatively small, thereby facilitating miniaturization of the computer device. - In this embodiment, the heat-
conductive fluid container 3 is mounted on themounting side 211 of thebase body 21, and extends across the throughhole 23 in thebase unit 2. In addition, the heat-conductive fluid container 3 is made of copper, is adapted to be placed in contact with the CPU, the South-bridge chips and the North-bridge chips, and is formed with a fluid-receiving space therein in spatial communication with the fluid containing passage in thebase unit 2 via theopenings FIG. 5 . - The heat exchanging fluid, such as water, (not shown) is contained in the fluid-receiving space in the
fluid container 3 and in the fluid containing passage in thebase unit 2. The heat exchanging fluid is capable of changing into fluid vapor when absorbing heat generated by the heat source. The fluid vapor is capable of changing into fluid condensate when cooled. - As shown in
FIG. 4 , theheat sink device 4 includes two heat-conductive bodies dissipating fins 43, and afan unit 44. In this embodiment, the heat-conductive bodies mounting side 211 of thebase body 21 of thebase unit 2, and are spaced apart from each other. Each of the heat-conductive bodies receiving space base unit 2 via a corresponding one of theopenings base body 21 of the base unit 2 (seeFIGS. 4 and 5 ) such that the innerreceiving space conductive bodies dissipating fins 43 interconnect the heat-conductive bodies hole 24 in thebase unit 2. Thefan unit 44 is disposed between the heat-conductive bodies base body 21 via the second throughhole 24, and is visible from the connectingside 212 of thebase body 21 for cooling thedissipating fins 43, as shown inFIG. 3 . - As shown in
FIG. 2 , theheat sink device 4′ is adapted for dissipating heat generated by the memory cards of the computer device in this embodiment. Theheat sink device 4′ is mounted on themounting side 211 of thebase body 21 of thebase unit 2, and includes two heat-conductive bodies 41′, 42′ spaced apart from each other, and a plurality of heat-dissipatingfins 43′ interconnecting the heat-conductive bodies 41′, 42′. Each of the heat-conductive bodies 41′, 42′ is formed with an inner receiving space (not shown) in spatial communication with the fluid containing passage in thebase unit 2 via a corresponding one of theopenings 203, 209 in thebase body 21 of the base unit 2 (seeFIG. 5 ) such that the inner receiving space in each of the heat-conductive bodies 41′, 42′ permits flow of the heat exchanging fluid thereinto. It is noted that a slot is defined between an adjacent pair of the heat-dissipating fins 43′ and permits extension of a corresponding memory card 9 therethrough such that heat generated by the corresponding memory card 9 can be dissipated, as shown inFIG. 2 . - As shown in
FIG. 4 , eachdriving unit 5 drives flow of the heat exchanging fluid in the fluid containing passage in thebase unit 2, and includes amotor 51 and afluid impeller 52. For eachdriving unit 5, themotor 51 is mounted on themounting side 211 of thebase body 21 of thebase unit 2 and has a drive shaft (not shown) extending into the fluid containing passage in thebase unit 2. Thefluid impeller 52 is disposed in the fluid containing passage in thebase unit 2, and is coupled to the drive shaft of themotor 51 such that thefluid impeller 52 is operable to rotate in response to operation of themotor 51, thereby driving flow of the heat exchanging fluid in the fluid containing passage in thebase unit 2. - In sum, due to the presence of the
heat sink devices fluid container 3, and the fluid containing passage contained with the heat exchanging fluid, the cooling system of the present invention can effectively dissipate heat generated by the computer device, thereby providing a superior cooling effect. - While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (7)
1. A cooling system for cooling a heat source, comprising:
a base unit configured with a fluid containing passage therein and having a mounting side;
a heat-conductive fluid container mounted on said mounting side of said base unit, formed with a fluid-receiving space therein in spatial communication with said fluid containing passage in said base unit, and having an outer contacting side adapted to be placed in thermal contact with the heat source; and
a heat exchanging fluid contained in the fluid-receiving space in said fluid container and in said fluid containing passage in said base unit, said heat exchanging fluid being capable of changing into fluid vapor when absorbing heat generated by the heat source, said fluid vapor being capable of changing into fluid condensate when cooled.
