US20100107412A1 - Ink-jet head and its manufacture method - Google Patents
Ink-jet head and its manufacture method Download PDFInfo
- Publication number
- US20100107412A1 US20100107412A1 US12/683,097 US68309710A US2010107412A1 US 20100107412 A1 US20100107412 A1 US 20100107412A1 US 68309710 A US68309710 A US 68309710A US 2010107412 A1 US2010107412 A1 US 2010107412A1
- Authority
- US
- United States
- Prior art keywords
- hydrolysable
- jet head
- ink jet
- manufacturing
- substituent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 16
- 239000000463 material Substances 0.000 claims abstract description 51
- -1 silane compound Chemical class 0.000 claims abstract description 51
- 229910000077 silane Inorganic materials 0.000 claims abstract description 48
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 40
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011737 fluorine Substances 0.000 claims abstract description 38
- 239000007859 condensation product Substances 0.000 claims abstract description 28
- 239000011342 resin composition Substances 0.000 claims abstract description 18
- 125000001424 substituent group Chemical group 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 19
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 17
- 150000004756 silanes Chemical class 0.000 claims description 13
- 125000002091 cationic group Chemical group 0.000 claims description 12
- 125000001153 fluoro group Chemical group F* 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 4
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 3
- 239000007788 liquid Substances 0.000 description 57
- 229920005989 resin Polymers 0.000 description 36
- 239000011347 resin Substances 0.000 description 36
- 230000002940 repellent Effects 0.000 description 34
- 239000005871 repellent Substances 0.000 description 34
- 239000011248 coating agent Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 19
- 239000000203 mixture Substances 0.000 description 17
- 239000003999 initiator Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 230000006872 improvement Effects 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 238000006460 hydrolysis reaction Methods 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 230000007062 hydrolysis Effects 0.000 description 6
- 239000008199 coating composition Substances 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- YTJDSANDEZLYOU-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoro-2-[4-(1,1,1,3,3,3-hexafluoro-2-hydroxypropan-2-yl)phenyl]propan-2-ol Chemical compound FC(F)(F)C(C(F)(F)F)(O)C1=CC=C(C(O)(C(F)(F)F)C(F)(F)F)C=C1 YTJDSANDEZLYOU-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 239000012952 cationic photoinitiator Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- QDWOFWLEARWNLW-UHFFFAOYSA-N [SiH4].OS(=O)(=O)C(F)(F)F Chemical compound [SiH4].OS(=O)(=O)C(F)(F)F QDWOFWLEARWNLW-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000002877 alkyl aryl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000005529 alkyleneoxy group Chemical group 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- XPBBUZJBQWWFFJ-UHFFFAOYSA-N fluorosilane Chemical compound [SiH3]F XPBBUZJBQWWFFJ-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 150000002576 ketones Chemical group 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 2
- 125000000229 (C1-C4)alkoxy group Chemical group 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 1
- 125000006552 (C3-C8) cycloalkyl group Chemical group 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- WQMWHMMJVJNCAL-UHFFFAOYSA-N 2,4-dimethylpenta-1,4-dien-3-one Chemical compound CC(=C)C(=O)C(C)=C WQMWHMMJVJNCAL-UHFFFAOYSA-N 0.000 description 1
- IGZBSJAMZHNHKE-UHFFFAOYSA-N 2-[[4-[bis[4-(oxiran-2-ylmethoxy)phenyl]methyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C(C=1C=CC(OCC2OC2)=CC=1)C(C=C1)=CC=C1OCC1CO1 IGZBSJAMZHNHKE-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- DPBNFTGTZKLYDL-UHFFFAOYSA-N 3,4-dihydrodioxol-1-ium Chemical compound C1CC=[O+]O1 DPBNFTGTZKLYDL-UHFFFAOYSA-N 0.000 description 1
- AHIPJALLQVEEQF-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1COC(C=C1)=CC=C1N(CC1OC1)CC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 1
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 125000003601 C2-C6 alkynyl group Chemical group 0.000 description 1
- 125000000041 C6-C10 aryl group Chemical group 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical group F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 241001082241 Lythrum hyssopifolia Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 229910003074 TiCl4 Inorganic materials 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- HITZGLBEZMKWBW-UHFFFAOYSA-N ac1n8rtr Chemical group C1CC2OC2CC1CC[Si](O1)(O2)O[Si](O3)(C4CCCC4)O[Si](O4)(C5CCCC5)O[Si]1(C1CCCC1)O[Si](O1)(C5CCCC5)O[Si]2(C2CCCC2)O[Si]3(C2CCCC2)O[Si]41C1CCCC1 HITZGLBEZMKWBW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- IDSLNGDJQFVDPQ-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1 IDSLNGDJQFVDPQ-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000005626 carbonium group Chemical group 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- SBTSVTLGWRLWOD-UHFFFAOYSA-L copper(ii) triflate Chemical compound [Cu+2].[O-]S(=O)(=O)C(F)(F)F.[O-]S(=O)(=O)C(F)(F)F SBTSVTLGWRLWOD-UHFFFAOYSA-L 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000004294 cyclic thioethers Chemical group 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical compound [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- KUCGHDUQOVVQED-UHFFFAOYSA-N ethyl(tripropoxy)silane Chemical compound CCCO[Si](CC)(OCCC)OCCC KUCGHDUQOVVQED-UHFFFAOYSA-N 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920006168 hydrated nitrile rubber Polymers 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-O oxonium Chemical compound [OH3+] XLYOFNOQVPJJNP-UHFFFAOYSA-O 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- FABOKLHQXVRECE-UHFFFAOYSA-N phenyl(tripropoxy)silane Chemical compound CCCO[Si](OCCC)(OCCC)C1=CC=CC=C1 FABOKLHQXVRECE-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- SPVXKVOXSXTJOY-UHFFFAOYSA-O selenonium Chemical compound [SeH3+] SPVXKVOXSXTJOY-UHFFFAOYSA-O 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 125000005323 thioketone group Chemical group 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- HHPPHUYKUOAWJV-UHFFFAOYSA-N triethoxy-[4-(oxiran-2-yl)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCC1CO1 HHPPHUYKUOAWJV-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- VUWVDNLZJXLQPT-UHFFFAOYSA-N tripropoxy(propyl)silane Chemical compound CCCO[Si](CCC)(OCCC)OCCC VUWVDNLZJXLQPT-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1606—Coating the nozzle area or the ink chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Definitions
- This invention is in an ink jet head and its manufacture method.
- a surface treatment is becoming more important to maintain ejecting performance by keeping ejecting opening surface as same condition at any time.
- a liquid repellent material is demanded for easy wiping, and wiping durability.
- the liquid repellent layer when the liquid repellent layer is prepared on the surface, the liquid repellent layer needs to adhere to its lower layer, and the problem of peeling off of liquid repellent layer may occur. Since the ink used for an ink jet head is not neutral in many cases, it is also required that the liquid repellent material should have durability against ink and have adhesion power to a nozzle. In addition to preventing peeling, from a viewpoint of simplification of manufacturing process and cost reduction, the process is desired that the nozzle material and liquid repellent layer is prepared all at once. That is, nozzle material itself is desired to have liquid repellency.
- the surface treatment method which used the fluoride containing silane compound is indicated in Japanese Patent Publication No 10-505870 and U.S. Pat. No. 6,283,578.
- fluorine-containing compounds generally have low dissolubility to other resin, it was difficult to mix with photosensitive resin and to use together.
- the block copolymer having fluorine-containing group was indicated in Japanese Patent Application Laid-Open No. 2002-105152 as a coating composition, it could not be applied to the high-precision patterning like nozzle forming.
- Japanese Patent Application Laid-Open No. 2002-292878 referred to the orifice plate having nozzle structure, which was made of fluorine-containing resin. Since fluorine-containing resin did not have photosensitive characteristic corresponding to patterning by photo-lithography, the nozzle had to be formed by dry etching etc. Furthermore, the inside of ink passage of a nozzle needs to be hydrophilic in order to obtain the ejecting performance, hydrophilic processing needed to be performed inside of the ink passage and the adhesion side with basis material and so on.
- Cationically polymerizable resin composition which included fluorine-containing compounds, was indicated by Japanese Patent Application Laid-Open No. 8-290572.
- the purpose of this invention was the rate reduction of water absorption of material, not liquid repellency. Since the compound in this invention has hydroxyl group for dissolubility with resin composition, the composition did not show liquid repellency.
- U.S. Pat. No. 5,644,014, EP B1 587667 and Japanese Patent Publication No. 3306442 referred to the liquid repellent material comprising hydrolysable silane compounds which had fluorine-containing group.
- the above-mentioned material is indicating the photo curability which was derived from photo radical polymerization, it is not mentioned about pattern formation using photo lithography technology nor the application to an ink jet head.
- This invention is made in view of above-mentioned many points, carried out to provide liquid repellent material of an ink jet head, which has high liquid repellency, high durability against the wiping (to maintain high liquid repellency) and the ease of wiping simultaneously, and which realizes high-quality image recording.
- the further purpose is to offer a manufacturing method of ink jet head which realizes the improvement in accuracy of the ejection outlet portion of a nozzle and a simple manufacturing process, by giving liquid repellent nature to the above-mentioned nozzle material itself, and making a liquid repellent processing process unnecessary.
- the present invention designed to attain the above-mentioned objectives is an ink jet head, wherein the nozzle material comprises condensation product of hydrolysable silane compound having fluorine-containing group and photo-polymerizable resin composition.
- Another present invention designed to attain the above-mentioned objectives is a method of manufacturing ink jet head, which is forming the nozzle having liquid repellent nature on the surface thereof by pattern-exposure and developing a nozzle material on the substrate, wherein the nozzle material comprises condensation product of a hydrolysable silane compound having fluorine-containing group and photo-polymerizable resin composition.
- liquid repellent material and photo resist composition are improved by using the above-mentioned composition.
- good patterning characteristic corresponding to formation of a high precision structure like a nozzle, high liquid repellency and high wiping durability are realized without liquid repellent processing on the surface.
- FIG. 1 is a perspective view of a substrate to be used for manufacturing the ink jet head of this invention.
- FIG. 2 is a 2 - 2 sectional view of FIG. 1 , showing an initial step of manufacturing the ink jet head of this invention.
- FIG. 3 is a sectional view showing a step for manufacturing the ink jet head of this invention.
- FIG. 4 is a sectional view showing a step for manufacturing the ink jet head of this invention.
- FIG. 5 is a sectional view showing a step for manufacturing the ink jet head of this invention.
- FIG. 6 is a sectional view showing a step for manufacturing the ink jet head of this invention.
- FIG. 7 is a sectional view showing a step for manufacturing the ink jet head of this invention.
- FIG. 8 is a sectional view showing the ink jet head of this invention manufactured by the steps of FIGS. 2 to 7 .
- the cured material has the siloxane frame (Inorganic frame) formed from the hydrolysable silane, and a frame (Organic frame: ether bond when using the epoxy group) by curing the cationically polymerizable group.
- a cured material becomes into the so-called organic and inorganic hybrid cured material, and durability against wiping and its recording liquid is improved by leaps and bounds. That is, it is thought that its strength as a film improves and the wiping resistance improves compared with liquid repellent layer formed only by the siloxane frame since liquid repellent layer of this invention has an organic frame.
- the hydrolysable silane compound having fluorine-containing group which is one of the starting materials of the condensation product, is indispensable to have one or more non-hydrolysable fluorine-containing group and hydrolysable substituent.
- non-hydrolysable fluorine-containing group straight-chain or blanched-chain fluoro-carbon group can be referred.
- the terminal or the side chain is preferred to be trifluoromethyl or pentafluoroethyl group. Owing to its surface free energy, fluorine-containing group have tendency to arrange in the surface.
- fluorine-containing group of the fluorosilane contains generally at least 1, preferably at least 3 and in particular at least 5 fluorine atoms, and generally not more than 30, more preferably not more than 25 fluorine atoms which are attached to one or more carbon atoms. It is preferred that said carbon atoms are aliphatic including cycloaliphatic atoms. Further, the carbon atoms to which fluorine atoms are attached are preferably separated by at least two atoms from the silicon atom, which are preferably carbon and/or oxygen atoms, e.g. a C 1-4 alkylene or a C 1-4 alkylenoxy, such as an ethylene or ethylenoxy linkage.
- Preferred hydrolysable silanes having a fluorine-containing group are those of general formula (1):
- R f is a non-hydrolysable substituent having 1 to 30 fluorine atoms bonded to carbon atoms
- R is a non-hydrolysable substituent
- X is a hydrolysable substituent
- b is an integer from 0 to 2, preferably 0 or 1 and in particular 0.
- the hydrolysable substituents X which may be identical or different from one another, are, for example, hydrogen or halogen (F, Cl, Br or I), alkoxy (preferably C 1-6 alkoxy, such as methoxy, ethoxy, n-propoxy, isopropoxy and n-butoxy, sec-butoxy, isobutoxy, and tert-butoxy), aryloxy (preferably C 6-10 aryloxy, such as phenoxy), acyloxy (preferably C 1-6 acyloxy, such as acetoxy or propionyloxy), alkylcarbonyl (preferably C 2-7 alkycarbonyl, such as acetyl).
- Preferred hydrolysable substituents are halogen, alkoxy groups, and acyloxy groups. Particularly preferred hydrolysable substituents are C 1-4 alkoxy groups, especially methoxy and ethoxy.
- the non-hydrolysable substituent R which may be identical to or different from one another, may be a non-hydrolysable substituent R containing a functional group or may be a non-hydrolysable substituent R without a functional group.
- the substituent R if present, is preferably a group without a functional group.
- the non-hydrolysable substituent R without a functional group is, for example, alkyl (e.g., C 1-8 alkyl, preferably C 1-6 alkyl, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, s-butyl and t-butyl, pentyl, hexyl, and octyl), cycloalkyl (e.g. C 3-8 cycloalkyl, such as cyclopropyl, cyclopentyl or cyclohexyl), alkenyl (e.g., alkyl (e.g., C 1-8 alkyl, preferably C 1-6 alkyl, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, s-butyl and t-butyl, pentyl, hexyl, and octyl),
- C 2-6 alkenyl such as vinyl, 1-propenyl, 2-propenyl and butenyl
- alkynyl e.g. C 2-6 alkynyl, such as acetylenyl and propargyl
- cycloalkenyl and cycloalkynyl e.g. C 2-6 alkenyl and cycloalkynyl
- aryl e.g. C 6-10 aryl, such as phenyl and naphthyl
- corresponding arylalkyl and alkylaryl e.g. C 7-15 arylalkyl and alkylaryl, such as benzyl or tolyl
- the substituent R may contain one or more substituents, such as halogen, alkyl, aryl, and alkoxy.
- R when present is preferably methyl or ethyl.
- R f is CF 3 (CF 2 ) n —Z— where n and Z are defined as defined in general formula (4) below.
- X is as defined in general compound 1 and preferably is methoxy or ethoxy
- Z is a divalent organic group
- n is an integer from 0 to 20, preferably 3 to 15, more preferably 5 to 10.
- Z contains not more than 10 carbon atoms and Z is more preferably a divalent alkylene or alkyleneoxy group having not more than 6 carbon atoms, such as methylene, ethylene, propylene, butylene, methylenoxy, ethyleneoxy, propylenoxy, and butylenoxy.
- ethylene is ethylene.
- C 2 F 5 —C 2 H 4 —SiX 3 Particularly preferred are C 2 F 5 —C 2 H 4 —SiX 3 , C 4 F 9 —C 2 H 4 —SiX 3 , C 6 F 13 —C 2 H 4 —SiX 3 , C 8 F 13 —C 2 H 4 —SiX 3 , C 10 F 21 —C 2 H 4 —SiX 3 and C 12 F 25 —C 2 H 4 —SiX 3 , where X is a methoxy or ethoxy group.
- the inventors have found that by using at least two different hydrolysable silanes having a fluorine-containing group of a different kind unexpectedly improved results are obtained, especially with regard to liquid repellent properties, wiping durability, and resistance to chemicals such as recording liquid.
- the silanes used preferably differ in the number of fluorine atoms contained therein or in the length (number of carbon atoms in the chain) of the fluorine-containing substituent.
- the fluoroalkyl groups of different length are believed to cause a structural arrangement of higher density, since the fluoroalkyl group should take an optimal arrangement in the uppermost surface.
- the high fluorine concentration in the uppermost surface is represented by fluoroalkyl groups of different length which results in the named improvements compared to the addition of a single fluorosilane.
- silane compound having fluorine-containing group i.e., silane compound not having fluorine-containing group
- silane compound not having fluorine-containing group silane compound not having fluorine-containing group
- condensation product and photo-polymerization composition it is also suitable for it from a viewpoint of durability to introduce a polymerizable group into condensation product.
- radical polymerizable group and cationically polymerizable group can be used as polymerizable substituent of hydrolysable silane compound. From a viewpoint of alkali ink resistance, cationically polymerizable group is desirable here.
- a preferred hydrolysable silane having a cationically polymerizable group is a compound of general formula (2):
- R c is a non-hydrolysable substituent having a cationically polymerizable group
- R is a non-hydrolysable substituent
- X is a hydrolysable substituent
- b is an integer from 0 to 2.
- a cationically polymerizable organic group a cyclic ether group represented epoxy group and oxetane group, a vinyl ether group etc. can be used.
- an epoxy group is preferable.
- substituent Rc are glycidyl or glycidyloxy C 1-20 alkyl, such as ⁇ -glycidylpropyl, ⁇ -glycidoxyethyl, ⁇ -glycidoxybutyl, ⁇ -glycidoxypentyl, ⁇ -glycidoxyhexyl, and 2-(3,4-epoxycyclohexyl)ethyl.
- the most preferred substituents R c are glycidoxypropyl and epoxycyclohexylethyl.
- silanes are g-glycidoxypropyltrimethoxysilane (GPTS), g ⁇ glycidoxypropyltriethoxysilane (GPTES), epoxycyclohexylethyltrimethoxysilane, and epoxycyclohexylethyltriethoxysilane.
- GPTS g-glycidoxypropyltrimethoxysilane
- GPTES g ⁇ glycidoxypropyltriethoxysilane
- epoxycyclohexylethyltrimethoxysilane epoxycyclohexylethyltriethoxysilane.
- the invention is not limited to the above-mentioned compounds.
- hydrolysable silane compounds having fluorine-containing group or photo-polymerizable group in addition to the hydrolysable silane compounds having fluorine-containing group or photo-polymerizable group, a hydrolysable silane having at least one alkyl substituent, a silane having at least one aryl substituent, or a silane having no non-hydrolysable substituent can be used together for controlling the physical properties of the liquid repellent layer.
- Preferred further hydrolysable silanes which may be used in the present invention are those of general formula (3):
- R is a non-hydrolysable substituent selected from substituted or unsubstituted alkyl and substituted or unsubstituted aryl
- X is a hydrolysable substituent
- a is an integer from 0 to 3.
- the proportion of the silanes used for preparing the condensation product is selected according to the application desired and is within the knowledge of a person skilled in the art of manufacture of inorganic polycondensates. It has been found that the hydrolysable silanes having a fluorine-containing group are appropriately used in amounts in the range from 0.5 to 20% by mole, preferably 1 to 10% by mole, based on the total amount of hydrolysable compounds used. Within these ranges a high liquid repellency as well as a very uniform surface are obtained. The latter is especially important for photo-curing and/or recording applications involving irradiation since the surface obtained often tends to have concave and/or convex forms which affect light scattering. Thus, the above-mentioned ranges provide highly repellent, even surfaces which are especially suited for photo-curing and/or recording applications.
- the proportion between the hydrolysable silane having the cationically polymerizable group and the further hydrolysable silane is preferably in the range of 10:1 to 1:10.
- the condensation product of the above-mentioned hydrolysable silanes is prepared by hydrolysis and condensation of said starting compounds in accordance with the sol-gel method, which is known to those skilled in the art.
- the sol-gel method generally comprises the hydrolysis of said hydrolysable silanes, optionally aided by acid or basic catalysis.
- the hydrolysed species will condense at least partially.
- the hydrolysis and condensation reactions cause the formation of condensation products having e.g. hydroxy groups and/or oxo bridges.
- the hydrolysis/condensation product may be controlled by appropriately adjusting parameters, such as e.g. the water content for hydrolysis, temperature, period of time, pH value, solvent type, and solvent amount, in order to obtain the condensation degree and viscosity desired.
- a metal alkoxide in order to catalyse the hydrolysis and to control the degree of condensation.
- the other hydrolysable compounds defined above may be used, especially an aluminum alkoxide, a titanium alkoxide, a zirconium alkoxide, and corresponding complex compounds (e.g. with acetyl acetone as the complex ligand) are appropriate.
- the composite coating composition further comprises at least one cationically polymerizable organic resin, which is preferably cationically photo-polymerizable.
- a cationically polymerizable organic resin which is preferably cationically photo-polymerizable. Since an organic frame is formed by cationic polymerization (typically ether bond formation), re-hydrolysis of a siloxane frame is subdued, and the resistance to recording liquid (typically alkaline ink) is improved. Meanwhile in this invention, the inorganic frame of siloxane shows high mechanical durability against wiping. As a result of coexistence of the organic frame and inorganic frame, it is surprisingly improved both of recording liquid resistance and wiping durability.
- the cationically polymerizable resin is preferably a cationically polymerisable epoxy resin known to those skilled in the art.
- the cationically polymerisable resin can also be any other resin having electron rich nucleophilic groups such as oxetane, vinylether, vinylaryl or having heteronuclear groups such as aldehydes, ketones, thioketones, diazoalkanes.
- resins having cationically polymerisable ring groups such as cyclic ethers, cyclic thioethers, cyclic imines, cyclic esters (lactone), 1,3-Dioxacycloalkane (ketale), spiroorthoesters or spiroorthocarbonates.
- cationically polymerizable resin refers to an organic compound having at least 2 cationically polymerizable groups including monomers, dimers, oligomers or polymers or mixtures thereof.
- the cationically polymerizable organic resin preferably comprises epoxy compounds, such as monomers, dimers, oligomers, and polymers.
- the epoxy compound used for the coating composition is preferably solid-state at room temperature (approx. 20° C.), more preferably it has a melting point of 40° C. or higher.
- epoxy resins of the bisphenol type e.g. Bisphenol-A-diglycidylether (Araldit GY 266 (Ciba)), Bisphenol-F-diglycidylether
- epoxy resins of the novolak type such as phenol novolak (e.g. Poly[(phenyl-2,3-epoxypropylether)- ⁇ -formaldehyde]) and cresol novolak as well as cycloaliphatic epoxy resins such as e.g.
- epoxy equivalent is preferably less than 2000, more preferably less than 1000. If epoxy equivalent exceeds 2000, the degree of cross-linking decreases in the curing reaction, and some problems may occur, decline of Tg, adhesion power to a substrate and ink-resistance etc.
- the coating composition according to the present invention further contains a cationic initiator.
- the specific type of the cationic initiator used may e.g. depend on the type of cationically polymerizable groups present, the mode of initiation (thermal or photolytic), the temperature, the type of radiation (in the case of photolytic initiation) etc.
- Suitable initiators include all common initiator systems, including cationic photo-initiators, cationic thermal initiators, and combinations thereof.
- Cationic photo-initiators are preferred.
- cationic initiators that can be used include onium salts, such as sulfonium, iodonium, carbonium, oxonium, silecenium, dioxolenium, aryldiazonium, selenonium, ferrocenium and immonium salts, borate salts and corresponding salts of Lewis acids AlCl 3 , TiCl 4 , SnCl 4 , compounds containing an imide structure or a triazine structure, azo compounds, perchloric acid, and peroxides.
- aromatic sulfonium salts or aromatic iodonium salts are advantageous in view of sensitivity and stability.
- a mixing ratio by weight of condensation product and cationically polymerizable organic resin is preferably 0.001-1:1, more preferably it is 0.005-0.5:1.
- liquid repellent layer of an ink jet head it is desirable that it has a flat surface with little unevenness.
- the liquid repellent layer which has unevenness, shows high liquid repellency (high advancing contact angle or high static contact angle) against recording liquid droplet.
- recording liquid remains in a concave portion and the liquid repellency of liquid repellent layer may be spoiled as a result.
- This phenomenon is remarkable in the embodiment that recording liquid contains pigment, i.e., a color material particle, since the color material particle enters and adheres to the concave portion. Therefore, as for the surface roughness Ra, which indicates the unevenness of liquid repellent layer, it is desirable to be less than 5.0 nm, and it is still more desirable especially that Ra is less than 1.0 nm.
- condensation product containing hydrolysable silane compound having fluorine-containing group leads to lower surface free energy, and flat surface can be obtained.
- nozzle forming material it is also possible to use various additive agents together for the purpose of increasing the degree of cross-linking, improvement in photo-sensitivity, prevention of swelling, improvement of coating characteristics, improvement of adhesion power to substrate, giving flexibility, to attain mechanical strength, the higher resistance against chemicals and so on.
- photo cationic initiator can be used with a reducing agent such as copper (II) trifluoromethanesulfonate, ascorbic acid etc, to attain higher degree of cross-linking.
- a reducing agent such as copper (II) trifluoromethanesulfonate, ascorbic acid etc
- fluorine compound in Japanese Patent Application Laid-Open No. 8-290572.
- addition of coupling agent (ex. Silane compounds) is also effective.
- This invention is suitable for the manufacturing method, which forms a nozzle by pattern-exposure and developing. For example, it is applied to the method which form precise nozzle structure with photo lithography technology using photosensitive material, indicated in Japanese Patent Application Laid-Open Nos. 4-10940 to 4-10942, Japanese Patent Application Laid-Open No. 6-286149, and the Japanese Patent No. 3143307 etc.
- the method of manufacturing ink jet head comprising:
- nozzle plate having ink ejection opening by pattern-exposure and developing of the nozzle material
- Another method of manufacturing ink jet head comprising:
- coating resin layer contains condensation product of hydrolysable silane compound and polymerizable resin composition.
- FIG. 1 is a perspective view of the substrate 1 having the ink ejection pressure-generating element 2 .
- FIG. 2 is a 2-2 sectional view of FIG. 1 .
- FIG. 3 is a figure of the substrate formed ink passage pattern 3 with dissoluble resin material. It is suitably used a positive type resist, especially a photo-decomposable positive type resist with a comparatively high molecular weight, in order to prevent a collapse of the ink passage pattern during processing of nozzle formation.
- FIG. 4 shows that the coating resin layer 4 of this invention has arranged on the ink passage pattern.
- the coating resin layer is polymerizable with light or thermal energy, especially cationic photo-polymerizable.
- the coating resin layer can be suitably formed by spin coating, direct coating, etc.
- an ejection opening 6 is formed by a pattern exposure through mask 5 , as shown in FIG. 5 and, developed as shown in FIG. 6 .
- an ink supply opening 7 is suitably formed to substrate ( FIG. 7 ), and an ink passage pattern is made to dissolve ( FIG. 8 ). Finally, if needed, heat-treats is applied, thus the nozzle material is cured completely, and an ink jet head is completed.
- the coating resin layer of this invention can be applied to a substrate two or more times, in order to obtain desired thickness of coating.
- it is indispensable to use above-mentioned coating resin composition as the most upper layer.
- Regarding lower layer it is also possible to use above-mentioned coating resin composition and photo-polymerizable resin composition not containing hydrolysable condensation product.
- a liquid repellent surface is obtained using hydrolysable condensation product containing fluorine atom, without performing a liquid repellent process. Since this liquid repellent nature is obtained at the time of an application and dryness, the liquid repellent nature inside of ejection outlet and ink passage, which formed of subsequent exposure and the development process, can be restrained and does not cause any problem concerning its performance as ink jet head.
- This invention has the feature that shows liquid repellency only for the nozzle surface through applying nozzle material on a substrate. Therefore, the mechanical methods, such as molding, laser processing and dry etching etc., can be useful also. In that case, hydrophilic processing is not needed, but it is used suitably.
- the nozzle material in this invention has reactive group such as polymerizable and hydrolysable group. Since those reactive groups remain even after pattern-exposure and developing, curing reaction can be promoted with additional light exposure or heat treatment. That additional curing process has positive effect on performance of the material such as adhesive property, ink resistance, wiping durability and so on.
- Hydrolysable condensation product was prepared according to the following procedures.
- condensation product was diluted with 2-butanol and ethanol to 20 wt % as nonvolatile content, and the hydrolysable condensation product was obtained.
- An ink jet head was produced according to the procedure shown in the above-mentioned method in FIGS. 1 to 8 .
- the silicone substrate 1 having the electric heat conversion element as ink ejection pressure generating element 2 was prepared, and the dissoluble resin layer was formed by applying polymethyl isopropenyl ketone (ODUR-1010, Tokyo Oka Kogyo Kabushiki Kaisha) by spin coating on the silicone substrate. Subsequently, after prebaking at 120° C. for 6 minutes, pattern exposure of ink passage was performed by mask aligner UX3000 (USHIO Electrical Machinery).
- Said polymethyl isopropeny ketone is the so-called positive type resist, which decomposes and becomes soluble to the organic solvent by UV irradiation.
- the pattern formed with the dissoluble resin material was the portion which was not exposed in the case of pattern exposure, and became the ink supply passage 3 ( FIG. 3 ).
- the thickness of the dissoluble resin material layer after development was 20 micrometers.
- a cationic photo-polymerizable coating resin shown in Table 1 was dissolved in methyl isobutyl ketone/xylene mixture solvent by 55 wt % as solid content, and applied on the substrate 1 with ink passage pattern 3 of dissoluble resin material layer by spin coating, and prebaking was performed at 90° C. for four minutes.
- the thickness of the coating resin layer 4 on ink passage pattern was 55 micrometers after repeating this application and prebaking 3 times ( FIG. 4 ).
- composition 1 hydrolysable hydrolysable condensation 25 parts condensation product of synthetic example product 1 (20 wt %) Epoxy resin EHPE-3150 (Daicel Chemical) 100 parts Additive 1,4-HFAB (Central Glass) 20 parts photo cationic SP172, Asahi Denka Industry 5 parts initiator Reducing agent copper (II) 0.5 parts trifluoromethanesulfonate Silane A187 (Nippon Unicar) 5 parts coupling agent 1,4-HFAB:(1,4-bis(2-hydroxyhexafluoroisopropyl)benzene)
- the coating resin layer was cured by the photo cationic polymerization except the ejection opening pattern, and the ejection opening pattern which had sharp edge was obtained ( FIG. 6 ).
- mask for forming ink supply opening in the back side of the substrate was arranged suitably, and ink supply opening 7 was formed by anisotropic etching of silicone substrate ( FIG. 7 ).
- the surface of the substrate having the nozzle was protected by a rubber film during anisotropic etching of silicone.
- the rubber protective film was removed after completing anisotropic etching, and further the dissoluble resin material layer forming ink passage pattern was decomposed by irradiating UV using said UX3000 on the whole surface again.
- the ink passage pattern 3 dissolved by immersing into methyl lactate for 1 hour while giving an ultrasonic wave to said substrate.
- heat treatment was performed at 200 degrees C. for 1 hour ( FIG. 8 ).
- an ink jet head was completed by adhering the ink supply member on the ink supply opening.
- An ink jet head was produced like embodiment 1 except for applying composition 2 shown in Table 2 instead of the composition 1 as underlayer, which application and prebaking were repeated twice, and as the most upper layer above-mentioned composition 1 was applied.
- An ink jet head was made like embodiment 1, except for using the composition 3 shown in Table 3 instead of the composition 1.
- composition 3 hydrolysable hydrolysable condensation 5 parts condensation product of synthetic example product 1 (20 wt %) Epoxy resin EHPE-3150, Daicel Chemical 100 parts Additive 1,4-HFAB, Central Glass 20 parts photo cationic SP172, Asahi Denka Industry 5 parts initiator Silane A187, Nippon Unicar 5 parts coupling agent 1,4-HFAB:(1,4-bis(2-hydroxyhexafluoroisopropyl)benzene)
- an ink jet head was produced completely like embodiment 1, except for an application and an prebaking were performed only once, and thickness of the coating resin layer was 20 micrometers of on an ink passage pattern.
- the obtained ink jet recording head of Embodiments 1 to was filled up with ink BCI-3Bk (Canon) and printing was carried out. And the highly quality image was obtained.
- the surface roughness of this ink jet head was measured in contact mode using scanning probe model microscope JSPM-4210.
- the surface roughness is Index Ra was 0.2 to 0.3 nm (it scans on 10-micrometer square), and the surface of this nozzle material was confirmed to be very flat and smooth (Table 4).
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Abstract
An ink jet head is formed of a nozzle material composed of a condensation product comprising a hydrolysable silane compound having a fluorine-containing group and a photo-polymerizable resin composition.
Description
- This invention is in an ink jet head and its manufacture method.
- Recently, the technical development to the improvement in a performance of smaller droplet, higher drive frequency and more number of nozzle is continued in order to make the record characteristic more advanced in an ink jet record system. And image recording is performed by ejecting liquid from an ejection opening as small droplet which adheres to the recording medium typified by paper.
- Here, a surface treatment is becoming more important to maintain ejecting performance by keeping ejecting opening surface as same condition at any time. Moreover, it is common to wipe off the ink which remained on the surface by e.g. rubber blade periodically to maintain the condition of the ejecting opening surface in an ink jet head. A liquid repellent material is demanded for easy wiping, and wiping durability.
- Moreover, when the liquid repellent layer is prepared on the surface, the liquid repellent layer needs to adhere to its lower layer, and the problem of peeling off of liquid repellent layer may occur. Since the ink used for an ink jet head is not neutral in many cases, it is also required that the liquid repellent material should have durability against ink and have adhesion power to a nozzle. In addition to preventing peeling, from a viewpoint of simplification of manufacturing process and cost reduction, the process is desired that the nozzle material and liquid repellent layer is prepared all at once. That is, nozzle material itself is desired to have liquid repellency.
- Various methods have so far been indicated as the liquid repellent processing on the surface of a nozzle in the ink jet head. However, most of them were just the surface treatment of the formed nozzle, and the nozzle material itself did not have the liquid repellent nature.
- The surface treatment method which used the fluoride containing silane compound is indicated in Japanese Patent Publication No 10-505870 and U.S. Pat. No. 6,283,578.
- However, these surface treatments were aimed at liquid repellent nature grant, and were not those in which the liquid repellent material itself has patterning nature. Moreover, the liquid repellent materials that had photosensitivity were indicated by Japanese Patent Application Laid-Open No. 11-322896, Japanese Patent Application Laid-Open No. 11-335440, and Japanese Patent Application Laid-Open No. 2000-26575. These materials could not form the solid structure like a nozzle.
- When the fluorine-containing compound which is a typical liquid repellent material is added to resin, it is well-known phenomenon that fluorine-containing group is arranged in the surface for its low surface energy, and presenting liquid repellency.
- However, since fluorine-containing compounds generally have low dissolubility to other resin, it was difficult to mix with photosensitive resin and to use together.
- Although the block copolymer having fluorine-containing group was indicated in Japanese Patent Application Laid-Open No. 2002-105152 as a coating composition, it could not be applied to the high-precision patterning like nozzle forming. Japanese Patent Application Laid-Open No. 2002-292878 referred to the orifice plate having nozzle structure, which was made of fluorine-containing resin. Since fluorine-containing resin did not have photosensitive characteristic corresponding to patterning by photo-lithography, the nozzle had to be formed by dry etching etc. Furthermore, the inside of ink passage of a nozzle needs to be hydrophilic in order to obtain the ejecting performance, hydrophilic processing needed to be performed inside of the ink passage and the adhesion side with basis material and so on.
- Cationically polymerizable resin composition, which included fluorine-containing compounds, was indicated by Japanese Patent Application Laid-Open No. 8-290572. However, the purpose of this invention was the rate reduction of water absorption of material, not liquid repellency. Since the compound in this invention has hydroxyl group for dissolubility with resin composition, the composition did not show liquid repellency.
- U.S. Pat. No. 5,644,014, EP B1 587667 and Japanese Patent Publication No. 3306442 referred to the liquid repellent material comprising hydrolysable silane compounds which had fluorine-containing group. Although the above-mentioned material is indicating the photo curability which was derived from photo radical polymerization, it is not mentioned about pattern formation using photo lithography technology nor the application to an ink jet head.
- This invention is made in view of above-mentioned many points, carried out to provide liquid repellent material of an ink jet head, which has high liquid repellency, high durability against the wiping (to maintain high liquid repellency) and the ease of wiping simultaneously, and which realizes high-quality image recording.
- The further purpose is to offer a manufacturing method of ink jet head which realizes the improvement in accuracy of the ejection outlet portion of a nozzle and a simple manufacturing process, by giving liquid repellent nature to the above-mentioned nozzle material itself, and making a liquid repellent processing process unnecessary.
- The present invention designed to attain the above-mentioned objectives is an ink jet head, wherein the nozzle material comprises condensation product of hydrolysable silane compound having fluorine-containing group and photo-polymerizable resin composition.
- Another present invention designed to attain the above-mentioned objectives is a method of manufacturing ink jet head, which is forming the nozzle having liquid repellent nature on the surface thereof by pattern-exposure and developing a nozzle material on the substrate, wherein the nozzle material comprises condensation product of a hydrolysable silane compound having fluorine-containing group and photo-polymerizable resin composition.
- That is, the compatibility of liquid repellent material and photo resist composition is improved by using the above-mentioned composition. Thus, good patterning characteristic corresponding to formation of a high precision structure like a nozzle, high liquid repellency and high wiping durability are realized without liquid repellent processing on the surface.
-
FIG. 1 is a perspective view of a substrate to be used for manufacturing the ink jet head of this invention. -
FIG. 2 is a 2-2 sectional view ofFIG. 1 , showing an initial step of manufacturing the ink jet head of this invention. -
FIG. 3 is a sectional view showing a step for manufacturing the ink jet head of this invention. -
FIG. 4 is a sectional view showing a step for manufacturing the ink jet head of this invention. -
FIG. 5 is a sectional view showing a step for manufacturing the ink jet head of this invention. -
FIG. 6 is a sectional view showing a step for manufacturing the ink jet head of this invention. -
FIG. 7 is a sectional view showing a step for manufacturing the ink jet head of this invention. -
FIG. 8 is a sectional view showing the ink jet head of this invention manufactured by the steps ofFIGS. 2 to 7 . - The present invention will be described in detail.
- These inventors found out that the nozzle surface which has high liquid repellency and high wiping durability even if liquid repellent processing was not performed, as a result of using the composition comprising condensation product containing hydrolysable silane compound having fluorine-containing group and photo-polymerizable resin composition as the nozzle material of the ink jet head.
- According to the composition of the nozzle material of this invention, the cured material has the siloxane frame (Inorganic frame) formed from the hydrolysable silane, and a frame (Organic frame: ether bond when using the epoxy group) by curing the cationically polymerizable group. Thereby, a cured material becomes into the so-called organic and inorganic hybrid cured material, and durability against wiping and its recording liquid is improved by leaps and bounds. That is, it is thought that its strength as a film improves and the wiping resistance improves compared with liquid repellent layer formed only by the siloxane frame since liquid repellent layer of this invention has an organic frame.
- Furthermore, since it is organic and inorganic hybrid material, the compatibility of fluorine-containing compound and photo polymerizable resin composition, which was a problem conventionally, is improved. And fluorine-containing compound which has low surface free energy is able to mix with photo-polymerizable resin composition as nozzle material.
- Subsequently, the composition material of this invention will be described concretely. The hydrolysable silane compound having fluorine-containing group, which is one of the starting materials of the condensation product, is indispensable to have one or more non-hydrolysable fluorine-containing group and hydrolysable substituent.
- As the non-hydrolysable fluorine-containing group, straight-chain or blanched-chain fluoro-carbon group can be referred. In the case of blanched-chain fluoro-carbon group, the terminal or the side chain is preferred to be trifluoromethyl or pentafluoroethyl group. Owing to its surface free energy, fluorine-containing group have tendency to arrange in the surface.
- On the other hand, fluorine-containing group of the fluorosilane contains generally at least 1, preferably at least 3 and in particular at least 5 fluorine atoms, and generally not more than 30, more preferably not more than 25 fluorine atoms which are attached to one or more carbon atoms. It is preferred that said carbon atoms are aliphatic including cycloaliphatic atoms. Further, the carbon atoms to which fluorine atoms are attached are preferably separated by at least two atoms from the silicon atom, which are preferably carbon and/or oxygen atoms, e.g. a C1-4 alkylene or a C1-4 alkylenoxy, such as an ethylene or ethylenoxy linkage.
- Preferred hydrolysable silanes having a fluorine-containing group are those of general formula (1):
-
RfSi(R)bX(3-b) (1) - wherein Rf is a non-hydrolysable substituent having 1 to 30 fluorine atoms bonded to carbon atoms, R is a non-hydrolysable substituent, X is a hydrolysable substituent, and b is an integer from 0 to 2, preferably 0 or 1 and in particular 0.
- In general formula (1) the hydrolysable substituents X, which may be identical or different from one another, are, for example, hydrogen or halogen (F, Cl, Br or I), alkoxy (preferably C1-6 alkoxy, such as methoxy, ethoxy, n-propoxy, isopropoxy and n-butoxy, sec-butoxy, isobutoxy, and tert-butoxy), aryloxy (preferably C6-10 aryloxy, such as phenoxy), acyloxy (preferably C1-6 acyloxy, such as acetoxy or propionyloxy), alkylcarbonyl (preferably C2-7 alkycarbonyl, such as acetyl). Preferred hydrolysable substituents are halogen, alkoxy groups, and acyloxy groups. Particularly preferred hydrolysable substituents are C1-4 alkoxy groups, especially methoxy and ethoxy.
- The non-hydrolysable substituent R, which may be identical to or different from one another, may be a non-hydrolysable substituent R containing a functional group or may be a non-hydrolysable substituent R without a functional group. In general formula (I) the substituent R, if present, is preferably a group without a functional group.
- The non-hydrolysable substituent R without a functional group is, for example, alkyl (e.g., C1-8 alkyl, preferably C1-6 alkyl, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, s-butyl and t-butyl, pentyl, hexyl, and octyl), cycloalkyl (e.g. C3-8 cycloalkyl, such as cyclopropyl, cyclopentyl or cyclohexyl), alkenyl (e.g. C2-6 alkenyl, such as vinyl, 1-propenyl, 2-propenyl and butenyl), alkynyl (e.g. C2-6 alkynyl, such as acetylenyl and propargyl), cycloalkenyl and cycloalkynyl (e.g. C2-6 alkenyl and cycloalkynyl), aryl (e.g. C6-10 aryl, such as phenyl and naphthyl), and corresponding arylalkyl and alkylaryl (e.g. C7-15 arylalkyl and alkylaryl, such as benzyl or tolyl). The substituent R may contain one or more substituents, such as halogen, alkyl, aryl, and alkoxy. In formula (1) R when present is preferably methyl or ethyl.
- A particular preferred substituent Rf is CF3(CF2)n—Z— where n and Z are defined as defined in general formula (4) below.
-
CF3 (CF2)n—Z—SiX3 (4) - wherein X is as defined in
general compound 1 and preferably is methoxy or ethoxy, Z is a divalent organic group, and n is an integer from 0 to 20, preferably 3 to 15, more preferably 5 to 10. Preferably, Z contains not more than 10 carbon atoms and Z is more preferably a divalent alkylene or alkyleneoxy group having not more than 6 carbon atoms, such as methylene, ethylene, propylene, butylene, methylenoxy, ethyleneoxy, propylenoxy, and butylenoxy. Most preferred is ethylene.
Specific examples are CF3CH2CH2SiCl2(CH3), CF3CH2CH2SiCl(CH3)2, CF3CH2CH2Si(CH3)(OCH3)2, CF3CH2CH2SiX3, C2F5CH2CH2SiX3, C4F9CH2CH2SiX3, n-C6F13CH2CH2SiX3, n-C8F17CH2CH2SiX3, n-C10F21CH2CH2SiX3, (X═OCH3, OC2H5 or Cl); i-C3F7O—CH2CH2CH2—SiCl2 (CH3), n-C6F13—CH2CH2—SiCl (OCH2CH3)2, n-C6F13—CH2CH2—SiCl2 (CH3) and n-C6F13—CH2CH2—SiCl (CH3)2. Particularly preferred are C2F5—C2H4—SiX3, C4F9—C2H4—SiX3, C6F13—C2H4—SiX3, C8F13—C2H4—SiX3, C10F21—C2H4—SiX3 and C12F25—C2H4—SiX3, where X is a methoxy or ethoxy group. - Furthermore, the inventors have found that by using at least two different hydrolysable silanes having a fluorine-containing group of a different kind unexpectedly improved results are obtained, especially with regard to liquid repellent properties, wiping durability, and resistance to chemicals such as recording liquid. The silanes used preferably differ in the number of fluorine atoms contained therein or in the length (number of carbon atoms in the chain) of the fluorine-containing substituent.
- Although the reason for these improvements is not clear, the fluoroalkyl groups of different length are believed to cause a structural arrangement of higher density, since the fluoroalkyl group should take an optimal arrangement in the uppermost surface. For example, in the case where at least two of C6F13—C2H4SiX3, C8F17—C2H4SiX3, and C10F21—C2H4—SiX3 (X as defined above) are used together, the high fluorine concentration in the uppermost surface is represented by fluoroalkyl groups of different length which results in the named improvements compared to the addition of a single fluorosilane.
- Moreover, it is suitable to use together different silane compound from above-mentioned silane compound having fluorine-containing group, i.e., silane compound not having fluorine-containing group, as starting materials of condensation reaction. In that case, adjustment of fluorine content, reaction control and control of the physical property become easy.
- Although this invention uses together above-mentioned condensation product and photo-polymerization composition, it is also suitable for it from a viewpoint of durability to introduce a polymerizable group into condensation product.
- As polymerizable substituent of hydrolysable silane compound, radical polymerizable group and cationically polymerizable group can be used. From a viewpoint of alkali ink resistance, cationically polymerizable group is desirable here.
- A preferred hydrolysable silane having a cationically polymerizable group is a compound of general formula (2):
-
RcSi(R)bX(3-b) (2) - wherein Rc is a non-hydrolysable substituent having a cationically polymerizable group, R is a non-hydrolysable substituent, X is a hydrolysable substituent, and b is an integer from 0 to 2.
- As a cationically polymerizable organic group, a cyclic ether group represented epoxy group and oxetane group, a vinyl ether group etc. can be used. In the viewpoint of availability and reaction control, an epoxy group is preferable.
- Specific examples of said substituent Rc are glycidyl or glycidyloxy C1-20alkyl, such as γ-glycidylpropyl, β-glycidoxyethyl, δ-glycidoxybutyl, ε-glycidoxypentyl, ω-glycidoxyhexyl, and 2-(3,4-epoxycyclohexyl)ethyl. The most preferred substituents Rc are glycidoxypropyl and epoxycyclohexylethyl.
- Specific examples of corresponding silanes are g-glycidoxypropyltrimethoxysilane (GPTS), g□ glycidoxypropyltriethoxysilane (GPTES), epoxycyclohexylethyltrimethoxysilane, and epoxycyclohexylethyltriethoxysilane. However, the invention is not limited to the above-mentioned compounds.
- Furthermore, in addition to the hydrolysable silane compounds having fluorine-containing group or photo-polymerizable group, a hydrolysable silane having at least one alkyl substituent, a silane having at least one aryl substituent, or a silane having no non-hydrolysable substituent can be used together for controlling the physical properties of the liquid repellent layer.
- Preferred further hydrolysable silanes, which may be used in the present invention are those of general formula (3):
-
RaSiX(4-a) (3) - wherein R is a non-hydrolysable substituent selected from substituted or unsubstituted alkyl and substituted or unsubstituted aryl, X is a hydrolysable substituent, and a is an integer from 0 to 3.
- Tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, ethyltrimethoxysilane, ethyl triethoxysilane, ethyltripropoxysilane, propyltrimethoxysilane, propyltriethoxysilane, propyltripropoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltripropoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, etc. are specifically mentioned. This invention is not limited to the above-mentioned compound.
- The proportion of the silanes used for preparing the condensation product is selected according to the application desired and is within the knowledge of a person skilled in the art of manufacture of inorganic polycondensates. It has been found that the hydrolysable silanes having a fluorine-containing group are appropriately used in amounts in the range from 0.5 to 20% by mole, preferably 1 to 10% by mole, based on the total amount of hydrolysable compounds used. Within these ranges a high liquid repellency as well as a very uniform surface are obtained. The latter is especially important for photo-curing and/or recording applications involving irradiation since the surface obtained often tends to have concave and/or convex forms which affect light scattering. Thus, the above-mentioned ranges provide highly repellent, even surfaces which are especially suited for photo-curing and/or recording applications.
- The proportion between the hydrolysable silane having the cationically polymerizable group and the further hydrolysable silane is preferably in the range of 10:1 to 1:10.
- Generally, the condensation product of the above-mentioned hydrolysable silanes is prepared by hydrolysis and condensation of said starting compounds in accordance with the sol-gel method, which is known to those skilled in the art. The sol-gel method generally comprises the hydrolysis of said hydrolysable silanes, optionally aided by acid or basic catalysis. The hydrolysed species will condense at least partially. The hydrolysis and condensation reactions cause the formation of condensation products having e.g. hydroxy groups and/or oxo bridges. The hydrolysis/condensation product may be controlled by appropriately adjusting parameters, such as e.g. the water content for hydrolysis, temperature, period of time, pH value, solvent type, and solvent amount, in order to obtain the condensation degree and viscosity desired.
- Moreover, it is also possible to use a metal alkoxide in order to catalyse the hydrolysis and to control the degree of condensation. For said metal alkoxide, the other hydrolysable compounds defined above may be used, especially an aluminum alkoxide, a titanium alkoxide, a zirconium alkoxide, and corresponding complex compounds (e.g. with acetyl acetone as the complex ligand) are appropriate.
- The composite coating composition further comprises at least one cationically polymerizable organic resin, which is preferably cationically photo-polymerizable. Since an organic frame is formed by cationic polymerization (typically ether bond formation), re-hydrolysis of a siloxane frame is subdued, and the resistance to recording liquid (typically alkaline ink) is improved. Meanwhile in this invention, the inorganic frame of siloxane shows high mechanical durability against wiping. As a result of coexistence of the organic frame and inorganic frame, it is surprisingly improved both of recording liquid resistance and wiping durability.
- The cationically polymerizable resin is preferably a cationically polymerisable epoxy resin known to those skilled in the art. The cationically polymerisable resin can also be any other resin having electron rich nucleophilic groups such as oxetane, vinylether, vinylaryl or having heteronuclear groups such as aldehydes, ketones, thioketones, diazoalkanes. Of special interest are also resins having cationically polymerisable ring groups such as cyclic ethers, cyclic thioethers, cyclic imines, cyclic esters (lactone), 1,3-Dioxacycloalkane (ketale), spiroorthoesters or spiroorthocarbonates.
- The term “cationically polymerizable resin” herein refers to an organic compound having at least 2 cationically polymerizable groups including monomers, dimers, oligomers or polymers or mixtures thereof.
- Accordingly, the cationically polymerizable organic resin preferably comprises epoxy compounds, such as monomers, dimers, oligomers, and polymers. The epoxy compound used for the coating composition is preferably solid-state at room temperature (approx. 20° C.), more preferably it has a melting point of 40° C. or higher.
- Examples of said epoxy compound for the coating composition are epoxy resins having at least one of the structural units (1) and (2):
- Further examples are epoxy resins of the bisphenol type (e.g. Bisphenol-A-diglycidylether (Araldit GY 266 (Ciba)), Bisphenol-F-diglycidylether) and epoxy resins of the novolak type, such as phenol novolak (e.g. Poly[(phenyl-2,3-epoxypropylether)-ω-formaldehyde]) and cresol novolak as well as cycloaliphatic epoxy resins such as e.g. 4-Vinylcyclohexene-diepoxide, 3,4-Epoxycyclohexane-carboxylic-acid-(3,4-epoxycyclohexylmethylesther) (UVR 6110, UVR 6128 (Union Carbide)). Additional examples are Triphenylolmethanetriglycidylether, N,N-Bis-(2,3-epoxypropyl)-4-(2,3-epoxypropoxy)-aniline and Bis-{4-[bis-(2,3-epoxypropyl)-amino]-phenyl}methane.
- Concerning the epoxy resin compound, epoxy equivalent is preferably less than 2000, more preferably less than 1000. If epoxy equivalent exceeds 2000, the degree of cross-linking decreases in the curing reaction, and some problems may occur, decline of Tg, adhesion power to a substrate and ink-resistance etc.
- The coating composition according to the present invention further contains a cationic initiator. The specific type of the cationic initiator used may e.g. depend on the type of cationically polymerizable groups present, the mode of initiation (thermal or photolytic), the temperature, the type of radiation (in the case of photolytic initiation) etc.
- Suitable initiators include all common initiator systems, including cationic photo-initiators, cationic thermal initiators, and combinations thereof.
- Cationic photo-initiators are preferred. Representative of cationic initiators that can be used include onium salts, such as sulfonium, iodonium, carbonium, oxonium, silecenium, dioxolenium, aryldiazonium, selenonium, ferrocenium and immonium salts, borate salts and corresponding salts of Lewis acids AlCl3, TiCl4, SnCl4, compounds containing an imide structure or a triazine structure, azo compounds, perchloric acid, and peroxides. As cationic photoinitiators, aromatic sulfonium salts or aromatic iodonium salts are advantageous in view of sensitivity and stability.
- A mixing ratio by weight of condensation product and cationically polymerizable organic resin is preferably 0.001-1:1, more preferably it is 0.005-0.5:1.
- When the mixing ratio of condensation product is lower, the liquid repellency of the surface is not sufficient. And when higher, photo-patterning characteristic and/or adhesion power to a substrate may decrease.
- Generally, in liquid repellent layer of an ink jet head, it is desirable that it has a flat surface with little unevenness. The liquid repellent layer, which has unevenness, shows high liquid repellency (high advancing contact angle or high static contact angle) against recording liquid droplet. However when rubbing liquid repellent layer in wiping operation etc with recording liquid, recording liquid remains in a concave portion and the liquid repellency of liquid repellent layer may be spoiled as a result. This phenomenon is remarkable in the embodiment that recording liquid contains pigment, i.e., a color material particle, since the color material particle enters and adheres to the concave portion. Therefore, as for the surface roughness Ra, which indicates the unevenness of liquid repellent layer, it is desirable to be less than 5.0 nm, and it is still more desirable especially that Ra is less than 1.0 nm.
- In this invention, addition of the condensation product containing hydrolysable silane compound having fluorine-containing group leads to lower surface free energy, and flat surface can be obtained.
- To above-mentioned nozzle forming material, it is also possible to use various additive agents together for the purpose of increasing the degree of cross-linking, improvement in photo-sensitivity, prevention of swelling, improvement of coating characteristics, improvement of adhesion power to substrate, giving flexibility, to attain mechanical strength, the higher resistance against chemicals and so on. For example, above-mentioned photo cationic initiator can be used with a reducing agent such as copper (II) trifluoromethanesulfonate, ascorbic acid etc, to attain higher degree of cross-linking. Moreover, in order to prevent swelling and size modification of the nozzle part in ink, it is also useful to add fluorine compound in Japanese Patent Application Laid-Open No. 8-290572. Furthermore, for the purpose of improvement of adhesion power to substrate, addition of coupling agent (ex. Silane compounds) is also effective.
- Next, the manufacturing method of an ink-jet head using an above-mentioned nozzle material will be explained.
- This invention is suitable for the manufacturing method, which forms a nozzle by pattern-exposure and developing. For example, it is applied to the method which form precise nozzle structure with photo lithography technology using photosensitive material, indicated in Japanese Patent Application Laid-Open Nos. 4-10940 to 4-10942, Japanese Patent Application Laid-Open No. 6-286149, and the Japanese Patent No. 3143307 etc.
- For example, the following methods are mentioned. Namely, the method of manufacturing ink jet head comprising:
- coating a nozzle material resin on a substrate,
- forming nozzle plate having ink ejection opening by pattern-exposure and developing of the nozzle material, and
- adhere the nozzle plate on the substrate having ink ejection pressure generating element.
- Another method of manufacturing ink jet head comprising:
- forming a ink passage pattern with dissoluble resin material on a substrate having an ink ejection pressure generating element,
- forming a coating resin later by applying a polymerizable coating resin of this invention as an ink passage wall on the dissoluble resin material layer,
- forming an ink ejection opening by removing coating resin layer above ink ejection pressure generating element,
- dissolving the dissoluble resin material pattern,
- wherein the coating resin layer contains condensation product of hydrolysable silane compound and polymerizable resin composition.
- Subsequently, it is explained the example of the ink jet head of this invention.
-
FIG. 1 is a perspective view of thesubstrate 1 having the ink ejection pressure-generatingelement 2.FIG. 2 is a 2-2 sectional view ofFIG. 1 .FIG. 3 is a figure of the substrate formedink passage pattern 3 with dissoluble resin material. It is suitably used a positive type resist, especially a photo-decomposable positive type resist with a comparatively high molecular weight, in order to prevent a collapse of the ink passage pattern during processing of nozzle formation. Subsequently,FIG. 4 shows that thecoating resin layer 4 of this invention has arranged on the ink passage pattern. The coating resin layer is polymerizable with light or thermal energy, especially cationic photo-polymerizable. The coating resin layer can be suitably formed by spin coating, direct coating, etc. Subsequently, anejection opening 6 is formed by a pattern exposure throughmask 5, as shown inFIG. 5 and, developed as shown inFIG. 6 . - Subsequently, an
ink supply opening 7 is suitably formed to substrate (FIG. 7 ), and an ink passage pattern is made to dissolve (FIG. 8 ). Finally, if needed, heat-treats is applied, thus the nozzle material is cured completely, and an ink jet head is completed. - The coating resin layer of this invention can be applied to a substrate two or more times, in order to obtain desired thickness of coating. In this case, it is indispensable to use above-mentioned coating resin composition as the most upper layer. Regarding lower layer, it is also possible to use above-mentioned coating resin composition and photo-polymerizable resin composition not containing hydrolysable condensation product.
- In the nozzle manufacturing process of this invention, a liquid repellent surface is obtained using hydrolysable condensation product containing fluorine atom, without performing a liquid repellent process. Since this liquid repellent nature is obtained at the time of an application and dryness, the liquid repellent nature inside of ejection outlet and ink passage, which formed of subsequent exposure and the development process, can be restrained and does not cause any problem concerning its performance as ink jet head.
- This invention has the feature that shows liquid repellency only for the nozzle surface through applying nozzle material on a substrate. Therefore, the mechanical methods, such as molding, laser processing and dry etching etc., can be useful also. In that case, hydrophilic processing is not needed, but it is used suitably.
- The nozzle material in this invention has reactive group such as polymerizable and hydrolysable group. Since those reactive groups remain even after pattern-exposure and developing, curing reaction can be promoted with additional light exposure or heat treatment. That additional curing process has positive effect on performance of the material such as adhesive property, ink resistance, wiping durability and so on.
- Hydrolysable condensation product was prepared according to the following procedures.
- Glycidylpropyltriethoxysilane 28 g (0.1 mol), methyltriethoxysilane 18 g (0.1 mol), trideca fluoro-1, 1,2,2-tetrahydroctyltriethoxysilane 6.6 g (0.013 mol, equivalent for 6 mol % in total amount of the hydrolysable silane compound), water 17.3 g, and ethanol 37 g was stirred at room temperature, subsequently refluxed for 24 hours, thus hydrolysable condensation product was obtained.
- Furthermore, the condensation product was diluted with 2-butanol and ethanol to 20 wt % as nonvolatile content, and the hydrolysable condensation product was obtained.
- An ink jet head was produced according to the procedure shown in the above-mentioned method in
FIGS. 1 to 8 . - At first, the
silicone substrate 1 having the electric heat conversion element as ink ejectionpressure generating element 2 was prepared, and the dissoluble resin layer was formed by applying polymethyl isopropenyl ketone (ODUR-1010, Tokyo Oka Kogyo Kabushiki Kaisha) by spin coating on the silicone substrate. Subsequently, after prebaking at 120° C. for 6 minutes, pattern exposure of ink passage was performed by mask aligner UX3000 (USHIO Electrical Machinery). - Exposure time was for 3 minutes, and development was carried out with methyl isobutyl ketone/xylene=2/1, and rinsed with xylene.
- Said polymethyl isopropeny ketone is the so-called positive type resist, which decomposes and becomes soluble to the organic solvent by UV irradiation. The pattern formed with the dissoluble resin material was the portion which was not exposed in the case of pattern exposure, and became the ink supply passage 3 (
FIG. 3 ). In addition, the thickness of the dissoluble resin material layer after development was 20 micrometers. Subsequently, A cationic photo-polymerizable coating resin shown in Table 1 was dissolved in methyl isobutyl ketone/xylene mixture solvent by 55 wt % as solid content, and applied on thesubstrate 1 withink passage pattern 3 of dissoluble resin material layer by spin coating, and prebaking was performed at 90° C. for four minutes. The thickness of thecoating resin layer 4 on ink passage pattern was 55 micrometers after repeating this application andprebaking 3 times (FIG. 4 ). -
TABLE 1 Composition 1hydrolysable hydrolysable condensation 25 parts condensation product of synthetic example product 1 (20 wt %) Epoxy resin EHPE-3150 (Daicel Chemical) 100 parts Additive 1,4-HFAB (Central Glass) 20 parts photo cationic SP172, Asahi Denka Industry 5 parts initiator Reducing agent copper (II) 0.5 parts trifluoromethanesulfonate Silane A187 (Nippon Unicar) 5 parts coupling agent 1,4-HFAB:(1,4-bis(2-hydroxyhexafluoroisopropyl)benzene) - Subsequently, pattern exposure of the ink ejection opening was applied using mask aligner “MPA600 super” made by CANON (
FIG. 5 ). - Next, the
ejection opening pattern 6 was formed through heating at 90 degrees C. for 4 minutes, developing by methyl isobutyl ketone (MIBK)/xylene=⅔ and performing a rinse with isopropyl alcohol. The coating resin layer was cured by the photo cationic polymerization except the ejection opening pattern, and the ejection opening pattern which had sharp edge was obtained (FIG. 6 ). Subsequently, mask for forming ink supply opening in the back side of the substrate was arranged suitably, andink supply opening 7 was formed by anisotropic etching of silicone substrate (FIG. 7 ). The surface of the substrate having the nozzle was protected by a rubber film during anisotropic etching of silicone. The rubber protective film was removed after completing anisotropic etching, and further the dissoluble resin material layer forming ink passage pattern was decomposed by irradiating UV using said UX3000 on the whole surface again. Subsequently, theink passage pattern 3 dissolved by immersing into methyl lactate for 1 hour while giving an ultrasonic wave to said substrate. Subsequently, in order to cure thecoating resin layer 4 completely, heat treatment was performed at 200 degrees C. for 1 hour (FIG. 8 ). Finally, an ink jet head was completed by adhering the ink supply member on the ink supply opening. - An ink jet head was produced like
embodiment 1 except for applyingcomposition 2 shown in Table 2 instead of thecomposition 1 as underlayer, which application and prebaking were repeated twice, and as the most upper layer above-mentionedcomposition 1 was applied. -
TABLE 2 Composition 2Epoxy resin EHPE-3150, Daicel Chemical 100 parts Additive 1,4-HFAB, Central Glass 20 parts photo SP172, Asahi Denka Industry 5 parts cationic initiator Reducing copper (II) 0.5 parts agent trifluoromethanesulfonate Silane A187, Nippon Unicar 5 parts coupling agent 1,4-HFAB:(1,4-bis (2-hydroxyhexafluoroisopropyl)benzene) - An ink jet head was made like
embodiment 1, except for using thecomposition 3 shown in Table 3 instead of thecomposition 1. -
TABLE 3 Composition 3hydrolysable hydrolysable condensation 5 parts condensation product of synthetic example product 1 (20 wt %) Epoxy resin EHPE-3150, Daicel Chemical 100 parts Additive 1,4-HFAB, Central Glass 20 parts photo cationic SP172, Asahi Denka Industry 5 parts initiator Silane A187, Nippon Unicar 5 parts coupling agent 1,4-HFAB:(1,4-bis(2-hydroxyhexafluoroisopropyl)benzene) - Using the
composition 3 shown in Table 3, an ink jet head was produced completely likeembodiment 1, except for an application and an prebaking were performed only once, and thickness of the coating resin layer was 20 micrometers of on an ink passage pattern. - The obtained ink jet recording head of
Embodiments 1 to was filled up with ink BCI-3Bk (Canon) and printing was carried out. And the highly quality image was obtained. - When printing again after performing wiping operation 30000 times with the HNBR rubber blade while spraying ink for the nozzle surface of this ink jet head, the same high-quality image as before wiping could be obtained. Thus wiping durability was proved to be excellent.
- Furthermore, after this ink jet head was filled up with the above-mentioned ink, preserved at 60 degrees C. for two months. The printing quality was the same as before preservation.
- Moreover, both values of advancing and receding contact angle against ink BCI-3Bk for an ink jet head was high. And liquid repellency was excellent (Table 4).
- The surface roughness of this ink jet head was measured in contact mode using scanning probe model microscope JSPM-4210. The surface roughness is Index Ra was 0.2 to 0.3 nm (it scans on 10-micrometer square), and the surface of this nozzle material was confirmed to be very flat and smooth (Table 4).
- Furthermore, surface analysis by ESCA (Electron Spectroscopy for Chemical Analysis) was performed with the measurement angle of 6 degrees by Quantum 2000 (Ulvac-phi).
- When the ratio of four elements of C, O, Si, and F is measured, it was observed that F atom was arranged on the surface at higher content than the calculated
value 6 atom % (Table 4). -
TABLE 4 (Evaluation result) Embodiment Embodiment Embodiment Embodiment 1 2 3 4 Printing quality good good good good (First stage) Printing quality good good good good (after wiping) Printing quality good good good good (After a preservation) Advancing 83 83 87 87 contact angle Receding 57 55 63 62 contact angle Surface 0.3 0.4 0.3 0.2 roughness Ra/nm Surface 32 32 38 38 fluoride atom ratio/atom %
Claims (20)
1-21. (canceled)
22. A method of manufacturing an ink jet head including a member provided with an ejection opening for ejecting ink, the method comprising:
applying a material comprising a condensation product comprising a hydrolysable silane compound having a fluorine-containing group and a photo-polymerizable resin composition for forming the member on a substrate; and
forming the ejection opening by exposing the material and removing an unexposed portion of the material.
23. A method of manufacturing an ink jet head including a member provided with an ejection opening for ejecting ink and an ink passage communicating with the ejection opening, the method comprising:
providing a pattern of the ink passage on a substrate provided with an ejection pressure generating element for ejecting ink;
providing a coating layer comprising a condensation product comprising a hydrolysable silane compound having a fluorine-containing group and a photo-polymerizable resin composition for forming the member on the pattern;
forming an opening by exposing the coating layer and removing an unexposed portion of the coating layer; and
removing the pattern to form the passage.
24. A method of manufacturing an ink jet head according to claim 22 ,
wherein after the ejection opening formation, a curing reaction is promoted with light or thermal energy.
25. A method of manufacturing an ink jet head according to claim 24 , wherein the nozzle material is applied two or more times on the substrate.
26. A method of manufacturing an ink jet head according to claim 22 , wherein the photo-polymerizable resin composition is a cationically photo-polymerizable resin composition.
27. A method of manufacturing an ink jet head according to claim 26 , wherein the cationically photo-polymerizable resin composition contains an epoxy compound.
28. A method of manufacturing an ink jet head according to claim 27 , wherein the cationically photo-polymerizable resin composition comprises an epoxy compound that is solid state at room temperature.
29. A method of manufacturing an ink jet head according to claim 22 , wherein the condensation product further comprises a hydrolysable silane compound having no fluorine-containing group.
30. A method of manufacturing an ink jet head according to claim 29 , wherein the hydrolysable silane compound having no fluorine-containing group is a hydrolysable silane compound having a photo-polymerizable group.
31. A method of manufacturing an ink jet head according to claim 30 , wherein the hydrolysable silane compound having a photo-polymerizable group is a hydrolysable silane compound having a cationic polymerization group.
32. A method of manufacturing an ink jet head according to claim 30 , wherein the hydrolysable silane compound having a photo-polymerizable group is a hydrolysable silane compound having an epoxy group.
33. A method of manufacturing an ink jet head according to claim 29 , wherein the hydrolysable silane compound having no fluorine-containing group is selected from a silane having at least one alkyl substituent, a silane having at least one aryl substituent or a silane having no non-hydrolysable substituent.
34. A method of manufacturing an ink jet head according to claim 22 , wherein the condensation product comprises a hydrolysable silane compound having a fluorine-containing group, a hydrolysable silane compound having a photo-polymerizable group, and a hydrolysable silane compound selected from a silane having at least one alkyl substituent, a silane having at least one aryl substituent or a silane having no non-hydrolysable substituent.
35. A method of manufacturing an ink jet head according to claim 22 , wherein the hydrolysable silane compound having a fluorine-containing group is represented by general formula (1):
RfSi(R)bX(3-b) (1)
RfSi(R)bX(3-b) (1)
wherein Rf is a non-hydrolysable substituent having 1 to 30 fluorine atoms bonded to a carbon atom, R is a non-hydrolysable substituent, X is a hydrolysable substituent, and b is an integer from 0 to 2.
36. A method of manufacturing an ink jet head according to claim 35 , wherein the non-hydrolysable substituent Rf has at least 5 fluorine atoms bonded to a carbon atom.
37. A method of manufacturing an ink jet head according to claim 35 , wherein the condensation product comprises at least two hydrolysable silane compounds having a fluorine-containing group, the silane compounds having a different number of fluorine atoms contained therein.
38. A method of manufacturing an ink jet head according to claim 31 , wherein the hydrolysable silane compound having a cationic polymerizable group is represented by general formula (2):
RcSi(R)bX(3-b) (2)
RcSi(R)bX(3-b) (2)
wherein Rc is a non-hydrolysable substituent having a cationic polymerizable group, R is a non-hydrolysable substituent, X is a hydrolysable substituent, and b is an integer from 0 to 2.
39. A method of manufacturing an ink jet head according to claim 33 , wherein the hydrolysable silane compound selected from a silane having at least one alkyl substituent, a silane having at least one aryl substituent or a silane having no non-hydrolysable substituent is represented by general formula (3):
RaSiX(4-a) (3)
RaSiX(4-a) (3)
wherein R is a non-hydrolysable substituent selected from substituted or unsubstituted alkyl groups and substituted or unsubstituted aryl groups, X is a hydrolysable substituent, and a is an integer from 0 to 3.
40. A method of manufacturing an ink jet head according to claim 22 , wherein the hydrolysable silane compound having a fluorine-containing group is represented by formula (4):
CF3(CF2)n—Z—SiX3 (4)
CF3(CF2)n—Z—SiX3 (4)
wherein X is a hydrolysable substituent and preferably is methoxy or ethoxy, Z is a divalent organic group, and n is an integer from 0 to 20.
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- 2003-07-22 AU AU2003304346A patent/AU2003304346A1/en not_active Abandoned
- 2003-07-22 EP EP03741523A patent/EP1675724B1/en not_active Expired - Lifetime
- 2003-07-22 WO PCT/JP2003/009246 patent/WO2005007411A1/en active Application Filing
- 2003-07-22 AT AT03741523T patent/ATE551195T1/en active
- 2003-07-22 JP JP2005504392A patent/JP4424751B2/en not_active Expired - Fee Related
- 2003-07-22 CN CN03825983.4A patent/CN1741905B/en not_active Expired - Fee Related
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US12059690B2 (en) | 2020-01-24 | 2024-08-13 | Canon Kabushiki Kaisha | Unit for electrostatic filter and electrostatic filter |
Also Published As
Publication number | Publication date |
---|---|
EP1675724A1 (en) | 2006-07-05 |
CN1741905B (en) | 2012-11-28 |
TW200520974A (en) | 2005-07-01 |
JP2007518588A (en) | 2007-07-12 |
US20060132539A1 (en) | 2006-06-22 |
US7658469B2 (en) | 2010-02-09 |
AU2003304346A1 (en) | 2005-02-04 |
EP1675724B1 (en) | 2012-03-28 |
CN1741905A (en) | 2006-03-01 |
ATE551195T1 (en) | 2012-04-15 |
WO2005007411A1 (en) | 2005-01-27 |
JP4424751B2 (en) | 2010-03-03 |
TWI241959B (en) | 2005-10-21 |
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