2. The cooling system as claimed in claim 1 , further comprising at least one driving unit for driving flow of said heat exchanging fluid in said fluid containing passage in said base unit, said driving unit including a motor mounted on said mounting side of said base unit and having a drive shaft extending into said fluid containing passage in said base unit, and a fluid impeller disposed in said fluid containing passage in said base unit, and coupled to said drive shaft of said motor such that said fluid impeller is operable to rotate in response to operation of said motor, thereby driving flow of said heat exchanging fluid in said fluid containing passage in said base unit.
3. The cooling system as claimed in claim 1 , further comprising at least one heat sink device mounted on said base unit for dissipating the heat generated by the heat source.
4. The cooling system as claimed in claim 3 , wherein said heat sink device includes:
two heat-conductive bodies mounted on said mounting side of said base unit, and spaced apart from each other, each of said heat-conductive bodies being formed with an inner receiving space in spatial communication with said fluid containing passage in said base unit such that said inner receiving space in each of said heat-conductive bodies permits flow of said heat exchanging fluid thereinto; and
a plurality of heat-dissipating fins interconnecting said heat-conductive bodies.
5. The cooling system as claimed in claim 4 , wherein said heat sink device further includes a fan unit disposed between said heat-conductive bodies for cooling said heat-dissipating fins.
6. The cooling system as claimed in claim 1 , wherein said base unit includes:
a base body having said mounting side, and a connecting side opposite to said mounting side and formed with a groove unit; and
a cover body attached on said connecting side surface of said base body, and covering sealingly said groove unit such that said groove unit constitutes said fluid containing passage.
7. The cooling system as claimed in claim 1 , wherein said heat exchanging fluid includes water.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098210312 | 2009-06-10 | ||
TW098210312U TWM371403U (en) | 2009-06-10 | 2009-06-10 | Water-cooling thin-type cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100314077A1 true US20100314077A1 (en) | 2010-12-16 |
Family
ID=43305389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/789,690 Abandoned US20100314077A1 (en) | 2009-06-10 | 2010-05-28 | Cooling system for a computer device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100314077A1 (en) |
TW (1) | TWM371403U (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6981543B2 (en) * | 2001-09-20 | 2006-01-03 | Intel Corporation | Modular capillary pumped loop cooling system |
WO2007086353A1 (en) * | 2006-01-24 | 2007-08-02 | Nec Corporation | Liquid-cooled heat radiation device |
US20080202730A1 (en) * | 2007-02-23 | 2008-08-28 | Alps Electric Co., Ltd. | Liquid cooling system |
US20090090489A1 (en) * | 2007-10-05 | 2009-04-09 | Asia Vital Components Co., Ltd. | Water-cooling heat-dissipating module of electronic apparatus |
-
2009
- 2009-06-10 TW TW098210312U patent/TWM371403U/en not_active IP Right Cessation
-
2010
- 2010-05-28 US US12/789,690 patent/US20100314077A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6981543B2 (en) * | 2001-09-20 | 2006-01-03 | Intel Corporation | Modular capillary pumped loop cooling system |
WO2007086353A1 (en) * | 2006-01-24 | 2007-08-02 | Nec Corporation | Liquid-cooled heat radiation device |
US8081460B2 (en) * | 2006-01-24 | 2011-12-20 | Nec Corporation | Liquid-cooled heat radiator |
US20080202730A1 (en) * | 2007-02-23 | 2008-08-28 | Alps Electric Co., Ltd. | Liquid cooling system |
US20090090489A1 (en) * | 2007-10-05 | 2009-04-09 | Asia Vital Components Co., Ltd. | Water-cooling heat-dissipating module of electronic apparatus |
Also Published As
Publication number | Publication date |
---|---|
TWM371403U (en) | 2009-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CHUN TENG ENTERPRISE CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUANG, WEN-JIUN;REEL/FRAME:024454/0617 Effective date: 20100427 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |